TW201513332A - Organic light emitting package structure and manufacturing method thereof - Google Patents

Abstract

A manufacturing method of an organic light emitting package structure includes following steps. A first substrate and an organic light emitting layer are provided. The first substrate has an active region and a peripheral region surrounding the active region. The organic light emitting layer is disposed on the active region and exposes the peripheral region. The first substrate and a second substrate are sealed together by a sealing material. The sealing material is metal in a liquid state or alloy in a liquid state and is a continuous structure. Moreover, an organic light emitting package structure manufactured by the manufacturing method is also provided.

Description

Organic light emitting package structure and manufacturing method thereof

The present invention relates to a package structure and a method of fabricating the same, and more particularly to an organic light emitting package structure and a method of fabricating the same.

The organic light-emitting package structure has been widely used in various electronic devices (such as display devices and light source devices) due to advantages such as self-illumination, no viewing angle dependence, power saving, simple process, low cost, high response speed, and full color.

Generally, in the process of the organic light emitting package structure, the organic light emitting substrate is first fabricated, and then the organic light emitting substrate and the opposite substrate are packaged together by using the sealing glue. However, conventional encapsulating adhesives are mostly organic rubber materials. The water-blocking ability of the organic rubber material is not good, and the external moisture is easily contacted with the organic light-emitting layer of the organic light-emitting substrate, thereby affecting the reliability of the organic light-emitting package structure.

The invention provides a method for manufacturing an organic light emitting package structure, which is produced The organic light-emitting package structure has good reliability.

The invention provides an organic light emitting package structure with good reliability.

A method of fabricating an organic light emitting package structure of the present invention includes the following steps. A first substrate and an organic light emitting layer are provided. The first substrate has a work area and a peripheral area surrounding the work area. The organic light emitting layer is disposed in the work area and exposes the peripheral area. The first substrate and the second substrate are encapsulated by an encapsulating material overlapping the peripheral region. The encapsulating material is a liquid metal or alloy and is a continuous structure.

An organic light emitting package structure of the present invention includes a first substrate, a second substrate, an organic light emitting layer, and an encapsulating material. The first substrate has a work area and a peripheral area surrounding the work area. The second substrate is opposite to the first substrate. The organic light emitting layer is disposed between the working area of the first substrate and the second substrate and exposes a peripheral area of the first substrate. The encapsulation material is disposed between the peripheral region of the first substrate and the second substrate and surrounds the organic light emitting layer along the surrounding direction. The surrounding direction is not parallel to the stacking direction of the first substrate and the second substrate. The encapsulating material is a continuous metal or continuous alloy in the surrounding direction.

In an embodiment of the invention, the step of encapsulating the first substrate and the second substrate by using an encapsulation material overlapping with the peripheral region comprises: heating the encapsulation material to make the encapsulation material in a liquid state; and dissolving the liquid encapsulation material in the first a peripheral region of a substrate or a region where the second substrate is intended to overlap with the peripheral region; and the first substrate and the second substrate are assembled. The encapsulating material is solid after stopping heating and returning to room temperature and combining the first and second substrates to effectively block moisture.

In an embodiment of the present invention, the method for fabricating the organic light emitting package structure further includes: partially heating the package after assembling the first substrate and the second substrate The area where the material is loaded.

In an embodiment of the invention, the step of locally heating the region of the encapsulating material is to locally heat the region where the encapsulating material is located by using a laser or a heat gun.

In an embodiment of the invention, the step of encapsulating the first substrate and the second substrate by using an encapsulation material overlapping with the peripheral region comprises: maintaining a gap between the peripheral region of the first substrate and the second substrate; heating the encapsulation material So that the encapsulating material is in a liquid state; and the liquid encapsulating material is filled into the void.

In an embodiment of the invention, the first substrate has a recess in the peripheral region, or the second substrate has a recess that is predetermined to overlap with the peripheral region, or the first substrate and the second substrate respectively have a recess in the peripheral region and The other substrate is overlapped with the peripheral region, and the first substrate and the second substrate are encapsulated by using an encapsulation material overlapping the peripheral region: the first substrate and the second substrate are encapsulated by an encapsulation material overlapping the recess of the first substrate Or packaging the first substrate and the second substrate with an encapsulation material overlapping the recess of the second substrate, or encapsulating the first substrate and the second substrate with an encapsulation material overlapping the recess of the first substrate and another recess of the second substrate .

In an embodiment of the invention, the first substrate has a recess in the peripheral region, and the encapsulation material is filled with the recessed region, and the first substrate and the second substrate are packaged by using the region.

In an embodiment of the invention, the encapsulating material has a melting point of less than 300 °C.

In an embodiment of the invention, the metal comprises indium or tin, and the alloy comprises a bismuth indium alloy, a bismuth tin alloy, a bismuth indium tin alloy or a tin zinc alloy.

In an embodiment of the invention, the first substrate has a recess in the peripheral region, and the encapsulating material fills the recess.

In an embodiment of the invention, the second substrate has another recess that overlaps the peripheral region, and the encapsulating material fills another recess.

In an embodiment of the invention, the second substrate has a recess overlapping the peripheral region, and the encapsulating material fills the recess of the second substrate.

In an embodiment of the invention, the first substrate has a rough structure located in the peripheral region, and the encapsulating material is stuck in the rough structure.

In an embodiment of the invention, the second substrate has another roughness structure that overlaps the peripheral region, and the encapsulating material is snapped into another roughness.

In an embodiment of the invention, the second substrate has a rough structure overlapping the peripheral region, and the encapsulating material is stuck into the rough structure.

In an embodiment of the invention, the first substrate has a modified surface located in the peripheral region, and the encapsulating material is fixed to the modified surface.

In an embodiment of the invention, the second substrate has another modified surface that overlaps the peripheral region, and the encapsulating material is fixed to the other modified surface.

In an embodiment of the invention, the second substrate has a modified surface that overlaps the peripheral region, and the encapsulating material is fixed to the modified surface.

In an embodiment of the invention, the organic light emitting package structure further includes a circuit layer and an insulating layer. The circuit layer is disposed on the encapsulating material and the organic light emitting layer And electrically connected to the organic light-emitting layer. The insulating layer is disposed between the first substrate and the second substrate and covers the circuit layer.

In the above, in the method of fabricating the organic light emitting package structure according to the embodiment of the invention, the first substrate and the second substrate are encapsulated by a liquid encapsulating material overlapping the peripheral region of the first substrate. Since the encapsulating material is a liquid metal or an alloy and is a continuous structure, the encapsulating material can effectively block the contact between the external moisture and the organic light emitting layer, thereby improving the reliability of the organic light emitting package structure.

The above described features and advantages of the invention will be apparent from the following description.

100, 100A~100C‧‧‧Organic light-emitting package structure

110‧‧‧First substrate

110a‧‧‧Workspace

110b‧‧‧ surrounding area

110c, 160c‧‧‧ dent

110c’‧‧‧Depression

110d, 160d‧‧‧Rough structure

110e, 160e‧‧‧ modified surface

120‧‧‧Organic light-emitting layer

130‧‧‧Line layer

140‧‧‧Insulation

150‧‧‧Packaging materials

160‧‧‧second substrate

160b‧‧‧Area

170‧‧‧Intervals

D1, d2‧‧‧ direction

G‧‧‧ gap

S‧‧‧ heating device

1A to 1E are schematic cross-sectional views showing a method of fabricating an organic light emitting package structure according to a first embodiment of the present invention.

2 is a top plan view of a first substrate and a recess thereof according to an embodiment of the present invention.

3 is a top plan view of a first substrate and a recess thereof according to another embodiment of the present invention.

4 is a cross-sectional view showing an organic light emitting package structure according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing an organic light emitting package structure according to still another embodiment of the present invention.

6A-6C are schematic cross-sectional views showing a method of fabricating an organic light emitting package structure according to a second embodiment of the present invention.

First embodiment

1A to 1E are schematic cross-sectional views showing a method of fabricating an organic light emitting package structure according to a first embodiment of the present invention. Referring to FIG. 1A, first, a first substrate 110 and an organic light emitting layer 120 are provided. The first substrate 110 has a work area 110a and a peripheral area 110b surrounding the work area 110a. The organic light emitting layer 120 is disposed on the working area 110a of the first substrate 110 and exposes the peripheral area 110b of the first substrate 110. In this embodiment, the circuit layer 130 electrically connected to the organic light-emitting layer 120 is further provided, and the circuit layer 130 is disposed in the peripheral region 110b. In addition, an insulating layer 140 covering the wiring layer 130 may be further provided, and the wiring layer 130 is located between the insulating layer 140 and the first substrate 110. In this embodiment, the material of the first substrate 110 is, for example, glass. However, the present invention is not limited thereto. In other embodiments, the material of the first substrate 110 may also be quartz, an organic polymer, a reflective material, or other suitable materials.

Referring to FIG. 1B to FIG. 1E, the first substrate 110 and the second substrate 160 are then encapsulated by an encapsulation material 150 overlapping the peripheral region 110b, wherein the encapsulation material 150 is in a liquid metal or alloy and is a continuous structure. In the present embodiment, the melting point of the encapsulating material 150 may be lower than 300 ° C, so that the organic light emitting layer 120 or other members are not easily damaged during the process of converting the encapsulating material 150 into a liquid state. Specifically, the encapsulating material 150 of the present embodiment may be indium, tin, antimony indium alloy, antimony tin alloy, antimony indium tin alloy, tin zinc alloy, or a combination thereof. However, the present invention is not limited thereto. In other embodiments, the encapsulating material 150 may also be other suitable materials. In the present embodiment, the material of the second substrate 160 is, for example, glass. However, the invention is not limited thereto, and in other embodiments, the second The material of the substrate 160 may also be quartz, an organic polymer, a reflective material, or other suitable materials.

In this embodiment, as shown in FIG. 1B, the encapsulating material 150 may be heated by the heating device S to make the encapsulating material 150 in a liquid state. Next, the liquid encapsulating material 150 can be distributed in the peripheral region 110b of the first substrate 110. It is worth mentioning that the first substrate 110 of the embodiment may further have a recess 110c located in the working area 110a of the peripheral area. In the present embodiment, the liquid encapsulating material 150 can be filled into the recess 110c. The recess 110c can limit the position of the liquid encapsulating material 150, and the liquid encapsulating material 150 does not easily contact the wiring layer 130 or the organic light emitting layer 120, thereby improving the yield of the organic light emitting package structure. 2 is a top plan view of a first substrate and a recess thereof according to an embodiment of the present invention. Referring to FIG. 2, in the embodiment, the recess 110c may be an annular recess. The annular recess may surround the working area 110a of the first substrate 110. However, the present invention is not limited thereto, and the encapsulation material 150 does not have to be filled in the recess 110c. In other embodiments, the encapsulation material 150 may also be directly coated on the first substrate 110 without the recess. Moreover, the invention does not limit the form of the recess 110c. 3 is a top plan view of a first substrate and a recess according to another embodiment of the present invention. Referring to Fig. 3, in this embodiment, the recess 110c may include a plurality of recesses 110c' separated from each other, and the recesses 110c' may be distributed in an annular region surrounding the working area 110a.

Then, as shown in FIG. 1C, in the present embodiment, the first substrate 110 and the second substrate 160 may be assembled when the liquid encapsulating material 150 is turned into a solid state. Please refer to FIG. 2. FIG. 2 is also a top view of a second substrate and a recess thereof according to an embodiment of the invention. Referring to FIG. 1C and FIG. 2 , in the embodiment, the second substrate 160 can also optionally have There is a recess 160c, and the recess 160c may be an annular recess. When the first substrate 110 and the second substrate 160 are assembled, the encapsulation material 150 may be filled in the recess 160c. However, the present invention is not limited thereto, and the encapsulating material 150 does not have to be filled in the recess 160c. In other embodiments, the encapsulating material 150 may also be distributed on the second substrate 160 without the recess. Moreover, the invention does not limit the form of the recess 160c. 3 is also a top view of a second substrate and a recess according to another embodiment of the present invention. Referring to FIG. 3, in this embodiment, the recess 160c may include a plurality of recessed portions 110c' separated from each other, and the encapsulating material 150 may be filled in the recessed portion 110c'.

Next, as shown in FIG. 1D, the area where the encapsulating material 150 is located may be locally heated to turn the encapsulating material 150 into a liquid state again. In particular, the area in which the encapsulating material 150 is located may be locally heated using a laser, heat gun or other suitable device. As shown in FIG. 1E, after the material to be packaged 150 is cooled, the encapsulation material 150 can be well bonded to the first substrate 110 and the second substrate 160, thereby completing the organic light emitting package structure 100 of the present embodiment. The organic light emitting package structure 100 of the present embodiment can be applied as an organic light emitting display panel, an organic light emitting surface light source, or other devices. Since the manufacturing method of the present embodiment utilizes a metal or alloy having good water and gas barrier properties as the encapsulating material 150 to encapsulate the first substrate 110 and the second substrate 160, the organic light emitting package structure 100 can have high reliability.

It should be noted that the above method for fabricating the organic light emitting package structure is for exemplifying the present invention and is not intended to limit the present invention. The organic light emitting package structure of the present invention can also be fabricated in other suitable manners. For example, the liquid encapsulation material 150 does not have to be distributed first in the peripheral region 110b of the first substrate 110, in another implementation. For example, the liquid encapsulating material 150 may be first distributed in the region 160b of the second substrate 160 that is intended to overlap with the peripheral region 110b of the first substrate 110. However, the first substrate 110 is further assembled with the second substrate 160 through the encapsulating material 150. The organic light emitting package structure 100 is completed. In addition, a recess 160c may be disposed on the region 160b of the second substrate 160 that is intended to overlap the peripheral region 110b of the first substrate 110. The function of the recess 160c may be similar to the recess 110c, so that the encapsulation material 150 is less likely to contact the organic light emitting layer 120. In FIG. 1C to FIG. 1E, although the recesses 110c and 160c are respectively disposed on the first substrate 110 and the second substrate 160, the present invention is not limited thereto, and the manufacturer may provide the recess 110c on the first substrate 110 according to actual needs. A recess 160c is provided on the second substrate 160, or recesses 110c, 160c are provided on the first substrate 110 and the second substrate 160, respectively.

Referring to FIG. 1E , the organic light emitting package structure 100 of the present embodiment includes a first substrate 110 , a second substrate 160 relative to the first substrate 110 , an organic light emitting layer 120 , and an encapsulation material 150 . The first substrate 110 has a work area 110a and a peripheral area 110b surrounding the work area 110a. The organic light emitting layer 120 is disposed between the working area 110a of the first substrate 110 and the second substrate 160, and exposes the peripheral area 110b of the first substrate 110. The encapsulation material 150 is disposed between the peripheral region 110b of the first substrate 110 and the second substrate 160 and surrounds the organic light emitting layer 120 along the surrounding direction d1. The surrounding direction d1 is not parallel to the stacking direction d2 of the first substrate 110 and the second substrate 160. The encapsulating material 150 is a continuous metal or continuous alloy in the circumferential direction d1.

The organic light emitting package structure 100 of the present embodiment further includes a circuit layer 130 and an insulating layer 140. The circuit layer 130 is disposed between the encapsulation material 150 and the organic light emitting layer 120. The circuit layer 130 is disposed between the first substrate 110 and the second substrate 160 and The organic light emitting layer 120 is electrically connected. The insulating layer 140 is disposed between the first substrate 110 and the second substrate 160 and covers the wiring layer 130 . The material of the insulating layer may be a non-conductive inorganic oxide such as cerium oxide (SiOx), cerium nitride (SiNx), cerium oxynitride (SiNxOy).

In the present embodiment, the first substrate 110 may have a recess 110c in the peripheral region 110b, and the encapsulation material 150 fills the recess 110c. The recess 110c can prevent the liquid encapsulating material 150 from contacting the organic light emitting layer 120 or other members in the process of the organic light emitting package structure 100, and can further increase the bonding strength between the first substrate 110 and the encapsulating material 150. The second substrate 160 may have a recess 160c overlapping the peripheral region 110b, and the encapsulation material 150 is further filled with the recess 160c. The recess 160c can also prevent the liquid encapsulating material 150 from contacting the organic light emitting layer 120 or other members during the process of the organic light emitting package structure 100. In FIG. 1E, although the recesses 110c and 160c are respectively disposed on the first substrate 110 and the second substrate 160, the present invention is not limited thereto, and the manufacturer may provide the recess 110c on the first substrate 110 according to actual needs, and on the second substrate. The recess 160c is provided on the 160, or the recesses 110c, 160c are provided on the first substrate 110 and the second substrate 160, respectively.

In addition to the above-described depressions, the joint strength can be increased, and other structures can be used to enhance it. The following is exemplified using FIGS. 4 and 5.

4 is a cross-sectional view showing an organic light emitting package structure according to another embodiment of the present invention. Referring to FIG. 4, the organic light emitting package structure 100A of FIG. 4 is similar to the organic light emitting package structure 100, and thus the same elements are denoted by the same reference numerals. In the organic light emitting package structure 100A, the first substrate 110 may have a thick portion located in the peripheral region 110b. The roughness 110d, and the encapsulation material 150 can be snapped into the roughness 110d. By the roughness 110d, the bonding strength between the first substrate 110 and the encapsulation material 150 can be enhanced. The second substrate 160 may have a roughness 160d overlapping the peripheral region 110b, and the encapsulation material 150 may also be caught in the roughness 160d. The bonding strength between the second substrate 160 and the encapsulating material 150 can also be enhanced by the roughness 160d. It should be noted that in FIG. 4, the first substrate 110 and the second substrate 160 have rough structures 110d and 160d, respectively. However, the present invention is not limited thereto, and the manufacturer may arrange a rough structure in one of the first substrate 110 and the second substrate 160, a rough structure on both of them, or a rough structure on both, depending on actual needs.

FIG. 5 is a cross-sectional view showing an organic light emitting package structure according to still another embodiment of the present invention. Referring to FIG. 5, the organic light emitting package structure 100B of FIG. 5 is similar to the organic light emitting package structure 100, and thus the same elements are denoted by the same reference numerals. In the organic light emitting package structure 100B, the first substrate 110 may have a modified surface 110e located in the peripheral region 110b, and the encapsulation material 150 may be fixed to the modified surface 110e. The modified surface 110e can also increase the bonding strength between the first substrate 110 and the encapsulation material 150. The second substrate 160 may have a modified surface 160e that overlaps the peripheral region 110b, and the encapsulation material 150 may be fixed to the modified surface 160e. The modified surface 160e can also increase the bonding strength between the second substrate 160 and the encapsulation material 150. It should be noted that in FIG. 5, the first substrate 110 and the second substrate 160 have modified surfaces 110e and 160e, respectively. However, the present invention is not limited thereto, and the manufacturer may configure the modified surface on one of the first substrate 110 and the second substrate 160 according to actual needs, and configure the modified surface on both of them, or neither of them may be configured. Quality surface.

Second embodiment

6A-6C are schematic cross-sectional views showing a method of fabricating an organic light emitting package structure according to a second embodiment of the present invention. The method of fabricating the organic light emitting package structure of the present embodiment is similar to the method of fabricating the organic light emitting package structure of the first embodiment, and thus the same elements are denoted by the same reference numerals. The difference between the method of fabricating the organic light emitting package structure of the present embodiment and the method of fabricating the organic light emitting package structure of the first embodiment is that the method of packaging the first substrate and the second substrate by using a package material overlapping the peripheral region is different. The following is a description of this difference, and the two will not be repeated.

Referring to FIG. 6A, first, a first substrate 110 and an organic light emitting layer 120 are provided. The first substrate 110 has a work area 110a and a peripheral area 110b surrounding the work area 110a. The organic light emitting layer 120 is disposed in the work area 110a and exposes the peripheral area 110b. Different from the first embodiment, in the embodiment, the spacers 170 disposed on the first substrate 110 or the second substrate 160 are further provided. The spacer 170 may maintain the gap G between the peripheral region 110b of the first substrate 110 and the second substrate 160.

Referring to FIG. 6A to FIG. 6C , the first substrate 110 and the second substrate 160 are encapsulated by an encapsulation material 150 overlapping the peripheral region 110 b of the first substrate 110 , wherein the encapsulation material 150 is a liquid metal or alloy and has a continuous structure. . Different from the first embodiment, in the present embodiment, as shown in FIG. 6A, the gap G between the peripheral region 110b of the first substrate 110 and the second substrate 160 can be maintained. Specifically, the second substrate 160 can bear against the spacer 170 while maintaining the gap G with the peripheral region 110b of the first substrate 110. Next, as shown in FIG. 6B, the encapsulating material 150 is heated to make the encapsulating material 150 liquid. However, the liquid encapsulating material 150 is filled in the gap G. As shown in FIG. 6C, after the material to be packaged 150 is cooled, the encapsulation material 150 can be well bonded to the first substrate 110 and the second substrate 160, thereby completing the organic light emitting package structure 100C of the present embodiment.

Referring to FIG. 6C, the organic light emitting package structure 100C of the present embodiment is similar to the organic light emitting package structure 100 of the first embodiment, and thus the same elements are denoted by the same reference numerals. The organic light emitting package structure 100C includes a first substrate 110, a second substrate 160 opposite to the first substrate 110, an organic light emitting layer 120, and an encapsulation material 150. The first substrate 110 has a work area 110a and a peripheral area 110b surrounding the work area 110a. The organic light emitting layer 120 is disposed between the working area 110a of the first substrate 110 and the second substrate 160, and exposes the peripheral area 110b of the first substrate 110. The encapsulation material 150 is disposed between the peripheral region 110b of the first substrate 110 and the second substrate 160 and surrounds the organic light emitting layer 120 along the surrounding direction d1. The surrounding direction d1 is not parallel to the stacking direction d2 of the first substrate 110 and the second substrate 160, and the encapsulating material 150 is a continuous metal or continuous alloy in the surrounding direction d1. Different from the first embodiment, the organic light emitting package structure 100C further includes a spacer 170 between the first substrate 110 and the second substrate 160.

In summary, in the method of fabricating an organic light emitting package structure according to an embodiment of the invention, the first substrate and the second substrate are encapsulated by a liquid encapsulation material overlapping the peripheral region of the first substrate. Since the encapsulating material is a liquid metal or an alloy and is a continuous structure, the encapsulating material can effectively block the contact between the external moisture and the organic light emitting layer, thereby improving the reliability of the organic light emitting package structure.

Although the present invention has been disclosed above by way of example, it is not intended to limit the present invention. The scope of the present invention is defined by the scope of the appended claims, which are defined by the scope of the appended claims. quasi.

100‧‧‧Organic light-emitting package structure

110‧‧‧First substrate

110a‧‧‧Workspace

110b‧‧‧ surrounding area

110c‧‧‧ dent

120‧‧‧Organic light-emitting layer

130‧‧‧Line layer

140‧‧‧Insulation

150‧‧‧Packaging materials

160‧‧‧second substrate

160b‧‧‧Area

160c‧‧‧ dent

D1, d2‧‧‧ direction

Claims (21)

A method for fabricating an organic light emitting package structure includes: providing a first substrate and an organic light emitting layer, the first substrate having a working area and a peripheral area surrounding the working area, the organic light emitting layer being disposed in the working area and exposed Excluding the peripheral region; and encapsulating the first substrate and a second substrate with a packaging material overlapping the peripheral region of the first substrate, wherein the encapsulating material is in a liquid metal or alloy and is a continuous structure. The method of manufacturing the organic light emitting package structure of claim 1, wherein the step of packaging the first substrate and the second substrate with the packaging material overlapping the peripheral region comprises: heating the packaging material to enable The encapsulating material is in a liquid state; the encapsulating material in a liquid state is distributed in the peripheral region of the first substrate or a region in which the second substrate is intended to overlap the peripheral region; and the first substrate and the second substrate are assembled. The method for manufacturing an organic light emitting package structure according to claim 2, further comprising: locally heating the region where the package material is located after the first substrate and the second substrate are assembled. The method for manufacturing an organic light emitting package structure according to claim 3, wherein the step of locally heating the region where the packaging material is located is: The area where the encapsulating material is located is locally heated by a laser or a heat gun. The method of manufacturing the organic light emitting package structure of claim 1, wherein the step of packaging the first substrate and the second substrate with the packaging material overlapping the peripheral region comprises: A gap is maintained between the peripheral region and the second substrate; the encapsulating material is heated to make the encapsulating material in a liquid state; and the encapsulating material in a liquid state is filled into the void. The manufacturing method of the organic light emitting package structure according to claim 1, wherein the first substrate has a recess in the peripheral region, or the second substrate has a recess that is intended to overlap the peripheral region, or The first substrate and the second substrate respectively have a recess in the peripheral region and another recess that is intended to overlap the peripheral region, and the first substrate and the second substrate are encapsulated by the packaging material overlapping the peripheral region The step of packaging the first substrate and the second substrate with the encapsulation material overlapping the recess of the first substrate, or encapsulating the first substrate with the encapsulation material overlapping the recess of the second substrate The first substrate and the second substrate are encapsulated by the second substrate or by using the encapsulation material overlapping the recess of the first substrate and the other recess of the second substrate. The method of manufacturing an organic light emitting package structure according to claim 1, wherein the encapsulating material has a melting point of less than 300 °C. The method of manufacturing an organic light emitting package structure according to claim 1, wherein the metal comprises indium or tin, and the alloy comprises a bismuth indium alloy, a bismuth tin alloy, 铋Indium tin alloy or tin zinc alloy. An organic light emitting package structure includes: a first substrate having a working area and a peripheral area surrounding the working area; a second substrate opposite to the first substrate; an organic light emitting layer disposed on the first substrate a peripheral region between the working area and the second substrate and exposing the first substrate; and a packaging material disposed between the peripheral region of the first substrate and the second substrate and along a surrounding direction Surrounding the organic light emitting layer, wherein the surrounding direction is not parallel to a stacking direction of the first substrate and the second substrate, and the encapsulating material is a continuous metal or a continuous alloy in the surrounding direction. The organic light emitting package structure of claim 9, wherein the first substrate has a recess in the peripheral region, and the encapsulating material fills the recess. The organic light emitting package structure of claim 10, wherein the second substrate has another recess overlapping the peripheral region, and the encapsulating material fills the other recess. The organic light emitting package structure of claim 9, wherein the second substrate has a recess overlapping the peripheral region, and the encapsulating material fills the recess of the second substrate. The organic light emitting package structure of claim 9, wherein the first substrate has a roughness structure in the peripheral region, and the packaging material is stuck in the roughness structure. The organic light emitting package structure of claim 13, wherein the second substrate has another roughness structure overlapping the peripheral region, and the packaging material is inserted into the other roughness structure. The organic light emitting package structure of claim 9, wherein the second substrate has a roughness structure overlapping the peripheral region, and the packaging material is stuck in the roughness structure. The organic light emitting package structure of claim 9, wherein the first substrate has a modified surface located in the peripheral region, and the packaging material is fixed to the modified surface. The organic light emitting package structure of claim 16, wherein the second substrate has another modified surface overlapping the peripheral region, and the encapsulating material is fixed to the other modified surface. The OLED package of claim 9, wherein the second substrate has a modified surface overlapping the peripheral region, and the encapsulating material is fixed to the modified surface. The organic light emitting package structure of claim 9, further comprising: a circuit layer disposed between the packaging material and the organic light emitting layer and electrically connected to the organic light emitting layer; and an insulating layer, And disposed between the first substrate and the second substrate and covering the circuit layer. The organic light emitting package structure according to claim 9, wherein The encapsulating material has a melting point below 300 °C. The organic light emitting package structure of claim 9, wherein the metal comprises indium or tin, and the alloy comprises a bismuth indium alloy, a bismuth tin alloy, a bismuth indium tin alloy or a tin zinc alloy.