TW201509236A - Electromagnetic-induced heating apparatus - Google Patents
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 116
- 230000005674 electromagnetic induction Effects 0.000 claims abstract description 108
- 239000002918 waste heat Substances 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 230000006698 induction Effects 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000001192 hot extrusion Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 11
- 238000011084 recovery Methods 0.000 description 5
- 238000010248 power generation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
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- 239000003507 refrigerant Substances 0.000 description 1
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Abstract
Description
本發明關於一種電磁感應加熱模組，特別是一種具有熱電廢熱回收發電之電磁感應加熱模組。 The invention relates to an electromagnetic induction heating module, in particular to an electromagnetic induction heating module with thermoelectric waste heat recovery power generation.
電磁感應加熱的方式是目前加熱的主流，與其他加熱方法相較其優點為可快速升溫、可局部對物件加熱、高安全性、無排放一氧化碳(CO)。請參考圖1，習知電磁感應加熱裝置1利用電磁感應加熱的原理，在感應線圈11通入可調變頻率的交流電，以產生感應磁場。所產生的磁力線通過待加熱物件10上會產生感應電流，也就是所謂的渦電流(eddy current)。待加熱物件10則會因為渦電流與物件之間的電阻而造成焦耳熱，而達到感應加熱的目的。感應加熱在機械加工上的應用可分為下列四項，亦可應用於家電用品上： The method of electromagnetic induction heating is the mainstream of current heating. Compared with other heating methods, it has the advantages of rapid temperature rise, local heating of objects, high safety, and no emission of carbon monoxide (CO). Referring to FIG. 1, the electromagnetic induction heating device 1 utilizes the principle of electromagnetic induction heating to apply an alternating current of a variable frequency to the induction coil 11 to generate an induced magnetic field. The generated magnetic lines pass through the object to be heated 10 to generate an induced current, which is called an eddy current. The object to be heated 10 will cause Joule heat due to the electric resistance between the eddy current and the object, and achieve the purpose of induction heating. The application of induction heating in machining can be divided into the following four items, which can also be applied to household appliances:
然而，感應線圈11周圍也會產生高溫，因此一般電磁感應加熱裝置1會加裝散熱裝置，以確保機台正常運作，並同時增加元件壽命以及產品長時間的可靠度。例如，家電產品電磁爐及電磁加熱器(hotplate)內部會加裝散熱風扇。然，風扇一方面增加產品耗電量，且主要缺點為產生噪音。工業界機台，例如高週波感應熔解爐或是高週波感應鍛造爐多使用水冷方式散熱，但其缺點為耗電，同時部分能量會以熱能的方式散失。二者均是屬於耗電耗能的產品。 However, high temperature is also generated around the induction coil 11. Therefore, the electromagnetic induction heating device 1 is generally equipped with a heat dissipating device to ensure the normal operation of the machine, and at the same time increase the life of the component and the reliability of the product for a long time. For example, a heat sink fan is installed inside the induction cooker and the electromagnetic heater of the home appliance. However, on the one hand, the fan increases the power consumption of the product, and the main disadvantage is the generation of noise. Industrial machines, such as high-frequency induction melting furnaces or high-frequency induction forging furnaces, use water cooling to dissipate heat, but the disadvantage is that they consume electricity, and some of the energy is dissipated as heat. Both are products that consume electricity and consume energy.
如上述，現有電磁感應加熱裝置1利用電磁感應將電能轉化為熱能，然而部分的熱能將以廢熱的形式散失，因此造成電磁感應加熱裝置1的溫度升高並減少元件壽命。為了降溫，一般電磁感應加熱裝置1會採用氣冷或是水冷方式，不僅會增加能源消耗，亦提高設備成本。 As described above, the conventional electromagnetic induction heating device 1 converts electric energy into heat energy by electromagnetic induction, but part of the heat energy is dissipated in the form of waste heat, thereby causing the temperature of the electromagnetic induction heating device 1 to rise and reducing the life of the element. In order to cool down, the electromagnetic induction heating device 1 generally adopts air cooling or water cooling, which not only increases energy consumption but also increases equipment cost.
本發明之一目的在於提供一種電磁感應加熱裝置，其可有效利用電磁感應加熱裝置產生的廢熱以減少電量消耗，並降低電磁感應加熱裝置的溫度。本發明之電磁感應加熱裝置將廢熱回收轉換為電能，並將產生的電能回饋給電磁感應加熱裝置，以降低電磁感應加熱模組的消耗功率。 An object of the present invention is to provide an electromagnetic induction heating device which can effectively utilize waste heat generated by an electromagnetic induction heating device to reduce power consumption and lower the temperature of the electromagnetic induction heating device. The electromagnetic induction heating device of the invention converts the waste heat recovery into electric energy, and feeds the generated electric energy to the electromagnetic induction heating device to reduce the power consumption of the electromagnetic induction heating module.
為達上述目的，本發明之電磁感應加熱裝置包含一電磁感應加熱模組、一熱電晶片、一散熱裝置及一電源供應裝置。電磁感應加熱模組以電磁感應產生熱能。熱電晶片具有一第一端及一第二端，其中第二端與電磁感應加熱模組接觸。散熱裝置與熱電晶片之第一端接觸。電源供應裝置與電磁感應加熱模組及熱電晶片電性連接，並供應電磁感應加熱模組電源。電磁感應加熱模組產生之廢熱經由熱電晶片傳送至散熱裝置進行散熱。 To achieve the above objective, the electromagnetic induction heating device of the present invention comprises an electromagnetic induction heating module, a thermoelectric chip, a heat sink and a power supply device. The electromagnetic induction heating module generates heat energy by electromagnetic induction. The thermoelectric wafer has a first end and a second end, wherein the second end is in contact with the electromagnetic induction heating module. The heat sink is in contact with the first end of the thermoelectric chip. The power supply device is electrically connected to the electromagnetic induction heating module and the thermoelectric chip, and supplies the electromagnetic induction heating module power supply. The waste heat generated by the electromagnetic induction heating module is transmitted to the heat sink via the thermoelectric chip for heat dissipation.
1‧‧‧電磁感應加熱裝置 1‧‧‧Electromagnetic induction heating device
10‧‧‧待加熱物件 10‧‧‧ items to be heated
11‧‧‧感應線圈 11‧‧‧Induction coil
3‧‧‧電磁感應加熱裝置 3‧‧‧Electromagnetic induction heating device
30‧‧‧待加熱物件 30‧‧‧ items to be heated
31‧‧‧電磁感應加熱模組 31‧‧‧Electromagnetic induction heating module
33‧‧‧熱電晶片 33‧‧‧Thermal chip
331‧‧‧第一端 331‧‧‧ first end
333‧‧‧第二端 333‧‧‧ second end
335‧‧‧陶瓷板 335‧‧‧Ceramic plate
35‧‧‧散熱裝置 35‧‧‧heating device
351‧‧‧散熱片 351‧‧‧ Heat sink
353‧‧‧風扇 353‧‧‧fan
37‧‧‧電源供應裝置 37‧‧‧Power supply unit
P‧‧‧P型半導體 P‧‧‧P type semiconductor
N‧‧‧N型半導體 N‧‧‧N type semiconductor
圖1係習知電磁感應裝置之一示意圖； 圖2係本發明電磁感應裝置於其電磁感應加熱模組處於開啟狀態之一示意圖；圖3係本發明電磁感應裝置於其電磁感應加熱模組處於關閉狀態之一示意圖；及圖4係本發明電磁感應裝置應用於一電磁爐之一實施例之一示意圖。 Figure 1 is a schematic view of a conventional electromagnetic induction device; 2 is a schematic view showing the electromagnetic induction device of the present invention in an open state of the electromagnetic induction heating module; FIG. 3 is a schematic view showing the electromagnetic induction device of the present invention in a closed state of the electromagnetic induction heating module; and FIG. 4 is a schematic view of the present invention A schematic diagram of one embodiment of an electromagnetic induction device applied to an induction cooker.
請參考圖2及3，本發明之電磁感應加熱裝置3包含一電磁感應加熱模組31、一熱電晶片33、一散熱裝置35及一電源供應裝置37。電磁感應加熱模組31以電磁感應產生熱能，以加熱待加熱物件30。熱電晶片33本身具有將熱能與電能互相轉換之功能，其具有一第一端331及一第二端333，其中第二端333與電磁感應加熱模組31接觸。散熱裝置35與熱電晶片33之第一端331接觸。電源供應裝置37與電磁感應加熱模組31及熱電晶片33電性連接，並供應電磁感應加熱模組31電源。電磁感應加熱模組31產生之廢熱經由熱電晶片33傳送至散熱裝置35進行散熱。熱電晶片33以其第二端333為介面，電磁感應加熱模組31產生之廢熱由此進入熱電晶片33內部，並經由第一端331傳遞至散熱裝置35散熱，廢熱在此可被轉換為電能，而儲存於電源供應裝置37中。 Referring to FIGS. 2 and 3, the electromagnetic induction heating device 3 of the present invention comprises an electromagnetic induction heating module 31, a thermoelectric chip 33, a heat sink 35 and a power supply device 37. The electromagnetic induction heating module 31 generates thermal energy by electromagnetic induction to heat the object 30 to be heated. The thermoelectric wafer 33 itself has a function of converting thermal energy and electrical energy to each other, and has a first end 331 and a second end 333, wherein the second end 333 is in contact with the electromagnetic induction heating module 31. The heat sink 35 is in contact with the first end 331 of the thermoelectric wafer 33. The power supply device 37 is electrically connected to the electromagnetic induction heating module 31 and the thermoelectric chip 33, and supplies the power of the electromagnetic induction heating module 31. The waste heat generated by the electromagnetic induction heating module 31 is transmitted to the heat sink 35 via the thermoelectric wafer 33 for heat dissipation. The thermoelectric wafer 33 is connected to the second end 333 of the thermoelectric wafer 33, and the waste heat generated by the electromagnetic induction heating module 31 enters the inside of the thermoelectric wafer 33 and is transmitted to the heat sink 35 via the first end 331 to dissipate heat, and the waste heat can be converted into electric energy. And stored in the power supply device 37.
本發明之電磁感應加熱裝置3整合電磁感應加熱模組31及熱電晶片33；熱電晶片33可將其第一端331及第二端333之間所存在的溫度差轉換為電壓差，因此產生電能。本發明之電磁感應加熱裝置3可藉由熱電晶片33將電磁感應加熱模組31之廢熱回收再發電而將電能儲存於電源供應裝置37。電源供應裝置37再將廢熱所產生的電能再提供給電磁感應加熱模組31或散熱裝置35，以達到節電和快速散熱之雙重功效。 The electromagnetic induction heating device 3 of the present invention integrates the electromagnetic induction heating module 31 and the thermoelectric wafer 33; the thermoelectric wafer 33 can convert the temperature difference existing between the first end 331 and the second end 333 into a voltage difference, thereby generating electric energy. . The electromagnetic induction heating device 3 of the present invention can recover the waste heat of the electromagnetic induction heating module 31 by the thermoelectric chip 33 and regenerate the electric energy to store the electric energy in the power supply device 37. The power supply device 37 then supplies the electric energy generated by the waste heat to the electromagnetic induction heating module 31 or the heat dissipation device 35 to achieve the dual functions of power saving and rapid heat dissipation.
詳細而言，熱電晶片33放置於電磁感應加熱模組31與散熱裝置 35之間。熱電晶片33包含複數P型半導體及複數N型半導體，P型半導體及N型半導體交錯地以電性串聯、熱性並聯之方式連接，以組成多組熱電偶，如圖2及3所示。電磁感應加熱裝置3利用散熱裝置35與周圍環境進行熱交換，因此在熱電晶片33之第一端331及第二端333產生溫度差。此時，熱電晶片33之第一端331為冷端且第二端333為熱端。藉此，電磁感應加熱模組31所產生之廢熱流經熱電晶片33而驅使熱電晶片33之P型半導體及N型半導體中的載子移動。載子累積則可於熱電晶片33之第一端331及第二端333產生電壓差，進而產生電能回存於電源供應裝置37之電池內。熱電晶片33之第一端331及第二端333間之溫差愈大，則轉換的電壓差就會愈高。 In detail, the thermoelectric chip 33 is placed on the electromagnetic induction heating module 31 and the heat sink Between 35. The thermoelectric wafer 33 includes a plurality of P-type semiconductors and a plurality of N-type semiconductors, and the P-type semiconductors and the N-type semiconductors are alternately connected in an electrical series connection and a thermal parallel connection to form a plurality of sets of thermocouples, as shown in FIGS. 2 and 3. Since the electromagnetic induction heating device 3 exchanges heat with the surrounding environment by the heat sink 35, a temperature difference is generated between the first end 331 and the second end 333 of the thermoelectric wafer 33. At this time, the first end 331 of the thermoelectric wafer 33 is a cold end and the second end 333 is a hot end. Thereby, the waste heat generated by the electromagnetic induction heating module 31 flows through the thermoelectric wafer 33 to drive the carriers in the P-type semiconductor and the N-type semiconductor of the thermoelectric wafer 33 to move. The carrier accumulation can generate a voltage difference between the first end 331 and the second end 333 of the thermoelectric chip 33, thereby generating electrical energy to be stored in the battery of the power supply device 37. The greater the temperature difference between the first end 331 and the second end 333 of the thermoelectric chip 33, the higher the voltage difference of the conversion.
本發明之電磁感應加熱裝置3所使用之散熱裝置35可為一水冷式或冷媒冷卻之散熱裝置，或一氣冷式散熱裝置。圖1及圖2所示之散熱裝置35一氣冷式散熱裝置。詳細而言，氣冷式散熱裝置35可包含至少一由熱的良導體所製成之散熱片351，以協助散熱，並且散熱裝置35可更包含一風扇353，以協助產生大量氣流通過散熱片351而協助散熱片351進行散熱。風扇353可藉由電源供應裝置37供應其電能。水冷式或冷媒冷卻式之散熱裝置則是藉由水或是冷媒流動之管路通過該散熱片351，或是直接接觸於第一端331之表面，而達成迅速散熱之效果。 The heat sink 35 used in the electromagnetic induction heating device 3 of the present invention may be a water-cooled or refrigerant-cooled heat sink or an air-cooled heat sink. The heat sink 35 shown in FIGS. 1 and 2 is an air-cooled heat sink. In detail, the air-cooling heat sink 35 may include at least one heat sink 351 made of a good heat conductor to assist in heat dissipation, and the heat sink 35 may further include a fan 353 to assist in generating a large amount of airflow through the heat sink. The 351 assists the heat sink 351 in dissipating heat. The fan 353 can supply its electric energy by the power supply device 37. The water-cooled or refrigerant-cooled heat dissipating device passes through the heat sink 351 through a pipe through which water or a refrigerant flows, or directly contacts the surface of the first end 331 to achieve rapid heat dissipation.
然而，若不需設置散熱片351等散熱輔助裝置，熱電晶片33之第一端331及第二端333間即可建立足夠之溫差時，連接於熱電晶片33之第一端331之散熱裝置35可不需使用散熱片351或風扇353協助散熱。此時，散熱裝置35可僅為熱電晶片33之第一端331上之一散熱表面。 However, if it is not necessary to provide a heat dissipating auxiliary device such as the heat sink 351, a heat dissipating device 35 connected to the first end 331 of the thermoelectric wafer 33 when a sufficient temperature difference can be established between the first end 331 and the second end 333 of the thermoelectric chip 33 is established. It is not necessary to use the heat sink 351 or the fan 353 to assist in heat dissipation. At this time, the heat sink 35 may be only one heat dissipating surface on the first end 331 of the thermoelectric wafer 33.
本發明之熱電晶片33較佳進一步包含二陶瓷板335，分別設置於第一端331及第二端333，以分別與電磁感應加熱模組31及散熱裝置35接觸。藉此，本發明之熱電晶片33易與家電產品中之電磁感應加熱模組31整合成嵌入式廚房家電產品(陶瓷面板)。 The thermoelectric wafer 33 of the present invention preferably further includes two ceramic plates 335 disposed at the first end 331 and the second end 333 to be in contact with the electromagnetic induction heating module 31 and the heat sink 35, respectively. Thereby, the thermoelectric wafer 33 of the present invention is easily integrated with the electromagnetic induction heating module 31 in the household electrical appliance into an embedded kitchen appliance product (ceramic panel).
本發明之電源供應裝置37可包含一DC轉AC轉換器、一變壓器及一穩壓器，藉以達到提供交流電給電磁感應加熱模組31、儲存熱電晶片33產生之直流電或提供熱電晶片33電能等之功能。本發明之電磁感應加熱裝置3可應用於一電磁爐、一電子鍋、一電熱水器、一熱水瓶、一高周波焊接機、一熱擠型機具、一射出成形機、或一熔煉爐等。 The power supply device 37 of the present invention may include a DC-to-AC converter, a transformer, and a voltage regulator, thereby providing AC power to the electromagnetic induction heating module 31, storing the DC power generated by the thermoelectric chip 33, or providing the thermoelectric chip 33, etc. Features. The electromagnetic induction heating device 3 of the present invention can be applied to an induction cooker, an electronic pot, an electric water heater, a hot water bottle, a high frequency welding machine, a hot extrusion type machine, an injection molding machine, or a melting furnace.
請參考圖2，當本發明之電磁感應加熱模組31處於開啟狀態，以產生熱能加熱待加熱物件30時，熱電晶片33可將電磁感應加熱模組31之廢熱回收，以降低電磁感應加熱模組31的溫度，並同時將熱能轉成電能，以將電能回饋給電源供應裝置37。電源供應裝置37可再將電量供給散熱裝置35或電磁感應加熱模組31，但不限定於此，藉此可使操作中之電磁感應加熱模組31耗電量降低。 Referring to FIG. 2, when the electromagnetic induction heating module 31 of the present invention is in an open state to generate heat energy to heat the object to be heated 30, the thermoelectric wafer 33 can recover the waste heat of the electromagnetic induction heating module 31 to reduce the electromagnetic induction heating mold. The temperature of group 31 is simultaneously converted into electrical energy to return electrical energy to power supply unit 37. The power supply device 37 can supply the electric power to the heat sink 35 or the electromagnetic induction heating module 31, but the present invention is not limited thereto, whereby the power consumption of the electromagnetic induction heating module 31 during operation can be reduced.
請參考圖3，當關閉本發明之電磁感應加熱模組31，而不產生熱能給待加熱物件30時，因此時電磁感應加熱模組31及加熱物件30上尚未降溫，可利用熱電晶片33將其廢熱回收，並經由散熱裝置35達到快速散熱的功效。此時，熱電晶片33同步將廢熱轉換成電能循環再利用而回饋給電源供應裝置37，藉此可使本發明之電磁感應加熱裝置3總耗電量降低。 Referring to FIG. 3, when the electromagnetic induction heating module 31 of the present invention is turned off without generating thermal energy to the object to be heated 30, the electromagnetic induction heating module 31 and the heating object 30 are not cooled yet, and the thermoelectric wafer 33 can be utilized. The waste heat is recovered and the heat dissipation effect is achieved through the heat sink 35. At this time, the pyroelectric wafer 33 synchronously converts the waste heat into electric energy for recycling and returns it to the power supply device 37, whereby the total power consumption of the electromagnetic induction heating device 3 of the present invention can be reduced.
除上述操作模式外，請參考圖3，當本發明電磁感應加熱模組31處於關閉狀態，而不產生熱能給待加熱物件30時，為了達到使電磁感應加熱模組31更快速降溫的目的，電源供應裝置37更可供應熱電晶片33電能，以使熱電晶片33於第二端333致冷，以協助電磁感應加熱模組31產生之廢熱進行散熱。於此操作模式下，熱電晶片33之第二端333轉變為冷端，而第一端331轉變為熱端，並藉由與熱電晶片33之第一端331接觸之散熱裝置35，更快速地協助轉變為熱端之第一端331上之熱能發散。 In addition to the above operation mode, referring to FIG. 3, when the electromagnetic induction heating module 31 of the present invention is in a closed state without generating thermal energy to the object to be heated 30, in order to achieve the purpose of lowering the temperature of the electromagnetic induction heating module 31 more quickly, The power supply device 37 further supplies the thermoelectric chip 33 with electrical energy to cause the thermoelectric chip 33 to be cooled at the second end 333 to assist the heat generated by the electromagnetic induction heating module 31 to dissipate heat. In this mode of operation, the second end 333 of the thermoelectric die 33 transitions to a cold end, and the first end 331 transitions to a hot end and is faster by the heat sink 35 in contact with the first end 331 of the thermoelectric die 33. Assist in the divergence of thermal energy on the first end 331 of the hot end.
電磁感應加熱原理之一應用實例為電磁爐。由於傳統電磁爐的操作功率大，電磁爐上所產生的熱，會直接往電磁線圈傳導，因此，電磁爐主體設計上需多方考量散熱功能。目前，大部份電磁爐所使用的散熱裝置也包含散熱片以及散熱風扇。然而，此類散熱裝置相當佔空間，也使得大功率電磁爐的體積無法輕量化。 One application example of the principle of electromagnetic induction heating is an induction cooker. Because the operating power of the traditional induction cooker is large, the heat generated on the induction cooker will be directly transmitted to the electromagnetic coil. Therefore, the design of the main body of the induction cooker needs to consider the heat dissipation function. At present, most of the heat sinks used in induction cookers also include heat sinks and cooling fans. However, such a heat sink is quite space-consuming, and the volume of the high-power induction cooker cannot be reduced.
本發明應用於電磁爐之實施例如下所述，其操作操作原理如圖4所示。當電磁爐中的電磁感應加熱裝置3運作時，電磁感應加熱模組31之感應線圈製造渦電流，在例如陶瓷板335之爐面上對待加熱物件30產生熱能。當電磁感應加熱裝置3欲降溫(調溫)時，會透過散熱裝置35連同其散熱風扇353來協助散熱(降溫)。然而，僅藉由散熱風扇353散熱，可能無法達到快速降溫之效果。為了改善此一問題，電磁爐內部之電磁感應加熱裝置3可包含一包含電磁感應線圈之電磁感應加熱模組31、一或多片熱電晶片33及至少一散熱裝置35。電磁爐之電磁感應加熱模組31在操作時所產生的廢熱，可利用熱電晶片33進行熱電轉換，而進行發電儲電動作，以作為後備電源，進而降低電磁爐的總耗電量。使用完畢之電磁爐之陶瓷面板335表面如欲更快速降溫，亦可啟動電源供應裝置37供應熱電晶片33電能之功能，以使熱電晶片33於第二端333致冷，以加速降溫。 The application of the present invention to an induction cooker is as follows, and its operation principle is as shown in FIG. When the electromagnetic induction heating device 3 in the induction cooker operates, the induction coil of the electromagnetic induction heating module 31 generates an eddy current, and heat is generated to the object 30 to be heated on the surface of the furnace plate 335, for example. When the electromagnetic induction heating device 3 is intended to be cooled (tempered), heat dissipation (cooling) is assisted by the heat sink 35 together with its heat dissipation fan 353. However, only by dissipating heat from the cooling fan 353, the effect of rapid cooling may not be achieved. In order to improve this problem, the electromagnetic induction heating device 3 inside the induction cooker may include an electromagnetic induction heating module 31 including an electromagnetic induction coil, one or more thermoelectric chips 33, and at least one heat sink 35. The waste heat generated by the electromagnetic induction heating module 31 of the induction cooker can be thermoelectrically converted by the thermoelectric wafer 33 to perform a power generation and storage operation as a backup power source, thereby reducing the total power consumption of the induction cooker. If the surface of the ceramic panel 335 of the used induction cooker is to be cooled more rapidly, the power supply device 37 can be activated to supply the power of the thermoelectric wafer 33 to cool the thermoelectric chip 33 at the second end 333 to accelerate the temperature drop.
此外，如圖4所示，本發明電磁感應加熱裝置3亦可包含兩組以上熱電晶片33及散熱裝置35之組合，並仍包含一電源供應裝置37及一電磁感應加熱模組31，藉此加強本發明電磁感應加熱裝置3之散熱及熱電晶片33發電之效率。 In addition, as shown in FIG. 4, the electromagnetic induction heating device 3 of the present invention may further comprise a combination of two or more thermoelectric chips 33 and a heat sink 35, and still includes a power supply device 37 and an electromagnetic induction heating module 31. The heat dissipation of the electromagnetic induction heating device 3 of the present invention and the efficiency of power generation by the thermoelectric chip 33 are enhanced.
據此，本發明係關於節能以及快速冷卻的改良型電磁感應加熱裝置3，其包含一電磁感應加熱模組31、一熱電晶片33、一散熱裝置35及一電源供應裝置37。本發明之電磁感應加熱裝置3利用熱電晶片33回收電磁感應加熱模組31的廢熱，並將熱能回收轉成電能，此電能 被散熱裝置35或是電磁感應加熱模組31再利用。藉此，本發明之電磁感應加熱裝置3不僅可降低系統總耗能，亦能迅速帶走電磁感應加熱模組31所產生的廢熱，達到快速降溫和溫控穩定等效果。本發明之電磁感應加熱裝置3之一較佳實施例為節能電磁爐。此電磁爐可有效改善傳統電磁爐之缺點，如高功率輸出、耗電和散熱性差等問題。藉此，使本發明之電磁感應加熱裝置3之一較佳實施例之電磁爐在較低功率輸出下操作，並同時帶來許多優點，如溫控穩定性佳(可快速升降溫或保溫)、體積縮小(散熱面積縮小或可改使用小瓦數風扇)、爐體輕薄化(嵌入式家具用途)。 Accordingly, the present invention relates to an improved electromagnetic induction heating device 3 for energy saving and rapid cooling, comprising an electromagnetic induction heating module 31, a thermoelectric chip 33, a heat sink 35 and a power supply device 37. The electromagnetic induction heating device 3 of the present invention recovers the waste heat of the electromagnetic induction heating module 31 by using the thermoelectric chip 33, and converts the heat energy recovery into electric energy. It is reused by the heat sink 35 or the electromagnetic induction heating module 31. Therefore, the electromagnetic induction heating device 3 of the invention not only can reduce the total energy consumption of the system, but also can quickly take away the waste heat generated by the electromagnetic induction heating module 31, thereby achieving the effects of rapid cooling and temperature control stability. A preferred embodiment of the electromagnetic induction heating device 3 of the present invention is an energy saving induction cooker. The induction cooker can effectively improve the shortcomings of the traditional induction cooker, such as high power output, power consumption and poor heat dissipation. Thereby, the induction cooker of the preferred embodiment of the electromagnetic induction heating device 3 of the present invention is operated at a lower power output, and at the same time brings many advantages, such as good temperature control stability (fast temperature rise or heat preservation), The volume is reduced (the heat dissipation area is reduced or the small wattage fan can be changed), and the furnace body is light and thin (for embedded furniture use).
綜上所述，本發明之電磁感應加熱裝置3之上述較佳實施例所具備優點條列如下： In summary, the advantages of the above-described preferred embodiment of the electromagnetic induction heating device 3 of the present invention are as follows:
1.廢熱回收發電，降低操作功率(省電)。 1. Waste heat recovery power generation, reducing operating power (power saving).
2.快速升降溫，溫控性佳(熱電晶片搭配散熱裝置) 2. Fast lifting temperature, good temperature control (thermoelectric chip with heat sink)
3.熱電晶片使用陶瓷基板來隔電導熱，易與家電產品整合成嵌入式廚房家電產品(陶瓷面板)。 3. The thermoelectric wafer uses a ceramic substrate to conduct electricity and heat conduction, and is easily integrated into a home appliance product (ceramic panel).
4.相關實施例可改用較小型散熱裝置，使產品(如電磁爐)輕量化或薄型化。 4. Related Embodiments A smaller heat sink can be used to make a product (such as an induction cooker) lighter or thinner.
5.本裝置體積小、易與製造業工具機具整合。尤其是電磁感應式射出成型和熔煉設備，除可有效進行廢熱回收外，亦可精確控制爐具或模具溫度，降低製程變異性。 5. The device is small in size and easy to integrate with manufacturing tools and tools. In particular, electromagnetic induction injection molding and melting equipment, in addition to effective waste heat recovery, can also accurately control the temperature of the stove or mold, reducing process variability.
3‧‧‧電磁感應加熱裝置 3‧‧‧Electromagnetic induction heating device
30‧‧‧待加熱物件 30‧‧‧ items to be heated
31‧‧‧電磁感應加熱模組 31‧‧‧Electromagnetic induction heating module
33‧‧‧熱電晶片 33‧‧‧Thermal chip
331‧‧‧第一端 331‧‧‧ first end
333‧‧‧第二端 333‧‧‧ second end
335‧‧‧陶瓷板 335‧‧‧Ceramic plate
35‧‧‧散熱裝置 35‧‧‧heating device
351‧‧‧散熱片 351‧‧‧ Heat sink
353‧‧‧風扇 353‧‧‧fan
37‧‧‧電源供應裝置 37‧‧‧Power supply unit
P‧‧‧P型半導體 P‧‧‧P type semiconductor
N‧‧‧N型半導體 N‧‧‧N type semiconductor
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| TW102131383A TW201509236A (en) | 2013-08-30 | 2013-08-30 | Electromagnetic-induced heating apparatus |
| CN201410424108.3A CN104427670A (en) | 2013-08-30 | 2014-08-26 | Electromagnetic induction heating device |
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| TW102131383A TW201509236A (en) | 2013-08-30 | 2013-08-30 | Electromagnetic-induced heating apparatus |
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| CN106052106A (en) * | 2016-07-08 | 2016-10-26 | 马鞍山市土豪鑫轮胎技术研发有限公司 | Safe stainless steel honeycomb type electric water heater |
| CN106052097A (en) * | 2016-07-08 | 2016-10-26 | 马鞍山市土豪鑫轮胎技术研发有限公司 | Safe and energy-saving ceramic water and electricity separation electric water heater |
| CN106403262A (en) * | 2016-07-08 | 2017-02-15 | 马鞍山市土豪鑫轮胎技术研发有限公司 | Safe single-control stainless steel honeycomb electric water heater |
| CN107504678A (en) * | 2016-07-08 | 2017-12-22 | 马鞍山市土豪鑫轮胎技术研发有限公司 | A kind of energy-saving ceramic water/electricity isolated electrothermal water heater |
| CN106052096A (en) * | 2016-07-08 | 2016-10-26 | 马鞍山市土豪鑫轮胎技术研发有限公司 | Safe single-control type electric water heater |
| CN106052094A (en) * | 2016-07-08 | 2016-10-26 | 马鞍山市土豪鑫轮胎技术研发有限公司 | Energy-saving electric water heater |
| CN107514801A (en) * | 2016-07-08 | 2017-12-26 | 马鞍山市土豪鑫轮胎技术研发有限公司 | One kind energy-conservation stainless steel honeycomb electric heater |
| CN106052102A (en) * | 2016-07-08 | 2016-10-26 | 马鞍山市土豪鑫轮胎技术研发有限公司 | Safe ceramic water-electricity separated electric water heater |
| CN106123304A (en) * | 2016-07-08 | 2016-11-16 | 马鞍山市土豪鑫轮胎技术研发有限公司 | A kind of safe dual control pottery water/electricity isolated electrothermal water heater |
| CN114777330A (en) * | 2022-05-19 | 2022-07-22 | 福建南粤厨具股份有限公司 | Commercial kitchen utensils and appliances of high frequency electric heating |
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| US5834828A (en) * | 1993-09-20 | 1998-11-10 | The United States Of America, As Represented By The Secretary Of The Army | Nanoporous semiconductor material and fabrication technique for use as thermoelectric elements |
| US5718124A (en) * | 1993-10-15 | 1998-02-17 | Senecal; Lise | Chilled service bowl |
| JPH11121815A (en) * | 1997-10-17 | 1999-04-30 | Seiko Instruments Inc | Thermoelectric element |
| KR20040096038A (en) * | 2003-05-07 | 2004-11-16 | 삼성전자주식회사 | Cooking device |
| US7174720B2 (en) * | 2003-07-07 | 2007-02-13 | Kennedy Brian C | Cooker utilizing a peltier device |
| US20100072191A1 (en) * | 2006-12-05 | 2010-03-25 | Yasuhiko Ookuma | Cooling device for electromagnetic induction type cookin heater |
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