TW201533071A - 具有酸不穩定基之共聚物、光阻組成物、經塗覆基板及形成電子裝置之方法 - Google Patents
具有酸不穩定基之共聚物、光阻組成物、經塗覆基板及形成電子裝置之方法 Download PDFInfo
- Publication number
- TW201533071A TW201533071A TW103144461A TW103144461A TW201533071A TW 201533071 A TW201533071 A TW 201533071A TW 103144461 A TW103144461 A TW 103144461A TW 103144461 A TW103144461 A TW 103144461A TW 201533071 A TW201533071 A TW 201533071A
- Authority
- TW
- Taiwan
- Prior art keywords
- substituted
- copolymer
- group
- unsubstituted
- monomer
- Prior art date
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 52
- 239000000203 mixture Substances 0.000 title claims abstract description 45
- 229920001577 copolymer Polymers 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000178 monomer Substances 0.000 claims abstract description 63
- -1 aryl alkane Chemical class 0.000 claims description 115
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 125000003118 aryl group Chemical group 0.000 claims description 20
- 239000002253 acid Substances 0.000 claims description 19
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 7
- 150000002596 lactones Chemical class 0.000 claims description 6
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 125000006267 biphenyl group Chemical group 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 claims 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 15
- 239000002585 base Substances 0.000 description 15
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 11
- 238000011109 contamination Methods 0.000 description 10
- 239000007789 gas Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 125000001424 substituent group Chemical group 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000004094 surface-active agent Substances 0.000 description 8
- 238000012795 verification Methods 0.000 description 8
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 229940116333 ethyl lactate Drugs 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 229910052684 Cerium Inorganic materials 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 5
- 238000000572 ellipsometry Methods 0.000 description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- TXLHVCXHFRFNCE-UHFFFAOYSA-N 1,1-diphenylethyl 2-methylprop-2-enoate Chemical compound C=1C=CC=CC=1C(C)(OC(=O)C(=C)C)C1=CC=CC=C1 TXLHVCXHFRFNCE-UHFFFAOYSA-N 0.000 description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 4
- 241000208340 Araliaceae Species 0.000 description 4
- YVGGHNCTFXOJCH-UHFFFAOYSA-N DDT Chemical compound C1=CC(Cl)=CC=C1C(C(Cl)(Cl)Cl)C1=CC=C(Cl)C=C1 YVGGHNCTFXOJCH-UHFFFAOYSA-N 0.000 description 4
- 101000692259 Homo sapiens Phosphoprotein associated with glycosphingolipid-enriched microdomains 1 Proteins 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 4
- 235000003140 Panax quinquefolius Nutrition 0.000 description 4
- 102100026066 Phosphoprotein associated with glycosphingolipid-enriched microdomains 1 Human genes 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 125000003709 fluoroalkyl group Chemical group 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 235000008434 ginseng Nutrition 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 125000002877 alkyl aryl group Chemical group 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 150000007942 carboxylates Chemical class 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 238000010943 off-gassing Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 230000002000 scavenging effect Effects 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 3
- 125000006702 (C1-C18) alkyl group Chemical group 0.000 description 2
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 2
- BHNHHSOHWZKFOX-UHFFFAOYSA-N 2-methyl-1H-indole Chemical compound C1=CC=C2NC(C)=CC2=C1 BHNHHSOHWZKFOX-UHFFFAOYSA-N 0.000 description 2
- PPXAHQRRLKQYTG-UHFFFAOYSA-N 2-phenylpropan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C1=CC=CC=C1 PPXAHQRRLKQYTG-UHFFFAOYSA-N 0.000 description 2
- QDFXRVAOBHEBGJ-UHFFFAOYSA-N 3-(cyclononen-1-yl)-4,5,6,7,8,9-hexahydro-1h-diazonine Chemical compound C1CCCCCCC=C1C1=NNCCCCCC1 QDFXRVAOBHEBGJ-UHFFFAOYSA-N 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
- ROWKJAVDOGWPAT-UHFFFAOYSA-N Acetoin Chemical compound CC(O)C(C)=O ROWKJAVDOGWPAT-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 125000002619 bicyclic group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012527 feed solution Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical class N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 150000004702 methyl esters Chemical class 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 125000006502 nitrobenzyl group Chemical group 0.000 description 2
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 150000003871 sulfonates Chemical class 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GCIYMCNGLUNWNR-UHFFFAOYSA-N (2,4-dinitrophenyl)methyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OCC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O GCIYMCNGLUNWNR-UHFFFAOYSA-N 0.000 description 1
- MCJPJAJHPRCILL-UHFFFAOYSA-N (2,6-dinitrophenyl)methyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OCC1=C([N+]([O-])=O)C=CC=C1[N+]([O-])=O MCJPJAJHPRCILL-UHFFFAOYSA-N 0.000 description 1
- MCVVDMSWCQUKEV-UHFFFAOYSA-N (2-nitrophenyl)methyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OCC1=CC=CC=C1[N+]([O-])=O MCVVDMSWCQUKEV-UHFFFAOYSA-N 0.000 description 1
- SWHAGWLVMRLFKO-UHFFFAOYSA-N (2-nitrophenyl)methyl carbamate Chemical group NC(=O)OCC1=CC=CC=C1[N+]([O-])=O SWHAGWLVMRLFKO-UHFFFAOYSA-N 0.000 description 1
- DLDWUFCUUXXYTB-UHFFFAOYSA-N (2-oxo-1,2-diphenylethyl) 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OC(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 DLDWUFCUUXXYTB-UHFFFAOYSA-N 0.000 description 1
- MSLTZKLJPHUCPU-WNQIDUERSA-M (2s)-2-hydroxypropanoate;tetrabutylazanium Chemical compound C[C@H](O)C([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MSLTZKLJPHUCPU-WNQIDUERSA-M 0.000 description 1
- XQLICAQLNCPJTD-UHFFFAOYSA-N (3-methyl-2-phenylbutan-2-yl) 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OC(C(C)C)(C)C1=CC=CC=C1 XQLICAQLNCPJTD-UHFFFAOYSA-N 0.000 description 1
- LYIULSSMSYSWPB-UHFFFAOYSA-N (4-butoxyphenyl)hydrazine Chemical compound CCCCOC1=CC=C(NN)C=C1 LYIULSSMSYSWPB-UHFFFAOYSA-N 0.000 description 1
- 125000000923 (C1-C30) alkyl group Chemical group 0.000 description 1
- LTHODMZAEOSAFI-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoro-2-[3-(1,1,1,3,3,3-hexafluoro-2-hydroxypropan-2-yl)cyclohexyl]propan-2-ol 2-methylprop-2-enoic acid Chemical compound C(C(=C)C)(=O)O.FC(C(C(F)(F)F)(O)C1CCCC(C1)C(C(F)(F)F)(C(F)(F)F)O)(F)F LTHODMZAEOSAFI-UHFFFAOYSA-N 0.000 description 1
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- OFZYBEBWCZBCPM-UHFFFAOYSA-N 1,1-dimethylcyclobutane Chemical compound CC1(C)CCC1 OFZYBEBWCZBCPM-UHFFFAOYSA-N 0.000 description 1
- GIMDPFBLSKQRNP-UHFFFAOYSA-N 1,1-diphenylethanol Chemical compound C=1C=CC=CC=1C(O)(C)C1=CC=CC=C1 GIMDPFBLSKQRNP-UHFFFAOYSA-N 0.000 description 1
- GTQHJCOHNAFHRE-UHFFFAOYSA-N 1,10-dibromodecane Chemical compound BrCCCCCCCCCCBr GTQHJCOHNAFHRE-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- GYQQFWWMZYBCIB-UHFFFAOYSA-N 1-[diazo-(4-methylphenyl)sulfonylmethyl]sulfonyl-4-methylbenzene Chemical compound C1=CC(C)=CC=C1S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C1=CC=C(C)C=C1 GYQQFWWMZYBCIB-UHFFFAOYSA-N 0.000 description 1
- QZOPRMWFYVGPAI-UHFFFAOYSA-N 1-chloroindole Chemical compound C1=CC=C2N(Cl)C=CC2=C1 QZOPRMWFYVGPAI-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- FFKFRQVYUILJCW-UHFFFAOYSA-N 1-hydroxypyrrolidine-2,5-dione;methanesulfonic acid Chemical compound CS(O)(=O)=O.ON1C(=O)CCC1=O FFKFRQVYUILJCW-UHFFFAOYSA-N 0.000 description 1
- QPAWHGVDCJWYRJ-UHFFFAOYSA-N 1-hydroxypyrrolidine-2,5-dione;trifluoromethanesulfonic acid Chemical compound ON1C(=O)CCC1=O.OS(=O)(=O)C(F)(F)F QPAWHGVDCJWYRJ-UHFFFAOYSA-N 0.000 description 1
- 125000006432 1-methyl cyclopropyl group Chemical group [H]C([H])([H])C1(*)C([H])([H])C1([H])[H] 0.000 description 1
- WVOVXOXRXQFTAS-UHFFFAOYSA-N 1-methyl-7-propan-2-ylphenanthrene-9,10-dione Chemical compound C1=CC=C2C3=CC=C(C(C)C)C=C3C(=O)C(=O)C2=C1C WVOVXOXRXQFTAS-UHFFFAOYSA-N 0.000 description 1
- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 description 1
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- ZWBANJRSWNLUEP-UHFFFAOYSA-N 2,2,2-trichloro-1,1-bis(2-chlorophenyl)ethanol Chemical compound C=1C=CC=C(Cl)C=1C(C(Cl)(Cl)Cl)(O)C1=CC=CC=C1Cl ZWBANJRSWNLUEP-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- VJQJMCBGRYSILI-UHFFFAOYSA-N 2,3-diphenylanthracene Chemical compound C1=CC=CC=C1C1=CC2=CC3=CC=CC=C3C=C2C=C1C1=CC=CC=C1 VJQJMCBGRYSILI-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JIXHYWCLUOGIMM-UHFFFAOYSA-N 2-(2-methoxyethoxy)propanoic acid Chemical compound COCCOC(C)C(O)=O JIXHYWCLUOGIMM-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LVKNZRPSERBSFR-UHFFFAOYSA-M 2-carboxyphenolate;tetramethylazanium Chemical compound C[N+](C)(C)C.OC1=CC=CC=C1C([O-])=O LVKNZRPSERBSFR-UHFFFAOYSA-M 0.000 description 1
- HBZHNVUMFPGVHW-UHFFFAOYSA-N 2-chloro-1h-indole Chemical compound C1=CC=C2NC(Cl)=CC2=C1 HBZHNVUMFPGVHW-UHFFFAOYSA-N 0.000 description 1
- WGQFSUPRSFADLS-UHFFFAOYSA-N 2-ethoxyethyl propaneperoxoate Chemical compound C(C)OCCOOC(CC)=O WGQFSUPRSFADLS-UHFFFAOYSA-N 0.000 description 1
- CKKQLOUBFINSIB-UHFFFAOYSA-N 2-hydroxy-1,2,2-triphenylethanone Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C(=O)C1=CC=CC=C1 CKKQLOUBFINSIB-UHFFFAOYSA-N 0.000 description 1
- RZCDMINQJLGWEP-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpent-4-en-1-one Chemical compound C=1C=CC=CC=1C(CC=C)(O)C(=O)C1=CC=CC=C1 RZCDMINQJLGWEP-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- 125000004398 2-methyl-2-butyl group Chemical group CC(C)(CC)* 0.000 description 1
- 125000004922 2-methyl-3-pentyl group Chemical group CC(C)C(CC)* 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- KLLLJCACIRKBDT-UHFFFAOYSA-N 2-phenyl-1H-indole Chemical compound N1C2=CC=CC=C2C=C1C1=CC=CC=C1 KLLLJCACIRKBDT-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- SALPESUBRHVBPM-UHFFFAOYSA-N 3-chloro-2-methyl-1h-indole Chemical compound C1=CC=C2C(Cl)=C(C)NC2=C1 SALPESUBRHVBPM-UHFFFAOYSA-N 0.000 description 1
- 125000004917 3-methyl-2-butyl group Chemical group CC(C(C)*)C 0.000 description 1
- 125000004919 3-methyl-2-pentyl group Chemical group CC(C(C)*)CC 0.000 description 1
- 125000004921 3-methyl-3-pentyl group Chemical group CC(CC)(CC)* 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229960000549 4-dimethylaminophenol Drugs 0.000 description 1
- YMRDPCUYKKPMFC-UHFFFAOYSA-N 4-hydroxy-2,2,5,5-tetramethylhexan-3-one Chemical compound CC(C)(C)C(O)C(=O)C(C)(C)C YMRDPCUYKKPMFC-UHFFFAOYSA-N 0.000 description 1
- 125000004920 4-methyl-2-pentyl group Chemical group CC(CC(C)*)C 0.000 description 1
- YXZXRYDYTRYFAF-UHFFFAOYSA-M 4-methylbenzenesulfonate;triphenylsulfanium Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 YXZXRYDYTRYFAF-UHFFFAOYSA-M 0.000 description 1
- JNEMMQNNBKHWHN-UHFFFAOYSA-N 4-phenylheptan-4-yl 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OC(CCC)(C1=CC=CC=C1)CCC JNEMMQNNBKHWHN-UHFFFAOYSA-N 0.000 description 1
- OQLZINXFSUDMHM-UHFFFAOYSA-N Acetamidine Chemical compound CC(N)=N OQLZINXFSUDMHM-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 102100024003 Arf-GAP with SH3 domain, ANK repeat and PH domain-containing protein 1 Human genes 0.000 description 1
- 229930192334 Auxin Natural products 0.000 description 1
- RTFRUGQUKHJWAE-UHFFFAOYSA-N CC(=CC)OC1C(=O)OCC1 Chemical compound CC(=CC)OC1C(=O)OCC1 RTFRUGQUKHJWAE-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- AHJKRLASYNVKDZ-UHFFFAOYSA-N DDD Chemical compound C=1C=C(Cl)C=CC=1C(C(Cl)Cl)C1=CC=C(Cl)C=C1 AHJKRLASYNVKDZ-UHFFFAOYSA-N 0.000 description 1
- UCNVFOCBFJOQAL-UHFFFAOYSA-N DDE Chemical group C=1C=C(Cl)C=CC=1C(=C(Cl)Cl)C1=CC=C(Cl)C=C1 UCNVFOCBFJOQAL-UHFFFAOYSA-N 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- YXHKONLOYHBTNS-UHFFFAOYSA-N Diazomethane Chemical class C=[N+]=[N-] YXHKONLOYHBTNS-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 101100380306 Homo sapiens ASAP1 gene Proteins 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 101150003633 PAG2 gene Proteins 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N Phenanthrene Natural products C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- HSHODKXUDASHJR-UHFFFAOYSA-N S(=O)(=O)(O)COC(=O)OCS(=O)(=O)O Chemical class S(=O)(=O)(O)COC(=O)OCS(=O)(=O)O HSHODKXUDASHJR-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 101000987219 Sus scrofa Pregnancy-associated glycoprotein 1 Proteins 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-ISLYRVAYSA-N V-65 Substances CC(C)CC(C)(C#N)\N=N\C(C)(C#N)CC(C)C WYGWHHGCAGTUCH-ISLYRVAYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000003670 adamantan-2-yl group Chemical group [H]C1([H])C(C2([H])[H])([H])C([H])([H])C3([H])C([*])([H])C1([H])C([H])([H])C2([H])C3([H])[H] 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 125000005248 alkyl aryloxy group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N alpha-ketodiacetal Natural products O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 239000002363 auxin Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- IQWCMCBBBRQZRO-UHFFFAOYSA-N benzene;propane Chemical compound CCC.C1=CC=CC=C1.C1=CC=CC=C1 IQWCMCBBBRQZRO-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-M benzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-M 0.000 description 1
- UKXSKSHDVLQNKG-UHFFFAOYSA-N benzilic acid Chemical compound C=1C=CC=CC=1C(O)(C(=O)O)C1=CC=CC=C1 UKXSKSHDVLQNKG-UHFFFAOYSA-N 0.000 description 1
- TXVHTIQJNYSSKO-UHFFFAOYSA-N benzo[e]pyrene Chemical compound C1=CC=C2C3=CC=CC=C3C3=CC=CC4=CC=C1C2=C34 TXVHTIQJNYSSKO-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- BBSMJLCAIWLSOF-UHFFFAOYSA-N butoxybenzene 1,2-diphenylhydrazine trifluoromethanesulfonic acid Chemical compound C1(=CC=CC=C1)NNC1=CC=CC=C1.C(CCC)OC1=CC=CC=C1.FC(S(=O)(=O)O)(F)F BBSMJLCAIWLSOF-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- SBPBAQFWLVIOKP-UHFFFAOYSA-N chlorpyrifos Chemical compound CCOP(=S)(OCC)OC1=NC(Cl)=C(Cl)C=C1Cl SBPBAQFWLVIOKP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000004851 cyclopentylmethyl group Chemical group C1(CCCC1)C* 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012955 diaryliodonium Substances 0.000 description 1
- GLUUGHFHXGJENI-UHFFFAOYSA-N diethylenediamine Natural products C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- PUILDPLJORAWEX-UHFFFAOYSA-N diphenylmethanol Chemical compound C=1C=CC=CC=1C(O)C1=CC=CC=C1.C=1C=CC=CC=1C(O)C1=CC=CC=C1 PUILDPLJORAWEX-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- JUINSXZKUKVTMD-UHFFFAOYSA-N hydrogen azide Chemical class N=[N+]=[N-] JUINSXZKUKVTMD-UHFFFAOYSA-N 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- GFAZHVHNLUBROE-UHFFFAOYSA-N hydroxymethyl propionaldehyde Natural products CCC(=O)CO GFAZHVHNLUBROE-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000007976 iminium ions Chemical class 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- GPKUICFDWYEPTK-UHFFFAOYSA-N methoxycyclohexatriene Chemical group COC1=CC=C=C[CH]1 GPKUICFDWYEPTK-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- DCUJJWWUNKIJPH-UHFFFAOYSA-N nitrapyrin Chemical compound ClC1=CC=CC(C(Cl)(Cl)Cl)=N1 DCUJJWWUNKIJPH-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-O oxonium Chemical group [OH3+] XLYOFNOQVPJJNP-UHFFFAOYSA-O 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- WXVUCMFEGJUVTN-UHFFFAOYSA-N phenyl methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=CC=C1 WXVUCMFEGJUVTN-UHFFFAOYSA-N 0.000 description 1
- GRJHONXDTNBDTC-UHFFFAOYSA-N phenyl trifluoromethanesulfonate Chemical compound FC(F)(F)S(=O)(=O)OC1=CC=CC=C1 GRJHONXDTNBDTC-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical class C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- PWQLFIKTGRINFF-UHFFFAOYSA-N tert-butyl 4-hydroxypiperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCC(O)CC1 PWQLFIKTGRINFF-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical group 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-O triphenylphosphanium Chemical compound C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-O 0.000 description 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 1
- SXPSZIHEWFTLEQ-UHFFFAOYSA-N tröger's base Chemical compound C12=CC=C(C)C=C2CN2C3=CC=C(C)C=C3CN1C2 SXPSZIHEWFTLEQ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- JLYXXMFPNIAWKQ-UHFFFAOYSA-N γ Benzene hexachloride Chemical compound ClC1C(Cl)C(Cl)C(Cl)C(Cl)C1Cl JLYXXMFPNIAWKQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
Abstract
一種共聚物,其包括衍生自下列者之重複單元:經內酯取代之單體;具有低於或等於12的pKa之鹼溶性單體;光酸產生單體;以及具有下式之酸不穩定單體:
□
其中,R1、R2、R3、及Ar係於本文中定義。該共聚物可用作光阻組成物之成分,且該光阻組成物可塗覆於具有欲圖案化之一或多層的基板,或使用於形成電子裝置之方法中。
Description
本發明係關於具有酸不穩定基之共聚物、以及該共聚物於光阻組成物中之用途。
極紫外線(extreme ultraviolet,EUV)輻射會被空氣強烈地吸收,因而EUV工具係在高度真空下進行操作以具有最大源強度。高度真空會增加低分子量光阻成分的氣體釋出(outgassing),其可能會沉積於光學元件。所產生的沉積會降低遮罩及成像鏡的反射性,其會造成到達晶圓表面之EUV能量減少,導致較低的產量及降低的產率。污染亦可能會影響反射光的偏振,此在EUV曝光工具的圖案化能力上可能極為重要。因此,對於顯現出降低的氣體釋出之光阻聚合物係有所需求。
一具體例係一種共聚物,其包含衍生自下列者之重複單元:具有式(I)之酸不穩定單體:
其中,R1為未經取代或經取代之C1-18烷基,R2為未經取代或經取代之C1-18烷基、未經取代或經取代之C7-18芳基烷基、或未經取代或經取代之C6-18芳基,R3為-H、-F、-CH3、或-CF3,以及Ar為未經取代或經取代之C6-18芳基,限制條件為R2及Ar總體上包括至少9個碳原子;經內酯取代之單體;具有低於或等於12的pKa之鹼溶性單體;以及光酸產生單體。
另一具體例係一種光阻組成物,其包含該共聚物。
另一具體例係一種經塗覆基板,其包含:(a)在其表面具有欲圖案化之一或多層的基板;以及(b)在該欲圖案化之一或多層上的光阻組成物之層。
另一具體例係一種形成電子裝置之方法,其包含:(a)將光阻組成物之層施加至基板;(b)使該光阻組成物層圖案式曝光於活化輻射;以及(c)對該經曝光之光阻組成物層進行顯影以提供阻劑浮雕影像。
此等及其他具體例係詳細說明於下。
本發明者等人已認定包含納入特定酸不穩
定單體的共聚物之光阻係顯現出降低的氣體釋出。
一具體例係一種共聚物,其包含衍生自下列者之重複單元:具有式(I)之酸不穩定單體:
其中,R1為未經取代或經取代之C1-18烷基,R2為未經取代或經取代之C1-18烷基、未經取代或經取代之C7-18芳基烷基、或未經取代或經取代之C6-18芳基,R3為-H、-F、-CH3、或-CF3,以及Ar為未經取代或經取代之C6-18芳基,限制條件為R2及Ar總體上包括至少9個碳原子;經內酯取代之單體;具有低於或等於12的pKa之鹼溶性單體;以及光酸產生單體。
在本文中使用時,術語“烷基”包括具有直鏈結構、分枝結構、環狀結構、或前述結構中之二或三者的組合之烷基。
除非另行指明,否則術語“經取代”意指包括至少一個取代基,諸如鹵素(即,F、Cl、Br、I)、羥基、胺基、硫醇基、羧基、羧酸根、酯(包括丙烯酸酯、甲基丙烯酸酯、及內酯)、醯胺、腈、硫醚、二硫醚、硝基、C1-18烷基(包括降基及金剛烷基)、C1-18烯基(包括降烯基)、C1-18烷氧基、C2-18烯氧基(包括乙烯醚)、C6-18芳基、C6-18芳氧基、C7-18烷基芳基、或C7-18烷基芳氧基。應瞭解“氟化”意指具有一或多個併入該基團之氟原子。例如,在標示C1-18
氟烷基之處,該氟烷基可包括一或多個氟原子,例如單一氟原子、二個氟原子(舉例而言,如在1,1-二氟乙基)、三個氟原子(舉例而言,如在2,2,2-三氟乙基)、或在碳的每個自由價之氟原子(舉例而言,如在全氟化基,諸如-CF3、-C2F5-、-C3F7、或-C4F9)。
式(I)中,R1為未經取代或經取代之C1-18烷基。某些具體例中,R1為未經取代或經取代之C1-12烷基,具體而言,未經取代或經取代之C1-6烷基,更具體而言,未經取代之C1-6烷基。R1之具體實例包括甲基、乙基、1-丙基、2-丙基、環丙基、1-丁基、2-丁基、2-甲基-1-丙基、第三丁基、環丁基、1-甲基環丙基、2-甲基環丙基、1-戊基、2-戊基、3-戊基、2-甲基-1-丁基、3-甲基-1-丁基、2-甲基-2-丁基、3-甲基-2-丁基、2,2-二甲基-1-丙基(新戊基)、環戊基、1-甲基環丁基、2-甲基環丁基、3-甲基環丁基、1,2-二甲基環丙基、2,2-二甲基環丙基、2,3-二甲基環丙基、1-己基、2-己基、3-己基、2-甲基-1-戊基、3-甲基-1-戊基、4-甲基-1-戊基、2-甲基-2-戊基、4-甲基-2-戊基、2-甲基-3-戊基、3-甲基-2-戊基、3-甲基-3-戊基、2,2-二甲基-1-丁基、3,3-二甲基-1-丁基、3,3-二甲基-2-丁基、2,3-二甲基-1-丁基、2,3-二甲基-2-丁基、1,2,2-三甲基環丙基、2,2,3-三甲基環丙基、(1,2-二甲基環丙基)甲基、(2,2-二甲基環丙基)甲基、1,2,3-三甲基環丙基、(2,3-二甲基環丙基)甲基、2,2-二甲基環丁基、2,3-二甲基環丁基、(1-甲基環丁基)甲基、1,2-二甲基環丁基、2,3-二甲基環丁基、(2-甲基環丁基)甲
基、1,3-二甲基環丁基、2,4-二甲基環丁基、(3-甲基環丁基)甲基、1-甲基環戊基、2-甲基環戊基、環戊基甲基、環己基、1-降基、2-降基、3-降基、1-金剛烷基、2-金剛烷基、八氫-1-并環戊二烯基(pentalenyl)、八氫-2-并環戊二烯基、八氫-3-并環戊二烯基、八氫-1-苯基-1-并環戊二烯基、八氫-2-苯基-2-并環戊二烯基、八氫-1-苯基-3-并環戊二烯基、八氫-2-苯基-3-并環戊二烯基、十氫-1-萘基、十氫-2-萘基、十氫-3-萘基、十氫-1-苯基-1-萘基、十氫-2-苯基-2-萘基、十氫-1-苯基-3-萘基、及十氫-2-苯基-3-萘基。某些具體例中,R1為C1-3烷基。某些具體例中,R1為甲基、乙基、1-丙基、或2-丙基。某些具體例中,R1為甲基。
式(I)中,R2為未經取代或經取代之C1-18烷基、未經取代或經取代之C7-18芳基烷基、或未經取代或經取代之C6-18芳基。某些具體例中,R2為未經取代或經取代之C1-12烷基、未經取代或經取代之C7-13芳基烷基、或未經取代或經取代之C6-12芳基。未經取代或經取代之C1-18烷基之具體實例係列示於上述R1。未經取代或經取代之C7-18芳基烷基之具體實例包括苄基、1-苯基乙基、2-苯基乙基、1-甲基-1-苯基乙基、(4-甲基苯基)甲基、(4-第三丁基苯基)甲基、1-(4-甲基苯基)乙基、1-(4-第三丁基苯基)乙基、2,3-二氫-1-茚基、2,3-二氫-1-甲基-1-茚基、2,3-二氫-2-甲基-1-茚基、2,3-二氫-3-甲基-1-茚基、1,2,3,4-四氫-1-萘基、1,2,3,4-四氫-2-萘基、1,2,3,4-四氫-1-甲基-1-萘基、1,2,3,4-四氫-2-甲基-1-萘基、1,2,3,4-四氫-1-甲基-2-萘基、1,2,3,4-四氫-2-
甲基-2-萘基、1,2,3,4-四氫-1-苯基-1-萘基、1,2,3,4-四氫-2-苯基-1-萘基、1,2,3,4-四氫-1-苯基-2-萘基、及1,2,3,4-四氫-2-苯基-2-萘基。未經取代或經取代之C6-18芳基之具體實例包括苯基、2-甲基苯基、3-甲基苯基、4-甲基苯基、3-第三丁基苯基、4-第三丁基苯基、1-萘基、2-萘基、聯苯基、1-菲基、2-菲基、9-菲基、1-蒽基、2-蒽基、9-蒽基、1-苊基、3-甲基-1-苊基、4-乙基-1-苊基、1-萉基、及2-甲基-1-萉基。某些具體例中,R2為C1-3烷基、苯基、或經C1-6烷基取代之苯基。某些具體例中,R2為甲基、乙基、1-丙基、2-丙基、1-丁基、或苯基。
式(I)中,R3為-H、-F、-CH3、或-CF3。某些具體例中,R3為-H或-CH3。某些具體例中,R3為-CH3。
式(I)中,Ar為未經取代或經取代之C6-18芳基。未經取代或經取代之C6-18芳基之具體實例包括苯基、2-甲基苯基、3-甲基苯基、4-甲基苯基、3-第三丁基苯基、4-第三丁基苯基、1-萘基、2-萘基、聯苯基、1-菲基、2-菲基、及9-菲基。某些具體例中,Ar為苯基、經C1-6烷基取代之苯基、聯苯基、或萘基。某些具體例中,Ar為苯基、4-第三丁基苯基、聯苯基、或2-萘基。
式(I)中,R2及Ar總體上包括至少9個碳原子。某些具體例中,R2及Ar總體上包括至少10個碳原子,具體而言,至少11個碳原子,更具體而言,至少12個碳原子。
某些具體例中,該酸不穩定單體包含
或其等之組合。
某些具體例中,以整體上100莫耳百分率之用於該共聚物之重複單元為基準計,該共聚物包含10至60莫耳百分率之衍生自該酸不穩定單體之重複單元。在此範圍內,衍生自該酸不穩定單體之重複單元的莫耳百分率可為15至50莫耳百分率,具體而言,20至55莫耳百分率,更具體而言,25至50莫耳百分率。
除了衍生自酸不穩定單體之重複單元以外,該共聚物尚包含衍生自經內酯取代之單體之重複單元、具有低於或等於12的pKa之鹼溶性單體、及光酸產生單體。
有用於形成193奈米光阻共聚物之任何經內酯取代之單體皆可使用。例示性之該等含內酯之單體包括
及其等之組合,其中,Ra為H、F、CN、C1-10烷基、或C1-10氟烷基。
某些具體例中,以整體上100莫耳百分率之用於該共聚物之重複單元為基準計,該共聚物包含25至65莫耳百分率之衍生自該經內酯取代之單體之重複單元。在此範圍內,衍生自該經內酯取代之單體之重複單元的莫耳百分率可為30至60莫耳百分率,具體而言,35至
55莫耳百分率。
該鹼溶性單體在25℃及1重量百分率於二甲基亞碸中進行測定時,具有低於或等於12的pKa。在此限制內,該pKa可為6至12,具體而言,7至11,更具體而言,7至10。某些具體例中,該鹼溶性單體具有式(II):
其中,Ra為-H、-F、-CH3、或-CF3,x為0或1,L為-C(O)-O-或C1-20未經取代或經取代之伸烴基,以及Z為具有低於或等於12的pKa之經鹵化或未經鹵化、芳香族或非芳香族C2-20含羥基之有機基。某些具體例中,Z包含1,1,1,3,3,3-六氟-2-羥基-丙-2-基。在本文中使用時,術語“烴基”,除非具體地確認其為“經取代之烴基”,否則無論是以其本身使用,或作為字首、字尾、或另一術語之片段,均指僅含有碳及氫之殘基。烴基殘基可為脂肪族或芳香族、直鏈狀、環狀、雙環狀、分枝狀、飽和、或不飽和。其亦可含有脂肪族、芳香族、直鏈狀、環狀、雙環狀、分枝狀、飽和、及不飽和烴部分之組合。式(II)之鹼溶性單體之具體實例包括
及其等之組合,其中,Ra為-H、-F、-CH3、或-CF3;以及Rb為C1-4全氟烷基。
某些具體例中,以整體上100莫耳百分率之用於該共聚物之重複單元為基準計,該共聚物包含4至30莫耳百分率之衍生自該鹼溶性單體之重複單元。在此範圍內,衍生自該鹼溶性單體之重複單元的莫耳百分率可為5至20莫耳百分率,具體而言,6至15莫耳百分率。
有用於形成193奈米光阻共聚物之任何光酸產生單體皆可使用。該等單體之例示說明性實例包括
及其等之組合,其中,Ra為-H、-F、-CH3、或-CF3;p為0、1、2、3、4、5、6、7、8、9、或10;k為0、1、2、3、4、5、6、7、8、9、或10;以及G+為碘鎓或鋶陽離子。
該光酸產生單體可包括鋶或碘鎓陽離子G+。某些具體例中,該鋶或碘鎓陽離子具有下式:
其中,X為S或I,其中,當X為I時,則a為2,且當X為S時,則a為3;R0每次出現時係經鹵化或未經鹵化且獨立地為C1-30烷基、多環狀或單環狀C3-30環烷基、多環狀或單環狀C6-30芳基、或前述至少二者之組合,其中,當X為S時,R0基之其中一者係視需要藉由單鍵附接至鄰接的R0基。
光酸產生單體之另外的實例包括
及前述至少二者之組合,其中,Ra係各自獨立地為H、F、-CN、C1-10烷基、或C1-10氟烷基。
某些具體例中,以整體上100莫耳百分率之用於該共聚物之重複單元為基準計,該共聚物包含2至20莫耳百分率之衍生自該光酸產生單體之重複單元。在此範圍內,衍生自該光酸產生單體之重複單元的莫耳百分率可為3至15莫耳百分率,具體而言,4至10莫耳百分率。
該共聚物之特定具體例中,該經內酯取代之單體包含
該鹼溶性單體包含;以及該光酸產生單體包含
該共聚物之另一特定具體例中,該酸不穩定單體包含
或其等之組合;該經內酯取代之單體包含
該鹼溶性單體包含;以及該光酸產生單體包含
一具體例係一種光阻組成物,其包含該共聚物,該共聚物係呈其上述變體中任一者之形式。以該光阻組成物中之固體(排除溶劑)之總重量為基準計,該光阻中該共聚物含量可為50至99重量百分率之量。在此範圍內,該光阻之該共聚物含量可為55至95重量百分率,具體而言,65至90重量百分率。
該光阻組成物可進一步包括一或多種光活
性成分,諸如光酸產生劑、光鹼產生劑、光起始劑、鍵結有或未鍵結光酸產生劑之另外的(甲基)丙烯酸酯系聚合物、鍵結有或未鍵結光酸產生劑之聚羥基苯乙烯系聚合物、及其等之組合。
一般而言,光酸產生劑包括適用於製備光阻目的之彼等光酸產生劑。光酸產生劑包括例如非離子性肟及各種鎓離子鹽。鎓離子包括例如未經取代及經取代之銨離子、未經取代及經取代之鏻離子、未經取代及經取代之砷鎓離子、未經取代及經取代之銻鎓離子、未經取代及經取代之鉍鎓離子、未經取代及經取代之氧鎓離子、未經取代及經取代之鋶離子、未經取代及經取代之硒鎓離子、未經取代及經取代之碲鎓離子、未經取代及經取代之氟鎓離子、未經取代及經取代之氯鎓離子、未經取代及經取代之溴鎓離子、未經取代及經取代之碘鎓離子、未經取代及經取代之胺基重氮鎓離子(經取代之疊氮化氫)、未經取代及經取代之氫氰鎓離子(經取代之氰化氫)、未經取代及經取代之二氮烯鎓離子(RN=N+R2)、未經取代及經取代之亞胺鎓離子(R2C=N+R2)、具有二個雙鍵取代基之四級銨離子(R=N+=R)、硝鎓離子(NO2 +)、雙(三芳基膦)亞胺鎓離子((Ar3P)2N+)、具有一個三鍵取代基之未經取代或經取代之三級銨(R≡NH+)、未經取代及經取代之腈鎓離子(RC≡NR+)、未經取代及經取代之重氮鎓離子(N≡N+R)、具有二個部分雙鍵取代基之三級銨離子(RN+HR)、未經取代及經取代之吡啶鎓離子、具有一個三鍵取代基及一個單鍵取代基
之四級銨離子(R≡N+R)、具有一個三鍵取代基之三級氧鎓離子(R≡O+)、亞硝鎓離子(N≡O+)、具有二個部分雙鍵取代基之三級氧鎓離子(RO+ R)、哌喃鎓離子(C5H5O+)、具有一個三鍵取代基之三級鋶離子(R≡S+)、具有二個部分雙鍵取代基之三級鋶離子(RS+ R)、及硫代亞硝鎓離子(N≡S+)。某些具體例中,該鎓離子係選自未經取代及經取代之二芳基碘鎓離子、及未經取代及經取代之三芳基鋶離子。適當的鎓鹽之實例可見於授予Crivello等人之美國專利第4,442,197號、授予Crivello之美國專利第4,603,101號、及授予Zweifel等人之美國專利第4,624,912號。
適當的光酸產生劑係於化學增幅型光阻之技術中已知者且包括例如:鎓鹽,例如三氟甲烷磺酸三苯基鋶、三氟甲烷磺酸(對第三丁氧基苯基)二苯基鋶、三氟甲烷磺酸參(對第三丁氧基苯基)鋶、對甲苯磺酸三苯基鋶;硝基苄基衍生物,例如對甲苯磺酸2-硝基苄酯、對甲苯磺酸2,6-二硝基苄酯、及對甲苯磺酸2,4-二硝基苄酯;磺酸酯,例如1,2,3-參(甲烷磺醯氧基)苯、1,2,3-參(三氟甲烷磺醯氧基)苯、及1,2,3-參(對甲苯磺醯氧基)苯;重氮甲烷衍生物,例如雙(苯磺醯基)重氮甲烷、雙(對甲苯磺醯基)重氮甲烷;乙二醛二肟衍生物,例如雙-O-(對甲苯磺醯基)-α-二甲基乙二醛二肟、及雙-O-(正丁烷磺醯基)-α-二甲基乙二醛二肟;N-羥基醯亞胺化合物之磺酸酯衍生物,例如N-羥基琥珀醯亞胺甲烷磺酸酯、N-羥基琥珀醯亞胺三氟甲烷磺酸酯;以及含鹵素之三化合物,例如2-(4-甲氧
基苯基)-4,6-雙(三氯甲基)-1,3,5-三、及2-(4-甲氧基萘基)-4,6-雙(三氯甲基)-1,3,5-三。具有具體實例之適當的光酸產生劑係進一步記載於授予Hashimoto等人之美國專利第8,431,325號,於第37欄第11至47行及第41至91欄。
二個具體的光酸產生劑(photoacid generator,PAG)係下列PAG1及PAG2,其製備法係記載於2012年9月15日申請之美國專利申請案序列號61/701,588。
其他適當的磺酸酯PAG包括磺酸化酯及磺醯氧基酮。參見J.of Photopolymer Science and Technology,4(3):337-340(1991),針對適當的磺酸酯PAG之揭示內容,其包括甲苯磺酸苯偶姻酯、α-(對甲苯磺醯氧基)-醋酸第三丁基苯酯及α-(對甲苯磺醯氧基)-醋酸第三丁酯。較佳的磺酸酯PAG亦揭示於授予Sinta等人之美國專利第5,344,742號。
其他有用的光酸產生劑包括硝基苄酯之家族、及s-三衍生物。適當的s-三光酸產生劑係揭示於例如美國專利第4,189,323號。
經鹵化之非離子性光酸產生化合物亦為適當者,例如,諸如1,1-雙[對氯苯基]-2,2,2-三氯乙烷(DDT);1,1-雙[對甲氧基苯基]-2,2,2-三氯乙烷;1,2,5,6,9,10-六溴環癸烷;1,10-二溴癸烷;1,1-雙[對氯苯基]-2,2-二氯乙烷;4,4-二氯-2-(三氯甲基)二苯甲醇;六氯二甲基碸;2-氯-6-(三氯甲基)吡啶;o,o-二乙基-o-(3,5,6三氯-2-吡啶基)硫代磷酸酯;1,2,3,4,5,6-六氯環己烷;N(1,1-雙[對氯苯基]-2,2,2-三氯乙基)乙醯胺;參[2,3-二溴丙基]異三聚氰酸酯;2,2-雙[對氯苯基]-1,1-二氯乙烯;參[三氯甲基]s-三;以及其異構物、類似物、同源物、及殘基化合物。適當的光酸產生劑亦揭示於歐洲專利申請案第0164248及0232972號。對於深紫外線曝光而言尤佳的光酸產生劑包括1,1-雙(對氯苯基)-2,2,2-三氯乙烷(DDT);1,1-雙(對甲氧基苯酚)-2,2,2-三氯乙烷;1,1-雙(氯苯基)-2,2,2-三氯乙醇;參(1,2,3-甲烷磺醯基)苯;以及參(三氯甲基)三。
光酸產生劑進一步包括光可崩解性鹼。光可崩解性鹼包括光可分解性陽離子,且較佳為有用於製備PAG者,其係與弱(pKa>2)酸(例如,諸如C1-20羧酸)之陰離子配對。例示性之該等羧酸包括甲酸、醋酸、丙酸、酒石酸、琥珀酸、環己基羧酸、苄酸、水楊酸、及其他該等羧酸。例示性之光可崩解性鹼包括下列結構之陽離子及陰離
子組合而成者,其中,該陽離子為三苯基鋶或下列者中之一者:
其中,R係獨立地為H、C1-20烷基、C6-20芳基、或C6-20烷基芳基,以及該陰離子為、RC(=O)-O-、或-OH,其中,R係獨立地為H、C1-20烷基、C1-20烷氧基、C6-20芳基、或C6-20烷基芳基。
該光阻可包括光鹼產生劑,其包括以非離子性光分解性發色基團(例如,諸如2-硝基苄基及苯偶姻基)為主體者。例示性之光鹼產生劑為胺基甲酸鄰硝基苄酯。
該光阻可包括光起始劑。光起始劑係用於該光阻組成物中以產生自由基而使交聯劑開始聚合作用。適當的自由基光起始劑包括例如偶氮化合物、含硫化合物、金屬鹽及錯合物、肟、胺、多核化合物、有機羰基化合物及其混合物,如美國專利第4,343,885號第13欄第26行至第17欄第18行所記載;以及9,10-蒽醌;1-氯蒽醌;2-氯蒽醌;2-甲基蒽醌;2-乙基蒽醌;2-第三丁基蒽醌;八甲基蒽醌;1,4-萘醌;9,10-菲醌;1,2-苯并蒽醌;2,3-苯并蒽醌;2-甲基-1,4-萘醌;2,3-二氯萘醌;1,4-二甲基蒽醌;2,3-二甲基蒽醌;2-苯基蒽醌;2,3-二苯基蒽醌;3-氯-2-甲基蒽醌;
惹烯醌(retenequinone);7,8,9,10-四氫萘醌;以及1,2,3,4-四氫苯并蒽-7,12-二酮。其他光起始劑係記載於美國專利第2,760,863號且包括鄰位酮醛基醇(vicinal ketaldonyl alcohol),諸如苯偶姻、新戊偶姻(pivaloin)、偶姻醚,如苯偶姻甲基及乙基醚;以及經α-烴取代之芳香族偶姻,包括α-甲基苯偶姻、α-烯丙基苯偶姻、及α-苯基苯偶姻。美國專利第2,850,445;2,875,047;及3,097,096號所揭示之光可還原性染料及還原劑、以及啡、、及醌類之染料;如美國專利第3,427,161;3,479,185;及3,549,367號所記載之二苯基酮、具有氫供體之2,4,5-三苯基咪唑基二聚物、及其混合物亦可用作光起始劑。
該光阻組成物可進一步包括界面活性劑。例示說明性界面活性劑包括氟化及非氟化界面活性劑,且較佳為非離子性。例示性之氟化非離子性界面活性劑包括全氟C4界面活性劑,諸如可得自3M Corporation之FC-4430及FC-4432界面活性劑;以及氟二醇,諸如得自Omnova之POLYFOXTM PF-636、PF-6320、PF-656、及PF-6520氟界面活性劑。
該光阻組成物可進一步包括作為非光可崩解性鹼之猝滅劑(quencher)。此等包括例如以氫氧化物、羧酸酯、胺、亞胺及醯胺為主體者。該等猝滅劑包括C1-30有機胺、亞胺或醯胺、強鹼(如氫氧化物或烷氧化物)或弱鹼(如羧酸酯)之C1-30四級銨鹽。例示性之猝滅劑包括胺,諸如特羅格爾鹼(Troger's base);受阻胺,諸如二氮雜雙環十
一烯(diazabicycloundecene,DBU)、二氮雜雙環壬烯(diazabicyclononene,DBN)、四羥基異丙基二胺及4-羥基-1-哌啶羧酸第三丁酯;離子性猝滅劑,包括四級烷基銨鹽,諸如氫氧化四丁基銨(tetrabutylammonium hydroxide,TBAH)、2-羥基苄酸四甲基銨(tetramethylammonium 2-hydroxybenzoic acid,TMA OHBA)、及乳酸四丁基銨。適當的猝滅劑係進一步記載於授予Hashimoto等人之美國專利第8,431,325號。
該光阻成分係典型地溶解於用於分散及塗覆之溶劑中。例示性之溶劑包括大茴香醚;醇,包括1-甲氧基-2-丙醇、及1-乙氧基-2-丙醇;酯,包括醋酸正丁酯、乳酸乙酯、醋酸1-甲氧基-2-丙酯、丙酸甲氧基乙氧酯、及丙酸乙氧基乙氧酯;酮,包括環己酮及2-庚酮;以及其等之組合。以該光阻組成物之總重量為基準計,溶劑量可為例如70至99重量百分率,具體而言,85至98重量百分率。
某些具體例中,以固體之總重量為基準計,該光阻組成物之溶液所含該聚合物之量係50至99重量百分率,具體而言,55至95重量百分率,更具體而言,65至90重量百分率。應瞭解本文中此種光阻中的成分所使用之“聚合物”可僅意指本文中所揭示之該共聚物、或該共聚物與有用於光阻的另一聚合物之組合。以固體之總重量為基準計,該光可崩解性鹼可以0.01至5重量百分率,具體而言,0.1至4重量百分率,更具體而言,0.2至
3重量百分率之量存在於該光阻中。以固體之總重量為基準計,可以0.01至5重量百分率,具體而言,0.1至4重量百分率,更具體而言,0.2至3重量百分率之量包括界面活性劑。以固體之總重量為基準計,可以0至50重量百分率,具體而言,1.5至45重量百分率,更具體而言,2至40重量百分率之量包括光酸產生劑。應瞭解總固體包括聚合物、光可崩解性鹼、猝滅劑、界面活性劑、任何添加的PAG、及任何視需要的添加劑,惟排除溶劑。
另一具體例係一種經塗覆基板,其包含:(a)在其表面具有欲圖案化之一或多層的基板;以及(b)在該欲圖案化之一或多層上的該光阻組成物之層。
該基板可由諸如半導體(諸如矽或化合物半導體(如III-V或II-VI))、玻璃、石英、陶瓷、銅等之材料製成。典型地,該基板為半導體晶圓,諸如單晶矽或化合物半導體晶圓,其具有一或多層及圖案化特徵形成於其表面。視需要地,下方基底基板材料本身可經圖案化,例如當希望在基底基板材料中形成溝槽時。在該基底基板材料上形成之層可包括例如一或多個導電層,諸如鋁、銅、鉬、鉭、鈦、鎢、該等金屬之合金、氮化物或矽化物、摻雜非晶矽或摻雜多晶矽之層;一或多個介電層,諸如氧化矽、氮化矽、氮氧化矽或金屬氧化物之層;半導體層,諸如單晶矽;襯層(underlayer);抗反射層,諸如底部抗反射層;及其等之組合。該等層可藉由各種技術形成,該等技術係例如化學氣相沉積(chemical vapor deposition,CVD),諸如
電漿增強CVD、低壓CVD或磊晶生長、物理氣相沉積(physical vapor deposition,PVD),諸如濺鍍或蒸鍍、電鍍或旋轉塗覆。
本發明進一步包括一種形成電子裝置之方法,其包含:(a)將任一種本文中所記載之光阻組成物之層施加至基板;(b)使該光阻組成物層圖案式曝光於活化(如紫外線或電子束)輻射;(c)對該經曝光之光阻組成物層進行顯影以提供阻劑浮雕影像。該方法可視需要進一步包括(d)將該阻劑浮雕圖案蝕刻入下方基板中。
將該光阻組成物施加至該基板係可藉由任何適當的方法完成,該等方法包括旋轉塗覆、噴霧塗覆、浸漬塗覆、及刮刀塗覆。某些具體例中,施加該光阻組成物之層係藉由使用塗覆軌道於溶劑中將該光阻進行旋轉塗覆而完成,其中,該光阻組成物係分散於旋轉中的晶圓。在分散期間,該晶圓可以至高4,000轉/每分鐘(rpm),具體而言,500至3,000rpm,且更具體而言,1,000至2,500rpm之速度進行旋轉。使經塗覆之晶圓旋轉以去除溶劑,並於加熱板進行烘烤以自該膜去除殘留的溶劑及自由體積而使其均勻密實。
接著,使用曝光工具(諸如步進器)施行圖案式曝光,其中,該膜係透過圖案遮罩被照射並從而受到圖案式曝光。某些具體例中,該方法係使用進階型曝光工具,其會產生處於能夠達成高解析度的波長之活化輻射(包括極紫外線(EUV)或電子束(e-beam)輻射)。應理解使用該活化
輻射之曝光會使在曝光區域中的PAG分解並產生酸及分解副產物,且該酸接著會在曝光後烘烤(post exposure bake,PEB)步驟期間引起該聚合物中的化學變化(解鎖(deblocking)酸敏感基而產生鹼溶性基,或者,催化曝光區域中的交聯反應)。該等曝光工具之解析度可為低於30奈米。
接著,藉由利用能夠選擇性地去除該膜之經曝光部分(其中,該光阻為正型)或去除該膜之未經曝光部分(其中,該光阻在經曝光之部位可進行交聯,即,負型)之適當的顯影劑處理經曝光之層而完成對該經曝光之光阻層之顯影。某些具體例中,該光阻為正型,其係以具有酸敏感(可去保護)基之聚合物為主體,且該顯影劑較佳為不含金屬離子之氫氧化四烷基銨溶液,例如,諸如0.26當量之氫氧化四甲基銨水溶液。或者,可藉由使用適當的有機溶劑顯影劑實施負型顯影(negative tone development,NTD)。NTD致使該光阻層之未經曝光部位之去除,由於彼等部位的極性反轉而留下經曝光部位。適當的NTD顯影劑包括例如酮、酯、醚、烴、及其混合物。其他適當的溶劑包括該光阻組成物中所使用者。某些具體例中,該顯影劑為2-庚酮或醋酸丁酯,諸如醋酸正丁酯。無論該顯影為正型或負型,皆由進行顯影而形成圖案。
當使用於一或多種該等圖案形成加工時,該光阻可用於組裝電子裝置及光電裝置,諸如記憶裝置、處理器晶片(包括中央處理單元或CPU)、繪圖晶片、及其
他該等裝置。
表1係針對7種酸不穩定單體列示計算出之物理特性。注意單體1係經取代,使得R2及Ar總體上包括7個碳原子,且單體2至7係經取代,使得R2及Ar總體上包括至少9個碳原子。該等物理特性(在23℃之蒸汽壓、cLogP及分子體積)係使用可於http://www.molinspiration.com/cgi-bin/properties取得之Molinspiration軟體進行計算。蒸汽壓係假定與EUV加工條件下之氣體釋出相關:單體蒸汽壓越高,在EUV加工條件下脫離基之氣體釋出的傾向越高。
[甲基丙烯酸1,1-二苯基乙酯(2)之合成]。甲基丙烯酸1,1-二苯基乙酯之合成方案係顯示於上,其中,“TEA”係指三乙基胺,“DMAP”係指4-(N,N-二甲基胺
基)吡啶,以及“CH2Cl2”係指二氯甲烷。為了合成此單體,將25克(0.126莫耳)之1,1-二苯基乙醇與14毫升(0.138莫耳)之甲基丙烯醯氯於含有19.09克(0.189莫耳)之三乙基胺及5莫耳百分率之4-(N,N-二甲基胺基)吡啶的二氯甲烷(200毫升)中進行處理。在0℃開始進行反應並將反應混合物在室溫攪拌16小時。接著,藉由利用500毫升之去離子水洗滌而將反應混合物猝熄並萃取入二氯甲烷中。於旋轉蒸發器自所得溶液中去除揮發物而產出25克之米色固體,其係藉由溶解於25毫升之二氯甲烷及己烷的65:35重量/重量混合物中並通過氧化鋁塞,利用二氯甲烷、己烷、及三乙基胺的61.75:33.25:5重量/重量/重量混合物進行洗提而予以進一步純化。溶劑去除係產出21克之甲基丙烯酸1,1-二苯基乙酯。
甲基丙烯酸1-苯基-1,2-二甲基丙-1-基酯(3)、甲基丙烯酸1-苯基-1-甲基乙酯(4)、甲基丙烯酸1-甲基-1-(2’-萘基)乙酯(5)、甲基丙烯酸1-(丙-1-基)-1-苯基丁-1-基酯(6)、及甲基丙烯酸1-(萘-2-基)-1-甲基乙酯(7)係藉由類似程序,以對應的三級醇起始而進行製備。
對照組單體甲基丙烯酸1-甲基-1-苯基乙酯(1)係購自ENF Technology且依原樣使用。
[共聚物合成]。藉由將甲基丙烯酸1,1-二苯基乙酯(10克,3.75毫莫耳)、α-甲基丙烯醯氧基-γ-丁內酯(α-GBLMA;8.44克,4.96毫莫耳)、甲基丙烯酸3,5-雙(1,1,1,3,3,3-六氟-2-羥基丙-2-基)環己烷酯(DiHFA;5.75
克,1.14毫莫耳)、及1,1-二氟-2-(甲基丙烯醯氧基)乙烷磺酸苯基二苯并噻吩鎓(TBP PDBTS-F2;2.87克;0.585毫莫耳)溶解於21.96克之乳酸乙酯(EL)及γ-丁內酯(GBL)的70:30體積/體積混合物中而製造進料溶液。藉由將2.59克之起始劑(以Wako V-65形式獲得)溶解於2.59克之乙腈及四氫呋喃的2:1體積/體積混合物中而製備起始劑溶液。
在配備有水冷凝器及用以監控燒瓶中反應的溫度計之2公升3頸圓底燒瓶中施行共聚作用。將內容物使用頂置式攪拌器進行攪拌。將19克之乳酸乙酯(EL)及γ-丁內酯(GBL)的70:30體積/體積混合物裝填至反應器中,並將內容物加熱至75℃。在4小時的進程內使用注射泵將進料溶液及起始劑溶液饋入反應器中。接著,將內容物攪拌2小時,之後將反應使用氫醌(0.05克)猝熄。將內容物冷卻至室溫並利用四氫呋喃稀釋成25重量百分率之固體,並自10倍(以重量計)之二異丙醚及甲醇的95:5重量/重量混合物中沉澱兩次。在各沉澱步驟後將所獲得之共聚物在50℃於真空下乾燥24小時而產生15.2克之共聚物2。
分別以等莫耳量之單體1、3、及4代替單體2而同樣地製備共聚物1、3、及4。
[光阻製備及加工]。含有該共聚物之光阻組成物係在KrF及EUV曝光條件下進行調配及評估。藉由合併4.95克之如上所製備之共聚物、0.1克之OMNOVATM PF656界面活性劑於乳酸乙酯的5重量百分率溶液、1.0克
之四羥基異丙基胺的1重量百分率溶液、37.91克之異丁酸羥基甲酯(HBM)及156克之乳酸乙酯而製備正型光阻組成物。使阻劑溶液通過0.2微米聚四氟乙烯過濾器。於預先塗覆有25奈米襯層之八吋(203.2毫米)直徑矽晶圓,將阻劑調配物離心澆鑄至阻劑厚度為50奈米。將該膜在130℃進行退火90秒並曝光於EUV光源(NA=0.30;四重(Quad);0.22σ/0.68σ),其係同時使用開放框陣列(open frame array)以獲得對比曲線,並透過含有暗視野線/空間圖案之二元式光罩。將經曝光之晶圓在100℃進行曝光後烘烤60秒並接著利用0.26當量之氫氧化四甲基銨溶液進行顯影30秒。
光微影結果係總結於表2,其中,“Es”為矯正能量(sizing energy),“DOF”為焦點深度(depth of focus),“LWR”為線寬粗糙度(line width roughness),以及“PCM”為圖案崩塌邊緣(pattern collapse margin),其係以奈米表示。曝光寬容度(exposure latitude)係定義為用以印記經矯正能量所標準化之目標直徑的+/-10%之曝光能量上的差異。就實施例1及2而言,焦點深度為0,此乃由於並無解析出26奈米線。結果係顯示以低氣體釋出性酸不穩定基製備之共聚物,於某些情形中在EUV具有增進的敏感度及曝光寬容度而展現出相對於比較例而言具競爭性的微影性能。
氣體釋出結果係使用於奈米科學與工程學院(College of Nanoscale Science and Engineering,CNSE)-SEMATECH阻劑氣體釋出計畫之ASML驗證板規程(ASML Witness Plate protocol)測得。SEMATECH已建立高通量(High Volume Throughput,HVT)工具,其係利用電子束曝光系統藉由同時照射驗證基板及鄰近的經阻劑塗覆之晶圓而對候選阻劑的氣體釋出產物之污染潛勢提供數據。
ASML驗證板阻劑氣體釋出規程具有數個步驟。該等步驟包括對驗證板進行氫清除以去除任何現有的污染物,實行驗證板之曝光並同時利用EUV或電子束輻射對經阻劑塗覆之晶圓進行曝光,接著藉由橢圓偏光術(ellipsometry)分析驗證板以測定污染。隨後進行另一氫清除步驟,以及最終為X射線光電子能譜(X-ray Photoelectron
Spectroscopy,XPS)分析以測定殘留之無法清除的污染。舉例而言,參見,Y.Kikuchi,E.Shiobara,H.Tanaka,I.Takagi,K.Katayama,N.Sugie,T.Takahashi,S.Inoue,T.Watanabe,T.Harada,and H.Kinoshita,“Study of EUV outgassing spatial distribution toward witness plate in EUV outgas tester”,Proceedings of SPIE,volume 8679,86790 M1-M9。
橢圓偏光術步驟係利用Woollam M-2000橢圓偏光儀實施以測定在驗證板之污染增長的厚度。此技術之典型的結果係橫跨污染點數毫米寬進行測定時為大約3奈米的污染厚度。橢圓偏光儀係使用約150微米的標稱點尺寸(nominal spot size)來繪製橫跨污染點的厚度。
在第二氫清除步驟(其係自驗證板去除可清除的污染)後,殘留的污染過薄而無法藉由橢圓偏光術進行測定,且瞭解到該組成物甚為重要,因而使用XPS測定。使用Physical Electronics Quantera XPS來測定此種在驗證板之剩餘的污染。使用先前在污染點的橢圓偏光術掃描期間所記錄之基準點參考系統來確定高峰污染時在驗證板的相同位置之測定值。接著,使用XPS來掃描具有對應於阻劑樣品中的所有相關元素之光發射電子能量的測定值之該位置。參見G.Denbeaux,Y.Kandel,G.Kane,D.Alvarado,M.Upadhyaya,Y.Khopkar,A.Friz,K.Petrillo,J.Sohn,C.Sarma,D.Ashworth,“Resist outgassing contamination growth results using both photon and electron exposures”,Proc.of SPIE,volume 8679,pages 86790L-1-7。
表3係提供來自製造商之工具說明,其中,可清除的增長係以奈米表示,且無法清除的增長係表示成(dR/R%),其中,dR/R為鏡反射損失。
結果係總結於表4。結果係顯示單體(2)可清除的碳增長係實質上低於單體(1),且恰當地在製造商針對NXE3100及NXE3300儀器的說明範圍內。
Claims (10)
- 一種共聚物,其包含衍生自下列者之重複單元:具有式(I)之酸不穩定單體:
其中,R1為未經取代或經取代之C1-18烷基;R2為未經取代或經取代之C1-18烷基、未經取代或經取代之C7-18芳基烷基、或未經取代或經取代之C6-18芳基;R3為-H、-F、-CH3、或-CF3;以及Ar為未經取代或經取代之C6-18芳基;限制條件為R2及Ar總體上包括至少9個碳原子;經內酯取代之單體;具有低於或等於12的pKa之鹼溶性單體;以及光酸產生單體。 - 如申請專利範圍第1項所述之共聚物,其中,R1為C1-3烷基。
- 如申請專利範圍第1或2項所述之共聚物,其中,R2為C1-3烷基、苯基、或經C1-6烷基取代之苯基。
- 如申請專利範圍第1至3項中任一項所述之共聚物,其中,Ar為苯基、經C1-6烷基取代之苯基、聯苯基、或萘基。
- 如申請專利範圍第1至4項中任一項所述之共聚物,其中,該經內酯取代之單體包含
其中,該鹼溶性單體包含;以及其中,該光酸產生單體包含 - 如申請專利範圍第1項所述之共聚物,其中,該酸不穩定單體包含
或其等之組合。 - 如申請專利範圍第1項所述之共聚物,其中,該酸不穩定單體包含
或其等之組合;其中,該經內酯取代之單體包含 其中,該鹼溶性單體包含;以及其中,該光酸產生單體包含 - 一種光阻組成物,其包含申請專利範圍第1至7項中任一項所述之共聚物。
- 一種經塗覆基板,其包含:(a)在其表面具有欲圖案化之一或多層的基板;以及(b)在該欲圖案化之一或多層上的申請專利範圍第8項所述之光阻組成物之層。
- 一種形成電子裝置之方法,其包含:(a)將申請專利範圍第8項所述之光阻組成物之層施加至基板;(b)使該光阻組成物層圖案式曝光於活化輻射;以及(c)對該經曝光之光阻組成物層進行顯影以提供阻劑浮雕影像。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361918191P | 2013-12-19 | 2013-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201533071A true TW201533071A (zh) | 2015-09-01 |
| TWI548656B TWI548656B (zh) | 2016-09-11 |
Family
ID=53399870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103144461A TWI548656B (zh) | 2013-12-19 | 2014-12-19 | 具有酸不穩定基之共聚物、光阻組成物、經塗覆基板及形成電子裝置之方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9182669B2 (zh) |
| JP (2) | JP6425524B2 (zh) |
| KR (2) | KR20150072364A (zh) |
| CN (1) | CN104725555A (zh) |
| TW (1) | TWI548656B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759315B (zh) * | 2016-07-22 | 2022-04-01 | 日商東京應化工業股份有限公司 | 阻劑組成物及阻劑圖型形成方法與高分子化合物 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11613519B2 (en) | 2016-02-29 | 2023-03-28 | Rohm And Haas Electronic Materials Llc | Photoacid-generating monomer, polymer derived therefrom, photoresist composition including the polymer, and method of forming a photoresist relief image using the photoresist composition |
| US9921475B1 (en) * | 2016-08-31 | 2018-03-20 | Rohm And Haas Electronic Materials Llc | Photoacid-generating compound, polymer derived therefrom, photoresist composition including the photoacid-generating compound or polymer, and method of forming a photoresist relief image |
| JP7344108B2 (ja) * | 2019-01-08 | 2023-09-13 | 信越化学工業株式会社 | レジスト組成物、及びパターン形成方法 |
| JP7170123B2 (ja) * | 2019-03-27 | 2022-11-11 | 富士フイルム株式会社 | 積層体、組成物、及び、積層体形成用キット |
| US11714355B2 (en) * | 2020-06-18 | 2023-08-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photoresist composition and method of forming photoresist pattern |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL101499C (zh) | 1951-08-20 | |||
| US2850445A (en) | 1955-01-19 | 1958-09-02 | Oster Gerald | Photopolymerization |
| US2875047A (en) | 1955-01-19 | 1959-02-24 | Oster Gerald | Photopolymerization with the formation of coherent plastic masses |
| GB1090142A (en) | 1965-02-26 | 1967-11-08 | Agfa Gevaert Nv | Photochemical insolubilisation of polymers |
| US3479185A (en) | 1965-06-03 | 1969-11-18 | Du Pont | Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers |
| US3549367A (en) | 1968-05-24 | 1970-12-22 | Du Pont | Photopolymerizable compositions containing triarylimidazolyl dimers and p-aminophenyl ketones |
| US4189323A (en) | 1977-04-25 | 1980-02-19 | Hoechst Aktiengesellschaft | Radiation-sensitive copying composition |
| US4442197A (en) | 1982-01-11 | 1984-04-10 | General Electric Company | Photocurable compositions |
| EP0153904B1 (de) | 1984-02-10 | 1988-09-14 | Ciba-Geigy Ag | Verfahren zur Herstellung einer Schutzschicht oder einer Reliefabbildung |
| DE3584316D1 (de) | 1984-06-01 | 1991-11-14 | Rohm & Haas | Lichtempfindliche beschichtungszusammensetzung, aus diesem hergestellte thermisch stabile beschichtungen und verfahren zur herstellung von thermisch stabilen polymerbildern. |
| US4603101A (en) | 1985-09-27 | 1986-07-29 | General Electric Company | Photoresist compositions containing t-substituted organomethyl vinylaryl ether materials |
| CA1307695C (en) | 1986-01-13 | 1992-09-22 | Wayne Edmund Feely | Photosensitive compounds and thermally stable and aqueous developablenegative images |
| JP2632066B2 (ja) | 1990-04-06 | 1997-07-16 | 富士写真フイルム株式会社 | ポジ画像の形成方法 |
| US5344742A (en) | 1993-04-21 | 1994-09-06 | Shipley Company Inc. | Benzyl-substituted photoactive compounds and photoresist compositions comprising same |
| JPH06324494A (ja) | 1993-05-12 | 1994-11-25 | Fujitsu Ltd | パターン形成材料およびパターン形成方法 |
| US7361444B1 (en) | 1998-02-23 | 2008-04-22 | International Business Machines Corporation | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof |
| US6680157B1 (en) | 2000-10-12 | 2004-01-20 | Massachusetts Institute Of Technology | Resist methods and materials for UV and electron-beam lithography with reduced outgassing |
| US7022455B2 (en) | 2001-12-28 | 2006-04-04 | Shipley Company, L.L.C. | Photoacid-labile polymers and photoresists comprising same |
| JP2003287890A (ja) * | 2002-01-23 | 2003-10-10 | Toray Ind Inc | ポジ型感放射線性組成物およびこれを用いたレジストパターンの製造方法 |
| JP2004318020A (ja) * | 2003-04-21 | 2004-11-11 | Toray Ind Inc | ポジ型感放射線性組成物およびこれを用いたレジストパターンの形成方法 |
| US7427463B2 (en) | 2003-10-14 | 2008-09-23 | Intel Corporation | Photoresists with reduced outgassing for extreme ultraviolet lithography |
| JP5066405B2 (ja) | 2007-08-02 | 2012-11-07 | 富士フイルム株式会社 | 電子線、x線又はeuv用レジスト組成物及び該組成物を用いたパターン形成方法 |
| JP4998746B2 (ja) * | 2008-04-24 | 2012-08-15 | 信越化学工業株式会社 | スルホニウム塩を含む高分子化合物、レジスト材料及びパターン形成方法 |
| JP5136792B2 (ja) * | 2008-11-21 | 2013-02-06 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| JP2010182732A (ja) | 2009-02-03 | 2010-08-19 | Toshiba Corp | 半導体装置の製造方法 |
| JP5462681B2 (ja) * | 2009-11-11 | 2014-04-02 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法、高分子化合物、化合物 |
| JP5851688B2 (ja) * | 2009-12-31 | 2016-02-03 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 感光性組成物 |
| JP5534205B2 (ja) * | 2010-08-27 | 2014-06-25 | 日産化学工業株式会社 | 感光性レジスト下層膜形成組成物及びレジストパターンの形成方法 |
| EP2472323A3 (en) * | 2010-12-31 | 2013-01-16 | Rohm and Haas Electronic Materials LLC | Polymerizable photoacid generators |
| EP2472321A1 (en) * | 2010-12-31 | 2012-07-04 | Rohm and Haas Electronic Materials LLC | Method of preparing photoacid-generating monomer |
| EP2472322A2 (en) * | 2010-12-31 | 2012-07-04 | Rohm and Haas Electronic Materials LLC | Photoacid generating monomer and precursor thereof |
| EP2527377A1 (en) | 2011-05-27 | 2012-11-28 | Rohm and Haas Electronic Materials LLC | Surface active additive and photoresist composition comprising same |
| US10025181B2 (en) * | 2011-06-27 | 2018-07-17 | Dow Global Technologies Llc | Polymer composition and photoresist comprising same |
| JP5655754B2 (ja) * | 2011-10-03 | 2015-01-21 | 信越化学工業株式会社 | ポジ型レジスト材料並びにこれを用いたパターン形成方法 |
| JP2013104985A (ja) * | 2011-11-11 | 2013-05-30 | Tokyo Ohka Kogyo Co Ltd | Euv用又はeb用レジスト組成物、及びレジストパターン形成方法 |
| US9182662B2 (en) | 2012-02-15 | 2015-11-10 | Rohm And Haas Electronic Materials Llc | Photosensitive copolymer, photoresist comprising the copolymer, and articles formed therefrom |
| JP6031420B2 (ja) * | 2012-08-31 | 2016-11-24 | ダウ グローバル テクノロジーズ エルエルシー | 光酸発生剤を含む末端基を含むポリマー、前記ポリマーを含むフォトレジストおよびデバイスの製造方法 |
| TWI523872B (zh) * | 2013-02-25 | 2016-03-01 | 羅門哈斯電子材料有限公司 | 光敏共聚物,包括該共聚物之光阻,及形成電子裝置之方法 |
-
2014
- 2014-10-30 US US14/527,884 patent/US9182669B2/en active Active
- 2014-12-05 JP JP2014247343A patent/JP6425524B2/ja active Active
- 2014-12-18 KR KR1020140183030A patent/KR20150072364A/ko not_active Ceased
- 2014-12-19 TW TW103144461A patent/TWI548656B/zh active
- 2014-12-19 CN CN201410818081.6A patent/CN104725555A/zh active Pending
-
2017
- 2017-02-23 KR KR1020170023952A patent/KR20170024598A/ko not_active Abandoned
- 2017-06-07 JP JP2017112492A patent/JP6506346B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759315B (zh) * | 2016-07-22 | 2022-04-01 | 日商東京應化工業股份有限公司 | 阻劑組成物及阻劑圖型形成方法與高分子化合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6506346B2 (ja) | 2019-04-24 |
| JP2017197764A (ja) | 2017-11-02 |
| JP6425524B2 (ja) | 2018-11-21 |
| TWI548656B (zh) | 2016-09-11 |
| US20150177614A1 (en) | 2015-06-25 |
| JP2015129273A (ja) | 2015-07-16 |
| KR20150072364A (ko) | 2015-06-29 |
| KR20170024598A (ko) | 2017-03-07 |
| CN104725555A (zh) | 2015-06-24 |
| US9182669B2 (en) | 2015-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI535741B (zh) | 光酸產生共聚物及相關之光阻組成物、經塗覆基板及形成電子裝置之方法 | |
| JP6015114B2 (ja) | 近赤外光吸収膜形成材料及び近赤外光吸収膜を有する積層膜 | |
| TWI467323B (zh) | 浸潤式曝光用光阻組成物,光阻圖型之形成方法及含氟樹脂 | |
| TWI587088B (zh) | 光酸產生共聚物及相關之光阻組成物、經塗覆基板及形成電子裝置之方法 | |
| TWI548656B (zh) | 具有酸不穩定基之共聚物、光阻組成物、經塗覆基板及形成電子裝置之方法 | |
| TWI588609B (zh) | 負型光阻組成物及圖案形成方法 | |
| KR102239635B1 (ko) | 레지스트 조성물, 레지스트 패턴 형성 방법 및 레지스트용 용매 | |
| KR20180076365A (ko) | 염기-반응성 성분을 포함하는 조성물 및 포토리소그래피 공정 | |
| TWI636326B (zh) | 光鹼產生劑及包括其的光致抗蝕劑組成物 | |
| TWI784272B (zh) | 抗蝕劑組成物、其製造方法及包含其的製品 | |
| TW201940967A (zh) | 組成物,以及阻劑圖型之形成方法及絕緣膜之形成方法 | |
| TWI585531B (zh) | 光阻圖型之形成方法,及負型顯影用光阻組成物 | |
| JP7696994B2 (ja) | 感放射線性樹脂組成物及びパターン形成方法 | |
| TWI536095B (zh) | 感光化射線或感放射線樹脂組成物及使用該組成物之圖案形成方法 | |
| TWI498369B (zh) | 抗蝕劑用酸擴散抑制劑及包含它的抗蝕劑組合物 | |
| KR102248827B1 (ko) | 감방사선성 수지 조성물, 레지스트 패턴 형성 방법, 산 발생체 및 화합물 | |
| KR101814827B1 (ko) | 레지스트 패턴 형성 방법 | |
| US20240201588A1 (en) | Organic salt, photoresist composition including the same, and pattern formation method using the same | |
| KR102884861B1 (ko) | 레지스트 패턴의 형성 방법 및 감방사선성 수지 조성물 | |
| US20240094633A1 (en) | Carboxylate salt, photoresist composition including the same, and method of forming pattern by using the photoresist composition |