TW201606868A - Breaking device - Google Patents

Abstract

The subject of the present invention is to provide a segmenting apparatus for segmenting a wafer by using a ring-like frame that is corresponding to the size of the wafer. The solution means is a segmenting apparatus, which comprises a working holding platform for holding a workpiece set, a pressing component for pressing along the predetermined segmentation lines of the held wafer, a gradually feeding means for making the work holding platform and the pressing component execute gradual feeding relatively, a pressing means for making the pressing component approach and leave in a vertical direction in relation to the wafer and for using the pressing component to press the wafer, and a porous board which is formed to be of predetermined hardness and capable of sinking due to the press of the pressing component. When using the pressing component to press the wafer held by an attraction face through the porous board, the porous board will sink along the predetermined segmentation lines, so that the wafer can be segmented along the predetermined segmentation lines certainly.

Description

Breaking device Field of invention

The present invention relates to a breaking device for dividing a wafer into individual wafers.

Background of the invention

A wafer formed on a surface by dividing an element such as an IC or an LSI by a predetermined dividing line is divided into a single chip with a device by dividing along a dividing line. As a method of dividing a wafer, a laser beam is irradiated from a surface side of the wafer along a dividing line, and after a reforming layer is formed inside the wafer, a breaking device having a blade is used along the strength. The reduced dividing line is a method in which the wafer is pressed by the blade and the wafer is divided into individual wafers using the reforming layer as a starting point (see, for example, Patent Documents 1 to 3 below).

When the wafer is divided, since the wafers to be divided into one piece are not scattered, the tape is attached to the ring-shaped annular frame having an opening in the center, and one side of the wafer is faced. The other side is attached to the tape exposed from the opening, and the wafer is supported by the annular frame through the tape.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-148982

Patent Document 2: Japanese Patent Laid-Open Publication No. 2013-038434

Patent Document 3: Japanese Patent Laid-Open Publication No. 2013-058671

Summary of invention

However, in order to press the blade along the dividing line to press the blade, a linear space is formed on the holding surface of the working chuck that holds the wafer to form a dividing line that does not support the wafer, and is pressed. The cut wafer is pressed and expanded toward the space. Therefore, it is impossible to divide the wafers having different intervals of the predetermined lines by using the same work chuck.

The present invention has been made in view of the above circumstances, and an object of the invention is to divide a wafer having a different interval between division lines by using the same work chuck in a dividing device that presses a wafer to divide.

The first invention is a breaking device that divides a wafer along a dividing line to form a wafer, and includes a working chuck, a pressing member, an index feeding means, a pressing means, and a porous plate. The work chuck is configured to hold a workpiece set which is formed by attaching a wafer to an adhesive tape which is attached to the opening of the annular frame having the opening, and is attached thereto. The wafer is formed with a linear starting point corresponding to the predetermined line, and the inner diameter of the opening is larger than the outer diameter of the wafer; the pressing member presses the wafer held by the working chuck along the dividing line; Indexing means is to make this The working clamping table is indexed and fed relative to the pressing member; the pressing means is to make the pressing member approach and away from the wafer held by the working clamping table in a vertical direction to press the wafer with the pressing member; The porous plate is recessed by the pressing of the pressing member, and the working table has a suction surface for sucking and holding one of the wafers, and a holding portion for holding the annular frame, and the holding portion is held by the working plate The workpiece group is pressed and divided by the pressing member along the dividing line.

In the above-described breaking device, it is preferable that when the wafer held by the suction surface is interposed between the porous plates by the pressing member, the upper surface of the annular frame held by the holding portion The relationship with the front end portion of the pressing member is such that the front end portion of the pressing member closest to the attraction surface is at a height that does not contact the upper surface of the annular frame.

According to a second aspect of the invention, there is provided a working chuck for use in the breaking device, wherein the suction surface of the working chuck includes a porous layer formed by a hardness which is recessed by pressing of the pressing member at a region where at least the wafer is held. Further, the wafer can be divided by pressing the wafer along the dividing line by the pressing member.

The breaking device of the present invention includes a working chuck that holds a workpiece group that integrates the annular frame and the wafer through the adhesive tape, and a pressing member that presses along a dividing line of the wafer held by the working chuck. And a porous plate recessed by the pressing of the pressing member, and when the pressing member holds the wafer held by the suction surface of the working chuck, the porous plate The groove is recessed along the dividing line along with the pressed wafer, so that it is not necessary to provide a linear space corresponding to the planned dividing line of the wafer on the suction surface of the working chuck.

According to this, it is possible to reliably divide the wafer along the planned dividing line, and even if the wafer having different intervals of the predetermined dividing lines can be held by the suction surface via the porous plate, the pressing member can be divided.

Further, when the wafer held by the suction surface via the porous plate is pressed by the pressing member, the relationship between the upper surface of the annular frame and the front end of the pressing member held by the holding portion is: The front end portion of the pressing member that has been closest to the attraction surface is at a height that does not contact the upper surface of the annular frame, so that the pressing member does not come into contact with the annular frame.

Therefore, it becomes unnecessary to use an annular frame having a size larger than the size of the wafer, and thus it is possible to prevent the apparatus from being enlarged.

The working clamp of the present invention includes a porous layer recessed by pressing of the pressing member on the suction surface of the working chuck, and the porous layer can be recessed along the dividing line by pressing by the pressing member. The wafer is singulated into wafers.

1‧‧‧Workpieces

10, 10a, 10b‧‧‧ breaking device

11, 20, 30‧‧‧Working table

110, 200, 300‧‧‧ frame

111, 201, 301‧‧‧ Wafer Holding Department

111a, 201a, 301a‧‧‧ attraction

112, 202‧‧‧Framekeeping Department

113, 203‧‧‧1st attraction channel

114, 204‧‧‧2nd attraction channel

12, 22, 32‧ ‧ rotating means

13, 23, 33‧‧‧ attracting sources

14‧‧‧Resisting members

14a‧‧‧ front end

15‧‧‧Measure means

16‧‧‧Divided feeding means

17‧‧‧Porous board

2‧‧‧Processing table

21, 31‧‧‧ porous layer

3‧‧‧ Keep face

302‧‧‧Clamping and holding mechanism

303‧‧‧Frame Mounting Department

304‧‧‧Axis

305‧‧‧Clamping Department

306‧‧‧Attraction channel

4‧‧‧Laser illumination

5‧‧‧Laser beam

6‧‧‧ starting point

D‧‧‧ components

F‧‧‧Ring frame

S‧‧‧ dividing line

T‧‧‧Adhesive tape

W‧‧‧ wafer

Wa‧‧‧ surface

Wb‧‧‧ back

+X, +Y, -Y, +Z, -Z‧‧‧ directions

Fig. 1(a) is a perspective view showing an example of a workpiece group, and Fig. 1(b) is a cross-sectional view showing a state in which a division starting point is formed inside the wafer.

Fig. 2 is a cross-sectional view showing the configuration of a first example of the breaking device.

Fig. 3 is a cross-sectional view showing an operation example of a first example of the breaking device.

Fig. 4 is a cross-sectional view showing the configuration of a second example of the breaking device.

Fig. 5 is a cross-sectional view showing an operation example of a second example of the breaking device.

Fig. 6 is a cross-sectional view showing the configuration of a third example of the breaking device.

Fig. 7 is a cross-sectional view showing an operation example of a third example of the breaking device.

Form for implementing the invention

The wafer W shown in FIG. 1 is an example of a workpiece to be divided by the breaking device 10 shown in FIG. 2 . As shown in FIG. 1(a), on the surface Wa of the wafer W, the element D is formed in each of the regions defined by the lattice-shaped dividing line S. On the back surface Wb opposite to the surface Wa of the wafer W, the element D is not formed. When the wafer W is processed, the adhesive tape T is attached to the back side of the annular frame F having the opening, and the surface Wa side of the wafer W is directed upward and the back surface Wb side is attached to the opening. The adhesive tape T of the portion, wherein the opening portion of the annular frame F has an inner diameter larger than the outer diameter of the wafer W. This is done to form the workpiece group 1 in which the annular frame F and the wafer W are integrated by the adhesive tape T. Further, the adhesive tape T is a type of tape which is formed of, for example, a stretchable substrate and an adhesive layer.

When the wafer W is divided, the division start point is formed along the division planned line S in advance. As shown in FIG. 1(b), the surface Wa side of the wafer W is placed on the holding surface 3 of the processing table 2 holding the workpiece group 1 and is held along the holding surface 3 of the processing table 2, for example, by the laser irradiation means 4. The predetermined line S is divided, and the laser beam 5 having a wavelength that is transparent to the wafer W is condensed inside the wafer W to form a linear division starting point 6 corresponding to the planned dividing line S. Further, by a cutting blade (not shown), a half cut of a groove for forming a depth that does not completely cut the wafer W is performed along the dividing line S on the surface Wa, and the groove is formed. As The starting point can also be divided.

The breaking device 10 shown in FIG. 2 includes a working chuck 11, a pressing member 14, a pressing means 15, a indexing means 16 and a porous plate 17. The work chuck 11 holds a workpiece group 1 in which a split start point 6 is formed inside the wafer W, and the press member 14 is pressed along a dividing line S of the wafer W held by the work chuck 11, and the press is performed. The means 15 causes the pressing member 14 to approach and move in the vertical direction (Z-axis direction) with respect to the wafer W held by the working chuck 11, and presses the wafer W with the pressing member 14, and the indexing feeding means 16 causes the working folder The table 11 and the pressing member 14 are relatively indexed in the Y-axis direction, and the porous plate 17 is formed by the hardness which is recessed by the pressing of the pressing member 14.

The work chuck 11 includes a housing 110, a wafer holding portion 111 formed on the inner peripheral side of the housing 110 to hold the wafer W, and an outer peripheral portion of the housing 110 for holding the annular frame F. The frame holding portion 112. The upper surface of the wafer holding portion 111 is a suction surface 111a that sucks and holds the surface Wa of the wafer W. The wafer holding portion 111 is formed of a porous member such as porous ceramic, and communicates with the suction source 13 through the first suction passage 113 formed inside the casing 110. A rotation means 12 for rotating the work chuck 11 in a predetermined direction is connected to a lower portion of the casing 110.

The frame holding portion 112 communicates with the suction source 13 through the second suction passage 114 formed inside the casing 110. When the workpiece group 1 is held by the work chuck 11, for example, the upper surface of the annular frame F held by the frame holding portion 112 may be located lower than the suction surface 111a of the wafer holding portion 111 (-Z side) position.

The pressing member 14 is, for example, a front end portion thereof as shown in Fig. 1(a) A straight line of the planned dividing line S of the wafer W is formed in a straight line shape. The pressing member 14 is connected to the pressing means 15. The pressing means 15 can press the wafer W through the pressing member 14 by lowering the pressing member 14 in the direction toward the wafer W. Further, the pressing member 14 may be formed in a circular shape like a blade.

The porous plate 17 is placed on the suction surface 111a of the work chuck 11. The porous plate 17 is formed of a film formed of a sintered porous molded body of ultrahigh molecular weight polyethylene powder, and may have a hardness that can be recessed by pressing of the pressing member 14, for example, A porous sheet (SUNMAP HP-5320) supplied by Nitto Denko Corporation was used. The porous sheet has a hardness of a dull hardness D42 in ASTM D2240. The porous plate 17 configured as described above can function as a buffer material when the wafer W is divided by the pressing member 14, and can be recessed depending on the load without hindering the wafer W from dividing the starting point. 6 expansion as a starting point.

Next, an operation example of the breaking device 10 will be described. First, as shown in FIG. 2, the workpiece set 1 is held by the work chuck 11. Specifically, the surface Wa of the wafer W is placed on the porous plate 17 with the adhesive tape T facing upward, and the annular frame F is placed on the frame holding portion 112. Then, the wafer holding portion 111 is attracted to the porous sheet 17 to suck and hold the surface Wa of the wafer W, and is sucked and held by the second holding passage 114 to the frame holding portion 112. Frame F.

Thereafter, as shown in FIG. 3, the pressing member 14 is disposed above the back side Wb side of the wafer W, and the pressing member 14 is positioned to face the wafer W in the Y-axis direction shown in FIG. 1(a). The division planned line S is opposite. Then press The means 15 lowers the pressing member 14 in the -Z direction, and presses the wafer W from the adhesive tape T side with the distal end portion 14a of the pressing member 14.

By applying the load by pressing the wafer W downward by the pressing member 14, the porous plate 17 is recessed with the load applied to the wafer W, and the surface Wa side of the wafer W faces the porous plate 17 Press to expand. Then, the wafer W that cannot withstand the pressing force is divided by the division starting point 6 formed on the division planned line S shown in Fig. 1(a) as a starting point.

At this time, as shown in FIG. 3, the upper surface of the annular frame F is located lower than the suction surface 111a of the wafer holding portion 111, so that the upper surface of the annular frame F held by the frame holding portion 112 is The relationship between the front end of the pressing member 14 is that the front end portion 14a of the pressing member 14 that is closest to the suction surface 111a of the wafer holding portion 111 is located above the upper surface of the annular frame F, that is, it is pressed The front end portion 14a of the member 14 does not contact the relationship of the upper surface of the annular frame F. Therefore, it is possible to prevent the front end portion 14a of the pressing member 14 from coming into contact with the annular frame F and being broken when the wafer W is divided. Moreover, since the annular frame F corresponding to the size of the wafer W can be used in the breaking device 10, it is possible to prevent the apparatus from being excessively enlarged. Further, even if the upper surface of the annular frame F is located at the same height or higher than the suction surface 111a of the wafer holding portion 111, as long as the wafer W is divided by the hardness of the porous plate 17, The front end portion 14a of the pressing member 14 that is closest to the suction surface 111a of the wafer holding portion 111 may be located above the upper surface of the annular frame F.

When the division has been performed along one division planned line S, the pressing member 14 can be moved in the +Y direction by the index feeding means 16 to work. The clamping table 11 is indexed with respect to the pressing member 14, and the pressing member 14 is positioned above the adjacent dividing line S, and the pressing member 14 is pressed in the same manner as described above. When the wafer W has been divided along all the dividing lines S toward the Y-axis direction, the rotating means 12 can be actuated to rotate the working chuck 11 by 90 degrees, and the direction shown in Fig. 1(a) is toward the X-axis. The predetermined dividing line S of the direction is directed in the Y-axis direction, and the same pressing is performed. When the pressing means 15 has been divided along all of the dividing starting points 6, the breaking of the wafer W is ended. This is done to divide the wafer W into wafers containing the element D. Further, in addition to the configuration in which the pressing means 14 is indexed and fed in the Y-axis direction, the working table 11 holding the wafer W may be indexed and fed in the Y-axis direction. That is, as long as the work chuck 11 and the pressing member 14 can be indexed and fed relative to each other.

In the breaking device 10, the porous plate 17 having the hardness which is recessed by the pressing of the pressing member 14 is disposed on the suction surface 111a of the work chuck 11, and thus by the pressing member 14 When the wafer W held by the suction surface 111a of the working chuck 11 is pressed, the porous sheet 17 is recessed along the dividing line S, so that the corresponding dividing line is not provided on the suction surface 111a of the working chuck 11 The linear space of S may also reliably separate the wafer W along the dividing line S.

The breaking device 10a shown in Fig. 4 is a second example of the breaking device. The breaking device 10a is provided with a working chuck 20 that holds the workpiece group 1 shown in Fig. 1, and is formed in the same configuration as the above-described breaking device 10. The work chuck 20 includes a housing 200, a wafer holding portion 201, and a frame holding portion 202. The lower portion of the frame body 200 is connected to a rotation that rotates the work chuck 20 in a predetermined direction. Transfer means 22. The wafer holding portion 201 communicates with the suction source 23 through the first suction passage 203 formed inside the casing 200. Further, the frame holding portion 202 communicates with the suction source 23 through the second suction passage 204 formed inside the casing 200.

As shown in FIG. 4, the porous layer 21 which is recessed by the pressing of the pressing member 14 is provided above the suction surface 201a of the wafer holding portion 201. The porous layer 21 has the same hardness as the porous plate 17 described above.

Next, an operation example of the breaking device 10a will be described. Similarly to the breaking device 10, as shown in FIG. 5, the surface of the wafer W is placed on the porous layer 21 with the adhesive tape T facing upward, and the workpiece group 1 is held by the working chuck 11. . Next, the front end of the pressing member 14 is positioned to face the planned dividing line S of the wafer W in the Y-axis direction shown in FIG. 1(a), and the pressing member 14 is lowered in the -Z direction by the pressing means 15. The wafer W is pressed by the pressing member 14 via the adhesive tape T.

At this time, the load-bearing porous layer 21 applied to the wafer W is recessed, and the surface Wa side of the wafer W is pressed and expanded toward the porous layer 21. In this way, the wafer W that cannot withstand the pressing force is divided by the division starting point 6 as a starting point. Further, similarly to the breaking device 10, when all the dividing starting points 6 have been divided, the pressing means 15 raises the pressing member 14 in the +Z direction, that is, the breaking of the wafer W is completed.

The breaking device 10b shown in Fig. 6 is a third example of the breaking device, and includes a working chuck 30 having a holding and holding mechanism 302 that sandwiches and holds the annular frame. Specifically, the work chuck 30 includes a housing 300, a wafer holding portion 301, and a clamp holding mechanism 302 that sandwiches and holds the annular frame F. A rotating means 32 for rotating the work chuck 30 in a predetermined direction is connected to a lower portion of the casing 300. The wafer holding portion 301 communicates with the suction source 33 through a suction passage 306 formed inside the casing 300. The porous layer 31 which is the same as the porous layer 21 of the breaking device 10a shown in FIGS. 4 and 5 is provided on the suction surface 301a of the wafer holding portion 301.

The clamp holding mechanism 302 is at least a frame mounting portion 303 on which the annular frame F is placed, a shaft portion 304 attached to one end of the frame mounting portion 303, and is rotated about the shaft portion 304 and placed on the frame. The holding portion 303 is formed by a clamping portion 305 to which the annular frame F is fixed.

Next, an operation example of the breaking device 10b will be described. First, as shown in FIG. 7, the workpiece group 1 is held by the work chuck 30. Specifically, the surface Wa side of the wafer W is placed on the porous layer 31 with the adhesive tape T facing upward, and the annular frame F is placed on the frame mounting portion 303. Next, the sandwiching portion 305 is rotated about the shaft portion 304, and the upper portion of the annular frame F is pressed to be fixed.

After the workpiece set 1 is held by the work chuck 30, the front end portion 14a of the pressing member 14 is positioned opposite to the planned dividing line S of the wafer W in the Y-axis direction shown in FIG. 1(a), and is pressed by means of pressing When the pressing member 14 is lowered in the -Z direction, the wafer W is pressed from the adhesive tape T side by the distal end portion 14a of the pressing member 14. At this time, the porous layer 31 is recessed in accordance with the load applied to the wafer W, and the surface Wa side of the wafer W is pressed and expanded toward the porous layer 31, and the wafer W is started from the division starting point 6. And is divided. Further, similarly to the breaking device 10a, when all the dividing starting points 6 have been divided, the pressing member 15 is raised in the +Z direction by the pressing means 15. That is, the breaking of the wafer W is completed.

As described above, in the breaking devices 10a and 10b, the suction faces 201a and 301a of the work chucks 20 and 30 are provided with a porous body formed by a predetermined hardness which is recessed by the pressing of the pressing member 14. Since the layers 21 and 31 are pressed by the pressing member 14 against the wafer W held by the working nips 20 and 30 via the porous layers 21 and 31, the porous layers 21 and 31 themselves are along the dividing line. Since the S is recessed, even if a linear space corresponding to the planned dividing line S is not provided on the attraction faces 201a and 301a, the wafer W can be surely divided along the planned dividing line S.

1‧‧‧Workpieces

10‧‧‧ Breaking device

11‧‧‧Working table

110‧‧‧ frame

111‧‧‧ Wafer Holder

111a‧‧‧Attraction

112‧‧‧Framekeeping Department

113‧‧‧1st attraction channel

114‧‧‧2nd attraction channel

12‧‧‧Rotating means

13‧‧‧Attraction source

14‧‧‧Resisting members

14a‧‧‧ front end

15‧‧‧Measure means

16‧‧‧Divided feeding means

17‧‧‧Porous board

6‧‧‧ starting point

F‧‧‧Ring frame

T‧‧‧Adhesive tape

W‧‧‧ wafer

Wa‧‧‧ surface

Wb‧‧‧ back

+X, +Y, -Y, +Z, -Z‧‧‧ directions

Claims (3)

A breaking device is a breaking device that divides a wafer along a dividing line to form a wafer, and includes: a working chuck for holding a workpiece group, the workpiece group is attached to the wafer to have an opening The opening of the annular frame is formed by covering and attaching an adhesive tape, and the wafer is formed with a linear starting point corresponding to a predetermined dividing line, and an inner diameter of the opening is larger than an outer diameter of the wafer; The pressing member presses the wafer held by the working table along the dividing line; the index feeding means divides the working table relative to the pressing member; and the pressing means is to press the pressing The member is close to and away from the wafer held by the work clamping table in a vertical direction to press the wafer with the pressing member; and the porous plate is recessed by the pressing member pressing, and the working clamping frame is provided And attracting a suction surface for holding one side of the wafer and holding the holding portion of the annular frame, and holding the workpiece group by the work clamping table, and pressing and dividing the wafer along the dividing line by the pressing member The breaking device according to claim 1, wherein when the wafer held by the suction surface is pressed by the pressing member, the upper surface of the annular frame held by the holding portion is as described above Press The relationship of the front end portion of the member is such that the front end portion of the pressing member closest to the attraction surface is at a height that does not contact the upper surface of the annular frame. A working clamping table is a working clamping table used in the breaking device of claim 1 or 2, wherein the suction surface of the working clamping table is provided with a hardness which is recessed by the pressing of the pressing member at least in the area where the wafer is held The formed porous layer is formed so that the wafer can be divided by pressing the wafer along the dividing line by the pressing member.