TW201603063A - Electronic device - Google Patents

Abstract

Provided is an electronic apparatus comprising: an induction apparatus; a switching element; and a cooler. The induction apparatus has a core and a coil wound around the core. The switching element is electrically connected to the coil, and a switching operation is elicited in the switching element using a carrier frequency which was made to be high frequency. The cooler is thermally coupled to the core.

Description

Electronic machine

The present invention relates to an electronic device including an induction device such as a reactor or a transformer, and the induction device includes a core body and a coil wound around the core body.

A part of the electronic device includes an induction machine such as a reactor or a transformer, and the induction machine has a core body and a coil wound around the core body. The induction machine suppresses the temperature rise by, for example, cooling by a cooler (for example, refer to Japanese Laid-Open Patent Publication No. Hei 7-129233).

The coil is electrically connected to the switching element. In order to achieve miniaturization of the induction machine, it is desirable to increase the carrier frequency, which is used for switching operations of the switching elements. However, since the core has a small electrical resistivity, if the carrier frequency is high frequency, the iron loss of the core is increased. As the core heats up due to the iron loss of the core, the temperature of the induction machine rises, so that it is difficult to increase the carrier frequency.

An object of the present invention is to provide an electronic device capable of suppressing an increase in temperature of an induction machine due to a high frequency of a carrier frequency.

An electronic device that solves the above problems, comprising: an induction device having a core and a coil wound around the core; and a switching element electrically connected to the coil and switching using a carrier frequency that is high frequency And a cooler that is thermally bonded to the core.

10‧‧‧Reactor device

11‧‧‧Induction machine

13‧‧‧ clearance board

21‧‧‧1st core

21a, 22a‧‧‧ flat section

21b, 22b‧‧‧1st foot

21c, 22c‧‧‧2nd foot

22‧‧‧2nd core

22a‧‧‧ Flat section

31‧‧‧1st coil

32‧‧‧2nd coil

33‧‧‧Connecting Department

41‧‧‧1st reel

41a, 42a‧‧‧ flat section

41b, 42b‧‧‧1st tubular

41c, 42c‧‧‧2nd tubular

42‧‧‧2nd reel

51‧‧‧1st cooler

52‧‧‧2nd cooler

51a, 52a‧‧‧ Body Department

51b, 52b‧‧‧ first board

51c, 52c‧‧‧ second board

51d, 52d‧‧‧ inner heat sink

53‧‧‧Switching elements

54‧‧‧Control substrate

Fig. 1 is a longitudinal sectional view showing a reactor device of a first embodiment.

Fig. 2 is a longitudinal sectional view showing a reactor device of a second embodiment.

Next, a first embodiment of a reactor device 10 for a vehicle that belongs to an electronic device will be described with reference to Fig. 1.

As shown in Fig. 1, the reactor device 10 includes an induction device 11 having two cores, a first core 21 and a second core 22, and two coils, that is, a first coil 31 and a second coil. 32. The first core body 21 and the second core body 22 are U-shaped core bodies. The first core body 21 and the second core body 22 are magnetic bodies and are formed by a dust core.

The first core body 21 includes a flat plate portion 21a formed in a substantially rectangular flat plate shape, and a cylindrical first leg portion 21b extending from the one end in the longitudinal direction of the flat plate portion 21a toward the second core body 22; The second leg portion 21c extends from the other end in the longitudinal direction of the flat plate portion 21a toward the second core body 22.

The second core body 22 includes a flat plate portion 22a formed in a substantially rectangular flat plate shape, and a cylindrical first leg portion 22b extending from the one end in the longitudinal direction of the flat plate portion 22a toward the first core body 21; and a cylindrical shape The second leg portion 22c extends from the other end in the longitudinal direction of the flat plate portion 22a toward the first core body 21.

The first core 21 and the second core 22 have the same shape. and In addition, the first and second core bodies 21 and 22 are disposed such that the distal end faces of the first leg portions 21b and 22b in the extending direction face each other, and the distal end faces of the second leg portions 21c and 22c in the extending direction are disposed. Face to face.

The gap plate 13 is interposed between the first leg portions 21b and 22b, respectively Between the front end faces and between the front end faces of the second leg portions 21c and 22c. Each of the gap plates 13 is a non-magnetic material (for example, ceramic), and is formed in a disk shape having the same outer diameter as that of the first leg portions 21b and 22b and the second leg portions 21c and 22c. The gap plate 13 is formed between the front end faces of the first leg portions 21b and 22b and the front end faces of the second leg portions 21c and 22c.

The first reel 41 is mounted on the first core 21, and is in the second The core 22 is provided with a second reel 42. The first reel 41 and the second reel 42 are made of resin. In the present embodiment, the first reel 41 and the second reel 42 are formed of a polyphenylene sulfide resin (PPS resin).

The first reel 41 has a flat plate portion 41a and a self-flat plate portion 41a. The cylindrical first cylindrical portion 41b that protrudes and the cylindrical second tubular portion 41c that protrudes from the flat plate portion 41a. The first leg portion 21b of the first core body 21 is inserted into the first tubular portion 41b, and the second leg portion 21c of the first core body 21 is inserted into the second tubular portion 41c.

The second reel 42 has a flat plate portion 42a and a self-flat plate portion 42a. The cylindrical first cylindrical portion 42b that protrudes and the cylindrical second tubular portion 42c that protrudes from the flat plate portion 42a. The first leg portion 22b of the second core body 22 is inserted into the first tubular portion 42b, and the second leg portion 22c of the second core body 22 is inserted into the second tubular portion 42c.

The first and second reels 41 and 42 are arranged in a first cylindrical shape. The front end portions of the portions 41b and 42b in the protruding direction are opposed to each other, and the front end portions of the second tubular portions 41c and 42c in the protruding direction are opposed to each other.

The first coil 31 has an annular shape and is first inserted around the first coil 31. The first tubular portions 41b and 42b of the leg portions 21b and 22b are wound. The second coil 32 has an annular shape and is wound around the second cylindrical portions 41c and 42c through which the second leg portions 21c and 22c are inserted. In the present embodiment, the first and second coils 31 and 32 are formed by bending one conductive plate in an edgewise manner, and the front end portion of the first coil 31 is connected to the second coil 32 by the connecting portion 33 and the second coil 32. The previous end is linked. The first coil 31 wound around the first leg portions 21b and 22b (that is, the first tubular portions 41b and 42b) and the second leg portions 21c and 22c (that is, the second tubular portions 41c and 42c) are wound around the second leg portions 21c and 22c. The second coils 32 are arranged adjacent to each other in the radial direction, and a connection portion 33 is provided in a gap between the coils 31 and 32. The winding direction of the first coil 31 is different from the winding direction of the second coil 32. Further, the first and second coils 31 and 32 may be integrally formed by bending one conductive plate side by side.

The reactor device 10 includes two coolers, that is, a first cooler 51 and the second cooler 52. The first cooler 51 is thermally coupled to the first core body 21. The second cooler 52 is thermally coupled to the second core 22 .

Each of the first and second coolers 51 and 52 has a flat and quadrangular box-shaped body portion 51a and 52a. The body portions 51a and 52a are aluminum products. Each of the main body portions 51a and 52a has first plates 51b and 52b, second plates 51c and 52c, and corrugated inner fins 51d and 52d. In the first cooler 51, the inner fins 51d are disposed between the first and second plates 51b and 51c and are hard welded to the plates 51b and 51c, and the outer peripheral portion of the first plate 51b. The hard weld is joined to the outer peripheral portion of the second plate 51c. The refrigerant flow path 51e through which the cooling water as a refrigerant flows is formed inside the main body portion 51a by the first plate 51b, the second plate 51c, and the inner fins 51d. Similarly, in the second cooler 52, the inner fins 52d are disposed between the first and second plates 52b and 52c, and are brazed to the plates 52b and 52c, and the outer peripheral portion of the first plate 52b is hard-welded. It is combined with the outer peripheral portion of the second plate 52c. The first plate 52b, the second plate 52c, and the inner fins 52d form a refrigerant flow path 52e through which the cooling water as a refrigerant flows in the main body portion 52a.

The flat plate portion 21a of the first core body 21 has the second core body The opposite side of 22 (outside). The first plate 51b of the first cooler 51 is in close contact with the outer surface of the flat plate portion 21a of the first core body 21 in a state of being in surface contact via heat-dissipating grease (not shown). The flat plate portion 22a of the second core body 22 has a surface (outer surface) on the opposite side of the first core body 21. The second plate 52c of the second cooler 52 is in close contact with the outer surface of the flat plate portion 22a of the second core body 22 via a heat-dissipating grease (not shown) and in surface contact. Therefore, in the present embodiment, the two coolers 51 and 52 are disposed on both sides of the core body (the first core body 21 and the second core body 22) via the core body. The first cooler 51 and the core (first core 21) are in surface contact with each other, and the second cooler 52 and the core (second core 22) are in surface contact with each other.

The switching element 53 (for example, an insulated gate bipolar transistor (IGBT)) is mounted on the second plate 51c of the first cooler 51 via the substrate 53a. Thereby, the first cooler 51 is thermally coupled to the switching element 53. The switching element 53 is electrically connected to the first coil 31 and the second coil 32. Further, a control board 54 electrically connected to the switching element 53 is mounted on the second board 51c of the first cooler 51. Control substrate 54 controls switching elements 53 switch action. Further, in the present embodiment, the control board 54 controls the switching operation of the switching element 53 using a carrier frequency (for example, a carrier frequency of 10 kHz or more) that is high-frequency.

Next, the function of this embodiment will be described.

In the reactor device 10 of the present embodiment, in order to achieve a feeling The size of the machine 11 is reduced, and the carrier frequency at which the switching operation of the switching element 53 is performed is increased. However, since the first core body 21 and the second core body 22 have a small specific resistance, the carrier wave frequency is increased in frequency, and the iron loss of the first core body 21 and the second core body 22 is increased. It causes fever due to iron loss.

In the present embodiment, the first core 21 and the first cooler are 51 is thermally coupled, and the second core 22 is thermally coupled to the second cooler 52. By the cooling water flowing in the refrigerant flow path 51e of the first cooler 51, the first core body 21 can be efficiently cooled and the cooling water flowing through the refrigerant flow path 52e of the second cooler 52 can be cooled. The second core 22 is cooled efficiently.

The switching element 53 is transmitted with the high frequency of the carrier frequency. Although the amount of heat is increased, the cooling water flowing through the refrigerant flow path 51e of the first cooler 51 is cooled, so that the temperature rise of the switching element 53 can be suppressed.

In this embodiment, the following effects can be obtained.

(1) The switching element 53 performs a switching operation using a carrier frequency that is high-frequency. The first core body 21 is thermally coupled to the first cooler 51, and the second core body 22 is thermally coupled to the second cooler 52. Thereby, the first core body 21 can be efficiently cooled by the first cooler 51, and the second core body 22 can be efficiently cooled by the second cooler 52. The result can be The temperature rise of the induction machine 11 due to the high frequency of the carrier frequency is suppressed.

(2) The first cooler 51 is thermally coupled to the switching element 53. Thereby, the switching element 53 which generates heat due to the high frequency of the carrier frequency can be cooled by the first cooler 51.

(3) The reactor device 10 has two coolers 51 and 52, and the coolers 51 and 52 are disposed on both sides of the core bodies 21 and 22 so as to sandwich the first core body 21 and the second core body 22. Thereby, the first and second core bodies 21 and 22 can be cooled more efficiently, and the temperature rise of the induction device 11 can be further suppressed.

(4) The first plate 51b of the first cooler 51 is in surface contact with the flat plate portion 21a of the first core body 21. The second plate 52c of the second cooler 52 is in surface contact with the flat plate portion 22a of the second core body 22. Thereby, the uniformity of the temperature distribution of the first and second core bodies 21 and 22 can be promoted. As a result, an increase in eddy current loss in a part of the first and second core bodies 21 and 22 can be suppressed.

Furthermore, this embodiment can be modified as follows.

○ As shown in the second embodiment of FIG. 2, the resin 55 may be disposed between the first coil 31 and the coolers 51 and 52 and between the second coil 32 and the coolers 51 and 52. The resin 55 is, for example, a thermoplastic resin such as a polyphenylene sulfide resin (PPS resin) or a polybutylene terephthalate resin (PBT resin) in which a glass filler is placed. Further, the resin 55 may be a thermosetting resin such as an unsaturated polyester resin. With this, heat from the first coil 31 and the second coil 32 is dissipated to the coolers 51 and 52 via the resin 55. Therefore, the first coil 31 and the second coil 32 can be efficiently cooled. As a result, the temperature rise of the induction machine 11 is further suppressed.

In each of the above embodiments, at least a part of the first plate 51b of the first cooler 51 is in contact with the flat plate portion 21a of the first core body 21, and the first cooler 51 and the first core body 21 are not required to be in contact with each other. Face contact.

In each of the above embodiments, at least a part of the second plate 52c of the second cooler 52 is in contact with the flat plate portion 22a of the second core body 22, and the second cooler 52 and the second core body 22 are not required to be in contact with each other. Face contact.

○ In each of the above embodiments, either of the two coolers 51 and 52 may be omitted.

In the above embodiments, the switching element 53 may be mounted on the second cooler 52. In this case, the switching element 53 may not be thermally coupled to the second cooler 52.

In the above embodiments, the switching element 53 may not be thermally coupled to the first cooler 51.

In the above embodiments, the shapes of the inner fins 51d and 52d are not particularly limited. For example, the inner fins 51d and 52d may be needle fins.

○ In each of the above embodiments, the coolers 51 and 52 may be air-cooled. In this case, the cooling gas such as air flows into the respective refrigerant flow paths 51e and 52e as a refrigerant.

○ In the above embodiments, the coolers 51 and 52 may be aluminum die-cast products.

In the above embodiments, the first core body 21 may have a shape different from that of the second core body 22.

In the above embodiments, the induction device 11 may wind the first coil 31 and the second coil 32 in one core. Or you can set only one coil.

In the above embodiments, the induction device 11 may have three or more cores.

In the above embodiments, the induction device 11 may have three or more coils.

In each of the above embodiments, the first coil 31 and the second coil 32 may be formed by winding a round wire.

In the above embodiments, the switching element 53 may be, for example, a gold oxide half field effect transistor (MOSFET) or the like.

In the above embodiments, the switching element 53 may be mounted on the control board 54.

In the above embodiments, the control board 54 may not be mounted on the second plate 51c of the first cooler 51, and may be fixed to another member such as a casing.

In the above embodiments, the induction device 11 may be a device other than the reactor (for example, a transformer).

In the above embodiments, the reactor device 10 may be a reactor device other than the vehicle.

10‧‧‧Reactor device

11‧‧‧Induction machine

13‧‧‧ clearance board

21‧‧‧1st core

21a‧‧‧ Flat section

21b, 22b‧‧‧1st foot

21c, 22c‧‧‧2nd foot

22‧‧‧2nd core

22a‧‧‧ Flat section

31‧‧‧1st coil

32‧‧‧2nd coil

33‧‧‧Connecting Department

41‧‧‧1st reel

41a, 42a‧‧‧ flat section

41b, 42b‧‧‧1st tubular

41c, 42c‧‧‧2nd tubular

42‧‧‧2nd reel

51‧‧‧1st cooler

52‧‧‧2nd cooler

51a, 52a‧‧‧ Body Department

51b, 52b‧‧‧ first board

51c, 52c‧‧‧ second board

51d, 52d‧‧‧ inner heat sink

51e, 52e‧‧‧ refrigerant flow path

53‧‧‧Switching elements

53a‧‧‧Substrate

54‧‧‧Control substrate

Claims (5)

An electronic device comprising: an induction device having a core and a coil wound around the core; a switching element electrically connected to the coil and switching operation using a high frequency carrier frequency; and cooling a heat that is bonded to the core. The electronic machine of claim 1, wherein the cooler is thermally coupled to the switching element. The electronic machine of claim 1, wherein the core is in surface contact with the cooler. The electronic device of claim 1, wherein the cooler is disposed on both sides of the core. The electronic device according to any one of claims 1 to 4, further comprising a resin disposed between the coil and the cooler.