TW201522511A - Positive photosensitive compositions - Google Patents

Abstract

A positive photosensitive composition is provided, which includes a siloxane polymer (A), a naphthoquinone diazide derivative (B) represented by the following formula (1) or (2), and an organic solvent (C). The positive photosensitive composition of the present invention is characterized in that it is thermoset at 350 DEG C or more to obtain a cured film which has a light transmissivity of 95% or more per 1 [mu]m film thickness at a wavelength of 400nm or less. In the formulas, each of R1 and R2 individually represents an aryl group.

Description

Positive photosensitive composition

The present invention relates to a positive photosensitive composition which can be utilized in the field of resists and the like.

The patterned transparent film is used in many fields of display elements such as a spacer, an insulating film, and a protective film. Various positive photosensitive compositions have been proposed in this application (see, for example, Patent Document 1 to Patent Document 3) ).

In general, in an electronic component such as a thin film transistor type liquid crystal display element or a solid-state imaging element, an insulating film is provided in order to insulate between wirings arranged in a layer shape. Among the elements manufactured in recent years, since an insulating film capable of forming a pattern having a predetermined shape is used, a positive photosensitive composition having a small number of steps for forming a film is widely used. The positive photosensitive composition must have a wide range of processes in the process of forming an insulating film. Further, an insulating film formed using a positive photosensitive composition or a display element having the insulating film may be brought into contact with a solvent, an acid, an alkali solution or the like in a post-manufacturing step. Therefore, the insulating film is required to have high solvent resistance, acid resistance, alkali resistance, and the like.

In recent years, there has been further a use of forming an inorganic film on a transparent film (pattern-like transparent film) formed at a high temperature. In this case, the inorganic membrane is chemically steamed. Forming by plating, sputtering, etc. In order to obtain a high-quality film by these film formation methods, a high temperature step is required (Non-Patent Document 1). That is, the transparent film which becomes the base of these inorganic films is also exposed to high temperature. When the heat resistance of the transparent film is insufficient, the detached gas is generated by thermal decomposition of the transparent film during the high-temperature process, and a high-quality inorganic film cannot be obtained due to the influence. Further, coloring occurs on the transparent film due to thermal deterioration, and it is difficult to use it in applications requiring transparency. Further, thermal stress is generated inside the film, and the crack resistance of the transparent film is lowered. For these reasons, a positive photosensitive composition having high heat resistance of 350 ° C or higher is required. There are several proposals for a positive photosensitive composition to be used for these applications (for example, refer to Patent Document 4 and Patent Document 5). Patent Document 4 discloses a material containing a decane polymer and a naphthoquinone-based sensitizer, and Patent Document 5 discloses mixing a siloxane polymer with a quinone imine compound and a naphthoquinone sensitizer. s material. However, these materials are difficult to satisfy all the required characteristics other than crack resistance, high transparency (transmittance, transparency) in the process.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 51-34711

[Patent Document 2] Japanese Patent Laid-Open Publication No. SHO 56-122031

[Patent Document 3] Japanese Patent Laid-Open No. Hei 5-165214

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2006-178436

[Patent Document 5] Japanese Patent Laid-Open Publication No. 2009-15285

[Non-patent literature]

[Non-Patent Document 1] "Transparent oxide functional culture using built-in nanostructure "Function Cultivation of Transparent Oxides Utilizing Built-In Nanostructure", Bulletin of the Chemical Society of Japan, Vol. 79, No. 1, p. 24 (2006)

In the above-described situation, it is excellent in heat resistance, transparency, adhesion to a substrate, crack resistance, and the like, and can be formed into a patterned transparent film by a development step using an aqueous alkali solution. A positive photosensitive composition of a transparent film).

The present invention is a positive photosensitive composition comprising a decane polymer (A), a naphthoquinonediazide derivative (B) having a specific structure, and an organic solvent (C), said positive photosensitive property The composition is characterized in that the cured film obtained by thermally curing the composition at 350 ° C or higher has a light transmittance of 95% or more at a wavelength of 400 nm.

The invention includes the following items.

[1] A positive photosensitive composition containing a naphthenic polymer (A), a naphthoquinonediazide derivative (B) represented by the following formula (1) or (2), and an organic Solvent (C); and the cured film obtained by thermally hardening the composition at 350 ° C or higher has a light transmittance of 95% or more per 1 μm film thickness at a wavelength of 400 nm, In the formula, R ¹ and R ² each independently represent an aryl group.

[2] The positive photosensitive composition according to [1], wherein R ^{1 of the} formula (1) or R ² of the formula (2) is selected from the following formulas (3) to (6); One of the groups of the monovalent groups represented, R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ and R ⁹ each independently represent hydrogen or an alkyl group having 1 to 5 carbon atoms.

[3] The positive photosensitive composition according to [1] or [2], wherein the oxirane polymer (A) is a hydrolytic condensation of a raw material containing at least two alkoxydecane compounds. A synthetic alkali-soluble polymer; here, two kinds of alkoxydecane compounds are two kinds of compounds having different amounts of alkoxy groups.

[4] The positive photosensitive composition according to [3], wherein the alkoxydecane compound is selected from the group consisting of tetramethoxynonane, tetraethoxydecane, methyltrimethoxydecane, and phenyltrimethyl. Oxy decane, methyl triethoxy decane, phenyl triethoxy decane, Dimethyldimethoxydecane, diphenyldimethoxydecane, methylphenyldimethoxydecane, dimethyldiethoxydecane, diphenyldiethoxydecane, methylphenyl A group consisting of diethoxydecane, trimethylmethoxydecane, and trimethylethoxydecane.

[5] The positive photosensitive composition according to any one of [1] to [4] wherein the weight average molecular weight of the siloxane polymer (A) is 500 to 100,000 in terms of polystyrene.

[6] The positive photosensitive composition according to any one of [1], wherein the naphthoquinonediazide derivative (B) is selected from the following formula (7) to formula (9). At least one of the groups of the compounds represented,

[7] A cured film obtained by using the positive photosensitive composition according to any one of [1] to [6].

[8] A display element produced by using the cured film according to [7].

Heat resistance of the cured film formed using the positive photosensitive composition of the present invention Excellent in transparency, transparency, crack resistance, resolution, solvent resistance, acid resistance, and alkali resistance, and the cured film used in a display element or the like is exposed to a high temperature even in a post-manufacturing step, even if immersed in In a solvent, an acid, an alkali solution, or the like, or in contact with the solutions, it is difficult to cause surface roughness on the film even when heat treatment or the like is performed. As a result, when the cured film formed using the positive photosensitive composition of the present invention is used as a transparent film or the like, the transmittance of light is improved, and the display quality of the display element using the cured film is improved.

The positive photosensitive composition of the present invention is a naphthoquinonediazide derivative (B) represented by the following formula (1) or formula (2), and an organic solvent (C). A positive photosensitive composition. The positive photosensitive composition is characterized in that the cured film obtained by thermally curing the composition at 350 ° C or higher has a light transmittance at a wavelength of 400 nm of 95% or more.

In the formula, R ¹ and R ² each independently represent an aryl group.

Hereinafter, each element will be described except for the siloxane polymer (A), the naphthoquinonediazide derivative (B), and the organic solvent (C) constituting the positive photosensitive composition of the present invention. In the following description, the positive photosensitive composition of the present invention may be referred to as "the composition of the present invention".

1) siloxane polymer (A)

The siloxane polymer (A) is synthesized by hydrolytic condensation of a raw material containing an alkoxy decane compound selected from the group consisting of one, two, three, four or more alkoxy groups. At least two types of the group, here, two kinds of alkoxydecane compounds are two kinds of compounds in which the number of alkoxy groups is different. When the alkoxydecane compound is three or more types, a compound having the same number of alkoxy groups may be contained. Further, in addition to the alkoxydecane compound, a decyl alcohol compound or a siloxane compound such as dioxane or tetraoxane may be used. Hereinafter, the compounds which can be used for these hydrolytic condensation are called alkoxy decane compounds.

Specific examples of the alkoxydecane compound used in the synthesis of the siloxane polymer (A) are: tris(3-(trimethoxydecyl)propyl)isocyanurate, tetrabutoxydecane, Tetrapropoxydecane, tetraisopropoxydecane, tetraethoxydecane, tetramethoxydecane, (3-bromopropyl)trimethoxydecane, (3-mercaptopropyl)triethoxydecane, (3-mercaptopropyl)trimethoxydecane, chloromethyltriethoxydecane, 1-[3-(trimethoxydecyl)propyl]urea, 2-(3,4-epoxycyclohexyl) Ethyltrimethoxydecane, 2-cyanoethyltriethoxydecane, 3-(2-aminoethylamino)propyltriethoxydecane, 3-(2-aminoethylamine) Propyltrimethoxydecane, 3-(triethoxydecyl)propyl isocyanate, 3-(trimethoxydecyl)propyl acrylate, 3-(trimethoxy) methacrylate Base alkyl)propyl ester, 3-aminopropyltriethoxydecane, 3-aminopropyltrimethoxydecane, 3-chloropropyltriethoxydecane, 3-glycidoxypropyl Trimethoxydecane, 3-trimethoxydecylpropyl chloride, 3-ureidopropyltriethoxydecane, 3-[tris(trimethyldecyloxy)decyl]propyl methacrylate, Allyl triethoxy decane, allyl trimethoxy decane, vinyl triethoxy decane, vinyl trimethoxy decane, benzyl triethoxy decane, cyclohexyl trimethoxy decane, dodecane Trimethoxy decane, ethyl trimethoxy decane, hexyl triethoxy decane, hexyl trimethoxy decane, octyl triethoxy decane, octadecyl triethoxy decane, octadecyl trimethoxy Base decane, pentyl triethoxy decane, phenyl triethoxy decane, phenyl trimethoxy decane, (p-tolyl) trimethoxy decane, methyl triethoxy decane, [bicyclic [2.2.1 ]hept-5-en-2-yl]triethoxydecane, 1H,1H,2H,2H-tridecafluoro-n-octyltriethoxydecane, ethyltriethoxydecane, triethoxy Fluorocarbon, triethoxy Base decane, trimethoxy decane, [3-(phenylamino)propyl]trimethoxynonane, dimethyldiethoxy decane, dimethyldimethoxydecane, 3-(2-amino group Ethylamino)propylmethyldimethoxydecane, 3-aminopropylmethyldiethoxydecane, 3-chloropropylmethyldimethoxydecane, 3-glycidyloxypropane Methyldimethoxydecane, 3-mercaptopropylmethyldimethoxydecane, cyclohexylmethyldimethoxydecane, (3-glycidyloxypropyl)methyldiethoxydecane , methylphenyl diethoxy decane, methyl phenyl dimethoxy decane, diphenyl diethoxy decane, diphenyl dimethoxy decane, methyl diethoxy decane, methyl two Methoxy decane, diethoxymethyl vinyl decane, dimethoxymethyl vinyl decane, di-p-tolyl dimethoxy decane, triethyl ethoxy decane, trimethyl methoxy Decane, trimethylethoxy decane, diphenyl Decanediol, diethyl(isopropyl)stanol, triethylstanol, triphenylstanol, hexamethyldioxane, and octamethylcyclotetraoxane.

The siloxane polymer (A) preferably has a moderate alkali solubility. The term "alkali solubility" in the present invention means a property of dissolving in an alkali to such a degree that a solution of a siloxane polymer (A) is applied onto a substrate by spin coating, and heated at 100 ° C for 2 minutes. The formed film having a thickness of 0.01 μm to 100 μm was immersed in a 2.38 wt% aqueous solution of tetramethylammonium hydroxide at 25 ° C for 5 minutes, and then washed with pure water, the film did not remain.

The alkoxyalkylene polymer (A) using these alkoxydecane compounds has high initial transparency, and even if it is calcined at a high temperature as the composition of the present invention, substantially no deterioration in transparency occurs. Further, the solubility in the aqueous alkali solution during development is high, that is, the developability is high, and a pattern-like transparent film is easily obtained. Further, the obtained pattern-like transparent film exhibits excellent solvent resistance, high water resistance, acid resistance, alkali resistance, and heat resistance, and further improves adhesion to the substrate.

In a specific example of the alkoxydecane compound, tetramethoxy decane, tetraethoxy decane, methyl trimethoxy decane, phenyl trimethoxy decane, methyl triethoxy decane, phenyl tri Ethoxy decane, dimethyl dimethoxy decane, diphenyl dimethoxy decane, methyl phenyl dimethoxy decane, dimethyl diethoxy decane, diphenyl diethoxy decane Methylphenyl diethoxy decane, trimethyl methoxy decane, and trimethyl ethoxy decane are easily obtained, thereby improving solvent resistance, water resistance, acid resistance, and resistance of the resulting patterned transparent film. From the viewpoint of alkalinity, heat resistance, and transparency, it is preferred.

The alkoxydecane compound may be used alone or in combination of three or more kinds.

2) Synthesis method of siloxane polymer (A)

The polymerization method of the siloxane polymer is not particularly limited, and the alkoxy decane compound can be produced by hydrolysis condensation. Water and an acid or base catalyst can be used in the hydrolysis. Examples of the acid catalyst include formic acid, acetic acid, trifluoroacetic acid, nitric acid, sulfuric acid, hydrochloric acid, hydrofluoric acid, boric acid, phosphoric acid, and a cation exchange resin. The base catalyst may, for example, be ammonia, triethylamine, monoethanolamine, diethanolamine, triethanolamine, sodium hydroxide, sodium carbonate, sodium hydrogencarbonate, potassium hydroxide or an anion exchange resin. The polymerization temperature is not particularly limited, and is usually in the range of 50 ° C to 150 ° C. The polymerization time is also not particularly limited, and is usually in the range of 1 hour to 48 hours. Further, the polymerization reaction can be carried out under any pressure of pressurization, reduced pressure or atmospheric pressure. After the polymerization, in order to stabilize the siloxane polymer, it is preferred to remove the low molecular weight component by distillation. The distillation may be a reduced pressure or a normal pressure, and the distillation temperature under normal pressure is usually from 100 ° C to 200 ° C.

The solvent used in the polymerization reaction is preferably an alkoxydecane compound to be used, and a solvent which dissolves the produced polymer. Specific examples of the solvent are: methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, isobutanol, tert-butanol, acetone, 2-butanone, ethyl acetate, Propyl acetate, tetrahydrofuran, acetonitrile, dioxane, toluene, xylene, cyclohexanone, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol dimethyl ether, diethyl Glycol methyl ether, methyl 3-methoxypropionate, and ethyl 3-ethoxypropionate. One type of these solvents may be used as the reaction solvent, or two or more types may be used in combination.

When the weight average molecular weight determined by gel permeation chromatography (GPC) analysis using polystyrene as a standard is in the range of 500 to 100,000, the siloxane polymer (A) is in the exposed portion. The development time until dissolution in the alkali developing solution is appropriate, and the surface of the film during development is difficult to be roughened, which is preferable. Further, when the weight average molecular weight is in the range of 1,500 to 50,000, the development time until the unexposed portion is dissolved in the alkali developing solution is appropriate, and the surface of the film is hardly roughened during development, and the development residue is extremely small, so that it is more preferable. . For the same reason, it is optimal if the weight average molecular weight is in the range of 2,000 to 20,000.

The weight average molecular weight of the siloxane polymer (A) can be determined by, for example, using polystyrene having a molecular weight of 645 to 132,900 in standard polystyrene (for example, polyphenylene manufactured by VARIAN). A calibration kit (Liquidization Kit) PL2010-0102), PLgel MIXED-D (manufactured by VARIAN), which was measured using tetrahydrofuran (THF) as a mobile phase.

3) Naphthoquinone diazide derivative (B)

The naphthoquinonediazide derivative (B) is a compound represented by the following formula (1) or (2).

In the formula, R ¹ and R ² each independently represent an aryl group.

R ¹ and R ^{2 in} the above formula are preferably selected from the group consisting of monovalent groups represented by the following formulas (3) to (6).

In the formula, R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ and R ⁹ each independently represent hydrogen or an alkyl group having 1 to 5 carbon atoms. Further, a straight line crossing the benzene ring is a bond, and is represented by any one of carbons other than carbon related to other bonds of the benzene ring.

The monovalent groups represented by the formulae (3) to (6) are preferably the following formula (3-1), formula (4-1), formula (5-1), and formula (6-1).

In the formula, the definitions of R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ and R ⁹ are the same as described above.

The naphthoquinonediazide derivative (B) is preferably any one of the compounds represented by the following formulas (7) to (9) from the viewpoint of improving the transparency of the positive photosensitive composition. These compounds may be used singly or in combination of two or more.

The content of the naphthoquinonediazide derivative (B) in the composition of the present invention is preferably from 5 parts by weight to 50 parts by weight based on 100 parts by weight of the siloxane polymer (A).

4) Solvent

The solvent used in the composition of the present invention is preferably a compound having a boiling point of from 100 ° C to 350 ° C. Specific examples of the solvent having a boiling point of 100 ° C to 350 ° C are: butyl acetate, butyl propionate, ethyl lactate, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, Ethyl oxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-oxopropionate, ethyl 3-oxopropionate, 3-methoxypropionic acid Methyl ester, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-oxopropionate, ethyl 2-oxopropionate, 2 -propyl propyl propionate, methyl 2-methoxypropionate, Ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, 2-oxo-2-methylpropionic acid Methyl ester, ethyl 2-oxo-2-methylpropanoate, methyl 2-methoxy-2-methylpropanoate, ethyl 2-ethoxy-2-methylpropionate, methyl pyruvate , ethyl pyruvate, propyl pyruvate, methyl acetate, ethyl acetate, ethyl 2-oxobutanoate, ethyl 2-oxobutanoate, dioxane, ethylene glycol, two Ethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,4-butanediol, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether Acid ester, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether, diethylene glycol monomethyl Ether acetate, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, two Ethylene glycol diethyl ether, diethylene glycol methyl ether, toluene, xylene, γ-butyrolactone, and N,N-dimethyl B Guanamine. These solvents may be used singly or in combination of two or more.

The solvent used in the composition of the present invention may be a mixed solvent of a compound having a boiling point of from 100 ° C to 350 ° C and a solvent other than the solvent. In this case, the content of the compound having a boiling point of 100 ° C to 350 ° C in the mixed solvent is 20% by weight or more. The solvent other than the compound having a boiling point of 100 ° C to 350 ° C can be used alone or in combination of two or more kinds of known solvents.

The solvent used in the composition of the present invention is selected from the group consisting of propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and diethyl ether. At least 1 of diol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ether, ethyl lactate, and butyl acetate Therefore, the uniformity of coating is improved, and thus it is more preferable. If used is selected from the group consisting of propylene glycol monomethyl ether acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, diethylene glycol methyl ether, ethyl lactate, and butyl acetate. At least one of them improves the uniformity of coating of the positive photosensitive composition, and is also optimal from the viewpoint of safety of the human body.

Further, the solvent in the composition of the present invention is preferably a ruthenium oxygen as a solid component with respect to the total amount of the decane polymer (A), the naphthoquinonediazide derivative (B), and the solvent (C). The total amount of the alkane polymer (A) and the naphthoquinonediazide derivative (B) is 5% by weight to 50% by weight.

5) Other ingredients

In the composition of the present invention, various additives may be added in order to improve resolution, coating uniformity, developability, and adhesion. The additives are mainly acrylic acid, styrene-based, polyethyleneimine-based or urethane-based polymer dispersants, anionic, cationic, nonionic or fluorine-based surfactants, and lanthanum coatings. An adhesion promoter such as a cloth promoter or a coupling agent, an alkali solubility promoter such as a polyvalent carboxylic acid or a phenol compound, an antioxidant such as a hindered phenol system, a hindered amine system, a phosphorus system or a sulfur compound, an epoxy compound or a melamine. A thermal crosslinking agent such as a compound or a double azide compound.

5-1) Polymer dispersant, surfactant, and coating accelerator

Among the polymer dispersant, the surfactant, and the coatability promoter, the components used in these applications can be used in the composition. These components may be one type or two or more types. Specific examples of such a polymer dispersant, a surfactant, and a coatability promoter are: Polyflow No. 45, Polyflow KL-245, and Polyflow. No.75, Polyflow No.90, Polyflow No. 95 (all of which are trade names, manufactured by Kyoei Chemical Industry Co., Ltd.), Disperbyk 161, Disperbyk 162, Diss Disperbyk 163, Disperbyk 164, Disperbyk 166, Disperbyk 170, Disperbyk 180, Diss Disperbyk 181, Disperbyk 182, BYK300, BYK306, BYK310, BYK320, BYK330, BYK342, BYK344, BYK346, BYK361N (all of which are trade names, BYK-Chemie Japan) (manufacturing), KP-341, KP-358, KP-368, KF-96-50CS, KF-50-100CS (all of which are trade names, manufactured by Shin-Etsu Chemical Co., Ltd.), Sha Fulong (Surflon) SC-101, Surflon KH-40, Surflon S-611 (all of which are trade names, manufactured by Seimi Chemical), Ftergent ) 222F, Ftergent 251, FTX-218 (all of which are trade names, manufactured by Neos), EFTOP EF-351, EFTOP EF -352, EFTOP EF-601, EFTOP EF-801, Ai EFTOP EF-802 (all of which are trade names, manufactured by Mitsubishi Material), Megafac F-171, Megafac F-177, Megafac F-475, Megafac F-556, Megafac R-08, Megafac R-30 (all of which are trade names, manufactured by Di Aisheng (DIC) Co., Ltd.), halothane Benzobenzenesulfonate, fluoroalkyl carboxylate, fluoroalkyl polyoxyethylene ether, fluoroalkyl ammonium iodide, fluoroalkyl betaine, fluoroalkyl sulfonate, diglycerol tetra (fluoroalkyl polyoxygen) Vinyl ether), fluoroalkyltrimethylammonium salt, fluoroalkylamine sulfonate, polyoxygen Vinyl nonylphenyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene alkyl ether, polyoxyethylene lauryl ether, polyoxyethylene oleyl ether, polyoxyethylene tridecyl ether, polyoxyethylene Cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene laurate, polyoxyethylene oleate, polyoxyethylene stearate, polyoxyethylene laurylamine, sorbitan laurate, Sorbitan palmitate, sorbitan stearate, sorbitan oleate, sorbitan fatty acid ester, polyoxyethylene sorbitan laurate, polyoxyethylene sorbitan Alcohol palmitate, polyoxyethylene sorbitan stearate, polyoxyethylene sorbitan oleate, polyoxyethylene naphthyl ether, alkyl benzene sulfonate, and alkyl diphenyl ether Sulfonate.

Among these compounds, from the viewpoint of improving the coating uniformity of the composition of the present invention, it is preferred that the additive contains a selected one selected from the group consisting of Megafac F-475, Megafac F-556, and fluorine. Alkylbenzenesulfonate, fluoroalkyl carboxylate, fluoroalkyl polyoxyethylene ether, fluoroalkyl ammonium iodide, fluoroalkyl betaine, fluoroalkyl sulfonate, diglycerol tetra (fluoroalkyl poly Fluorine-based surfactants such as oxyethylene ether), fluoroalkyltrimethylammonium salts, and fluoroalkylaminosulfonates, and BYK306, BYK342, BYK344, BYK346, KP-341, KP-358, and KP At least one of the group consisting of an oxime-based coatability promoter such as -368.

The content of the polymer dispersant, the surfactant, and the coatability promoter in the composition of the present invention is preferably from 0.001 part by weight to 0.1 part by weight per 100 parts by weight of the total solid content of the composition.

5-2) Adhesion promoter

The adhesion promoter is used to improve the adhesion between the cured film and the substrate. Adhesion A coupling agent can be suitably used in the accelerator. The adhesion promoter may be one type or two or more types. A decane-based, aluminum-based or titanate-based compound can be used as the coupling agent. Specific examples of the coupling agent are: 3-glycidoxypropyl dimethyl ethoxy decane, 3-glycidoxy propyl methyl diethoxy decane, 3-glycidoxy propyl trimethoxy group Decane, acetoxy aluminium diisopropoxide, and tetraisopropylbis(dioctylphosphite) titanate. Among these adhesion promoters, 3-glycidoxypropyltrimethoxydecane is preferred because it has a large effect of improving adhesion.

The content of the adhesion promoter in the composition of the present invention is preferably 10 parts by weight or less based on 100 parts by weight of the siloxane polymer (A).

5-3) Alkali solubility promoter

There are various kinds of alkali solubility promoters, and among them, a polyvalent carboxylic acid or a phenol compound is preferable from the viewpoint of easily adjusting alkali solubility.

5-3-1) Polycarboxylic acid

A polyvalent carboxylic acid such as trimellitic anhydride, phthalic anhydride or 4-methylcyclohexane-1,2-dicarboxylic anhydride may be added to the composition of the present invention. Among these polycarboxylic acids, trimellitic anhydride is preferred.

5-3-2) phenolic compound

The composition of the present invention may also be added: 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, 2,2',4,4'-tetrahydroxydiphenyl Methyl ketone, 2,3,3',4-tetrahydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, bis(2,4-dihydroxyphenyl)methane, bis ( p-Hydroxyphenyl)methane, tris(p-hydroxyphenyl)methane, 1,1,1-tris(p-hydroxyphenyl)ethane, bis(2,3,4-trihydroxyphenyl)methane, 2,2 - bis(2,3,4-trihydroxyphenyl)propane, 4,4'-dihydroxy Base-2,2'-diphenylpropane, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1,3-tris(2,5-dimethyl-4-hydroxyphenyl) 3-phenylpropane, 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene]bisphenol, bis (2, 5-dimethyl-4-hydroxyphenyl)-2-hydroxyphenylmethane, 3,3,3',3'-tetramethyl-1,1'-spirobiguan-5,6,7,5 ',6',7'-hexanol (3,3,3',3'-tetramethyl-1,1'-spirobiinden-5,6,7,5',6',7'-hexanol), or 2 a phenolic compound such as 2,4-trimethyl-7,2,4'-trihydroxyflavan (2,2,4-trimethyl-7,2,4'-trihydroxyflavan). Among these phenol compounds, 4,4'-dihydroxy-2,2'-diphenylpropane and 1,1-bis(4-hydroxyphenyl) ring are preferred from the viewpoint of improving crack resistance. Hexane, 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene]bisphenol.

If a polycarboxylic acid or a phenol compound is added to the composition of the present invention, the alkali solubility can be adjusted. Further, when an epoxy compound is contained in the positive photosensitive composition, the carboxyl group of the polyvalent carboxylic acid or the phenol of the phenol compound can react with the epoxy group of these epoxy compounds to further improve heat resistance and chemical resistance. Character. Further, when a polyvalent carboxylic acid is added to the positive photosensitive composition of the present invention, decomposition of the naphthoquinonediazide derivative (B) can be suppressed during storage, and coloring of the positive photosensitive composition can be prevented.

In the composition of the present invention, in the case where a polyvalent carboxylic acid or a phenol compound is added, the polyvalent carboxylic acid and the phenol compound are each preferably 1 part by weight to 30 parts by weight based on 100 parts by weight of the siloxane polymer (A). The parts by weight are more preferably 2 parts by weight to 20 parts by weight.

5-4) Antioxidants

Among the antioxidants, an antioxidant selected from the group consisting of hindered phenol type, hindered amine type, phosphorus type, and sulfur type compound can be suitably used. The antioxidant may be one type or two or more types. From the viewpoint of weather resistance, the antioxidant is preferably an antioxidant of a hindered phenol compound. Specific examples of the antioxidant are, for example, Irganox 1010, Irganox FF, Irganox 1035, Irganox 1035FF, Irganox ) 1076, Irganox 1076FD, Irganox 1076DWJ, Irganox 1098, Irganox 1135, Irganox 1330, Easy Irganox 1726, Irganox 1425WL, Irganox 1520L, Irganox 245, Irganox 245FF, Irganox 245DWJ, Irganox 259, Irganox 3114, Irganox 565, Irganox 565 DD, Irganox 295 (all above) Trade name; BASF (made by Japan), ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO -50, ADK STAB AO-60, ADK STAB AO-70, and ADK STAB AO-80 (all of which are trade names; Made by ADEKA (shares). Among them, ADK STAB AO-60 is preferred.

The content of the antioxidant in the composition of the present invention is preferably from 0.1 part by weight to 5 parts by weight, more preferably from 1 part by weight to 3 parts by weight, per 100 parts by weight of the siloxane polymer (A).

5-5) Thermal crosslinking agent

As the thermal crosslinking agent, a component which causes a crosslinking reaction during film formation using a positive photosensitive composition can be used. The thermal crosslinking agent may be one type or two or more types. A thermal crosslinking agent such as an epoxy compound can be used for the thermal crosslinking agent. Specific examples of such thermal crosslinking agents are: Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epica Epikote 828, Epikote 190P, Epikote 191P, Epikote 1004, Epikote 1256, YX8000 (all of which are trade names; Japan Epoxy Resin (manufactured by Japan Epoxy Resin), Araldite CY177, Araldite CY184 (all of which are trade names; BASF (Japan)), Cerro Celloxide 2021P, EHPE-3150 (all of which are trade names; manufactured by Daicel Chemical industries), and Tecmoa VG3101L (trade name; Prentke ( Printec) (share) manufacturing)).

The content of the thermal crosslinking agent in the composition of the present invention is preferably from 1 part by weight to 30 parts by weight, more preferably from 5 parts by weight to 15 parts by weight, per 100 parts by weight of the solid component of the composition.

When the composition of the present invention is stored in a light-shielded manner at a temperature of from -30 ° C to 25 ° C, the composition has a good stability over time, which is preferable. If the storage temperature is -20 ° C to 10 ° C, the precipitate does not exist, so it is more preferable.

The composition of the present invention is suitable for forming a transparent film, and is most suitable for forming an opening having a small opening of 10 μm or less due to a relatively high resolution at the time of patterning. membrane. Here, the insulating film is, for example, a film (interlayer insulating film) or the like provided to insulate between wirings arranged in a layer shape.

The film such as the transparent film or the insulating film can be formed by a usual method of forming a film in the field of a resist. The formation method is exemplified below.

First, the composition of the present invention is applied onto a substrate such as glass by a known method such as spin coating, roll coating, or slit coating. Examples of the substrate include a transparent glass substrate such as white glass, blue plate glass, and cyan coated glass coated with cerium oxide, polycarbonate, polyether oxime, polyester, acrylic acid, vinyl chloride, aromatic polyamine, and polyfluorene. A synthetic resin sheet, a film or a substrate such as an amidoximine or a polyimide, a metal substrate such as an aluminum plate, a copper plate, a nickel plate or a stainless steel plate, and a ceramic plate or a semiconductor substrate having a photoelectric conversion element. For these substrates, chemical treatment such as a decane coupling agent, plasma treatment, ion plating, sputtering, gas phase reaction, vacuum vapor deposition, or the like may be performed as needed.

The film of the composition on the substrate is then dried in a hot plate or oven. Usually, it is dried at 60 ° C ~ 120 ° C for 1 minute ~ 5 minutes. The dried film on the substrate is irradiated with radiation such as ultraviolet rays through a mask of a desired pattern shape. Although the irradiation conditions depend on the kind of the sensitizer in the composition, for example, if the sensitizer is a naphthoquinonediazide derivative, it is preferably irradiated with i rays at ⁵ mJ/cm ² to 1,000 mJ/cm ² . The naphthoquinonediazide derivative in the portion irradiated with ultraviolet rays is a hydrazine carboxylic acid and is rapidly dissolved in the developer.

The film after the radiation irradiation is developed using a developing solution such as an alkali solution. Through this development, the portion of the film that is irradiated with radiation is rapidly dissolved in the developer. development The method is not particularly limited, and any of immersion development, liquid coating development, and shower development can be used.

The developer is preferably an alkali solution. Specific examples of the base contained in the alkali solution are: tetramethylammonium hydroxide, tetraethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, sodium carbonate, sodium hydrogencarbonate, potassium carbonate, hydrogencarbonate Potassium, sodium hydroxide, or potassium hydroxide. Further, the developer is suitably used as an aqueous solution of these bases. In other words, examples of the developing solution include an organic base such as tetramethylammonium hydroxide, tetraethylammonium hydroxide or 2-hydroxyethyltrimethylammonium hydroxide, sodium carbonate, sodium hydroxide or hydroxide. An aqueous solution of an inorganic base such as potassium.

In the developer, for the purpose of reducing the development residue or adapting the shape of the pattern, methanol, ethanol or a surfactant may be added. As the surfactant, for example, a surfactant selected from the group consisting of an anionic system, a cationic system, and a nonionic system can be used. Among these surfactants, in particular, when a nonionic polyoxyethylene alkyl ether is added, it is preferable from the viewpoint of improving the resolution.

The developed film is sufficiently washed with pure water, and then the entire surface of the film on the substrate is irradiated with radiation again. For example, when the radiation is ultraviolet rays, the film is irradiated with an intensity of 100 mJ/cm ² to 1,000 mJ/cm ² . The film irradiated with radiation again is finally calcined at 180 ° C to 350 ° C for 10 minutes to 120 minutes. In this way, a transparent film which is desired to be patterned can be obtained.

The pattern-like transparent film obtained in the above manner can also be used as a pattern-like insulating film. Further, a transparent electrode may be formed on the insulating film, and after patterning by etching, a film subjected to alignment treatment may be formed. The insulating film has high sputtering resistance, Therefore, even if a transparent electrode is formed, wrinkles are not generated on the insulating film, and high transparency can be maintained.

A resin film such as a transparent film or an insulating film is used for a display element such as a liquid crystal. For example, the display element is formed by arranging an element substrate on which a patterned transparent film or insulating film is provided on the substrate and a color filter substrate as a counter substrate in alignment with each other. Then, they are combined by heat treatment, and liquid crystal is injected between the opposing substrates to seal the injection port.

Alternatively, it may be produced by dispersing liquid crystal on the element substrate, laminating the element substrate, and sealing the liquid crystal so as not to leak.

As described above, an insulating film having excellent heat resistance and transparency formed of the positive photosensitive composition of the present invention can be used for a liquid crystal display element. In addition, the liquid crystal used in the liquid crystal display device of the present invention, that is, the liquid crystal compound and the liquid crystal composition are not particularly limited, and any liquid crystal compound and liquid crystal composition can be used.

[Examples]

Hereinafter, the present invention will be further described by way of examples, but the invention is not limited thereto.

[Synthesis Example 1] Synthesis of a siloxane polymer (A1)

Into a four-necked flask equipped with a stirrer, diethylene glycol ethyl methyl ether as a polymerization solvent, tetraethoxy decane as a monomer, dimethyl dimethoxy decane, and phenyl trimethyl group were added in the following weights. Further, a mixed solution of 10.3 g of formic acid and 16.0 g of water was added dropwise to the oxoxane. Heating at 80 ° C for 1 hour, followed by heating for 1 hour while steaming The low molecular component is removed by distillation. Then, the mixture was further heated at 130 ° C for 2 hours to distill off the low molecular component to obtain a polymer polymerization liquid. The total low boiling point component distilled off was 30.8 g. The reaction liquid was cooled to room temperature to obtain a decane polymer (A1).

A portion of the solution was collected and the weight average molecular weight was determined by GPC analysis (polystyrene standard). The weight average molecular weight was 5,100.

[Synthesis Example 2] Synthesis of a siloxane polymer (A2)

According to the method of Synthesis Example 1, each component was added in the following weight, and polymerization was carried out (addition of formic acid 10.3 g, water 14.6 g).

The treatment according to Synthesis Example 1 was carried out to obtain a polymer polymerization liquid. The total low-boiling component removed by distillation was 29.3 g. The weight average molecular weight determined by GPC analysis (polystyrene standard) of the obtained methoxyalkane polymer (A2) was 4,200.

[Synthesis Example 3] Synthesis of a siloxane polymer (A3)

According to the method of Synthesis Example 1, each component was charged in the following weight, and polymerization was carried out (9.6 g of formic acid and 15.0 g of water).

The treatment according to Synthesis Example 1 was carried out to obtain a polymer polymerization liquid. The total low-boiling component removed by distillation removal was 32.1 g. The weight average molecular weight determined by GPC analysis (polystyrene standard) of the obtained methoxyalkane polymer (A3) was 4,200.

[Synthesis Example 4] Synthesis of a siloxane polymer (A4)

According to the method of Synthesis Example 1, each component was added in the following weight, and polymerization was carried out (addition of formic acid: 15.9 g, water: 42.8 g).

The treatment according to Synthesis Example 1 was carried out to obtain a polymer polymerization liquid. The total low-boiling component removed by distillation was 28.9 g. The weight average molecular weight determined by GPC analysis (polystyrene standard) of the obtained methoxyalkane polymer (A4) was 3,500.

[Synthesis Example 5] Synthesis of a siloxane polymer (A5)

According to the method of Synthesis Example 1, each component was added in the following weight, and polymerization was carried out (addition of 12.6 g of formic acid and 19.2 g of water).

The treatment according to Synthesis Example 1 was carried out to obtain a polymer polymerization liquid. The total low-boiling component removed by distillation was 36.9 g. The weight average molecular weight determined by GPC analysis (polystyrene standard) of the obtained methoxyalkane polymer (A5) was 6,300.

[Synthesis Example 6] Synthesis of a siloxane polymer (A6)

According to the method of Synthesis Example 1, each component was charged in the following weight, and polymerization was carried out (0.2 g of phosphoric acid and 31.5 g of water).

The treatment according to Synthesis Example 1 was carried out to obtain a polymer polymerization liquid. Steaming The total low-boiling component removed by distillation was 36.9 g. The weight average molecular weight determined by GPC analysis (polystyrene standard) of the obtained methoxyalkane polymer (A6) was 7,300.

[Example 1] [Manufacture of Positive Photosensitive Composition]

Diethylene glycol ethyl methyl ether as a solvent, a decane polymer (A1) obtained in Synthesis Example 1, a compound of the formula (7) as a naphthoquinonediazide derivative (B), as an additive Megafac F-556 (hereinafter abbreviated as "F-556") manufactured by DIC Co., Ltd. was mixed and dissolved under the following weight to obtain a positive photosensitive composition.

[Evaluation method of positive photosensitive composition]

1) Formation of patterned transparent film

The positive photosensitive composition synthesized in Example 1 was spin-coated on a glass substrate at 1000 rpm for 10 seconds, and dried on a hot plate at 100 ° C for 2 minutes. The substrate was placed in the air through a mask for forming a hole pattern, and a proximity exposure machine TME-150PRC (light source was an ultrahigh pressure mercury lamp) manufactured by Topcon Co., Ltd. was used, and the wavelength cut filter was used. When the light of 350 nm or less was cut off, g-rays, h-rays, and i-rays were taken out, and exposure was performed by the exposure gap 100 micrometer. The exposure amount was measured by an integrated light meter UIT-102 and a light receiver UVD-365PD manufactured by Ushio Electric Co., Ltd., and was set to 100 mJ/cm ² . The exposed glass substrate was immersed and developed in a tetramethylammonium hydroxide aqueous solution for 60 seconds to remove the composition of the exposed portion. The developed substrate was washed with pure water for 60 seconds, and then dried on a hot plate at 100 ° C for 2 minutes. Using the exposure machine, the substrate was subjected to total exposure at an exposure amount of 300 mJ/cm ² without passing through a mask, and then baked in an oven at 350 ° C for 30 minutes to form a patterned transparent film having a film thickness of 1.0 μm. . The film thickness was measured by a stylus type film thickness meter (step) P15 manufactured by KLA-Tencor Japan Co., Ltd.

2) Residual film rate after development

The film thickness was measured before and after development, and was calculated according to the following formula.

(film thickness after development / film thickness before development) × 100 (%)

3) Resolution

The substrate of the pattern-like transparent film after the post-baking obtained in the above 1) was observed by an optical microscope at 1,000 times, and the mask size at which the glass was exposed at the bottom of the hole pattern was confirmed. The case where the hole pattern cannot be formed is regarded as defective (NG: No Good).

4) Transparency

Using a TC-1800 manufactured by Tokyo Denshoku Co., Ltd., a glass substrate on which a transparent film was not formed was used as a reference, and the light transmittance at a wavelength of 400 nm was measured.

5) Heat resistance

The substrate of the patterned transparent film obtained in the above 1) was additionally baked in an oven at 350 ° C for 30 minutes, and the light transmittance was measured in the same manner as in the above 4) before and after heating, and after post-baking ( The light transmittance before the additional baking was set to T ₁ , and the light transmittance after the additional baking was set to T ₂ . The smaller the decrease in the light transmittance from the post-baking to the additional baking, the better the determination. Further, the film thickness was measured before and after heating, and the rate of change in film thickness was calculated from the following formula.

(additional film thickness after baking / film thickness after post-baking) × 100 (%)

6) Crack resistance

The presence or absence of cracks in the transparent film obtained in the above 1) was observed by visual observation. The case where no crack occurred on the film surface was judged to be good (G: Good), and the case where the film surface was cracked was judged to be bad (NG: No Good).

With respect to the positive photosensitive composition synthesized in Example 1, the results obtained by the above evaluation method are shown in Table 1.

[Embodiment 2]

A positive photosensitive composition was prepared according to Example 1 except that the decyl alkane polymer (A1) used in Example 1 was used instead of the siloxane polymer (A2) obtained in Synthesis Example 2. . The results are shown in Table 1.

[Example 3]

A positive photosensitive composition was prepared in accordance with Example 1 except that the alumoxane polymer (A1) used in Example 1 was used instead of the alumoxane polymer (A3) obtained in Synthesis Example 3. . The results are shown in Table 1.

[Example 4]

A positive photosensitive composition was prepared in accordance with Example 1 except that the alumoxane polymer (A1) used in Example 1 was used instead of the alumoxane polymer (A4) obtained in Synthesis Example 4. . The results are shown in Table 1.

[Example 5]

A positive feeling was prepared in accordance with Example 1 except that instead of the siloxane polymer (A1) used in Example 1, the siloxane polymer (A5) obtained in Synthesis Example 5 was used. The photo composition was evaluated. The results are shown in Table 1.

[Embodiment 6]

A positive photosensitive composition was prepared in accordance with Example 1 except that the alumoxane polymer (A1) used in Example 1 was used instead of the alumoxane polymer (A6) obtained in Synthesis Example 6. . The results are shown in Table 1.

[Embodiment 7]

A positive photosensitive composition was prepared and evaluated in accordance with Example 1 except that the compound of the formula (7) used in Example 1 was used instead of the compound of the formula (8). The results are shown in Table 1.

[Embodiment 8]

A positive photosensitive composition was prepared and evaluated in accordance with Example 1 except that the compound of the formula (7) used in Example 1 was used instead of the compound of the formula (9). The results are shown in Table 1.

[Embodiment 9]

The n-oxyalkylene polymer (A1) obtained in the synthesis example 4 and the synthesis example 5 and the aluminoxane polymer (A4) and the aluminoxane polymer (A5) were used in the following manner except for the oxyalkylene polymer (A1) used in the example 1. A positive photosensitive composition was prepared in accordance with Example 1 and evaluated. The results are shown in Table 1.

[Embodiment 10]

Further, 0.15 g of bisphenol Z (manufactured by Honshu Chemical Industry Co., Ltd.) was added to the composition of Example 8, and a positive photosensitive composition was prepared and evaluated. The results are shown in Table 1.

[Example 11]

Diethylene glycol ethyl methyl ether, a siloxane polymer (A1), a siloxane polymer (A5), a compound of the formula (7), bisphenol A (manufactured by Honshu Chemical Industry Co., Ltd.), F- 556 was mixed and dissolved under the following weight to obtain a positive photosensitive composition.

[Comparative Example 1]

In place of the compound of the formula (7) used in Example 1, 4,4'-[1-[4-[1-[4-hydroxyphenyl]- as a 1,2-quinonediazide compound was used. Prepared according to Example 1 except for the ester compound of 1-methylethyl]phenyl]ethylidene]bisphenol and 6-diazo-5,6-dihydro-5-oxo-naphthalene-1-sulfonic acid The positive photosensitive composition was evaluated. The results are shown in Table 2.

Table 2

[Comparative Example 2]

In place of the compound of the formula (8) used in Example 6, 4,4'-[1-[4-[1-[4-hydroxyphenyl]- as a 1,2-quinonediazide compound was used. Prepared according to Example 6 except for the ester compound of 1-methylethyl]phenyl]ethylidene]bisphenol and 6-diazo-5,6-dihydro-5-oxo-naphthalene-1-sulfonic acid The positive photosensitive composition was evaluated. The results are shown in Table 2.

[Comparative Example 3]

In place of the compound of the formula (9) used in Example 7, 4,4'-[1-[4-[1-[4-hydroxyphenyl]- as a 1,2-quinonediazide compound was used. Prepared according to Example 7 except for the ester compound of 1-methylethyl]phenyl]ethylidene]bisphenol and 6-diazo-5,6-dihydro-5-oxo-naphthalene-1-sulfonic acid The positive photosensitive composition was evaluated. The results are shown in Table 2.

[Comparative Example 4]

Instead of using the compound of the formula (7) in Example 8, 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1 was used as the 1,2-quinonediazide compound. In addition to the ester compound of -methylethyl]phenyl]ethylidene]bisphenol and 6-diazo-5,6-dihydro-5-oxo-naphthalene-1-sulfonic acid, preparation was carried out in accordance with Example 8. The photosensitive composition was evaluated. The results are shown in Table 2.

According to the results of the examples and the comparative examples, it was found that the cured film formed using the positive photosensitive composition of the present invention has high transmittance.

[Industrial availability]

The positive photosensitive composition of the present invention can be used, for example, for a liquid crystal display element.

Claims (8)

A positive photosensitive composition comprising: a decane polymer (A), a naphthoquinonediazide derivative (B) represented by the following formula (1) or (2), and an organic solvent (C) And the positive photosensitive composition is a cured film obtained by thermally curing the composition at 350 ° C or higher, and has a light transmittance of 95% or more per 1 μm film thickness at a wavelength of 400 nm. In the formula, R ¹ and R ² each independently represent an aryl group. The positive photosensitive composition according to claim 1, wherein R ^{1 of} the formula (1) or R ² of the formula (2) is selected from the following formulas (3) to (6); One of the monovalent groups, R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ and R ⁹ each independently represent hydrogen or an alkyl group having 1 to 5 carbon atoms. Positive photosensitive combination as described in claim 1 or 2 And the alkoxyalkylene polymer (A) is an alkali-soluble polymer synthesized by hydrolytic condensation of a raw material containing at least two alkoxydecane compounds; and here, two kinds of alkoxydecane compounds It is a choice of two compounds having different amounts of alkoxy groups. The positive photosensitive composition according to claim 3, wherein the alkoxydecane compound is selected from the group consisting of tetramethoxynonane, tetraethoxydecane, methyltrimethoxydecane, and phenyltrimethoxy. Base decane, methyl triethoxy decane, phenyl triethoxy decane, dimethyl dimethoxy decane, diphenyl dimethoxy decane, methyl phenyl dimethoxy decane, dimethyl A group consisting of diethoxydecane, diphenyldiethoxydecane, methylphenyldiethoxydecane, trimethylmethoxydecane, and trimethylethoxydecane. The positive photosensitive composition according to any one of claims 1 to 4, wherein the oxyalkylene polymer (A) has a weight average molecular weight of 500 to 100,000 in terms of polystyrene. The positive photosensitive composition according to any one of claims 1 to 5, wherein the naphthoquinonediazide derivative (B) is selected from the following formula (7) to (formula) 9) at least one of the groups of the compounds represented, A cured film formed by using the positive photosensitive composition according to any one of claims 1 to 5. A display element produced by using a cured film as described in claim 7 of the patent application.