TW201400782A - Adjustable heat dissipation device - Google Patents
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- TW201400782A TW201400782A TW101122690A TW101122690A TW201400782A TW 201400782 A TW201400782 A TW 201400782A TW 101122690 A TW101122690 A TW 101122690A TW 101122690 A TW101122690 A TW 101122690A TW 201400782 A TW201400782 A TW 201400782A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 56
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- 239000004020 conductor Substances 0.000 claims description 3
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- 239000000956 alloy Substances 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
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- 230000033228 biological regulation Effects 0.000 abstract 3
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- 238000012546 transfer Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
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- 238000001816 cooling Methods 0.000 description 2
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Abstract
Description
本發明係提供一種可調式散熱裝置，尤指可輔助預設發熱源快速散熱、降溫之散熱裝置，利用散熱裝置的散熱基座以下座板、上基板分別配合高度調整模組、間距調整模組，在預設發熱源上組裝調整適當密合度、不產生間隙，以達到良好散熱功能。 The invention provides an adjustable heat dissipating device, in particular to a heat dissipating device capable of assisting a preset heat source to quickly dissipate heat and cool down, and the lower base plate and the upper substrate of the heat dissipating base of the heat dissipating device are respectively matched with the height adjusting module and the spacing adjusting module. It is assembled and adjusted on the preset heat source to adjust the proper adhesion and no gap to achieve good heat dissipation.
按，在電子科技時代不斷進步，許多電子、電氣產品的開發、問世，提供人們在生活及工作的環境中，透過各種電子、電氣產品享受不同的生活、工作模式，而在各種電子、電氣產品中，電腦或行動電子產品等與生活、工作之間，最息息相關，而各種類型的電腦如：桌上型電腦、筆記型電腦、平板電腦或個人數位助理〔PDA〕等，都是目前使用最普遍也最頻繁的電子、電氣產品，而該類型電腦或電子、電氣產品中，所應用之電路板、介面卡等，其所設置的各式電子零組件，在應用、運作時產生的熱能，即必須予以快速排散，避免影響可攜式電子、電氣產品的運作，而目前在行動通訊產品或可攜式電子、電氣產品的電路板上發熱源(如：中央處理器〔CPU〕、微處理器或晶片或單晶片等)，因受到空間的限制而無法組裝散熱風扇，都是直接貼附在產品的機殼上，透過產品的機殼輔助電路板散熱，或者透過鋁柱 或銅柱的連接，再電路板的熱源與機殼間成為導熱介質，將電路板上的熱能傳送至機殼上，以進行散熱，但在實際應用、實施時，猶存在些許麻煩與困擾，如： According to the continuous progress in the era of electronic technology, the development and introduction of many electronic and electrical products provide people with different life and work modes through various electronic and electrical products in the environment of living and working, and in various electronic and electrical products. Among them, computers or mobile electronic products are most closely related to life and work, and various types of computers such as desktop computers, notebook computers, tablet computers or personal digital assistants (PDAs) are currently the most used. The most common electronic and electrical products, and the types of computer or electronic and electrical products, the circuit boards and interface cards used, and the various types of electronic components installed in the application, the heat energy generated during operation and operation, That is to say, it must be quickly dissipated to avoid affecting the operation of portable electronic and electrical products. At present, there are heat sources on mobile communication products or portable electronic and electrical products (such as CPUs, CPUs). Processors or wafers or single-chips, etc., cannot be assembled due to space constraints, and are directly attached to the product. On the product through the housing auxiliary cooling circuit board, or through the alumina column Or the connection of the copper column, and the heat source between the heat source of the circuit board and the casing becomes a heat-conducting medium, and the heat energy on the circuit board is transmitted to the casing for heat dissipation, but in practical application and implementation, there are still some troubles and troubles. Such as:
(一)透過鋁柱或銅柱作為電路板與機殼間的熱傳導介質，會因鋁柱或銅柱的重量，造成電子、電氣產品的重量增加，且影響電子、電氣產品的系統避震效果差、防衝擊的反彈力也不佳，容易發生電子、電氣產品在遇到外力時即碎裂的現象。 (1) Through the aluminum column or copper column as the heat conduction medium between the circuit board and the casing, the weight of the electronic or electrical products will increase due to the weight of the aluminum column or the copper column, and the system suspension effect of the electronic and electrical products will be affected. Poor and anti-impact rebound force is not good, and it is prone to breakage of electronic and electrical products when they encounter external forces.
(二)在產品機殼與電路板間，因利用鋁柱或銅柱形成導熱體，也在電路板的與機殼間形成間隙，以致電路板上的發熱源與機殼間的距離加大，反而影響熱傳導的效能，造成在電路板與機殼的間隙內發生積熱現象，散熱效果反而變差。 (2) Between the product casing and the circuit board, the heat conductor is formed by using the aluminum column or the copper column, and a gap is formed between the circuit board and the casing, so that the distance between the heat source and the casing on the circuit board is increased. On the contrary, it affects the efficiency of heat conduction, causing heat accumulation in the gap between the circuit board and the casing, and the heat dissipation effect is worse.
(三)在產品機殼與電路板間欲組裝鋁柱或銅柱時，複數鋁柱或銅柱的尺寸精度必須提高，若稍有尺寸的偏差，會造成電路板與機殼、機體的組裝作業不易控制，導致產品良率降低、可信賴度亦降低。 (3) When assembling an aluminum column or a copper column between the product casing and the circuit board, the dimensional accuracy of the plurality of aluminum columns or copper columns must be improved. If the deviation of the size is slight, the assembly of the circuit board and the casing and the body may be caused. The operation is not easy to control, resulting in lower product yield and lower reliability.
是以，要如何解決目前對於各類型電腦或電子、電氣產品，內部電路板之發熱源的熱能排散不易之缺失與困擾，且透過鋁柱或銅柱的導熱造成各類型電腦或電子、電氣產品組裝作業的問題與麻煩，即為從事此行業者所亟欲改善之方向所在。 Therefore, how to solve the current lack of heat dissipation in the heat dissipation of various types of computers or electronic and electrical products, internal circuit boards, and the heat conduction through aluminum columns or copper columns to cause various types of computers or electronics, electrical The problems and troubles of product assembly operations are the direction that those who are engaged in this industry want to improve.
故，發明人有鑑於上述之問題與缺失，乃搜集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種可以增加導熱接觸面積、縮短散熱路徑、提升散熱效果，方便組裝作業進行之可調式散熱裝置的發明專利誕生者。 Therefore, in view of the above problems and shortcomings, the inventors have collected relevant information, evaluated and considered through multiple parties, and have accumulated many years of experience in the industry, through continuous trial and modification, designed to increase the thermal contact area. The invention patents for shortening the heat dissipation path, improving the heat dissipation effect, and facilitating the assembly operation of the adjustable heat sink device.
本發明之主要目的乃在於該散熱裝置之散熱基座，於下座板、上基板外側邊分別裝設複數熱管，且下座板的底面之抵貼面可供貼附於預設發熱源，並於下座板分別設有複數調節孔、複數定位螺孔，而相對複數定位螺孔於上基板設有複數調移孔，則下座板的各調節孔係供複數高度調整模組，以套裝彈性保持體之調整桿體，分別活動穿設、且利用一側對接部穿伸出下座板的調節孔外，組裝於具有預設發熱源之預設電路板上，可供調整下座板與預設發熱源、預設電路板的間距，再於下座板的各定位螺孔、上基板的各調移孔間分別組裝複數間距調整模組套裝之調移桿體、彈力保持體，上基板外表面並貼附於散熱器具之散熱鰭片、預設電子產品(如：筆記型電腦、平版電腦、電子字典或個人數位助理〔PDA〕等)之機殼或面板，達到利用散熱裝置導引預設發熱源的熱能、並快速向外排散之目的。 The main purpose of the present invention is to provide a heat dissipation base for the heat dissipation device, and a plurality of heat pipes are respectively disposed on the outer sides of the lower seat plate and the upper substrate, and the abutting surface of the bottom surface of the lower seat plate can be attached to the preset heat source. And a plurality of adjusting holes and a plurality of positioning screw holes are respectively arranged on the lower seat plate, and a plurality of adjusting holes are arranged on the upper substrate relative to the plurality of positioning screw holes, wherein the adjusting holes of the lower seat plate are for a plurality of height adjusting modules. The adjusting rod body of the elastic retaining body is separately movably disposed, and is protruded from the adjusting hole of the lower seat plate by using one side butting portion, and assembled on a preset circuit board having a preset heat source for adjustment The spacing between the seat plate and the preset heat source and the preset circuit board, and then the positioning of the plurality of pitch adjustment module sets and the elastic force retention between the positioning screw holes of the lower seat plate and the transfer holes of the upper substrate Body, the outer surface of the upper substrate is attached to the heat sink fin of the heat sink, and the casing or panel of the preset electronic product (such as a notebook computer, a lithographic computer, an electronic dictionary or a personal digital assistant (PDA), etc.) Heat sink guides the preset heat source Heat, and quickly dissipated outwardly of the object.
本發明之次要目的乃在於該散熱裝置之散熱基座，係可利用上基板貼合於散熱鰭片、預設電子產品的機殼或面板， 以透過散熱基座導引預設發熱源之熱能，透過大面積的傳熱、導熱作用，可快速將熱能傳送至散熱鰭片、預設機殼，縮短熱傳導的路徑。 The secondary object of the present invention is to provide a heat dissipation base for the heat dissipation device, which can be attached to the heat dissipation fin and the casing or panel of the preset electronic product by using the upper substrate. The thermal energy of the preset heat source is guided through the heat dissipation base, and the heat transfer and the heat conduction function of the large area can quickly transfer the heat energy to the heat dissipation fins and the preset casing to shorten the heat conduction path.
本發明之再一目的乃在於該散熱裝置之散熱基座，係於下座板、上基板間分別組裝高度調整模組、間距調整模組，而能適度調整下座板與預設發熱源、預設電路板之間的接觸平整度、穩定度、密合度、不產生間隙，避免發生傾斜、翹起的現象，組裝作業並不會受到尺寸的限制、但可以控制組裝的貼附密合度，以供散熱裝置可以適用各種電子產品(如：筆記型電腦、平版電腦、電子字典或個人數位助理〔PDA〕等)的內部空間中，進行快速組裝。 A further object of the present invention is to provide a heat dissipation base of the heat dissipating device, which is respectively assembled with a height adjustment module and a spacing adjustment module between the lower seat plate and the upper substrate, and can appropriately adjust the lower seat plate and the preset heat source, The contact flatness, stability, tightness, and no gap between the preset boards avoid the phenomenon of tilting and lifting, and the assembly work is not limited by the size, but the adhesion of the assembly can be controlled. The heat sink can be quickly assembled in the interior space of various electronic products (such as notebook computers, lithographic computers, electronic dictionaries, or personal digital assistants (PDAs).
為達成上述目的及功效，本發明所採用之技術手段及其構造，茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下，俾利完全瞭解。 In order to achieve the above objects and effects, the technical means and the configuration of the present invention will be described in detail with reference to the preferred embodiments of the present invention.
請參閱第一、二、三、四圖所示，係為本發明之立體外觀圖、立體分解圖、另一方向之立體分解圖、側視剖面圖，由圖中可以清楚看出，本發明之散熱裝置係包括散熱基座1、複數高度調整模組2及複數間距調整模組3，其中：該散熱基座1係包括下座板11、上基板12及複數熱管13，且下座板11底部為設有一個或一個以上之抵貼面111，並設有複數貫穿之調節孔112、定位螺孔113 ，複數調節孔112則分別呈沉孔狀，而相對下座板11的複數定位螺孔113、則於上基板12設有複數調移孔121，再於下座板11、上基板12的相對外側面，分別設有複數卡制槽114、122，以利用各相對式的卡制槽114、122，分別供熱管13嵌入、定位。 Please refer to the first, second, third and fourth figures, which are the perspective view, the exploded view, the exploded view of the other direction, and the side cross-sectional view of the present invention. It can be clearly seen from the figure that the present invention is The heat dissipation device includes a heat dissipation base 1, a plurality of height adjustment modules 2, and a plurality of pitch adjustment modules 3, wherein the heat dissipation base 1 includes a lower seat plate 11, an upper substrate 12, and a plurality of heat pipes 13, and the lower seat plate The bottom portion of the 11 is provided with one or more abutting faces 111, and is provided with a plurality of adjusting holes 112 and positioning screw holes 113. The plurality of adjusting holes 112 are respectively formed in a counterbore shape, and the plurality of positioning screw holes 113 of the lower seat plate 11 are provided with a plurality of adjusting holes 121 on the upper substrate 12, and then opposite to the lower seat plate 11 and the upper substrate 12. The outer side surfaces are respectively provided with a plurality of card slots 114 and 122 for respectively embedding and positioning the heat pipes 13 by using the respective locking grooves 114 and 122.
該複數高度調整模組2係包括複數調整桿體21、套設於各調整桿體21上之彈性保持體22，且各調整桿體21一側頂部分別凸設有環狀桿頭211、另側底部為分別設有扣槽212、扣環213及對接部23，而各對接部23係分別設有位於調整桿體21一側之鎖固螺桿231、供鎖固桿體231鎖固、結合之定位套筒232，並於各定位套筒232內部設有供鎖固螺桿231鎖入之內螺孔233。 The plurality of height adjustment modules 2 include a plurality of adjustment rod bodies 21 and elastic holding bodies 22 that are sleeved on the adjustment rod bodies 21, and an annular rod head 211 is protruded from the top of each of the adjustment rod bodies 21, respectively. The bottom bottom portion is respectively provided with a buckle groove 212, a buckle ring 213 and an abutting portion 23, and each abutting portion 23 is respectively provided with a locking screw 231 on the side of the adjusting rod body 21, and the locking rod body 231 is locked and combined. The positioning sleeve 232 is disposed, and an inner screw hole 233 for locking the locking screw 231 is disposed inside each positioning sleeve 232.
該複數間距調整模組3係包括複數調移桿體31、套設於調移桿體31上之彈力保持體32，且調移桿體31一側頂部凸設有環狀帽頭311、另側底部為設有螺桿312。 The plurality of pitch adjustment modules 3 include a plurality of adjustment lever bodies 31, and an elastic force retaining body 32 sleeved on the adjustment lever body 31, and an annular cap head 311 is protruded from the top of the adjustment lever body 31 side, and another The bottom bottom is provided with a screw 312.
上述各構件於組裝時，係利用散熱基座1之下座板11上複數調節孔112，可供複數高度調整裝模組2之各調整桿體21、分別活動穿設，且各調整桿體21底部之扣槽212、對接部23，並分別穿出各調節孔112外，且於扣槽212處組裝、嵌設扣環213，供調整桿體21不脫離各調節孔12，再於下座板11的複數定位螺孔113、上基板12的複數調移孔121，則供複數間距調整模組3之 各調移桿體31，分別活動穿設於各調移孔121內，再利用各調移桿體31底部之螺桿312，分別鎖設於下座板11之各定位螺孔113，達到調整下座板11、上基板12的相鄰間距，以透過散熱基座1、複數高度調整模組2及複數間距調整模組3，組構成本發明之散熱裝置。 When assembling the above-mentioned components, the plurality of adjusting holes 112 on the lower seat plate 11 of the heat dissipation base 1 are used, and the adjusting rod bodies 21 of the plurality of height adjusting assembly modules 2 are respectively movably disposed, and the adjusting rod bodies are respectively disposed. The buckle groove 212 and the abutting portion 23 at the bottom of the 21 are respectively disposed outside the adjusting holes 112, and the buckle 213 is assembled and embedded at the buckle groove 212, so that the adjusting rod body 21 does not leave the adjusting holes 12, and then The plurality of positioning screw holes 113 of the seat plate 11 and the plurality of adjusting holes 121 of the upper substrate 12 are provided for the plurality of spacing adjustment modules 3 The adjustment lever bodies 31 are respectively disposed in the respective adjustment holes 121, and are respectively locked by the screw 312 at the bottom of each adjustment lever body 31, and are respectively locked to the positioning screw holes 113 of the lower seat plate 11 to be adjusted. The adjacent spacing between the seat plate 11 and the upper substrate 12 is configured to form a heat sink of the present invention through the heat dissipation base 1, the plurality of height adjustment modules 2, and the plurality of pitch adjustment modules 3.
而上述散熱基座1之下座板11、上基板12，係可分別為導熱材質之銅、鋁或錫或金屬合金材質等所製成；且下座板11、上基板12間裝設之複數熱管13，係可分別呈U形狀、L形狀或ㄇ形狀等各種設計之形狀，以供複數熱管13可以分別夾持在下座板11、上基板12的外側表面，並分別嵌入各卡制槽114、122內。 The lower base plate 11 and the upper substrate 12 of the heat dissipation base 1 are respectively made of copper, aluminum or tin or a metal alloy material of a heat conductive material; and the lower base plate 11 and the upper substrate 12 are installed. The plurality of heat pipes 13 may have various designs such as a U shape, an L shape, or a ㄇ shape, so that the plurality of heat pipes 13 may be respectively clamped on the outer surfaces of the lower seat plate 11 and the upper substrate 12, and respectively embedded in the respective card slots. 114, 122.
且複數高度調整模組2的調整桿體21上，套設之彈性保持體22，複數間距調整模組3的調移桿體31上，套設之彈力保持體32，該複數彈性保持體22、複數彈力保持體32，係分別為彈簧或簧片等，具受力變形後自動復位之功能。 And the elastic rod body 21 of the plurality of height adjusting modules 2, the elastic retaining body 22, the adjusting rod body 31 of the plurality of spacing adjusting modules 3, and the elastic retaining body 32, the plurality of elastic retaining bodies 22 The plurality of elastic retaining bodies 32 are respectively springs or reeds, and have the function of automatically resetting after being deformed by force.
請參閱第二、三、五、六、七、八、九、十圖所示，係為本發明之立體分解圖、另一方向之立體分解圖、較佳實施例之立體分解圖、較佳實施例之另一方向立體分解圖、較佳實施例之立體外觀圖、較佳實施例組裝時之立體分解圖、較佳實施例之側視剖面圖、較佳實施例另一方向之側視剖面圖，由圖中可以清楚看出，本發明之散熱裝置係利用散熱基座 1之下座板11，以底部表面一個或一個以上之抵貼面111，分別對位貼附於預設電路板4上之預設發熱源41，並利用下座板11上活動穿設之複數高度調整模組2的調整桿體21，以各調整桿體21之對接部23的定位套筒232，分別組裝於預設電路板4的預設發熱源41周邊之複數穿孔40內，即可利用下座板1上複數調整桿體21，透過底部對接部23之鎖固螺桿231，分別對位鎖入各定位套筒232的內螺孔233，並藉由調整桿體21的鎖固螺桿231、在定位套筒232的內螺孔233中鎖入或退出的調整，配合各調整桿體21上套設之彈性保持體22的彈性伸縮、變形作用，且利用扣槽212處嵌設之扣環213，防止各調整桿體21受彈性保持體22的反彈力影響，而跳出各調節孔112，即可利用各調整桿體21，分別調整下座板11與預設電路板4、預設發熱源41間的貼附密合度、形成平整接觸不產生間隙，以配合不同型式、體積大小之預設發熱源41(可為中央處理器〔CPU〕、微處理器、晶片或單晶片或各式發熱之電子零組件等)進行下座板11的抵貼面111與預設發熱源41表面間，貼合之平整度、穩定度、密合度、不會產生間隙，可以避免散熱基座1發生傾斜或翹起的狀況，以供下座板11可更平整的貼附預設發熱源41與預設電路板4、形成密合無間隙，組裝過程不會受到尺寸限制。 Please refer to the second, third, fifth, sixth, seventh, eighth, ninth and tenth drawings for the perspective view of the present invention, the exploded view of the other direction, the exploded view of the preferred embodiment, and the preferred embodiment. Another perspective view of the embodiment, a perspective view of the preferred embodiment, an exploded perspective view of the preferred embodiment, a side cross-sectional view of the preferred embodiment, and a side view of the preferred embodiment in another direction The cross-sectional view, as can be clearly seen from the figure, the heat sink of the present invention utilizes a heat sink base 1 The lower seat plate 11 is affixed to the preset heat source 41 on the preset circuit board 4 by one or more abutting surfaces 111 on the bottom surface, and is movably disposed on the lower seat plate 11 The adjusting rod body 21 of the plurality of height adjusting modules 2 is respectively assembled in the plurality of through holes 40 around the preset heat source 41 of the predetermined circuit board 4 by the positioning sleeves 232 of the abutting portions 23 of the adjusting rod bodies 21, that is, The plurality of adjusting rods 21 of the lower seat plate 1 can be adjusted, and the locking screws 231 of the bottom abutting portion 23 are respectively locked into the inner screw holes 233 of the positioning sleeves 232, and the locking body 21 is locked. The adjusting and locking of the screw 231 in the inner screw hole 233 of the positioning sleeve 232 cooperates with the elastic expansion and contraction of the elastic retaining body 22 of the adjusting rod body 21, and is embedded in the buckle groove 212. The buckle 213 prevents the adjustment lever body 21 from being affected by the rebound force of the elastic holding body 22, and jumps out of the adjustment holes 112, so that the lower seat plate 11 and the preset circuit board 4 can be respectively adjusted by using the adjustment lever bodies 21, Presetting the adhesion between the heat source 41 and forming a flat contact without generating a gap to match different types The predetermined heat source 41 of the volume (which may be a central processing unit (CPU), a microprocessor, a wafer or a single chip, or various electronic components for heating, etc.) performs the abutting surface 111 of the lower seat plate 11 and the preset heat generation. Between the surfaces of the source 41, the flatness, stability, tightness, and no gap of the bonding can prevent the heat sink base 1 from being tilted or tilted, so that the lower seat plate 11 can be attached to the flatter preset. The heat source 41 is formed in close contact with the predetermined circuit board 4 without gaps, and the assembly process is not limited by size.
且散熱基座1之下座板11固設於預設電路板4後，下座板11與上基板12間，則可透過間距調整模組3，進行相鄰間隔的距離調整，透過間距調整模組3之調移桿體31穿過上基板12的調移孔121，再以螺桿312鎖入下座板11的定位螺孔113中，並配合調移桿體31上套設之彈力保持體32的彈性伸縮、變形作用，調整上基板12與下座板11間的平整度、穩定度，不致發生傾斜或偏位、鬆動的情況、形成相對平衡，而組裝、調整作業不會受到尺寸的限制或公差、間距的影響，並保持下座板11與上基板12間的平衡、穩定，且供上基板12、熱管13可與外部預設電子產品(如：筆記型電腦、平版電腦、電子字典或個人數位助理〔PDA〕等)之機殼5、面板或散熱鰭片等散熱器具接觸，進行穩定的熱能傳送、排散，並透過下座板11、上基板12間設置之複數熱管13，輔助下座板11上接觸預設發熱源41吸收之熱能，快速傳送至上基板12，再由上基板12向外透過機殼5、面板或散熱鰭片等散熱器具進行快速散熱。 The lower base plate 11 of the heat dissipation base 1 is fixed on the predetermined circuit board 4, and between the lower base plate 11 and the upper base plate 12, the distance adjustment module 3 can be transmitted through the spacing adjustment module 3 to adjust the distance between adjacent spaces and adjust the transmission pitch. The adjustment rod body 31 of the module 3 passes through the adjustment hole 121 of the upper substrate 12, and is locked into the positioning screw hole 113 of the lower seat plate 11 by the screw 312, and is matched with the elastic force of the sleeve on the adjustment rod body 31. The elastic expansion and contraction of the body 32 adjusts the flatness and stability between the upper substrate 12 and the lower seat plate 11, so that the tilting, the misalignment, the looseness, and the relative balance are not caused, and the assembly and adjustment operations are not subject to the size. The limitation or tolerance, the influence of the spacing, and maintaining the balance and stability between the lower seat plate 11 and the upper substrate 12, and the upper substrate 12 and the heat pipe 13 can be externally preset with electronic products (eg, a notebook computer, a lithographic computer, An electronic dictionary or a personal digital assistant (PDA), etc., is provided with a heat sink having a casing 5, a panel, or a heat sink fin, and is configured to perform stable heat transfer, discharge, and a plurality of heat pipes disposed between the lower seat plate 11 and the upper substrate 12. 13, the auxiliary lower seat plate 11 is contacted with the preset heat source 41 to suck The thermal energy is transferred quickly oriented substrates 12, 12 and then outwardly through the casing 5 for rapid cooling, radiator panels or the like having a heat dissipation fin on the substrate.
是以，以上所述僅為本發明之較佳實施例而已，非因此侷限本發明之專利範圍，本發明之散熱裝置利用散熱基座1之下座板11、上基板12及複數熱管13，且下座板11配合高度調整模組2，進行與預設電路板4、預設發熱源41間的貼合之平整度、穩定度，作適當的調整避免傾斜或翹 起，再於下座板11與上基板12間，則利用間距調整模組3進行調整相鄰間距、平整度及穩定度，俾可達到散熱基座1平整接觸預設發熱源41，而進行快速吸熱、散熱之目的，並透過散熱基座1的下座板11、上基板12間設置複數熱管13，輔助下座板11將吸收的熱能往上基板12傳送，再利用上基板12組裝於外部預設電子產品(如：筆記型電腦、平版電腦、電子字典或個人數位助理〔PDA〕等)之機殼5、面板或散熱鰭片等散熱器具，達到擴大散熱面積、有效快速散熱之功效，故舉凡可達成前述效果之結構、裝置皆應受本發明所涵蓋，此種簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 Therefore, the above description is only a preferred embodiment of the present invention, and is not limited to the scope of the present invention. The heat sink of the present invention utilizes the lower base plate 11, the upper substrate 12, and the plurality of heat pipes 13 of the heat dissipation base 1, The lower seat plate 11 cooperates with the height adjustment module 2 to perform flatness and stability with the preset circuit board 4 and the preset heat source 41, and is appropriately adjusted to avoid tilting or tilting. Then, between the lower seat plate 11 and the upper substrate 12, the pitch adjustment module 3 is used to adjust the adjacent pitch, the flatness and the stability, so that the heat dissipation base 1 can be flatly contacted with the preset heat source 41, and For the purpose of rapid heat absorption and heat dissipation, a plurality of heat pipes 13 are disposed between the lower base plate 11 and the upper substrate 12 of the heat dissipation base 1, and the auxiliary lower plate 11 transports the absorbed heat energy to the upper substrate 12, and is assembled by the upper substrate 12 Externally preset electronic products (such as notebook computers, lithographic computers, electronic dictionaries or personal digital assistants (PDAs), etc.), such as the casing 5, panels or heat sink fins, to achieve increased heat dissipation area, effective heat dissipation Therefore, the structures and devices that can achieve the foregoing effects are all covered by the present invention. Such simple modifications and equivalent structural changes are equally included in the scope of the patent of the present invention and are combined with Chen Ming.
上述本發明之可調式散熱裝置於實際應用、實施時，為可具有下列各項優點，如： The above-mentioned adjustable heat sink of the present invention can have the following advantages in practical application and implementation, such as:
(一)散熱基座1透過下座板11貼合預設發熱源41，再以上基板12接觸外部預設電子產品之機殼5或散熱鰭片等散熱器具，且下座板11與上基板12間再裝設複數熱管13，可將下座板11吸收預設發熱源41的熱能、快速往上基板12及預設機殼5傳送，達到進行快速散熱之目的。 (1) The heat dissipation base 1 is attached to the preset heat source 41 through the lower seat plate 11, and the upper substrate 12 is in contact with the heat sink having a casing 5 or a heat sink fin of an external preset electronic product, and the lower seat plate 11 and the upper substrate The 12 re-installed plurality of heat pipes 13 can absorb the heat energy of the preset heat source 41 and quickly transfer to the upper substrate 12 and the preset casing 5 to achieve rapid heat dissipation.
(二)散熱基座1係透過高度調整模組2，調整下座板11與預設發熱源41間、形成緊密貼合的效果、不會產生間隙，下座板11與上基板12間，再利用間距調 整模組3調整相鄰的平整度、穩定度，使預設發熱源41與外部預設產品的機殼5、面板或散熱鰭片等散熱器具間，不產生間隙，並藉散熱基座1擴大接觸面積、增加熱傳導速度，具有快速傳導熱能之效果。 (2) The heat dissipation base 1 is passed through the height adjustment module 2 to adjust the effect of forming a close fit between the lower seat plate 11 and the preset heat source 41, and no gap is formed between the lower seat plate 11 and the upper substrate 12. Reuse pitch The whole module 3 adjusts the adjacent flatness and stability, so that the preset heat source 41 and the heat sink of the casing 5, the panel or the heat sink fin of the external preset product do not generate a gap, and the heat sink base 1 Expanding the contact area, increasing the heat transfer rate, and having the effect of rapidly conducting heat energy.
(三)散熱基座1透過高度調整模組2、間距調整模組3，進行組裝作業與散熱基座1與預設發熱源41、預設電子產品機殼5、面板或散熱鰭片等散熱器具間的平整度、穩定度、密合度等調整、組裝及調整作業不會受到尺寸限制，組裝作業簡易、快速。 (3) The heat dissipation base 1 passes through the height adjustment module 2 and the pitch adjustment module 3, and performs assembly work and heat dissipation of the heat dissipation base 1 and the preset heat source 41, the preset electronic product casing 5, the panel or the heat dissipation fins. The adjustment, assembly and adjustment of the flatness, stability, and fit between the appliances are not limited by the size, and the assembly work is simple and fast.
故，本發明為主要針對熱裝置設計，係利用散熱基座之下座板與預設電路板的預設發熱源接觸，並透過高度調整模組調整下座板與預設發熱源間的接觸平整度、穩定度、密合度、形成緊密貼合、不會產生間隙，而下座板與上基板間，即藉間距調整模組進行平整度、穩定度的調整，避免發生傾斜或翹起的現象，而可達到散熱基座與預設發熱源間形成大面積接觸、快速傳輸熱能、進行散熱為主要保護重點，並利用下座板與上基板間設置的複數熱管，輔助下座板的熱能快速往上基板傳送，乃僅使散熱基座具有良好的散熱功能之優勢，且散熱基座可以透過上基板、將熱能傳送至外部預設產品之機殼、面板或散熱鰭片等散熱器具，對外進行大面積的散熱，供預設發熱源可以快速排散熱能，惟，以上所述僅為本發明之較佳實施例而已，非因此即侷限本發明之專利範圍 ，故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化，均應同理包含於本發明之專利範圍內，合予陳明。 Therefore, the present invention is mainly directed to the design of the thermal device, which uses the lower base plate of the heat dissipation base to contact the preset heat source of the preset circuit board, and adjusts the contact between the lower seat plate and the preset heat source through the height adjustment module. Flatness, stability, tightness, tight fit, no gaps, and between the lower base plate and the upper base plate, that is, the adjustment of the flatness and stability by the spacing adjustment module to avoid tilting or lifting Phenomenon, it can reach a large area contact between the heat sink base and the preset heat source, fast transfer heat energy, heat dissipation as the main protection focus, and use the multiple heat pipes provided between the lower seat plate and the upper substrate to assist the heat energy of the lower seat plate The fast transfer to the upper substrate only has the advantage that the heat dissipation base has a good heat dissipation function, and the heat dissipation base can transmit the heat energy to the heat sink of the external preset body, the panel or the heat sink fin through the upper substrate. A large area of heat is radiated externally, and the preset heat source can quickly dissipate heat. However, the above description is only a preferred embodiment of the present invention, and thus is not limited to the present invention. Scope Therefore, all the modifications and equivalent structural changes made by the description and the drawings of the present invention are included in the scope of the patent of the present invention and are combined with Chen Ming.
綜上所述，本發明上述之可調式散熱裝置於實施、應用時，為確實能達到其功效及目的，故本發明誠為一實用性優異之研發，為符合發明專利之申請要件，爰依法提出申請，盼審委早日賜准本案，以保障發明人之辛苦研發、創設，倘若 鈞局審委有任何稽疑，請不吝來函指示，發明人定當竭力配合，實感德便。 In summary, the above-mentioned adjustable heat sink of the present invention can achieve its efficacy and purpose when implemented and applied. Therefore, the present invention is an excellent research and development, and is an application for conforming to the invention patent. To file an application, I hope that the trial committee will grant the case as soon as possible to protect the inventor's hard work in research and development, and if there is any doubt in the audit committee, please do not hesitate to give instructions, the inventor will try his best to cooperate, and feel really good.
1‧‧‧散熱基座 1‧‧‧heating base
11‧‧‧下座板 11‧‧‧ Lower seat board
111‧‧‧抵貼面 111‧‧‧Resist
112‧‧‧調節孔 112‧‧‧Adjustment hole
113‧‧‧定位螺孔 113‧‧‧ Positioning screw holes
114‧‧‧卡制槽 114‧‧‧ card slot
12‧‧‧上基板 12‧‧‧Upper substrate
121‧‧‧調移孔 121‧‧‧Transfer hole
122‧‧‧卡制槽 122‧‧‧ card slot
13‧‧‧複數熱管 13‧‧‧Multiple heat pipes
2‧‧‧高度調整模組 2‧‧‧ Height adjustment module
21‧‧‧調整桿體 21‧‧‧Adjusting the rod body
23‧‧‧對接部 23‧‧‧Docking Department
211‧‧‧桿頭 211‧‧‧ head
212‧‧‧扣槽 212‧‧‧ buckle groove
213‧‧‧扣環 213‧‧‧ buckle
22‧‧‧彈性保持體 22‧‧‧Elastic retaining body
231‧‧‧鎖固螺桿 231‧‧‧Locking screw
232‧‧‧定位套筒 232‧‧‧ positioning sleeve
233‧‧‧內螺孔 233‧‧‧Inner hole
3‧‧‧間距調整模組 3‧‧‧pitch adjustment module
31‧‧‧調移桿體 31‧‧‧Transfer rod body
311‧‧‧帽頭 311‧‧‧ hat head
312‧‧‧螺桿 312‧‧‧ screw
32‧‧‧彈力保持體 32‧‧‧ Elastic retaining body
4‧‧‧電路板 4‧‧‧ boards
40‧‧‧穿孔 40‧‧‧Perforation
41‧‧‧發熱源 41‧‧‧heat source
5‧‧‧機殼 5‧‧‧Shell
第一圖 係為本發明之立體外觀圖。 The first figure is a three-dimensional appearance of the present invention.
第二圖 係為本發明之立體分解圖。 The second figure is a perspective exploded view of the present invention.
第三圖 係為本發明另一方向之立體分解圖。 The third figure is an exploded perspective view of another direction of the present invention.
第四圖 係為本發明之側視剖面圖。 The fourth drawing is a side cross-sectional view of the present invention.
第五圖 係為本發明較佳實施例之立體分解圖。 Figure 5 is a perspective exploded view of a preferred embodiment of the present invention.
第六圖 係為本發明較佳實施例之另一方向立體分解圖。 Figure 6 is a perspective exploded view of another preferred embodiment of the present invention.
第七圖 係為本發明較佳實施例之立體外觀圖。 Figure 7 is a perspective view of a preferred embodiment of the present invention.
第八圖 係為本發明較佳實施例組裝時之立體分解圖。 The eighth drawing is an exploded perspective view of the preferred embodiment of the present invention when assembled.
第九圖 係為本發明較佳實施例之側視剖面圖。 Figure 9 is a side cross-sectional view of a preferred embodiment of the present invention.
第十圖 係為本發明較佳實施例另一方向之側視剖面圖。 Figure 10 is a side cross-sectional view showing another direction of the preferred embodiment of the present invention.
1‧‧‧散熱基座 1‧‧‧heating base
11‧‧‧下座板 11‧‧‧ Lower seat board
112‧‧‧調節孔 112‧‧‧Adjustment hole
113‧‧‧定位螺孔 113‧‧‧ Positioning screw holes
114‧‧‧卡制槽 114‧‧‧ card slot
12‧‧‧上基板 12‧‧‧Upper substrate
121‧‧‧調移孔 121‧‧‧Transfer hole
122‧‧‧卡制槽 122‧‧‧ card slot
13‧‧‧複數熱管 13‧‧‧Multiple heat pipes
2‧‧‧高度調整模組 2‧‧‧ Height adjustment module
21‧‧‧調整桿體 21‧‧‧Adjusting the rod body
211‧‧‧桿頭 211‧‧‧ head
212‧‧‧扣槽 212‧‧‧ buckle groove
213‧‧‧扣環 213‧‧‧ buckle
22‧‧‧彈性保持體 22‧‧‧Elastic retaining body
23‧‧‧對接部 23‧‧‧Docking Department
231‧‧‧鎖固螺桿 231‧‧‧Locking screw
3‧‧‧間距調整模組 3‧‧‧pitch adjustment module
31‧‧‧調移桿體 31‧‧‧Transfer rod body
311‧‧‧帽頭 311‧‧‧ hat head
312‧‧‧螺桿 312‧‧‧ screw
32‧‧‧彈力保持體 32‧‧‧ Elastic retaining body
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101122690A TWI499752B (en) | 2012-06-25 | 2012-06-25 | Adjustable heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101122690A TWI499752B (en) | 2012-06-25 | 2012-06-25 | Adjustable heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201400782A true TW201400782A (en) | 2014-01-01 |
| TWI499752B TWI499752B (en) | 2015-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101122690A TWI499752B (en) | 2012-06-25 | 2012-06-25 | Adjustable heat sink |
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| Country | Link |
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| TW (1) | TWI499752B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673129A (en) * | 2017-10-16 | 2019-04-23 | 宇瞻科技股份有限公司 | With can modulation radiating surface position radiator |
| CN110831394A (en) * | 2018-08-13 | 2020-02-21 | 中兴通讯股份有限公司 | Heat dissipation structure and electronic equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060060328A1 (en) * | 2004-09-21 | 2006-03-23 | Ingo Ewes | Heat-transfer devices |
| TW201005488A (en) * | 2008-07-18 | 2010-02-01 | Foxconn Tech Co Ltd | Heat dissipation device |
| CN201435040Y (en) * | 2009-03-31 | 2010-03-31 | 上海研祥智能科技有限公司 | Radiator of industrial computer |
-
2012
- 2012-06-25 TW TW101122690A patent/TWI499752B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673129A (en) * | 2017-10-16 | 2019-04-23 | 宇瞻科技股份有限公司 | With can modulation radiating surface position radiator |
| CN110831394A (en) * | 2018-08-13 | 2020-02-21 | 中兴通讯股份有限公司 | Heat dissipation structure and electronic equipment |
| EP3840556A4 (en) * | 2018-08-13 | 2021-10-13 | ZTE Corporation | Heat dissipation structure and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI499752B (en) | 2015-09-11 |
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