TW201427586A - Shielding composite diaphragm - Google Patents
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- TW201427586A TW201427586A TW101149188A TW101149188A TW201427586A TW 201427586 A TW201427586 A TW 201427586A TW 101149188 A TW101149188 A TW 101149188A TW 101149188 A TW101149188 A TW 101149188A TW 201427586 A TW201427586 A TW 201427586A
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- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 230000005291 magnetic effect Effects 0.000 claims description 89
- 239000010410 layer Substances 0.000 claims description 57
- 239000012790 adhesive layer Substances 0.000 claims description 38
- 239000011258 core-shell material Substances 0.000 claims description 31
- 239000000696 magnetic material Substances 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract 3
- 239000006247 magnetic powder Substances 0.000 description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910000859 α-Fe Inorganic materials 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000035699 permeability Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910017052 cobalt Inorganic materials 0.000 description 6
- 239000010941 cobalt Substances 0.000 description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 6
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- 230000005855 radiation Effects 0.000 description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
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- 238000002955 isolation Methods 0.000 description 4
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- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
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- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 1
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- 230000036541 health Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
本揭露係關於一種膜片，特別是一種屏蔽複合膜片。 The present disclosure relates to a diaphragm, particularly a shielded composite diaphragm.
電子裝置(如電視、無線電、電腦、醫療儀器、商業機器、通信設備及類似物)之操作，係伴隨電子裝置之電子電路的電磁輻射之產生而進行，其可能會輻射至電子裝置中的其它元件並且對其產生干擾。此輻射通常發展為電磁頻譜之射頻波段(即介於約10KHz與10GHz之間)範圍內的暫態，且被稱為電磁干擾(EMI)。 The operation of electronic devices (such as televisions, radios, computers, medical instruments, business machines, communication devices, and the like) is carried out with the generation of electromagnetic radiation from electronic circuits of electronic devices, which may radiate to other devices in the electronic device. The component is interfering with it. This radiation typically develops transients in the RF band of the electromagnetic spectrum (ie, between about 10 KHz and 10 GHz) and is known as electromagnetic interference (EMI).
在常態作業中，電子裝置會產生因以輻射和傳導方式放出之電磁能而影響鄰近電子裝置干擾傳輸，此電磁干擾(EMI)可能會造成重要信號的衰降或完全損失，從而使得電子裝置效率不彰或無法運作。 In normal operation, the electronic device generates electromagnetic energy emitted by radiation and conduction, which affects the adjacent electronic device to interfere with transmission. This electromagnetic interference (EMI) may cause the attenuation or complete loss of important signals, thereby making the electronic device efficient. Not working or not working.
隨著電子裝置不斷朝向輕量化、可撓曲、高效能及低成本發展，唯有高頻化驅動電路設計得以滿足產品之輕薄短小需求，但高密度模組或元件封裝技術，使功率或傳輸元件極易產生高頻電磁干擾問題，此電磁干擾除了會影響到其它模組功能安全運作之外，更嚴重時甚至會危害人體健康。 As electronic devices continue to move toward lightweight, flexible, high-performance and low-cost development, only high-frequency drive circuits are designed to meet the light, thin, and short-term needs of products, but high-density modules or component packaging technologies enable power or transmission. Components are prone to high-frequency electromagnetic interference problems. In addition to affecting the safe operation of other modules, this electromagnetic interference may even endanger human health.
因此，為減弱電磁干擾(EMI)之影響，降低電磁干擾(EMI)的不利效應，電子裝置可採用能吸收或反射電磁干擾(EMI)能量的屏蔽，以將電磁干擾(EMI)能量侷限於一裝置內，以使此裝置與其他裝置絕緣。此屏蔽被提供作為介於電子裝置與其他裝置之間的一障壁，且通常組態為一外罩或覆蓋於電子裝置中之電子元件外表 面的一屏蔽層。目前常用的電磁干擾(EMI)屏蔽膜片，主要以電場屏蔽為主，其絕緣層不具任何其它功能，且電性壓合接著時容易分層脫落。 Therefore, in order to reduce the influence of electromagnetic interference (EMI) and reduce the adverse effects of electromagnetic interference (EMI), the electronic device may use a shield capable of absorbing or reflecting electromagnetic interference (EMI) energy to limit electromagnetic interference (EMI) energy to one. Inside the device to insulate the device from other devices. The shield is provided as a barrier between the electronic device and the other device, and is usually configured as a housing or an electronic component covering the electronic device. a shield of the surface. At present, the commonly used electromagnetic interference (EMI) shielding diaphragm is mainly composed of electric field shielding, and its insulating layer does not have any other functions, and the electrical pressing is easy to delaminate.
本揭露提出一種屏蔽複合膜片，藉由多個導磁凸塊配置於導磁層上的結構可有效抑制電路間傳導或輻射等電磁雜訊，提升電路動作之穩定性 The present disclosure provides a shielded composite diaphragm. The structure in which a plurality of magnetically conductive bumps are disposed on the magnetic conductive layer can effectively suppress electromagnetic noise such as conduction or radiation between circuits, thereby improving the stability of the circuit operation.
根據本揭露實施例所揭露之一種屏蔽複合膜片，屏蔽複合膜片包括有一導磁層、多個導磁凸塊、一導體層以及一導電膠層。多個導磁凸塊配置於導磁層上。導體層配置於導磁凸塊上。導體層介於這些導磁凸塊與導電膠層之間，導磁層、導電膠層與這些導磁凸塊之底部之間形成多個彼此相連通的孔隙。。 According to an embodiment of the present disclosure, a shielded composite film includes a magnetic conductive layer, a plurality of magnetic conductive bumps, a conductive layer, and a conductive adhesive layer. A plurality of magnetic conductive bumps are disposed on the magnetic conductive layer. The conductor layer is disposed on the magnetic conductive bump. The conductor layer is interposed between the magnetic conductive bumps and the conductive adhesive layer, and the magnetic conductive layer, the conductive adhesive layer and the bottoms of the magnetic conductive bumps form a plurality of pores communicating with each other. .
根據本揭露實施例所揭露之一種屏蔽複合膜片，屏蔽複合膜片包括有一導磁核殼層以及多個導磁核殼凸塊。多個導磁核殼凸塊配置於導磁核殼層。 According to an embodiment of the present disclosure, a shielded composite diaphragm includes a magnetic core shell and a plurality of magnetic core shell bumps. A plurality of magnetic core-core bumps are disposed on the magnetic core shell.
本揭露在於提出一種屏蔽複合膜片，主要在導磁層上具有導磁凸塊的結構或是在導磁核殼層上配置多個導磁核殼凸塊，可增加電場屏蔽有效面積及深度，使電磁波產生多次反射，以提升整體電磁干擾(EMI)隔離屏蔽效能。另外，導電膠層與導體層之間或指導電膠層與導磁核殼層之間的空隙具透氣性，亦可減少導電膠層與軟板間因熱壓接合時，因內部氣體膨脹所引起的分層脫落現象，提升結構穩定性。 The disclosure is to provide a shielding composite film, which mainly has a structure of a magnetic conductive bump on the magnetic conductive layer or a plurality of magnetic conductive core-shell bumps on the magnetic conductive core shell, which can increase the effective area and depth of the electric field shielding. The electromagnetic wave is repeatedly reflected to improve the overall electromagnetic interference (EMI) isolation shielding effectiveness. In addition, the gap between the conductive adhesive layer and the conductor layer or between the conductive adhesive layer and the magnetic conductive core shell is breathable, and the internal gas expansion is also reduced when the conductive adhesive layer and the soft plate are joined by thermocompression. The resulting delamination phenomenon improves structural stability.
以上之關於本揭露內容之說明及以下之實施方式之說明係用 以示範與解釋本揭露之精神與原理，並且提供本揭露之專利申請範圍更進一步之解釋。 The above description of the disclosure and the following description of the embodiments are used The spirit and principles of the present disclosure are illustrated and explained, and a further explanation of the scope of the patent application of the present disclosure is provided.
以下在實施方式中詳細敘述本揭露之詳細特徵以及優點，其內容足以使任何熟習相關技藝者了解本揭露之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本揭露相關之目的及優點。以下之實施例係進一步詳細說明本揭露之觀點，但非以任何觀點限制本揭露之範疇。 The detailed features and advantages of the present disclosure are described in detail in the following detailed description of the embodiments of the present disclosure, which are The objects and advantages associated with the present disclosure can be readily understood by those skilled in the art. The following examples are intended to further illustrate the present disclosure, but are not intended to limit the scope of the disclosure.
請參考『第1圖』，係為本揭露所揭露之一種屏蔽複合膜片100的示意圖。本實施例為一屏蔽複合膜片100，屏蔽複合膜片100包括有導磁層101、多個導磁凸塊102、導體層103以及導電膠層104。 Please refer to FIG. 1 , which is a schematic diagram of a shielded composite diaphragm 100 disclosed in the present disclosure. This embodiment is a shielded composite film 100. The shielded composite film 100 includes a magnetic conductive layer 101, a plurality of magnetic conductive bumps 102, a conductive layer 103, and a conductive adhesive layer 104.
多個導磁凸塊102配置於導磁層101上，導磁凸塊102可為錐形體、矩形體、柱形體及上述任意組合所構成的群組其中之一。導體層103配置於導磁凸塊102上。 The plurality of magnetic conductive bumps 102 are disposed on the magnetic conductive layer 101, and the magnetic conductive bumps 102 may be one of a group consisting of a cone, a rectangular body, a cylindrical body, and any combination thereof. The conductor layer 103 is disposed on the magnetic conductive bumps 102.
請繼續參考『第1圖』，屏蔽複合膜片100更包括有一導電膠層104，導電膠層104為異向或同向導電膠層104。導體層103則介於導磁凸塊102與導電膠層104之間。屏蔽複合膜片100中導電膠層104與導磁凸塊102之底部之間形成多個彼此相連通的孔隙。 Continuing to refer to FIG. 1 , the shielding composite film 100 further includes a conductive adhesive layer 104 , and the conductive adhesive layer 104 is an anisotropic or co-directional conductive adhesive layer 104 . The conductor layer 103 is interposed between the magnetic conductive bumps 102 and the conductive adhesive layer 104. A plurality of pores communicating with each other are formed between the conductive adhesive layer 104 of the shield composite film 100 and the bottom of the magnetic conductive bumps 102.
其中，導磁凸塊102之高度，即從導磁層101的表面至導磁凸塊102最高點的高度，一般為導磁層101厚度的2%-50%。導磁 層101包含磁粉及高分子樹脂，成分比例可為磁粉100-70wt%及高分子樹脂0-30wt%或磁粉100-80 wt%及高分子樹脂0-20 wt%。另外，磁粉的平均粒徑為0.5-25um。導磁層101的厚度範圍可為0.02-0.7mm或0.05-0.3mm，其厚度大小與製作時刮刀法成形生胚有關。導磁層101為單層、多層等結構及上述任意組合所構成的群組其中之一，而導體層103為金、銀、銅、鋁及上述任意組合所構成的群組其中之一。導體層103的厚度範圍為20-750nm或75-450nm。 The height of the magnetic conductive bumps 102, that is, the height from the surface of the magnetic conductive layer 101 to the highest point of the magnetic conductive bumps 102 is generally 2% to 50% of the thickness of the magnetic conductive layer 101. Magnetic conduction The layer 101 comprises magnetic powder and a polymer resin, and the composition ratio may be 100-70 wt% of the magnetic powder, 0-30 wt% of the polymer resin or 100-80 wt% of the magnetic powder and 0-20 wt% of the polymer resin. Further, the magnetic powder has an average particle diameter of 0.5 to 25 um. The thickness of the magnetic permeability layer 101 may range from 0.02 to 0.7 mm or from 0.05 to 0.3 mm, and the thickness thereof is related to the blade forming of the green body at the time of manufacture. The magnetic conductive layer 101 is one of a group consisting of a single layer, a multilayer, and the like, and any combination of the above, and the conductor layer 103 is one of a group consisting of gold, silver, copper, aluminum, and any combination thereof. The thickness of the conductor layer 103 ranges from 20 to 750 nm or from 75 to 450 nm.
導磁層101中的磁粉，可包含以下成分：磁粉為MOFe2O3鐵氧磁體時，其中M為錳、鈷、鎳、銅、鋅、鎂、鐵及上述任意組合所構成的群組其中之一磁粉為MFe12O19鐵氧磁體時，其中M為鋇、鍶及上述任意組合所構成的群組其中之一。磁粉為Ba2M2Fe12O22鐵氧磁體時，其中M為錳、鈷、鎳、銅、鋅、鎂及上述任意組合所構成的群組其中之一磁粉為Fe-X合金時，其中X為錳、鈷、鎳、鋁、矽、鉻及上述任意組合所構成的群組其中之一。磁粉可為MOFe2O3、Ba2M2Fe12O22鐵氧磁體、Fe-X合金及金、銀、銅、鋁等導體及上述任意組合所構成的群組其中之一。 The magnetic powder in the magnetic permeability layer 101 may include the following components: when the magnetic powder is an MOFe 2 O 3 ferrite magnet, wherein M is a group consisting of manganese, cobalt, nickel, copper, zinc, magnesium, iron, and any combination thereof. When one of the magnetic powders is an MFe 12 O 19 ferrite magnet, M is one of a group consisting of 钡, 锶 and any combination of the above. When the magnetic powder is a Ba 2 M 2 Fe 12 O 22 ferrite magnet, wherein M is manganese, cobalt, nickel, copper, zinc, magnesium, and any combination of the above, one of the magnetic powders is an Fe-X alloy, wherein X is one of a group consisting of manganese, cobalt, nickel, aluminum, lanthanum, chromium, and any combination thereof. The magnetic powder may be one of a group consisting of MOFe 2 O 3 , Ba 2 M 2 Fe 12 O 22 ferrite magnet, Fe-X alloy, and conductors of gold, silver, copper, aluminum, and the like, and any combination thereof.
請繼續參考『第1圖』，本揭露係提供一種屏蔽複合膜片100，其兼具電磁干擾(EMI)屏蔽及吸收之功能，此結構之形成方式，主要在導磁層101表面施以角錐狀序化結構的導磁凸塊102，接著濺鍍奈米級厚之角錐型導體層103於導磁凸塊102上，並塗佈導電膠層104提供接地抑制雜訊等用途。此屏蔽複合膜片100之優勢在於此特定角錐面可增加屏蔽有效面積及深度，使電磁波產生多 次反射，其導磁層101更可屏蔽高頻磁場，以提升整體EMI隔離屏蔽效能。此導電膠層104與導磁凸塊102之底部之間形成多個彼此相連通的孔隙，亦可增加導電膠層104接著性以減少因熱壓接合時，內部氣體膨脹所引起的分離脫落問題，提升結構穩定性。 Please refer to FIG. 1 again. The present disclosure provides a shielded composite diaphragm 100 which has the functions of electromagnetic interference (EMI) shielding and absorption. The structure is formed by applying a pyramid on the surface of the magnetic conductive layer 101. The magnetically conductive bumps 102 of the sequenced structure are then sputtered with a nano-thick pyramidal conductor layer 103 on the magnetically conductive bumps 102, and coated with a conductive adhesive layer 104 to provide grounding suppression noise and the like. The advantage of the shielded composite diaphragm 100 is that the specific pyramid surface can increase the effective area and depth of the shield, resulting in more electromagnetic waves. The secondary reflection, the magnetic permeability layer 101 can shield the high frequency magnetic field to improve the overall EMI isolation shielding effectiveness. A plurality of pores communicating with each other are formed between the conductive adhesive layer 104 and the bottom of the magnetic conductive bumps 102, and the adhesion of the conductive adhesive layer 104 may be increased to reduce separation and separation caused by internal gas expansion during thermocompression bonding. Improve structural stability.
請參考『第2圖』，係為本揭露所揭露之一種屏蔽複合膜片200的示意圖。本實施例為一屏蔽複合膜片200，屏蔽複合膜片200包括有導磁核殼層201以及導磁核殼凸塊202。 Please refer to FIG. 2 , which is a schematic diagram of a shielded composite diaphragm 200 disclosed in the present disclosure. This embodiment is a shielded composite diaphragm 200. The shielded composite diaphragm 200 includes a magnetic core shell layer 201 and a magnetic core shell bump 202.
導磁核殼凸塊202配置於導磁核殼層201，導磁核殼凸塊202為錐形體、矩形體、柱形體及上述任意組合所構成的群組其中之一。其中導磁核殼層201以及導磁核殼凸塊202由複數個導磁核殼20構成，每一導磁核殼20包括一磁性物21以及一導體層22，導體層22包覆磁性物21。 The magnetic core-core bump 202 is disposed on the magnetic core shell 201, and the magnetic core-core bump 202 is one of a group consisting of a cone, a rectangle, a cylinder, and any combination thereof. The magnetic core shell layer 201 and the magnetic core shell bump 202 are composed of a plurality of magnetic core shells 20, each of the magnetic core shells 20 includes a magnetic material 21 and a conductor layer 22, and the conductor layer 22 covers the magnetic material. twenty one.
請繼續參考『第2圖』，屏蔽複合膜片200更包括有一導電膠層204，導電膠層204為異向或同向導電膠層204。導電膠層204位於導磁核殼層201之導磁核殼凸塊202上，屏蔽複合膜片200中導電膠層204與導磁核殼凸塊202之底部之間形成多個彼此相連通的孔隙。 Continuing to refer to FIG. 2, the shield composite film 200 further includes a conductive adhesive layer 204. The conductive adhesive layer 204 is an anisotropic or co-conductive adhesive layer 204. The conductive adhesive layer 204 is located on the magnetic core shell bump 202 of the magnetic core shell 201, and a plurality of conductive adhesive layers 204 and the bottom of the magnetic core shell bump 202 are formed in the shield composite film 200. Porosity.
其中，磁性物21包含磁粉及高分子樹脂，成分比例可為磁粉100-70wt%及高分子樹脂0-30wt%或磁粉100-80 wt%及高分子樹脂0-20 wt%。導體層22為金、銀、銅、鋁及上述任意組合所構成的群組其中之一。 The magnetic substance 21 comprises magnetic powder and a polymer resin, and the composition ratio may be 100-70 wt% of the magnetic powder, 0-30 wt% of the polymer resin or 100-80 wt% of the magnetic powder, and 0-20 wt% of the polymer resin. The conductor layer 22 is one of a group consisting of gold, silver, copper, aluminum, and any combination of the above.
磁性物21中的磁粉，可包含以下成分：磁粉為MOFe2O3鐵氧磁體時，其中M為錳、鈷、鎳、銅、鋅、鎂、鐵及上述任意組合 所構成的群組其中之一。磁粉為MFe12O19鐵氧磁體時，其中M為鋇、鍶及上述任意組合所構成的群組其中之一。磁粉為Ba2M2Fe12O22鐵氧磁體時，其中M為錳、鈷、鎳、銅、鋅、鎂及上述任意組合所構成的群組其中之一磁粉為Fe-X合金，其中X為錳、鈷、鎳、鋁、矽、鉻及上述任意組合所構成的群組其中之一。磁粉可為MOFe2O3、Ba2M2Fe12O22鐵氧磁體、Fe-X合金及金、銀、銅、鋁等導體及上述任意組合所構成的群組其中之一。 The magnetic powder in the magnetic material 21 may include the following components: when the magnetic powder is an MOFe 2 O 3 ferrite magnet, wherein M is a group consisting of manganese, cobalt, nickel, copper, zinc, magnesium, iron, and any combination thereof. One. When the magnetic powder is an MFe 12 O 19 ferrite magnet, M is one of a group consisting of 钡, 锶 and any combination of the above. When the magnetic powder is a Ba 2 M 2 Fe 12 O 22 ferrite magnet, one of the group consisting of manganese, cobalt, nickel, copper, zinc, magnesium and any combination thereof is a Fe-X alloy, wherein X It is one of a group consisting of manganese, cobalt, nickel, aluminum, lanthanum, chromium and any combination of the above. The magnetic powder may be one of a group consisting of MOFe 2 O 3 , Ba 2 M 2 Fe 12 O 22 ferrite magnet, Fe-X alloy, and conductors of gold, silver, copper, aluminum, and the like, and any combination thereof.
請繼續參考『第2圖』，本揭露係提供一種屏蔽複合膜片200，其兼具電磁干擾(EMI)屏蔽及吸收之功能，此結構之形成方式，主要在導磁核殼層201表面施以角錐狀序化結構的導磁核殼凸塊202，接著塗佈導電膠層204提供接地抑制雜訊等用途。此屏蔽複合膜片200之優勢在於此特定角錐面可增加屏蔽有效面積及深度，使電磁波產生多次反射，其導磁核殼層201更可完全屏蔽高頻磁場，以提升整體電磁干擾(EMI)隔離屏蔽效能。此角錐面亦可增加導電膠層204接著性以減少因熱壓接合時，內部氣體膨脹所引起的分離脫落問題，提升結構穩定性。 Please continue to refer to "Fig. 2". The present disclosure provides a shielded composite diaphragm 200 which has both electromagnetic interference (EMI) shielding and absorption functions. The formation of this structure is mainly applied to the surface of the magnetic core shell 201. The conductive core shell bump 202 of the pyramidal structure is sequentially coated with a conductive adhesive layer 204 to provide grounding suppression noise and the like. The advantage of the shielded composite diaphragm 200 is that the specific pyramid surface can increase the effective area and depth of the shield, so that the electromagnetic wave generates multiple reflections, and the magnetic core shell 201 can completely shield the high frequency magnetic field to improve the overall electromagnetic interference (EMI). ) Isolation of shielding effectiveness. The pyramidal surface can also increase the adhesion of the conductive adhesive layer 204 to reduce the separation and shedding problem caused by the expansion of the internal gas during the thermocompression bonding, thereby improving the structural stability.
請參考『第3圖』，係為本揭露之電磁強度測試圖。本實施例請參考『第1圖』，其中以甲苯或正丁醇等有機溶劑與NiCuZn鐵氧磁粉(Ferrite)混合16-20hr，再利用刮刀成型製作生胚，胚體經過80℃/30min烘乾，此鐵氧磁粉(Ferrite)導磁率為120。導磁層101厚度為0.63mm，並將角錐狀序化結構(底面積1×1mm2，高45um)轉印至導磁層101之表面，形成一連續高低起伏面。之後再以濺鍍方式於導磁凸塊102之角錐表面鍍上導體層103(厚度0.73um)。 再覆蓋導電膠層104即可進行電磁波輻射測試。測試結果如『第3圖』所示，趨勢線A為一般平面型導體層，趨勢線B為具角錐型的屏蔽複合膜片100。由『第3圖』可知具角錐型的屏蔽複合膜片100之輻射損失平均值比平面型導體層低約8-12 dBuv。以700MHz頻率來說，角錐型的屏蔽複合膜片100能因電場屏蔽面積及深度增加而使屏蔽效能提升約12 dBuv，且導磁層101更有助於屏蔽高頻磁場，故此屏蔽複合膜片100有助於提升電磁屏蔽及抑制雜訊之能力。 Please refer to "Fig. 3" for the electromagnetic strength test chart of this disclosure. For the present embodiment, please refer to "Fig. 1", in which an organic solvent such as toluene or n-butanol is mixed with NiCuZn ferrite powder (Ferrite) for 16-20 hr, and then a green sheet is formed by a doctor blade, and the embryo body is baked at 80 ° C / 30 min. Dry, this ferrite magnetic permeability (Ferrite) permeability is 120. The magnetic conductive layer 101 has a thickness of 0.63 mm, and the pyramidal-like structure (bottom area 1 × 1 mm 2 , height 45 μm) is transferred to the surface of the magnetic conductive layer 101 to form a continuous high and low undulating surface. Thereafter, the conductor layer 103 (thickness 0.73 um) is plated on the pyramidal surface of the magnetic conductive bump 102 by sputtering. The conductive adhesive layer 104 is covered to perform electromagnetic wave radiation test. The test results are shown in Fig. 3, the trend line A is a general planar conductor layer, and the trend line B is a shielded composite diaphragm 100 having a pyramid shape. It can be seen from Fig. 3 that the average value of the radiation loss of the shielded composite diaphragm 100 having a pyramid shape is about 8-12 dBuv lower than that of the planar conductor layer. At 700MHz, the pyramidal shield composite diaphragm 100 can increase the shielding effectiveness by about 12 dBuv due to the increase of the electric field shielding area and depth, and the magnetic permeability layer 101 is more conducive to shielding the high-frequency magnetic field, so the shielded composite diaphragm 100 helps improve electromagnetic shielding and the ability to suppress noise.
請參考『第4圖』，係為本揭露之另一電磁強度測試圖。本實施例請參考『第4圖』，其中此實施例主要將鐵基金屬粉製作成薄層生胚(EW0201)，控制適當的鐵基粉及有機溶劑比例(62.5/37.5wt%)，胚體再經過80℃/30min烘乾，經堆疊後導磁層101厚度控制為0.3mm，將導磁凸塊102之角錐狀規則陣列(底面積1×1mm2，高45um)轉印到鐵基生胚表面。以濺鍍法於導磁凸塊102表面批覆導體層103(厚度：0.2um)。測試結果如『第4圖』所示，趨勢線C為一般平面型導體層，趨勢線D為具角錐型的屏蔽複合膜片100。實施例結果發現具角錐型導體層之鐵基金屬系的屏蔽複合膜片100的屏蔽效果於0.8-1GHz頻段時效應較為顯著，其屏蔽效能可提升達5-8dBuv值。 Please refer to Figure 4 for another electromagnetic strength test chart of this disclosure. For the present embodiment, please refer to "Fig. 4". In this embodiment, the iron-based metal powder is mainly made into a thin layer of green embryo (EW0201), and the proportion of the appropriate iron-based powder and organic solvent (62.5/37.5 wt%) is controlled. The body is further dried at 80 ° C / 30 min. After stacking, the thickness of the magnetic conductive layer 101 is controlled to 0.3 mm, and the regular pyramidal array of the magnetic conductive bumps 102 (bottom area 1 × 1 mm 2 , height 45 μm) is transferred to the iron base. Embryo surface. The conductor layer 103 (thickness: 0.2 um) was overlaid on the surface of the magnetic conductive bump 102 by sputtering. The test results are shown in Fig. 4, the trend line C is a general planar conductor layer, and the trend line D is a pyramidal type shielded composite diaphragm 100. The results of the embodiment show that the shielding effect of the iron-based metal-based shielded composite film 100 having a pyramidal conductor layer is more effective in the 0.8-1 GHz band, and the shielding effectiveness can be improved by 5-8 dBuv.
本揭露在於提出一種屏蔽複合膜片，主要在導磁層上具有導磁凸塊的結構或是在導磁核殼層上配置多個導磁核殼凸塊，可增加電場屏蔽有效面積及深度，使電磁波產生多次反射，以提升整體電磁干擾(EMI)隔離屏蔽效能。另外，導電膠層與導體層之間或 指導電膠層與導磁核殼層之間的空隙具透氣性，亦可減少導電膠層與軟板間因熱壓接合時，因內部氣體膨脹所引起的分層脫落現象，提升結構穩定性。 The disclosure is to provide a shielding composite film, which mainly has a structure of a magnetic conductive bump on the magnetic conductive layer or a plurality of magnetic conductive core-shell bumps on the magnetic conductive core shell, which can increase the effective area and depth of the electric field shielding. The electromagnetic wave is repeatedly reflected to improve the overall electromagnetic interference (EMI) isolation shielding effectiveness. In addition, between the conductive adhesive layer and the conductor layer or It guides the air gap between the electro-adhesive layer and the magnetic core shell to have gas permeability, and can also reduce the delamination phenomenon caused by the internal gas expansion when the conductive adhesive layer and the soft board are joined by hot pressing, thereby improving the structural stability. .
雖然本揭露以前述之實施例揭露如上，然其並非用以限定本揭露。在不脫離本揭露之精神和範圍內，所為之更動與潤飾，均屬本揭露之專利保護範圍。關於本揭露所界定之保護範圍請參考所附之申請專利範圍。 Although the disclosure is disclosed above in the foregoing embodiments, it is not intended to limit the disclosure. All changes and refinements are beyond the scope of this disclosure. Please refer to the attached patent application for the scope of protection defined by this disclosure.
100‧‧‧屏蔽複合膜片 100‧‧‧Shield composite diaphragm
101‧‧‧導磁層 101‧‧‧ magnetically conductive layer
102‧‧‧導磁凸塊 102‧‧‧Magnetic bumps
103‧‧‧導體層 103‧‧‧Conductor layer
104‧‧‧導電膠層 104‧‧‧ Conductive adhesive layer
200‧‧‧屏蔽複合膜片 200‧‧‧Shield composite diaphragm
201‧‧‧導磁核殼層 201‧‧‧Magnetic core shell
202‧‧‧導磁核殼凸塊 202‧‧‧Magnetic core-shell bumps
204‧‧‧導電膠層 204‧‧‧Electrical adhesive layer
20‧‧‧導磁核殼 20‧‧‧Magnetic core shell
21‧‧‧磁性物 21‧‧‧ Magnetics
22‧‧‧導體層 22‧‧‧Conductor layer
第1圖，係為本揭露所揭露之一種屏蔽複合膜片的示意圖。 FIG. 1 is a schematic view of a shielded composite film disclosed in the present disclosure.
第2圖，係為本揭露所揭露之一種屏蔽複合膜片的示意圖。 Figure 2 is a schematic view of a shielded composite film disclosed in the present disclosure.
第3圖，係為本揭露之電磁強度測試圖。 Figure 3 is a test chart of the electromagnetic strength of the present disclosure.
第4圖，係為本揭露之另一電磁強度測試圖。 Figure 4 is another electromagnetic strength test chart of the present disclosure.
100‧‧‧屏蔽複合膜片 100‧‧‧Shield composite diaphragm
101‧‧‧導磁層 101‧‧‧ magnetically conductive layer
102‧‧‧導磁凸塊 102‧‧‧Magnetic bumps
103‧‧‧導體層 103‧‧‧Conductor layer
104‧‧‧導電膠層 104‧‧‧ Conductive adhesive layer
Claims (9)
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| TW101149188A TWI482585B (en) | 2012-12-21 | 2012-12-21 | Shielding composite diaphragm |
| CN201210579784.9A CN103889197B (en) | 2012-12-21 | 2012-12-27 | Shielding composite membrane |
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| CN105377005A (en) * | 2014-09-01 | 2016-03-02 | 斯迪克新型材料（江苏）有限公司 | Protective adhesive tape with wave absorbing function |
| CN104202956A (en) * | 2014-09-01 | 2014-12-10 | 斯迪克新型材料（江苏）有限公司 | Pressure-sensitive adhesive film with anti-jamming function |
| CN108811477B (en) * | 2014-09-01 | 2020-02-14 | 斯迪克新型材料（江苏）有限公司 | Electronic product film for reducing electromagnetic radiation |
| CN104219942A (en) * | 2014-09-04 | 2014-12-17 | 斯迪克新型材料（江苏）有限公司 | Multipurpose wave absorbing film |
| CN104302159A (en) * | 2014-09-04 | 2015-01-21 | 苏州斯迪克新材料科技股份有限公司 | Wideband multi-use wave absorbing film |
| CN105459462A (en) * | 2014-09-04 | 2016-04-06 | 斯迪克新型材料（江苏）有限公司 | Composite type electromagnetic wave absorbing film |
| CN108102562B (en) * | 2017-12-12 | 2020-06-30 | 武汉华星光电半导体显示技术有限公司 | Anisotropic conductive film |
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| CN103889197A (en) | 2014-06-25 |
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