TW201427805A - Adsorption reversal device - Google Patents
Adsorption reversal device Download PDFInfo
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- TW201427805A TW201427805A TW102129107A TW102129107A TW201427805A TW 201427805 A TW201427805 A TW 201427805A TW 102129107 A TW102129107 A TW 102129107A TW 102129107 A TW102129107 A TW 102129107A TW 201427805 A TW201427805 A TW 201427805A
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
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Abstract
本發明提供一種可以極為簡單之構造進行吸附板之上下動之吸附反轉裝置。吸附基板W並使其反轉之吸附反轉裝置,具備由左右之側架14支持之旋轉軸15、呈水平地安裝於旋轉軸15並與旋轉軸15一起旋動之支持構件16、透過下壓構件17而保持於支持構件16成可上下動之水平的吸附板18、以及對該吸附板18隨時以朝向上方之方式進行彈壓之回彈彈簧19;且以如下之方式構成:藉由使下壓構件17動作而使吸附板18往下動,藉由解除下壓構件17下壓之力、並藉由回彈彈簧19之彈壓力而使吸附板18上升並返回原位置。The present invention provides an adsorption reversal device that can be moved up and down on an adsorption plate in an extremely simple configuration. The adsorption reversing device that adsorbs and inverts the substrate W includes a rotating shaft 15 supported by the left and right side frames 14 and a supporting member 16 horizontally attached to the rotating shaft 15 and rotated together with the rotating shaft 15 The pressing member 17 is held by the suction plate 18 at a level at which the supporting member 16 can move up and down, and a rebound spring 19 that elastically presses the suction plate 18 upward; and is configured as follows: The pressing member 17 operates to move the suction plate 18 downward, and the suction plate 18 is raised and returned to the original position by releasing the pressing force of the pressing member 17 and by the elastic pressure of the rebound spring 19.
Description
本發明係關於在對由玻璃、矽、陶瓷、化合物半導體等之脆性材料所構成之基板進行加工分斷用之刻劃線、沿著該刻劃線進行分斷基板等之基板加工裝置等所使用之吸附反轉裝置。 The present invention relates to a substrate processing apparatus for cutting a substrate made of a brittle material such as glass, tantalum, ceramics, or a compound semiconductor, and cutting the substrate along the scribe line. The adsorption reversal device used.
由習知,例如於專利文獻1等揭示有如下方法:對載置於平台上之基板,使刀輪(又稱刻劃輪)在施加既定之刻劃壓之狀態下轉動、或利用由雷射光束之照射產生之熱梯度等,形成相互正交之複數條平行之刻劃線,之後,使基板表背面反轉,從與設有該刻劃線之面相反側之面以裂斷桿按壓而使基板撓曲藉此分斷基板,取出單位製品。 Conventionally, for example, Patent Document 1 discloses a method of rotating a cutter wheel (also referred to as a scoring wheel) in a state where a predetermined moment is pressed, or using a mine, on a substrate placed on a platform. a thermal gradient generated by the irradiation of the beam of light, etc., forming a plurality of mutually orthogonal scribe lines in parallel, and then inverting the front and back sides of the substrate, and breaking the rod from the side opposite to the surface on which the scribe line is provided The substrate is deflected by pressing to thereby break the substrate, and the unit product is taken out.
此外,關於貼合有2片玻璃基板之基板之分斷方法,例如於專利文獻2(圖45等),亦揭示有利用以下所示之步驟進行分斷之方法。亦即,對載置於刻劃裝置之平台上之基板,藉由使刀輪轉動,而於基板之一面即a面形成刻劃線。接著,在利用吸附反轉裝置吸附基板並使其反轉之後,載置於裂斷裝置之平台上,對成為基板a面之背面的基板b面以裂斷桿等進行按壓而裂斷基板a面。接著,與上述同樣地,於基板b面形成刻劃線,使基板反轉後,對基板a面以裂斷桿等進行按壓而分斷基板b面。之後,將所分斷之基板從裂斷裝置卸除而移往下一步驟。 Further, a method of dividing a substrate in which two glass substrates are bonded to each other is disclosed, for example, in Patent Document 2 (FIG. 45 and the like), and a method of dividing by the steps shown below. That is, the substrate placed on the platform of the scoring apparatus is formed by scribing the cutter wheel to form a score line on one side of the substrate, that is, the a surface. Then, after the substrate is adsorbed by the adsorption inversion device and inverted, the substrate is placed on the platform of the cracking device, and the substrate b surface which is the back surface of the substrate a surface is pressed by a cracking rod or the like to break the substrate a. surface. Then, in the same manner as described above, a scribe line is formed on the surface of the substrate b, and after the substrate is reversed, the surface of the substrate a is pressed by a rupture rod or the like to break the surface of the substrate b. Thereafter, the broken substrate is removed from the breaking device and moved to the next step.
專利文獻1:國際公開WO2005/053925號公報 Patent Document 1: International Publication WO2005/053925
專利文獻2:國際公開WO2002/057192號公報 Patent Document 2: International Publication WO2002/057192
在如上述之基板之加工方法中,使用於使基板反轉之吸附反轉裝置,具備有用以吸附置於平台等之載置台上之基板並抬起之吸附板,而使利用吸附板吸附並抬起之基板進行反轉。作為使該吸附板相對於基板面上下升降之機構,例如從位於平台之上方之構架(frame)等之支持部延伸設置垂直之支柱,於該垂直之支柱,將保持該吸附板成可反轉之升降構件安裝成可升降。該升降構件,以如下方式形成:為了使其升降對於反轉為必要之距離而藉由移動行程較長之流體汽缸或利用齒條與齒輪(pinion)等構成複雜的構造之升降機構進行升降。 In the method for processing a substrate as described above, the adsorption inversion device for reversing the substrate is provided with an adsorption plate for adsorbing a substrate placed on a stage such as a stage and raised, and adsorbing by the adsorption plate The raised substrate is reversed. As a mechanism for raising and lowering the adsorption plate relative to the surface of the substrate, for example, a vertical pillar is extended from a support portion such as a frame located above the platform, and the vertical pillar supports the adsorption plate to be reversible The lifting member is mounted to be lifted and lowered. The elevating member is formed in such a manner that the fluid cylinder having a long moving stroke or the elevating mechanism having a complicated structure such as a rack and a pinion is lifted and lowered in order to raise and lower the necessary distance for reversing.
在如上述般之吸附反轉裝置,存在有如下之問題點:藉由垂直之支柱、或沿著此進行升降之升降構件、以及裝入於內部之複雜的升降機構而使升降裝置成為大型者、且機構變複雜並使成本變高。 In the above-described adsorption reversal device, there is a problem in that the lifting device becomes a large person by a vertical pillar, an elevating member that is lifted and lowered along the same, and a complicated lifting mechanism incorporated therein. And the organization is complicated and the cost is high.
因此,本發明有鑑於上述之習知課題,目的在於提供一種可以新穎的機構、更極為簡單之構造進行吸附板之上下動的吸附反轉裝置。 Accordingly, the present invention has been made in view of the above-described conventional problems, and an object thereof is to provide an adsorption reversal device in which a suction mechanism can be moved downward by a novel mechanism and a more extremely simple structure.
為了達成上述目的而在本發明中提出了如接下來的技術性手段。亦即,本發明係吸附基板並使其反轉之吸附反轉裝置,具備由左右之側架支持之旋轉軸、呈水平地安裝於該旋轉軸並與旋轉軸一起旋動之支持構件、透過下壓構件而保持於該支持構件成可上下動之水平的吸附板、以及對該吸附板隨時以朝向上方之方式進行彈壓之回彈彈簧;且成為以如下方式形成之構成:藉由使該下壓構件動作而使該吸附板往下動,藉由解除該下壓構件下壓之力、並藉由該回彈彈簧之彈壓力而使該吸附板上升並 返回原位置。 In order to achieve the above object, the following technical means are proposed in the present invention. That is, the present invention is an adsorption reversal device that adsorbs and inverts a substrate, and includes a rotating shaft supported by the left and right side frames, a supporting member horizontally attached to the rotating shaft and rotated together with the rotating shaft, and transmitted through a pressing plate that is held by the pressing member at a level at which the supporting member can move up and down, and a rebound spring that elastically presses the suction plate so as to face upward; and is configured to be formed by: The pressing member moves to move the suction plate downward, and the force of pressing the pressing member is released, and the suction plate is raised by the elastic pressure of the rebound spring. Return to the original location.
在本發明之吸附反轉裝置中,由於形成為一旦解除下壓構件之下壓力,則藉由回彈彈簧之彈壓力(復原力)而吸附板自然返回原位置,因此具有如下之效果:可省略用以使吸附板上升之機械性的機構,藉此可以簡單之構成、且低成本形成吸附板之升降機構。 In the adsorption reversal apparatus of the present invention, since the pressure of the rebound spring is restored to the original position by the elastic pressure (recovery force) of the rebound spring, the suction plate is naturally returned to the original position, and thus has the following effects: By omitting the mechanical mechanism for raising the suction plate, the lifting mechanism of the suction plate can be formed in a simple configuration and at low cost.
在上述發明中,較佳為:下壓構件,由具備有活塞之氣缸構成,且該活塞形成為在開啟動作(ON動作)下進行往下動、在關閉動作(OFF動作)下解除下壓力,並且可調整開啟動作(ON動作)時之下壓量。藉此,可根據基板之厚度等之作業條件,而適當地調整吸附板之下降量。 In the above invention, it is preferable that the pressing member is constituted by a cylinder including a piston, and the piston is formed to be moved downward in an opening operation (ON operation) and to be released in a closing operation (OFF operation). And can adjust the amount of pressure when the opening action (ON action). Thereby, the amount of drop of the adsorption plate can be appropriately adjusted in accordance with the working conditions such as the thickness of the substrate.
此外,在上述發明中,較佳為:用於對氣缸供給空氣之空氣流路設於旋轉軸內部,且連接有從空氣流路至氣缸之空氣流通用之配管。 Further, in the above invention, it is preferable that an air flow path for supplying air to the cylinder is provided inside the rotating shaft, and a pipe common to the air flow from the air flow path to the cylinder is connected.
藉此,在該吸附板反轉旋動時,與氣缸連接之配管不會扭結,並且可簡化與氣缸連接之配管設備。 Thereby, when the suction plate is reversely rotated, the pipe connected to the cylinder is not kinked, and the piping device connected to the cylinder can be simplified.
A‧‧‧基板加工裝置 A‧‧‧Substrate processing equipment
B‧‧‧刻劃裝置 B‧‧‧ scoring device
C‧‧‧吸附反轉裝置 C‧‧‧Adsorption reversal device
D‧‧‧吸附升降裝置 D‧‧‧Adsorption lifting device
W‧‧‧基板(脆性材料基板) W‧‧‧Substrate (brittle substrate)
14‧‧‧側架 14‧‧‧Side frame
15‧‧‧旋轉軸 15‧‧‧Rotary axis
15a‧‧‧空氣流路 15a‧‧‧Air flow path
16‧‧‧支持構件 16‧‧‧Support components
17‧‧‧下壓構件 17‧‧‧Compressed members
18‧‧‧吸附板 18‧‧‧Adsorption plate
19‧‧‧回彈彈簧 19‧‧‧Rebound spring
圖1,係表示裝入有本發明之吸附反轉裝置之基板加工裝置之整體構成的立體圖。 Fig. 1 is a perspective view showing the overall configuration of a substrate processing apparatus incorporating the adsorption reversal apparatus of the present invention.
圖2,係圖1之基板加工裝置中的刻劃裝置之概略性的前視圖。 Figure 2 is a schematic front elevational view of the scoring apparatus in the substrate processing apparatus of Figure 1.
圖3,係表示圖1之基板加工裝置中的吸附反轉裝置之整體構成的立體圖。 Fig. 3 is a perspective view showing the overall configuration of an adsorption reversal device in the substrate processing apparatus of Fig. 1.
圖4,係圖3之吸附反轉裝置之一部分放大剖面圖。 Figure 4 is a partially enlarged cross-sectional view showing the adsorption reversal device of Figure 3.
圖5,係表示圖3之吸附反轉裝置中的吸附板之往下動狀態之與圖4同 樣的剖面圖。 Figure 5 is a view showing the downward movement state of the adsorption plate in the adsorption reversal device of Figure 3, which is the same as Figure 4 A profile view.
圖6,係表示圖3之吸附反轉裝置之反轉旋動機構部分的側視圖。 Fig. 6 is a side view showing a portion of the reverse rotation mechanism of the adsorption reversing device of Fig. 3.
圖7,係表示圖1之基板加工裝置中的吸附升降裝置的立體圖。 Fig. 7 is a perspective view showing the adsorption lifting device in the substrate processing apparatus of Fig. 1.
圖8,係表示利用基板加工裝置之基板加工步驟之第1階段的說明圖。 Fig. 8 is an explanatory view showing a first stage of a substrate processing step by a substrate processing apparatus.
圖9,係表示基板加工步驟之第2階段的說明圖。 Fig. 9 is an explanatory view showing a second stage of the substrate processing step.
圖10,係表示基板加工步驟之第3階段的說明圖。 Fig. 10 is an explanatory view showing a third stage of the substrate processing step.
圖11,係表示基板加工步驟之第4階段的說明圖。 Fig. 11 is an explanatory view showing a fourth stage of the substrate processing step.
圖12,係表示基板加工步驟之第5階段的說明圖。 Fig. 12 is an explanatory view showing a fifth stage of the substrate processing step.
圖13,係表示基板加工步驟之第6階段的說明圖。 Fig. 13 is an explanatory view showing a sixth stage of the substrate processing step.
圖14,係表示基板加工步驟之第7階段的說明圖。 Fig. 14 is an explanatory view showing a seventh stage of the substrate processing step.
圖15,係表示基板加工步驟之第8階段的說明圖。 Fig. 15 is an explanatory view showing an eighth stage of the substrate processing step.
圖16,係表示基板加工步驟之第9階段的說明圖。 Fig. 16 is an explanatory view showing a ninth stage of the substrate processing step.
圖17,係表示基板加工步驟之第10階段的說明圖。 Fig. 17 is an explanatory view showing a tenth stage of the substrate processing step.
圖18,係表示基板加工步驟之第11階段的說明圖。 Fig. 18 is an explanatory view showing an eleventh stage of the substrate processing step.
圖19,係表示安裝於基板加工裝置之操作面板的圖式。 Fig. 19 is a view showing an operation panel mounted on a substrate processing apparatus.
圖20,係表示裝入於基板加工裝置之裂斷裝置的前視圖。 Fig. 20 is a front elevational view showing the breaking device incorporated in the substrate processing apparatus.
圖21,係表示吸附反轉裝置以及吸附升降裝置之連接各吸附板與空氣吸引裝置之空氣回路的圖式。 Fig. 21 is a view showing an air circuit in which the adsorption reversing device and the adsorption lifting device are connected to the respective adsorption plates and the air suction device.
以下,根據圖式針對本發明之吸附反轉裝置之細節進行說明。另外,在此處,根據利用裝入於對基板加工刻劃線、且於之後使基板反轉之基板加工裝置的吸附反轉裝置之實施例進行說明。 Hereinafter, details of the adsorption inversion apparatus of the present invention will be described based on the drawings. In addition, an example of an adsorption reversal apparatus incorporated in a substrate processing apparatus that performs scribe scribing on a substrate and then reverses the substrate will be described.
裝入有本發明之吸附反轉裝置的基板加工裝置A,如圖1所示,具備有於基板W之表面加工刻劃線的刻劃裝置B、使基板W反轉的吸附反轉裝置C、以及配置於刻劃裝置B之平台之上方且吸附基板W並使其升降的吸附升降裝置D。該等刻劃裝置B、吸附反轉裝置C以及吸附升降裝置D,裝入於基板加工裝置A之構架1。構架1,係由金屬製之架材以長方體之形態組裝成,且將在圖1之俯視觀察中沿著長邊方向之線設為X方向,將與X方向正交之方向設為Y方向而於以下進行說明。 As shown in FIG. 1, the substrate processing apparatus A incorporating the adsorption inversion apparatus of the present invention includes a scribing apparatus B for processing a scribe line on the surface of the substrate W, and an adsorption reversal apparatus C for reversing the substrate W. And an adsorption lifting device D disposed above the platform of the scoring device B and adsorbing and lifting the substrate W. The scribing device B, the adsorption reversing device C, and the adsorption lifting device D are incorporated in the frame 1 of the substrate processing apparatus A. The frame 1 is assembled in a rectangular parallelepiped shape from a metal frame material, and the line along the longitudinal direction in the plan view of FIG. 1 is set to the X direction, and the direction orthogonal to the X direction is set to the Y direction. This is explained below.
刻劃裝置B,如圖1、2所示,裝入於構架1內之沿著X方向之一端側(在本實施例中為圖1之右側),且具備有在台板2上沿著於Y方向延伸之軌條3進行移動之平台4。台板2,形成為在俯視觀察下於Y方向延伸之長方形,且其一端部分從構架1延伸出。平台4,具備於其上面具有多個吸附孔的吸附面4a,且成為可藉由內藏馬達之旋轉驅動部5而於水平面內旋動。此外,平台4以及旋轉驅動部5,安裝於沿著軌條3進行移動之移動載台6上,且形成為藉由利用馬達8進行旋轉之螺紋軸9而於Y方向進行移動。此外,將具有導引件10之樑(橫架)11沿著X方向設置於構架1,且將具有刀輪12之可升降的刻劃頭13以可於X方向移動之方式安裝於導引件10。 The scribing device B, as shown in FIGS. 1 and 2, is mounted on the one end side of the frame 1 in the X direction (in the present embodiment, the right side of FIG. 1), and is provided on the platen 2 along The rail 4 that extends in the Y direction moves the platform 4. The platen 2 is formed in a rectangular shape extending in the Y direction in a plan view, and one end portion thereof extends from the frame 1. The stage 4 is provided with an adsorption surface 4a having a plurality of adsorption holes on the upper surface thereof, and is rotatable in a horizontal plane by a rotation driving unit 5 of the built-in motor. Further, the stage 4 and the rotation drive unit 5 are attached to the movement stage 6 that moves along the rail 3, and are formed to move in the Y direction by the screw shaft 9 that is rotated by the motor 8. Further, a beam (cross frame) 11 having the guide member 10 is disposed on the frame 1 in the X direction, and the scribing head 13 having the liftable and lowering of the cutter wheel 12 is attached to the guide in a movable manner in the X direction. Item 10.
吸附反轉裝置C,如圖1、圖3~5所示,具備有由左右之側架14、14支持之於Y方向延伸之水平的旋轉軸15、水平地安裝於該旋轉軸15且與旋轉軸15一起進行旋轉之支持構件16、以及於該支持構件16透過複數個、在本實施例中為4個之下壓構件17支持成可上下動之水平的吸附板18。吸附板18具備於下面具有多個吸附孔之吸附面18a,且藉由回彈彈 簧19而隨時係朝向上方彈壓。在本實施例中作為上述之下壓構件17,係以具備有在開啟動作(ON動作)下往下動、在關閉動作(OFF動作)下解除下壓力之活塞的氣缸形成。藉由使該氣缸17開啟動作(ON動作),如圖5所示,使吸附板18以抵抗回彈彈簧19而往下動,且藉由使氣缸17關閉動作(OFF動作),形成為可藉由回彈彈簧19之復原力而使吸附板18返回圖4之原位置。此外,下壓構件17即氣缸之活塞17a,形成為可調整其突出行程。藉此,可根據基板W之厚度等之作業條件而適當地調整吸附板18之下降量。進一步地,旋轉軸15係以內部成為中空之管材形成,其內部形成作為用以從空氣供給源(圖示外)往該氣缸17供給空氣之空氣流路15a。從該空氣流路15a透過配管47而與各氣缸17連接。藉此,使得於吸附板18反轉旋動時與氣缸17連接之配管47不扭結。 As shown in FIGS. 1 and 3 to 5, the adsorption reversing device C includes a horizontal rotating shaft 15 supported by the left and right side frames 14 and 14 and horizontally attached to the rotating shaft 15 and The support member 16 that rotates the rotary shaft 15 together, and the support member 16 pass through a plurality of adsorption plates 18 that support the horizontally movable members 17 in the present embodiment. The adsorption plate 18 is provided with an adsorption surface 18a having a plurality of adsorption holes below, and by means of a rebound bomb The spring 19 is pressed upwards at any time. In the present embodiment, the lower pressure member 17 is formed by a cylinder including a piston that moves downward in an opening operation (ON operation) and a lower pressing force in a closing operation (OFF operation). When the cylinder 17 is opened (ON operation), as shown in FIG. 5, the suction plate 18 is moved downward against the rebound spring 19, and the cylinder 17 is closed (OFF operation) to be formed. The suction plate 18 is returned to the original position of Fig. 4 by the restoring force of the rebound spring 19. Further, the pressing member 17, that is, the piston 17a of the cylinder, is formed to be adjustable in its protruding stroke. Thereby, the amount of drop of the adsorption plate 18 can be appropriately adjusted in accordance with the working conditions such as the thickness of the substrate W. Further, the rotating shaft 15 is formed of a hollow pipe material inside, and an air flow path 15a for supplying air to the cylinder 17 from an air supply source (not shown) is formed inside. The air flow path 15a is connected to each of the air cylinders 17 through the pipe 47. Thereby, the pipe 47 connected to the cylinder 17 when the suction plate 18 is reversely rotated is not kinked.
吸附反轉裝置C之旋轉軸15,形成為可藉由反轉旋動機構42進行180度旋轉。該反轉旋動機構42,如圖6所示,於其一端部具備齒輪20,藉由利用汽缸22使嚙合於該齒輪20之齒條21驅動,形成為可180度旋轉。藉此,使得吸附板18之吸附面18a可從向下之姿勢反轉為向上之姿勢,此外相反地,可從向上之姿勢反轉為向下之姿勢。此外,如圖1所示,於在構架1之X方向延伸之上部架材1a,1a之上面設置有軌條23,23,於吸附反轉裝置C之側架14,14之上端部,設置有沿該軌條23,23進行滑動之導引部24,24。進一步地,用以使吸附反轉裝置C藉由手動而移動之把手25,以與一方之導引部24相連並往構架1之外側延伸之方式設置。藉此,形成為可藉由手動而使吸附板18從確保了可反轉之空間之構架1內之圖1中之左側亦即基板反轉位置,移動至刻劃裝置B之平台4之上方亦即基板 交付位置。 The rotating shaft 15 of the adsorption reversing device C is formed to be rotated by 180 degrees by the reverse rotation mechanism 42. As shown in FIG. 6, the reverse rotation mechanism 42 is provided with a gear 20 at one end thereof, and is driven by the cylinder 22 to mesh the rack 21 meshed with the gear 20 so as to be rotatable by 180 degrees. Thereby, the suction surface 18a of the suction plate 18 can be reversed from the downward posture to the upward posture, and conversely, it can be reversed from the upward posture to the downward posture. Further, as shown in FIG. 1, rails 23, 23 are provided on the upper surface of the frame members 1a, 1a extending in the X direction of the frame 1, and are disposed at the upper ends of the side frames 14, 14 of the adsorption reversing device C. There are guides 24, 24 that slide along the rails 23, 23. Further, the handle 25 for moving the adsorption reversing device C by hand is provided to be connected to one of the guide portions 24 and to extend to the outside of the frame 1. Thereby, it is formed that the suction plate 18 can be manually moved from the left side of the frame 1 in FIG. 1 in which the reversible space is secured, that is, the substrate reversal position, to the top of the platform 4 of the scoring device B. Substrate Delivery location.
進一步地,於橋架左右之側架14,14之上端之連結板26,設置有安裝於構架1之可出入之定位銷28,28卡入之卡合孔27。定位銷28,分別配置於上述之基板反轉位置與基板交付位置,而形成為在吸附反轉位置C來到基板反轉位置以及基板交付位置時,藉由位置偵測構件29進行偵測而自動地往卡合孔27卡入。作為定位銷28,例如可以藉由電磁鐵之ON/OFF(開啟/關閉)而進行出入之螺線管(solenoid)形成。此外,作為位置偵測構件29,可利用光感測器或限制開關(limit switch)等。 Further, the connecting plates 26 at the upper ends of the side frames 14 and 14 on the left and right sides of the bridge are provided with engaging holes 27 that are inserted into the frame 1 and into which the positioning pins 28 and 28 are inserted. The positioning pins 28 are respectively disposed at the substrate inversion position and the substrate delivery position, and are formed to be detected by the position detecting member 29 when the adsorption inversion position C reaches the substrate inversion position and the substrate delivery position. It is automatically snapped into the engaging hole 27. As the positioning pin 28, for example, a solenoid which is opened and closed by ON/OFF of the electromagnet can be formed. Further, as the position detecting member 29, a photo sensor or a limit switch or the like can be utilized.
吸附升降裝置D,如圖7所示,具備有固定於構架1之水平的固定板30、具有安裝於固定板30且朝向垂直下方進行往復運動之活塞31a的流體汽缸31、及固定於該流體汽缸31之活塞31a之下端的吸附板32。吸附板32,配置於上述之刻劃裝置B之平台4之上方,且於下面設置有具有多數個吸附孔之吸附面32a。此外,吸附板32,具備有從其上面往垂直上方延伸並可滑動地貫通固定板30之複數個導引件33。在本實施例中,導引件33以圓棒材形成,且於以流體汽缸31為中心之對稱位置以每2根為一對之方式,合計配置有4根。藉此,可在吸附板32進行升降時阻止自由旋轉,並且可更安定地保持吸附板32之水平姿勢。此外,導引件33之上端藉由連結構件33a相互地連結保持,而藉此可補強導引件33並保持垂直之立設姿勢,且可使吸附板32滑順地升降。 As shown in FIG. 7, the adsorption lifting device D includes a fixing plate 30 fixed to the horizontal direction of the frame 1, a fluid cylinder 31 having a piston 31a attached to the fixing plate 30 and reciprocating vertically downward, and a fluid cylinder 31 fixed to the fluid. The adsorption plate 32 at the lower end of the piston 31a of the cylinder 31. The adsorption plate 32 is disposed above the platform 4 of the above-described scoring device B, and has an adsorption surface 32a having a plurality of adsorption holes on the lower surface. Further, the suction plate 32 is provided with a plurality of guide members 33 extending from the upper surface thereof vertically upward and slidably penetrating the fixing plate 30. In the present embodiment, the guide member 33 is formed of a round bar material, and four of them are arranged in a total of two at a symmetrical position centered on the fluid cylinder 31. Thereby, the free rotation can be prevented when the adsorption plate 32 is lifted and lowered, and the horizontal posture of the adsorption plate 32 can be more stably maintained. Further, the upper ends of the guide members 33 are mutually coupled and held by the joint members 33a, whereby the guide members 33 can be reinforced and held in a vertical standing position, and the suction plate 32 can be smoothly raised and lowered.
在本實施例中,吸附反轉裝置C以及吸附升降機構D中之吸附板18,32之升降動作及真空動作、以及使吸附反轉裝置C之吸附板18反轉之反轉旋動機構42之驅動,處於可藉由利用按鈕開關之開關操作而以 手動進行。具體而言,如圖19所示,用以解除吸附反轉裝置C之定位銷28,28之鎖止的右側鎖止解除按鈕34以及左側鎖止解除按鈕35、為了在基板交付位置使吸附板18往下動而對下壓構件(氣缸)17進行ON/OFF操作的升降按鈕36、用以使吸附升降裝置D之流體汽缸31作動的操作按鈕37、以及驅動吸附反轉裝置C之反轉旋動機構42的反轉操作按鈕43,設置於安裝在基板加工裝置A之正面之操作面板38(在圖1中省略)。進一步地,吸附反轉裝置C之吸附板18之真空按鈕39、及吸附升降裝置D之吸附板32之真空按鈕40設置於上述操作面板38。 In the present embodiment, the adsorption reversing device C and the lifting operation and vacuum operation of the adsorption plates 18, 32 in the adsorption lifting mechanism D, and the reverse rotation mechanism 42 for reversing the adsorption plate 18 of the adsorption reversing device C are reversed. Driven by a switch operation using a push button switch Manually. Specifically, as shown in FIG. 19, the right side lock release button 34 and the left lock release button 35 for releasing the lock of the positioning pins 28, 28 of the suction reversing device C are provided for the suction plate at the substrate delivery position. The up/down button 36 that performs the ON/OFF operation of the lower pressing member (cylinder) 17 to move downward, the operation button 37 for actuating the fluid cylinder 31 of the adsorption lifting device D, and the reverse of the driving adsorption inversion device C The reverse operation button 43 of the turning mechanism 42 is provided on the operation panel 38 (omitted in FIG. 1) mounted on the front surface of the substrate processing apparatus A. Further, the vacuum button 39 of the adsorption plate 18 of the adsorption reversing device C and the vacuum button 40 of the adsorption plate 32 of the adsorption lifting device D are provided on the operation panel 38.
上述之刻劃裝置B之平台4、吸附反轉裝置C之吸附板18以及吸附升降裝置D之吸附板32之各吸附面4a、18a、32a之吸附孔,透過吸氣用之配管與採用真空泵之空氣吸引裝置(圖示外)連接,而形成可藉由吸引空氣吸附保持基板W。在圖1~7中,連接各吸附板之吸氣用之配管以及其附帶設備,為了避免圖式之複雜化而省略。吸附反轉裝置C之吸附板18與吸附升降裝置D之吸附板32,如圖21所示,形成為從同一空氣吸引裝置48經由配管49供給吸引空氣,而一旦按壓吸附板32之真空按鈕40則藉由切換閥(valve)50做切換。藉此,可謀求空氣吸引裝置之省力化、使往各吸附板之配管簡略化、以及基板加工裝置之成本降低,並且可僅以按壓真空按鈕40之一鍵(one-touch)操作進行吸引空氣之切換。 The adsorption hole of each of the adsorption surfaces 4a, 18a, and 32a of the platform 4 of the scoring device B, the adsorption plate 18 of the adsorption reversal device C, and the adsorption plate 32 of the adsorption lifting device D passes through the suction pipe and the vacuum pump. The air suction means (outside the figure) are connected to form a substrate W which can be held by suction air suction. In Figs. 1 to 7, the piping for suction for connecting the adsorption plates and the accompanying equipment are omitted in order to avoid complication of the drawings. As shown in FIG. 21, the adsorption plate 18 of the adsorption reversing device C and the adsorption plate 32 of the adsorption lifting device D are formed such that the suction air is supplied from the same air suction device 48 via the pipe 49, and once the vacuum button 40 of the adsorption plate 32 is pressed, Then, switching is performed by a switching valve 50. Thereby, labor saving of the air suction device, simplification of piping to the adsorption plates, and cost reduction of the substrate processing apparatus can be achieved, and the air can be sucked by only one-touch operation of pressing the vacuum button 40. Switching.
接著,針對藉由上述之基板加工裝置A,於單板之基板W之上面加工刻劃線之後,使該基板W反轉之步驟,利用圖1、圖8~19依序進行說明。在圖1中,於刻劃裝置B之平台4上所載置之基板W,處於其上面既已藉由刀輪12加工有刻劃線之狀態。利用刀輪12之刻劃加工,係藉 由使平台4移動至台板2之延伸端部而載置欲加工之基板W後,使平台4移行至刻劃頭13之位置,使刀輪12下降並使刀輪12或平台4相對地移動而進行。此外,藉由旋轉驅動部5使平台4旋轉90度,藉此可加工X-Y方向之刻劃線。 Next, the step of inverting the substrate W on the upper surface of the substrate W of the single substrate by the substrate processing apparatus A described above will be sequentially described with reference to FIGS. 1 and 8 to 19 . In Fig. 1, the substrate W placed on the stage 4 of the scribing device B is in a state in which the scribing wheel 12 has been machined with a score line. Using the knives of the cutter wheel 12, After the platform 4 is moved to the extended end of the platen 2 and the substrate W to be processed is placed, the platform 4 is moved to the position of the scribing head 13 to lower the cutter wheel 12 and the cutter wheel 12 or the platform 4 is oppositely Move and proceed. Further, the table 4 is rotated by 90 degrees by the rotation driving portion 5, whereby the scribe line in the X-Y direction can be processed.
於上面加工刻劃線並載置於平台4上之基板W,經由以下之步驟而表背面反轉。首先,對吸附反轉裝置C之左側之定位銷28之鎖,以操作左側鎖解除按鈕35而進行解除。然後,握持把手25並以手動方式如圖8、9所示使吸附板18移動至刻劃裝置B之平台4之上方、亦即基板交付位置。在該基板交付位置,利用位置感測構件29進行感測而自動地將右側之定位銷28卡入於卡合孔27,將吸附反轉裝置C之位置鎖止。 The substrate W which is scribed in the scribe line and placed on the stage 4 is reversed by the following steps. First, the lock of the positioning pin 28 on the left side of the adsorption reversing device C is released by operating the left lock release button 35. Then, the handle 25 is gripped and the suction plate 18 is moved manually above the platform 4 of the scoring device B, that is, the substrate delivery position, as shown in Figs. At the substrate delivery position, the position sensing member 29 senses and automatically engages the right positioning pin 28 in the engagement hole 27 to lock the position of the adsorption reversing device C.
接著,按壓升降按鈕36而使下壓構件17(參照圖5)作動,使吸附板18如圖10所示向下移動至與平台4之基板W接觸之位置。在該位置,按壓真空按鈕39而使基板W吸附於吸附板18。此時,由平台4之吸引空氣所產生之吸附力,藉由額外設置之平台用之吸附解除按鈕(圖示外),成為於按壓真空按鈕39之前解除、或與按壓該真空按鈕39之操作連動而解除。接著,再次按壓升降按鈕36而解除下壓構件17之下壓力。藉由該解除,吸附板18藉由回彈彈簧19之復原力而如圖11所示般返回原位置。 Next, the lift button 36 is pressed to actuate the pressing member 17 (see FIG. 5), and the suction plate 18 is moved downward to a position in contact with the substrate W of the stage 4 as shown in FIG. At this position, the vacuum button 39 is pressed to adsorb the substrate W to the adsorption plate 18. At this time, the suction force generated by the suction air of the stage 4 is released by the suction button (not shown) for the additional platform, and is released before the vacuum button 39 is pressed or pressed. Released in conjunction. Next, the lift button 36 is pressed again to release the pressure under the pressing member 17. By this release, the suction plate 18 returns to the original position as shown in FIG. 11 by the restoring force of the rebound spring 19.
接著,按壓右側鎖解除按鈕34而解除右側之定位銷28之鎖後,如圖12所示,以手動方式使吸附反轉裝置C移動至基板反轉位置。在該基板反轉位置,利用位置感測構件29進行感測而將左側之定位銷28卡入於卡合孔27,將吸附反轉裝置C之位置鎖止。在該位置,如圖13所示,按壓反轉操作按鈕43而使吸附板18反轉。 Next, after the right lock release button 34 is pressed to unlock the lock pin 28 on the right side, as shown in FIG. 12, the suction reversing device C is manually moved to the substrate inversion position. At the substrate inversion position, the position sensing member 29 senses, and the left positioning pin 28 is engaged with the engaging hole 27 to lock the position of the adsorption reversing device C. At this position, as shown in FIG. 13, the reverse operation button 43 is pressed to invert the suction plate 18.
在使吸附板18反轉後,按壓左側鎖解除按鈕35而解除鎖,以手動方式使吸附反轉裝置C移動至圖14之基板交付位置。之後,按壓吸附升降裝置D之操作按鈕37,如圖15所示,使吸附板32下降於吸附於吸附反轉裝置C之吸附板18的基板W上。在該狀態下,按壓真空按鈕40而使吸附空氣從吸附反轉裝置C之吸附板18切換成吸附升降裝置D之吸附板32,使基板W吸附於吸附板32後,按壓操作按鈕37而如圖16所示,使吸附升降裝置D之吸附板32上升,並且藉由上述之操作解除吸附反轉裝置C之鎖而使吸附反轉裝置C(吸附板18)返回基板反轉位置。 After the suction plate 18 is reversed, the left lock release button 35 is pressed to release the lock, and the adsorption reversal device C is manually moved to the substrate delivery position of FIG. Thereafter, the operation button 37 of the adsorption lifting device D is pressed, and as shown in FIG. 15, the adsorption plate 32 is lowered onto the substrate W adsorbed to the adsorption plate 18 of the adsorption reversal device C. In this state, the vacuum button 40 is pressed to switch the adsorbed air from the adsorption plate 18 of the adsorption reversing device C to the adsorption plate 32 of the adsorption lifting device D, and after the substrate W is adsorbed to the adsorption plate 32, the operation button 37 is pressed. As shown in Fig. 16, the adsorption plate 32 of the adsorption lifting device D is raised, and the lock of the adsorption inversion device C is released by the above operation, and the adsorption inversion device C (adsorption plate 18) is returned to the substrate inversion position.
接著,按壓操作按鈕37,如圖17所示,使吸附升降裝置D之吸附板32下降至刻劃裝置B之平台4上,按壓真空按鈕40而使吸附板32之吸附空氣關閉。藉此,於平台4交付基板W。之後,按壓操作按鈕37而如圖18所示,使吸附升降裝置D之吸附板32上升至原位置。此外,返回至反轉位置之吸附反轉裝置C之吸附板18,藉由按壓反轉操作按鈕43使其反轉成吸附面18a朝向下方而為了接下來的基板反轉作業使其待機。如此般經反轉之基板W,為了接下來的裂斷步驟而從平台4卸除。 Next, by pressing the operation button 37, as shown in Fig. 17, the suction plate 32 of the adsorption lifting device D is lowered onto the stage 4 of the scoring device B, and the vacuum button 40 is pressed to close the adsorption air of the adsorption plate 32. Thereby, the substrate W is delivered on the platform 4. Thereafter, the operation button 37 is pressed, and as shown in FIG. 18, the suction plate 32 of the adsorption lifting device D is raised to the original position. In addition, the suction plate 18 of the adsorption reversing device C that has returned to the reverse position is reversed so that the suction surface 18a faces downward, and the substrate reverses the operation for the next substrate inversion operation. The substrate W thus inverted is removed from the stage 4 for the next breaking step.
在上述之步驟中,吸附反轉裝置C之吸附板18,由於在來到基板反轉位置及基板交付位置時藉由定位銷28鎖止,因此可於已決定之位置確實地保持吸附板18。此外,在基板W之交付動作或反轉動作時,吸附板18不會左右晃動,而可以穩定之姿勢順利地進行。此外,吸附反轉裝置C之吸附板18,係從刻劃裝置B之平台4接受基板W之後,使其往基板反轉位置移動並反轉者,因此在從平台4接收基板W時,亦可僅抬起至不與平台4接觸之程度。因此,如圖3~5所示,作為使吸附板18升降之機構, 可以利用上下移動行程較小之下壓構件17、及在解除了下壓構件17之下壓力時使吸附板18返回原位置之回彈彈簧19之簡單之機構而呈小型化地形成。 In the above-described step, the adsorption plate 18 of the adsorption reversing device C is locked by the positioning pin 28 when it comes to the substrate inversion position and the substrate delivery position, so that the adsorption plate 18 can be surely held at the determined position. . Further, during the delivery operation or the reverse operation of the substrate W, the adsorption plate 18 does not shake left and right, and the stable posture can be smoothly performed. Further, the adsorption plate 18 of the adsorption reversing device C receives the substrate W from the stage 4 of the scribing device B, and then moves it to the substrate inversion position and reverses it. Therefore, when the substrate W is received from the stage 4, It can be lifted only to the extent that it does not come into contact with the platform 4. Therefore, as shown in FIGS. 3 to 5, as a mechanism for lifting and lowering the suction plate 18, The pressing member 17 having a small vertical movement stroke and a simple mechanism for returning the suction spring 18 to the original position when the pressure under the pressing member 17 is released can be formed in a small size.
在上述實施例中,為了反轉刻劃裝置B之平台4上之基板W,首先利用吸附反轉裝置C拾起平台4上之基板W並使其反轉後,將基板W往吸附升降裝置D交付並載置於平台4,但除了此順序之外,亦可首先利用吸附升降裝置D從平台4拾起基板W並往吸附反轉裝置C交付,使基板W反轉後,利用吸附反轉裝置C將基板W載置於平台4。 In the above embodiment, in order to reverse the substrate W on the platform 4 of the scribing device B, first, the substrate W on the stage 4 is picked up by the adsorption reversal device C and inverted, and then the substrate W is moved toward the adsorption lifting device. D is delivered and placed on the platform 4, but in addition to this sequence, the substrate W can be picked up from the platform 4 by the adsorption lifting device D and delivered to the adsorption reversal device C, and after the substrate W is inverted, the adsorption is reversed. The transfer device C mounts the substrate W on the stage 4.
此外,除了裝入於基板加工裝置A之刻劃裝置B之外,亦可如圖20所示,裝入具備有藉由汽缸44進行升降之板狀之裂斷桿45之裂斷裝置E。於該情形,將預先於上面加工有刻劃線之基板W,載置於具備有與上述之刻劃裝置B之平台4相同移動機構之平台4,藉由吸附反轉裝置C及吸附升降裝置D經由與上述之步驟相同順序,以刻劃線成為背面側之方式使基板W反轉並返回平台4。然後,使平台4移動至裂斷桿45之下方而將裂斷桿45按壓於基板W並使基板W撓曲,沿著刻劃線進行分斷。之後,使經分斷之基板W從平台4卸除。 Further, in addition to the scribing device B incorporated in the substrate processing apparatus A, as shown in FIG. 20, a breaking device E including a plate-shaped splitting bar 45 that is lifted and lowered by the cylinder 44 may be incorporated. In this case, the substrate W on which the score line is previously processed is placed on the stage 4 having the same moving mechanism as the stage 4 of the above-described scoring device B, by the adsorption reversal device C and the adsorption lifting device. D, in the same order as the above-described steps, inverts the substrate W and returns it to the stage 4 so that the scribe line becomes the back side. Then, the stage 4 is moved below the rupture rod 45, the rupture rod 45 is pressed against the substrate W, and the substrate W is deflected, and is broken along the scribe line. Thereafter, the divided substrate W is removed from the stage 4.
以上雖已針對本發明之代表性的實施例進行了說明,但本發明並不特別限定於上述之實施型態。例如,在上述實施例中,吸附反轉裝置C及吸附升降裝置D中之吸附板18、32之升降動作及真空動作、以及使吸附反轉裝置C之吸附板18反轉之反轉旋動機構42之驅動,雖以手動之方式藉由按鈕操作進行,但亦可構成為以自動之方式藉由電腦控制進行。此外在本發明中,在達成其目的、不脫離請求之範圍的範圍內,可進行適 當修正、變更。 Although the representative embodiments of the present invention have been described above, the present invention is not particularly limited to the above-described embodiments. For example, in the above embodiment, the lifting operation and the vacuum operation of the adsorption plates 18, 32 in the adsorption reversal device C and the adsorption lifting device D, and the reverse rotation of the adsorption plate 18 of the adsorption reversal device C are reversed. The driving of the mechanism 42 is manually performed by a button operation, but may be configured to be controlled by a computer in an automatic manner. Further, in the present invention, it is possible to carry out the appropriate range within the scope of achieving the purpose without departing from the scope of the request. When correcting or changing.
本發明係在對玻璃等之脆性材料基板進行刻劃加工或裂斷加工之基板加工裝置中,利用於使基板反轉之吸附反轉裝置。 The present invention is applied to a substrate processing apparatus for scribing or cracking a brittle material substrate such as glass, and is used in an adsorption inversion apparatus for reversing a substrate.
C‧‧‧吸附反轉裝置 C‧‧‧Adsorption reversal device
14‧‧‧側架 14‧‧‧Side frame
15‧‧‧旋轉軸 15‧‧‧Rotary axis
16‧‧‧支持構件 16‧‧‧Support components
17‧‧‧下壓構件 17‧‧‧Compressed members
18‧‧‧吸附板 18‧‧‧Adsorption plate
18a‧‧‧吸附面 18a‧‧‧Adsorption surface
19‧‧‧回彈彈簧 19‧‧‧Rebound spring
24‧‧‧導引部 24‧‧‧ Guidance Department
25‧‧‧把手 25‧‧‧Hands
26‧‧‧連結板 26‧‧‧Link board
27‧‧‧卡合孔 27‧‧‧Snap hole
42‧‧‧反轉旋動機構 42‧‧‧Reverse rotation mechanism
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013001466A JP2014135332A (en) | 2013-01-09 | 2013-01-09 | Suction turnover device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201427805A true TW201427805A (en) | 2014-07-16 |
Family
ID=51036258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102129107A TW201427805A (en) | 2013-01-09 | 2013-08-14 | Adsorption reversal device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014135332A (en) |
| KR (1) | KR20140090934A (en) |
| CN (1) | CN103910196A (en) |
| TW (1) | TW201427805A (en) |
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|---|---|---|---|---|
| TWI613057B (en) * | 2015-11-20 | 2018-02-01 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate breaking device |
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| CN107622967B (en) * | 2017-11-02 | 2023-09-22 | 湖南艾博特机器人技术有限公司 | A kind of photovoltaic silicon crystal cell flower basket output posture changing mechanism |
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| CN109230414B (en) * | 2018-09-26 | 2024-04-02 | 江苏毅昌科技有限公司 | Television module overturning equipment |
| WO2020082232A1 (en) | 2018-10-23 | 2020-04-30 | Yangtze Memory Technologies Co., Ltd. | Semiconductor device flipping apparatus |
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| KR102216018B1 (en) * | 2020-10-30 | 2021-02-15 | 송순국 | Turn around device for compact disk case |
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- 2013-08-14 TW TW102129107A patent/TW201427805A/en unknown
- 2013-10-29 CN CN201310522744.5A patent/CN103910196A/en active Pending
- 2013-12-06 KR KR1020130151220A patent/KR20140090934A/en not_active Ceased
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| TWI613057B (en) * | 2015-11-20 | 2018-02-01 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate breaking device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140090934A (en) | 2014-07-18 |
| CN103910196A (en) | 2014-07-09 |
| JP2014135332A (en) | 2014-07-24 |
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