TW201407876A - Dielectric conduit for EHF communication - Google Patents
Dielectric conduit for EHF communication Download PDFInfo
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- TW201407876A TW201407876A TW102121711A TW102121711A TW201407876A TW 201407876 A TW201407876 A TW 201407876A TW 102121711 A TW102121711 A TW 102121711A TW 102121711 A TW102121711 A TW 102121711A TW 201407876 A TW201407876 A TW 201407876A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/122—Dielectric loaded (not air)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/02—Waveguide horns
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
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- H10W44/248—
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- H10W72/884—
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- H10W90/734—
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- H10W90/754—
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Abstract
一種用於電磁EHF信號傳播的介電導管,其中該介電導管含有一介電材料的長型本體,其在一第一終端與一第二終端之間沿一縱向軸線連續地延伸,其中在沿該縱向軸線上的各點處該長型本體的正交截面在沿該截面的主要軸線上具有一第一維度,其中該主要軸線沿該截面的最大維度延伸,和一沿該截面之次要軸線的第二維度,其中該次要軸線沿對該主要軸線呈直角的截面最寬維度延伸;以及,對於該長型本體的各個截面,該第一維度大於該電磁EHF信號的波長,並且該第二維度小於該電磁EHF信號的波長。A dielectric conduit for electromagnetic EHF signal propagation, wherein the dielectric conduit comprises an elongated body of dielectric material extending continuously along a longitudinal axis between a first terminal and a second terminal, wherein An orthogonal cross-section of the elongate body at various points along the longitudinal axis has a first dimension along a major axis along the cross-section, wherein the major axis extends along a largest dimension of the cross-section, and a second along the cross-section a second dimension of the axis, wherein the secondary axis extends along a widest dimension of the section at right angles to the primary axis; and, for each section of the elongated body, the first dimension is greater than a wavelength of the electromagnetic EHF signal, and The second dimension is less than the wavelength of the electromagnetic EHF signal.
Description
本揭示概略有關一種用於EHF通訊,包含利用介電導引結構和射束聚焦結構所進行之通訊,的裝置、系統及方法。 The present disclosure is generally directed to an apparatus, system, and method for EHF communication including communication using a dielectric guiding structure and a beam focusing structure.
在半導體製造及電路設計技術上的進步促使發展並生產出具有日益提高之操作頻率的IC。因此,併有此等積體電路之電子產品和系統能夠提供相較於先前產品更為強大的功能性。此項增生的功能性概略包含按照更快速度來處理更多的資料量。 Advances in semiconductor fabrication and circuit design technology have led to the development and production of ICs with ever-increasing operating frequencies. Therefore, electronic products and systems with such integrated circuits can provide more powerful functionality than previous products. The functional outline of this hyperplasia involves processing more data at a faster rate.
許多電子系統含有多個印刷電路板(PCB),這些高速IC係經裝設其等之上,同時可經此以對該等IC路由往返傳送各種信號。對於裝設有至少兩片PCB並且需要在這些PCB之間傳通資訊的電子系統,現已開發出各式連接器和背板架構以促成該等機板之間的資訊流通。然不幸地,此等連接器及背板架構會將各種阻抗不連續性引入到信號路徑內,導致信號品質或整體性出現劣化。藉由像是攜帶信號之機械性連接器之傳統方式的機板連接通常會產生不連續性,而這需要高成本的電子元件以利解決。傳統的機械性連接器亦可能隨時間而磨損,需要精確的校準作業與製造方法,同時易受機械推撞問題的影響。 Many electronic systems contain a plurality of printed circuit boards (PCBs) that are mounted on top of them, and thereby can route various signals to and from the ICs. For electronic systems equipped with at least two PCBs and requiring communication between these PCBs, various connector and backplane architectures have been developed to facilitate the flow of information between the boards. Unfortunately, these connector and backplane architectures introduce various impedance discontinuities into the signal path, resulting in degradation of signal quality or integrity. Conventional board connections, such as mechanical connectors that carry signals, typically create discontinuities that require costly electronic components to solve. Conventional mechanical connectors can also wear out over time, requiring precise calibration and manufacturing methods, and are susceptible to mechanical impact problems.
傳統連接器的這些特徵可能導致信號整體性的劣化以及需 按各種高速率進行資料傳送的電子系統不穩定,如此又會對該等產品的可用度造成限制。傳統連接器的不利特徵會導致信號整體性的劣化以及經設計以按各種高速率進行資料傳送的電子系統相對應的不穩定問題,從而侷限該等系統的可用度。據此,確需多項方法及系統以供耦接高資料速率信號路徑的不連續部分,然又不致產生與可插入實體連接器和等化電路相關聯的成本及電力消耗。此外,亦需多項方法及系統以供確保此等解決方案擁有製造簡易性、模組化與效率度。 These characteristics of traditional connectors may lead to degradation of signal integrity and the need Electronic systems that transmit data at various high rates are unstable, which in turn limits the availability of such products. Disadvantages of conventional connectors can result in degradation of signal integrity and instability associated with electronic systems designed to transmit data at various high rates, thereby limiting the availability of such systems. Accordingly, multiple methods and systems are needed to couple discrete portions of a high data rate signal path without the cost and power consumption associated with pluggable physical connectors and equalization circuits. In addition, a number of methods and systems are required to ensure that these solutions are easy to manufacture, modular and efficient.
此等系統的範例可如美國專利第5,621,913號和美國專利申請案第12/655,041號案文中所揭示。茲將本案中所參照之該等與所有其他公開文件為所有目的依其等整體而按參考方式併入本案。 Examples of such systems are disclosed in U.S. Patent No. 5,621,913 and U.S. Patent Application Serial No. 12/655,041. These and all other publicly available documents referred to in this application are hereby incorporated by reference in their entirety for all purposes.
在一實施例裡,本發明是針對一種用於具有至少一已知波長之電磁EHF信號傳播的介電導管,其中該介電導管含有一第一介電材料的長型本體,其在一第一終端與一第二終端之間沿一縱向軸線連續地延伸,其中在沿該縱向軸線上的各點處該長型本體的正交截面在沿該截面的主要軸線上具有一第一維度,其中該主要軸線沿該截面的最大維度延伸,和一沿該截面之次要軸線的第二維度,其中該次要軸線沿對該主要軸線呈直角的截面最寬維度延伸;以及,對於該長型本體的各個截面,該第一維度大於該電磁EHF信號的已知波長,並且該第二維度小於該電磁EHF信號的已知波長。 In one embodiment, the present invention is directed to a dielectric conduit for electromagnetic EHF signal propagation having at least one known wavelength, wherein the dielectric conduit includes a long body of a first dielectric material, A terminal and a second terminal extend continuously along a longitudinal axis, wherein the orthogonal cross-section of the elongated body at each point along the longitudinal axis has a first dimension along a major axis along the cross-section, Wherein the primary axis extends along a largest dimension of the section and a second dimension along a minor axis of the section, wherein the secondary axis extends along a widest dimension of the section at right angles to the primary axis; and, for the length Each section of the body is larger than a known wavelength of the electromagnetic EHF signal and the second dimension is less than a known wavelength of the electromagnetic EHF signal.
在本實施例中,該長型本體具有一表面,其中該表面之面積的至少四分之一是被一第一反射性包覆所覆蓋,此包覆係一反射性材料或 是多個反射性材料的組合,而經組態設定以在當沿該長型本體的長度上傳播該電磁EHF信號時能夠予以反射。 In this embodiment, the elongated body has a surface, wherein at least one quarter of the area of the surface is covered by a first reflective coating, the coating is a reflective material or It is a combination of multiple reflective materials that are configured to reflect when the electromagnetic EHF signal is propagated along the length of the elongated body.
在另一實施例裡,本發明是關於一種用於該電磁EHF信號傳播的導管,該導管含有複數個介電材料的長型本體,各個長型本體係經組態設定以傳播獨立的電磁EHF信號,並且各個長型本體的介電材料為相同或互異。該等長型本體各者在一第一終端與一第二終端之間沿一縱向軸線連續地延伸,並且在沿該縱向軸線上的各點處各個長型本體的正交截面在沿該截面的主要軸線上具有一第一維度,其中該主要軸線係經定義為該截面的最大維度,和一沿該截面之次要軸線的第二維度,其中該次要軸線係經定義為對該主要軸線呈直角的截面最寬維度。 In another embodiment, the present invention is directed to a conduit for the propagation of electromagnetic EHF signals, the conduit comprising a plurality of elongated bodies of dielectric material, each elongated system configured to propagate an independent electromagnetic EHF Signals, and the dielectric materials of the individual elongated bodies are the same or different. Each of the elongate bodies extends continuously along a longitudinal axis between a first terminal and a second terminal, and orthogonal cross sections of the respective elongate bodies along the cross section along the longitudinal axis are along the cross section The main axis has a first dimension, wherein the major axis is defined as the largest dimension of the section, and a second dimension along the minor axis of the section, wherein the secondary axis is defined as the primary dimension The axis has the widest dimension of the cross section at right angles.
對於各個長型本體的該等各個截面,該第一維度大於待沿該長型本體所傳播之電磁EHF信號的已知波長,而該第二維度則小於待沿該長型本體所傳播之電磁EHF信號的已知波長。此外,對於該等複數個長型本體各者的至少一局部,該等複數個長型本體以組合方式延伸並且彼此相鄰,其中各個長型本體是藉一第一反射性包覆而分離於各個相鄰長型本體,此包覆係一反射性材料或是多個反射性材料的組合,而經組態設定以在當沿該等長型本體的長度上傳播該電磁EHF信號時能夠予以反射。 For each of the sections of each elongated body, the first dimension is greater than a known wavelength of the electromagnetic EHF signal to be propagated along the elongated body, and the second dimension is less than the electromagnetic wave to be propagated along the elongated body The known wavelength of the EHF signal. In addition, for at least a portion of each of the plurality of elongated bodies, the plurality of elongated bodies extend in combination and adjacent to each other, wherein each elongated body is separated by a first reflective coating Each adjacent elongate body, the cladding being a reflective material or a combination of a plurality of reflective materials, configured to be capable of imparting electromagnetic EHF signals along the length of the elongate body reflection.
在又另一實施例裡,本發明是關於一種沿一如前所述之導管傳播電磁EHF信號的方法,其中該方法包含利用電磁EHF傳送器以傳送電磁EHF信號;將該導管之長型本體的第一終端設置為鄰近於該EHF傳送器,故而將該所傳電磁EHF信號的至少一局部透過該第一終端導向至該長型本體內;以及將該電磁EHF信號的所導向局部沿該長型本體傳播至該長 型本體的第二終端。 In still another embodiment, the present invention is directed to a method of propagating an electromagnetic EHF signal along a conduit as described above, wherein the method includes utilizing an electromagnetic EHF transmitter to transmit an electromagnetic EHF signal; the elongated body of the conduit The first terminal is disposed adjacent to the EHF transmitter, such that at least a portion of the transmitted electromagnetic EHF signal is directed through the first terminal into the elongated body; and the guided portion of the electromagnetic EHF signal is along the Long body propagates to the length The second terminal of the type body.
102‧‧‧晶粒 102‧‧‧ grain
104‧‧‧導體連接器 104‧‧‧Conductor connector
106‧‧‧傳導器 106‧‧‧transmitters
108‧‧‧裹封材料 108‧‧‧Wraping materials
110‧‧‧PCB接地平面 110‧‧‧PCB ground plane
112‧‧‧疊覆層 112‧‧‧Overlay
114‧‧‧極高頻(EHF)通訊晶片 114‧‧‧Every high frequency (EHF) communication chip
116‧‧‧連接器印刷電路板(PCB) 116‧‧‧Connector Printed Circuit Board (PCB)
202‧‧‧晶粒 202‧‧‧ grain
204‧‧‧導體連接器 204‧‧‧Conductor connector
206‧‧‧傳導器 206‧‧‧transmitters
208‧‧‧裹封材料 208‧‧‧Wraping materials
214‧‧‧EHF通訊晶片 214‧‧‧EHF communication chip
218‧‧‧導線框架 218‧‧‧ lead frame
220‧‧‧天線連附接線 220‧‧‧Antenna connection wiring
222‧‧‧介電導管 222‧‧‧ dielectric conduit
224‧‧‧長型本體 224‧‧‧Long body
226‧‧‧縱向軸線 226‧‧‧ longitudinal axis
228‧‧‧第一維度 228‧‧‧ first dimension
230‧‧‧第二維度 230‧‧‧ second dimension
232‧‧‧包覆材料 232‧‧‧Covering materials
240‧‧‧截面 240‧‧‧section
242‧‧‧主要軸線 242‧‧‧ main axis
244‧‧‧次要軸線 244‧‧‧ secondary axis
246‧‧‧截面 246‧‧‧section
248‧‧‧截面 248‧‧‧section
300‧‧‧介電導管 300‧‧‧ dielectric conduit
302‧‧‧長型本體 302‧‧‧Long body
304‧‧‧第一終端 304‧‧‧ first terminal
306‧‧‧第二終端 306‧‧‧second terminal
308‧‧‧第一橫向表面 308‧‧‧First lateral surface
310‧‧‧第二橫向表面 310‧‧‧Second lateral surface
312‧‧‧第一主要表面 312‧‧‧ first major surface
314‧‧‧第二主要表面 314‧‧‧ second major surface
316‧‧‧長度 316‧‧‧ length
318‧‧‧寬度 318‧‧‧Width
320‧‧‧深度 320‧‧‧depth
322‧‧‧包覆 322‧‧‧Cover
400‧‧‧EHF電磁通訊系統 400‧‧‧EHF electromagnetic communication system
402‧‧‧第一EHF通訊晶片 402‧‧‧First EHF Communication Chip
404‧‧‧第二EHF通訊晶片 404‧‧‧Second EHF communication chip
406‧‧‧PCB基板 406‧‧‧PCB substrate
500‧‧‧EHF通訊系統 500‧‧‧EHF communication system
502‧‧‧介電導管 502‧‧‧ dielectric conduit
504‧‧‧第一EHF通訊晶片 504‧‧‧First EHF communication chip
506‧‧‧第二EHF通訊晶片 506‧‧‧Second EHF communication chip
508‧‧‧第一耦接特性 508‧‧‧First coupling characteristics
510‧‧‧長型立方體 510‧‧‧ long cube
512‧‧‧第二耦接特性 512‧‧‧Second coupling characteristics
602‧‧‧耦接特性 602‧‧‧ coupling characteristics
604‧‧‧長方形-金字塔狀平截頭體 604‧‧‧Rectangular-pyramidal frustum
606‧‧‧基底 606‧‧‧Base
608‧‧‧頂部 608‧‧‧ top
610‧‧‧終端 610‧‧‧ Terminal
612‧‧‧長型立方體 612‧‧‧ long cube
613‧‧‧頂部高度 613‧‧‧ top height
614‧‧‧基底高度 614‧‧‧base height
615‧‧‧頂部寬度 615‧‧‧ top width
616‧‧‧基底寬度 616‧‧‧Base width
618‧‧‧介電介面平板 618‧‧‧Dielectric interface tablet
620‧‧‧平板厚度 620‧‧‧ plate thickness
700‧‧‧介電導管 700‧‧‧ dielectric conduit
702‧‧‧耦接特性 702‧‧‧ coupling characteristics
704‧‧‧介電號角片 704‧‧‧Dielectric horn
706‧‧‧介電介面平板 706‧‧‧Dielectric interface tablet
708‧‧‧EHF電磁信號來源 708‧‧‧EHF electromagnetic signal source
800‧‧‧介電導管 800‧‧‧ dielectric conduit
802‧‧‧耦接特性 802‧‧‧ coupling characteristics
804‧‧‧第一介電透鏡 804‧‧‧First dielectric lens
806‧‧‧第二介電透鏡 806‧‧‧Second dielectric lens
808‧‧‧EHF電磁信號來源 808‧‧‧EHF electromagnetic signal source
810‧‧‧介電導管終端 810‧‧‧ Dielectric conduit terminal
900‧‧‧第一長型介電立方體 900‧‧‧First long dielectric cube
902‧‧‧第二長型介電立方體 902‧‧‧Second long dielectric cube
904‧‧‧包覆材料 904‧‧‧Cover material
1000‧‧‧第一長型介電立方體 1000‧‧‧First long dielectric cube
1002‧‧‧第二長型介電立方體 1002‧‧‧Second long dielectric cube
1004‧‧‧包覆材料 1004‧‧‧Cover material
1018‧‧‧介電導管 1018‧‧‧ dielectric conduit
1020‧‧‧長型本體 1020‧‧‧Long body
1022‧‧‧長型本體 1022‧‧‧Long body
1024‧‧‧長型本體 1024‧‧‧long body
1026‧‧‧長型本體 1026‧‧‧Long body
1028‧‧‧包覆 1028‧‧‧Cover
現將參照隨附圖式以說明多個實施例。在該等圖式中,類似參考編號係表述等同或功能性類似的構件。 A number of embodiments will now be described with reference to the accompanying drawings. In the drawings, like reference numerals are used to refer to the
圖1為根據本發明之一實施例之一EHF通訊晶片的側視圖,圖中顯示一些內部元件。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view of an EHF communication wafer in accordance with one embodiment of the present invention showing some internal components.
圖2為圖1之EHF通訊晶片的立體圖。 2 is a perspective view of the EHF communication chip of FIG. 1.
圖3為根據本發明之一實施例之一介電導管節段的立體圖。 3 is a perspective view of a dielectric conduit segment in accordance with an embodiment of the present invention.
圖4A-4C為根據本發明之特定實施例之代表性介電導管的截面視圖。 4A-4C are cross-sectional views of representative dielectric conduits in accordance with certain embodiments of the present invention.
圖5為根據本發明之另一實施例之一介電導管的立體圖。 Figure 5 is a perspective view of a dielectric conduit in accordance with another embodiment of the present invention.
圖6為根據本發明之又另一實施例之一EHF電磁通訊系統的半示意側視圖。 6 is a semi-schematic side view of an EHF electromagnetic communication system in accordance with yet another embodiment of the present invention.
圖7為根據本發明之另一實施例之一替代性EHF電磁通訊系統的略圖說明。 Figure 7 is a schematic illustration of an alternative EHF electromagnetic communication system in accordance with another embodiment of the present invention.
圖8為根據本發明之一實施例之一示範性耦接特性的立體圖。 8 is a perspective view of an exemplary coupling feature in accordance with an embodiment of the present invention.
圖9為根據本發明之一實施例之一鄰接於EHF信號來源之耦接特性的略圖說明。 Figure 9 is a schematic illustration of the coupling characteristics of a source adjacent to an EHF signal in accordance with one embodiment of the present invention.
圖10為根據本發明之一實施例之一鄰接於EHF信號來源之替代性耦接特性的略圖說明。 Figure 10 is a schematic illustration of an alternative coupling feature adjacent to an EHF signal source in accordance with one embodiment of the present invention.
圖11描繪根據本發明之一實施例之一介電導管的局部。 Figure 11 depicts a portion of a dielectric conduit in accordance with an embodiment of the present invention.
圖12描繪根據本發明之一實施例之一替代性介電導管的局部。 Figure 12 depicts a portion of an alternative dielectric catheter in accordance with one embodiment of the present invention.
圖13描繪根據本發明之一實施例之又另一替代性介電導管的局部。 Figure 13 depicts a portion of yet another alternative dielectric conduit in accordance with an embodiment of the present invention.
第14圖為說明一根據本發明實施例之方法的流程圖。 Figure 14 is a flow chart illustrating a method in accordance with an embodiment of the present invention.
本揭示雖可受於各種修改及替代形式,然確藉由各圖式中之實例以顯示其特定實施例並在此加以詳細說明。應瞭解該等圖式以及對於其等之詳細說明並非意欲將本揭示限制在所揭示的特定形式,而是相反地,其目的為涵蓋所有歸屬於按如後載申請專利範圍所定義之本揭示精神與範疇內的修改、等同與替代項目。 The present disclosure is susceptible to various modifications and alternative forms, and the specific embodiments of the embodiments are shown in the drawings. It is to be understood that the appended claims are not intended to Modifications, equivalents, and alternatives within the spirit and scope.
在下列說明中列述出眾多特定細節,藉此供以通徹地瞭解本揭示。現將參照本揭示主題項目的多項實施例,其等範例可如隨附圖式中所示。本揭示主題項目雖為經併同於該等實施例所描述,然應瞭解此非欲以僅將本揭示主題項目限制於該等特定實施例。相反地,本揭示主題項目係欲涵蓋可經納入於按如後載申請專利範圍所定義之本揭示主題項目精神與範圍內的各種替代、修改與等同項目。在其他實例裡,眾知的處理程序步驟並未詳加說明以避免非必要地模糊本揭示。 Numerous specific details are set forth in the description which follows. Reference will now be made to a number of embodiments of the subject matter of the present disclosure, such as the accompanying drawings. The subject matter of the present disclosure is described in conjunction with the embodiments, and it is understood that the subject matter of the present disclosure is limited only to the specific embodiments. Rather, the subject matter of the present disclosure is intended to cover various alternatives, modifications, and equivalents, which are included in the spirit and scope of the subject matter of the disclosure as defined by the appended claims. In other instances, well-known process steps have not been described in detail to avoid unnecessarily obscuring the present disclosure.
此外,在下列說明中列述出眾多特定細節,藉此供以通徹地瞭解本揭示項目。然熟習本項技藝之人士應隨能明知,即使並無該等特定細節,確仍可實作本揭示主題項目。在其他實例裡,並未對熟習本項技藝之人士所眾知的方法、程序及元件詳加說明以避免模糊本揭示主題項目的特點。 In addition, numerous specific details are set forth in the description which follows, However, those skilled in the art should know that the subject matter of the present disclosure can be implemented even without such specific details. In other instances, methods, procedures, and components that are well known to those skilled in the art are not described in detail to avoid obscuring the features of the subject matter disclosed herein.
後文中將以圖式顯示並且說明許多牽涉到用於EHF通訊之介電耦接器的裝置、系統和方法。 A number of devices, systems, and methods involving a dielectric coupler for EHF communication will be shown and described below.
能夠經由通訊鏈路以提供通訊的裝置稱為通訊裝置或通訊 單元。例如,能夠在EHF頻帶中運作的通訊單元可稱為EHF通訊單元。EHF通訊單元的其一範例為EHF通訊鏈路(comm-link)晶片。在全篇中將會互換地使用該等辭彙「通訊鏈路晶片」、「通訊鏈路晶片封裝」及「EHF通訊鏈路晶片封裝」以指稱經嵌入於IC封裝內的EHF天線。這些通訊鏈路晶片的範例可如美國臨時專利申請案序號61/491,811、61/467,334及61/485,103案文所詳述,茲將所有該等為各種目的而依其等整體併入本案。 A device capable of providing communication via a communication link is called a communication device or communication unit. For example, a communication unit capable of operating in the EHF band can be referred to as an EHF communication unit. An example of an EHF communication unit is an EHF communication link (comm-link) chip. The vocabulary "communication link wafer", "communication link chip package" and "EHF communication link chip package" will be used interchangeably throughout the article to refer to the EHF antenna embedded in the IC package. Examples of such communication link wafers are described in detail in the text of U.S. Provisional Patent Application Serial Nos. 61/491,811, 61/467,334, and 61/485,103, each of which is incorporated herein in its entirety for all purposes.
圖1為一示範性極高頻(EHF)通訊晶片114的側視圖,此圖中根據一實施例顯示一些內部元件。即如參照圖1所討論,該EHF通訊晶片114可為架置在該EHF通訊晶片114的連接器印刷電路板(PCB)116上。圖2顯示一類似的示範性EHF通訊晶片214。注意到圖1是利用電腦模擬圖形以描繪該EHF通訊晶片114,並因而能夠按風格化方式來顯示一些元件。該EHF通訊晶片114可經組態設定以傳送且接收極高頻信號。即如所示,該EHF通訊晶片114可含有晶粒102、導線框架(未予圖示)、一或更多像是連附接線104的導體連接器、像是天線106的傳導器以及裹封材料108。該晶粒102可含有任何經組態設定為在適當晶粒基板上之最小化電路的適當結構,並且功能性地等同於又稱為「晶片」或「積體電路(IC)」的元件。該晶粒基板可為利用像是矽質的任何適當半導體材料所構成,然不限於此。該晶粒102可為架置而電性通聯於該導線框架。該導線框架(類似於圖2的218)可為經組態設定以供一或更多其他電路運作連接於該晶粒102的任何適當導電導線排置。該導線框架(參見圖2的218)的導線可為嵌入或固定於一導線框架基板內。該導線框架基板可為利用任何適當的絕緣材料所構成,該者係經組態設定以按一預定排置方式大致地固持該等導線。 1 is a side view of an exemplary very high frequency (EHF) communication chip 114 showing some internal components in accordance with an embodiment. As discussed with respect to FIG. 1, the EHF communication chip 114 can be mounted on a connector printed circuit board (PCB) 116 of the EHF communication chip 114. FIG. 2 shows a similar exemplary EHF communication chip 214. It is noted that Figure 1 is a computer simulation of a graphic to depict the EHF communication chip 114 and thus is capable of displaying some components in a stylized manner. The EHF communication chip 114 can be configured to transmit and receive very high frequency signals. As shown, the EHF communication die 114 can include a die 102, a leadframe (not shown), one or more conductor connectors such as the attached wires 104, a conductor such as the antenna 106, and a wrapper. Material 108. The die 102 can contain any suitable structure configured to minimize circuitry on a suitable die substrate and is functionally equivalent to what is also referred to as a "wafer" or "integrated circuit (IC)." The die substrate may be formed of any suitable semiconductor material such as tantalum, but is not limited thereto. The die 102 can be electrically connected to the lead frame. The leadframe (similar to 218 of FIG. 2) can be any suitable conductive lead arrangement configured to operate for one or more other circuits to be coupled to the die 102. The wire of the lead frame (see 218 of Figure 2) can be embedded or fixed within a lead frame substrate. The lead frame substrate can be constructed using any suitable insulating material that is configured to substantially hold the wires in a predetermined arrangement.
此外,可利用像是一或更多連附接線104的導體連接器,藉由任何適當方法來達成該晶粒102與該導線框架之導線間的電性通訊。可利用該等連附接線104以將該晶粒102之電路上的點處電性連接於該導線框架上的相對應導線。在另一實施例裡,可將該晶粒102反置並且導體連接器含有多個凸起,或晶粒焊球,而非連附接線104,這些可按照通稱為「覆晶」排置的方式所組態設定。 In addition, electrical communication between the die 102 and the wires of the leadframe can be accomplished by any suitable method using a conductor connector such as one or more of the attached wires 104. The connection wires 104 can be utilized to electrically connect points on the circuit of the die 102 to corresponding wires on the wire frame. In another embodiment, the die 102 can be inverted and the conductor connector includes a plurality of bumps, or die balls, rather than the attached wires 104, which can be referred to as "flip-chip" arrangements. Mode configured settings.
該天線106可為一按如傳導器所組態設定以供在電性與電磁信號之間進行轉換的任何適當結構。該天線106可為組態設定以在EHF頻譜中運作,並且可經組態設定以傳送及/或接收電磁信號;換言之,作為傳送器、接收器或收發器之用。在一實施例裡,可將該天線106建構成該導線框架的一部份(參見圖2中的218)。在其他實施例裡,該天線106可為分離於該晶粒102,然確可藉由任何適當方法以與其運作連接,同時可被設置在該晶粒102的鄰近處。例如,可利用天線連附接線(類似於圖2的220)以將該天線106連接至該晶粒102。或另者,在覆晶組態中,該天線106可為連接至該晶粒102而無須運用天線連附接線(參見220)。在其他實施例裡,可將該天線106設置在該晶粒102上或是該PCB 116上。 The antenna 106 can be any suitable structure configured as configured for the transducer for conversion between electrical and electromagnetic signals. The antenna 106 can be configured to operate in the EHF spectrum and can be configured to transmit and/or receive electromagnetic signals; in other words, as a transmitter, receiver or transceiver. In one embodiment, the antenna 106 can be constructed as part of the leadframe (see 218 in Figure 2). In other embodiments, the antenna 106 can be separate from the die 102, but can be operatively coupled thereto by any suitable method while being disposed adjacent to the die 102. For example, an antenna can be attached to the antenna (similar to 220 of FIG. 2) to connect the antenna 106 to the die 102. Alternatively, in a flip chip configuration, the antenna 106 can be connected to the die 102 without the use of an antenna connection (see 220). In other embodiments, the antenna 106 can be disposed on the die 102 or on the PCB 116.
此外,該裹封材料108可將該EHF通訊晶片114的各種元件保持在固定的相對位置處。該裹封材料108可為任何經組態設定以對該EHF通訊晶片114之電氣與電子元件提供電性絕緣及實體保護的適當材料。例如,該裹封材料108可為鑄模化合物、玻璃、塑膠或陶瓷。該裹封材料108可為依照任何適當形狀所構成。例如,該裹封材料108可為按照長方形塊體的形式,其裹封該EHF通訊晶片114中除該導線框架之未經連接 導線以外的所有元件。一或更多的外部連接則可藉由其他電路或元件所構成。例如外部連接可包含焊球板及/或外部焊球以供連接至一印刷電路板。 In addition, the encapsulation material 108 can hold the various components of the EHF communication wafer 114 at a fixed relative position. The encapsulation material 108 can be any suitable material configured to provide electrical insulation and physical protection to the electrical and electronic components of the EHF communication wafer 114. For example, the wrapper 108 can be a mold compound, glass, plastic or ceramic. The wrapper 108 can be constructed in accordance with any suitable shape. For example, the encapsulation material 108 can be in the form of a rectangular block enclosing the unconnected portion of the EHF communication wafer 114 except the lead frame. All components except the wire. One or more external connections may be formed by other circuits or components. For example, the external connections may include solder balls and/or external solder balls for connection to a printed circuit board.
更進一步,該EHF通訊晶片114可為架置在一連接器PCB 116上。該連接器PCB 116可含有一或更多疊覆層112,而其中一者可為PCB接地平面110。該PCB接地平面110可為任何經組態設定以對該PCB 116上之電路和元件提供電性接地的適當結構。 Further, the EHF communication chip 114 can be mounted on a connector PCB 116. The connector PCB 116 can include one or more overlays 112, one of which can be a PCB ground plane 110. The PCB ground plane 110 can be any suitable configuration configured to provide electrical grounding to the circuits and components on the PCB 116.
圖2為一EHF通訊晶片214的立體圖,圖中顯示一些內部元件。注意到圖2是利用電腦模擬圖形以描繪該EHF通訊晶片214,並因而能夠按風格化方式來顯示一些元件。即如所示,該EHF通訊晶片214可含有晶粒202、導線框架218、一或更多像是連附接線204的導體連接器、像是天線206的傳導器、一或更多天線連附接線220以及裹封材料208。該晶粒202、該導線框架218、一或更多連附接線204、該天線206、該等天線連附接線220以及該裹封材料208可具有類似於如圖1所示該EHF通訊晶片114之晶粒102、導線框架、連附接線104、天線106、天線連附接線以及裹封材料108之元件的功能性。此外,該EHF通訊晶片214可含有一連接器PCB(類似於PCB 116)。 2 is a perspective view of an EHF communication chip 214 showing some of the internal components. It is noted that Figure 2 is a computer simulation of the graphics to depict the EHF communication chip 214 and thus enables some components to be displayed in a stylized manner. As shown, the EHF communication die 214 can include die 202, leadframe 218, one or more conductor connectors such as attached wires 204, a conductor such as antenna 206, and one or more antennas attached. Wiring 220 and wrap material 208. The die 202, the leadframe 218, one or more attachment wires 204, the antenna 206, the antenna attachment wires 220, and the wrapper 208 can have an EHF communication die 114 similar to that shown in FIG. The functionality of the die 102, the leadframe, the attached wiring 104, the antenna 106, the antenna attachment wiring, and the components of the encapsulation material 108. Additionally, the EHF communication chip 214 can include a connector PCB (similar to the PCB 116).
在圖2中,可觀察到該晶粒202係經裹封在該EHF通訊晶片214內,而該等連附接線204可將該晶粒202連接於該天線206。在本實施例裡,該EHF通訊晶片214可為架置在該連接器PCB上。該連接器PCB(未予圖示)可含有一或更多疊覆層(未予圖示),而其中一者可為PCB接地平面(未予圖示)。該PCB接地平面可為任何經組態設定以對該EHF通訊晶片214的PCB上之電路和元件提供電性接地的適當結構。 In FIG. 2, it can be observed that the die 202 is encapsulated within the EHF communication chip 214, and the connection wires 204 can connect the die 202 to the antenna 206. In this embodiment, the EHF communication chip 214 can be mounted on the connector PCB. The connector PCB (not shown) may contain one or more overlay layers (not shown), one of which may be a PCB ground plane (not shown). The PCB ground plane can be any suitable configuration configured to provide electrical grounding to the circuitry and components on the PCB of the EHF communication chip 214.
現續參照圖1-2,可納入並且組態設定該EHF通訊晶片214以供與該EHF通訊晶片114進行EHF通訊。此外,該EHF通訊晶片114或214之任一者可為組態設定以傳送及/或接收電磁信號,故而提供該EHF通訊晶片114與該EHF通訊晶片214以及伴隨電性電路或元件之間的單或雙向通訊。在一實施例裡,該EHF通訊晶片114與該EHF通訊晶片214可為共同設置在單一PCB上並且提供板內PCB通訊。在另一實施例裡,該EHF通訊晶片114可位於一第一PCB(類似於該PCB 116)上,同時該EHF通訊晶片214位於一第二PCB(類似於該PCB 116)上,因此能夠提供板間PCB通訊。 Referring now to Figures 1-2, the EHF communication chip 214 can be incorporated and configured for EHF communication with the EHF communication chip 114. In addition, any of the EHF communication chips 114 or 214 can be configured to transmit and/or receive electromagnetic signals, thereby providing the EHF communication die 114 and the EHF communication die 214 and accompanying electrical circuits or components. Single or two-way communication. In one embodiment, the EHF communication die 114 and the EHF communication die 214 can be co-located on a single PCB and provide in-board PCB communication. In another embodiment, the EHF communication chip 114 can be located on a first PCB (similar to the PCB 116), and the EHF communication chip 214 is located on a second PCB (similar to the PCB 116), thereby providing PCB communication between boards.
在一些情況下,可將像是該等EHF通訊晶片114及214的組對架置為互相足夠遠離,故而不致在該等之間可靠地交換EHF電磁信號。在這些情況下,可能會希望能夠於EHF通訊晶片組對之間提供改善的信號傳輸結果。為此目的,本發明提供一種經組態設定以傳播電磁EHF信號的介電導管,即如後文所說明及附圖中所顯示者。 In some cases, pairs of such EHF communication chips 114 and 214 can be placed sufficiently far apart from each other so that EHF electromagnetic signals are not reliably exchanged between them. In these cases, it may be desirable to provide improved signal transmission results between pairs of EHF communication chipsets. To this end, the present invention provides a dielectric conduit configured to propagate electromagnetic EHF signals, as will be described hereinafter and as shown in the accompanying drawings.
圖3為根據本發明之一實施例之一示範性介電導管222節段的立體圖。在後文中,可將該介電導管222另外地或替換地稱為波導或介電波導。 3 is a perspective view of an exemplary dielectric conduit 222 segment in accordance with an embodiment of the present invention. Hereinafter, the dielectric conduit 222 may be additionally or alternatively referred to as a waveguide or a dielectric waveguide.
該介電導管222含有一長型本體224,其含有一第一介電材料。該長型本體224通常是沿著該介電導管222的縱向軸線226延伸。該長型本體含有最好是擁有至少約2.0之介電常數的第一介電材料。具有顯著較高介電常數的材料可能會導致所偏好的長型本體維度縮減,原因是當EHF信號進入到具有較高介電常數的材料內時波長會降低。最好,該長型本體含有屬於介電材料的塑膠材料。 The dielectric conduit 222 includes an elongated body 224 that contains a first dielectric material. The elongate body 224 generally extends along a longitudinal axis 226 of the dielectric conduit 222. The elongated body contains a first dielectric material that preferably has a dielectric constant of at least about 2.0. Materials with significantly higher dielectric constants may result in a preferred reduction in the length of the elongated body because the wavelength is reduced when the EHF signal enters a material with a higher dielectric constant. Preferably, the elongated body contains a plastic material that is a dielectric material.
該長型本體224係經塑形,故而在沿該縱向軸線226上的各個點處,該長型本體224中與該縱向軸線呈正交的截面會展現一主要軸線,此軸線是跨於該截面而沿該截面的最大維度所延伸,以及該截面的一次要軸線,此軸線是跨於該截面沿該截面的最大維度所延伸而與該主要軸線呈直角。對於此等截面各者,該截面會具有一沿其主要軸線的第一維度228,以及一沿其次要軸線的第二維度230。 The elongate body 224 is shaped such that at various points along the longitudinal axis 226, a cross-section of the elongate body 224 that is orthogonal to the longitudinal axis exhibits a major axis that spans the The section extends along the largest dimension of the section, and the primary axis of the section, the axis extending across the section along the largest dimension of the section at a right angle to the major axis. For each of these sections, the section will have a first dimension 228 along its major axis and a second dimension 230 along its minor axis.
為強化該長型本體224內部傳播電磁EHF信號的能力,各個長型本體的尺寸係經適當調整,故而各個截面之第一維度的長度大於待沿該導管上所傳播之電磁EHF信號的波長;並且該第二維度小於待沿該導管上所傳播之電磁EHF信號的波長。在本發明的替代性實施例裡,該第一維度是大於該待予傳播電磁EHF信號之波長的1.4倍,而該第二維度則是不大於該待予傳播電磁EHF信號之波長的約一半。 To enhance the ability of the elongated body 224 to propagate electromagnetic EHF signals internally, the dimensions of each elongated body are suitably adjusted such that the length of the first dimension of each section is greater than the wavelength of the electromagnetic EHF signal to be propagated along the conduit; And the second dimension is less than the wavelength of the electromagnetic EHF signal to be propagated along the conduit. In an alternative embodiment of the invention, the first dimension is greater than 1.4 times the wavelength of the electromagnetic EHF signal to be propagated, and the second dimension is no more than about half of the wavelength of the electromagnetic EHF signal to be propagated. .
此外,可藉由將一包覆材料232設置在該介電長型本體224的外部表面來強化由該長型本體所進行的電磁EHF信號傳播。該長型本體之表面的性質將會按照各個長型本體的特定維度而改變。然通常考量到該長型本體的整體表面積,該包覆材料232一般會覆蓋此表面的至少約四分之一。在另一實施例裡,被該第一反射性包覆是覆蓋該長型本體的至少一半表面,即如圖3中對於包覆材料232所示者。在本發明的又另一替代性實施例裡,該第一反射性包覆則是覆蓋該長型本體的整體表面。佈用於長型本體上的包覆可包含單一反射性材料或是多種反射性材料。該包覆可包含在該長型本體之不同面部,或表面,上的不同反射性材料。 In addition, electromagnetic EHF signal propagation by the elongated body can be enhanced by placing a cladding material 232 on the outer surface of the dielectric elongated body 224. The nature of the surface of the elongate body will vary according to the particular dimensions of each elongate body. While generally considering the overall surface area of the elongate body, the cladding material 232 will typically cover at least about a quarter of the surface. In another embodiment, the first reflective coating covers at least half of the surface of the elongate body, as shown for the cladding material 232 in FIG. In still another alternative embodiment of the invention, the first reflective coating covers the entire surface of the elongate body. The coating of the cloth for the elongated body may comprise a single reflective material or a plurality of reflective materials. The cover may comprise different reflective materials on different faces, or surfaces, of the elongate body.
對於每項實施例,該包覆材料可為按如連續包覆而該材料中 大致無含缺縫或孔洞的方式所塗佈。在另一實施例裡,該包覆材料可含有複數個孔洞,像是規則性地或不規則性地相隔的空孔,或是梳織或網編包覆中出現的空隙,即如圖3中對於包覆材料232所示者。 For each of the embodiments, the covering material may be in the form of, for example, continuous coating. It is applied in a manner that is substantially free of nicks or holes. In another embodiment, the covering material may contain a plurality of holes, such as voids that are regularly or irregularly spaced, or voids that appear in the woven or mesh wrap, as shown in FIG. The one shown for the cladding material 232.
適當的包覆材料包含能夠反射待沿該長型本體224所傳播之電磁EHF信號的材料。適合用於包覆的反射性材料可包含導體材料、耗散材料或是其他的介電材料。當該包覆含有導體材料時,該導體材料可含有單一或多種導體金屬。當該包覆含有額外的介電材料時,例如環繞該長型本體的空氣,該第二介電材料通常會具有小於該導管之介電常數的介電常數。 Suitable cladding materials include materials that are capable of reflecting electromagnetic EHF signals to be propagated along the elongated body 224. Reflective materials suitable for cladding may comprise a conductor material, a dissipative material, or other dielectric material. When the cladding contains a conductor material, the conductor material may contain a single or multiple conductor metals. When the coating contains additional dielectric material, such as air surrounding the elongated body, the second dielectric material will typically have a dielectric constant that is less than the dielectric constant of the conduit.
附圖中對於包覆的描繪並非反映該包覆材料的實際維度,而經誇大以便於清晰說明。足供反射電磁EHF信號的包覆材料層厚度可為相當微薄,並且通常僅需極薄覆層即可令人滿意地反射所傳播信號。例如,當該包覆材料為導體金屬時,極薄的金屬箔片通常即能滿足多數目的。一般說來,針對本發明之目的,可供令人滿意地反射內部電磁EHF信號的任何包覆材料厚度即為足夠厚度。或另者,可部份地藉由製造及使用考量來決定該包覆材料的厚度。 The depiction of the cladding in the drawings does not reflect the actual dimensions of the cladding material, but is exaggerated for clarity of illustration. The thickness of the cladding material layer sufficient to reflect the electromagnetic EHF signal can be rather meager, and generally only a very thin coating is required to satisfactorily reflect the propagated signal. For example, when the cladding material is a conductor metal, an extremely thin metal foil is usually sufficient for most purposes. In general, for the purposes of the present invention, any cladding material thickness that satisfactorily reflects the internal electromagnetic EHF signal is a sufficient thickness. Alternatively, the thickness of the cladding material may be determined in part by manufacturing and usage considerations.
可藉由採取運用橫向電場(TE)傳播模式之單模式長方形模式波導來減少信號在該介電導管內的損失。或另者,該導管可運用一種混合式傳播模式,此非純粹橫向電場(TE)模式亦非橫向磁場(TM)模式,而是具有Emn y及Emn x,其中m和n分別是指極值,亦即最大值與最小值,的數量。在一示範性情境中,各個族系的基本模式可表示為E11 y及E11 x。 The loss of signal within the dielectric conduit can be reduced by employing a single mode rectangular mode waveguide that utilizes a transverse electric field (TE) propagation mode. Alternatively, the catheter may employ a hybrid propagation mode, which is not a transverse electric field (TE) mode or a transverse magnetic field (TM) mode, but has E mn y and E mn x , where m and n refer to The maximum value, that is, the maximum and minimum values. In an exemplary scenario, the basic patterns of each family can be expressed as E 11 y and E 11 x .
對於任一傳播模式族系,該切截頻率可為定義如下:
其中kx及ky為沿x和y方向上的橫向傳播常數;在一示範性情境中,假設該場域係沿x軸所極化,則kx及ky可近似如下:
在一範例中,該導管的長型本體是由即如LDPE或HOPE的聚乙烯塑料所組成,並且待沿該導管所傳播之電磁EHF信號的頻率為60GHz。對於該示範性導管,m=1,n=1,寬度a=2mm,高度b=1mm,n1=1.5並且n2=n3=n4=n5=1。利用等式(2)-(5),可計算出該示範性導管的切截頻率約為56GHz,這表示60GHz的操作頻率適用於經由該介電導管的信號傳輸。 In one example, the elongate body of the catheter is comprised of a polyethylene plastic such as LDPE or HOPE, and the frequency of the electromagnetic EHF signal to be propagated along the conduit is 60 GHz. For this exemplary catheter, m = 1, n = 1, width a = 2 mm, height b = 1 mm, n1 = 1.5 and n2 = n3 = n4 = n5 = 1. Using equations (2)-(5), the cutoff frequency of the exemplary catheter can be calculated to be about 56 GHz, which means that the operating frequency of 60 GHz is suitable for signal transmission via the dielectric conduit.
通常,當a維度增加,切截頻率就會變得較低。換言之,藉較大維度,操作頻率可體驗到較高階模式傳播。在本範例裡是利用聚乙烯塑膠來作為波導或介電導管,然亦可運用具有低損切線的替代性介電材料,像是TEFLOT、聚苯乙烯,玻璃、橡膠、陶瓷等等。 Usually, as the a dimension increases, the cutoff frequency becomes lower. In other words, with a larger dimension, the operating frequency can experience higher order mode propagation. In this example, polyethylene plastic is used as the waveguide or dielectric conduit, but alternative dielectric materials with low loss tangent, such as TEFLOT, polystyrene, glass, rubber, ceramics, etc., can also be used.
對於像是1米長USB電纜線的應用項目而言,較高階模式傳播可能導致每傳輸長度的較高損失以及較高的發散效應,然確在利於製造及耦接效率的容忍範圍內。不過,具有寬度10mm及厚度1.5mm的示範性聚乙烯導管能夠以6Gb/s傳送資料達5米遠。 For applications such as 1-meter long USB cable, higher order mode propagation may result in higher loss per transmission length and higher divergence effects, but within tolerances for manufacturing and coupling efficiency. However, an exemplary polyethylene conduit having a width of 10 mm and a thickness of 1.5 mm is capable of transmitting data at 5 Gb/s up to 5 meters.
即如前述,「n」是表示折射指數,此值定義光在真空中的速度/光在材料中的速度。對於近全內部反射,此「n」亦可為較低的包覆材料指數。可藉由各種具有不同折射指數的包覆物來環繞或包封該介電導管的長型本體。該包覆材料的折射指數係經定義為光在真空中的速度對光在該包覆材料內之相位速度的比值(er),或如下式:
對於均質及非均質包覆材料來說,當該包覆材料的折射指數小於該長型本體核芯之介電材料的折射指數時即能達到電磁EHF信號的全內部反射。因此,可利用裸出長方形介電條帶來作為長型本體。 For homogeneous and heterogeneous cladding materials, full internal reflection of the electromagnetic EHF signal can be achieved when the refractive index of the cladding material is less than the refractive index of the dielectric material of the elongated body core. Therefore, a bare rectangular dielectric strip can be utilized as the elongated body.
該長型本體224可擁有任何各種可能的幾何性,只要該長型本體之各截面的第一維度大於待予傳播之電磁EHF信號的波長,同時該第二維度小於待予傳播之電磁EHF信號的波長即可。一般說來,該長型本體224係經塑形故而各個截面具有由一些直線及/或連續彎曲的線段之組合所構成的外型。在一實施例裡,各個截面具有定義一長方形、圓角長方形、體育場形(stadium)或者超橢圓形的外型,其中該超橢圓形包括含有橢圓形和過橢圓形的形狀。 The elongated body 224 can have any of a variety of possible geometries as long as the first dimension of each section of the elongated body is greater than the wavelength of the electromagnetic EHF signal to be propagated while the second dimension is less than the electromagnetic EHF signal to be propagated. The wavelength can be. In general, the elongate body 224 is shaped such that each section has an exterior formed by a combination of linear and/or continuously curved segments. In one embodiment, each cross section has an outer shape defining a rectangular shape, a rounded rectangular shape, a stadium shape, or a super elliptical shape, wherein the super elliptical shape includes a shape including an elliptical shape and an over elliptical shape.
例如,圖4A說明一截面240,其定義一具有主要軸線242和次要軸線244的圓角長方形。圖4B說明一截面246,其定義一具有主要軸線242和次要軸線244的體育場形或包囊形。同時圖4C說明一截面248,其定義一具有主要軸線242和次要軸線244的橢圓形248。 For example, FIG. 4A illustrates a section 240 that defines a rounded rectangle having a primary axis 242 and a secondary axis 244. FIG. 4B illustrates a section 246 that defines a stadium or capsule shape having a primary axis 242 and a secondary axis 244. 4C illustrates a section 248 that defines an elliptical shape 248 having a primary axis 242 and a secondary axis 244.
在一實施例裡,即如圖5所示,一介電導管300可含有一第一介電材料的長型本體302,其中該長型本體302係自第一終端304至第二 終端306沿一縱向軸線延伸,而該等第一與第二終端之間的距離則對應於該長型本體302的長度316。 In one embodiment, as shown in FIG. 5, a dielectric conduit 300 can include a long body 302 of a first dielectric material, wherein the elongated body 302 is from the first terminal 304 to the second Terminal 306 extends along a longitudinal axis, and the distance between the first and second terminals corresponds to length 316 of elongated body 302.
該長型本體302定義一長型立方體。換言之,該長型本體302係經塑形故而,在沿其縱向軸線上的各點處,該長型本體302中與該縱向軸線呈正交的截面可定義一長方形。該長型本體302含有一第一橫向表面308以及一與該第一橫向表面相隔的第二橫向表面310,而分隔該等第一及第二橫向表面的距離318則定義該長型本體在沿一主要軸線上的寬度。類似地,該長型本體302含有一第一主要表面312以及一與該第一主要表面相隔的第二主要表面314,而分隔該等第一及第二主要表面的距離320則定義該長型本體在沿一次要軸線上的深度。 The elongated body 302 defines an elongated cube. In other words, the elongate body 302 is shaped such that, at various points along its longitudinal axis, a cross-section in the elongate body 302 that is orthogonal to the longitudinal axis defines a rectangle. The elongated body 302 includes a first lateral surface 308 and a second lateral surface 310 spaced from the first lateral surface, and a distance 318 separating the first and second lateral surfaces defines the elongated body along the edge The width on a major axis. Similarly, the elongate body 302 includes a first major surface 312 and a second major surface 314 spaced from the first major surface, and a distance 320 separating the first and second major surfaces defines the elongated shape. The depth of the body along a major axis.
圖5的介電導管300另外含有一包覆322,其中該包覆含有反射性材料或是一個以上的反射性材料,此等材料在各個橫向表面308、310和主要表面312、314上環繞該長型本體302,即如圖5的部份切離視圖中所示者。 The dielectric conduit 300 of FIG. 5 additionally includes a cover 322, wherein the cover contains a reflective material or more than one reflective material that surrounds the respective lateral surfaces 308, 310 and major surfaces 312, 314. The elongated body 302, as shown in the partially cut away view of FIG.
本發明的介電導管適用於強化一EHF電磁通訊系統內之信號EHF通訊晶片間的電磁EHF信號傳播。即如圖6所示,代表性EHF電磁通訊系統400係經顯示為含有一介電導管300,此導管具有第一終端304及第二終端306。第一EHF通訊晶片402係經設置為鄰近該第一終端304,而第二EHF通訊晶片404則是設置為鄰近該第二終端306。各個通訊晶片可為選擇性地接附於一基板,像是PCB基板406。 The dielectric conduit of the present invention is suitable for enhancing electromagnetic EHF signal propagation between signal EHF communication chips in an EHF electromagnetic communication system. That is, as shown in FIG. 6, a representative EHF electromagnetic communication system 400 is shown to include a dielectric conduit 300 having a first termination 304 and a second termination 306. The first EHF communication chip 402 is disposed adjacent to the first terminal 304, and the second EHF communication chip 404 is disposed adjacent to the second terminal 306. Each of the communication chips can be selectively attached to a substrate such as a PCB substrate 406.
在使用過程中,倘若該通訊晶片402係經組態設定以作為一具有適用該介電導管之波長的電磁EHF信號之傳輸來源,則可將該EHF頻 率電磁信號自鄰近於該終端304的第一EHF通訊晶片402發送至該介電導管300內。然後,倘若該通訊晶片404係經組態設定以作為電磁EHF信號的接收器之用,則可沿該導管300的長度傳播該信號並予傳至該介電導管的第二終端306,在此可由鄰近於該第二終端306的第二通訊晶片404接收。該介電導管可運用於例如自一專屬傳輸來源至一專屬接收器的單向傳播。或另者,而且更通常地,該介電導管可在任一或兩者方向上往返於能夠傳送或接收EHF信號的傳導器導引此等信號。 In use, if the communication chip 402 is configured to be a transmission source of an electromagnetic EHF signal having a wavelength suitable for the dielectric conduit, the EHF frequency can be used. The rate electromagnetic signal is transmitted from the first EHF communication chip 402 adjacent to the terminal 304 into the dielectric conduit 300. Then, if the communication chip 404 is configured to be used as a receiver for the electromagnetic EHF signal, the signal can be propagated along the length of the catheter 300 and pre-transmitted to the second terminal 306 of the dielectric conduit, where It may be received by a second communication chip 404 adjacent to the second terminal 306. The dielectric conduit can be used, for example, for unidirectional propagation from a proprietary transmission source to a dedicated receiver. Alternatively, and more generally, the dielectric conduit can direct such signals to and from a transducer capable of transmitting or receiving EHF signals in either or both directions.
本發明的介電導管可為硬固性,或者可為較具彈性以適用於由該導管所連接之多個EHF通訊晶片間的各種距離與指向範圍。本發明的介電導管可在其一或兩者末端處含有連接器構件或扣定器以將該導管300接附定位,藉此將該導管300接附於一或更多與該傳送及接收IC封裝相關聯的裝置,或是藉以將該導管直接地接附於傳送及/或接收IC封裝。該介電導管300可為選擇性地設置在一導電表面上,或部份地嵌入於其內,特別是當運用於一電子裝置內時尤甚。 The dielectric conduit of the present invention can be rigid or can be more flexible to accommodate a variety of distances and pointing ranges between a plurality of EHF communication wafers connected by the conduit. The dielectric conduit of the present invention may include a connector member or fastener at one or both ends to attach the catheter 300, thereby attaching the catheter 300 to one or more of the transmission and reception The device associated with the IC package, or by which the catheter is directly attached to the transmitting and/or receiving IC package. The dielectric conduit 300 can be selectively disposed on a conductive surface or partially embedded therein, particularly when used in an electronic device.
本發明之介電導管的第一及第二終端中至少一者可進一步含有一經組態設定以強化EHF信號傳輸的耦接特性。例如,該耦接特性可經組態設定以強化外部電磁EHF信號進入該第一介電材料之長型本體內的傳輸,並且/或者強化電磁EHF信號離出該第一介電材料之長型本體的傳輸。圖7中略圖描繪一併有第一及第二耦接特性的EHF電磁通訊系統。即如圖示,該EHF通訊系統500含有一介電導管502,其係經組態設定以促成第一EHF通訊晶片504與第二EHF通訊晶片506之間的EHF電磁信號傳播。該介電導管502在該介電導管502的長型立方體510與該第一通訊晶片504 之間的介面處進一步併入一第一耦接特性508,並且在該長型立方體510與該第二通訊晶片506之間的介面處併有一第二耦接特性512。 At least one of the first and second terminals of the dielectric conduit of the present invention may further comprise a coupling feature configured to enhance EHF signal transmission. For example, the coupling characteristic can be configured to enhance transmission of an external electromagnetic EHF signal into the elongated body of the first dielectric material and/or to enhance the long EEG signal from the first dielectric material. The transmission of the ontology. The schematic of Figure 7 depicts an EHF electromagnetic communication system with first and second coupling characteristics. As shown, the EHF communication system 500 includes a dielectric conduit 502 that is configured to facilitate EHF electromagnetic signal propagation between the first EHF communication chip 504 and the second EHF communication chip 506. The dielectric conduit 502 is in the elongated cube 510 of the dielectric conduit 502 and the first communication chip 504 A first coupling characteristic 508 is further incorporated between the interface, and a second coupling characteristic 512 is formed at the interface between the elongated cube 510 and the second communication chip 506.
該耦接特性可為能夠將EHF電磁信號自一鄰近EHF信號來源,像是EHF傳送器或傳導器,傳播、聚焦及/或傳送至該長型立方體之終端的任何結構。該耦接特性可含有一或更多介電材料,該等比較於該長型立方體的第一介電材料可為相同或相異。可選定該耦接特性的幾何性,例如藉由併入一介電透鏡或介電號角片,藉以將傳送至該長型立方體內的信號能量予以最大化。 The coupling characteristic can be any structure capable of propagating, focusing, and/or transmitting an EHF electromagnetic signal from a neighboring EHF signal source, such as an EHF transmitter or transmitter, to the terminal of the elongated cube. The coupling characteristic can contain one or more dielectric materials that can be the same or different than the first dielectric material of the elongated cube. The geometry of the coupling characteristics can be selected, for example, by incorporating a dielectric lens or dielectric horn to maximize the signal energy delivered into the elongated cube.
在本發明之一實施例中,該介電導管可併入一或更多耦接特性,而這些又可含有介電透鏡、介電號角片、介電介面平板和介電轉換器之其一的一或更多者。介電號角片通常係經組態設定以自一EHF信號來源捕捉最大的所傳EHF能量而供傳送至該長型立方體。例如,該耦接特性可含有定義一長方形-金字塔狀平截頭體的介電號角片,即如圖8的耦接特性602所示,其係經耦接於一介電材料而為長型立方體的長型本體612。 In an embodiment of the invention, the dielectric conduit may incorporate one or more coupling characteristics, which in turn may include one of a dielectric lens, a dielectric horn, a dielectric interface plate, and a dielectric converter. One or more. Dielectric horns are typically configured to capture the largest transmitted EHF energy from an EHF signal source for transmission to the elongated cube. For example, the coupling characteristic can include a dielectric horn that defines a rectangular-pyramid frustum, as shown in the coupling characteristic 602 of FIG. 8, which is coupled to a dielectric material and is elongated. The elongated body 612 of the cube.
該耦接特性602含有一由一介電材料所組成的長方形-金字塔狀平截頭體604,而該材料可相同於或不同於該長型本體612的第一介電材料。該長方形-金字塔狀平截頭體604含有一基底606及一頂部608,並且是經由該頂部608耦接於該長型立方體612的終端610。該長方形-金字塔狀平截頭體604具有頂部高度613和頂部寬度615,其中該頂部高度613大致等於其所耦接之長型立方體612的高度,並且該長方形-金字塔狀平截頭體的頂部寬度615通常是大致等於其所耦接之長型立方體612的寬度。該等平截頭體高度及寬度各者可自其等在該平截頭體604的頂部608處至該平截頭 體604的基底606處之數值而增加。在本發明之一實施例裡,該等平截頭體高度及寬度是自其等在該平截頭體604的頂部608處之數值至在該平截頭體604的基底606處的基底高度614和基底寬度616而線性地增加。亦將能瞭解該等耦接特性可擁有其他適用於耦接至具有不同截面組態之導管的組態。 The coupling characteristic 602 includes a rectangular-pyramid frustum 604 composed of a dielectric material that may be the same as or different from the first dielectric material of the elongated body 612. The rectangular-pyramid frustum 604 includes a base 606 and a top 608 and is coupled to the terminal 610 of the elongated cube 612 via the top 608. The rectangular-pyramid frustum 604 has a top height 613 and a top width 615, wherein the top height 613 is substantially equal to the height of the elongated cube 612 to which it is coupled, and the top of the rectangular-pyramid frustum The width 615 is generally approximately equal to the width of the elongated cube 612 to which it is coupled. Each of the frustum heights and widths may be from the top 608 of the frustum 604 to the frustum The value at the base 606 of the body 604 increases. In one embodiment of the invention, the frustum height and width are values from the top 608 of the frustum 604 to the base height at the base 606 of the frustum 604. 614 and substrate width 616 increase linearly. It will also be appreciated that these coupling characteristics may have other configurations suitable for coupling to conduits having different cross-sectional configurations.
該耦接特性602可選擇性地進一步具有一介電介面平板618,其係經耦接於該長方形-金字塔狀平截頭體604的基底606,並且具有大致等於相對應之長方形-金字塔狀平截頭體604基底高度614及基底寬度616的高度與寬度。該介電介面平板618可另外定義一平板厚度620,其大致等於預期由該長型本體612所傳播的EHF信號之波長的四分之一。該介電介面平板618可具有異於該耦接特性之介電常數的介電常數。 The coupling feature 602 can optionally further have a dielectric interface plate 618 coupled to the base 606 of the rectangular-pyramid frustum 604 and having a substantially equal rectangular-pyramid plane The base height 614 of the frustum 604 and the height and width of the base width 616. The dielectric interface plate 618 can additionally define a plate thickness 620 that is substantially equal to a quarter of the wavelength of the EHF signal that is expected to propagate by the elongated body 612. The dielectric interface plate 618 can have a dielectric constant that is different from the dielectric constant of the coupling characteristic.
圖9為一介電導管700的略圖描述,其中該導管併入一含有介電號角片704和介電介面平板706的耦接特性702。該耦接特性702係經設置在一EHF電磁信號來源708的鄰近處,藉此將EHF信號進入該導管之終端內的傳送最大化以利傳播。 9 is a schematic depiction of a dielectric conduit 700 incorporating a coupling characteristic 702 comprising a dielectric horn plate 704 and a dielectric interface plate 706. The coupling characteristic 702 is disposed adjacent to an EHF electromagnetic signal source 708, thereby maximizing the transmission of the EHF signal into the terminal of the catheter for propagation.
在本發明之一替代性實施例裡,該介電導管可併入具有一或更多介電透鏡的耦接特性,其中該等透鏡係經適當地設置,藉此將入射EHF電磁信號進入到該導管之終端內的傳送最大化以利傳播。為此目的可運用各種介電透鏡,包含凹面透鏡、凸面透鏡、Fresnel透鏡等等,並且該耦接特性可經組態設定以耦接至具有不同截面維度的導管,即如前文所述者。 In an alternative embodiment of the invention, the dielectric conduit can incorporate coupling characteristics having one or more dielectric lenses, wherein the lenses are suitably positioned to thereby enter an incident EHF electromagnetic signal The delivery within the terminal of the catheter is maximized for propagation. Various dielectric lenses can be utilized for this purpose, including concave lenses, convex lenses, Fresnel lenses, and the like, and the coupling characteristics can be configured to couple to conduits having different cross-sectional dimensions, ie as previously described.
圖10為一介電導管800的略圖描述,其中該導管併入一含有第一介電透鏡804和第二介電透鏡806的耦接特性802。該耦接特性802 係經設置為鄰近一EHF電磁信號來源808以捕捉入射的EHF信號。一般說來,該耦接特性的介電透鏡804、806係經指向設定且互相分隔,故而所折射之EHF輻射的焦點交會於該介電導管的終端810。 10 is a schematic depiction of a dielectric conduit 800 incorporating a coupling characteristic 802 that includes a first dielectric lens 804 and a second dielectric lens 806. The coupling characteristic 802 It is placed adjacent to an EHF electromagnetic signal source 808 to capture the incident EHF signal. In general, the coupling characteristics of the dielectric lenses 804, 806 are directed and spaced apart from each other such that the focus of the refracted EHF radiation intersects the terminal 810 of the dielectric conduit.
可利用Snell公式來估算對於一或更多介電透鏡的焦點位置,此公式描述電磁波在當通過像是水、玻璃和空氣的不同媒介物間之邊界時的行為。更詳細地說,Snell公式陳述入射與折射角度之正弦值間的關係是等於在兩個媒介物內之相位速度的比值,或者等於折射指數之比值的倒數,即如下式:
其中各個θ為對於該入射波(θ1)及對於該折射波(θ2)自該邊界之法線所測得的角度,v為光線在各個個別媒介物內的速度(通常是以每秒公尺,或m/s,為單位)並且n為各個個別媒介物的折射指數(不含單位)。 Wherein each θ is the angle measured for the incident wave (θ 1 ) and for the refracted wave (θ 2 ) from the normal to the boundary, and v is the velocity of the light within each individual medium (usually in per second) Metric, or m/s, is the unit) and n is the refractive index (without units) of each individual vehicle.
在本發明的其他實施例裡,介電導管可併入複數個介電材料長型本體,藉以構成能夠傳播多個獨立EHF信號的介電導管,或者是藉由關閉該介電導管的功能直到出現有兩個遮蔽結構以至少部份地環繞該共集介電導管為止來將偽假輻射最小化。 In other embodiments of the invention, the dielectric conduit can incorporate a plurality of elongated bodies of dielectric material to form a dielectric conduit capable of propagating a plurality of independent EHF signals, or by turning off the function of the dielectric conduit until Two masking structures are present to minimize pseudo-radial radiation at least partially around the collective dielectric conduit.
在該介電導管含有複數個介電本體的情況下,各個額外長型本體通常會至少部份地沿該第一長型本體延伸並與其鄰接,同時各個長型本體可藉由含有第一或第二反射性材料的第一或第二包覆而分隔於其他的長型本體。在一實施例裡,即如圖11所示,一示範性組合波導含有第一長型介電立方體900和第二長型介電立方體902,此等係經並列排置,故而該第一長型立方體900的一橫向側邊靠接於該第二長型立方體902的一橫向側 邊。在一替代性實施例裡,即如圖12所示,另一示範性組合波導含有第一長型介電立方體1000和第二長型介電立方體1002,此等係按堆疊方式所排置,故而該第一長型立方體1000的一主要表面靠接於該第二長型立方體1002的一主要表面。 In the case where the dielectric conduit includes a plurality of dielectric bodies, each of the additional elongated bodies generally extends at least partially along and adjacent to the first elongated body, while each elongated body can be comprised of the first or The first or second cladding of the second reflective material is separated from the other elongated bodies. In one embodiment, as shown in FIG. 11, an exemplary combined waveguide includes a first elongated dielectric cube 900 and a second elongated dielectric cube 902, which are arranged side by side, and thus the first length A lateral side of the cube 900 abuts against a lateral side of the second elongated cube 902 side. In an alternative embodiment, as shown in FIG. 12, another exemplary combined waveguide includes a first elongated dielectric cube 1000 and a second elongated dielectric cube 1002, which are arranged in a stacked manner. Therefore, a major surface of the first elongated cube 1000 abuts against a major surface of the second elongated cube 1002.
在兩者實施例中,該等第一及第二長型立方體之第一及第二主要表面的至少一者可為大致由一含有反射性材料的適當包覆所覆蓋。在圖11的實施例中,該等第一及第二長型立方體900、902是藉由包覆材料904所完整包裝且分隔,而在圖12裡該等第一及第二長型立方體1000、1002則是藉由包覆材料1004所完整包裝且分隔。 In both embodiments, at least one of the first and second major surfaces of the first and second elongated cubes may be substantially covered by a suitable coating comprising a reflective material. In the embodiment of FIG. 11, the first and second elongated cubes 900, 902 are completely packaged and separated by a cladding material 904, and the first and second elongated cubes 1000 are illustrated in FIG. 1002 is completely packaged and separated by a covering material 1004.
在又另一實施例裡,即如圖13中所描繪者,該介電導管1018含有四個個別的介電材料長型本體並且由包覆1028所分隔且裹裝,其中該等四個個別的長型本體是按照二乘二矩陣所排置。 In yet another embodiment, as depicted in FIG. 13, the dielectric conduit 1018 includes four individual elongated bodies of dielectric material and is separated and wrapped by a cover 1028, wherein the four individual The long form of the body is arranged according to a two by two matrix.
在本發明之介電導管含有多個長型本體以供傳播多個獨立EHF信號的情況下,各個長型本體可為同時地,或是依序地,分離於各個其他長型本體,故而能夠將各個長型本體的終端設置為鄰近不同的EHF信號來源及/或接收器。 In the case where the dielectric conduit of the present invention includes a plurality of elongated bodies for propagating a plurality of independent EHF signals, each of the elongated bodies can be separated from each other of the other elongated bodies simultaneously or sequentially. The terminals of each elongated body are placed adjacent to different EHF signal sources and/or receivers.
本發明的介電導管遵從一種沿一導管進行電磁EHF信號傳播的方法,即如圖14的流程圖1100中所述者。此方法可包含,在1102處,利用一電磁EHF傳送器以傳送電磁EHF信號;將該導管之長型本體的第一終端設置為鄰近該EHF傳送器,故而,在1104處,該所傳送電磁EHF信號的至少一局部會經由該第一終端導引至該長型本體之內;以及,在1106處,將該電磁EHF信號的所導引局部沿該長型本體傳播至該長型本體的第 二終端。 The dielectric conduit of the present invention follows a method of electromagnetic EHF signal propagation along a conduit, as depicted in flow chart 1100 of FIG. The method can include, at 1102, utilizing an electromagnetic EHF transmitter to transmit an electromagnetic EHF signal; positioning the first terminal of the elongated body of the conduit adjacent the EHF transmitter, such that at 1104, the transmitted electromagnetic At least a portion of the EHF signal is directed into the elongated body via the first terminal; and, at 1106, the guided portion of the electromagnetic EHF signal propagates along the elongated body to the elongated body First Two terminals.
在一些實施例裡,該方法可進一步包含,在1108處,將該導管之長型本體的第二終端設置為鄰近於一經組態設定以接收EHF輻射的EHF接收器;在1110處,自該導管之長型本體的第二終端發射所傳播電磁EHF信號;以及,在1112處,由該EHF接收器接收所發射電磁EHF信號。 In some embodiments, the method can further include, at 1108, positioning the second terminal of the elongated body of the conduit adjacent to an EHF receiver configured to receive EHF radiation; at 1110, from A second terminal of the elongated body of the conduit transmits the propagated electromagnetic EHF signal; and, at 1112, the transmitted electromagnetic EHF signal is received by the EHF receiver.
在一些實施例裡,其中該EHF傳送器可對應於一第一EHF傳導器並且該EHF接收器可對應於一第二EHF傳導器,該方法可又進一步包含,在1114處,利用該第二EHF傳導器以傳送第二電磁EHF信號;在1116處,經由該第二終端將該所傳送第二電磁EHF信號的至少一局部接收至該長型本體內;以及,在1118處,將該第二電磁EHF信號的所接收局部沿該長型本體傳播至該長型本體的第一終端;在1120處,自該導管之長型本體的第一終端發射該所傳播第二電磁EHF信號;以及,在1122處,由該第一EHF傳導器接收該所發射第二電磁EHF信號。 In some embodiments, wherein the EHF transmitter can correspond to a first EHF transmitter and the EHF receiver can correspond to a second EHF conductor, the method can further include, at 1114, utilizing the second An EHF transmitter to transmit a second electromagnetic EHF signal; at 1116, at least a portion of the transmitted second electromagnetic EHF signal is received into the elongated body via the second terminal; and, at 1118, the first Receiving a received portion of the electromagnetic EHF signal along the elongated body to a first terminal of the elongated body; at 1120, transmitting the propagated second electromagnetic EHF signal from a first terminal of the elongated body of the conduit; At 1122, the transmitted second electromagnetic EHF signal is received by the first EHF transmitter.
本揭示的一些實施例亦可提供一種含有IC封裝組件的系統,而該組件包含具有經設置在含有一導體平面局部之基板上的EHF通訊晶片。該EHF通訊晶片亦可含有能夠傳送具有EHF頻率之傳送信號的傳導器。該基板的導體平面局部大致能夠反射該傳送信號。該系統亦可含有一長型介電耦接器,其具有鄰近該EHF通訊晶片之傳導器的第一末端、長度,以及與該第一末端相隔的第二末端。該傳送信號的至少一局部可在該第一末端處通過而進入該介電耦接器內,並且可沿該介電耦接器或導管傳播離出該傳導器。此外,該傳送信號可具有一極化特徵,此特徵在該介電耦接器的整個長度上會大致維持為相同。 Some embodiments of the present disclosure may also provide a system including an IC package assembly having an EHF communication chip disposed on a substrate having a planar portion of a conductor. The EHF communication chip may also contain a transmitter capable of transmitting a transmission signal having an EHF frequency. The conductor plane of the substrate is substantially substantially reflective of the transmitted signal. The system can also include an elongated dielectric coupler having a first end adjacent the conductor of the EHF communication chip, a length, and a second end spaced from the first end. At least a portion of the transmitted signal can pass through the first end and into the dielectric coupler and can propagate away from the conductor along the dielectric coupler or conduit. Additionally, the transmitted signal can have a polarization characteristic that will remain substantially the same throughout the length of the dielectric coupler.
前文的特定實施例說明將能完整揭露本揭示的一般本質,然其他人士確可藉由施用業界技藝方面的知識俾隨能針對各式應用項目對此等特定實施例進行修改及/或調適,而無須非適當實驗又不致悖離本揭示的一般概念。因此,該等調適及修改係基於本揭所述教示和指導而應歸屬於所揭示實施例之等同項目的意義和範疇內。應瞭解本揭詞彙或術語係屬描述性而非限制性之目的,使得應由熟習本項技藝之人士依照所述教示和指導以解譯本揭術語或詞彙。 The foregoing description of the specific embodiments will be able to fully disclose the general nature of the present disclosure, while others may be able to modify and/or adapt these particular embodiments for various applications by applying the technical knowledge of the art. There is no need for undue experimentation and no departure from the general concept of this disclosure. Accordingly, the adaptations and modifications are intended to be within the meaning and scope of equivalents of the disclosed embodiments. It is to be understood that the terms of the present invention are intended to be illustrative and not restrictive, so that the subject matter or vocabulary should be interpreted in accordance with the teachings and teachings.
本揭示的廣度與範疇不應受限於任何前述的示範性實施例,而僅應依照後載之申請專利範圍及其等的均等項目所定義。 The breadth and scope of the present disclosure should not be limited to any of the foregoing exemplary embodiments, but only as defined by the appended claims and their equivalents.
222‧‧‧介電導管 222‧‧‧ dielectric conduit
224‧‧‧長型本體 224‧‧‧Long body
226‧‧‧縱向軸線 226‧‧‧ longitudinal axis
228‧‧‧第一維度 228‧‧‧ first dimension
230‧‧‧第二維度 230‧‧‧ second dimension
232‧‧‧包覆材料 232‧‧‧Covering materials
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| US10171578B1 (en) * | 2017-06-29 | 2019-01-01 | Texas Instruments Incorporated | Tapered coax launch structure for a near field communication system |
| EP3429025A1 (en) * | 2017-07-14 | 2019-01-16 | Nxp B.V. | A cable, method of making thereof and corresponding apparatus |
| CN111937229B (en) | 2018-04-06 | 2021-11-12 | 韩国科学技术院 | Waveguide for transmitting electromagnetic wave signals |
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| EP2862285A1 (en) | 2015-04-22 |
| KR20150023791A (en) | 2015-03-05 |
| WO2013192337A1 (en) | 2013-12-27 |
| CN104521154A (en) | 2015-04-15 |
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