TW201514502A - Chip inspection base - Google Patents
Chip inspection base Download PDFInfo
- Publication number
- TW201514502A TW201514502A TW102135887A TW102135887A TW201514502A TW 201514502 A TW201514502 A TW 201514502A TW 102135887 A TW102135887 A TW 102135887A TW 102135887 A TW102135887 A TW 102135887A TW 201514502 A TW201514502 A TW 201514502A
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- Prior art keywords
- detecting
- positioning member
- positioning
- wafer
- inspection
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- 238000007689 inspection Methods 0.000 title claims abstract description 39
- 239000011159 matrix material Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 45
- 238000001514 detection method Methods 0.000 description 19
- 238000012360 testing method Methods 0.000 description 6
- 239000000523 sample Substances 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本發明係與晶片的檢測設備有關,特別是一種晶片檢測座。 The present invention relates to a wafer inspection apparatus, and more particularly to a wafer inspection holder.
為了維持晶片在出廠時的交貨品質每一個晶片在出廠前都必須經過檢測的動作以確定該晶片的功能正常。目前晶片的檢測的動作都是利用人工手動的方式將一待檢測的晶片放置在一檢測機的檢測台上,讓檢測機進行檢測,完成後將晶片取下放置到檢測完成的位置然後再取一晶片放置到檢測機的檢測台上進行下一個晶片的檢測,如此的反覆進行。 In order to maintain the quality of the wafer at the factory, each wafer must be tested before it leaves the factory to determine the function of the wafer. At present, the detecting operation of the wafer is to manually place a wafer to be inspected on a testing machine of the detecting machine, and let the detecting machine perform the detection. After the completion, the wafer is removed and placed to the position where the detection is completed, and then taken. A wafer is placed on the inspection station of the inspection machine for inspection of the next wafer, and this is repeated.
這樣的檢測方式雖然可以達到檢測晶片的基本目的可是大多數的晶片又薄又扁再加上許多的晶片都設有背膠,因此以人工操作的方式來取放晶片並不容易。又,晶片的檢測是透過探針與晶片的檢測點觸接來進行,所以晶片在放置到檢測座時定位就非常的重要,若定位不準確會導至檢測結果不正確,因此如可提升晶片定位的精準度也是一個重要的課題。 Although such a detection method can achieve the basic purpose of detecting a wafer, most wafers are thin and flat, and many wafers are provided with a backing, so that it is not easy to pick and place the wafer in a manually operated manner. Moreover, the detection of the wafer is performed by the probe contacting the detection point of the wafer, so that the positioning of the wafer when it is placed on the detection seat is very important. If the positioning is inaccurate, the detection result is incorrect, so the wafer can be lifted. The accuracy of positioning is also an important issue.
本發明之一目的在於提供一種定位精確之晶片檢測座。 It is an object of the present invention to provide a wafer inspection mount that is accurately positioned.
本發明之再一目的在於提供一種可以減少晶片與檢測座台面接觸面積之晶片檢測座。 It is still another object of the present invention to provide a wafer detecting holder which can reduce the contact area between the wafer and the detecting surface.
為了達成前述目的,依據本發明所提供之一種晶片檢測座,包含有一檢測台,上設有一檢測區,該檢測區的側邊設有一定位擋牆。第一定位件,設於該檢測台的一側邊,可以在靠近與遠離該檢測台的二位置間移動。該第一定位件包含有至少一頂柱,該第一定位件朝該檢測台移動時該頂柱可以伸至該檢測台的台面上並且朝該定位擋牆靠近。一第二定位件,設於該檢測台的一側邊,可以在靠近與遠離該檢測台的二位置間移動。 該第二定位件包含有至少一頂柱,該第二定位件朝該檢測台移動時該頂柱可以伸至該檢測台的台面上並且朝該定位擋牆靠近。 In order to achieve the foregoing object, a wafer inspection seat according to the present invention includes a detection station having a detection area, and a side of the detection area is provided with a positioning retaining wall. The first positioning member is disposed on one side of the detecting platform and is movable between two positions close to and away from the detecting platform. The first positioning member includes at least one top post, and the top post can extend to the table surface of the detecting table and approach the positioning retaining wall when the first positioning member moves toward the detecting platform. A second positioning member is disposed on one side of the detecting platform and movable between two positions close to and away from the detecting platform. The second positioning member includes at least one top post, and the top post can extend to the table surface of the detecting table and approach the positioning retaining wall when the second positioning member moves toward the detecting platform.
其中該檢測座的台面上設有設有凸起以減少與晶片底面的接觸面積,使晶片可以更容易被拿取。 The surface of the detecting seat is provided with a protrusion to reduce the contact area with the bottom surface of the wafer, so that the wafer can be more easily taken.
10‧‧‧檢測台 10‧‧‧Testing station
11‧‧‧台面 11‧‧‧ countertop
12‧‧‧檢測區 12‧‧‧Detection area
13‧‧‧定位擋牆 13‧‧‧ Positioning retaining wall
14‧‧‧凸起 14‧‧‧ bump
15‧‧‧凹溝 15‧‧‧ Groove
131‧‧‧第一段 131‧‧‧ first paragraph
132‧‧‧第二段 132‧‧‧second paragraph
20‧‧‧第一定位件 20‧‧‧First positioning piece
21‧‧‧頂柱 21‧‧‧Top column
22‧‧‧導軌 22‧‧‧ rails
30‧‧‧第二定位件 30‧‧‧Second positioning parts
31‧‧‧頂柱 31‧‧‧Top column
32‧‧‧導軌 32‧‧‧rails
第一圖係本發明之外觀立體示意圖。 The first figure is a perspective view of the appearance of the present invention.
第二圖係本發明之頂面視圖。 The second drawing is a top view of the invention.
第三圖係本發明之頂面視圖,顯示定位件與晶片夾合的狀態。 The third figure is a top view of the present invention showing the state in which the positioning member is clamped to the wafer.
第四圖係本發明之頂面視圖,顯示定位件與不同尺寸晶片定位的狀態。 The fourth figure is a top view of the present invention showing the state in which the positioning member is positioned with different sized wafers.
為了詳細說明本發明之技術特點所在,茲舉以下之較佳實施例並配合圖式說明如後,其中:如第一圖至第三圖所示,為本發明之晶片檢測座係設置於晶片檢測機上,用來與探針座對應使探針座上所設置的探針可以與該檢測座上所放置的晶片觸接進行晶片的檢測。本發明晶片檢測座包含有:一檢測台10,該檢測台10具有一台面11,該台面11上設有一檢測區12,該檢測區12的側邊設有一定位擋牆13,該定位擋牆13具有一第一段131與一第二段132,該第一段131與該第二段132之間夾設一角度,在本實施例該第一段131與該第二段132之間夾設90度角並分別位於該檢測區12的二側邊。該台面上在檢測區12設有複數的凸起14,該等凸14起可以為矩形、圓形、三角形、多邊形或其他形狀,在本實施例中以矩形為說明例,該等凸起14呈矩陣排列。該台面11上設有複數凹溝15,該等凹溝15分別對應於該等凸起14之間的凹部。 In order to explain the technical features of the present invention in detail, the following preferred embodiments will be described with reference to the following drawings, wherein, as shown in the first to third figures, the wafer detecting pedestal of the present invention is disposed on the wafer. The detecting machine is configured to correspond to the probe base so that the probe provided on the probe holder can be contacted with the wafer placed on the detecting seat to perform wafer inspection. The wafer detecting seat of the present invention comprises: a detecting station 10 having a surface 11 on which a detecting area 12 is disposed, and a side of the detecting area 12 is provided with a positioning retaining wall 13 13 has a first segment 131 and a second segment 132. The first segment 131 and the second segment 132 are disposed at an angle. In the embodiment, the first segment 131 and the second segment 132 are sandwiched. A 90 degree angle is provided and is located on each of the two sides of the detection area 12. The detecting surface 12 is provided with a plurality of protrusions 14 on the mesa, and the protrusions 14 may be rectangular, circular, triangular, polygonal or other shapes. In the embodiment, a rectangle is taken as an example, and the protrusions 14 are used. Arranged in a matrix. The mesa 11 is provided with a plurality of recesses 15 corresponding to the recesses between the projections 14, respectively.
一第一定位件20,設於該檢測台10的一側邊,可以在靠近與遠離該檢測台10的二位置間移動。該第一定位件20包含有至少一頂柱21,該第一定位件20朝該檢測台10移動時該頂柱21可以伸至該檢測台的台面11上並且朝該定位擋牆13的第一段131靠近。在本實施例該檢測台的 一側設有二導軌22,該第一定位件20穿設於該二導軌22上可沿該二導軌22移動,該第一定位件20為一活動塊,設有二頂柱21,該二頂柱分別落於該檢測台台面11的一凹溝15,該二頂柱21可沿該凹溝15朝該定位擋牆13移動,該頂柱21的直徑大於該凹溝15的深度。 A first positioning member 20 is disposed on one side of the detecting table 10 and is movable between two positions close to and away from the detecting table 10. The first positioning member 20 includes at least one top post 21. When the first positioning member 20 moves toward the detecting table 10, the top post 21 can extend onto the table 11 of the detecting table and face the positioning retaining wall 13 A section of 131 is close. In the embodiment of the test bench Two guide rails 22 are disposed on one side of the second positioning member 20, and the first positioning member 20 is movable along the two guide rails 22. The first positioning member 20 is a movable block, and two top pillars 21 are provided. The top pillars respectively fall on a groove 15 of the test bench surface 11 , and the two top pillars 21 are movable along the groove 15 toward the positioning retaining wall 13 . The diameter of the top pillar 21 is greater than the depth of the groove 15 .
一第二定位件30,設於該檢測台10的一側邊,可以在靠近與遠離該檢測台10的二位置間移動。該第二定位件30包含有至少一頂柱31,該第二定位件30朝該檢測台10移動時該頂柱31可以伸至該檢測台10的台面11上並且朝該定位擋牆13的第二段132靠近。在本實施例該檢測台10的一側設有二導軌32,該第二定位件30穿設於該二導軌32上可沿該二導軌32移動,該第二定位件30為一活動塊,設有二頂柱31,該二頂柱分別落於該檢測台台面11的一凹溝15,該二頂柱31可沿該凹溝15朝該定位擋牆13移動,該頂柱31的直徑大於該凹溝15的深度。 A second positioning member 30 is disposed on one side of the detecting table 10 and is movable between two positions close to and away from the detecting table 10. The second positioning member 30 includes at least one top post 31. When the second positioning member 30 moves toward the detecting table 10, the top post 31 can extend onto the table 11 of the detecting table 10 and face the positioning retaining wall 13 The second segment 132 is close. In the embodiment, the second positioning member 30 is disposed on the two guiding rails 10 and is movable along the two guiding rails 32. The second positioning member 30 is a movable block. The two top posts 31 are respectively disposed on a recess 15 of the test bench surface 11 , and the two top posts 31 are movable along the recess 15 toward the positioning retaining wall 13 . The diameter of the top post 31 It is larger than the depth of the groove 15.
以本發明之結構當晶片C置放在檢測台台面11的檢測區12時,因為與該晶片C底面接觸的部位是檢測區12該等凸起14的頂面,相較於傳統的結構本發明中該檢測區12與該晶片C接觸的面積減少,因此晶片C更容易被拿起來。再者,當晶片放置在該檢測區後該第一定位件20與該第二定位件30皆朝該晶片移動,該第一定位件20的頂柱21會頂抵於晶片C的一側,使晶片C被夾設於該定位擋牆第一段131與該第一定位件的頂柱21之間。該第二定位件的頂柱31會頂抵於晶片C的一側,使晶片C被夾設於該定位擋牆第二段132與該第二定位件的頂柱31之間。如此可以使每一個晶片皆被精準的定位在同一個位置接受檢測,並且由於該第一定位件20與該第二定位件30可以在靠近與遠離該檢測台的位置間移動,因此不論晶片的大或小該第一定位件與該第二定位件皆可以將每一晶片都定位在相同的位置接受檢測,如第四圖所示,有效的改善前述的問題並提升晶片檢測的效率與正確性。 In the structure of the present invention, when the wafer C is placed on the detection region 12 of the inspection table 11 , since the portion in contact with the bottom surface of the wafer C is the top surface of the projections 14 of the detection region 12, compared with the conventional structure In the invention, the area in which the detection area 12 is in contact with the wafer C is reduced, so that the wafer C is more easily picked up. Moreover, after the wafer is placed in the detection area, the first positioning member 20 and the second positioning member 30 are both moved toward the wafer, and the top pillar 21 of the first positioning member 20 is pressed against one side of the wafer C. The wafer C is sandwiched between the first segment 131 of the positioning retaining wall and the top post 21 of the first positioning member. The top post 31 of the second positioning member abuts against one side of the wafer C, so that the wafer C is sandwiched between the second retaining wall portion 132 and the top post 31 of the second positioning member. In this way, each of the wafers can be accurately positioned and detected at the same position, and since the first positioning member 20 and the second positioning member 30 can be moved between the positions close to and away from the detection table, regardless of the wafer Large or small, both the first positioning member and the second positioning member can position each wafer at the same position for detection, as shown in the fourth figure, effectively improving the aforementioned problems and improving the efficiency and correctness of wafer inspection. Sex.
10‧‧‧檢測台 10‧‧‧Testing station
11‧‧‧台面 11‧‧‧ countertop
12‧‧‧檢測區 12‧‧‧Detection area
13‧‧‧定位擋牆 13‧‧‧ Positioning retaining wall
131‧‧‧第一段 131‧‧‧ first paragraph
132‧‧‧第二段 132‧‧‧second paragraph
14‧‧‧凸起 14‧‧‧ bump
15‧‧‧凹溝 15‧‧‧ Groove
20‧‧‧第一定位件 20‧‧‧First positioning piece
21‧‧‧頂柱 21‧‧‧Top column
22‧‧‧導軌 22‧‧‧ rails
30‧‧‧第二定位件 30‧‧‧Second positioning parts
31‧‧‧頂柱 31‧‧‧Top column
32‧‧‧導軌 32‧‧‧rails
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102135887A TW201514502A (en) | 2013-10-03 | 2013-10-03 | Chip inspection base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102135887A TW201514502A (en) | 2013-10-03 | 2013-10-03 | Chip inspection base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201514502A true TW201514502A (en) | 2015-04-16 |
| TWI497080B TWI497080B (en) | 2015-08-21 |
Family
ID=53437569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102135887A TW201514502A (en) | 2013-10-03 | 2013-10-03 | Chip inspection base |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201514502A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109108473B (en) * | 2018-09-06 | 2020-03-31 | 重庆科技学院 | Use method of overhead biochip object stage |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002277502A (en) * | 2001-01-12 | 2002-09-25 | Nidec-Read Corp | Substrate inspection device and substrate inspection method |
| JP4642610B2 (en) * | 2005-09-05 | 2011-03-02 | 東京エレクトロン株式会社 | Substrate alignment device and substrate accommodation unit |
| TWI352200B (en) * | 2008-01-10 | 2011-11-11 | Chipmos Technologies Inc | Auxiliary disassembling apparatus and jig therein |
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2013
- 2013-10-03 TW TW102135887A patent/TW201514502A/en unknown
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| Publication number | Publication date |
|---|---|
| TWI497080B (en) | 2015-08-21 |
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