TW201516789A - Composite substrate - Google Patents
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- TW201516789A TW201516789A TW102138511A TW102138511A TW201516789A TW 201516789 A TW201516789 A TW 201516789A TW 102138511 A TW102138511 A TW 102138511A TW 102138511 A TW102138511 A TW 102138511A TW 201516789 A TW201516789 A TW 201516789A
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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Abstract
Description
本發明是有關於一種基板,特別是有關於一種複合基板。 The present invention relates to a substrate, and more particularly to a composite substrate.
近年來,隨著數位資訊和無線行動通訊技術的快速發展,許多電子產品,例如行動電話(Mobile Phone)、平板電腦(tablet PC)或是智慧型手機(Smart Phone)等,多會使用觸控面板(Touch Panel)作為輸入介面,以提升其操作便利性。觸控面板依照其感測方式大致可區分為電阻式、電容式、光學式、聲波式以及電磁式等,其中電容式觸控面板因具有反應時間快、可靠度佳以及耐用度高等優點,已被廣泛地使用於電子產品中。 In recent years, with the rapid development of digital information and wireless mobile communication technologies, many electronic products, such as mobile phones, tablet PCs, or smart phones, use touch. The Touch Panel is used as an input interface to enhance its operational convenience. The touch panel can be roughly classified into a resistive type, a capacitive type, an optical type, an acoustic wave type, and an electromagnetic type according to the sensing method. The capacitive touch panel has the advantages of fast response time, good reliability, and high durability. It is widely used in electronic products.
目前的電容式觸控面板多為單片玻璃式(one glass solution,OGS)觸控面板。隨著搭配觸控面板的電子裝置或顯示裝置逐漸趨向大尺寸的設計,單片塑膠式(one plastic solution,OPS)觸控面板也逐漸變成關注的焦點。單片塑膠式觸控面板採用軟性基板作為主體,以使觸控面板具有輕薄的尺寸。然而,目前的軟性基板在觸控面板的製程上仍有不少的缺點。舉例而言,由於軟性基板也需要有相當的強度,因此軟性基板通常會藉由在表 面配置硬化層(hard coating layer)或是高硬度材質(例如是聚甲基丙烯酸甲酯(polymethyl methacrylate,PMMA)或是環烯共聚物(cyclic olefin copolymer,COC))而形成複合基板。當需進行高溫製程時,複合基板容易因各層結構的膨脹尺度不同而累積應力。若在高溫製程之前的製作過程中因切割或其他原因而使複合基板的邊緣產生裂痕,後續的高溫製程會使裂痕因應力而往複合基板的內部擴展,進而使得觸控面板的製造良率下降。當然,複合基板應用於其他裝置時也會因為裂痕往內部擴展而導致良率下降。 Currently, capacitive touch panels are mostly one glass solution (OGS) touch panels. As electronic devices or display devices with touch panels have gradually moved toward large-sized designs, one-piece plastic (OPS) touch panels have gradually become the focus of attention. The single-piece plastic touch panel uses a flexible substrate as a main body to make the touch panel have a thin and light size. However, the current flexible substrate still has a number of disadvantages in the manufacturing process of the touch panel. For example, since a flexible substrate also needs to have considerable strength, a flexible substrate is usually used in the table. The surface is provided with a hard coating layer or a high hardness material (for example, polymethyl methacrylate (PMMA) or a cyclic olefin copolymer (COC)) to form a composite substrate. When a high temperature process is required, the composite substrate is liable to accumulate stress due to the different expansion scales of the layers. If the edge of the composite substrate is cracked due to cutting or other reasons during the manufacturing process before the high-temperature process, the subsequent high-temperature process causes the crack to expand into the interior of the composite substrate due to stress, thereby causing the manufacturing yield of the touch panel to decrease. . Of course, when the composite substrate is applied to other devices, the crack will be internally expanded to cause a decrease in yield.
本發明提供一種複合基板,能防止位在其側邊的裂痕往其內部擴展,進而提高製造良率。 The present invention provides a composite substrate which can prevent cracks located on the sides thereof from spreading to the inside thereof, thereby improving the manufacturing yield.
本發明提出一種複合基板,包括一第一基板部、一第二基板部以及一第一硬化層。第二基板部配置於第一基板部上,且在相同厚度下,第二基板部的可撓性劣於第一基板部的可撓性。第一硬化層配置於第二基板部上,且第二基板部位在第一硬化層與第一基板部之間,其中複合基板設置有第一硬化層的一第一面設置有一凹槽結構,凹槽結構對應於複合基板的一周圍區域,並且貫穿第一硬化層與第二基板部。 The invention provides a composite substrate comprising a first substrate portion, a second substrate portion and a first hardened layer. The second substrate portion is disposed on the first substrate portion, and the flexibility of the second substrate portion is inferior to the flexibility of the first substrate portion at the same thickness. The first hardened layer is disposed on the second substrate portion, and the second substrate portion is between the first hardened layer and the first substrate portion, wherein a first surface of the composite substrate provided with the first hardened layer is provided with a groove structure. The groove structure corresponds to a surrounding area of the composite substrate and penetrates the first hardened layer and the second substrate portion.
本發明更提出一種複合基板,包括一第一基板部、一第二基板部以及一第一硬化層。第二基板部配置於第一基板部上, 且在相同厚度下,第二基板部的可撓性劣於第一基板部的可撓性。第一硬化層配置於第二基板部上,且第二基板部位於第一硬化層與第一基板部之間,其中第一硬化層的側面與第二基板部的側面構成一平滑側面,平滑側面的軌跡變異小於15μm,其中軌跡變異定義為,當平滑側面實質上平行第一基板部的一側邊分布時,平滑側面的軌跡中最接近側邊的一第一點與最遠離側邊的一第二點之間的距離。 The invention further provides a composite substrate comprising a first substrate portion, a second substrate portion and a first hardened layer. The second substrate portion is disposed on the first substrate portion, Also, at the same thickness, the flexibility of the second substrate portion is inferior to the flexibility of the first substrate portion. The first hardened layer is disposed on the second substrate portion, and the second substrate portion is located between the first hardened layer and the first substrate portion, wherein a side surface of the first hardened layer and a side surface of the second substrate portion form a smooth side surface, which is smooth The trajectory variation of the side is less than 15 μm, wherein the trajectory variation is defined as a first point of the smooth side surface closest to the side and the farthest side when the smooth side is substantially parallel to one side of the first substrate portion. The distance between a second point.
在本發明的一實施例中,上述的凹槽結構具有一內側面與一外側面,外側面位於內側面與複合基板的一側邊之間。內側面為一平滑側面,平滑側面的軌跡變異小於15μm,其中軌跡變異定義為,當平滑側面實質上平行第一基板部的側邊分布時,平滑側面的軌跡中最接近側邊的一第一點與最遠離側邊的一第二點之間的距離。 In an embodiment of the invention, the groove structure has an inner side surface and an outer side surface, and the outer side surface is located between the inner side surface and one side of the composite substrate. The inner side surface is a smooth side surface, and the trajectory variation of the smooth side surface is less than 15 μm, wherein the trajectory variation is defined as a first one of the smooth side surfaces closest to the side when the smooth side surface is substantially parallel to the side of the first substrate portion. The distance between the point and a second point that is furthest from the side.
在本發明的一實施例中,上述的第一基板部的材質為聚碳酸酯(polycarbonate,PC)。 In an embodiment of the invention, the first substrate portion is made of polycarbonate (PC).
在本發明的一實施例中,上述的第二基板部的材質為聚甲基丙烯酸甲酯(polymethyl methacrylate,PMMA)或是環烯共聚物(cyclic olefin copolymer,COC)。 In an embodiment of the invention, the second substrate portion is made of polymethyl methacrylate (PMMA) or a cyclic olefin copolymer (COC).
在本發明的一實施例中,上述的第一硬化層的表面的鉛筆硬度(pencil hardness)高於H。 In an embodiment of the invention, the surface of the first hardened layer has a pencil hardness higher than H.
在本發明的一實施例中,上述的第一硬化層與第二基板部的總厚度小於150微米(micrometer,μm)。 In an embodiment of the invention, the total thickness of the first hardened layer and the second substrate portion is less than 150 micrometers (μm).
在本發明的一實施例中,上述的凹槽結構的深度小於150微米。 In an embodiment of the invention, the groove structure has a depth of less than 150 microns.
在本發明的一實施例中,上述的凹槽結構的寬度約為30微米。 In an embodiment of the invention, the groove structure has a width of about 30 microns.
在本發明的一實施例中,上述的凹槽結構環繞複合基板的整個周圍區域。 In an embodiment of the invention, the groove structure surrounds the entire surrounding area of the composite substrate.
在本發明的一實施例中,上述的凹槽結構為連續的一環狀凹槽,並在周圍區域構成連續的一封閉路徑。 In an embodiment of the invention, the groove structure is a continuous annular groove and forms a continuous closed path in the surrounding area.
在本發明的一實施例中,上述的凹槽結構包括不連續的多個條狀凹槽。 In an embodiment of the invention, the groove structure comprises a plurality of strip-shaped grooves that are discontinuous.
在本發明的一實施例中,上述的條狀凹槽排列成多列,同一列的條狀凹槽彼此分離一間距,且另一列的條狀凹槽中至少一者對應於間距設置。 In an embodiment of the invention, the strip-shaped grooves are arranged in a plurality of rows, the strip-shaped grooves of the same column are separated from each other by a pitch, and at least one of the strip-shaped grooves of the other column is disposed corresponding to the pitch.
在本發明的一實施例中,上述的複合基板更包括一填充材料,配置於凹槽結構內,其中填充材料的折射率相近於第二基板部的折射率。 In an embodiment of the invention, the composite substrate further includes a filling material disposed in the recess structure, wherein the refractive index of the filling material is close to the refractive index of the second substrate portion.
在本發明的一實施例中,上述的複合基板更包括一第二硬化層,配置於第一基板部上,且第一基板部位在第二硬化層與第二基板部之間。 In an embodiment of the invention, the composite substrate further includes a second hardened layer disposed on the first substrate portion, and the first substrate portion is between the second hardened layer and the second substrate portion.
在本發明的一實施例中,上述的第二基板部包括一基質與分布於基質中的多個纖維結構。 In an embodiment of the invention, the second substrate portion includes a substrate and a plurality of fiber structures distributed in the substrate.
在本發明的一實施例中,上述的基質的材質相同於第一 基板部。 In an embodiment of the invention, the material of the substrate is the same as the first The substrate portion.
在本發明的一實施例中,上述的複合基板具有一透光區域,周圍區域位於透光區域的至少一側。複合基板更包括一裝飾層,裝飾層配置於複合基板的第一面或相對於第一面的一第二面,並且對應於周圍區域。 In an embodiment of the invention, the composite substrate has a light transmissive area, and the surrounding area is located on at least one side of the light transmissive area. The composite substrate further includes a decorative layer disposed on the first side of the composite substrate or a second side opposite to the first surface and corresponding to the surrounding area.
在本發明的一實施例中,上述的複合基板更包括一觸控感測結構,且觸控感測結構配置於第二面,並且至少對應於透光區域。 In an embodiment of the invention, the composite substrate further includes a touch sensing structure, and the touch sensing structure is disposed on the second surface and corresponds to at least the light transmitting region.
在本發明的一實施例中,上述的複合基板,更包括一承板。裝飾層配置於承板,並且對應於周圍區域而藉由承板貼附於複合基板的第一面或第二面。 In an embodiment of the invention, the composite substrate further includes a carrier. The decorative layer is disposed on the carrier and is attached to the first or second surface of the composite substrate by a carrier corresponding to the surrounding area.
基於上述,本發明提出的複合基板在其設置有第一硬化層的第一面上設置凹槽結構,其中凹槽結構對應於複合基板的周圍區域,並且貫穿第一硬化層與第二基板部。此外,本發明提出的另一複合基板的第一硬化層的側面與第二基板部的側面構成平滑側面,平滑側面的軌跡變異小於15μm。據此,複合基板能藉由凹槽結構或者平滑表面防止位在其側邊的裂痕往內擴展,進而提高製造良率。 Based on the above, the composite substrate provided by the present invention is provided with a groove structure on a first surface on which the first hardened layer is disposed, wherein the groove structure corresponds to a surrounding area of the composite substrate, and penetrates the first hardened layer and the second substrate portion . Further, the side surface of the first hardened layer and the side surface of the second substrate portion of the other composite substrate proposed by the present invention constitute a smooth side surface, and the track variation of the smooth side surface is less than 15 μm. Accordingly, the composite substrate can be prevented from being spread inward by cracks on the sides thereof by the groove structure or the smooth surface, thereby improving the manufacturing yield.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
100、100a、100b、100c、100d、100e、100f、100g、100h、200、200a、200b‧‧‧複合基板 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 200, 200a, 200b‧‧‧ composite substrate
102、202‧‧‧第一面 102, 202‧‧‧ first side
103、203‧‧‧第二面 103, 203‧‧‧ second side
104、104a、104b、104c‧‧‧凹槽結構 104, 104a, 104b, 104c‧‧‧ groove structure
1042、1048‧‧‧條狀凹槽 1042, 1048‧‧‧ strip grooves
1044、1046‧‧‧線性凹槽 1044, 1046‧‧‧ linear grooves
106、206‧‧‧周圍區域 106, 206‧‧‧ surrounding area
107、204‧‧‧透光區域 107, 204‧‧‧Light transmission area
108‧‧‧側邊 108‧‧‧ side
110、210‧‧‧第一基板部 110, 210‧‧‧ First substrate
120、120a、220、220a‧‧‧第二基板部 120, 120a, 220, 220a‧‧‧ second substrate
122、222‧‧‧基質 122, 222‧‧‧ matrix
124、224‧‧‧纖維結構 124, 224‧‧‧ fiber structure
130、230‧‧‧第一硬化層 130, 230‧‧‧ first hardened layer
140、240‧‧‧第二硬化層 140, 240‧‧‧ second hardened layer
150‧‧‧填充材料 150‧‧‧Filling materials
160、250‧‧‧裝飾層 160, 250‧‧‧ decorative layer
170‧‧‧承板 170‧‧‧ board
180‧‧‧黏著層 180‧‧‧Adhesive layer
190a、190b、190c‧‧‧觸控感測結構 190a, 190b, 190c‧‧‧ touch sensing structure
192a、192b、192c‧‧‧第一電極單元 192a, 192b, 192c‧‧‧ first electrode unit
194a、194b、194c‧‧‧第二電極單元 194a, 194b, 194c‧‧‧ second electrode unit
C‧‧‧裂痕 C‧‧‧Rift
D‧‧‧間距 D‧‧‧ spacing
d‧‧‧深度 D‧‧‧depth
P1‧‧‧第一點 P1‧‧‧ first point
P2‧‧‧第二點 P2‧‧‧ second point
S1‧‧‧內側面 S1‧‧‧ inside
S2‧‧‧外側面 S2‧‧‧ outside side
S3、S4‧‧‧側面 S3, S4‧‧‧ side
Ss‧‧‧平滑側面 Ss‧‧‧Smooth side
t‧‧‧總厚度 T‧‧‧ total thickness
V‧‧‧軌跡變異 V‧‧‧ trajectory variation
W‧‧‧寬度 W‧‧‧Width
圖1是本發明一實施例的複合基板的俯視示意圖。 1 is a schematic plan view of a composite substrate according to an embodiment of the present invention.
圖2是圖1的複合基板的側視示意圖。 2 is a side elevational view of the composite substrate of FIG. 1.
圖3是圖2的複合基板的局部剖面放大圖。 3 is a partial cross-sectional enlarged view of the composite substrate of FIG. 2.
圖4是圖1的複合基板在區域A的局部上視圖,且表示圖3的平滑側面的軌跡變異。 4 is a partial top view of the composite substrate of FIG. 1 in region A, and showing the trajectory variation of the smooth side of FIG.
圖5A是圖1的複合基板的側邊產生裂痕的示意圖。 FIG. 5A is a schematic view showing cracks on the side of the composite substrate of FIG. 1. FIG.
圖5B是圖5A的複合基板的凹槽結構防止側邊裂痕往內擴展的示意圖。 FIG. 5B is a schematic view showing the groove structure of the composite substrate of FIG. 5A preventing the side cracks from expanding inward. FIG.
圖6是本發明另一實施例的複合基板的俯視示意圖。 6 is a top plan view of a composite substrate according to another embodiment of the present invention.
圖7是本發明又一實施例的複合基板的局部放大圖。 Fig. 7 is a partially enlarged plan view showing a composite substrate according to still another embodiment of the present invention.
圖8是本發明再一實施例的複合基板的局部放大圖。 Fig. 8 is a partially enlarged plan view showing a composite substrate according to still another embodiment of the present invention.
圖9是本發明更一實施例的複合基板的側視示意圖。 Figure 9 is a side elevational view of a composite substrate in accordance with a further embodiment of the present invention.
圖10是本發明另一實施例的複合基板的俯視示意圖。 Figure 10 is a top plan view of a composite substrate in accordance with another embodiment of the present invention.
圖11是圖10的複合基板的側視示意圖。 Figure 11 is a side elevational view of the composite substrate of Figure 10.
圖12是本發明又一實施例的複合基板的側視示意圖。 Figure 12 is a side elevational view of a composite substrate in accordance with still another embodiment of the present invention.
圖13與圖14是本發明其他實施例的複合基板的側視示意圖。 13 and 14 are schematic side views of a composite substrate according to another embodiment of the present invention.
圖15A至圖15C是圖14的複合基板的相關實施例的俯視示意圖。 15A-15C are top plan views of related embodiments of the composite substrate of Fig. 14.
圖16是本發明再一實施例的複合基板的俯視示意圖。 Figure 16 is a top plan view of a composite substrate in accordance with still another embodiment of the present invention.
圖1是本發明一實施例的複合基板的俯視示意圖。圖2是圖1的複合基板的側視示意圖。請參考圖1與圖2,在本實施例中,複合基板100包括第一基板部110、第二基板部120、第一硬化層130以及第二硬化層140。第二基板部120配置於第一基板部110上。第一硬化層130配置於第二基板部120上,且第二基板部120位在第一硬化層130與第一基板部110之間。第二硬化層140可選擇性地配置於第一基板部110上,且第一基板部110位在第二硬化層140與第二基板部120之間。 1 is a schematic plan view of a composite substrate according to an embodiment of the present invention. 2 is a side elevational view of the composite substrate of FIG. 1. Referring to FIG. 1 and FIG. 2 , in the embodiment, the composite substrate 100 includes a first substrate portion 110 , a second substrate portion 120 , a first hardened layer 130 , and a second hardened layer 140 . The second substrate portion 120 is disposed on the first substrate portion 110. The first hardened layer 130 is disposed on the second substrate portion 120 , and the second substrate portion 120 is located between the first hardened layer 130 and the first substrate portion 110 . The second hardened layer 140 is selectively disposed on the first substrate portion 110 , and the first substrate portion 110 is located between the second hardened layer 140 and the second substrate portion 120 .
在本實施例中,第一基板部110與第二基板部120的特性為:在相同厚度下,第二基板部120的可撓性劣於第一基板部110的可撓性。複合基板100例如是用於製作觸控面板(touch panel)的基板,特別是用於製作單片塑膠式(one plastic solution,OPS)觸控面板的基板。此類觸控面板所使用的基板須具備可撓性,以使觸控面板的設計可以趨向輕薄化。然而,此類基板因常會設置於觸控面板的接觸面,所以也須顧及強度,故通常會利用可撓性不同的基板部製成複合基板,例如是第一基板部110與第二基板部120的組合,可用以提高複合基板100的強度。此外,複合基板100的第一硬化層130與第二硬化層140分別位在複合基板100的外側,使得第一基板部110與第二基板部120位在第一硬化層130與第二硬化層140之間,亦可用以提高複合基板100的強度。 In the present embodiment, the characteristics of the first substrate portion 110 and the second substrate portion 120 are such that the flexibility of the second substrate portion 120 is inferior to the flexibility of the first substrate portion 110 at the same thickness. The composite substrate 100 is, for example, a substrate for fabricating a touch panel, and particularly a substrate for fabricating a one-piece plastic (OPS) touch panel. The substrate used in such a touch panel must be flexible so that the design of the touch panel can be made thinner and lighter. However, since such a substrate is often disposed on the contact surface of the touch panel, the strength must be considered. Therefore, the substrate portion is made of a flexible substrate, for example, the first substrate portion 110 and the second substrate portion. A combination of 120 can be used to increase the strength of the composite substrate 100. In addition, the first hardened layer 130 and the second hardened layer 140 of the composite substrate 100 are respectively located outside the composite substrate 100 such that the first substrate portion 110 and the second substrate portion 120 are located at the first hardened layer 130 and the second hardened layer. Between 140, it can also be used to increase the strength of the composite substrate 100.
在本實施例中,複合基板100設置有第一硬化層130的 第一面102設置有凹槽結構104。複合基板100的第一面102為複合基板100中對應於第一硬化層130的表面。凹槽結構104對應於複合基板100的周圍區域106並鄰近複合基板100的側邊108,並且凹槽結構104從第一面102貫穿第一硬化層130與第二基板部120。因此,第一基板部110的局部經由貫穿第一硬化層130與第二基板部120的凹槽結構104而暴露出來,如圖1與圖2所示。此外,在本實施例中,複合基板100還可包括填充材料150。填充材料150配置於凹槽結構104內,其中填充材料150的折射率相近於第二基板部120的折射率,但在其他未繪示的實施例中,凹槽結構104內亦可不填入填充材料150,本發明不限制填充材料150的配置與否。 In this embodiment, the composite substrate 100 is provided with the first hardened layer 130 The first face 102 is provided with a groove structure 104. The first surface 102 of the composite substrate 100 is a surface of the composite substrate 100 corresponding to the first hardened layer 130. The groove structure 104 corresponds to the surrounding area 106 of the composite substrate 100 and is adjacent to the side 108 of the composite substrate 100 , and the groove structure 104 penetrates the first hard layer 130 and the second substrate portion 120 from the first surface 102 . Therefore, a portion of the first substrate portion 110 is exposed through the groove structure 104 penetrating the first hardened layer 130 and the second substrate portion 120, as shown in FIGS. 1 and 2. Further, in the present embodiment, the composite substrate 100 may further include a filling material 150. The filling material 150 is disposed in the groove structure 104, wherein the refractive index of the filling material 150 is close to the refractive index of the second substrate portion 120, but in other embodiments not shown, the filling may not be filled in the groove structure 104. The material 150, the present invention does not limit the configuration of the filler material 150.
圖3是圖2的複合基板的局部剖面放大圖。圖4是圖1的複合基板在區域A的局部上視圖,且表示圖3的平滑側面的軌跡變異。請參考圖1至圖4,在本實施例中,凹槽結構104具有內側面S1與外側面S2,外側面S2位於內側面S1與複合基板100的側邊108之間。內側面S1為平滑側面,並且,由圖4的上視圖來看,平滑側面(內側面S1)的軌跡變異V小於15μm,其中軌跡變異V是指將平滑側面(內側面S1)以線性軌跡表示時,線性軌跡的起伏程度。因此,軌跡變異V定義為,當平滑側面(內側面S1)的軌跡實質上平行第一基板部110的側邊108分布時,平滑側面(內側面S1)的軌跡中最接近側邊108的第一點P1與最遠離側邊108的第二點P2之間的距離,如圖4所示。上述的平滑 側面(內側面S1)實質上平行第一基板部110的側邊108分布,僅是藉由第一基板部110的側邊108作為比較基準,以明確定義平滑側面的軌跡變異V,而非用以限定本發明的平滑側面(內側面S1)平行第一基板部110的側邊108。另外,上述的距離例如是沿著垂直於側邊108的方向所量測到的尺寸。 3 is a partial cross-sectional enlarged view of the composite substrate of FIG. 2. 4 is a partial top view of the composite substrate of FIG. 1 in region A, and showing the trajectory variation of the smooth side of FIG. Referring to FIG. 1 to FIG. 4 , in the embodiment, the groove structure 104 has an inner side surface S1 and an outer side surface S2 , and the outer side surface S2 is located between the inner side surface S1 and the side edge 108 of the composite substrate 100 . The inner side surface S1 is a smooth side surface, and, as seen from the top view of FIG. 4, the trajectory variation V of the smooth side surface (inner side surface S1) is less than 15 μm, wherein the trajectory variation V means that the smooth side surface (inner side surface S1) is represented by a linear trajectory The degree of fluctuation of the linear trajectory. Therefore, the trajectory variation V is defined such that when the trajectory of the smooth side surface (inner side surface S1) is substantially parallel to the side edges 108 of the first substrate portion 110, the trajectory closest to the side edge 108 of the smooth side surface (inner side surface S1) The distance between the point P1 and the second point P2 farthest from the side 108 is as shown in FIG. Smoothing above The side surface (inner side surface S1) is substantially parallel to the side edges 108 of the first substrate portion 110, and is only used as a comparison reference by the side edges 108 of the first substrate portion 110 to clearly define the trajectory variation V of the smooth side surface, instead of using The side surface 108 of the first substrate portion 110 is paralleled to define a smooth side surface (inner side surface S1) of the present invention. Additionally, the distances described above are, for example, dimensions measured along a direction perpendicular to the side edges 108.
另一方面,在本實施例中,第一基板部110的材質例如為聚碳酸酯(polycarbonate,PC),而第二基板部120的材質例如為聚甲基丙烯酸甲酯(polymethyl methacrylate,PMMA)或是環烯共聚物(cyclic olefin copolymer,COC)。第一硬化層130的表面的鉛筆硬度(pencil hardness)可以高於H。凹槽結構104可經由例如是雷射在複合基板100的第一面102對應於周圍區域106之處加工而貫穿第一硬化層130與第二基板部120。 On the other hand, in the present embodiment, the material of the first substrate portion 110 is, for example, polycarbonate (PC), and the material of the second substrate portion 120 is, for example, polymethyl methacrylate (PMMA). Or a cyclic olefin copolymer (COC). The pencil hardness of the surface of the first hardened layer 130 may be higher than H. The groove structure 104 may penetrate through the first hard layer 130 and the second substrate portion 120 via, for example, laser processing at a location where the first face 102 of the composite substrate 100 corresponds to the surrounding region 106.
此外,第一基板部110的厚度在本實施例中大於第二基板部120。第一硬化層130與第二基板部120的總厚度t小於150微米。由於凹槽結構104貫穿第一硬化層130與第二基板部120,故在本實施例中,凹槽結構104的深度d小於150微米,且寬度W約為30微米。然而,本發明並不限定第一基板部110與第二基板部120的材質、第一硬化層130與第二基板部120的總厚度t、凹槽結構104的深度d與寬度W,其可依據實際需求調整。 Further, the thickness of the first substrate portion 110 is larger than the second substrate portion 120 in this embodiment. The total thickness t of the first hardened layer 130 and the second substrate portion 120 is less than 150 micrometers. Since the groove structure 104 penetrates the first hardened layer 130 and the second substrate portion 120, in the present embodiment, the groove structure 104 has a depth d of less than 150 micrometers and a width W of about 30 micrometers. However, the present invention does not limit the material of the first substrate portion 110 and the second substrate portion 120, the total thickness t of the first hardened layer 130 and the second substrate portion 120, the depth d and the width W of the groove structure 104, which may Adjust according to actual needs.
圖5A是圖1的複合基板的側邊產生裂痕的示意圖。圖5B是圖5A的複合基板的凹槽結構防止側邊裂痕往內擴展的示意圖。請參考圖5A與圖5B,當複合基板100需進行高溫製程時, 由於複合基板100的各基板部與各硬化層的材質可能不相同,故容易在高溫製程中因膨脹尺度不同而累積應力。若複合基板100在高溫製程之前的加工過程中(例如是切割複合基板100)已對複合基板100產生破壞,例如是如圖5A所示的位在側邊108的裂痕C,後續的高溫製程會使裂痕C因複合基板100上累積的應力而往複合基板100的內部擴展。 FIG. 5A is a schematic view showing cracks on the side of the composite substrate of FIG. 1. FIG. FIG. 5B is a schematic view showing the groove structure of the composite substrate of FIG. 5A preventing the side cracks from expanding inward. FIG. Referring to FIG. 5A and FIG. 5B, when the composite substrate 100 is subjected to a high temperature process, Since the material of each of the substrate portions of the composite substrate 100 and the respective hardened layers may be different, it is easy to accumulate stress due to the difference in expansion scale in the high-temperature process. If the composite substrate 100 has been damaged by the composite substrate 100 during the processing before the high temperature process (for example, cutting the composite substrate 100), for example, the crack C at the side 108 as shown in FIG. 5A, the subsequent high temperature process will occur. The crack C is spread to the inside of the composite substrate 100 due to the stress accumulated on the composite substrate 100.
此時,由於本實施例的複合基板100的第一面102對應於周圍區域106之處設置有凹槽結構104,當裂痕C從複合基板100的側邊108往複合基板100的內部擴展時,貫穿第一硬化層130與第二基板部120的凹槽結構104可以有效阻擋裂痕C的擴展,如圖5B所示,進而提高複合基板100的製造良率。 At this time, since the first surface 102 of the composite substrate 100 of the present embodiment is provided with the groove structure 104 corresponding to the surrounding area 106, when the crack C is expanded from the side 108 of the composite substrate 100 to the inside of the composite substrate 100, The groove structure 104 penetrating the first hardened layer 130 and the second substrate portion 120 can effectively block the expansion of the crack C, as shown in FIG. 5B, thereby improving the manufacturing yield of the composite substrate 100.
請參考圖1、圖5A與圖5B,在本實施例中,位在第一面102的凹槽結構104環繞複合基板100的整個周圍區域106。具體而言,凹槽結構104為連續的環狀凹槽,並在周圍區域106構成連續的封閉路徑。因此,無論裂痕C出現在複合基板100的側邊108的哪個部分,在周圍區域106構成連續的封閉路徑的凹槽結構104都能有效防止裂痕C往複合基板100的內部擴展。然而,本發明不限制凹槽結構104的形狀,也不限制凹槽結構104需環繞複合基板100的整個周圍區域106,其可依據實際需求調整,如後續介紹的圖6至圖8所示。 Referring to FIG. 1 , FIG. 5A and FIG. 5B , in the embodiment, the groove structure 104 located on the first surface 102 surrounds the entire surrounding area 106 of the composite substrate 100 . In particular, the groove structure 104 is a continuous annular groove and forms a continuous closed path in the surrounding area 106. Therefore, regardless of which portion of the side 108 of the composite substrate 100 the crack C appears, the groove structure 104 which constitutes a continuous closed path in the peripheral region 106 can effectively prevent the crack C from expanding toward the inside of the composite substrate 100. However, the present invention does not limit the shape of the groove structure 104, nor does it restrict the groove structure 104 from surrounding the entire surrounding area 106 of the composite substrate 100, which may be adjusted according to actual needs, as shown in FIGS. 6 to 8 described later.
圖6是本發明另一實施例的複合基板的俯視示意圖。請參考圖6,在圖6的實施例中,複合基板100a的凹槽結構104a包 括多個條狀凹槽1042。條狀凹槽1042分別對應於複合基板100a的多個側邊,例如是對應於矩形的複合基板100a的四個側邊,其中相鄰的兩條狀凹槽1042互相交錯,使得位在第一面102的凹槽結構104a環繞複合基板100a的整個周圍區域106,並在周圍區域106構成連續的封閉路徑。因此,複合基板100a的凹槽結構104a可以有效防止位在複合基板100a的側邊108的裂痕C(如圖5B)往複合基板100a的內部擴展。 6 is a top plan view of a composite substrate according to another embodiment of the present invention. Please refer to FIG. 6. In the embodiment of FIG. 6, the groove structure 104a of the composite substrate 100a is packaged. A plurality of strip grooves 1042 are included. The strip-shaped recesses 1042 respectively correspond to a plurality of side edges of the composite substrate 100a, for example, four sides corresponding to the rectangular composite substrate 100a, wherein the adjacent two-shaped recesses 1042 are interlaced with each other so that the first one is located at the first The groove structure 104a of the face 102 surrounds the entire surrounding area 106 of the composite substrate 100a and forms a continuous closed path in the surrounding area 106. Therefore, the groove structure 104a of the composite substrate 100a can effectively prevent the crack C (FIG. 5B) located at the side 108 of the composite substrate 100a from expanding toward the inside of the composite substrate 100a.
圖7是本發明又一實施例的複合基板的局部放大圖。請參考圖7,在圖7的實施例中,複合基板100b的凹槽結構104b可以為連續的環狀凹槽。位在第一面102的凹槽結構104b由線性凹槽1044與線性凹槽1046交替連接而構成折曲狀的結構,並且環繞複合基板100b的整個周圍區域106,以在周圍區域106構成連續的封閉路徑。在此,線性凹槽1044與線性凹槽1046各自具有不同延伸方向。 Fig. 7 is a partially enlarged plan view showing a composite substrate according to still another embodiment of the present invention. Referring to FIG. 7, in the embodiment of FIG. 7, the groove structure 104b of the composite substrate 100b may be a continuous annular groove. The groove structure 104b positioned on the first side 102 is alternately connected by the linear groove 1044 and the linear groove 1046 to form a bent structure, and surrounds the entire surrounding area 106 of the composite substrate 100b to constitute a continuous area in the surrounding area 106. Closed path. Here, the linear groove 1044 and the linear groove 1046 each have a different extending direction.
圖8是本發明再一實施例的複合基板的局部放大圖。請參考圖8,在圖8的實施例中,複合基板100c的凹槽結構104c包括不連續的多個條狀凹槽1048。條狀凹槽1048排列成多列,同一列的條狀凹槽1048彼此分離間距D,且另一列的條狀凹槽1048中至少一者對應於間距D設置。 Fig. 8 is a partially enlarged plan view showing a composite substrate according to still another embodiment of the present invention. Referring to FIG. 8, in the embodiment of FIG. 8, the groove structure 104c of the composite substrate 100c includes a plurality of strip-shaped grooves 1048 that are discontinuous. The strip-shaped recesses 1048 are arranged in a plurality of rows, the strip-shaped recesses 1048 of the same column are separated from each other by a spacing D, and at least one of the strip-shaped recesses 1048 of the other column is disposed corresponding to the spacing D.
圖9是本發明更一實施例的複合基板的側視示意圖。請參考圖9,在本實施例中,複合基板100d與複合基板100的主要差異在於,複合基板100d的第二基板部120a包括基質122與分 布於基質122中的多個纖維結構124。基質122的材質可以相同於第一基板部110,例如是聚碳酸酯,而第二基板部120a的纖維結構124的材質例如是玻璃纖維或高分子材料纖維。 Figure 9 is a side elevational view of a composite substrate in accordance with a further embodiment of the present invention. Referring to FIG. 9, in the present embodiment, the main difference between the composite substrate 100d and the composite substrate 100 is that the second substrate portion 120a of the composite substrate 100d includes the substrate 122 and the sub-board. A plurality of fibrous structures 124 disposed in the matrix 122. The material of the substrate 122 may be the same as the first substrate portion 110, for example, polycarbonate, and the material of the fiber structure 124 of the second substrate portion 120a is, for example, glass fiber or polymer material fiber.
第二基板部120a與第一基板部110可於一道連續製程進行製作,例如是先在液態的聚碳酸酯中混入玻璃纖維,以形成包括基質122與纖維結構124的第二基板部120a,並繼續將更多的液態的聚碳酸酯塗佈或是滴注於第二基板部120a上,以形成第一基板部110。 The second substrate portion 120a and the first substrate portion 110 can be fabricated in a continuous process, for example, by first mixing glass fibers in a liquid polycarbonate to form a second substrate portion 120a including a substrate 122 and a fiber structure 124, and More liquid polycarbonate is continuously applied or dropped onto the second substrate portion 120a to form the first substrate portion 110.
待第一硬化層130形成於第二基板部120a上之後,便可經由雷射加工在複合基板100d的第一面102對應於周圍區域106之處形成凹槽結構104。雖然基質122的材質相同於第一基板部110,但由於基質122內還有纖維結構124,因此可以達成在相同厚度下,第二基板部120a的可撓性劣於第一基板部110的可撓性,以提高複合基板100d的強度。當然,在其他的實施例中,第二基板部120a的基質122與第一基板部110可以具有不同的材質,而第二基板部120a與第一基板部110可以藉由共擠出或是貼合的方式堆疊在一起。 After the first hardened layer 130 is formed on the second substrate portion 120a, the groove structure 104 can be formed at the first surface 102 of the composite substrate 100d corresponding to the surrounding region 106 via laser processing. Although the material of the substrate 122 is the same as that of the first substrate portion 110, since the fiber structure 124 is also present in the substrate 122, it can be achieved that the flexibility of the second substrate portion 120a is inferior to that of the first substrate portion 110 at the same thickness. Flexibility to increase the strength of the composite substrate 100d. Of course, in other embodiments, the substrate 122 of the second substrate portion 120a and the first substrate portion 110 may have different materials, and the second substrate portion 120a and the first substrate portion 110 may be coextruded or pasted. The way they are stacked together.
圖10是本發明另一實施例的複合基板的俯視示意圖。圖11是圖10的複合基板的側視示意圖。請參考圖10與圖11,在本實施例中,複合基板200包括第一基板部210、第二基板部220、第一硬化層230以及第二硬化層240。第二基板部220配置於第一基板部210上。第一硬化層230配置於第二基板部220上,且第 二基板部220位於第一硬化層230與第一基板部210之間。第二硬化層240配置於第一基板部210上,且第一基板部210位在第二硬化層240與第二基板部220之間。第一基板部210與第二基板部220的特性為:在相同厚度下,第二基板部220的可撓性劣於第一基板部210的可撓性。有關第一基板部210與第二基板部220的描述可以參考前述的第一基板部110與第二基板部120。 Figure 10 is a top plan view of a composite substrate in accordance with another embodiment of the present invention. Figure 11 is a side elevational view of the composite substrate of Figure 10. Referring to FIG. 10 and FIG. 11 , in the embodiment, the composite substrate 200 includes a first substrate portion 210 , a second substrate portion 220 , a first hardened layer 230 , and a second hardened layer 240 . The second substrate portion 220 is disposed on the first substrate portion 210. The first hardened layer 230 is disposed on the second substrate portion 220, and The two substrate portions 220 are located between the first hardened layer 230 and the first substrate portion 210. The second hardened layer 240 is disposed on the first substrate portion 210 , and the first substrate portion 210 is located between the second hardened layer 240 and the second substrate portion 220 . The characteristics of the first substrate portion 210 and the second substrate portion 220 are such that the flexibility of the second substrate portion 220 is inferior to the flexibility of the first substrate portion 210 at the same thickness. For the description of the first substrate portion 210 and the second substrate portion 220, reference may be made to the aforementioned first substrate portion 110 and second substrate portion 120.
在本實施例中,複合基板200實質上為上述的複合基板100進一步經過切割或者形成導角等步驟而製作成的,其中複合基板100切割成由凹槽結構104所定義出來的尺寸大小即為本實施例的複合基板200。在此,第一硬化層230的側面S3與第二基板部220的側面S4會暴露於外並且構成平滑側面Ss,平滑側面Ss的軌跡變異V小於15μm,其中軌跡變異V的定義可參考圖4與前述的相關描述,在此不多加贅述。也就是說,本實施例的平滑側面Ss可視為前述實施例的內側面S1。根據前述實施例可知,利用雷射加工形成平滑表面Ss,可以有效防止如圖5A所示的裂痕C往複合基板200內部擴展,進而提高複合基板200的製造良率。 In the present embodiment, the composite substrate 200 is substantially formed by the step of cutting or forming a lead angle, etc., wherein the composite substrate 100 is cut into a size defined by the groove structure 104. The composite substrate 200 of this embodiment. Here, the side surface S3 of the first hardened layer 230 and the side surface S4 of the second substrate portion 220 are exposed to the outside and constitute a smooth side surface Ss, and the track variation V of the smooth side surface Ss is less than 15 μm, wherein the definition of the track variation V can be referred to FIG. The related descriptions of the foregoing are not described here. That is, the smooth side surface Ss of the present embodiment can be regarded as the inner side surface S1 of the foregoing embodiment. According to the foregoing embodiment, it is understood that the smooth surface Ss is formed by laser processing, and the crack C as shown in FIG. 5A can be effectively prevented from expanding into the inside of the composite substrate 200, thereby improving the manufacturing yield of the composite substrate 200.
在本實施例中,第一基板部210的材質例如為聚碳酸酯,第二基板部220的材質例如為聚甲基丙烯酸甲酯或是環烯共聚物。此外,第一硬化層230的表面的鉛筆硬度可以高於H。第一基板部210的厚度大於第二基板部220的厚度,而第一硬化層230與第二基板部220的總厚度t小於150微米。然而,本發明並不限制第一基板部210與第二基板部220的材質,以及第一基板部 210、第一硬化層230與第二基板部220的厚度,其可依據實際需求作調整。 In the present embodiment, the material of the first substrate portion 210 is, for example, polycarbonate, and the material of the second substrate portion 220 is, for example, polymethyl methacrylate or a cycloolefin copolymer. Further, the surface hardness of the surface of the first hardened layer 230 may be higher than H. The thickness of the first substrate portion 210 is greater than the thickness of the second substrate portion 220, and the total thickness t of the first hardened layer 230 and the second substrate portion 220 is less than 150 microns. However, the present invention does not limit the materials of the first substrate portion 210 and the second substrate portion 220, and the first substrate portion. 210, the thickness of the first hardened layer 230 and the second substrate portion 220, which can be adjusted according to actual needs.
舉例而言,圖12是本發明又一實施例的複合基板的側視示意圖。請參考圖12,在本實施例中,複合基板200a與複合基板200的主要差異在於,複合基板200a的第二基板部220a包括基質222與分布於基質222中的多個纖維結構224。基質222的材質可以相同於第一基板部210,例如是聚碳酸酯,而第二基板部220a的纖維結構224的材質例如是玻璃纖維或高分子材料纖維。複合基板200a的第一基板部210與第二基板部220a的組成與製作方法請參考前述的複合基板100d的第一基板部110與第二基板部120a的組成與製作方法,在此不多加贅述。 For example, FIG. 12 is a side view of a composite substrate according to still another embodiment of the present invention. Referring to FIG. 12, in the present embodiment, the main difference between the composite substrate 200a and the composite substrate 200 is that the second substrate portion 220a of the composite substrate 200a includes a substrate 222 and a plurality of fiber structures 224 distributed in the substrate 222. The material of the substrate 222 may be the same as the first substrate portion 210, for example, polycarbonate, and the material of the fiber structure 224 of the second substrate portion 220a is, for example, glass fiber or polymer material fiber. For the composition and manufacturing method of the first substrate portion 210 and the second substrate portion 220a of the composite substrate 200a, refer to the composition and manufacturing method of the first substrate portion 110 and the second substrate portion 120a of the composite substrate 100d described above, and the description thereof will not be repeated here. .
由此可知,本發明並不限制複合基板的第一基板部與第二基板部的材質與形成方式,只要複合基板的第一基板部與第二基板部的特性符合在相同厚度下,第二基板部的可撓性劣於第一基板部的可撓性,以及第一硬化層的表面的鉛筆硬度大於H,便可以將本發明的設計應用於上述的複合基板,以防止位在複合基板的側邊或是周邊的裂痕往其內部擴展而影響製造良率。 Therefore, the present invention does not limit the material and formation manner of the first substrate portion and the second substrate portion of the composite substrate, as long as the characteristics of the first substrate portion and the second substrate portion of the composite substrate conform to the same thickness, and second The flexibility of the substrate portion is inferior to the flexibility of the first substrate portion, and the pencil hardness of the surface of the first hardened layer is greater than H, so that the design of the present invention can be applied to the above composite substrate to prevent the position on the composite substrate. The cracks on the sides or the periphery extend to the inside to affect the manufacturing yield.
圖13與圖14是本發明其他實施例的複合基板的側視示意圖。圖15A至圖15C是圖14的複合基板的相關實施例的俯視示意圖。請先參考圖13、圖14與圖15A,在本實施例中,複合基板100e與100f的結構大致類似於圖1與圖2的複合基板100,其主要差異在於,複合基板100e與100f除了包括複合基板100的構件 (如圖2所示的第一基板部110、第二基板部120、第一硬化層130、第二硬化層140以及填充材料150)以及特徵(第一面102設置有對應於周圍區域106並鄰近側邊108的凹槽結構104)之外,複合基板100e與100f還具有透光區域107。前述的周圍區域106位於透光區域107的至少一側,例如圖15A的周圍區域106是以環繞透光區域107為例,但本發明並不以此為限制,其他實施例的周圍區域106也可以僅位在透光區域107的相對兩側。 13 and 14 are schematic side views of a composite substrate according to another embodiment of the present invention. 15A-15C are top plan views of related embodiments of the composite substrate of Fig. 14. Referring to FIG. 13 , FIG. 14 and FIG. 15A , in the present embodiment, the structures of the composite substrates 100 e and 100 f are substantially similar to those of the composite substrate 100 of FIGS. 1 and 2 , the main difference being that the composite substrates 100 e and 100 f include Component of composite substrate 100 (the first substrate portion 110, the second substrate portion 120, the first hardened layer 130, the second hardened layer 140, and the filling material 150 as shown in FIG. 2) and features (the first surface 102 is provided corresponding to the surrounding region 106 In addition to the groove structure 104) of the side edges 108, the composite substrates 100e and 100f also have a light transmitting region 107. The foregoing surrounding area 106 is located on at least one side of the light-transmitting area 107. For example, the surrounding area 106 of FIG. 15A is an example of the surrounding light-transmitting area 107. However, the present invention is not limited thereto, and the surrounding area 106 of other embodiments is also It may be located only on opposite sides of the light transmitting region 107.
在圖13與圖14的實施例中,複合基板100e與100f更包括裝飾層160。首先,在圖13的實施例中,裝飾層160配置於複合基板100e配置有第一硬化層130的第一面102,並且對應於周圍區域106。如此,當複合基板100e應用於製作面板(未繪示),例如是製作觸控面板或顯示面板時,裝飾層160可用以遮蔽面板內的走線。然而,本發明並不限制將裝飾層160配置於第一面102。在圖14的實施例中,複合基板100f也同樣配置有裝飾層160。與圖13的複合基板100e不同之處在於,複合基板100f的裝飾層160配置於相對於第一面102的第二面103,並且對應於周圍區域106。此處所述的第二面103係指複合基板100f中對應於第二硬化層140的表面。據此,本發明並不限制將裝飾層160配置於複合基板的第一面102或第二面103,其可依據需求調整。另一方面,本實施例的裝飾層160是以對應於整個周圍區域106為例,其中對應於整個周圍區域106是指裝飾層160從複合基板100e的側邊108往內延伸並且跨越凹槽結構104。然而,本發明並不以此 為限制,其他實施例的裝飾層也可以僅配置於部份周圍區域106,例如是從對應於凹槽結構104的邊緣之處往朝向透光區域107的方向延伸,而不遮蔽凹槽結構104。亦即,只要裝飾層160符合位在周圍區域106的條件,其實際尺寸與位置可依據實際需求調整。此外,圖13的複合基板100e與圖14的複合基板100f的俯視圖可參照圖15A,其中圖15A僅是用來示意本發明的複合基板100f的裝飾層160對應於周圍區域106,其構件的尺寸比例並非為實際的尺寸比例。舉例而言,實際上凹槽結構104應該更為貼近側邊108,並非如同圖15A所示位在裝飾層160的中間。 In the embodiment of FIGS. 13 and 14, the composite substrates 100e and 100f further include a decorative layer 160. First, in the embodiment of FIG. 13, the decorative layer 160 is disposed on the composite substrate 100e with the first face 102 of the first hardened layer 130 disposed, and corresponds to the surrounding region 106. As such, when the composite substrate 100e is applied to a fabrication panel (not shown), such as a touch panel or display panel, the decorative layer 160 can be used to shield the traces within the panel. However, the present invention is not limited to disposing the decorative layer 160 on the first side 102. In the embodiment of Fig. 14, the composite substrate 100f is also provided with the decorative layer 160. The difference from the composite substrate 100e of FIG. 13 is that the decorative layer 160 of the composite substrate 100f is disposed on the second surface 103 with respect to the first surface 102 and corresponds to the surrounding area 106. The second face 103 described herein refers to a surface of the composite substrate 100f corresponding to the second hardened layer 140. Accordingly, the present invention is not limited to disposing the decorative layer 160 on the first side 102 or the second side 103 of the composite substrate, which can be adjusted as needed. On the other hand, the decorative layer 160 of the present embodiment is exemplified by the entire surrounding area 106, wherein the corresponding surrounding area 106 means that the decorative layer 160 extends inwardly from the side 108 of the composite substrate 100e and spans the groove structure. 104. However, the present invention does not For the sake of limitation, the decorative layer of other embodiments may also be disposed only in a portion of the surrounding area 106, for example, extending from the edge corresponding to the groove structure 104 toward the light transmitting area 107 without obscuring the groove structure 104. . That is, as long as the decorative layer 160 conforms to the condition of the surrounding area 106, its actual size and position can be adjusted according to actual needs. In addition, a top view of the composite substrate 100e of FIG. 13 and the composite substrate 100f of FIG. 14 can be referred to FIG. 15A, wherein FIG. 15A is only used to illustrate the decorative layer 160 of the composite substrate 100f of the present invention corresponding to the surrounding area 106, the size of which is The ratio is not the actual size ratio. For example, in practice the groove structure 104 should be closer to the side edges 108 than in the middle of the decorative layer 160 as shown in Figure 15A.
再者,在圖13與圖14的實施例中,複合基板100e與100f更包括承板170。裝飾層160配置於承板170,並且對應於複合基板100e的周圍區域106而藉由承板170貼附於第一面102,或對應於複合基板100f的周圍區域106而藉由承板170貼附於第二面103。更進一步地說,裝飾層160可以事先製作在承板170上。之後,配置有裝飾層160的承板170以黏著層180貼附於第一面102或第二面103,並且裝飾層160對應於周邊區域106。其中,黏著層180可以全面覆蓋裝飾層160與承板170上未配置有裝飾層160的部分表面,以避免空氣進入複合基板100e與100f內,也可以僅配置在裝飾層160上。此外,本發明亦不限制裝飾層160的作法,其也可直接製作於第一面102或第二面103並對應於周邊區域106,而省略配置承板170與黏著層180。 Furthermore, in the embodiment of FIGS. 13 and 14, the composite substrates 100e and 100f further include a carrier 170. The decorative layer 160 is disposed on the carrier 170 and is attached to the first surface 102 by the carrier 170 corresponding to the surrounding area 106 of the composite substrate 100e, or is attached by the carrier 170 corresponding to the surrounding area 106 of the composite substrate 100f. Attached to the second side 103. Further, the decorative layer 160 may be fabricated on the carrier 170 in advance. Thereafter, the carrier 170 provided with the decorative layer 160 is attached to the first face 102 or the second face 103 with the adhesive layer 180, and the decorative layer 160 corresponds to the peripheral region 106. The adhesive layer 180 may completely cover the decorative layer 160 and a portion of the surface of the carrier 170 on which the decorative layer 160 is not disposed to prevent air from entering the composite substrates 100e and 100f, or may be disposed only on the decorative layer 160. In addition, the present invention does not limit the method of the decorative layer 160. It may be directly formed on the first surface 102 or the second surface 103 and corresponds to the peripheral region 106, and the arrangement carrier 170 and the adhesive layer 180 are omitted.
請參考圖14與圖15A,在本實施例中,複合基板100f 更包括觸控感測結構190a。觸控感測結構190a配置於第二面103,並且至少對應於透光區域107。具體而言,觸控感測結構190a包括沿相交的兩方向延伸的第一電極單元192a與第二電極單元194a,其中雖然圖15A僅繪示部分第一電極單元192a與部分第二電極單元194a作為示意,但實際上觸控感測結構190a可以具有多個第一電極單元192a與多個第二電極單元194a。本實施例的觸控感測結構190a例如是互感式的電極結構。亦即,當複合基板100f作為觸控面板,並以對應於第一面102的第一硬化層130作為觸控面時,第一電極單元192a與第二電極單元194a可以配置於複合基板100e的第二面103,且第一電極單元192a與第二電極單元194a的交會處以絕緣材料(未繪示)分隔,而第一電極單元192a與第二電極單元194a的其中之一跨越絕緣材料,以使第一電極單元192a與第二電極單元194a彼此電性絕緣。或者,第一電極單元192a與第二電極單元194a的其中之一可以配置於複合基板100e的第二面103,而第一電極單元192a與第二電極單元194a的另一配置於另一基板(未繪示),且複合基板100f覆蓋在基板上。換言之,本發明並不限制電極結構的實際製作方式,其可依據需求調整。據此,複合基板100f可作為觸控面板,其中用於連接第一電極單元192a與第二電極單元194a的走線(未繪示)可以從第一電極單元192a或第二電極單元194a延伸至周圍區域106,並藉由裝飾層160遮蔽,以避免使用者從複合基板100e的外部察覺走線,而影響觸控面板的外觀。此外,本實施例的複合 基板100f內的複合基板100也可以依據需更換成圖6至圖9的複合基板100a至100d,並在其上配置裝飾層160與觸控感測結構190a。或者,圖13的複合基板100e也可參照圖15A的複合基板100f配置觸控感測結構190a。然而,本發明並不限制觸控感測結構的種類,以下將針對其他的觸控感測結構作說明。 Referring to FIG. 14 and FIG. 15A, in the embodiment, the composite substrate 100f The touch sensing structure 190a is further included. The touch sensing structure 190 a is disposed on the second surface 103 and corresponds to at least the light transmitting region 107 . Specifically, the touch sensing structure 190a includes a first electrode unit 192a and a second electrode unit 194a extending in two intersecting directions, wherein FIG. 15A only shows a portion of the first electrode unit 192a and a portion of the second electrode unit 194a. By way of illustration, the touch sensing structure 190a may have a plurality of first electrode units 192a and a plurality of second electrode units 194a. The touch sensing structure 190a of this embodiment is, for example, a mutual inductance type electrode structure. That is, when the composite substrate 100f is used as the touch panel and the first hardened layer 130 corresponding to the first surface 102 is used as the touch surface, the first electrode unit 192a and the second electrode unit 194a may be disposed on the composite substrate 100e. The second surface 103, and the intersection of the first electrode unit 192a and the second electrode unit 194a is separated by an insulating material (not shown), and one of the first electrode unit 192a and the second electrode unit 194a spans the insulating material to The first electrode unit 192a and the second electrode unit 194a are electrically insulated from each other. Alternatively, one of the first electrode unit 192a and the second electrode unit 194a may be disposed on the second surface 103 of the composite substrate 100e, and the other of the first electrode unit 192a and the second electrode unit 194a may be disposed on another substrate ( Not shown), and the composite substrate 100f is covered on the substrate. In other words, the present invention does not limit the actual fabrication of the electrode structure, which can be adjusted as needed. Accordingly, the composite substrate 100f can function as a touch panel, wherein a trace (not shown) for connecting the first electrode unit 192a and the second electrode unit 194a can extend from the first electrode unit 192a or the second electrode unit 194a to The surrounding area 106 is shielded by the decorative layer 160 to prevent the user from perceiving the trace from the outside of the composite substrate 100e, thereby affecting the appearance of the touch panel. In addition, the composite of the embodiment The composite substrate 100 in the substrate 100f may be replaced with the composite substrates 100a to 100d of FIGS. 6 to 9 as needed, and the decorative layer 160 and the touch sensing structure 190a may be disposed thereon. Alternatively, the touch sensing structure 190a may be disposed on the composite substrate 100e of FIG. 13 with reference to the composite substrate 100f of FIG. 15A. However, the present invention does not limit the types of touch sensing structures, and other touch sensing structures will be described below.
請參考圖15B,在本實施例中,複合基板100g也可以如圖14所示的複合基板100f或圖13所示的複合基板100e配置有裝飾層160,且裝飾層160也可以藉由承板170與黏著層180貼附於複合基板100f的第二面103或是第一面102。複合基板100g與前述的複合基板100f的主要差異在於,複合基板100g包括配置於第二面103並至少對應於透光區域107的觸控感測結構190b。具體而言,觸控感測結構190b包括第一電極單元192b與第二電極單元194b,其中雖然圖15B僅繪示部分第一電極單元192b與部分第二電極單元194b作為示意,但實際上觸控感測結構190b可以具有多個第一電極單元192b與多個第二電極單元194b。本實施例的觸控感測結構190b例如是互感式的單層電極結構。亦即,第一電極單元192b與第二電極單元194b可以配置於複合基板100g的第二面,且第一電極單元192b與第二電極單元194b彼此分離而電性絕緣。據此,複合基板100g可作為觸控面板,其中用於連接第一電極單元192b與第二電極單元194b的走線可以延伸至周圍區域106,並藉由裝飾層160遮蔽,以避免影響觸控面板的外觀。同樣地,本實施例的複合基板100g內的複合基板100也可以 依據需更換成圖6至圖9的複合基板100a至100d,並在其第二面103或是第一面102配置裝飾層160,在此不多加贅述。 Referring to FIG. 15B, in the embodiment, the composite substrate 100g may be provided with a decorative layer 160 as shown in the composite substrate 100f shown in FIG. 14 or the composite substrate 100e shown in FIG. 13, and the decorative layer 160 may also be supported by the carrier. The adhesive layer 180 and the adhesive layer 180 are attached to the second surface 103 of the composite substrate 100f or the first surface 102. The main difference between the composite substrate 100g and the composite substrate 100f described above is that the composite substrate 100g includes a touch sensing structure 190b disposed on the second surface 103 and corresponding to at least the light-transmitting region 107. Specifically, the touch sensing structure 190b includes a first electrode unit 192b and a second electrode unit 194b, wherein FIG. 15B only shows a portion of the first electrode unit 192b and a portion of the second electrode unit 194b as an illustration, but actually touches The control sensing structure 190b may have a plurality of first electrode units 192b and a plurality of second electrode units 194b. The touch sensing structure 190b of this embodiment is, for example, a mutual inductance single layer electrode structure. That is, the first electrode unit 192b and the second electrode unit 194b may be disposed on the second surface of the composite substrate 100g, and the first electrode unit 192b and the second electrode unit 194b are separated from each other and electrically insulated. Accordingly, the composite substrate 100g can be used as a touch panel, wherein the trace for connecting the first electrode unit 192b and the second electrode unit 194b can extend to the surrounding area 106 and be shielded by the decorative layer 160 to avoid affecting the touch. The appearance of the panel. Similarly, the composite substrate 100 in the composite substrate 100g of the present embodiment can also The decorative substrate 160 is disposed on the second surface 103 or the first surface 102 according to the composite substrate 100a to 100d of FIG. 6 to FIG. 9 and will not be described here.
請參考圖15C,在本實施例中,複合基板100h也可以如圖14所示的複合基板100f或圖13所示的複合基板100e配置有裝飾層160,且裝飾層160也可以藉由承板170與黏著層180貼附於複合基板100h的第二面103或是第一面102。複合基板100h與前述的複合基板100f與100g的主要差異在於,複合基板100h包括配置於第二面103並至少對應於透光區域107的觸控感測結構190c。觸控感測結構190c包括第一電極單元192c與第二電極單元194c,其中雖然圖15C僅繪示部分第一電極單元192c與部分第二電極單元194c作為示意,但實際上觸控感測結構190c可以具有多個第一電極單元192c與多個第二電極單元194c。本實施例的觸控感測結構190c例如是互感式的單層電極結構。亦即,第一電極單元192c與第二電極單元194c可以配置於複合基板100h的第二面103上,且第一電極單元192c與第二電極單元194c彼此分離而電性絕緣。據此,複合基板100h可作為觸控面板,其中用於連接第一電極單元192c與第二電極單元194c的走線可以延伸至周圍區域106,並藉由裝飾層160遮蔽,以避免影響觸控面板的外觀。同樣地,本實施例的複合基板100h內的複合基板100也可以依據需更換成圖6至圖9的複合基板100a至100d,並在其第一面102或第二面103配置裝飾層160,在此不多加贅述。此外,同為互感式單層電極結構的觸控感測結構190c與觸控感測結構190b 的差異在於互相對應的第一電極單元與第二電極單元的數量不同。觸控感測結構190c的每個第一電極單元192c對應一個第二電極單元194c,但觸控感測結構190b的每個第一電極單元192b對應四個第二電極單元194b。如此,兩者的感測效能具有差異,但本發明並不限制複合基板應採用何種觸控感測結構。換言之,任何適用的觸控感測結構都能應用於本發明的複合基板。 Referring to FIG. 15C, in the embodiment, the composite substrate 100h may be provided with a decorative layer 160 as shown in the composite substrate 100f shown in FIG. 14 or the composite substrate 100e shown in FIG. 13, and the decorative layer 160 may also be supported by the carrier. 170 and the adhesive layer 180 are attached to the second surface 103 of the composite substrate 100h or the first surface 102. The main difference between the composite substrate 100h and the above-described composite substrates 100f and 100g is that the composite substrate 100h includes a touch sensing structure 190c disposed on the second surface 103 and corresponding to at least the light-transmitting region 107. The touch sensing structure 190c includes a first electrode unit 192c and a second electrode unit 194c. Although FIG. 15C only shows a portion of the first electrode unit 192c and a portion of the second electrode unit 194c as a schematic, the touch sensing structure is actually The 190c may have a plurality of first electrode units 192c and a plurality of second electrode units 194c. The touch sensing structure 190c of this embodiment is, for example, a mutual inductance single layer electrode structure. That is, the first electrode unit 192c and the second electrode unit 194c may be disposed on the second surface 103 of the composite substrate 100h, and the first electrode unit 192c and the second electrode unit 194c are separated from each other and electrically insulated. Accordingly, the composite substrate 100h can serve as a touch panel, wherein the trace for connecting the first electrode unit 192c and the second electrode unit 194c can extend to the surrounding area 106 and be shielded by the decorative layer 160 to avoid affecting the touch. The appearance of the panel. Similarly, the composite substrate 100 in the composite substrate 100h of the present embodiment may be replaced with the composite substrates 100a to 100d of FIG. 6 to FIG. 9 and the decorative layer 160 may be disposed on the first surface 102 or the second surface 103 thereof. I will not repeat them here. In addition, the touch sensing structure 190c and the touch sensing structure 190b are also mutually inductive single-layer electrode structures. The difference is that the number of the first electrode unit and the second electrode unit corresponding to each other is different. Each of the first electrode units 192c of the touch sensing structure 190c corresponds to one second electrode unit 194c, but each of the first electrode units 192b of the touch sensing structure 190b corresponds to the four second electrode units 194b. As such, the sensing performance of the two has a difference, but the present invention does not limit which touch sensing structure should be used for the composite substrate. In other words, any suitable touch sensing structure can be applied to the composite substrate of the present invention.
圖16是本發明再一實施例的複合基板的俯視示意圖。請參考圖16,在本實例中,複合基板200b的結構大致類似於圖10與圖11的複合基板200,其主要差異在於,複合基板200b除了包括複合基板200的構件(如圖11所示的第一基板部210、第二基板部220、第一硬化層230以及第二硬化層240等)以及特徵(如圖11所示的第一硬化層230的側面S3與第二基板部220的側面S4構成平滑側面Ss)之外,複合基板200b更包括裝飾層250。具體而言,複合基板200b具有透光區域204以及位於透光區域204的至少一側的周圍區域206,例如圖16的周圍區域206是以環繞透光區域204為例,但本發明並不以此為限制。裝飾層250配置於複合基板200b的第一面202或相對於第一面202的第二面203,並且對應於周圍區域206,其中第一面202係指複合基板200b配置有第一硬化層230(繪示於圖11)的表面,而第二面203係指複合基板200b配置有第二硬化層240(繪示於圖11)的表面。如此,裝飾層250可以在複合基板200b應用於製作面板(未繪示)時遮蔽面板內的走線。另外,本實施例的裝飾層250是以配置於 整個周圍區域206為例,其中配置於整個周圍區域206是指裝飾層250從複合基板200b的平滑側面Ss往內延伸並且覆蓋平滑側面Ss。然而,其他實施例的裝飾層也可以僅配置於部份周圍區域206,例如是不覆蓋平滑側面Ss或僅覆蓋部分平滑側面Ss。再者,本實施例的裝飾層250可以如同圖15A所示的裝飾層160配置於承板170,並且對應於複合基板200a的周圍區域206而藉由黏著層180貼附於複合基板200b的第二面203或是第一面202,也可以是直接配置於周圍區域206上。同樣地,複合基板200b也可以配置觸控感測結構(未繪示),觸控感測結構配置於第二面203,並且至少對應於透光區域204,其中觸控感測結構可以是如圖15A至圖15C所示的觸控感測結構190a至190c的其中之一,或是其他適當的觸控感測結構,本發明並不限制觸控感測結構的種類。據此,複合基板200b可作為觸控面板,其中觸控感測結構中的走線(未繪示)可以延伸至周圍區域206,並藉由裝飾層250遮蔽,以避免影響觸控面板的外觀。 Figure 16 is a top plan view of a composite substrate in accordance with still another embodiment of the present invention. Referring to FIG. 16, in the present example, the structure of the composite substrate 200b is substantially similar to that of the composite substrate 200 of FIGS. 10 and 11, the main difference being that the composite substrate 200b includes components other than the composite substrate 200 (as shown in FIG. 11). The first substrate portion 210, the second substrate portion 220, the first hardened layer 230, the second hardened layer 240, and the like) and features (the side surface S3 of the first hardened layer 230 and the side of the second substrate portion 220 as shown in FIG. 11) The composite substrate 200b further includes a decorative layer 250 in addition to the smooth side Ss). Specifically, the composite substrate 200b has a light transmitting region 204 and a surrounding region 206 located on at least one side of the light transmitting region 204. For example, the surrounding region 206 of FIG. 16 is an example of the surrounding light transmitting region 204, but the present invention does not This is a limitation. The decorative layer 250 is disposed on the first surface 202 of the composite substrate 200b or the second surface 203 opposite to the first surface 202, and corresponds to the surrounding area 206, wherein the first surface 202 refers to the composite substrate 200b configured with the first hardened layer 230 The surface (shown in FIG. 11) refers to the surface of the composite substrate 200b on which the second hardened layer 240 (shown in FIG. 11) is disposed. As such, the decorative layer 250 can shield the traces within the panel when the composite substrate 200b is applied to a panel (not shown). In addition, the decorative layer 250 of the embodiment is configured The entire surrounding area 206 is exemplified, wherein the entire surrounding area 206 means that the decorative layer 250 extends inward from the smooth side Ss of the composite substrate 200b and covers the smooth side Ss. However, the decorative layer of other embodiments may also be disposed only in a portion of the surrounding area 206, such as not covering the smooth side Ss or only the partially smooth side Ss. Furthermore, the decorative layer 250 of the present embodiment may be disposed on the carrier 170 as the decorative layer 160 illustrated in FIG. 15A, and attached to the composite substrate 200b by the adhesive layer 180 corresponding to the surrounding area 206 of the composite substrate 200a. The two faces 203 or the first face 202 may also be disposed directly on the surrounding area 206. Similarly, the touch sensing structure (not shown) may be disposed on the composite substrate 200b. The touch sensing structure is disposed on the second surface 203 and corresponds to at least the light transmitting area 204. The touch sensing structure may be as One of the touch sensing structures 190a to 190c shown in FIG. 15A to FIG. 15C or other suitable touch sensing structures, the present invention does not limit the types of touch sensing structures. Accordingly, the composite substrate 200b can be used as a touch panel. The traces (not shown) in the touch sensing structure can be extended to the surrounding area 206 and shielded by the decorative layer 250 to avoid affecting the appearance of the touch panel. .
值得注意的是,在上述的所有實施例中,所述「設置於基板的第一面或第二面」或類似的用語,僅是用以說明本發明的實施方式,並不限定所述構件須直接接觸基板的表面。舉例來說,所述「裝飾層160配置於複合基板的第一面102」的實施方式,並不限定裝飾層160需直接接觸複合基板的第一面102(第一硬化層130的表面),實際上裝飾層160與第一硬化層130之間可依據需求配置其他構件(例如是光學薄膜),本發明並不以此為限制。 It should be noted that in all the above embodiments, the phrase "provided on the first side or the second side of the substrate" or the like is merely used to explain the embodiment of the present invention, and the member is not limited. Must be in direct contact with the surface of the substrate. For example, the embodiment in which the “decorative layer 160 is disposed on the first surface 102 of the composite substrate” does not limit the decorative layer 160 to directly contact the first surface 102 of the composite substrate (the surface of the first hardened layer 130). In fact, other members (for example, optical films) may be disposed between the decorative layer 160 and the first hardened layer 130 as needed, and the invention is not limited thereto.
綜上所述,本發明提出的複合基板在其配置有第一硬化層的第一面上設置有凹槽結構,凹槽結構位在第一面的周圍區域,並且貫穿第一硬化層與第二基板部,其中凹槽結構的內側面為平滑側面,且平滑側面的軌跡變異小於15μm。此外,本發明提出的另一複合基板的第一硬化層的側面與第二基板部的側面構成平滑側面,平滑側面的軌跡變異小於15μm。據此,複合基板能藉由在凹槽結構的內側面或者第一硬化層的側面與第二基板部的側面構成的平滑側面,有效防止位在其側邊的裂痕往其內部擴展,進而提高製造良率。 In summary, the composite substrate provided by the present invention is provided with a groove structure on a first surface of which the first hardened layer is disposed, the groove structure is located in a surrounding area of the first surface, and penetrates the first hardened layer and the first The two substrate portions, wherein the inner side surface of the groove structure is a smooth side surface, and the track variation of the smooth side surface is less than 15 μm. Further, the side surface of the first hardened layer and the side surface of the second substrate portion of the other composite substrate proposed by the present invention constitute a smooth side surface, and the track variation of the smooth side surface is less than 15 μm. According to this, the composite substrate can effectively prevent the cracks on the side edges from expanding to the inside by the smooth side surface formed on the inner side surface of the groove structure or the side surface of the first hardened layer and the side surface of the second substrate portion, thereby improving Create yield.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧複合基板 100‧‧‧Composite substrate
102‧‧‧第一面 102‧‧‧ first side
104‧‧‧凹槽結構 104‧‧‧ Groove structure
106‧‧‧周圍區域 106‧‧‧ surrounding area
108‧‧‧側邊 108‧‧‧ side
110‧‧‧第一基板部 110‧‧‧First substrate
120‧‧‧第二基板部 120‧‧‧Second substrate unit
130‧‧‧第一硬化層 130‧‧‧First hardened layer
140‧‧‧第二硬化層 140‧‧‧Second hardened layer
150‧‧‧填充材料 150‧‧‧Filling materials
Claims (30)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102138511A TW201516789A (en) | 2013-10-24 | 2013-10-24 | Composite substrate |
| CN201410168241.7A CN104571681A (en) | 2013-10-24 | 2014-04-24 | Composite substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102138511A TW201516789A (en) | 2013-10-24 | 2013-10-24 | Composite substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201516789A true TW201516789A (en) | 2015-05-01 |
Family
ID=53087936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102138511A TW201516789A (en) | 2013-10-24 | 2013-10-24 | Composite substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104571681A (en) |
| TW (1) | TW201516789A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112335179A (en) * | 2018-07-30 | 2021-02-05 | 京瓷株式会社 | Composite substrate |
| CN113102945A (en) * | 2021-03-29 | 2021-07-13 | 深圳市锦瑞新材料股份有限公司 | Large-arc-height forming processing technology for composite board of mobile phone shell |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010020473A (en) * | 2008-07-09 | 2010-01-28 | Touch Panel Kenkyusho:Kk | Resistive film type touch panel structural body |
| CN201993731U (en) * | 2011-03-15 | 2011-09-28 | 德理投资股份有限公司 | Touch panel with composite substrate |
| CN102799293A (en) * | 2011-05-25 | 2012-11-28 | 胜华科技股份有限公司 | Cover plate structure and manufacturing method and touch display device thereof |
| JP5230788B2 (en) * | 2011-11-24 | 2013-07-10 | 日東電工株式会社 | Transparent conductive film |
-
2013
- 2013-10-24 TW TW102138511A patent/TW201516789A/en unknown
-
2014
- 2014-04-24 CN CN201410168241.7A patent/CN104571681A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN104571681A (en) | 2015-04-29 |
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