TW201517344A - Organic light-emitting device - Google Patents
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- TW201517344A TW201517344A TW102138644A TW102138644A TW201517344A TW 201517344 A TW201517344 A TW 201517344A TW 102138644 A TW102138644 A TW 102138644A TW 102138644 A TW102138644 A TW 102138644A TW 201517344 A TW201517344 A TW 201517344A
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- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 claims description 2
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
- H10K50/171—Electron injection layers
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
本發明係關於有機發光裝置，特別係導入一黏性材料，以提高製作性以及封裝效率。 The present invention relates to an organic light-emitting device, and in particular to introducing a viscous material to improve the manufacturability and packaging efficiency.
有機發光裝置係依材料之不同可區分為小分子發光二極體(OLED)以及大分子發光二極體(PLED)兩大類，小分子發光二極體(OLED)多採用真空蒸鍍法；大分子發光二極體(PLED)則多採塗布法或印刷法，且依選用的材料以及所應用的製程方法，皆會影響成品之良率、製程步驟以及製作成本 Organic light-emitting devices can be classified into two types: small-molecule light-emitting diodes (OLEDs) and macromolecular light-emitting diodes (PLEDs) depending on materials. Small-molecule light-emitting diodes (OLEDs) are mostly vacuum vapor-deposited; Molecular light-emitting diodes (PLEDs) are often coated or printed, and depending on the materials selected and the process methods used, they affect the yield, process steps, and manufacturing costs of the finished product.
然而，小分子發光二極體(OLED)以及大分子發光二極體(PLED)已有諸多之材料，且小分子發光二極體(OLED)以及大分子發光二極體(PLED)係必須與一對基板電性連接，方可運作。而多數之研究係針對基板相互黏接或基板與外殼相互黏貼固定之方式，並鮮少針對小分子發光二極體(OLED)或大分子發光二極體(PLED)與基板之黏接性進行探討。故，若能以黏接之方法黏貼固定小分子發光二極體(OLED)或大分子發光二極體(PLED)與基板之黏接性，將可改善有機發光裝置之封裝性且簡化製程步驟。 However, small molecule light-emitting diodes (OLEDs) and macromolecular light-emitting diodes (PLEDs) have many materials, and small-molecule light-emitting diodes (OLEDs) and macromolecular light-emitting diodes (PLEDs) must A pair of substrates are electrically connected to operate. Most of the research is on the way that the substrates are bonded to each other or the substrate and the outer casing are adhered to each other, and the adhesion between the small molecule light-emitting diode (OLED) or the macro-molecule diode (PLED) and the substrate is rarely performed. Explore. Therefore, if the adhesion of the small molecule light-emitting diode (OLED) or the macro-molecule diode (PLED) to the substrate can be adhered by adhesion, the encapsulation of the organic light-emitting device can be improved and the process steps can be simplified. .
因此，有鑒於上述之諸多缺失，本發明係提供一種有機發光裝置，係導入一黏性材料於有機發光裝置，以增加該有機發光裝置之製作性以及封裝效率。 Therefore, in view of the above-mentioned many deficiencies, the present invention provides an organic light-emitting device that introduces a viscous material into an organic light-emitting device to increase the fabrication and packaging efficiency of the organic light-emitting device.
本發明有鑑於上述的缺失，係提出一種有機發光裝置，用以解決習知技術的缺點。 In view of the above-mentioned deficiencies, the present invention provides an organic light-emitting device for solving the disadvantages of the prior art.
本發明之主要目的係提高有機發光裝置之製作性以及封裝效率。 The main object of the present invention is to improve the manufacturability and packaging efficiency of an organic light-emitting device.
本發明之另一目的係導入一黏性材料於有機發光裝置之中，使其具備黏著性。 Another object of the present invention is to introduce a viscous material into an organic light-emitting device to provide adhesion.
為達到上述之目的，本發明係提供一種有機發光裝置，其係包含一第一基材、一積體結構層以及一第二基材。該第一基材之一表面係具有一導電層；該積體結構層係設置於該第一基材之該導電層之上，該積體結構層包含一發光層，該發光層之一面係設置一電子注入層，其所對應之另一面係設置一電洞注入層；該第二基材之一表面係具有一導電層，該導電層係設置於該積體結構層之上；其特徵在於該積體結構層係含有一黏性材料，藉以提高其與相鄰部件之黏固性。 In order to achieve the above object, the present invention provides an organic light-emitting device comprising a first substrate, an integrated structure layer and a second substrate. One surface of the first substrate has a conductive layer; the integrated structure layer is disposed on the conductive layer of the first substrate, and the integrated structure layer comprises a light emitting layer, and one side of the light emitting layer is An electron injecting layer is disposed on the other surface of which a hole injecting layer is disposed; one surface of the second substrate has a conductive layer, and the conductive layer is disposed on the integrated structure layer; The integrated structural layer contains a viscous material to improve its adhesion to adjacent components.
100‧‧‧第一基材 100‧‧‧First substrate
120‧‧‧導電層 120‧‧‧ Conductive layer
200‧‧‧積體結構層 200‧‧‧Integrated structural layer
210‧‧‧發光層 210‧‧‧Lighting layer
220‧‧‧電子傳輸層 220‧‧‧Electronic transmission layer
230‧‧‧電子注入層 230‧‧‧Electronic injection layer
240‧‧‧電洞傳輸層 240‧‧‧ hole transport layer
250‧‧‧電洞注入層 250‧‧‧ hole injection layer
300‧‧‧第二基材 300‧‧‧Second substrate
320‧‧‧導電層 320‧‧‧ Conductive layer
400‧‧‧黏性材料 400‧‧‧Adhesive materials
第一圖 係為本發明之一種有機發光裝置之實施例。 The first figure is an embodiment of an organic light-emitting device of the present invention.
第二圖 係為本發明之一種有機發光裝置之另一實施例。 The second figure is another embodiment of an organic light-emitting device of the present invention.
第三圖 係為本發明之一種有機發光裝置之再一實施例。 The third figure is still another embodiment of an organic light-emitting device of the present invention.
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：請參考第一圖，係為本發明之一種有機發光裝置之實施例，係包含：一第一基材100、一積體結構層200以及一第二基材300。 In order to fully understand the objects, features and effects of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings. An embodiment of an organic light-emitting device according to the invention comprises a first substrate 100, an integrated structure layer 200 and a second substrate 300.
該第一基材100之一表面係具有一導電層120，該導電層120係電性連接於一電力供給單元(圖未示)。其中，該導電層120係可為陰極電極抑或是陽極電極。 One surface of the first substrate 100 has a conductive layer 120 electrically connected to a power supply unit (not shown). The conductive layer 120 can be a cathode electrode or an anode electrode.
該積體結構層200係設置於該第一基材100之該導電層120之上，該積體結構層200包含一發光層210，該發光層210之一面係設置一電子注入層230，其所對應之另一面係設置一電洞注入層250，其中，該發光層210之材料係包含Alq3、Almq3、TBADN、TPC、CBP、DCB、DBP、PVK、MEH-PPV，該電子注入層230之材料係包含Alq3、LiF、MgP、MgF2、Ca/Al、Al2O3，又，該電洞注入層250之材料係包含Pedot、CuPc、TiOPc、m-MTDATA、2-TNATA。 The integrated structure layer 200 is disposed on the conductive layer 120 of the first substrate 100. The integrated structure layer 200 includes a light emitting layer 210. One of the light emitting layers 210 is provided with an electron injecting layer 230. The corresponding other surface is provided with a hole injection layer 250, wherein the material of the light-emitting layer 210 comprises Alq3, Almq3, TBADN, TPC, CBP, DCB, DBP, PVK, MEH-PPV, and the electron injection layer 230 The material includes Alq3, LiF, MgP, MgF2, Ca/Al, and Al 2 O 3 . Further, the material of the hole injection layer 250 includes Pedot, CuPc, TiOPc, m-MTDATA, and 2-TNATA.
該第二基材300之一表面係具有一導電層320，該導電層320係電性連接於該電力供給單元，並設置於該積體結構層200之上。其中，該導電層320係可為陰極電極抑或是陽極電極。 One surface of the second substrate 300 has a conductive layer 320 electrically connected to the power supply unit and disposed on the integrated structure layer 200. The conductive layer 320 can be a cathode electrode or an anode electrode.
再者，該第二基材300之該導電層320以及該第一基材100之該導電層120係與該積體結構層200以及該電力供給單元係形成一電性迴路。又，該第二基材300之該導電層320以及該第一基材100之該導電層120係可為金屬材質或是非金屬導電材質，該金屬材質係包含銅、銀、鋁、 鎂、鈣、金、鎢、鐵或鋼；該非金屬導電材質係包含聚吡咯(polypyrrole)、聚苯硫醚(polyphenylene sulfide)、聚苯胺(polyaniline)、聚乙炔(polyacetylene)、聚苯胺基酸。 Furthermore, the conductive layer 320 of the second substrate 300 and the conductive layer 120 of the first substrate 100 form an electrical circuit with the integrated structure layer 200 and the power supply unit. Moreover, the conductive layer 320 of the second substrate 300 and the conductive layer 120 of the first substrate 100 may be made of a metal material or a non-metal conductive material, and the metal material comprises copper, silver, aluminum, Magnesium, calcium, gold, tungsten, iron or steel; the non-metallic conductive material comprises polypyrrole, polyphenylene sulfide, polyaniline, polyacetylene, polyaniline acid.
值得注意的是，該積體結構層200係含有一黏性材料400，該黏性材料400係可同時導入該積體結構層200之該電子注入層230、該發光層210以及該電洞注入層250使其分別具備黏性功能，以提高其與相鄰部件、該第一基材100以及該第二基材300之黏固性，並增加其製作性以及封裝效率。 It is to be noted that the integrated structure layer 200 includes a viscous material 400 that can be simultaneously introduced into the electron injection layer 230 of the integrated structure layer 200, the luminescent layer 210, and the hole injection. The layer 250 is provided with a viscous function to improve the adhesion to the adjacent member, the first substrate 100 and the second substrate 300, and to increase the manufacturability and packaging efficiency.
於本實施例中，該電子注入層230、該發光層210以及該電洞注入層250係分別含有該黏性材料400。更詳細說明，具該黏性材料400之該發光層210係可黏固與其相鄰之該電子注入層230以及該電洞注入層250，並且含有該黏性材料400之該電子注入層230以及含有該黏性材料400之該電洞注入層250其一面係可黏固該發光層210，另一面則可黏固該第一基材100以及該第二基材300，以形成堆疊之層狀結構。 In the embodiment, the electron injecting layer 230, the light emitting layer 210, and the hole injecting layer 250 respectively contain the adhesive material 400. In more detail, the luminescent layer 210 having the viscous material 400 is capable of adhering the electron injection layer 230 adjacent thereto and the hole injection layer 250, and the electron injection layer 230 containing the viscous material 400 and The hole injection layer 250 containing the adhesive material 400 can adhere to the light emitting layer 210 on one side, and the first substrate 100 and the second substrate 300 can be adhered on the other side to form a stacked layer. structure.
然而，於其它未繪示之實施例，該黏性材料400係可導入該電子注入層230、該發光層210以及該電洞注入層250之任一者以提高其與相鄰部件之黏固性，抑或是導入該電子注入層230、該發光層210以及該電洞注入層250之任兩者，以提高其與相鄰部件之黏固性。換言之，該積體結構層200之該電子注入層230、該發光層210以及該電洞注入層250係可依製程需求選擇至少其一者、至少其兩者或同時導入該黏性材料400，以提高其之黏固性並增加其製作性以及封裝效率。 However, in other embodiments not shown, the adhesive material 400 can be introduced into the electron injection layer 230, the light emitting layer 210, and the hole injection layer 250 to improve adhesion to adjacent components. Or, the electron injection layer 230, the light-emitting layer 210, and the hole injection layer 250 are introduced to improve the adhesion to adjacent components. In other words, the electron injection layer 230, the light-emitting layer 210, and the hole injection layer 250 of the integrated structure layer 200 may select at least one of them, at least two of them, or simultaneously introduce the adhesive material 400 according to process requirements. To improve its adhesion and increase its manufacturability and packaging efficiency.
其中，該黏性材料400係包含天然樹脂類、人工樹脂類或無 機物黏著劑。又，該天然樹脂類係可為樹膠(阿拉伯膠)、動物膠(明膠)；該人工樹脂類係可為白膠(PVAc)、強力膠(氯丁烯橡膠)；該無機物黏著劑係可為蠟、二氧化矽(silicon dioxide)。 Wherein, the adhesive material 400 comprises natural resin, artificial resin or no Body adhesive. Moreover, the natural resin type may be a gum (Arabic gum) or an animal glue (gelatin); the artificial resin type may be a white glue (PVAc) or a super glue (chlorobutylene rubber); the inorganic adhesive system may be Wax, silicon dioxide.
再者，該第一基材100、該第二基材300以及該積體結構層200更可容納於一玻璃基板中，該玻璃基板係可增加結構之穩固性。然而，該玻璃基板係可省略直接藉由該第一基材100、該第二基材300包覆該積體結構層200，使其結構達到更輕巧之目的。 Furthermore, the first substrate 100, the second substrate 300, and the integrated structure layer 200 can be further accommodated in a glass substrate, which can increase the structural stability. However, the glass substrate can omit the fact that the integrated structure layer 200 is directly coated by the first substrate 100 and the second substrate 300, so that the structure is made lighter.
請參考第二圖，係為本發明之一種有機發光裝置之又一實施例，係包含該第一基材100、該積體結構層200以及該第二基材300。該第一基材100、該第二基材300之結構特徵係與第一圖所描述之實施例相同，於此不再贅述。本實施例與第一圖之實施例不同之處在於，該積體結構層200之該發光層210可取代該電子注入層230。換言之，該積體結構層200係可省略該電子注入層230。 Please refer to the second figure, which is a further embodiment of an organic light-emitting device of the present invention, comprising the first substrate 100, the integrated structure layer 200 and the second substrate 300. The structural features of the first substrate 100 and the second substrate 300 are the same as those of the embodiment described in the first figure, and details are not described herein again. The embodiment is different from the embodiment of the first figure in that the light emitting layer 210 of the integrated structure layer 200 can replace the electron injecting layer 230. In other words, the integrated structure layer 200 can omit the electron injection layer 230.
再者，該積體結構層200係可包含該黏性材料400，該黏性材料400係可同時導入該積體結構層200之該發光層210以及該電洞注入層250使其分別具備黏性功能，以提高其與相鄰部件、該第一基材100以及該第二基材300之黏固性並增加其製作性以及封裝效率。 Furthermore, the integrated structure layer 200 may include the viscous material 400, and the viscous material 400 may be simultaneously introduced into the luminescent layer 210 of the integrated structure layer 200 and the hole injection layer 250 to be respectively viscous. Sexual function to improve its adhesion to adjacent components, the first substrate 100 and the second substrate 300 and increase its manufacturability and packaging efficiency.
於本實施例中，該發光層210以及該電洞注入層250係分別含有該黏性材料400。更詳細說明，具該黏性材料400之該發光層210係可黏固與其相鄰之該電洞注入層250以及該第一基材100。然而，含有該黏性材料400之該電洞注入層250其一面係可黏固該發光層210，而另一面則可黏固該第二基材300，以形成堆疊之層狀結構。而於未繪示之實施例，該黏 性材料400係可導入該發光層210以及該電洞注入層250之任一者，以提高其與相鄰部件之黏固性。換言之，該積體結構層200之該發光層210以及該電洞注入層250係可依製程需求選擇至少其一者或同時導入該黏性材料400，以提高其之黏固性並增加其製作性以及封裝效率。 In the embodiment, the light-emitting layer 210 and the hole injection layer 250 respectively contain the adhesive material 400. In more detail, the light-emitting layer 210 having the adhesive material 400 is capable of adhering the hole injection layer 250 adjacent thereto and the first substrate 100. However, the hole injection layer 250 containing the viscous material 400 may adhere to the luminescent layer 210 on one side and the second substrate 300 on the other side to form a stacked layered structure. In the embodiment not shown, the stick The material 400 can be introduced into any of the light-emitting layer 210 and the hole injection layer 250 to improve the adhesion to adjacent members. In other words, the light-emitting layer 210 and the hole injection layer 250 of the integrated structure layer 200 can select at least one of them or simultaneously introduce the adhesive material 400 according to process requirements to improve the adhesion and increase the fabrication thereof. Sex and packaging efficiency.
請參考第三圖，係為本發明之一種有機發光裝置之再一實施例，係包含該第一基材100、該積體結構層200以及該第二基材300。該第一基材100、該第二基材300之結構特徵係與第一圖所描述之實施例相同，於此不再贅述。本實施例與第一圖之實施例不同之處在於該積體結構層200更可進一步包含一電子傳輸層220以及一電洞傳輸層240。 Referring to FIG. 3, a further embodiment of an organic light-emitting device according to the present invention includes the first substrate 100, the integrated structure layer 200, and the second substrate 300. The structural features of the first substrate 100 and the second substrate 300 are the same as those of the embodiment described in the first figure, and details are not described herein again. The embodiment is different from the embodiment of the first embodiment in that the integrated structure layer 200 further includes an electron transport layer 220 and a hole transport layer 240.
該電子傳輸層220係設置於該積體結構層200之該電子注入層230以及該發光層210之間。又，該電洞傳輸層240係設置於該積體結構層200之該電洞注入層250以及該發光層210之間。藉由該電子傳輸層220以及該電洞傳輸層240以提高其傳輸效率與發光效率，其中，該電子傳輸層220之材料係包含Alq3、BCP、PBD、Liq、Almq3、DVPBi、TAZ、OXD、BND、PV，該電洞傳輸層240之材料係包含NPB、TPD、Pani、PVK、Pedot。 The electron transport layer 220 is disposed between the electron injection layer 230 of the integrated structure layer 200 and the light emitting layer 210. Moreover, the hole transport layer 240 is disposed between the hole injection layer 250 of the integrated structure layer 200 and the light-emitting layer 210. The electron transport layer 220 and the hole transport layer 240 are used to improve the transmission efficiency and the light-emitting efficiency. The material of the electron transport layer 220 includes Alq3, BCP, PBD, Liq, Almq3, DVPBi, TAZ, OXD, BND, PV, the material of the hole transport layer 240 includes NPB, TPD, Pani, PVK, Pedot.
又，該電子傳輸層220以及該電洞傳輸層240更可同時導入該黏性材料400，該黏性材料400係可提供該電子傳輸層220黏固該電子注入層230以及該發光層210，以及提供該電洞傳輸層240黏固該電洞注入層250以及該發光層210，以增加製作性以及封裝效率。 Moreover, the electron transport layer 220 and the hole transport layer 240 can be simultaneously introduced into the adhesive material 400. The adhesive material 400 can provide the electron transport layer 220 to adhere the electron injection layer 230 and the light emitting layer 210. And providing the hole transport layer 240 to adhere the hole injection layer 250 and the light emitting layer 210 to increase the manufacturability and packaging efficiency.
於本實施例中，該電子注入層230、該發光層210、該電洞注入層250、該電子傳輸層220以及該電洞傳輸層240係分別含有該黏性材料400。更詳細說明，具黏性材料400之發光層210係可黏固與其相鄰之該 電子傳輸層220以及該電洞傳輸層240。然而，含有該黏性材料400之該電子傳輸層220以及含有該黏性材料400之該電洞傳輸層240之其一面係可黏固該發光層210，而另一面則可黏固電子注入層230以及電洞注入層250。再者，含有該黏性材料400之該電子注入層230以及含有該黏性材料400之該電洞注入層250其一面係可黏固該電子傳輸層220以及該電洞傳輸層240，另一面則可黏固該第一基材100以及該第二基材300，以形成堆疊之層狀結構。 In the present embodiment, the electron injecting layer 230, the light emitting layer 210, the hole injecting layer 250, the electron transporting layer 220, and the hole transporting layer 240 respectively contain the adhesive material 400. In more detail, the luminescent layer 210 of the viscous material 400 is affixable to the adjacent layer. The electron transport layer 220 and the hole transport layer 240. However, the electron transport layer 220 containing the adhesive material 400 and one side of the hole transport layer 240 containing the adhesive material 400 can adhere to the light emitting layer 210, and the other side can adhere to the electron injecting layer. 230 and a hole injection layer 250. Furthermore, the electron injecting layer 230 containing the adhesive material 400 and the hole injecting layer 250 containing the adhesive material 400 can adhere to the electron transporting layer 220 and the hole transporting layer 240 on one side, and the other side. The first substrate 100 and the second substrate 300 may be adhered to form a stacked layered structure.
另外，於其它未繪示之實施例，該黏性材料400係可導入該電子注入層230、該發光層210、該電洞注入層250、該電子傳輸層220以及該電洞傳輸層240之至少其一者以提高其與相鄰部件之黏固性，抑或是導入該電子注入層230、該發光層210、該電洞注入層250、該電子傳輸層220以及該電洞傳輸層240之至少其兩者或任意組合，以提高其與相鄰部件之黏固性，換言之，該積體結構層200之該電子注入層230、該發光層210、該電洞注入層250、該電子傳輸層220以及該電洞傳輸層240係可依製程需求選擇至少一者、至少任兩者、任意組合或同時導入該黏性材料400，以提高其與相鄰部件之黏固性，以增加其製作性以及封裝效率。 In addition, in other embodiments not shown, the adhesive material 400 can be introduced into the electron injection layer 230, the light emitting layer 210, the hole injection layer 250, the electron transport layer 220, and the hole transport layer 240. At least one of them is used to improve adhesion to adjacent components, or to the electron injecting layer 230, the light emitting layer 210, the hole injecting layer 250, the electron transporting layer 220, and the hole transporting layer 240. At least two or any combination thereof to improve adhesion to adjacent components, in other words, the electron injection layer 230 of the integrated structure layer 200, the light-emitting layer 210, the hole injection layer 250, the electron transport The layer 220 and the hole transport layer 240 may select at least one, at least two, any combination or simultaneously introduce the adhesive material 400 according to process requirements to improve the adhesion between the layer and the adjacent component to increase the adhesion thereof. Productivity and packaging efficiency.
以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之較佳實施例而已，熟習本發明領域者將顯而易見，該等實施例僅係用於描繪本發明，不應解讀為限制本發明之範圍。即凡依本發明申請範圍所作之均等變化與修飾等，皆應仍屬本發明之專利涵蓋範圍內。 The present invention has been described in detail above, but the foregoing is only the preferred embodiment of the present invention, To limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.
100‧‧‧第一基材 100‧‧‧First substrate
120‧‧‧導電層 120‧‧‧ Conductive layer
200‧‧‧積體結構層 200‧‧‧Integrated structural layer
210‧‧‧發光層 210‧‧‧Lighting layer
230‧‧‧電子注入層 230‧‧‧Electronic injection layer
250‧‧‧電洞注入層 250‧‧‧ hole injection layer
300‧‧‧第二基材 300‧‧‧Second substrate
320‧‧‧導電層 320‧‧‧ Conductive layer
400‧‧‧黏性材料 400‧‧‧Adhesive materials
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