TW201601846A - Electronic component liquid material application method and device - Google Patents

Abstract

The present invention relates to an electronic component liquid material application method and device, comprising: a machine having a first gantry and a second gantry, wherein a cantilever is disposed therebetween; and a first head is disposed at the first carrier The cantilever, the first carrier can be driven to perform X-axis displacement on the cantilever; the application valve is provided with a plurality of valve modules arranged in parallel in the X-axis direction by the application head synchronous linkage; a conveying track is provided at Below the first gantry and the second gantry; the glue valve of each valve module can be automatically driven to make X, Y, Z axial fine adjustment displacement or correct displacement, so that the valve valve of the plurality of valve modules can be glued. Automation, miniaturization, precision and high performance can be achieved more effectively.

Description

Electronic component liquid material application method and device

The invention relates to a liquid material application method and device, in particular to an electronic component liquid material application method and device for applying a viscous material to most electronic components.

According to the general electronic component applied to the liquid material, usually by applying a viscous material thereon to fix a plurality of components, or encapsulating the electronic component, or by mixing the substance into the adhesive material. To cause physical or chemical changes in electronic components, and because these electronic components have small and large production requirements, in order to be able to automate production, often multiple electronic components are simultaneously fabricated into a single component and simultaneously applied. For the processing of the liquid material process, taking the light-emitting diode (LED) as an example, since the body of the light-emitting diode (LED) is actively small, in order to facilitate the process operation, the lead frame is formed as a whole, so that the majority The light-emitting diodes (LEDs) are arranged in a matrix and fixed on the bracket to form a rectangular sheet shape for transporting, and at the same time, the application of the adhesive material is performed thereon.

In the general viscous material application, it can be generally divided into contact type and non-contact type. The contact type viscous material is applied as a glue with high viscosity, and the glue is usually continuous. The non-contact type of viscous material is applied by using a viscous glue, which is usually produced by spraying droplets, which is commonly called dispensing operation; taking the dispensing operation of a light-emitting diode (LED) as an example, The conventional dispensing method uses a single valve to illuminate the light-emitting surfaces of a plurality of light-emitting diodes arranged in a matrix on the support one by one. In the dispensing operation, the light-emitting surface of the light-emitting diode (LED) is caused to have different light-emitting effects, such as differences in the color of the light, by substances contained in the adhesive material, such as silver powder.

However, in the prior art, a plurality of light-emitting diodes arranged in a matrix on a holder are individually dispensed by a single valve, and although the dispensing of the light-emitting surfaces of the light-emitting diodes can be performed very accurately, the dispensing is performed. Efficiency does not meet the needs of the industry; if multiple valves are used for dispensing at the same time, it is difficult to consistently discharge the rubber valves, and the amount of glue will be different. The number of defective products increases, and since the body of the light-emitting diode is small, the distance between the parts to be dispensed of the light-emitting diodes arranged in a matrix on the support may be slightly different, when multiple glue valves are simultaneously dispensed. If the glue outlet of the valve cannot completely correspond to the part to be dispensed, the result of successive dispensing will make the subsequent finished products more defective! Accordingly, it is an object of the present invention to provide an electronic component liquid material application method that can be adapted to apply a viscous material to an electronic component in a transport track using a plurality of glue valves.

Another object of the present invention is to provide an electronic component liquid material applying device which can be adapted to apply a viscous material to a crop material to be applied to a jig by using a plurality of glue valves.

It is still another object of the present invention to provide an apparatus for carrying out the method of handling materials according to claims 1 to 15.

The method for applying the liquid component of the electronic component according to the object of the present invention comprises: using a plurality of valve modules provided with a rubber valve, the main displacement of the large displacement can be simultaneously performed on one of the application heads, and the valve is finely adjusted and displaced. And perform a little glue step with the valve, right The crops to be applied underneath should be dispensed one by one.

Another electronic component liquid material application method according to the object of the present invention, Included: a plurality of axially fine-tuning displacements of X and Y on a plurality of valves on a given head, wherein one of the valves is fixed in the X-axis, and the plurality of valves are adjustable in any one of X and Y; and A little glue step, in which a plurality of glue valves are simultaneously dispensed corresponding to the crop material to be applied underneath.

Another electronic component liquid material application method according to the object of the present invention, Included: a plurality of valve modules each having a valve on each of the application heads, the fine adjustment displacement of the Z-axis of the valve is performed by the driving member on the valve module, and X or Y The axial fine-tuning displacement is performed by the driving member outside the valve module on the entire valve valve module, and then the valve on the valve valve is interlocked with the displacement of the valve module; and a rubber step is performed to simultaneously use the plurality of valves Dispensing the crop material to be applied underneath it.

Still another electronic component liquid material application method according to the object of the present invention, Included: a plurality of valve modules each having a valve on each of the application heads, the Z-axis fine-tuning displacement of the valve actuation on the valve module by the first drive member; The valve module with the first driving member is used for the Y-axis fine-tuning displacement; the third driving member drives the first driving member and the second driving member that are interlocked with the valve to perform X-axis fine adjustment displacement; and performs a little In the glue step, the plurality of glue valves are simultaneously dispensed corresponding to the crop material to be applied underneath.

Still another electronic component liquid material applying device according to another object of the present invention The utility model comprises: a machine platform having a first gantry and a second gantry at a distance between the first gantry and the second gantry; a straddle arm is arranged between the first gantry and the second gantry; and a first head is provided at the first gantry Cantilever, the first carrier can be driven to X-axis displacement on the cantilever; the application head The valve module with the multiple arrays arranged in parallel in the X-axis direction is synchronously linked by the application head; a conveying track is arranged below the first gantry and the second gantry on the machine platform, and has an X-axis The conveying flow path to the direction.

Another electronic component liquid material applying device according to another object of the present invention The utility model comprises: a applying head, comprising a first carrier which can be driven to be X-axis displacement, wherein the first carrier is provided with a multi-array valve valve module, which is arranged in parallel at the X-axis direction and is firstly arranged The carrier is synchronously linked, and the first carrier is provided with a plurality of driving members respectively driving the rubber valve for the X, Y, Z axial fine adjustment displacement.

An electronic component liquid material applying device according to still another object of the present invention, comprising: a device for performing the liquid material applying method of the electronic component according to the first to fifteenth aspect of the patent application.

In the embodiment of the present invention, the electronic component liquid material applying method and device are implemented, because the second carrier of the application head can be automatically driven for large displacement on the Z-axis slide rail of the first carrier. The main displacement, and the valve on each valve module can also be automatically driven to make X, Y, Z axial fine adjustment displacement or correct displacement, so that the valve of the multiple valve valve module is processed in the processing process. The automation, miniaturization, precision and high efficiency of the dispensing operation can be achieved more effectively.

A‧‧‧ machine

A1‧‧‧Rack

A11‧‧‧First Dragon Gate

A111‧‧‧rails

A112‧‧‧Drive components

A12‧‧‧Second Dragon Gate

A121‧‧‧rails

A122‧‧‧Drive components

A2‧‧‧ cantilever

A21‧‧‧rails

A22‧‧‧ drive components

B‧‧‧Make a head

B1‧‧‧ first carrier

B11‧‧‧ Slider

B12‧‧‧First interval

B13‧‧‧rails

B2‧‧‧Second carrier

B21‧‧‧ straddle

B211‧‧‧Second interval

B22‧‧‧Interval space

B23‧‧‧Main drive

B231‧‧‧ buckle seat

B232‧‧‧Fixed parts

B24‧‧‧ third interval

B241‧‧‧First Inter-Care

B242‧‧‧Second Inter-cell

B243‧‧‧ ribs

B25‧‧‧rails

C‧‧‧ valve module

C1‧‧‧ third carrier

C2‧‧‧rails

C3‧‧‧First drive

C4‧‧‧ valve

C5‧‧‧ fine-tuning drive group

C51‧‧‧second drive

C511‧‧‧First mount

C512‧‧‧ pivot

C513‧‧‧ bushing

C514‧‧‧ Output shaft assembly

C52‧‧‧third drive

C221‧‧‧Second seat

C222‧‧‧ Output shaft

C223‧‧‧Leather belt

C224‧‧‧Second seat

C225‧‧‧ third mount

D‧‧‧ conveyor track

D1‧‧‧ Inlet

D2‧‧‧Outlet

D21‧‧‧Preheating fixture

D22‧‧‧Main processing fixture

D23‧‧‧ temporary fixture

D24‧‧‧ Negative pressure suction hole

D25‧‧ ‧parts

D251‧‧‧ Dispensing area

D252‧‧‧ ribs

E‧‧‧ calibration seat

E1‧‧‧ calibration platform

F‧‧‧ bracket

The first figure is a perspective view of the configuration relationship of each mechanism in the embodiment of the present invention.

The second figure is a schematic perspective view of the back side of the head applied in the embodiment of the present invention.

The third figure is a schematic perspective view of the front side of the head of the embodiment of the present invention.

The fourth figure is a three-dimensional schematic view of a rubber valve module in the embodiment of the present invention.

The fifth figure is a three-dimensional schematic diagram of a rubber valve module and a fine adjustment driving group in the embodiment of the present invention.

The sixth figure is a schematic side view of the rubber valve module and the fine adjustment driving group in the embodiment of the present invention.

Figure 7 is a perspective view showing the rear side of the first carrier removed by the head in the embodiment of the present invention.

The eighth figure is a schematic cross-sectional view of the second carrier separation valve valve module and the fine adjustment driving group in the embodiment of the present invention.

The ninth drawing is a schematic view of the rear side of the first carrier removed by the application head in the embodiment of the present invention.

Figure 11 is a perspective view of a transport track in an embodiment of the present invention.

Please refer to the first and second figures. The electronic component liquid material application method of the embodiment of the present invention can be used as an example for the electronic component liquid material applying device for the light-emitting diode to be applied for the crop material dispensing operation. The utility model comprises a machine A, which is provided with a frame A1. The frame A1 comprises a first gantry A11 and a second gantry A12 spaced apart from each other, and a straddle is arranged between the first gantry A11 and the second gantry A12. The cantilever A2, wherein the cantilever A2 is horizontally disposed with two X-axis slide rails A21 spaced apart from each other, and the first gantry A11 and the second gantry A12 are respectively provided with Y-axis slide rails A111 and A121 to make the cantilever A2 The end spans the upper end, and the drive arm A112, A122, for example, the motor and the screw, can drive the cantilever A2 to perform the Y-axis displacement; and the application head B, the first carrier B1 is disposed on the cantilever A2, the first load The back side of the seat B1 is provided with two upper and lower sets of sliders B11, so that the first carrier B1 can be disposed on the upper and lower spaced X-axis slide rails A21, and can be driven by the driving component A22 such as a motor and a screw. X-axis sliding displacement on the cantilever A2; the first carrier B1 is suspended by the slider B11 and the cantilever A2 Below A2, there is also a hollow a first section B12; a conveying track D, disposed between the first gantry A11 and the second gantry A12 on the machine A, having a conveying flow path in the X-axis; a calibration seat E, disposed on the machine The side of the transport track D on A is adjacent to the side of the operator, and a correction platform E1 is disposed thereon.

Referring to the second and third figures, the application head B includes: a second carrier B2 having a plate shape with a straddle B21 attached to both sides of the first carrier B1. On the rail B13, a second space B22 is formed between the second carrier B2 and the first carrier B1, and a second interval B211 is opened on each side of each of the straddles B21. The member B23 is fastened to the upper end of the first carrier B1 by a fastening seat 231, and is fixed to the inner side of the second carrier B2 in the space B22 by a fixing member B232, for example, the main driving member B23 of the motor. Driven, the second carrier B2 can be relatively slidably displaced relative to the first carrier B1 on the Z-axis slide rail B13; the second carrier B2 is provided with a hollow third interval B24; the complex array valve The module C is disposed on the second carrier B2 of the application head B, and is synchronously linked by the application head B, and arranged in parallel with the same X-axis direction as the conveying path of the conveying track D; In the embodiment, the second group of valve modules C are fixed in the X and Y axial directions, and the first, third and fourth groups of valve modules C are adjustable in the X and Y axial directions.

Referring to the third and fourth figures, the valve module C includes: a third carrier C1 having a Z-axis slide C2 on the front side and a first drive such as a motor above the third carrier C1. C3; A rubber valve C4 is correspondingly disposed on the third carrier C1, which is driven by the first driving member C3, and can be finely adjusted on the sliding rail C2 for the Z-axis up and down displacement; the valve C4 is used for discharging Adhesive materials, the structure and operation principle of the invention are not related to the characteristics of the invention, so I will not repeat them! The second set of fixed valve module C is directly fixed on the second carrier B2 by the third carrier C1 and is synchronously linked, so that it is in an unadjustable displacement in the X and Y directions.

Please refer to the third, fifth and sixth figures. The first, third and fourth sets of adjustable valve module C in the valve module C are further provided with a fine adjustment drive group C5 on the rear side, which includes a Y-axis. a second drive member C51, such as a motor, for fine adjustment, and a third drive member C52, such as a motor, for performing X-axis fine adjustment; a third interval B24 and a valve for the fine adjustment drive group C5 to be hollowed out via the second carrier B2 The module C is linked and fine-tuned, wherein the second driving member C51 is disposed on a first fixing base C511, and is disposed at a distance from the upper and lower groups of the valve module C and parallel to the pivot rod C512, and the end of the pivot rod C512 The third carrier C1 is fixed to the third valve holder C1 of the valve module C, and the other end is fixed to the first fixing base B511 by a sleeve B513. The second driving member C51 is disposed at the first fixing seat between the upper and lower sets of the pivot rods C512. C511 is on the other side of the opposite valve module C. The output shaft assembly C514 passes through the fixing base C511, the output shaft assembly C514 is fixed to the third carrier C1 of the valve module C with its front end to drive The third carrier C1 interlocks the integral valve module C for Y-axis displacement; the third driver C52 is disposed on a second fixing seat C521, and the output shaft C52 thereof 2 One end of the X-axis fine adjustment component C524 is connected by a belt C523, and the other end of the fine adjustment component C524 is fixedly coupled with the side of the first fixing base C511, and the fine adjustment component C524 is simultaneously disposed on a third fixing base C525; The output shaft C522 of the three driving members B42 rotates, and the first fixing base C511 is linked to the X-axis left and right by the belt C523 and the fine adjustment unit C524.

Please refer to the seventh figure, and please refer to the second and third figures at the same time. The fine adjustment driving group C5 is located in the space B22 between the first carrier B1 and the second carrier B2, wherein the second driving component C51 Exposed to the outside of the first interval B12 of the first carrier B1 to shorten the width of the space B22; and the output shaft C522 of the third driving member C52 is connected to the end of the fine adjustment component C524 by a belt C523, and is exposed to The second section B211 of the second carrier B2 is slid across the seat B21 for adjustment.

Referring to the seventh and eighth figures, the second carrier B2 is just between the valve module C and the fine adjustment driving group C5. The upper and lower ends of the first fixing base C511 of the second driving member C51 are spanned. The upper and lower ends of the third section B24 of the second carrier B2 are hollowed out, and are respectively disposed on the X-axis slide rail B25 on the upper and lower ends of the third section B24 of the second carrier B2. The two sets of pivot rod C512 and the output shaft assembly C514 are fixed to the third carrier B1 of the valve module C through the third section B24 which is hollowed out by the second carrier B2; the second fixing of the third driving component C52 is fixed. The seat C521 is fixed on the back side of the second carrier B2; please refer to the third and ninth figures, the third interval B24 of the second carrier B2 is hollowed out, and includes a first inter-cell B241 and a second inter-cell B242, and a second inter-cell B242 is formed therebetween. a rib B243 of a suitable width, wherein the first inter-cell B241 is provided with a first set of adjustable glue The valve module C, the second inter-cell B242 is provided with a third and four sets of adjustable valve module C, and the rib B243 is provided with a second set of fixed glue valve modules C; In the fine adjustment driving group C5 of the adjusting valve module C, the third fixing base C525 of each third driving member C52 is respectively fixed on the left side and the rib of the first cell B241 on the back side of the second carrier B2. B243, right side of the second cell B242.

Referring to the tenth figure, the X-axis conveying flow path formed by the conveying track D is provided with a preheating fixture D21, a main processing jig D22, and a temporary treatment arranged from the inlet D1 to the discharge port D2. D23, each of which is provided with a negative pressure suction hole D24 for adsorbing the crop material to be applied thereon by vacuum suction, since the embodiment of the invention uses the electronic component liquid material used for the light-emitting diode dispensing operation As an example, the crop material to be applied may be a rectangular sheet-like support E in which a plurality of light-emitting diodes are arranged in a matrix; and the transport track D at the main processing jig D22 is provided with a frame-like block member D25. A dispensing zone D251 is formed on the majority of the hollowed-out hollow, and a rib D252 is formed between the two dispensing zones D251; when the bracket F is conveyed above the main processing fixture D22, the main processing fixture D22 will be a self-pressure suction hole D24 sucks the bracket F under the bracket F with a negative pressure, and raises the top bracket F against the frame grid member D25 and the rib D252, so that the rectangular sheet-shaped bracket E avoids the deflection deformation, so that It can be stretched and flattened and dispensed by the D251 in the dispensing area of the grid.

The method for applying the liquid material of the electronic component according to the embodiment of the present invention comprises: a feeding step of arranging the light-emitting diodes to be applied to the crop material support F in a rectangular sheet shape to transport the track D as an X-axis conveying flow. The transportation of the road is preheated by the feed port D1 via the preheating fixture D21 and then transferred to the main processing fixture D22; a positioning step includes raising the main processing fixture D22 to the top support bracket F to make the branch The frame F is positioned under the frame grid-shaped member D25 and the rib D252; and the X-axis of the application head B on the first gantry A11, the second gantry A12, the Y-axis slide rails A111, A121 and the cantilever A2 Displace the slide rail A21 so that the application head B is located directly above the bracket F of the main processing jig D22; the one-step rubber step causes the second carrier B2 of the application head B to be driven by the seat drive member B23, and In the slide rail B13 of the first carrier B1, the glue valve C4 of each rubber valve module C is synchronously connected to make a main displacement of the Z-axis large displacement; and then the rubber valve C4 on each rubber valve module C is finely adjusted. The fine adjustment displacement includes: driving the valve C4 on the valve module C by the first driving member C3, and causing the valve C4 to perform the Z-axis up and down fine adjustment displacement on the third carrier C1 slide C2; The driving member C51 drives the third carrier C1 of the valve module C provided with the first driving member C3, so that the entire valve module C including the valve C4 is linked to the upper valve C4 for the Y-axis front. After the fine adjustment displacement; the third driving member B42 drives the first fixing base C511 of the fine adjustment driving group C5, so that the first fixing base C511 is driven to be displaced, and the first driving member C3, the second driving member C5, and the valve mode are linked. The third carrier C1 of the C is on the valve C4, and the left and right trimming displacements are made in the X axis; then, the glue valve C4 of each valve module C corresponds to the light emitting diode arranged on the lower frame F of the lower frame F, Dispense one by one in one way; in a cooling temporary step, the finished support F is lowered by the main processing jig D22, and the support F is disengaged from the top of the frame-like block D25 and the rib D252. It is then transferred to the temporary fixture D23 for a slight cooling and solidification of the finished glue. Thereafter, the discharge port D2 from the conveyance rail D is removed and the conveyance flow path is collected.

In the dispensing step, the fine adjustment displacement of the valve C4 on each valve module C will be corrected at any time during the dispensing process, and the correction valve E is removed from the delivery track D by the valve C of the valve module C. The platform E1 performs nuclear calibration, obtains the distance deviation value from the matrix of the light-emitting diodes arranged on the bracket F, and then adjusts the fine adjustment displacement correction by adjusting the glue valve C4 of each rubber valve module C to obtain each valve. The correct dispensing position of the valve C4 on the module C; wherein, the valve valve C of the valve valve module C is finely adjusted, and the second group of valve valve modules C fixed on the X and Y axes is the C4 valve Correcting or fine-tuning the reference, and adjusting the first, third, and fourth sets of adjustable valve module C upper valve C4 and the conveying track D conveying flow path with the same X-axis spacing and Y-axis positioning for fine tuning The correct position of each valve B34 in the four sets of valve modules B3 includes the correct position of the Z axis.

In the embodiment of the present invention, the second component carrier B2 of the application head B can be automatically driven on the Z-axis slide rail B13 of the first carrier B1. The main displacement of the large displacement, and the rubber valve C4 of each valve module C can also be automatically driven to perform X, Y, Z axial fine adjustment displacement or correct displacement, so that the valve is applied by the plurality of valve modules C C4 can be more effectively achieved in the process of automation, miniaturization, precision and high efficiency of the dispensing operation of the workpiece to be processed.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

A‧‧‧ machine

A1‧‧‧Rack

A11‧‧‧First Dragon Gate

A111‧‧‧rails

A112‧‧‧Drive components

A12‧‧‧Second Dragon Gate

A121‧‧‧rails

A122‧‧‧Drive components

A2‧‧‧ cantilever

A21‧‧‧rails

A22‧‧‧ drive components

B‧‧‧Make a head

B1‧‧‧ first carrier

D‧‧‧ conveyor track

E1‧‧‧ calibration platform

E‧‧‧ calibration seat

Claims (32)

The invention relates to a method for applying an electronic component liquid material, comprising: a plurality of rubber valve modules provided with a rubber valve, which can simultaneously perform a main displacement of a large displacement on an application head, and further adjust the displacement of the rubber valve; The valve performs a one-step glue step, which is dispensed one by one corresponding to the crop material to be applied underneath. The method of applying the electronic component liquid material according to claim 1, wherein the main displacement is a second carrier on which the plurality of valve modules are disposed, and driven by a main driving member The Z-axis slide rail on a carrier is displaced. An electronic component liquid material application method comprises: making a plurality of axial fine adjustment displacements of X and Y on a plurality of rubber valves on an application head, wherein one of the rubber valves is fixed in the X axis, and the plurality of rubber valves are in X, Y Any axial adjustment; and a little glue step is performed, and the plurality of valves are simultaneously dispensed corresponding to the crop material to be applied underneath. An electronic component liquid material application method comprises: a plurality of rubber valve modules respectively provided with a rubber valve on an application head, wherein a fine adjustment displacement of a Z-axis of the rubber valve is driven by a driving component on the rubber valve module The valve is carried out, and any axially adjustable displacement of X and Y is performed by the driving member outside the valve module to the entire valve module, and then the valve on the valve is interlocked with the displacement of the valve module; In the dispensing step, the plurality of valves are simultaneously dispensed corresponding to the crop material to be applied underneath. An electronic component liquid material application method comprises: a plurality of glue valve modules each having a glue valve on an application head, and a Z-axis fine adjustment of a valve actuation on a valve assembly by a first drive member Displacement The driving member performs a Y-axis fine adjustment displacement on the valve valve module provided with the first driving member; and the X-axis fine-adjusting displacement is driven by the third driving member to drive the first driving member and the second driving member that are interlocked with the rubber valve; And a little glue step is performed, and the plurality of glue valves are simultaneously dispensed corresponding to the crop material to be applied underneath. The method of applying the electronic component liquid material according to any one of claims 1 to 3, wherein the valve module comprises a third carrier and a valve, and the valve is subjected to the third carrier. The first first drive is driven. The electronic component liquid material application method according to claim 6, wherein the fine adjustment displacement system drives the rubber valve to perform a Z-axis up and down displacement on the third carrier. The electronic component liquid material application method according to claim 6, wherein the fine adjustment displacement is a second driving member driving the rubber valve module to perform Y-axis front and rear displacement. The electronic component liquid material application method according to claim 6, wherein the fine adjustment displacement is a third driving member driving the rubber valve module to perform X-axis left and right displacement. The method for applying an electronic component liquid material according to any one of claims 1 to 3, wherein the crop material to be applied is topped to a top member by a main processing fixture. The method for applying an electronic component liquid material according to any one of claims 1 to 3, wherein the dispensing step further comprises: a feeding step of conveying the crop material to be transported by the conveying rail; The road is transported and is transferred from a feed inlet to the main processing fixture after being preheated by the preheating fixture; A positioning step is such that the main processing fixture is topped to be applied to the crop material, and the plurality of glue valves on the application head are located above the crop material to be applied. The method for applying an electronic component liquid material according to any one of claims 1 to 3, wherein the dispensing step further comprises: transferring the finished crop material to be delivered to a conveying track. The temporary fixture is subjected to a cooling temporary step, and then removed from the conveyor track to be collected. The method for applying an electronic component liquid material according to claim 11, wherein the fine adjustment displacement is performed during the dispensing process, and the calibration valve is removed from the delivery rail by the valve to perform nuclear calibration, and then the glue is adjusted according to the deviation value. The valve is corrected for displacement. The method for applying an electronic component liquid material according to any one of claims 1 to 4, wherein the one of the plurality of rubber valves is fixed in any axial displacement of X and Y on the application head, The axial displacement of the X, Y of the plurality of valves on the application head is adjustable. The method for applying an electronic component liquid material according to any one of claims 1 to 3, wherein the crop material to be applied is a rectangular sheet-like stent in which a light-emitting diode is arranged in a matrix. An electronic component liquid material applying device comprises: a machine platform having a first gantry and a second gantry at a distance between the first gantry and the second gantry; and a spanning arm disposed between the first gantry and the second gantry; A first carrier is disposed on the cantilever, and the first carrier can be driven to perform X-axis displacement on the cantilever; the application valve is provided with a plurality of valve modules arranged in parallel in the X-axis direction. Gearing; A conveying track is disposed between the first gantry and the second gantry on the machine platform and has a conveying flow path in the X-axis direction. The electronic component liquid material applying device according to claim 16, further comprising a calibration seat disposed on a side of the transport rail outside the transport rail adjacent to the operator, and a calibration platform is disposed thereon. An electronic component liquid material applying device comprises: an application head comprising a first carrier capable of being driven to be X-axis displacement, wherein the first carrier is provided with a complex array valve module on the X axis The plurality of driving members are arranged in parallel and are synchronously linked by the first carrier. The first carrier is provided with a plurality of driving members for respectively driving the rubber valve for the X, Y, Z axial fine adjustment displacement. The electronic component liquid material applying device according to any one of claims 16 to 18, further comprising a second carrier disposed on the first carrier, the complex array valve module On the second carrier, the second carrier can be relatively slidably displaced relative to the first carrier in the Z-axis by the driving of a main driving member. The electronic component liquid material applying device according to any one of claims 16 to 18, wherein the rubber valve module comprises a third carrier and a rubber valve, and the rubber valve is subjected to the third carrier. The first driving member is driven, and can be displaced up and down in the Z axis. The electronic component liquid material applying device according to any one of claims 16 to 18, wherein, in the multiple array rubber valve module, one set is fixed in any one of X and Y axial directions, and the complex array is in X. Any axial displacement of Y can be adjusted. The electronic component liquid material applying device according to any one of claims 16 to 18, wherein the valve valve module is driven by a fine adjustment driving group, and the fine adjustment driving group comprises a second fine adjustment of the Y axis. Drive member, and one performs X-axis micro Adjusted third drive. The electronic component liquid material applying device according to claim 19, wherein the two sides of the second carrier are respectively disposed on the Z-axis slide rails on both sides of the first carrier, and A space is formed between the second carrier and the first carrier. The electronic component liquid material application device of claim 19, wherein the rear side of the valve module is provided with a second driving member, which is disposed on the first carrier on the second carrier, the first fixing The seat is pivotally coupled between the valve module and the first mount, and the second drive member is driven by the output shaft assembly to drive the valve module to perform Y-axis displacement. The electronic component liquid material applying device according to claim 19, wherein the rear side of the rubber valve module is provided with a first fixing seat, and an X-axis sliding rail disposed on the second carrier; The third driving component is disposed on the second mounting seat on the second carrier, the output shaft is coupled to a fine adjustment component, and the fine adjustment component is coupled to the first fixing seat, so that the valve module can be X-axis in the sliding rail Displacement. The electronic component liquid material applying device according to claim 19, wherein the second carrier is interposed between the valve module and a fine adjustment driving group; and the second carrier is provided with a third interval of hollowing out. The fine adjustment drive group is interlocked with the valve valve module through the third section and finely adjusted. The electronic component liquid material applying device according to any one of claims 24 to 25, wherein the second carrier is provided with a hollow third section, and the upper and lower ends of the first fixing seat are respectively disposed at the The upper and lower ends of the three sections are each on an X-axis slide rail. An electronic component liquid material applying device according to claim 24, wherein The second carrier is provided with a hollow third section, and the pivot rod and the output shaft assembly are connected to the valve module through the third section. The electronic component liquid material applying device according to any one of claims 26 to 28, wherein the third section includes a first inter-cell and a second inter-cell, and a rib is formed therebetween. The electronic component liquid material applying device according to claim 16, wherein the conveying flow path formed by the conveying rail is provided with a preheating fixture arranged from the inlet port to the discharge port, and main processing. A fixture, a temporary fixture, which is adsorbed by a vacuum suction to be applied thereto. The electronic component liquid material applying device according to claim 30, wherein the conveying rail at the main processing jig is provided with a stopper. An apparatus for performing the liquid material application method of the electronic component according to the first to fifteenth aspect of the patent application.