TW201510814A - Sensor device, input device, and electronic device - Google Patents

Abstract

Provided are a sensor device, an input device, and an electronic device in which degradation of detection precision from effects of electromagnetic noise from external sources can be alleviated. A sensor device according to an embodiment of the present technology comprises an electrode substrate and shield layers. The electrode substrate further comprises a plurality of first electrode wires and a plurality of second electrode wires. A plurality of capacitance sensors which are respectively formed in a plurality of facing regions of the plurality of first electrode wires and the plurality of second electrode wires are arrayed in a matrix. The shield layers are disposed upon the electrode substrate, and further comprise conductive films which isolate at least portions of wiring regions of the plurality of second electrode wires which communicate among the plurality of facing regions.

Description

Sensing device, input device and electronic machine

The present technology relates to a sensing device, an input device, and an electronic device that can electrostatically detect an input operation.

As a sensor device for an electronic device, for example, a capacitor element is provided, and an operation position and a pressing force of an operator for inputting an operation surface can be detected (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-170659

In recent years, there has been a method of inputting a higher degree of freedom by a gesture operation using a finger movement, but it is expected that more stable detection of the pressing force on the operation surface with higher precision can be realized. The input operation. For example, in a sensing device configured to perform an electrostatic detecting input operation, it is necessary to suppress a decrease in detection accuracy due to an influence of electromagnetic noise from the outside.

In view of the above circumstances, an object of the present invention is to provide a sensing device, an input device, and an electronic device that can suppress a decrease in detection accuracy due to an influence of external electromagnetic noise.

In order to achieve the above object, a sensing device according to one aspect of the present technology includes an electrode substrate and a shielding layer.

The electrode substrate includes a plurality of first electrode lines and a plurality of second electrode lines, and is formed by a plurality of capacitance sensings formed in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines The devices are arranged in a matrix.

The shielding layer is provided on the electrode substrate and includes a conductor film that shields at least a part of the wiring region connecting the plurality of second electrode lines between the plurality of opposing regions.

In the above sensing device, the shield layer functions as an electromagnetic mask covering the wiring region. Thereby, it is possible to suppress a decrease in the detection accuracy of each of the capacitance sensors due to the influence of electromagnetic noise from the outside.

The plurality of first electrode lines and the plurality of second electrode lines may be arranged apart from each other in the thickness direction of the electrode substrate. In this case, the plurality of capacitance sensors are respectively formed at intersections of the plurality of first electrode lines and the plurality of second electrode lines.

The electrode substrate may include a first insulating layer supporting the plurality of first electrode lines and a second insulating layer supporting the plurality of second electrode lines. In this case, the shield layer is provided, for example, on the first insulating layer.

The shielding layer may be disposed on the same plane as the plurality of first electrode lines. The conductor film may be made of the same material as the plurality of first electrode lines. The conductor film may include a plurality of third electrode lines disposed between each of the plurality of first electrode lines. The conductor film may further include a wiring portion that connects the plurality of third electrode lines to each other.

On the other hand, the plurality of capacitance sensors may be formed in opposite regions of the plurality of first electrode lines and the plurality of second electrode lines, which face each other in the in-plane direction of the electrode substrate. In this case, the shielding layer may further include a configuration An insulating film between the conductor film and the wiring region.

The electrode substrate may include a plurality of jumper wiring portions provided at intersections of the plurality of first electrode lines and the plurality of second electrode lines. The conductor film may be provided on the same plane as the plurality of jumper wiring portions. The shielding layer may also cover the plurality of jumper wiring portions. The conductor film may be made of the same material as the plurality of jumper wiring portions. The shielding layer may further shield at least a portion of the wiring regions connecting the plurality of first electrode lines between the plurality of opposing regions.

The plurality of second electrode lines may include an outer peripheral wiring portion formed on the outer side of the detection region in which the plurality of capacitive sensors arranged in a matrix are formed. In this case, the shielding layer may further shield at least a part of the outer peripheral wiring portion.

The sensing device may further include: a deformable first conductor layer disposed to face one of the electrode substrates; and a first support including a connection between the first conductor layer and the electrode substrate A plurality of first structures. Furthermore, the sensing device may further include: a second conductor layer disposed to face the other main surface of the electrode substrate; and a second support including a connection between the second conductor layer and the electrode substrate A plurality of second structures.

An input device of one form of the present technology includes an operating member, an electrode substrate, and a shielding layer.

The above operating member includes an input operating surface.

The electrode substrate includes a plurality of first electrode lines and a plurality of second electrode lines, and is formed by a plurality of capacitance sensings formed in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines The devices are arranged in a matrix.

The shielding layer is provided between the operation member and the electrode substrate, and includes a conductor film that shields at least a part of the wiring region connecting the plurality of second electrode lines between the plurality of opposing regions.

An electronic device in one form of the present technology includes a display element, an electrode substrate, and a shielding layer.

The above display element includes an input operation surface.

The electrode substrate includes a plurality of first electrode lines and a plurality of second electrode lines, and is formed by a plurality of capacitance sensings formed in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines The devices are arranged in a matrix.

The shielding layer is disposed between the display element and the electrode substrate and includes a conductor film that shields at least a part of the wiring region connecting the plurality of second electrode lines between the plurality of opposing regions.

As described above, according to the present technology, it is possible to suppress a decrease in detection accuracy due to the influence of electromagnetic noise from the outside.

Furthermore, the present technology is not necessarily limited to the effects described herein, and may be any of the effects described in the present disclosure.

1‧‧‧Sensing device

10‧‧‧Operating components

11‧‧‧Flexible display

12‧‧‧Metal film

13‧‧‧Next layer

20‧‧‧Electrode substrate

20C‧‧‧electrode substrate

20Cs‧‧‧Detection Department

20s‧‧‧Detection Department

20sa1‧‧Detection Department

20sa2‧‧Detection Department

20sa3‧‧Detection Department

20sb1‧‧‧Detection Department

20sb2‧‧‧Detection Department

21‧‧‧1st wiring substrate

21a‧‧‧Edge

21b‧‧‧Edge

21C‧‧‧Edge

22‧‧‧2nd wiring substrate

23‧‧‧Next layer

30‧‧‧1st support

31‧‧‧Substrate

32‧‧‧Structural layer

35‧‧‧Next layer

40‧‧‧2nd support

50‧‧‧ conductor layer

60‧‧‧Control Department

61‧‧‧ Computing Department

62‧‧‧Signal Generation Department

70‧‧‧Electronic machines

100‧‧‧ input device

100C‧‧‧ input device

110‧‧‧1st

113‧‧‧Wiring substrate

120‧‧‧2nd

210‧‧‧1st electrode line

210a‧‧‧ lead line

210b‧‧‧Electrode wire

210C‧‧‧1st electrode line

210D‧‧‧1st electrode line

210Dm‧‧‧ unit electrode body

210m‧‧‧unit electrode body (1st unit electrode body)

210p‧‧‧electrode line

210w‧‧‧Auxiliary electrode

210w1‧‧‧Auxiliary electrode

210w2‧‧‧Auxiliary electrode

210w3‧‧‧Auxiliary electrode

210y‧‧‧Connecting Department

210z‧‧‧Connecting Department

211‧‧‧1st substrate

211C‧‧‧Substrate

220‧‧‧2nd electrode line

220b‧‧‧Wiring area

220C‧‧‧2nd electrode line

220D‧‧‧electrode wire

220E‧‧‧Electrode wire

220F‧‧‧electrode wire

220m‧‧‧unit electrode body (2nd unit electrode body)

220p‧‧‧electrode line

220q‧‧‧Spanning Wiring Department

220r‧‧‧Insulation

220r1‧‧‧Insulation film

220w‧‧‧Auxiliary electrode

220w1‧‧‧Auxiliary electrode

220w2‧‧‧Auxiliary electrode

220w3‧‧‧Auxiliary electrode

220y‧‧‧Connecting Department

220z‧‧‧Connecting Department

221‧‧‧2nd substrate

310‧‧‧1st structure

310a1‧‧‧1st structure

310a2‧‧‧1st structure

310a3‧‧‧1st structure

310b1‧‧‧1st structure

310b2‧‧‧1st structure

310p1‧‧‧1st structure

310p2‧‧‧1st structure

310p3‧‧‧1st structure

310p4‧‧‧1st structure

320‧‧‧1st housing

321‧‧‧1st convex

322‧‧‧2nd convex

323‧‧‧ recess

330‧‧‧First Space Department

330b1‧‧‧1st Space Department

330p0‧‧‧1st Space Department

341‧‧‧ joints

410‧‧‧2nd structure

410p0‧‧‧2nd structure

410p1‧‧‧2nd structure

410p2‧‧‧2nd structure

420‧‧‧ second housing

430‧‧‧2nd Space Department

430a2‧‧‧Second Space Department

430b1‧‧‧Second Space Department

430b2‧‧‧2nd Space Department

710‧‧‧ Controller

Ca1, Ca2, Ca3‧‧‧Changes in electrostatic capacitance

Cb1, Cb2‧‧‧Changes in electrostatic capacitance

Cc11, Cc12, Cc13, Cc14, Cc15‧‧‧ electrostatic capacitor

F‧‧‧ force

F1‧‧‧ force

F2‧‧‧ force

F3‧‧‧ force

F4‧‧‧ force

h‧‧‧Operator

P‧‧‧ points

S1‧‧‧Shield

S2‧‧‧Shield

S3‧‧‧Shield

S11‧‧‧electrode wire (third electrode wire)

S11b‧‧‧Strip

S12‧‧‧Wiring Department

S12a‧‧‧ lead line

S20‧‧‧ openings

S21‧‧‧ conductor film

S22‧‧‧ conductor film

Fig. 1 is a schematic cross-sectional view showing an input device according to a first embodiment of the present technology.

Fig. 2 is an exploded perspective view of the above input device.

Fig. 3 is a schematic cross-sectional view showing the main part of the above input device.

Figure 4 is a block diagram of an electronic device using the above input device.

FIG. 5 is a schematic cross-sectional view showing a state in which a force applied to the first and second structures is pressed when the point of the first surface of the input device is pressed downward in the Z-axis direction by an operator.

6A and 6B are schematic main cross-sectional views showing the state of the input device when the point on the first structure of the first surface is operated by the operator, and the output output from the detecting unit at this time. A diagram of an example of a signal.

Fig. 7 is a plan view showing a main part of an electrode substrate of the input device.

FIG. 8 is a plan view of a main part of a first wiring board constituting the electrode substrate.

FIG. 9 is a plan view of a main part of a second wiring board constituting the electrode substrate.

10A and 10B are plan views schematically showing the entire first wiring board.

Fig. 11A is a schematic cross-sectional view showing an input device according to a second embodiment of the present technology, and B is a cross-sectional view showing an enlarged main portion of the input device.

12A and 12B are plan views showing main parts of a configuration of a first electrode line and a second electrode line in the input device.

Fig. 13A is a plan view showing a principal part of an electrode substrate in the input device, and B is a cross-sectional view taken along line A-A.

Fig. 14 is a schematic cross-sectional view for explaining the configuration of a detecting unit of the input device.

Fig. 15A is a plan view showing a main part of an electrode substrate including a shield layer, B is a cross-sectional view taken along line B1-B1, and C is a cross-sectional view taken along line C1-C1.

Fig. 16A is a plan view showing a main part of an electrode substrate including a shield layer, B is a cross-sectional view taken along line B2-B2, and C is a cross-sectional view taken along line C2-C2.

Fig. 17 is a plan view showing a main part of a modification of the configuration of the first electrode line.

Fig. 18 is a schematic plan view showing another configuration example of the first electrode line.

19A-C are plan views of main parts showing a variation of the configuration of the second electrode line.

Fig. 20 is a schematic cross-sectional view showing a modification of the configuration of the input device.

Hereinafter, an embodiment of the present technology will be described with reference to the drawings.

<First embodiment>

1 is a schematic cross-sectional view of an input device 100 according to a first embodiment of the present technology, FIG. 2 is an exploded perspective view of the input device 100, FIG. 3 is a schematic cross-sectional view of a main portion of the input device 100, and FIG. 4 is an input device 100. A block diagram of an electronic machine 70. Hereinafter, the configuration of the input device 100 of the present embodiment will be described. In addition, in the figure, the X-axis and the Y-axis indicate directions orthogonal to each other (in-plane direction of the input device 100), and the Z-axis indicates X-axis and Y-axis The direction of the orthogonal direction (the thickness direction or the up and down direction of the input device 100).

[input device]

The input device 100 includes a flexible display (display element) 11 that accepts an operation of a user, and a sensing device 1 that detects an operation of a user. The input device 100 is configured, for example, as a flexible touch panel display, and incorporated in the electronic device 70 described below. The sensing device 1 and the flexible display 11 are in the form of a flat plate extending in a direction perpendicular to the Z-axis.

The flexible display 11 includes a first surface 110 and a second surface 120 on the opposite side of the first surface 110. The flexible display 11 has both a function as an input operation unit in the input device 100 and a function as a display unit. In other words, the flexible display 11 functions as the input operation surface and the display surface, and displays an image corresponding to the user's operation from the first surface 110 toward the upper side in the Z-axis direction. For example, an image corresponding to a keyboard, a GUI (Graphical User Interface), or the like is displayed on the first surface 110. Examples of the operation for operating the flexible display 11 include a finger or a pen (stylus).

The specific configuration of the flexible display 11 is not particularly limited. For example, a so-called electronic paper, an organic EL (Electroluminescence) panel, an inorganic EL panel, a liquid crystal panel, or the like can be used as the flexible display 11. Further, the thickness of the flexible display 11 is not particularly limited, and is, for example, about 0.1 mm to 1 mm.

The sensing device 1 includes a metal film (first conductor layer) 12, a conductor layer (second conductor layer) 50, an electrode substrate 20, a first support 30, and a second support 40. The sensing device 1 is disposed on the second surface 120 side of the flexible display 11 .

The metal film 12 is formed in a deformable sheet shape. The conductor layer 50 is disposed opposite to the metal film 12. The electrode substrate 20 includes a plurality of first electrode lines 210 and a plurality of second electrode lines 220 that are disposed opposite to the plurality of first electrode lines 210 and intersect the plurality of first electrode lines 210, and are deformably disposed on the metal Between the film 12 and the conductor layer 50, the change in the distance from the metal film 12 and the conductor layer 50 can be electrostatically detected. The first support 30 includes a plurality of first structures 310 that are connected between the metal film 12 and the electrode substrate 20, and a first space portion 330 that is formed. It is between a plurality of first structures 310. The second support 40 includes a plurality of second structures 410 disposed between the adjacent plurality of first structures 310 and connected between the conductor layer 50 and the electrode substrate 20, and a second space portion 430. It is formed between a plurality of second structures 410.

The sensing device 1 (input device 100) of the present embodiment detects the metal film 12 and the electrode substrate 20 and the conductor layer 50 and the electrode by the input operation on the first surface 110 of the flexible display 11 by electrostatic detection. The input operation is detected by a change in the distance between the substrates 20. The input operation is not limited to the operation of consciously pushing the first surface 110, and may be a touch operation. That is, as described below, even if a small pressing force (for example, about several tens of g) is added by a normal touch operation, the input device 100 can detect the touch, and thus can be configured to perform a general touch feeling. The same touch operation of the detector.

The input device 100 includes a control unit 60 that includes a calculation unit 61 and a signal generation unit 62. The calculation unit 61 detects the operation of the user based on the change in the electrostatic capacitance of the detection unit 20s. The signal generation unit 62 generates an operation signal based on the detection result of the calculation unit 61.

The electronic device 70 shown in FIG. 4 includes a controller 710 that performs processing based on an operation signal generated by the signal generating portion 62 of the input device 100. The operation signal processed by the controller 710 is output to the flexible display 11 as an image signal, for example. The flexible display 11 is connected to a drive circuit mounted on the controller 710 via the flexible wiring board 113 (see FIG. 2). The drive circuit described above may be mounted on the wiring substrate 113.

The electronic device 70 is typically a mobile phone, a smart phone, a personal computer, a tablet PC, a portable game machine, etc., but is not limited to the portable electronic device. The machine can also be applied to fixed electronic equipment such as ATM (Automatic Teller Machine) and automatic ticket vending machines.

In the present embodiment, the flexible display 11 is configured as one of the operating members 10 of the input device 100. That is, the input device 100 includes the operation member 10, the electrode substrate 20, and the first branch. The holder 30, the second support 40, and the conductor layer 50. Hereinafter, each element will be described.

(operating member)

The operation member 10 has a laminated structure of the flexible display 11 including the first surface 110 and the second surface 120 and the metal film 12. In other words, the operation member 10 includes a first surface 110 that receives an operation of the user, and a second surface 120 on which the metal film 12 is formed and is opposite to the first surface 110, and is configured in a deformable sheet shape.

The metal film 12 is formed into a deformable sheet shape in accordance with the deformation of the flexible display 11, and is made of, for example, a metal foil such as Cu (copper) or Al (aluminum) or a mesh material. The thickness of the metal film 12 is not particularly limited, and is, for example, several 10 nm to several 10 μm. The metal film 12 is connected to a specific reference potential (for example, a ground potential). Thereby, the metal film 12 exhibits a constant shielding function against electromagnetic waves when it is mounted on the electronic device 70. In other words, for example, it is possible to suppress the intrusion of electromagnetic waves from other electronic components mounted on the electronic device 70 and the leakage of electromagnetic waves from the input device 100, and contribute to the stability of the operation of the electronic device 70.

Further, the constituent material of the metal film 12 is not limited to a metal, and may be, for example, a metal oxide material such as ITO (Indium Tin Oxides) or another conductive material such as carbon.

For example, as shown in FIG. 3, the metal film 12 is formed by attaching the adhesive layer 13 on which the metal foil is formed to the flexible display 11. The material of the layer 13 is not particularly limited as long as it has adhesiveness, and a resin film to which a resin material is applied can also be produced. Alternatively, it may be formed of a vapor deposition film or a sputtering film formed directly on the flexible display 11, or may be a coating film such as a conductive paste printed on the surface of the flexible display 11.

(conductor layer)

The conductor layer 50 constitutes the lowermost portion of the input device 100 and is disposed to face the metal film 12 in the Z-axis direction. The conductor layer 50 also functions as a support plate of the input device 100, for example, in a manner that has a higher flexural rigidity than the operating member 10 and the electrode substrate 20. to make. The conductor layer 50 may be formed of, for example, a metal plate containing a metal material such as an Al alloy or a Mg (magnesium) alloy, or a conductor plate such as a carbon fiber reinforced plastic. Alternatively, the conductor layer 50 may have a laminated structure in which a conductor film such as a plating film, a vapor deposition film, a sputtering film, or a metal foil is formed on an insulator layer such as a plastic material. Further, the thickness of the conductor layer 50 is not particularly limited, and is, for example, about 0.3 mm.

The conductor layer 50 is connected to a specific reference potential (for example, a ground potential). Thereby, the conductor layer 50 functions as an electromagnetic shielding layer when mounted on the electronic device 70. In other words, for example, it is possible to suppress the intrusion of electromagnetic waves from other electronic components mounted on the electronic device 70 and the leakage of electromagnetic waves from the input device 100, and contribute to the stability of the operation of the electronic device 70.

(electrode substrate)

The electrode substrate 20 is composed of a laminate including a first wiring substrate 21 of the first electrode line 210 and a second wiring substrate 22 including the second electrode line 220.

The first wiring substrate 21 includes a first base material 211 (see FIG. 2 ) and a plurality of first electrode lines (X electrodes) 210 . The first base material 211 (first insulating layer) is made of, for example, a flexible sheet, and specifically, PET (Polyethylene Terephthalate, polyethylene terephthalate), PEN (Polyethylene Naphthalate) It is composed of an electrically insulating plastic sheet (film) such as ethylene glycol formate, PC (Poly Carbonate), PMMA (Poly (methyl methacrylate), polymethyl methacrylate), and polyimine. The thickness of the first base material 211 is not particularly limited, and is, for example, several 10 μm to several 100 μm.

The plurality of first electrode wires 210 are integrally provided on one surface of the first base material 211. The plurality of first electrode lines 210 are arranged at a predetermined interval along the X-axis direction, and are formed substantially linearly along the Y-axis direction. The first electrode lines 210 are respectively led out to the edge portions of the first base material 211 and the like, and are respectively connected to different terminals. Further, the first electrode lines 210 are electrically connected to the control unit 60 via the terminals.

Further, each of the plurality of first electrode lines 210 may be composed of a single electrode line, or may be composed of a plurality of electrode groups arranged along the X-axis direction. Also, the plurals constituting each electrode group The strip electrodes may be connected to a common terminal or may be connected by dividing into two or more different terminals.

On the other hand, the second wiring board 22 includes a second base material 221 (see FIG. 2 ) and a plurality of second electrode lines (Y electrodes) 220 . Similarly to the first base material 211, the second base material 221 (second insulating layer) is made of, for example, a flexible sheet, and specifically, electrically insulating such as PET, PEN, PC, PMMA, or polyimide. The plastic sheet (film) and the like. The thickness of the second base material 221 is not particularly limited, and is, for example, several 10 μm to several 100 μm. The second wiring board 22 is disposed to face the first wiring board 21 .

The plurality of second electrode lines 220 are configured in the same manner as the plurality of first electrode lines 210. In other words, the plurality of second electrode wires 220 are integrally provided on one surface of the second base material 221, and are arranged at a predetermined interval along the Y-axis direction, and are formed substantially linearly along the X-axis direction. Further, each of the plurality of second electrode lines 220 may be composed of a single electrode line, or may be composed of a plurality of electrode groups arranged along the Y-axis direction.

The second electrode wires 220 are respectively led out to the edge portions of the second base member 221 and the like, and are respectively connected to different terminals. The plurality of electrode lines constituting each electrode group may be connected to a common terminal, or may be connected to two or more different terminals. Further, the second electrode lines 220 are electrically connected to the control unit 60 via the terminals.

The first electrode wire 210 and the second electrode wire 220 can be formed by a printing method such as screen printing, gravure offset printing, or inkjet printing, or can be patterned by photolithography using a metal foil or a metal layer. Formed by the method. Further, by forming the first and second base materials 211 and 221 from a flexible sheet material, the entire electrode substrate 20 can have a flexible structure.

As shown in FIG. 3, the electrode substrate 20 includes an adhesive layer 23 that bonds the first wiring substrate 21 and the second wiring substrate 22 to each other. Next, the layer 23 is electrically insulating, and is made of, for example, a cured material of an adhesive, an adhesive material such as a tape, or the like.

As described above, in the electrode substrate 20 of the present embodiment, the plurality of first electrode lines The 210 and the plurality of second electrode wires 220 are arranged apart from each other in the thickness direction (Z-axis direction) of the electrode substrate 20. Therefore, the electrode substrate 20 is formed by arranging a plurality of detecting portions 20s (capacitive sensors) formed in a plurality of opposing regions of the plurality of first electrode lines 210 and the plurality of second electrode lines 220 in a matrix. The plurality of detecting portions 20s are formed in intersections of the plurality of first electrode lines 210 and the plurality of second electrode lines 220, respectively.

In the present embodiment, the plurality of first electrode lines 210 are disposed on the side of the operation member 10 of the plurality of second electrode lines 220. However, the plurality of second electrode lines 210 are not limited thereto, and the plurality of second electrode lines 220 may be disposed in plural numbers. The strip first electrode line 210 is on the side of the operation member 10.

(Control Department)

The control unit 60 is electrically connected to the electrode substrate 20 . More specifically, the control unit 60 is connected to each of the plurality of first and second electrode lines 210 and 220 via terminals. The control unit 60 constitutes a signal processing circuit that can generate information on an input operation to the first surface 110 based on the outputs of the plurality of detecting portions 20s. The control unit 60 acquires the capacitance change amount of each detection unit 20s while scanning each of the plurality of detection units 20s at a specific cycle, and generates information on the input operation based on the capacitance change amount.

Typically, the control unit 60 is configured by a computer including a CPU (Central Processing Unit), an MPU (Micro Processor Unit), a memory, and the like. The control unit 60 may be composed of a single wafer component or a plurality of circuit components. The control unit 60 may be mounted on the input device 100 or may be mounted on the electronic device 70 in which the input device 100 is incorporated. In the case of the former, for example, it is mounted on a flexible wiring board connected to the electrode substrate 20. In the latter case, it can also be constructed integrally with the controller 710 of the control electronics 70.

As described above, the control unit 60 includes the calculation unit 61 and the signal generation unit 62, and executes various functions in accordance with a program stored in a memory unit (not shown). The calculation unit 61 calculates an operation position in the XY coordinate system on the first surface 110 based on an electric signal (input signal) output from each of the first and second electrode lines 210 and 220 of the electrode substrate 20, and a signal generation unit. 62 based on the knot An operational signal is generated. Thereby, an image based on the input operation on the first surface 110 can be displayed on the flexible display 11.

The calculation unit 61 shown in FIGS. 3 and 4 calculates the XY coordinates of the operation position of the operator on the first surface 110 based on the output from each of the detection units 20s to which the unique XY coordinates are assigned. Specifically, the calculation unit 61 calculates an intersection region formed between each of the X electrodes and the Y electrodes based on the amount of change in electrostatic capacitance obtained from each of the X electrodes (first electrode line 210) and the Y electrode (second electrode line 220). The amount of change in electrostatic capacitance in each of the detecting portions 20s of the opposing region). The XY coordinates of the operating position of the operator can be calculated from the ratio of the amount of change in the electrostatic capacitance of each of the detecting portions 20s.

For example, the calculation unit 61 is based on an electrode corresponding to the detection electrode (E2) obtained by applying a drive signal to the electrode line corresponding to the drive electrode (E1) of the first and second electrode lines 210 and 220 at a specific cycle. The output of the line is obtained, and the amount of change in capacitance of each detecting portion 20s is obtained. The signal generation unit 62 generates information (control signal) regarding an input operation to the input operation surface based on the output of the calculation unit 61 (the amount of capacitance change of each detection unit 20s).

In the present embodiment, the first electrode line 210 is the drive electrode (E1), and the second electrode line 220 is the detection electrode (E2). Since the driving electrode (E1) has a relatively stable potential compared with the detecting electrode (E2), it is less susceptible to electromagnetic noise than the detecting electrode (E2). From this point of view, the first electrode line 210 also functions as a shield layer that protects the second electrode line 220 from electromagnetic noise.

Further, the calculation unit 61 can determine whether or not the first surface 110 accepts an operation. Specifically, for example, when the amount of change in electrostatic capacitance of the entire detecting unit 20s or the amount of change in electrostatic capacitance of each detecting unit 20s is equal to or greater than a specific threshold value, it can be determined that the first surface 110 is operated. Moreover, by setting the threshold to 2 or more, for example, it is possible to distinguish between a touch operation and an (ideal) pressing operation. Further, the pressing force can be calculated based on the amount of change in the electrostatic capacitance of the detecting portion 20s.

The signal generation unit 62 generates a specific operation letter based on the calculation result of the calculation unit 61. number. The operation signal may also be, for example, an image control signal for generating a display image outputted to the flexible display 11, an operation signal corresponding to a key of a keyboard image displayed at an operation position on the flexible display 11, Or an operation signal or the like corresponding to an operation of a GUI (Graphical User Interface).

Here, in the input device 100, the distance between each of the metal film 12 and the conductor layer 50 and the electrode substrate 20 (detection portion 20s) is changed by the operation on the first surface 110, and includes the first and The second support bodies 30 and 40. Hereinafter, the first and second supports 30 and 40 will be described.

(Basic structure of the first and second supports)

The first support 30 is disposed between the operation member 10 and the electrode substrate 20 . The first support body 30 includes a plurality of first structures 310, a first case 320, and a first space portion 330. In the present embodiment, the first support 30 is bonded to the electrode substrate 20 via the adhesive layer 35 (see FIG. 3). The layer 35 may be an adhesive or may be composed of an adhesive such as an adhesive or a tape.

As shown in FIG. 3, the first support 30 of the present embodiment has a base material 31, a structural layer 32 provided on the surface (upper surface) of the base material 31, and a plurality of joints formed at specific positions on the structural layer 32. The layered structure of the portion 341. The base material 31 is made of an electrically insulating plastic sheet such as PET, PEN or PC. The thickness of the base material 31 is not particularly limited, and is, for example, several μm to several 100 μm.

The structural layer 32 is made of an electrically insulating resin material such as UV (Ultraviolet) resin, and a plurality of first convex portions 321 , second convex portions 322 , and concave portions 323 are formed on the base material 31 . Each of the first convex portions 321 has a shape such as a columnar shape, a columnar shape, or a frustum shape that protrudes in the Z-axis direction, and is arranged on the base material 31 at a predetermined interval. The second convex portion 322 is formed to have a specific width so as to surround the periphery of the base material 31.

Further, although the structural layer 32 is made of a material having rigidity which can be deformed by the input operation on the first surface 110 to the extent that the electrode substrate 20 is deformed, it may be elastically deformable together with the operating member 10 at the time of input operation. Material composition. That is, the elastic modulus of the structural layer 32 is not particularly It is not limited, and can be appropriately selected within a range in which the operational feeling of the target or the detection sensitivity can be obtained.

The concave portion 323 is formed of a flat surface formed between the first and second convex portions 321 and 322. That is, the space region on the concave portion 323 constitutes the first space portion 330. Further, in the present embodiment, the adhesion preventing layer 342 (not shown in FIG. 3) formed of a UV resin having a low adhesiveness or the like is formed on the concave portion 323. The shape of the prevention layer 342 is not particularly limited, and may be formed in an island shape or may be formed of a flat film on the concave portion 323.

Further, a joint portion 341 made of an adhesive resin material or the like is formed on each of the first and second convex portions 321 and 322. In other words, each of the first structures 310 is composed of a laminate of the first protrusions 321 and the joints 341 formed on the first protrusions 321 , and each of the first housings 320 is formed by the second protrusions 322 and the second protrusions 322 . The laminated body 341 on the portion 322 is formed of a laminate. Thereby, the thickness (height) of the first structure body 310 and the first case body 320 is substantially the same, and in the present embodiment, for example, it is in the range of several μm to several hundred μm. In addition, the height of the prevention layer 342 is not particularly limited as long as it is lower than the height of the first structure body 310 and the first case body 320, and is formed to be lower than the first and second convex portions 321 and 322, for example. .

The plurality of first structures 310 are arranged corresponding to the arrangement of the respective detecting units 20s. In the present embodiment, the plurality of first structures 310 are disposed to face the center of each of the plurality of detecting portions 20s in the Z-axis direction, for example, but the present invention is not limited thereto, and may be disposed in relation to each of the plurality of first structures 310. The position of the center offset of the detecting portion 20s. Further, the number of the structures 310 opposed to the respective detecting units 20s is not limited to one, and may be plural.

The first case 320 is formed to surround the periphery of the first support 30 along the circumference of the electrode substrate 20 . The length of the first casing 320 in the short-side direction, that is, the width, is not particularly limited as long as the strength of the first support body 30 and the input device 100 as a whole can be sufficiently ensured.

On the other hand, the second support 40 is disposed between the electrode substrate 20 and the conductor layer 50. The second support 40 includes a plurality of second structures 410 , a second case 420 , and a second space unit 430 .

As shown in FIG. 3, in the second support 40 of the present embodiment, the second structure 410 and the second case 420 are directly formed on the conductor layer 50. The second structure body 410 and the second case body 420 are, for example, It is composed of an adhesive insulating resin material and also functions as a joint between the conductor layer 50 and the electrode substrate 20. The thickness of the second structure 410 and the second case 420 is not particularly limited, and is, for example, several μm to several 100 μm.

The second structures 410 are disposed between the adjacent first structures 310, respectively. In other words, the second structures 410 are disposed between the adjacent detecting portions 20s. The second structure 410 is not limited to this, and the second structure 410 can be disposed to face each of the detecting units 20s.

The second case 420 is formed to surround the periphery of the second support 40 along the circumference of the conductor layer 50. The width of the second case 420 is not particularly limited as long as the strength of the second support 40 and the input device 100 as a whole is sufficiently ensured, and is configured to have substantially the same width as the first case 320.

Further, the second structural body 410 is not particularly limited in its modulus of elasticity as in the structural layer 32 constituting the first structural body 310. In other words, it can be appropriately selected within a range in which the operational feeling or the detection sensitivity of the target can be obtained, or can be formed of an elastic material that can be deformed together with the electrode substrate 20 at the time of the input operation.

Further, the second space portion 430 is formed between the second structures 410 and constitutes a space region around the second structures 410 and the second casing 420. In the present embodiment, the second space portion 430 accommodates each of the detecting portions 20s and each of the first structures 310 when viewed in the Z-axis direction.

As described above, the first and second supports 30 and 40 of the present embodiment include (1) the first and second structures 310 and 410 and the first and second space portions 330 and 430, and (2) from Z. When the axial direction is observed, the first structural body 310 and the second structural body 410 do not overlap each other, and the first structural body 310 is disposed on the second space portion 430.

Therefore, as will be described later, the metal film 12 and the conductor layer 50 can be deformed by a slight pressing force of about several tens of g at the time of operation.

(Operation of the first and second support bodies)

FIG. 5 is a schematic cross-sectional view showing a state in which the force applied to the first and second structures 310 and 410 when the point P on the first surface 110 is pressed downward in the Z-axis direction by the operator h. In the picture The hollow arrow schematically indicates the magnitude of the force pressed downward in the Z-axis direction (hereinafter, simply referred to as "lower"). The deflection of the metal film 12, the electrode substrate 20, and the like, and the elastic deformation of the first and second structures 310 and 410 are not shown in FIG. Furthermore, in the following description, even when the user performs a touch operation that is unintentionally pressed, a slight pressing force is actually added, so that the input operations are collectively referred to as "pressing".

For example, when the point P on the first space portion 330p0 is pressed downward by the force F, the metal film 12 directly under the point P is deflected downward. As a result, the first structures 310p1 and 310p2 adjacent to the first space portion 330p0 receive the force F1 and are elastically deformed in the Z-axis direction to have a slight decrease in thickness. Further, due to the deflection of the metal film 12, the first structures 310p3 and 310p4 adjacent to the first structures 310p1 and 310p2 also receive a force F2 smaller than F1. Further, by applying a force to the electrode substrate 20 by the forces F1 and F2, the region immediately below the first structures 310p1 and 310p2 is deflected downward in the center. As a result, the second structure 410p0 disposed between the first structures 310p1 and 310p2 receives the force F3 and is elastically deformed in the Z-axis direction to have a slight decrease in thickness. Further, the second structure 410p1 disposed between the first structures 310p1 and 310p3 and the second structure 410p2 disposed between the first structures 310p2 and 310p4 also receive a force F4 smaller than F3.

In this manner, the force can be transmitted in the thickness direction by the first and second structures 310 and 410, and the electrode substrate 20 can be easily deformed. Moreover, the deflection of the metal film 12 and the electrode substrate 20 is affected by the pressing force in the in-plane direction (the direction parallel to the X-axis direction and the Y-axis direction), and the force can affect not only the operation sub-h The area immediately below can also affect the first and second structures 310 and 410 in the vicinity thereof.

Further, in the above (1), the metal film 12 and the electrode substrate 20 can be easily deformed by the first and second space portions 330 and 430. Further, the electrode substrate 20 can be flexibly deflected by the pressure higher than the pressing force of the operator h by the first and second structures 310 and 410 formed of a column or the like.

Further, in the above (2), since the first and second structures 310 and 410 are arranged so as not to overlap each other when viewed in the Z-axis direction, the first structure 310 can be connected to the second space 430 below the electrode. The substrate 20 is easily deflected.

An example of the amount of change in the electrostatic capacitance of the detecting portion 20s at the time of the specific operation will be described below.

(Output example of detection unit)

15A and FIG. 15B are schematic main cross-sectional views showing an aspect of the input device 100 when the first surface 110 is operated by the operation sub-h, and an example of an output signal outputted from the detection unit 20s at this time. The histograms shown along the X-axis in FIGS. 15A and 15B schematically show the amount of change in capacitance from the reference value in each detecting unit 20s. In addition, FIG. 15A shows a state in which the operator h is pressed against the first structure body 310 (310a2), and FIG. 15B shows a state in which the operator h is pressed against the first space portion 330 (330b1).

In FIG. 15A, the first structure body 310a2 directly under the operation position is most stressed, and the first structure body 310a2 itself is elastically deformed and displaced downward. The detection unit 20sa2 directly below the first structure body 310a2 is displaced downward by the displacement. Thereby, the detecting portion 20sa2 and the conductor layer 50 are close to each other via the second space portion 430a2. In other words, the distance between the detecting portion 20sa2 and the metal film 12 slightly changes, and the distance from the conductor layer 50 largely changes, thereby obtaining the amount of change Ca2 in the electrostatic capacitance. On the other hand, the first structures 310a1 and 310a3 are slightly displaced downward by the influence of the deflection of the metal film 12, and the amounts of change in the capacitances in the detecting portions 20sa1 and 20sa3 are Ca1 and Ca3, respectively.

In the example shown in Fig. 15A, Ca2 is the largest, and Ca1 and Ca3 are substantially the same and smaller than Ca2. That is, as shown in FIG. 15A, the amounts of change Ca1, Ca2, and Ca3 of the capacitance indicate the distribution of the mountain shape with the apex of Ca2. In this case, the calculation unit 61 can calculate the center of gravity or the like based on the ratio of Ca1, Ca2, and Ca3, and calculate the XY coordinates on the detection unit 20sa2 as the operation position.

On the other hand, in FIG. 15B, the first structures 310b1 and 310b2 in the vicinity of the operation position are slightly elastically deformed by the deflection of the metal film 12, and are displaced downward. By This displacement causes the electrode substrate 20 to be deflected, and the detection portions 20sb1 and 20sb2 directly below the first structures 310b1 and 310b2 are displaced downward. Thereby, the detecting portions 20sb1 and 20sb2 are close to the conductor layer 50 via the second space portions 430b1 and 430b2. In other words, the distance between the detecting portions 20sb1 and 20sb2 and the metal film 12 is slightly changed, and the distance from the conductor layer 50 is relatively changed, and the amounts of change Cb1 and Cb2 of the capacitance are obtained, respectively.

In the example shown in Fig. 15B, Cb1 and Cb2 are substantially the same. Thereby, the calculation unit 61 can calculate the XY coordinates between the detection units 20sb1 and 20sb2 as the operation positions.

As described above, according to the present embodiment, since the thicknesses of the detecting portion 20s and the metal film 12, the detecting portion 20s, and the conductor layer 50 are both variable by the pressing force, the amount of change in the electrostatic capacitance in the detecting portion 20s can be further increased. Thereby, the detection sensitivity of the input operation can be improved.

Further, even if the operation position on the flexible display 11 is any point on the first structure body 310 or the first space portion 330, the XY coordinates of the operation position can be calculated. In other words, when the metal film 12 is subjected to the pressing force in the in-plane direction, not only the capacitance of the detecting portion 20s directly below the operation position is changed, but also the detecting portion near the operating position when viewed from the Z-axis direction. The electrostatic capacitance changes in 20s. Thereby, unevenness in detection accuracy in the first surface 110 can be suppressed, and high detection accuracy on the entire first surface 110 can be maintained.

(Shield)

Further, the flexible display 11 constituting the operating member 10 is driven and controlled by the controller 710 as described above. The flexible display 11 typically displays an image in-plane by controlling the illumination of a plurality of pixels arranged in a matrix. At this time, there is a case where the pixel circuit that drives each pixel generates electromagnetic noise of a level that cannot be ignored by the sensing device 1.

As described above, the sensing device 1 is configured to detect the input operation surface in accordance with the change in the electrostatic capacitance of the detecting portion 20s based on the change in the opposing distance with respect to the metal film 12 and the conductor layer 50 (1st) The operating position and the amount of operation (pressure) of the surface 110). Therefore, when the electromagnetic noise is intruded into the detecting unit 20s, the detection accuracy of the capacitance change amount of the detecting unit 20s is lowered, and the smaller the capacitance change amount, the more remarkable the problem.

On the other hand, a certain mask function can be ensured by the metal film 12 disposed between each of the detecting portions 20s and the flexible display 11. However, since the metal film 12 must be formed to have a thickness that can be deformed following the input operation to the input operation surface (the first surface 110), the thickness of the electromagnetic noise can be surely prevented. As described above, the input device for the electrostatic detection input operation must have a structure that can sufficiently protect the detecting portion 20s from electromagnetic noise when the detection accuracy is improved.

Therefore, the sensing device 1 of the present embodiment includes the shield layer S1 for electromagnetically shielding the electrode lines constituting the detecting portion 20s from the noise source. As shown in FIGS. 2 and 3, the shield layer S1 is provided on the electrode substrate 20.

The shield layer S1 is composed of a conductor film provided on the first base material 211 supporting the plurality of first electrode lines 210. In the present embodiment, the shield layer S1 is provided on the first substrate 211 on the same plane as the plurality of first electrode lines 210. Thereby, the shield layer S1 can be formed without separately providing a member that supports the shield layer S1. Further, since the shield layer S1 is made of the same material as the plurality of first electrode lines 210, the first electrode line and the shield layer S1 can be formed by the same procedure.

7 is a plan view of a main portion of the electrode substrate 20, FIG. 8 is a plan view of a main portion of the first wiring substrate 21, and FIG. 9 is a plan view of a main portion of the second wiring substrate 22.

In the illustrated example, the first and second electrode lines 210 and 220 are each composed of an electrode line group including a plurality of electrode thin lines. However, the present invention is not limited thereto, and may be composed of a single wide electrode line.

In the present embodiment, the shield layer S1 includes a plurality of electrode lines S11 (third electrode lines) disposed between each of the plurality of first electrode lines 210. The plurality of electrode lines S11 and the first electrode lines 210 are arranged with a specific gap therebetween. The plurality of electrode lines S11 are formed to have the same width, and the length of each of the electrode lines S11 is formed to be substantially equal to the length of the first electrode line 210. The plurality of electrode lines S11 are connected to a specific reference potential (for example, a ground potential) in the same manner as the metal film 12 and the conductor layer 50, respectively.

According to the above configuration, the plurality of second electrode lines 220 are observed from the flexible display 11 At this time, the wiring region 220b between the plurality of detecting portions 20s (opposing regions of the first electrode wires 210 and the second electrode wires 220) is shielded by the shield layer S1 (electrode wires S11). Thereby, the wiring region 220b is electromagnetically shielded from the flexible display 11.

Each of the electrode wires S11 can be formed into a conductive paste by a printing method such as screen printing, gravure offset printing, or inkjet printing, or a material such as a metal foil, a metal layer or a transparent conductive film such as ITO, or a conductor material such as a carbon material can be used. Formed by a patterning method of photolithography. The thickness of each electrode wire S11 is not particularly limited, and is typically formed to have a thickness equal to that of the first electrode wire 210 (for example, 10 nm to 10 μm).

Each electrode line S11 is not limited to the example formed by the same step as the first electrode line 210. Further, each of the electrode lines S11 may be made of a material different from the first electrode line 210, or may be formed thicker than the thickness of the first electrode line 210.

The area in which the wiring region 220b is shielded by the shield layer S1 is adjusted by the width of each electrode line S11 constituting the shield layer S1. Since the shield layer S1 is formed on the same plane as the first electrode line 210, a part of the wiring region 220b is shielded by the shield layer S1.

In order to shield the entire area of the wiring region 220b by the shield layer S1, for example, an insulating film covering the first electrode line 210 may be separately formed, and a shield layer may be provided on the insulating film. At this time, it is also possible to cover at least a part of the wiring region of the first electrode line 210 between the plurality of detecting portions 20s by the shield layer. In this case, the shield layer may be formed of a grid-shaped conductor film that is opened in a region opposed to the plurality of detecting portions 20s.

FIG. 10A is a plan view schematically showing the entire first wiring board 21. The shield layer S1 further includes a wiring portion S12 that connects the plurality of electrode lines S11 to each other. The wiring portion S12 is connected to the plurality of electrode lines S11 on the edge portion 21a on the long side of one of the first wiring boards 21. The wiring portion S12 is pulled to the edge portion 21c on the other long side of the other side via the edge portion 21b on the short side of the one side of the first wiring substrate 21. A lead line S12a connected to the wiring portion S12 is formed in the edge portion 21c, and is connected to a specific reference potential (ground potential) via the control portion 60. By this, The plurality of electrode lines S11 disposed between the plurality of first electrode lines 210 are commonly connected to the ground potential.

Further, a lead line 210a connected to each of the plurality of first electrode lines 210 is formed on the edge portion 21c of the first wiring board 21, and each of the first electrode lines 210 is connected to the control unit 60 via the lead lines 210a.

Although not shown, the second wiring board 22 is provided with lead lines that are connected to each of the plurality of second electrode lines 220, and the lead lines are typically formed on the short side of one of the second wiring boards 22. unit. Therefore, in order to cover at least a part of the lead wires of the second electrode wires 220 (the outer peripheral wiring portions are formed on the outer side of the detection region in which the plurality of detecting portions 20s are formed), it is protected from electromagnetic noise. As shown in FIG. 10B, the lead line is shielded by the shield layer S provided on the first wiring substrate 21.

FIG. 10B is a plan view showing a first wiring board showing a variation of the configuration of the shield layer S1. The shield layer S1 further includes a strip portion S11b formed on the edge portion 21b of the first wiring substrate 21. The strip portion S11b is connected between the wiring portion S12 and the lead line S12a, and is three-dimensionally covered with a region between the electrode line 210b on the side closest to the edge portion 21b of the plurality of first electrode lines 210 and the edge portion. Thereby, the outer peripheral wiring portion of the second electrode line 220 located directly under the strip portion S11b can be protected from electromagnetic noise.

Here, as one of the devices that affect the detection sensitivity of the sensing device 1, a flexible display 11 can be cited. When the metal film 12, the conductor layer 50, and the shield layer S1 are connected only to the control unit 60, the flexible display 11 may affect the ground potential of the control unit 60, and the electromagnetic shielding may not be sufficiently exhibited. Cover effect. Therefore, by connecting the metal film 12, the conductor layer 50, and the shield layer S1 to the ground of the controller 710 connected to the flexible display 11, the ground potential can be maintained more stably, and the electromagnetic shielding effect can be improved. Further, even if the metal film 12, the conductor layer 50, and the shield layer S1 are connected by more contacts, the electromagnetic shielding effect can be improved.

<Second embodiment>

Next, a second embodiment of the present technology will be described.

In the first embodiment, the plurality of first electrode lines and the plurality of second electrode lines are spaced apart from each other in the thickness direction of the electrode substrate, and a plurality of detecting portions are formed at intersections of the electrode lines (capacitive sense) Detector). On the other hand, in the present embodiment, the plurality of first electrode lines and the plurality of second electrode lines are spaced apart from each other in the surface of the electrode substrate, and a plurality of detecting portions (capacitors) are formed in the opposing regions of the electrode lines. Sensor).

Fig. 11A is a schematic cross-sectional view of an input device 100C according to a second embodiment of the present technology, and Fig. 11B is a cross-sectional view showing an enlarged main portion of the input device 100C. The present embodiment is different from the first embodiment in that the electrode substrate 20C electrostatically detects a change in the distance from each of the metal film 12 and the conductor layer 50 in accordance with the amount of change in capacitive coupling in the XY plane. In other words, the Y electrode 220C includes an opposing portion that faces the X electrode 210C in the in-plane direction of the electrode substrate 20C, and the opposing portion constitutes the detecting portion 20Cs.

The electrode substrate 20C includes a substrate 211C in which a plurality of first electrode lines (X electrodes) 210C and a plurality of second electrode lines (Y electrodes) 220C are disposed, and the plurality of X electrodes 210C and Y electrodes 220C are disposed on the same plane. .

An example of the configuration of the X electrode (first electrode line) 210C and the Y electrode (second electrode line) 220C will be described with reference to FIGS. 12A and 12B. Here, an example is shown in which each of the X electrodes 210C and each of the Y electrodes 220C includes a plurality of unit electrode bodies (first unit electrode bodies) 210m having a comb shape and a plurality of unit electrode bodies (second unit electrode bodies) 220m. Each of the unit electrode bodies 210m and one unit electrode body 220m forms each of the detecting portions 20Cs.

As shown in FIG. 12A, the X electrode 210C includes a plurality of unit electrode bodies 210m, electrode line portions 210p, and a plurality of connection portions 210z. The electrode line portion 210p extends in the Y-axis direction. The plurality of unit electrode bodies 210m are arranged at a fixed interval in the Y-axis direction. The electrode line portion 210p is disposed at a predetermined interval from the unit electrode body 210m, and is connected to each other by the connection portion 210z.

As described above, the unit electrode body 210m has a comb shape as a whole. Specifically, the unit The electrode body 210m includes a plurality of auxiliary electrodes 210w and a joint portion 210y. A plurality of auxiliary electrodes 210w extend in the X-axis direction. The adjacent auxiliary electrodes 210w are spaced apart by a specific interval. One end of the plurality of auxiliary electrodes 210w is connected to the joint portion 210y extending in the X-axis direction.

As shown in FIG. 12B, the Y electrode 220C includes a plurality of unit electrode bodies 220m, electrode line portions 220p, and a plurality of connecting portions 220z. The electrode wire portion 220p extends in the X-axis direction. The plurality of unit electrode bodies 220m are arranged at a fixed interval in the X-axis direction. The electrode line portion 220p is disposed at a predetermined interval from the unit electrode body 220m, and is connected to each other by the connection portion 220z. Further, the configuration in which the unit electrode body 220m is directly provided on the electrode line portion 220p may be employed by omitting the connection portion 220z.

As described above, the unit electrode body 220m has a comb shape as a whole. Specifically, the unit electrode body 220m includes a plurality of auxiliary electrodes 220w and a connecting portion 220y. A plurality of auxiliary electrodes 220w extend in the X-axis direction. The adjacent auxiliary electrodes 220w are spaced apart by a specific interval. One end of the plurality of auxiliary electrodes 220w is connected to the joint portion 220y extending in the Y-axis direction.

As shown in FIG. 13A, each detecting unit 20Cs is formed in a region where each unit electrode body 210m and each unit electrode body 220m are combined with each other. The plurality of auxiliary electrodes 210w of the unit electrode body 210m and the plurality of auxiliary electrodes 220w of the unit electrode body 220m are alternately arranged in the Y-axis direction. In other words, the auxiliary electrodes 210w and 220w are arranged to face each other in the in-plane direction (for example, the Y-axis direction) of the electrode substrate 20C.

Figure 13B is a cross-sectional view as seen from the direction of A-A of Figure 13A. The Y electrode 220C is provided to intersect the X electrode 210C as in the first embodiment, but is formed on the same plane as the X electrode 210C. Therefore, as shown in FIG. 13B, the region where the X electrode 210C and the Y electrode 220C intersect is configured such that each of the X electrodes 210C and the Y electrodes 220C are not in direct contact with each other. That is, the insulating layer 220r is provided on the electrode line portion 210p of the X electrode 210C and the electrode line portion 220p of the Y electrode 220C. And, in a region where the X electrode 210C and the Y electrode 220C intersect, to cross the The jumper wiring portion 220q is provided in the form of the insulating layer 220r. The electrode line portion 220p is connected by the jumper wiring portion 220q.

Fig. 14 is a schematic cross-sectional view for explaining the configuration of the detecting unit 20Cs of the embodiment. In the example shown in the figure, in the detecting portion 20Cs, the auxiliary electrode 210w1 and the auxiliary electrode 220w1, the auxiliary electrode 220w1 and the auxiliary electrode 210w2, the auxiliary electrode 210w2 and the auxiliary electrode 220w2, the auxiliary electrode 220w2 and the auxiliary electrode 210w3, and the auxiliary electrode 210w3 are The auxiliary electrodes 220w3 are respectively capacitively coupled. In other words, the substrate 211C is used as a dielectric layer, and the capacitances Cc11, Cc12, Cc13, Cc14, and Cc15 between the auxiliary electrodes can be based on the first of the metal film 12 and the conductor layer 50 and the first electrode including the auxiliary electrode. The second electrode lines 210C and 220C are capacitively coupled to each other.

According to the above configuration, the second substrate and the subsequent layer of the electrode substrate are not required, and the thickness of the input device 100C can be reduced. Further, the plurality of auxiliary electrodes are capacitively coupled to each other, and the distance between the auxiliary electrodes of the capacitive coupling can be shortened. Thereby, the capacitive coupling amount of the entire input device 100C can be increased, and the detection sensitivity can be improved.

Further, the sensing device of the present embodiment includes a shield layer S2 for electromagnetically shielding the electrode lines constituting the detecting portion 20Cs from the noise source. As shown in FIGS. 15A to 15C, the shield layer S2 is provided on the electrode substrate 20C.

Fig. 15A is a plan view showing a principal part of a substrate 20C, Fig. 15B is a cross-sectional view taken along line B1-B1 of Fig. 15A, and Fig. 15C is a cross-sectional view taken along line C1-C1 of Fig. 15A.

As shown in FIG. 15A, the shield layer S2 includes a first conductor film S21 covering the electrode line portion 210p of the first electrode line 210C, and a second conductor film S22 covering the electrode line portion 220p of the second electrode line 220C. At least part. The electrode line portions 210p and 220p correspond to a wiring region connecting the first and second electrode lines 210 and 220 between the plurality of detecting portions 20Cs.

Further, the shield layer S2 includes an insulating film disposed between the first conductor film S21 and the electrode line portion 210p, and an insulating film disposed between the second conductor film S22 and the electrode line portion 220p. Each of the insulating films of the present embodiment corresponds to an insulating layer covering the electrode line portions 210p and 220p. 220r.

That is, the shield layer S2 of the present embodiment is provided on the same plane as the jumper wiring portion 220q and the insulating layer 220r. The first and second conductor films S21 and S22 are provided on the same plane as the jumper wiring portion 220q. Therefore, by forming the first and second conductor films S21 and S22 by the same material as the jumper wiring portion 220q, the first and second conductor films S21 and S22 and the jumper wiring portion 220q can be formed in the same step. In other words, in this example, after the first electrode line 210C and the second electrode line 220C are formed, the intersection of the first electrode line 210C and the second electrode line 220C can be simultaneously formed in the jumper wiring portion 220q and the first The insulating layer 220r between the electrode lines 210C and the insulating layer 220r covering the first electrode line 210C and the second electrode line 220C. Further, the jumper wiring portion 220q and the first and second conductor films S21 and S22 can be formed simultaneously. The formation method is not particularly limited, and a printing method such as screen printing can be typically applied.

In addition, in order to avoid electrical contact between the first and second conductor films S21 and S22 and the jumper wiring portion 220q, the shield layer S2 includes an opening S20 through which the jumper wiring portion 220q is exposed. Of course, the present invention is not limited thereto, and the masking effect may be improved by covering the wiring portion 220q with the shield layer S. In this case, the constitution of the shield layer S3 shown in Figs. 16A to 16C can be employed.

Fig. 16A is a plan view of a main portion of an electrode substrate 20C, Fig. 16B is a cross-sectional view taken along line B2-B2 of Fig. 16A, and Fig. 16C is a cross-sectional view taken along line C2-C2 of Fig. 16A.

In this example, after the jumper wiring portion 220q is formed, the insulating film 220r1 covering the jumper wiring portion 220q is formed, and the first and second conductor films S21 and S22 are formed on the insulating film 220r1. That is, the shield layer S3 of this example includes the first and second conductor films S21 and S22, and the insulating film 220r1 disposed between the conductor films S21 and S22 and the electrode line portions 210p and 220p.

While the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications may be made without departing from the spirit and scope of the invention.

For example, in the first embodiment described above, the first electrode line 210 is configured by a linear electrode line or an electrode line group. However, the present invention is not limited thereto, and electrodes of various shapes may be employed.

For example, as shown in FIG. 17, the first electrode lines 210D may also include a plurality of unit electrode bodies 210Dm. The unit electrode body 210Dm is formed in an opposing region that intersects with the second electrode line, and constitutes a capacitance sensor. The unit electrode body 210Dm of the X electrode 210D is composed of a plurality of auxiliary electrodes, but may be composed of a flat solid electrode.

The configuration of the unit electrode body is not limited to the above example, and various forms shown in, for example, FIGS. 18(A) to (P) can be employed.

Similarly to the plurality of second electrode lines 220, the electrode lines 220D each composed of a plurality of electrode lines including a plurality of electrode thin lines may be used as shown in FIG. 19A, or may be plural as shown in FIG. 19B. The electrode line 220E of the unit electrode body. Alternatively, it may be composed of a single electrode line 220F as shown in Fig. 19C.

Further, the shield layers S1 and S2 for shielding the detecting portion 20s from electromagnetic noise are disposed between the flexible display 11 and the detecting portion 20s, but the noise source is present on the conductor layer 50 side ( For example, when a wiring board such as a driving circuit of an input device is provided, a shielding layer may be disposed on the back side of the electrode substrate.

Further, in the above embodiments, the configuration in which the electrode substrate 20 is supported by the pair of supports 30 and 40 has been described. However, the electrode substrate 20 may be supported by only one of the supports. FIG. 20 shows an example of the configuration of an input device in which the second support 40 is omitted.

Further, in the above embodiments, the input device including the first and second supports 30 and 40 has been described as an example. However, the present technology is also applicable to an input device including only one of the supports. Or an input device that does not have any support.

Further, although the flexible display 11 has been described as an example of the operation member 10, the present invention is not limited thereto, and the present technology is also applicable to, for example, a keyboard on which a key sequence is displayed.

Furthermore, the present technology can also obtain the following constitution.

(1) A sensing device comprising: The electrode substrate includes a plurality of first electrode lines and a plurality of second electrode lines, and a plurality of capacitive sensations respectively formed in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines The detectors are arranged in a matrix; and the shielding layer is disposed on the electrode substrate and includes a conductor film that shields at least a part of the wiring regions connecting the plurality of second electrode lines between the plurality of opposing regions.

(2) The sensing device according to (1) above, wherein the plurality of first electrode lines and the plurality of second electrode lines are arranged apart from each other in a thickness direction of the electrode substrate, and the plurality of capacitance sensors Each of the plurality of first electrode lines and the plurality of second electrode lines intersects each other.

(3) The sensor device according to (2), wherein the electrode substrate includes: a first insulating layer supporting the plurality of first electrode lines; and a second insulating layer supporting the plurality of second electrode lines; The shield layer is provided on the first insulating layer.

(4) The sensing device according to (3) above, wherein the shielding layer is provided on a same plane as the plurality of first electrode lines.

(5) The sensing device according to any one of (2) to (4) wherein the conductor film is made of the same material as the plurality of first electrode lines.

(6) The sensing device according to any one of (2) to (5), wherein the conductor film includes a plurality of third electrode lines disposed between each of the plurality of first electrode lines.

(7) The sensing device according to (6) above, wherein the conductor film further includes a wiring portion that connects the plurality of third electrode lines to each other.

(8) The sensing device according to (1) above, wherein the plurality of capacitance sensors are respectively formed on the plurality of first electrode lines and the plurality of strips facing each other in an in-plane direction of the electrode substrate In the opposing region of the electrode line, the shield layer further includes an insulating film disposed between the conductor film and the wiring region.

(9) The sensing device according to (8) above, wherein the electrode substrate includes a plurality of jumper wiring portions provided at an intersection of the plurality of first electrode lines and the plurality of second electrode lines.

(10) The sensing device according to (9) above, wherein the conductor film is provided on a same plane as the plurality of jumper wiring portions.

(11) The sensing device according to (9) above, wherein the shielding layer covers the plurality of jumper wiring portions.

(12) The sensing device according to any one of (9) to (11), wherein the conductor film is made of the same material as the plurality of jumper wiring portions.

The sensing device according to any one of (1) to (12), wherein the shielding layer further shields at least a part of the wiring regions connecting the plurality of first electrode lines between the plurality of opposing regions.

The sensing device according to any one of the above-mentioned (1), wherein the plurality of second electrode lines include outer peripheral wiring portions formed in the plurality of the plurality of rows arranged in a matrix The outer side of the detection area of the capacitance sensor; and the shielding layer further shields at least a portion of the outer peripheral wiring portion.

(15) The sensing device according to any one of (1) to (14) further comprising: a deformable first conductor layer disposed to face one of the electrode substrates; and the first a support comprising a connection between the first conductor layer and the electrode substrate Several first structures.

(16) The sensing device according to (15) above, further comprising: a second conductor layer disposed to face the other main surface of the electrode substrate; and a second support including a second conductor a plurality of second structures between the layer and the electrode substrate.

10‧‧‧Operating components

11‧‧‧Flexible display

12‧‧‧Metal film

13‧‧‧Next layer

20‧‧‧Electrode substrate

20s‧‧‧Detection Department

21‧‧‧1st wiring substrate

22‧‧‧2nd wiring substrate

23‧‧‧Next layer

30‧‧‧1st support

31‧‧‧Substrate

32‧‧‧Structural layer

35‧‧‧Next layer

40‧‧‧2nd support

50‧‧‧ conductor layer

60‧‧‧Control Department

61‧‧‧ Computing Department

62‧‧‧Signal Generation Department

100‧‧‧ input device

110‧‧‧1st

120‧‧‧2nd

210‧‧‧1st electrode line

220‧‧‧2nd electrode line

310‧‧‧1st structure

320‧‧‧1st housing

321‧‧‧1st convex

322‧‧‧2nd convex

323‧‧‧ recess

330‧‧‧First Space Department

341‧‧‧ joints

410‧‧‧2nd structure

420‧‧‧ second housing

430‧‧‧2nd Space Department

S1‧‧‧Shield

Claims (18)

A sensing device includes an electrode substrate including a plurality of first electrode lines and a plurality of second electrode lines, and is formed by a plurality of the plurality of first electrode lines and the plurality of second electrode lines a plurality of capacitive sensors in the opposite region are arranged in a matrix; and a shielding layer is disposed on the electrode substrate and includes a conductor film that shields the plurality of the plurality of opposing regions from the plurality of opposing regions At least a portion of the wiring area of the electrode line. The sensing device according to claim 1, wherein the plurality of first electrode lines and the plurality of second electrode lines are disposed apart from each other in a thickness direction of the electrode substrate, and the plurality of capacitance sensors are respectively formed in the above An intersection of the plurality of first electrode lines and the plurality of second electrode lines. The sensing device of claim 2, wherein the electrode substrate comprises: a first insulating layer supporting the plurality of first electrode lines; and a second insulating layer supporting the plurality of second electrode lines; and the shielding layer The first insulating layer is provided on the first insulating layer. The sensing device of claim 3, wherein the shielding layer is disposed on a same plane as the plurality of first electrode lines. The sensing device of claim 2, wherein the conductor film is made of the same material as the plurality of first electrode lines. The sensing device of claim 2, wherein the conductor film includes a plurality of third electrode lines disposed between each of the plurality of first electrode lines. The sensing device according to claim 6, wherein the conductor film further includes a wiring portion that connects the plurality of third electrode lines to each other. The sensing device of claim 1, wherein the plurality of capacitance sensors are respectively formed on the plurality of first electrode lines and the plurality of second electrode lines that face each other in an in-plane direction of the electrode substrate The shielding layer further includes an insulating film disposed between the conductor film and the wiring region. The sensing device according to claim 8, wherein the electrode substrate includes a plurality of jumper wiring portions provided at an intersection of the plurality of first electrode lines and the plurality of second electrode lines. The sensing device of claim 9, wherein the conductor film is disposed on a same plane as the plurality of jumper wiring portions. The sensing device of claim 9, wherein the shielding layer covers the plurality of jumper wiring portions. The sensing device of claim 9, wherein the conductor film is made of the same material as the plurality of jumper wiring portions. The sensing device of claim 1, wherein the shielding layer further shields at least a portion of the wiring area connecting the plurality of first electrode lines between the plurality of opposing regions. The sensing device of claim 1, wherein the plurality of second electrode lines include a peripheral wiring portion formed on an outer side of a detection region in which the plurality of capacitance sensors arranged in a matrix are formed; The shielding layer further shields at least a portion of the outer peripheral wiring portion. The sensing device of claim 1, further comprising: a deformable first conductor layer disposed to face one of the electrode substrates; and a first support including a connection between the first conductor layer and a plurality of first structures between the electrode substrates. The sensing device of claim 15, further comprising: a second conductor layer disposed to face the other main surface of the electrode substrate; and a second support including a second conductor layer and the electrode A plurality of second structures between the substrates. An input device comprising: an operation member including an input operation surface; and an electrode substrate including a plurality of first electrode lines and a plurality of second electrode lines, and respectively formed on the plurality of first electrode lines and the plural a plurality of capacitive sensors in a plurality of opposing regions of the second electrode line are arranged in a matrix; and a shielding layer disposed between the operating member and the electrode substrate and including a conductor film, the conductive film shielding And connecting at least a part of the wiring regions of the plurality of second electrode lines between the plurality of opposing regions. An electronic device comprising: a display element including an input operation surface; and an electrode substrate including a plurality of first electrode lines and a plurality of second electrode lines, and respectively formed on the plurality of first electrode lines and the plurality of a plurality of capacitive sensors in a plurality of opposing regions of the second electrode line are arranged in a matrix; and a shielding layer disposed between the display element and the electrode substrate and including a conductor film, the conductive film shielding And connecting at least a part of the wiring regions of the plurality of second electrode lines between the plurality of opposing regions.