TW201407499A - Strip layout having identification structure of LED lead frame - Google Patents
Strip layout having identification structure of LED lead frame Download PDFInfo
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- TW201407499A TW201407499A TW101128391A TW101128391A TW201407499A TW 201407499 A TW201407499 A TW 201407499A TW 101128391 A TW101128391 A TW 101128391A TW 101128391 A TW101128391 A TW 101128391A TW 201407499 A TW201407499 A TW 201407499A
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- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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Abstract
Description
本發明係有關於一種LED料帶,尤指一種具有辨識結構之LED料帶。The invention relates to an LED strip, in particular to an LED strip with an identification structure.
請參照第一圖所示,直立式發光二極體支架結構係在一導線架10a上設有多數等距相連之支架單元20a,各支架單元20a上分別設有兩相對立之第一接腳21a及第二接腳22a,並於第一接腳21a上端形成有碗狀之凹部210a,以供承載並固定一晶片(固晶,Die bond),另外,其第二接腳22a上端係具有一接點,以供電性連接一導線;接著,以焊接(連接打線,Wiring)的方式連結第一接腳21a上的晶片與第二接腳22a上之接點,待完成電性連結後,再透過封裝材料(如環氧樹脂)予以包覆封裝,並進行切腳、成品測試及包裝等作業,據此形成發光二極體。As shown in the first figure, the vertical light-emitting diode support structure is provided with a plurality of equidistantly connected bracket units 20a on a lead frame 10a, and each of the bracket units 20a is provided with two opposite first pins. 21a and the second pin 22a, and a bowl-shaped recess 210a is formed at the upper end of the first pin 21a for carrying and fixing a wafer (Die bond), and the second pin 22a has an upper end. a contact is connected to a wire by power supply; then, the contact between the wafer on the first pin 21a and the second pin 22a is connected by soldering (Wiring), after the electrical connection is completed, Then, it is coated and encapsulated by a sealing material (such as epoxy resin), and subjected to cutting, finished product testing, and packaging operations, thereby forming a light-emitting diode.
然而,上述發光二極體的製程中,因發光二極體的晶片必須設置在第一接腳21a上,且第二接腳22a是用於連接打線,因此,該導線架10a須以一定方向置放於模具中,以將晶片安置在正確的接腳上,並進行後續打線及包覆封裝過程。However, in the manufacturing process of the above-mentioned light-emitting diode, since the wafer of the light-emitting diode must be disposed on the first pin 21a, and the second pin 22a is used for connecting the wire, the lead frame 10a must be oriented in a certain direction. Placed in the mold to place the wafer on the correct pins and perform subsequent wire bonding and cladding processes.
習知導線架10a用於判別方向性的方法是在導線架10a的一側邊切削一斜角30a,透過該斜角30a的設置即可判斷該導線架10a是否放置正確;惟,習知導線架10a的斜角30a需另設置模具以進行二次加工,其製程耗時且有額外的模具費用,進而造成產品成本的提高,此為本發明人所欲積極改良之處。The method for determining the directivity of the lead frame 10a is to cut a bevel 30a on one side of the lead frame 10a, and the setting of the bevel 30a can determine whether the lead frame 10a is correctly placed; however, the conventional wire The bevel 30a of the frame 10a requires another mold to be subjected to secondary processing, which is time-consuming and has an additional mold cost, thereby causing an increase in product cost, which is a positive improvement of the inventors.
有鑑於此,本發明人為達到上述目的,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。In view of the above, the present inventors have made great efforts to study and cooperate with the application of the theory, and finally propose a present invention which is reasonable in design and effective in improving the above-mentioned defects.
本發明之一目的,在於提供一種具有辨識結構之LED料帶,其係提供LED料帶以一定方向置放於模具中,以利進行後續固晶、打線及包覆封裝過程。An object of the present invention is to provide an LED strip with an identification structure, which provides an LED strip to be placed in a mold in a certain direction to facilitate subsequent die bonding, wire bonding and encapsulation processes.
為了達成上述之目的,本發明係為一種具有辨識結構之LED料帶,包括複數導線架組,係為等距相連且呈直線排列,每一導線架組包含一定數量的支架單元;至少一主銜接段,該主銜接段係串連每一導線架組中的該些支架單元,並延伸連接相鄰的另一導線架組;複數夾持片,各該夾持片係位於每一導線架組中相鄰的支架單元之間,並突伸在該主銜接段的一側邊;第一零畸導線架,位於該些導線架組的一外側,第一零畸導線架包含至少一個第一支架單元;以及第二零畸導線架,相對位於該些導線架組的另一外側,第二零畸導線架包含至少一個第二支架單元;其中,第一支架單元的數量不等於第二支架單元的數量,且第一支架單元的數量與第第二支架單元的數量總和等於每一導線架組包含的支架單元數量。In order to achieve the above object, the present invention is an LED strip having an identification structure, including a plurality of lead frame sets, which are equidistantly connected and arranged in a line, each lead frame set including a certain number of bracket units; at least one main In the connecting section, the main connecting section is connected in series with the bracket units in each lead frame group, and extends to connect another adjacent lead frame set; a plurality of clamping pieces, each of which is located in each lead frame An adjacent bracket unit in the group protrudes from one side of the main connecting section; a first zero-distortion lead frame is located on an outer side of the lead frame sets, and the first zero-distortion lead frame includes at least one a bracket unit; and a second zero-distortion lead frame opposite to the other outer side of the lead frame set, the second zero-distortion lead frame includes at least one second bracket unit; wherein the number of the first bracket unit is not equal to the second The number of bracket units, and the sum of the number of first bracket units and the number of second bracket units is equal to the number of bracket units included in each lead frame group.
為了達成上述之目的,本發明係為一種具有辨識結構之LED料帶,包括一導線架組,係為等距相連且呈直線排列,該導線架組包含一定數量的支架單元;至少一主銜接段,該主銜接段係串連該導線架組中的該些支架單元;複數夾持片,各該夾持片係位於該導線架組中相鄰的支架單元之間,並突伸在該主銜接段的一側邊;第一零畸導線架,位於該導線架組的一外側,第一零畸導線架包含至少一個第一支架單元;以及第二零畸導線架,相對位於該導線架組的另一外側,第二零畸導線架包含至少一個第二支架單元;其中,第一支架單元的數量不等於第二支架單元的數量,且第一支架單元的數量與第第二支架單元的數量總和等於該導線架組包含的支架單元數量。In order to achieve the above object, the present invention is an LED strip having an identification structure, comprising a lead frame group which are equidistantly connected and arranged in a line, the lead frame group comprising a certain number of bracket units; at least one main connection a segment connecting the plurality of bracket units in the lead frame group; a plurality of clamping pieces, each of the clamping pieces being located between adjacent ones of the lead frame groups, and protruding therefrom a side of the main junction; a first zero-distortion lead frame located on an outer side of the lead frame set, the first zero-distortion lead frame includes at least one first bracket unit; and a second zero-distortion lead frame opposite to the wire The other outer side of the shelf set, the second zero-distortion lead frame includes at least one second bracket unit; wherein the number of the first bracket units is not equal to the number of the second bracket units, and the number of the first bracket units and the second bracket The sum of the number of units is equal to the number of bracket units included in the leadframe group.
相較於習知,本發明之LED基座主要是利用夾持片的設置與否,進而將LED料帶區隔為導線架組、第一零畸導線架及第二零畸導線架,並透過第一零畸導線架及第二零畸導線架包含不同數量的支架單元,藉此作為判斷LED料帶方向的依據,以提供LED料帶以一定方向置放於模具中,並進行後續固晶、打線及包覆封裝過程,省卻習知為辨識方向所採取的二次加工工序,且可減省模具費用,進而降低產品成本,增加本發明之實用性。Compared with the prior art, the LED base of the present invention mainly utilizes the setting of the clamping piece, thereby separating the LED strip into a lead frame set, a first zero-distortion lead frame and a second zero-distortion lead frame, and The first zero-distortion lead frame and the second zero-distortion lead frame include different numbers of bracket units, thereby serving as a basis for judging the direction of the LED strips, so as to provide the LED strips to be placed in the mold in a certain direction, and to perform subsequent solidification. The crystal, wire bonding and encapsulation process eliminates the secondary processing steps that are conventionally used to identify the direction, and can reduce the cost of the mold, thereby reducing the product cost and increasing the practicability of the present invention.
有關本發明之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。The detailed description and technical content of the present invention are set forth in the accompanying drawings.
請參照第二圖,係為本發明之具有辨識結構之LED料帶的平面示意圖,該LED料帶1包括複數導線架組10、至少一主銜接段20、複數夾持片30、第一零畸導線架40及第二零畸導線架50。Please refer to the second figure, which is a schematic plan view of the LED strip with the identification structure of the present invention. The LED strip 1 includes a plurality of lead frame sets 10, at least one main connecting section 20, a plurality of clamping pieces 30, and a first zero. The distorted lead frame 40 and the second zero-distortion lead frame 50.
該些導線架組10係呈直線排列,且每一導線架組10包含一定數量的支架單元11;本實施例中,該LED料帶1係包含3組導線架組10,每一組導線架組10則是包含有5個支架單元11。各該支架單元11包含一第一接腳111及間隔設置的一第二接腳112,該第一接腳111成型有一凹杯113,該凹杯113係供置設一LED晶片。The lead frame sets 10 are arranged in a straight line, and each lead frame set 10 includes a certain number of bracket units 11; in this embodiment, the LED strip 1 includes three sets of lead frame sets 10, each set of lead frames Group 10 is comprised of five bracket units 11. Each of the bracket units 11 includes a first pin 111 and a second pin 112 spaced apart from each other. The first pin 111 is formed with a concave cup 113 for arranging an LED chip.
該主銜接段20係串連每一導線架組10中的該些支架單元11,並向兩側延伸而連接相鄰的另一導線架組10;較佳地,該主銜接段20係成型在該些第一接腳111及第二接腳112的中段,以提供該些第一接腳111及第二接腳112的支撐力。The main connecting section 20 is connected in series with the bracket units 11 in each lead frame set 10, and extends to both sides to connect adjacent one lead frame sets 10; preferably, the main connecting section 20 is formed In the middle of the first pin 111 and the second pin 112, the supporting forces of the first pin 111 and the second pin 112 are provided.
在射出成型的過程中,該些夾持片30的設置係提供模具作為夾持之用。該些夾持片30係對應各支架單元11的位置而成型,各該夾持片30是位於每一導線架組10中相鄰的支架單元11之間,並突伸在該主銜接段20的一側邊;本實施例中,該些夾持片30的截面係呈梯形,實際實施時並不以此為限。In the process of injection molding, the arrangement of the holding pieces 30 provides a mold for clamping. The clamping pieces 30 are formed corresponding to the positions of the respective bracket units 11 , and each of the clamping pieces 30 is located between the adjacent bracket units 11 in each lead frame set 10 and protrudes from the main connecting section 20 . In the embodiment, the clamping pieces 30 have a trapezoidal cross section, which is not limited thereto.
值得注意的是,相鄰的導線架組10之間的主銜接段上未具有該夾持片30,透過該夾持片30的設置與否,即可判斷一組導線架組10的範圍及每一組導線架組10所包含的支架單元11數量,倘若相鄰的二支架單元11之間不具有該夾持片30,則此相鄰的二支架單元11係分屬不同組的導線架組10。It should be noted that the holding piece 30 is not present on the main connecting section between the adjacent lead frame sets 10, and the range of the set of lead frames 10 can be determined by the setting of the holding piece 30 or not. The number of the bracket units 11 included in each set of lead frame sets 10 is such that if the adjacent two bracket units 11 do not have the holding piece 30, the adjacent two bracket units 11 belong to different sets of lead frames. Group 10.
該第一零畸導線架40位於該些導線架組10的一外側,該第一零畸導線架40包含至少一個第一支架單元41;又,該第二零畸導線架50相對位於該些導線架組10的另一外側,該第二零畸導線架50包含至少一個第二支架單元51;其中,第一零畸導線架40包含的第一支架單元41數量不等於第二零畸導線架50包含的第二支架單元51數量,且第一零畸導線架40之第一支架單元41的數量與第二零畸導線架50之第二支架單元51的數量總和等於每一導線架組10包含的支架單元11數量。The first zero-distortion lead frame 40 is located on an outer side of the lead frame sets 10, and the first zero-distortion lead frame 40 includes at least one first bracket unit 41; The other outer side of the lead frame set 10 includes the at least one second bracket unit 51; wherein the first zero-distortion lead frame 40 includes a number of the first bracket units 41 that is not equal to the second zero-distortion wires The rack 50 includes a second bracket unit 51, and the sum of the number of the first bracket units 41 of the first zero-distance lead frame 40 and the second bracket unit 51 of the second zero-distortion lead frame 50 is equal to each lead frame group. 10 includes the number of bracket units 11.
再者,本發明之LED料帶1更包括一輔助銜接段60,該輔助銜接段60係位在相對該些凹杯113的另一側邊,該輔助銜接段60係串連該些支架單元11、第一支架單元41、及第二支架單元51的末段。Furthermore, the LED strip 1 of the present invention further includes an auxiliary engaging section 60 which is fastened to the other side of the concave cups 113. The auxiliary engaging sections 60 are connected in series with the bracket units. 11. The first bracket unit 41 and the last section of the second bracket unit 51.
請續參照第三圖,係為本發明之具有辨識結構之LED料帶的使用示意圖;本發明之LED料帶1使用時係放置在一模具2中,該模具2具有相對的一第一側邊2’及一第二側邊2”,該LED料帶1須以一定方向置放於該模具2中,以將晶片安置在第一接腳111上,後續進行打線,最後再利用封裝材料3進行封裝製程,據以完成發光二極體的製作。Referring to the third figure, it is a schematic diagram of the use of the LED strip with the identification structure of the present invention; the LED strip 1 of the present invention is used in a mold 2 having an opposite first side. The side 2' and the second side 2", the LED strip 1 must be placed in the mold 2 in a certain direction to place the wafer on the first pin 111, followed by wire bonding, and finally using the packaging material. 3 The packaging process is performed to complete the fabrication of the light-emitting diode.
該LED料帶1放置時,其方向的辨識方法係透過該LED料帶1二外側的該第一零畸導線架40及該第二零畸導線架50來判定,例如將包含有2個支架單元41的第一零畸導線架40之一側邊設定為左側,相對地,則包含有3個支架單元51的第二零畸導線架50之另一側邊即為右側,接著可再根據製程設定,例如將左側的第一零畸導線架40定位在該模具2的第一側邊2’,同時,將右側的第二零畸導線架50定位在該模具2的第二側邊2”,藉此將該LED料帶1正確地安置在該模具2內,以完成發光二極體之製作,後續再進行裁切或分裝等製程。When the LED strip 1 is placed, the direction identification method is determined by the first zero-distortion lead frame 40 and the second zero-distortion lead frame 50 on the outer side of the LED strip 1, for example, two brackets are included. One side of the first zero-distortion lead frame 40 of the unit 41 is set to the left side, and oppositely, the other side of the second zero-distance lead frame 50 including the three bracket units 51 is the right side, and then can be further Process setting, for example, positioning the first zero-distortion lead frame 40 on the left side on the first side 2' of the mold 2, and positioning the second zero-distortion lead frame 50 on the right side on the second side 2 of the mold 2 Thus, the LED strip 1 is correctly placed in the mold 2 to complete the fabrication of the LED, and then the cutting or dispensing process is performed.
值得一提的是,本發明之LED料帶1亦可設置單獨的一組導線架組之實施方式,此實施方式中,導線架組10與第一零畸導線架40、導線架組10與第二零畸導線架50之間的主銜接段20上未具有該夾持片30。It is worth mentioning that the LED strip 1 of the present invention can also be provided with a separate set of lead frame sets. In this embodiment, the lead frame set 10 and the first zero-distortion lead frame 40 and the lead frame set 10 are The holding piece 30 is not provided on the main engaging section 20 between the second and second lead frame 50.
以上所述僅為本發明之較佳實施例,非用以限定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the invention.
10a...導線架10a. . . Lead frame
20a...支架單元20a. . . Bracket unit
21a...第一接腳21a. . . First pin
210a...凹部210a. . . Concave
22a...第二接腳22a. . . Second pin
30a...斜角30a. . . bevel
1...LED料帶1. . . LED tape
2...模具2. . . Mold
3...封裝材料3. . . Packaging material
2’...第一側邊2'. . . First side
2”...第二側邊2"...second side
10...導線架組10. . . Lead frame set
11...支架單元11. . . Bracket unit
111...第一接腳111. . . First pin
112...第二接腳112. . . Second pin
113...凹杯113. . . Concave cup
20...主銜接段20. . . Main link
30...夾持片30. . . Holding piece
40...第一零畸導線架40. . . First zero distortion lead frame
41...第一支架單元41. . . First bracket unit
50...第二零畸導線架50. . . The 20th distortion lead frame
51...第二支架單元51. . . Second bracket unit
60...輔助銜接段60. . . Auxiliary connection segment
第一圖係為一般直立式發光二極體支架的LED料帶﹔The first figure is an LED strip of a general vertical light-emitting diode support;
第二圖係本發明本發明之具有辨識結構之LED料帶的平面示意圖;2 is a schematic plan view of an LED strip with an identification structure of the present invention;
第三圖係本發明之具有辨識結構之LED料帶的使用示意圖。The third figure is a schematic diagram of the use of the LED strip with the identification structure of the present invention.
1...LED料帶1. . . LED tape
10...導線架組10. . . Lead frame set
11...支架單元11. . . Bracket unit
111...第一接腳111. . . First pin
112...第二接腳112. . . Second pin
113...凹杯113. . . Concave cup
20...主銜接段20. . . Main link
30...夾持片30. . . Holding piece
40...第一零畸導線架40. . . First zero distortion lead frame
41...第一支架單元41. . . First bracket unit
50...第二零畸導線架50. . . The 20th distortion lead frame
51...第二支架單元51. . . Second bracket unit
60...輔助銜接段60. . . Auxiliary connection segment
Claims (10)
複數導線架組,係為等距相連且呈直線排列,每一導線架組包含一定數量的支架單元;
至少一主銜接段,該主銜接段係串連每一導線架組中的該些支架單元,並延伸連接相鄰的另一導線架組;
複數夾持片,各該夾持片係位於每一導線架組中相鄰的支架單元之間,並突伸在該主銜接段的一側邊;
第一零畸導線架,位於該些導線架組的一外側,第一零畸導線架包含至少一個第一支架單元;以及
第二零畸導線架,相對位於該些導線架組的另一外側,第二零畸導線架包含至少一個第二支架單元;
其中,第一支架單元的數量不等於第二支架單元的數量,且第一支架單元的數量與第第二支架單元的數量總和等於每一導線架組包含的支架單元數量。An LED strip with an identification structure, comprising:
The plurality of lead frame groups are equidistantly connected and arranged in a straight line, and each lead frame group comprises a certain number of bracket units;
At least one main connecting section, the main connecting section is connected in series with the bracket units in each lead frame group, and extends to connect another adjacent lead frame set;
a plurality of clamping pieces, each of the clamping pieces being located between adjacent bracket units in each lead frame group and protruding on one side of the main connecting section;
a first zero-distortion lead frame located on an outer side of the lead frame sets, the first zero-distortion lead frame includes at least one first bracket unit; and a second zero-distortion lead frame opposite to the other outer side of the lead frame sets The second zero-distortion lead frame includes at least one second bracket unit;
Wherein, the number of the first bracket units is not equal to the number of the second bracket units, and the sum of the number of the first bracket units and the number of the second bracket units is equal to the number of the bracket units included in each lead frame group.
一導線架組,係為等距相連且呈直線排列,該導線架組包含一定數量的支架單元;
至少一主銜接段,該主銜接段係串連該導線架組中的該些支架單元;
複數夾持片,各該夾持片係位於該導線架組中相鄰的支架單元之間,並突伸在該主銜接段的一側邊;
第一零畸導線架,位於該導線架組的一外側,第一零畸導線架包含至少一個第一支架單元;以及
第二零畸導線架,相對位於該導線架組的另一外側,第二零畸導線架包含至少一個第二支架單元;
其中,第一支架單元的數量不等於第二支架單元的數量,且第一支架單元的數量與第第二支架單元的數量總和等於該導線架組包含的支架單元數量。An LED strip with an identification structure, comprising:
a lead frame group is equidistantly connected and arranged in a line, the lead frame group comprising a certain number of bracket units;
At least one main connecting section, the main connecting section is connected to the bracket units in the lead frame group;
a plurality of clamping pieces, each of the clamping pieces being located between adjacent ones of the lead frame sets and projecting on one side of the main engaging section;
a first zero-distortion lead frame located on an outer side of the lead frame set, the first zero-distortion lead frame includes at least one first bracket unit; and a second zero-distortion lead frame opposite to the other outer side of the lead frame set, The 20-point lead frame includes at least one second bracket unit;
Wherein, the number of the first bracket units is not equal to the number of the second bracket units, and the sum of the number of the first bracket units and the number of the second bracket units is equal to the number of the bracket units included in the lead frame group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101128391A TWI455045B (en) | 2012-08-07 | 2012-08-07 | Strip layout having identification structure of LED lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101128391A TWI455045B (en) | 2012-08-07 | 2012-08-07 | Strip layout having identification structure of LED lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201407499A true TW201407499A (en) | 2014-02-16 |
| TWI455045B TWI455045B (en) | 2014-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW101128391A TWI455045B (en) | 2012-08-07 | 2012-08-07 | Strip layout having identification structure of LED lead frame |
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| Country | Link |
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| TW (1) | TWI455045B (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3618534B2 (en) * | 1997-11-28 | 2005-02-09 | 同和鉱業株式会社 | Optical communication lamp device and manufacturing method thereof |
| TWI476885B (en) * | 2009-03-06 | 2015-03-11 | 光寶電子(廣州)有限公司 | Conductive frame strip, combination of conductive strip and insulating shell, and light emitting diode module using the same |
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2012
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| Publication number | Publication date |
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| TWI455045B (en) | 2014-10-01 |
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