TW201526102A - A baffle assembly and an apparatus for treating a substrate with the baffle - Google Patents

Abstract

The present invention provides a substrate processing apparatus capable of using a baffle assembly to regulate the most reasonable injection uniformity of plasma or gas in a device. The substrate processing apparatus comprises a processing chamber, a substrate supporting unit, a gas supply unit, a plasma source and a baffle assembly. The baffle assembly includes a first injection board fixed in the processing chamber, and a second injection board jointed to the first injection board in the vertical direction to thereby take its center as an axis for rotation. The baffle assembly makes use of a rotation angle of the second injection board to regulate the injection amount of the plasma or gas based on an area of the substrate installed in the processing chamber.

Description

Baffle assembly and apparatus for processing a substrate having the same

The present invention relates to a substrate processing apparatus, and more particularly to an apparatus for processing a substrate using plasma.

In order to manufacture a semiconductor element, it is required to perform various processes such as vapor deposition, photographing, etching, ashing, washing, and polishing on a semiconductor substrate such as a wafer. Among them, a plurality of processes such as vapor deposition, etching, and ashing processes are performed on a semiconductor substrate such as a wafer by plasma or gas in a chamber.

Fig. 1 is a cross-sectional view showing a substrate processing apparatus using ordinary plasma.

Referring to Fig. 1, a conventional substrate processing apparatus converts a gas injected into a process chamber 12 through a gas supply unit 11 into a plasma by a plasma source 13. The plasma generated by the plasma source is supplied to the upper portion of the substrate 15 through the baffle 14 in the process chamber 12.

In order to increase the uniformity of the plasma in the substrate processing apparatus, a plurality of holes are formed in the baffle 14. However, due to factors such as the configuration in the process chamber 16 of the substrate processing apparatus and the flow of the plasma, there is a problem that the uniformity of the plasma processing rate of the substrate 15 is lowered.

The baffle 14 can control the uniformity of the process according to changes in the position and number of the injection holes and the like. However, in order to find the most reasonable condition of one equipment, in general, a plurality of baffles having different positions and numbers of injection holes are alternately used, and accordingly, time and cost are correspondingly increased.

Moreover, when a plurality of process gases are used in the same equipment or the same plasma generating apparatus, the plasma profile changes. In this case, when the ordinary baffle is used, the process uniformity is affected.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Patent Publication No. 2012-0074877.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus capable of adjusting the ejection uniformity of the most rational plasma or gas in one apparatus by using one shutter assembly.

Moreover, it is another object of the present invention to provide a baffle assembly that utilizes a baffle assembly to adjust the most uniform plasma or gas jet uniformity of a plurality of substrate processing equipment.

The subject matter to be solved by the present invention is not limited thereto, and other problems not mentioned will be clearly understood by the following description.

The invention provides a substrate processing apparatus. According to an embodiment, the substrate processing apparatus includes: a processing chamber; a substrate supporting unit configured to support the substrate in the processing chamber; the shutter assembly, a first ejecting plate and a second ejecting plate and a driving unit, wherein the first ejecting plate and the second ejecting plate are located above an upper portion of the substrate supporting unit in the processing chamber, and the driving unit is configured to a second injection plate that rotates about a center thereof; and a gas supply unit that supplies a gas to an upper portion of the first injection plate and the second injection plate; and the baffle assembly is configured to be capable of passing the second injection plate The rotation angle is set to adjust the amount of plasma or gas to be injected in the area of the substrate.

Further, a first fixing hole penetrating in the vertical direction is formed in a central portion of the first ejection plate, and a second fixing hole penetrating in the vertical direction is formed in an edge region of the first ejection plate.

Further, the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate, and a second variable hole disposed in a central region of the second injection plate And a third variable hole disposed in an edge region of the second spray plate; wherein a central region of the second spray plate is opposite to a central region of the first spray plate; and an edge of the second spray plate The region is opposed to the edge region of the first spray plate; and when the second spray plate is at the first position, the first variable hole is opposed to the first fixing hole and the second fixing hole When the second injection plate is located at a second position different from the first position, the second variable hole is disposed to face the first fixing hole; and the second injection plate is located in the foregoing When the first position and the third position are different from each other, the third variable hole is provided to face the second fixing hole; the first position, the second position, and the third position are The front can be changed by the rotation of the second injection plate The position of the second spray plate will be described.

Further, a part of the first fixing hole and a part of the second fixing hole are formed in a row in a radial direction of the first injection plate, and a part of the first variable hole, a part of the second variable hole, and a part of the third The variable holes are provided in a row in the radial direction of the second injection plate.

According to another embodiment, the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate, and a second variable hole disposed in the second injection hole a central region of the second spray plate; the central region of the second spray plate is opposite to a central region of the first spray plate; and an edge region of the second spray plate is opposite to an edge region of the first spray plate; When the first injection plate is at the first position, the first variable hole is provided to face the first fixing hole and the second fixing hole; and the second injection plate is located different from the first position In the second position, the second variable hole is provided to face the first fixing hole; the first position and the second position are changeable by the rotation of the second injection plate The position of the second spray plate.

Further, a part of the first fixing hole and a part of the second fixing hole are arranged in a row in a radial direction of the first injection plate, and a part of the first variable hole and a part of the second variable hole are in the second The radial directions of the spray plates are each set in a row.

According to still another embodiment, the second injection plate is formed with a first variable hole that is disposed in a central region of the second injection plate and An edge region; and a third variable hole disposed in an edge region of the second injection plate; wherein a central region of the second injection plate faces a central region of the first injection plate; and the second injection plate The edge region faces the edge region of the first spray plate; and when the first spray plate is at the first position, the first variable hole faces the first fixing hole and the second fixing hole According to another aspect, when the second injection plate is located at a third position different from the first position, the third variable hole is provided to face the second fixing hole; the first position and the first The 3 position can be changed by the rotation of the second injection plate.

According to still another embodiment, a third fixing hole is further formed in the first injection plate, and the third fixing hole is disposed in a middle portion of a region between a central portion of the first injection plate and an edge region of the first injection plate. a fourth variable hole further formed in the second injection plate, wherein the fourth variable hole is disposed in a middle region which is a region between a central region of the second injection plate and an edge region of the second injection plate; The fourth variable hole is provided to face the third fixing hole when the second injection plate is positioned at the second position or the third position.

Further, a part of the first fixing hole, a part of the second fixing hole, and a part of the third fixing hole are formed in a row in a radial direction of the first injection plate, and a part of the first variable hole is in the second injection. The radial direction of the plates is set in a row, and a part of the fourth variable holes and a part of the second variable holes or a part of the third variable holes are arranged in a row in the radial direction of the second injection plate.

According to still another embodiment, the second injection plate has a configuration a first variable hole and a fifth variable hole that are disposed in a central region and an edge region of the second spray plate; a central region of the second spray plate is opposed to a central region of the first spray plate; and the second portion An edge region of the spray plate is opposite to an edge region of the first spray plate; and when the second spray plate is at the first position, the first variable hole is opposite to the first fixed hole and the second fixed hole In the second position, when the second injection plate is located at a second position different from the first position, the fifth variable hole is provided to face the first fixing hole and the second fixing hole. The first position and the second position are positions of the second injection plate that can be changed by the rotation of the second injection plate; and the first variable hole and the fifth variable hole are the first The fixing hole and the second fixing hole are provided in the same size or smaller than the size of the first fixing hole and the second fixing hole, and the fifth variable hole is disposed in a central region of the second injection plate. The fifth variable hole system disposed in the edge region of the second injection plate is formed in a size This different.

Further, a part of the first fixing hole and a part of the second fixing hole are arranged in a row in a radial direction of the first injection plate, and a part of the first variable hole and a part of the fifth variable hole are in the second The radial directions of the spray plates are each set in a row.

Furthermore, the present invention provides a baffle assembly. According to one embodiment, the baffle assembly has a first spray plate and a second spray plate that are stacked one on another, and a drive unit for rotating the second spray plate about its center, and the baffle assembly is The manner in which the amount of plasma or gas is injected is adjusted in accordance with the area of the substrate by the rotation angle of the second ejection plate. Assume.

Further, a first fixing hole penetrating in the vertical direction is formed in a central portion of the first ejection plate, and a second fixing hole penetrating in the vertical direction is formed in an edge region of the first ejection plate.

Further, the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate, and a second variable hole disposed in a central region of the second injection plate And a third variable hole disposed in an edge region of the second spray plate; wherein a central region of the second spray plate is opposite to a central region of the first spray plate; and an edge of the second spray plate The region is opposed to the edge region of the first spray plate; and when the second spray plate is at the first position, the first variable hole is opposed to the first fixing hole and the second fixing hole When the second injection plate is located at a second position different from the first position, the second variable hole is disposed to face the first fixing hole; and the second injection plate is located in the foregoing When the first position and the third position are different from each other, the third variable hole is provided to face the second fixing hole; the first position, the second position, and the third position are The position of the second injection plate that can be changed by the rotation of the second injection plate.

According to another embodiment, the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate, and a second variable hole disposed in the second injection hole a central region of the second injection plate; the central region of the second injection plate is opposite to the central region of the first injection plate; and the edge region of the second injection plate is When the first injection plate is located at the first position, the first variable hole is disposed to face the first fixing hole and the second fixing hole; When the second injection plate is located at a second position different from the first position, the second variable hole is provided to face the first fixing hole; the first position and the second position are The position of the second injection plate that is changed by the rotation of the second injection plate.

According to still another aspect of the invention, the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate, and a third variable hole disposed in the second injection hole An edge region of the plate; the central region of the second spray plate is opposite to a central region of the first spray plate; and an edge region of the second spray plate is opposite to an edge region of the first spray plate; When the first injection plate is at the first position, the first variable hole is provided to face the first fixing hole and the second fixing hole; and the second injection plate is located different from the first position In the third position, the third variable hole is provided to face the second fixing hole; the first position and the third position are changeable by the rotation of the second injection plate The position of the second spray plate.

According to still another embodiment, a third fixing hole is further formed in the first injection plate, and the third fixing hole is disposed in a region between a central region of the first injection plate and an edge region of the first injection plate; Further, the second injection plate is further formed with a fourth fixing hole which is disposed at a central portion of the second injection plate and an edge of the second injection plate The region between the regions; the fourth fixing hole is provided to face the third fixing hole when the second injection plate is located at the second position or the third position.

According to still another embodiment, the second injection plate has a first variable hole and a fifth variable hole that are disposed in a central region and an edge region of the second injection plate, and a central region of the second injection plate is a central portion of the spray plate is opposed to each other; an edge region of the second spray plate is opposite to an edge region of the first spray plate; and when the second spray plate is at the first position, the first variable hole is The first fixing hole and the second fixing hole are opposed to each other; and when the second injection plate is located at a second position different from the first position, the fifth variable hole and the first fixing hole And the second fixing hole is opposed to each other; the first position and the second position are positions of the second injection plate that can be changed by rotation of the second injection plate; and the first variable hole The first fixing hole and the second fixing hole are the same size as or smaller than the size of the first fixing hole and the second fixing hole, and are disposed in the central region of the second ejection plate. a fifth variable hole and an edge region disposed on the second spray plate The fifth variable pore system of the domain is formed to be different in size from each other.

The substrate processing apparatus and the shutter assembly according to the embodiment of the present invention can adjust the gas or plasma injection amount in accordance with the region of the gas injection plate during the substrate processing process.

Moreover, the substrate processing apparatus of the embodiment of the present invention The baffle assembly is capable of adjusting the amount of gas or plasma sprayed throughout the entire area of the gas injection plate during the substrate processing process.

1, 2‧‧‧ substrate processing equipment

10‧‧‧Substrate

11‧‧‧ body supply unit

12‧‧‧Centre chamber

13‧‧‧ Plasma source

14‧‧‧ board

15‧‧‧ board

16‧‧ ‧Processing Room

100‧‧‧Processing chamber

120‧‧‧Processing room

122‧‧‧ venting holes

123‧‧‧ Grounding wire

124‧‧‧Exhaust line

126‧‧‧ pump

140‧‧‧The plasma generation room

142‧‧‧Discharge room

144‧‧‧Diffuse room

200‧‧‧Substrate support unit

220‧‧‧support board

240‧‧‧Support shaft

300‧‧‧ gas supply unit

320‧‧‧ gas supply line

340‧‧‧ Gas Storage Department

360‧‧‧ gas 埠

400‧‧‧ Plasma source

420‧‧‧Antenna

440‧‧‧Power supply

500‧‧‧Baffle assembly

520‧‧‧1st spray plate

520a‧‧‧ upper surface

520b‧‧‧ lower surface

520c‧‧‧ side

520d‧‧‧ openings

522‧‧‧1st fixing hole

524‧‧‧2nd fixing hole

526‧‧‧3rd fixing hole

528, 548, 548a, 548b,

548c, 548d, 548e‧‧‧

540‧‧‧2nd spray plate

541‧‧‧1st variable hole

542‧‧‧2nd variable hole

543‧‧‧3rd variable hole

544‧‧‧4th variable hole

545‧‧‧5th variable hole

560‧‧‧ drive unit

562‧‧‧ drive gear

562a‧‧‧Drive board

564‧‧‧Connected components

566‧‧‧Motor

S11, s21‧‧‧ central area

S12, s22‧‧‧ edge area

S13, s23‧‧‧ intermediate area

Figure 1 is a cross-sectional view showing a conventional substrate processing apparatus.

Fig. 2 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention.

Fig. 3 is a perspective view showing a part of the drive unit and the second injection plate of Fig. 2;

Fig. 4 is a plan view showing the first spray plate of Fig. 2;

Fig. 5 is a plan view showing the second spray plate of Fig. 2;

Fig. 6 is a plan view showing a state in which the first fixing hole and the second fixing hole of Fig. 4 are opened and closed by the rotation of the second ejection plate of Fig. 5;

Fig. 7 is a plan view showing a state in which the first fixing hole and the second fixing hole of Fig. 4 are opened and closed by the rotation of the second ejection plate of Fig. 5;

Fig. 8 is a plan view showing a state in which the first fixing hole and the second fixing hole of Fig. 4 are opened and closed by the rotation of the second ejection plate of Fig. 5;

Fig. 9 is a plan view showing another embodiment of the second injection plate of Fig. 2;

Fig. 10 is a plan view showing a state in which the first fixing hole and the second fixing hole of Fig. 4 are opened and closed by the rotation of the second ejection plate of Fig. 9;

Fig. 11 is a plan view showing a state in which the first fixing hole and the second fixing hole of Fig. 4 are opened and closed by the rotation of the second injection plate of Fig. 9;

Figure 12 is a plan view showing still another embodiment of the second spray plate of Figure 2; Figure.

Fig. 13 is a plan view showing a state in which the first fixing hole and the second fixing hole of Fig. 4 are opened and closed by the rotation of the second ejection plate of Fig. 12;

Fig. 14 is a plan view showing a state in which the first fixing hole and the second fixing hole of Fig. 4 are opened and closed by the rotation of the second ejection plate of Fig. 12;

Fig. 15 is a plan view showing still another embodiment of the second spray plate of Fig. 2;

Fig. 16 is a plan view showing an embodiment in which the injection rates of the first fixing holes and the second fixing holes of Fig. 4 are adjusted by the rotation of the second injection plate of Fig. 15;

Fig. 17 is a plan view showing an aspect in which the injection rates of the first fixing holes and the second fixing holes of Fig. 4 are adjusted by the rotation of the second injection plate of Fig. 15;

Fig. 18 is a plan view showing the first spray plate of Fig. 2 further including a third fixing hole.

Fig. 19 is a plan view showing still another embodiment of the second spray plate of Fig. 2;

FIG. 20 is a plan view showing a state in which the first to third fixing holes of FIG. 18 are opened and closed by the rotation of the second injection plate of FIG. 19 .

Fig. 21 is a plan view showing a state in which the first to third fixing holes of Fig. 18 are opened and closed by the rotation of the second injection plate of Fig. 19 .

Fig. 22 is a plan view showing a state in which the first to third fixing holes of Fig. 18 are opened and closed by the rotation of the second injection plate of Fig. 19;

Fig. 23 is a perspective view showing a part of the drive unit and the second injection plate of Fig. 2 in still another embodiment.

Figure 24 is a view showing a baffle plate in which a second spray plate is provided inside the first spray plate. A perspective view of a part of the component that has been cut.

Figure 25 is a cross-sectional view showing the substrate processing apparatus in which the second ejection plate is coupled to the lower end of the first ejection plate.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified into various forms, and the scope of the present invention is not limited to the following embodiments. This embodiment is intended to provide a person with an average knowledge in the industry in order to fully explain the present invention. Therefore, the shapes of the elements in the drawings are exaggerated to emphasize a more explicit description.

In an embodiment of the invention, the substrate 10 is a semiconductor wafer. However, the present invention is not limited thereto, and the substrate 10 may be another type of substrate such as a glass substrate.

Further, in the embodiment of the present invention, the substrate processing apparatus is a device that performs processes such as ashing, vapor deposition, or etching using plasma or gas.

Hereinafter, a substrate processing apparatus 1 according to an embodiment of the present invention will be described.

Fig. 2 is a cross-sectional view showing a substrate processing apparatus 1 according to an embodiment of the present invention. Referring to FIG. 2, the substrate processing apparatus 1 has a process chamber 100, a substrate supporting unit 200, a gas supply unit 300, a plasma source 400, and a shutter assembly 500.

The process chamber 100 has a process chamber 120 and a plasma generation chamber 140. The processing chamber 120 provides space for processing the substrate 10 with plasma. The plasma generation chamber 140 provides space for plasma to be produced by the process gas.

The interior of the processing chamber 120 has an upper open space. The processing chamber 120 has a substantially cylindrical shape. A substrate inflow port (not shown) is formed in a side wall of the processing chamber 120. The substrate 10 enters the inside of the processing chamber 120 through the substrate inflow port. The substrate inflow port (not shown) is opened and closed by an opening and closing member such as a door (not shown). A vent hole 122 is formed in a bottom surface of the processing chamber 120. The exhaust line 124 is coupled to the exhaust hole 122. A pump 126 is disposed on the exhaust line 124. Pump 126 regulates the pressure within process chamber 120 to process pressure. The residual gas and reaction by-products in the processing chamber 120 are discharged to the outside of the processing chamber 120 through the exhaust line 124.

The plasma generating chamber 140 is located outside of the processing chamber 120. As an example, the plasma generation chamber 140 is located at an upper portion of the processing chamber 120 and is coupled to the processing chamber 120. The plasma generation chamber 140 has a discharge chamber 142 and a diffusion chamber 144. The discharge chamber 142 and the diffusion chamber 144 are sequentially disposed in the vertical direction. The discharge chamber 142 has a hollow cylindrical shape. The space in the discharge chamber 142 is narrower than the space in the processing chamber 120 when viewed from the upper portion. In the discharge chamber 142, plasma is generated from the gas. The space in the diffusion chamber 144 has a portion that gradually increases as it goes closer to the lower side. The lower end of the diffusion chamber 144 is coupled to the upper end of the processing chamber 120, and a sealing member (not shown) for sealing the outside is provided therebetween.

The process chamber 100 is formed of a conductive material. The process chamber 100 is grounded through a ground line 123.

The substrate supporting unit 200 supports the substrate 10. The substrate supporting unit 200 has a support plate 220 and a support shaft 240.

The support plate 220 is located in the processing chamber 120 and has a disk shape. The support plate 220 is supported by the support shaft 240. The substrate 10 is placed on the upper surface of the support plate 220. Electrodes (not shown) are provided inside the support plate 220, and the substrate 10 is supported by the support plate 220 by electrostatic force or a mechanical clamp.

The gas supply unit 300 is provided at an upper portion of the discharge chamber 142. One or more gas supply units 300 are provided. The gas supply unit 300 has a gas supply line 320, a gas storage unit 340, and a gas port 360.

The gas supply line 320 is coupled to the gas crucible 360. The gas crucible 360 is coupled to the upper portion of the discharge chamber 142. The gas system supplied through the gas crucible 360 flows into the discharge chamber 142 and is excited into a plasma in the discharge chamber 142.

The plasma source 400 generates plasma in the discharge chamber 142 from the gas supplied from the gas supply unit 300. As an example, the plasma source 400 can also be an inductively coupled plasma source. The plasma source 400 has an antenna 420 and a power source 440.

The antenna 420 is provided outside the discharge chamber 142 and is disposed in a plurality of turns around the side of the discharge chamber 142. One end of the antenna 420 is connected to the power source 440 and the other end is grounded.

Power source 440 applies power to antenna 420. As an example, the power source 440 applies high frequency power to the antenna 420.

The shutter assembly 500 includes a first injection plate 520, a second injection plate 540, and a drive unit 560. The shutter assembly 500 is disposed at an upper end of the processing chamber 120. The gas supplied from the gas supply unit 300 or the plasma generated by the plasma source 400 is ejected to the upper portion of the substrate supporting unit 200 by the shutter assembly 500. The baffle assembly 500 can press the first spray plate 520 or the second spray plate The area of the bottom surface of 540 adjusts the amount of gas or plasma injection. The baffle assembly 500 is grounded. The baffle assembly 500 is disposed in contact with the process chamber 100 to be grounded through the process chamber 100. The second injection plate 540 and the first injection plate 520 are sequentially disposed in the vertical direction.

The drive unit 560 is provided to rotate the second injection plate 540 about its center. The driving unit 560 is disposed to penetrate the upper surface of the diffusion chamber 144 in the edge region of the upper surface of the diffusion chamber 144. The drive unit 560 has a drive gear 562, a coupling member 564, and a motor 566.

The drive gear 562 transmits the driving force transmitted by the coupling member 564 to the second injection plate 540. FIG. 3 is a perspective view showing a part of the drive gear 562 and the second injection plate 540 of the drive gear 562 of FIG. 2 . Referring to Fig. 3, drive gear 562 is provided to mesh with a gear provided on a side surface of second spray plate 540. The drive gear 562 is in the form of a circular plate, and a gear is formed on the side thereof. A coupling member 564 is coupled to the center of the upper surface of the drive gear 562.

The coupling member 564 transmits the driving force generated by the motor 566 to the driving gear 562. Referring again to FIG. 2, the coupling member 564 is provided to penetrate the upper surface of the diffusion chamber 144. A motor 566 is coupled to the upper end of the coupling member 564.

The motor 566 generates a driving force for rotating the second injection plate 540. The motor 566 is provided at an edge portion of the upper surface of the diffusion chamber 144.

According to one embodiment, the first injection plate 520 is provided to be fixed to the upper end of the processing chamber 120. The diameter of the first spray plate 520 It is larger than the inner diameter of the upper end of the processing chamber 120.

Fig. 4 is a view of the first spray plate 520 as seen from the upper portion. Referring to Fig. 4, the first spray plate 520 has a disk shape. The first injection hole 522 and the second fixing hole 524 are formed in the first injection plate 520. The first fixing hole 522 and the second fixing hole 524 are formed to penetrate the first injection plate 520 in the vertical direction. The first fixing hole 522 and the second fixing hole 524 have a substantially circular shape when viewed from the upper portion, and are formed to have the same size. A plurality of the first fixing holes 522 and the second fixing holes 524 are provided.

The first fixing hole 522 is formed in the central region s11 of the first injection plate 520. The second fixing hole 524 is formed in the edge region s12 of the first injection plate 520. A part of the first fixing holes s11 and a part of the second fixing holes s12 are arranged in a row in the radial direction of the first injection plate 520. A plurality of rows 528 in which a part of the first fixing holes s11 and a part of the second fixing holes s12 are arranged are provided in plurality. Each of the rows 528 is arranged at a predetermined angle to each other with the center of the first injection plate 520 as a reference.

Fig. 5 is a view of the second spray plate 540 as seen from the upper portion. Referring to Fig. 5, the second injection plate 540 has a disk shape and is provided with gears on its side surface. In the second injection plate 540, a first variable hole 541, a second variable hole 542, and a third variable hole 543 are formed. The first variable hole 541, the second variable hole 542, and the third variable hole 543 are formed so as to penetrate the second injection plate 540 in the vertical direction. The first variable hole 541, the second variable hole 542, and the third variable hole 543 each have a substantially circular shape when viewed from the upper portion, and are formed to have the same size. The size of the first variable hole 541, the second variable hole 542, and the third variable hole 543 is the same as the first fixing hole 522 and the second solid The fixed holes 524 have the same size or smaller than the sizes of the first fixing holes 522 and the second fixing holes 524. A plurality of the first variable hole 541, the second variable hole 542, and the third variable hole 543 are provided. A part of the first variable hole 541, a part of the second variable hole 542, and a part of the third variable hole 543 are arranged in a line in the radial direction of the second injection plate 540. A plurality of columns 548 in which a part of the first variable hole 541, a part of the second variable hole 542, and a part of the third variable hole 543 are arranged are provided. Each of the rows 548 including the first variable orifice 541, the partial second variable orifice 542, or a part of the third variable orifice 543 is formed at a predetermined angle with respect to the center of the second injection plate 540. arrangement.

The first variable hole 541 is formed in the central region s21 and the edge region s22 of the second injection plate 540.

The second variable hole 542 is formed in the central region s21 of the second injection plate 540. Each of the rows 548b in which a part of the second variable holes 542 are arranged is arranged at a predetermined angle with respect to the row 548a in which a part of the first variable holes 541 are arranged with reference to the center of the second injection plate 540. The angle between the row 548b in which a part of the second variable holes 542 are arranged and the row 548a in which a part of the first variable holes 541 are arranged is smaller than the angle between the rows 548a in which a part of the first variable holes 541 are arranged.

The third variable hole 543 is formed in the edge region s22 of the second injection plate 540. Each of the rows 548c in which a part of the third variable holes 543 are arranged is arranged at a predetermined angle with respect to the row 548a in which a part of the first variable holes 541 are arranged with reference to the center of the second injection plate 540. A column 548c in which a part of the third variable hole 543 is arranged and a part of the first variable hole are arranged The angle formed by the row 548a of 541 is smaller than the angle between the columns 548a in which a part of the first variable holes 541 are arranged.

The angle between the column 548a in which a part of the first variable holes 541 are arranged and the column 548c in which a part of the third variable holes 543 are arranged is different from the column 548a in which a part of the first variable holes 541 are arranged, and a part of the third portion is arranged. The angle between the columns 548c of the variable apertures 543. The angle between the row 548a in which a part of the first variable hole 541 is arranged and the column 548c in which a part of the third variable hole 543 is arranged, and the column 548a in which a part of the first variable hole 541 is arranged are arranged and a part is arranged third. The angle between the rows 548c of the variable holes 543 is the same in the column 548a in which a part of the first variable holes 541 are arranged, and the directions are the same but different in direction.

Referring to FIG. 2 again, the second injection plate 540 is provided such that the lower surface of the first injection plate 520 is adjacent to the upper surface of the second injection plate 540. The second spray plate 540 is rotatable about its center.

Hereinafter, a mode in which the injection holes of the first injection plate 520 are opened and closed by the rotation of the second injection plate 540 of FIG. 5 will be described.

6 to 8 are views showing a state in which the first spray plate 520 and the second spray plate 540 of Fig. 5 are sequentially joined in the vertical direction from the upper side. 6 to 8, the central region s21 of the second injection plate 540 is opposed to the central region s11 of the first injection plate 520, and the edge region s22 of the second injection plate 540 is connected to the edge region s12 of the first injection plate 520. Opposite.

FIG. 6 is a view showing a state in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the first position. Referring to Fig. 6, when the second injection plate 540 is at the first position, the first variable hole 541 It is located at a position facing the first fixing hole 522 and the second fixing hole 524. Therefore, the first fixing hole 521 and the second fixing hole 522 are opened.

FIG. 7 is a view showing a mode in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the second position. Referring to Fig. 7, the second position is a position at which the second injection plate 540 is rotated to the right by a predetermined angle with respect to the first position. When the second injection plate 540 is at the second position, the second variable hole 542 is located at a position facing the first fixing hole 522. Therefore, the first fixing hole 522 is opened, and the second fixing hole 524 is closed.

FIG. 8 is a view showing a mode in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the third position. Referring to Fig. 8, the third position is a position at which the second injection plate 540 is rotated counterclockwise by a predetermined angle with respect to the first position. When the second injection plate 540 is at the third position, the third variable hole 543 is located at a position opposed to the second fixing hole 524. Therefore, the second fixing hole 524 is opened, and the first fixing hole 522 is closed.

Fig. 9 is a view showing another embodiment of the second spray plate 540 of Fig. 2; Referring to Fig. 9, in the second injection plate 540, other configurations, functions, shapes, and the like are the same as those of the second injection plate 540 of Fig. 5 except for the arrangement of the variable holes. The first variable hole 541 and the second variable hole 542 are formed in the second injection plate 540. A plurality of the first variable hole 541 and the second variable hole 542 are provided. A part of the first variable hole 541 and a part of the second variable hole 542 are arranged in a line in the radial direction of the second injection plate 540. A plurality of columns 548 each having a part of the first variable hole 541 and a part of the second variable hole 542 are arranged. Each of the rows 548 composed of a part of the first variable hole 541 and a part of the second variable hole 542 is used to connect the second spray plate. The centers of 540 are arranged at a certain angle as a reference.

The first variable hole 541 is formed in the central region s21 and the edge region s22 of the second injection plate 540.

The second variable hole 542 is formed in the central region s21 of the second injection plate 540. Each of the rows 548b in which a part of the second variable holes 542 are arranged is arranged at a predetermined angle with respect to the row 548a in which a part of the first variable holes 541 are arranged with reference to the center of the second injection plate 540. The angle between the row 548b in which a part of the second variable holes 542 are arranged and the row 548a in which a part of the first variable holes 541 are arranged is smaller than the angle between the rows 548a in which a part of the first variable holes 541 are arranged.

Hereinafter, a mode in which the injection holes of the first injection plate 520 are opened and closed by the rotation of the second injection plate 540 of FIG. 9 will be described.

10 to 11 are views showing a state in which the first injection plate 520 and the second injection plate 540 of Fig. 9 are sequentially joined in the vertical direction from the upper side.

FIG. 10 is a view showing a mode in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the first position. Referring to Fig. 10, when the second injection plate 540 is at the first position, the first variable hole 541 is located at a position facing the first fixing hole 522 and the second fixing hole 524. Therefore, the first fixing hole 522 and the second fixing hole 524 are opened.

FIG. 11 is a view showing a state in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the second position. Referring to Fig. 11, when the second injection plate 540 is at the second position, the second variable hole 542 is located at a position facing the first fixing hole 522. Therefore, the first fixing hole 522 Open, the second fixing hole 524 is closed.

Fig. 12 is a view showing still another embodiment of the second spray plate 540 of Fig. 2; Referring to Fig. 12, in the second injection plate 540, other structures, functions, shapes, and the like are the same as those of the second injection plate 540 of Fig. 5 except for the arrangement of the variable holes. The first variable hole 541 and the third variable hole 543 are formed in the second injection plate 540. A plurality of the first variable hole 541 and the third variable hole 543 are provided. A part of the first variable hole 541 and a part of the second variable hole 543 are arranged in a line in the radial direction of the second injection plate 540. A plurality of columns 548 in which a part of the first variable hole 541 and a part of the third variable hole 543 are arranged are provided in plurality. Each of the rows 548 including the first variable orifice 541 and the partial third variable orifice 543 are arranged at a predetermined angle with respect to the center of the second injection plate 540.

The first variable hole 541 is formed in the central region s21 and the edge region s22 of the second injection plate 540.

The third variable hole 543 is formed in the edge region s22 of the second injection plate 540. Each of the rows 548c in which a part of the third variable holes 543 are arranged is arranged at a predetermined angle with respect to the row 548a in which a part of the first variable holes 541 are arranged with reference to the center of the second injection plate 540. The angle between the row 548c in which a part of the third variable holes 543 are arranged and the column 548a in which a part of the first variable holes 541 are arranged is smaller than the angle between the rows 548a in which a part of the first variable holes 541 are arranged.

Hereinafter, a mode in which the injection holes of the first injection plate 520 are opened and closed by the rotation of the second injection plate 540 of FIG. 12 will be described.

13 to 14 are views showing the first spray plate viewed from the upper portion. 520 and the second spray plate 540 of FIG. 12 are sequentially connected in the vertical direction.

FIG. 13 is a view showing a mode in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the first position. Referring to Fig. 13, when the second injection plate 540 is at the first position, the first variable hole 541 is located at a position facing the first fixing hole 522 and the second fixing hole 524. Therefore, the first fixing hole 522 and the second fixing hole 524 are opened.

FIG. 14 is a view showing a state in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the third position. Referring to Fig. 14, when the second injection plate 540 is at the third position, the third variable hole 543 is located at a position opposed to the second fixing hole 524. Therefore, the second fixing hole 524 is opened, and the first fixing hole 522 is closed.

Fig. 15 is a view showing another embodiment of the second spray plate 540 of Fig. 2; Referring to Fig. 15, in the second injection plate 540, other structures, functions, shapes, and the like are the same as those of the second injection plate 540 of Fig. 5 except for the arrangement and size of the variable holes. The first variable hole 541 and the fifth variable hole 545 are formed in the second injection plate 540.

A plurality of the first variable hole 541 and the fifth variable hole 545 are provided. A part of the first variable hole 541 and a part of the fifth variable hole 545 are arranged in a line in the radial direction of the second injection plate 540. A plurality of columns 548 in which a part of the first variable hole 541 and a part of the fifth variable hole 545 are arranged are provided in plurality. Each of the rows 548 including the first variable orifice 541 and the partial fifth variable orifice 545 are arranged at a predetermined angle with respect to the center of the second injection plate 540.

The first variable hole 541 is formed in the central region s21 and the edge region s22 of the second injection plate 540. The size of the first variable hole 541 is equal to or smaller than the size of the first fixing hole 522 and the second fixing hole 524 or smaller than the size of the first fixing hole 522 and the second fixing hole 524.

The fifth variable hole 545 is formed in the central region s21 and the edge region s22 of the second injection plate 540. Each of the rows 548e in which a part of the fifth variable holes 545 are arranged is arranged at a predetermined angle with respect to the row 548a in which a part of the first variable holes 541 are arranged with reference to the center of the second injection plate 540. The angle between the row 548e in which a part of the fifth variable holes 545 are arranged and the row 548a in which a part of the first variable holes 541 are arranged is smaller than the angle between the rows 548a in which a part of the first variable holes 541 are arranged. The size of the fifth variable hole 545 is the same as or smaller than the size of the first fixing hole 522 and the second fixing hole 524 or smaller than the size of the first fixing hole 522 and the second fixing hole 524. The fifth variable hole 545 disposed in the central portion s21 of the second injection plate 540 and the fifth variable hole disposed in the edge region s22 of the second injection plate 540 are formed to be different from each other.

Hereinafter, a mode in which the injection amount is adjusted in the region of the first injection plate 500 by the rotation of the second injection plate 540 of FIG. 15 will be described.

16 to 17 are views showing a state in which the first injection plate 520 and the second injection plate 540 of Fig. 15 are sequentially joined in the vertical direction from the upper side.

FIG. 16 is a view for explaining the injection amount divided by the area of the first injection plate 520 when the second injection plate 540 is at the first position. The pattern. Referring to Fig. 16, when the second injection plate 540 is at the first position, the first variable hole 541 is located at a position facing the first fixing hole 522 and the second fixing hole 524. Therefore, the first fixing hole 522 and the second fixing hole 524 are opened. The sizes of the first variable holes 541 are set to be the same as each other. Therefore, the injection amount of the gas or the plasma passing through the first fixing hole 522 is the same as the amount of the gas or plasma passing through the second fixing hole 524.

FIG. 17 is a view for explaining an injection amount that is divided into regions of the first injection plate when the second injection plate 540 is at the second position. Referring to Fig. 17, when the second injection plate 540 is at the second position, the fifth variable hole 545 is located at a position opposed to the first fixing hole 522 and the second fixing hole 524. Therefore, the first fixing hole 522 and the second fixing hole 524 are opened, and the amount of gas or plasma sprayed through the first fixing hole 522 is different from the amount of gas or plasma injected through the second fixing hole 524.

Hereinafter, another embodiment of the baffle assembly 500 of Fig. 2 will be described.

Fig. 18 is a view for explaining the third fixing hole 526 of the first injection plate 520 of Fig. 2 . The first spray plate 520 of Fig. 4 has two regions. Unlike this, the first spray plate 520 has three regions. Referring to Fig. 18, the first spray plate 520 has a central portion s11, an edge region s12, and an intermediate portion s13. The intermediate portion s13 is formed between the central region s11 and the edge region s12.

Further, a third fixing hole 526 is formed in the first injection plate 520. The overall configuration of the first spray plate 520 is the same as that of the above embodiment.

The size and shape of the third fixing hole 526 are formed to be the first The fixing hole 522 and the second fixing hole 524 are substantially the same. A plurality of third fixing holes 526 are provided. The third fixing hole 526 is formed in the intermediate portion s13. A part of the third fixing holes 526 and a part of the first fixing holes 522 and a part of the second fixing holes 524 are arranged in a row in the radial direction of the first injection plate 520. The number of rows in which a part of the third fixing holes are arranged is the same as the number in which a part of the first fixing holes 522 and a part of the second fixing holes 524 are arranged.

Fig. 19 is a view showing still another embodiment of the second injection plate 540. The second injection plate 540 of Figs. 5, 9, 12, and 15 has two regions. Unlike this, the second injection plate 540 has three regions. Referring to Fig. 19, the second ejection plate 540 has a central region s21, an edge region s22, and an intermediate region s23. The intermediate portion s23 is formed between the central region s21 and the edge region s22.

In addition to the arrangement of the fourth variable hole 544, the second injection plate 540 has the other structure, function, shape, and the like, and is the second injection plate 540 of FIG. A fourth variable hole 544 is further formed in the second spray plate 540. A plurality of fourth variable holes 544 are provided. A part of the fourth variable hole 544, the second variable hole 542, and the third variable hole 543 are arranged in a line in the radial direction of the second injection plate 540. A plurality of rows 548d of a part of the fourth variable holes 544 are arranged. Each of the rows 548d formed of a part of the fourth variable holes 544 are arranged at a predetermined angle with respect to the center of the second injection plate 540 as a reference. The fourth variable hole 544 is formed in the intermediate portion s23.

Hereinafter, a mode in which the injection holes of the first injection plate 520 are opened and closed by the rotation of the second injection plate 540 of FIG. 19 will be described.

20 to 22 are the first spray plate 520 viewed from the upper portion. FIG. 19 is a view showing a form in which the second injection plates 540 of FIG. 19 are sequentially joined in the vertical direction.

FIG. 20 is a view showing a state in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the first position. Referring to Fig. 20, when the second injection plate 540 is at the first position, the first variable hole 541 is located at a position facing the first fixing hole 522, the second fixing hole 524, and the third fixing hole 526. Therefore, the first fixing hole 522, the second fixing hole 524, and the third fixing hole 526 are opened.

FIG. 21 is a view showing a state in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the second position. Referring to Fig. 21, when the second injection plate 540 is at the second position, the fourth variable hole 544 which is arranged in a line with the second variable hole 542 and the second variable hole 542 is located in the first fixing hole 522 and the first fixing hole 522. 3 The position at which the fixing hole 526 is opposed. Therefore, the first fixing hole 522 and the third fixing hole 526 are opened, and the second fixing hole 524 is closed.

FIG. 22 is a view showing a mode in which the injection holes of the first injection plate 520 are opened and closed when the second injection plate 540 is at the third position. Referring to Fig. 22, when the second injection plate 540 is at the third position, the third variable hole 543 and the fourth variable hole 544 arranged in a line with the third variable hole 543 are located in the second fixing hole 524 and the second 3 The position at which the fixing hole 526 is opposed. Therefore, the second fixing hole 524 and the third fixing hole 526 are opened, and the first fixing hole 522 is closed.

Figure 23 is a diagram showing still another embodiment of the baffle assembly 500 of Figure 2 . Referring to Fig. 23, unlike the above embodiment, the driving unit The 560 system rotates the second injection plate 540 about its center by a magnetic force.

The baffle assembly 500 is similar to the baffle assembly 500 of FIG. 3 except for the drive plate 562a and the second spray plate 540.

A plurality of magnets are provided on the side of the second spray plate 540. The magnet can also be a permanent magnet. Each of the magnets is provided such that the magnets that are in direct contact with each other are oriented in a radial direction different from each other toward the radial direction of the second injection plate 540. Each of the magnets is arranged at a constant angle with respect to the center of the second injection plate 540 as a reference.

The drive plate 562a is located at the position where the drive gear 562 of FIG. 3 is disposed. The drive plate 562a has a disk shape. A permanent magnet is provided on a side portion of the drive plate 562a. Each of the magnets is provided such that the magnets that are in direct contact with each other are oriented in a radial direction different from each other toward the radial direction of the second injection plate 540. Each of the magnets is arranged at a predetermined angle with the center of the drive plate 562a as a reference.

The drive plate 562a is rotated about its center by the driving force transmitted from the drive shaft 564. The second spray plate 540 is rotated at an angle by the rotation of the drive plate 562a by the magnetic force.

The driving unit 560 is disposed inside or outside the processing chamber 100.

The drive unit includes various forms other than the drive unit 560 of FIGS. 3 and 23 described above.

Figure 24 is a diagram showing still another embodiment of the baffle assembly 500 of Figure 2 . Referring to Fig. 24, the second injection plate 540 is provided on the first injection plate. The interior of the 520.

The first spray plate 520 has a hollow disk shape. The first spray plate 520 has an upper surface 520a, a lower surface 520b, and a side surface 520c that connects the upper surface 520a and the lower surface 520b. A first fixing hole 522 and a second fixing hole 524 are formed in the upper surface 520a and the lower surface 520b. The first fixing hole 522 and the second fixing hole 524 are formed in the same manner as the first fixing hole 522 and the second fixing hole 524 of FIG. 4 . An opening 520d is formed in the side surface 520c of the first spray plate 520. The gear train on the side of the second injection plate 540 is meshed with the drive gear 562 through the opening 520d.

The form, function, and the like of the second injection plate 540 are the same as those of the above embodiment.

FIG. 25 is a view showing the substrate processing apparatus 2 in which the second ejection plate 540 is coupled to the lower portion of the first ejection plate 520. Referring to Fig. 25, other configurations, functions, and forms other than the shutter assembly 500 are substantially similar to the substrate processing apparatus 1 of Fig. 2.

When the second spray plate 540 is coupled to the lower portion of the first spray plate 520, the shutter assembly 500 is provided at the lower end of the diffusion chamber 144. The baffle assembly 500 is constructed identically to the baffle assembly 500 of FIG. However, the first spray plate 520 is fixed to the lower end of the diffusion chamber 144. The first spray plate 520 and the second spray plate 540 are disposed in the vertical direction.

As described above, the substrate processing apparatus 1, 2 of the present invention adjusts the ejection rate in accordance with the area of the lower portion of the shutter assembly 500 in accordance with the type of the process gas, the manufacturing process, or other process conditions, whereby the surface of the substrate can be uniformly formed. Spray gas or plasma.

In the above embodiment, the substrate processing apparatus using an inductively coupled plasma source type ICP will be described. However, embodiments of the present invention are also applicable to all forms of plasma sources such as capacitively coupled plasma source CCP or remote plasma.

The above detailed description is merely illustrative of the invention. Further, the foregoing description of the preferred embodiments of the present invention is described, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in the present specification, and equivalent to the scope of the above-described disclosure and/or the technical or knowledge of the industry. The above-described embodiments are described in the best mode for embodying the technical idea of the present invention, and various modifications can be made in accordance with the specific fields of application and use of the present invention. Therefore, the detailed description of the invention above is not intended to limit the invention. Moreover, it must be construed that the scope of the accompanying patent application also includes other embodiments.

1‧‧‧Substrate processing equipment

10‧‧‧Substrate

100‧‧‧Processing chamber

120‧‧‧Processing room

122‧‧‧ venting holes

123‧‧‧ Grounding wire

124‧‧‧Exhaust line

126‧‧‧ pump

140‧‧‧The plasma generation room

142‧‧‧Discharge room

144‧‧‧Diffuse room

200‧‧‧Substrate support unit

220‧‧‧support board

240‧‧‧Support shaft

300‧‧‧ gas supply unit

320‧‧‧ gas supply line

340‧‧‧ Gas Storage Department

360‧‧‧ gas 埠

400‧‧‧ Plasma source

420‧‧‧Antenna

440‧‧‧Power supply

500‧‧‧Baffle assembly

520‧‧‧1st spray plate

540‧‧‧2nd spray plate

560‧‧‧ drive unit

562‧‧‧ drive gear

564‧‧‧Connected components

566‧‧‧Motor

Claims (27)

A substrate processing apparatus comprising: a processing chamber; a substrate supporting unit configured to support a substrate in the processing chamber; the baffle assembly having a first spraying plate and a second spraying plate and a driving unit, the first a first ejecting plate and the second ejecting plate are located above the substrate supporting unit in the processing chamber, and are stacked on top of each other, wherein the driving unit is configured to rotate the second ejecting plate with its center as an axis; and gas supply The unit supplies gas to the upper portion of the first injection plate and the second injection plate, and the baffle assembly adjusts plasma or gas according to a region of the substrate by a rotation angle of the second injection plate. The amount of injection is set. The substrate processing apparatus according to claim 1, wherein a first fixing hole penetrating in the vertical direction is formed in a central portion of the first ejection plate, and an edge region of the first ejection plate is formed in a vertical direction. The second fixing hole. The substrate processing apparatus according to claim 2, wherein the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate; a second variable hole is disposed in a central region of the second injection plate; and a third variable hole is disposed in an edge region of the second injection plate; and a central region of the second injection plate is the first region The central region of the spray plate is opposed to each other, and an edge region of the second spray plate is opposed to an edge region of the first spray plate, and when the second spray plate is at the first position, the first variable hole is The first fixing hole and the second fixing hole are opposed to each other, and when the second injection plate is located at a second position different from the first position, the second variable hole is opposite to the first fixing hole In the above-described manner, when the second injection plate is located at a third position different from the first position and the second position, the third variable hole is provided to face the second fixing hole. And the first position, the second position, and the third position are positions of the second injection plate that are changed by the rotation of the second injection plate. The substrate processing apparatus according to claim 3, wherein a part of the first fixing holes and a part of the second fixing holes are arranged in a row in a radial direction of the first injection plate, and A part of the first variable hole, a part of the second variable hole, and a part of the third variable hole are provided in a row in the radial direction of the second injection plate. The substrate processing apparatus according to claim 2, wherein the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate, and a second variable hole a central region of the second spray plate; a central region of the second spray plate facing a central region of the first spray plate; an edge region of the second spray plate and an edge region of the first spray plate When the first injection plate is at the first position, the first variable hole is provided to face the first fixing hole and the second fixing hole, and the second injection plate is located at the first position When the second position is different from the second position, the second variable hole is disposed to face the first fixing hole, and the first position and the second position are changed by the rotation of the second injection plate. The position of the second injection plate. The substrate processing apparatus according to claim 5, wherein a part of the first fixing holes and a part of the second fixing holes are arranged in a row in a radial direction of the first ejection plate, and A part of the first variable hole and a part of the second variable hole are provided in a row in the radial direction of the second injection plate. The substrate processing apparatus according to claim 2, wherein the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate; and a third variable hole is disposed An edge region of the second spray plate; a central region of the second spray plate facing a central region of the first spray plate; and an edge region of the second spray plate and an edge region of the first spray plate When the first injection plate is at the first position, the first variable hole is provided to face the first fixing hole and the second fixing hole, and the second injection plate is located at the first position When the third position is different from the third position, the third variable hole is disposed to face the second fixing hole, and the first position and the third position are changed by the rotation of the second injection plate. The position of the second injection plate. The substrate processing apparatus according to claim 7, wherein a part of the first fixing holes and a part of the second fixing holes are formed in a row in a radial direction of the first ejection plate, and a part of the first variable holes and a part of the first The variable orifices are each arranged in a row in the radial direction of the second injection plate. The substrate processing apparatus according to claim 3, wherein the first injection plate further has a third fixing hole formed in a central region of the first injection plate and an edge region of the first injection plate. The intermediate region is an intermediate region, and a fourth variable hole is further formed in the second injection plate, and the fourth variable hole is disposed between the central region of the second injection plate and the edge region of the second injection plate. The intermediate region, that is, the intermediate variable region, and the fourth variable orifice are provided to face the third fixing hole when the second injection plate is positioned at the second position or the third position. The substrate processing apparatus according to claim 9, wherein a part of the first fixing hole, a part of the second fixing hole, and a part of the third fixing hole are arranged in a row in a radial direction of the first injection plate, and a part of the first The variable hole is formed in a row in the radial direction of the second injection plate, and a part of the fourth variable hole and a part of the second variable hole or a part of the third variable hole are in a radial direction of the second injection plate. Each is set up in a column. The substrate processing apparatus according to claim 2, wherein the second injection plate has a first variable hole and a fifth variable hole disposed in a central region and an edge region of the second injection plate, and a center of the second injection plate The area is opposite to the central area of the first spray plate, An edge region of the second spray plate faces an edge region of the first spray plate, and when the second spray plate is at the first position, the first variable hole and the first fixed hole and the second portion The fixing hole is opposed to each other, and when the second injection plate is located at a second position different from the first position, the fifth variable hole faces the first fixing hole and the second fixing hole In the first position and the second position, the position of the second injection plate that is changed by the rotation of the second injection plate, the first variable hole and the fifth variable hole are The first fixing hole and the second fixing hole are provided in the same size or smaller than the size of the first fixing hole and the second fixing hole, and the fifth portion disposed in the central region of the second ejection plate The variable pores and the fifth variable pores disposed in the edge regions of the second spray plate are formed to have different sizes. The substrate processing apparatus according to claim 11, wherein a part of the first fixing holes and a part of the second fixing holes are formed in a row in a radial direction of the first ejection plate, and a part of the first variable holes and a part of the first The variable orifices are each formed in a row in the radial direction of the second injection plate. The substrate processing apparatus of claim 1, wherein the side end portion of the second ejection plate is provided with a gear, and the driving unit has: The drive gear is provided to mesh with the gear; the motor generates a driving force for rotating the second injection plate; and the coupling member transmits the driving force generated by the motor to the drive gear. The substrate processing apparatus according to claim 1, wherein the driving unit is provided such that the second injection plate is rotated about a center thereof by a magnetic force. The substrate processing apparatus of claim 2, wherein the first ejection plate is provided to be fixed to the processing chamber. The substrate processing apparatus according to any one of claims 1 to 10, wherein the second injection plate is provided on an upper portion of the first injection plate. The substrate processing apparatus according to any one of claims 1 to 10, wherein the second injection plate is provided at a lower portion of the first injection plate. The substrate processing apparatus according to any one of claims 1 to 10, wherein the first injection plate has a hollow disk shape, and the second injection plate is provided inside the first injection plate. The substrate processing apparatus according to any one of claims 1 to 10, further comprising a plasma source that causes the gas supplied from the gas supply unit to generate a plasma. A baffle assembly having: a first spray plate and a second spray plate stacked one above another; and a drive unit for rotating the second spray plate about its center; Here, the baffle assembly is provided to adjust the amount of plasma or gas to be injected in the area of the substrate by the rotation angle of the second injection plate. The baffle assembly according to claim 20, wherein a first fixing hole penetrating in the vertical direction is formed in a central portion of the first ejection plate, and a first penetration hole is formed in an edge region of the first ejection plate. 2 fixing holes. The baffle assembly of claim 21, wherein the first spray plate is provided to be fixed to the process chamber. The baffle assembly according to claim 21, wherein the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate; and the second variable hole is disposed in the second variable hole a central region of the second injection plate; and a third variable hole disposed in an edge region of the second injection plate; and a central region of the second injection plate facing the central region of the first injection plate, wherein An edge region of the second ejection plate faces an edge region of the first ejection plate, and when the second ejection plate is at the first position, the first variable hole is fixed to the first fixing hole and the second fixing hole The way the holes are facing, When the second injection plate is located at a second position different from the first position, the second variable hole is provided to face the first fixing hole, and the second injection plate is located at the first position When the position is the third position different from the second position, the third variable hole is disposed to face the second fixing hole, and the first position, the second position, and the third position are borrowed The position of the second injection plate that is changed by the rotation of the second injection plate. The baffle assembly according to claim 21, wherein the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate; and a second variable hole a central region of the second spray plate; a central region of the second spray plate facing a central region of the first spray plate; an edge region of the second spray plate and an edge region of the first spray plate When the first injection plate is located at the first position, the first variable hole is provided to face the first fixing hole and the second fixing hole, and the second injection plate is located in the first When the first position is different from the first position, the second variable hole is disposed to face the first fixing hole, and The first position and the second position are positions of the second injection plate that are changed by the rotation of the second injection plate. The baffle assembly of claim 21, wherein the second injection plate is formed with a first variable hole disposed in a central region and an edge region of the second injection plate; and a third variable hole An edge region of the second spray plate; a central region of the second spray plate facing a central region of the first spray plate; and an edge region of the second spray plate and an edge region of the first spray plate When the first injection plate is located at the first position, the first variable hole is provided to face the first fixing hole and the second fixing hole, and the second injection plate is located in the first When the third position is different from the first position, the third variable hole is disposed to face the second fixing hole, and the first position and the third position are rotated by the second injection plate. The position of the second injection plate that is changed. The baffle assembly according to claim 23, wherein the first injection plate further has a third fixing hole formed in a central portion of the first injection plate and an edge region of the first injection plate. Area between, Further, a fourth fixing hole is further formed in the second injection hole, and the fourth fixing hole is disposed in a region between a central portion of the second injection plate and an edge region of the second injection plate, and the fourth fixing hole When the second injection plate is located at the second position or the third position, it is provided to face the third fixing hole. The baffle assembly according to claim 21, wherein the second injection plate has a first variable hole and a fifth variable hole disposed in a central region and an edge region of the second injection plate, and a center of the second injection plate The region is opposed to a central region of the first spray plate, and an edge region of the second spray plate is opposed to an edge region of the first spray plate, and when the second spray plate is at the first position, the first portion The variable hole is provided to face the first fixing hole and the second fixing hole, and when the second injection plate is located at a second position different from the first position, the fifth variable hole is The first fixing hole and the second fixing hole are opposed to each other, and the first position and the second position are positions of the second injection plate that are changed by rotation of the second injection plate, and the The variable aperture is provided to be equal to or smaller than the size of the first fixing hole and the second fixing hole, and smaller than the size of the first fixing hole and the second fixing hole, and The fifth variable hole disposed in the central portion of the second injection plate and the fifth variable hole disposed in the edge region of the second injection plate are formed to have different sizes.