TW201532962A - 六方晶氮化硼的製造方法及散熱片 - Google Patents
六方晶氮化硼的製造方法及散熱片 Download PDFInfo
- Publication number
- TW201532962A TW201532962A TW104100500A TW104100500A TW201532962A TW 201532962 A TW201532962 A TW 201532962A TW 104100500 A TW104100500 A TW 104100500A TW 104100500 A TW104100500 A TW 104100500A TW 201532962 A TW201532962 A TW 201532962A
- Authority
- TW
- Taiwan
- Prior art keywords
- boron nitride
- hexagonal boron
- earth metal
- alkaline earth
- metal compound
- Prior art date
Links
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 229910052582 BN Inorganic materials 0.000 title claims abstract description 97
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000013078 crystal Substances 0.000 title abstract description 9
- 230000017525 heat dissipation Effects 0.000 title 1
- 229910052580 B4C Inorganic materials 0.000 claims abstract description 51
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 239000000203 mixture Substances 0.000 claims abstract description 31
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims description 34
- 150000001341 alkaline earth metal compounds Chemical class 0.000 claims description 33
- 229920001971 elastomer Polymers 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000005060 rubber Substances 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 10
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 239000000725 suspension Substances 0.000 claims description 8
- 238000005087 graphitization Methods 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 5
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 claims description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 abstract description 6
- 150000001339 alkali metal compounds Chemical class 0.000 abstract 1
- 150000002736 metal compounds Chemical class 0.000 abstract 1
- 239000000047 product Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 17
- -1 nitrogen-containing compound Chemical class 0.000 description 16
- 239000006227 byproduct Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000010304 firing Methods 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 6
- 239000012467 final product Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000006228 supernatant Substances 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 5
- 150000001342 alkaline earth metals Chemical class 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000007858 starting material Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 4
- 229910000024 caesium carbonate Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000010908 decantation Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 238000005121 nitriding Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 238000000634 powder X-ray diffraction Methods 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 3
- 229910002651 NO3 Inorganic materials 0.000 description 3
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 235000010338 boric acid Nutrition 0.000 description 3
- 229960002645 boric acid Drugs 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004570 mortar (masonry) Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- XGCDBGRZEKYHNV-UHFFFAOYSA-N 1,1-bis(diphenylphosphino)methane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 XGCDBGRZEKYHNV-UHFFFAOYSA-N 0.000 description 1
- QRFALSDGOMLVIR-UHFFFAOYSA-N 1,2,3,4-tetrabromobenzene Chemical compound BrC1=CC=C(Br)C(Br)=C1Br QRFALSDGOMLVIR-UHFFFAOYSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- MFEVGQHCNVXMER-UHFFFAOYSA-L 1,3,2$l^{2}-dioxaplumbetan-4-one Chemical compound [Pb+2].[O-]C([O-])=O MFEVGQHCNVXMER-UHFFFAOYSA-L 0.000 description 1
- AHBGXHAWSHTPOM-UHFFFAOYSA-N 1,3,2$l^{4},4$l^{4}-dioxadistibetane 2,4-dioxide Chemical compound O=[Sb]O[Sb](=O)=O AHBGXHAWSHTPOM-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- OLGOTNLCPQXGLS-UHFFFAOYSA-N 1-ethyl-4-methylpyrazole Chemical compound CCN1C=C(C)C=N1 OLGOTNLCPQXGLS-UHFFFAOYSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- DBOSBRHMHBENLP-UHFFFAOYSA-N 4-tert-Butylphenyl Salicylate Chemical compound C1=CC(C(C)(C)C)=CC=C1OC(=O)C1=CC=CC=C1O DBOSBRHMHBENLP-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- JZHKIUBMQMDQRG-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCCC JZHKIUBMQMDQRG-UHFFFAOYSA-N 0.000 description 1
- GYHQGJNGNWUDKS-UHFFFAOYSA-N CC1(C(=O)OC(C2(CCCO2)C)=O)CCCO1 Chemical compound CC1(C(=O)OC(C2(CCCO2)C)=O)CCCO1 GYHQGJNGNWUDKS-UHFFFAOYSA-N 0.000 description 1
- HPUYRHNNPAHJBD-UHFFFAOYSA-N CCCCCCCCCCCCCOP(O)OC1=CC=CC=C1 Chemical compound CCCCCCCCCCCCCOP(O)OC1=CC=CC=C1 HPUYRHNNPAHJBD-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229910000003 Lead carbonate Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- UQFQONCQIQEYPJ-UHFFFAOYSA-N N-methylpyrazole Chemical compound CN1C=CC=N1 UQFQONCQIQEYPJ-UHFFFAOYSA-N 0.000 description 1
- HDJGANPLOWXKTM-UHFFFAOYSA-N NC(=O)NCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound NC(=O)NCCCC(C(OCC)(OCC)OCC)CCCCCCCC HDJGANPLOWXKTM-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002675 Polyoxyl Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- APQHKWPGGHMYKJ-UHFFFAOYSA-N Tributyltin oxide Chemical compound CCCC[Sn](CCCC)(CCCC)O[Sn](CCCC)(CCCC)CCCC APQHKWPGGHMYKJ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001895 acrylonitrile-acrylic-styrene Polymers 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910000411 antimony tetroxide Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- HNDAFHXJOOETRX-UHFFFAOYSA-N butane;2-tert-butyl-5-methylbenzene-1,4-diol Chemical compound CCCC.CC1=CC(O)=C(C(C)(C)C)C=C1O HNDAFHXJOOETRX-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- GOAJGXULHASQGJ-UHFFFAOYSA-N ethene;prop-2-enenitrile Chemical group C=C.C=CC#N GOAJGXULHASQGJ-UHFFFAOYSA-N 0.000 description 1
- IAJNXBNRYMEYAZ-UHFFFAOYSA-N ethyl 2-cyano-3,3-diphenylprop-2-enoate Chemical compound C=1C=CC=CC=1C(=C(C#N)C(=O)OCC)C1=CC=CC=C1 IAJNXBNRYMEYAZ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- ZPCVPCZOZOVGBE-UHFFFAOYSA-L oct-2-enoate tin(2+) Chemical compound [Sn+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O ZPCVPCZOZOVGBE-UHFFFAOYSA-L 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- LSZKGNJKKQYFLR-UHFFFAOYSA-J tri(butanoyloxy)stannyl butanoate Chemical compound [Sn+4].CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O.CCCC([O-])=O LSZKGNJKKQYFLR-UHFFFAOYSA-J 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- 229940048102 triphosphoric acid Drugs 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- CGRJOQDFNTYSGH-UHFFFAOYSA-N tritylphosphane Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(P)C1=CC=CC=C1 CGRJOQDFNTYSGH-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
- C01B21/0646—Preparation by pyrolysis of boron and nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
- C01B21/0648—After-treatment, e.g. grinding, purification
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/32—Radiation-absorbing paints
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本發明係提供一種六方晶氮化硼之製造方法,其係具有如下的加熱步驟:將含有碳化硼與鹼土族金屬化合物,且前述碳化硼對前述鹼土族金屬化合物之莫耳比為0.5至2.0之混合物,在氨氛圍下以1300至1500℃進行加熱,得到含有六方晶氮化硼之生成物。
Description
本發明係關於一種六方晶氮化硼之製造方法,以及藉由該製造方法所得之含有六方晶氮化硼的散熱片。
六方晶氮化硼係具有石墨類似之層狀構造。由於六方晶氮化硼之導熱性、絕緣性、化學安定性、固體潤滑性及耐熱衝撃性等特性優異,故活用此等特性而被應用於固體潤滑劑、離型劑、樹脂及橡膠之填充材、耐熱性燒結體及絕緣性燒結體等。
六方晶氮化硼之製造方法係已知有各種方法(例如,參照專利文獻1、2)。具體例係如下。
(1)使硼酸、氧化硼、硼砂等含有硼與氧的化合物托持於磷酸鈣等之填充材後,在氨氛圍下燒製之方法。
(2)將上述硼化合物、二氰二醯胺、三聚氰胺、尿素等含氮之化合物的混合物燒製之方法。
(3)使上述硼化合物與碳等之還原性物質的混合物在氮氣氛圍下燒製之方法。
(4)將碳化硼與硼酸酐及以加熱成為硼酸酐之化合物的至少一種粉末之混合物,在氮、氨等含氮之非氧化性氛圍下燒製之方法(參照專利文獻1)。
(5)於氮氛圍燒製碳化硼後之生成物中,混合三氧化二硼及/或其前軀體,並燒製而除去副生成碳之方法(參照專利文獻2)。
[專利文獻1]日本特開平5-000808號公報
[專利文獻2]日本特開2007-308360號公報
然而,以(1)之方法因燒製時含有硼與氧之化合物會融解,故化合物與氨氛圍之接觸面積不會變大。以(2)之方法係因含有氮之化合物於燒製時易氣化或分解,故很難提高氮化硼之生成率。以(3)之方法係在酸洗淨等之簡單的後處理中難以除去之還原性物質易殘留成為雜質。
以(4)之方法,硼酸酐之熔點係低至480℃,在高溫下徐緩揮發而與碳化硼之混合比率變化產生組成偏差。因此,有碳化硼易殘留成為雜質之問題。以(5)之方法係必須有如下之2階段高溫加熱處理:於碳化硼之氮化高溫加熱處理至1800至2200℃,於作為雜質之副生成碳除
去高溫加熱處理至1500至2200℃。因此,有所製作之六方晶氮化硼成本變高之問題。
本發明係為解決習知之六方晶氮化硼之製造方法的問題而成者,在其一態樣中,目的在於提供一種有效率地製造具有高結晶性之六方晶氮化硼的方法。又,本發明係在另一態樣中,目的在於提供一種兼備高絕緣性與高導熱性之散熱片。
本發明係在其一態樣中,係提供六方晶氮化硼之製造方法,其係具有如下之加熱步驟:將含有碳化硼與鹼土族金屬化合物且前述碳化硼對前述鹼土族金屬化合物之莫耳比為0.5至2.0之混合物,在氨氛圍下以1300至1500℃進行加熱,得到含有六方晶氮化硼之生成物。
上述製造方法係具有將以特定之莫耳比含有碳化硼與鹼土族金屬化合物之混合物在氨氛圍下,以較習知更低的溫度加熱而得到含有六方晶氮化硼之生成物的加熱步驟。以如此之加熱步驟係可讓用來作為原料之碳化硼與鹼土族金屬化合物充分反應。因此,可充分降低原料之殘存量與副生成物之生成量,有效率地製造六方晶氮化硼。經過上述加熱步驟所得之六方晶氮化硼具有高的結晶性。
鹼土族金屬化合物係可含有選自由碳酸鈣、碳酸鍶及碳酸鋇所成之群中的至少1種。上述製造方法係可具有如下之精製步驟:從混合生成物與含有酸之洗淨液
所得之懸濁液,除去含有與六方晶氮化硼相異之化合物的溶液,得到含有六方晶氮化硼之固形物。六方晶氮化硼之平均粒徑可為0.1至300μm,石墨化指數(GI)可為6以下。
本發明係在一個態樣中,提供含有:以上述製造方法所得之六方晶氮化硼、與樹脂及橡膠之至少一者的散熱片。如此之散熱片因係含有以上述製造方法所得且具高結晶性的六方晶氮化硼,故兼備高絕緣性與高導熱性。
本發明係在一個態樣中,可提供有效率地製造具有高結晶性之六方晶氮化硼的方法。又,本發明係在另一個態樣中,可提供兼備高絕緣性與高導熱性之散熱片。
10‧‧‧散熱片
第1圖係表示本發明之散熱片的一實施形態之立體圖。
以下詳細說明本發明之一實施形態。又,以下之實施形態係用以說明本發明之例示,並無將本發明限定於以下內容之意旨。本實施形態之製造方法係可藉由將特定之調配比的碳化硼及鹼土族金屬化合物之混合物,在氨氛圍下以較習知技術更低之燒製溫度加熱,以有效率地得到以習知技術無法達成之高結晶性(高結晶)的六方晶
氮化硼。
<起始原料>
與習知技術之一大差異,可舉例如作為本實施形態之製造方法的起始物質之碳化硼與鹼土族金屬化合物的莫耳比,為碳化硼/鹼土族金屬化合物=0.5至2.0。在習知技術之以碳化硼作為起始物質的六方晶氮化硼之製造方法(特許文獻1及2)中,並未添加鹼土族金屬化合物。
又,在習知技術之以正硼酸作為起始物質之六方晶氮化硼之製造方法中,正硼酸/鹼土族金屬化合物之莫耳比為3以上,與本實施形態很大差異。
若碳化硼對鹼土族金屬化合物之莫耳比(碳化硼/鹼土族金屬化合物之莫耳比)超過2.0,則無法充分提高六方晶氮化硼之結晶性。又,氮化反應未充分進行至碳化硼粒子之內部而增加碳化硼之殘存量。因此,生成物成為六方晶氮化硼與碳化硼之混合物。另外,碳化硼/鹼土族金屬化合物之莫耳比未達0.5時,鹼土族金屬化合物變得過剩,六方晶氮化硼成為玻璃狀。因此,變得很難將六方晶氮化硼從爐內取出,無法有效率地製造。
碳化硼對鹼土族金屬化合物之莫耳比的下限可為0.6,亦可為1.0。該莫耳比之上限可為1.8。
本實施形態中源自含有碳化硼及鹼土族金屬之混合物的六方晶氮化硼之生成機構係可如下述推定。
(1)於碳化硼粒子之表面形成鹼土族金屬之硼酸鹽。
(2)上述硼酸鹽發揮如助熔劑之作用而於碳化硼粒子
表面生成六方晶氮化硼。
(3)氮化反應進行至碳化硼粒子內部而成為六方晶氮化硼粒子。
亦即,以特定之莫耳比使用碳化硼與鹼土族金屬化合物係可得到具有高結晶性之六方晶氮化硼粒子的原因之一。
<加熱步驟>
本實施形態中之碳化硼及鹼土族金屬化合物的混合物之加熱係在氨氛圍下以1300至1500℃進行。習知技術之以碳化硼作為起始原料之六方晶氮化硼之製造方法的加熱溫度必須為1800至2200℃(特許文獻2)。如此,在本實施形態係加熱溫度低,即使比較廉價之加熱爐亦可充分應付,故成本上優越。
加熱溫度未達1300℃時,氮化反應無法充分進行至碳化硼粒子之內部,而增加碳化硼之殘存量。因此,生成物成為六方晶氮化硼與碳化硼之混合物。六方晶氮化硼之結晶性亦降低。若加熱溫度超過1500℃,氨之分解較氮化反應先發生,無法生成六方晶氮化硼。
又,從經濟性之觀點,最高加熱溫度中之保持時間較佳為10小時以下,更佳為5小時以下。該保持時間之下限例如可為1小時,亦可為2小時。加熱爐係可使用公知之工業爐。可舉例如管狀電爐、箱型燒製爐、隧道式爐、及旋轉窯。
以加熱步驟所得之加熱後的生成物(加熱生
成物)係含有粒子狀六方晶氮化硼作為主成分。加熱生成物中之六方晶氮化硼的含有量係例如可為60質量%以上,亦可為70質量%以上。加熱生成物係可含有與六方晶氮化硼相異之副生成物。於加熱步驟產生之副生成物係可以如下之精製步驟除去。
<精製步驟(洗淨處理)>
於加熱步驟所得之加熱生成物係除了六方晶氮化硼之外,可含有作為副生成物之鹼土族金屬的硼酸鹽及/或鹼土族金屬的硼化物。與六方晶氮化硼相異之化合物的此等副生成物係與酸反應而生成硝酸鹽。此等硝酸鹽係可溶於水,故可藉由使用含有酸之洗淨液與視需要之水之洗淨處理除去副生成物。藉由除去副生成物,可得到六方晶氮化硼的純度比加熱生成物更高之固形物。此處所得之固形物係可僅含有六方晶氮化硼,亦可為在六方晶氮化硼外含有微量之副生成物。
就酸而言,從六方晶氮化硼與副生成物之溶解性的觀點,較佳係硝酸。以下說明洗淨處理之一例。相對於硝酸含有量為5質量%之稀硝酸100質量份,調配加熱生成物0.1至5質量份。調配後,於室溫攪拌10分鐘以上而調製懸濁液。將攪拌所得之懸濁液放置1小時以上之後,藉傾析除去上清液。上清液係與六方晶氮化硼相異之化合物的副生成物經溶解之硝酸溶液。
其次,相對於藉傾析除去上清液之加熱生成物0.1至2質量份,調配水100質量份。調配後,在室
溫攪拌10分鐘以上。攪拌後放置1小時以上而除去上清液。使如此之水的調配及具有傾析之水洗操作較佳為重複3次以上。藉此,除去硝酸鹽,得到由六方晶氮化硼之單一相所構成之最終生成物。
最終生成物係例如六方晶氮化硼粒子之凝聚物。可利用使用乳鉢等敲碎最後生成物之粉碎步驟,藉此而得到六方晶氮化硼之粉末。六方晶氮化硼之平均粒徑係例如為0.1至300μm,亦可為0.2至100μm。
<鹼土族金屬化合物>
於本實施形態所使用之鹼土族金屬化合物可舉例如鹼土族金屬之氧化物、碳酸鹽、氫氧化物、及硝酸鹽。此等之中,較佳為碳酸鈣、碳酸鍶、碳酸鋇。鹼土族金屬化合物之粒徑較佳為100μm以下,更佳為30μm以下。
<碳化硼>
使用於本實施形態之碳化硼可為一般者,可使用例如市售之碳化硼粉末。碳化硼粉末的粒徑愈小,愈易氮化至碳化硼粉末之粒子內部。因此,例如雷射繞射散射法中之平均粒徑(D50)較佳為300μm以下,更佳為100μm以下。
本實施形態中,氮化從碳化硼粒子之表面進行。因此,生成之六方晶氮化硼的粒徑係依存於作為起始物質之碳化硼的粒徑。亦即,可依碳化硼粒子之粒徑而控制六方晶氮化硼的形狀及粒徑。此係與習知技術之以燒製溫度的增加及/或燒製時間來控制粒徑,以及以氮化硼鱗片粒子之噴霧乾燥處理,或氮化硼燒結體之破碎來控制形
狀有很大的差異。
<平均粒徑之定義及評估方法>
本說明書中之鹼土族金屬化合物、碳化硼、六方晶氮化硼之平均粒徑係以掃描電子顯微鏡(SEM)測定粒度分布之中間值徑。測定時係使用SEM(日本電子(股)公司製,型式:JSM-6390)。鹼土族金屬化合物係以倍率10000倍,碳化硼係以倍率500至1000倍,六方晶氮化硼係以倍率180至700倍拍攝SEM照片,使用量尺以肉眼計測各粒子之粒子徑。量尺係以照片中表示之量尺作為基準,測定粒子數設為100粒子。
<石墨化指數(GI)之定義>
本實施形態之製造方法所得之六方晶氮化硼具有高的結晶性,可使用粉末X線繞射測定法中之結晶性指標的石墨化指數(GI=Graphitization Index)而確認。GI係依下式算出X線繞射圖之(100)、(101)及(102)線的積分強度比,亦即面積比,而求出(J.Thomas,et.al,J.Am.Chem.Soc.84,4619(1962))。GI之值愈小,愈為高結晶性。
GI=[面積{(100)+(101)}]/[面積(102)]
本實施形態之製造方法所得之六方晶氮化硼的GI係例如6以下。若GI超過6,有時無法發揮導熱性、化學安定性、固體潤滑性、耐熱衝撃性及電氣絕緣性等優異之特性。因此,有時亦不適於此等特性所需之用途。
<石墨化指數(GI)之測定方法>
GI之測定係可使用例如「日本電子製X線繞射裝置,
裝置名:JDX-3500」而測定。就測定之前處理而言,敲碎所作製之六方晶氮化硼而得到粉末。使用此粉末,以如下之條件進行粉末X線繞射測定。生成物之定性分析亦可以同條件進行。試料含有六方晶氮化硼以外之成分時,係進行酸洗、水洗、及乾燥處理而除去該成分而進行測定。
管球:Cu旋轉對陰極(CuK α;λ=1.54056Å)
輸出:40KV-20mA
偵測器:閃爍計數器
濾光器:單色器
狹縫條件:索勒狹縫(soller slit) 5°(入射,受光)
DS-SS-RS=1°-1°-0.15mm
掃描條件:步進掃描法
步進幅寬;0.02° 計數時間;0.6秒
測定範圍:2 θ=10至80°
本實施形態之製造方法係如下述(1)。進一步,可為下述(2)及/或下述(3)。
(1)一種六方晶氮化硼之製造方法,其特徵係將碳化硼與鹼土族金屬化合物之莫耳比為碳化硼/鹼土族金屬化合物=0.5至2.0之碳化硼及鹼土族金屬化合物之混合物,在氨氛圍下以1300至1500℃加熱。
(2)如前述(1)記載之六方晶氮化硼之製造方法,其中,鹼土族金屬化合物為選自碳酸鈣、碳酸鍶、碳酸鋇之至少1種以上。
(3)如前述(1)或(2)記載之六方晶氮化硼之製造方法,
其中,六方晶氮化硼之平均粒徑為0.1至300μm,石墨化指數(GI)為6以下。
本實施形態之製造方法係發揮效率佳地得到高結晶之六方晶氮化硼粉末之效果。
依上述之製造方法所得之六方晶氮化硼係可調配於樹脂組成物及橡膠組成物(以下,亦有時總稱為「組成物」。)作為填充劑。亦即,六方晶氮化硼之用途係可舉例如上述組成物。有關上述組成物說明於以下。
組成物中之六方晶氮化硼之含有率係依組成物之種類與用途而異,例如為10至90體積%,較佳為40至80體積%。若上述含有率未達10體積%,組成物之成形性雖優異,但有耐熱衝熱性及耐濕可靠性降低之傾向。另外,若上述含有率超過90體積%,損及成形性而產生未填充部或孔洞,有損電氣絕緣性及可靠性之傾向。
樹脂組成物係含有以下敘述之樹脂之至少一種。亦即,樹脂係可舉例如雙酚型環氧樹脂、酚酚醛清漆型環氧樹脂、脂環型環氧樹脂、雜環型環氧樹脂、縮水甘油基酯型環氧樹脂、縮水甘油基胺型環氧樹脂、鹵化環氧樹脂等之環氧樹脂、聚苯并咪唑、聚苯并唑、聚苯并噻唑、聚二唑、聚吡唑、聚喹喔啉、聚喹唑啉二酮、聚苯并并酮、聚吲哚酮、聚喹唑啉酮、聚吲哚酚、聚矽氧樹脂、聚矽氧-環氧樹脂、酚樹脂、三聚氰胺樹脂、尿素樹脂、不飽和聚酯、聚胺基雙馬來醯亞胺、二烯丙基酞酸酯樹脂、氟樹脂、甲基戊烯聚合物、聚醯亞胺、聚醯胺醯亞
胺、聚醚醯亞胺、66-尼龍及MXD-尼龍、非晶系尼龍等之聚醯胺、聚苯二甲酸丁二酯及聚苯二甲酸乙二酯等之聚酯、聚苯硫醚、改質聚伸苯基醚、聚芳酸酯、全芳香族聚酯、聚碸、液晶聚合物、聚醚醚酮、聚醚碸、聚碳酸酯、馬來醯亞胺改質樹脂、ABS樹脂、AAS(丙烯腈/丙烯橡膠/苯乙烯)樹脂、以及AES(丙烯腈-乙烯/丙烯/二烯橡膠-苯乙烯)樹脂等。
樹脂組成物係可含有硬化劑。環氧樹脂之硬化劑係可舉例如酚酚醛清漆、甲酚酚醛清漆等之酚系硬化劑、四氫酞酸酐、六氫酞酸酐、及甲基四氫酞酸酐等之酸酐系硬化劑等。其使用量係相對於環氧樹脂100質量份,以30至90質量份較佳。
橡膠組成物係可含有天然橡膠或合成橡膠。合成橡膠係可舉例如丁基橡膠、丙烯酸橡膠、乙烯丙烯橡膠、聚矽氧橡膠、聚酯彈性體、及聚丁二烯等。
組成物係依需要亦可含有以下之硬化促進劑、觸媒、加硫劑、滑劑/離型劑、安定劑、光安定劑、著色劑、難燃劑、偶合劑等。
硬化促進劑係可舉例如苯並胍胺、2,4-二肼基-6-甲基胺基-S-三、2-甲基吡唑、2-乙基-4-甲基吡唑、1-氰基乙基-2-乙基-4-甲基吡唑等之吡唑衍生物、氟化硼之各種胺錯合物、參二甲基胺基甲基酚、1,8-二偶氮雙環(5,4,0)-十一碳烯-7,苯甲基二甲基胺等之三級胺化合物、二氰二醯胺、雙酚型環氧樹脂或甲酚酚醛清漆型環氧樹脂
與氨之反應所得之胺基醇化合物、己二酸聯胺等之含氮硬化促進劑、三苯基膦、三環己基膦、甲基二苯基膦、三苯甲基膦、1,2-雙(二苯基膦基)乙烷、及雙(二苯基膦基)甲烷等之有機膦系硬化促進劑等。
觸媒係可舉例如雙-(三丁基錫)氧化物、二辛烯酸錫、辛酸銻、丁酸錫、一氧化鉛、硫化鉛、碳酸鉛等之硬化觸媒、及鉑化合物等之聚合觸媒等。
加硫劑係可舉例如過氧化苯甲醯基、過氧化二異丙苯基等。
滑劑/離型劑係可舉例如棕櫚蠟、褐煤蠟、聚酯寡聚物、聚矽氧油、低分子量聚乙烯、石蠟、直鏈脂肪酸之金屬鹽、酸醯胺及酯等。
安定劑係可舉例如2,6-二-第三丁基-4-甲基酚、1,3,5-參(2-甲基-4-羥基-5-第三丁基酚)丁烷、二硬脂基硫二丙酸酯、三壬基苯基亞磷酸酯及三癸基亞磷酸酯等。
光安定劑係可舉例如2,2’-二羥基-4-甲氧基二苯甲酮、2(2’-羥基-5-甲基苯基)苯並三唑、4-第三丁基苯基水楊酸酯及乙基-2-氰基-3,3-二苯基丙烯酸酯等。
著色劑係可舉例如氧化鐵紅及碳黑等。
難燃劑係可舉例如三氧化銻、四氧化銻、三苯基氫化銻、水和氧化鋁、二茂鐵、膦氮烯(phosphazene)、四溴化苯、四溴酞酸酐、磷酸三鄰甲苯酯、四溴化雙酚A及溴化環氧衍生物等。
偶合劑係可舉例如乙烯基三甲氧基矽烷、
γ-環氧丙氧三甲氧基矽烷、γ-脲丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷等之矽烷系偶合劑、異丙基三異硬脂醯基鈦酸酯、二異丙苯基苯基氧乙酸酯鈦酸酯、雙(二辛基焦磷酸酯)氧乙酸酯鈦酸酯、異丙基十三碳基苯磺醯基鈦酸酯等之鈦系偶合劑、及乙醯基烷氧基鋁二異丙酸酯等之鋁系偶合劑等。
第1圖係表示本實施形態之散熱片的立體圖。散熱片10係含有六方晶氮化硼,與樹脂及橡膠之至少一者。樹脂及橡膠係可藉由使上述之樹脂組成物及橡膠組成物硬化而得。在散熱片10中,六方晶氮化硼與樹脂及橡膠之含有量係相對於六方晶氮化硼100質量份,樹脂及橡膠之合計為20至100質量份。
本實施形態之散熱片10係可以如下之順序製作。塗佈經調配粒狀之六方晶氮化硼,與樹脂組成物及/或橡膠組成物所得之漿液而形成胚片。將此胚片加熱至例如100至300℃。藉此,使樹脂組成物及/或橡膠組成物硬化。如此方式,可於樹脂及/或橡膠之基質中形成填充有粒狀之六方晶氮化硼的散熱片。
於上述實施形態之製造方法所製造之粒狀六方晶氮化硼係具有高的結晶性。含有如此之六方晶氮化硼的本實施形態之散熱片係顯示高絕緣性與高導熱性。因此,本實施形態之散熱片係亦可謂絕緣散熱片。
以上,說明本發明之適當的實施形態,但
本發明係不限定於上述之實施形態者。例如,本發明之散熱片係可含有六方晶氮化硼、樹脂、及與橡膠相異之其他成分。
以下,依實施例及比較例,進一步詳細說明本發明之內容。但,本發明係只要不超出其要旨,則不限定於以下之實施例。
(實施例1至7、比較例1至5)
以特定量秤量碳化硼粉末(電氣化學工業製、等級名:S22)與碳酸鋇粉末(MTI公司製、平均粒徑50nm以下、純度99.9質量%以上)而調配,使用碳化硼乳鉢混合15分鐘。將所製作之混合物載置於氮化硼板之後,配置於管狀電氣爐內。使爐內真空抽氣之後,一邊使氨氣以流量4L/分流通,一邊以10℃/分之昇溫速度加熱至特定之溫度(保持溫度)。於表1中,顯示保持溫度與該保持溫度中之保持時間。
經過保持時間後,停止加熱並冷卻之。於爐內之溫度降至100℃以下之時點開啟爐體,取出氮化硼板,回收加熱生成物。其次,於5質量%之稀硝酸50g中投入加熱生成物0.2g,於室溫攪拌30分鐘,調製懸濁液。將懸濁液放置3小時後,藉傾析除去上清液而得到殘留物。
其後,於殘留物中調配水50g,於室溫放置3小時,除去上清液,進行過濾。重複如此之水洗過濾操作3次。其後,將所得之固形物使用乾燥機以100℃乾燥3小時,得到最後生成物。
將碳化硼粉末與鹼土族金屬化合物之調配比率、及加熱條件表示於表1中,調製實施例1至7及比較例1至5之12種類的加熱生成物及最後生成物。
(比較例6)
除不使用鹼土族金屬化合物以外,與實施例1同樣方式而製作加熱生成物及最後生成物。
(實施例8至10)
除了將鹼土族金屬化合物之種類及/或碳化硼粉末與鹼土族金屬化合物之調配比率如表1所示般變更以外,與實施例1同樣方式製作六方晶氮化硼。有關此等之結果整理表示於表1中。
將於各實施例及各比較例所製作之加熱生成物及最後生成物以瑪瑙乳鉢敲碎,使用X線繞射裝置(日本電子製,裝置名:JDX-3500)進行粉末X線繞射測定,鑑定生成物之結晶相。所鑑定之結晶相係如表1及表2所示。表1及表2係從所鑑定之結晶相之含有量高者依順記載。
對於以粉末X線繞射測定確認出最後生成物為六方晶氮化硼之單一相者,算出六方晶氮化硼之GI及平均粒徑。將此等之結果表示於表2。如表1與表2之實施例與比較例所示,依本發明,可得到高結晶且具有0.3至85μm之非常廣平均粒徑的六方晶氮化硼。
(實施例11至12、比較例7)
調配實施例1、實施例6及比較例2所得之六方晶氮化硼100質量份與液狀聚矽氧橡膠(Toray DowCorning
Silicone公司製、商品名「CF-3110」)50質量份而得到混合物。於此混合物中適量加入甲苯與加硫劑而調製漿液。使用自動塗佈裝置(Tester產業股份公司製、商品名:PI-1210)將漿液形成胚片。將此胚片加熱至170℃並加硫,製造厚度為0.20mm(0.0002m)之絕緣散熱片。
將絕緣散熱片夾在TO-3型銅製加熱箱體與銅板之間,以鎖模扭力5Kgf-cm鎖緊而得到積層體。其後,對加熱箱體施加電力15W並保持5分鐘後,測定加熱箱體與銅板之溫度差。依以下之計算式,算出絕緣散熱片之厚度方向之熱電阻。
熱電阻(℃/W)=溫度差(℃)/電力(W)
使加熱箱體與銅板之傳熱面積假設為6cm2(=0.0006m2),依以下之計算式算出絕緣散熱片之厚度方向之導熱率。
導熱率(W/m‧K)=[電力(W)×片材厚度(0.0002m)÷傳熱面積(0.0006m2)]÷溫度差(K)
整理此等之結果表示於表3中。如表3之實施例與比較例所示,使用實施例1、6之六方晶氮化硼粉末的絕緣散熱片係顯示低熱電阻與高導熱率。
若依據本發明之製造方法,可有效率地製造高結晶之六方晶氮化硼。依本發明所得之六方晶氮化硼係例如可填充於樹脂等之基質作為高導熱性填充劑而製作複合材料,而在產業領域使用。
10‧‧‧散熱片
Claims (5)
- 一種六方晶氮化硼之製造方法,其係具有如下的加熱步驟:將含有碳化硼與鹼土族金屬化合物且前述碳化硼對前述鹼土族金屬化合物之莫耳比為0.5至2.0之混合物,在氨氛圍下以1300至1500℃進行加熱,得到含有六方晶氮化硼之生成物。
- 如申請專利範圍第1項所述之六方晶氮化硼之製造方法,其中,前述鹼土族金屬化合物含有選自由碳酸鈣、碳酸鍶、及碳酸鋇所構成之群中的至少1種。
- 如申請專利範圍第1或2項所述之六方晶氮化硼之製造方法,其係具有如下之精製步驟:從混合有前述生成物與含有酸之洗淨液所得之懸濁液,除去含有與前述六方晶氮化硼相異之化合物的溶液,得到含有前述六方晶氮化硼之固形物。
- 如申請專利範圍第1至3項中任一項所述之六方晶氮化硼之製造方法,其中前述六方晶氮化硼之平均粒徑為0.1至300μm、石墨化指數(GI)為6以下。
- 一種散熱片,其係含有:以如申請專利範圍第1至4項中任一項所述之六方晶氮化硼之製造方法所得之六方晶氮化硼、與樹脂及橡膠之至少一者。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014001897 | 2014-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201532962A true TW201532962A (zh) | 2015-09-01 |
Family
ID=53523969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104100500A TW201532962A (zh) | 2014-01-08 | 2015-01-08 | 六方晶氮化硼的製造方法及散熱片 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9879168B2 (zh) |
| JP (1) | JP6519876B2 (zh) |
| TW (1) | TW201532962A (zh) |
| WO (1) | WO2015105145A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI724259B (zh) * | 2016-12-01 | 2021-04-11 | 日商德山股份有限公司 | 六方晶氮化硼粉末及其製造方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6588731B2 (ja) * | 2015-05-07 | 2019-10-09 | キヤノン株式会社 | 電子写真感光体、プロセスカートリッジおよび電子写真装置 |
| US11407638B2 (en) * | 2016-12-26 | 2022-08-09 | Tokuyama Corporation | Hexagonal boron nitride powder and production process therefor |
| CN115214202A (zh) * | 2022-04-26 | 2022-10-21 | 北京科技大学 | 一种高导热层状热界面材料及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05808A (ja) | 1991-06-18 | 1993-01-08 | Showa Denko Kk | 窒化ほう素粉末の製造方法 |
| JP2922096B2 (ja) | 1993-07-30 | 1999-07-19 | 川崎製鉄株式会社 | 六方晶窒化硼素粉末の製造方法 |
| JP3175483B2 (ja) | 1994-06-30 | 2001-06-11 | 日本鋼管株式会社 | 窒化ホウ素含有材料およびその製造方法 |
| US6319602B1 (en) * | 1996-08-06 | 2001-11-20 | Otsuka Kagaku Kabushiki Kaisha | Boron nitride and process for preparing the same |
| JP3669818B2 (ja) * | 1997-07-09 | 2005-07-13 | 電気化学工業株式会社 | 六方晶窒化ほう素粉末 |
| US6645612B2 (en) * | 2001-08-07 | 2003-11-11 | Saint-Gobain Ceramics & Plastics, Inc. | High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them |
| WO2006087982A1 (ja) * | 2005-02-16 | 2006-08-24 | Ngk Insulators, Ltd. | 六方晶窒化ホウ素単結晶の製造方法および六方晶窒化ホウ素単結晶 |
| JP5081488B2 (ja) | 2006-04-20 | 2012-11-28 | Jfeスチール株式会社 | 六方晶窒化ホウ素粉末 |
| CN101318636B (zh) * | 2008-05-12 | 2011-04-13 | 中国科学院上海硅酸盐研究所 | 一种原位氮化制备含六方氮化硼的复合材料的方法 |
| JP5065198B2 (ja) | 2008-08-04 | 2012-10-31 | 株式会社カネカ | 六方晶窒化ホウ素の製造方法 |
| EP2487134B1 (en) * | 2009-10-09 | 2017-08-09 | Mizushima Ferroalloy Co. Ltd. | Hexagonal boron nitride powder and method for producing same |
-
2015
- 2015-01-08 JP JP2015556830A patent/JP6519876B2/ja not_active Expired - Fee Related
- 2015-01-08 US US15/110,030 patent/US9879168B2/en active Active
- 2015-01-08 WO PCT/JP2015/050367 patent/WO2015105145A1/ja not_active Ceased
- 2015-01-08 TW TW104100500A patent/TW201532962A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI724259B (zh) * | 2016-12-01 | 2021-04-11 | 日商德山股份有限公司 | 六方晶氮化硼粉末及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20160333246A1 (en) | 2016-11-17 |
| WO2015105145A1 (ja) | 2015-07-16 |
| US9879168B2 (en) | 2018-01-30 |
| JPWO2015105145A1 (ja) | 2017-03-23 |
| JP6519876B2 (ja) | 2019-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7207384B2 (ja) | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート | |
| TWI718560B (zh) | 六方晶氮化硼粉末及其製造方法以及使用其之組成物及散熱材料 | |
| JP5065198B2 (ja) | 六方晶窒化ホウ素の製造方法 | |
| JP6483508B2 (ja) | 六方晶窒化ホウ素粉末及びその製造方法 | |
| JP3461651B2 (ja) | 六方晶窒化ほう素粉末及びその用途 | |
| JP5923106B2 (ja) | 窒化ホウ素粉末の連続的製造方法 | |
| TWI832978B (zh) | 氮化硼凝集粉末、散熱片及半導體裝置 | |
| JP7334763B2 (ja) | 窒化アルミニウム-窒化ホウ素複合凝集粒子およびその製造方法 | |
| JP5673539B2 (ja) | 球状化窒化ほう素の製造法 | |
| JP6979034B2 (ja) | 六方晶窒化ホウ素粉末及びその製造方法 | |
| TW201827383A (zh) | 氮化硼塊狀粒子、其製造方法及使用其之熱傳導樹脂組成物 | |
| KR20160122725A (ko) | 구상 질화붕소 미립자 및 그 제조 방법 | |
| JP2010042963A (ja) | 六方晶窒化ホウ素の製造方法 | |
| KR20180048612A (ko) | 열전도성 수지 조성물 | |
| TW201532962A (zh) | 六方晶氮化硼的製造方法及散熱片 | |
| JP7554473B2 (ja) | 粒状窒化ホウ素の製造方法および粒状窒化ホウ素 | |
| JP2019218254A (ja) | 六方晶窒化ホウ素粉末及びその製造方法 | |
| Ha et al. | Advanced Thermal Interface Materials: Insights into Low‐Temperature Sintering and High Thermal Conductivity of MgO | |
| JP5109882B2 (ja) | 六方晶窒化ホウ素粉末の製造方法 | |
| JP5883253B2 (ja) | 六方晶炭窒化ホウ素、その製造方法及び組成物 | |
| Kadel et al. | Solvothermal synthesis and structural characterization of unfilled and Yb‐filled cobalt antimony skutterudite | |
| CN120019022A (zh) | 粒状氮化硼的制造方法和粒状氮化硼 | |
| JP7140939B2 (ja) | 窒化ホウ素粉末、及び窒化ホウ素粉末の製造方法 | |
| TWI881174B (zh) | 氮化硼粉末、及氮化硼粉末之製造方法 | |
| JP5987322B2 (ja) | 金属酸化物含有窒化ホウ素の製造方法 |