TW201520511A - 3D measurement device, 3D measurement method, and manufacturing method of substrate - Google Patents

Abstract

This invention provides a 3D measurement device capable of increasing the measurement precision using photometric stereo technology. The 3D measurement device comprises: a height measurement part, a 3D shape measurement part, and a compensation part. The height measurement part is configured for measuring the height or height shift of a predetermined position of a measurement subject. The 3D shape measurement part is configured for using the photometric stereo technology to measure the 3D shape of the measurement subject. The compensation part is configured for compensating the data obtained at the 3D shape measurement part according to the data obtained from the height measurement part.

Description

Three-dimensional measuring device, three-dimensional measuring method and manufacturing method of substrate Field of invention

This technique relates to a technique such as a three-dimensional measuring device that measures the three-dimensional shape of an object to be measured.

Background of the invention

Since the past, there has been a method of measuring the three-dimensional shape using Photometric Stereo. In the photometric stereography method, first, three or more illuminations having different light irradiation directions are used to illuminate the measurement target in turn, and the imaging target is imaged by the imaging unit each time the illumination is switched. Then, based on three or more images obtained by the imaging unit, the normal direction in each point on the surface of the object to be measured is acquired as a normal map.

Thereby, the object to be measured can be measured in three dimensions. In the case where there are three or more images in which light having different irradiation directions is irradiated onto the object to be measured, the three-dimensional shape of the object to be measured can be measured by photometric stereography.

Patent Document 1 discloses an appearance inspection device that inspects the appearance of a substrate on which a solder material is printed or a substrate on which an electronic component is mounted, using a photometric stereography method.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-237034

Summary of invention

In general, when the photometric stereography method is applied, diffusion reflection (Lambertian reflectance) and shape change are linear in the measurement surface of the measurement object. The further the shape of the measurement surface is from the condition, the greater the error of the measurement data by the photometric stereography.

The object of the present technology is to provide a three-dimensional measuring device or the like which can improve the measurement accuracy by photometric stereography.

In order to achieve the above object, the three-dimensional measuring device of the present invention includes a height measuring unit, a three-dimensional shape measuring unit, and a correcting unit.

The height measuring unit is configured to measure a height or a height displacement of a predetermined position of the object to be measured.

The ternary shape measuring unit is configured to measure the three-dimensional shape of the object to be measured by photometric stereography.

The correction unit is configured to supplement the data obtained by the three-dimensional shape measuring unit based on the data obtained by the height measuring unit.

The three-dimensional measuring device is based on the high-precision data obtained by the height measuring unit, and is supplemented by photometric stereography. By measuring the obtained data, the measurement accuracy by the photometric stereography method can be improved.

The three-dimensional shape measuring unit may include a photometric stereoscopic image acquiring unit that is configured to individually illuminate the light by three or more light sources. The area of the object to be measured is photographed, thereby obtaining three or more images. Thereby, the measurement of the three-dimensional shape by the photometric stereography can be performed.

The three-dimensional measuring device may further include an image processing unit.

The image acquisition unit may be configured to image the measurement target object that is irradiated with the light in the irradiation direction by the three or more light sources, and acquire the measurement target object. image.

The image processing unit may be configured to capture a plurality of regions included in an image of the measurement target obtained by the image acquisition unit. The image processing unit can measure the image including the object to be measured into a plurality of regions, and can measure the height of the region by the height measuring unit and/or the three-dimensional shape measuring unit, thereby improving the measurement accuracy.

The height measuring unit may measure the height of the object to be measured along a line that traverses the plurality of regions obtained by the image processing unit. However, if there are two or more points as measurement points, a line segment can be formed, and if there are three or more points as measurement points, the surface can be formed, so that the accuracy can be further improved.

The three-dimensional shape measuring unit may also be each of the above figures The three-dimensional shape is measured for each region captured by the processing unit.

The correction unit may correct the data obtained by the three-dimensional shape measuring unit based on the difference between the data obtained by the height measuring unit and the data obtained by the three-dimensional shape measuring unit. Thereby, the correction unit obtains an error between the data obtained in the height measuring unit and the data obtained in the three-dimensional shape measuring unit, and corrects the error based on the error.

The correction unit may also remove the difference portion from the data obtained in the third-dimensional shape measuring unit.

The height measuring unit may have a displacement meter. By using a displacement meter, the measurement accuracy by the height measuring unit is improved.

The three-dimensional measuring apparatus according to another aspect of the present invention includes three or more light sources, an imaging element, a height measuring unit, a three-dimensional shape measuring unit, and a correction unit.

Next, the imaging element can capture an object to be measured.

Next, the height measuring unit is configured to measure a height or a height displacement of a predetermined position of the object to be measured.

Next, the ternary shape measuring unit is configured to measure the three-dimensional shape of the object to be measured by photometric stereography using the three or more light sources and the imaging element. Next, the correction unit is configured to correct the data obtained by the three-dimensional shape measuring unit based on the data obtained by the height measuring unit.

Further, the three-dimensional measuring device may further include: a holding portion that holds a substrate as the object to be measured; and a support portion that is configured The image pickup device and the three or more light sources are integrally supported by the holding portion, and a moving mechanism that relatively moves the holding portion and the support portion.

The three-dimensional measurement method of the present technique includes measuring the height of the predetermined position of the object to be measured, or the height displacement.

Next, the three-dimensional shape of the object to be measured is measured by photometric stereography.

Next, the data obtained by the measurement of the above-described three-dimensional shape is corrected based on the data obtained by the height or height displacement measurement.

The program for performing the three-dimensional measurement in the present technique is such that the three-dimensional measuring device performs the following steps. The steps of measuring the height or the height displacement of the predetermined position of the object to be measured, the step of measuring the three-dimensional shape of the object to be measured by photometric stereography, and the measurement based on the height or height displacement The data is a step of correcting the data obtained by measuring the aforementioned three-dimensional shape.

The manufacturing method of the substrate of the present technology is included on a substrate, mounting a part or forming a solder material.

The height or the height displacement of the predetermined position of the aforementioned part or the aforementioned welding material on the substrate is measured.

Next, the three-dimensional shape of the aforementioned part or the consumable is measured by photometric stereography.

Next, the data obtained by the measurement of the above-described three-dimensional shape is corrected based on the data obtained by the height or height displacement measurement.

As described above, with the present technology, the measurement accuracy by the photometric stereography method can be improved.

However, the effects described herein are not limited, and may be any effects described in the present disclosure.

1‧‧‧Substrate

3‧‧‧ alignment mark

10‧‧‧Transportation Department

11‧‧‧ Guides

12‧‧‧ feet

13‧‧‧Conveyor belt

15‧‧‧Control Department

16‧‧‧Image Processing Department

17‧‧‧Image Memory Department

20‧‧‧ spare parts

21‧‧‧ spare board

22‧‧‧Support pins

30‧‧‧ camera unit

31‧‧‧Photographic components

32‧‧‧Lighting Department

32a‧‧‧Dome components

32b‧‧‧Lighting

33‧‧‧ Laser Displacement Meter

40‧‧‧Mobile agencies

100‧‧‧Inspection device

PA‧‧‧Photography area

P1‧‧‧ mounting surface

P2‧‧‧Electronic parts

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an inspection apparatus to which a three-dimensional measuring apparatus of the present technology is applied.

Fig. 2 is a view of the inspection apparatus shown in Fig. 1 as seen in the transport direction of the mounting substrate.

Fig. 3 is a schematic view of an image pickup unit viewed in the Z direction.

Fig. 4 is a block diagram showing the electrical configuration of the function display inspection device.

Fig. 5 is a flow chart showing the operation of the inspection device.

Fig. 6 is a view showing an example of a photographing area obtained by an image pickup element.

FIG. 7 is a diagram for explaining classification of regions within an image captured by step 106.

Fig. 8 is a view showing the relationship between the measurement surface of the measurement target and the coordinate system of the space.

Fig. 9 is a graph showing data obtained by using the gradient field data calculated by photometric stereography.

Fig. 10 is a graph showing data obtained by correcting the gradient field.

Form for implementing the invention

Hereinafter, embodiments of the present technology will be described with reference to the drawings.

1. Composition of an inspection device suitable for a three-dimensional measuring device

1) Composition of the inspection device

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an inspection apparatus to which a three-dimensional measuring apparatus of the present technology is applied. 2 is a view of the inspection apparatus 100 shown in FIG. 1 in a conveyance direction of the mounting substrate.

The inspection apparatus 100 is a device that inspects the mounting state of electronic components on the substrate after mounting electronic components on a substrate such as a mounting substrate by a mounting machine.

The inspection apparatus 100 is a conveyance unit 10 that conveys the substrate 1 in the conveyance direction (X direction) and stops the conveyed substrate 1 at a predetermined position. The inspection device 100 is a spare portion 20 having a substrate 1 that is stopped at a stop target position by a lower support.

The inspection apparatus 100 includes an imaging unit 30 and a movement mechanism 40 that moves the imaging unit 30 in the X and Y directions, and the imaging unit 30 has an illumination unit 32 that emits light to the substrate 1 supported by the spare unit 20, And an imaging element 31 that images the substrate 1 that is irradiated with light.

The substrate 1 to be inspected by the inspection device 100 has a rectangular shape, for example, in plan view. A plurality of alignment marks 3 are provided on the substrate 1 (refer to FIG. 1). In Fig. 1, an example of a case where the alignment mark 3 is provided on the diagonal line on the diagonal line of the substrate 1 is shown.

The conveyance unit 10 has two guides 11 that sandwich the substrate 1 from both sides and guide the substrate 1 in the conveyance direction. Each of the guides 11 is a plate-like member having a shape elongated toward the conveying direction of the substrate 1. On the lower side of each of the guide members 11, a plurality of leg portions 12 each having a lower support guide 11 are provided. Guides 11 is attached to a base (not shown) of the inspection apparatus 100 through the leg portion 12.

The spare portion 20 has a spare plate 21 configured to be movable up and down, and a plurality of support pins 22 that are erected on the standby plate 21.

On the inner side of each of the guide members 11, a conveyor belt 13 that can be rotated forward and backward is provided. The conveyance unit 10 is configured to convey the substrate 1 to a predetermined position (a position at which the spare portion 20 is disposed) by which the inspection is performed by the conveyance of the conveyance belt 13, or to carry out the inspection of the substrate 1 that has finished the inspection.

Each of the guides 11 is formed such that the upper end portion is bent toward the inner side. The upper end portion of the guide 11 is such that when the substrate 1 is moved upward by the spare portion 20, the substrate 1 is brought into contact with the upper side, whereby the upper end portion and the spare portion 20 can be used to sandwich both sides of the substrate 1. Thereby, the substrate 1 is held, and in the state of being held, the inspection process by the imaging unit 30 is performed. At this time, the transport unit 10 or the spare unit 20 functions as a “holding unit” that holds the substrate.

FIG. 3 is a schematic view of the imaging unit 30 viewed in the Z direction. The illumination unit 32 of the imaging unit 30 has a dome-shaped dome member 32a having an opening formed at the top thereof, and three or more illuminations (light sources) 32b disposed inside the dome member 32a. The one illumination 32b is composed of, for example, one or a plurality of LEDs (Light Emitting Diodes). The illumination 32b is provided, for example, at eight, and is disposed on a circumference centering on the main optical axis (Z direction) of the imaging unit 30. The illuminations 32b are for example arranged at equal angular intervals.

The dome member 32a functions as a "support portion" that integrally supports the imaging element 31 and the plurality of illuminations 32b.

The imaging element 31 is fixed to the opening of the dome member 32a at the upper side of the dome member 32a of the illumination unit 32, and is disposed such that its main optical axis is perpendicular to the inspection surface of the substrate 1. The imaging element 31 includes an imaging element such as a CCD sensor (Charge Coupled Device) or a CMOS sensor (CMOS: Complementary Metal Oxide Semiconductor), and an optical system such as an imaging lens. .

The imaging element 31 captures the alignment mark 3 on the substrate 1 or captures the inspection surface of the substrate 1 under the control of the control unit 15 which will be described later. The imaging area of the imaging element 31 is formed to be, for example, about 35 mm × 35 mm. When the imaging surface of the substrate 1 is imaged by the imaging device 31, the imaging element 31 is moved in the X and Y-axis directions by the moving mechanism 40, and the area on the substrate 1 that must be inspected is divided into plural times. Camera. In addition, the imaging element 31 is used in the three-dimensional measurement of the object to be measured, which will be described later, as will be described later.

In the illustrated example, the number of the imaging units 30 is one, but the number of the imaging units 30 may be two or more.

The inspection apparatus 100 is provided with a laser displacement meter 33 that is provided to be movable integrally with the imaging unit 30. For example, the laser displacement meter 33 is mounted on the side of the image pickup element 31. The laser displacement meter 33 measures the height or height displacement in a predetermined position of the electronic component as the measurement target on the substrate 1.

2) The electrical composition of the inspection device

FIG. 4 is a block diagram showing the electrical configuration of the function display inspection apparatus 100.

The inspection apparatus 100 includes a control unit 15, an image processing unit 16, and an image storage unit 17. Further, the inspection apparatus 100 includes the above-described moving mechanism 40, a laser displacement gauge 33, an image sensor 31, and an illumination unit 32.

The image processing unit 16 processes the image on the substrate 1 obtained by the image sensor 31 in accordance with the control of the control unit 15. The image storage unit 17 stores image data processed by the image processing unit 16.

The control unit 15 is provided with at least a hard computer such as a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). Body element. The control unit 15 may be a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array) or another ASIC (Application Specific Integrated Circuit). And other components to achieve.

The control unit 15 can individually turn ON and OFF the plurality of illuminations 32b. The control unit 15 can, for example, illuminate at least one of the illuminations 32b, or can simultaneously illuminate all of the eight illuminations 32b.

2. Check the action of the device

FIG. 5 is a flow chart showing the operation of the inspection apparatus 100 as part of the manufacturing method of the substrate.

The control unit 15 moves the imaging unit 30 onto the substrate 1 carried by the transport unit 10, and images the alignment marks on the substrate 1 by the imaging element 31. Thereby, the substrate 1 and the imaging unit 30 are relatively positioned (step 101). Thereby, it is decided to be unified in the system of the inspection apparatus 100. Standard system.

The control unit 15 individually lights the illuminations 32b one by one, and uses the imaging element 31 located at a predetermined position to photograph a predetermined area on the substrate 1 every time the lighting is switched (step 102).

As shown in FIG. 6, the predetermined area (photographing area PA) is an area including, for example, one or more electronic parts P2 to be measured, which is mounted on the mounting surface P1 of the substrate 1.

When there are a plurality of electronic components to be measured, there are cases in which the imaging area PA is plural. Alternatively, the imaging element 31 may image one area including a plurality of electronic parts P2 as one imaging area PA, or may photograph the entire substrate 1 as one imaging area PA. In other words, the imaging area PA can be appropriately set by the number, size, arrangement of the electronic components to be measured, and the angle of view or resolution of the imaging element 31.

In step 102, the control unit 15 acquires an image of eight imaging areas PA of the measurement target caused by light in eight different directions (step 103). For convenience of explanation, the following is to set the plurality of images as "image A". The plurality of (8) images are used for calculations for the three-dimensional shape measurement by photometric stereography. At this time, the control unit 15 functions as a "photometric stereoscopic image acquisition unit".

The control unit 15 transmits the captured image A to the image storage unit 16 through the image processing unit 16. Image A can be a color image or a grayscale image.

Further, the control unit 15 is in a state in which all the illuminations 32b are turned on. In the state in which the light in the irradiation direction of the eight illuminations 32b is irradiated onto the object to be measured, the imaging element 31 is used to image the object to be measured (step 104). Thereby, the control unit 15 acquires one image of the imaging area PA including the measurement target (step 105). At this time, the control unit 15 functions as an "image acquisition unit". For the sake of convenience of explanation, the following image is set to "image B".

The image B is not necessarily an image obtained by the illumination of the eight illuminations 32b, and may be a predetermined number of illuminations 32b among the eight by, for example, a point-symmetric position centered on the optical axis. The resulting image is illuminated.

The control unit 15 stores the captured image B in the image storage unit 17 through the image processing unit 16. The image B may be a color image or a grayscale image, preferably formed to be the same as the selection of the image A.

The control unit 15 analyzes the image B by the image processing unit 16. FIG. 6 is an example of displaying an image (for example, image B) of a predetermined area PA as described above. In this example, the electronic component P2 is a passive component such as a resistor. The image processing unit 16 extracts a plurality of regions from the image B by edge processing or the like based on the pixel values (luminance values) of the image B (step 106). The plurality of regions are regions that are distinguished by the material of the object located in the imaging region PA. That is, depending on the material, the form of reflection such as the reflectance of the illumination light and the direction of reflection may be different.

FIG. 7 is a diagram for explaining classification of a region obtained by step 106. The region (1) is the surface (mounting surface) P1 of the substrate 1, the regions (2) and (4) are the electrode portions of the electronic component P2, and the region (3) is the resin mounting body of the electronic component P2. unit.

Next, the control unit 15 controls the movement of the moving mechanism 40 to traverse the plurality of regions (1) to (4) that are captured, so that the laser displacement meter supported by the imaging unit 30 is supported. 33 moves.

The control unit 15 measures the height of the electronic component P2 from the mounting surface P1 by using the laser displacement meter 33 while scanning the laser displacement meter 33 as described above (step 107). That is, the control unit 15 measures the height (i.e., height displacement) of the electronic component P2. At this time, the laser displacement meter 33 and the control unit 15 function as a "height measuring unit".

FIG. 8 is a view showing the relationship between the measurement surface R of the measurement target and the coordinate system of the space. The control unit 15 generates a gradient field C(p, q) for each of the regions using the photometric stereography for each region captured in step 106 (step 108). p = δ z / δ x, q = δ z / δ y. At this time, at least the control unit 15 functions as a "three-dimensional shape measuring unit".

Specifically, the control unit 15 uses the known relative positions of the respective illuminations 32b and the illumination directions obtained by the known illuminations 32b, based on the brightness in each of the extracted regions (1) to (4). Values, etc., for each of these regions, calculate p = δ z / δ x, q = δ z / δ y. The measurement point is formed on at least one dot (pixel) for each region, for example, on the line segment shown in FIG.

The data of the gradient fields p, q obtained in step 108 represents the shape of the electronic component P2 including the mounting surface P1. Fig. 9 is a graph showing data according to the gradient fields p, q. The curved shape has a shape corresponding to each of the regions (1) to (4).

Next, the control unit 15 is based on the information obtained by the laser displacement meter 33. The gradient fields p and q are corrected (step 109). At this time, the control unit 15 functions as a "correction unit". The difference between the measurement data (pm, qm) obtained by the laser displacement meter 33 on the line shown in Fig. 7 which is divided for each region, and the gradient field (p, q) corresponding to the above will be obtained. The set of (error) is taken as (ep, eq) (see the following formula). n is the number of measurements, that is, the number of measurement points.

[ Equation 1] ep _1..n = p ( x _1..n , y _1..n )- pm ( x _1..n , y _1..n ) eq _1..n = q ( x _{1. .n} , y _1..n )- qm ( x _1..n , y _1..n )

The approximate expressions calculated from the point sequences ep1..n and eq1..n are e(x) and e(y), respectively, and the control unit 15 performs the gradient field C(p, q) using the following equation. Correction. The gradient fields to be corrected are set to pf and qf. In other words, the corrected gradient fields pf and qf are values indicating the portion of the error obtained by the measurement of the three-dimensional shape obtained by the photometric stereography.

[number 2] p _f ( x , y ) = p ( x , y ) - e ( x ) q _f ( x , y ) = q ( x , y ) - e ( y )

The approximation method for obtaining the approximate expressions e(x) and e(y) is not particularly limited, but for example, an averaging method, a bilinear method, or an n-time approximation (for example, a second approximation) can be applied.

The corrected gradient fields pf and qf are, for example, as shown in FIG. 10, and a curve whose height information is corrected is displayed as compared with the case shown in FIG.

3. Conclusion

The inspection apparatus 100 according to the present embodiment corrects the data obtained by the photometric stereography based on the high-precision data obtained by the laser displacement meter 33, thereby improving the measurement accuracy by the photometric stereography. .

In particular, regions including a plurality of different materials have different reflectances. Therefore, if a photometric stereography method is applied, a highly accurate three-dimensional shape data cannot be obtained. However, by using the high-precision data obtained by the laser displacement meter 33, the accuracy of the measurement data obtained by the photometric stereography method can be improved even if the measurement object has a different plurality of materials.

For example, the three-dimensional shape can be measured at a high speed by the three-dimensional measurement of the present embodiment, compared with the method of measuring the three-dimensional shape by scanning the entire three-dimensional region using a one-dimensional laser displacement meter. Further, since it is not necessary to use an expensive measuring device such as a two-dimensional laser displacement meter, the measurement of the three-dimensional shape can be performed at low cost.

By applying the method of the three-dimensional measurement of the present technique to the inspection apparatus 100, in addition to the inspection items obtained by the conventional inspection apparatus 100, the inspection by the measurement of the three-dimensional shape can also be performed. Therefore, it is possible to realize various inspection processes by one inspection apparatus 100, and it is possible to improve the reliability of the product.

4. Other embodiments

The present technology is not limited to the embodiments described above, and various other embodiments can be realized.

In particular, the inspection apparatus 100 of the above-described embodiment checks the state of the electronic component mounted on the substrate 1, but may, for example, inspect the state of the welding material formed on the substrate 1. At this time, the inspection apparatus for inspecting the state of the welding material can also calculate the volume of the welding material by using the data of the measurement of the three-dimensional shape.

The object to be measured may not be a passive element as described above, and the present technology can be applied to various types including the active element.

Alternatively, the three-dimensional measuring device may be a device having a separate function of a three-dimensional measurement, and not a three-dimensional measuring device being applied to the inspection device 100. For example, the present technology can also be applied to a three-dimensional measuring device that is utilized in the medical field or other industrial fields.

As shown in FIG. 7, the direction in which the laser displacement gauge 33 is scanned is the X direction, but may be the scanning direction of the component including the two directions of X and Y. Thereby, the number of measurement points can be increased, and the accuracy of the calculation can be improved. Alternatively, scanning may be performed along a line in a plurality of directions in one object to be measured.

In the example shown in FIG. 6, the imaging area PA obtained by the imaging element 31 is an area including an image of one electronic component P2. However, for example, when the image capturing area includes an image of a plurality of electronic components, the control unit 15 may have a algorithm for scanning processing of a displacement meter corresponding to the relative arrangement, posture, direction, and the like of the plurality of electronic components. Thereby, the time efficiency of the inspection can be improved.

In the above embodiment, a laser displacement meter is used, but a displacement meter using optical interference, a displacement meter using ultrasonic waves, a contact type displacement meter, or the like may be used. It is not limited to a displacement meter, for example, such as light cutting, etc. A sensor that can illuminate at least one element of light on the object to be measured and detect the reflected state of the light, and may be any machine.

The order of steps 102 (and 103) and steps 104 (and 105) shown in FIG. 5 may also be reversed.

Alternatively, the steps 102 and 104 can also be performed simultaneously by changing the wavelength of the illumination light. At this time, for example, the image for acquiring the image A is visible light, and the image for obtaining the image B is infrared light, whereby the images can be simultaneously photographed. In this case, the image sensor must have an image sensor that can detect the light of the different wavelengths.

Alternatively, the image processing unit 16 may generate the image B by processing the image A obtained in the step 102 (and 103). At this time, steps 104 and 105 are not required.

In the above embodiment, the imaging unit is configured to move with respect to the substrate held by the transport unit 10. However, the imaging unit may be fixed, and the holding unit holding the substrate may be moved relative to the imaging unit.

In the above embodiment, the number of the illuminations 32b serving as the light source is eight, and may be at least three or nine or more.

In the above embodiment, the laser displacement meter 33 is integrally supported by the imaging unit 30, but the inspection device may be equipped with a mechanism for moving the individual.

In the above embodiment, the height measuring unit as the laser displacement meter 33 measures the height displacement across a plurality of regions (1) to (4) of the electronic component. The height measuring unit may also have at least 1 point, for example, for each of the areas. The measurement point is used to determine the height, and is not limited to the measurement method as shown above.

Among the characteristic portions of the respective aspects described above, at least two feature portions may be combined.

The present technology can also adopt the configuration shown below.

(1) A three-dimensional measuring device comprising: a height measuring unit configured to measure a height or a height displacement of a predetermined position of the object to be measured; and a three-dimensional shape measuring unit configured to: by photometry The three-dimensional shape is used to measure the three-dimensional shape of the object to be measured, and the correction unit is configured to complement the data obtained by the three-dimensional shape measuring unit based on the data obtained by the height measuring unit.

(2) The three-dimensional shape measuring unit according to the above aspect, wherein the three-dimensional shape measuring unit includes a photometric stereoscopic image acquiring unit configured to include three or more light sources by the imaging element pair. On the other hand, three or more images are acquired by photographing the regions of the measurement target that are individually irradiated with light.

(3) The three-dimensional measuring device according to (2), further comprising: an image acquiring unit configured to cause the pair of imaging elements to be irradiated to include three or more light sources The image to be measured of the light in the irradiation direction is imaged to obtain an image including the object to be measured, and the image processing unit is configured to: acquire the measurement target included in the image acquisition unit a plurality of regions within the image of the object.

(4) The three-dimensional measuring device according to the above aspect, wherein the height measuring unit measures the height of the object to be measured along a line that traverses the plurality of regions obtained by the image processing unit.

(5) The three-dimensional measuring device according to (3) or (4), wherein the three-dimensional shape measuring unit measures the third time for each of the regions captured by the image processing unit. Meta shape.

(3) The three-dimensional measuring device according to any one of the above-mentioned, wherein the correction unit is based on data obtained in the height measuring unit and data obtained in the third-dimensional shape measuring unit. The difference is the correction of the data obtained in the third-dimensional shape measuring unit.

(7) The three-dimensional measuring apparatus according to (6), wherein the correction unit removes the difference from the data obtained by the three-dimensional shape measuring unit.

The three-dimensional measuring device according to any one of (1) to (7), wherein the height measuring unit has a displacement meter.

(9) A three-dimensional measuring apparatus comprising: three or more light sources; an imaging element that can image an object to be measured; and a height measuring unit that measures a predetermined position of the object to be measured a three-dimensional shape measuring unit configured to measure a three-dimensional shape of the object to be measured by photometric stereography using the three or more light sources and the imaging element; and a correction unit, It is configured to be obtained from the height measuring unit. The data is corrected in the data obtained by the aforementioned three-dimensional shape measuring unit.

(10) The three-dimensional measuring device according to (9), further comprising: a holding portion that holds the substrate as the measurement target; and a support portion that is disposed on the holding portion and integrated The image sensor and the three or more light sources are supported, and the moving mechanism is configured to relatively move the holding portion and the support portion.

(11) A three-dimensional measurement method for measuring a height or a height displacement of a predetermined position of an object to be measured, and measuring a three-dimensional shape of the object to be measured by photometric stereography, and measuring the height or height displacement according to the height or height The obtained data is corrected for the data obtained by the measurement of the aforementioned three-dimensional shape.

(12) A method of manufacturing a substrate by mounting a component or forming a solder material on a substrate, and measuring a height or a height displacement of a predetermined position of the component or the solder material on the substrate, by photometric stereography. The three-dimensional shape of the above-mentioned part or the consumable is measured, and the data obtained by the measurement of the above-described three-dimensional shape is corrected based on the data obtained by the height or height displacement measurement.

15‧‧‧Control Department

16‧‧‧Image Processing Department

17‧‧‧Image Memory Department

31‧‧‧Photographic components

32‧‧‧Lighting Department

33‧‧‧ Laser Displacement Meter

40‧‧‧Mobile agencies

Claims (12)

A three-dimensional measuring device includes a height measuring unit configured to measure a height or a height displacement of a predetermined position of the object to be measured, and a three-dimensional shape measuring unit configured to measure the measurement target by photometric stereography The three-dimensional shape of the object and the correction unit are configured to complement the data obtained by the third-dimensional shape measuring unit based on the data obtained by the height measuring unit. The three-dimensional measuring device according to claim 1, wherein the three-dimensional shape measuring unit includes a photometric stereoscopic image acquiring unit configured to include three or more imaging element pairs The light source is individually irradiated to the region of the object to be measured of light, and three or more images are obtained. The three-dimensional measuring device according to claim 2, further comprising: an image acquiring unit configured to perform the measurement target object irradiated with light in an irradiation direction by the three or more light sources by the imaging device The image capture unit obtains an image including the object to be measured, and the image processing unit is configured to capture a plurality of regions included in the image of the object to be measured obtained by the image acquisition unit. The three-dimensional measuring device according to claim 3, wherein the height measuring unit measures the height of the object to be measured along a line that traverses the plurality of regions obtained by the image processing unit. The three-dimensional measuring device according to claim 3, wherein the three-dimensional shape measuring unit measures the three-dimensional shape in each of the regions captured by the image processing unit. The three-dimensional measuring device according to claim 1, wherein the correction unit is obtained from the third-dimensional shape measuring unit based on a difference between the data obtained in the height measuring unit and the data obtained in the three-dimensional shape measuring unit. The information is corrected. The three-dimensional measuring apparatus according to claim 6, wherein the correction unit removes the difference from the data obtained by the third-dimensional shape measuring unit. The three-dimensional measuring device of claim 1, wherein the height measuring unit has a displacement meter. A three-dimensional measuring device comprising: three or more light sources; an imaging element that can image an object to be measured; and a height measuring unit configured to measure a height or a height displacement of a predetermined position of the object to be measured; The element shape measuring unit is configured to measure the three-dimensional shape of the object to be measured by photometric stereography using the three or more light sources and the image sensor, and the correction unit is configured to be based on the height measuring unit The obtained data is corrected in the data obtained by the above-described three-dimensional shape measuring unit. The three-dimensional measuring device according to claim 9, further comprising: a holding portion for holding a substrate as the object to be measured; The support portion is disposed on the holding portion, and integrally supports the imaging element and the three or more light sources, and a moving mechanism that relatively moves the holding portion and the support portion. A three-dimensional measurement method for measuring a height or a height displacement of a predetermined position of an object to be measured, and measuring a three-dimensional shape of the object to be measured by photometric stereography, and measuring the data based on the height or height displacement, The data obtained by the measurement of the aforementioned three-dimensional shape is corrected. A method of manufacturing a substrate by mounting a component or forming a solder material on a substrate, measuring a height or a height displacement of a predetermined position of the component or the solder material on the substrate, and measuring the part or by photometric stereography The three-dimensional shape of the consumable material is corrected based on the data obtained by measuring the height or height displacement described above.