TW201507814A - Methods for manufacturing polishing pad and polishing apparatus - Google Patents

Abstract

The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of (a) providing a releasing carrier; (b) providing a foaming resin composition; (c) coating the foaming resin composition of the step (c) on the carrier of the step (a); and (d) curing the foaming resin composition of the step (c). The invention also provides a method for manufacturing a polishing apparatus.

Description

Method of manufacturing a polishing pad and a polishing apparatus

This invention relates to a method of making a polishing pad and a polishing apparatus.

Grinding generally refers to the chemical mechanical polishing (CMP) process, for the initial rough surface wear control, which uses an abrasive slurry containing fine particles to be evenly dispersed on the surface of a polishing pad while holding a substrate to be ground. The polishing pad is honed in a repeated regular motion. The substrate to be polished is an object such as a semiconductor, a storage medium substrate, an integrated circuit, a liquid crystal display flat glass, an optical glass, and a photovoltaic panel. During the grinding process, the substrate to be polished must be ground using a polishing pad, so that the quality of the polishing pad directly affects the grinding effect of the substrate to be polished.

Referring to Figure 1, a schematic view of a polishing apparatus having a conventional polishing pad is shown. The polishing apparatus 1 includes a pressure plate 11, an adsorption pad 12, a substrate 13 to be polished, a polishing disk 14, a polishing pad 15, and an abrasive slurry 16. The pressure plate 11 is opposed to the grinding disc 14. The adsorption pad 12 is adhered to the pressure plate 11 by a backing layer (not shown), and the adsorption pad 12 is used for adsorbing and fixing the substrate 13 to be ground. The polishing pad 15 is fixed to the grinding disc 14 and faces the pressure plate 11 for grinding the substrate 13 to be polished.

The operation of the polishing apparatus 1 is as follows. First, the substrate 13 to be polished is placed on the adsorption pad 12, and the substrate 13 to be polished is sucked by the adsorption pad 12. Then, the grinding disc 14 and the pressure plate 11 are rotated in opposite directions, and at the same time, the pressure plate 11 is moved downward. The polishing pad 15 is brought into contact with the surface of the substrate 13 to be polished, and the substrate 13 to be polished can be polished by continuously supplementing the polishing slurry 16 and the polishing pad 15.

A conventional polishing pad manufacturing method is described in US Pat. Pub. No. 2006/0035573, which is a method in which a polymer resin solution is foamed by blowing air, and after adding a bridging agent, it is poured into a suitable mold, and subjected to high temperature or chemical crosslinking. The joint curing forms a columnar elastic body, and after removing the mold, it is cooled and cut into pieces to form a polishing pad. In the method for manufacturing the conventional polishing pad, when the polymer resin solution is foamed by air, the air is easy to float due to the low density, and when the resin is poured into the mold, the foam is not easily uniformly distributed in the mold. In the resin block, the upper layer air content is too much, and the lower layer air content is too small, so only the middle layer is available in the entire block; in addition, if a defect such as uneven foaming occurs inside the resin block, the interval will be affected. The polishing pad, in addition, the method of injecting the mold, when the perfusion size is increased, the process is more difficult to control, for example, the perfusion time may be prolonged to affect the curing of the resin, thereby affecting the subsequent processing. When the conventional polishing pad is applied in the chemical mechanical polishing method, the flatness of the object to be polished is not good due to the poor quality of the polishing pad, and the unevenness is improved, and the surface of the object to be polished remains in the polishing liquid. Grinding particles, causing scratches on the surface of the object to be polished. If applied to the wafer process, the scratch on the surface of the wafer affects the stability, which will affect the process of yellowing, developing, etching, etc. in the back stage, and the micro integrated circuit After multiple stacking, the stability is also reduced, and the defect rate is increased, and the production is further improved.

The invention adopts the coating method to manufacture the polishing pad, can obtain the polishing pad with uniform foaming, is easy to control the thickness, is easy to process in the back stage and is convenient for storage and transportation, and can be applied to the continuous process.

The present invention provides a method of manufacturing a polishing pad comprising: (a) providing a carrier, wherein the carrier is a release material; (b) providing a foamed resin composition; (c) step (b) The foamed resin composition is coated on the carrier of the step (a); And (d) a foamed resin composition of the curing step (c).

The present invention also provides a method of manufacturing a polishing apparatus, wherein the polishing apparatus comprises: a substrate; a polishing pad attached to the polishing disk for polishing the substrate; and a polishing slurry contacting the substrate A material for grinding; wherein the method of manufacturing the polishing pad comprises the aforementioned method.

1‧‧‧Learning grinding device

2‧‧‧grinding device

11‧‧‧ Pressure plate

12‧‧‧Adsorption pad

13‧‧‧The substrate to be ground

14‧‧‧ grinding disc

15‧‧‧ polishing pad

16‧‧‧ polishing slurry

21‧‧‧ Pressure plate

22‧‧‧Adsorption pad

23‧‧‧Substrate

24‧‧‧ grinding disc

25‧‧‧ polishing pad

26‧‧‧ polishing slurry

Figure 1 shows a schematic view of a polishing apparatus having a conventional polishing pad; Figure 2 shows a schematic view of a polishing apparatus having a polishing pad of the present invention; Figure 3 shows a scanning electron microscope image of the polishing pad of the present invention; and Figure 4 shows a conventional polishing pad. Scanning electron microscope image; and

The present invention provides a method of manufacturing a polishing pad comprising: (a) providing a carrier, wherein the carrier is a release material; (b) providing a foamed resin composition; (c) step (b) The foamed resin composition is applied onto the carrier of the step (a); and (d) the foamed resin composition of the curing step (c).

The term "carrier" as used in the present invention means a member which can accommodate the foamed resin composition, and which can be easily removed after the foamed resin composition is cured. Preferably, It is a piece of material; on the other hand, the carrier is a release material. The "release material" as used in the present invention means a material which does not react with the foamed resin composition during the production of the polishing pad, and can be easily removed after the foamed resin composition is cured. Preferably, the release material is a "film having a low permeability". According to the invention, "has hypotonicity" The term "membrane of permeability" means a film or film which substantially prevents the foamed resin composition on the surface of the film having low permeability of the present invention from penetrating into the lower surface of the film having a low permeability. In a preferred embodiment of the invention, the low permeability film can be formed on a substrate material, such as paper. Preferably, the carrier is a polyethylene terephthalate film, a polypropylene film, a polycarbonate film, a polyethylene film, a polyethylene terephthalate film, a release paper or a release cloth. Further, the polypropylene is preferably oriented polypropylene.

Preferably, the carrier is provided in a continuous form, such as a rolled release material. The rolled release material can be used in a roll-to-roll manner as compared to conventional methods of making a single polishing pad involving molding or casting, which improves batch uniformity.

In a specific embodiment of the invention, the foamed resin composition comprises a resin, a foaming agent, and a bridging agent.

The resin according to the present invention is preferably an elastomer. The term "elastomer" as used in the present invention refers to a polymer type which exhibits a rubber-like quality. When ground, the elastomer acts as a good buffer to avoid scratching the surface of the object to be abraded. The term "foamed resin" as used in the present invention refers to a material containing a thermoplastic resin and a thermally decomposable foaming agent. The resin preferably comprises at least one selected from the group consisting of polyurethane, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastomeric rubber, polystyrene, polyaromatic molecules, fluoropolymers , polyimine, cross-linked polyurethane, cross-linked polyolefin, polyether, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethylene, poly(ethylene terephthalate), polyarene amide, Polyaromatic hydrocarbons, polymethyl methacrylate, copolymers thereof, block copolymers thereof, mixtures thereof, and blends thereof.

The term "foaming agent" as used in the present invention means a reagent or method for foaming a resin according to the present invention. The method for foaming the resin according to the present invention may be chemical foaming or physical foaming, wherein the chemical foaming utilizes a reagent which can perform a chemical reaction to generate a gas, and the gas generated after the reaction is uniformly distributed in the resin combination. In. On the other hand, the physical foaming system blows a gas into the resin composition, and uniformly distributes the gas to be driven by stirring. In the resin composition.

The term "crosslinking agent" as used in the present invention means an agent which can be crosslinked with a resin according to the present invention and cured under suitable conditions. The type of the crosslinking agent depends on the type of the resin.

In another preferred embodiment of the invention, the foamed resin composition further comprises an abrasive particle. The abrasive particles can be blended with the slurry to facilitate the grinding action. The abrasive particles may be uniformly distributed in the foamed resin composition, and may be located in the resin portion of the polishing pad or in the foamed pores of the polishing pad. Preferably, the abrasive particles are cerium oxide, cerium oxide, aluminum oxide, antimony trioxide or ferric oxide. In another aspect, the abrasive particles have a particle size between about 0.01 microns and about 10 microns.

In one embodiment of the invention, the coating of step (c) is knife coating, printing wheel printing coating, roller extrusion coating or spray coating. The specific embodiments of the coating methods are those of ordinary skill in the art to which the invention pertains. On the other hand, the coating is preferably continuous coating.

According to the method of the present invention, the step (d) is the foamed resin composition of the curing step (c). The specific embodiment of such curing is determined by those of ordinary skill in the art to which the present invention pertains depending on the type of resin to be cured and the type of bridging agent as desired. In a preferred embodiment of the invention, the curing step cures the foamed resin composition after high temperature drying at a temperature of from about 60 ° C to about 130 ° C.

In a preferred embodiment of the invention, the method further comprises a surface finishing step of trimming the surface of the cured resin composition in step (d). Specific embodiments of the trimming process, such as polishing or cutting out portions of the surface, can be by any conventional polishing or dissection method, such as sanding with a sandpaper or cutting with a tool, conditions for polishing and cutting. It is well known to those of ordinary skill in the art to which the invention pertains.

In another preferred embodiment of the present invention, there is further provided a trench forming step of forming at least one trench in the surface of the cured resin composition in the step (d). This hair Those of ordinary skill in the art to which the invention pertains may, depending on the disclosure of the specification, select suitable processing means to form grooves on the surface of the cured resin composition, for example, using laser processing. The groove assists the flow of the slurry during the grinding process. Preferably, the groove to groove width ratio is from 1 to 0.05.

In a preferred embodiment of the invention, the method according to the invention is combined with a continuously provided carrier, and the steps of the method according to the invention are formed into a production line by means of a drum, which is provided, coated, cured, trimmed The steps of forming the grooves and the like can be continuously performed to make the manufacturing more convenient.

In a preferred embodiment of the invention, the method further comprises the step (e) of removing the carrier. Preferably, the removing step of the carrier can remove the polishing pad from the production device after the polishing pad is manufactured. On the other hand, the removing step of the carrier can also be applied to the grinding process. Remove from the polishing pad. The specific embodiment of the removal depends on the carrier used, for example using a tear-off method.

In one embodiment of the invention, the method further comprises the step of applying an adhesive to the surface of the cured resin composition such that the polishing pad can be adhered to the abrasive disk. Those of ordinary skill in the art to which the present invention pertains may select suitable adhesives in accordance with the disclosure of the specification.

In one embodiment of the invention, the method further comprises the step of applying an adhesive to the surface of the carrier such that the polishing pad can be affixed to the abrasive disk. Those of ordinary skill in the art to which the present invention pertains may select suitable adhesives in accordance with the disclosure of the specification.

In another preferred embodiment of the invention, the adhesive is a pressure sensitive adhesive or a polyurethane. As used herein, a "pressure sensitive adhesive" comprises a carrier film and an adhesive on the upper and lower sides of the carrier film. Preferably, the material of the carrier film is selected from the group consisting of polyethylene terephthalate, polypropylene and polyethylene.

The invention adopts the coating method to manufacture the polishing pad, and since the mold is not used, it can be The polishing pad is uniformly foamed, and the coating thickness is easy to control, easy to process in the back stage and convenient for storage and transportation, and can be applied to a continuous process, and the process is reduced to reduce the manufacturing cost.

The present invention also provides a method of manufacturing a polishing apparatus, wherein the polishing apparatus comprises: a substrate; a polishing pad attached to the polishing disk for polishing the substrate; and a polishing slurry contacting the substrate A material for grinding; wherein the method of manufacturing the polishing pad comprises the aforementioned method.

Preferably, the polishing apparatus further comprises: a pressure plate disposed relative to the polishing disk; and an adsorption pad attached to the pressure plate for adsorbing and fixing the substrate.

Referring to Figure 2, a schematic view of a polishing apparatus having a polishing pad of the present invention is shown. The polishing apparatus 2 includes a pressure plate 21, an adsorption pad 22, a substrate 23, a grinding disk 24, a polishing pad 25, and a polishing slurry 26. The pressure plate 21 is opposed to the grinding disc 24. The adsorption pad 22 is adhered to the pressure plate 21 by a backing layer (not shown), and the adsorption pad 22 is used for adsorbing and fixing the substrate 23. The polishing pad 25 is fixed to the grinding disc 24 and faces the pressure plate 21 for grinding the substrate 23.

The operation of the polishing apparatus 2 is as follows. First, the substrate 23 is placed on the adsorption pad 22, and the substrate 23 is sucked by the adsorption pad 22. Then, the grinding disc 24 and the pressure plate 21 are rotated in opposite directions, and at the same time, the pressure plate 21 is moved downward to bring the polishing pad 25 into contact with the surface of the substrate 23, by continuously replenishing the polishing slurry 26 and The polishing pad 25 functions to polish the substrate 23.

The invention is illustrated by the following examples, which are not intended to be construed as limiting the invention.

Example:

The resin composition was uniformly stirred, and air was blown into the resin composition, stirred and rotated between 1000 rpm and 4000 rpm, coated on a release paper with a doctor blade, and dried at 110 ° C for 1 minute in an oven, followed by drying. The curing was carried out at 80 ° C for 30 seconds, followed by cutting off the surface. Its scanning electron microscope is shown in Figure 3. As a result, it was found that the foaming was uniformly distributed.

Comparative example:

The resin composition is uniformly stirred, and air is blown into the resin composition, stirred and rotated between 1000 rpm and 4000 rpm, and then poured into a mold, heated at 60 ° C for 30 minutes in a mold, and then the mold is removed, and then The wafer was heated in an oven at 110 ° C for 16 seconds. Its scanning electron microscope is shown in Figure 4. When the polymer resin solution is foamed by air, the air is easy to float due to the low density, and the foam is not easily evenly distributed when being poured into the mold, and the upper layer of the resin block in the mold is excessively airy, the lower layer The air content is too low, so only the middle layer is available in the entire block.

The polishing pads prepared in the above examples and comparative examples were evaluated for physical properties, and the diseases are shown in Table 1 below. The results show that the polishing pad prepared in the examples has a lower compression ratio and a higher hardness, and is a preferred polishing pad which has a relatively low deformation amount when it is used.

The above-described embodiments are merely illustrative of the principles and effects of the invention, and are not intended to limit the invention. Modifications and variations of the embodiments described above will be apparent to those skilled in the art without departing from the spirit of the invention. The scope of the invention should be patented as described later Listed in the scope.

Claims (13)

A method of manufacturing a polishing pad comprising: (a) providing a carrier, wherein the carrier is a release material; (b) providing a foamed resin composition; (c) foaming the step (b) The resin composition is applied to the carrier of the step (a); and (d) the foamed resin composition of the curing step (c). The method according to claim 1, wherein the carrier is a polyethylene terephthalate film, a polypropylene film, a polycarbonate film, a polyethylene film, a polyethylene terephthalate film, a release paper or a separation film. Type cloth. The method of claim 1, wherein the carrier is provided in a continuous manner. The method of claim 1, wherein the foamed resin composition comprises a resin, a foaming agent, and a bridging agent. The method of claim 4, wherein the resin comprises at least one selected from the group consisting of polyurethane, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastomeric rubber, polystyrene, polyaromatic molecules. , fluoropolymer, polyimide, crosslinked polyurethane, crosslinked polyolefin, polyether, polyester, polyacrylate, elastomeric polyethylene, polytetrafluoroethylene, poly(ethylene terephthalate), Polyarylamine amides, polyaromatics, polymethyl methacrylate, copolymers thereof, block copolymers thereof, mixtures thereof, and blends thereof. The method of claim 1, wherein the foamed resin composition further comprises an abrasive particle. According to the method of claim 1, wherein the coating of the step (c) is knife coating, printing wheel printing coating, roller extrusion coating or spraying. According to the method of claim 1, a surface finishing step is further included, which is a trimming step (d) The surface of the cured resin composition. According to the method of claim 1, there is further provided a groove forming step of forming at least one groove on the surface of the cured resin composition in the step (d). According to the method of claim 1, it further comprises the step (e) of removing the carrier. According to the method of claim 1, a step of applying an adhesive to the surface of the cured resin composition is further included. According to the method of claim 1, the method further comprises the step of applying an adhesive to the surface of the carrier. A method of manufacturing a polishing apparatus, wherein the polishing apparatus comprises: a polishing disc; a substrate; a polishing pad attached to the polishing disc for polishing the substrate; and a polishing slurry contacting the base A material for grinding; wherein the polishing pad is produced by the method according to any one of claims 1 to 12.