TW201436677A - 電路基板及此電路基板的製造方法 - Google Patents
電路基板及此電路基板的製造方法 Download PDFInfo
- Publication number
- TW201436677A TW201436677A TW102138849A TW102138849A TW201436677A TW 201436677 A TW201436677 A TW 201436677A TW 102138849 A TW102138849 A TW 102138849A TW 102138849 A TW102138849 A TW 102138849A TW 201436677 A TW201436677 A TW 201436677A
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- metal layer
- circuit board
- layer
- forming
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 title description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 217
- 239000002184 metal Substances 0.000 claims abstract description 217
- 239000000758 substrate Substances 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 27
- 239000000945 filler Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 230
- 230000017525 heat dissipation Effects 0.000 description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 36
- 229910052802 copper Inorganic materials 0.000 description 33
- 239000010949 copper Substances 0.000 description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000007747 plating Methods 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 239000007769 metal material Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- -1 and for example Chemical compound 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/081277 WO2014087470A1 (ja) | 2012-12-03 | 2012-12-03 | 回路基板及びこの回路基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201436677A true TW201436677A (zh) | 2014-09-16 |
Family
ID=50882922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102138849A TW201436677A (zh) | 2012-12-03 | 2013-10-28 | 電路基板及此電路基板的製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2014087470A1 (ja) |
| TW (1) | TW201436677A (ja) |
| WO (1) | WO2014087470A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874223A (zh) * | 2017-12-05 | 2019-06-11 | 同泰电子科技股份有限公司 | 可导热的柔性线路板结构 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019212895A (ja) * | 2018-06-01 | 2019-12-12 | シャープ株式会社 | パワーモジュール |
| JP7194542B2 (ja) * | 2018-09-20 | 2022-12-22 | Fdk株式会社 | モジュール及びプリント基板 |
| WO2021210150A1 (ja) * | 2020-04-17 | 2021-10-21 | 株式会社メイコー | 回路基板の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2636537B2 (ja) * | 1991-04-08 | 1997-07-30 | 日本電気株式会社 | プリント配線板の製造方法 |
| JP2002016332A (ja) * | 2000-06-28 | 2002-01-18 | Ibiden Co Ltd | スルーホールを有する積層板およびその製造方法 |
| JP2005286299A (ja) * | 2004-03-03 | 2005-10-13 | Mitsubishi Paper Mills Ltd | 回路基板の製造方法 |
| JP2009010266A (ja) * | 2007-06-29 | 2009-01-15 | Meiko:Kk | プリント配線板の製造方法及びプリント配線板 |
-
2012
- 2012-12-03 WO PCT/JP2012/081277 patent/WO2014087470A1/ja not_active Ceased
- 2012-12-03 JP JP2014550819A patent/JPWO2014087470A1/ja active Pending
-
2013
- 2013-10-28 TW TW102138849A patent/TW201436677A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874223A (zh) * | 2017-12-05 | 2019-06-11 | 同泰电子科技股份有限公司 | 可导热的柔性线路板结构 |
| TWI702887B (zh) * | 2017-12-05 | 2020-08-21 | 同泰電子科技股份有限公司 | 軟性線路板結構 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014087470A1 (ja) | 2014-06-12 |
| JPWO2014087470A1 (ja) | 2017-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6335619B2 (ja) | 配線基板及び半導体パッケージ | |
| JP6027001B2 (ja) | 放熱回路基板 | |
| JP4316483B2 (ja) | プリント基板の製造方法及びプリント基板 | |
| TW200403016A (en) | Multilayer wiring board, method of manufacturing the wiring board and substrate meterial for the wiring board | |
| JP2013065865A (ja) | 放熱基板の製造方法 | |
| JP2014038993A (ja) | コア基板及びこれを用いたプリント回路基板 | |
| JP2016111332A (ja) | パッケージ構造およびその製造方法 | |
| WO2013000207A1 (zh) | 金属基电路板及其制造方法 | |
| CN100435602C (zh) | 电子部件的制造方法及电子部件 | |
| JP2006165299A5 (ja) | ||
| JP2015146346A (ja) | 多層配線板 | |
| JP6392163B2 (ja) | 配線基板及びその製造方法、半導体装置 | |
| TW201436677A (zh) | 電路基板及此電路基板的製造方法 | |
| TW201803427A (zh) | 配線基板或配線基板材料之製造方法 | |
| TWI445100B (zh) | 封裝結構及其製作方法 | |
| TW201826451A (zh) | 半導體裝置及其製造方法 | |
| CN103716982A (zh) | 高导热印刷电路板结构 | |
| CN111031687A (zh) | 制备散热电路板的方法 | |
| JP2000068322A (ja) | 半導体装置及びその製造方法 | |
| CN103650652A (zh) | 印刷电路板及其制造方法 | |
| JP5197562B2 (ja) | 発光素子パッケージ及びその製造方法 | |
| JP2015023088A (ja) | チップ抵抗器、チップ抵抗器の実装構造 | |
| TWI442526B (zh) | 導熱基板及其製作方法 | |
| JP2015115470A (ja) | セラミック配線基板及びその製造方法 | |
| CN115151026B (zh) | 内嵌电绝缘散热体的电路板的制备方法 |