TW201421214A - Spray heat dissipation structure - Google Patents

Abstract

A heat dissipating structure is installed in an electronic device casing, the heat dissipating structure includes a radiator and a water spraying device, and the water spraying device comprises a water tank, a water absorbing member and a water spraying member connecting the water absorbing member, the water spraying member is provided with a nozzle corresponding to the heat sink The water absorbing member can suck the water in the water tank into the water spray member and eject from the nozzle to the heat sink. The heat dissipation structure can be increased by the water spray on the heat sink to increase the heat dissipation effect.

Description

Spray heat dissipation structure

The invention relates to a heat dissipation structure of an electronic device, in particular to a heat dissipation structure of a spray type electronic device.

The fan unit in the electronic device can carry the heat inside the casing out of the system. As the industry's computing power is getting higher and higher, the heat generated inside the casing is also increasing. It requires higher speed and larger fan blade space to produce better heat dissipation. Due to the limitations of the space inside some electronic devices, the fan size cannot be changed. It is conventionally known that the fan-type heat dissipation cannot meet the basic heat dissipation requirements of the electronic device.

In view of the above, it is necessary to provide a heat dissipation structure having a better heat dissipation function.

The heat dissipating structure is installed in an electronic device casing, and the heat dissipating structure comprises a radiator and a water spraying device, the water spraying device comprises a water tank, a water absorbing member and a water spraying member connecting the water absorbing member, and the water spraying member is provided with a nozzle corresponding to the radiator. The water absorbing member can suck the water in the water tank into the water spray member and eject it from the nozzle to the heat sink.

In one embodiment, the water absorbing member comprises a pressing cylinder, a pressing rod and a pressing cap on the pressing rod, and the pressing rod sucks water in the water tank into the water spraying member by pressing the pressing cylinder.

In one embodiment, the water absorbing member further includes a spring between the pressing cap and the pressing cylinder.

In one embodiment, the water spray device further includes a baffle on the casing, the baffle is provided with a through hole, and the push cap protrudes from the through hole.

In one embodiment, the water spray member includes a U-shaped buffer tube that connects the water absorbing member.

In one embodiment, the water absorbing member includes an outlet pipe connected to the water spray member, and the water outlet pipe and the water spray member are butted by an interference fit.

In one embodiment, the water spray member further includes a water spray pipe and a connecting pipe connecting the water spray pipe and the buffer pipe, and the water spray pipe is perpendicular to the connecting pipe.

In one embodiment, the connecting pipe and the plane of the water spout pipe are substantially perpendicular to a plane of the connecting pipe and the buffer pipe.

In one embodiment, the housing is provided with an air outlet, the heat sink includes a heat dissipation fan and a heat dissipation fin group, and the heat dissipation fin group is located between the heat dissipation fan and the air outlet, and the nozzle of the water absorption member is directly dissipating the heat dissipation Fin set.

In one embodiment, the nozzle includes a plurality of nozzles, each nozzle including an atomizing structure.

Compared with the prior art, the heat dissipation structure can increase the heat dissipation effect by spraying water on the heat sink.

Referring to FIG. 1 and FIG. 2 , an electronic device heat dissipation structure is mounted in an electronic device 100 according to an embodiment of the invention. In this embodiment, the electronic device 100 can be a notebook computer. The electronic device 100 includes a housing 10. The housing 10 includes a bottom cover 12 and a keyboard 18. An air outlet 124 is defined on one side of the bottom cover 12. The electronic device 100 further includes a motherboard 20 mounted between the bottom cover 12 and the keyboard 18. The motherboard 20 is provided with a heating element 23, which may be a CPU.

The heat dissipating mechanism includes a heat sink 30 and a water spray device 50. The heat sink 30 includes a fan 31, a heat pipe 35 and a fin set 34. One end of the heat pipe 35 is in thermal contact with the heat generating component 23, and the other end of the heat pipe 35 is in thermal contact with the fin set 34. The fin set 34 is located outside the fan 31. A rectangular opening 22 is defined in the housing 10.

Referring to FIGS. 3 and 4 , the water spray device 50 includes a water tank 51 , a water absorbing member 53 , a water spray member 55 , and a movable baffle 58 .

The water tank 51 can be a flat cylinder. The water tank 51 contains pure water, alcohol or other liquid for dissipating heat.

The water absorbing member 53 includes a pressing cylinder 532, a suction pipe 531, an outlet pipe 533, a pressing rod 535, a pressing cap 537 and a spring 539. The suction pipe 531 projects into the water tank 51. The pressing cylinder 532 can suck the water in the water tank 51 by the pressing of the pressing lever 535. The cap 537 is fixed to the upper end of the pressing rod 535. The lower end of the pressing lever 535 projects into the pressing cylinder 532. The spring 539 is sleeved on the pressing rod 535 and located between the pressing cap 537 and the pressing cylinder 532. The baffle 58 includes a through hole 582 for receiving the cap 537.

The water spray member 55 includes a buffer tube 551, a water spray pipe 555, and a connecting pipe 553 connecting the buffer pipe 551 and the water spray pipe 555. The buffer tube 551 can be U-shaped. One end of the buffer tube 551 can be connected to the water outlet pipe 533 of the water absorbing member 53. The water outlet pipe 533 and the water spray member 55 can be docked by an interference fit, that is, the diameter of the nozzle of the water outlet pipe 533 is slightly larger than the pipe mouth of the buffer pipe 551. The diameter, or the diameter of the nozzle of the outlet pipe 533 is slightly smaller than the diameter of the nozzle of the buffer tube 551, so that one of the nozzles extends into the other nozzle for docking. The connecting pipe 553 and the water spray pipe 555 can extend in a straight line, and the water spray pipe 555 can be perpendicular to the connecting pipe 553. To save space, the plane of the connecting pipe 553 and the water spray pipe 555 may be substantially perpendicular to the plane of the connecting pipe 553 and the buffer pipe 551. The water spray pipe 555 is provided with a plurality of nozzles 556 corresponding to the fin group 34. Each nozzle 556 can include an atomizing structure.

Referring to FIG. 5, during assembly, the heat sink 30 is mounted on the motherboard 20, and one end of the heat pipe 35 is in thermal contact with the heat generating component 23, and the other end of the heat pipe 35 is in thermal contact with the fin set 34. The fin set 34 is located on the side of the fan 31. The water suction pipe 531 of the water absorbing member 53 is inserted into the water tank 51, and the water outlet pipe 533 of the water absorbing member 53 is butted against the buffer pipe 551. The baffle 58 is fastened to the opening 22 of the housing 10. The water spray pipe 555 of the water spray device 50 is placed on the outer side of the fin set 34 such that the nozzle 556 corresponds to the fin set 34. The cap 537 of the water absorbing member 53 projects from the through hole 582 of the baffle 58 to the housing 10.

In use, the electronic device 100 operates, the heating element 23 generates heat, and the fan 31 rotates outwardly to the heat pipe 35 and the fin group 34 to dissipate heat. To accelerate the heat dissipation, the cap 537 can be pressed downward by the side of the housing 10 on which the keyboard 18 is mounted. The water absorbing member 53 absorbs water from the water tank 51 and outputs water to the nozzle of the water spray pipe 555 through the buffer tube 551. 556 spouted. The sprayed water mist falls on the fin set 34, and the water mist absorbs heat during the evaporation of the contact heat. Under the action of the fan 31, the evaporated water mist is blown out of the electronic device 100, thereby increasing the heat sink. The heat dissipation effect of 30, and to some extent, prevents the water mist from entering the housing 10 to affect the operation of the electronic component.

When water is added, the baffle 58 is taken up, the water absorbing member 53 can be removed, and pure water or alcohol can be added to the water tank 51.

In the present embodiment, the bending design of the buffer tube 551 can prevent water from flowing back in the water spray pipe 555 and the connecting pipe 553, thereby affecting the heat dissipation effect.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above-mentioned preferred embodiments of the present invention are intended to be within the scope of the following claims.

100. . . Electronic device

10. . . case

12. . . Bottom cover

124. . . Air outlet

18. . . keyboard

20. . . motherboard

twenty two. . . Opening

twenty three. . . Heating element

30. . . heat sink

31. . . fan

34. . . Fin set

35. . . Heat pipe

50. . . Water spray device

51. . . Water tank

53. . . Absorbent parts

531. . . straw

532. . . Press cylinder

533. . . Outlet pipe

535. . . Pressing lever

537. . . Press the cap

539. . . spring

55. . . Water spray

551. . . Buffer tube

553. . . Connecting pipe

555. . . Sprinkler pipe

556. . . nozzle

58. . . Baffle

582. . . Through hole

1 is a perspective view of an electronic device in an embodiment of the present invention.

Figure 2 is a partially exploded perspective view of the housing of one of the other views of Figure 1.

Figure 3 is an exploded perspective view of the water spray device of Figure 2.

Figure 4 is a partial perspective assembled view of Figure 3.

FIG. 5 is an assembled, isometric view of the heat dissipation mechanism of the other view of FIG. 2. FIG.

50. . . Water spray device

51. . . Water tank

53. . . Absorbent parts

531. . . straw

532. . . Press cylinder

533. . . Outlet pipe

535. . . Pressing lever

537. . . Press the cap

539. . . spring

55. . . Water spray

551. . . Buffer tube

553. . . Connecting pipe

555. . . Sprinkler pipe

556. . . nozzle

58. . . Baffle

582. . . Through hole

Claims (10)

A heat dissipating structure is installed in an electronic device casing, the heat dissipating structure includes a radiator and a water spraying device, and the water spraying device comprises a water tank, a water absorbing member and a water spraying member connecting the water absorbing member, the water spraying member is provided with a nozzle corresponding to the heat sink The water absorbing member can suck the water in the water tank into the water spray member and eject from the nozzle to the heat sink. The heat dissipation structure according to claim 1, wherein the water absorbing member comprises a pressing cylinder, a pressing rod and a pressing cap on the pressing rod, and the pressing rod sucks water in the water tank into the water spraying member by pressing the pressing cylinder in. The heat dissipation structure of claim 2, wherein the water absorbing member further comprises a spring between the pressing cap and the pressing cylinder. The heat dissipation structure of claim 2, wherein the water spray device further comprises a baffle on the casing, the baffle is provided with a through hole, and the push cap protrudes from the through hole. The heat dissipation structure according to claim 1, wherein the water spray member comprises a U-shaped buffer tube connected to the water suction member. The heat dissipation structure according to claim 5, wherein the water absorbing member comprises an outlet pipe connected to the water spray member, and the water outlet pipe and the water spray member are butted by an interference fit. The heat dissipation structure according to claim 5, wherein the water spray member further comprises a water spray pipe and a connecting pipe connecting the water spray pipe and the buffer pipe, and the water spray pipe is perpendicular to the connecting pipe. The heat dissipation structure of claim 7, wherein the connecting pipe and the plane of the water pipe are substantially perpendicular to a plane of the connecting pipe and the buffer pipe. The heat dissipation structure of claim 1, wherein the housing is provided with an air outlet, the heat sink includes a heat dissipation fan and a heat dissipation fin group, and the heat dissipation fin group is located between the heat dissipation fan and the air outlet. The nozzle of the water absorbing member is facing the heat sink fin group. The heat dissipation structure of claim 1, wherein the nozzle comprises a plurality of nozzles, each nozzle comprising an atomizing structure.