TW201518711A - Image positioning method and apparatus - Google Patents
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Abstract
Description
本揭露是有關於一種影像定位方法及裝置。 The disclosure relates to an image positioning method and device.
在傳統的電路板外觀檢測過程中,大部分都是採取人工目視檢測的方式。然而,人工目視檢測會有個人主觀意識不同、工作疲勞或是其他因素,而造成檢測結果的差異。為了避免上述問題,目前常用光學檢測的方式來取代人工目視檢測。然而,若要使用習知光學檢測設備對電路板進行檢測,必須在電路板為靜止的狀態下,取得靜態的電路板畫面並進行分析。在產線上輸送電路板時,若是需要將電路板停止才能對電路板進行檢測,會降低產能。除此之外,由於大多數電路板的線路佈局十分複雜,若是使用傳統的光學檢測方式,以拍攝電路板正光源影像來進行分析,容易有分析錯誤的可能。 In the traditional board appearance inspection process, most of them are taken by manual visual inspection. However, manual visual inspection may have different subjective consciousness, work fatigue or other factors, resulting in differences in test results. In order to avoid the above problems, optical detection is often used instead of manual visual inspection. However, in order to detect a circuit board using a conventional optical detecting device, it is necessary to obtain a static board picture and analyze it while the board is stationary. When the board is transported on the production line, if it is necessary to stop the board to detect the board, the productivity will be reduced. In addition, since the layout of most circuit boards is very complicated, if the conventional optical detection method is used, it is easy to analyze errors by taking the image of the positive light source of the circuit board for analysis.
本揭露提供一種影像定位方法及裝置,可在物體為移動的狀態下拍攝所述物體的影像,進而獲得影像中所述物體與設計 檔中所述物體之間的座標轉換關係。 The present disclosure provides an image positioning method and apparatus for capturing an image of the object while the object is moving, thereby obtaining the object and design in the image. The coordinate conversion relationship between the objects in the file.
本揭露提出一種影像定位方法。所述方法包括下列步驟。於不同時間點擷取物體的第一影像、第二影像以及第三影像,其中所述物體包含第一透光部與第二透光部。利用第一透光部在第一影像與第二影像中的位置以及第一影像與第二影像的間隔時間,計算所述物體的移動速度。利用第一透光部與第二透光部在第一影像或第二影像中的位置,以及利用所述物體的移動速度,獲得第三影像中的該物體與設計檔中的該物體兩者之間的第一座標轉換關係。利用設計檔以及第一座標轉換關係,獲得設計檔中的元件於第三影像中的對應位置以定位元件。 The present disclosure proposes an image localization method. The method includes the following steps. The first image, the second image, and the third image of the object are captured at different time points, wherein the object includes a first light transmitting portion and a second light transmitting portion. The moving speed of the object is calculated by the position of the first light transmitting portion in the first image and the second image and the interval between the first image and the second image. Using the position of the first light transmitting portion and the second light transmitting portion in the first image or the second image, and using the moving speed of the object, obtaining the object in the third image and the object in the design file The first coordinate conversion relationship between. Using the design file and the first coordinate conversion relationship, the corresponding position of the component in the design file in the third image is obtained to locate the component.
本揭露提出一種影像定位裝置。所述裝置包括影像擷取單元以及計算單元。影像擷取單元於不同時間點擷取物體的第一影像、第二影像以及第三影像,其中所述物體包含第一透光部與第二透光部。計算單元耦接至影像擷取單元以接收第一影像、第二影像以及第三影像,其中計算單元利用第一透光部在第一影像與第二影像中的位置以及第一影像與第二影像的間隔時間,計算所述物體的移動速度。計算單元利用第一透光部與第二透光部在第一影像或第二影像中的位置,以及利用該物體的移動速度,獲得第三影像中的該物體與設計檔中的該物體兩者之間的第一座標轉換關係。計算單元利用設計檔以及第一座標轉換關係,獲得設計檔中的元件於第三影像中的對應位置以定位元件。 The present disclosure proposes an image positioning device. The device includes an image capture unit and a calculation unit. The image capturing unit captures the first image, the second image, and the third image of the object at different time points, wherein the object includes a first light transmitting portion and a second light transmitting portion. The computing unit is coupled to the image capturing unit to receive the first image, the second image, and the third image, wherein the calculating unit uses the position of the first light transmitting portion in the first image and the second image, and the first image and the second image The interval between images is used to calculate the moving speed of the object. The calculating unit uses the position of the first light transmitting portion and the second light transmitting portion in the first image or the second image, and uses the moving speed of the object to obtain the object in the third image and the object in the design file. The first coordinate conversion relationship between the two. The computing unit uses the design file and the first coordinate conversion relationship to obtain a corresponding position of the component in the design file in the third image to locate the component.
基於上述,本揭露的實施例所提出的影像定位方法及裝 置可利用於不同時間點擷取所述物體的不同影像,例如第一影像、第二影像以及第三影像。第一影像與第二影像可以被用來找出所述物體的第一透光部的位置,以及計算出所述物體的移動速度。利用第一透光部與第二透光部在第一影像或第二影像中的位置,以及利用所述物體的移動速度,可獲得第三影像中的該物體與設計檔中的該物體兩者之間的座標轉換關係。利用設計檔與座標轉換關係,可獲得設計檔中的元件在第三影像中的對應位置以定位元件。 Based on the above, the image positioning method and the device proposed by the embodiments of the present disclosure The device can be used to capture different images of the object at different time points, such as a first image, a second image, and a third image. The first image and the second image may be used to find the position of the first light transmitting portion of the object and calculate the moving speed of the object. Obtaining the object in the third image and the object in the design file by using the position of the first light transmitting portion and the second light transmitting portion in the first image or the second image, and using the moving speed of the object Coordinate conversion relationship between people. By using the design file and the coordinate conversion relationship, the corresponding position of the components in the design file in the third image can be obtained to locate the component.
為讓本揭露的上述特徵能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above features of the present disclosure more apparent, the following embodiments are described in detail with reference to the accompanying drawings.
100‧‧‧影像定位裝置 100‧‧‧Image Positioning Device
102‧‧‧影像擷取單元 102‧‧‧Image capture unit
104‧‧‧計算單元 104‧‧‧Computation unit
106、601‧‧‧電路板 106, 601‧‧‧ circuit board
108‧‧‧輸送帶 108‧‧‧Conveyor belt
110、112、114‧‧‧發光二極體 110, 112, 114‧‧‧Lighting diodes
116‧‧‧擴散板 116‧‧‧Diffuser
118、140‧‧‧背光影像 118, 140‧‧‧ Backlit images
120‧‧‧正光影像 120‧‧‧正光影像
122‧‧‧第一透光部 122‧‧‧First light transmission department
124‧‧‧第一推算位置 124‧‧‧First estimated position
126‧‧‧第二透光部 126‧‧‧Second light transmission department
128‧‧‧第二推算位置 128‧‧‧ second estimated position
420‧‧‧第一背光影像 420‧‧‧First backlit image
421、422、423、441、442、443、461、462、463‧‧‧透光部位置 421, 422, 423, 441, 442, 443, 461, 462, 463‧‧ ‧ light transmission position
440‧‧‧第二背光影像 440‧‧‧Second backlit image
460‧‧‧正光影像 460‧‧‧正光影像
464‧‧‧小搜尋區域 464‧‧‧Small search area
502‧‧‧元件 502‧‧‧ components
504‧‧‧透光部 504‧‧‧Transmission Department
602‧‧‧第一載具 602‧‧‧First Vehicle
604‧‧‧第二載具 604‧‧‧Second Vehicle
612、614‧‧‧定位孔 612, 614‧‧‧ positioning holes
622、624‧‧‧透光部 622, 624‧‧ ‧Lighting Department
L1、L2‧‧‧距離 L1, L2‧‧‧ distance
S202~S206、S302~S308、S502~S532‧‧‧步驟 S202~S206, S302~S308, S502~S532‧‧‧ steps
α‧‧‧角度 ‧‧‧‧ angle
圖1是依照本揭露一實施例說明一種影像定位裝置的示意圖。 FIG. 1 is a schematic diagram of an image positioning apparatus according to an embodiment of the present disclosure.
圖2是依照本揭露一實施例說明一種影像定位方法的流程圖。 FIG. 2 is a flowchart illustrating an image positioning method according to an embodiment of the disclosure.
圖3是依照本揭露再一實施例說明一種影像定位方法的流程圖。 FIG. 3 is a flowchart illustrating an image positioning method according to still another embodiment of the present disclosure.
圖4是依照本揭露一實施例說明於不同時間點擷取物體的不同影像的示意圖。 4 is a schematic diagram illustrating different images of objects captured at different points in time according to an embodiment of the disclosure.
圖5是依照本揭露另一實施例說明一種影像定位方法的流程 圖。 FIG. 5 is a flowchart illustrating an image positioning method according to another embodiment of the disclosure. Figure.
圖6是依照本揭露又一實施例說明一種影像定位方法的示意圖。 FIG. 6 is a schematic diagram of an image localization method according to still another embodiment of the present disclosure.
圖7是依照本揭露一實施例說明一種擷取影像的情境示意圖。 FIG. 7 is a schematic diagram of a scenario for capturing an image according to an embodiment of the disclosure.
圖8是依照本揭露一實施例說明一種將電路板配置在具有透光部的載具上的示意圖。 FIG. 8 is a schematic view showing a circuit board disposed on a carrier having a light transmitting portion according to an embodiment of the present disclosure.
圖9是依照本揭露另一實施例說明一種將電路板配置具有透光部的載具的示意圖。 FIG. 9 is a schematic view showing a carrier in which a circuit board is disposed with a light transmitting portion according to another embodiment of the present disclosure.
在本案說明書全文(包括申請專利範圍)中所使用的「耦接」一詞可指任何直接或間接的連接手段。舉例而言,若文中描述第一裝置耦接於第二裝置,則應該被解釋成該第一裝置可以直接連接於該第二裝置,或者該第一裝置可以透過其他裝置或某種連接手段而間接地連接至該第二裝置。另外,凡可能之處,在圖式及實施方式中使用相同標號的元件/構件/步驟代表相同或類似部分。不同實施例中使用相同標號或使用相同用語的元件/構件/步驟可以相互參照相關說明。 The term "coupled" as used throughout the specification (including the scope of the patent application) may be used in any direct or indirect connection. For example, if the first device is described as being coupled to the second device, it should be construed that the first device can be directly connected to the second device, or the first device can be connected through other devices or some kind of connection means. Connected to the second device indirectly. In addition, wherever possible, the elements and/ Elements/components/steps that use the same reference numbers or use the same terms in different embodiments may refer to the related description.
本揭露的下述諸實施例提供影像定位方法及裝置,其可在不同時間點對移動狀態下的物體(例如電路板或其他產品)擷取不同影像(例如背光影像與正光影像)。利用分析物體的背光影 像可以找出所述物體的第一透光部在背光影像中的位置。利用第一透光部在背光影像中的位置以及利用所述物體的移動速度,可獲得正光影像中的物體與設計檔中的該物體兩者之間的座標轉換關係。所述座標轉換關係可以應用於對所述物體的外觀檢測分析或其他生產線檢查程序。 The following embodiments of the present disclosure provide an image positioning method and apparatus that can capture different images (eg, a backlit image and a positive light image) of an object (eg, a circuit board or other product) in a moving state at different points in time. Use the backlit shadow of the analyzed object The position of the first light transmitting portion of the object in the backlight image can be found. By using the position of the first light transmitting portion in the backlight image and the moving speed of the object, a coordinate conversion relationship between the object in the positive light image and the object in the design file can be obtained. The coordinate conversion relationship can be applied to an appearance detection analysis of the object or other line inspection procedures.
圖1是依照本揭露一實施例說明一種影像定位裝置100的示意圖。影像定位裝置100包括影像擷取單元102以及計算單元104。影像定位裝置100例如是配置在生產線的光學檢測設備,或是其他可以用來檢測處於移動狀態下的產品的系統/裝置。影像擷取單元102可以是攝影機、監視器、數位相機或是任何具有影像擷取功能的裝置。計算單元104耦接影像擷取單元102,計算單元104可以是筆記型電腦、個人電腦、工作站、平板電腦或其他具有計算功能的裝置。 FIG. 1 is a schematic diagram of an image positioning apparatus 100 according to an embodiment of the present disclosure. The image positioning device 100 includes an image capturing unit 102 and a computing unit 104. The image localization device 100 is, for example, an optical detection device disposed on a production line, or other system/device that can be used to detect a product in a moving state. The image capturing unit 102 can be a camera, a monitor, a digital camera, or any device having an image capturing function. The computing unit 104 is coupled to the image capturing unit 102. The computing unit 104 can be a notebook computer, a personal computer, a workstation, a tablet computer, or other computing device.
在本實施例中,需要進行檢測的物體被例舉為電路板106,如圖1所示。電路板106會經由輸送帶108進行輸送。電路板106的前方配置有至少一個光源,例如圖1所示發光二極體(light emitting diode,LED)110與112分別選擇性地配置於影像擷取單元102的上方與/或下方。LED 110配置在影像擷取單元102上方,而LED 112配置在影像擷取單元102與電路板106之間。LED 110與LED 112可以選擇性地配置擴散板。LED 110與LED 112用以當作拍攝電路板106的正光影像時所使用的正光源。電路板106的下方配置有至少一個光源,例如圖1所示LED 114。LED 114用以當作拍攝電路板106的背光影像時所使用的背光源。除此之外,在LED 114之上更配置有擴散板116。LED 114的光透過擴散板116後會更加均勻。 In the present embodiment, the object to be detected is exemplified as the circuit board 106, as shown in FIG. Circuit board 106 is conveyed via conveyor belt 108. At least one light source is disposed in front of the circuit board 106. For example, the light emitting diodes (LEDs) 110 and 112 are respectively disposed above and/or below the image capturing unit 102. The LED 110 is disposed above the image capturing unit 102, and the LED 112 is disposed between the image capturing unit 102 and the circuit board 106. The LED 110 and the LED 112 can selectively configure the diffusion plate. The LED 110 and the LED 112 are used as a positive light source for use in capturing a positive light image of the circuit board 106. Below the circuit board 106 is disposed at least one light source, such as the LED 114 shown in FIG. LED 114 is used as a backlight used when capturing a backlit image of the circuit board 106. In addition to this, a diffusion plate 116 is further disposed above the LED 114. The light of the LED 114 is more uniform after passing through the diffuser 116.
當電路板106進行外觀檢測時,藉由控制LED 110、LED 112與/或LED 114的關閉或開啟,影像擷取單元102可於不同時間點分別拍攝處於移動狀態的電路板106的背光影像118以及正光影像120,並儲存於計算單元104中。例如在一些實施例中,在電路板106經由輸送帶108輸送的過程中LED 114會持續的打光,因此在LED 110與LED 112關閉的期間影像擷取單元102可以拍攝電路板106的背光影像118,而在LED 110與LED 112開啟的期間影像擷取單元102可以拍攝電路板106的正光影像120。又例如在另一些實施例中,在LED 110與LED 112關閉的期間LED 114被開啟,因此影像擷取單元102可以拍攝處於移動狀態的電路板106的背光影像118;以及在LED 110與LED 112開啟的期間LED 114被關閉,因此影像擷取單元102可以拍攝處於移動狀態的電路板106的正光影像120。 When the circuit board 106 performs the appearance detection, by controlling the LED 110, the LED 112 and/or the LED 114 to be turned off or on, the image capturing unit 102 can respectively capture the backlight image 118 of the circuit board 106 in the moving state at different time points. And the positive light image 120 is stored in the computing unit 104. For example, in some embodiments, the LEDs 114 are continuously illuminated during the transport of the circuit board 106 via the conveyor belt 108, so that the image capture unit 102 can capture the backlit image of the circuit board 106 while the LEDs 110 and LEDs 112 are off. 118, while the image capturing unit 102 can capture the positive light image 120 of the circuit board 106 while the LED 110 and the LED 112 are turned on. For another example, in other embodiments, the LED 114 is turned on during the period when the LED 110 and the LED 112 are turned off, so the image capturing unit 102 can capture the backlight image 118 of the board 106 in a moving state; and at the LED 110 and the LED 112. The LED 114 is turned off during the turn-on period, so the image capturing unit 102 can capture the positive light image 120 of the board 106 in a moving state.
另一方面,計算單元104可以從儲存媒體中讀入電路板106的設計檔(例如:電路板106的製作規格檔案,又稱fab檔)。電路板106的所述設計檔包含了電路板106在製造程序中的詳細資訊,例如:電路板106上所有的元件的連接關係、元件接點位置、元件規格、元件位置以及/或者元件與電路板106邊界之距離等等資訊。在本實施例中,影像定位裝置100並不侷限只能應用 在電路板106上,也可應用在電子零件或是其他待測的移動物品上。 On the other hand, the computing unit 104 can read the design file of the circuit board 106 from the storage medium (for example, the production specification file of the circuit board 106, also known as the fab file). The design file of the circuit board 106 contains detailed information of the circuit board 106 in the manufacturing process, such as: connection relationship of all components on the circuit board 106, component contact position, component specifications, component position, and/or component and circuit. The distance between the boundaries of the board 106 and the like. In this embodiment, the image positioning apparatus 100 is not limited to application only. On the circuit board 106, it can also be applied to electronic parts or other moving objects to be tested.
圖2是依照本揭露一實施例說明一種影像定位方法的流程圖。以下即搭配圖1的各個單元來說明本實施例中的各個步驟。請同時參照圖1及圖2,在步驟S202中,在電路板106經由輸送帶108運送的過程中,影像擷取單元102會在不同的時間點擷取電路板106的背光影像以及正光影像。例如,藉由控制LED 110、LED 112與/或LED 114的關閉或開啟,影像擷取單元102可在第一時間點拍攝由背光源(例如LED 114)所照射的電路板106的背光影像118作為所述背光影像,以及在第二時間點拍攝由正光源(例如LED 110與/或LED 112)所照射的電路板106的正光影像120作為所述正光影像。其中,所述第一時間點可以早於所述第二時間點。在其他實施例中所述第一時間點可以晚於所述第二時間點。 FIG. 2 is a flowchart illustrating an image positioning method according to an embodiment of the disclosure. The respective steps in this embodiment will be described below in conjunction with the respective units of FIG. Referring to FIG. 1 and FIG. 2 simultaneously, in step S202, during the process of transporting the circuit board 106 via the conveyor belt 108, the image capturing unit 102 captures the backlight image and the positive light image of the circuit board 106 at different time points. For example, by controlling the LED 110, LED 112, and/or LED 114 to be turned off or on, the image capture unit 102 can capture a backlight image 118 of the circuit board 106 illuminated by a backlight (eg, LED 114) at a first point in time. As the backlight image, a positive light image 120 of the circuit board 106 illuminated by a positive light source (for example, LED 110 and/or LED 112) is taken as the positive light image at a second time point. The first time point may be earlier than the second time point. In other embodiments the first point in time may be later than the second point in time.
電路板106包含至少一個透光部,例如圖1所示第一透光部122與第二透光部126。第一透光部122與第二透光部126可以是電路板106的透孔(Plating Through Hole)或是電路板上其他可以透光的部份(例如:定位孔、螺絲孔或電性元件的插孔)。背光影像118可以提供高反差(高對比度)影像,使得計算單元104可以容易地分辨識出第一透光部122與第二透光部126在背光影像118中的位置。在其他實施例中,為了讓計算單元104更容易辨識背光影像118中的透光部122與126,計算單元104可對背光 影像118進行二值化處理,以提升影像的對比度。 The circuit board 106 includes at least one light transmitting portion, such as the first light transmitting portion 122 and the second light transmitting portion 126 shown in FIG. The first light transmitting portion 122 and the second light transmitting portion 126 may be a through hole of the circuit board 106 or other light transmissive portions on the circuit board (for example, a positioning hole, a screw hole or an electrical component) Jack). The backlight image 118 can provide a high contrast (high contrast) image, so that the computing unit 104 can easily distinguish the positions of the first light transmitting portion 122 and the second light transmitting portion 126 in the backlight image 118. In other embodiments, in order to make the computing unit 104 more easily recognize the light transmitting portions 122 and 126 in the backlight image 118, the computing unit 104 may be opposite to the backlight. The image 118 is binarized to enhance the contrast of the image.
在一些應用例中,輸送帶108的移動速度可依照使用者的需求進行調整。也就是說,輸送帶108的移動速度(即電路板106的移動速度)可以事先獲知,並將電路板106的移動速度輸入至計算單元104。因此,在步驟S204中,影像定位裝置100可提供電路板106在輸送帶108上的移動速度。在另一些實施例中,當無法預先獲知並提供電路板106的移動速度時,也可藉由其它方式得知電路板106在輸送帶108上的移動速度,詳細方式容後詳述。 In some applications, the speed of movement of the conveyor belt 108 can be adjusted to the needs of the user. That is, the moving speed of the conveyor belt 108 (i.e., the moving speed of the circuit board 106) can be known in advance, and the moving speed of the circuit board 106 is input to the calculating unit 104. Therefore, in step S204, the image localizing apparatus 100 can provide the moving speed of the circuit board 106 on the conveyor belt 108. In other embodiments, when the moving speed of the circuit board 106 cannot be known and provided in advance, the moving speed of the circuit board 106 on the conveyor belt 108 can be known by other means, and the detailed manner will be described in detail later.
接著,在步驟S206中,計算單元104可以利用電路板106的第一透光部122及/或第二透光部126在背光影像(例如圖1所示背光影像118)中的位置,以及利用電路板106的移動速度,獲得正光影像(例如圖1所示正光影像120)中的電路板106與設計檔(例如fab檔)中的電路板106兩者之間的第一座標轉換關係。 Next, in step S206, the calculation unit 104 can utilize the position of the first light transmitting portion 122 and/or the second light transmitting portion 126 of the circuit board 106 in the backlight image (for example, the backlight image 118 shown in FIG. 1), and utilize The speed of movement of the circuit board 106 results in a first coordinate conversion relationship between the circuit board 106 in the positive light image (e.g., the positive light image 120 shown in FIG. 1) and the circuit board 106 in the design file (e.g., fab file).
以下將詳細說明在步驟S206中,計算單元104如何獲得正光影像(例如圖1所示正光影像120)中的電路板106與設計檔(例如fab檔)中的電路板106兩者之間的第一座標轉換關係。請參考圖1,計算單元104可以利用電路板106的第一透光部122在背光影像118中的位置,以及電路板106的移動速度,推算出電路板106的第一透光部122在正光影像120中的第一推算位置124。以此類推,計算單元104可以利用電路板106的第二透光部126在背光影像118中的位置,以及電路板106的移動速度,推算 出電路板106的第二透光部126在正光影像120中的推算位置128。接著,計算單元104將正光影像120中的第一推算位置124與電路板106的第一透光部122在設計檔中的位置進行比對,以獲得正光影像120中的電路板106與設計檔中的電路板106兩者之間的第二座標轉換關係。在理想狀態下,正光影像120中的第一推算位置124應為電路板106的第一透光部122在正光影像120中的實際位置,因此計算單元104可直接使用所述第二座標轉換關係作為圖2中步驟S206所述的第一座標轉換關係。在實際操作環境中,在電路板106從第一時間點至第二時間點的移動過程中可能會發生變異事件(例如因為輸送帶108的振動而使電路板106發生微幅轉動/移動),使得正光影像120中的第一推算位置124與電路板106的第一透光部122在正光影像120中的實際位置二者之間可能具有位置誤差。若此位置誤差是在容許範圍內,則計算單元104還是可以直接使用所述第二座標轉換關係作為圖2中步驟S206所述的第一座標轉換關係。 In the following, in detail, in step S206, the calculation unit 104 obtains the first between the circuit board 106 in the positive light image (for example, the positive light image 120 shown in FIG. 1) and the circuit board 106 in the design file (for example, the fab file). A standard conversion relationship. Referring to FIG. 1 , the calculation unit 104 can estimate the position of the first light transmitting portion 122 of the circuit board 106 in the backlight image 118 and the moving speed of the circuit board 106 to calculate the first light transmitting portion 122 of the circuit board 106 in the positive light. The first estimated position 124 in the image 120. By analogy, the calculation unit 104 can calculate the position of the second light transmitting portion 126 of the circuit board 106 in the backlight image 118 and the moving speed of the circuit board 106. The second light transmitting portion 126 of the output circuit board 106 is at an estimated position 128 in the positive light image 120. Next, the calculating unit 104 compares the first estimated position 124 in the positive light image 120 with the position of the first light transmitting portion 122 of the circuit board 106 in the design file to obtain the circuit board 106 and the design file in the positive light image 120. The second coordinate conversion relationship between the boards 106 in the middle. In an ideal state, the first estimated position 124 in the positive light image 120 should be the actual position of the first light transmitting portion 122 of the circuit board 106 in the positive light image 120. Therefore, the calculating unit 104 can directly use the second coordinate conversion relationship. The first coordinate conversion relationship described in step S206 in FIG. In an actual operating environment, a variability event may occur during movement of the board 106 from the first time point to the second time point (eg, the board 106 is slightly rotated/moved due to vibration of the conveyor belt 108), There may be a positional error between the first estimated position 124 in the positive light image 120 and the actual position of the first light transmitting portion 122 of the circuit board 106 in the positive light image 120. If the position error is within the allowable range, the calculation unit 104 can directly use the second coordinate conversion relationship as the first coordinate conversion relationship described in step S206 of FIG.
一般而言,電路板106的電路佈局十分複雜,元件之間排列的也十分緊密。計算單元104要由影像擷取單元102所拍攝的正光影像120中,準確地辨識出電路板106的透光部正確位置可能需要花費大量的時間,尤其是當電路板106具有不只一個的透光部時。 In general, the circuit layout of the circuit board 106 is very complicated, and the components are arranged very closely. It may take a lot of time for the computing unit 104 to accurately recognize the correct position of the light transmitting portion of the circuit board 106 in the positive light image 120 captured by the image capturing unit 102, especially when the circuit board 106 has more than one light transmission. Ministry time.
因此,當電路板106具有多個透光部時,在本揭露一實施例中,由於計算單元104可在電路板106的設計檔中獲得電路 板106的多個透光部座標。因此,計算單元104藉由使用所述第二座標轉換關係,依據電路板106的多個透光部在設計檔的多個座標位置推算出多個透光部在正光影像120中的多個推算位置。在推算出多個透光部在正光影像120中的多個推算位置之後,計算單元104可依據電路板106的多個透光部在正光影像120中的多個推算位置定義出多個小搜尋區域。接著,計算單元104分別在正光影像120中的多個小搜尋區域內進行實際透光部影像搜尋,以找出電路板106的這些透光部在正光影像120中的實際位置。 Therefore, when the circuit board 106 has a plurality of light transmitting portions, in an embodiment of the present disclosure, since the computing unit 104 can obtain the circuit in the design file of the circuit board 106 The plurality of light transmitting portions of the plate 106 are coordinate. Therefore, by using the second coordinate conversion relationship, the calculating unit 104 estimates a plurality of projections of the plurality of light transmitting portions in the positive light image 120 according to the plurality of light transmitting portions of the circuit board 106 at a plurality of coordinate positions of the design file. position. After calculating a plurality of estimated positions of the plurality of light transmitting portions in the positive light image 120, the calculating unit 104 may define a plurality of small searches according to the plurality of light emitting portions of the circuit board 106 in the plurality of estimated positions in the positive light image 120. region. Next, the calculation unit 104 performs an actual light transmission portion image search in a plurality of small search regions in the positive light image 120 to find the actual position of the light transmitting portions of the circuit board 106 in the positive light image 120.
由於輸送帶108的振動或是其他因素,計算單元104推算出的多個透光部推算位置不一定是電路板106中多個透光部在正光影像120中的實際位置。無論如何,在正光影像120中這些透光部的推算位置依然是用來找出在正光影像120中這些透光部的實際位置的重要線索。因此,計算單元104可以依據在正光影像120中這些透光部的推算位置分別定義出多個小搜尋區域,以加速找出在正光影像120中這些透光部的實際位置。舉例來說,計算單元104可以在正光影像120中這些透光部的推算位置的其中一個透光部的推算位置當做一個小搜尋區域的圓心,而以所述其中一個透光部的半徑乘以預設倍率(例如10倍)作為所述小搜尋區域的半徑。計算單元104可以在所述小搜尋區域內進行影像分析以搜尋所述其中一個透光部在正光影像120中的實際位置。電路板106的其他透光部亦可以參照所述其中一個透光部的相關 說明來找出在正光影像120中的實際位置。在本實施例中,使用者可依照實際需求調整所述小搜尋區域的範圍。若是在正光影像120的所述多個小搜尋區域內皆無法經由影像處理搜尋到電路板106的透光部的實際位置,則計算單元104可以直接使用所述第二座標轉換關係作為圖2中步驟S206所述的第一座標轉換關係。 Due to the vibration of the conveyor belt 108 or other factors, the plurality of light transmitting portion estimation positions calculated by the calculating unit 104 are not necessarily the actual positions of the plurality of light transmitting portions in the circuit board 106 in the positive light image 120. In any event, the estimated positions of the light transmissive portions in the positive light image 120 are still important clues for finding the actual position of the light transmissive portions in the positive light image 120. Therefore, the calculating unit 104 can respectively define a plurality of small search regions according to the estimated positions of the light transmitting portions in the positive light image 120 to accelerate the finding of the actual positions of the light transmitting portions in the positive light image 120. For example, the calculation unit 104 may calculate the estimated position of one of the light transmitting portions of the light-transmitting portions in the positive light image 120 as the center of a small search region, and multiply the radius of the one of the light-transmitting portions by A preset magnification (for example, 10 times) is used as the radius of the small search area. The computing unit 104 may perform image analysis in the small search area to search for the actual position of the one of the light transmitting portions in the positive light image 120. Other light transmitting portions of the circuit board 106 may also refer to the correlation of one of the light transmitting portions. The description is to find the actual position in the positive light image 120. In this embodiment, the user can adjust the range of the small search area according to actual needs. If the actual position of the light transmitting portion of the circuit board 106 cannot be searched through the image processing in the plurality of small search areas of the positive light image 120, the calculating unit 104 may directly use the second coordinate conversion relationship as the second coordinate conversion relationship in FIG. The first coordinate conversion relationship described in step S206.
另一方面,若是計算單元104在多個小搜尋區域內分別搜尋到電路板106的透光部的實際位置,則計算單元104比對電路板106的這些透光部在正光影像120中的多個實際位置以及電路板106的多個透光部在設計檔中的位置,以獲得正光影像120中的電路板106與設計檔中的電路板106兩者之間的所述第一座標轉換關係。 On the other hand, if the computing unit 104 searches for the actual position of the light transmitting portion of the circuit board 106 in the plurality of small search areas, the calculating unit 104 compares the light transmitting portions of the circuit board 106 in the positive light image 120. The actual position and the position of the plurality of light transmissive portions of the circuit board 106 in the design file to obtain the first coordinate conversion relationship between the circuit board 106 in the positive light image 120 and the circuit board 106 in the design file. .
當電路板106在輸送過程中,因機台的振動或是其他的外力因素而可能造成電路板106在輸送帶108上的方向角發生改變,進而使在背光影像118中電路板106的方向角與在正光影像120中電路板106的方向角二者之間存在誤差。計算單元104可以取得電路板106的第一透光部122與第二透光部126在背光影像118中的位置,接著計算單元104利用第一透光部122與第二透光部126在背光影像118中的位置,以及利用電路板106的移動速度,推算出第一透光部122與第二透光部126在正光影像120中的第一推算位置124與第二推算位置128(請參照步驟S206的相關說明而類推之)。計算單元104比對電路板106的第一透光部122與第二透光部126在正光影像120中的第一推算位置124與第二 推算位置128以及第一透光部122與第二透光部126在設計檔中的位置,以及依據比較結果計算正光影像120中電路板106的位置與方向角,以及進而獲得正光影像120中的電路板106與設計檔中的電路板106兩者之間的所述第一座標轉換關係。 When the circuit board 106 is in the process of transportation, the direction angle of the circuit board 106 on the conveyor belt 108 may be changed due to vibration of the machine table or other external force factors, thereby causing the direction angle of the circuit board 106 in the backlight image 118. There is an error between the direction angle of the board 106 in the positive light image 120. The calculating unit 104 can obtain the position of the first light transmitting portion 122 and the second light transmitting portion 126 of the circuit board 106 in the backlight image 118, and then the calculating unit 104 uses the first light transmitting portion 122 and the second light transmitting portion 126 in the backlight. The position in the image 118 and the moving speed of the circuit board 106 are used to calculate the first estimated position 124 and the second estimated position 128 of the first light transmitting portion 122 and the second light transmitting portion 126 in the positive light image 120 (please refer to Corresponding description of step S206 and the like). The calculating unit 104 compares the first light transmitting portion 122 and the second light transmitting portion 126 of the circuit board 106 in the first estimated position 124 and the second in the positive light image 120. Calculating the position of the first light transmitting portion 122 and the second light transmitting portion 126 in the design file, and calculating the position and direction angle of the circuit board 106 in the positive light image 120 according to the comparison result, and further obtaining the positive light image 120 The first coordinate conversion relationship between the circuit board 106 and the circuit board 106 in the design file.
另一方面,計算單元104在獲得第一座標轉換關係後,可利用設計檔中元件之位置資訊(如元件與透光部之相對位置關係、或是元件於設計檔之位置座標)以及上述的第一座標轉換關係,以獲得設計檔中的元件於正光影像120中的對應位置,並定位(例如是以投影的方式)至正光影像120中。 On the other hand, after obtaining the first coordinate conversion relationship, the calculation unit 104 can utilize the position information of the components in the design file (such as the relative positional relationship between the component and the light transmitting portion, or the position coordinate of the component in the design file) and the above The first mark conversion relationship is to obtain the corresponding position of the component in the design file in the positive light image 120, and is positioned (for example, in a projection manner) into the positive light image 120.
綜上所述,在正光影像120中電路板106的定位特徵和周圍區域之間的反差不夠大,因此較不易找出在正光影像120中電路板106的定位特徵。上述實施例利用背光影像118可快速找出電路板106的透光部。再者,若用影像擷取單元102從上視角拍攝整個電路板106影像,有些定位特徵會被鄰近或上方的元件遮蔽而不易找出定位特徵。由於透光部特徵上方通常不存在遮蔽物,因此上述實施例可利用背光影像118快速找出透光部作為定位特徵。當影像定位裝置100可事先獲知電路板106的移動速度時,計算單元104可依據背光影像118中電路板106的透光部的位置而快速地獲得在正光影像120中電路板106的透光部的位置,進而獲得正光影像120中的電路板106與設計檔(例如fab檔)中的電路板106兩者之間的第一座標轉換關係。所述第一座標轉換關係可以應用於對電路板106的外觀檢測分析或其他生產線檢 查程序。所述背光影像118與所述正光影像120可以在不同時間點分別被擷取,因此在電路板106為移動狀態下可以對電路板106進行外觀檢測分析、偵測電路板旋轉角度以及/或者將電路板106的元件資訊投影至正光影像120中。 In summary, the contrast between the positioning features of the circuit board 106 and the surrounding area in the positive light image 120 is not sufficiently large, so that the positioning features of the circuit board 106 in the positive light image 120 are less likely to be found. The above embodiment utilizes the backlight image 118 to quickly find the light transmitting portion of the circuit board 106. Moreover, if the image capture unit 102 is used to capture the entire circuit board 106 image from the upper perspective, some of the positioning features may be obscured by adjacent or upper components and the positioning features may not be easily found. Since the shielding is generally not present above the light transmitting portion feature, the above embodiment can quickly find the light transmitting portion as the positioning feature by using the backlight image 118. When the image positioning device 100 can know the moving speed of the circuit board 106 in advance, the calculating unit 104 can quickly obtain the light transmitting portion of the circuit board 106 in the positive light image 120 according to the position of the light transmitting portion of the circuit board 106 in the backlight image 118. The position, in turn, obtains a first coordinate conversion relationship between the circuit board 106 in the positive light image 120 and the circuit board 106 in the design file (eg, the fab file). The first coordinate conversion relationship can be applied to the appearance detection analysis of the circuit board 106 or other production line inspection. Check the program. The backlight image 118 and the positive light image 120 can be respectively captured at different time points. Therefore, when the circuit board 106 is in a moving state, the appearance and analysis of the circuit board 106 can be performed, the rotation angle of the circuit board can be detected, and/or The component information of the circuit board 106 is projected into the positive light image 120.
在另一實施例中,當影像定位裝置100無法事先獲知電路板106的移動速度時,影像定位裝置100可藉由進行圖3所示實施例以計算出電路板106的移動速度。 In another embodiment, when the image positioning apparatus 100 cannot know the moving speed of the circuit board 106 in advance, the image positioning apparatus 100 can calculate the moving speed of the circuit board 106 by performing the embodiment shown in FIG.
圖3是依照本揭露再一實施例說明一種影像定位方法的流程圖。圖4是依照本揭露一實施例說明於不同時間點擷取物體的不同影像的示意圖。圖4所示實施例可以參照圖1的相關說明而類推之。請同時參照圖3與圖4,在電路板106經由輸送帶108運送的過程中,影像擷取單元102會在不同的時間點擷取電路板106的第一影像、第二影像以及第三影像(步驟S302)。舉例來說,影像擷取單元102可以在第一時間點與第二時間點分別擷取電路板106的背光影像118與背光影像140作為所述第一影像與所述第二影像,以及在第三時間點擷取電路板106的正光影像120作為所述第三影像。例如,藉由控制LED 110、LED 112與/或LED 114的關閉或開啟,影像擷取單元102可在第一時間點拍攝由背光源(例如LED 114)所照射的電路板106的背光影像118,以及在第二時間點拍攝由背光源(LED 114)所照射的電路板106的背光影像140,以及在第三時間點拍攝由正光源(例如LED 110與/或LED 112)所照射的電路板106的正光影像120。 FIG. 3 is a flowchart illustrating an image positioning method according to still another embodiment of the present disclosure. 4 is a schematic diagram illustrating different images of objects captured at different points in time according to an embodiment of the disclosure. The embodiment shown in FIG. 4 can be analogized with reference to the related description of FIG. 1. Referring to FIG. 3 and FIG. 4 simultaneously, during the process of transporting the circuit board 106 via the conveyor belt 108, the image capturing unit 102 captures the first image, the second image, and the third image of the circuit board 106 at different time points. (Step S302). For example, the image capturing unit 102 can capture the backlight image 118 and the backlight image 140 of the circuit board 106 as the first image and the second image, respectively, at the first time point and the second time point, and The positive light image 120 of the circuit board 106 is captured as the third image at three time points. For example, by controlling the LED 110, LED 112, and/or LED 114 to be turned off or on, the image capture unit 102 can capture a backlight image 118 of the circuit board 106 illuminated by a backlight (eg, LED 114) at a first point in time. And photographing the backlight image 140 of the circuit board 106 illuminated by the backlight (LED 114) at a second time point, and capturing the circuit illuminated by the positive light source (eg, LED 110 and/or LED 112) at a third point in time A positive light image 120 of the plate 106.
值得注意的是,在此實施例中,並不侷限第一時間點、第二時間以及第三時間點的先後順序。例如,所述第一時間點可以早於所述第二時間點,而所述第二時間點可以早於所述第三時間點。在另一實施例中,所述第一時間點可以晚於所述第二時間點,而所述第二時間點可以晚於所述第三時間點。在其他實施例中,所述第二時間點可以晚於所述第三時間點,而所述第三時間點可以晚於所述第一時間點。 It should be noted that, in this embodiment, the order of the first time point, the second time, and the third time point is not limited. For example, the first time point may be earlier than the second time point, and the second time point may be earlier than the third time point. In another embodiment, the first time point may be later than the second time point, and the second time point may be later than the third time point. In other embodiments, the second time point may be later than the third time point, and the third time point may be later than the first time point.
在步驟S304中,計算單元104可利用電路板106的第一透光部122分別在背光影像118與背光影像140的位置,以及利用背光影像118與背光影像140的間隔時間,計算出電路板106的移動速度。在另一實施例中,計算單元104也可利用電路板106的第二透光部126分別在背光影像118與背光影像140的位置,以及利用背光影像118與背光影像140的間隔時間,計算出電路板106的移動速度。 In step S304, the computing unit 104 can calculate the circuit board 106 by using the first light transmitting portion 122 of the circuit board 106 at the position of the backlight image 118 and the backlight image 140, and the interval between the backlight image 118 and the backlight image 140. The speed of movement. In another embodiment, the computing unit 104 can also calculate the position of the backlight image 118 and the backlight image 140 by using the second light transmitting portion 126 of the circuit board 106, and the interval between the backlight image 118 and the backlight image 140. The speed of movement of the circuit board 106.
接著,在步驟S306中,計算單元104利用第一透光部122與第二透光部126各自在背光影像118與背光影像140的位置,以及利用電路板106的移動速度,獲得正光影像120中的電路板106與設計檔(例如fab檔)中的電路板106兩者之間的第一座標轉換關係。最後,在步驟S308中,計算單元104利用設計檔以及第一座標轉換關係,獲得設計檔中的元件於正光影像120中的對應位置以定位元件。舉例來說,計算單元104可利用設計檔中元件之位置資訊(如元件與透光部之相對位置關係、或是元件於設計 檔之位置座標)以及上述的第一座標轉換關係,以獲得設計檔中的元件於正光影像120中的對應位置,並定位(例如是以投影的方式)至正光影像120中。 Next, in step S306, the calculation unit 104 obtains the position of the backlight image 118 and the backlight image 140 by using the first light transmitting portion 122 and the second light transmitting portion 126, and obtaining the positive light image 120 by using the moving speed of the circuit board 106. The first coordinate conversion relationship between the circuit board 106 and the circuit board 106 in the design file (e.g., fab file). Finally, in step S308, the computing unit 104 obtains the corresponding position of the component in the design file in the positive light image 120 to locate the component by using the design file and the first coordinate conversion relationship. For example, the computing unit 104 can utilize the position information of components in the design file (such as the relative positional relationship between the component and the light transmitting portion, or the component in the design). The position coordinates of the gears and the first coordinate conversion relationship described above are obtained to obtain corresponding positions of the components in the design file in the positive light image 120, and are positioned (for example, in a projection manner) into the positive light image 120.
以下將詳細說明在步驟S306中,計算單元104如何獲得所述第一座標轉換關係。請參考圖4,計算單元104可以利用背光影像140中的第一透光部122與第二透光部126(或可利用背光影像118中的第一透光部122與第二透光部126的位置),以及電路板106的移動速度,推算出電路板106的第一透光部122與第二透光部126在正光影像120中的第一推算位置124與第二推算位置128。接著,計算單元104將正光影像120中的第一推算位置124以及第二推算位置128與電路板106的第一透光部與第二透光部在設計檔中的位置進行比對,以獲得正光影像120中的電路板106與設計檔中的電路板106兩者之間的第二座標轉換關係。 How the calculation unit 104 obtains the first coordinate conversion relationship will be described in detail below in step S306. Referring to FIG. 4 , the calculation unit 104 can utilize the first light transmitting portion 122 and the second light transmitting portion 126 in the backlight image 140 (or the first light transmitting portion 122 and the second light transmitting portion 126 in the backlight image 118 can be utilized. The position of the circuit board 106 and the moving speed of the circuit board 106 are used to estimate the first estimated position 124 and the second estimated position 128 of the first light transmitting portion 122 and the second light transmitting portion 126 of the circuit board 106 in the positive light image 120. Next, the calculating unit 104 compares the first estimated position 124 and the second estimated position 128 in the positive light image 120 with the positions of the first light transmitting portion and the second light transmitting portion of the circuit board 106 in the design file to obtain A second coordinate conversion relationship between the circuit board 106 in the positive light image 120 and the circuit board 106 in the design file.
在理想狀態下,正光影像120中的第一推算位置124與第二推算位置128應為電路板106的第一透光部122與第二透光部126在正光影像120中的實際位置,因此計算單元104可直接使用所述第二座標轉換關係作為圖3中步驟S306所述的第一座標轉換關係。在實際操作環境中,在電路板106從第一時間點至第三時間點的移動過程中可能會發生變異事件(例如,因為輸送帶108的振動而使電路板106發生微幅轉動/移動),使得正光影像120中的第一推算位置124以及第二推算位置128與電路板106的第一透光部122與第二透光部126在正光影像120中的實際位置二 者之間可能具有位置誤差。若此位置誤差是在容許範圍內,則計算單元104還是可以直接使用所述第二座標轉換關係作為圖3中步驟S306所述的第一座標轉換關係。 In an ideal state, the first estimated position 124 and the second estimated position 128 in the positive light image 120 should be the actual positions of the first light transmitting portion 122 and the second light transmitting portion 126 of the circuit board 106 in the positive light image 120. The calculation unit 104 can directly use the second coordinate conversion relationship as the first coordinate conversion relationship described in step S306 in FIG. In an actual operating environment, a variability event may occur during movement of the board 106 from the first time point to the third time point (eg, the board 106 is slightly rotated/moved due to vibration of the conveyor belt 108) The first estimated position 124 and the second estimated position 128 in the positive light image 120 and the actual position of the first light transmitting portion 122 and the second light transmitting portion 126 of the circuit board 106 in the positive light image 120 are two. There may be positional errors between the two. If the position error is within the allowable range, the calculation unit 104 can directly use the second coordinate conversion relationship as the first coordinate conversion relationship described in step S306 of FIG.
或者,在其他實施例中,圖3中步驟S306可以包括下述子步驟。藉由使用該第二座標轉換關係,計算單元104可以依據電路板106的多個透光部在該設計檔內的座標而推算出電路板106的這些透光部在正光影像120中的多個推算位置。依據電路板106的這些透光部在正光影像120中的所述多個推算位置,計算單元104可以定義多個小搜尋區域。計算單元104可以分別在正光影像120中的所述多個小搜尋區域內進行「透光部影像搜尋」,以找出電路板106的這些透光部在正光影像120中的多個實際位置。計算單元104可以比對電路板106的這些透光部在正光影像120中的所述多個實際位置以及電路板106的這些透光部在該設計檔中的位置,以獲得圖3中步驟S306所述的第一座標轉換關係。此處所述找出透光部在正光影像120中的實際位置,可以參照圖6的相關說明而類推之。 Alternatively, in other embodiments, step S306 in FIG. 3 may include the following sub-steps. By using the second coordinate conversion relationship, the calculation unit 104 can calculate a plurality of the light-transmitting portions of the circuit board 106 in the positive light image 120 according to the coordinates of the plurality of light-transmitting portions of the circuit board 106 in the design file. Estimate the location. The computing unit 104 may define a plurality of small search regions depending on the plurality of estimated positions of the light transmitting portions of the circuit board 106 in the positive light image 120. The calculation unit 104 can perform a "light transmission portion image search" in the plurality of small search regions in the positive light image 120 to find a plurality of actual positions of the light transmission portions of the circuit board 106 in the positive light image 120. The computing unit 104 can compare the plurality of actual positions of the light transmitting portions of the circuit board 106 in the positive light image 120 and the positions of the light transmitting portions of the circuit board 106 in the design file to obtain step S306 in FIG. The first coordinate conversion relationship. The actual position of the light transmitting portion in the positive light image 120 is found here, and can be analogized with reference to the related description of FIG. 6.
圖5是依照本揭露另一實施例說明一種影像定位方法的流程圖。圖5所示步驟S202、步驟S204與步驟S206可以參照圖2所示實施例的相關說明而類推之。於圖5所示實施例中,步驟S202包括子步驟S502、S504、S506、S508與S520,步驟S204包括子步驟S510、S512、S514、S516與S518,而步驟S206包括子步驟S522、S524、S526、S528與S530。另外,圖5所示步驟 S202、步驟S204與步驟S206亦可以分別參照圖3所示步驟S302、步驟S304與步驟S306的相關說明而類推之。圖5可以視為圖3所示流程圖的諸多實施方式中一個詳細實施示例。 FIG. 5 is a flowchart illustrating an image positioning method according to another embodiment of the disclosure. Steps S202, S204, and S206 shown in FIG. 5 can be analogized with reference to the related description of the embodiment shown in FIG. 2. In the embodiment shown in FIG. 5, step S202 includes sub-steps S502, S504, S506, S508, and S520, step S204 includes sub-steps S510, S512, S514, S516, and S518, and step S206 includes sub-steps S522, S524, and S526. , S528 and S530. In addition, the steps shown in Figure 5 S202, step S204 and step S206 may also be referred to the descriptions of step S302, step S304 and step S306 shown in FIG. 3 respectively. Figure 5 can be seen as a detailed implementation example of the various embodiments of the flow chart shown in Figure 3.
圖6是依照本發明又一實施例說明一種影像定位方法的示意圖。圖6所示第一背光影像420、第二背光影像440與正光影像460可以參照圖4所示背光影像118、背光影像140與正光影像120的相關說明而類推之。請同時參考圖4、圖5與圖6,在本實施例中,待測物體可以是電路板106,或是電路板106與其載具之總成。在步驟S502中,影像擷取單元102在第一時間點擷取電路板106的第一影像(例如:圖4所示電路板106的第一背光影像118或圖6所示第二背光影像420),並將第一背光影像420傳輸至計算單元104。在步驟S504中,計算單元104可以將第一背光影像420進行二值化處理,使得影像的對比更加清楚。接著,計算單元104可以在步驟S506中從經二值化的背光影像找出電路板106的透光部的位置,並判斷在第一背光影像420所找出的透光部的數量。若是計算單元104在步驟S506中無法找到兩個以上的透光部,則回到步驟S502,也就是影像擷取單元102重新擷取電路板106的第一背光影像420。 FIG. 6 is a schematic diagram of an image localization method according to still another embodiment of the present invention. The first backlight image 420, the second backlight image 440, and the positive light image 460 shown in FIG. 6 can be analogized with reference to the related descriptions of the backlight image 118, the backlight image 140, and the positive light image 120 shown in FIG. Referring to FIG. 4, FIG. 5 and FIG. 6, in the embodiment, the object to be tested may be the circuit board 106 or the assembly of the circuit board 106 and its carrier. In step S502, the image capturing unit 102 captures the first image of the circuit board 106 at the first time point (for example, the first backlight image 118 of the circuit board 106 shown in FIG. 4 or the second backlight image 420 shown in FIG. And transmitting the first backlit image 420 to the computing unit 104. In step S504, the calculation unit 104 may perform binarization processing on the first backlight image 420 to make the contrast of the image clearer. Next, the calculating unit 104 can find the position of the light transmitting portion of the circuit board 106 from the binarized backlight image in step S506, and determine the number of light transmitting portions found in the first backlight image 420. If the calculation unit 104 cannot find more than two light transmitting portions in step S506, the process returns to step S502, that is, the image capturing unit 102 retrieves the first backlight image 420 of the circuit board 106.
若是計算單元104在經過二值化的第一背光影像420中找到兩個以上的透光部(例如:圖6所示421、422以及423分別表示在第一背光影像420中電路板106的第一透光部、第二透光部與第三透光部的位置),則計算單元104會進行步驟S508。在步 驟S508中,計算單元104將在第一背光影像420中第一透光部的位置421、第二透光部的位置422與/或第三透光部的位置423比對於設計檔(例如fab檔)中的電路板106的第一透光部、第二透光部與/或第三透光部的位置,以獲得第一背光影像420中的電路板106與設計檔中的電路板106兩者之間的第三座標轉換關係。例如,第一背光影像420中第一透光部的位置421與第二透光部的位置422之間的距離L1可以作為電路板106的定位特徵,以及/或者第一透光部的位置421與第三透光部的位置423之間的距離L2可以作為電路板106的定位特徵,以及/或者藉由第一透光部的位置421、第二透光部的位置422與第三透光部的位置423間的夾角α可以作為電路板106的定位特徵。計算單元104可以在電路板106設計檔中找出符合上述定位特徵的透光部位置,以獲得第一背光影像420中的電路板106與設計檔中的電路板106兩者之間的第三座標轉換關係。 If the calculation unit 104 finds two or more light transmissive portions in the binarized first backlight image 420 (for example, 421, 422, and 423 shown in FIG. 6 respectively indicate the circuit board 106 in the first backlight image 420. The calculation unit 104 proceeds to step S508 when the position of the light transmitting portion, the second light transmitting portion and the third light transmitting portion. In step In step S508, the calculating unit 104 compares the position 421 of the first light transmitting portion, the position 422 of the second light transmitting portion, and/or the position 423 of the third light transmitting portion in the first backlight image 420 to the design file (for example, fab) Positions of the first light transmitting portion, the second light transmitting portion, and/or the third light transmitting portion of the circuit board 106 in the file) to obtain the circuit board 106 in the first backlight image 420 and the circuit board 106 in the design file The third coordinate conversion relationship between the two. For example, the distance L1 between the position 421 of the first light transmitting portion and the position 422 of the second light transmitting portion in the first backlight image 420 may serve as a positioning feature of the circuit board 106 and/or a position 421 of the first light transmitting portion. The distance L2 from the position 423 of the third light transmitting portion may serve as a positioning feature of the circuit board 106, and/or by the position 421 of the first light transmitting portion, the position 422 of the second light transmitting portion, and the third light transmitting portion. The angle α between the positions 423 of the portions can be used as a positioning feature of the circuit board 106. The computing unit 104 can find the position of the light transmitting portion that meets the positioning feature in the design file of the circuit board 106 to obtain a third between the circuit board 106 in the first backlight image 420 and the circuit board 106 in the design file. Coordinate conversion relationship.
在步驟S510中,影像擷取單元102在第二時間點擷取電路板106的第二影像(例如:圖4所示電路板106的第二背光影像140或圖6所示第二背光影像440),並將第二背光影像440傳輸至計算單元104。在步驟S512中,計算單元104可以將第二背光影像440進行二值化處理。接著,計算單元104可以在步驟S514中,經由二值化的第二背光影像440找出電路板106的透光部的位置,並判斷在第二背光影像440所找出的透光部的數量。若是計算單元104在步驟S514中無法找到兩個以上的透光部,則回到 步驟S502,也就是影像擷取單元102重新擷取電路板106的第一背光影像420與第二背光影像440。若是計算單元104在經過二值化的第二背光影像440中找到兩個以上的透光部(例如:圖6所示441、442以及443分別表示在第二背光影像440中電路板106的第一透光部、第二透光部與第三透光部的位置),則計算單元104會進行步驟S516。 In step S510, the image capturing unit 102 captures the second image of the circuit board 106 at a second time point (for example, the second backlight image 140 of the circuit board 106 shown in FIG. 4 or the second backlight image 440 shown in FIG. 6 And transmitting the second backlit image 440 to the computing unit 104. In step S512, the calculation unit 104 may perform binarization processing on the second backlight image 440. Next, the calculating unit 104 may find the position of the light transmitting portion of the circuit board 106 via the binarized second backlight image 440 in step S514, and determine the number of the light transmitting portions found in the second backlight image 440. . If the calculation unit 104 cannot find more than two light transmitting portions in step S514, it returns to In step S502, the image capturing unit 102 retrieves the first backlight image 420 and the second backlight image 440 of the circuit board 106. If the calculation unit 104 finds two or more light transmitting portions in the binarized second backlight image 440 (for example, 441, 442, and 443 shown in FIG. 6 respectively indicate the circuit board 106 in the second backlight image 440. The calculation unit 104 proceeds to step S516 when the position of the light transmitting portion, the second light transmitting portion and the third light transmitting portion.
在步驟S516中,計算單元104將在第二背光影像440中電路板106的第一透光部的位置441、第二透光部的位置442以及/或者第三透光部的位置443比對於設計檔(例如fab檔)中電路板106的第一透光部、第二透光部與/或第三透光部的位置,以獲得第二背光影像440中的電路板106與設計檔中的電路板106兩者之間的第四座標轉換關係。例如,第二背光影像440中第一透光部的位置441與第二透光部的位置442之間的距離L1可以作為電路板106的定位特徵,以及/或者第一透光部的位置441與第三透光部的位置443之間的距離L2可以作為電路板106的定位特徵,以及/或者藉由第一透光部的位置441、第二透光部的位置442與第三透光部的位置443間的夾角α可以作為電路板106的定位特徵。計算單元104可以在電路板106設計檔中找出符合上述定位特徵的透光部位置,以獲得第二背光影像440中的電路板106與設計檔中的電路板106兩者之間的第四座標轉換關係。 In step S516, the calculation unit 104 compares the position 441 of the first light transmitting portion, the position 442 of the second light transmitting portion, and/or the position 443 of the third light transmitting portion of the circuit board 106 in the second backlight image 440. The position of the first light transmitting portion, the second light transmitting portion, and/or the third light transmitting portion of the circuit board 106 in the design file (for example, the fab file) to obtain the circuit board 106 and the design file in the second backlight image 440 The circuit board 106 has a fourth coordinate conversion relationship between the two. For example, the distance L1 between the position 441 of the first light transmitting portion and the position 442 of the second light transmitting portion in the second backlight image 440 may serve as a positioning feature of the circuit board 106 and/or a position 441 of the first light transmitting portion. The distance L2 from the position 443 of the third light transmitting portion may serve as a positioning feature of the circuit board 106, and/or by the position 441 of the first light transmitting portion, the position 442 of the second light transmitting portion, and the third light transmitting portion. The angle α between the positions 443 of the portions can be used as a positioning feature of the circuit board 106. The computing unit 104 can find the location of the light transmissive portion in the design file of the circuit board 106 that meets the above-described positioning features to obtain a fourth between the circuit board 106 in the second backlight image 440 and the circuit board 106 in the design file. Coordinate conversion relationship.
另一方面,由於電路板106在輸送帶108上的輸送過程中可能會發生偏移或振動。在步驟S508與步驟S516中,計算單 元104分別對第一背光影像420與第二背光影像440都進行了與設計檔的座標轉換,以確定第一背光影像420中的多個透光部與第二背光影像440中的多個透光部之間的對應關係(例如,確定第一背光影像420中位置421處的透光部是否相同於第二背光影像440中位置441處的透光部),以增加計算單元104計算電路板106的移動速度的準確性。 On the other hand, offset or vibration may occur during the transport of the circuit board 106 on the conveyor belt 108. In step S508 and step S516, the calculation list The first backlight image 420 and the second backlight image 440 are coordinate-converted with the design file to determine a plurality of transparent portions of the first backlight image 420 and the second backlight image 440. Corresponding relationship between the light portions (for example, determining whether the light transmitting portion at the position 421 in the first backlight image 420 is the same as the light transmitting portion at the position 441 in the second backlight image 440) to increase the calculation unit 104 to calculate the circuit board The accuracy of the movement speed of 106.
計算單元104在步驟S518中利用電路板106的透光部在第一背光影像420中的位置、該同一個透光部在第二背光影像440中的位置、以及拍攝第一背光影像420與拍攝第二背光影像440的間隔時間,計算電路板106的移動速度。 The calculating unit 104 uses the position of the light transmitting portion of the circuit board 106 in the first backlight image 420, the position of the same light transmitting portion in the second backlight image 440, and the first backlight image 420 and the shooting in step S518. The interval between the second backlight images 440 calculates the moving speed of the circuit board 106.
接著,在步驟S520中,影像擷取單元102在第三時間點擷取電路板106的第三影像(例如:圖4所示電路板106的正光影像120或圖6所示正光影像460)。圖5所示實施例中拍攝電路板106影像的順序依序為第一影像(例如圖6所示第一背光影像420)、第二影像(例如圖6所示第二背光影像440)、第三影像(例如圖6所示正光影像460),然而在其他實施例中拍攝電路板106影像的順序不限於此。例如,在另一些實施例中,拍攝電路板106影像的順序可能依序為第一影像(例如圖6所示第一背光影像420)、第三影像(例如圖6所示正光影像460)、第二影像(例如圖6所示第二背光影像440)。又例如,在其他實施例中,拍攝電路板106影像的順序可能依序為第三影像(例如圖6所示正光影像460)、第一影像(例如圖6所示第一背光影像420)、第二影像 (例如圖6所示第二背光影像440)。 Next, in step S520, the image capturing unit 102 captures a third image of the circuit board 106 at a third time point (for example, the positive light image 120 of the circuit board 106 shown in FIG. 4 or the positive light image 460 shown in FIG. 6). The sequence of the image of the capture circuit board 106 in the embodiment shown in FIG. 5 is sequentially the first image (for example, the first backlight image 420 shown in FIG. 6) and the second image (for example, the second backlight image 440 shown in FIG. 6). The three images (such as the positive light image 460 shown in FIG. 6), however, the order in which the image of the circuit board 106 is captured in other embodiments is not limited thereto. For example, in other embodiments, the sequence of capturing the image of the circuit board 106 may be sequentially the first image (eg, the first backlight image 420 shown in FIG. 6) and the third image (such as the positive light image 460 shown in FIG. 6). A second image (such as the second backlit image 440 shown in Figure 6). For example, in other embodiments, the sequence of capturing the image of the circuit board 106 may be a third image (such as the positive light image 460 shown in FIG. 6) and a first image (such as the first backlight image 420 shown in FIG. 6). Second image (For example, the second backlight image 440 shown in FIG. 6).
在步驟S522中,計算單元104可利用電路板106的至少二個透光部在第一背光影像420(或第二背光影像440)中的位置,以及利用在步驟S518所計算出的電路板106的移動速度,推算出所述至少二個透光部在正光影像460中的位置。例如,藉由利用步驟S518所計算出的電路板106的移動速度,計算單元104可以依據在第二背光影像440中電路板106的第一透光部的位置441、第二透光部的位置442與第三透光部的位置443而推算出在正光影像460中電路板106的第一透光部、第二透光部與第三透光部的推算位置。 In step S522, the computing unit 104 can utilize the position of the at least two light transmissive portions of the circuit board 106 in the first backlight image 420 (or the second backlight image 440), and utilize the circuit board 106 calculated in step S518. The moving speed is used to estimate the position of the at least two light transmitting portions in the positive light image 460. For example, by using the moving speed of the circuit board 106 calculated in step S518, the calculating unit 104 can determine the position of the first light transmitting portion and the position of the second light transmitting portion of the circuit board 106 in the second backlight image 440. 442 and the position 443 of the third light transmitting portion are used to estimate the estimated positions of the first light transmitting portion, the second light transmitting portion, and the third light transmitting portion of the circuit board 106 in the positive light image 460.
接著,計算單元104在步驟S522中比對在正光影像460中電路板106的透光部的推算位置以及在設計檔中透光部的位置,以及依據比對結果計算在正光影像460中電路板106的位置以及方向角,以及進而獲得正光影像460中的電路板106與設計檔中的電路板106兩者之間的第二座標轉換關係。例如,計算單元104將在正光影像460中電路板106的第一透光部的位置461與第二透光部的位置462比對於在設計檔中電路板106的第一透光部與第二透光部的位置,以計算在正光影像460中電路板106的位置以及方向角,以及進而獲得正光影像460中的電路板106與設計檔中的電路板106兩者之間的第二座標轉換關係。 Next, the calculating unit 104 compares the estimated position of the light transmitting portion of the circuit board 106 in the positive light image 460 and the position of the light transmitting portion in the design file in step S522, and calculates the circuit board in the positive light image 460 according to the comparison result. The position and orientation angle of 106, and thus the second coordinate conversion relationship between the circuit board 106 in the positive light image 460 and the circuit board 106 in the design file. For example, the calculation unit 104 compares the position 461 of the first light transmitting portion of the circuit board 106 with the position 462 of the second light transmitting portion in the positive light image 460 to the first light transmitting portion and the second portion of the circuit board 106 in the design file. Position of the light transmissive portion to calculate the position and orientation angle of the circuit board 106 in the positive light image 460, and thereby obtain a second coordinate conversion between the circuit board 106 in the positive light image 460 and the circuit board 106 in the design file relationship.
由於在步驟S522中,計算單元104推算出的多個透光部推算位置可能與實際透光部的位置不符。無論如何,在正光影像 460中這些透光部的推算位置依然是用來找出在正光影像460中這些透光部的實際位置的重要線索。因此,在步驟S524中,計算單元104藉由使用第二座標轉換關係,依據電路板106的多個透光部在設計檔內的位置推算出電路板106的多個透光部在正光影像460中的多個推算位置。接著,計算單元104在步驟S522中依據電路板106的多個透光部在正光影像460中的所述多個推算位置定義出多個小搜尋區域,並分別在正光影像460中的所述多個小搜尋區域內進行透光部影像搜尋,以找出電路板106的所述多個透光部在正光影像460中的多個實際位置。 Since the plurality of light-transmitting portion estimation positions calculated by the calculation unit 104 may not match the position of the actual light-transmitting portion in step S522. Anyway, in a positive light image The estimated positions of these light transmissive portions in 460 are still important clues for finding the actual position of these light transmissive portions in the positive light image 460. Therefore, in step S524, the calculating unit 104 derives the plurality of light transmitting portions of the circuit board 106 in the positive light image 460 according to the position of the plurality of light transmitting portions of the circuit board 106 in the design file by using the second coordinate conversion relationship. Multiple inferred locations in . Next, the calculating unit 104 defines a plurality of small search regions according to the plurality of estimated positions of the plurality of light transmitting portions of the circuit board 106 in the positive light image 460 in step S522, and respectively in the positive light image 460 The light transmissive portion image search is performed in a small search area to find a plurality of actual positions of the plurality of light transmitting portions of the circuit board 106 in the positive light image 460.
例如,計算單元104可以在正光影像460中第三透光部的推算位置當做一個小搜尋區域464的圓心,而以所述第三透光部的半徑乘以預設倍率(例如10倍)作為所述小搜尋區域464的半徑。計算單元104可以在所述小搜尋區域464內進行影像分析以搜尋所述第三透光部在正光影像460中的實際位置463。電路板106的其他透光部亦可以參照所述第三透光部的相關說明來找出在正光影像460中的實際位置。 For example, the calculation unit 104 may treat the estimated position of the third light transmitting portion in the positive light image 460 as the center of a small search area 464, and multiply the radius of the third light transmitting portion by a preset magnification (for example, 10 times). The radius of the small search area 464. The calculation unit 104 may perform image analysis in the small search area 464 to search for the actual position 463 of the third light transmitting portion in the positive light image 460. The other light transmitting portions of the circuit board 106 can also find the actual position in the positive light image 460 with reference to the related description of the third light transmitting portion.
在步驟S526中,計算單元104可以判斷步驟S524所找到的在正光影像460中電路板106的透光部的數量。若是計算單元104判斷在步驟S524所找到的透光部的數量少於兩個,則計算單元104進行步驟S528。在步驟S528中,計算單元104直接使用步驟S522所獲得的第二座標轉換關係作為應用轉換關係(即圖2中步驟S206所述第一座標轉換關係)。另一方面,若是計算單元 104在步驟S526判斷在正光影像460中被找到的透光部的數量大於等於2,則計算單元104進行步驟S530。在步驟S530中,計算單元104比對電路板106的多個透光部在正光影像460中的多個實際位置(例如圖6所示位置461、462與463)以及電路板106的多個透光部在設計檔中的位置,以獲得正光影像460中的電路板106與設計檔中的電路板106兩者之間的座標轉換關係(即圖2中步驟S206所述第一座標轉換關係)。 In step S526, the calculation unit 104 may determine the number of light transmitting portions of the circuit board 106 in the positive light image 460 found in step S524. If the calculation unit 104 determines that the number of the light transmitting portions found in step S524 is less than two, the calculation unit 104 proceeds to step S528. In step S528, the calculation unit 104 directly uses the second coordinate conversion relationship obtained in step S522 as the application conversion relationship (i.e., the first coordinate conversion relationship described in step S206 in Fig. 2). On the other hand, if it is a calculation unit 104 determines in step S526 that the number of light transmitting portions found in the positive light image 460 is greater than or equal to 2, and the calculating unit 104 proceeds to step S530. In step S530, the computing unit 104 compares the plurality of transparent portions of the circuit board 106 at a plurality of actual positions in the positive light image 460 (for example, positions 461, 462, and 463 shown in FIG. 6) and a plurality of transparent portions of the circuit board 106. The position of the light portion in the design file to obtain a coordinate conversion relationship between the circuit board 106 in the positive light image 460 and the circuit board 106 in the design file (ie, the first coordinate conversion relationship described in step S206 in FIG. 2) .
接著,在步驟S532中,計算單元104可利用設計檔中一元件之位置資訊(如元件與透光部之相對位置關係、或是元件於設計檔之位置座標)以及該應用轉換關係(即圖2中步驟S206所述第一座標轉換關係)以獲得設計檔中的該元件於正光影像460中的對應位置,並定位(例如是以投影的方式)至正光影像460中。藉由對照電路板106的正光影像460與電路板106設計檔中的元件資訊,便可進行電路板106的外觀檢測,並進行各種分析/檢查。舉例來說,計算單元104可依照設計檔來檢查/分析正光影像460的對應位置的局部影像,進而得知電路板106上的元件是否遺漏,或是元件接腳是否連接錯誤,或是接腳焊點是否空焊。另一方面,由於本實施例所提出的影像定位方法及裝置是在電路板106輸送的過程中,就可進行檢測。因此,檢測過程並不會對產線輸送有任何的影響,改善了傳統檢測方法在檢測過程中必須將電路板106靜止而造成產線輸送延遲的問題。 Next, in step S532, the calculating unit 104 can use the position information of a component in the design file (such as the relative positional relationship between the component and the light transmitting portion, or the position coordinate of the component in the design file) and the application conversion relationship (ie, the figure) The first coordinate conversion relationship of step S206 is performed to obtain a corresponding position of the component in the design image in the positive light image 460, and is positioned (for example, in a projection manner) into the positive light image 460. By comparing the component information in the file design with the positive light image 460 of the circuit board 106 and the circuit board 106, the appearance of the circuit board 106 can be detected and various analysis/inspection can be performed. For example, the calculation unit 104 can check/analyze the partial image of the corresponding position of the positive light image 460 according to the design file, and further know whether the component on the circuit board 106 is missing, or whether the component pin is connected incorrectly, or the pin is connected. Whether the solder joint is empty. On the other hand, since the image positioning method and apparatus proposed in the embodiment are in the process of transporting the circuit board 106, the detection can be performed. Therefore, the detection process does not have any influence on the production line transportation, and the problem that the conventional detection method must stop the circuit board 106 during the detection process and cause delay in the production line is improved.
特別值得注意的是,當影像擷取裝置102在擷取電路板 106的影像後,計算單元104可以取具有完整透光部面積的透光部來進行定位。因此,假設在影像擷取的過程中,有部份透光部被電路板106上的其他元件所遮蔽,也不會影響定位結果。舉例來說,圖7是依照本揭露一實施例說明一種擷取影像的示意圖。在圖7中,當影像擷取裝置102在擷取電路板106的影像時,電路板106上的透光部504被附近的元件502(例如:電容、電阻或電路板106上其他零件)部份遮蔽。此時,計算單元104可以判斷透光部504不具有完整透光部面積,使得透光部504不會被計算單元104當作透光部來進行定位。 It is particularly noteworthy that when the image capture device 102 is capturing the circuit board After the image of 106, the calculation unit 104 can take a light transmitting portion having a complete light transmitting portion area for positioning. Therefore, it is assumed that some of the light transmitting portions are shielded by other components on the circuit board 106 during image capturing, and the positioning result is not affected. For example, FIG. 7 is a schematic diagram illustrating a captured image according to an embodiment of the disclosure. In FIG. 7, when the image capturing device 102 captures an image of the circuit board 106, the light transmitting portion 504 on the circuit board 106 is surrounded by a component 502 (for example, a capacitor, a resistor, or other components on the circuit board 106). Covered. At this time, the calculation unit 104 can determine that the light transmitting portion 504 does not have a complete light transmitting portion area, so that the light transmitting portion 504 is not positioned by the calculating unit 104 as the light transmitting portion.
在另一實施例中,當需要檢測的電路板不具有透光部時,所述要檢測的電路板可以配置在具有透光部的載具上。例如,圖8是依照本揭露一實施例說明一種將電路板配置在具有透光部的載具上的示意圖。在圖8中,待測的物體包括電路板601與載具602。電路板601為透光度不足或是不具有透光部的電路板。電路板601載於該載具602上。載具602具有至少一個定位孔(例如圖8所示定位孔612與614)作為所述待測物體的透光部。因此,圖8所示待測物體(電路板601與載具602)可以適用圖1至圖7的相關說明。 In another embodiment, when the circuit board to be detected does not have a light transmitting portion, the circuit board to be detected may be disposed on a carrier having a light transmitting portion. For example, FIG. 8 is a schematic view showing a circuit board disposed on a carrier having a light transmitting portion according to an embodiment of the present disclosure. In FIG. 8, the object to be tested includes a circuit board 601 and a carrier 602. The circuit board 601 is a circuit board having insufficient transmittance or having no light transmitting portion. Circuit board 601 is carried on the carrier 602. The carrier 602 has at least one positioning hole (for example, positioning holes 612 and 614 shown in FIG. 8) as a light transmitting portion of the object to be tested. Therefore, the object to be tested (the circuit board 601 and the carrier 602) shown in FIG. 8 can be applied to the related description of FIGS. 1 to 7.
圖9是依照本揭露另一實施例說明一種將電路板配置在具有透光部的載具上的示意圖。在圖9中,待測的物體包括電路板601與載具604。電路板601載於該載具604上。載具602配置有至少一個透光部(例如圖8所示透光部622與624)。電路板601 可不疊置於透光部622上或可部份疊置於透光部622上。因此,圖9所示待測物體(電路板601與載具604)可以適用圖1至圖7的相關說明。 FIG. 9 is a schematic view showing a circuit board disposed on a carrier having a light transmitting portion according to another embodiment of the present disclosure. In FIG. 9, the object to be tested includes a circuit board 601 and a carrier 604. Circuit board 601 is carried on the carrier 604. The carrier 602 is provided with at least one light transmitting portion (for example, the light transmitting portions 622 and 624 shown in FIG. 8). Circuit board 601 It may not be stacked on the light transmitting portion 622 or may be partially stacked on the light transmitting portion 622. Therefore, the object to be tested (the circuit board 601 and the carrier 604) shown in FIG. 9 can be applied to the related description of FIGS. 1 to 7.
綜上所述,本揭露的諸實施例所提出的影像定位方法及裝置可利用擷取電路板的背光影像以及正光影像,在電路板為移動狀態下對電路板進行外觀檢測分析、偵測電路板旋轉角度以及定位電路板正光影像中的元件資訊。電路板在輸送帶上移動,會因為輸送帶振動而造成電路板微小的轉動。本揭露的諸實施例利用透光部進行定位,可偵測電路板的位置與旋轉角度,進而修正電路板因外力因素而造成的偏移。另一方面,本揭露的諸實施例利用背光影像的透光部與設計檔(例如fab檔)的零件位置,定位電路板的正光影像,以有效的解決電路板正光影像太過複雜而分析不易之問題。 In summary, the image positioning method and device provided by the embodiments of the present disclosure can utilize the backlight image and the positive light image of the captured circuit board, and perform appearance detection analysis and detection circuit on the circuit board when the circuit board is in a moving state. The angle of rotation of the board and the component information in the positive image of the positioning board. The board moves on the conveyor belt, causing a slight rotation of the board due to vibration of the conveyor belt. The embodiments of the present disclosure utilize the light transmitting portion for positioning, and can detect the position and the rotation angle of the circuit board, thereby correcting the offset of the circuit board due to external force factors. On the other hand, the embodiments of the present disclosure utilize the position of the light-transmitting portion of the backlight image and the position of the design file (for example, the fab file) to locate the positive light image of the circuit board, so as to effectively solve the problem that the positive image of the circuit board is too complicated and difficult to analyze. The problem.
雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露的精神和範圍內,當可作些許的更動與潤飾,故本揭露的保護範圍當視後附的申請專利範圍所界定者為準。 The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.
S302~S308‧‧‧步驟 S302~S308‧‧‧Steps
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI587246B (en) * | 2015-11-20 | 2017-06-11 | 晶睿通訊股份有限公司 | Image differentiating method and camera system with an image differentiating function |
| TWI793299B (en) * | 2018-08-30 | 2023-02-21 | 日商昕芙旎雅股份有限公司 | Workpiece counting control system, parts feeder |
| TWI822117B (en) * | 2022-06-16 | 2023-11-11 | 技嘉科技股份有限公司 | Examination method and system for engineering drawing |
| TWI882278B (en) * | 2022-12-28 | 2025-05-01 | 財團法人工業技術研究院 | Locating method, operating method and locating device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI749409B (en) * | 2019-11-25 | 2021-12-11 | 致茂電子股份有限公司 | Optical measuring method |
| CN112838018B (en) * | 2019-11-25 | 2023-09-15 | 致茂电子(苏州)有限公司 | Optical measurement methods |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4672564A (en) * | 1984-11-15 | 1987-06-09 | Honeywell Inc. | Method and apparatus for determining location and orientation of objects |
| TWI227318B (en) * | 2003-11-18 | 2005-02-01 | Univ Nat Taiwan Science Tech | Positioning method of element |
| CN102122175A (en) * | 2010-01-08 | 2011-07-13 | 广东正业科技股份有限公司 | Image positioning method |
| TW201221900A (en) * | 2010-11-17 | 2012-06-01 | Inst Information Industry | Three-dimensional size measuring system and method for measuring three-dimensional size of object |
| CN203024760U (en) * | 2012-11-05 | 2013-06-26 | 山西潞安环保能源开发股份有限公司 | Similar material settlement monitoring device |
-
2013
- 2013-11-07 TW TW102140461A patent/TW201518711A/en unknown
-
2014
- 2014-01-06 CN CN201410004801.5A patent/CN104634788A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI587246B (en) * | 2015-11-20 | 2017-06-11 | 晶睿通訊股份有限公司 | Image differentiating method and camera system with an image differentiating function |
| TWI793299B (en) * | 2018-08-30 | 2023-02-21 | 日商昕芙旎雅股份有限公司 | Workpiece counting control system, parts feeder |
| TWI822117B (en) * | 2022-06-16 | 2023-11-11 | 技嘉科技股份有限公司 | Examination method and system for engineering drawing |
| TWI882278B (en) * | 2022-12-28 | 2025-05-01 | 財團法人工業技術研究院 | Locating method, operating method and locating device |
| US12488499B2 (en) | 2022-12-28 | 2025-12-02 | Industrial Technology Research Institute | Positioning method, operating method and positioning device |
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