TW201423009A - Cryogenic treatment device - Google Patents
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- TW201423009A TW201423009A TW101147053A TW101147053A TW201423009A TW 201423009 A TW201423009 A TW 201423009A TW 101147053 A TW101147053 A TW 101147053A TW 101147053 A TW101147053 A TW 101147053A TW 201423009 A TW201423009 A TW 201423009A
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- 239000000112 cooling gas Substances 0.000 claims abstract description 98
- 239000007788 liquid Substances 0.000 claims abstract description 94
- 238000001816 cooling Methods 0.000 claims abstract description 70
- 239000000110 cooling liquid Substances 0.000 claims abstract description 43
- 238000001704 evaporation Methods 0.000 claims abstract description 35
- 230000008020 evaporation Effects 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000000284 extract Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 26
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011084 recovery Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 230000036413 temperature sense Effects 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Abstract
Description
本發明係有關於一種處理裝置，特別是指一種使用冷卻氣體對零件進行深冷處理之深冷處理裝置。
The present invention relates to a processing apparatus, and more particularly to a cryogenic processing apparatus for cryogenically treating a part using a cooling gas.
目前深冷處理大致有三種方式，有乾冰法、機械冷凍法及液態氮法。其中使用液態氮法可使零件之溫度冷卻至零下190度，其他方法無法使零件之溫度冷卻至零下190度。而前使用液態氮法之深冷處理裝置如美國專利第4739622號及美國專利第6332325號，通常使待處理之零件浸泡於液態氮內，零件容易產生熱震，易使處理物件龜裂與脫皮。
為解決上述問題，中華民國專利539837號提供一種深冷處理裝置，此專利之深冷處理裝置非將零件浸泡於液態氮中進行深冷處理，仍是供應液態氮至一冷卻腔體內，並透過加熱器瞬間加熱液態氮，使液態氮氣化為低溫氮氣，透過風扇將低溫氮氣導引至冷卻腔體內，但有可能發生液態氮無法完全氣化為低溫氮氣，使液態氮滴至位於冷卻腔體內之零件，進而產生上述之問題。
有鑑於上述問題，本發明提供一種深冷處理裝置，其透過液體蒸發模組容置冷卻液體，並使冷卻液體氣化為冷卻氣體，以對零件作深冷處理，如此冷卻液體不會因氣化不完全而滴至零件，而發生習知深冷處理裝置之問題。
At present, there are roughly three ways of cryogenic treatment, such as dry ice method, mechanical freezing method and liquid nitrogen method. The liquid nitrogen method is used to cool the temperature of the part to minus 190 degrees. Other methods cannot cool the temperature of the part to minus 190 degrees. In the past, the cryogenic treatment device using the liquid nitrogen method, such as U.S. Patent No. 4,379,622 and U.S. Patent No. 6,332,325, generally immerses the parts to be treated in liquid nitrogen, and the parts are prone to thermal shock, which easily causes cracking and peeling of the treated articles.
In order to solve the above problem, the Republic of China Patent No. 539837 provides a cryogenic treatment device. The cryogenic treatment device of this patent does not soak the parts in liquid nitrogen for cryogenic treatment, and still supplies liquid nitrogen to a cooling chamber and passes through the heater instantaneously. The liquid nitrogen is heated to make the liquid nitrogen gas into a low-temperature nitrogen gas, and the low-temperature nitrogen gas is guided into the cooling cavity through the fan, but there is a possibility that the liquid nitrogen cannot be completely vaporized into low-temperature nitrogen gas, and the liquid nitrogen is dropped to the parts located in the cooling cavity body. In turn, the above problems arise.
In view of the above problems, the present invention provides a cryogenic treatment device that accommodates a cooling liquid through a liquid evaporation module and vaporizes the cooling liquid into a cooling gas to cryogenically treat the part, so that the cooling liquid is not vaporized. Completely dripping into the part, and the problem of the conventional cryogenic treatment device occurs.
本發明之目的，在於提供一種深冷處理裝置，其具有至少一液體蒸發模組及一導流模組，並透過液體蒸發模組氣化一冷卻液體為一冷卻氣體，再透過導流模組使冷卻氣體導入一冷卻腔體，以對至少一零件進行深冷處理，如此防止冷卻液體與零件直接接觸，避免冷卻零件之速度過快，進而避免零件因發生熱衝擊問題而產生脆化。
本發明係提供一種深冷處理裝置，其包含：一下蓋，其具有一冷卻腔體，該冷卻腔體供至少一零件設置；一上蓋，其設置於該下蓋，並具有一冷卻氣體產生腔體；至少一液體蒸發模組，其設置於該上蓋，並位於該冷卻氣體產生腔體，該液體蒸發模組容置一冷卻液體，並氣化該冷卻液體為一冷卻氣體，該冷卻氣體流動至該冷卻氣體產生腔體；以及一導流模組，其設置於該上蓋，並位於該冷卻氣體產生腔體及該冷卻腔體之間，該導流模組抽取該冷卻氣體產生腔體內之該冷卻氣體至該冷卻腔體，以冷卻位於該冷卻腔體內之該零件。
It is an object of the present invention to provide a cryogenic treatment device having at least one liquid evaporation module and a flow guiding module, and vaporizing a cooling liquid into a cooling gas through a liquid evaporation module, and then passing through the flow guiding module. The cooling gas is introduced into a cooling cavity to cryogenically process at least one part, thereby preventing the cooling liquid from directly contacting the parts, avoiding the speed of cooling the parts too fast, and thereby avoiding embrittlement of the parts due to thermal shock problems.
The present invention provides a cryogenic treatment apparatus comprising: a lower cover having a cooling cavity for at least one component; an upper cover disposed on the lower cover and having a cooling gas generating cavity At least one liquid evaporating module disposed on the upper cover and located in the cooling gas generating cavity, the liquid evaporating module accommodating a cooling liquid, and vaporizing the cooling liquid as a cooling gas, the cooling gas flowing a cooling gas generating cavity; and a flow guiding module disposed on the upper cover and located between the cooling gas generating cavity and the cooling cavity, the flow guiding module extracting the cooling gas generating cavity The cooling gas is directed to the cooling cavity to cool the component located within the cooling cavity.
茲為使對本發明之結構特徵及所達成之功效有更進一步之瞭解與認識，謹佐以各項之實施例及配合詳細之說明，說明如後：
習知深冷處理裝置通常係將欲進行深冷處理之零件浸泡於冷卻液體，冷卻液體會使零件急速冷卻，導致零件發生熱衝擊的問題而使零件產生脆化，此現象於進行微小零件深冷處理時更為嚴重。為了克服上述問題，本實施例之深冷處理裝置係先將冷卻液體氣化為冷卻氣體，再使用冷卻氣體對零件進行深冷處理，有效減緩零件冷卻之速度，避免零件發生熱衝擊的問題而使零件產生脆化。
請參閱第一圖，係本發明之第一實施例之深冷處理裝置的剖面圖；如圖所示，本實施例提供一種深冷處理裝置1，本實施例之深冷處理裝置1用於對微小零件進行深冷處理，而且其體積微型化，不佔用空間，可置於桌面上使用。深冷處理裝置1具有一下蓋10、一上蓋12、二液體蒸發模組14及一導流模組16，下蓋10具有一開口100、一側壁101及一底面102，底面102與開口100相對應，並與側壁101形成一冷卻腔體103，冷卻腔體103供至少一零件設置。另外，上蓋12具有一開口120、一側壁121及一圓弧頂面122，圓弧頂面122對應開口120，側壁121與圓弧頂面122形成一冷卻氣體產生腔體123。二液體蒸發模組14設置於上蓋12之側壁121，分別位於冷卻氣體產生腔體123之兩側，需要說明的是，液體蒸發模組14設置的位置不以上蓋12為限，亦可設置於下蓋10鄰近其開口100之側壁101，且液體蒸發模組14的數量並不以二個為限。導流模組16設置於上蓋12之開口120，並對應上蓋12之冷卻氣體產生腔體123，相同地，導流模組16亦可設置於下蓋10鄰近其開口100處，也表示導流模組16設置冷卻氣體產生腔體123與冷卻腔體103之間即可。
請一併參閱第二圖，係本發明之第一實施例之深冷處理裝置的使用狀態圖；如圖所示，本實施例之深冷處理裝置1於使用時，零件2先置放於下蓋10之冷卻腔體103內。然後上蓋12組設於下蓋10，使冷卻腔體103為密封狀態。位於上蓋12之二液體蒸發模組14分別容置一冷卻液體3(如:液態氮)，每一液體蒸發模組14對冷卻液體3加熱，使冷卻液體3氣化為一冷卻氣體4(如：低溫氮氣)，冷卻氣體4先往圓弧頂面122流動，並沿著圓弧頂面122之圓弧面流動，最後集中至圓弧頂面122之中心區域，即位於冷卻氣體產生腔體123之上方，如此有效防止冷卻氣體4聚集於上蓋12之角落；同時地，導流模組16位於冷卻氣體產生腔體123與冷卻腔體103之間，並抽取聚集於冷卻氣體產生腔體123上方之冷卻氣體4，使聚集於冷卻氣體產生腔體123上方之冷卻氣體往上蓋12之開口120流動，最後導流模組16吸入冷卻氣體產生腔體123之冷卻氣體4排入下蓋10之冷卻腔體103。然導流模組16擾動冷卻腔體103內之冷卻氣體4，使冷卻氣體4可均勻分布於冷卻腔體103內，控制冷卻腔體103內之溫度均勻分布，以均勻地對冷卻腔體123內之零件2進行深冷處理，即使零件2之溫度降低至零下190度，進而提升對零件2之冷卻效果。
然本實施例之深冷處理裝置1並非直接使零件2浸泡於冷卻液體3內，而透過液體蒸發模組14將冷卻液體3氣化成冷卻氣體4，然後透過冷卻氣體4對零件2進行深冷處理，而且冷卻液體3於液體蒸發模組14內先氣化成冷卻氣體4，使冷卻液體3不會與零件2接觸，如此有效防止零件2之冷卻速度過快，而發生熱衝擊的問題而使零件2產生脆化。
下述對深冷處理裝置1之各元件作細部說明。請參閱第三圖及第四圖，係本發明之第一實施例之下蓋及上蓋的剖面圖；如圖所示，下蓋10及上蓋12分別包含一殼體104、124及一隔熱層105、125。隔熱層105、125設置於殼體104、124內，隔熱層105、125可防止深冷處理裝置1外部之溫度傳導至冷卻腔體103及冷卻氣體產生腔體123，而影響冷卻腔體103及冷卻氣體產生腔體123內之溫度，因此本實施例之下蓋10及上蓋12具有良好的保溫效果，有效維持冷卻腔體103及冷卻氣體產生腔體123之溫度，避免降低對零件2之冷卻效果。
下蓋10之冷卻腔體103內設有一承載模組106，承載模組106係用以承載零件。本實施例之承載模組106包含一承載架1061及一載具1062，承載架1061卡設於下蓋10之側壁101，載具1062用以承載零件，並置放於承載架1061，使零件位於冷卻腔體103內。其中可省略載具1062之設置，直接將零件設置於承載架1061，也可達到使零件設置於冷卻腔體103內， 於此不再贅述。而承載模組106之承載架1061及載具1062更分別具有複數第一流通孔10611及複數第二流通孔10621，該些第一流通孔10611及第二流通孔10621係讓冷卻腔體103之冷卻氣體流動至下蓋10之底面102，以避免冷卻氣體累積於承載架1061上，導致冷卻腔體103內之溫度分布不均勻。
此外，更可使下蓋10之底面102與上蓋12之圓弧頂面122一樣呈圓弧狀，當冷卻氣體4從該些第一流通孔10611及該些第二流通孔10621通過並流動至下蓋10之底面102時，冷卻氣體4沿著呈圓弧狀之底面102流動(如第二圖所示)，呈圓弧狀之底面102導引冷卻氣體4回流至冷卻腔體103上側，如此使冷卻氣體4不斷地於冷卻腔體103內循環流動，有效加速地使零件到達冷卻溫度，並減少冷卻液體之使用，有效降低成本。
再一併參閱第五圖，係本發明之第四圖之A區域的放大圖；如圖所示，設置於上蓋12內之液體蒸發模組14具有一液體容置槽141及一加熱元件142，加熱元件142埋設於液體容置槽141之底部。冷卻液體容置於液體容置槽141內，加熱元件142對容置於液體容置槽141內之冷卻液體加熱，讓冷卻液體氣化成為冷卻氣體。而本實施例之加熱元件142連接一控制器5，控制器5可控制加熱元件142之加熱溫度，進而控制冷卻液體之氣化速率及液體蒸發模組14所產生之冷卻氣體的溫度。
然後，上蓋12具有二液體供應管路126，二液體供應管路126係從上蓋12之外側穿過上蓋12之側壁121並延伸至上蓋12之冷卻氣體產生腔體123內。每一液體供應管路126具有一液體供應口1261，液體供應口1261對應液體蒸發模組14之液體容置槽141，如此液體供應管路126連接位於深冷處理裝置1外部之一液體供應裝置6(如第四圖所示)，液體供應裝置6供應冷卻液體至液體供應管路126，冷卻液體從液體供應管路126之液體供應口1261流入液體容置槽141。
然每一液體供應管路126更具有一液體控制閥1262，液體控制閥1262位於深冷處理裝置1之外部，並連接控制器5。控制器5控制液體控制閥1262之開啟或關閉，進而控制液體供應管路126供應冷卻液體之流量。
復參閱第四圖，本實施例之導流模組16設置於上蓋12之開口120，其包含一致動器161及一風扇162。致動器161設置於上蓋12之外側，其具有一驅動軸1611，驅動軸1611係從上蓋12之外側往上蓋12之開口120的中心延伸。風扇162設置於上蓋12之開口120，其具有一轉軸1621，致動器161之驅動軸1611連接於風扇162之轉軸1621。然致動器161連接控制器5，控制器5控制致動器161，致動器161之驅動軸1611驅動風扇162之轉軸1621轉動，進而使風扇162轉動。需要說明的是，致動器161也可設置於下蓋10之外側，而驅動軸1611從下蓋10之外側穿入，於此不再贅述。
本實施例之致動器161之驅動軸1611未從深冷處理裝置1之外部貫穿上蓋12之圓弧頂面122至冷卻氣體產生腔體123內，而是沿著上蓋12之開口120延伸。也因驅動軸1611未從深冷處理裝置1之外部貫穿上蓋12之圓弧頂面122至冷卻氣體產生腔體123內，驅動軸1611與上蓋12摩擦所產生之熱不容易傳導至冷卻氣體產生腔體123內，而影響產生於冷卻氣體產生腔體123內之冷卻氣體的溫度；同樣地，也防止液體蒸發模組14所產生之冷卻氣體流動至圓弧頂面122時，冷卻氣體從驅動軸1621貫穿圓弧頂面122之位置流失。
然，風扇162具有一進氣端1622及一出氣端1623，進氣端1622對應上蓋12之冷卻氣體產生腔體123，出氣端1623對應下蓋10之冷卻腔體103。當風扇162轉動時，進氣端1622抽取冷卻氣體產生腔體123內之冷卻氣體，同時也導引冷卻氣體產生腔體123內之冷卻氣體往下流動。然，風扇162之出氣端1623供應冷卻氣體至冷卻腔體103，以對位於冷卻腔體103之零件進行深冷處理。同時，風扇162轉動時，擾動進入冷卻腔體103之冷卻氣體，使冷卻氣體均勻分布於冷卻腔體103內，使冷卻腔體103各處之溫度一致，進而使零件均勻冷卻。
本實施例之導流模組16更包含一導流結構163，導流結構163設置於風扇162之出氣端1623，以導引從風扇162之出氣端1623流出之冷卻氣體的流動方向。導流結構163具有複數導流板1631，調整該些導流板1631之傾斜角度，而該些導流板1631可同步調整，即使該些導流板1631之傾斜角度一致，該些導流板1631也可分開調整，即使每一導流板1631之傾斜角度不一致。不論該些導流板1631如何調整，該些導流板1631之傾斜角度係依據冷卻氣體分佈之需而調整，以導引冷卻氣體至冷卻腔體103，對零件進行深冷處理。
復參閱第一圖及第三圖，下蓋10內更設有一加熱模組18，加熱模組18位於承載模組106下方，使本實施例之深冷處理裝置1可同時進行深冷處理與回溫處理。請一併參閱第六圖，係本發明之第一實施例之深冷處理裝置的另一使用狀態圖；如圖所示，待停止對零件2作深冷處理之後，透過加熱模組18及導流模組16提供一熱氣流7，熱氣流7流動至冷卻腔體103，以提升位於冷卻腔體103之零件2的溫度。詳言之，下蓋10之底面102為圓弧面，當導流模組16的風扇162轉動而使空氣通過加熱模組18產生熱氣流7時，向下流動之熱氣流7沿為圓弧面之底面102向上流動，熱氣流7穿過承載模組106之該些第一流通孔10611及該些第二流通孔10621回流至冷卻腔體103，以提升位於冷卻腔體103之零件2的溫度。
又因加熱模組18位於承載模組106之下方，與零件2之距離較短，使熱氣流7可於短時間內流動至零件2並對零件2進行回溫處理，有效提升回溫效率。同時，對應冷卻腔體103之導流模組16的風扇162轉動時，以擾動回流至冷卻腔體103之熱氣流7，使熱氣流7均勻分布於冷卻腔體103內，進而使零件2可均勻回溫。
請參閱第七圖，係本發明之第二實施例之深冷處理裝置的剖面圖；如圖所示，本實施例之深冷處理裝置1更設有至少一液面偵測器11及複數溫度感測器13，液面偵測器11設置於上蓋12，並對應液體蒸發模組14之液體容置槽141，且連接控制器5，而液面偵測器11用以偵測容置於液體容置槽141內之冷卻液體的液面高度。當冷卻液體之液面高度超過一預設值時，控制器5控制設置於液體供應管路126之液體控制閥1262關閉液體供應管路126，以停止供應冷卻液體至液體蒸發模組14之液體容置槽141內，如此有效防止冷卻液體從液體容置槽141溢出，並滴入冷卻腔體103內，且與位於冷卻腔體103內之零件2接觸。
然，該些溫度感測器13分別設置於下蓋10之冷卻腔體103及上蓋12之冷卻氣體產生腔體123，並連接控制器5。當深冷處理裝置1進行深冷處理時，該些溫度感測器13感測冷卻腔體103及冷卻氣體產生腔體123內冷卻氣體之溫度，控制器5依據該些溫度感測器13所感測之溫度判斷是否讓液體蒸發模組14持續產生冷卻氣體；或者是否控制液體蒸發模組14之加熱元件的加熱溫度，以降低或升高液體蒸發模組14所產生之冷卻氣體的溫度。
待深冷處理裝置1停止進行深冷處理，而進行回溫處理時，位於冷卻腔體103之溫度感測器13感測冷卻腔體103之溫度，控制器5依據溫度感測器13所感測之溫度，判斷是否持續開啟加熱模組18進行回溫處理。
綜上所述，本發明係有關於一種深冷處理裝置，其設有至少一液體蒸發模組，透過液體蒸發模組將冷卻液體氣化成冷卻氣體，並透過導流模組導引至冷卻腔體，如此冷卻液體不會與進行深冷處理之零件直接接觸，避免零件急速冷卻而使零件發生熱衝擊的問題，進而避免零件產生脆化。
惟以上所述者，僅為本發明之各項實施例而已，並非用來限定本發明實施之範圍，舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本發明之申請專利範圍內。
In order to further understand and understand the structural features and the effects achieved by the present invention, the following examples and detailed descriptions are provided to illustrate the following:
Conventional cryogenic treatment equipment usually immerses the part to be cryogenically treated in a cooling liquid, and the cooling liquid causes the parts to be rapidly cooled, causing thermal shock of the parts and embrittlement of the parts. This phenomenon is caused by cryogenic treatment of small parts. More serious. In order to overcome the above problems, the cryogenic treatment device of the present embodiment first vaporizes the cooling liquid into a cooling gas, and then uses the cooling gas to cry-cool the parts, thereby effectively slowing down the cooling speed of the parts and avoiding the problem of thermal shock of the parts. Produces embrittlement.
Referring to the first drawing, a cross-sectional view of a cryogenic processing apparatus according to a first embodiment of the present invention; as shown, the present embodiment provides a cryogenic processing apparatus 1 for use in a cryogenic processing apparatus 1 of the present embodiment. It is cryogenically processed and its size is miniaturized. It does not take up space and can be placed on the desktop. The cryogenic treatment device 1 has a lower cover 10, an upper cover 12, a two-liquid evaporation module 14 and a flow guiding module 16. The lower cover 10 has an opening 100, a side wall 101 and a bottom surface 102, and the bottom surface 102 corresponds to the opening 100. And forming a cooling cavity 103 with the side wall 101, and the cooling cavity 103 is provided for at least one part. In addition, the upper cover 12 has an opening 120, a side wall 121 and a circular arc top surface 122. The circular arc top surface 122 corresponds to the opening 120, and the side wall 121 and the circular arc top surface 122 form a cooling gas generating cavity 123. The two liquid evaporating modules 14 are disposed on the side walls 121 of the upper cover 12, respectively, on the two sides of the cooling gas generating cavity 123. It should be noted that the liquid evaporating module 14 is disposed at a position not limited to the upper cover 12, and may be disposed on the second liquid evaporating module 14 The lower cover 10 is adjacent to the side wall 101 of the opening 100, and the number of the liquid evaporation modules 14 is not limited to two. The flow guiding module 16 is disposed on the opening 120 of the upper cover 12 and corresponding to the cooling gas generating cavity 123 of the upper cover 12. Similarly, the flow guiding module 16 can also be disposed at the lower cover 10 adjacent to the opening 100 thereof, which also indicates the diversion. The module 16 is disposed between the cooling gas generating chamber 123 and the cooling chamber 103.
Referring to the second drawing, it is a use state diagram of the cryogenic processing apparatus according to the first embodiment of the present invention; as shown in the figure, when the cryogenic processing apparatus 1 of the present embodiment is used, the component 2 is placed on the lower cover first. 10 in the cooling cavity 103. Then, the upper cover 12 is disposed on the lower cover 10 to make the cooling cavity 103 a sealed state. The liquid evaporating module 14 located in the upper cover 12 respectively accommodates a cooling liquid 3 (eg, liquid nitrogen), and each liquid evaporating module 14 heats the cooling liquid 3 to vaporize the cooling liquid 3 into a cooling gas 4 (eg, : low temperature nitrogen), the cooling gas 4 first flows toward the circular arc top surface 122, flows along the circular arc surface of the circular arc top surface 122, and finally concentrates to the central region of the circular arc top surface 122, that is, in the cooling gas generating cavity Above the 123, the cooling gas 4 is effectively prevented from collecting at the corner of the upper cover 12; at the same time, the flow guiding module 16 is located between the cooling gas generating cavity 123 and the cooling cavity 103, and is collected and collected in the cooling gas generating cavity 123. The upper cooling gas 4 flows the cooling gas collected above the cooling gas generating cavity 123 to the opening 120 of the upper cover 12, and finally the cooling gas 4 sucked into the cooling gas generating cavity 123 by the flow guiding module 16 is discharged into the lower cover 10. The cavity 103 is cooled. The flow guiding module 16 disturbs the cooling gas 4 in the cooling cavity 103, so that the cooling gas 4 can be evenly distributed in the cooling cavity 103, and the temperature in the cooling cavity 103 is controlled to uniformly distribute the cooling cavity 123. The inner part 2 is subjected to cryogenic treatment, even if the temperature of the part 2 is lowered to minus 190 degrees, thereby improving the cooling effect on the part 2.
However, the cryogenic treatment device 1 of the present embodiment does not directly immerse the component 2 in the cooling liquid 3, but vaporizes the cooling liquid 3 into the cooling gas 4 through the liquid evaporation module 14, and then clinks the component 2 through the cooling gas 4, Moreover, the cooling liquid 3 is first vaporized into the cooling gas 4 in the liquid evaporation module 14, so that the cooling liquid 3 does not come into contact with the part 2, thereby effectively preventing the cooling rate of the part 2 from being too fast, and causing thermal shock to cause the part 2 Produces embrittlement.
The components of the cryogenic processing apparatus 1 will be described in detail below. Please refer to the third and fourth figures, which are cross-sectional views of the lower cover and the upper cover of the first embodiment of the present invention; as shown, the lower cover 10 and the upper cover 12 respectively include a casing 104, 124 and an insulation. Layers 105, 125. The heat insulation layers 105 and 125 are disposed in the casings 104 and 124. The heat insulation layers 105 and 125 prevent the temperature outside the cryogenic treatment device 1 from being transmitted to the cooling cavity 103 and the cooling gas generation cavity 123, thereby affecting the cooling cavity 103. And the temperature of the cooling gas generating chamber 123, so that the cover 10 and the upper cover 12 have good heat preservation effect in the embodiment, and the temperature of the cooling cavity 103 and the cooling gas generating cavity 123 are effectively maintained, thereby avoiding the reduction of the component 2 Cooling effect.
A carrying module 106 is disposed in the cooling cavity 103 of the lower cover 10, and the carrying module 106 is used to carry the components. The carrier module 106 of the present embodiment includes a carrier 1061 and a carrier 1062. The carrier 1061 is mounted on the sidewall 101 of the lower cover 10. The carrier 1062 is used to carry the components and is placed on the carrier 1061 so that the components are located. Cooling inside the cavity 103. The arrangement of the carrier 1062 can be omitted, and the components can be directly disposed on the carrier 1061, and the components can be disposed in the cooling cavity 103, and details are not described herein. The carrier 1061 and the carrier 1062 of the carrying module 106 further have a plurality of first through holes 10611 and a plurality of second through holes 10621, and the first through holes 10611 and the second through holes 10621 are used to cool the cavity 103. The cooling gas flows to the bottom surface 102 of the lower cover 10 to prevent the cooling gas from accumulating on the carrier 1061, resulting in uneven temperature distribution in the cooling cavity 103.
In addition, the bottom surface 102 of the lower cover 10 can be arcuate like the circular arc top surface 122 of the upper cover 12, and the cooling gas 4 passes through the first flow holes 10611 and the second flow holes 10621 and flows to When the bottom surface 102 of the lower cover 10 is closed, the cooling gas 4 flows along the arc-shaped bottom surface 102 (as shown in the second figure), and the arc-shaped bottom surface 102 guides the cooling gas 4 to flow back to the upper side of the cooling chamber 103. In this way, the cooling gas 4 is continuously circulated in the cooling cavity 103, effectively accelerating the parts to the cooling temperature, and reducing the use of the cooling liquid, thereby effectively reducing the cost.
Referring to FIG. 5 again, it is an enlarged view of the A area of the fourth embodiment of the present invention; as shown, the liquid evaporation module 14 disposed in the upper cover 12 has a liquid receiving groove 141 and a heating element 142. The heating element 142 is embedded in the bottom of the liquid receiving groove 141. The cooling liquid is accommodated in the liquid accommodating groove 141, and the heating element 142 heats the cooling liquid accommodated in the liquid accommodating groove 141 to vaporize the cooling liquid into a cooling gas. The heating element 142 of the embodiment is connected to a controller 5, and the controller 5 can control the heating temperature of the heating element 142, thereby controlling the gasification rate of the cooling liquid and the temperature of the cooling gas generated by the liquid evaporation module 14.
Then, the upper cover 12 has a two-liquid supply line 126 which passes through the side wall 121 of the upper cover 12 from the outer side of the upper cover 12 and extends into the cooling gas generating cavity 123 of the upper cover 12. Each liquid supply line 126 has a liquid supply port 1261, and the liquid supply port 1261 corresponds to the liquid receiving groove 141 of the liquid evaporation module 14, such that the liquid supply line 126 is connected to one of the liquid supply devices 6 outside the cryogenic treatment device 1. (As shown in the fourth figure), the liquid supply device 6 supplies a cooling liquid to the liquid supply line 126, and the cooling liquid flows into the liquid containing groove 141 from the liquid supply port 1261 of the liquid supply line 126.
Each liquid supply line 126 further has a liquid control valve 1262 which is located outside the cryogenic treatment unit 1 and is connected to the controller 5. The controller 5 controls the opening or closing of the liquid control valve 1262 to control the flow of the liquid supply line 126 to supply the cooling liquid.
Referring to the fourth figure, the flow guiding module 16 of the embodiment is disposed on the opening 120 of the upper cover 12, and includes an actuator 161 and a fan 162. The actuator 161 is disposed on the outer side of the upper cover 12 and has a drive shaft 1611 extending from the outer side of the upper cover 12 toward the center of the opening 120 of the upper cover 12. The fan 162 is disposed on the opening 120 of the upper cover 12 and has a rotating shaft 1621. The driving shaft 1611 of the actuator 161 is coupled to the rotating shaft 1621 of the fan 162. The actuator 161 is connected to the controller 5, and the controller 5 controls the actuator 161. The drive shaft 1611 of the actuator 161 drives the rotation shaft 1621 of the fan 162 to rotate, thereby rotating the fan 162. It should be noted that the actuator 161 can also be disposed on the outer side of the lower cover 10, and the drive shaft 1611 is inserted from the outer side of the lower cover 10, and details are not described herein.
The drive shaft 1611 of the actuator 161 of the present embodiment does not extend from the outside of the cryogenic treatment device 1 through the arcuate top surface 122 of the upper cover 12 into the cooling gas generating cavity 123, but extends along the opening 120 of the upper cover 12. Also, since the drive shaft 1611 does not penetrate the arc top surface 122 of the upper cover 12 from the outside of the cryogenic treatment device 1 into the cooling gas generating cavity 123, the heat generated by the friction between the drive shaft 1611 and the upper cover 12 is not easily conducted to the cooling gas generating chamber. In the body 123, the temperature of the cooling gas generated in the cooling gas generating cavity 123 is affected; similarly, when the cooling gas generated by the liquid evaporation module 14 is prevented from flowing to the circular arc top surface 122, the cooling gas is driven from the driving shaft. 1621 is lost through the position of the arc top surface 122.
The fan 162 has an air inlet end 1622 and an air outlet end 1623. The air inlet end 1622 corresponds to the cooling gas generating cavity 123 of the upper cover 12, and the air outlet end 1623 corresponds to the cooling cavity 103 of the lower cover 10. When the fan 162 rotates, the intake end 1622 extracts the cooling gas in the cooling gas generating chamber 123, and also guides the cooling gas in the cooling gas generating chamber 123 to flow downward. However, the outlet end 1623 of the fan 162 supplies cooling gas to the cooling chamber 103 to cryogenically process the components located in the cooling chamber 103. At the same time, when the fan 162 rotates, the cooling gas entering the cooling cavity 103 is disturbed, so that the cooling gas is uniformly distributed in the cooling cavity 103, so that the temperatures of the cooling cavity 103 are uniform, and the parts are evenly cooled.
The flow guiding module 16 of the embodiment further includes a flow guiding structure 163. The guiding structure 163 is disposed at the air outlet end 1623 of the fan 162 to guide the flow direction of the cooling gas flowing out from the air outlet end 1623 of the fan 162. The flow guiding structure 163 has a plurality of baffles 1631, and the tilt angles of the baffles 1631 are adjusted, and the baffles 1631 can be adjusted synchronously, even if the tilt angles of the baffles 1631 are the same, the baffles The 1631 can also be adjusted separately even if the inclination angle of each of the baffles 1631 is inconsistent. Regardless of how the baffles 1631 are adjusted, the inclination angles of the baffles 1631 are adjusted according to the distribution of the cooling gas to guide the cooling gas to the cooling cavity 103, and the parts are subjected to cryogenic treatment.
Referring to the first and third figures, a heating module 18 is further disposed in the lower cover 10, and the heating module 18 is located below the carrying module 106, so that the cryogenic processing device 1 of the embodiment can simultaneously perform cryogenic processing and temperature recovery. deal with. Please refer to the sixth drawing, which is another use state diagram of the cryogenic processing apparatus according to the first embodiment of the present invention; as shown in the figure, after the cryogenic treatment of the component 2 is stopped, the heating module 18 and the diversion are transmitted. The module 16 provides a hot gas stream 7 that flows to the cooling chamber 103 to raise the temperature of the part 2 located in the cooling chamber 103. In detail, the bottom surface 102 of the lower cover 10 is a circular arc surface. When the fan 162 of the flow guiding module 16 rotates to generate the hot air flow 7 through the heating module 18, the downward flowing hot air current 7 is an arc. The bottom surface 102 of the surface flows upward, and the hot air flow 7 passes through the first through holes 10611 of the carrying module 106 and the second through holes 10621 to return to the cooling cavity 103 to lift the part 2 located in the cooling cavity 103. temperature.
Moreover, since the heating module 18 is located below the carrying module 106, the distance from the component 2 is short, so that the hot airflow 7 can flow to the component 2 in a short time and the component 2 is warmed back, thereby effectively improving the temperature recovery efficiency. At the same time, when the fan 162 of the flow guiding module 16 corresponding to the cooling cavity 103 rotates, the hot air flow 7 returned to the cooling cavity 103 is disturbed to uniformly distribute the hot air flow 7 in the cooling cavity 103, so that the component 2 can be Evenly return to temperature.
7 is a cross-sectional view of a cryogenic processing apparatus according to a second embodiment of the present invention; as shown, the cryogenic processing apparatus 1 of the present embodiment further includes at least one liquid level detector 11 and a plurality of temperature senses. The liquid level detector 11 is disposed on the upper cover 12 and corresponding to the liquid receiving groove 141 of the liquid evaporation module 14, and is connected to the controller 5, and the liquid level detector 11 is used for detecting the liquid content. The liquid level of the cooling liquid in the receiving groove 141. When the liquid level of the cooling liquid exceeds a predetermined value, the controller 5 controls the liquid control valve 1262 disposed in the liquid supply line 126 to close the liquid supply line 126 to stop supplying the cooling liquid to the liquid of the liquid evaporation module 14. In the accommodating groove 141, the cooling liquid is effectively prevented from overflowing from the liquid accommodating groove 141, and is dropped into the cooling cavity 103, and is in contact with the part 2 located in the cooling cavity 103.
The temperature sensors 13 are respectively disposed in the cooling cavity 103 of the lower cover 10 and the cooling gas generating cavity 123 of the upper cover 12, and are connected to the controller 5. When the cryogenic treatment device 1 performs the cryogenic treatment, the temperature sensors 13 sense the temperature of the cooling gas in the cooling chamber 103 and the cooling gas generating chamber 123, and the controller 5 senses the temperature according to the temperature sensors 13. The temperature determines whether the liquid evaporation module 14 continues to generate the cooling gas; or whether the heating temperature of the heating element of the liquid evaporation module 14 is controlled to reduce or increase the temperature of the cooling gas generated by the liquid evaporation module 14.
When the cryogenic treatment device 1 stops the cryogenic treatment, when the temperature recovery process is performed, the temperature sensor 13 located in the cooling chamber 103 senses the temperature of the cooling chamber 103, and the controller 5 senses the temperature according to the temperature sensor 13. It is determined whether the heating module 18 is continuously turned on to perform the temperature return process.
In summary, the present invention relates to a cryogenic treatment apparatus provided with at least one liquid evaporation module, which vaporizes a cooling liquid into a cooling gas through a liquid evaporation module, and is guided to a cooling cavity through a flow guiding module. Therefore, the cooling liquid does not directly contact the parts subjected to the cryogenic treatment, thereby avoiding the problem that the parts are rapidly cooled and the parts are thermally shocked, thereby avoiding embrittlement of the parts.
The above is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the claims of the present invention. All should be included in the scope of the patent application of the present invention.
1．．．深冷處理裝置1. . . Cryogenic treatment unit
10．．．下蓋10. . . lower lid
100．．．開口100. . . Opening
101．．．側壁101. . . Side wall
102．．．底面102. . . Bottom
103．．．冷卻腔體103. . . Cooling chamber
104．．．殼體104. . . case
105．．．隔熱層105. . . heat insulation
106．．．承載模組106. . . Carrier module
1061．．．承載架1061. . . Carrier
10611．．．第一流通孔10611. . . First flow hole
1062．．．載具1062. . . vehicle
10621．．．第二流通孔10621. . . Second flow hole
11．．．液面偵測器11. . . Liquid level detector
12．．．上蓋12. . . Upper cover
120．．．開口120. . . Opening
121．．．側壁121. . . Side wall
122．．．圓弧頂面122. . . Circular top surface
123．．．冷卻氣體產生腔體123. . . Cooling gas generating chamber
124．．．殼體124. . . case
125．．．隔熱層125. . . heat insulation
126．．．液體供應管路126. . . Liquid supply line
1261．．．液體供應口1261. . . Liquid supply port
1262．．．液體控制閥1262. . . Liquid control valve
13．．．溫度感測器13. . . Temperature sensor
14．．．液體蒸發模組14. . . Liquid evaporation module
141．．．液體容置槽141. . . Liquid receiving tank
142．．．加熱元件142. . . Heating element
16．．．導流模組16. . . Diversion module
161．．．致動器161. . . Actuator
1611．．．驅動軸1611. . . Drive shaft
162．．．風扇162. . . fan
1621．．．轉軸1621. . . Rotating shaft
1622．．．進氣端1622. . . Intake end
1623．．．出氣端1623. . . Venting end
163．．．導流結構163. . . Diversion structure
1631．．．導流板1631. . . Deflector
18．．．加熱模組18. . . Heating module
2．．．零件2. . . Components
3．．．冷卻液體3. . . Cooling liquid
4．．．冷卻氣體4. . . Cooling gas
5．．．控制器5. . . Controller
6．．．液體供應裝置6. . . Liquid supply device
7．．．熱氣流7. . . Hot air flow
第一圖為本發明之第一實施例之深冷處理裝置的剖面圖；
第二圖為本發明之第一實施例之深冷處理裝置的使用狀態圖；
第三圖為本發明之第一實施例之下蓋的剖面圖；
第四圖為本發明之第一實施例之上蓋的剖面圖；
第五圖為本發明之第四圖之A區域的放大圖；
第六圖為本發明之第一實施例之深冷處理裝置的另一使用狀態圖；以及
第七圖為本發明之第二實施例之深冷處理裝置的剖面圖。
The first figure is a cross-sectional view of a cryogenic treatment apparatus according to a first embodiment of the present invention;
The second drawing is a use state diagram of the cryogenic processing apparatus according to the first embodiment of the present invention;
Figure 3 is a cross-sectional view of the lower cover of the first embodiment of the present invention;
Figure 4 is a cross-sectional view of the upper cover of the first embodiment of the present invention;
Figure 5 is an enlarged view of a region A of the fourth diagram of the present invention;
Fig. 6 is a view showing another use state of the cryogenic processing apparatus according to the first embodiment of the present invention; and a seventh sectional view showing the cryogenic processing apparatus of the second embodiment of the present invention.
1．．．深冷處理裝置1. . . Cryogenic treatment unit
10．．．下蓋10. . . lower lid
100．．．開口100. . . Opening
101．．．側壁101. . . Side wall
102．．．底面102. . . Bottom
103．．．冷卻腔體103. . . Cooling chamber
12．．．上蓋12. . . Upper cover
120．．．開口120. . . Opening
121．．．側壁121. . . Side wall
122．．．圓弧頂面122. . . Circular top surface
123．．．冷卻氣體產生腔體123. . . Cooling gas generating chamber
14．．．液體蒸發模組14. . . Liquid evaporation module
16．．．導流模組16. . . Diversion module
18．．．加熱模組18. . . Heating module
Claims (11)
一下蓋，具有一冷卻腔體，該冷卻腔體供至少一零件設置；
一上蓋，設置於該下蓋，並具有一冷卻氣體產生腔體；
至少一液體蒸發模組，設置於該上蓋或該下蓋，該液體蒸發模組供容置一冷卻液體，並氣化該冷卻液體為一冷卻氣體，該冷卻氣體流動至該冷卻氣體產生腔體；以及
一導流模組，設置於該冷卻氣體產生腔體及該冷卻腔體之間，該導流模組抽取該冷卻氣體產生腔體內之該冷卻氣體至該冷卻腔體，以冷卻位於該冷卻腔體內之該零件。A cryogenic treatment device comprising:
a lower cover having a cooling cavity for at least one part;
An upper cover disposed on the lower cover and having a cooling gas generating cavity;
At least one liquid evaporating module is disposed on the upper cover or the lower cover, the liquid evaporating module is configured to receive a cooling liquid, and vaporize the cooling liquid into a cooling gas, and the cooling gas flows to the cooling gas generating cavity And a flow guiding module disposed between the cooling gas generating cavity and the cooling cavity, the guiding module extracting the cooling gas in the cooling gas generating cavity to the cooling cavity to cool the Cool the part inside the cavity.
一液體容置槽，容置該冷卻液體；以及
一加熱元件，設置於該液體容置槽之底部，該加熱元件加熱容置於該容置槽內之該冷卻液體，該冷卻液體氣化為該冷卻氣體。The cryogenic treatment device of claim 1, wherein the liquid evaporation module comprises:
a liquid accommodating groove for accommodating the cooling liquid; and a heating element disposed at the bottom of the liquid accommodating groove, the heating element heating the cooling liquid accommodated in the accommodating groove, and the cooling liquid is vaporized into The cooling gas.
至少一液體供應管路，穿設該上蓋或該下蓋，並對應該液體容置槽，該液體供應管路供應該冷卻液體至該液體容置槽。The cryogenic treatment device described in claim 3, further comprising:
At least one liquid supply line is disposed through the upper cover or the lower cover and corresponding to the liquid receiving groove, and the liquid supply line supplies the cooling liquid to the liquid receiving groove.
至少一液面偵測器，對應該液體容置槽設置，以偵測該液體容置槽內之該冷卻液體的液面高度。The cryogenic treatment device described in claim 3, further comprising:
At least one liquid level detector is disposed corresponding to the liquid receiving groove to detect the liquid level of the cooling liquid in the liquid receiving groove.
一致動器，設置於該上蓋或該下蓋之外側，並具有一驅動軸，該驅動軸從該上蓋或該下蓋之外側穿入；以及
一風扇，具有一轉軸、一進氣端及一出氣端，該轉軸連接於該驅動軸，該風扇之進氣端對應該冷卻氣體產生腔體，該出氣端對應該冷卻腔體，該致動器之該驅動軸驅動該風扇之該轉軸轉動，該風扇之該進氣端抽取該冷卻氣體產生腔體之該冷卻氣體，該風扇之該出氣端導引該冷卻氣體至該該冷卻腔體，以冷卻該零件。The cryogenic treatment device of claim 1, wherein the flow guiding module comprises:
An actuator, disposed on an outer side of the upper cover or the lower cover, and having a drive shaft penetrating from the outer side of the upper cover or the lower cover; and a fan having a rotating shaft, an intake end, and a An air outlet end, the rotating shaft is connected to the driving shaft, and the air inlet end of the fan corresponds to the cooling gas generating cavity, the air outlet end corresponds to the cooling cavity, and the driving shaft of the actuator drives the rotating shaft of the fan to rotate, The air inlet end of the fan extracts the cooling gas of the cooling gas generating cavity, and the air outlet end of the fan guides the cooling gas to the cooling cavity to cool the component.
一導流結構，設置於該風扇之該出氣端，並具有複數導流板，該些導流板係分別具有一傾斜角度，以導引該冷卻氣體之流動方向。The cryogenic treatment device of claim 6, wherein the flow guiding module further comprises:
A flow guiding structure is disposed at the air outlet end of the fan and has a plurality of baffles each having an inclined angle to guide a flow direction of the cooling gas.
一承載模組，設置於該下蓋，並位於該冷卻腔體內，且承載該零件。The cryogenic treatment device described in claim 1 further comprises:
A carrying module is disposed on the lower cover and located in the cooling cavity and carries the component.
一支撐架，設置於該下蓋，並具有複數第一流通孔；以及
一載具，設置於該支撐架，並位於該冷卻腔體，且承載該零件，該載具包含複數第二流通孔，該冷卻氣體流通於該些第一流通孔及該些第二流通孔。The cryogenic processing apparatus of claim 8, wherein the carrying module comprises:
a support frame disposed on the lower cover and having a plurality of first flow holes; and a carrier disposed on the support frame and located in the cooling cavity and carrying the component, the carrier comprising a plurality of second flow holes The cooling gas flows through the first flow holes and the second flow holes.
一加熱模組，設置於該下蓋，並位於該承載模組之下方，該加熱模組產生一熱氣流，該熱氣流流動至該冷卻腔體，以回復該零件之溫度。The cryogenic treatment device as described in claim 8 of the patent application further comprises:
A heating module is disposed on the lower cover and located below the carrying module. The heating module generates a hot air flow, and the hot air flows to the cooling cavity to restore the temperature of the component.
一第一溫度感測元件，設置於該上蓋，並位於該冷卻氣體產生腔體，該第一溫度感測元件感測該冷卻氣體產生腔體之溫度；以及
一第二溫度感測元件，設置於該下蓋，並位於該冷卻腔體，該第二溫度感測元件感測該冷卻腔體之溫度。The cryogenic treatment device according to claim 10, further comprising:
a first temperature sensing component disposed on the upper cover and located in the cooling gas generating cavity, the first temperature sensing component sensing a temperature of the cooling gas generating cavity; and a second temperature sensing component, setting The lower cover is located in the cooling cavity, and the second temperature sensing element senses the temperature of the cooling cavity.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101147053A TW201423009A (en) | 2012-12-12 | 2012-12-12 | Cryogenic treatment device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101147053A TW201423009A (en) | 2012-12-12 | 2012-12-12 | Cryogenic treatment device |
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| TW201423009A true TW201423009A (en) | 2014-06-16 |
| TWI504848B TWI504848B (en) | 2015-10-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021684A (en) * | 2019-04-19 | 2019-07-16 | 无锡奥特维科技股份有限公司 | Cooling device and annealing furnace |
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| CN1147594C (en) * | 2001-02-05 | 2004-04-28 | 华南理工大学 | Microcomputer-controlled cryogenic treatment device and its technology |
| CN1948516A (en) * | 2006-11-08 | 2007-04-18 | 浙江大学 | Temperature controllable deep cooling treatment system bases on natural circulation |
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| CN110021684A (en) * | 2019-04-19 | 2019-07-16 | 无锡奥特维科技股份有限公司 | Cooling device and annealing furnace |
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