TW201520265A - 可固化環氧樹脂組成物 - Google Patents
可固化環氧樹脂組成物 Download PDFInfo
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- TW201520265A TW201520265A TW103133229A TW103133229A TW201520265A TW 201520265 A TW201520265 A TW 201520265A TW 103133229 A TW103133229 A TW 103133229A TW 103133229 A TW103133229 A TW 103133229A TW 201520265 A TW201520265 A TW 201520265A
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- Prior art keywords
- epoxy
- curable composition
- weight
- range
- functional monomer
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
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Abstract
本發明係揭示含一環氧混合物之可固化組成物,該環氧混合物含a)一環氧混合物,其含i)含具有以第一環氧組份之總重計,小於10重量%之2-官能性單體含量且具有一在170至200之範圍內的環氧當量之環氧酚型酚醛清漆寡聚物的第一環氧組份、及ii)含一具有至少2之平均官能度之單體之環氧樹脂的第二環氧組份;以及b)一硬化劑。該等可固化組成物可用以製備用於熱熔應用之預浸物。
Description
本揭示內容之實施例係有關於環氧樹脂組成物且更詳細地係有關於與硬化劑組合以形成可固化組成物之環氧樹脂組成物。該等可固化組成物可用以製造預浸物。
環氧熱固性材料業經作為嵌埋強化纖維以製備用於結構應用之輕質且高強度複合物件的樹脂基質。在各種複合製法之間,該熱熔預浸物方法為較佳方法,因為其可提供一致的性質且容易供複合材料製造者使用,尤其容易用於運動物品、航太、汽車及其它應用。
文中表示的“熱熔”預漬物係指經不含溶劑之未固化或微固化環氧調配物浸漬的纖維。典型的製造程序包含(1)膜製造、及(2)膜浸漬。
許多不同類型之高官能性環氧樹脂業經用以使該等固化環氧熱固性材料獲得高玻璃轉化溫度(Tg)以縮短脫模時間。然而,這些高官能性環氧樹脂的使用亦可導致合適黏度的損失、及該樹脂摻合物之熔化黏度的增加,其會導致該等經浸漬纖維之不足的樹脂濕潤化、在複合物件
內之層狀結構間的孔隙形成、及熔態環氧樹脂摻合物之製造的困難。
因此,需要一可提供(1)作為一半永久性黏著劑之合適黏性、(2)高玻璃轉化溫度(Tg)、及(3)一用於熱熔預浸物加工之合適黏度輪廓之用於製備熱熔預浸物的可固化組成物。
在本發明之一概括性實施例中,係揭示一含由以下或本質上由以下所組成的可固化組成物:a)一環氧混合物,其含i)含具有以第一環氧組份之總重計,小於10重量%之2-官能性單體含量且具有一在170至200之範圍內的環氧當量之環氧酚型酚醛清漆寡聚物的第一環氧組份、及ii)含一具有至少2之平均官能度之單體之環氧樹脂的第二環氧組份;以及b)一硬化劑。
圖1為溫度對熱流之標繪圖。
在各實施例中,該可固化組成物包含一環氧混合物;及b)一硬化劑。
該組成物含有一環氧混合物。該混合物包含i)一含具有以該第一環氧組份之總重計,小於10重量% 2-官能
性單體含量且具有一在170至200之範圍內之環氧當量的環氧酚型酚醛清漆寡聚物、及ii)一含一具有至少2之平均官能度之單體的環氧樹脂之第二環氧組份。
該第一環氧組份包含環氧酚型酚醛清漆寡聚物。在一實施例中,該環氧酚型酚醛清漆為酚型酚醛清漆(EPN)且在又另一實施例中,係為雙酚-F環氧酚醛清漆。
環氧酚型酚醛清漆之一般結構係以下式I表示
在一實施例中,該第一環氧組份包含具有小於10重量%2-官能性單體(2-官能性,在上述式I內,n=0)、且在另一實施例中,具有小於5重量%2-官能性單體之環氧酚醛清漆寡聚物。
一般而言,該第一環氧組份每分子(在上述式I內,n=2.0至3.0)平均具有在自4.0至5.0個之範圍內的環氧基、及具有一在150至220之範圍內的環氧當量,且在另一實施例中,每分子(在上述式I內,n=2.2至2.8)具有在4.2至4.8個之範圍內的環氧基、及具有一在170至200之範圍內的環氧當量。
以該環氧混合物之總重計,該第一環氧組份通常係以在自3至96重量%之範圍內的數量存在於該環氧混合
物內,且在其它實施例中,係以在自10至90重量%之範圍內的數量存在。低於3重量%之濃度會導致低Tg,其不足以減少該脫模時間,而高於96重量%之濃度會導致複合製造之黏性效能不足。
在各實施例中,該環氧混合物進一步包含一含一
具有至少2之平均官能度之單體的環氧樹脂之第二環氧組份。在一實施例中,該第二環氧組份可具有2.8之平均官能度。
該第二環氧組份可不同且可包括能單獨使用或
併用其二或更多者之習知且在市面上有售的環氧樹脂。在選擇用於文中所揭示的組成物之環氧樹脂時,不應只考慮最終產物的性質,而是必需考慮黏度及會影響該樹脂組成物之加工的其它性質。
尤其適合的環氧樹脂包括,但不限於:以多官能
性醇、酚、環脂肪族羧酸、芳香族胺、或胺基酚與環氧氯丙烷之反應產物為基礎的環氧樹脂。一些非限制性實施例包括,例如雙酚A二縮水甘油醚、雙酚F二縮水甘油醚、間苯雙酚二縮水甘油醚、及對-胺基酚之三縮水甘油醚。合適的環氧樹脂之其它實例包括,但不限於:環氧氯丙烷分別與鄰-甲酚、及酚型酚醛清漆的反應產物。其它的環氧樹脂包括二乙烯基苯或二乙烯基萘的環氧化物。亦可使用2或更多種環氧樹脂的混合物。
可用於本發明以製備該等可固化組成物之環氧樹脂可選自以下市售產物:例如得自The Dow Chemical
Company之D.E.R®.331、D.E.R.® 332、D.E.R®.383、D.E.R.® 334、D.E.R®.580、D.E.N®.431、D.E.N.® 438、D.E.R®.736、或D.E.R®.732環氧樹脂、或得自Synasia之Syna 21環脂肪族環氧樹脂。作為本發明之一闡明,該額外的環氧樹脂可以是液體環氧樹脂(諸如D.E.R.383、環氧酚醛清漆D.E.N.438、環脂肪族環氧化物Syna 21)、及二乙烯基鏈芳烴二氧化物、二乙烯基苯二氧化物(DVBDO)及其等之混合物的混合物。
以該環氧混合物的總重計,該第二環氧組份通常
係以在自0至97重量%之範圍內的數量存在於該環氧混合物內,且以在各其它實施例中之該環氧混合物的總重計,其存在量範圍為自10至90重量%。
可添加硬化劑至該混合物以形成一可固化組成物。
可使用任何合適的環氧硬化劑。可使用的環氧硬化劑之實例包括,但不限於:脂肪族胺、經改質脂肪族胺、環脂肪族胺、經改質環脂肪族胺、醯胺基胺、二氰基聚醯胺、聚醯胺、第三胺、芳香族胺、酸酐、硫醇、環狀甲脒、異氰酸酯氰酸酯等。合適的硬化劑包括雙氰胺(DICY)、雙(4-胺基環己基)甲烷(AMICURE® PACM)、二乙三胺(DETA)、三乙四胺(TETA)、胺基乙基哌(AEP)、異佛酮二胺(IPDA)、1,2-二胺基環己烷(DACH)、4,4’二胺基二苯基甲烷(MDA)、二胺基二苯基碸(DDS)、間-苯二胺(MPD)、二乙基甲苯二
胺(DETDA)、間-苯二甲胺(MXDA)、雙(胺基乙基環己烷)、雙氰胺、酞酸酐(PA)、四氫酞酸酐(THPA)、甲基四氫酞酸酐(MTHPA)、甲基六氫酞酸酐(MHHPA)、六氫酞酸酐(HHPA)、耐地酸甲基酸酐(NMA)、二苯基酮四羧酸二酸酐(BTDA)、四氯酞酸酐(TCPA)等、及其等的混合物。
酚系硬化劑亦可用於該熱固性組成物。合適的酚
系硬化劑包括Rezicure ® 3XXX產物種類、Meiwa’s MEH-XXXX產物種類或為熟悉本項技藝者已知的其它酚系硬化劑。
一般而言,該硬化劑係以每百份環氧樹脂在自1
至35份(phr)範圍內的數量存在於該可固化組成物內,而在另一實施例中,係以在自3至30phr範圍內的數量存在。小於1phr之硬化劑含量會得到不能提供所欲複合性能之未經充份固化的熱固性塑膠。
在各實施例中,該可固化組成物可擇地進一步包含一或多種溶劑。可使用之溶劑實例包括,但不限於:甲基乙基酮(MEK)、二甲基甲醯胺(DMF)、乙醇(EtOH)、丙二醇甲醚(PM)、丙二醇甲醚乙酸酯(DOWANOLTM PMA)及其等之混合物。
在各其它實施例中,並未使用溶劑。
可擇地,可添加催化劑至該可固化組成物以促進
該調配物之固化。該催化劑之類型取決於所欲目的用途。
可使用的催化劑實例包括,但不限於:苯基二甲
基脲(Omicure U405,CVC Thermoset Specialty)、4,4’-亞甲雙苯基二甲基脲(Omicure U415,CVC Thermoset Specialty)、環脂肪族二甲基脲(Omicure U35,CVC Thermoset Specialty)、3,4-二氯苯基二甲基脲(Diuron,CVC Thermoset Specialty)、及4氯苯基二甲基脲(Monuron,CVC Thermoset Specialty)。其它催化劑實例包括,但不限於至少一種第三胺,其包括經酚系取代的第三胺;至少一硼酸-胺複合物;至少一種三氟化硼-胺複合物;至少一咪唑或經取代之咪唑;至少一金屬乙醯基丙酮酸鹽;至少一過渡金屬(例如鈷、鎳、鋅、鉻、鐵、銅)鹽;至少一第四銨或鏻鹽;至少一膦或經取代之膦化合物;或其等之組合。
一般而言,該催化劑係以每百份環氧樹脂之在自
0.5至10份(phr)之範圍內的數量存在於該可固化組成物,且在另一實施例中,係以在自1至8phr之範圍內的數量存在。
該可固化組成物亦可含有一靭化劑。在一實施例中,該靭化劑為一核芯殼橡膠。
核芯殼橡膠為一含以下組份的聚合物:藉一作為主要成份之含彈性或橡膠聚合物之聚合物而形成的橡膠顆粒核芯,且可擇地具有一使用具有2或更多個雙鍵之單體所形成且塗覆在該核芯層上的中間層;及一藉接枝聚合在該核芯上之一聚合物而形成的殼層。該殼層可藉使一單體接
枝至該核芯而部份或完全覆蓋該橡膠顆粒核芯的表面。
一般而言,該橡膠顆粒核芯係自丙烯酸或甲基丙
烯酸酯單體或二烯(共軛二烯)單體或乙烯基單體或矽氧烷型單體及其等之組成所構成。
該殼層使該調配物得到相容性且具有促進該等
芯殼橡膠顆粒在本發明之樹脂或硬化劑內混合且分散的有限可膨脹性。在一實施例中,該殼並不具有有助於本發明該環氧樹脂或硬化劑之反應性基團。又在另一實施例中,該殼可能具有有助於該環氧樹脂或硬化劑之反應性基團,例如環氧或羧酸基。
該核芯殼橡膠可選自市售產物,例如各得自The
Dow Chemical Company之Paraloid EXL 2650A、EXL 2655、EXL2691 A、或得自Kaneka Corporation之Kane Ace® MX系列,諸如MX 120、MX 125、MX 130、MX 136、MX 551、或得自Mitsubishi Rayon之METABLEN SX-006。
聚合物添加物亦可存在於該可固化組成物內。合適的聚合物添加物實例包括,但不限於:聚乙烯基二甲醇縮甲醛(諸如得自Chisso Corp之Vinylec K及Vinylec L)、聚甲基丙烯酸甲酯(諸如得自Dianal America Inc之Dianal BR-73及BR-80)、聚醚碸(諸如得自Sumitomo Chemical Co.Ltd之Sumika Excel 3600P及5003P)、聚碸(諸如得自BASF之Ultrason S2010)、聚醯亞胺(諸如得自Sabic Innovative Plastics之Extem Resin VH1003)、及聚醚醯亞胺(諸如得自
Innovative Plastics)之Ultem 1010及ULTEM 1040)。
本發明該等可固化或可熱固性組成物可擇地含
有一或多種可用於其等之目的用途的其它添加物。例如可用於本發明組成物之該等可視需要選用的添加物可包括,但不限於:反應性或非反應性稀釋劑、安定劑、表面活化劑、流量改質劑、顏料或染劑、霧面劑、除氣劑、阻燃劑(例如無機阻燃劑、鹵化阻燃劑、及非鹵化阻燃劑,諸如含磷材料)、固化起始劑、固化抑制劑、濕潤劑、著色劑或顏料、熱塑性橡膠、加工佐劑、UV阻隔化合物、螢光化合物、UV安定劑、惰性填料、纖維狀補強劑、抗氧化劑、抗衝擊改質劑(其包括熱塑性顆料)、及其等之混合物。上述列示有意具代表性且不具限制性。用於本發明之調配物的較佳添加物可藉熟悉本發明技藝者而最佳化。
可藉熟悉本項技藝者已知的任何合適方法(諸如
蒸餾或溶劑萃取)而製備該可固化組成物。然後該可固化組成物可以與一硬化劑、另一環氧樹脂、及上述之任何其它組份混合以形成呈任何組合或亞組合的該可固化組成物。
該可固化組成物可用以製備熱熔預浸物,其中纖維係經不含溶劑的未固化或微固化環氧調配物浸漬。典型的製造程序包括(1)膜製造及(2)膜浸漬。在膜製造時,係於高溫(例如自50-150℃)下,使該環氧樹脂(群)與添加物(群)、催化劑(群)、硬化劑(群)混合並裝配成特定膜形式。該等調配物主要呈預聚合物態且具有一有限的固化程度(即便有),
且該等膜係藉紙/聚乙烯脫膜片而保護。在膜浸漬時,該織造或單向織物係在加熱下經該等環氧膜浸漬以形成預浸物。
在進行固化前,該等預浸物有點類似彼等經保護薄片覆蓋的黏性紙。一旦該等保護薄片經移除,該等預浸物之多層或層組係經堆疊入一模具內、或一心型上以形成該等複合物件之所欲形狀。然後在真空及/或壓力下,使該預浸物材料進行熱固化方法以固結該等層合物。較高的固化溫度通常導致快速固化反應歷程,但是可需要額外的模具冷卻時間,其會使該等已固結的層合物恢復用於使其等自該等熱模具移除的充份勁度。
在各實施例中,自該等可固化組成物之製成的預
浸物具有一等於或大於當該預浸物固化的時間低於2小時之最終固化溫度的玻璃轉化溫度(Tg)。在各實施例中,該等固化條件包括一在自80至200℃之範圍內的固化溫度。在各實施例中,該Tg係在自115至215℃之範圍內。
黏性為允許半永久性黏著劑在直接接觸時,黏著
另一表面的該半永久性黏著劑之一性質。就黏性而言,在25℃、1弧度/秒(rad/s)下、該所欲複合剪力模數(G*)的範圍係自約0.3至0.03兆帕(MPa)。當G*大於0.3兆帕時,該未經固化的環氧樹脂組成物會缺乏足以附著於該黏著劑的濕潤力。當G*小於0.03兆帕時,該未經固化的環氧樹脂組成物會缺乏足以使該預浸物維持在該垂直的黏著劑上之剪力抗性。
在一實施例中,預浸物的製法如下:以輥機供應
經有點黏性之不含溶劑的環氧調配物預先浸漬之碳纖維織物薄片。一經聚矽氧處理的紙及/或聚乙烯保護片係夾在該輥機上之各該層之間以防止在貯存期間,該預浸物黏著於本身,且在該製造期間,促進處理。
該熱熔(不含溶劑)預浸物製法的可接受浸漬溫
度範圍為自約60至約80℃,其係比在第1圖內所示的放熱固化反應的開始溫度低至少20℃。已認為此浸漬溫度在該複合製法進行前可減少非所欲環氧膠化現象。在上述溫度範圍下,所建議的加工黏度位準為自約10至約3帕*秒(Pa*s),因此,即便在可視需要選用的固體及黏性纖維之存在下,該等纖維仍可經具有良好纖維濕潤性但不會發生樹脂滴落現象之該環氧樹脂組成物浸漬。
可使用該等熱熔預浸物製成的該等複合物件之用途的實例包括,但是不限於:運動物品、飛行器、及汽車。
使用以下原料:實驗性EPN-(E-EPN),每一分子平均具有在自4.0至5.0個的範圍內之環氧基的高官能性環氧酚系酚醛清漆(在上述式I內,n=2.0至3.0),且以每一分子(2-官能性)2.0個環氧基為基準計,其數量為小於5重量%。
D.E.N.TM 438-("DEN 438"),得自The Dow Chemical Company之每一分子平均具有3.6個環氧基的EPN。
D.E.N.TM 431-("DEN 431"),得自The Dow Chemical
Company之每一分子平均具有2.8個環氧基的EPN。
D.E.R.TM 662-("DER 662"),得自The Dow Chemical Company之固體環氧樹脂。
D.E.R.TM 383-("DER 383"),得自The Dow Chemical Company之雙酚A液體環氧樹脂。
Epon SU-8-("eBPAN"),得自The Momentive之環氧雙酚A酚醛清漆,其係為一種多官能性環氧樹脂。
CG-1200-("DICY"),得自The Air Product and Chemical Inc之雙氰胺,其係為一種潛固化劑。
U415 M-("UREA"),得自The Emerald Performance,CVC Thermoset Specialities之2,4-甲苯雙二甲基脲,其係為一種催化劑。
在實例1及2內,係將DEN 431加熱至70℃,且接
著添加DICY及UREA,並於2,300rpm下藉SpeedMixerTM(DAC150.1 FVZ-K,FlackTeK Inc.)而一起混合,費時2分鐘,並至少操作3或更多回以獲得均質摻混物(Blend-1)。將該等E-EPN、DER 383及DER 662加熱至120℃並於2,300rpm下,藉上述SpeedMixerTM而混合,費時2分鐘,並至少操作3或更多回以獲得均質摻混物(Blend-2)。然後將Blend-1倒入Blend-2內,且於800rpm下,使用上述SpeedMixerTM一起混合這兩種摻混物,費時30秒,然後於1,600rpm下混合1分鐘以獲得一充份混合的調配物。將該全部調配物倒入一預熱模(約120℃)內以鑄造用於進一步固化之3毫米厚飾板。用於實例1及2之該等組份的數量係分別示於表1及表2內。
在比較例A及B內,將DEN 431加熱至70℃,然
後添加DICY及UREA,且於2,300rpm下,使用上述SpeedMixerTM混合該等組份,費時2分鐘,且操作至少3或更多回以獲得該均質摻混物(Blend-1)。將DER 383及DER 662與環氧雙酚A酚醛清漆(EBPAN)(EBPAN係慬用於比較例B內)加熱至120℃並於2,300rpm下使用上述SpeedMixerTM一起混合,費時2分鐘,並操作至少3或更多回以獲得該均質摻混物(Blend-2)。將Blend-1倒入該Blend-2內,且接著於800rpm下,藉上述SpeedMixerTM而混合,費時30秒,然後於1,600rpm下,費時1分鐘以獲得一充份混合的調配物。將該全部調配物倒入該預熱模具(約120℃)內以鑄造該等用於進一步固化的3毫米厚飾板。該等組份之使用量係示於表1內。
在比較例C內,將DEN 431加熱至70℃,且接著
添加DICY及UREA,並於2,300rpm下使用上述SpeedMixerTM混合,費時2分鐘,且操作至少3或更多回以獲得該均質摻混物(Blend-1)。將DEN 438加熱至120℃且於800rpm下,使用上述SpeedMixerTM(DAC150.1 FVZ-K,FlackTeK Inc.)混合該DEN 438及Blend-1,費時30秒,然後於1,600rpm下,混合1分鐘以獲得一充份混合的調配物。將該全部調配物倒入該預熱模具(約120℃)內以鑄造該等用於進一步固化的3毫米厚飾板。
就比較例A及B與實例1而言,所使用該固化程序
為在一空氣循環烘箱內進行2小時之140℃等溫固化。
就實例2及比較例C而言,所使用該固化程序為在一空氣循環烘箱內進行2小時之160℃等溫固化。
藉該GPC使用一配備TDA 302偵檢器陣列(其包括一折射率偵檢器、一黏度偵檢器、及一RALLS(右角雷射光散射偵檢器))之Viscotek GP Max而測定該官能度。使用2 PL凝膠3微米混合型E,300×7.5毫米分析柱進行分離。使用經250ppm BHT抑制的四氫呋喃(THF)作為該流動相。使該試樣溶解在流動相(1%)內且過濾。使用Viscotek 115K聚苯乙烯標準物校準該儀器。
使用差示掃描式量熱器(TA Instruments Q2000)以進行熱分析。該放熱固化反應的開始溫度(Tonset)係藉在氮氣氛下進行-2℃/分鐘的溫度掃描(流率=80毫升/分鐘)。
藉使用一先進的流變膨脹系統(ARES G2,TA Instruments)而進行動態機械熱分析(DMTA)。該測試試樣之標稱尺寸為12.7毫米×3.0毫米×40.0毫米。該測試溫度的範圍係自25至250℃且其急升速率為3℃/分鐘。該固定測試頻率為1Hz且該應變振幅為0.1%。該正切δ的尖峰據稱為該經固化的Tg。
使用旋轉流變器(AR2000 ex.TA Instruments)以進行流變研究。藉使用一不銹鋼平行板(50毫米直徑,間隙=800微米)而進行該等研究。在固定急升速率、振盪頻率及振盪應變(分別為2℃/分鐘、1Hz、及0.5%)下,監測該經測試調配物之黏度-溫度輪廓。於25℃下進行頻率掃描(0.1至100Hz)以監測該黏性測定法之複合剪力模數。
藉分別遵照ASTM D5045及ASTM D790之測試指引而測定破裂靭性(KIC)及彎曲模數。
Claims (10)
- 一種可固化組成物,其含:a)一環氧混合物,其含i)一含具有以第一環氧之總重計,小於10重量%之2-官能性單體裝置、且具有在170至200範圍內之環氧當量的環氧酚型酚醛清漆寡聚物之第一環氧組份ii)一含具有平均至少2之官能度之單體的環氧樹脂之第二環氧組份其中以該環氧混合物之總重計,該第一環氧係以在自10至90重量%之範圍內的數量存在,而該第二環氧係以在自0至97重量%之範圍內的數量存在;及b)一硬化劑。
- 如請求項1之可固化組成物,其中以該第一環氧組份之總重計,該第一環氧組份包含小於5重量%之2-官能性單體。
- 如請求項1或2之可固化組成物,其中該第一環氧組份之每一分子具有自4.0至5.0個環氧基的平均官能度。
- 如上述請求項中任一項之可固化組成物,其中該第一環氧組份之每一分子具有自4.2至4.8個環氧基的平均官能度。
- 如上述請求項中任一項之可固化組成物,其中以該第一環氧組份之總重計,該第一環氧組份包含小於5重量%之2-官能基單體、在自15至20重量%範圍內之3-官能性 單體、在自10至20重量%範圍內之4-官能性單體、在自10至20重量%範圍內之5-官能性單體、及在自50至60重量%範圍內之6-官能性單體。
- 如上述請求項中任一項之可固化組成物,其中該硬化劑係選自以下所組成之群組:脂肪族胺、經改質脂肪族胺、環脂肪族胺、經改質環脂肪族胺、醯胺基胺、二氰基聚醯胺、聚醯胺、第三胺、芳香族胺、酸酐、硫醇、環狀甲脒、異氰酸酯氰酸酯、酚系硬化劑及其等之組合。
- 如上述請求項中任一項之可固化組成物,其中該可固化組成物並未含有溶劑。
- 如上述請求項中任一項之可固化組成物,其進一步包含一催化劑。
- 如上述請求項中任一項之可固化組成物,其於在25℃及1弧度/秒、以及等於或大於當該預浸物係經固化,費時小於2小時之最終固化溫度的條件下,具有一在自0.3至0.03兆帕之範圍內的複合剪力模數。
- 一種熱熔預浸物,其係自如上述請求項中任一項之可固化組成物製成。
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| WO2017150529A1 (ja) * | 2016-02-29 | 2017-09-08 | 三菱ケミカル株式会社 | 繊維強化樹脂材料積層体及びその製造方法 |
| US20190002686A1 (en) | 2017-06-29 | 2019-01-03 | Dow Global Technologies Llc | Epoxy-fiber reinforced composites, method to form the composites and epoxy resin composition used therefor |
| CN112513131B (zh) * | 2018-07-24 | 2024-02-06 | 日本化药株式会社 | 环氧树脂及其组合物、树脂片、预浸料及复合材料 |
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| US5066735A (en) * | 1987-11-16 | 1991-11-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
| KR100563509B1 (ko) * | 1998-09-25 | 2006-03-23 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 에폭시 수지 조성물 및 이 에폭시 수지 조성물을 사용한 적층 필름 및 반도체 장치 |
| US20030082385A1 (en) | 2001-07-13 | 2003-05-01 | Toray Composites (America), Inc. | Quick cure carbon fiber reinforced epoxy resin |
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