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TW201519546A - Short circuit component, and short circuit - Google Patents

Short circuit component, and short circuit Download PDF

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Publication number
TW201519546A
TW201519546A TW103126866A TW103126866A TW201519546A TW 201519546 A TW201519546 A TW 201519546A TW 103126866 A TW103126866 A TW 103126866A TW 103126866 A TW103126866 A TW 103126866A TW 201519546 A TW201519546 A TW 201519546A
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TW
Taiwan
Prior art keywords
electrode
short
conductor
electrodes
fusible
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TW103126866A
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Chinese (zh)
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TWI653796B (en
Inventor
米田吉弘
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迪睿合股份有限公司
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Publication of TW201519546A publication Critical patent/TW201519546A/en
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Publication of TWI653796B publication Critical patent/TWI653796B/en

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    • H02J7/60
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/572Means for preventing undesired use or discharge
    • H01M50/574Devices or arrangements for the interruption of current
    • H01M50/581Devices or arrangements for the interruption of current in response to temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/74Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00Safety devices for primary or secondary batteries
    • H01M2200/10Temperature sensitive devices
    • H01M2200/103Fuse
    • H02J7/61
    • H02J7/63
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Fuses (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Power Engineering (AREA)
  • Protection Of Static Devices (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

An object of the present invention is to implement a bypass element whereby, even with a weak current path, an open circuit is short-circuited with a blowout of a fusible conductor resulting from heating of a heat emitting body. A bypass element comprises: an insulation substrate (10); a heat emitting body (17); first and second electrodes (11, 12) which are mutually adjacent; a third electrode (13) which is adjacent to the first electrode (11); a fourth electrode (14) which is adjacent to the second electrode (12); a first fusible conductor (21) which is mounted across the first and third electrodes (11, 13); a second fusible conductor (22) which is mounted across the second and fourth electrodes (12, 14); a fifth electrode (15) which is connected to the heat emitting body (17); a sixth electrode (16) which is adjacent to the fifth electrode (15); and a third fusible conductor (23) which is mounted across the fifth and sixth electrodes (15, 16). The first and second fusible conductors (21, 22) are blown out by the heat emitting body (17), and the first and second electrodes (11, 12) are short-circuited by the fused conductor thereacross.

Description

短路元件、及短路電路 Short circuit component, and short circuit

本發明係關於藉由電氣訊號使開放狀態之電源線或訊號線物理且電氣短路之短路元件、及短路電路。本申請案係以在日本於2013年8月7日申請之日本專利申請號特願2013-164616為基礎主張優先權,參照此申請並援用於本申請案。 The present invention relates to a short-circuiting element and a short-circuiting circuit that physically and electrically short-circuit a power supply line or a signal line in an open state by an electrical signal. The present application claims priority on the basis of Japanese Patent Application No. 2013-164616, filed on Jan.

大多數可充電反覆利用之二次電池被加工成電池包並供應給使用者。尤其是重量能量密度高之鋰離子二次電池,為了確保使用者及電子機器之安全,一般而言,將過充電保護、過放電保護等數個保護電路內設於電池包,具有在既定情形遮斷電池包之輸出之功能。 Most rechargeable secondary batteries are processed into battery packs and supplied to the user. In particular, in order to ensure the safety of users and electronic equipment, lithium ion secondary batteries having a high weight and energy density are generally provided in a battery pack such as overcharge protection and overdischarge protection. The function of interrupting the output of the battery pack.

此種保護元件,會有使用內設於電池包之FET開關進行輸出之ON/OFF,據以進行電池包之過充電保護或過放電保護動作之情形。然而,在因某種原因而使FET開關短路損壞之情形、或被施加雷電突波等而大電流瞬間流過之情形、或因電池單元之壽命使得輸出電壓異常降低、或相反地輸出過大之異常電壓之情形時,仍必須保護電池包或電子機器免於受到起火等意外之影響。因此,為了在上述可假設之任一異常狀態下皆能安全地遮斷電池單元之輸出,係使用由保險絲元件構成之保護元件,該保險絲元件具有以來自外部之訊號遮斷電流路徑之功能。 Such a protection element may be turned ON/OFF using an FET switch built in a battery pack to perform an overcharge protection or an overdischarge protection operation of the battery pack. However, in the case where the FET switch is short-circuited and damaged for some reason, or a large current flows instantaneously when a lightning surge or the like is applied, or the output voltage is abnormally lowered due to the life of the battery unit, or vice versa. In the case of abnormal voltage, it is still necessary to protect the battery pack or electronic equipment from accidents such as fire. Therefore, in order to safely interrupt the output of the battery unit in any of the above-mentioned abnormal states, a protection element composed of a fuse element having a function of interrupting the current path with an external signal is used.

作為適於鋰離子二次電池等之保護電路之保護元件,如專利 文獻1記載,將可熔導體跨接於電流路徑上之第1電極、發熱體引出電極、第2電極間而構成電流路徑之一部分,將此電流路徑上之可熔導體藉由過電流導致之自體發熱或設在保護元件內部之發熱體熔斷。此種保護元件,藉由使熔融後之液體狀可熔導體聚集在與發熱體相連之導體層上以遮斷電流路徑。 As a protective element suitable for a protection circuit of a lithium ion secondary battery or the like, such as a patent In Document 1, it is described that a soluble conductor is bridged between a first electrode on a current path, a heating element extraction electrode, and a second electrode to form a part of a current path, and the fusible conductor on the current path is caused by an overcurrent. The self-heating or the heating element provided inside the protective element is blown. Such a protective element blocks the current path by collecting the molten liquid fusible conductor on the conductor layer connected to the heat generating body.

專利文獻1:日本特開2010-003665號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-003665

專利文獻2:日本特開2004-185960號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2004-185960

專利文獻3:日本特開2012-003878號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2012-003878

此外,近年來,使用電池與馬達之HEV(Hybrid Electric Vehicle)或EV(Electric Vehicle)急速地普及。作為HEV或EV之動力源,從能量密度與輸出特性考量逐漸使用鋰離子二次電池。在汽車用途上,必須要高電壓、大電流。因此,開發了能承受高電壓、大電流之專用單元,但從製造成本上的問題考量,大多數情形藉由將複數個電池單元串聯、並聯,使用泛用單元確保所需之電壓電流。 Further, in recent years, HEVs (Hybrid Electric Vehicles) or EVs (Electric Vehicles) using batteries and motors have rapidly spread. As a power source of HEV or EV, a lithium ion secondary battery is gradually used from the viewpoint of energy density and output characteristics. In automotive applications, high voltage and high current are required. Therefore, a dedicated unit capable of withstanding high voltage and large current has been developed, but in consideration of manufacturing cost, in most cases, a plurality of battery cells are connected in series and in parallel, and a common unit is used to secure a required voltage and current.

此處,高速移動中之汽車等,會有急速之驅動力降低或急停而造成危險之情形,因此亦要求緊急狀態時之電池管理。例如,即使在行駛中產生電池系統之異常時,為避免危險,最好是能供應用以移動至修理工廠或安全場所之驅動力、或警示燈及空調用之驅動力。 Here, in a car that is moving at a high speed, there is a case where the driving force of the rapid speed is lowered or the emergency stop is dangerous, and therefore battery management in an emergency state is also required. For example, even if an abnormality of the battery system occurs during running, in order to avoid danger, it is preferable to supply a driving force for moving to a repair factory or a safe place, or a driving force for a warning light and an air conditioner.

然而,在專利文獻1之串聯有複數個電池單元之電池包,僅在充放電路徑上設有保護元件之情形,若電池單元之一部分產生異常使保 護元件作動,則電池包整體之充放電路徑被遮斷,無法持續供應電力。 However, in the battery pack in which a plurality of battery cells are connected in series in Patent Document 1, only the protective component is provided on the charge and discharge path, and if one of the battery cells is abnormal, it is guaranteed. When the protective element is actuated, the entire charging and discharging path of the battery pack is blocked, and power supply cannot be continuously supplied.

因此,有提出一種短路元件,為了僅排除以複數個單元構成之電池包內之異常電池單元,有效地活用正常之電池單元,而能形成僅使異常之電池單元旁通之旁通路徑。 Therefore, there has been proposed a short-circuiting element in which an abnormal battery cell in a battery pack composed of a plurality of cells is excluded, a normal battery cell is effectively utilized, and a bypass path that bypasses only an abnormal battery cell can be formed.

此短路元件50,如圖20所示,具有於充放電路徑上與電池單元51串聯且在正常時開放之兩個開放電極52,53、藉由熔融使兩個開放電極52,53間短路之可熔導體54、以及與可熔導體54串聯且使該可熔導體54熔融之發熱體55。 As shown in FIG. 20, the short-circuiting element 50 has two open electrodes 52, 53 which are connected in series with the battery unit 51 in the charge and discharge path and which are normally opened, and short-circuit between the two open electrodes 52, 53 by melting. The fusible conductor 54 and the heat generating body 55 which is connected in series with the fusible conductor 54 and melts the fusible conductor 54.

發熱體55係藉由透過充放電路徑之電流流通而自體發熱,藉由此熱(焦耳熱)使可熔導體54熔融。發熱體55與FET等電流控制元件56連接。電流控制元件56控制成在電池單元51正常時限制對發熱體55之供電,在異常時經由充放電路徑對發熱體55通以電流。 The heating element 55 is self-heated by the current flowing through the charge and discharge path, and the meltable conductor 54 is melted by the heat (Joule heat). The heating element 55 is connected to a current control element 56 such as an FET. The current control element 56 is controlled to restrict the supply of power to the heating element 55 when the battery unit 51 is normal, and to apply current to the heating element 55 via the charging and discharging path when an abnormality occurs.

使用了短路元件50之電池電路,在電池單元51被檢測出異常電壓等時,即藉由保護元件57從充放電路徑上遮斷該電池單元51,且使電流控制元件56作動,對發熱體55通以電流。藉此,藉由發熱體55之熱使可熔導體54熔融,熔融導體凝集、結合於兩個開放電極52,53上。是以,開放電極52,53藉由熔融導體而短路,藉此能形成使電池單元51旁通之電流路徑。 When the battery unit 51 detects an abnormal voltage or the like, the battery unit 51 blocks the battery unit 51 from the charging and discharging path and causes the current control unit 56 to actuate the heating element. 55 pass current. Thereby, the meltable conductor 54 is melted by the heat of the heat generating body 55, and the molten conductor is aggregated and bonded to the two open electrodes 52, 53. Therefore, the open electrodes 52, 53 are short-circuited by the molten conductor, whereby a current path bypassing the battery unit 51 can be formed.

然而,在將短路元件50使用於流通較電源線微弱之電流之數位訊號線中時,無法對發熱體55供應可得到足以使可熔導體54熔斷之充分發熱量的電力,短路元件50之用途限於電源線用途。 However, when the short-circuiting element 50 is used in a digital signal line that flows through a weak current of the power supply line, the heating element 55 cannot be supplied with electric power sufficient to obtain a sufficient amount of heat generated by the fusible conductor 54, and the short-circuiting element 50 is used. Limited to power cord use.

又,將電流路徑切換至發熱體55側之電流控制元件56亦伴 隨著電流額定值之提升而同樣地被要求額定值提升。又,高額定值之電流控制元件一般而言係昂貴,就成本而言為不利。 Further, the current control element 56 that switches the current path to the side of the heating element 55 is also accompanied As the current rating increases, the rating is likewise required to increase. Also, high rating current control components are generally expensive and disadvantageous in terms of cost.

因此,本發明之目的在於,提供一種短路元件、及短路電路,其即使在組裝於微弱之電流路徑之場合下亦能對發熱體供應足以使可熔導體熔斷之充分電力,能使用於所有用途。 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a short-circuiting element and a short-circuiting circuit capable of supplying sufficient power to a heat generating body to melt a fusible conductor even when assembled in a weak current path, and can be used for all purposes. .

為了解決上述課題,本發明之短路元件,具備:絕緣基板;發熱體;第1及第2電極,於上述絕緣基板彼此相鄰設置;第3電極,與上述第1電極相鄰設置;第4電極,與上述第2電極相鄰設置;第1可熔導體,從上述第1電極跨至上述第3電極而被搭載,藉由來自上述發熱體之加熱,在上述第1電極與上述第3電極之間熔斷;第2可熔導體,從上述第2電極跨至上述第4電極而被搭載,藉由來自上述發熱體之加熱,在上述第2電極與上述第4電極之間熔斷;第5電極,與上述發熱體電氣連接;第6電極,與上述第5電極相鄰設置;以及第3可熔導體,藉由從上述第5電極跨至上述第6電極而被搭載而與上述發熱體串聯,藉由來自上述發熱體之加熱,在上述第5電極與上述第6電極之間熔斷;以來自上述發熱體之加熱使上述第1、第2可熔導體熔融,藉由凝集於上述第1、第2電極上之熔融導體結合以使上述第1、第2電極間短路。 In order to solve the above problems, the short-circuiting element of the present invention includes: an insulating substrate; a heat generating body; first and second electrodes are disposed adjacent to each other on the insulating substrate; and a third electrode is disposed adjacent to the first electrode; The electrode is disposed adjacent to the second electrode; the first fusible conductor is mounted from the first electrode to the third electrode, and the first electrode and the third electrode are heated by the heat generating body The second fusible conductor is mounted from the second electrode to the fourth electrode, and is melted between the second electrode and the fourth electrode by heating from the heating element; a fifth electrode electrically connected to the heating element; a sixth electrode disposed adjacent to the fifth electrode; and a third meltable conductor mounted on the sixth electrode and extending to the sixth electrode The body is connected in series, and is melted between the fifth electrode and the sixth electrode by heating from the heating element; and the first and second meltable conductors are melted by heating from the heating element, and are aggregated in the above Melting on the first and second electrodes The fusion conductors are combined to short-circuit the first and second electrodes.

又,本發明之短路電路,具備:第1電路,具有第1保險絲、以及彼此相鄰形成且絕緣之第1、第2電極;以及第2電路,係與上述第1電路電性上獨立形成,具有發熱體及與上述發熱體之一端連接之第2保險絲;藉由對上述第2電路通以電流而從上述發熱體發出之熱,使上述第1保險絲熔融且使上述第1、第2電極間短路後,使上述第2保險絲熔斷以停 止上述發熱體之發熱。 Further, the short circuit of the present invention includes: a first circuit having a first fuse; and first and second electrodes which are formed adjacent to each other and insulated; and a second circuit electrically and independently formed from the first circuit a heating element and a second fuse connected to one end of the heating element; and the first fuse is melted by the heat generated from the heating element by applying a current to the second circuit, and the first and second ends are made After the short circuit between the electrodes, the second fuse is blown to stop The heat of the above heating element is stopped.

根據本發明,由於組裝於外部電路之跨第1、第2電極間之電流路徑與對使第1、第2可熔導體熔斷之發熱體之供電路徑在電性上獨立,因此不論外部電路之種類為何,均能對發熱體供應可得到足以使第1、第2可熔導體熔斷之充分發熱量的電力。是以,根據本發明,作為外部電路,除了電源電路以外,亦能適用於流通微弱電流之數位訊號電路。 According to the present invention, since the current path between the first and second electrodes assembled to the external circuit and the power supply path for the heat generating body that fuses the first and second meltable conductors are electrically independent, regardless of the external circuit In the case of the type, it is possible to supply electric power to the heating element which is sufficient to generate sufficient heat generation for the first and second fusible conductors. Therefore, according to the present invention, as an external circuit, in addition to the power supply circuit, it can be applied to a digital signal circuit that circulates a weak current.

又,根據本發明,由於與組裝於外部電路之跨第1、第2電極間之電流路徑在電性上獨立地形成對發熱體之供電路徑,因此能將控制對發熱體之供電之電流控制元件不拘外部電路之電流額定值為何而依據發熱體之額定值來選擇,能更廉價地製造。 Moreover, according to the present invention, since the current path between the first and second electrodes assembled to the external circuit is electrically independent of the power supply path to the heat generating body, the current control for controlling the power supply to the heat generating body can be controlled. The components are selected according to the rated value of the heating element regardless of the current rating of the external circuit, and can be manufactured at a lower cost.

1‧‧‧短路元件 1‧‧‧Short-circuit components

2‧‧‧開關 2‧‧‧Switch

3‧‧‧第1電路 3‧‧‧1st circuit

4‧‧‧第2電路 4‧‧‧2nd circuit

10‧‧‧絕緣基板 10‧‧‧Insert substrate

10a‧‧‧表面 10a‧‧‧ surface

10b‧‧‧背面 10b‧‧‧back

11‧‧‧第1電極 11‧‧‧1st electrode

11a‧‧‧第1電極端子部 11a‧‧‧1st electrode terminal

12‧‧‧第2電極 12‧‧‧2nd electrode

12a‧‧‧第2電極端子部 12a‧‧‧2nd electrode terminal

13‧‧‧第3電極 13‧‧‧3rd electrode

14‧‧‧第4電極 14‧‧‧4th electrode

15‧‧‧第5電極 15‧‧‧5th electrode

15a‧‧‧下層部 15a‧‧‧Under the Ministry

15b‧‧‧上層部 15b‧‧‧Upper Department

16‧‧‧第6電極 16‧‧‧6th electrode

16a‧‧‧第6電極端子部 16a‧‧‧6th electrode terminal

17‧‧‧發熱體 17‧‧‧heating body

18‧‧‧絕緣層 18‧‧‧Insulation

19‧‧‧發熱體引出電極 19‧‧‧Feature body extraction electrode

20‧‧‧發熱體電極端子部 20‧‧‧heating electrode terminal

21‧‧‧第1可熔導體 21‧‧‧1st fusible conductor

22‧‧‧第2可熔導體 22‧‧‧2nd fusible conductor

23‧‧‧第3可熔導體 23‧‧‧3rd fusible conductor

25‧‧‧絕緣構件 25‧‧‧Insulating components

26‧‧‧構裝用焊料 26‧‧‧Building solder

27‧‧‧貫通孔 27‧‧‧through holes

28‧‧‧絕緣壁 28‧‧‧Insulated wall

29‧‧‧覆蓋構件 29‧‧‧ Covering components

30‧‧‧短路電路 30‧‧‧Short circuit

31‧‧‧外部電路 31‧‧‧External Circuit

32‧‧‧助焊劑 32‧‧‧ Flux

33‧‧‧電流控制元件 33‧‧‧ Current control components

34‧‧‧外部電源 34‧‧‧External power supply

35‧‧‧檢測電路 35‧‧‧Detection circuit

40‧‧‧短路元件 40‧‧‧Short-circuit components

50‧‧‧短路元件 50‧‧‧Short-circuit components

60‧‧‧電路 60‧‧‧ Circuitry

61‧‧‧電池單元 61‧‧‧ battery unit

62‧‧‧保護電阻 62‧‧‧protection resistance

63‧‧‧保護元件 63‧‧‧Protection components

64‧‧‧電池單位 64‧‧‧ battery unit

70‧‧‧高熔點金屬層 70‧‧‧High melting point metal layer

71‧‧‧低熔點金屬層 71‧‧‧Low-melting metal layer

72‧‧‧開口部 72‧‧‧ openings

73‧‧‧開口部 73‧‧‧ openings

74‧‧‧開口部 74‧‧‧ openings

圖1係顯示適用本發明之短路元件之圖,(A)係俯視圖,(B)係剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a short-circuiting element to which the present invention is applied, (A) is a plan view, and (B) is a cross-sectional view.

圖2係顯示短路元件中之發熱體之發熱中心的俯視圖。 Fig. 2 is a plan view showing the heat generating center of the heat generating body in the short-circuiting member.

圖3係顯示適用本發明之短路元件之電路圖。 Fig. 3 is a circuit diagram showing a short-circuiting element to which the present invention is applied.

圖4係顯示適用本發明之短路電路之電路圖。 Fig. 4 is a circuit diagram showing a short circuit to which the present invention is applied.

圖5係顯示第1、第2電極間短路之短路元件之圖,(A)係剖面圖,(B)係電路圖。 Fig. 5 is a view showing a short-circuiting element short-circuited between the first and second electrodes, (A) is a cross-sectional view, and (B) is a circuit diagram.

圖6係顯示第5、第6電極間被遮斷而發熱體之發熱停止之短路元件的圖,(A)係剖面圖,(B)係電路圖。 Fig. 6 is a view showing a short-circuiting element in which the fifth and sixth electrodes are blocked and the heat generation of the heating element is stopped, (A) is a cross-sectional view, and (B) is a circuit diagram.

圖7係顯示適用本發明之其他短路元件之圖,(A)係俯視圖,(B)係剖面圖。 Fig. 7 is a view showing another short-circuiting element to which the present invention is applied, (A) is a plan view, and (B) is a cross-sectional view.

圖8係顯示適用本發明之其他短路元件之圖,(A)係俯視圖,(B)係剖面圖。 Fig. 8 is a view showing another short-circuiting element to which the present invention is applied, (A) is a plan view, and (B) is a cross-sectional view.

圖9係顯示發熱體形成於絕緣基板之背面之短路元件的剖面圖。 Fig. 9 is a cross-sectional view showing a short-circuiting element in which a heating element is formed on the back surface of an insulating substrate.

圖10係顯示發熱體形成於絕緣層內部之短路元件的剖面圖。 Fig. 10 is a cross-sectional view showing a short-circuiting element in which a heat generating body is formed inside an insulating layer.

圖11係顯示發熱體形成於絕緣層內部之短路元件的剖面圖。 Fig. 11 is a cross-sectional view showing a short-circuiting element in which a heating element is formed inside an insulating layer.

圖12係顯示發熱體及第1~第6電極形成於絕緣基板之表面之短路元件的俯視圖。 Fig. 12 is a plan view showing a short-circuiting element in which a heating element and first to sixth electrodes are formed on the surface of an insulating substrate.

圖13係具有具備保護電阻之短路元件之電池包的電路圖。 Fig. 13 is a circuit diagram of a battery pack having a short-circuiting element having a protective resistor.

圖14係顯示具有高熔點金屬層與低熔點金屬層且具備被覆構造之可熔導體的立體圖,(A)係顯示以高熔點金屬層作為內層且以低熔點金屬層覆蓋的構造,(B)係顯示以低熔點金屬層作為內層且以高熔點金屬層覆蓋的構造。 14 is a perspective view showing a fusible conductor having a high melting point metal layer and a low melting point metal layer and having a coated structure, and (A) shows a structure in which a high melting point metal layer is used as an inner layer and covered with a low melting point metal layer, (B) The structure showing a low melting point metal layer as an inner layer and a high melting point metal layer is shown.

圖15係顯示具備高熔點金屬層與低熔點金屬層之積層構造之可熔導體的立體圖,(A)係顯示上下雙層構造,(B)係顯示內層及外層之三層構造。 Fig. 15 is a perspective view showing a fusible conductor having a laminated structure of a high melting point metal layer and a low melting point metal layer, wherein (A) shows an upper and lower double layer structure, and (B) shows a three layer structure of an inner layer and an outer layer.

圖16係顯示具備高熔點金屬層與低熔點金屬層之多層構造之可熔導體的剖面圖。 Figure 16 is a cross-sectional view showing a fusible conductor having a multilayer structure of a high melting point metal layer and a low melting point metal layer.

圖17係顯示於高熔點金屬層之表面形成有線狀之開口部且露出低熔點金屬層之可熔導體的俯視圖,(A)係沿長度方向形成有開口部者,(B)係沿寬度方向形成有開口部者。 17 is a plan view showing a fusible conductor in which a linear opening is formed on a surface of a high-melting-point metal layer and a low-melting-point metal layer is exposed, and (A) is formed with an opening in a longitudinal direction, and (B) is in a width direction. An opening is formed.

圖18係顯示於高熔點金屬層之表面形成有圓形之開口部且露出低熔點金屬層之可熔導體的俯視圖。 Fig. 18 is a plan view showing a fusible conductor in which a circular opening is formed on the surface of the high-melting-point metal layer and the low-melting-point metal layer is exposed.

圖19係顯示於高熔點金屬層形成有圓形之開口部且於內部充填有低熔點金屬之可熔導體的俯視圖。 Fig. 19 is a plan view showing a fusible conductor in which a circular opening portion is formed in a high melting point metal layer and a low melting point metal is filled inside.

圖20係顯示使用參考例之短路元件之電池電路的電路圖。 Fig. 20 is a circuit diagram showing a battery circuit using the short-circuiting element of the reference example.

以下,參照圖式詳細說明適用本發明之短路元件、及短路電路。此外,本發明不僅限定於以下實施形態,在不脫離本發明要旨之範圍內當然可進行各種變更。又,圖式係以示意方式顯示,會有各尺寸之比率等與現實不同之情形。具體之尺寸等應參酌以下說明判斷。又,在圖式彼此間當然含有彼此之尺寸關係或比率不同之部分。 Hereinafter, a short-circuiting element and a short-circuiting circuit to which the present invention is applied will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below, and various modifications can be made without departing from the spirit and scope of the invention. Moreover, the drawings are shown in a schematic manner, and there are cases where the ratio of each size is different from the reality. The specific dimensions and the like should be judged by the following instructions. Further, the drawings naturally contain portions having different dimensional relationships or ratios from each other.

[短路元件] [short circuit element]

[第1形態] [First form]

適用本發明之短路元件1,如圖1(A)(B)所示,具備:絕緣基板10;發熱體17;第1及第2電極11,12,於絕緣基板10之表面10a側彼此相鄰設置;第3電極13,與第1電極11相鄰設置;第4電極14,與第2電極12相鄰設置;第1可熔導體21,從第1電極11跨至第3電極13而被搭載,藉由來自發熱體17之加熱,在第1電極11與第3電極13之間熔斷;第2可熔導體22,從第2電極12跨至第4電極14而被搭載,藉由來自發熱體17之加熱,在第2電極12與第4電極14之間熔斷。 As shown in Fig. 1 (A) and (B), the short-circuiting element 1 of the present invention includes an insulating substrate 10, a heating element 17, and first and second electrodes 11, 12 on the surface 10a side of the insulating substrate 10. The third electrode 13 is disposed adjacent to the first electrode 11; the fourth electrode 14 is disposed adjacent to the second electrode 12; and the first soluble conductor 21 extends from the first electrode 11 to the third electrode 13 It is mounted, and is melted between the first electrode 11 and the third electrode 13 by heating from the heating element 17; the second soluble conductor 22 is mounted from the second electrode 12 to the fourth electrode 14 by the second electrode 12 The heating from the heating element 17 is blown between the second electrode 12 and the fourth electrode 14.

又,短路元件1,具備:第5電極15,於絕緣基板10之表面10a側與發熱體17電氣連接;第6電極16,與第5電極15相鄰設置;以及第3可熔導體23,藉由從第5電極15跨至第6電極16而被搭載而與發熱體17串聯,藉由來自發熱體17之加熱,在第5電極15與第6電極16之間熔斷。 Further, the short-circuiting element 1 includes a fifth electrode 15 electrically connected to the heating element 17 on the surface 10a side of the insulating substrate 10, a sixth electrode 16 disposed adjacent to the fifth electrode 15, and a third fusible conductor 23, By being mounted from the fifth electrode 15 to the sixth electrode 16 and being connected in series with the heating element 17, the heating is performed between the fifth electrode 15 and the sixth electrode 16 by heating from the heating element 17.

短路元件1,以來自發熱體17之加熱使第1、第2可熔導體 21,22熔融,藉由凝集於第1、第2電極11,12上之熔融導體結合以使此等第1、第2電極11,12間短路。 The short-circuiting element 1 is heated by the heating element 17 to make the first and second fusible conductors 21, 22 is melted, and the molten conductors agglomerated on the first and second electrodes 11, 12 are combined to short-circuit the first and second electrodes 11, 12.

絕緣基板10係使用例如氧化鋁、玻璃陶瓷、多鋁紅柱石、氧化鋯等之具有絕緣性之構件形成為大致方形。絕緣基板10,除此之外亦可使用用於玻璃環氧基板、酚醛基板等之印刷配線基板之材料亦可,但必須留意第1~第3可熔導體21~23熔斷時之溫度。 The insulating substrate 10 is formed into a substantially square shape using an insulating member such as alumina, glass ceramic, mullite, or zirconia. In addition to the insulating substrate 10, a material for a printed wiring board such as a glass epoxy substrate or a phenolic substrate may be used. However, it is necessary to pay attention to the temperature at which the first to third soluble conductors 21 to 23 are blown.

發熱體17係電阻值較高且通電則發熱之具有導電性之構件,由例如W、Mo、Ru等構成。藉由使用網版印刷技術將此等合金或組成物、化合物之粉狀體與樹脂結合劑等混合而成糊狀者在絕緣基板10上形成圖案、加以燒成等形成。 The heating element 17 is a conductive member having a high electric resistance value and generating heat when energized, and is made of, for example, W, Mo, Ru or the like. The alloy or the composition, the powder of the compound, the resin binder, and the like are mixed by a screen printing technique to form a paste, and a pattern is formed on the insulating substrate 10, and firing or the like is formed.

發熱體17在絕緣基板10之表面10a上被絕緣層18覆蓋。絕緣層18係謀求發熱體17之保護及絕緣,且係用以將發熱體17之熱以良好效率往第1~第6電極11~16傳遞而設置,由例如玻璃層構成。藉由發熱體17加熱第1~第6電極11~16,可使第1~第3可熔導體21~23之熔融導體容易地凝集。 The heating element 17 is covered by the insulating layer 18 on the surface 10a of the insulating substrate 10. The insulating layer 18 is provided to protect and insulate the heating element 17, and is provided to transmit the heat of the heating element 17 to the first to sixth electrodes 11 to 16 with good efficiency, and is composed of, for example, a glass layer. When the first to sixth electrodes 11 to 16 are heated by the heating element 17, the molten conductors of the first to third fusible conductors 21 to 23 can be easily aggregated.

又,發熱體17一端與形成於絕緣基板10之發熱體引出電極19連接,另一端與後述之第5電極15連接。發熱體引出電極19形成有面對絕緣基板10側緣之發熱體電極端子部20。發熱體引出電極19係透過貫通孔27與設在絕緣基板10背面之外部連接端子(未圖示)連接。發熱體17係透過發熱體引出電極19、發熱體電極端子部20以及外部連接端子與後述之電流控制元件33連接。 Further, one end of the heating element 17 is connected to the heating element extraction electrode 19 formed on the insulating substrate 10, and the other end is connected to a fifth electrode 15 which will be described later. The heat generating body lead electrode 19 is formed with a heat generating body electrode terminal portion 20 facing the side edge of the insulating substrate 10. The heating element extraction electrode 19 is connected to an external connection terminal (not shown) provided on the back surface of the insulating substrate 10 through the through hole 27. The heating element 17 is connected to the heating element lead electrode 19, the heating element terminal portion 20, and the external connection terminal to a current control element 33 which will be described later.

[第1~第6電極] [1st to 6th electrodes]

在被覆發熱體17之絕緣層18上形成有第1~第6電極11~16。第1電極11,在一側與第2電極12相鄰形成且藉由彼此分離而絕緣。在第1電極11之另一側形成有第3電極13,藉由此等第1、第3電極11,13支撐第1可熔導體21之兩側緣,謀求第1可熔導體21之位置偏移防止。第1電極11與第3電極13藉由在絕緣層18上一體形成而電氣連接,且藉由積層玻璃等絕緣構件25而被物理分離。藉由將第1、第3電極11,13一體形成於絕緣層18上且積層絕緣構件25,進而於絕緣構件25上積層第1可熔導體21,絕緣構件25能發揮將發熱體17之熱對第1可熔導體21或第1及第3電極11,13以良好效率傳遞之熱塗布器(Heat Spreader)的功能。是以,短路元件1在發熱體17發熱後,即能在短時間熔斷第1可熔導體21。 The first to sixth electrodes 11 to 16 are formed on the insulating layer 18 covering the heating element 17. The first electrode 11 is formed adjacent to the second electrode 12 on one side and insulated by being separated from each other. The third electrode 13 is formed on the other side of the first electrode 11, and the first and third electrodes 11, 13 are supported to support both side edges of the first fusible conductor 21, thereby achieving the position of the first fusible conductor 21. Offset prevention. The first electrode 11 and the third electrode 13 are electrically connected by being integrally formed on the insulating layer 18, and are physically separated by an insulating member 25 such as laminated glass. By integrally forming the first and third electrodes 11 and 13 on the insulating layer 18 and laminating the insulating member 25, the first soluble conductor 21 is laminated on the insulating member 25, and the insulating member 25 can exhibit heat of the heating element 17. The function of a heat spreader that transmits the first fusible conductor 21 or the first and third electrodes 11 and 13 with good efficiency. Therefore, after the short-circuiting element 1 generates heat, the first fusible conductor 21 can be blown in a short time.

第1、第3電極11,13透過構裝用焊料26而搭載有後述之第1可熔導體21。又,第1電極11係形成有面對絕緣基板10之側面之第1電極端子部11a。第1電極端子部11a係透過貫通孔27與設在絕緣基板10背面之外部連接端子(未圖示)連接。第1電極端子部11a透過外部連接端子與構裝短路元件1之元件之電流路徑之一端連接。 The first and third electrodes 11 and 13 are mounted with a first fusible conductor 21 to be described later through the solder 26 for mounting. Further, the first electrode 11 is formed with a first electrode terminal portion 11a that faces the side surface of the insulating substrate 10. The first electrode terminal portion 11a is connected to an external connection terminal (not shown) provided on the back surface of the insulating substrate 10 through the through hole 27. The first electrode terminal portion 11a is connected to one end of a current path of the element constituting the short-circuiting element 1 through an external connection terminal.

於第2電極12之與第1電極11相鄰之一側之相反另一側形成有第4電極14,藉由此等第2、第4電極12,14支撐第2可熔導體22之兩側緣,謀求第2可熔導體22之位置偏移防止。第2電極12與第4電極14亦與第1、第3電極同樣地藉由在絕緣層18上一體形成而電氣連接,且藉由積層玻璃等絕緣構件25而被物理分離。第2、第4電極12,14透過構裝用焊料26而搭載有後述之第2可熔導體22。又,第2電極12係形成有面對絕緣基板10之側面之第2電極端子部12a。第2電極端子部12a係透過 貫通孔27與設在絕緣基板10背面之外部連接端子(未圖示)連接。第2電極端子部12a透過外部連接端子與構裝短路元件1之元件之電流路徑之另一端連接。 The fourth electrode 14 is formed on the opposite side of the second electrode 12 from the side adjacent to the first electrode 11, and the second and fourth electrodes 12, 14 are supported to support the second meltable conductor 22 The side edge prevents the positional deviation of the second fusible conductor 22 from being prevented. Similarly to the first and third electrodes, the second electrode 12 and the fourth electrode 14 are electrically connected to each other by being integrally formed on the insulating layer 18, and are physically separated by an insulating member 25 such as laminated glass. The second and fourth electrodes 12 and 14 are mounted with a second fusible conductor 22 to be described later through the solder 26 for mounting. Further, the second electrode 12 is formed with a second electrode terminal portion 12a facing the side surface of the insulating substrate 10. The second electrode terminal portion 12a is transmitted through The through hole 27 is connected to an external connection terminal (not shown) provided on the back surface of the insulating substrate 10. The second electrode terminal portion 12a is connected to the other end of the current path of the element constituting the short-circuiting element 1 through the external connection terminal.

第1、第2電極11,12,由於係藉由第1、第2可熔導體21,22之熔融導體凝集、結合而短路,因此較佳為以能保持更多之熔融導體且確實結合之方式形成為較第3、第4電極13,14更廣之面積(參照圖1(B))。 Since the first and second electrodes 11 and 12 are short-circuited by the aggregation and bonding of the molten conductors of the first and second fusible conductors 21 and 22, it is preferable to maintain more molten conductors and to reliably bond them. The method is formed to have a wider area than the third and fourth electrodes 13 and 14 (see FIG. 1(B)).

第5電極15具有與發熱體17連接之下層部15a、以及形成於絕緣層18上且搭載第3可熔導體23之上層部15b。於第5電極15之上層部15b之設有下層部15a側之相反側相隔既定距離設有第6電極16。第5、第6電極15,16,透過構裝用焊料26搭載有後述之第3可熔導體23。又,第6電極16係形成有面對絕緣基板10之側面之第6電極端子部16a。第6電極端子部16a係透過貫通孔27與設在絕緣基板10背面之外部連接端子(未圖示)連接。第6電極端子部16a透過外部連接端子與對發熱體17供應電流之外部電源34連接。 The fifth electrode 15 has a layer portion 15a that is connected to the heating element 17, and a layer portion 15b that is formed on the insulating layer 18 and that is mounted on the third meltable conductor 23. The sixth electrode 16 is provided at a predetermined distance from the opposite side of the lower portion 15a side of the layer portion 15b of the fifth electrode 15. The fifth and sixth electrodes 15 and 16 are mounted with a third fusible conductor 23 to be described later through the solder 26 for mounting. Further, the sixth electrode 16 is formed with a sixth electrode terminal portion 16a facing the side surface of the insulating substrate 10. The sixth electrode terminal portion 16a is connected to an external connection terminal (not shown) provided on the back surface of the insulating substrate 10 through the through hole 27. The sixth electrode terminal portion 16a is connected to an external power source 34 that supplies a current to the heating element 17 through an external connection terminal.

此等第1~第6電極11~16、以及發熱體引出電極19,可使用Cu或Ag等之一般電極材料形成。又,較佳為,在至少第1、第2電極11,12之表面上藉由公知之鍍敷處理形成有Ni/Au鍍敷、Ni/Pd鍍敷、Ni/Pd/Au鍍敷等之被膜。藉此,可防止第1、第2電極11,12之氧化,確實地保持熔融導體。又,將短路元件1回焊構裝之情形,藉由使連接第1、第2可熔導體21,22之構裝用焊料26或形成第1、第2可熔導體21,22之外層之低熔點金屬熔融,可防止熔蝕(焊料沖蝕)切斷第1、第2電極11,12。此外,除了第1及第2電極11,12以外,當然亦可於第3~第6電極13~16之表面上形 成Ni/Au鍍敷、Ni/Pd鍍敷、Ni/Pd/Au鍍敷等之被膜。 The first to sixth electrodes 11 to 16 and the heating element extraction electrode 19 can be formed using a general electrode material such as Cu or Ag. Further, it is preferable that at least the first and second electrodes 11 and 12 are formed by Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating, or the like by a known plating treatment. Membrane. Thereby, oxidation of the first and second electrodes 11 and 12 can be prevented, and the molten conductor can be surely held. Further, in the case where the short-circuiting element 1 is reflowed, the solder 26 for connecting the first and second fusible conductors 21, 22 or the outer layer of the first and second fusible conductors 21, 22 is formed. The low-melting-point metal is melted to prevent the first and second electrodes 11, 12 from being cut by the erosion (solder erosion). Further, in addition to the first and second electrodes 11, 12, of course, the surfaces of the third to sixth electrodes 13 to 16 may be formed. It is a film of Ni/Au plating, Ni/Pd plating, Ni/Pd/Au plating, or the like.

又,於分別面對絕緣基板10之側面之第1電極端子部11a、第2電極端子部12a、第6電極端子部16a、以及發熱體電極端子部20,形成有防止用以將短路元件1構裝於電路基板之焊料上升至絕緣基板10之表面10a的絕緣壁28。設於第1電極端子部11a上之絕緣壁28,係沿著第1~第4電極11~14之第1、第2可熔導體21,22之搭載區域跨至第2電極12上而形成。藉此,防止第1、第2可熔導體21,22通過第1、第2電極端子部11a,12a而流出,確實地凝集、結合於第1、第2電極11,12上。 Further, the first electrode terminal portion 11a, the second electrode terminal portion 12a, the sixth electrode terminal portion 16a, and the heat generating body electrode terminal portion 20 which face the side faces of the insulating substrate 10 are formed to prevent the short-circuiting member 1 from being formed. The solder which is mounted on the circuit board rises to the insulating wall 28 of the surface 10a of the insulating substrate 10. The insulating wall 28 provided in the first electrode terminal portion 11a is formed along the mounting region of the first and second meltable conductors 21, 22 of the first to fourth electrodes 11 to 14 across the second electrode 12. . Thereby, the first and second meltable conductors 21 and 22 are prevented from flowing out through the first and second electrode terminal portions 11a and 12a, and are surely aggregated and bonded to the first and second electrodes 11 and 12.

[第1~第3可熔導體] [1st to 3rd fusible conductors]

第1~第3可熔導體21~23能使用因發熱體17之發熱迅速熔斷之任一金屬,可較佳地使用例如以Sn為主成分之無鉛焊料。 For the first to third fusible conductors 21 to 23, any metal that is rapidly blown by the heat generation of the heating element 17 can be used, and for example, a lead-free solder containing Sn as a main component can be preferably used.

又,第1~第3可熔導體21~23亦可含有低熔點金屬與高熔點金屬。作為低熔點金屬,較佳為使用無鉛焊料等焊料,作為高熔點金屬,較佳為使用Ag、Cu或以此等為主成分之合金等。藉由含有高熔點金屬與低熔點金屬,將短路元件1回焊構裝之情形,即使回焊溫度超過低熔點金屬層之熔融溫度而低熔點金屬熔融,亦可抑制低熔點金屬往外部流出,能維持第1~第3可熔導體21~23之形狀。又,在熔斷時,亦藉由低熔點金屬熔融,熔蝕(焊料沖蝕)高熔點金屬,而能以高熔點金屬之熔點以下之溫度迅速地熔斷。此外,第1~第3可熔導體21~23如後說明般,能以各種構成來形成。 Further, the first to third fusible conductors 21 to 23 may contain a low melting point metal and a high melting point metal. As the low melting point metal, a solder such as a lead-free solder is preferably used, and as the high melting point metal, Ag, Cu, or an alloy containing the like as a main component is preferably used. When the short-circuiting element 1 is reflowed by containing a high melting point metal and a low melting point metal, even if the reflow temperature exceeds the melting temperature of the low melting point metal layer and the low melting point metal is melted, the low melting point metal can be suppressed from flowing out to the outside. The shape of the first to third fusible conductors 21 to 23 can be maintained. Further, at the time of melting, the low melting point metal is melted, and the high melting point metal is ablated (solder erosion), and can be rapidly melted at a temperature lower than the melting point of the high melting point metal. Further, the first to third fusible conductors 21 to 23 can be formed in various configurations as will be described later.

[第1可熔導體之先熔融] [First melt of the first fusible conductor]

此處,短路元件1形成為第1、第2可熔導體21,22較第3可熔導體23 先熔斷。其原因在於,若第3可熔導體23較第1、第2可熔導體21,22先熔斷,即停止對發熱體17之供電,第1、第2可熔導體21,22不會熔斷,而無法使第1及第2電極11,12間短路。 Here, the short-circuiting element 1 is formed as the first and second fusible conductors 21, 22 and the third fusible conductor 23 First blown. This is because when the third soluble conductor 23 is blown first than the first and second meltable conductors 21, 22, the power supply to the heating element 17 is stopped, and the first and second meltable conductors 21, 22 are not blown. However, the first and second electrodes 11 and 12 cannot be short-circuited.

因此,短路元件1形成為,在發熱體17發熱後,第1、第2可熔導體21,22會先熔斷。具體而言,短路元件1之第1、第2可熔導體21,22搭載於較第3可熔導體23接近發熱體17之發熱中心的位置。 Therefore, the short-circuiting element 1 is formed such that after the heat generating body 17 generates heat, the first and second meltable conductors 21, 22 are first melted. Specifically, the first and second fusible conductors 21 and 22 of the short-circuiting element 1 are mounted at positions closer to the heat generating center of the heat generating body 17 than the third meltable conductor 23 .

此處,所謂發熱體17之發熱中心,係指藉由發熱體17發熱而產生之熱分布中在發熱初期階段最高溫之區域。從發熱體17所發出之熱中,來自絕緣基板10之放熱量最多,在將絕緣基板10以耐熱衝擊性優異但熱傳導率亦高之陶瓷材料形成的情形等,熱會擴散至絕緣基板10。因此,發熱體17在已開始通電之發熱初期之階段,從與絕緣基板10相接之外緣起之距離最遠的中心最熱,而隨著朝向與絕緣基板10相接之外緣越被放熱而溫度越難以上升。 Here, the heat generating center of the heat generating body 17 refers to a region of the heat distribution generated by the heat generation of the heat generating body 17 at the highest temperature in the initial stage of heat generation. The heat generated from the heat generating body 17 is the largest in heat release from the insulating substrate 10, and the heat is diffused to the insulating substrate 10 when the insulating substrate 10 is formed of a ceramic material having excellent thermal shock resistance and high thermal conductivity. Therefore, the heat generating body 17 is the hottest at the center of the farthest distance from the outer edge of the insulating substrate 10 at the initial stage of the heat generation at which the energization has started, and is more radiated as the outer edge is in contact with the insulating substrate 10. The temperature is harder to rise.

因此,如圖2所示,短路元件1中,藉由將第1、第2可熔導體21,22搭載於較第3可熔導體23接近發熱體17之發熱初期中最為高溫之發熱中心C的位置,即可使熱較第3可熔導體23早傳遞,而使之熔斷。第3可熔導體23由於較第1、第2可熔導體21,22慢被加熱,因此係在第1、第2可熔導體21,22熔斷後被熔斷。 Therefore, as shown in FIG. 2, in the short-circuiting element 1, the first and second meltable conductors 21, 22 are mounted on the heat-generating center C which is the highest temperature in the initial stage of heat generation of the heat-generating body 17 closer to the third meltable conductor 23. The position is such that the heat is transferred earlier than the third fusible conductor 23 to be blown. Since the third fusible conductor 23 is heated slowly by the first and second fusible conductors 21 and 22, the first and second fusible conductors 21 and 22 are blown and then blown.

又,短路元件1亦可藉由改變第1、第2可熔導體21,22與第3可熔導體23之形狀來使第1、第2可熔導體21,22較第3可熔導體23先熔斷。例如,第1、第2可熔導體21,22,由於厚度越薄越容易熔斷,因此如圖1(B)所示,短路元件1中,可藉由使第1、第2可熔導體21,22之厚 度較第3可熔導體23薄,來使之較第3可熔導體23先熔斷。此外,第1~第3可熔導體21~23在例如具有以高熔點金屬鍍敷覆蓋低熔點金屬箔之構造的情形,亦可使高熔點金屬層之厚度在第1、第2可熔導體21,22中較薄,在第3可熔導體23中則較厚,或者,亦可使低熔點金屬箔之厚度在第1、第2可熔導體21,22中較薄,在第3可熔導體23中則較厚。 Further, the short-circuiting element 1 can change the shapes of the first and second fusible conductors 21, 22 and the third fusible conductor 23 so that the first and second fusible conductors 21, 22 are smaller than the third fusible conductor 23. First blown. For example, the first and second fusible conductors 21 and 22 are more likely to be blown as the thickness is thinner. Therefore, as shown in FIG. 1(B), the short-circuiting element 1 can be made to have the first and second fusible conductors 21 22 thick The degree is thinner than the third fusible conductor 23 so as to be melted earlier than the third fusible conductor 23. Further, the first to third fusible conductors 21 to 23 may have a structure in which a low melting point metal foil is coated with a high melting point metal, for example, and the thickness of the high melting point metal layer may be in the first and second soluble conductors. 21, 22 is thinner, thicker in the third fusible conductor 23, or the thickness of the low-melting-point metal foil may be thinner in the first and second fusible conductors 21, 22, in the third The melted conductor 23 is thicker.

除此之外,短路元件1中,亦可藉由低熔點金屬形成第1、第2可熔導體21,22,並藉由高熔點金屬形成第3可熔導體23等藉由改變層構造來使熔點產生差異,使第1、第2可熔導體21,22較第3可熔導體23相對容易熔斷,藉由發熱體17之發熱使第1、第2可熔導體21,22較第3可熔導體23先熔斷。 In addition, in the short-circuiting element 1, the first and second fusible conductors 21, 22 may be formed of a low-melting-point metal, and the third fusible conductor 23 may be formed by a high-melting-point metal or the like by changing the layer structure. When the melting points are different, the first and second fusible conductors 21, 22 are relatively easily melted compared to the third fusible conductor 23, and the first and second fusible conductors 21, 22 are made third by the heat generated by the heating element 17. The fusible conductor 23 is first blown.

[其他] [other]

此外,為了使第1~第3可熔導體21~23之氧化防止及熔融時之濕潤性提升,在第1~第3可熔導體21~23上塗布有助焊劑32。 In addition, in order to prevent oxidation of the first to third fusible conductors 21 to 23 and improve wettability at the time of melting, the flux 32 is applied to the first to third fusible conductors 21 to 23.

短路元件1之絕緣基板10被覆蓋構件29覆蓋而保護其內部。覆蓋構件29具有側壁29a與頂面部29b,藉由側壁29a連接於絕緣基板10上,成為閉塞短路元件1之內部之蓋體。覆蓋構件29,與上述絕緣基板10同樣地,係使用例如熱塑性塑膠、陶瓷、玻璃環氧基板等之具有絕緣性之構件形成。 The insulating substrate 10 of the short-circuiting element 1 is covered by the covering member 29 to protect the inside thereof. The cover member 29 has a side wall 29a and a top surface portion 29b, and is connected to the insulating substrate 10 via the side wall 29a to form a lid that closes the inside of the short-circuiting element 1. The cover member 29 is formed of an insulating member such as a thermoplastic plastic, a ceramic, or a glass epoxy substrate, similarly to the above-described insulating substrate 10.

又,覆蓋構件29,亦可在頂面部29b之內面側形成有覆蓋部電極29c。覆蓋部電極29c係形成在與第1、第2電極11,12重疊之位置。此覆蓋部電極29c,在發熱體17發熱使第1、第2可熔導體21,22熔融後,藉由凝集在第1、第2電極11,12上之熔融導體接觸而濕潤擴散,使熔融導 體確實地遍布保持於第1及第2電極11,12間,能使保持之熔融導體之容許量增加。 Further, the cover member 29 may have a cover portion electrode 29c formed on the inner surface side of the top surface portion 29b. The cover portion electrode 29c is formed at a position overlapping the first and second electrodes 11 and 12. The cover portion electrode 29c is heated by the heat generating body 17 to melt the first and second meltable conductors 21, 22, and then is wetted by the molten conductor which is aggregated on the first and second electrodes 11, 12, and is melted and melted. guide The body is surely spread over the first and second electrodes 11 and 12, and the allowable amount of the held molten conductor can be increased.

[電路構成] [circuit composition]

其次,說明短路元件1之電路構成。圖3顯示短路元件1之電路圖。圖4顯示適用短路元件1之短路電路30一例。 Next, the circuit configuration of the short-circuiting element 1 will be described. Figure 3 shows a circuit diagram of the short-circuiting element 1. FIG. 4 shows an example of a short circuit 30 to which the short-circuiting element 1 is applied.

短路元件1,第1電極11及第2電極12在初期狀態下彼此 開放,且構成藉由第1、第2可熔導體21,22熔融即短路之開關2,具有藉由該開關2連接第1電極11與第2電極12之第1電路3。第1電路3藉由串聯於構裝短路元件1之電路基板之電流路徑上而組裝於電源電路或數位訊號電路等各種外部電路31A,31B間。 The short-circuiting element 1, the first electrode 11 and the second electrode 12 are mutually in an initial state The switch 2, which is open and short-circuited by the first and second soluble conductors 21, 22, has a first circuit 3 in which the first electrode 11 and the second electrode 12 are connected by the switch 2. The first circuit 3 is assembled between various external circuits 31A, 31B such as a power supply circuit or a digital signal circuit by being connected in series to a current path of the circuit board on which the short-circuiting element 1 is mounted.

又,短路元件1中,第5電極15、第6電極16、發熱體17、以及第3可熔導體23在初期狀態下構成對發熱體17之供電路徑,且構成藉由發熱體17之發熱使第3可熔導體23熔斷並遮斷該供電路徑之第2電路4。由於第2電路4係與第1電路3電性上獨立,藉由發熱體17之熱使第1、第2可熔導體21,22熔融,因此係與第1電路3熱連接。發熱體17一端透過發熱體引出電極19及發熱體電極端子部20連接於控制對第2電路4供電之電流控制元件33。又,發熱體17另一端透過第5電極15與第3可熔導體23串聯。又,第3可熔導體23搭載於第5、第6電極15,16上,第6電極16與外部電源34連接。 Further, in the short-circuiting element 1, the fifth electrode 15, the sixth electrode 16, the heat generating body 17, and the third meltable conductor 23 constitute a power supply path to the heat generating body 17 in an initial state, and constitute heat generated by the heat generating body 17. The third meltable conductor 23 is blown and the second circuit 4 of the power supply path is blocked. Since the second circuit 4 is electrically independent of the first circuit 3, the first and second fusible conductors 21, 22 are melted by the heat of the heat generating body 17, and thus are thermally connected to the first circuit 3. One end of the heating element 17 passes through the heating element extraction electrode 19 and the heating element electrode terminal portion 20 is connected to a current control element 33 that controls the supply of power to the second circuit 4. Further, the other end of the heating element 17 is connected in series to the third fusible conductor 23 through the fifth electrode 15. Further, the third fusible conductor 23 is mounted on the fifth and sixth electrodes 15 and 16, and the sixth electrode 16 is connected to the external power source 34.

電流控制元件33係控制對第2電路4供電之開關元件,與藉由例如FET構成、檢測第1電路3之物理短路之要否的檢測電路35連接。檢測電路35係檢測出是否產生使各種外部電路31A,31B(組裝有短路元件1 之第1電路3)間通電之必要的電路,例如在電池包之異常電壓時之旁通電流路徑之建構、對網路通訊機器中之駭客或入侵而使資料伺服器迂迴之旁通訊號路徑的建構、或者裝置或軟體之啟動等,產生要藉由第1電路3之短路而物理地、不可逆地使外部電路31A,31B間之電流路徑短路的必要時,係使電流控制元件33動作。 The current control element 33 controls a switching element that supplies power to the second circuit 4, and is connected to a detection circuit 35 that is configured by, for example, an FET and detects whether or not the first circuit 3 is physically short-circuited. The detecting circuit 35 detects whether or not the various external circuits 31A, 31B are generated (the short-circuiting element 1 is assembled) The circuit necessary for energizing the first circuit 3), for example, the construction of the bypass current path when the battery pack is abnormally voltage, and the communication number of the data server when the hacker or the intrusion in the network communication device is reversed When the path is constructed, or the device or the soft body is activated, etc., if the current path between the external circuits 31A and 31B is physically and irreversibly short-circuited by the short circuit of the first circuit 3, the current control element 33 is operated. .

藉此,在藉由對第2電路4供應外部電源34之電力而發熱體17發熱,首先第1、第2可熔導體21,22即熔斷(圖5(A)(B))。第1、第2可熔導體21,22之熔融導體之大部分被拉引至濕潤性高且面積廣之第1、第2電極11,12上,凝集於第1電極11上之熔融導體與凝集於第2電極12上之熔融導體結合。藉此,透過熔融導體使第1電極11與第2電極12短路,而連接外部電路31A,31B。 As a result, the heat generating body 17 generates heat by supplying electric power of the external power source 34 to the second circuit 4, and first, the first and second meltable conductors 21, 22 are blown (FIG. 5(A)(B)). Most of the molten conductors of the first and second meltable conductors 21, 22 are drawn to the first and second electrodes 11, 12 having a high wettability and a wide area, and the molten conductor aggregated on the first electrode 11 is The molten conductor aggregated on the second electrode 12 is bonded. Thereby, the first electrode 11 and the second electrode 12 are short-circuited by the molten conductor, and the external circuits 31A and 31B are connected.

此時,短路元件1中,藉由將第1、第2可熔導體21,22設於較第3可熔導體23接近發熱體17之發熱中心處,且藉由將第1、第2可熔導體21,22形成為厚度較第3可熔導體23薄,而能使之較第3可熔導體23先熔斷。是以,短路元件1中,至第1電路3短路為止可確實地對第2電路4之發熱體17持續供電。 At this time, in the short-circuiting element 1, the first and second meltable conductors 21, 22 are disposed closer to the heat-generating center of the heat-generating body 17 than the third meltable conductor 23, and by the first and second The melted conductors 21, 22 are formed to be thinner than the third fusible conductor 23, and can be melted earlier than the third fusible conductor 23. Therefore, in the short-circuiting element 1, the heating element 17 of the second circuit 4 can be surely supplied with power until the first circuit 3 is short-circuited.

又,短路元件1,能藉由使第1、第2電極11,12面積形成為較第3、第4電極13,14廣,以保持更多之熔融導體,能確實地使熔融導體結合,使第1、第2電極11,12間短路(圖1(B)、圖5(A))。 Further, the short-circuiting element 1 can be formed such that the first and second electrodes 11 and 12 are wider than the third and fourth electrodes 13 and 14, so that a larger number of molten conductors can be held, and the molten conductor can be surely joined. The first and second electrodes 11 and 12 are short-circuited (Fig. 1 (B), Fig. 5 (A)).

發熱體17雖在第1、第2可熔導體21,22之熔斷後亦持續發熱,但藉由在第1、第2可熔導體21,22後第3可熔導體23亦接著熔斷,使第2電路4亦被遮斷(圖6(A)(B))。藉此,遮斷對發熱體17之供電路徑, 停止發熱。 The heating element 17 continues to generate heat even after the first and second fusible conductors 21 and 22 are blown, but the third fusible conductor 23 is also blown after the first and second fusible conductors 21 and 22, so that the heating element 17 is subsequently blown. The second circuit 4 is also blocked (Fig. 6(A)(B)). Thereby, the power supply path to the heating element 17 is blocked. Stop heating.

根據此種短路元件1及短路電路30,由於組裝於外部電路31A,31B之第1電路3與使第1電路3短路之第2電路4,在電性上獨立,因此不論外部電路31之種類為何,均能將第2電路之電源電壓設定得較高,即使使用低額定值之發熱體17,亦能供應可得到足以使第1、第2可熔導體21,22熔斷之充分發熱量的電力。是以,根據短路元件1及短路電路30,作為組裝第1電路3之外部電路31,除了電源電路以外,亦能適用於流通微弱電流之數位訊號電路。 According to the short-circuiting element 1 and the short-circuiting circuit 30, since the first circuit 3 incorporated in the external circuits 31A and 31B and the second circuit 4 in which the first circuit 3 is short-circuited are electrically independent, the type of the external circuit 31 is different. In any case, the power supply voltage of the second circuit can be set high, and even if the heating element 17 of the low rated value is used, it is possible to supply a sufficient amount of heat sufficient to melt the first and second fusible conductors 21, 22. electric power. Therefore, the short circuit element 1 and the short circuit 30 are used as the external circuit 31 for assembling the first circuit 3, and can be applied to a digital signal circuit in which a weak current flows, in addition to the power supply circuit.

又,根據短路元件1及短路電路30,由於與第1電路3在電性上獨立地形成第2電路4,因此能將控制對發熱體17之供電之電流控制元件33不拘第1電路3之額定值為何而依據發熱體17之額定值來選擇,藉由使用控制低額定值之發熱體17(例如1A)之電流控制元件33,而能更廉價地製造。 Further, since the short circuit element 1 and the short circuit 30 are electrically formed independently of the first circuit 3, the current control element 33 for controlling the power supply to the heating element 17 can be prevented from the first circuit 3. The rating is selected depending on the rating of the heating element 17, and it can be manufactured more inexpensively by using the current control element 33 that controls the low-rated heating element 17 (for example, 1A).

[第2形態] [Second form]

又,適用本發明之短路元件,亦可如以下方式構成。此外,以下之說明中,對與上述之短路元件1及短路電路30相同之構成賦予相同之符號,省略其說明。 Further, the short-circuiting element to which the present invention is applied may be configured as follows. In the following description, the same components as those of the above-described short-circuiting element 1 and short-circuiting circuit 30 are denoted by the same reference numerals, and their description will be omitted.

第2形態之短路元件40,如圖7(A)(B)所示,與短路元件1之不同點在於未形成有第4電極14及第2可熔導體22。短路元件40中,藉由第1可熔導體21熔融,其熔融導體遍布第1電極11與第2電極12凝集,藉此能使第1、第2電極11,12短路。 As shown in FIGS. 7(A) and (B), the short-circuiting element 40 of the second embodiment is different from the short-circuiting element 1 in that the fourth electrode 14 and the second meltable conductor 22 are not formed. In the short-circuiting element 40, the first meltable conductor 21 is melted, and the molten conductor is aggregated throughout the first electrode 11 and the second electrode 12, whereby the first and second electrodes 11 and 12 can be short-circuited.

又,短路元件40亦同樣地,第1可熔導體21搭載於較第3 可熔導體23接近發熱體17之發熱中心的位置。且短路元件40中,第1可熔導體21形成為厚度較第3可熔導體23薄。藉此,短路元件40亦同樣地,能使第1可熔導體21較第3可熔導體23先熔斷。 Further, similarly, in the short-circuiting element 40, the first fusible conductor 21 is mounted on the third The fusible conductor 23 is close to the position of the heat generating center of the heat generating body 17. Further, in the short-circuiting element 40, the first fusible conductor 21 is formed to be thinner than the third fusible conductor 23. Thereby, similarly, the short-circuiting element 40 can fuse the first meltable conductor 21 to the third meltable conductor 23 first.

又,短路元件40亦同樣地,第1電極11與第3電極13藉由在絕緣層18上一體形成而電氣連接,且藉由積層玻璃等絕緣構件25而被物理分離。又,第2電極12中,與第1電極11相鄰之側係與第1電極11露出相同程度,與第1電極11相反之側被絕緣構件25覆蓋。 Further, similarly, in the short-circuiting element 40, the first electrode 11 and the third electrode 13 are electrically connected to each other by being integrally formed on the insulating layer 18, and are physically separated by an insulating member 25 such as laminated glass. Further, in the second electrode 12, the side adjacent to the first electrode 11 is exposed to the same extent as the first electrode 11, and the side opposite to the first electrode 11 is covered by the insulating member 25.

[第3形態] [Third form]

第3形態之短路元件50,如圖8所示,與短路元件1之不同點在於未形成有第4電極14。短路元件50中,藉由第1、第2可熔導體21,22熔融,其熔融導體凝集、結合於第1電極11與第2電極12上,藉此能使第1、第2電極11,12短路。 As shown in FIG. 8, the short-circuiting element 50 of the third aspect is different from the short-circuiting element 1 in that the fourth electrode 14 is not formed. In the short-circuiting element 50, the first and second fusible conductors 21 and 22 are melted, and the molten conductor is aggregated and bonded to the first electrode 11 and the second electrode 12, whereby the first and second electrodes 11 can be made. 12 short circuit.

又,短路元件50亦同樣地,第1、第2可熔導體21,22搭載於較第3可熔導體23接近發熱體17之發熱中心的位置。且短路元件50中,第1、第2可熔導體21,22形成為厚度較第3可熔導體23薄。藉此,短路元件50亦同樣地,能使第1、第2可熔導體21,22較第3可熔導體23先熔斷。 Further, similarly, in the short-circuiting element 50, the first and second meltable conductors 21 and 22 are mounted closer to the heat generating center of the heat generating body 17 than the third meltable conductor 23. Further, in the short-circuiting element 50, the first and second fusible conductors 21, 22 are formed to be thinner than the third fusible conductor 23. Thereby, similarly, the short-circuiting element 50 can fuse the first and second meltable conductors 21, 22 earlier than the third meltable conductor 23.

又,短路元件50亦同樣地,第1電極11與第3電極13藉由在絕緣層18上一體形成而電氣連接,且藉由積層玻璃等絕緣構件25而被物理分離。又,第2電極12中,與第1電極11相鄰之側係與第1電極11露出相同程度且透過構裝用焊料26構裝有第2可熔導體22,與第1電極11相反之側被絕緣構件25覆蓋。 Further, similarly, in the short-circuiting element 50, the first electrode 11 and the third electrode 13 are electrically connected by being integrally formed on the insulating layer 18, and are physically separated by the insulating member 25 such as laminated glass. Further, in the second electrode 12, the side adjacent to the first electrode 11 is exposed to the same extent as the first electrode 11, and the second fusible conductor 22 is configured to pass through the solder for mounting, and is opposite to the first electrode 11. The side is covered by the insulating member 25.

[發熱體] [heating stuff]

上述之短路元件1中,雖將發熱體17形成於絕緣基板10之表面10a上且使第1~第3可熔導體21~23重疊,但發熱體17亦可如圖9所示形成於絕緣基板10之背面10b。此情形下,發熱體17在絕緣基板10之背面10b係被絕緣層18覆蓋。又,與發熱體17一端連接之發熱體引出電極19及發熱體電極端子部20亦同樣地形成於絕緣基板10之背面10b。第5電極15中,與發熱體17另一端連接之下層部15a形成於絕緣基板10之背面10b,搭載第3可熔導體23之上層部15b形成於絕緣基板10之表面10a,下層部15a與上層部15b透過導電通孔而連續。 In the short-circuiting element 1 described above, the heating element 17 is formed on the surface 10a of the insulating substrate 10 and the first to third fusible conductors 21 to 23 are overlapped, but the heating element 17 may be formed in insulation as shown in FIG. The back surface 10b of the substrate 10. In this case, the heating element 17 is covered by the insulating layer 18 on the back surface 10b of the insulating substrate 10. Further, the heat generating body lead electrode 19 and the heat generating body electrode terminal portion 20 which are connected to one end of the heat generating body 17 are formed on the back surface 10b of the insulating substrate 10 in the same manner. In the fifth electrode 15, the layer portion 15a is formed on the back surface 10b of the insulating substrate 10, and the upper portion 15b of the third soluble conductor 23 is formed on the surface 10a of the insulating substrate 10, and the lower layer portion 15a is formed. The upper layer portion 15b is continuous through the conductive via holes.

又,發熱體17較佳為在絕緣基板10之背面10b中形成於與第1~第3可熔導體21~23重疊的位置。此時,較佳為第1、第2可熔導體21,22搭載於較第3可熔導體23接近發熱體17之發熱中心的位置。 Further, the heating element 17 is preferably formed at a position overlapping the first to third fusible conductors 21 to 23 on the back surface 10b of the insulating substrate 10. At this time, it is preferable that the first and second meltable conductors 21 and 22 are mounted closer to the heat generating center of the heat generating body 17 than the third meltable conductor 23.

短路元件1,藉由發熱體17形成於絕緣基板10之背面10b,使絕緣基板10之表面10a平坦化,藉此,能將第1~第6電極11~16形成於表面10a上。是以,短路元件1,能簡化第1~第6電極11~16之製程,且謀求低高度。 The short-circuiting element 1 is formed on the back surface 10b of the insulating substrate 10 by the heating element 17, and the surface 10a of the insulating substrate 10 is planarized, whereby the first to sixth electrodes 11 to 16 can be formed on the surface 10a. Therefore, the short-circuiting element 1 can simplify the processes of the first to sixth electrodes 11 to 16, and achieve a low height.

又,短路元件1,在將發熱體17形成於絕緣基板10之背面10b的情形下,亦能藉由使用精密陶瓷等熱傳導性優異之材料作為絕緣基板10之材料,而能藉由發熱體17與積層於絕緣基板10之表面10a上之情形同等地將第1~第3可熔導體21~23加熱、熔斷。 Further, when the short-circuiting element 1 is formed on the back surface 10b of the insulating substrate 10, a material having excellent thermal conductivity such as precision ceramics can be used as the material of the insulating substrate 10, and the heat generating body 17 can be used. The first to third fusible conductors 21 to 23 are heated and melted in the same manner as the case of laminating on the surface 10a of the insulating substrate 10.

此外,短路元件40,50中亦可將發熱體17形成於絕緣基板10之背面10b。 Further, in the short-circuiting elements 40, 50, the heat generating body 17 may be formed on the back surface 10b of the insulating substrate 10.

又,短路元件1,亦可如圖10所示將發熱體17形成於形成在絕緣基板10之表面10a上之絕緣層18內部。此情形下,連接有發熱體17一端之發熱體引出電極19,其與發熱體17連接之一端部亦形成至絕緣層18內部。又,連接有發熱體17另一端之第5電極15中,下層部15a形成至絕緣層18內部。 Further, in the short-circuiting element 1, as shown in FIG. 10, the heat generating body 17 may be formed inside the insulating layer 18 formed on the surface 10a of the insulating substrate 10. In this case, the heat generating body lead-out electrode 19 to which one end of the heat generating body 17 is connected is formed, and one end portion connected to the heat generating body 17 is also formed inside the insulating layer 18. Further, of the fifth electrode 15 to which the other end of the heating element 17 is connected, the lower layer portion 15a is formed inside the insulating layer 18.

又,發熱體17較佳為在絕緣層18內部形成於與第1~第3可熔導體21~23重疊的位置。此時,較佳為第1、第2可熔導體21,22搭載於較第3可熔導體23接近發熱體17之發熱中心的位置。又,短路元件1,亦可將發熱體17形成於形成在絕緣基板10之背面10b上之絕緣層18內部。 Further, it is preferable that the heating element 17 is formed inside the insulating layer 18 at a position overlapping the first to third fusible conductors 21 to 23. At this time, it is preferable that the first and second meltable conductors 21 and 22 are mounted closer to the heat generating center of the heat generating body 17 than the third meltable conductor 23. Further, in the short-circuiting element 1, the heat generating body 17 may be formed inside the insulating layer 18 formed on the back surface 10b of the insulating substrate 10.

此外,短路元件40,50中亦可將發熱體17形成於形成在絕緣基板10之表面10a或背面10b上之絕緣層18內部。 Further, in the short-circuiting members 40, 50, the heat generating body 17 may be formed inside the insulating layer 18 formed on the surface 10a or the back surface 10b of the insulating substrate 10.

又,短路元件1亦可如圖11所示,將發熱體17形成於絕緣基板10內部。此情形下,不需設置覆蓋發熱體17之絕緣層18。又,連接有發熱體17一端之發熱體引出電極19,其與發熱體17連接之一端部形成至絕緣基板10內部,透過導電通孔與設在絕緣基板10之表面10a之另一端部及發熱體電極端子部20連接。第5電極15中,與發熱體17另一端連接之下層部15a形成至絕緣基板10內部,與搭載第3可熔導體23之上層部15b經由導電通孔而連續。 Further, as shown in FIG. 11, the short-circuiting element 1 may form the heat generating body 17 inside the insulating substrate 10. In this case, it is not necessary to provide the insulating layer 18 covering the heating element 17. Further, the heating element extraction electrode 19 having one end of the heating element 17 is connected, and one end portion of the connection with the heating element 17 is formed inside the insulating substrate 10, and is transmitted through the conductive via hole and the other end portion of the surface 10a of the insulating substrate 10 and is heated. The body electrode terminal portion 20 is connected. In the fifth electrode 15, the layer portion 15a is formed inside the insulating substrate 10 in connection with the other end of the heating element 17, and the upper portion 15b of the third soluble conductor 23 is continuous via the conductive via.

又,發熱體17較佳為在絕緣基板10內部形成於與第1~第3可熔導體21~23重疊的位置。此時,較佳為第1、第2可熔導體21,22搭載於較第3可熔導體23接近發熱體17之發熱中心的位置。 Further, the heating element 17 is preferably formed at a position overlapping the first to third fusible conductors 21 to 23 inside the insulating substrate 10. At this time, it is preferable that the first and second meltable conductors 21 and 22 are mounted closer to the heat generating center of the heat generating body 17 than the third meltable conductor 23.

此外,短路元件40,50中亦可將發熱體17形成於絕緣基板 10內部。 In addition, the short-circuiting elements 40, 50 may also form the heating element 17 on the insulating substrate. 10 internal.

又,短路元件1亦可如圖12所示,將發熱體17在絕緣基板10之表面10a上與第1~第6電極11~16排列形成。此情形下,發熱體17被絕緣層18覆蓋。又,與發熱體17另一端連接之第5電極15以單層形成於絕緣基板10之表面10a上。進而,第1、第2可熔導體21,22較佳為搭載於較第3可熔導體23接近發熱體17之發熱中心的位置。 Further, as shown in FIG. 12, the short-circuiting element 1 may be formed by arranging the heat generating body 17 on the front surface 10a of the insulating substrate 10 and the first to sixth electrodes 11 to 16. In this case, the heating element 17 is covered by the insulating layer 18. Further, the fifth electrode 15 connected to the other end of the heating element 17 is formed in a single layer on the surface 10a of the insulating substrate 10. Further, it is preferable that the first and second meltable conductors 21 and 22 are mounted at positions closer to the heat generating center of the heat generating body 17 than the third meltable conductor 23.

此外,短路元件40,50中亦可將發熱體17在絕緣基板10之表面10a上與第1~第6電極11~16排列形成。 Further, in the short-circuiting elements 40, 50, the heating element 17 may be formed by arranging the first to sixth electrodes 11 to 16 on the surface 10a of the insulating substrate 10.

[保護電阻] [protective resistance]

又,短路元件1,亦可為具備連接於第1電極11或第2電極12之任一方之保護電阻之構成。此處,保護電阻為相當於連接於短路元件1之電子零件之內部電阻之電阻值。例如,短路元件1如圖13所示,在鋰離子二次電池之電池包40內之電路60中用於使產生過充電或過放電等異常電壓之電池單元61旁通之旁通電流路徑之建構的情形,係於第2電極12連接具有相當於連接於電池單元61之內部電阻之電阻值的保護電阻62。 Further, the short-circuiting element 1 may be configured to include a protective resistor connected to either of the first electrode 11 or the second electrode 12. Here, the protective resistance is a resistance value equivalent to the internal resistance of the electronic component connected to the short-circuiting element 1. For example, as shown in FIG. 13, the short-circuiting element 1 is used in a circuit 60 in a battery pack 40 of a lithium ion secondary battery for bypassing a bypass current path in which a battery unit 61 that generates an abnormal voltage such as overcharge or overdischarge is bypassed. In the case of construction, the second electrode 12 is connected to a protective resistor 62 having a resistance value corresponding to the internal resistance of the battery unit 61.

圖13中,電池包之電路60具備複數個電池單位64,該電池單位64係以短路元件1、控制短路元件1之動作之電流控制元件33、電池單元61、將電池單元61從充放電路徑上遮斷之保護元件63構成,複數個電池單位64係串聯。 In Fig. 13, the battery pack circuit 60 includes a plurality of battery units 64, the battery unit 64 is a short-circuiting element 1, a current control element 33 for controlling the operation of the short-circuiting element 1, a battery unit 61, and a battery unit 61 from a charge and discharge path. The upper blocking protection element 63 is constructed, and a plurality of battery units 64 are connected in series.

又,電池包之電路60具備檢測各電池單位64之電池單元61之電壓且對保護元件63與電流控制元件33輸出異常訊號之檢測電路35。 Further, the battery pack circuit 60 includes a detection circuit 35 that detects the voltage of the battery unit 61 of each battery unit 64 and outputs an abnormal signal to the protection element 63 and the current control element 33.

各電池單位64,保護元件63與電池單元61串聯。又,電 池單位64,短路元件1之第1電極11透過保護電阻62與保護元件63之開放端連接,第2電極12與電池單元61之開放端連接,藉此保護元件63及電池單元61與短路元件1並聯。 Each battery unit 64 has a protective element 63 connected in series with the battery unit 61. Again, electricity In the cell unit 64, the first electrode 11 of the short-circuiting element 1 is connected to the open end of the protective element 63 through the protective resistor 62, and the second electrode 12 is connected to the open end of the battery unit 61, whereby the protective element 63 and the battery unit 61 and the short-circuiting element are protected. 1 parallel.

又,電池單位64中,電流控制元件33、以及保護元件63分別與檢測電路35連接。檢測電路35與各電池單元61連接,檢測各電池單元61之電壓值,在電池單元61為過充電電壓或過放電電壓時,使具有該電池單元61之電池單位64之保護元件63驅動且對電流控制元件33輸出異常訊號。 Further, in the battery unit 64, the current control element 33 and the protection element 63 are connected to the detection circuit 35, respectively. The detection circuit 35 is connected to each battery unit 61, and detects the voltage value of each battery unit 61. When the battery unit 61 is overcharged or overdischarged, the protection element 63 of the battery unit 64 having the battery unit 61 is driven and The current control element 33 outputs an abnormal signal.

保護元件62能由例如場效電晶體(以下,稱為FET)構成。又,保護元件62能由具有連接於充放電路徑上之一對電極、跨該電極間而連接且使該電極間短路之可熔導體、以及與可熔導體串聯在電壓異常時通電而發熱使可熔導體熔融之發熱體的元件構成。 The protective element 62 can be constituted by, for example, a field effect transistor (hereinafter, referred to as an FET). Further, the protective element 62 can be made to have a fusible conductor that is connected to one of the pair of electrodes on the charge and discharge path, is connected between the electrodes, and is short-circuited between the electrodes, and is connected to the soluble conductor in series to generate heat when the voltage is abnormal. The component of the heating element in which the fusible conductor is melted.

此電路60,依據從檢測電路35輸出之檢測訊號,在電池單元61之電壓值為超過既定過放電或過充電狀態之電壓時,進行下述控制,即,使保護元件63及短路元件1動作,將該電池單位64從充放電電流路徑遮斷,且使短路元件1之開關2短路,形成使該電池單位64旁通之旁通電流路徑。 The circuit 60 performs the following control, that is, the protection element 63 and the short-circuit element 1 when the voltage value of the battery unit 61 exceeds a predetermined over-discharge or over-charge state according to the detection signal output from the detection circuit 35. The battery unit 64 is blocked from the charge and discharge current path, and the switch 2 of the short-circuiting element 1 is short-circuited to form a bypass current path bypassing the battery unit 64.

上述電池包之電路60,在正常時,由於短路元件1之開關20開放,因此電流往保護元件63及電池單元61側流動。電路60,若在電池單元61偵測到電壓異常等,則藉由檢測電路35對保護元件63輸出異常訊號,藉由保護元件63將異常之電池單元61從電池包之充放電電流路徑上遮斷。 In the circuit 60 of the battery pack described above, since the switch 20 of the short-circuiting element 1 is opened, current flows to the side of the protective element 63 and the battery unit 61. In the circuit 60, if the battery unit 61 detects a voltage abnormality or the like, the detection circuit 35 outputs an abnormal signal to the protection element 63, and the protection element 63 shields the abnormal battery unit 61 from the charge and discharge current path of the battery pack. Broken.

其次,電路60,被控制成藉由檢測電路35對電流控制元件33亦輸出異常訊號,使電流往短路元件1之發熱體17流動。短路元件1藉由發熱體17對第1、第2可熔導體21,22加熱、使其熔融,藉此,熔融導體凝集、結合在第1、第2電極11,12上,使第1、第2電極11,12間短路。藉此,電路60能藉由短路元件1形成使電池單元61旁通之旁通電流路徑。此外,短路元件1,藉由第1、第2可熔導體21,22熔斷後使第3可熔導體23熔斷,停止對發熱體17之供電。 Next, the circuit 60 is controlled to output an abnormal signal to the current control element 33 by the detecting circuit 35 to cause current to flow to the heat generating body 17 of the short-circuiting element 1. The short-circuiting element 1 heats and melts the first and second meltable conductors 21, 22 by the heating element 17, whereby the molten conductor is aggregated and bonded to the first and second electrodes 11 and 12 to make the first The second electrodes 11, 12 are short-circuited. Thereby, the circuit 60 can form a bypass current path for bypassing the battery unit 61 by the short-circuiting element 1. Further, the short-circuiting element 1 is blown by the first and second fusible conductors 21, 22, and then the third fusible conductor 23 is blown, and the supply of power to the heating element 17 is stopped.

藉此,電路60,在一個電池單元61產生異常之情形,亦可形成透過短路元件1在該電池單元61迂迴之旁通電流路徑,可藉由其餘正常之電池單元61維持充放電功能。此時,於短路元件1,由於設有具有與被遮斷之電池單元61之內部電阻大致相同電阻值之保護元件62,因此電路60,在建構旁通電流路徑後亦能設為與正常時相同之電阻值。 Thereby, in the case where an abnormality occurs in one battery unit 61, the circuit 60 can also form a bypass current path through the short-circuiting element 1 in the battery unit 61, and the charge and discharge function can be maintained by the remaining normal battery unit 61. At this time, since the short-circuiting element 1 is provided with the protective element 62 having substantially the same resistance as the internal resistance of the battery unit 61 that is interrupted, the circuit 60 can be set to be normal after the bypass current path is constructed. The same resistance value.

此外,保護元件62亦可如圖13所示形成於短路元件1,或者亦可形成於電路60,而與短路元件1之第1電極端子部11a連接。 Further, the protective element 62 may be formed on the short-circuiting element 1 as shown in FIG. 13, or may be formed in the circuit 60 and connected to the first electrode terminal portion 11a of the short-circuiting element 1.

[第1~第3可熔導體] [1st to 3rd fusible conductors]

如上述般,第1~第3可熔導體21~23之任一個或全部亦可含有低熔點金屬與高熔點金屬。此時,第1~第3可熔導體21~23亦可如圖14(A)所示,使用作為內層設有Ag、Cu或以此等作為主成分之合金等構成的高熔點金屬層70、作為外層設有以Sn作為主成分之無鉛焊料等構成的低熔點金屬層71之可熔導體。此情形下,第1~第3可熔導體21~23亦可作成高熔點金屬層70之全面被低熔點金屬層71覆蓋之構造,亦可係除了相對向之一對側面外均被覆蓋的構造。高熔點金屬層70及低熔點金屬層71之被覆構 造,可使用鍍敷等公知之成膜技術來形成。 As described above, any one or all of the first to third fusible conductors 21 to 23 may contain a low melting point metal and a high melting point metal. In this case, as shown in FIG. 14(A), the first to third fusible conductors 21 to 23 may be formed of a high melting point metal layer which is formed of an alloy having Ag, Cu or the like as an essential component in the inner layer. 70. A fusible conductor of a low-melting-point metal layer 71 comprising a lead-free solder containing Sn as a main component as an outer layer. In this case, the first to third fusible conductors 21 to 23 may be formed such that the high-melting-point metal layer 70 is entirely covered by the low-melting-point metal layer 71, or may be covered except for one of the opposite sides. structure. Coating structure of high melting point metal layer 70 and low melting point metal layer 71 It can be formed by a known film forming technique such as plating.

又,如圖14(B)所示,第1~第3可熔導體21~23亦使用作為內層設有低熔點金屬層71、作為外層設有高熔點金屬層70之可熔導體。此情形下,第1~第3可熔導體21~23亦可作成低熔點金屬層71之全面被高熔點金屬層70覆蓋之構造,亦可係除了相對向之一對側面外均被覆蓋的構造。 Further, as shown in Fig. 14(B), the first to third fusible conductors 21 to 23 are also made of a fusible conductor having a low-melting-point metal layer 71 as an inner layer and a high-melting-point metal layer 70 as an outer layer. In this case, the first to third fusible conductors 21 to 23 may be formed such that the low-melting-point metal layer 71 is entirely covered by the high-melting-point metal layer 70, or may be covered except for one of the opposite sides. structure.

又,第1~第3可熔導體21~23亦可如圖15所示,作成積層有高熔點金屬層70與低熔點金屬層71之積層構造。 Further, as shown in FIG. 15, the first to third fusible conductors 21 to 23 may have a laminated structure in which a high-melting-point metal layer 70 and a low-melting-point metal layer 71 are laminated.

此情形下,如圖15(A)所示,第1~第3可熔導體21~23形成為由搭載於第1~第6電極11~16之下層與積層於下層之上之上層構成的雙層構造,可於作為下層之高熔點金屬層70之上面積層作為上層之低熔點金屬層71,相反地亦可於作為下層之低熔點金屬層71之上面積層作為上層之高熔點金屬層70。或者,第1~第3可熔導體21~23亦可如圖15(B)所示,形成為由內層與積層於內層之上下面之外層構成的三層構造,可於作為內層之高熔點金屬層70之上下面積層作為外層之低熔點金屬層71,相反地亦可於作為內層之低熔點金屬層71之上下面積層作為外層之高熔點金屬層70。 In this case, as shown in FIG. 15(A), the first to third fusible conductors 21 to 23 are formed by being mounted on the lower layer of the first to sixth electrodes 11 to 16 and the upper layer on the lower layer. The double-layer structure can be used as the upper layer of the low-melting-point metal layer 71 as the lower layer of the high-melting-point metal layer 70, or the upper layer of the high-melting-point metal layer 70 as the upper layer of the lower-layered low-melting-point metal layer 71. . Alternatively, as shown in FIG. 15(B), the first to third fusible conductors 21 to 23 may be formed as a three-layer structure composed of an inner layer and an outer layer laminated on the upper and lower layers of the inner layer, and may be used as an inner layer. The upper surface layer of the high-melting-point metal layer 70 serves as the outer layer of the low-melting-point metal layer 71, and conversely, the lower-area layer as the outer layer of the low-melting-point metal layer 71 as the inner layer.

又,第1~第3可熔導體21~23亦可如圖16所示,亦可為交互積層高熔點金屬層70與低熔點金屬層71之四層以上的多層構造。此情形下,第1~第3可熔導體21~23亦可為被構成最外層之金屬層覆蓋全面或除了相對向之一對側面外均被覆蓋的構造。 Further, as shown in FIG. 16, the first to third fusible conductors 21 to 23 may have a multilayer structure in which four or more layers of the high-melting-point metal layer 70 and the low-melting-point metal layer 71 are alternately laminated. In this case, the first to third fusible conductors 21 to 23 may have a structure in which the metal layer constituting the outermost layer is entirely covered or covered except for a pair of opposite sides.

又,第1~第3可熔導體21~23亦可於構成內層之低熔點 金屬層71之表面將高熔點金屬層70成條狀地局部積層。圖17係第1~第3可熔導體21~23之俯視圖。 Further, the first to third fusible conductors 21 to 23 may also constitute a low melting point of the inner layer. The surface of the metal layer 71 partially deposits the high melting point metal layer 70 in a strip shape. Fig. 17 is a plan view showing the first to third fusible conductors 21 to 23.

圖17(A)所示之第1~第3可熔導體21~23,係於低熔點金屬層71之表面於寬度方向相隔既定間隔在長度方向形成有複數條線狀之高熔點金屬層70,藉此沿著長度方向形成線狀之開口部72,低熔點金屬層71從此開口部72露出。第1~第3可熔導體21~23,藉由低熔點金屬層71從開口部72露出,熔融後之低熔點金屬與高熔點金屬之接觸面積增加,能更加促進高熔點金屬層70之侵蝕作用而提升熔斷性。開口部72能藉由例如對低熔點金屬層71施以構成高熔點金屬層70之金屬之部分鍍敷來加以形成。 The first to third fusible conductors 21 to 23 shown in FIG. 17(A) are formed by forming a plurality of linear high-melting-point metal layers 70 in the longitudinal direction at a predetermined interval in the width direction on the surface of the low-melting-point metal layer 71. Thereby, the linear opening portion 72 is formed along the longitudinal direction, and the low melting point metal layer 71 is exposed from the opening portion 72. The first to third fusible conductors 21 to 23 are exposed from the opening portion 72 by the low-melting-point metal layer 71, and the contact area between the molten low-melting metal and the high-melting-point metal is increased, and the erosion of the high-melting-point metal layer 70 can be further promoted. Act to improve the fuse. The opening portion 72 can be formed by, for example, plating a portion of the metal forming the high melting point metal layer 70 on the low melting point metal layer 71.

又,圖17(B)所示,第1~第3可熔導體21~23,亦可係於低熔點金屬層71之表面於長度方向相隔既定間隔在寬度方向形成複數條線狀之高熔點金屬層70,藉此沿著寬度方向形成線狀之開口部72。 Further, as shown in Fig. 17(B), the first to third fusible conductors 21 to 23 may be formed on the surface of the low-melting-point metal layer 71 so as to form a plurality of linear high melting points in the width direction at predetermined intervals in the longitudinal direction. The metal layer 70 is thereby formed with a linear opening portion 72 along the width direction.

又,第1~第3可熔導體21~23亦可如圖18所示,於低熔點金屬層71之表面形成高熔點金屬層70且於高熔點金屬層70全面形成圓形之開口部73,從此開口部73使低熔點金屬層71露出。開口部73能藉由例如對低熔點金屬層71施以構成高熔點金屬層70之金屬之局部鍍敷來加以形成。 Further, as shown in FIG. 18, the first to third fusible conductors 21 to 23 may form a high-melting-point metal layer 70 on the surface of the low-melting-point metal layer 71 and form a circular opening portion 73 in the high-melting-point metal layer 70. From this opening portion 73, the low-melting-point metal layer 71 is exposed. The opening portion 73 can be formed by, for example, applying a partial plating of a metal constituting the high melting point metal layer 70 to the low melting point metal layer 71.

第1~第3可熔導體21~23,藉由低熔點金屬層71從開口部73露出,熔融後之低熔點金屬與高熔點金屬之接觸面積增加,能更加促進高熔點金屬之侵蝕作用而提升熔斷性。 The first to third fusible conductors 21 to 23 are exposed from the opening 73 by the low-melting-point metal layer 71, and the contact area between the molten low-melting metal and the high-melting-point metal is increased, and the erosion of the high-melting-point metal can be further promoted. Improve the fuse.

又,第1~第3可熔導體21~23亦可如圖19所示,於作為內層之高熔點金屬層70形成多數個開口部74,於此高熔點金屬層70使用 鍍敷技術等成膜出低熔點金屬層71,並充填於開口部74內。藉此,第1~第3可熔導體21~23中,由於熔融之低熔點金屬接觸於高熔點金屬之面積增大,因此能在更短時間內由低熔點金屬將高熔點金屬溶蝕。 Further, as shown in FIG. 19, the first to third fusible conductors 21 to 23 may have a plurality of openings 74 formed in the high-melting-point metal layer 70 as an inner layer, and the high-melting-point metal layer 70 may be used. The low melting point metal layer 71 is formed by a plating technique or the like, and is filled in the opening portion 74. Thereby, in the first to third fusible conductors 21 to 23, since the area of the molten low melting point metal in contact with the high melting point metal is increased, the high melting point metal can be eroded by the low melting point metal in a shorter time.

又,第1~第3可熔導體21~23較佳為使低熔點金屬層71之體積形成為較高熔點金屬層70之體積大。第1~第3可熔導體21~23,係藉由發熱體17之發熱而被加熱,藉由低熔點金屬熔融而溶蝕高熔點金屬,藉此能迅速地熔融、熔斷。是以,第1~第3可熔導體21~23,藉由使低熔點金屬層71之體積形成為較高熔點金屬層70之體積大,而能促進此溶蝕作用,迅速地進行對第1、第2電極11,12上之熔融導體之凝集、結合、或者進行第5、第6電極15,16間之遮斷。 Further, it is preferable that the first to third fusible conductors 21 to 23 have a volume of the low-melting-point metal layer 71 formed to have a large volume of the higher-melting-point metal layer 70. The first to third fusible conductors 21 to 23 are heated by the heat generation of the heating element 17, and the high melting point metal is melted by the melting of the low melting point metal, whereby the melting and melting can be quickly performed. Therefore, the first to third fusible conductors 21 to 23 can be made to have the volume of the low-melting-point metal layer 71 as a bulk of the higher-melting-point metal layer 70, thereby promoting the dissolution and rapidly performing the first The molten conductors on the second electrodes 11, 12 are aggregated or bonded, or the fifth and sixth electrodes 15 and 16 are blocked.

此外,本發明之短路元件並不限於使用在鋰離子二次電池之電池包之情形,當然亦可應用在電子機器之電源線或數位訊號線等必須要電氣訊號之電流路徑之遮斷及旁通之各種用途。又,電流控制元件33之作動條件,並不限於電池單元61之電壓異常之情形,可藉由偵測例如周圍溫度之異常上升、被水淹沒等各種事故來作動。 In addition, the short-circuiting element of the present invention is not limited to the case of using a battery pack for a lithium ion secondary battery, and of course, it can also be applied to the interruption and side of a current path of an electric signal such as a power line or a digital signal line of an electronic device. Through a variety of uses. Further, the operation condition of the current control element 33 is not limited to the case where the voltage of the battery unit 61 is abnormal, and can be activated by detecting various accidents such as an abnormal rise in the ambient temperature and flooding.

1‧‧‧短路元件 1‧‧‧Short-circuit components

10‧‧‧絕緣基板 10‧‧‧Insert substrate

10a‧‧‧表面 10a‧‧‧ surface

11‧‧‧第1電極 11‧‧‧1st electrode

11a‧‧‧第1電極端子部 11a‧‧‧1st electrode terminal

12‧‧‧第2電極 12‧‧‧2nd electrode

12a‧‧‧第2電極端子部 12a‧‧‧2nd electrode terminal

13‧‧‧第3電極 13‧‧‧3rd electrode

14‧‧‧第4電極 14‧‧‧4th electrode

15‧‧‧第5電極 15‧‧‧5th electrode

15a‧‧‧下層部 15a‧‧‧Under the Ministry

15b‧‧‧上層部 15b‧‧‧Upper Department

16‧‧‧第6電極 16‧‧‧6th electrode

16a‧‧‧第6電極端子部 16a‧‧‧6th electrode terminal

17‧‧‧發熱體 17‧‧‧heating body

18‧‧‧絕緣層 18‧‧‧Insulation

19‧‧‧發熱體引出電極 19‧‧‧Feature body extraction electrode

20‧‧‧發熱體電極端子部 20‧‧‧heating electrode terminal

21‧‧‧第1可熔導體 21‧‧‧1st fusible conductor

22‧‧‧第2可熔導體 22‧‧‧2nd fusible conductor

23‧‧‧第3可熔導體 23‧‧‧3rd fusible conductor

25‧‧‧絕緣構件 25‧‧‧Insulating components

26‧‧‧構裝用焊料 26‧‧‧Building solder

27‧‧‧貫通孔 27‧‧‧through holes

28‧‧‧絕緣壁 28‧‧‧Insulated wall

29‧‧‧覆蓋構件 29‧‧‧ Covering components

29a‧‧‧側壁 29a‧‧‧ Sidewall

29b‧‧‧頂面部 29b‧‧‧ top face

29c‧‧‧覆蓋部電極 29c‧‧‧ Cover electrode

32‧‧‧助焊劑 32‧‧‧ Flux

Claims (44)

一種短路元件,具備:絕緣基板;發熱體;第1及第2電極,於上述絕緣基板彼此相鄰設置;第3電極,與上述第1電極相鄰設置;第4電極,與上述第2電極相鄰設置;第1可熔導體,搭載在從上述第1電極至上述第3電極,藉由來自上述發熱體之加熱,在上述第1電極與上述第3電極之間熔斷;第2可熔導體,搭載在從上述第2電極至上述第4電極,藉由來自上述發熱體之加熱,在上述第2電極與上述第4電極之間熔斷;第5電極,與上述發熱體電氣連接;第6電極,與上述第5電極相鄰設置;以及第3可熔導體,藉由搭載在從上述第5電極至上述第6電極而與上述發熱體串聯,藉由來自上述發熱體之加熱,在上述第5電極與上述第6電極之間熔斷;以來自上述發熱體之加熱使上述第1、第2可熔導體熔融,藉由凝集於上述第1、第2電極上之熔融導體結合以使上述第1、第2電極間短路。 A short-circuiting element comprising: an insulating substrate; a heating element; the first and second electrodes are disposed adjacent to the insulating substrate; the third electrode is disposed adjacent to the first electrode; and the fourth electrode and the second electrode Provided adjacent to each other; the first fusible conductor is mounted on the first electrode to the third electrode, and is melted between the first electrode and the third electrode by heating from the heating element; the second fusible The conductor is mounted on the second electrode to the fourth electrode, and is heated between the second electrode and the fourth electrode by heating from the heating element; and the fifth electrode is electrically connected to the heating element; a sixth electrode is disposed adjacent to the fifth electrode; and a third meltable conductor is mounted in series with the heat generating body from the fifth electrode to the sixth electrode, and is heated by the heat generating body. The fifth electrode and the sixth electrode are melted; the first and second meltable conductors are melted by heating from the heat generating body, and the molten conductors that are aggregated on the first and second electrodes are joined to each other. Short between the first and second electrodes . 如申請專利範圍第1項之短路元件,其中,藉由使上述第1、第2可熔導體熔融並使上述第1、第2電極間短路後,使上述第3可熔導體熔融,以遮斷對上述發熱體之供電路徑,停止發熱。 The short-circuiting element according to the first aspect of the invention, wherein the first and second meltable conductors are melted and the first and second electrodes are short-circuited, and the third meltable conductor is melted to cover The power supply path to the heating element is broken, and the heat is stopped. 如申請專利範圍第1或2項之短路元件,其中,上述第1電極與上述 第3電極、以及上述第2電極與上述第4電極分別電氣連接,且藉由絕緣構件而在物理上分離。 A short-circuiting element according to claim 1 or 2, wherein the first electrode and the above The third electrode and the second electrode are electrically connected to the fourth electrode, respectively, and are physically separated by an insulating member. 如申請專利範圍第1或2項之短路元件,其中,上述第1可熔導體及上述第2可熔導體搭載於較上述第3可熔導體接近上述發熱體之發熱中心的位置。 The short-circuiting element according to claim 1 or 2, wherein the first meltable conductor and the second meltable conductor are mounted closer to a heat generating center of the heat generating body than the third meltable conductor. 如申請專利範圍第1或2項之短路元件,其中,上述第1可熔導體及上述第2可熔導體厚度形成為較上述第3可熔導體薄。 The short-circuiting element according to claim 1 or 2, wherein the first fusible conductor and the second fusible conductor are formed to be thinner than the third fusible conductor. 如申請專利範圍第1或2項之短路元件,其中,上述第1可熔導體及上述第2可熔導體熔點較上述第3可熔導體低。 The short-circuiting element according to claim 1 or 2, wherein the first meltable conductor and the second meltable conductor have a lower melting point than the third meltable conductor. 如申請專利範圍第1或2項之短路元件,其中,上述第3可熔導體之材料構成係與上述第1及第2可熔導體相同。 The short-circuiting element according to claim 1 or 2, wherein the material structure of the third fusible conductor is the same as that of the first and second fusible conductors. 如申請專利範圍第1或2項之短路元件,其具備絕緣層,該絕緣層積層於上述絕緣基板之形成有上述第1~第4電極之表面側;上述第1~第4電極形成於上述絕緣層上;上述發熱體形成於上述絕緣層之內部或上述絕緣層與上述絕緣基板之間。 The short-circuiting element according to claim 1 or 2, further comprising: an insulating layer laminated on a surface side of the insulating substrate on which the first to fourth electrodes are formed; wherein the first to fourth electrodes are formed on the surface The heat generating body is formed inside the insulating layer or between the insulating layer and the insulating substrate. 如申請專利範圍第1或2項之短路元件,其中,上述發熱體形成於上述絕緣基板之內部。 The short-circuiting element according to claim 1 or 2, wherein the heat generating body is formed inside the insulating substrate. 如申請專利範圍第1或2項之短路元件,其中,上述發熱體形成於上述絕緣基板之與形成有上述第1~第4電極之表面相反側之背面。 The short-circuiting element according to claim 1 or 2, wherein the heat generating body is formed on a back surface of the insulating substrate opposite to a surface on which the first to fourth electrodes are formed. 如申請專利範圍第1或2項之短路元件,其中,上述發熱體及上述第1~第4電極形成於上述絕緣基板之形成有上述第1~第4電極之表面。 The short-circuiting element according to claim 1 or 2, wherein the heat generating body and the first to fourth electrodes are formed on a surface of the insulating substrate on which the first to fourth electrodes are formed. 一種短路元件,具備:絕緣基板;發熱體;第1及第2電極,於上述絕緣基板彼此相鄰設置;第3電極,與上述第1電極相鄰設置;第1可熔導體,搭載在從上述第1電極至上述第3電極,藉由來自上述發熱體之加熱,在上述第1電極與上述第3電極之間熔斷;第5電極,與上述發熱體電氣連接;第6電極,與上述第5電極相鄰設置;以及第3可熔導體,藉由搭載在從上述第5電極至上述第6電極而與上述發熱體串聯,藉由來自上述發熱體之加熱,在上述第5電極與上述第6電極之間熔斷;以來自上述發熱體之加熱而使上述第1可熔導體熔融,藉由凝集於上述第1電極上之熔融導體亦凝集於上述第2電極上以使上述第1、第2電極間短路。 A short-circuiting element comprising: an insulating substrate; a heating element; the first and second electrodes are disposed adjacent to each other on the insulating substrate; the third electrode is disposed adjacent to the first electrode; and the first soluble conductor is mounted on the first electrode The first electrode to the third electrode are blown between the first electrode and the third electrode by heating from the heating element; the fifth electrode is electrically connected to the heating element; and the sixth electrode is The fifth electrode is disposed adjacent to each other; and the third meltable conductor is mounted in series with the heat generating body from the fifth electrode to the sixth electrode, and is heated by the heat generating body to the fifth electrode and The sixth electrode is melted; the first meltable conductor is melted by heating from the heat generating body, and the molten conductor that is aggregated on the first electrode is also aggregated on the second electrode to make the first Short circuit between the second electrodes. 如申請專利範圍第12項之短路元件,其中,藉由使上述第1可熔導體熔融並使上述第1、第2電極間短路後,使上述第3可熔導體熔融,以遮斷對上述發熱體之供電路徑,停止發熱。 The short-circuiting element according to claim 12, wherein the first meltable conductor is melted and the first and second electrodes are short-circuited, and the third meltable conductor is melted to block the The heating path of the heating element stops heating. 如申請專利範圍第12或13項之短路元件,其中,上述第1電極與上述第3電極係電氣連接,且藉由絕緣構件而在物理上分離。 The short-circuiting element according to claim 12 or 13, wherein the first electrode and the third electrode are electrically connected to each other and are physically separated by an insulating member. 如申請專利範圍第12或13項之短路元件,其具備搭載於上述第2電極上之第2可熔導體; 以來自上述發熱體之加熱使上述第1、第2可熔導體熔融,藉由凝集於上述第1、第2電極上之熔融導體結合以使上述第1、第2電極間短路。 A short-circuiting element according to claim 12 or 13, comprising a second meltable conductor mounted on the second electrode; The first and second meltable conductors are melted by heating from the heat generating body, and the molten conductors that are aggregated on the first and second electrodes are coupled to each other to short-circuit the first and second electrodes. 如申請專利範圍第12或13項之短路元件,其中,上述第1可熔導體搭載於較上述第3可熔導體接近上述發熱體之發熱中心的位置。 The short-circuiting element according to claim 12 or 13, wherein the first meltable conductor is mounted at a position closer to a heat generating center of the heat generating body than the third meltable conductor. 如申請專利範圍第15項之短路元件,其中,上述第1可熔導體及上述第2可熔導體搭載於較上述第3可熔導體接近上述發熱體之發熱中心的位置。 The short-circuiting element according to claim 15, wherein the first meltable conductor and the second meltable conductor are mounted closer to a heat generating center of the heat generating body than the third meltable conductor. 如申請專利範圍第12或13項之短路元件,其中,上述第1可熔導體厚度形成為較上述第3可熔導體薄。 The short-circuiting element of claim 12 or 13, wherein the thickness of the first fusible conductor is formed to be thinner than the third fusible conductor. 如申請專利範圍第15項之短路元件,其中,上述第1可熔導體及上述第2可熔導體厚度形成為較上述第3可熔導體薄。 The short-circuiting element of claim 15, wherein the first fusible conductor and the second fusible conductor are formed to be thinner than the third fusible conductor. 如申請專利範圍第12或13項之短路元件,其中,上述第1可熔導體熔點較上述第3可熔導體低。 The short-circuiting element of claim 12 or 13, wherein the first meltable conductor has a lower melting point than the third meltable conductor. 如申請專利範圍第15項之短路元件,其中,上述第1可熔導體及上述第2可熔導體熔點較上述第3可熔導體低。 The short-circuiting element of claim 15, wherein the first meltable conductor and the second meltable conductor have a lower melting point than the third meltable conductor. 如申請專利範圍第12或13項之短路元件,其中,上述第3可熔導體之材料構成係與上述第1可熔導體相同。 The short-circuiting element of claim 12 or 13, wherein the material structure of the third fusible conductor is the same as that of the first fusible conductor. 如申請專利範圍第15項之短路元件,其中,上述第3可熔導體之材料構成係與上述第1及第2可熔導體相同。 The short-circuiting element of claim 15, wherein the material structure of the third fusible conductor is the same as that of the first and second fusible conductors. 如申請專利範圍第12或13項之短路元件,其具備絕緣層,該絕緣層積層於上述絕緣基板之形成有上述第1~第3電極之表面側;上述第1~第3電極形成於上述絕緣層上; 上述發熱體形成於上述絕緣層之內部或上述絕緣層與上述絕緣基板之間。 A short-circuiting element according to claim 12 or 13, comprising: an insulating layer laminated on a surface side of the insulating substrate on which the first to third electrodes are formed; wherein the first to third electrodes are formed On the insulation layer; The heat generating body is formed inside the insulating layer or between the insulating layer and the insulating substrate. 如申請專利範圍第12或13項之短路元件,其中,上述發熱體形成於上述絕緣基板之內部。 The short-circuiting element according to claim 12 or 13, wherein the heat generating body is formed inside the insulating substrate. 如申請專利範圍第12或13項之短路元件,其中,上述發熱體形成於上述絕緣基板之與形成有上述第1~第3電極之表面相反側之背面。 The short-circuiting element according to claim 12, wherein the heat generating body is formed on a back surface of the insulating substrate opposite to a surface on which the first to third electrodes are formed. 如申請專利範圍第12或13項之短路元件,其中,上述發熱體及上述第1~第3電極形成於上述絕緣基板之形成有上述第1~第3電極之表面。 The short-circuiting element according to claim 12, wherein the heat generating body and the first to third electrodes are formed on a surface of the insulating substrate on which the first to third electrodes are formed. 如申請專利範圍第1、2、12、13項中任一項之短路元件,其中,至少在上述第1電極及上述第2電極之表面被覆有Ni/Au鍍敷、Ni/Pd鍍敷、Ni/Pd/Au鍍敷之任一者。 The short-circuiting element according to any one of claims 1, 2, 12, and 13, wherein at least the surface of the first electrode and the second electrode is coated with Ni/Au plating, Ni/Pd plating, or Any of Ni/Pd/Au plating. 如申請專利範圍第1、2、12、13項中任一項之短路元件,其中,上述第1電極之面積較上述第3電極之面積廣。 The short-circuiting element according to any one of claims 1, 2, 12, and 13, wherein the area of the first electrode is larger than the area of the third electrode. 如申請專利範圍第1或2項之短路元件,其中,上述第1電極之面積較上述第3電極之面積廣,上述第2電極之面積較上述第4電極之面積廣。 The short-circuiting element according to claim 1 or 2, wherein the area of the first electrode is larger than the area of the third electrode, and the area of the second electrode is larger than the area of the fourth electrode. 如申請專利範圍第1、2、12、13項中任一項之短路元件,其具備:覆蓋構件,設在上述絕緣基板上用以保護內部;上述覆蓋構件,在與上述第1電極及上述第2電極重疊之位置形成有覆蓋部電極。 The short-circuiting element according to any one of claims 1, 2, 12, and 13, further comprising: a covering member provided on the insulating substrate to protect the inside; the covering member and the first electrode and the A cover electrode is formed at a position where the second electrodes overlap. 如申請專利範圍第1、2、12、13項中任一項之短路元件,其中,於上述第1電極或上述第2電極連接有保護電阻。 The short-circuiting element according to any one of claims 1, 2, 12, and 13, wherein a protective resistor is connected to the first electrode or the second electrode. 如申請專利範圍第1、2、12、13項中任一項之短路元件,其具備搭載於上述第2電極上之第2可熔導體;上述第1可熔導體及上述第2可熔導體係以Sn為主成分之無鉛焊料。 The short-circuiting element according to any one of claims 1, 2, 12, and 13, comprising a second fusible conductor mounted on the second electrode; the first fusible conductor and the second fusible guide The system uses Sn-based lead-free solder as the main component. 如申請專利範圍第1、2、12、13項中任一項之短路元件,其具備搭載於上述第2電極上之第2可熔導體;上述第1可熔導體及上述第2可熔導體含有低熔點金屬與高熔點金屬;上述低熔點金屬藉由來自上述發熱體之加熱而熔融,熔蝕上述高熔點金屬。 The short-circuiting element according to any one of claims 1, 2, 12, and 13, comprising a second fusible conductor mounted on the second electrode; the first fusible conductor and the second fusible conductor And comprising a low melting point metal and a high melting point metal; and the low melting point metal is melted by heating from the heating element to etch the high melting point metal. 如申請專利範圍第34項之短路元件,其中,上述低熔點金屬係焊料;上述高熔點金屬係Ag、Cu、或以Ag或Cu為主成分之合金。 The short-circuiting element according to claim 34, wherein the low-melting-point metal-based solder; the high-melting-point metal is Ag, Cu, or an alloy containing Ag or Cu as a main component. 如申請專利範圍第34項之短路元件,其中,上述第1可熔導體及上述第2可熔導體係內層為高熔點金屬、外層為低熔點金屬之被覆構造。 The short-circuiting element according to claim 34, wherein the inner layer of the first fusible conductor and the second fusible conductive system is a high melting point metal and the outer layer is a low melting point metal coating structure. 如申請專利範圍第34項之短路元件,其中,上述第1可熔導體及上述第2可熔導體係內層為低熔點金屬、外層為高熔點金屬之被覆構造。 The short-circuiting element of claim 34, wherein the inner layer of the first fusible conductor and the second fusible conductive system is a low melting point metal and the outer layer is a high melting point metal coating structure. 如申請專利範圍第34項之短路元件,其中,上述第1可熔導體及上述第2可熔導體係低熔點金屬與高熔點金屬積層之積層構造。 The short-circuiting element according to claim 34, wherein the first meltable conductor and the second meltable conductive system have a laminated structure of a low melting point metal and a high melting point metal layer. 如申請專利範圍第34項之短路元件,其中,上述第1可熔導體及上述第2可熔導體係低熔點金屬與高熔點金屬交互積層之4層以上之多層構造。 The short-circuiting element according to claim 34, wherein the first meltable conductor and the second meltable conductive system have a multilayer structure of four or more layers in which a low melting point metal and a high melting point metal are alternately laminated. 如申請專利範圍第34項之短路元件,其中,上述第1可熔導體及上述第2可熔導體,在形成於構成內層之低熔點金屬表面之高熔點金屬設有開口部。 The short-circuiting element according to claim 34, wherein the first fusible conductor and the second fusible conductor are provided with an opening portion in a high melting point metal formed on a surface of the low melting point metal constituting the inner layer. 如申請專利範圍第34項之短路元件,其中,上述第1可熔導體及上述第2可熔導體具有:具有多數個開口部之高熔點金屬層與形成於上述高熔點金屬層上之低熔點金屬層,於上述開口部充填有低熔點金屬。 The short-circuiting element of claim 34, wherein the first fusible conductor and the second fusible conductor have a high melting point metal layer having a plurality of openings and a low melting point formed on the high melting point metal layer The metal layer is filled with a low melting point metal in the opening. 如申請專利範圍第34項之短路元件,其中,上述第1可熔導體及上述第2可熔導體中,低熔點金屬之體積較高熔點金屬之體積大。 The short-circuiting element of claim 34, wherein among the first fusible conductor and the second fusible conductor, the volume of the low-melting-point metal is higher than the volume of the melting-point metal. 一種短路電路,具備:第1電路,具有第1保險絲、以及彼此相鄰形成且絕緣之第1、第2電極;以及第2電路,與上述第1電路電性上獨立形成,具有發熱體及與上述發熱體之一端連接之第2保險絲;藉由對上述第2電路通以電流而從上述發熱體發出之熱,使上述第1保險絲熔融且使上述第1、第2電極間短路後,使上述第2保險絲熔斷以停止上述發熱體之發熱。 A short circuit comprising: a first circuit; a first fuse; and first and second electrodes that are formed adjacent to each other and insulated; and a second circuit that is electrically formed independently of the first circuit and has a heating element and a second fuse connected to one end of the heating element; and the first fuse is melted and the first and second electrodes are short-circuited by heat generated by the heat generating body by applying a current to the second circuit. The second fuse is blown to stop the heat generation of the heat generating body. 如申請專利範圍第43項之短路電路,其中,上述第2電路中,上述發熱體及上述第2保險絲連接於電源及開關元件,藉由驅動上述開關元件以使電流流通。 A short circuit according to claim 43, wherein in the second circuit, the heating element and the second fuse are connected to a power source and a switching element, and the switching element is driven to cause a current to flow.
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CN108370016A (en) * 2015-11-20 2018-08-03 弗劳恩霍夫应用研究促进协会 Electric crossover assembly for bridging electric components, especially energy source or energy absorption device
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JP2015035286A (en) 2015-02-19
WO2015020103A1 (en) 2015-02-12
CN105453212A (en) 2016-03-30
KR20160040574A (en) 2016-04-14
JP6184238B2 (en) 2017-08-23
KR102233539B1 (en) 2021-03-29
TWI653796B (en) 2019-03-11
CN105453212B (en) 2018-06-12

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