TW201343034A - Compound double-side copper clad laminate and manufacturing method thereof - Google Patents
Compound double-side copper clad laminate and manufacturing method thereof Download PDFInfo
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- TW201343034A TW201343034A TW101120193A TW101120193A TW201343034A TW 201343034 A TW201343034 A TW 201343034A TW 101120193 A TW101120193 A TW 101120193A TW 101120193 A TW101120193 A TW 101120193A TW 201343034 A TW201343034 A TW 201343034A
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- copper foil
- adhesive layer
- film
- sided
- insulating
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 160
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 40
- 239000010949 copper Substances 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 150000001875 compounds Chemical class 0.000 title abstract 5
- 239000011889 copper foil Substances 0.000 claims abstract description 116
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 3
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 239000010408 film Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 46
- 239000002131 composite material Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 19
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000006185 dispersion Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- -1 polyethylene terephthalate Polymers 0.000 claims description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims 2
- 229920000265 Polyparaphenylene Polymers 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 229920000417 polynaphthalene Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 230000000873 masking effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 238000002310 reflectometry Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920006259 thermoplastic polyimide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 108010039918 Polylysine Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000656 polylysine Polymers 0.000 description 1
- 108010026466 polyproline Proteins 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
Description
本發明屬於軟性印刷電路板結構及工藝領域，具體涉及一種複合式雙面銅箔基板及其製造方法。 The invention belongs to the field of soft printed circuit board structure and process, and particularly relates to a composite double-sided copper foil substrate and a manufacturing method thereof.
目前全球電子產業的發展趨勢向輕薄短小、高耐熱性、多功能性、高密度化、高可靠性、且低成本的方向發展，因此基板的選用就成為很重要的影響因素。而良好的基板必須具備高熱傳導性、高尺寸安定性、高遮色效果、高散熱性、高耐熱性、及低熱膨脹係數的材料特性。聚醯亞胺樹脂熱穩定性高且具有優異的散熱性、機械強度及粘著性，常運用於多種電子材料，如用於軟性印刷電路板(Flexible Printed Circuit)。 At present, the development trend of the global electronics industry is developing in the direction of lightness, shortness, high heat resistance, versatility, high density, high reliability, and low cost. Therefore, the selection of substrates has become an important factor. A good substrate must have high thermal conductivity, high dimensional stability, high opacity, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Polyimine resin has high thermal stability and excellent heat dissipation, mechanical strength and adhesion, and is commonly used in various electronic materials, such as for Flexible Printed Circuits.
由於目前FPC行業所使用的無膠銅箔基材普遍受到日本等國外原物料廠商的技術控制，相對的生產成本較高且生產工藝複雜，需要經過很高的高溫處理，不易於產品的推廣使用和價格的成本控制。傳統的無膠雙面板的制程為：雙面銅箔壓合熱塑性聚醯亞胺(TPI)經過高溫壓合烘烤制程固化反應完全後生產出成品。此生產工藝不僅耗費能源，而且使用相對成本較高的TPI原料，並且在生產過程中良率偏低。因此，目前通常在使用的無膠雙面銅箔基板存在生產時需要高溫處理、長時間高溫烘烤等制程式控制制的限制，不僅需要較高的生產成本，浪費能源和生產時間，並且還無法保證生產的良率和效率，限制了生產能力。 Since the glueless copper foil substrate used in the FPC industry is generally controlled by the technology of foreign raw materials manufacturers such as Japan, the relative production cost is high and the production process is complicated, which requires high temperature treatment and is not easy to promote. Cost control of usage and price. The traditional glueless double-panel process is as follows: a double-sided copper foil press-bonded thermoplastic polyimide (TPI) is produced by a high-temperature press-bake process after the curing reaction is completed. This production process not only consumes energy, but also uses relatively high cost TPI raw materials, and the yield is low during the production process. Therefore, the glueless double-sided copper foil substrate which is usually used at present is limited in the production process, such as high temperature treatment and long time high temperature baking, which requires high production cost, waste of energy and production time, and also Production yield and efficiency cannot be guaranteed and production capacity is limited.
鑒於上述缺陷，有必要研發出性能優越、便於量產且成本低、良率高的雙面銅箔基板及製造工藝。如中國專利200810217932.6公開了一種雙面撓性覆銅板及其製作方法，該雙面撓性覆銅板包括一單面覆銅板、塗布於該單面覆銅板上的膠粘劑層、以及壓覆於該膠粘劑層上的另一銅箔或另一單面撓性覆銅板，所述單面覆銅板包括一銅箔以及塗布於銅箔上的聚醯亞胺層，所述聚醯亞胺 層與膠粘劑層相鄰設置；其製作方法包括下述步驟：步驟一，提供銅箔、並製備聚醯胺酸及膠粘劑；步驟二，在銅箔上塗布一層聚醯胺酸，經過乾燥、高溫亞胺化後形成單面聚醯亞胺撓性覆銅板；步驟三，在制得的一單面撓性覆銅板的聚醯亞胺面上塗布一層膠粘劑，經乾燥後與銅箔或另一單面撓性覆銅板經過輥壓複合並固化後制得雙面撓性覆銅板。雖然專利200810217932.6的本意是提供一種能夠克服三層法製造雙面撓性覆銅板難以薄型化和尺寸穩定性較差的不足，以及二層法撓性覆蓋膜的高成本和表觀差的問題，而且綜合性能優異、成本低廉，能夠實現基材的薄型化的雙面撓性覆銅板及其製作方法，但是其在實際生產中會存在下述缺陷：生產制程比較難，設備需要將張力控制得很好，塗上膠層後，在壓合段很容易產生折皺，長度無法做長，良率不高，良率只有30%左右。 In view of the above drawbacks, it is necessary to develop a double-sided copper foil substrate and a manufacturing process which are superior in performance, convenient in mass production, low in cost, and high in yield. For example, Chinese Patent No. 200810217932.6 discloses a double-sided flexible copper clad laminate and a manufacturing method thereof, the double-sided flexible copper clad laminate comprising a single-sided copper clad laminate, an adhesive layer coated on the single-sided copper clad laminate, and a coating on the adhesive Another copper foil or another single-sided flexible copper clad laminate on the layer, the single-sided copper clad laminate comprising a copper foil and a polyimide layer coated on the copper foil, the polyimine The layer is disposed adjacent to the adhesive layer; the manufacturing method comprises the following steps: step one, providing copper foil, preparing poly-proline and an adhesive; and step two, coating a layer of poly-lysine on the copper foil, drying, high temperature After imidization, a unilateral polyimide flexible copper clad laminate is formed; in step 3, a layer of adhesive is applied on the polyiminoimine surface of a single-sided flexible copper clad plate, and after drying, with copper foil or another The single-sided flexible copper clad laminate is rolled and cured to obtain a double-sided flexible copper clad laminate. Although the intention of the patent 200810217932.6 is to provide a problem that it is difficult to reduce the thickness and stability of the double-sided flexible copper clad laminate by the three-layer method, and the high cost and apparent difference of the two-layer flexible cover film, and A double-sided flexible copper clad laminate with excellent comprehensive performance and low cost, which can realize thinning of a substrate, and a manufacturing method thereof, but in actual production, there are the following defects: the production process is difficult, and the equipment needs to control the tension very much. Well, after applying the glue layer, it is easy to produce wrinkles in the pressing section, the length cannot be made long, the yield is not high, and the yield is only about 30%.
為了克服上述缺陷，本發明提供了一種可進行壓合工藝生產的，可使用較低溫度生產，並且生產簡單、良率高、性能優異的、使用方便的複合式雙面銅箔基板，相對于傳統的加工工藝做了極大的改良。 In order to overcome the above drawbacks, the present invention provides a composite double-sided copper foil substrate which can be produced by a press-bonding process and which can be produced at a lower temperature and which is simple in production, high in yield, excellent in performance, and convenient to use. The traditional processing technology has been greatly improved.
本發明為了解決其技術問題所採用的技術方案是：一種複合式雙面銅箔基板，由無膠單面覆銅板和帶膠銅箔板兩者壓合構成，所述無膠單面覆銅板由一層銅箔以及形成於銅箔一表面的絕緣基膜構成，所述帶膠銅箔板由另一銅箔以及塗覆於另一銅箔一表面的絕緣粘結膠層構成，且所述絕緣基膜和所述絕緣粘結膠層相鄰設置。 The technical solution adopted by the present invention to solve the technical problem thereof is: a composite double-sided copper foil substrate, which is composed of a rubber-free single-sided copper clad laminate and a rubberized copper clad plate, and the rubber-free single-sided copper clad laminate Forming a layer of copper foil and an insulating base film formed on a surface of the copper foil, the rubberized copper foil board being composed of another copper foil and an insulating adhesive layer coated on a surface of the other copper foil, and The insulating base film and the insulating adhesive layer are disposed adjacent to each other.
較佳地，所述絕緣基膜是聚醯亞胺(PI)膜、聚對苯二甲酸乙二醇酯(PET)膜、聚萘酯(PEN)膜和液晶聚合物(PLC)膜中的一種，所述絕緣基膜的厚度為7~100um。 Preferably, the insulating base film is in a polyimide film, a polyethylene terephthalate (PET) film, a polynaphthyl ester (PEN) film, and a liquid crystal polymer (PLC) film. In one type, the insulating base film has a thickness of 7 to 100 um.
較佳地，所述絕緣基膜是聚醯亞胺(PI)膜。 Preferably, the insulating base film is a polyimide film (PI) film.
較佳地，所述銅箔為壓延(RA)銅箔、電解(ED)銅箔和高延展(HD)銅箔中的一種，且所述銅箔的厚度為7.5~35um。 Preferably, the copper foil is one of a calendered (RA) copper foil, an electrolytic (ED) copper foil, and a high-stretch (HD) copper foil, and the copper foil has a thickness of 7.5 to 35 um.
較佳地，所述絕緣粘結膠層是環氧樹脂膠系層、丙烯酸酯膠系層、聚對苯二甲酸乙二醇酯膠系層、聚氨酯膠系層和聚醯亞胺膠系層中的一種，所述絕緣粘結膠層的厚度為5~50um。 Preferably, the insulating adhesive layer is an epoxy adhesive layer, an acrylate adhesive layer, a polyethylene terephthalate adhesive layer, a polyurethane adhesive layer, and a polyimine adhesive layer. In one of the above, the insulating adhesive layer has a thickness of 5 to 50 um.
上述複合式雙面銅箔基板的製造方法如下：將由一層銅箔以及形成於銅箔一表面的絕緣基膜所構成的無膠單面覆銅板和由另一銅箔以及塗覆於另一銅箔一表面的絕緣粘結膠層所構成的帶膠銅箔板兩者進行熱壓合，且所述絕緣基膜和所述絕緣粘結膠層相鄰設置，熱壓合溫度控制在30~100℃，制得本發明所述複合式雙面銅箔基板。 The composite double-sided copper foil substrate is manufactured by the following method: a glueless single-sided copper clad plate composed of a copper foil and an insulating base film formed on one surface of the copper foil, and another copper foil and another copper coating The rubberized copper foil board formed by the insulating adhesive layer on the surface of the foil is thermocompression-bonded, and the insulating base film and the insulating adhesive layer are disposed adjacent to each other, and the thermal pressing temperature is controlled at 30~ The composite double-sided copper foil substrate of the present invention was obtained at 100 °C.
較佳地，所述無膠單面覆銅板的製備方法如下：將形成所述絕緣基膜的液態分散體塗覆至銅箔上，並經烘烤固化形成所述無膠單面覆銅板。 Preferably, the glueless single-sided copper clad plate is prepared by applying a liquid dispersion forming the insulating base film to a copper foil, and baking and curing to form the glueless single-sided copper clad laminate.
較佳地，所述帶膠銅箔板是由RCC銅箔基材撕除離型層之後形成，且所述RCC銅箔基材的製備方法如下：將形成絕緣粘結膠層的液態分散體塗覆於另一銅箔的一表面，然後烘烤，使所述液態分散體達到半流動半固化狀態形成絕緣粘結膠層，然後在絕緣粘結膠層表面貼覆離型層，制得RCC銅箔基材。較佳地，所述離型層為離型紙或離型膜，且厚度為30~200um。 Preferably, the rubberized copper foil sheet is formed by tearing off the release layer from the RCC copper foil substrate, and the RCC copper foil substrate is prepared as follows: a liquid dispersion forming an insulating adhesive layer Coating on a surface of another copper foil, and then baking, the liquid dispersion is semi-flowed and semi-cured to form an insulating adhesive layer, and then the release layer is coated on the surface of the insulating adhesive layer. RCC copper foil substrate. Preferably, the release layer is a release paper or a release film and has a thickness of 30 to 200 um.
本發明的有益效果是：本發明通過使用常用的無膠單面覆銅板和帶膠銅箔板兩者進行低溫熱壓合制得本發明的複合式雙面銅箔基板，避免了現有技術的高溫壓合制程和使用昂貴的TPI原料，並得到能夠滿足無膠雙面板特性需要的複合式雙面銅箔基板，不僅節約了生產成本，而且提高了產品生產的良率，擴展了產品的使用範圍，而且本發明的複合式雙面銅箔基板具有優異的尺寸安定性和耐彎折性能，並具有遮色效果、高耐熱性和高反射率。 The invention has the beneficial effects that the composite double-sided copper foil substrate of the invention is obtained by low-temperature thermocompression bonding using both the conventional glueless single-sided copper clad laminate and the rubberized copper foil panel, thereby avoiding the prior art. The high-temperature press-bonding process and the use of expensive TPI raw materials, and the composite double-sided copper foil substrate that can meet the needs of the non-rubber double-panel characteristics, not only saves production costs, but also improves the production yield of the products and expands the use of the products. Also, the composite double-sided copper foil substrate of the present invention has excellent dimensional stability and bending resistance, and has a color opaque effect, high heat resistance, and high reflectance.
實施例：下面結合附圖對本發明的較佳實施例進行詳細闡述，以使本發明的優點和特徵能更易於被本領域技術人員理解，從而對本發明的保護範圍做出更為清楚明確的界定。 The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings in order to make the advantages and features of the present invention more readily understood by those skilled in the art, so that the scope of the present invention is more clearly defined. .
一種複合式雙面銅箔基板，由無膠單面覆銅板1和帶膠銅箔板2兩者壓合構成，所述無膠單面覆銅板1由一層銅箔11以及形成於銅箔一表面的絕緣基膜12構成，所述帶膠銅箔板2由另一銅箔21以及塗覆於另一銅箔一表面的絕緣粘結膠層22構成，且所述絕緣基膜12和所述絕緣粘結膠層22相鄰設置。 A composite double-sided copper foil substrate is composed of a glueless single-sided copper clad laminate 1 and a rubberized copper clad laminate 2, wherein the glueless single-sided copper clad laminate 1 comprises a copper foil 11 and a copper foil. The surface of the insulating base film 12 is composed of another copper foil 21 and an insulating adhesive layer 22 coated on the surface of the other copper foil, and the insulating base film 12 and the The insulating adhesive layer 22 is disposed adjacent to each other.
其中，所述絕緣基膜12是聚醯亞胺(PI)膜、聚對苯二甲酸乙二醇酯(PET)膜、聚萘酯(PEN)膜和液晶聚合物(PLC)膜中的一種，優選的是聚醯亞胺(PI)膜，所述絕緣基膜12的厚度為7~100um。 Wherein, the insulating base film 12 is one of a polyimide film (PI) film, a polyethylene terephthalate (PET) film, a polynaphthyl ester (PEN) film, and a liquid crystal polymer (PLC) film. Preferred is a polyimide film (PI) film having a thickness of 7 to 100 μm.
其中，所述銅箔11、21為壓延(RA)銅箔、電解(ED)銅箔和高延展(HD)銅箔中的一種，且所述銅箔11、21的厚度為7.5~35um。 The copper foils 11 and 21 are one of a rolled (RA) copper foil, an electrolytic (ED) copper foil, and a high-stretch (HD) copper foil, and the copper foils 11 and 21 have a thickness of 7.5 to 35 μm.
其中，所述絕緣粘結膠層22是環氧樹脂膠系層、丙烯酸酯膠系層、聚對苯二甲酸乙二醇酯膠系層、聚氨酯膠系層和聚醯亞胺膠系層中的一種，所述絕緣粘結膠層22的厚度為5~50um。 The insulating adhesive layer 22 is an epoxy resin adhesive layer, an acrylate adhesive layer, a polyethylene terephthalate adhesive layer, a polyurethane adhesive layer, and a polyimine rubber adhesive layer. For one type, the insulating adhesive layer 22 has a thickness of 5 to 50 um.
上述複合式雙面銅箔基板的製造方法如下：一、無膠單面覆銅板1的製備：利用有機溶劑來混合溶解所需的各組分，形成絕緣基膜的液態分散體，使用塗布生產設備將此液態分散體塗覆至銅箔11上形成絕緣基膜12，使此塗布後的絕緣基膜經過線上乾燥烘箱，除去內含的有機溶劑並達到固化，以免在收卷時相互粘附，並通過後續的烘烤工藝達到成分反應固化，形成無膠單面覆銅板1； 二、RCC銅箔基板的製備：利用有機溶劑來混合所需的各組分，形成絕緣粘結膠層22的液態分散體，將此絕緣粘結膠層的液態分散體使用塗布生產設備塗覆於銅箔21的粗糙面側，經過線上乾燥烘箱的烘烤，去除內含的有機溶劑，並使絕緣粘結膠層達到半流動半固化狀態，最後在絕緣粘結膠層上帖覆離型層，形成RCC銅箔基板；三、使用無膠單面覆銅板1和RCC銅箔基板，將RCC銅箔基板的離型層撕除得到帶膠銅箔板2，將無膠單面覆銅板1和帶膠銅箔板2通過壓合機熱壓合(所述絕緣基膜12和所述絕緣粘結膠層22相鄰設置)後再經過固化得到複合式雙面銅箔基板，其中熱壓合溫度控制在30~100℃。 The manufacturing method of the above composite double-sided copper foil substrate is as follows: 1. Preparation of a single-sided copper-clad laminate 1 : mixing and dissolving each component required by an organic solvent to form a liquid dispersion of an insulating base film, which is produced by coating The device applies the liquid dispersion to the copper foil 11 to form the insulating base film 12, and the coated insulating base film is passed through an in-line drying oven to remove the contained organic solvent and solidify to prevent adhesion to each other during winding. And through the subsequent baking process to achieve the component reaction solidification, forming a glueless single-sided copper clad laminate 1; 2. Preparation of RCC copper foil substrate: an organic solvent is used to mix the required components to form a liquid dispersion of the insulating adhesive layer 22, and the liquid dispersion of the insulating adhesive layer is coated with a coating production device. On the rough side of the copper foil 21, it is baked by an on-line drying oven to remove the organic solvent contained therein, and the insulating adhesive layer is semi-flowed and semi-cured, and finally the release layer is coated on the insulating adhesive layer. Layer, form RCC copper foil substrate; Third, use glueless single-sided copper clad laminate 1 and RCC copper foil substrate, tear off the release layer of RCC copper foil substrate to obtain rubberized copper foil board 2, and glueless single-sided copper clad laminate 1 and the rubberized copper foil sheet 2 are thermocompression-bonded by a press machine (the insulating base film 12 and the insulating adhesive layer 22 are disposed adjacent to each other) and then cured to obtain a composite double-sided copper foil substrate, wherein the heat is obtained. The pressing temperature is controlled at 30~100 °C.
上述方法中，通過配方的調整，使絕緣基膜和絕緣粘結膠層達到接近的熱膨脹係數。 In the above method, the insulating base film and the insulating adhesive layer are brought to a close thermal expansion coefficient by the adjustment of the formulation.
本發明的製造方法在生產中張力容易控制，且可以連續生產，不必擔心中途換料而造成機器停機等問題，生產良率也比較高，良率達到90%以上。採用長度範圍100~1000m的無膠單面覆銅板進行熱壓合，實現連續量產。通過使用常用的無膠單面覆銅板和RCC銅箔基材複合結合後得到發明的複合式雙面銅箔基板，能夠滿足無膠雙面板特性需要，節約了生產成本，提高產品生產的良率，擴展了產品的使用範圍。 The manufacturing method of the invention is easy to control in production, and can be continuously produced, and does not have to worry about the machine shutdown caused by refueling in the middle, and the production yield is also relatively high, and the yield is over 90%. The non-adhesive single-sided copper clad laminate with a length range of 100~1000m is used for hot pressing to achieve continuous mass production. The composite double-sided copper foil substrate of the invention can be obtained by combining the conventional glueless single-sided copper clad laminate and the RCC copper foil substrate, thereby meeting the requirement of the non-rubber double panel characteristic, saving production cost and improving the yield of the product production. , expanding the scope of use of the product.
本發明的複合式雙面銅箔基板與現有技術的雙面銅箔基板的尺寸安定性測試結果如下表1：
上表1中，樣品1和2為本發明的複合式雙面銅箔基板；樣品3和樣品4為現有技術雙面銅箔基板。 In Table 1 above, Samples 1 and 2 are composite double-sided copper foil substrates of the present invention; Samples 3 and 4 are prior art double-sided copper foil substrates.
由表1資料顯示，本發明的複合式雙面銅箔基板具有優異的尺寸安定性和耐彎折性能，並具有遮色效果、高耐熱性和高反射率。 As shown in the data in Table 1, the composite double-sided copper foil substrate of the present invention has excellent dimensional stability and bending resistance, and has a color opaque effect, high heat resistance and high reflectance.
上述實施例僅為例示性說明本發明原理及其功效，而非用於限制本發明。本發明的權利保護範圍，應如權利要求書所列。 The above embodiments are merely illustrative of the principles of the invention and its advantages, and are not intended to limit the invention. The scope of protection of the invention should be as set forth in the claims.
1‧‧‧無膠單面覆銅板 1‧‧‧Uncoated single-sided copper clad laminate
2‧‧‧帶膠銅箔板 2‧‧‧With plastic copper foil board
11‧‧‧銅箔 11‧‧‧ copper foil
12‧‧‧絕緣基膜 12‧‧‧Insulation base film
21‧‧‧銅箔 21‧‧‧ copper foil
22‧‧‧絕緣粘結膠層 22‧‧‧Insulating adhesive layer
圖1為本發明的複合式雙面銅箔基板結構示意圖；圖2為本發明的複合式雙面銅箔基板的製作方法示意圖。 1 is a schematic structural view of a composite double-sided copper foil substrate according to the present invention; and FIG. 2 is a schematic view showing a manufacturing method of a composite double-sided copper foil substrate according to the present invention.
1‧‧‧無膠單面覆銅板 1‧‧‧Uncoated single-sided copper clad laminate
2‧‧‧帶膠銅箔板 2‧‧‧With plastic copper foil board
11‧‧‧銅箔 11‧‧‧ copper foil
12‧‧‧絕緣基膜 12‧‧‧Insulation base film
21‧‧‧銅箔 21‧‧‧ copper foil
22‧‧‧絕緣粘結膠層 22‧‧‧Insulating adhesive layer
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| CN105979704A (en) * | 2016-06-06 | 2016-09-28 | 苏州安洁科技股份有限公司 | High heat radiation printed circuit board welding technology based on double-layer aluminum |
| TWI865861B (en) * | 2022-03-25 | 2024-12-11 | 唐虞企業股份有限公司 | Signal transmission component assembly and circuit board component |
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| CN102794962A (en) * | 2012-08-29 | 2012-11-28 | 松扬电子材料(昆山)有限公司 | Composite double-sided copper foil substrate and manufacturing method thereof |
| CN103029375B (en) * | 2013-01-11 | 2016-04-13 | 松扬电子材料(昆山)有限公司 | Composite double-face copper foil substrate and manufacture method thereof |
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| CN105979704A (en) * | 2016-06-06 | 2016-09-28 | 苏州安洁科技股份有限公司 | High heat radiation printed circuit board welding technology based on double-layer aluminum |
| CN105979704B (en) * | 2016-06-06 | 2018-10-26 | 苏州安洁科技股份有限公司 | A kind of welding procedure based on the high heat elimination printed circuit board of the double-deck aluminium |
| TWI865861B (en) * | 2022-03-25 | 2024-12-11 | 唐虞企業股份有限公司 | Signal transmission component assembly and circuit board component |
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| CN102630126B (en) | 2014-04-16 |
| CN102630126A (en) | 2012-08-08 |
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