TW201406239A - Solder ball assembly mask, solder ball assembly device, solder ball assembly system including the above device, and solder ball assembly method using the same - Google Patents

Abstract

The present invention relates to a solder ball assembly mask, a solder ball assembly device, and a solder ball assembly system including the above device, and a solder ball assembly method using the same. The solder ball assembling device of the present invention includes a platen, an assembly mask, and at least one rubber scraper, and the platen mounts the printed circuit board on the upper surface, and the assembly mask has a respective connection corresponding to the printed circuit board. The opening of the pad is mounted by being superposed on the platen, and the rubber blade is placed on the upper surface side of the assembly mask, and a plurality of solder balls are pressed in one direction.

Description

Tin ball assembly mask, solder ball assembly device, solder ball including the above device Assembly system and solder ball assembly method using the same

The present invention relates to a solder ball assembly mask, a solder ball assembly device, a solder ball assembly system including the above device, and a solder ball assembly method using the same.

In the past, it has become more and more popular to form a solder bump on a printed circuit board (PCB) and then assemble a flip chip of the component thereon.

In particular, the CPU and the image calculation device for high-speed calculation of large-capacity data have been rapidly connected to the substrate and the component by using a conventional gold wire (Au wire), and the substrate and the component are preferably connected by tin bumps to improve the connection resistance. Crystal mode.

The tin bumps described above can be classified into the following two methods: one is a method in which a solder paste (Solder Paste) is printed on a substrate, and the other is a fine solder ball ( The Solder Ball is formed by being assembled on a substrate, and is formed by directly injecting the melted tin or injecting the substrate into the substrate using a mask. The tin bumps formed as described above are melted by the connection of Cu pads or tin bumps formed between the wafers, and the gaps of the metals are bonded.

The above-mentioned method of forming the tin bumps is as described in Korean Laid-Open Patent Publication No. 2008-0014143 (published on Feb. 13, 2008). There are the following methods: one is a ball placement method, which is formed and covered. After the opening of the same size of the mask, the tin bump is pressed by the rubber scraper, thereby assembling the tin bump to the output/input pad of the substrate by the opening of the mask; the other is in the formation of the jig and The vacuum holes having the same substrate pattern are assembled to the substrate by vacuum-picking the tin bumps.

However, the solder ball assembly method described above has a disadvantage in that only tin bumps of the same size can be formed on the output/input pads of the substrate by using only solder balls of the same size. In the above-mentioned solder ball assembly method, if the solder balls of different sizes are assembled in the same manner after assembling the first solder balls, the jig or the mask may be interfered by the first assembled solder balls. So it is actually impossible to achieve.

The above disadvantages of using the same size solder balls also impose many limitations when designing components. In general, even if the tin bumps that transmit the input and output signals to the component are small, they do not interfere with the function of the component, but if the terminal of the strong power source is transmitted, and the ground terminal of the power source of the driving component is removed, The larger the tin bump, the more the stability of the component can be improved.

However, in the conventional solder ball assembly method, only solder balls of the same size are used. Therefore, in order to maintain the stability of the function of the device, it is necessary to supplement the design of the wafer, but this design change will result in an increase in product cost.

It is an object of the present invention to provide a solder ball assembly mask which can assemble solder balls of various sizes to solve the above problems.

Another object of the present invention is to provide a solder ball assembling apparatus which can assemble solder balls of various sizes to solve the above problems.

Another object of the present invention is to provide a solder ball assembly system including a solder ball assembling device, which can assemble solder balls of various sizes to solve the above problems.

Another object of the present invention is to provide a solder ball assembling method which can assemble solder balls of various sizes using a solder ball assembling device to solve the above problems.

A solder ball assembly mask according to an embodiment of the present invention includes an opening portion for assembling a solder ball corresponding to each of the pads of the printed circuit board, and corresponding to the diameter of the solder ball, having a phase Different size.

In the mask for assembling a solder ball according to an embodiment of the present invention, the opening portion has a plurality of first opening portions and a second opening portion, and the first opening portion corresponds to a ground pad of the printed circuit board and a power pad. The second opening corresponds to the input and output pads of the printed circuit board, and the first opening is larger than the second opening.

Further, a solder ball assembling apparatus according to an embodiment of the present invention includes a platen, a mask for assembly, and at least one rubber scraper which assembles a printed circuit board to an upper surface, and the assembly mask has Corresponding to the respective opening portions of the pads of the printed circuit board, the printed circuit board is interposed and mounted on the platen, and the rubber blades are respectively located on the upper surface side of the assembly mask, and are oriented in one direction. Many tin balls are pressed in.

In the solder ball assembling apparatus according to an embodiment of the present invention, the opening portion has a size corresponding to the diameter of the solder ball.

In the solder ball assembly device according to the embodiment of the present invention, the opening portion includes a plurality of first opening portions and a second opening portion, wherein the first opening portion corresponds to a ground pad of the printed circuit board and a power pad, and the second portion The opening corresponds to the The input and output pads of the printed circuit board are larger than the second opening.

In the solder ball assembling device according to the embodiment of the present invention, the rubber scraper includes a first rubber scraper and a second rubber scraper, and the first rubber scraper presses the first solder ball corresponding to the first opening portion, The second rubber blade presses the second solder ball corresponding to the second opening.

Further, a solder ball assembling system according to another embodiment of the present invention includes a solder ball assembling device, a control unit coupled to the solder ball assembling device, a photographing portion located at an upper portion of the solder ball assembling device, and transmitting image information to the control portion, and A display unit connected to the control unit.

In a solder ball assembling system according to another embodiment of the present invention, the solder ball assembling device includes a platen, an assembly mask, and at least one rubber scraper, and the platen is assembled on the upper surface of the printed circuit board for assembly. The mask has openings corresponding to the pads of the printed circuit board, and the printed circuit board is interposed and mounted on the platen. The rubber blades are respectively located on the upper surface side of the assembly mask. Press a lot of solder balls into one direction.

In the solder ball assembling system of another embodiment of the present invention, the opening portion has a size corresponding to the diameter of the solder ball.

In the solder ball assembly system of the embodiment of the present invention, the opening portion includes a plurality of first opening portions and a second opening portion, the first opening portion is a ground pad corresponding to the printed circuit board and the power pad, the second The opening corresponds to an input and output pad of the printed circuit board, and the first opening is larger than the second opening.

In a solder ball assembly system according to another embodiment of the present invention, the rubber scraper includes a first rubber scraper and a second rubber scraper, and the first rubber scraper is paired The first solder ball is pressed in the first opening portion, and the second rubber blade presses the second solder ball corresponding to the second opening portion.

In addition, the solder ball assembling method according to another embodiment of the present invention includes the following steps: (A) preparing a printed circuit board on which a solder ball is assembled, and (B) assembling the printed circuit board into a solder ball assembling device, (C) The control unit uses the solder ball assembling device to assemble a plurality of first solder balls to the printed circuit board, and (D) the control unit assembles a plurality of second solder balls to the printed circuit board using the solder ball assembling device. a step wherein the first solder ball is larger in size than the second solder ball.

A solder ball assembling method according to another embodiment of the present invention further includes the following steps: (E) the control unit uses the solder ball assembling device to sequentially assemble a plurality of other solder balls smaller than the second solder ball to the printed circuit. The steps of the board.

The solder ball assembling method of other embodiments of the present invention further includes the following steps: (F) performing the step of the solder ball reflowing process.

In the method of assembling a solder ball according to another embodiment of the present invention, in the step (B), the printed circuit board is interposed between the platen of the solder ball assembling device and the upper assembly mask, and the opening of the assembly mask The parts are assembled corresponding to the pads of the printed circuit board.

In a solder ball assembling method according to another embodiment of the present invention, the (C) step includes the steps of: (C-1) supplying a plurality of first solder balls to the assembly mask, and (C-2) using the (C-3) analyzing the image information of the assembly mask obtained by the imaging unit provided on the upper portion of the mask for assembly, and determining the first step of the step of pressing the first rubber blade provided on the side of the mask for assembly Whether the first solder ball is assembled or not, and (C-4) is assembled with the first solder ball, and then the first solder ball remaining in the assembly mask is pressed into the step.

In the method of assembling a solder ball according to another embodiment of the present invention, the step (D) includes the following steps: (D-1) a step of supplying a plurality of second solder balls to the assembly mask in which the first solder ball is assembled, (D-2) using the step of press-fitting the second rubber blade provided on the other side of the assembly mask, and (D-3) analyzing the assembly mask obtained by passing through the imaging unit provided in the upper portion of the assembly mask. The image information determines whether the second solder ball is assembled or not, and (D-4) the step of pressing the second solder ball remaining in the assembly mask after the second solder ball is assembled.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

The objects, advantages and novel features of the invention will become apparent from In this manual, when the reference number is used for the constituent elements of each drawing, as long as it is the same component, even if it appears in different drawings, the same number is used as much as possible. In addition, terms such as "one side", "the other side", "first" and "second" are used to distinguish between a constituent element and other constituent elements, and the constituent elements are not restricted by the term. The detailed description of the well-known art is described below and is omitted to avoid obscuring the gist of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1a is a structural view showing a system including a solder ball assembling apparatus according to an embodiment of the present invention, and Fig. 1b is a plan view showing a mask constituting a solder ball assembling apparatus according to an embodiment of the present invention.

As shown in FIG. 1a, a system including a solder ball assembling apparatus according to an embodiment of the present invention includes the following: a solder ball assembling device, a control unit 400 coupled to the solder ball assembling device, and an upper portion of the solder ball assembling device. The photographing unit 600 and the display unit 500 connected to the control unit 400.

In particular, the solder ball assembling apparatus includes a platen 100 on which the printed circuit board 110 is assembled on the upper surface, and opening portions 210 corresponding to the pads of the printed circuit board 110. The interposing printed circuit board 110 is superposed on the platen 100 and mounted thereon. The assembly mask 200 and the first rubber blade 310 and the second rubber blade 320 which are respectively disposed on the upper surface side of the assembly mask 200 and which perform the reciprocating operation in one direction corresponding to the control unit 400. Here, the solder ball assembling apparatus includes the two rubber scrapers of the first rubber scraper 310 and the second rubber scraper 320. However, the present invention is not limited thereto, and only one rubber scraper may be used, or three or more rubber scrapers may be used.

The platen 100 is a member supported by the printed circuit board 110 on the upper surface thereof, and the assembly cover 200 is superposed and attached by means of a coupling means such as a clamp, and the printed circuit board can be interposed between the platen 100 and the assembly cover 200. 110 and fixed installation.

The assembly mask 200 is composed of an assembly surface and side walls formed along edges of the assembly surface, and the assembly surface includes openings 210 corresponding to the pads of the printed circuit board 110, respectively. The above-mentioned assembly mask 200 receives a supply of a plurality of solder balls.

In particular, as shown in FIG. 1b, the assembly surface of the assembly mask 200 has openings 210 having different sizes corresponding to the pads of the printed circuit board 110. For example, the opening portion 210 may include a plurality of first opening portions 211 having a large diameter and a second opening portion 212 having a relatively small diameter. Of course, for assembly The assembly surface of the mask 200 may include a plurality of other openings in addition to the first opening portion 211 and the second opening portion 212, and the diameter of the opening portion may be different depending on the size of the supplied solder balls.

At this time, the first rubber blade 310 and the second rubber blade 320 respectively provided on one side of the assembly mask 200 are reciprocated in one direction on one surface of the assembly mask 200, thereby sequentially Up to the smallest, a plurality of individually supplied solder balls are assembled to their respective openings.

For example, after the assembly mask 200 is supplied with a plurality of first solder balls having the largest diameter, the first rubber blade 310 presses one surface of the assembly mask 200 in one direction, thereby the first tin having the largest diameter. The balls are assembled to the first opening portion 211 of the assembly mask 200, respectively.

Next, the assembly mask 200 is supplied with a plurality of second solder balls having a smaller diameter than the first solder balls, and the second rubber scraper 320 presses one surface of the assembly mask 200 in other directions, thereby applying the second solder balls. The second opening portion 212 of the assembly mask 200 is assembled.

Of course, in addition to the first solder ball and the second solder ball, the solder ball for the assembly mask 200 may be supplied with a plurality of solder balls according to the respective diameters, and the first rubber scraper 310 or the second rubber scraper 320 may be used. A plurality of solder balls supplied in diameter are attached to the opening.

In the solder ball assembling apparatus according to the embodiment of the present invention, the control unit 400 controls the first rubber blade 310 or the second rubber blade 320, and the first rubber blade 310 or the second rubber blade 320 is assembled in one direction. The press ball is repeatedly pressed by one surface of the mask 200, whereby a plurality of solder balls supplied in respective diameters are attached to the assembly mask 200.

At this time, the control unit 400 is photographed from the upper portion of the solder ball assembly device. The unit 600 receives the image information on the side of the assembly mask 200, and grasps whether or not the solder ball of the opening portion of the assembly mask 200 is assembled. The first rubber blade 310 or the second rubber blade 320 is controlled to apply the solder ball. Completely assembled.

Therefore, the system including the solder ball assembling device according to an embodiment of the present invention can use a solder ball assembling device to correspond to each pad of the printed circuit board 110, for example, a large-diameter solder ball for a conductive power supply pad and a ground pad. A small diameter solder ball is assembled to the input and output pads.

Thereby, the power pad and the ground pad have a relatively large tin bump through the assembled large diameter solder ball, which can improve the stability of the component.

Hereinafter, a solder ball assembling method using a solder ball assembling apparatus according to another embodiment of the present invention will be described with reference to Figs. 4a to 4d. Fig. 2 is a view showing an example of the operation of the first rubber blade in the solder ball assembling method using the solder ball assembling device according to another embodiment of the present invention, and Fig. 3 is a view showing the solder ball using the solder ball assembling device according to another embodiment of the present invention. In the assembly method, an example of the operation of the second rubber blade is shown. 4a to 4d are cross-sectional views showing the construction of a solder ball assembling method using a solder ball assembling apparatus according to another embodiment of the present invention.

As shown in Fig. 4a, using the solder ball assembling method of the solder ball assembling apparatus according to another embodiment of the present invention, first, a printed circuit board 110 in which solder balls are assembled is prepared.

The printed circuit board 110 shown in FIG. 4a includes, for example, a structure of a substrate 111, a pad 112, and a solder resist pattern layer 113. Further, the printed circuit board 110 can be divided into a region A to the ground pad, a B region to the power pad, and a C region to the input and output terminals. Of course, in addition to the printed circuit board 110 shown in FIG. 4a, it can also be applied to Various printed circuit boards with pads of different sizes.

Then, as shown in Fig. 4b, the above printed circuit board 110 is assembled on the solder ball assembling device.

That is, the printed circuit board 110 is assembled between the platen 100 and the assembly mask 200, and the opening portion 210 of the assembly mask 200 is assembled corresponding to each of the pads 112 of the printed circuit board 110. Here, the platen 100 and the assembly mask 200 can be attached to each other in a state in which the printed circuit board 110 is interposed by means of a joining means such as a clamp.

In the state in which the printed circuit board 110 is interposed, after the platen 100 and the assembly mask 200 are overlapped with each other, a plurality of first solder balls 121 are supplied to the assembly mask 200, and the first solder balls 121 are assembled to the ground pad. The maximum diameter of the A zone and the B zone of the power pad.

Next, in accordance with the control of the control unit 400, the first rubber blade 310 is pressed in one direction on one surface of the assembly mask 200. As shown in Fig. 2, a plurality of first solder balls 121 are attached to the assembly. The first opening portion 211 of the mask 200.

Thereby, as shown in FIG. 4b, the first solder balls 121 are in contact with the pads of the A region and the B region, respectively.

Then, the control unit 400 determines that the first solder balls 121 completely fill the first opening portion 121 by using the image of the assembly mask 200 received from the image capturing unit 600.

When the first solder ball 121 does not completely fill the first opening portion 211, the control unit 400 controls the first rubber blade 310 to press the first solder ball 121 remaining in the assembly mask 200 again.

After the first solder ball 121 is completely filled in the first opening portion 211, The first solder ball 121 remaining in the assembly mask 200 is removed, and a plurality of second solder balls 122 are supplied to the assembly mask 200, and the second solder balls 122 are assembled in the pair of input and output terminals C, and have a small The diameter.

Next, in accordance with the control of the control unit 400, the first opening portion 211 is completely covered by the first solder ball 121, and the second rubber blade 320 is pressed in the other direction. As shown in FIG. 3, a plurality of second solder balls 122 are assembled to the second opening portion 212 of the assembly mask 200, respectively.

Thereby, as shown in FIG. 4c, the second solder balls 122 are respectively in contact with the pads of the C region.

Then, the control unit 400 determines whether or not the second solder ball 122 completely fills the second opening portion 212 using the image of the assembly mask 200 received from the image capturing unit 600.

When the second solder ball 122 does not completely fill the second opening portion 212, the control portion 400 controls the second rubber blade 320 to press the second solder ball 122 remaining in the assembly mask 200 again.

As described above, after the second solder ball 122 is filled in the second opening portion 212, the assembly mask 200 can be separated from the printed circuit board 110, and a reflow process can be performed.

Thereby, the first solder ball 121 and the second solder ball 122 are reflowed, and the first solder ball 121 and the second solder ball 122 can form equal tin bumps from the height t of the solder resist pattern layer 113.

Therefore, the elements bonded by forming the same tin bumps from the height t of the solder resist pattern layer 113 have the same height from the printed circuit board 110, and pass through the tin bumps corresponding to the pads of the A region and the B region. But Improve stability.

The solder ball assembly system according to an embodiment of the present invention uses a solder ball assembly device to pass through a large diameter tin ball assembled to a power pad of a printed circuit board and a ground pad, and has a relatively large tin bump. The effect of improving the stability of the component is obtained.

The solder ball assembling method according to another embodiment of the present invention can be obtained by a device in which a solder ball assembled in a size is formed to form a solder bump of the same height, and high stability is obtained.

The above is a detailed description of the specific embodiments of the present invention, but is only intended to specifically illustrate the present invention, and the present invention is not limited to the above, and if it has a general knowledge in the field, it can be included in the technical idea of the present invention. Change or improvement, this is self-evident.

The specific scope of the present invention can be more clearly understood from the scope of the appended claims.

100‧‧‧ board

110‧‧‧Printed circuit board

111‧‧‧Substrate

112‧‧‧ pads

113‧‧‧ solder mask layer

200‧‧‧Assembled mask

210‧‧‧ openings

211‧‧‧ first opening

212‧‧‧second opening

310‧‧‧First rubber scraper

320‧‧‧Second rubber scraper

400‧‧‧Control Department

500‧‧‧Display Department

600‧‧‧Photography Department

Fig. 1a is a structural view of a system including a solder ball assembling apparatus according to an embodiment of the present invention.

Fig. 1b is a plan view showing a mask constituting a solder ball assembling apparatus according to an embodiment of the present invention.

Fig. 2 is a view showing an example of the operation of the first rubber blade in the solder ball assembling method using the solder ball assembling apparatus according to the embodiment of the present invention.

Figure 3 is a view showing a tin used in a solder ball assembling apparatus according to an embodiment of the present invention. In the ball assembling method, an example of the operation of the second rubber blade is shown.

Fig. 4a is a cross-sectional view showing the construction of a solder ball assembling method using a solder ball assembling apparatus according to an embodiment of the present invention.

Fig. 4b is a cross-sectional view showing the construction of a solder ball assembling method using a solder ball assembling apparatus according to an embodiment of the present invention.

Fig. 4c is a cross-sectional view showing the construction of a solder ball assembling method using a solder ball assembling apparatus according to an embodiment of the present invention.

Fig. 4d is a cross-sectional view showing the construction of a solder ball assembling method using a solder ball assembling apparatus according to an embodiment of the present invention.

100‧‧‧ board

110‧‧‧Printed circuit board

200‧‧‧Assembled mask

210‧‧‧ openings

310‧‧‧First rubber scraper

320‧‧‧Second rubber scraper

400‧‧‧Control Department

500‧‧‧Display Department

600‧‧‧Photography Department

Claims (15)

A solder ball assembly mask includes openings corresponding to the pads of the printed circuit board for assembling the solder balls, and the openings have different sizes corresponding to the diameters of the solder balls. The solder ball assembly mask according to claim 1, wherein the opening portion includes a plurality of first openings corresponding to the ground pads and the power pads of the printed circuit board, and the plurality of openings correspond to the printing a second opening of the input and output pads of the circuit board, and the first openings are larger than the second openings. A solder ball assembling device comprising: a board for assembling a printed circuit board to an upper surface; an assembly mask having respective openings corresponding to the pads of the printed circuit board, the printed circuit board is interposed Mounted on the platen; at least one rubber scraper is located on one side of the upper surface of the assembly mask, and presses a plurality of solder balls in one direction; wherein the openings have corresponding tin ball diameters Different sizes. The solder ball assembly device of claim 3, wherein the openings comprise a plurality of first openings and a plurality of second openings, the first openings corresponding to the ground pads of the printed circuit board And the power supply pads, the second openings correspond to the input and output pads of the printed circuit board, and the first openings are larger than the second openings. The solder ball assembly device of claim 4, wherein the rubber scraper comprises: a first rubber scraper that presses a first solder ball corresponding to the first openings; and a second rubber scraper, The second solder balls corresponding to the second openings are pressed. A solder ball assembly system includes: a solder ball assembly device; a control unit coupled to the solder ball assembly device; and a photographing portion located at an upper portion of the solder ball assembly device to transmit image information to the control portion; The display unit is coupled to the control unit. The solder ball assembling system of claim 6, wherein the solder ball assembling device comprises: a plate for assembling the printed circuit board to the upper surface; and an assembly mask corresponding to the printed circuit Each of the openings of the pads of the board is mounted by being overlapped by the printed circuit board; at least one rubber scraper is located on one side of the upper surface of the assembly mask, and a plurality of solder balls are arranged in one direction Pressing; wherein the openings have different sizes corresponding to the diameters of the solder balls. A solder ball assembly system as described in claim 7 of the patent application, wherein The opening portion includes a plurality of first openings and a plurality of second openings corresponding to the ground pad and the power pad of the printed circuit board, and the second openings correspond to the printing The input and output pads of the circuit board, and the first openings are larger than the second openings. The solder ball assembly system of claim 8, wherein the rubber scraper comprises: a first rubber scraper that presses a first solder ball corresponding to the first openings; and a second rubber scraper, The second solder balls corresponding to the second openings are pressed. A solder ball assembling method comprising: (A) a step of preparing a printed circuit board on which a solder ball is assembled; (B) a step of mounting the printed circuit board on a solder ball assembling device; (C) assembling the solder ball using the solder ball a step of assembling a plurality of first solder balls on the printed circuit board; (D) a step of assembling the plurality of second solder balls to the printed circuit board by using the solder ball assembly device; wherein The first solder balls have a larger size than the second solder balls. The solder ball assembling method according to claim 10, further comprising: (E) the control unit uses the solder ball assembling device, and the other than the second tin A plurality of solder balls having a small ball size are sequentially assembled to the printed circuit board from large to small. The solder ball assembling method according to claim 10, further comprising: (F) performing the step of the solder ball reflowing project. The solder ball assembling method according to claim 10, wherein in the step (B), the printed circuit board is interposed between the platen of the solder ball assembling device and the upper portion of the assembly mask, and the assembly is used. The opening of the mask is assembled corresponding to each of the pads of the printed circuit board. The method for assembling a solder ball according to claim 13 , wherein the step (C) of the method further comprises: (C-1) the step of supplying the first solder ball to the assembly mask; (C) -2) a step of pressing the first rubber blade provided on the side of the mask for assembly; (C-3) analyzing image information of the assembly mask from the image forming portion provided in the upper portion of the assembly mask , determining whether the first solder balls are assembled; (C-4) returning whether the first solder balls are assembled, and the first solder balls remaining in the assembly mask are pressed again. The method for assembling a solder ball according to claim 13 , wherein the step (D) of the method further comprises the following steps: (D-1) a step of supplying a plurality of the second solder balls to the assembly mask in which the first solder balls are assembled; (D-2) using the second rubber scraper provided on the other side of the assembly mask (D-3) analyzing the image information of the assembly mask from the imaging unit provided in the upper portion of the assembly mask, and determining whether the second solder balls are assembled; (D-4) Responding to whether the second solder balls are assembled or not, the assembly of the second solder balls remaining in the mask is again pressed.