TW201609865A - Polyimine, polylysine, resin composition, and substrate for flexible display - Google Patents
Polyimine, polylysine, resin composition, and substrate for flexible display Download PDFInfo
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Abstract
一種聚醯亞胺,其係四羧酸成分與二胺成分反應而得之聚醯亞胺,其特徵為:該四羧酸成分含有下述結構式(1)所示之化合物;該二胺成分含有下述結構式(2)所示之化合物60莫耳%以上。 □□A polyimine which is a polyimine obtained by reacting a tetracarboxylic acid component with a diamine component, characterized in that the tetracarboxylic acid component contains a compound represented by the following structural formula (1); The component contains 60 mol% or more of the compound represented by the following structural formula (2). □ □
Description
本發明係關於聚醯亞胺及聚醯胺酸,並關於使用其之樹脂組成物,以及可撓性顯示器用基板。 The present invention relates to polyimine and polylysine, and to a resin composition using the same, and a substrate for a flexible display.
作為耐熱性高、具有難燃性、電絕緣性優良的有機材料,聚醯亞胺已為人所知(例如,參照專利文獻1)。 Polyimine is known as an organic material having high heat resistance, flame retardancy, and electrical insulating properties (for example, see Patent Document 1).
聚醯亞胺,利用其特性而被廣泛使用於電氣、電子材料領域之中。具體而言,其作為可撓性印刷配線版、耐熱性黏著膠帶等的基材,而被使用於半導體的絕緣膜、保護膜等。 Polyimine is widely used in the field of electrical and electronic materials due to its properties. Specifically, it is used as a base material of a flexible printed wiring board or a heat-resistant adhesive tape, and is used for an insulating film, a protective film, or the like of a semiconductor.
另一方面,有機電致(EL;Electro Luminescence)顯示器、液晶顯示器等的顯示裝置,要求高精密度。此外,近幾年,顯示裝置的用途擴大至資訊設備。於是,為了滿足超薄型、輕量化及可彎折的要求,將塑膠薄膜使用為基板的可撓性顯示器正受到矚目。 On the other hand, display devices such as an organic electroluminescence (EL) display and a liquid crystal display require high precision. In addition, in recent years, the use of display devices has expanded to information equipment. Therefore, in order to meet the requirements of ultra-thin, lightweight, and bendable, a flexible display using a plastic film as a substrate is attracting attention.
聚醯亞胺則被期待應用於該可撓性顯示器的基板。 Polyimine is expected to be applied to the substrate of the flexible display.
該可撓性顯示器,在製造過程中,要求正確的重合位置。另外,在製造時,具有需進行高溫處理的情況。因此要求,即使對該可撓性顯示器的基板進行高溫處理亦不會輕易膨脹或收縮的特性(所謂的尺寸穩定性)。 The flexible display requires a correct coincidence position during the manufacturing process. In addition, at the time of manufacture, there is a case where high temperature treatment is required. Therefore, it is required that the substrate of the flexible display does not easily expand or contract (so-called dimensional stability) even if it is subjected to high-temperature treatment.
聚醯亞胺的尺寸穩定性,一般而言,係由線膨脹係數來進行評價。於是,有人嘗試製作低線膨脹係數的聚醯亞胺(例如,參照專利文獻2及非 專利文獻1)。然而,使用聚醯亞胺作為該可撓性顯示器的基板的情況中,膜厚為20μm左右,而在這種等級的厚度之中,尚未發現線膨脹係數與玻璃相一樣低的聚醯亞胺。 The dimensional stability of polyimine is generally evaluated by the coefficient of linear expansion. Therefore, attempts have been made to produce a polyimine having a low coefficient of linear expansion (for example, refer to Patent Document 2 and Patent Document 1). However, in the case where polyimide is used as the substrate of the flexible display, the film thickness is about 20 μm, and among the thicknesses of this grade, no polyimine having a linear expansion coefficient as low as that of the glass phase has been found. .
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2007-46054號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-46054
[專利文獻2]日本特開2007-99951號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-99951
[非專利文獻] [Non-patent literature]
[非專利文獻1]Youngsuk Jung et al., European Polymer Journal 49 (2013) 3642-3650 [Non-Patent Document 1] Youngsuk Jung et al., European Polymer Journal 49 (2013) 3642-3650
本發明,係以解決以往之該等問題而達成以下目的作為課題。亦即,本發明之目的在於提供一種具有低線膨脹係數的聚醯亞胺以及作為其前驅物的聚醯胺酸,並提供使用其之樹脂組成物以及可撓性顯示器用基板。 The present invention has been made in order to solve the above problems and achieve the following objects. That is, an object of the present invention is to provide a polyimine having a low coefficient of linear expansion and a polyphthalic acid as a precursor thereof, and to provide a resin composition using the same and a substrate for a flexible display.
作為用以解決該課題的手段,如以下所述。亦即: The means for solving this problem is as follows. that is:
<1>一種聚醯亞胺,其係將四羧酸成分與二胺成分反應而得之聚醯亞胺,其特徵為:該四羧酸成分,含有下述結構式(1)所示之化合物; 該二胺成分,含有下述結構式(2)所示之化合物60莫耳%以上。 <1> Polyimine, which is a polyimine obtained by reacting a tetracarboxylic acid component with a diamine component, characterized in that the tetracarboxylic acid component contains the following structural formula (1). Compound The diamine component contains 60 mol% or more of the compound represented by the following structural formula (2).
<2>如上述<1>之聚醯亞胺,其中,在形成平均厚度20μm的薄膜時,該薄膜的線膨脹係數為2.00ppm/K~7.00ppmm/K。 <2> The polyimine of the above <1>, wherein the film has a linear expansion coefficient of 2.00 ppm/K to 7.00 ppmm/K when a film having an average thickness of 20 μm is formed.
<3>如上述<1>至<2>中任一項之聚醯亞胺,其中,在形成平均厚度20μm的薄膜時,該薄膜的線膨脹係數為3.00ppm/K~7.00ppm/K。 The polyimine of any one of the above-mentioned <1> to <2>, wherein the film has a linear expansion coefficient of 3.00 ppm/K to 7.00 ppm/K when a film having an average thickness of 20 μm is formed.
<4>如上述<1>至<3>中任一項之聚醯亞胺,其中,二胺成分含有結構式(2)所示之化合物95莫耳%以上。 The polyimine of any one of the above-mentioned <1> to <3>, wherein the diamine component contains 95% or more of the compound represented by the structural formula (2).
<5>如上述<1>至<4>中任一項之聚醯亞胺,其中,四羧酸成分含有結構式(1)所示之化合物95莫耳%以上。 The polyimine of any one of the above-mentioned <1> to <4>, wherein the tetracarboxylic acid component contains 95% or more of the compound represented by the structural formula (1).
<6>如上述<1>至<5>中任一項之聚醯亞胺,其中,四羧酸成分與二胺成分的莫耳比(四羧酸成分/二胺成分)為1.00/1.00~0.96/1.00。 The polyimine of any one of the above-mentioned <1> to <5>, wherein the molar ratio of the tetracarboxylic acid component to the diamine component (tetracarboxylic acid component/diamine component) is 1.00/1.00. ~0.96/1.00.
<7>如上述<1>至<6>中任一項之聚醯亞胺,其中,四羧酸成分與二胺成分的莫耳比(四羧酸成分/二胺成分)為1.00/1.00~0.98/1.00。 The polyimine of any one of the above-mentioned <1> to <6>, wherein the molar ratio of the tetracarboxylic acid component to the diamine component (tetracarboxylic acid component/diamine component) is 1.00/1.00. ~0.98/1.00.
<8>一種聚醯亞胺,其係具有下述結構式(3)所示之重複單元的聚醯亞胺,其特徵為: 在形成平均厚度20μm的薄膜時,該薄膜的線膨脹係數為2.00ppm/K~7.00ppm/K。 <8> A polyimine which is a polyimine having a repeating unit represented by the following structural formula (3), which is characterized by: When a film having an average thickness of 20 μm is formed, the film has a linear expansion coefficient of 2.00 ppm/K to 7.00 ppm/K.
<9>如上述<8>之聚醯亞胺,其中,薄膜的線膨脹係數為3.00ppm/K~7.00ppm/K。 <9> The polyimine of the above <8>, wherein the film has a linear expansion coefficient of 3.00 ppm/K to 7.00 ppm/K.
<10>如上述<8>至<9>中任一項之聚醯亞胺,其中,結構式(3)所示之重複單元,相對於聚醯亞胺的重複單元的總量,為90莫耳%以上。 The polyimine of any one of the above-mentioned <8>, wherein the repeating unit represented by the structural formula (3) is 90 with respect to the total amount of the repeating unit of the polyimine. More than Mole.
<11>如上述<8>至<10>中任一項之聚醯亞胺,其係由四羧酸成分與二胺成分反應而得,其中,該四羧酸成分含有下述結構式(1)所示之化合物;該二胺成分中,相對於該二胺成分,含有60莫耳%以上的下述結構式(2)所示之化合物。 The polyimine of any one of the above-mentioned <8>, which is obtained by reacting a tetracarboxylic acid component and a diamine component, wherein the tetracarboxylic acid component contains the following structural formula ( 1) A compound represented by the following structural formula (2) containing 60 mol% or more of the diamine component.
<12>一種聚醯胺酸,其係四羧酸成分與二胺成分反應而得之聚醯胺酸,其特徵為:該四羧酸成分含有下述結構式(1)所示之化合物;該二胺成分含有下述結構式(2)所示之化合物60莫耳%以上。 <12> A poly-proline acid obtained by reacting a tetracarboxylic acid component with a diamine component, wherein the tetracarboxylic acid component contains a compound represented by the following structural formula (1); The diamine component contains 60 mol% or more of the compound represented by the following structural formula (2).
<13>如上述<12>之聚醯胺酸,其中,二胺成分含有結構式(2)所示之化合物95莫耳%以上。 <13> The polyaminic acid according to <12> above, wherein the diamine component contains 95% by mole or more of the compound represented by the structural formula (2).
<14>如上述<12>至<13>中任一項之聚醯胺酸,其中,四羧酸成分含有結構式(1)所示之化合物95莫耳%以上。 The poly-proline in any one of the above-mentioned <12> to <13>, wherein the tetracarboxylic acid component contains 95% or more of the compound represented by the structural formula (1).
<15>如上述<12>至<14>中任一項之聚醯胺酸,其中,四羧酸成分與二胺成分的莫耳比(四羧酸成分/二胺成分)為1.00/1.00~0.96/1.00。 The poly-proline in any one of the above-mentioned <12> to <14> wherein the molar ratio of the tetracarboxylic acid component to the diamine component (tetracarboxylic acid component/diamine component) is 1.00/1.00. ~0.96/1.00.
<16>如上述<12>至<15>中任一項之聚醯胺酸,其中,四羧酸成分與二胺成分的莫耳比(四羧酸成分/二胺成分)為1.00/1.00~0.98/1.00。 The poly-proline in any one of the above-mentioned <12> to <15> wherein the molar ratio of the tetracarboxylic acid component to the diamine component (tetracarboxylic acid component/diamine component) is 1.00/1.00. ~0.98/1.00.
<17>如上述<12>至<16>中任一項之聚醯胺酸,其中,含有聚醯胺酸10質量%的液體,在25℃下,經過1個月後的黏度為1Pa.s以上。 <17> The polylysine according to any one of the above <12> to <16> wherein the liquid containing 10% by mass of polyamic acid has a viscosity of 1 Pa after one month at 25 ° C. s above.
<18>一種樹脂組成物,其特徵為包含:該<1>至<11>中任一項之聚醯亞胺 以及該<12>至<17>中任一項之聚醯胺酸的任一者。 <18> A resin composition characterized by comprising: the polyimine of any one of <1> to <11> And any one of the polyamic acids of any one of <12> to <17>.
<19>一種可撓性顯示器用基板,其特徵為包含:該<1>至<11>中任一項之聚醯亞胺以及該<12>至<17>中任一項之聚醯胺酸的任一者。 <19> A substrate for a flexible display, comprising: the polyimine of any one of <1> to <11>, and the polyamine of any one of <12> to <17> Any of the acids.
根據本發明,可解決以往的該等問題而達成該目的,其可提供一種具有低線膨脹係數的聚醯亞胺,及作為其前驅物的聚醯胺酸,並提供一種使用其之樹脂組成物及可撓性顯示器用基板。 According to the present invention, the object of the prior art can be attained, and it is possible to provide a polyimine having a low coefficient of linear expansion, and a polylysine as a precursor thereof, and to provide a resin composition using the same. And substrates for flexible displays.
〔圖1〕係顯示溫度-CTE之關係的圖表。 [Fig. 1] is a graph showing the relationship between temperature and CTE.
(聚醯亞胺) (polyimine)
<第1聚醯亞胺> <First polyimine>
本發明的第1聚醯亞胺,係四羧酸成分與二胺成分反應而得之聚醯亞胺。 The first polyimine of the present invention is a polyimine obtained by reacting a tetracarboxylic acid component with a diamine component.
<<四羧酸成分>> <<tetracarboxylic acid component>>
該四羧酸成分,含有下述結構式(1)所示之化合物,更因應需求,含有其他的化合物。 The tetracarboxylic acid component contains a compound represented by the following structural formula (1), and further contains other compounds depending on the demand.
該四羧酸成分中,含有該結構式(1)所示之化合物90莫耳%以上較佳,含有95莫耳%以上更佳,含有100莫耳%最佳。 The tetracarboxylic acid component preferably contains 90 mol% or more of the compound represented by the structural formula (1), more preferably 95 mol% or more, and most preferably 100 mol%.
<<二胺成分>> <<Diamine component>>
該二胺成分,含有下述結構式(2)所示之化合物60莫耳%以上。 The diamine component contains 60 mol% or more of the compound represented by the following structural formula (2).
在使該結構式(1)所示之化合物與下述結構式(A)所示之化合物反應的情況下,可得到與該第1聚醯亞胺相似的聚醯亞胺。然而,該聚醯亞胺並無法得到低線膨脹係數。 When the compound represented by the structural formula (1) is reacted with a compound represented by the following structural formula (A), a polyimine similar to the first polyimine can be obtained. However, this polyimine does not give a low coefficient of linear expansion.
該二胺成分,含有該結構式(2)所示之化合物95莫耳%以上較佳,含有100莫耳%更佳。 The diamine component preferably contains 95 mol% or more of the compound represented by the structural formula (2), and more preferably contains 100 mol%.
該第1聚醯亞胺中,作為該四羧酸成分與該二胺成分的莫耳比(四羧酸成分/二胺成分),雖未特別限制而可因應目的適當選擇,但1.00/1.00~0.96/1.00較佳,1.00/1.00~0.98/1.00更佳。 In the first polyimine, the molar ratio (tetracarboxylic acid component/diamine component) of the tetracarboxylic acid component and the diamine component is not particularly limited and may be appropriately selected depending on the purpose, but 1.00/1.00 ~0.96/1.00 is better, and 1.00/1.00~0.98/1.00 is better.
該第1聚醯亞胺中,較佳為具有醯胺酸。該第1聚醯亞胺中的該醯胺酸的量,較佳為該第1聚醯亞胺中的醯亞胺基的10莫耳%以下。 Preferably, the first polyimine has valeric acid. The amount of the amic acid in the first polyimine is preferably 10 mol% or less of the quinone imine group in the first polyimine.
該第1聚醯亞胺,在形成平均厚度20μm的薄膜時,該薄膜的線 膨脹係數較佳為2.00ppm/K~7.00ppm/K,更佳為3.00ppm/K~7.00ppm/K。 The first polyimine, when the film having an average thickness of 20 μm is formed, the film line The expansion coefficient is preferably from 2.00 ppm/K to 7.00 ppm/K, more preferably from 3.00 ppm/K to 7.00 ppm/K.
該線膨脹係數,可藉由熱機械分析(TMA,Thermomechanical Analysis)所求得。 The coefficient of linear expansion can be obtained by thermomechanical analysis (TMA).
具體而言,使用熱機械測定裝置(SII公司製TMA/SS6100),算出線膨脹係數。首先,以膜厚每1μm為4.9mN的方式,對聚醯亞胺的薄膜施加張力,再於氮氛圍下,進行30℃~150℃(升溫速度10℃/min)的處理,以去除吸附的水分。接著,在維持張力的狀態下,於氮氛圍下冷卻之後,在50℃~350℃(升溫速度5℃/min)下進行測定,算出線膨脹係數。線膨脹係數,係以100℃~200℃中的算術平均值所算出。 Specifically, a linear expansion coefficient was calculated using a thermomechanical measuring device (TMA/SS6100 manufactured by SII Corporation). First, a film is applied to a film of polyimine with a film thickness of 4.9 mN per 1 μm, and then treated at 30 ° C to 150 ° C (temperature rising rate of 10 ° C/min) in a nitrogen atmosphere to remove adsorption. Moisture. Next, after maintaining the tension, the mixture was cooled in a nitrogen atmosphere, and then measured at 50 ° C to 350 ° C (heating rate 5 ° C / min) to calculate a coefficient of linear expansion. The coefficient of linear expansion is calculated from the arithmetic mean value in the range of 100 ° C to 200 ° C.
該第1聚醯亞胺,可藉由例如,於溶劑的存在下使該四羧酸成分與該二胺成分反應而得到聚醯胺酸之後,將該聚醯胺酸進行醯亞胺化而得之。 The first polyimine may be obtained by reacting the tetracarboxylic acid component with the diamine component in the presence of a solvent to obtain a polyamic acid, and then subjecting the polyamic acid to ruthenium iodide. Get it.
作為該溶劑,雖無特別限制而可因應目的適當選擇,但可舉例如,1-甲基-2-吡咯烷酮(NMP)、二甲基乙醯胺(DMAc)等。 The solvent is appropriately selected depending on the purpose, and is not particularly limited, and examples thereof include 1-methyl-2-pyrrolidone (NMP) and dimethylacetamide (DMAc).
作為得到該聚醯胺酸時的反應溫度,雖無特別限制而可因應目的適當選擇,但可舉例如常溫等。該常溫為20℃~30℃的溫度。 The reaction temperature at the time of obtaining the polyamic acid is not particularly limited and may be appropriately selected depending on the intended purpose, and examples thereof include room temperature and the like. The normal temperature is a temperature of 20 ° C to 30 ° C.
作為得到該聚醯胺酸時的反應時間,雖無特別限制而可因應目的適當選擇,但可舉例如,1天~7天。 The reaction time when the polyamic acid is obtained is not particularly limited and may be appropriately selected depending on the purpose, and may be, for example, from 1 day to 7 days.
該醯亞胺化,可藉由例如,加熱該聚醯胺酸來進行(所謂的熱醯亞胺化)。 The ruthenium imidization can be carried out, for example, by heating the polyamic acid (so-called hydrazine imidization).
該加熱溫度,可舉例如,200℃~400℃等。 The heating temperature is, for example, 200 ° C to 400 ° C or the like.
該加熱時間,可舉例如,1小時~5小時。 The heating time is, for example, 1 hour to 5 hours.
<第2聚醯亞胺> <Second polyimine>
本發明的第2聚醯亞胺,具有下述結構式(3)所示之重複單元。 The second polyimine of the present invention has a repeating unit represented by the following structural formula (3).
該第2聚醯亞胺,亦可具有醯胺酸。該第2聚醯亞胺中,該醯胺酸的量,較佳為該第2聚醯亞胺中的醯亞胺基的10莫耳%以下。 The second polyimine may also have a proline. In the second polyimine, the amount of the amic acid is preferably 10 mol% or less of the quinone imine group in the second polyimine.
該第2聚醯亞胺,在形成平均厚度20μm的薄膜時,該薄膜的線膨脹係數為2.00ppm/K~7.00ppm/K,較佳為3.00ppm/K~7.00ppm/K。 In the second polyimide, when the film having an average thickness of 20 μm is formed, the film has a linear expansion coefficient of 2.00 ppm/K to 7.00 ppm/K, preferably 3.00 ppm/K to 7.00 ppm/K.
該線膨脹係數,可藉由熱機械分析(TMA)求得。 The coefficient of linear expansion can be obtained by thermomechanical analysis (TMA).
具體而言,使用熱機械測定裝置(SII公司製TMA/SS6100),算出線膨脹係數。首先,以膜厚每1μm為4.9mN的方式,對聚醯亞胺的薄膜施加張力,於氮氛圍下,進行30℃~150℃(升溫速度10℃/min)的處理,以去除吸附之水分。接著,在維持張力的狀態下,於氮氛圍下進行冷卻之後,在50℃~350℃(升溫速度5℃/min)下進行測定,算出線膨脹係數。線膨脹係數,係以100℃~200℃中的算術平均值所算出。 Specifically, a linear expansion coefficient was calculated using a thermomechanical measuring device (TMA/SS6100 manufactured by SII Corporation). First, a film is applied to a film of polyimine with a film thickness of 4.9 mN per 1 μm, and a treatment at 30 ° C to 150 ° C (temperature rising rate of 10 ° C/min) is performed under a nitrogen atmosphere to remove adsorbed moisture. . Subsequently, the film was cooled in a nitrogen atmosphere while maintaining the tension, and then measured at 50 ° C to 350 ° C (heating rate 5 ° C / min) to calculate a coefficient of linear expansion. The coefficient of linear expansion is calculated from the arithmetic mean value in the range of 100 ° C to 200 ° C.
該第2聚醯亞胺中,該結構式(3)所示之重複單元的量,雖無特別限制而可因應目的適當選擇,但相對於該第2聚醯亞胺的重複單元的總量,較佳為90莫耳%,更佳為95莫耳%以上,最佳為100莫耳%。此處,該第2聚醯亞胺的重複單元,係指下述通式(A)所示之重複單元。 In the second polyimine, the amount of the repeating unit represented by the structural formula (3) is appropriately selected depending on the purpose, but the total amount of the repeating unit relative to the second polyimine is not particularly limited. Preferably, it is 90% by mole, more preferably 95% by mole or more, and most preferably 100% by mole. Here, the repeating unit of the second polyimine refers to a repeating unit represented by the following formula (A).
該通式(A)中,X表示4價基,Y表示2價基。 In the formula (A), X represents a tetravalent group, and Y represents a divalent group.
該第2聚醯亞胺,係由例如,使四羧酸成分與二胺成分反應而得之。 The second polyimine is obtained, for example, by reacting a tetracarboxylic acid component with a diamine component.
該四羧酸成分,含有下述結構式(1)所示之化合物。 The tetracarboxylic acid component contains a compound represented by the following structural formula (1).
該二胺成分中,相對該二胺成分,較佳為含有下述結構式(2)所示之化合物60莫耳%以上。 In the diamine component, it is preferable to contain 60 mol% or more of the compound represented by the following structural formula (2) with respect to the diamine component.
該二胺成分,含有該結構式(2)所示之化合物95莫耳%以上較佳,含有100莫耳%更佳。 The diamine component preferably contains 95 mol% or more of the compound represented by the structural formula (2), and more preferably contains 100 mol%.
該第2聚醯亞胺,可藉由例如,在溶劑存在下使該四羧酸成分與該二胺成分反應而得到聚醯胺酸之後,使該聚醯胺酸進行醯亞胺化而得之。 The second polyimine can be obtained by reacting the tetracarboxylic acid component with the diamine component in the presence of a solvent to obtain polylysine, and then subjecting the polyamic acid to ruthenium imidization. It.
該溶劑雖無特別限制而可因應目的適當選擇,但可舉例如,1-甲基-2-吡咯烷酮(NMP)、二甲基乙醯胺(DMAc)等。 The solvent is not particularly limited and may be appropriately selected depending on the purpose, and examples thereof include 1-methyl-2-pyrrolidone (NMP) and dimethylacetamide (DMAc).
得到該聚醯胺酸時的反應溫度,雖無特別限制而可因應目的適當選擇,但可舉例如,常溫等。該常溫為20℃~30℃的溫度。 The reaction temperature in the case of obtaining the polyamic acid is not particularly limited and may be appropriately selected depending on the intended purpose, and examples thereof include room temperature and the like. The normal temperature is a temperature of 20 ° C to 30 ° C.
得到該聚醯胺酸時的反應時間,雖無特別限制而可因應目的適當選擇,但可舉例如,1天~7天等。 The reaction time when the polyamic acid is obtained is not particularly limited and may be appropriately selected depending on the purpose, and may be, for example, 1 day to 7 days.
該醯亞胺化,可藉由例如,加熱該聚醯胺酸來進行(所謂的熱醯亞胺化)。 The ruthenium imidization can be carried out, for example, by heating the polyamic acid (so-called hydrazine imidization).
該加熱溫度,可舉例如200℃~400℃等。 The heating temperature is, for example, 200 ° C to 400 ° C or the like.
該加熱時間,可舉例如1小時~5小時等。 The heating time is, for example, 1 hour to 5 hours.
(聚醯胺酸) (polyglycine)
本發明的聚醯胺酸,係四羧酸成分與二胺成分反應所得之聚醯胺酸。 The polylysine of the present invention is a polyamic acid obtained by reacting a tetracarboxylic acid component with a diamine component.
<四羧酸成分> <tetracarboxylic acid component>
該四羧酸成分,含有下述結構式(1)所示之化合物,更因應需求,含有其他的化合物。 The tetracarboxylic acid component contains a compound represented by the following structural formula (1), and further contains other compounds depending on the demand.
該四羧酸成分,含有該結構式(1)所示之化合物90莫耳%以上較佳,含有95莫耳%以上更佳,含有100莫耳%最佳。 The tetracarboxylic acid component preferably contains 90 mol% or more of the compound represented by the structural formula (1), more preferably 95 mol% or more, and most preferably 100 mol%.
<<二胺成分>> <<Diamine component>>
該二胺成分,含有下述結構式(2)所示之化合物60莫耳%以上。 The diamine component contains 60 mol% or more of the compound represented by the following structural formula (2).
該二胺成分,含有該結構式(2)所示之化合物95莫耳%以上較佳,含有100莫耳%更佳。 The diamine component preferably contains 95 mol% or more of the compound represented by the structural formula (2), and more preferably contains 100 mol%.
該聚醯胺酸中,該四羧酸成分與該二胺成分的莫耳比(四羧酸成分/二胺成分),雖無特別限制而可因應目的適當選擇,但較佳為1.00/1.00~0.96/1.00,更佳為1.00/1.00~0.98/1.00。 In the polyamic acid, the molar ratio (tetracarboxylic acid component/diamine component) of the tetracarboxylic acid component and the diamine component is not particularly limited and may be appropriately selected depending on the purpose, but is preferably 1.00/1.00. ~0.96/1.00, more preferably 1.00/1.00~0.98/1.00.
含有該聚醯胺酸10質量%的液體,在25℃下,經過1個月(30天)後的黏度,雖無特別限制而可因應目的適當選擇,但從該液體之塗佈性優良的觀點來看,較佳為1Pa.S以上。 The viscosity of the liquid containing 10% by mass of the polyaminic acid at 25 ° C for one month (30 days) is not particularly limited and may be appropriately selected depending on the purpose, but the coating property from the liquid is excellent. From a point of view, it is preferably 1 Pa. S or above.
含有該聚醯胺酸的液體中,該聚醯胺酸的濃度,較佳為10質量%左右。該濃度,若大幅低於10質量%,則難以較厚地製作薄膜,若大幅超過10質量%,則該聚醯胺酸變得難以溶解。 In the liquid containing the polyamic acid, the concentration of the polyamic acid is preferably about 10% by mass. When the concentration is sufficiently less than 10% by mass, it is difficult to form a film thickly, and if it is more than 10% by mass, the polylysine becomes difficult to dissolve.
該液中的該聚醯胺酸的溶劑,較佳為1-甲基-2-吡咯烷酮(NMP)。 The solvent of the polyproline in the liquid is preferably 1-methyl-2-pyrrolidone (NMP).
例如,於溶劑存在下,使該四羧酸成分與該二胺成分反應,可得到該聚醯胺酸。 For example, the polycarboxylic acid can be obtained by reacting the tetracarboxylic acid component with the diamine component in the presence of a solvent.
作為該溶劑,雖無特別限制而可因應目的適當選擇,但可舉例 如,1-甲基-2-吡咯烷酮(NMP)、二甲基乙醯胺(DMAc)等。 The solvent is not particularly limited and may be appropriately selected depending on the purpose, but may be exemplified For example, 1-methyl-2-pyrrolidone (NMP), dimethylacetamide (DMAc), and the like.
該反應溫度雖無特別限制而可因應目的適當選擇,但可舉例如,常溫等。該常溫為20℃~30℃的溫度。 The reaction temperature is not particularly limited and may be appropriately selected depending on the purpose, and examples thereof include room temperature and the like. The normal temperature is a temperature of 20 ° C to 30 ° C.
該反應時間雖無特別限制而可因應目的適當選擇,但可舉例如,1天~7天等。 The reaction time is not particularly limited and may be appropriately selected depending on the purpose, and may be, for example, from 1 day to 7 days.
(樹脂組成物) (resin composition)
本發明的樹脂組成物,含有本發明的該聚醯亞胺以及本發明的該聚醯胺酸的任一者,更因應需求,含有溶劑等的其他成分。 The resin composition of the present invention contains any of the polyimine of the present invention and the polyamic acid of the present invention, and further contains other components such as a solvent depending on the demand.
該樹脂組成物含有該聚醯胺酸的情況,該樹脂組成物較佳為含有醯亞胺化觸媒。 When the resin composition contains the polyamic acid, the resin composition preferably contains a ruthenium-based catalyst.
<溶劑> <solvent>
該溶劑,可舉例如,間甲酚、2-吡咯烷酮、1-甲基-2-吡咯烷酮、1-乙基-2-吡咯烷酮、1-乙烯-2-吡咯烷酮、二甲基乙醯胺、N,N二甲基甲醯胺、γ-丁內酯、乳酸乙酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、三甘醇二甲醚(Triglyme)等。該等的溶劑可單獨使用,或是亦可組合2種以上使用。 The solvent may, for example, be m-cresol, 2-pyrrolidone, 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1-vinyl-2-pyrrolidone, dimethylacetamide, N, N-dimethylformamide, γ-butyrolactone, ethyl lactate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), triglyme (Triglyme) and the like. These solvents may be used singly or in combination of two or more.
<醯亞胺化觸媒> <醯imination catalyst>
該醯亞胺化觸媒,可舉例如,雜環式3級胺類、脂肪族3級胺類、芳香族3級胺類、脂肪族酸酐、芳香族酸酐等。 Examples of the ruthenium-based catalyst include heterocyclic tertiary amines, aliphatic tertiary amines, aromatic tertiary amines, aliphatic acid anhydrides, and aromatic acid anhydrides.
該雜環式3級胺類,可舉例如,吡啶、甲吡啶、喹啉、咪唑等。 Examples of the heterocyclic tertiary amines include pyridine, pyridyl, quinoline, and imidazole.
該脂肪族3級胺類,可舉例如,三乙基胺等。 The aliphatic tertiary amine may, for example, be triethylamine or the like.
該芳香族3級胺類,可舉例如,N,N-二甲基苯胺等。 Examples of the aromatic tertiary amines include N,N-dimethylaniline and the like.
該脂肪族酸酐,可舉例如,乙酸酐等。 The aliphatic acid anhydride may, for example, be acetic anhydride or the like.
該芳香族酸酐,可舉例如,苯二甲酸酐等。 The aromatic acid anhydride may, for example, be phthalic anhydride or the like.
該等化合物可單獨使用1種,亦可併用2種以上。 These compounds may be used alone or in combination of two or more.
<其他的成分> <Other ingredients>
該其他的成分,可舉例如,交聯劑等。 The other component may, for example, be a crosslinking agent or the like.
<<交聯劑>> <<Crosslinker>>
該交聯劑,可舉例如,環氧樹脂、三聚氰胺樹脂等。 The crosslinking agent may, for example, be an epoxy resin or a melamine resin.
-環氧樹脂- - epoxy resin -
該環氧樹脂,可舉例如,雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、萘型環氧樹脂、脂環式環氧樹脂等。 The epoxy resin may, for example, be a bisphenol A epoxy resin, a bisphenol F epoxy resin, a novolak epoxy resin, a cresol novolak epoxy resin, a naphthalene epoxy resin, or an alicyclic ring. Epoxy resin, etc.
(可撓性顯示器用基板) (substrate for flexible display)
本發明的可撓性顯示器用基板,含有本發明的該聚醯亞胺,及本發明的該聚醯胺酸的任一項,更因應需求,含有其他的成分。 The substrate for a flexible display of the present invention contains the polyimine of the present invention and any of the polyamines of the present invention, and further contains other components as needed.
<其他的成分> <Other ingredients>
該其他的成分,可舉例如,填充材料、表面調整劑、滑劑等。 Examples of the other component include a filler, a surface conditioner, a lubricant, and the like.
該可撓性顯示器用基板的平均厚度,雖無特別限制而可因應目 的適當選擇,但較佳為10μm~30μm。 The average thickness of the substrate for a flexible display can be adjusted according to the average thickness. A suitable choice, but preferably 10 μm to 30 μm.
該可撓性顯示器用基板,可為單層構造,亦可為多層構造。 The substrate for a flexible display may have a single layer structure or a multilayer structure.
該可撓性顯示器用基板的製作方法,並無特別限制而可因應目的適當選擇,可舉例如,將液態的本發明之該樹脂組成物塗佈於塗佈板上並且進行乾燥,再從該塗佈板剝離而成為薄膜的方法等。然而,亦可以具有可撓性的樹脂板作為塗佈板,且不將形成於該塗佈板上的薄膜剝離,而連同該塗佈板一併作為可撓性顯示器用基板。 The method for producing the substrate for a flexible display is not particularly limited and may be appropriately selected depending on the purpose, and for example, the liquid resin composition of the present invention is applied onto a coating plate and dried, and then A method in which a coated plate is peeled off to form a film. However, a flexible resin sheet may be used as the coating sheet, and the film formed on the coating sheet may not be peeled off, and the coated sheet may be used as a substrate for a flexible display.
該塗佈板,可舉例如,玻璃板、金屬板、樹脂薄膜等。 The coating plate may, for example, be a glass plate, a metal plate, a resin film or the like.
該塗佈的方法,可舉例如,滾筒塗佈法、刮刀塗佈法、模塗法、浸塗法、棒塗佈法等。 The coating method may, for example, be a roll coating method, a knife coating method, a die coating method, a dip coating method, a bar coating method, or the like.
該樹脂組成物,含有該聚醯胺酸的情況下,亦可在塗佈後,進行適當加熱,以進行熱醯亞胺化。該熱醯亞胺化的溫度及時間,可舉例如,在製作該聚醯亞胺之中的熱醯亞胺化的溫度及時間等。 When the resin composition contains the polyamic acid, it may be heated to be imidized by heating after application. The temperature and time of the hydrazine imidization may, for example, be the temperature and time of the hydrazine imidization in the production of the polyimine.
具有該可撓性顯示器用基板的可撓性顯示器,可舉例如,有機EL顯示器、電子紙等。 The flexible display having the substrate for a flexible display may, for example, be an organic EL display or an electronic paper.
說明該有機EL顯示器的一例。該有機EL元件,在至少一面為透明的一對陽極及陰極所構成的電極之間,具有發光層。這樣的有機EL元件,可舉例如,下述有機EL元件等。 An example of the organic EL display will be described. This organic EL device has a light-emitting layer between electrodes composed of a pair of anodes and cathodes which are transparent at least on one surface. Examples of such an organic EL device include the following organic EL devices.
(1)該陰極與該發光層之間設有電子傳輸層的有機EL元件(陽極/發光層/電子傳輸層/陰極)(「/」係表示各層鄰接並且積層) (1) An organic EL element (anode/light-emitting layer/electron transport layer/cathode) in which an electron transport layer is provided between the cathode and the light-emitting layer ("/" means that each layer is adjacent and laminated)
(2)該陽極與該發光層之間設有電洞傳輸層的有機EL元件(陽極/電洞傳輸層/發光層/陰極) (2) an organic EL element (anode/hole transport layer/light-emitting layer/cathode) having a hole transport layer between the anode and the light-emitting layer
(3)該陰極與該發光層之間設有電子傳輸層,且該陽極與該發光層之間設有電洞傳輸層的有機EL元件(陽極/電洞傳輸層/發光層/電子傳輸層/陰極) (3) an organic EL element (anode/hole transport layer/light-emitting layer/electron transport layer) provided with an electron transport layer between the cathode and the light-emitting layer, and a hole transport layer between the anode and the light-emitting layer /cathode)
具有(陽極/電洞傳輸層/發光層/電子傳輸層/陰極)所示之層構造的可撓性有機EL顯示器,可藉由例如下述方法來製造:在透明或是不透明的可撓性顯示器用基板上形成陽極,並在透明或是不透明的可撓性顯示器用基板上形成陰極(其中,任一面為透明),在形成該陽極的可撓性顯示器用基板上,依序形成電洞傳輸層、發光層、電子傳輸層,最後在將形成陰極的可撓性顯示器用基板,以夾住上述各層的方式重疊,而形成電極朝向上述各側的態樣,以將端部密封。 A flexible organic EL display having a layer structure (anode/hole transport layer/light emitting layer/electron transport layer/cathode) can be manufactured by, for example, a transparent or opaque flexibility An anode is formed on the substrate for display, and a cathode (where one surface is transparent) is formed on the transparent or opaque substrate for flexible display, and holes are sequentially formed on the substrate for flexible display forming the anode. The transport layer, the light-emitting layer, and the electron transport layer are finally stacked on the flexible display substrate in which the cathodes are formed so as to sandwich the respective layers, and the electrodes are formed to face the respective sides to seal the ends.
【實施例】 [Examples]
以下雖說明本發明的實施例,但本發明並不因為該等的實施例而有任何限制。 The embodiments of the present invention are described below, but the present invention is not limited by the embodiments.
以下的實施例、比較例中,使用下述結構式所示之化合物。對於該等化合物,使用其下方的縮寫。 In the following examples and comparative examples, compounds represented by the following structural formulas were used. For these compounds, the abbreviations below are used.
(製造例1) (Manufacturing Example 1)
<SBPDIDA的合成> <Synthesis of SBPDIDA>
SBPDIDA,係依照Macromol.Chem.Phys.200,1879-1888(1999)所記載的方法合成。該方法如下所示。 SBPDIDA was synthesized according to the method described in Macromol. Chem. Phys. 200, 1879-1888 (1999). The method is as follows.
於氮氣流下,在具備機械攪拌裝置與冷卻管的500mL四頸燒瓶中,加入對伸苯基二胺(PDA)54.14g(500.6mmol)與1-甲基-2-吡咯烷酮(NMP)280g,再以60℃加熱及攪拌。確認溶解之後,逐次少量加入3,3’,4,4’-聯苯四羧酸二酐(BPDA)14.71g(50.00mmol)。在60℃下加熱及攪拌2小時之後,於190℃進行加熱及攪拌4小時。放冷後,對於析出之SBPDIDA進行過濾,並以乙醇500mL洗淨。在100℃的真空烘箱中乾燥12小時,而分離出紅色結晶的SBPDIDA。產量20.93g。產率88.2%。 Under a nitrogen flow, in a 500 mL four-necked flask equipped with a mechanical stirring device and a cooling tube, 54.14 g (500.6 mmol) of p-phenylenediamine (PDA) and 280 g of 1-methyl-2-pyrrolidone (NMP) were added. Heat and stir at 60 °C. After confirming dissolution, 14.71 g (50.00 mmol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) was added in small portions. After heating and stirring at 60 ° C for 2 hours, heating and stirring were carried out at 190 ° C for 4 hours. After allowing to cool, the precipitated SBPDIDA was filtered and washed with 500 mL of ethanol. It was dried in a vacuum oven at 100 ° C for 12 hours to separate the red crystalline SBPDiDA. The yield was 20.93 g. The yield was 88.2%.
(1)1H NMR(DMSO-d6、δ) (1) 1 H NMR (DMSO-d6, δ)
8.34(d,J=8.1Hz,2H),8.32(s,2H),8.04(d,J=7.8Hz,2H),7.04(d,J=8.4Hz,4H),6.64(d,J=8.7Hz,4H),3.85(Brs,4H) 8.34 (d, J = 8.1 Hz, 2H), 8.32 (s, 2H), 8.04 (d, J = 7.8 Hz, 2H), 7.04 (d, J = 8.4 Hz, 4H), 6.64 (d, J = 8.7) Hz, 4H), 3.85 (Brs, 4H)
(2)IR(KBr,cm-1): (2) IR (KBr, cm -1 ):
3438、3328、3215(以上為NH伸縮),1766、1720(以上為醯亞胺羰基伸縮),1516、1383(以上為芳香環伸縮) 3438, 3328, 3215 (above is NH stretching), 1766, 1720 (above is yttrium carbonyl stretching), 1516, 1383 (above is aromatic ring stretching)
(3)m.p.(DSC) (3) m.p. (DSC)
405℃~409℃ 405 ° C ~ 409 ° C
(實施例1) (Example 1)
<聚醯胺酸清漆的調製> <Preparation of polyamic acid varnish>
<<二胺:SBPDIDA,四羧酸成分/二胺成分=1.00/1.00(莫耳比),固體成份10質量%>> <<Diamine: SBPDiDA, tetracarboxylic acid component / diamine component = 1.00 / 1.00 (mole ratio), solid content 10% by mass>>
秤量2.00g的BPDA(6.80mmol)、3.23g的SBPDIDA(6.80mmol),及47.0g的NMP,並置入100mL的玻璃瓶中。在罐磨機(jar mill)中,於室溫下攪拌3天,得到聚醯胺酸清漆。 2.80 g of BPDA (6.80 mmol), 3.23 g of SBPDiDA (6.80 mmol), and 47.0 g of NMP were weighed and placed in a 100 mL glass vial. The mixture was stirred at room temperature for 3 days in a jar mill to obtain a polyamic acid varnish.
(實施例2) (Example 2)
<聚醯胺酸清漆的調製> <Preparation of polyamic acid varnish>
<<二胺:SBPDIDA,四羧酸成分/二胺成分=0.98/1.00(莫耳比),固體成份10質量%>> <<Diamine: SBPDiDA, tetracarboxylic acid component / diamine component = 0.98 / 1.00 (mole ratio), solid content 10% by mass>>
秤量2.00g的BPDA(6.80mmol)、3.29g的SBPDIDA(6.93mmol),及47.6g的NMP,並置入100mL的玻璃瓶中。在罐磨機中,於室溫下攪拌3天,得到聚醯胺酸清漆。 2.80 g of BPDA (6.80 mmol), 3.29 g of SBPIDDA (6.93 mmol), and 47.6 g of NMP were weighed and placed in a 100 mL glass vial. The mixture was stirred at room temperature for 3 days in a pot mill to obtain a polyamic acid varnish.
(比較例1) (Comparative Example 1)
<聚醯胺酸清漆的調製> <Preparation of polyamic acid varnish>
<<二胺:PDA,四羧酸成分/二胺成分=1.00/1.00(莫耳比),固體成份10質量%>> <<Diamine: PDA, tetracarboxylic acid component / diamine component = 1.00 / 1.00 (mole ratio), solid content 10% by mass>>
秤量5.00g的BPDA(16.99mmol)、1.84g的PDA(16.99mmol),及61.5g的NMP,並且置入100mL的玻璃瓶。在罐磨機中,於室溫下攪拌3天,得到聚醯 胺酸清漆。 5.00 g of BPDA (16.99 mmol), 1.84 g of PDA (16.99 mmol), and 61.5 g of NMP were weighed and placed in a 100 mL glass vial. In a pot mill, stir at room temperature for 3 days to obtain polyfluorene Amino acid varnish.
(比較例2) (Comparative Example 2)
<聚醯胺酸清漆的調製> <Preparation of polyamic acid varnish>
<<二胺:PDA,四羧酸成分/二胺成分=0.98/1.00(莫耳比),固體成份10質量%>> <<Diamine: PDA, tetracarboxylic acid component / diamine component = 0.98 / 1.00 (mole ratio), solid content 10% by mass>>
秤量5.00g的BPDA(16.99mmol)、1.88g的PDA(17.38mmol)及61.9g的NMP,並置入100mL的玻璃瓶。在罐磨機中,於室溫下攪拌3天,得到聚醯胺酸清漆。 5.00 g of BPDA (16.99 mmol), 1.88 g of PDA (17.38 mmol), and 61.9 g of NMP were weighed and placed in a 100 mL glass vial. The mixture was stirred at room temperature for 3 days in a pot mill to obtain a polyamic acid varnish.
(比較例3) (Comparative Example 3)
<聚醯胺酸清漆的調製> <Preparation of polyamic acid varnish>
<<二胺:PDA/SBPDIDA(10/1莫耳比),四羧酸成分/二胺成分=0.98/1.00(莫耳比),固體成份10質量%>> <<Diamine: PDA/SBPDIDA (10/1 molar ratio), tetracarboxylic acid component/diamine component=0.98/1.00 (mole ratio), solid content 10% by mass>>
秤量5.00g的BPDA(16.99mmol)、1.67g的PDA(15.45mmol)、0.73g的SBPDIDA(1.54mmol),及NMP66.63g,並置入100mL的玻璃瓶。在罐磨機中,於室溫下攪拌3天,得到聚醯胺酸清漆。 5.00 g of BPDA (16.99 mmol), 1.67 g of PDA (15.45 mmol), 0.73 g of SBPIDDA (1.54 mmol), and NMP 66.63 g were weighed and placed in a 100 mL glass vial. The mixture was stirred at room temperature for 3 days in a pot mill to obtain a polyamic acid varnish.
(聚醯亞胺膜的製作) (Production of polyimine film)
將所得之聚醯胺酸清漆,澆注於設有間隙的玻璃板上。以既定的乾燥條件(記載於表1-1及表1-2中)使該玻璃板乾燥。接著,在250℃/1h+350℃/1h的條件下進行醯亞胺化。冷卻後,將所得之聚醯亞胺膜從玻璃剝除,以進行分離。 為了釋放殘留在聚醯亞胺膜中的應力,在未施加張力的狀態下,進行360℃/1h的熱處理,得到聚醯亞胺膜。 The resulting polyamic acid varnish was cast on a glass plate provided with a gap. The glass plate was dried under predetermined drying conditions (described in Table 1-1 and Table 1-2). Next, hydrazylation was carried out at 250 ° C / 1 h + 350 ° C / 1 h. After cooling, the obtained polyimide film was peeled off from the glass to carry out separation. In order to release the stress remaining in the polyimide film, heat treatment at 360 ° C / 1 h was carried out without applying tension to obtain a polyimide film.
(TMA測定:線膨脹係數(CTE)的測定) (TMA measurement: measurement of coefficient of linear expansion (CTE))
使用熱機械測定裝置(SII公司製TMA/SS6100),算出線膨脹係數。首先,以膜厚每1μm為4.9mN的方式施加張力,在氮氛圍下,進行30℃~150℃(升溫速度10℃/min)的處理,以去除吸附的水分。接著,在維持張力的狀態下,於氮氛圍下進行冷卻之後,以膜厚每1μm為4.9mN的方式施加張力,並在50℃~350℃(升溫速度5℃/min)下進行測定,算出線膨脹係數。結果顯示於表1-1及表1-2,並顯示於圖1。此外,表1-1及表1-2中的線膨脹係數為100℃~200℃的算術平均值。 The coefficient of linear expansion was calculated using a thermomechanical measuring device (TMA/SS6100 manufactured by SII Corporation). First, the tension was applied so that the film thickness was 4.9 mN per 1 μm, and the treatment was carried out at 30 ° C to 150 ° C (temperature rising rate 10 ° C / min) in a nitrogen atmosphere to remove the adsorbed moisture. Then, after cooling in a nitrogen atmosphere while maintaining the tension, tension was applied so that the film thickness was 4.9 mN per 1 μm, and the measurement was performed at 50 ° C to 350 ° C (heating rate 5 ° C / min) to calculate Linear expansion coefficient. The results are shown in Table 1-1 and Table 1-2, and are shown in Figure 1. Further, the linear expansion coefficients in Tables 1-1 and 1-2 are arithmetic mean values of 100 ° C to 200 ° C.
實施例3、4,係使用酸/胺比為1.00的BPDA/SBPDIDA之清漆的情況。雖具有20μm左右的厚度,但在60℃乾燥下,分別顯示3.72ppm/K、3.47ppm/K的線膨脹係數。 Examples 3 and 4 are the case of using a varnish of BPDA/SBPDIDA having an acid/amine ratio of 1.00. Although it has a thickness of about 20 μm, it exhibits a linear expansion coefficient of 3.72 ppm/K and 3.47 ppm/K under drying at 60 °C.
實施例5~9,係使用酸/胺比為0.98的BPDA/SBPDIDA之清漆的情況。實施例5與6,在相同乾燥條件下的厚度雖不同,但分別為3.05ppm/K、4.46ppm/K的低線膨脹係數。 Examples 5 to 9 were the case of using a varnish of BPDA/SBPDIDA having an acid/amine ratio of 0.98. Examples 5 and 6 had different thicknesses under the same drying conditions, but were low linear expansion coefficients of 3.05 ppm/K and 4.46 ppm/K, respectively.
實施例7,係將實施例6中的乾燥時間縮短的情況,線膨脹係數為4.76ppm/K,其係低線膨脹係數。 In Example 7, the drying time in Example 6 was shortened, and the coefficient of linear expansion was 4.76 ppm/K, which was a low coefficient of linear expansion.
實施例8與9,在相同乾燥條件下的厚度雖不同,但分別為6.75ppm/K、5.61ppm/K,為低線膨脹係數。 Examples 8 and 9 have different thicknesses under the same drying conditions, but are 6.75 ppm/K and 5.61 ppm/K, respectively, and have a low coefficient of linear expansion.
因為乾燥時間導致線膨脹係數有所不同,此被認為是其呈現的凝聚力有所差異而產生的結果。 Since the drying time causes the coefficient of linear expansion to be different, this is considered to be the result of the difference in the cohesive force exhibited.
比較例4~7,係改變乾燥條件與平均厚度之情況的比較例。 Comparative Examples 4 to 7 are comparative examples in which the drying conditions and the average thickness were changed.
從比較例1的聚醯胺酸清漆所得到的聚醯亞胺,平均厚度為10μm左右的情況,雖為5ppm/K左右的低線膨脹係數,但若為20μm左右,則線膨脹係數變大,超過14ppm/K。 When the average thickness of the polyamidene obtained from the polyamic acid varnish of Comparative Example 1 is about 10 μm, the low linear expansion coefficient is about 5 ppm/K, but if it is about 20 μm, the linear expansion coefficient becomes large. , more than 14ppm / K.
比較例9,係使用PDA作為大部分之二胺的情況。此情況中,無法使CTE變小,而呈現14.0ppm/K這樣較大的值。 In Comparative Example 9, PDA was used as the majority of the diamine. In this case, the CTE cannot be made small, and a large value of 14.0 ppm/K is exhibited.
(黏度測定) (viscosity measurement)
使用流變計(TA Instruments公司AR-G2),測定25℃下的黏度。結果顯示於表2。 The viscosity at 25 ° C was measured using a rheometer (TA Instruments AR-G2). The results are shown in Table 2.
在25℃下保存53天之後,實施例1的聚醯胺酸清漆(聚醯胺酸含量10質量%)的黏度為14.33Pa.s,實施例2的聚醯胺酸清漆(聚醯胺酸含量10質量%)的黏度為3.94Pa.s。從此情況來看,可清楚瞭解實施例1及2的聚醯胺酸清漆,即使經過53天,亦具有充分的黏度而可用於製膜。另一方面,未使用SBPDIDA的比較例1及比較例2的聚醯胺酸清漆(聚醯胺酸含量10質量%)的黏度,經過9天後,為0.3Pa.s以下,可瞭解對於進行製膜來說其黏度太低。 After storage for 53 days at 25 ° C, the viscosity of the polyamic acid varnish of Example 1 (polyammonic acid content 10% by mass) was 14.33 Pa. s, the viscosity of the polyamic acid varnish (polyglycine content 10% by mass) of Example 2 is 3.94 Pa. s. From this point of view, it can be clearly understood that the polyamic acid varnishes of Examples 1 and 2 have a sufficient viscosity and can be used for film formation even after 53 days. On the other hand, the viscosity of the polyamic acid varnish (polyglycine content: 10% by mass) of Comparative Example 1 and Comparative Example 2 in which SBPDIDA was not used was 0.3 Pa after 9 days. Below s, it can be understood that the viscosity is too low for film formation.
對於實施例3及實施例5中所製作的聚醯亞胺膜,進行以下的評價。結果顯示於表3。 The polyimine films produced in Example 3 and Example 5 were evaluated as follows. The results are shown in Table 3.
(體積電阻率) (volume resistivity)
將聚醯亞胺膜夾入具備直徑50mm之電極的電阻計(resistivity cell),使用高電阻計(high resistance meter 4339B:Agilent公司),以施加100V時的電流值,算出體積電阻率。又,測定時的溫度在25℃以下。 The polyimide film was sandwiched between a resistive cell having an electrode having a diameter of 50 mm, and a volume resistivity was calculated by applying a current value at 100 V using a high resistance meter (high resistance meter 4339B: Agilent). Further, the temperature at the time of measurement was 25 ° C or lower.
(1%重量減少溫度) (1% weight reduction temperature)
將聚醯亞胺膜置入鋁鍋,並使用熱重量測定裝置(TG/DTA6200 SII公司製)進行測定。溫度範圍在30℃~550℃(升溫速度為5℃/min),並於氮氛圍下進行。 The polyimide film was placed in an aluminum pan and measured using a thermogravimetric measuring apparatus (manufactured by TG/DTA6200 SII). The temperature range is from 30 ° C to 550 ° C (heating rate of 5 ° C / min) and is carried out under a nitrogen atmosphere.
(儲存模數E’) (storage modulus E’)
將聚醯亞胺膜裁切為寬度1cm,長度3cm,使用動態黏彈性測定裝置(RSA3 TA公司製)進行測定。溫度範圍係25℃~400℃(升溫速度為5℃/min),施加頻率為1Hz,並且在大氣下進行測定。 The polyimide film was cut into a width of 1 cm and a length of 3 cm, and measured using a dynamic viscoelasticity measuring apparatus (manufactured by RSA3 TA Co., Ltd.). The temperature range was 25 ° C to 400 ° C (temperature up rate was 5 ° C / min), the applied frequency was 1 Hz, and the measurement was performed under the atmosphere.
(斷裂伸長率以及5%拉伸應力) (elongation at break and 5% tensile stress)
將聚醯亞胺膜裁切為寬度1cm、長度10cm,使用萬能試驗機(Autocom AC-50 TSE公司製),以20mm/min進行拉伸試驗,得到應力-應變曲線。藉此,得到斷裂伸長率(%)與5%拉伸應力(MPa)。 The polyimine film was cut into a width of 1 cm and a length of 10 cm, and a tensile test was performed at 20 mm/min using a universal testing machine (manufactured by Autocom AC-50 TSE Co., Ltd.) to obtain a stress-strain curve. Thereby, elongation at break (%) and 5% tensile stress (MPa) were obtained.
從體積電阻率的測定結果,可確認本發明的聚醯亞胺,與以往的聚醯亞胺相同,具有1015Ω.m台的充分絕緣性。 From the measurement results of the volume resistivity, it was confirmed that the polyimine of the present invention has the same molecular weight as the conventional polyimine, and has 10 15 Ω. The insulation of the m station is sufficient.
從1%重量減少溫度的測定結果,可確認本發明的聚醯亞胺,即使在550℃下,連1%的重量都沒有減少,可確認具有充分的耐熱性。此外,測定溫度範圍最大為550℃,係因為所使用之鋁鍋的熔點而有所限制。 From the results of the measurement of the 1% weight loss temperature, it was confirmed that the polyimine of the present invention did not decrease even at a temperature of 550 ° C, and it was confirmed that the heat resistance was sufficient. Further, the measurement temperature range of up to 550 ° C is limited by the melting point of the aluminum pan used.
從儲存模數、斷裂伸長率以及5%拉伸應力的測定結果,可確認本發明的聚醯亞胺薄膜,係具有充分的硬度與韌性的薄膜。 From the measurement results of the storage modulus, the elongation at break, and the tensile stress of 5%, it was confirmed that the polyimide film of the present invention is a film having sufficient hardness and toughness.
[產業上的可利用性] [Industrial availability]
本發明的聚醯亞胺,因為具有低線膨脹係數,故可較佳地應用為可撓性顯示器的基板。 The polyimine of the present invention can be preferably applied as a substrate of a flexible display because it has a low coefficient of linear expansion.
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| WO2019188770A1 (en) * | 2018-03-29 | 2019-10-03 | 住友化学株式会社 | Moisture-sensitive film and sensor using same |
| TWI718592B (en) * | 2018-08-20 | 2021-02-11 | 財團法人紡織產業綜合研究所 | Preparing method of polyamide-imide |
| TWI670295B (en) | 2018-08-20 | 2019-09-01 | 財團法人紡織產業綜合研究所 | Polyamide-imide and method of preparing the same |
| KR102319883B1 (en) * | 2019-01-25 | 2021-11-01 | 주식회사 엘지화학 | Diamine compound, and polyimide precursor and polyimide film prepared by using the same |
| EP3915974B1 (en) * | 2019-01-25 | 2022-08-24 | LG Chem, Ltd. | Diamine compound, and polyimide precursor and polyimide film using same |
| CN111303004B (en) * | 2020-02-27 | 2023-09-29 | 云南大学 | Imide monomer as amino end cap, organic hybridization film and preparation method thereof |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5115090A (en) * | 1990-03-30 | 1992-05-19 | Sachdev Krishna G | Viscosity stable, essentially gel-free polyamic acid compositions |
| NZ258489A (en) * | 1992-12-07 | 1997-03-24 | Commw Scient Ind Res Org | Polymer or oligomer formed from nadic acid, n,n'-bis(aminoaryl) aryldiimide and an aromatic tetracarboxylic acid; oligomeric intermediates; (cured) fibre reinforced composites |
| JPH09188812A (en) * | 1996-01-11 | 1997-07-22 | Mitsui Toatsu Chem Inc | Crystallization accelerator |
| JPH10182607A (en) * | 1996-12-25 | 1998-07-07 | Dainippon Ink & Chem Inc | Diaminodiphenylbisphthalimide compound, method for producing the same, and method for producing dyes and pigments |
| JP4957059B2 (en) * | 2005-04-19 | 2012-06-20 | 宇部興産株式会社 | Polyimide film laminate |
| JP2008044229A (en) * | 2006-08-16 | 2008-02-28 | Toyobo Co Ltd | Multilayered polyimide film and its forming method |
| JP2009067042A (en) * | 2008-06-02 | 2009-04-02 | Ube Ind Ltd | Production method of polyimide film |
| TWI628068B (en) * | 2009-08-21 | 2018-07-01 | 東麗 杜邦股份有限公司 | Polyimide film |
| TWI568795B (en) * | 2011-09-29 | 2017-02-01 | 日產化學工業股份有限公司 | Resin composition for display substrate |
| JP6036361B2 (en) * | 2013-02-07 | 2016-11-30 | 宇部興産株式会社 | Polyimide film and polyimide metal laminate using the same |
-
2014
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|---|---|---|---|---|
| TWI629095B (en) * | 2016-04-08 | 2018-07-11 | 財團法人紡織產業綜合研究所 | Polyimide composition and preparation method of separation membrane |
| US10675590B2 (en) | 2016-04-08 | 2020-06-09 | Taiwan Textile Research Institute | Polyimide composition and preparation method of separation membrane |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016013403A1 (en) | 2016-01-28 |
| JP2016023285A (en) | 2016-02-08 |
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