TW201426070A - A metal strain relief device for use in an optical communications system, an optical fiber cable that employs the strain relief device, and a method - Google Patents

Abstract

A strain relief device and method are provided for use with an optical fiber cable of an optical communications system. The strain relief device comprises a plurality of metal wires, or rods, grouped into a bundle of parallel metal wires and a clamping mechanism for clamping first and second ends of the metal wires to an optical fiber cable. The clamped bundle of metal wires forms a spring having a spring constant that provides it with a desired stiffness and a desired flexibility.

Description

Metal wire buckle device for an optical communication system, optical fiber cable with the same, and a method

Cross-reference to related applications

This application is a continuation of the application of the application No. 13/543,930, entitled "A Z-PLUGGABLE OPTICAL COMMUNICATIONS MODULE, AN OPTICAL COMMUNICATIONS SYSTEM, AND A METHOD", filed on July 9, 2012, the application being filed. It is incorporated herein by reference in its entirety.

The present invention relates to an optical communication system. More particularly, the present invention relates to a metal wire buckle device and method for use in an optical communication module.

A parallel optical communication module has a plurality of transmission (TX) channels, a plurality of reception (RX) channels, or a module of either. A parallel optical transceiver module has one of a plurality of TX channels and a plurality of RX channels in the TX portion and the RX portion of the transceiver module. The TX portion includes components for transmitting data in the form of modulated optical signals via a plurality of optical waveguides, typically optical fibers. The TX portion includes a laser driver circuit and a plurality of laser diodes. The laser driver circuit outputs an electrical signal to the laser diode to modulate it. When the laser diode is modulated, its output has a power level corresponding to logic 1 and logic 0. Quasi-light signal. An optical system of the transceiver module focuses the optical signals generated by the laser diodes into the ends of the respective transmission fibers, the transmission fibers being held in a connector that mates with the transceiver module.

Typically, the TX portion also includes a plurality of monitoring photodiodes that monitor the output power levels of the respective laser diodes and generate respective electrical feedback signals that are fed back to the transceiver controller. The transceiver controller processes the feedback signal to obtain respective average output power levels for the respective laser diodes. The transceiver controller outputs control signals to the laser driver circuit, the control signals causing the laser driver circuit to adjust the current signals of the modulated and/or biased outputs to the respective laser diodes such that the laser diodes The average output power level is maintained at a relatively constant level.

The RX portion includes a plurality of receiving photodiodes that receive incoming light signals output from ends of respective receiving fibers held in the connector. The optical system of the transceiver module focuses the light output from the end of the receiving fiber to the respective receiving photodiode. The receiving photodiode converts the incoming optical signal into an electrical analog signal. An electrical detection circuit, such as a transimpedance amplifier (TIA), receives the electrical signal generated by the receiving photodiode and outputs a corresponding amplified electrical signal that is processed in the RX portion to recover the data.

There is an increasing demand in the optical communications industry for one of the parallel optical communication systems capable of simultaneously transmitting and receiving an increasing amount of data. To achieve this, it is known to combine a plurality of parallel optical transceiver modules of the type set forth above to produce a parallel optical communication system having one of a higher bandwidth than the individual parallel optical transceiver modules. For this purpose, a variety of parallel optical transceiver modules are used in such systems.

Figure 1 illustrates a perspective view of one of the electrical connectors 2 (referred to in the industry as a Meg-Array connector) mounted on a printed circuit board (PCB) 3. The Meg-array connector 2 includes a receptacle 4 having an array of conductive ball contacts (not shown) on the bottom surface and an array of conductive blade pairs 5 on its upper surface. Figure 2 illustrates a parallel optical transceiver A perspective view of one of the Meg-array connectors 2 shown in FIG. 1 after the module 6 (referred to in the industry as a Snap-12 Parallel Optical Transceiver Module) has been inserted into the jack 4. The Snap-12 module 6 has an array of electrical contacts (not shown) on its lower surface that is pressed down to the jack in the Y direction of an X, Y, Z Cartesian coordinate system. At 4 o'clock, the electrical contacts are in contact with the respective pair of conductive vanes 5 of the Meg-Array connector 2.

A receptacle 7 is disposed in one of the front panels 8 formed in a box (not shown) for receiving an opening in an optical connector module (not shown). Inserting the optical connector module into the receptacle 7 through the opening formed in the front panel 8 in the Z direction so that the mating feature (not shown) on the inner side of the receptacle 7 engages the optical connector module (not shown) The optical connector module (not shown) is mated with the receptacle 7 by a respective mating feature (not shown). Since the front panel 8 constitutes the edge of one of the boxes in which the parallel optical transceiver modules are mounted, this type of mounting configuration is referred to in the industry as an edge mounted configuration. The optical connector module is mechanically and optically coupled to one end of a plurality of fiber ribbon cables (not shown) having a plurality of (e.g., 4, 8, 12, 24, or 48) fibers.

By mounting a plurality of optical transceiver modules 6 side by side on the motherboard PCB 3, an optical communication system having an extremely high frequency width can be achieved. However, there are disadvantages associated with edge mounted configurations of the type shown in FIG. 2. One such disadvantage is that the receptacle 7 and the individual optical connector modules (not shown) are relatively wide in the X dimension and thus occupy a significant amount of space on the front panel 8. Since the space on the front panel 8 is limited, the ability to increase the bandwidth by increasing the size of the array is also limited.

Another disadvantage associated with the edge mounted configuration shown in FIG. 2 is that the parallel optical transceiver module 6 is not Z pluggable, that is, it cannot be inserted into and removed from the front panel 8. Rather, the module 6 is inserted into its respective Meg by placing the module 6 over the respective jack 4 and applying a force in the downward Y direction before the top of the box has been secured in place. - Array jack 4 in. The top of the box is then secured in place. This makes the task of installing the module 6 and swapping out the module 6 relatively difficult and time consuming.

The present invention relates to a cable fastening device for use with a fiber optic cable of an optical communication system, a fiber optic cable equipped with the cable fastening device, and a method. The wire fastening device comprises: a plurality of metal wires or rods gathered into a bundle of parallel metal wires; and a clamping mechanism for clamping the first and second ends of the wires to a fiber optic cable. The bundle is formed by a clamping wire forming a spring having a spring constant that provides it with a desired stiffness and a desired flexibility.

The fiber optic cable includes a cable fastening device secured to one end portion of the fiber optic cable and a panel of the end portion secured to the fiber optic cable. The wire fastening device comprises: a plurality of metal wires or rods gathered into a bundle of parallel metal wires; and a clamping mechanism for clamping the first and second ends of the wires to the fiber optic cable.

The method includes providing a fiber optic cable for use in an optical communication system, providing a wire fastening device, and fastening the wire fastening device to one end portion of the optical fiber by a clamping mechanism. The wire fastening device comprises: a plurality of metal wires or rods gathered into a bundle of parallel metal wires; and the clamping mechanism.

These and other features and advantages of the present invention will be apparent from the description and appended claims.

2‧‧‧Electrical Connector/Meg-array Connector

3‧‧‧Printed circuit board/mother board printed circuit board

4‧‧‧ jack / Meg-Array jack

5‧‧‧Electrical blade pair

6‧‧‧Parallel Optical Transceiver Module/Snap-12 Module/Module/Optical Transceiver Module/Parallel Optical Communication Module

7‧‧‧容座

8‧‧‧ front panel

10‧‧‧ Optical Communication System/System

11‧‧‧Box/Shell/Metal System Box/Shell/System Box

12‧‧‧Front panel/metal front panel

12a‧‧‧Metal panels/panels

12a'‧‧‧ wall

13‧‧‧ openings

20‧‧‧Z pluggable optical communication module/optical communication module

21‧‧‧Metal housing/housing

21a‧‧‧ upper surface

22‧‧‧Electromagnetic interference shielding device

Section 22a‧‧‧

23‧‧‧Fiber ribbon cable/belt cable

24‧‧‧ Track

30‧‧‧Z pluggable optical communication module/parallel optical communication module

40‧‧‧Printed circuit board

50‧‧‧ Heat sink structure / separate heat sink structure

60‧‧‧ Heat sink structure / separate heat sink structure

63‧‧‧ arrow

64‧‧‧ arrow

70‧‧‧Actuator mechanism/screw rotary actuator mechanism

71‧‧‧conductive contact array

72‧‧‧ Motherboard printed circuit board

72a‧‧‧ upper surface

73‧‧‧Aikem screw

73a‧‧‧ head

73b‧‧‧Aikem with threaded nut

75‧‧‧ Compartment housing

75a‧‧‧ Rear vertical wall

80‧‧‧Guidance system

80a‧‧‧ side

80b‧‧‧lower surface

81‧‧‧Cam followers

82‧‧‧ hanger

90‧‧‧ cam

90a‧‧‧ cam surface

100‧‧‧ Optical Communication System/System

101‧‧‧Metal system box/housing/box

102‧‧‧ front panel

103‧‧‧ motherboard printed circuit board

103a‧‧‧ upper surface

104‧‧‧Bottom panel

105‧‧‧Meg-array jack

106‧‧‧Parallel optical communication module

110‧‧•Spring loaded actuator mechanism/actuator mechanism/spring load actuator

111‧‧‧Main compression spring / main spring / spring

112‧‧‧Base

113‧‧‧ screws

113a‧‧‧ shaft parts

113b‧‧‧ head

114‧‧‧Sliding parts

116‧‧‧ release trigger

117‧‧‧Vertical support

118‧‧‧down trigger

120‧‧‧Z pluggable optical communication module/optical communication module

121‧‧ ‧ sales

130‧‧‧Release button/button

130a‧‧‧Part 1

130b‧‧‧Part II

130c‧‧‧ openings

131‧‧‧Shell

131a‧‧‧ upper surface

135‧‧‧Compressed spring

140‧‧‧Guiding system/guiding agency

145‧‧‧ arrow

160‧‧‧Electromagnetic interference shielding device

161‧‧‧Fiber Cable/Cable

161a‧‧‧ Panel

162‧‧‧Group/Bundle/Line Group/Component/Wire Link Device

163‧‧‧Metal wire / rod / wire / rod / component / wire buckle device

163a‧‧‧

164‧‧‧First clamp/component/wire fastener/clamp

165‧‧‧Second fixture/component/wire device/fixture

200‧‧‧ Optical Communication System/System

210‧‧‧Z pluggable optical communication module/optical communication module

211‧‧‧ track

212‧‧‧ front panel

212a‧‧‧ openings

220‧‧‧ motherboard printed circuit board

220a‧‧‧ upper surface

221‧‧Meg-array jack

230‧‧‧Optical connector module

240‧‧‧ Compartment

241‧‧‧Frame

241a‧‧‧ front wall

241b‧‧‧Back wall

241c‧‧‧ first through hole

241d‧‧‧second through hole

242‧‧‧ Heat sink structure

242a‧‧‧Cam follower dimples/pits

242b‧‧‧Cam follower dimples/pits

242c‧‧‧ vertical slot

242d‧‧‧ front end

242e‧‧‧ backend

243‧‧‧ cam

243a‧‧‧First Cam/Cam

243b‧‧‧Second cam/cam

243c‧‧‧Offset hole

243d‧‧‧ cylindrical inner surface part

243e‧‧‧flat inner surface section

244‧‧‧ mandrel

244a‧‧‧Slotted hexagonal head/head

244b‧‧‧ shaft parts

244c‧‧‧ cylindrical outer surface part

244d‧‧‧flat outer surface section

244e‧‧‧ holding clip groove

245‧‧‧ holding clip

246‧‧‧ feet

246a‧‧‧ openings

251‧‧‧ track

X‧‧‧ coordinate axis

Y‧‧‧ coordinate axis

Z‧‧‧ coordinate axis

Figure 1 illustrates a perspective view of one of the Meg-Array connectors mounted on a PCB.

2 illustrates a perspective view of the Meg-Array connector after a Snap-12 parallel optical transceiver module has been inserted into the jack of the Meg-Array connector shown in FIG.

FIG. 3 illustrates a front perspective view of one of the optical communication systems in accordance with an illustrative embodiment.

4 illustrates a perspective view of one of the Z pluggable OCMs shown in FIG. 3 with one side of the housing removed to reveal one of the parallel OCMs and parallel OCMs mounted thereon.

Figure 5 illustrates a front perspective view of one of the optical communication systems shown in Figure 3, wherein the box And a portion of the front panel is removed to reveal an actuator mechanism for transmitting motion to the Z-pluggable OCM in the downward and upward Y directions.

6A-6E illustrate perspective views of an optical communication system having a spring loaded actuator mechanism for transmitting motion in an upward and downward Y direction to a Z pluggable OCM.

7A-7D illustrate another embodiment of an optical communication system configured to receive a Z pluggable OCM and including for transmitting motion to Z in a downward and upward Y direction. Plug and unplug the OCM actuator mechanism.

Figure 8 illustrates one of the compartments shown in Figures 7A-7D in exploded form to show the individual components of the compartment.

Figures 9A and 9B illustrate a perspective view and a rear perspective view, respectively, of the compartment (in its assembled form) shown in Figure 8.

10A and 10B illustrate a front perspective view and a rear perspective view, respectively, of the heat sink structure shown in Fig. 8.

11 and 12 illustrate perspective views of the cam and mandrel shown in Fig. 8, respectively.

Figures 13A-13D illustrate the parallel OCMs disposed in one of the compartments shown in Figures 7A-7D from their raised position by the actuator mechanism shown in Figures 8-12 A front perspective view of the compartment as it moves to its lowered position.

Figure 14 illustrates a perspective view of a cable tie device and cable connected to the Z pluggable OCM shown in Figures 6A-6E.

Figure 15 illustrates a perspective view of one of one of the wire fastening devices shown in Figure 14 and one of the cables.

Figure 16 illustrates a cross-sectional view of the buckle assembly and cable shown in Figure 15 having a panel secured to one end of the cable and secured to one of the ends of the buckle assembly.

According to the present invention, a wire buckle device for use in an optical communication system is provided. For illustrative purposes, the reference wire fastening device can advantageously be used with one of the Z-pluggable Optical communication module (OCM) to illustrate the wire buckle device and method. However, the wire buckle device is not limited to use with any particular type of optical communication module.

The Z pluggable OCM contains a plurality of parallel OCMs (POCMs) and is configured to be removably inserted into one of the openings formed in one of the front panels of an optical communication system. When the Z pluggable OCM is inserted into the opening formed in a front panel in the forward Z direction, the actuator mechanism transmits motion to the Z pluggable OCM in the downward Y direction, so that the Z pluggable OCM Mounted on one of the upper surfaces of a motherboard PCB. To remove the Z pluggable OCM, the actuator mechanism transfers motion in the upward Y direction to the Z pluggable OCM so that it is removed from the motherboard PCB. Once removed from the motherboard PCB, a user can remove the Z pluggable OCM by applying a force in the reverse Z direction (ie, perpendicular to the front panel and away from one of the front panels) Z pluggable OCM.

The Z pluggable OCM is relatively long in the Z dimension to accommodate a plurality of parallel OCMs contained therein, and the plurality of parallel OCMs are connected in series in the Z direction on the inside of the Z pluggable OCM. However, the Z pluggable OCM is relatively narrow in the X dimension. By making the Z pluggable OCM relatively long in the Z dimension, a relatively large number of POCMs can be cascaded in the Z direction on the inside of the module, which allows the X dimension of the system to remain relatively small. By keeping the module relatively narrow in the X dimension, a larger number of Z pluggable OCMs can be mounted in the front panel to increase the edge mounting density and can be cascaded in the Z direction within each Z pluggable OCM. The increase in the number of POCMs, combined with the increased edge mounting density allows for a very high total bandwidth. In addition, the Z's pluggability of the module allows it to be easily installed and removed to provide a number of other advantages, such as, for example, the ability to easily replace one of the modules in the event of a component failure. Due to the increased edge mounting density of the Z pluggable OCM, the wire loop device of the present invention is required, as will be explained in detail below with reference to Figures 14-16.

3 illustrates a front perspective view of one of the optical communication systems 10 that does not have (but may have) the wire buckle device of the present invention. One of the cartridges or housings 11 of the optical communication system 10 has a front panel 12 in which an opening 13 is formed for receiving a respective Z pluggable OCM 20. As will be more detailed below It is stated that each of the Z pluggable OCMs 20 has a metal housing 21 and a plurality of POCMs (not shown) that are mounted within the housing 21. Each of the Z pluggable OCMs 20 has an electromagnetic interference (EMI) shielding device 22 attached to one end thereof, the EMI shielding device being attached to one end of a fiber ribbon cable 23 and a metal housing 21 One end. As will be explained in more detail below, the EMI shielding device 22 performs an EMI shielding function.

4 illustrates a perspective view of one of the Z pluggable OCMs 20 shown in FIG. 3 with one side of the housing 21 removed to reveal one of the PCBs 40 on which the POCM 30 and POCM 30 are mounted. . In accordance with this illustrative embodiment, four POCMs 30 each having six transmission channels and six receive channels are mounted on and electrically interconnected to PCB 40. Thus, according to this embodiment, each ribbon cable 23 has twenty-four transmission fibers and twenty-four receiving fibers. However, the present invention is not limited in terms of the number of POCMs 30 accommodated in each Z pluggable OCM 20 or the number of transmission and/or reception channels provided in each POCM 30. The present invention is also not limited in the number of optical fibers contained in the ribbon cable 23.

Referring again to FIG. 3, although the Z pluggable OCM 20 is not limited to having any particular X, Y or Z dimension (according to an illustrative embodiment), each Z pluggable OCM 20 has about 0.5 inches in the X dimension. One width, which is about half the width of the parallel optical communication module 6 shown in FIGS. 1 and 2. Even with this greatly reduced width, each Z pluggable OCM 30 provides approximately twice as many channels as the parallel optical communication module 6. Thus, the edge mount configuration shown in Figure 3 has a front panel mounting density that is approximately four times greater than the front panel mounting density of the configuration shown in Figure 2.

Referring again to FIG. 4, due to the high mounting density of the Z pluggable OCM 20 in the front panel 12, and due to the large number of channels each Z pluggable OCM 20 has, a relatively large amount of heat will be required in the system 10. dissipation. For this reason, the Z pluggable OCM 20 of the embodiment shown in Figure 4 has been designed with a separate heat sink structure for the IC (not shown) and for the laser diode (not shown). This feature allows the IC and the laser diode to operate at different temperatures. One of the heat sink structures 50 is thermally coupled by a metal housing 21 to a thermal pad (not shown) on which the IC is mounted, and the other of the heat sink structures 60 is thermally coupled thereto to have a laser mounted thereon One of the pole body metal lead frames (not shown). The heat sink structures 50 and 60 respectively diffuse and dissipate heat generated by the IC and the laser diode.

In addition to the thermal diffusion and dissipation functions performed by the individual heat sink structures 50 and 60, the system 10 will preferably include a cooling system (not shown) that will blow air through the metal of the Z pluggable OCM 20. The housing 21 is to promote cooling. Air blown through the fin structure 50 in the Z direction will cool the IC of the POCM 30, while air blown through the fin structure 60 will cool the laser diode of the POCM 30.

Referring to Figure 4, the PCB 40 of the Z pluggable OCM 20 has an array of electrically conductive contacts (not shown) that are electrically connected to respective parallel OCMs 30 disposed on a lower surface thereof. When the Z-pluggable OCM 20 edge is mounted in the front panel 12 (Fig. 3), the array of conductive contacts and the upper surface of the motherboard PCB (not shown) disposed on the system 10 (Fig. 3) The contact array of conductive contacts is described in more detail below with reference to Figures 5 through 6D.

The present invention is not limited in terms of the type or configuration of the POCM used in the Z pluggable OCM 20 or in the manner in which the POCM is mounted within the housing 21. Other examples of POCMs suitable for this purpose are disclosed in U.S. Patent Nos. 7,331, 720 and U.S. Patent No. 8,036,500, the disclosures of which are incorporated herein by reference. A variety of other known POCMs are also suitable for use with the present invention, as will be understood by those skilled in the art in view of the description provided herein.

5 illustrates a front perspective view of one of the optical communication systems 10 shown in FIG. 3 with portions of the metal system box or housing 11 and metal front panel 12 removed to reveal the alignment of the interior of the system enclosure 11. Mechanism 70. The purpose of the actuator mechanism 70 is to transfer motion to the Z-pluggable OCM 20 in the downward and upward Y directions to respectively engage the OCM 20 to the conductive contact array 71 disposed on one of the upper surfaces 72a of a motherboard PCB 72. And to get the OCM 20 out of it. According to this embodiment, the actuator mechanism 70 is actuated by one of the cam mechanisms The cam mechanism lowers the Z-pluggable OCM 20 to the upper surface 72a of the motherboard PCB 72 as the Acme screw 73 rotates in one direction, and in the opposite direction on the Acme screw 73 The Z-pluggable OCM 20 is lifted away from the upper surface 72a of the motherboard PCB 72 when rotated.

The actuator mechanism 70 includes a guide system 80 that has an elongated generally rectangular configuration with one of the cam followers 81 integrally formed along an upper edge of the opposite side of the guide system 80. Only one side 80a of the guiding system 80 is visible in Figure 5, but the opposite side is structurally identical to the side 80a. The guiding system 80 has one of the hangers 82 integrally formed along its length along the lower surface 80b. The housing 21 of the Z-pluggable OCM 20 has a track 24 formed along the length of its upper surface 21a. The track 24 and the hanger 82 are sized and shaped to engage each other when the Z-pluggable OCM 20 is inserted through the front panel 12 in the Z direction with the track 24 and the hanger 82 aligned with each other. The guiding system 80 guides the Z-pluggable OCM 20 into the cartridge 11 and the leading-out cartridge 11 in the forward Z direction and the reverse Z direction, respectively. Once the Z-pluggable OCM 20 has been fully inserted into the cartridge 11, it is ready to be lowered by the actuator mechanism 70 down the Y direction onto the upper surface 72a of the motherboard PCB 72.

The Acme screw 73 of the actuator mechanism 70 includes a head 73a and a threaded shaft member (not shown), wherein the head portion 73a is fixed to one end of the threaded shaft member and to a metal panel fastened to the front panel 12 12a is adjacent. An Aikem threaded nut 73b is threadedly engaged with the opposite end of the shaft member and is rotationally coupled to a rear vertical wall 75a of a compartment housing 75. A cam 90 is fixedly secured along its length to the shaft member of the Acme screw 73. For this reason, the shaft member is not visible in Figure 5. The cam 90 has a cam surface 90a that restricts the traveling direction of the cam follower 81 formed therein. When the Acme screw 73 is rotated in the clockwise direction, the cam 90 moves in the forward Z direction indicated by the arrow 63. When the cam 90 is moved in this direction, the direction of travel of the cam follower 81 causes the guiding system 80 to lower, i.e., move in the downward Y direction. When the Acme screw 73 is rotated in the counterclockwise direction, the cam 90 moves in the reverse Z direction indicated by the arrow 64. When the cam 90 moves in this direction, the direction of travel of the cam follower 81 causes The guiding system 80 is raised, that is, moved in the upward Y direction.

After the Z-pluggable OCM 20 has been fully inserted through the front panel 12 such that the EMI shielding device 22 abuts the panel 12a, the person installing the OCM 20 turns the head 73a of the Acme screw 73 counterclockwise two turns. The OCM 20 is lowered (i.e., moved in the downward Y direction) onto the upper surface 72a of the motherboard PCB 72. When the OCM 20 has been completely lowered onto the upper surface 72a of the motherboard PCB 72, the array of conductive contacts disposed on the lower surface of the PCB 40 (Fig. 4) of the OCM 20 is disposed on the upper surface 72a of the motherboard PCB 72. The respective conductive contact arrays 71 are in contact. To remove the OCM 20 from the system 10, the person removing the OCM 20 rotates the head 73a of the Acme screw 73 two turns in a clockwise direction to cause the OCM 20 to be lifted off (ie, moved in the upward Y direction). PCB 72. The person can then remove the OCM 20 from the system 10 by sliding the OCM 20 away from the front panel 12 and generally perpendicular to the reverse Z direction of the front panel 12. Of course, two turns are not the only pitch that can be used for this purpose, so this is just one example of the manner in which the screw-rotating actuator mechanism 70 is operable.

6A-6E illustrate perspective views of a light communication system 100 having a spring loaded actuator mechanism 110 for transmitting motion in an upward and downward Y direction to a Z pluggable OCM 120. Optical communication system 100 includes a metal system box or housing 101 having a front panel 102. The side of the cartridge 101 has been removed in Figures 6A-6E to make it easier to see the spring loaded actuator mechanism 110. A motherboard PCB 103 is mounted on the upper surface of the bottom panel 104 of one of the cartridges 101. A plurality of Meg-array jacks 105 similar or identical to the jacks 4 shown in FIGS. 1 and 2 are mounted on the upper surface 103a of the motherboard PCB 103. The number of Meg-array jacks 105 mounted on the motherboard PCB 103 in the Z direction is equal to the number of POCMs 106 included in each of the Z pluggable OCMs 120.

FIG. 6A illustrates the optical communication system 100 and the OCM 120 before one of the Z pluggable OCMs 120 is inserted in the forward Z direction through an opening formed in the front panel 102. 6B illustrates the optical communication system 100 after one of the Z pluggable OCMs 120 has been fully inserted into the system 100, but just before the spring loaded actuator mechanism 110 is triggered. OCM 120. 6C illustrates the optical communication system 100 and the Z pluggable OCM just after the spring loaded actuator mechanism 110 has been triggered but before all of the energy stored in one of the main compression springs 111 of the actuator mechanism 110 is released. One of the 120. 6D illustrates that all of the energy that has been triggered in the spring loaded actuator mechanism 110 and stored in the main spring 111 has been released to cause a cam (not shown) to force the Z pluggable OCM 120 in the downward Y direction to One of the optical communication system 100 and the Z-pluggable OCM 120 after the upper surface 103a of the motherboard PCB 103. 6E illustrates that a release button 130 has been pressed by a user to cause a cam (not shown) of the spring loaded actuator mechanism 110 to lift the Z-pluggable OCM 120 away from the motherboard PCB 103 in the upward Y direction. The optical communication system 100 behind the upper surface 103a, wherein one of the Z pluggable OCMs 120 is fully inserted into the system 100. The manner in which the spring loaded actuator mechanism 110 operates will now be described with reference to Figures 6A-6E.

The spring loaded actuator mechanism 110 includes a main spring 111 , a base 112 , a screw 113 , a slider 114 , a release trigger 116 , a vertical support 117 , a downward trigger 118 , and a guiding system 140 . Inside cam (not shown). One of the ends of the spring 111 is fixedly secured to the base 112. The proximal end of one of the screws 113 is also fixedly secured to the base 112. One of the shafts 113a of the screw 113 is slidable in the Z direction through one of the openings formed in the slider 114. The release trigger 116 is rotationally coupled to the base 112 at its proximal end. When the actuator mechanism 110 is in the rearward state or position shown in Figure 6B, the release trigger 116 pivotally contacts the pin 121 disposed on the opposite side of the vertical support 117 on its distal end. The lower trigger 118 has a proximal end that is disposed in free space to contact one of the heads 113b of one of the screws 113 when the spring loaded actuator 110 is in its rearward position as shown in Figure 6B. A distal end of one of the lower triggers 118 is mechanically coupled to the release trigger 116.

When the Z pluggable OCM 120 is inserted into the interior of the cartridge 101 through the front panel 102 in the Z direction, the upper surface 131a of the housing 131 of the Z pluggable OCM 120 engages the spring loaded actuator mechanism 110, causing the spring load The actuator mechanism 110 is movable in the forward and reverse Z directions within the guidance system 140. The force applied to the Z pluggable OCM 120 in the positive Z direction is along the positive Z direction The spring loaded actuator 110 is pushed until the spring loaded actuator 110 is in its rearward position as shown in Figure 6B. As the spring loaded actuator 110 travels in this direction, the distance between the base 112 and the slider 114 is reduced, thereby causing the main spring 111 to become compressed. When the spring loaded actuator mechanism 110 travels in this direction, the shaft 113a of the screw 113 slides through the opening formed in the slider 114 to extend in the direction indicated by the arrow 145. When the spring loaded actuator mechanism 110 reaches its rearward position, the head 113b of the screw 113 contacts the proximal end of the lower trigger 118.

The lower trigger 118 is essentially a lever such that the force exerted by the head 113b of the screw 113 against the proximal end of the lower trigger 118 causes the distal end of the lower trigger 118 to move in the upward Y direction. When the distal end of the flip-flop 118 moves in this direction, the flip-flop 118 triggers the release trigger 116 by disengaging the distal end of the release trigger 116 from the pin 121. When this occurs, the energy stored in the main spring 111 is released, which forces the spring loaded actuator mechanism 110 to move from its rearward position as shown in Figure 6B to its forward position as shown in Figure 6D. When the spring loaded actuator mechanism 110 moves from its rearward position as shown in Figure 6B to its forward position as shown in Figure 6D, the spring loaded actuator mechanism 110 actuates one of the cams of the guiding mechanism 140 (not shown) The cam pushes the Z pluggable OCM 120 in the downward Y direction such that the conductive contacts (not shown) disposed on the lower surface of the PCB (not shown) of the OCM 120 are placed in the respective Meg-array jacks. Conductive contacts (not shown) in 105.

Referring to FIG. 6E, the optical communication system 100 also includes a spring loaded button mechanism including a release button 130 and a compression spring 135. One of the first portions 130a of the release button 130 extends through one of the openings 130c formed in the front panel 102. One of the second portions 130b of the button 130 extends behind the front panel 102. The compression spring 135 has a proximal end that is mechanically coupled to the second portion 130b of the button 130 and a distal end that abuts the spring loaded actuator mechanism 110. When the Z-pluggable OCM 120 is in the in-and-down position shown in Figure 6D, the button 130 extends completely from the front panel 102. If the button 130 is pressed in the inward Z direction until the first portion 130a of the button 130 is almost flush with the front panel 102, the compression spring 135 is far The end will apply a force to the spring loaded actuator mechanism 110 that will force it in the backward Z direction. When this occurs, application of a cam (not shown) within the guiding system 140 to the Z pluggable OCM 120 in the upward Y direction will cause the Z pluggable OCM 120 to disengage from the motherboard PCB 103. The user can then withdraw the Z pluggable OCM 120 from the system 100 by applying a force to the Z pluggable OCM 120 in the reverse Z direction (ie, away from the front panel 102).

The Z-pluggable OCM 120 includes an EMI shielding device 160 (Figs. 6A-6E) that is fastened to one of the panels 161a of a fiber optic cable 161. The EMI shielding device 160 is similar or identical to the EMI shielding device 22 (Figs. 3-5). The EMI shielding device 22 is made of a metallic material that is strong and provides a degree of flexibility, such as, for example, sheet metal. As can be seen more clearly in Figure 4, portion 22a of EMI shielding device 22 is curved inwardly on all sides. When the Z-pluggable OCM 20 is in its fully inserted position, the portion 22a abuts the panel 12a mounted on the front panel 12. The flexibility of the EMI shielding device 22 allows the portion 22a to be slightly deformed to ensure continuous contact with the metal panel 12a. Once the Z-pluggable OCM 20 has been placed in its fully inserted position, the portion 22a remains continuous with the panel 12a even when the Z-pluggable OCM 20 is moved in the upward and downward Y directions by the actuator mechanism 70. contact.

The same is true for the EMI shielding device 160 shown in Figures 6A-6E. For example, as can be seen in Figures 6B-6D, the EMI shielding device 160 remains contiguous with the front panel 102 during the lowering and raising of the Z-pluggable OCM 120 in the downward and upward Y directions. Both EMI shielding devices 22 and 160 provide a robust EMI shielding solution. As can also be seen in Figures 3 and 5, the panel 12a has walls 12a' projecting from the panel 12a in the rearward Z direction on opposite sides of the panel 12a. These walls 12a' are contiguous with portions 22a of the respective EMI shielding devices 22 of the Z-pluggable OCMs 20 that are inserted into the system 10 adjacent to the walls 12a'. This feature further prevents the presence of an air gap at the front panel 12, which ensures that very little, if any, EMI escapes from the cassette 11 through the front panel 12.

7A-7D illustrate another embodiment of an optical communication system 200 configured to receive a Z pluggable OCM 210 and including an actuator mechanism (not shown) The actuator mechanism is configured to transfer motion to the Z-pluggable OCM 210 in the downward and upward Y directions to cause it to engage and disengage one of the motherboard PCBs 220 of the system 200, respectively. FIG. 7A illustrates a front perspective view of one of the optical communication systems 200 just prior to insertion of the Z pluggable OCM 210 through one of the openings 212a formed in one of the front panels 212 of the system 200. 7B illustrates one of the optical communication systems 200 after the Z pluggable OCM 210 has been fully inserted into the system 200 but before the Z pluggable OCM 210 is lowered by an actuator mechanism (not shown) to engage the motherboard PCB 220. Front perspective. 7C illustrates the optical communication system 200 after the Z pluggable OCM 210 has been fully inserted into the system 200 and after the Z pluggable OCM 210 has been lowered by an actuator mechanism (not shown) to engage the motherboard PCB 220. One of the front perspectives. 7D illustrates a front perspective view of one of the optical communication systems 200 in which the Z pluggable OCM 210 is in the fully inserted and engaged position shown in FIG. 7C, with an optical connector module 230 coupled to the Z pluggable OCM. 210.

The embodiment of optical communication system 200 shown in Figures 7A-7D has a plurality of compartments 240 that are identically configured to receive respective Z-pluggable OCMs 210. The configuration of the compartment 240 will be explained with reference to FIGS. 8 to 12. FIG. 8 illustrates one of the compartments 240 in its exploded form to show the individual components of the compartment 240. The compartment 240 is comprised of a frame 241, a fin structure 242, a cam 243, a mandrel 244, and a retaining clip 245. Figures 9A and 9B illustrate a perspective view and a rear perspective view, respectively, of the compartment 240 shown in Figure 8 in its assembled form. 10A and 10B illustrate a front perspective view and a rear perspective view, respectively, of the heat sink structure 242 shown in FIG. 11 and 12 illustrate perspective views of cam 243 and mandrel 244, respectively.

The manner in which the compartment 240 is assembled will now be described with reference to Figures 8-12. As shown in FIGS. 10A and 10B, the first cam 243a and the second cam 243b are inserted into cam follower dimples 242a and 242b formed in opposite ends of the fin structure 242. One of the vertical slots 242c of the movement of the mandrel 244 is allowed to extend from one of the front ends 242d of the fin structure 242 to one of the rear ends 242e of the fin structure 242. As best seen in Figures 8-9B, the cams 243a and 243b have been After being positioned within the cam follower pockets 242a and 242b, the fin structure 242 is inserted into the frame 241 such that the front end 242d of the fin structure 242 abuts an inner surface of one of the front walls 241a of the frame 241 and causes the fin structure 242 The rear end 242e is adjacent to an inner surface of one of the rear walls 241b of the frame 241.

After the fin structure 242 in which the cams 243a and 243b have been positioned has been fastened to the frame 241, one end of the mandrel 244 is inserted through the first through hole formed in the front wall 241a and the rear wall 241b of the frame 241, respectively. The 241c and the second through holes 241d pass through the offset holes 243c (FIG. 11) formed in the cams 243a and 243b. The offset holes 243c each have a cylindrical inner surface portion 243d and a flat inner surface portion 243e which together form a key groove in the cams 243a and 243b. The mandrel 244 has a slotted hexagonal head 244a and a shaft member 244b. The shaft member 244b has a cylindrical outer surface portion 244c and a flat outer surface portion 244d which together form a key. When the mandrel 244 is inserted into the offset hole 243c formed in the cams 243a and 243b, the cylindrical inner surface portion 243d of the offset hole 243c is in contact with the cylindrical outer surface portion 244c of the shaft member 244b, and the offset hole 243c is The flat inner surface portion 243e is in contact with the flat outer surface portion 244d of the shaft member 244b. In this manner, the mandrel 244 is coupled to the cams 243a and 243b in a one-key/keyway coupling configuration.

When the compartment 240 is in the assembled form as shown in Figures 9A and 9B, the slotted hexagonal head 244a of the mandrel 244 abuts an outer surface of the front wall 241a of the frame 241. The retaining clip 245 is then clamped into one of the retaining clip recesses 244e shown in Figure 12 such that the retaining clip 245 abuts the outer surface of the rear wall 241b of the frame 241, as shown in Figure 9B. The frame 241 is fastened to the upper surface of the motherboard PCB 220 via a fastening device (not shown) inserted through an opening 246a formed in the leg portion 246 of the frame 241.

In accordance with this illustrative embodiment, the actuator mechanism is comprised of a portion of the frame 241, a fin structure 242, cams 243a and 243b, a mandrel 244, and a retaining clip 245. As shown in FIG. 10B, the fin structure 242 has a rail 211 that engages on the opposite side of the Z-pluggable OCM 210 when it is inserted into the opening 212a (FIG. 7B) formed in the front panel 212 (FIG. 7A). )of A rail 251 is formed on the opposite side thereof.

Once the Z pluggable OCM 210 has been fully inserted into the compartment 240, as shown in Figure 7B, it is easily lowered onto the motherboard PCB 220. One or more of the Meg-array jacks 221 (FIGS. 7A and 7B) of the type shown in FIGS. 1 and 2 are mounted on the upper surface 220a of the motherboard PCB 220 in the compartment 240. The lower surface of the Z pluggable OCM 210 PCB (not shown) has one or more Meg-array connectors (not shown) for mating with the respective Meg-array jacks 221. To lower the Z pluggable OCM 210 onto the motherboard PCB 220 and to raise the Z pluggable OCM 210 to the motherboard PCB 220, the user uses a screwdriver or the like to turn the head of the mandrel 244 244a, as will now be explained with reference to Figures 13A-13D.

In Figure 13A, the Z pluggable OCM 210 is in its raised position. When the user rotates the head 244a of the mandrel 244 in a counterclockwise direction, the cams 243a and 243b are within the cam follower pockets 242a and 242b of the fin structure 242 from the position shown in Figure 13A (here, The cam exerts an upwardly directed force against the top of the dimples 242a and 242b) to move to the position shown in Figures 13B-13D (where the cam exerts a downwardly directed force against the bottom of the dimples 242a and 242b). ). In FIG. 13D, a Meg-array connector (not shown) on the lower surface of the PCB of the OCM 210 is connected to a Meg-array jack 221 disposed on the motherboard PCB 220. Rotating the head 244a of the mandrel 244 in the opposite direction will cause the OCM 210 to rise in the Y direction away from the motherboard PCB 220 to allow the OCM 210 to be removed from the system 200.

Figure 14 illustrates a perspective view of a buckle assembly and cable 161 and panel 161a coupled to the Z-pluggable OCM 120 shown in Figures 6A-6E. Since the Z-pluggable OCM 120 can be mounted intensively on the front panel 102, conventional wire buckle assemblies, such as rubber sleeves, may not be provided for having a thickness of less than or equal to about 0.125 inches or about 125 mils or The diameter of the cable 161 is sufficient to bend. In accordance with an illustrative embodiment, the wire buckle device includes a group or bundle 162 of metal wires or rods 163 having ends 163a that are clamped between the first clamp 164 and the second clamp 165. The diameter of the wire 163 can be, for example, 0.015 inches (15 mils).

Typically, metal line 163 has a diameter in the range of from about 15 mils to about 32 mils. The number of lines 163 included in the bundle depends on other considerations set forth below, but will typically be two to thirty, and most commonly will be ten to twenty. Line group 162 is sufficiently strong to prevent cable 161 from bending beyond its minimum allowable bend radius. The strength of line group 162 can also be easily tuned by using more or fewer lines 163 in each group 162.

Figure 15 illustrates a perspective view of one of the wire fastening devices including components 162, 163, 164, 165. Figure 15 also shows a portion of one of the cables 161 shown in Figure 14. Figure 16 illustrates a cross-sectional view of cable 161, panel 161a, and button assembly 162/163/164/165. According to the illustrative embodiment of Figures 6A-6E and 14-16, the distance between adjacent Z-pluggable OCMs 120 is so small that a rubber cable tie device would not be able to provide sufficient wire buckles. In general, the one-wire fastener device should be sufficiently rigid to absorb a predetermined amount of mechanical energy and have a spring constant that allows the cable to bend a predetermined amount while preventing the cable from bending beyond a predetermined minimum bend radius. Due to the space limitations created by the dense packaging of the Z-pluggable OCM 120 at the front panel, a rubber boot will likely be too small to absorb the amount of mechanical energy that needs to be absorbed. On the other hand, a solid metal clasp device would be too stiff to allow the cable to be bent as desired or necessary.

According to an embodiment of the present invention, it has been determined that the metal wires 163 are collectively gathered into a bundle of parallel metal wires and the end 163a thereof is clamped to one end portion of the cable 161 to form a spring having a sufficient stiffness to absorb A predetermined amount of mechanical energy is simultaneously provided with sufficient flexibility to allow it to bend to a spring constant of a predetermined minimum bend radius. In the illustrative embodiment, group 162 includes one having a length of about 1.75 inches (i.e., the distance between clamps 164 and 165) and thirteen of a diameter of about .015 inches or 15 mils. Metal wire 163.

This configuration of the buckle device allows the cable 161, which typically has a diameter of about one inch, to be bent to a minimum bend radius of no less than about one inch. Can be used by using more or fewer lines 163. The stiffness of the spring is trimmed or tuned by varying the diameter of the line 163, by changing the material of the line 163, and/or by varying the length of the line 163 disposed between the clamps 164 and 165. The adjustability of the wire buckle device makes it extremely user friendly so that it is suitable for use in many fiber optic cable applications.

The invention has been described with reference to a few illustrative or exemplary embodiments for the purpose of illustrating the principles of the invention. Those skilled in the art will appreciate that the invention is not limited to the illustrative embodiments. For example, although the wire or rod 163 has been shown clamped to the cable 161 by the first and second clamps, the end 163a of the wire 163 can be clamped or fixedly secured to the cable 161. A single clamping mechanism is used for this purpose. It will be appreciated by those skilled in the art that, in light of the description provided herein, modifications may be made to the embodiments described herein while still achieving the objectives of the invention, and all such modifications are within the scope of the invention.

10‧‧‧ Optical Communication System/System

11‧‧‧Box/Shell/Metal System Box/Shell/System Box

12‧‧‧Front panel/metal front panel

12a‧‧‧Metal panels/panels

12a'‧‧‧ wall

13‧‧‧ openings

20‧‧‧Z pluggable optical communication module/optical communication module

21‧‧‧Metal housing/housing

22‧‧‧Electromagnetic interference shielding device

23‧‧‧Fiber ribbon cable/belt cable

X‧‧‧ coordinate axis

Y‧‧‧ coordinate axis

Z‧‧‧ coordinate axis

Claims (18)

A wire fastening device for use with a fiber optic cable of an optical communication system, the wire fastening device comprising: a plurality of metal wires or rods integrated into a bundle of parallel metal wires; and a clamping mechanism for The first and second ends of the metal wire are clamped to a fiber optic cable. The fastener device of claim 1, wherein the metal wires or rods have a diameter in a range between about 15 mils and about 32 mils. A thread fastening device according to claim 2, wherein the metal wires or rods have a diameter of about 15 mils. A thread fastening device according to claim 3, wherein there are two to thirty metal wires or rods in the bundle. A thread fastening device according to claim 4, wherein there are ten to twenty metal wires or rods in the bundle. The wire fastening device of claim 1, wherein the clamping mechanism comprises a first clamp for clamping the first end of the metal wire to the optical fiber cable, and a second clamp for the metal wire The end is clamped to a second clamp of the fiber optic cable. An optical fiber cable for use in an optical communication system, the optical fiber cable comprising: a wire fastening device fastened to one end portion of the optical fiber cable, the wire fastening device comprising: a plurality of metal wires or rods, Integrating a bundle of parallel metal wires, and a clamping mechanism for clamping the first and second ends of the wires to a fiber optic cable; and a panel fixedly secured to the fiber One end of the end portion. The fiber optic cable of claim 7, wherein the metal wires or rods have a diameter in a range between about 15 mils and about 32 mils. A fiber optic cable according to claim 8 wherein the metal wires or rods have a diameter of about 15 mils. A fiber optic cable according to claim 8, wherein there are two to thirty metal wires or rods in the bundle. The fiber optic cable of claim 10, wherein there are ten to twenty metal wires or rods in the bundle. The fiber optic cable of claim 7, wherein the clamping mechanism includes a first clamp for clamping the first end of the metal wire to the fiber optic cable, and a second clamp for the metal wire The end is clamped to a second clamp of the fiber optic cable. A method for providing a fiber optic cable with a wire buckle, the method comprising: providing a fiber optic cable for use in an optical communication system; providing a wire buckle device comprising: a plurality of metal wires or rods a plurality of parallel metal wires; and a clamping mechanism for clamping the first and second ends of the metal wires to the optical fiber cable; and fastening the wire fastening device by means of a clamping mechanism Fastened to one end of the fiber optic cable. The method of claim 13, wherein the metal wires or rods have a diameter in a range between about 15 mils and about 32 mils. The method of claim 14, wherein the metal wires or rods have a diameter of about 15 mils. The method of claim 14, wherein there are two to thirty metal wires or rods in the bundle. The method of claim 16, wherein there are ten to twenty metal wires or rods in the bundle. The method of claim 13 wherein the clamping mechanism includes a first clamp for clamping the first end of the metal wire to the end portion of the fiber optic cable, and for the metal wire The second end is clamped to a second clamp of the end portion of the fiber optic cable.