TW201407226A - Manufacturing system of optical display device and manufacturing method of optical display device - Google Patents

Abstract

A manufacturing system of an optical display device comprising, an affixing apparatus(12, 15, 18) that makes an affixed body(P11, P12) which is made by affixing an optical member sheet(FX) to an optical display component(P, PX), and a cutting apparatus(16, 19) that comprises a laser light irradiation device(30), wherein the cutting apparatus(16, 19) forms an optical member(FS) out of the optical display component, the laser light irradiation device(30) irradiates laser light to a cutting part(S) being set between a facing portion and an excess portion(Y) on the optical member sheet(FX) of the affixed body(P11, P12), while having the laser light being focused on a layer(L) which locates closest to the optical display component among a plurality of layers(S7) in a laminated structure of optical layers(S1).

Description

Production system and production method of optical display device

The present invention relates to a production system and a production method of an optical display device such as a liquid crystal display.

The present invention claims priority based on Japanese Patent Application No. 2012-175963, filed on Aug. 08, 2012, and the Japanese Patent Application No. 2013-104402, filed on May 16, 2013. Quote its content.

Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate attached to a liquid crystal panel (optical display member) is cut out from a long film to cut a layer having a size conforming to a display area of the liquid crystal panel. Thereafter, it is bonded to a liquid crystal panel (for example, refer to Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2003-255132.

However, in the above-described conventional structure, in consideration of variations in the dimensions of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) of the ply of the liquid crystal panel, a ply which is slightly larger than the display region is cut. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, which may hinder the miniaturization of the device.

On the other hand, in Patent Document 1, a cutter is used for cutting and adding A method by which an optical component is cut from an optical component layer. Further, there is also a method of cutting the optical component from the optical component layer by performing cutting processing using laser light instead of cutting using a cutter. Compared with the cutting process using a sharp blade such as a cutter, the cutting process using laser light can reduce the vibration amplitude (tolerance) of the cutting line, and achieve the purpose of improving the cutting accuracy. In addition, in this specification, the cutting process using a laser beam is called "laser cutting."

Here, the optical component layer includes a structure in which a plurality of optical layers are laminated, The optical layer includes a film layer having a low average absorption rate of laser light in a vibration wavelength range of the irradiated laser light. Hereinafter, in the present specification, the "film layer having a low average absorption rate of the laser light in the vibration wavelength range of the irradiated laser light" is referred to as a "low absorption rate film layer".

An optical component for stacking a plurality of optical layers including the aforementioned low absorptive film layer In the case where the layer is subjected to laser cutting, the operator must further increase the laser light output and cut off the low absorption rate film by thermal energy as compared with the case of laser cutting for the optical component layer not including the low absorption rate film layer. Floor. Therefore, the optical component formed by laser cutting the optical component layer including the low absorptivity film layer has problems such as large cut ends, thermal deformation, and narrow effective area of the optical component.

The present invention has been made in view of the above, and provides a production system of an optical display device and The production method can reduce the frame portion around the display area, achieve the purpose of expanding the display area, and miniaturize the machine, and can suppress thermal deformation of the cut end of the optical component caused by laser cutting, and expand the effective area of the optical component. .

In order to achieve the above object, the present invention employs the following means.

(1) An aspect of the present invention is a production system of an optical display device, which is a production system in which an optical component is attached to an optical display component to form an optical display device, and is provided with: a bonding device, which is to be optically displayed. An optical component layer having a larger display area of the component and comprising an optical layer of a laminated structure is attached to the The optical display member is configured to form a bonding body; and the cutting device is a laser beam irradiation device that irradiates laser light for cutting processing; wherein the cutting device is a direction of a display region of the optical component layer in the bonding body a portion, the remaining portion of the outer portion of the opposite portion is cut, and an optical component corresponding to the size of the display region is formed from the optical component layer; and the laser light irradiation device faces the opposite portion and the remaining portion of the optical component layer in the bonded body The cut portion between the portions is focused as a focus on the layer closest to the optical display member among the plurality of layers including the optical layer of the laminated structure, and the laser light is irradiated.

According to the above structure, the optical component layer larger than the display area is bonded to the optical After the display member is cut, the remaining portion of the optical component layer is cut, and an optical component corresponding to the size of the display region can be formed on the surface of the optical display member with better precision, and the frame portion outside the display region can be reduced and the display region can be achieved. Expansion and miniaturization of the machine.

Further, the cutting using the laser light is more accurate than the cutting using the dicing blade, and the frame portion around the display region can be made smaller than in the case of using the dicing blade.

Then, the layer closest to the optical display member (generally a low absorptivity film layer) is focused as a focus, and the laser light is irradiated to cut the optical component layer with high efficiency and suppress the optical component layer. The thermal deformation of the cut end and the suppression of the damage of the surface of the optical display member can achieve the purpose of further reducing the frame portion of the optical display device.

In addition, the "opposing portion with the display region" in the above configuration means an area which is larger than the display area and smaller than the outer shape of the optical display member (the outline shape in the plan view), and avoids the functional part such as the electronic component mounting portion. Area. That is, the above-described structure includes a case where the remaining portion is cut by laser along the outer periphery of the optical display member.

Further, in the above configuration, "the size corresponding to the display area" means a size larger than the display area and smaller than the outer shape of the optical display member (the outline shape in the plan view), and the electrons in the optical display member are avoided. The size of the functional part such as the component mounting part.

In the above configuration, the "laser light for cutting processing" means laser light to be irradiated by the cutting process of the optical component layer. This means that the cutting process can only perform irradiation of laser light. Further, the cutting process can also perform irradiation of laser light and other operations.

(2) In the aspect of the above (1), the laser light irradiation device is configured to form a cutting line that cuts the layer portion closest to the optical display member.

In this case, damage to the surface of the optical display member can be effectively suppressed as compared with the case where the laser is completely cut to the layer closest to the optical display member.

(3) In the aspect of the above (2), the cutting device further has a tearing device which is along a direction intersecting with a bonding surface of the optical display member to which the optical component layer is bonded, The optical display member is displaced, and the remaining portion of the optical component layer after the cutting line is formed by the cutting device is torn from the opposing portion.

According to this configuration, it is possible to easily remove the remaining portion by tearing, and it is possible to suppress the irregularity of the peeling or cutting end caused by the tearing action of the optical member remaining in the optical display member.

(4) In any one of the aspects (1) to (3), further comprising: a detecting unit that detects an outer peripheral edge of a bonding surface of the optical component layer and the optical display member; The cutting portion is set along the outer circumference.

In the above configuration, "the bonding surface of the optical component layer and the optical display member" refers to the surface of the optical component layer of the optical display component. Specifically, the "outer peripheral edge of the bonding surface" refers to the bonding optical in the optical display component. The outer periphery of the substrate on the side of the component layer.

(5) A method of producing an optical display device according to another aspect of the present invention is a method for producing an optical display device by bonding an optical member to an optical display member, comprising: a bonding step, An optical component layer that is larger than a display area of the optical display member and includes an optical layer of a laminated structure is bonded to the optical display component to form a bonding body; and a cutting step is performed toward the optical component in the bonding body The opposite portion between the opposite portion of the display region of the layer and the remaining portion of the outer portion of the opposite portion is focused as a focus at a layer closest to the optical display member among a plurality of layers of the optical layer including the laminated structure The laser light for cutting and cutting is irradiated, and the opposing portion and the remaining portion are cut, and an optical component corresponding to the size of the display region is formed from the optical component layer.

(6) In the aspect of (5) above, the cutting step further comprises a laser irradiation step; In the irradiation irradiation step, laser light is irradiated to the cut portion to form a cutting line that cuts the layer portion closest to the optical display member.

(7) In the aspect of (6) above, the cutting step further comprises a tearing step; the tearing step a step of displacing toward the optical display member side along a direction intersecting with a bonding surface of the optical display member to which the optical component layer is bonded, and tearing the opposite portion to form the cutting line after the cutting step The remainder of the optical component layer.

(8) In any of the above aspects (5) to (7), the production system of the above optical display device The system further includes a detecting step of detecting an outer peripheral edge of the bonding surface of the optical component layer and the optical display member in the bonding body before the cutting step; the cutting portion is set along the outer circumferential edge.

According to the present invention, it is possible to reduce the frame portion around the display area, achieve the purpose of expanding the display area and miniaturizing the machine, and suppress thermal deformation of the cut end of the optical component at the time of laser cutting and enlarge the effective area of the optical component. .

1‧‧‧Film bonding system

5‧‧‧Roller conveyor

11‧‧‧First calibration device

12‧‧‧First bonding device

12a, 15a, 18a‧‧‧ transporting device

12b, 15b, 18b‧‧‧ pinch roller

12c, 15c, 18c‧‧‧ Roller Holder

12d‧‧‧Protective film recycling department

13‧‧‧First cutting device

14‧‧‧Second calibration device

15‧‧‧Second laminating device

15d‧‧‧Second Recycling Department

16‧‧‧Second cutting device

16a, 19a‧‧‧ camera

17‧‧‧ Third calibration device

18‧‧‧ Third bonding device

18d‧‧‧ Third Recycling Department

19‧‧‧ Third cutting device

20‧‧‧Control device

30‧‧‧Laser light irradiation device

31‧‧‧ pedestal

31a‧‧‧ Keep face

32‧‧‧Mobile devices

33‧‧‧Control device

61‧‧‧First Inspection Department

62‧‧‧Second Detection Department

63‧‧‧Photographing device

63a‧‧‧Photographing surface

64‧‧‧Light source

65‧‧‧Control Department

160‧‧‧Laser oscillator

161‧‧‧First illumination position adjustment device

161a, 162a‧‧ lens

161b, 162b‧‧‧ actuator

161c, 162c‧‧‧Rotary axis

162‧‧‧second illumination position adjustment device

163‧‧‧Condensing lens

C‧‧‧ camera

CA‧‧‧ inspection area

ED‧‧‧ outer periphery

F1‧‧‧First optical component layer

F2‧‧‧Second optical component layer

F3‧‧‧ third optical component layer

F11‧‧‧First optical component

F12‧‧‧Second optical component

F13‧‧‧ Third optical component

F1S‧‧‧ layer

F21‧‧‧ first bonding layer

F22‧‧‧Second bonding layer

F23‧‧‧ third bonding layer

FS‧‧‧Optical components

FX‧‧‧ optical component layer

G‧‧‧Border Department

H‧‧‧ Height

H1‧‧‧ Height

L‧‧‧Laser light

L1‧‧‧Focus distance

Qa, Qb, Qc‧‧ Focus

P‧‧‧ LCD panel

P1‧‧‧ first substrate

P2‧‧‧second substrate

P3‧‧‧ liquid crystal layer

P4‧‧‧ display area

P5‧‧‧Electronic Component Installation Department

Pf‧‧‧protective film

P11‧‧‧First single-sided fitting panel

P12‧‧‧Second single-sided fitting panel

P13‧‧‧ double-sided fitting panel

Starting point of pt1‧‧

End point of pt2‧‧

PX‧‧‧Optical display parts

R1‧‧‧First roll drum

R2‧‧‧second roll drum

R3‧‧‧ third roll

S‧‧‧cutting department

S1‧‧‧ optical layer

S2‧‧‧Adhesive layer

S4‧‧‧ surface protection film

S5‧‧‧Fitting layer

S6‧‧‧ polarizer

S7‧‧‧ first film

S8‧‧‧second film

SA1‧‧‧ first fit surface

SA2‧‧‧ second fit surface

SL‧‧‧ cut line

T1‧‧‧ fitting surface

T2‧‧‧ face

T3‧‧‧ face

T4‧‧‧ face

U‧‧‧ focus

V1‧‧‧ first direction

V2‧‧‧ second direction

V3‧‧‧ third direction

Y, Y’‧‧‧ remaining

Θ‧‧‧ tilt angle

Fig. 1 is a schematic structural view showing a film bonding system of an optical display device in an embodiment of the present invention.

Fig. 2 is a perspective view of the periphery of the second cutting device of the film bonding system.

Fig. 3 is a perspective view corresponding to the internal structure of the second cutting device shown in Fig. 2.

Fig. 4 is a perspective view showing the periphery of a second bonding apparatus of the above film bonding system.

Figure 5 is a cross-sectional view of the first bonding layer in the above film bonding system.

Fig. 6 is a cross-sectional view showing a second bonding layer around the second cutting device in the film bonding system.

Fig. 7 is a plan view showing a third bonding layer around the third cutting device in the above film bonding system.

Figure 8 is a cross-sectional view taken along line A-A of Figure 7.

Figure 9 is a cross-sectional view of the double-sided bonding panel passing through the above film bonding system.

Fig. 10 is a cross-sectional view showing a liquid crystal panel and a bonding layer bonded to the liquid crystal panel.

Fig. 11 is a cross-sectional view showing a state in which the above-mentioned bonding layer is cut by laser.

Fig. 12A is a cross-sectional view showing a state in which the above-mentioned bonding layer portion is partially cut by a laser.

Fig. 12B is a cross-sectional view showing the remaining portion of the above-mentioned bonding layer being torn.

Figure 13 is a perspective view showing a pattern when the remaining portion of the optical component layer is torn from the optical display member.

Fig. 14 is a schematic view showing the first detecting portion of the outer periphery of the bonding surface.

Fig. 15 is a schematic view showing a modification of the first detecting portion for detecting the outer periphery of the bonding surface.

Fig. 16 is a plan view showing the position of the outer periphery of the bonding surface.

Fig. 17 is a view showing the second detecting portion for detecting the outer periphery of the bonding surface.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this embodiment, the description is As a production system of an optical display device, a film bonding system constituting a part of a production system of an optical display device, and a production method of an optical display device using a film bonding system. In each figure, the XYZ orthogonal coordinate system is set, the X direction shows the width direction of the optical display member (liquid crystal panel), the Y direction shows the transport direction of the optical display unit, and the Z direction shows the orthogonal direction of the X direction and the Y direction. .

Fig. 1 is a view showing a film bonding system 1 of the present embodiment (production system of optical equipment) Schematic structure of the system. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel. The film bonding system 1 manufactures an optical component bonding body including the optical display member and the optical component. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. Each part of the film bonding system 1 is integrally controlled by a control device 20 as an electronic control unit.

The film bonding system 1 is from the starting position of the bonding step to the final position, so that The liquid crystal panel P is transported by, for example, a drive type roller conveyor 5, and the liquid crystal panel P is sequentially subjected to a specific process. The liquid crystal panel P is conveyed on the roller conveyor 5 in a horizontal state in which the front surface and the reverse surface thereof are horizontal.

In the left side of the drawing, the upstream side of the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side) is displayed, and the right side of the drawing shows the downstream side of the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport downstream side).

Referring to FIGS. 7 to 9 together, the plan view of the liquid crystal panel P is rectangular. A display region P4 having a shape along the outer circumference is formed from an inner side of the outer circumference thereof at a specific width. When the panel of the second calibration device 14 is transported to the upstream side, the short side of the display region P4 is conveyed approximately in the transport direction, and when the panel of the second calibration device 14 is transported to the downstream side, Then, the long side of the display region P4 is transported to the liquid crystal panel P approximately along the transport direction.

For the front and back sides of the liquid crystal panel P, the first optical component layer of the strip shape The first optical component F11, the second optical component F12, and the third optical component F13 cut by the F1, the second optical component layer F2, and the third optical component layer F3 are appropriately bonded. In the present embodiment, the double-sided side of the backlight side and the display surface side of the liquid crystal panel P are respectively bonded with the first optical component F11 (optical component, opposite portion) and the third optical component F13 (optical component) as a polarizing film. And the opposite side), the second optical component F12 (optical component, opposite portion) overlapping the first optical component F11 is further adhered to the backlight side of the liquid crystal panel P as a luminance increasing film.

As shown in FIG. 1, the film bonding system 1 includes a first calibration device 11, The liquid crystal panel P is transported from the upstream process to the panel transport upstream side of the roller conveyor 5, and the liquid crystal panel P is calibrated; the first bonding device 12 (bonding device) is disposed in the first calibration device 11 The panel transporting the downstream side; the first cutting device 13 is disposed adjacent to the first bonding device 12; and the second calibration device 14 is disposed on the panel of the first bonding device 12 and the first cutting device 13 Downstream side.

Further, the film bonding system 1 includes a second bonding device 15 (bonding device). The second cutting device 16 (cutting device) is disposed near the second bonding device 15; the third calibration device 17 is disposed at the second bonding device. The panel 15 and the second cutting device 16 are transported to the downstream side; the third bonding device 18 (the bonding device) is provided on the panel transport downstream side of the third calibration device 17; and the third cutting device 19 is cut. The breaking device is disposed near the third bonding device 18.

The first calibration device 11 can hold the liquid crystal panel P and freely face vertically and horizontally Move in the direction. Moreover, the first calibration device 11 has a pair of cameras for capturing, for example, the liquid crystal panel P. The panel conveys the ends of the upstream side and the downstream side (not shown). The photographic data of the camera is transmitted to the control device 20. The control device 20 inspects the data based on the photographic data and the optical axis direction stored in advance to activate the first calibration device 11. However, the second calibration device 14 and the third calibration device 17 described later also have a camera, and the photographic data of the camera is used for calibration.

The first calibration device 11 is controlled by the action of the control device 20 to be relatively first The bonding device 12 performs calibration of the liquid crystal panel P. At this time, the position of the liquid crystal panel P in the horizontal direction (hereinafter referred to as the member width direction) of the vertical conveyance direction and the rotation direction of the vertical axis (hereinafter, simply referred to as the rotation direction) are determined. In this state, the liquid crystal panel P is guided to the bonding position of the first bonding apparatus 12.

The first bonding device 12 is for the strip-shaped first optical group that is guided to the bonding position The lower side surface of the layer F1 (optical element layer) is bonded to the upper side (backlight side) of the liquid crystal panel P conveyed along the upper side (refer to FIG. 5). The first bonding apparatus 12 includes a conveying device 12a that winds the first optical component layer F1 from the first winding roller R1 around which the first optical component layer F1 is wound, and conveys it along the longitudinal direction thereof. The optical component layer F1 and the nip roller 12b are attached to the lower surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the lower side of the first optical component layer F1 conveyed by the conveying apparatus 12a.

The conveying device 12a includes a drum holding portion 12c that supports the first winding The first roll drum R1 of the optical component layer F1, and the first optical component layer F1 is wound up along the longitudinal direction thereof; and the protective film collecting portion 12d is overlapped with the upper side of the first optical component layer F1 and the first The protective film pf that is unrolled together with the optical component layer F1 is collected on the downstream side of the panel transfer of the first bonding apparatus 12.

The nip roller 12b has a pair of bonding drums arranged in parallel with each other in the axial direction. A predetermined gap is formed between the pair of bonding rollers. The gap is the fit of the first bonding device 12 position. The liquid crystal panel P and the first optical component layer F1 are superposed and guided into the gap. The liquid crystal panel P and the first optical component layer F1 are pinched between a pair of bonding rollers, and are sent to the downstream side of the panel conveyance. By performing the foregoing operations on the plurality of liquid crystal panels P that are sequentially transported, the first bonding apparatus 12 is formed by continuously bonding the plurality of liquid crystal panels P to the strip-shaped first optical component layer at a predetermined interval. The first bonding layer F21 on the lower side of F1.

The first cutting device 13 is located downstream of the panel conveyance of the protective film collecting portion 12d. side. The first cutting device 13 is cut at a predetermined portion of the first optical component layer F1 (between the liquid crystal panels P arranged in the transport direction), and cuts the entire width along the width direction of the component of the liquid crystal panel P, whereby the first sticker is used. The first optical component layer F1 of the laminated layer F21 is formed into a layer F1S larger than the display region P4 (in this embodiment, larger than the liquid crystal panel P) (refer to Fig. 6). However, the first cutting device 13 is not limited to use a cutting blade or use a laser cutting machine. The first single-sided bonding panel P11 (optical display member, bonding body) in which the layer F1S larger than the display region P4 is bonded to the upper surface of the liquid crystal panel P is formed by the cutting step of the first cutting device 13 ) (Refer to Figure 6).

In addition, regarding the layer F1S, the size of the portion protruding toward the outside of the liquid crystal panel P (layer The size of the remaining portion of the sheet F1S can be appropriately set corresponding to the size of the liquid crystal panel P. For example, when the layer F1S is applied to a small-sized and small-sized liquid crystal panel P of 5 吋 to 10 ,, at each side of the layer F1S, between one side of the layer F1S and one side of the liquid crystal panel P The interval can be set to a length ranging from 2 mm to 5 mm.

The second calibration device 14 is transported in a direction slightly parallel to the short side of the display area P4. The first single-sided bonding panel P11 is switched in the direction so as to be conveyed in parallel with the long side of the display region P4. However, the direction conversion is a case where the optical axis direction of the other optical component layers bonded to the liquid crystal panel P is disposed at a right angle with respect to the optical axis direction of the first optical component layer F1.

The second calibration device 14 performs the same calibration as the first calibration device 11. which is, The second calibration device 14 determines the width direction and the rotation of the member of the first single-sided bonding panel P11 with respect to the second bonding device 15 based on the inspection data stored in the optical axis direction of the control device 20 and the imaging data of the camera C. The position in the direction. In this state, the first single-sided bonding panel P11 is guided to the bonding position of the second bonding apparatus 15.

The second bonding device 15 is for the elongated second optical group guided to the bonding position The lower surface of the layer F2 is bonded to the upper surface of the first single-sided bonding panel P11 (the backlight side of the liquid crystal panel P) which is conveyed along the lower side. The second bonding apparatus 15 includes a conveying device 15a that winds the second optical component layer F2 from the second winding roller R2 around which the second optical component layer F2 is wound, and conveys it along the longitudinal direction thereof. The second optical component layer F2 and the nip roller 15b are attached to the lower side of the second optical component layer F2 conveyed by the conveying device 15a by the upper side surface of the first single-sided bonding panel P11 conveyed by the roller conveyor 5. .

The conveying device 15a includes a drum holding portion 15c that supports and winds a second The second reel roller R2 of the optical component layer F2, and the second optical component layer F2 is wound up along the longitudinal direction thereof; and the second recovery portion 15d (tearing device) is transported through the panel located on the nip roller 15b The remaining portion of the second optical component layer F2 after the second cutting device 16 on the downstream side is recovered.

The nip roller 15b has a pair of bonding rolls arranged in parallel with each other in the axial direction cylinder. A predetermined gap is formed between the pair of bonding rollers. This gap is the bonding position of the second bonding apparatus 15. The first single-sided bonding panel P11 and the second optical component layer F2 are superposed and introduced into the gap. The first single-sided bonding panel P11 and the second optical component layer F2 are pinched between the bonding rollers and sent to the downstream side of the panel conveying. The second bonding device 15 forms a plurality of first single-sided bonding panels P11 at a certain interval by performing the foregoing operations on a plurality of liquid crystal panels P that are sequentially transported. The second bonding layer F22 is continuously attached to the lower side of the elongated second optical component layer F2.

The second cutting device 16 is located on the downstream side of the panel conveyance of the pinch roller 15b. The second cutting device 16 simultaneously cuts the second optical component layer F2 and the layer F1S of the first optical component layer F1 of the first single-sided bonding panel P11 attached to the lower side of the second optical component layer F2 (refer to Figure 6). The second cutting device 16 is, for example, a carbon dioxide (CO ₂ ) laser cutting machine. The second cutting device 16 cuts the second optical component layer F2 and the layer F1S uninterrupted along the outer periphery of the display region P4 (in the present embodiment, along the outer periphery of the liquid crystal panel P).

The second cutting device 16 is a layer of each optical component (the first optical component layer F1 and the second The optical component layer F2) is bonded to the liquid crystal panel P and then cut together to improve the optical axis direction of each optical component layer (the first optical component layer F1 and the second optical component layer F2), thereby eliminating the respective opticals. The deviation of the optical axis direction between the component layers (the first optical component layer F1 and the second optical component layer F2) and the cutting step in the first cutting device 13 can be simplified. The details of the second cutting device 16 will be described later.

Cutting each optical component layer (first optical component layer F1 and second optical group) through the above The second layering device 16 is formed on the upper surface of the liquid crystal panel P, and the second single-sided bonding panel P12 (optical display member, sticker) is bonded to the first optical component F11 and the second optical component F12. Fit) (Refer to Figure 8). At this time, as shown in FIG. 4, the second bonding layer F22 makes the opposite portions of the second single-sided bonding panel P12 and the cut-off display region P4 (each optical component (the first optical component F11 and the second optical component F12) )) The remaining portions Y, Y' of the respective optical component layers (the first optical component layer F1 and the second optical component layer F2) remaining in a frame shape are separated. The remaining portion Y' of the second optical component layer F2 may be in the form of a plurality of ladders connected (refer to FIG. 4), and the remaining portion Y' is taken up to the second recycling portion together with the remaining portion Y of the first optical component layer F1. 15d.

Here, the "opposing portion with the display region P4" means larger than the display region P4. It is smaller than the outer shape of the liquid crystal panel P, and is an area that avoids functional parts such as an electronic component mounting portion. In this embodiment, in the liquid crystal panel P having a rectangular outer shape in plan view, at the three sides except the functional portion, the remaining portion is cut off by laser along the outer periphery of the liquid crystal panel P, which is equivalent to the function. On one side of the portion, the remaining portion is cut by laser from a position outside the outer periphery of the liquid crystal panel P toward the display region P4 side.

Further, in the present embodiment, the second cutting device 16 has a configuration in which the second optical component layer F2 and the layer F1S of the first optical component layer F1 are simultaneously cut, but is not limited thereto, and may be only The layer F1S of the first optical component layer F1 is cut, or only the structure of the second optical component layer F2 is cut.

Referring to Fig. 1, the third calibration device 17 reverses the front/reverse side of the second single-sided bonding panel P12 on the backlight side of the liquid crystal panel P toward the upper side, so that the display surface side of the liquid crystal panel P faces the upper side, and performs The first calibration device 11 and the second calibration device 14 are identically calibrated. That is, the third calibration device 17 determines the width direction of the member of the second single-sided bonding panel P12 with respect to the third bonding device 18 based on the optical axis direction inspection data stored in the control device 20 and the photographic data of the camera. The position in the direction of rotation. In this state, the second single-sided bonding panel P12 is guided to the bonding position of the third bonding device 18.

The third bonding device 18 is directed to the lower side of the strip-shaped third optical component layer F3 (optical component layer) guided to the bonding position, and the upper side of the second single-sided bonding panel P12 that is conveyed along the lower side thereof (on the display surface side of the liquid crystal panel P), the bonding is performed. The third bonding apparatus 18 includes a conveying device 18a that winds the third optical component layer F3 from the third winding roller R3 around which the third optical component layer F3 is wound, and conveys the first optical component layer F3 along the longitudinal direction thereof. The three optical component layers F3 and the nip roller 18b are attached to the lower side of the third optical component layer F3 conveyed by the conveying device 18a by the upper side surface of the second single-sided bonding panel P12 conveyed by the roller conveyor 5. .

The conveying device 18a has a roller holding portion 18c that supports the winding of the third optical The third reel drum R3 of the component layer F3, and the third optical component layer F3 is wound up along the longitudinal direction thereof; and the third recovery portion 18d is passed through the panel on the downstream side of the nip roller 18b. The remaining portion of the third optical component layer F3 after the third cutting device 19 is recovered.

The nip roller 18b has a pair of bonding rolls arranged in parallel with each other in the axial direction. cylinder. A predetermined gap is formed between the pair of bonding rollers. The gap is the bonding position of the third bonding device 18. The second single-sided bonding panel P12 and the third optical component layer F3 are superposed and guided into the gap. The second single-sided bonding panel P12 and the third optical component layer F3 are pinched between the pair of bonding rollers and sent to the downstream side of the panel conveying. The third bonding apparatus 18 is formed by continuously bonding a plurality of second single-sided bonding panels P12 at a predetermined interval by performing a plurality of operations on the plurality of second single-sided bonding panels P12 that are sequentially transported. The third bonding layer F23 to the lower side of the elongated third optical component layer F3.

The third cutting device 19 is located on the downstream side of the panel conveyance of the pinch roller 18b, and will be The three optical component layers F3 are cut. The third cutting device 19 is the same laser processing machine as the second cutting device 16, and cuts the third optical component layer F3 continuously along the outer periphery of the display region P4 (for example, along the outer periphery of the liquid crystal panel P). .

The third cutting device 19 is formed by cutting the third optical component layer F3 as described above. A double-sided bonding panel P13 (optical display device) to which the third optical component F13 is attached to the upper surface of the two-side bonding panel P12 (refer to FIG. 9). Further, at this time, the third bonding layer F23 causes the remaining portion of the third optical component layer F3 which remains in the frame shape after the double-sided bonding panel P13 and the opposite portion (the third optical component F13) of the cut display region P4 ( Separation is not shown in the figure. The remaining portion of the third optical component layer F3 is formed in a ladder shape in which plural numbers are connected in the same manner as the remaining portion Y' of the second optical component layer F2. The remaining portion of the third optical component layer F3 is taken up to the third recovery portion 18d.

The double-sided bonding panel P13 passes through a defect inspection device not shown in the figure to check that If there is a defect (poor fit, etc.), transfer it to the downstream process for other processing.

Hereinafter, each optical component layer (first optical component layer F1, second optical component layer F2) And the third optical component layer F3) collectively referred to as the optical component layer FX, and the liquid crystal panel P attached to each of the optical component layers (the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3) and each The single-sided bonding panel (the first single-sided bonding panel P11 and the second single-sided bonding panel P12) are collectively referred to as an optical display component PX, and each optical component (first optical component F11, second optical component F12, and third optical The component F13) is collectively referred to as an optical component FS.

The polarizing film constituting the optical component layer FX is dyed, for example, by a dichroic dye The colored polyvinyl alcohol (PVA) film is formed to extend toward one axis. However, there is a case where the thickness of the PVA film is uneven or the dyeing of the dichroic dye is uneven, and the polarizing film is liable to cause a deviation in the optical axis direction from the inner side in the width direction of the optical component layer FX and the outer side in the width direction.

Here, in the film bonding system 1 of the present embodiment, it is stored in advance according to the storage. The inspection data distributed in the optical axis plane in each part of the optical component layer FX of the memory device 20 causes the first calibration device 11, the second calibration device 14, and the third calibration device 17 to be bonded to the optical display component of the optical component layer FX Calibration of the PX. Next, the first bonding apparatus 12, the second bonding apparatus 15, and the third bonding apparatus 18 attach the optical display member PX to the optical component layer FX. Further, the optical axis direction may be detected when the optical component layer FX is taken out, and the optical display component PX may be calibrated based on the detection data.

As shown in FIG. 5, the liquid crystal panel P has a first substrate P1, for example, a thin film. a rectangular substrate composed of a TFT (Thin Film Transistor) substrate; a second substrate P2 facing the same rectangular substrate disposed on the first substrate P1; and a liquid crystal layer P3 sealed on the first substrate P1 and the second substrate Between the substrates P2. In addition, the layer hatching is omitted for convenience of the drawings.

Referring to Figures 7 and 8, the first substrate P1 has three sides along its outer periphery. The two sides of the second substrate P2 are disposed corresponding to the three sides, and one of the remaining sides of the outer periphery protrudes outward from the side opposite to the second substrate P2. Thereby, the electronic component mounting portion P5 extending to the outside of the second substrate P2 can be provided on the one side of the first substrate P1.

Referring to FIGS. 6 and 8, the second cutting device 16 is a detecting unit such as a camera 16a. The outer periphery of the display region P4 is detected, and the first optical component layer F1 and the second optical component layer F2 are cut along the outer periphery of the display region P4 or the like. In the same manner, the third cutting device 19 detects the outer periphery of the display region P4 by the detecting portion such as the camera 19a, and cuts the third optical component layer F3 along the outer periphery of the display region P4 or the like. Outside the display region P4, a frame portion G of a specific width for attaching a sealant such as the first substrate P1 and the second substrate P2 is provided. Each of the cutting devices (the second cutting device 16 and the third cutting device 19) performs laser cutting within the width of the frame portion G.

When laser-cutting the resin optical component layer FX alone, the optical component layer FX The cut end may be expanded or undulated by thermal deformation. Therefore, when the optical component layer FX after the laser cutting is bonded to the optical display member PX, it is easy to cause a problem of poor adhesion such as air mixing or deformation in the optical component layer FX.

On the other hand, after bonding the optical component layer FX to the liquid crystal panel P, it is cut by laser In this embodiment of the optical component layer FX, the cut end of the optical component layer FX is supported by the glass surface of the liquid crystal panel P. Therefore, the cut end of the optical component layer FX of the optical component layer FX after laser cutting is less likely to form an expansion or wave shape. Moreover, since it is performed after bonding to the liquid crystal panel P, it is difficult to produce the problem of a poor bonding.

The vibration amplitude (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade of the cutter The tolerance is smaller. Therefore, in the film bonding system 1 of the present embodiment, it is cut off using a cutting blade. In the case of the optical component layer FX, the width of the frame portion G can be made narrower. As a result, the liquid crystal panel P (machine) applied to the film bonding system 1 of the present embodiment can be downsized and/or the display area P4 can be increased in size. At this point, it can be effectively applied to a high-performance mobile device that needs to enlarge the display screen under the limitation of the size of the casing, such as a smart phone or a tablet terminal in recent years.

Further, a layer in which the optical component layer FX is integrated into the display region P4 of the liquid crystal panel P After the sheet is cut and then bonded to the liquid crystal panel P, the dimensional tolerances of the layer and the liquid crystal panel P and the dimensional tolerances of the relative bonding positions are superimposed. Therefore, it is difficult to make the width of the frame portion G of the liquid crystal panel P narrow (it is difficult to enlarge the display region).

On the other hand, after the optical component layer FX is attached to the liquid crystal panel P, according to the display In the case where the region P4 is cut, only the vibration tolerance of the cutting line has to be considered. Therefore, in the film bonding system 1 of the present embodiment, the tolerance (±0.1 mm or less) of the width of the frame portion G can be reduced. This also makes it possible to narrow the width of the frame portion G of the liquid crystal panel P (which can enlarge the display area).

Furthermore, in the film bonding system 1 of the present embodiment, the laser light of the non-profit blade is used. The optical component layer FX is cut. Therefore, in the film bonding system 1, no stress is applied to the liquid crystal panel P at the time of cutting, and cracks or cracks are less likely to occur at the edge of the substrate of the liquid crystal panel P, and durability against thermal cycling or the like can be improved. Similarly, in the film bonding system 1, when the optical component layer FX is cut, the liquid crystal panel P is non-contact-processed, and damage to the electronic component mounting portion P5 is also small. The damage suppression of the liquid crystal panel P by the laser cutting is described later.

As shown in Fig. 7, the optical component layer FX is cut by laser (the third optical group in Fig. 7) In the case of the layer F3), the third cutting device 19 sets, for example, the extension line of one of the long sides of the display region P4 as the starting point pt1 of the laser cutting, and starts cutting the long side from the starting point pt1. action. Further, the third cutting device 19 sets the end point pt2 of the laser cutting to one circle after the laser light surrounds the display area P4. The position on the extension line of the short side of the starting point side of the display area P4 is reached. The starting point pt1 and the end point pt2 are designed such that the remaining portion of the optical component layer FX still retains a specific splicing portion and can withstand the tension when the optical component layer FX is taken up.

Figure 2 shows the use of each single-sided bonding panel (first single-sided bonding panel P11 and A perspective view of an example of the laser beam irradiation device 30 of the cutting portion of the optical component layer FX of the first single-sided bonding panel P12). Further, although the example in which the second cutting device 16 is applied is shown in Fig. 2, the third cutting device 19 may have the same configuration.

As shown in FIG. 2, the laser beam irradiation device 30 includes a pedestal 31, a scanner as the second cutting device 16, a moving device 32, and a control device 33.

The laser light irradiation device 30 is operated by the control device 33 as an electronic control device, and the laser beam L is irradiated to the optical component layer FX of the first single-sided bonding panel P11 (refer to FIG. 6). The second optical component layer F2 and the layer F1S) cut the optical component layer FX into optical components FS of a specific size.

The pedestal 31 has a holding surface 31a that holds the first single-sided bonding panel P11 (irradiation target).

The second cutting device 16 (scanner) emits the laser light L to the optical component layer FX to cut off the optical component layer FX of the first single-sided bonding panel P11 held by the pedestal 31.

The second cutting device 16 allows the laser beam L to perform biaxial scanning in a plane parallel to the holding surface 31a of the pedestal 31 (in the XY plane). That is, the second cutting device 16 is independently movable relative to the pedestal 31 in the X direction and the Y direction. Thereby, the second cutting device 16 can be moved to an arbitrary position on the pedestal 31, and the laser light L can be irradiated to any position of the optical component layer FX held by the pedestal 31 with a high precision.

The moving device 32 allows the second cutting device 16 to move relative to the pedestal 31. The moving device 32 has the second cutting device 16 in the first direction V1 (X direction) of the parallel holding surface 31a, the parallel holding surface 31a, and the second direction V2 (Y direction) orthogonal to the first direction V1, and the holding surface 31a. The third direction V3 (Z direction) of the normal direction relatively moves with respect to the pedestal 31. The moving device 32 operates, for example, a linear motor provided in the slider mechanism of the second cutting device 16 (not shown), and moves the second cutting device 16 in all directions of XYZ.

The above structure may be transmitted through the mobile device to move the second cutting device 16 The mobile device similar to the above is configured to move the pedestal 31, and may be configured to move both the pedestal 31 and the second cutting device 16.

Figure 3 shows the second cutting device 16 (scanner) in the laser light irradiation device 30. A perspective view of the internal structure. However, the drawings of the mobile device 32 and the control device 33 in FIG. 3 are omitted.

As shown in FIG. 3, the second cutting device 16 includes a laser oscillator 160, a first irradiation position adjusting device 161, a second irradiation position adjusting device 162, and a collecting lens 163.

The laser oscillator 160 is a device for pulsing the laser light L. In the present embodiment, a CO ₂ laser oscillator (carbon dioxide laser oscillator) is used. Further, as the laser oscillator 160, there may be other ultraviolet (UV) laser oscillators, semiconductor laser oscillators, laser (YAG) laser oscillators, and excimer laser oscillators, and there are no particular limitations. . The CO ₂ laser oscillator is preferable in that, for example, when the polarizing film is cut and processed, laser light is appropriately oscillated at a high output.

The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are The laser light oscillated by the laser oscillator 160 can perform a biaxial scan of the scanning element in a plane parallel to the holding surface 31a.

For example, a current scanner, a gimbal, or the like can be used as the first irradiation position adjusting device 161 and The second illumination position adjustment device 162. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are attached to the optical path of the laser light L between the laser oscillator 160 and the collecting lens 163, and the first irradiation is performed from the side of the laser oscillator 160. The position adjustment device 161 and the second irradiation position adjustment device 162 are arranged in this order.

The first irradiation position adjusting device 161 is provided with a lens 161a and an adjustment lens 161a. The angled actuator 161b. The actuator 161b has a rotation axis 161c parallel to the Z direction, and the lens 161a is coupled to the rotation shaft 161c.

The second irradiation position adjusting device 162 is provided with an actuator 162b that sets the angle between the lens 162a and the adjustment lens 162a. The actuator 162b has a rotation axis 162c parallel to the Y direction, and the lens 162a is coupled to the rotation shaft 162c.

The laser light L oscillated by the laser oscillator 160 passes through the lens 161a, the lens 162a, The order of the condensing lens 163 is irradiated to the optical component layer FX held by the pedestal 31. The first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 adjust the setting angles of the respective lenses 161a and 162a that drive the respective actuators 161b and 162b under the control of the control device 33. Next, the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162 are directed to the optical component layer FX on the pedestal 31 to perform biaxial scanning on the irradiation position of the irradiated laser light L.

The optical path of the laser light L is in the state shown by the solid line in the figure, from the laser The laser light L oscillated by the oscillator 160 is focused on the focus Qa on the optical component layer FX. Similarly, in the case where the optical path of the laser light L is in the state shown by the one-dot chain line in the drawing, the laser light L is focused on the focal point Qb. In the case where the optical path of the laser light L is in the state shown by the two-dot chain line in the figure, the laser light L is focused on the focal point Qc.

The condensing lens 163 is disposed in the second illumination position adjusting device 162 in the present embodiment. Between the optical component layer FX and the optical component. The condensing lens 163 focuses the laser light L of the adjusted optical path on a predetermined position of the optical component layer FX by the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. The condenser lens 163 is, for example, an fθ lens. The condensing lens 163 can focus the laser light L indicated by each line in the drawing from the lens 162a and in parallel into the condensing lens 163 in parallel to the optical component layer FX.

The control device 33 can be applied to the mobile device 32, the first illumination position adjustment device 161, and the The second irradiation position adjusting device 162 performs the operation control so that the laser light L that has passed through the collecting lens 163 is moved along the desired trajectory on the optical component layer FX held by the pedestal 31.

In this embodiment, by using the nozzle system of the moving device 32, the optical component layer FX can be relatively moved relative to the laser oscillator 160 to perform a wide range of laser cutting. Further, by using the scanner system of the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162, the laser beam L can be subjected to biaxial scanning, and the high-precision laser cutting of the detail can be performed.

Here, the "nozzle system" in the above description refers to the relative movement of the second cutting device 16 with respect to the pedestal 31.

In the above description, the "scanner system" refers to the irradiation position of the irradiated laser light L toward the optical component layer FX on the pedestal 31 using the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162. Perform a two-axis scan.

Figure 10 is a separation of the protective film protective film from the first optical component layer F1 (separation layer) A cross-sectional view of the state in which the sheet is attached to the liquid crystal panel P. Hereinafter, the first optical component layer F1 will be described as an example, but the second optical component layer F2 and the third optical component layer F3 also have the same structure.

The first optical component layer F1 has a film-like optical layer S1; Adhesive layer S2 on the side of one side of S1 (lower side in the figure); can be separated and laminated on the optical layer via the adhesive layer S2 A protective film pf (separating layer, not shown in Fig. 10) on the side of one side of the layer S1; and a surface protective film S4 laminated on the other side (upper side in the drawing) of the optical layer S1.

The optical layer S1 has a layered polarizer S6; and is bonded to one of the polarizers S6 a first film S7 on the side of the side (the liquid crystal panel P side) (the layer closest to the optical display member); and a second film S8 adhered to the other side of the polarizer S6. The first film S7 and the second film S8 are, for example, protective films for protecting the polarizing mirror S6.

The optical layer S1 has a function as a polarizing plate across the entire area of the display region P4 of the liquid crystal panel P. In addition, the hatching of each layer is omitted for convenience of illustration.

The first optical component layer F1 has an adhesive layer S2 remaining on one side and is thin with protection In a state in which the film pf is separated, it is bonded to the bonding surface T1 of the liquid crystal panel P via the adhesive layer S2 (the backlight side in the present embodiment). In the film bonding system 1 of the present embodiment, the first optical component layer F1 (optical component layer FX) is transported to the bonding position with the liquid crystal panel P (optical display member PX) with the adhesive layer S2 facing downward. As a result, the film bonding system 1 can suppress the occurrence of poor adhesion such as adhesion of foreign matter in the adhesive layer S2. Hereinafter, the layered body obtained by removing the protective film pf and the adhesive layer S2 from the first optical component layer F1 (optical component layer FX) is referred to as a bonding layer sheet S5.

In the first optical component layer F1, the polarizer S6 is polyvinyl alcohol (PVA, Polyvinyl) Alcohol) film layer. The first film S7 is a film layer of a cycloolefin polymer (COP). The second film S8 is a film of triacetyl cellulose (TAC). The surface protective film S4 (and the protective film pf) is a polyethylene terephthalate (PET) film layer.

As shown in Fig. 11, the laminated layer S5 of the optical layer S1 having the above laminated structure In the state of being bonded to the bonding surface T1 of the liquid crystal panel P, the second cutting device 16 performs laser cutting. The second cutting device 16 is directed toward the liquid crystal panel P that is bonded to the bonding layer S5 of the liquid crystal panel P. The cut portion S between the opposite portion (the first optical component F11) and the remaining portion Y of the display region P4 is on the layer of the liquid crystal panel P closest to the optical layer S1 of the bonding layer sheet S5 (the first film S7) At the low absorption rate film layer, the focus U is focused, and the laser light L is irradiated.

Now, only the first optical component layer F1 is bonded to the surface on one side of the liquid crystal panel P. In the state, the laser cutting of the first optical component layer F1 is performed. In this case, in order to suppress the damage of the liquid crystal panel P and cut the bonding layer sheet S5 with a high efficiency, the distance from the surface T2 of the second cutting device 16 side to the focal point U of the laser light L in the bonding layer sheet S5 (Focus distance L1) is set as follows.

That is, the focal length L1 is set to be from the second cutting device in the bonding layer sheet S5. The thickness of the surface T2 of the 16 side to the surface T3 of the second cutting device 16 side of the first film S7 is greater than or equal to the thickness of the surface T2 of the first film S7 from the surface T2 of the second cutting device 16 side to the liquid crystal panel of the first film S7. The thickness of the surface T4 on the P side is equal to or less. The focal length L1 is adjusted by irradiation conditions such as the output of the laser light L, the moving speed, and the beam diameter.

Further, in the case where the laser cutting is performed in a state in which the first optical component layer F1 is overlapped and the second optical component layer F2 is bonded, the layer can be regarded as an integrated bonding layer to set a focus. Distance L1. Moreover, the laser cutting of the third optical component layer F3 can also perform the same focusing mode.

In the bonding layer S5, for the laser wavelength range of the irradiated laser light L The film layer having a high average absorption rate of the light emission L (the high absorptivity film layer, the PET layer, the PVA layer, and the TAC layer in the present embodiment) can be cut satisfactorily even if the output of the laser light L is suppressed.

On the other hand, in the bonding layer sheet S5, the film layer having a low average absorption rate of the laser light L in the vibration wavelength range of the irradiated laser light L (low absorption rate film layer, COP layer in the present embodiment) ), it is necessary to increase the output of the laser light L to cut off by thermal energy.

In this way, too much heat energy is added to the high absorptivity film layer to cut off the bonding layer sheet S5. The end is greatly melted and deformed, and the frame portion around the display region P4 is prevented from being shrunk. Moreover, damage such as fine cracks is likely to occur on the surface of the liquid crystal panel P, which affects durability.

In this regard, in the film bonding system 1 of the present embodiment, the bonding layer sheet S5 is included. Among the plurality of layers of the optical layer S1, the focus U is focused (concentrated energy) at the low absorptive film layer closest to the optical display member (liquid crystal panel P), and the laser light L is irradiated. Thereby, the high absorptivity film layer on the side of the laser beam irradiation device 30 in the bonding layer sheet S5 is cut and separated at intervals corresponding to the beam diameter of the laser beam L. Further, the low absorptivity film layer on the side of the liquid crystal panel P in the bonding layer sheet S5 is cut and separated at intervals of the beam diameter of the laser beam L. Thereby, in addition to suppressing damage of the liquid crystal panel P by the laser light L, the bonding layer sheet S5 can be cut off with high efficiency.

In this way, the laser light L is irradiated and the optical component layer (the bonding layer S5) is cut to The step of forming the optical component corresponds to the cutting step of the present invention.

It is desirable to completely cut off the low-absorption film layer, but to suppress the liquid crystal panel P As shown in Fig. 12A, a part of the first film S7 (low-absorbency film layer) of the optical layer S1 may be cut into a sheet-like shape or a discontinuous shape which is tearable. In this case, the cutting line formed on the first film S7 is indicated by the symbol SL in the figure.

In this manner, the step of irradiating the laser light L to cut a portion of the first film S7 into a tearable sheet or intermittently to form a cutting line corresponds to the laser irradiation step of the present invention.

After the cutting line SL is formed, as shown in FIG. 12B, it is attached to the display area P4. The optical component FS tears the remaining portion Y. At this time, the remaining portion Y is displaced toward the liquid crystal panel P side and is torn along the intersecting direction (the direction orthogonal to the bonding surface T1 in the drawing) of the bonding surface T1 of the liquid crystal panel P. This displacement is performed by, for example, the winding operation of the second collecting portion 15d (refer to Fig. 4). Through this displacement, the optical member FS and the remaining portion Y are torn at the edge of the edge of the liquid crystal panel P as cut.

In this manner, the tearing step of displacing the remaining portion Y along the liquid crystal panel P side in the direction intersecting the bonding surface T1 of the liquid crystal panel P corresponds to the tearing step of the present invention.

The stress applied to the optical component FS at the time of tearing acts on pressing the optical component FS Close to the side of the mating surface T1. Thereby, it is possible to suppress the problem of poor bonding such as peeling of the cut end of the optical component FS.

In order to suppress an irregularity of the cut end of the optical component FS due to the concentration of the remaining slit at a portion of the cut line SL, the displacement direction of the remaining portion Y is preferably an angle close to the orthogonal direction with the fitting surface T1. .

In this way, the laser light L is irradiated and the optical component layer (the bonding layer S5) is cut. The step of breaking the wire and then tearing the remaining portion Y to cut the optical component layer to form an optical component corresponds to the cutting step of the present invention.

As explained above, the optical film having the film bonding system 1 according to the above embodiment is as described above. In the production system of the display device, after the optical component layer FX which is larger than the display area P4 of the liquid crystal panel P is attached to the liquid crystal panel P, the remaining portion of the optical component layer FX is cut, and the liquid crystal panel P can be better. An optical component FS corresponding to the size of the display area P4 is formed on the surface. As a result, the liquid crystal panel P applied to the film bonding system 1 can reduce the frame portion G outside the display region P4, and achieve the purpose of expanding the display area and miniaturizing the device.

Further, the cutting using the laser light L is more accurate than the cutting using the cutting blade. Therefore, the frame portion G around the display region P4 can be made smaller than in the case of using the dicing blade.

Next, the liquid crystal of the optical layer S1 closest to the laminated structure in the optical component layer FX The focus U is focused at the layer of the panel P (low absorptive film layer), and the laser light L is irradiated, so that the optical component layer FX can be cut off with high efficiency. Therefore, thermal deformation of the cut end of the optical component layer FX can be suppressed, and can also be suppressed The surface of the liquid crystal panel P is damaged, and the optical display device can further reduce the frame portion.

Further, according to the production system of the optical display device having the above-described film bonding system 1, The laser light irradiation device 30 that cuts the optical component layer FX forms a partially cut line SL at the layer of the liquid crystal panel P closest to the optical layer S1 at the cut portion S of the optical component layer FX, and is completely Ray The surface damage of the liquid crystal panel P can be effectively suppressed as compared with the case where the shot is cut to the layer closest to the liquid crystal panel P.

Moreover, since it has a crossing direction along the bonding surface T1 with the liquid crystal panel P, it is liquid crystal. The side of the panel P is displaced, and the tearing device (second collecting portion 15d) that tears the remaining portion of the optical component layer FX after the cutting line SL is formed from the optical member FS, so that the remaining portion can be torn It is easily removed, and the irregularity of the peeling or cutting end caused by the tearing action of the optical component FS remaining on the liquid crystal panel P can be suppressed.

In the above embodiment, the optical component FS and the optical group of the optical display part PX The separation operation of the remaining portion Y of the layer FX is performed by winding the remaining portion Y by the second collection portion 15d or the third collection portion 18d (refer to FIGS. 1 and 4), but is not limited thereto. The separation operation can also be performed using various devices or step engineering. At this time, as shown in Fig. 13, the remaining portion Y is torn at the corner portion of the optical display member PX as a starting point, which is advantageous for starting to tear the edge edge of the liquid crystal panel P, and smoothly separating the remaining portion Y.

However, the present invention is not limited to the above-described embodiments and modifications, for example, the present invention The laminated polarizing plate of the cutting target is not limited to the COP polarizing plate, and may include polyethylene terephthalate (PET) film, polyvinyl alcohol (PVA) film, and triacetate fiber. High absorptivity film layer such as TAC film, and low absorption film layer such as cycloolefin polymer (COP) film, polypropylene (PP) film, and polymethylmethacrylate film (PMMA) Various illustrations.

In this embodiment, the laser light is irradiated to the target and the specific processing is performed. The structure is exemplified by a structure in which the optical component layer is cut into a frame shape, but is not limited thereto. For example, the optical component layer may be divided into at least two, a slit is formed through the optical component layer, and a groove portion (cut) of a predetermined depth is formed in the optical component layer. Specifically, there are, for example, cutting (cutting), half cutting, marking processing, and the like of the end portions of the optical component layer.

The optical component attached to the liquid crystal panel is only an optical layer having a laminated structure, It is not limited to a polarizing film, but may be a retardation film or a luminance increasing film. In this case, it is also possible to focus and irradiate the laser light as a focus at the layer closest to the liquid crystal panel of each of the thin film optical layers.

Further, in the above embodiment, the second cutting device 16 detects by the camera 16a or the like. The portion detects the outer periphery of the display region P4, and cuts the first optical component layer F1 and the second optical component layer F2 along the outer periphery of the display region P4 or the like. Further, the third cutting device 19 detects the outer periphery of the display region P4 by the detecting portion such as the camera 19a, and cuts the third optical component layer F3 along the outer periphery of the display region P4 or the like. However, the configuration of the detecting unit in the second cutting device 16 and the third cutting device 19 is not limited thereto.

Specifically, the film bonding system 1 is attached to the second bonding layer F22 and has detection The detecting portion on the outer peripheral edge of the bonding surface of the first optical component layer F1 and the second optical component layer F2 and the liquid crystal panel P may cut the cutting portion SX set along the outer periphery of the bonding surface. Further, the film bonding system 1 is provided on the third bonding layer F23, and has a detecting portion for detecting the outer peripheral edge of the bonding surface of the third optical component layer F3 and the liquid crystal panel P, and may be cut along the outer periphery of the bonding surface. The cut portion SX is set.

In this way, the step of detecting the outer periphery of the bonding surface of the third optical component layer F3 and the liquid crystal panel P corresponds to the detecting step of the present invention.

Further, the cut portion may also be referred to as a cut line.

Thus, the detection operation of the outer periphery of the bonding surface and the cutting operation of the cutting device are performed as described in detail below. Hereinafter, a modification of the film bonding system 1 will be described using Figs. 14 to 17 .

Fig. 14 is a schematic view showing the first detecting portion 61 for detecting the outer periphery of the bonding surface. The first detecting unit 61 included in the film bonding system 1 of the present embodiment has an imaging device 63 that captures a bonding surface of the liquid crystal panel P and the layer F1S in the second bonding layer F22 (hereinafter referred to as The first bonding surface SA1) is a screen of the outer peripheral edge ED; the illumination source 64 is for illuminating the outer peripheral edge ED; and the control unit 65 is for storing the image captured by the imaging device 63 or for detecting the outer peripheral edge ED according to the screen. Calculus.

The first detecting unit 61 is provided between the nip roller 15b on the panel transport upstream side of the second cutting device 16 in the first drawing and the second cutting device 16.

The photographing device 63 is fixed and disposed inside the first bonding surface SA1 of the outer peripheral edge ED, and is inclined, and the normal line of the first bonding surface SA1 is at an angle θ with the normal line of the imaging surface 63a of the imaging device 63 ( Hereinafter, it is referred to as the inclination angle θ of the photographing device 63. The photographing device 63 causes the photographing surface 63a to face the outer peripheral edge ED, and the image of the outer peripheral edge ED is photographed from the side of the second bonding layer F22 where the layer sheet F1S is bonded.

The inclination angle θ of the photographing device 63 is preferably set so as to reliably capture the outer periphery of the first substrate P1 constituting the first bonding surface SA1. For example, the liquid crystal panel P divides the main board into a plurality of liquid crystal panels, which is a case where a multi-layered panel is formed, and a deviation occurs in the outer periphery of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P, and the second substrate P2 The end faces are offset to the outside of the end faces of the first substrate P1. In the above case, the inclination angle θ of the photographing device 63 can preferably be set such that the outer periphery of the second substrate P2 does not enter the photographing field of view of the photographing device 63.

In the above case, the inclination angle θ of the photographing device 63 is preferably matched to the distance H between the first bonding surface SA1 and the center of the imaging surface 63a of the photographing device 63 (hereinafter referred to as the height H of the photographing device 63). set up. For example, the height H of the photographing device 63 is 50 mm or more and 100 mm or less. In the case of the imaging device 63, the inclination angle θ of the imaging device 63 can be set to an angle in the range of 5° or more and 20° or less. However, in the case where the amount of deviation is known empirically, the height H of the photographing device 63 and the tilt angle θ of the photographing device 63 can be obtained from the amount of deviation. In the present embodiment, the height H of the photographing device 63 is set to 78 mm, and the tilt angle θ of the photographing device 63 is set to 10°.

The tilt angle θ of the photographing device 63 may also be 0°. Figure 15 shows the first test A schematic diagram of a modification of the portion 61 is an example in which the inclination angle θ of the photographing device 63 is 0°. In this case, the imaging device 63 and the illumination light source 64 may be disposed at positions overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.

The distance between the first bonding surface SA1 and the center of the imaging surface 63a of the photographing device 63 H1 (hereinafter, referred to as the height H1 of the photographing device 63) is preferably set to a position where it is easy to detect the outer peripheral edge ED of the first bonding surface SA1. For example, it is preferable that the height H1 of the photographing device 63 can be set in a range of 50 mm or more and 150 mm or less.

The illumination light source 64 is fixed and disposed in the second bonding layer F22 and laminated with the layer F1S The opposite side of the side. The illumination light source 64 is disposed outside the first bonding surface SA1 of the outer peripheral edge ED. In the present embodiment, the optical axis of the illumination source 64 is parallel to the normal line of the imaging surface 63a of the imaging device 63.

In addition, the illumination source 64 may be disposed in the second bonding layer F22 and laminated with the layer. The side of F1S (i.e., the same side as the photographing device 63).

Moreover, as long as the illumination light emitted by the illumination source 64 can be illuminated, the illumination device is illuminated The peripheral edge ED of 63 is captured, and the optical axis of the illumination source 64 and the normal line of the imaging surface 63a of the photographing device 63 may also intersect each other.

Fig. 16 is a plan view showing the position of the outer periphery of the bonding surface. As shown An inspection area CA is set on the conveyance path of the second bonding layer F22. Inspection area CA is set at The liquid crystal panel P to be transported corresponds to the position of the outer peripheral edge ED of the first bonding surface SA1. In the figure, the inspection area CA is set at four positions corresponding to the four corners of the first bonding surface SA1 of the rectangular plan view to detect the corner portion of the first bonding surface SA1 (ie, the outer circumference ED). structure. In the figure, in the outer periphery of the first bonding surface SA1, the hook portion of the corresponding corner portion is shown as the outer peripheral edge ED.

The first detecting portion 61 of Fig. 14 is detected in the inspection area CA at four positions. The outer circumference is ED. Specifically, each of the inspection areas CA is provided with an imaging device 63 and an illumination light source 64. The first detecting unit 61 captures a corner portion of the first bonding surface SA1 of each of the liquid crystal panels P to be transported, and detects the outer peripheral edge ED based on the image data. The data of the outer periphery ED to be detected is stored in the control unit 65 shown in Fig. 14.

In addition, as long as the periphery of the first bonding surface SA1 can be detected, the inspection area CA is The set position is not limited to this. For example, each inspection area CA may be disposed at a position corresponding to a part of each side of the first bonding surface SA1 (for example, a central portion of each side). In this case, the structure of each side (four side edges, ie, the outer circumference) of the first bonding surface SA1 is detected.

Moreover, the imaging device 63 and the illumination light source 64 are not limited to being disposed in each inspection area CA. The structure may be a structure that moves along a movement route set along the outer periphery ED of the first bonding surface SA1. In this case, since the photographing device 63 and the illumination light source 64 are configured to detect the outer peripheral edge ED when they are located in the respective inspection areas CA, it is possible to detect the outer peripheral edge ED by providing a plurality of imaging devices 63 and the illumination light source 64 each. .

The cut portion of the layer F1S of the second cutting device 16 and the second optical component layer F2 (cut The broken line is set based on the detection result of the outer periphery ED of the first bonding surface SA1. The control unit 65 shown in Fig. 11 sets the cutting positions of the layer F1S and the second optical component layer F2 based on the data of the peripheral edge ED of the first bonding surface SA1 stored, so that the first optical component F11 is formed. Will not highlight the LCD panel P The size of the outer side (outside of the first bonding surface SA1). The second cutting device 16 cuts the layer sheet F1S and the second optical unit layer F2 at the cutting position determined by the control unit 65.

Returning to Fig. 1, the second cutting device 16 is disposed on the panel of the first detecting portion 61. Transport to the downstream side. The second cutting device 16 cuts the display region P4 in the layer F1S and the second optical component layer F2 bonded to the liquid crystal panel P along the cutting portion (cutting line) set according to the outer periphery ED of the detection. The opposite portion of the opposite portion of the opposite portion (refer to Fig. 6) is cut to cut out the first optical component F11 and the second optical component F12 corresponding to the size of the display region P4 (refer to Fig. 9). Thereby, the second single-sided bonding panel P12 in which the first two optical modules F11 and the second optical components F12 are bonded to the upper surface of the liquid crystal panel P is laminated.

In this embodiment, in the liquid crystal panel P in which the plan view is a rectangular shape, The remaining sides of the liquid crystal panel P may be laser-cut at the three sides except the functional portion, and the one side of the functional portion may be appropriately extended from the outer periphery of the liquid crystal panel P toward the display region P4 side. The laser is used to cut off the rest of the position. For example, in the case where the first substrate P1 is a TFT substrate, it may be offset from the periphery of the liquid crystal panel P other than the functional portion to the display region P4 side by a certain distance at the side corresponding to the functional portion. Cut off at the location.

Fig. 17 is a schematic view showing the second detecting portion 62 for detecting the outer periphery of the bonding surface. Real The second detecting unit 62 included in the film bonding system 1 of the embodiment has an imaging device 63 that captures a bonding surface of the liquid crystal panel P and the third optical component layer F3 in the third bonding layer F23 (hereinafter, The second bonding surface SA2) is a screen of the outer peripheral edge ED; the illumination light source 64 illuminates the outer peripheral edge ED; and the control unit 65 stores the image captured by the imaging device 63, and detects the outer peripheral edge ED based on the screen. The calculation used. The second detecting unit 62 has the same configuration as the first detecting unit 61 described above.

The second detecting unit 62 is disposed on the panel of the third cutting device 19 in FIG. 1 . The nip roll 18b on the upstream side and the third cutting device 19 are conveyed. The second detecting unit 62 is located at an inspection area set on the transport path of the third bonding layer F23, and detects the outer periphery ED of the second bonding surface SA2 in the same manner as the first detecting unit 61 described above.

The cutting portion (cutting line) of the third optical component layer F3 of the third cutting device 19 is set based on the detection result of the outer peripheral edge ED of the second bonding surface SA2.

For example, the control unit 65 of the second detecting unit 62 can set the cut portion (cut line) of the third optical component layer F3 based on the stored information of the outer peripheral edge ED of the second bonding surface SA2, so that the third optical The module F13 is formed so as not to protrude outside the liquid crystal panel P (outside of the second bonding surface SA2). Further, the setting of the cutting portion (cutting line) is not necessarily performed by the control portion 65 of the second detecting portion 62, and the cutting portion (cutting line) set along the outer periphery of the bonding surface may be used second. The data of the outer periphery ED detected by the detecting unit 62 is performed using an additional setting calculation means.

The third cutting device 19 cuts the third optical module layer F3 at a cutting portion (cutting line) set along the outer peripheral edge ED of the bonding surface.

The third cutting device 19 cuts off the display region P4 attached to the third optical component layer F3 of the liquid crystal panel P along the set cutting portion (cutting line) based on the detection of the outer peripheral edge ED ( Referring to the opposite portion of Fig. 8) and the remaining portion outside the opposite portion, the third optical component F13 corresponding to the size of the display region P4 is cut out (refer to Fig. 9). Thereby, the double-sided bonding panel P13 to which the third optical component F13 is bonded is formed on the upper surface of the second single-sided bonding panel P12.

The film bonding system of the above modification can also effectively suppress the adhesion of particulate contaminants on the surface of the product without affecting the processing precision of the product, and help to reduce the frame portion.

Further, in the above-described embodiment, the second cutting device 16 including the laser oscillator 160 has been described as relatively moving relative to the pedestal 31, but the configuration is not limited thereto. For example, in laser vibration When the swinging device 160 is large and is not suitable for moving, the fixed laser oscillator 160 can be used to move the scanning element (the first irradiation position adjusting device 161 and the second irradiation position adjusting device 162) relative to the pedestal 31. . In this case, the condensing lens 163 can also be moved following the scanning element.

In the film bonding system of the above embodiment, the detection unit is used to detect each plural number The outer peripheral edge of the bonding surface of the liquid crystal panel P is set to the cutting position of the layer F1S, the second optical component layer F2, and the third optical component layer 3 of each liquid crystal panel P according to the outer periphery of the detection. Thereby, regardless of the individual difference in the size of the liquid crystal panel P or the layer F1S, the optical component of the desired size can be cut. Therefore, there is no difference in quality due to individual differences in the size of the liquid crystal panel P or the layer F1S, and the frame portion around the display area can be reduced, and the display area can be enlarged and the size of the machine can be reduced.

Next, the above-described embodiment and the configuration in the modification are an example of the present invention, and Various changes are made without departing from the spirit and scope of the invention.

16‧‧‧Second cutting device

F1‧‧‧First optical component layer

F11‧‧‧First optical component

L‧‧‧Laser light

L1‧‧‧Focus distance

P‧‧‧ LCD panel

P4‧‧‧ display area

S‧‧‧cutting department

S1‧‧‧ optical layer

S2‧‧‧Adhesive layer

S4‧‧‧ surface protection film

S5‧‧‧Fitting layer

S6‧‧‧ polarizer

S7‧‧‧ first film

S8‧‧‧second film

T1‧‧‧ fitting surface

T2‧‧‧ face

T3‧‧‧ face

T4‧‧‧ face

U‧‧‧ focus

The remainder of Y‧‧

Claims (8)

A production system for an optical display device, which is a production system for bonding an optical component to an optical display component to form an optical display device, comprising: a bonding device that is larger than a display area of the optical display component and includes a layer stack The optical component layer of the optical layer of the structure is bonded to the optical display component to form a bonding body; and the cutting device has a laser light irradiation device that irradiates laser light for cutting processing; wherein the cutting device is the sticker The opposite portion of the display region of the optical component layer in the combination, the remaining portion of the outer portion of the opposite portion is cut, and an optical component corresponding to the size of the display region is formed from the optical component layer; and the laser light irradiation device faces the The cut portion between the opposite portion and the remaining portion of the optical component layer in the bonded body is focused as a focus at a layer closest to the optical display member among a plurality of layers of the optical layer including the laminated structure, and is irradiated The laser light. The production system of an optical display device according to claim 1, wherein the laser beam irradiation device forms a cutting line that cuts a layer portion closest to the optical display member in the cutting portion. The production system of an optical display device according to claim 2, wherein the cutting device further has a tearing device; the tearing device is attached to the optical component layer along the optical component The intersecting direction of the face is displaced toward the optical display member side, and the remaining portion of the optical component layer after the cutting line is formed by the cutting device is torn from the facing portion. The production system of an optical display device according to any one of claims 1 to 3, further comprising: a detecting portion, in the bonded body, detecting the optical component layer and the optical display component The outer peripheral edge of the bonding surface; and the cutting portion is set along the outer periphery. A method of producing an optical display device, which is a method for producing an optical display device by bonding an optical component to an optical display component, comprising: a bonding step, which is larger than a display area of the optical display component and includes a layer stacking An optical component layer of the optical layer of the structure is bonded to the optical display component to form a bonding body; and a cutting step is performed toward the opposite portion of the display region of the optical component layer in the bonding body and the remaining portion of the opposite portion The cut portion between the portions is focused as a focus on the layer closest to the optical display member among the plurality of layers including the optical layer of the laminated structure, and the laser light for cutting processing is irradiated, and the opposite portion is irradiated The remaining portion is cut, and an optical component corresponding to the size of the display region is formed from the optical component layer. The method for producing an optical display device according to claim 5, wherein the cutting step further comprises a laser irradiation step; the laser irradiation step irradiates the laser beam to the cutting portion to form the closest The cutting line after the layer portion of the optical display member is cut. The method of producing an optical display device according to claim 6, wherein the cutting step further comprises a tearing step; the tearing step is performed by bonding the optical component layer to the optical display member. The intersecting direction of the face is displaced toward the optical display member side, and the remaining portion of the optical component layer after the cutting line is formed by the cutting step is torn from the opposing portion. The method for producing an optical display device according to any one of claims 5 to 7, further comprising a detecting step of detecting the optical in the bonded body before the cutting step The outer peripheral edge of the bonding surface of the component layer and the optical display member; and the cutting portion is set along the outer periphery.