TW201401583A - Package of photoelectric device and photoelectric module - Google Patents

Abstract

A package of photoelectric unit including a first substrate, a photoelectric device, a molding compound, a conductor and a redistribution layer is provided. The first substrate has a via hole and a cavity. The photoelectric device disposed in the cavity has a pad. The cavity is filled with the molding compound so as to fix the photoelectric device, and the pad of the photoelectric device is not covered by the molding compound. The conductor is disposed in the via hole. The redistribution layer is disposed on the first substrate and the molding compound, and the redistribution layer extends from the conductor to the pad for electrically connecting the photoelectric device and the conductor.

Description

Photoelectric component package and photoelectric module

The invention relates to a photovoltaic element package and a photoelectric module.

In today's booming optoelectronic products, various types of optoelectronic components have been widely applied to mature semiconductor process technology, and continue to develop toward miniaturization and multi-functionality. Photoelectric components using semiconductor process technology can be used for optical connection and transmission. Photoelectric communication elements requiring parallel optical coupling, such as Active Optical Cable/AOC Transceiver.

1 is a schematic view of a conventional photovoltaic element package. Referring to FIG. 1 , a conventional photovoltaic device package 100 includes a substrate 110 , a photovoltaic element 120 , an e driving chip 130 , and a printed circuit board 140 . The photovoltaic element 120 is disposed on the substrate 110. The driving chip 130 and the substrate 110 are disposed on the printed circuit board 140, and the driving chip 130 and the photovoltaic element 120 are respectively electrically connected to the printed circuit board 140 by wire bonding.

In the case of high frequency communication, the shorter the line, the more crosstalk can be avoided. However, since the wire length of the conventional photovoltaic device package is limited by the manufacturing equipment or the arc of the wire, it is difficult to further reduce it. In addition, in the prior art, a printed circuit board suitable for a wire bonding process is complicated in production.

The present invention provides a photovoltaic element package having a short signal conduction path between the photovoltaic element and the drive wafer.

The present invention provides a photovoltaic module using the above-described photovoltaic device package.

One embodiment of the present invention provides a photovoltaic device package including a first substrate, a photovoltaic element, a colloid, an electrical conductor, and a wiring layer. The first substrate has a constant hole and a recess. The photovoltaic element is disposed in the recess, and the photovoltaic element has a contact. The colloid is filled in the recess to fix the photovoltaic element in the recess, and the contacts of the optoelectronic component are not covered by the colloid. The electrical conductor is disposed in the through hole. The circuit layer is disposed on the first substrate and the glue body, and the circuit layer extends from the electrical conductor to the contact for electrically connecting the photoelectric element and the electrical conductor.

In an embodiment of the invention, the first substrate has a first surface and a second surface, and the photoelectric element has an active surface, the active surface is used to emit or receive an optical signal, and the circuit layer is disposed on the circuit board. The first surface and the gel, and the active surface is substantially coplanar with the first surface.

In an embodiment of the invention, the depth of the recess is smaller than the thickness of the first substrate, and the photovoltaic element is disposed on a bottom surface of the recess.

In an embodiment of the invention, the depth of the recess is substantially equal to the thickness of the first substrate, and the recess penetrates the first substrate.

In an embodiment of the invention, the method further includes a conductive bump, wherein the electrical conductor has a first end surface and a second end surface, the first end surface is connected to the circuit layer, and the second end surface is connected to the conductive bump.

In an embodiment of the invention, the invention further includes a carrier having a third surface and a fourth surface, the carrier comprising the third surface a plurality of pads and a plurality of pads on the fourth surface, the pads on the third surface and the pads on the fourth surface are electrically connected to the plurality of conductive vias of the carrier, respectively The bump is attached to one of the pads on the third surface.

In an embodiment of the invention, a driving chip is further included, and the driving wafer is connected to the pads on the third surface through a plurality of solder balls for electrically connecting the photovoltaic elements.

An embodiment of the present invention provides a photovoltaic module including a photovoltaic device package, a second substrate, and at least one light guiding device. The photovoltaic device package includes a first substrate, a photovoltaic element, a colloid, an electrical conductor, and a wiring layer. The first substrate has a constant hole and a recess. The optoelectronic component is disposed in the recess, the optoelectronic component has a contact, and the optoelectronic component is used to emit or receive an optical signal. The colloid is filled in the recess to fix the photovoltaic element in the recess, and the contacts of the optoelectronic component are not covered by the colloid. The electrical conductor is disposed in the through hole. The circuit layer is disposed on the first substrate and the glue body, and the circuit layer extends from the electrical conductor to the contact for electrically connecting the photoelectric element and the electrical conductor. The second substrate is disposed on one side of the first substrate, and the second substrate has a reflective surface corresponding to the photoelectric element to reflect the optical signal. The light guiding element is disposed between the first substrate and the second substrate, and the light guiding element is configured to transmit the optical signal.

In an embodiment of the invention, the first substrate has a first surface and a second surface, and the photoelectric element has an active surface, the active surface is used to emit or receive optical signals, and the circuit layer is disposed on the first a surface and a colloid, and the active surface is substantially coplanar with the first surface.

In an embodiment of the invention, the depth of the recess is smaller than the first The thickness of the substrate, and the photovoltaic element is disposed on one of the bottom surfaces of the recess.

In an embodiment of the invention, the depth of the recess is substantially equal to the thickness of the first substrate, and the recess penetrates the first substrate.

In an embodiment of the invention, the method further includes a conductive bump, wherein the electrical conductor has a first end surface and a second end surface, the first end surface is connected to the circuit layer, and the second end surface is connected to the conductive bump.

In an embodiment of the invention, the photo-electric component package further includes a carrier having a third surface and a fourth surface, the carrier includes a plurality of pads on the third surface and a plurality of pads on the four surfaces, the pads on the third surface and the pads on the fourth surface are respectively electrically connected through the plurality of conductive vias of the carrier, and the conductive bumps are connected in the first One of these pads on the three surfaces.

In an embodiment of the invention, the photo-electric device package further includes a driving chip, and the driving wafer is connected to the portions of the pads on the third surface through a plurality of solder balls for electrically connecting the photovoltaic elements.

In an embodiment of the invention, the first substrate has a first alignment portion, the second substrate has a second alignment portion, and the first alignment portion is coupled with the second alignment portion to combine the first substrate with The second substrate.

Based on the above, the embodiment of the present invention effectively shortens the signal transmission path between the driving chip and the photovoltaic element through the circuit layer and the conductor, thereby improving the performance of the photovoltaic module.

The above described features and advantages of the present invention will be more apparent from the following description.

2A is a schematic cross-sectional view of a photovoltaic device package in accordance with an embodiment of the present invention. Referring to FIG. 2A, the photovoltaic device package 200 of the present embodiment includes a first substrate 210, a photovoltaic element 220, a colloid 230, a conductive body 240, and a redistribution layer. The first substrate 210 has a uniform hole 212 and a recess 214. The optoelectronic component 220 is disposed within the recess 214, and the optoelectronic component 220 has a contact 222. The colloid 230 is filled in the recess 214 to fix the optoelectronic component 220 within the recess 214, and the contact 222 of the optoelectronic component 220 is not covered by the colloid 230. The electrical conductor 240 is disposed in the through hole 212. The reconfiguration circuit layer 250 is disposed on the first substrate 210 and the colloid 230, and the reconfiguration circuit layer 250 extends from the electrical conductor 240 to the contact 222 for electrically connecting the photovoltaic element 220 and the electrical conductor 240.

The first substrate 210 has a first surface 216 and a second surface 218 opposite to each other. The optoelectronic component 220 has an active surface 224, and the active surface 224 is located on the upper surface of the optoelectronic component 220 and is used to emit or receive an optical signal; the contact 222 is also located on the upper surface of the optoelectronic component 220, but does not overlap with the active surface; The reconfiguration circuit layer 250 is disposed on the first surface 216 and the colloid 230. In the present embodiment, the depth D of the recess 214 is smaller than the thickness T of the first substrate 210, and the photoelectric element 220 is disposed on one of the bottom surfaces 214a of the recess 214. The optoelectronic component 220 is disposed in the recess 214 to make the active surface 224 of the optoelectronic component 220 substantially coplanar with the first surface 216. Thus, the complexity of the reconfigured wiring layer 250 can be reduced and shortened. Connected to the contact 222 of the photovoltaic element 220 and the conductor 240 The signal conduction path of the circuit layer 250 is reconfigured. In other embodiments, the active surface 224 of the optoelectronic component 220 may not be coplanar with the first surface 216, and the invention is not limited thereto.

In addition, the electrical conductor 240 has a first end surface 242 and a second end surface 244 . The first end surface 242 is connected to the reconfiguration circuit layer 250 , and the second end surface 244 is connected to a conductive bump 260 .

The photovoltaic device package 200 of the present embodiment further includes a carrier 270 and a driving wafer 278. The carrier 270 has a first third surface 272 and a fourth surface 274, and the carrier 270 includes a plurality of pads 272a, 274a. The pads 272a are located on the third surface 272. The pads 274a are located on the fourth surface 274. The pads 272a and the pads 274a are electrically connected to the plurality of conductive vias 276 of the carrier 270, respectively. The conductive bumps 260 of the photovoltaic device package 200 are connected to the pads 272a on the third surface 272, and the driving wafers 278 are connected to the partial pads 272a through a plurality of solder balls 279 for electrically connecting the photovoltaic elements 220. In addition, the pads 274a of the carrier 270 can also be connected to a printed circuit board (not shown) through solder. In this embodiment, the photo-electric component 220 can be electrically connected to the driving die 278 through the pad 272a connected to the electrical conductor 240. For example, the pad 272a connected to the electrical conductor 240 can be electrically conductive by using one of the pads 272a on the third surface 272. The circuit (not shown) electrically connects the pads 272a connected to the driving chip 278, thereby electrically connecting the photovoltaic element 220 to the driving chip 278, but the invention is not limited thereto.

The photovoltaic element 220 of the photovoltaic device package 200 of the present embodiment is connected to the carrier 270 through the relocation wiring layer 250, the conductor 240 and the conductive bumps 260, and is electrically connected to the driving wafer 278. Photoelectric element of this embodiment Compared with the conventional photovoltaic device package, the package 200 reduces the signal conduction path between the driving chip 278 and the photovoltaic element 220, and reduces the probability of occurrence of crosstalk, thereby reducing the difficulty and cost of the process. It should be noted that FIG. 2A is a schematic cross-sectional view of the photovoltaic device package 200. In this cross section, the embodiment only shows one contact 222, one electrical conductor 240, and one through hole 212 to indicate In other embodiments, the contacts 222, the conductors 240, and the through holes 212 may also be plural.

In order to more clearly describe the photovoltaic device package 200 of the present embodiment, one of the manufacturing methods of the photovoltaic device package 200 is provided herein. 2B to 2F are schematic cross-sectional views showing a manufacturing process of the photovoltaic device package of Fig. 2A. First, referring to FIG. 2B, a first substrate 210 having a through hole 212 and a recess 214 is provided. The type of the first substrate 210 may be a germanium substrate, a ceramic substrate, a printed circuit board, or the like, but is not limited thereto. The first substrate 210 can be etched by two etchings or the like to form the through holes 212 and the recesses 214 of different depths.

Next, referring to FIG. 2C, the photovoltaic element 220 is disposed on the bottom surface 214a of the cavity 214, and the active surface 224 of the photovoltaic element 220 is coplanar with the first surface 216. In this embodiment, the photo-electric component 220 can be a photo detector (PD) for receiving an optical signal or a vertical cavity-emitting laser for emitting an optical signal (Vertical-Cavity Surface-Emitting Laser, VCSEL), but the type of the photovoltaic element 220 is not limited thereto.

Referring again to FIG. 2D, the colloid 230 is filled into the pocket 214 to secure the photovoltaic element 220 within the pocket 214. Colloid 230 will be slightly covered The optoelectronic component 220 is covered to secure it, but does not cover the contacts 222 of the optoelectronic component 220. In this embodiment, the material of the colloid 230 may include benzocyclobutene (BCB), silicon rubber, polyimide (PI), epoxy resin (Epoxy), and polyester (Polyurethane). , PU) or cerium oxide, etc., but the material of the colloid 230 is not limited thereto. In this embodiment, the colloid 230 can be filled into the cavity 214 by means of spin coating, and the first surface 216 between the cavity 214 and the through hole 212 can also be coated with the colloid 230 at the same time (not shown). The flatness of the first surface 216 is increased to facilitate subsequent fabrication of the rewiring circuit layer 250.

Next, referring to FIG. 2E , the electrical conductor 240 is disposed in the through hole 212 . Moreover, the reconfiguration wiring layer 250 is disposed on the first substrate 210 and the colloid 230, and the reconfiguration wiring layer 250 extends from the first end surface 242 of the electrical conductor 240 to the contact 222. It is worth mentioning that in other manufacturing processes, the electrical conductor 240 can also be disposed in the through hole 212 in the step of FIG. 2B, and is not limited by the steps of the embodiment. Referring to FIG. 2F, the conductive bumps 260 are connected to the second end surface 244 of the electrical conductor 240.

Finally, returning to FIG. 2A, conductive bumps 260 and drive wafer 278 are attached to pads 272a on third surface 272 of carrier 270. In this manner, the photo-electric component 220 can be electrically connected to the driving wafer 278 through the re-wiring circuit layer 250, the conductive body 240, and the conductive bumps 260 to the carrier 270. The carrier 270 may be a germanium substrate, a ceramic substrate, a printed circuit board, or the like. Compared with the conventional photovoltaic device package 100, the photovoltaic device package 200 of the present embodiment is not only simple in process, but also can shorten the driving chip 278. The signal transmission path with the photovoltaic element 220 further enhances the performance of the photovoltaic device package 200.

3A is a cross-sectional view of a photovoltaic device package in accordance with another embodiment of the present invention. The main difference between the photovoltaic device package 300 of FIG. 3A and the photovoltaic device package 200 of FIG. 2A is that, in the photovoltaic device package 300 of FIG. 3A, the depth D of the cavity 314 is substantially equal to the thickness T of the first substrate 310; In the photovoltaic device package 200 of FIG. 2A, the depth D of the recess 214 is smaller than the thickness T of the first substrate 210. That is, the recess 314 and the through hole 312 of the photovoltaic device package 300 of the present embodiment both penetrate the first substrate 310. Therefore, when the through hole 312 and the recess 314 are manufactured, the first substrate 310 of the embodiment can be completed by one etching, which is convenient in the process. Of course, the manner in which the through holes 312 and the recesses 314 are formed is not limited to the above.

In order to more clearly describe the photovoltaic device package 300 of the present embodiment, one of the manufacturing methods of the photovoltaic device package 300 is provided herein. 3B to 3E are schematic cross-sectional views showing a manufacturing process of the photovoltaic device package of FIG. 3A. First, referring to FIG. 3B, a first substrate 310 is provided. The first substrate 310 has a through hole 312, a recess 314, a first surface 316 and a second surface 318. In the embodiment, the through hole 312 and the recess 314 penetrate the first substrate 310. The first substrate 310 may be a silicon wafer, a ceramic substrate, a printed circuit board, or the like. To facilitate the next step, as shown in FIG. 3B, the electrical conductor 340 is first placed in the through hole 312.

Next, referring to FIG. 3C, the photocell 320 having the contact 322 and an active surface 324 is disposed in the recess 314. Due to the pocket 314 The first substrate 310 is passed through to allow the photovoltaic element 320 to be secured within the recess 314 and the active surface 324 of the optoelectronic component 320 is substantially coplanar with the first surface 316 of the first substrate 310. In fabrication, as shown in FIG. 3C, the first substrate 310 is inverted and a jig 10 is disposed on the first surface 316 of the first substrate 310 to block the recess 314. As such, the optoelectronic component 320 can be placed in the pocket 314 and the active surface 324 of the optoelectronic component 320 can be positioned on the fixture 10 to be coplanar with the first surface 316 of the first substrate 310.

Again, the colloid 330 is filled into the pocket 314 such that the optoelectronic component 320 is secured within the pocket 314 by the colloid 330. The active surface 324 of the photovoltaic element 320 is coplanar with the first surface 316 of the first substrate 310, and the contact 322 is exposed to the colloid 330. After the colloid 330 is cured, the first substrate 310 is turned over, as shown in FIG. 3D.

Next, referring to FIG. 3E , a reconfiguration wiring layer 350 is disposed on the first substrate 310 and the colloid 330 , and the reconfiguration wiring layer 350 extends from the first end surface 342 of the electrical conductor 340 to the contact 322 . Moreover, the conductive bumps 360 are connected to the second end surface 344 of the conductor 340.

Finally, returning to FIG. 3A, the conductive bumps 360 and the solder balls 379 of the driving wafer 378 are connected to the pads 372a of the carrier 370. In this manner, the photo-electric component 320 can be electrically connected to the driving wafer 378 through the re-distribution wiring layer 350, the electrical conductor 340, and the conductive bumps 360 to the carrier 370. The carrier 370 may be a germanium substrate, a ceramic substrate, a printed circuit board, or the like. The photovoltaic device package 300 of the present embodiment is connected by a re-wiring circuit layer 350, a conductor 340, a conductive bump 360, and a carrier 370 instead of being originally wired. The signal transmission path between the driving chip 378 and the photoelectric element 320 can be It is shortened, thereby improving the performance of the photovoltaic device package 300.

It should be noted here that, since FIGS. 3A to 3E are schematic cross-sectional views, in this cross section, the present embodiment only shows one contact 322, one electric conductor 340, and one through hole 312 to illustrate, but in other embodiments. The contacts 322, the conductors 340, and the through holes 312 may also be plural.

The photovoltaic device package of the embodiment of the present invention can be applied to a photovoltaic module, thereby improving the performance of the photovoltaic module by shortening the signal transmission path between the driving wafer and the photovoltaic element. The photovoltaic device package 200 of FIG. 2A will be taken as an example. Of course, in other embodiments, the photovoltaic device package 300 of FIG. 3A may also be used. The type of the photovoltaic device package is not limited thereto.

4 is a schematic diagram of a photovoltaic module in accordance with an embodiment of the present invention. Referring to FIG. 4 , the photovoltaic module 400 of the embodiment includes a photovoltaic device package 200 , a second substrate 480 , and at least one light guiding component 490 . The second substrate 480 is disposed on the first surface 216 of the first substrate 210 of the photovoltaic device package 200. The second substrate 480 has a reflective surface 482 corresponding to the optoelectronic component 220 of the optoelectronic component package 200 to reflect the optical signal emitted from the optoelectronic component 220 or received by the optoelectronic component 220. The light guiding element 490 is disposed between the first substrate 210 and the second substrate 480 for transmitting optical signals. The light guiding element 490 can be an optical fiber, but is not limited thereto. In the present embodiment, the pads 274a on the fourth surface 274 of the carrier 270 are soldered to a printed circuit board 20 to transfer signals from the drive wafer 278 to the printed circuit board 20.

In this embodiment, the first substrate 210 has a first alignment portion 219. The second substrate 480 has a second alignment portion 484, and the first alignment portion 219 is combined with the second alignment portion 484 to combine the first substrate 210 and the second substrate 480. In turn, the light guiding element 490 and the optical element 220 in the photovoltaic module 400 can be accurately aligned to enable the optical signal to be efficiently transmitted therebetween. In this embodiment, the first alignment portion 219 is a registration bump, and the second alignment portion 484 is an alignment groove. However, in other embodiments, the first alignment portion 219 may also be a registration concave. The slot, and the second alignment portion 484 can be a aligning bump.

The optoelectronic module 400 of the present embodiment electrically connects the optoelectronic component 220 to the carrier 270 through the reconfiguration wiring layer 250, the electrical conductor 240 and the conductive bumps 260, and connects the driving wafer 278 to the carrier 270 to make the optoelectronic component. 220 can be coupled to drive die 278 with a shorter signal transfer path. In addition, the optoelectronic module 400 of the present embodiment is coupled to the second alignment portion 484 through the first alignment portion 219 to accurately align the light guiding element 490 and the optical element 220 to improve the efficiency of the optical signal.

In summary, the photovoltaic device package and the photovoltaic module of the present invention form through holes and recesses on the first substrate, place the photovoltaic elements in the recesses, and place the electrical conductors in the through holes, and through the reconfiguration The circuit layer is connected to the first end surface of the electrical conductor and the contact of the photoelectric element, and the second end surface of the electrical conductor is connected to the conductive bump to electrically connect the optical component to the conductive bump. The conductive bumps are disposed on the pads on the carrier to electrically connect the photovoltaic elements to the driving wafers also disposed on the carrier, thereby replacing the photovoltaic elements and driving the wafers by connecting the wires, so that the driving wafers and the photovoltaics are driven. The signal transmission path between components can be shortened to improve performance.

Although the invention has been disclosed above by way of example, it is not intended to be limiting The scope of the present invention is defined by the scope of the appended claims, and the scope of the invention is defined by the scope of the appended claims. Prevail.

D‧‧‧Deep depth

T‧‧‧The thickness of the first substrate

10‧‧‧ fixture

20‧‧‧Printed circuit board

100‧‧‧Looking optoelectronic component package

110‧‧‧Substrate

120‧‧‧Optoelectronic components

130‧‧‧Drive chip

140‧‧‧Printed circuit board

200, 300‧‧‧Photoelectric component package

210, 310‧‧‧ first substrate

212, 312‧‧‧through holes

214, 314‧‧ ‧ pocket

214a‧‧‧ bottom

216, 316‧‧‧ first surface

218, 318‧‧‧ second surface

219‧‧‧The first counter

220, 320‧‧‧Optoelectronic components

222‧‧‧Contacts

224, 324‧‧‧ active surface

230, 330‧‧‧ colloid

240, 340‧‧‧ Electrical conductors

242, 342‧‧‧ first end face

244, 344‧‧‧ second end face

250, 350‧‧‧Reconfigured circuit layers

260, 360‧‧‧ conductive bumps

270, 370‧‧‧ Vehicles

272, 372‧‧‧ third surface

272a, 372a‧‧‧ pads

274, 374‧‧‧ fourth surface

274a, 374a‧‧‧ pads

276, 376‧‧‧ conductive perforations

278, 378‧‧‧ drive wafer

279, 379‧‧‧ solder balls

400‧‧‧Optoelectronic module

480‧‧‧second substrate

482‧‧‧reflecting surface

484‧‧‧Second Matching Department

490‧‧‧Light guiding elements

1 is a schematic view of a conventional photovoltaic element package.

2A is a schematic cross-sectional view of a photovoltaic device package in accordance with an embodiment of the present invention.

2B to 2F are schematic cross-sectional views showing a manufacturing process of the photovoltaic device package of Fig. 2A.

3A is a cross-sectional view of a photovoltaic device package in accordance with another embodiment of the present invention.

3B to 3E are schematic cross-sectional views showing a manufacturing process of the photovoltaic device package of FIG. 3A.

4 is a schematic diagram of a photovoltaic module in accordance with an embodiment of the present invention.

D‧‧‧Deep depth

T‧‧‧The thickness of the first substrate

200‧‧‧Photoelectric component package

210‧‧‧First substrate

212‧‧‧through holes

214‧‧‧ recess

214a‧‧‧ bottom

216‧‧‧ first surface

218‧‧‧ second surface

219‧‧‧The first counter

220‧‧‧Optoelectronic components

222‧‧‧Contacts

224‧‧‧Active surface

230‧‧‧ colloid

240‧‧‧Electrical conductor

242‧‧‧ first end face

244‧‧‧second end face

250‧‧‧Reconfigured circuit layer

260‧‧‧conductive bumps

270‧‧‧ Vehicles

272‧‧‧ third surface

272a‧‧‧ pads

274‧‧‧ fourth surface

274a‧‧‧ pads

276‧‧‧Electrical perforation

278‧‧‧Drive chip

279‧‧‧ solder balls

Claims (15)

A photovoltaic device package comprising: a first substrate having a uniform aperture and a recess; a photovoltaic element disposed in the recess, the optoelectronic component having a contact; a colloid filling the recess to enable The photo-electric component is fixed in the recess, and the contact of the photo-electric component is not covered by the colloid; an electric conductor is disposed in the through-hole; and a circuit layer is disposed on the first substrate and the colloid The circuit layer extends from the electrical conductor to the contact for electrically connecting the optoelectronic component to the electrical conductor. The photovoltaic device package of claim 1, wherein the first substrate has a first surface and a second surface, and the photoelectric element has an active surface for emitting or receiving a An optical signal, and the circuit layer is disposed on the first surface and the colloid, and the active surface is substantially coplanar with the first surface. The photovoltaic device package of claim 1, wherein the recess has a depth smaller than a thickness of the first substrate, and the photovoltaic element is disposed on a bottom surface of the recess. The photovoltaic device package of claim 1, wherein the recess has a depth substantially equal to a thickness of the first substrate, and the recess penetrates the first substrate. The photovoltaic device package of claim 1, further comprising a conductive bump, wherein the conductive body has a first end surface and a second end surface, the first end surface is connected to the circuit layer, and The second end face Connected to the conductive bump. The photovoltaic device package of claim 5, further comprising a carrier having a third surface and a fourth surface, the carrier comprising a plurality of interfaces on the third surface The pad and the plurality of pads on the fourth surface, the pads on the third surface and the pads on the fourth surface respectively pass through the plurality of conductive perforations of the carrier Connected, the conductive bump is connected to one of the pads on the third surface. The photovoltaic device package of claim 6, further comprising a driving chip, wherein the driving chip is connected to the plurality of pads on the third surface through a plurality of solder balls for electrical The photovoltaic element is connected. An optoelectronic module includes: a photo-electric component package comprising: a first substrate having a uniform aperture and a recess; a photovoltaic element disposed in the recess, the optoelectronic component having a contact, the optoelectronic component For emitting or receiving an optical signal; a colloid is filled in the recess to fix the photovoltaic element in the recess, and the contact of the optoelectronic component is not covered by the colloid; an electrical conductor is disposed on the And a circuit layer disposed on the first substrate and the colloid, the circuit layer extending from the electrical conductor to the contact for electrically connecting the optoelectronic component and the electrical conductor; a second substrate And disposed on one side of the first substrate, the second substrate has a reflective surface corresponding to the photoelectric element to reflect the optical signal; The at least one light guiding element is disposed between the first substrate and the second substrate, and the light guiding element is configured to transmit the optical signal. The photovoltaic module of claim 8, wherein the first substrate has a first surface and a second surface, and the photoelectric element has an active surface for emitting or receiving the light. a signal, and the circuit layer is disposed on the first surface and the colloid, and the active surface is substantially coplanar with the first surface. The photovoltaic module of claim 8, wherein the recess has a depth smaller than a thickness of the first substrate, and the photoelectric element is disposed on a bottom surface of the recess. The photovoltaic module of claim 8, wherein the recess has a depth substantially equal to a thickness of the first substrate, and the recess penetrates the first substrate. The photoelectric module of claim 8, further comprising a conductive bump, wherein the conductive body has a first end surface and a second end surface, the first end surface is connected to the circuit layer, and the The second end surface is connected to the conductive bump. The photovoltaic module of claim 12, wherein the photovoltaic device package further comprises a carrier having a third surface and a fourth surface, the carrier comprising the third a plurality of pads on the surface and a plurality of pads on the fourth surface, wherein the pads on the third surface and the pads on the fourth surface respectively pass through the carrier The conductive vias are electrically connected, and the conductive bumps are connected to one of the pads on the third surface. The photovoltaic module according to claim 13 of the patent application, wherein the The photo-electric component package further includes a driving chip, and the driving chip is connected to the plurality of pads on the third surface through a plurality of solder balls for electrically connecting the photovoltaic elements. The photoelectric module of claim 8, wherein the first substrate has a first alignment portion, the second substrate has a second alignment portion, and the first alignment portion is associated with the second pair The bit portion combines the first substrate and the second substrate.