[go: up one dir, main page]

TW201348817A - Light emitting module - Google Patents

Light emitting module Download PDF

Info

Publication number
TW201348817A
TW201348817A TW101131995A TW101131995A TW201348817A TW 201348817 A TW201348817 A TW 201348817A TW 101131995 A TW101131995 A TW 101131995A TW 101131995 A TW101131995 A TW 101131995A TW 201348817 A TW201348817 A TW 201348817A
Authority
TW
Taiwan
Prior art keywords
light
optical coupling
coupling member
emitting diode
emitting
Prior art date
Application number
TW101131995A
Other languages
Chinese (zh)
Inventor
Che-Ming Chang
Min-Chieh Hu
Original Assignee
Gio Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gio Optoelectronics Corp filed Critical Gio Optoelectronics Corp
Priority to TW101131995A priority Critical patent/TW201348817A/en
Publication of TW201348817A publication Critical patent/TW201348817A/en

Links

Landscapes

  • Planar Illumination Modules (AREA)

Abstract

A light emitting module includes at least one light emitting diode (LED) and a light guiding structure. The LED emits light. The light guiding structure is disposed opposite to the LED and includes an optical coupling element, a light guiding film and a transparent connecting element. At least part of light from the light emitting diode emits into the optical coupling element. The light guiding film is disposed opposite to the optical coupling element. The light guiding structure is disposed on the boundary between the optical coupling element and the light guiding film. Light emits into the light optical coupling element, at least part of it is through the transparent connected element to enter the light guiding film.

Description

發光模組 Light module

本發明係關於一種發光模組,特別是有關於一種可薄型化之發光模組。 The invention relates to a light-emitting module, in particular to a light-emitting module which can be thinned.

發光二極體是一種由半導體材料製作而成的發光元件,具有耗電量低、元件壽命長、反應速度快等優點,再加上體積小容易製成極小或陣列式元件的特性,因此近年來隨著技術不斷地進步,其應用範圍也由指示燈、背光源甚至擴大到了照明領域。 The light-emitting diode is a light-emitting element made of a semiconductor material, and has the advantages of low power consumption, long component life, fast reaction speed, and the like, and the small size is easy to be made into a very small or array type component. As technology continues to advance, its range of applications has expanded from indicator lights and backlights to lighting.

請參照圖1所示,其係為習知顯示裝置之發光模組的部份剖面示意圖。發光模組1係一側邊入光式背光模組,其主要包括至少一發光二極體11、一導光板12與一電路板13。發光二極體11係具有一發光二極體晶粒111,發光二極體11及部分導光板12係設置於電路板13上,導光板12係鄰設於發光二極體11之出光面112,以利發光二極體11所發出之光線進入至導光板12,再藉由導光板12導引光線,進而提供均勻的亮度及光線予顯示裝置之面板。 Please refer to FIG. 1 , which is a partial cross-sectional view of a light emitting module of a conventional display device. The light-emitting module 1 is a light-emitting backlight module, which mainly includes at least one light-emitting diode 11, a light guide plate 12 and a circuit board 13. The light-emitting diode 11 has a light-emitting diode die 111. The light-emitting diode 11 and a portion of the light guide plate 12 are disposed on the circuit board 13. The light guide plate 12 is disposed adjacent to the light-emitting surface 112 of the light-emitting diode 11. The light emitted by the LED 11 enters the light guide plate 12, and then guides the light through the light guide plate 12, thereby providing uniform brightness and light to the panel of the display device.

隨著顯示裝置的日益薄型化,發光模組1的厚度也需隨之縮減,因而所採用之導光板12的厚度也不斷地減少。然而,目前利用射出製程而產出的導光板12,其射出的厚度極限約為0.4~0.5毫米,且受到發光二極體11元件之 封裝結構中,側光式的發光二極體11,其導線架高度可能已大於導光板12的厚度。故使得於現今技術中,無法再減少導光板12的厚度,俾使得顯示裝置的薄型化受到考驗。 As the display device is increasingly thinner, the thickness of the light-emitting module 1 also needs to be reduced, and the thickness of the light guide plate 12 used is also continuously reduced. However, the light guide plate 12 which is currently produced by the injection process has a thickness limit of about 0.4 to 0.5 mm and is exposed to the components of the light-emitting diode 11 . In the package structure, the edge-type light-emitting diode 11 may have a lead frame height greater than the thickness of the light guide plate 12. Therefore, in the prior art, the thickness of the light guide plate 12 can no longer be reduced, and the thickness of the display device is tested.

因此,如何提供一種發光模組,可降低導光結構的厚度,以使得顯示裝置更加薄型化,另外,更可提升發光二極體所發出之光線進入導光結構的光線量,確保發光模組的發光品質,已成為當前重要課題。 Therefore, how to provide a light-emitting module can reduce the thickness of the light-guiding structure, so that the display device is thinner, and the amount of light emitted by the light-emitting diode into the light-guiding structure can be increased to ensure the light-emitting module. The quality of light has become an important issue at present.

有鑑於上述課題,本發明之目的為提供一種發光模組,可降低導光結構的厚度,更可提升發光二極體所發出之光線進入導光結構的光線量。 In view of the above problems, an object of the present invention is to provide a light-emitting module, which can reduce the thickness of the light-guiding structure and increase the amount of light that the light emitted by the light-emitting diode enters the light-guiding structure.

為達上述目的,依據本發明之一種發光模組包含至少一發光二極體以及一導光結構。發光二極體發出一光線。導光結構與發光二極體相對設置,導光結構包含一光耦合件、一導光膜片及一透光連結件。至少部分光線由發光二極體入射光耦合件。導光膜片係對應光耦合件設置。透光連結件設置於光耦合件及導光膜片之一交界處。其中入射光耦合件的光線,至少部分經由透光連結件,而入射導光膜片。 To achieve the above objective, a light emitting module according to the present invention comprises at least one light emitting diode and a light guiding structure. The light emitting diode emits a light. The light guiding structure is disposed opposite to the light emitting diode, and the light guiding structure comprises an optical coupling member, a light guiding film and a light transmitting connecting member. At least a portion of the light is incident on the optical coupling by the light emitting diode. The light guiding film is disposed corresponding to the optical coupling. The light-transmitting connecting member is disposed at a boundary of one of the optical coupling member and the light guiding film. The light incident on the light coupling member enters the light guiding film at least partially via the light transmitting connecting member.

在一實施例中,透光連結件係為一膠體。 In one embodiment, the light transmissive link is a gel.

在一實施例中,透光連結件係填補光耦合件與導光膜片之間的縫隙。 In an embodiment, the light-transmissive link fills a gap between the optical coupling member and the light-guiding film.

在一實施例中,透光連結件係平滑化光耦合件與導光膜片交界處之一段差。 In one embodiment, the light-transmissive link is a step that smoothes the intersection of the optical coupling and the light-guiding film.

在一實施例中,導光膜片之厚度係小於發光二極體之一出光面的高度。 In one embodiment, the thickness of the light guiding film is less than the height of one of the light emitting surfaces of the light emitting diode.

在一實施例中,導光結構之鄰近發光二極體之一側具有一第一高度,遠離發光二極體之一側具有一第二高度,第一高度係大於第二高度。又,第一高度係大於等於發光二極體之一出光面的高度。 In one embodiment, a side of the light guiding structure adjacent to the light emitting diode has a first height, and a side away from the side of the light emitting diode has a second height, and the first height is greater than the second height. Further, the first height is greater than or equal to the height of one of the light-emitting surfaces of the light-emitting diode.

在一實施例中,第一高度的範圍為0.4毫米至1.0毫米。第二高度的範圍為0.05毫米至0.35毫米。 In an embodiment, the first height ranges from 0.4 mm to 1.0 mm. The second height ranges from 0.05 mm to 0.35 mm.

在一實施例中,光耦合件係為一導光板,且鄰近發光二極體之一側具有一膨大部。 In one embodiment, the optical coupling member is a light guide plate and has an enlarged portion on a side adjacent to the light emitting diode.

在一實施例中,光耦合件係為一部分楔形導光板。 In an embodiment, the optical coupling is a portion of a wedge shaped light guide.

在一實施例中,導光結構更包含一定位片,其係連接光耦合件及導光膜片。其中,定位片係為一反射片。 In an embodiment, the light guiding structure further comprises a positioning piece, which is connected to the optical coupling component and the light guiding film. Wherein, the positioning piece is a reflection piece.

在一實施例中,光耦合件係為一透鏡,透鏡設置於導光膜片鄰近於發光二極體之一側。 In one embodiment, the optical coupling member is a lens disposed on a side of the light guiding film adjacent to the light emitting diode.

在一實施例中,光耦合件係具有一反射面及一光耦合面,光耦合件藉由光耦合面而與導光膜片耦接,至少部分光線經由反射面及光耦合面入射導光膜片。反射面與光耦合面之間具有一夾角,夾角係小於等於45度。 In one embodiment, the optical coupling member has a reflecting surface and a light coupling surface, and the optical coupling member is coupled to the light guiding film by the light coupling surface, and at least part of the light is incident on the light guiding surface and the light coupling surface. Diaphragm. There is an angle between the reflecting surface and the light coupling surface, and the angle is less than or equal to 45 degrees.

在一實施例中,光耦合件係具有一反射面,光線經由反射面入射導光膜片。 In an embodiment, the optical coupling member has a reflecting surface, and the light is incident on the light guiding film via the reflecting surface.

在一實施例中,光耦合件更具有一輔助成型件,輔助 成型件具有一容置部,光耦合件係容置於容置部。 In an embodiment, the optical coupling member further has an auxiliary molding member for assisting The molded part has a receiving portion, and the optical coupling member is accommodated in the receiving portion.

在一實施例中,當發光二極體為複數時,該等發光二極體係設置於導光結構之一側邊。 In one embodiment, when the light emitting diodes are plural, the light emitting diode systems are disposed on one side of the light guiding structure.

在一實施例中,發光模組更包含一電路板,其連接發光二極體及導光結構。 In an embodiment, the light emitting module further comprises a circuit board connected to the light emitting diode and the light guiding structure.

承上所述,本發明之發光模組的發光二極體係發出光線並入射導光結構,其中至少部分入射導光結構之光耦合件的光線,係經由透光連結件入射至導光膜片。由於透光連結件係連接光耦合件與導光膜片,使得光耦合件藉由透光連結件可較佳地將發光二極體的光線入射導光膜片內。另外,本發明之導光結構的導光膜片較習知的導光板薄,俾使得應用於顯示裝置或其他發光裝置時,整體可更為薄型化。 As described above, the light-emitting diode system of the light-emitting module of the present invention emits light and enters the light-guiding structure, wherein at least part of the light of the light-coupling member incident on the light-guiding structure is incident on the light-guiding film via the light-transmitting connecting member. . Since the light-transmitting connecting member connects the optical coupling member and the light guiding film, the light coupling member can preferably illuminate the light of the light-emitting diode into the light guiding film by the light-transmitting connecting member. Further, the light guiding film of the light guiding structure of the present invention is thinner than the conventional light guiding plate, and when applied to a display device or other light emitting device, the overall thickness can be made thinner.

以下將參照相關圖式,說明依本發明較佳實施例之發光模組,其中相同的元件將以相同的參照符號加以說明。須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。 Hereinafter, a light-emitting module according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals. It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered.

發光模組包含至少一發光二極體以及一導光結構。發光二極體發出一光線。發光模組係例如應用於一顯示裝置,以提供光源予一面板;或者發光模組可作為照明裝置的光源,或是其他電子裝置的光源。導光結構係與發光二極體相對設置,其中導光結構包含一光耦合件、一導光膜片及一透光連結件。至少部分光線由發光二極體入射光耦合件。導光膜片係對應光耦合件設置。透光連結件設置於光耦合件及導光膜片之一交界處。值得說明的是,入射光耦合件的光線,至少部分經由透光連結件,而入射導光膜片。以下係以複數實施例及其變化態樣具體說明本發明內容。 The light emitting module includes at least one light emitting diode and a light guiding structure. The light emitting diode emits a light. The light-emitting module is applied, for example, to a display device to provide a light source to a panel; or the light-emitting module can be used as a light source of the illumination device or a light source of other electronic devices. The light guiding structure is disposed opposite to the light emitting diode, wherein the light guiding structure comprises an optical coupling member, a light guiding film and a light transmitting connecting member. At least a portion of the light is incident on the optical coupling by the light emitting diode. The light guiding film is disposed corresponding to the optical coupling. The light-transmitting connecting member is disposed at a boundary of one of the optical coupling member and the light guiding film. It should be noted that the light incident on the light coupling member is incident on the light guiding film at least partially via the light transmitting connecting member. The present invention is specifically described below in the plural embodiments and variations thereof.

第一實施例 First embodiment

圖2A為本發明第一實施例之一種發光模組的剖面圖,圖2B為圖2A之發光模組的示意圖。發光模組2包含至少一發光二極體3以及一導光結構4。本發明之發光模組2係例如應用於一顯示裝置,且發光模組2係為一側光式背光模組,以提供一均勻光源予一顯示面板。 2A is a cross-sectional view of a light emitting module according to a first embodiment of the present invention, and FIG. 2B is a schematic view of the light emitting module of FIG. 2A. The light emitting module 2 includes at least one light emitting diode 3 and a light guiding structure 4 . The light-emitting module 2 of the present invention is applied to, for example, a display device, and the light-emitting module 2 is a one-side light-type backlight module to provide a uniform light source to a display panel.

本實施例之發光模組2係具有複數發光二極體3,該等發光二極體3係排列設置於導光結構4之一側邊(如圖2B所示)。其中,發光二極體3設置的數量並非限定於本發明,且排列的方式可為一維排列或是二維排列,圖2B中該等發光二極體3係以一維排列為例。發光二極體3係具有一發光二極體晶粒31,且發光二極體3係為一側光式(side-view)的表面安裝元件。當然,發光二極體3也可 以是一裸晶設置於一電路板上;或者,發光二極體3更可為一有機發光二極體(OLED)。 The light-emitting module 2 of the present embodiment has a plurality of light-emitting diodes 3 arranged in a side of one side of the light-guiding structure 4 (as shown in FIG. 2B). The number of the LEDs 3 is not limited to the present invention, and the arrangement may be one-dimensional or two-dimensional. In FIG. 2B, the LEDs are exemplified by a one-dimensional arrangement. The light-emitting diode 3 has a light-emitting diode die 31, and the light-emitting diode 3 is a side-view surface mount component. Of course, the LED 3 can also be Therefore, a die is disposed on a circuit board; or, the LED 3 is more preferably an organic light emitting diode (OLED).

導光結構4係與發光二極體3相對設置,更詳細來說,導光結構4係設置於發光二極體3的出光面32的一側,以使發光二極體3所發出之光線射入導光結構4內。 The light guiding structure 4 is disposed opposite to the light emitting diode 3, and more specifically, the light guiding structure 4 is disposed on one side of the light emitting surface 32 of the light emitting diode 3 so that the light emitted by the light emitting diode 3 is emitted. The light is injected into the light guiding structure 4.

導光結構4包含一光耦合件41、一導光膜片(Light Guiding Film,LGF)42及一透光連結件43。光耦合件41係與發光二極體3對應設置,發光二極體3發出的部分光線係入射光耦合件41。本實施例之光耦合元件41係例如為一透鏡,透鏡係設置於導光膜片42鄰近發光二極體3之一側。另外,本實施例之光耦合件41係具有一反射面411及一光耦合面412,光耦合件41係藉由光耦合面412而與導光膜片42耦接,且至少部分光線係經由反射面411反射至光耦合面412,再由光耦合面412出射進而入射導光膜片42。反射面411與光耦合面412之間具有一夾角,夾角係小於等於45度。 The light guiding structure 4 includes a light coupling member 41, a light guiding film (LGF) 42 and a light transmitting connecting member 43. The light coupling member 41 is disposed corresponding to the light emitting diode 3, and part of the light emitted from the light emitting diode 3 is incident on the light coupling member 41. The optical coupling element 41 of the present embodiment is, for example, a lens disposed on one side of the light guiding film 42 adjacent to the light emitting diode 3. In addition, the optical coupling member 41 of the present embodiment has a reflecting surface 411 and a light coupling surface 412. The optical coupling member 41 is coupled to the light guiding film 42 by the light coupling surface 412, and at least part of the light is passed through The reflecting surface 411 is reflected to the light coupling surface 412, and is emitted from the light coupling surface 412 to enter the light guiding film 42. The reflecting surface 411 has an angle with the light coupling surface 412, and the angle is less than or equal to 45 degrees.

導光膜片42係對應光耦合件41設置,導光膜片42的厚度係小於發光二極體3之出光面32的高度。本實施例之導光膜片42的厚度之範圍例如為0.15至0.25毫米。 The light guiding film 42 is disposed corresponding to the light coupling member 41, and the thickness of the light guiding film 42 is smaller than the height of the light emitting surface 32 of the light emitting diode 3. The thickness of the light guiding film 42 of the present embodiment ranges, for example, from 0.15 to 0.25 mm.

透光連結件43係設置於光耦合件41及導光膜片42之一交界處。透光連結件43係為一膠體,以填補光耦合件41與導光膜片42之間的縫隙,另外,藉由透光連結件43以平滑化光耦合件41與導光膜片42交界處之一段差。值得說明的是,透光連結件43與光耦合件41及導光膜片 42的接面之處必須較為平滑,以防止光線射出,而有漏光的情形產生。 The light-transmitting connecting member 43 is disposed at a boundary of one of the optical coupling member 41 and the light guiding film 42. The light-transmitting connecting member 43 is a colloid to fill the gap between the optical coupling member 41 and the light guiding film 42 , and the light-transmitting connecting member 43 is used to smooth the optical coupling member 41 and the light guiding film 42 . One of the sections is poor. It should be noted that the light-transmitting connecting member 43 and the optical coupling member 41 and the light guiding film The junction of 42 must be relatively smooth to prevent light from being emitted, and light leakage occurs.

由圖2A可看出,導光結構4之鄰近發光二極體3之一側具有一第一高度H1,而導光結構4遠離發光二極體3之一側係具有一第二高度H2,第一高度H1係大於第二高度H2,本實施例之第一高度H1的範圍係為0.4毫米至0.65毫米,而第二高度H2的範圍係為0.15至0.25毫米。更詳細來說,導光結構4的第一高度H1係大於或等於發光二極體3之一出光面32的高度,以使發光二極體3的發出的光線可直接進入導光結構4內,接著光線再由導光結構4的出光面E射出。藉由導光結構4導引該等發光二極體3所發出之光線的方向,以提供顯示面板一個亮度均勻的背光源。而顯示面板,則可設置於第二高度H2的區域,以減少整個顯示裝置的厚度。 As can be seen from FIG. 2A, one side of the light guiding structure 4 adjacent to the light emitting diode 3 has a first height H 1 , and the side of the light guiding structure 4 away from the light emitting diode 3 has a second height H. 2 , the first height H 1 is greater than the second height H 2 , the first height H 1 of the embodiment ranges from 0.4 mm to 0.65 mm, and the second height H 2 ranges from 0.15 to 0.25 mm. In more detail, the first height H 1 of the light guiding structure 4 is greater than or equal to the height of one of the light emitting surfaces 32 of the light emitting diode 3, so that the emitted light of the light emitting diode 3 can directly enter the light guiding structure 4 Then, the light is then emitted from the light exit surface E of the light guiding structure 4. The direction of the light emitted by the light-emitting diodes 3 is guided by the light guiding structure 4 to provide a uniform brightness of the display panel. The display panel can be disposed in the area of the second height H 2 to reduce the thickness of the entire display device.

另外,本實施例之發光模組2更包含一電路板5,係連接發光二極體3及導光結構4,該等發光二極體3係電性連結於電路板5,並且被電路板5所驅動,而導光結構4則有一部分設置於電路板5。 In addition, the light-emitting module 2 of the present embodiment further includes a circuit board 5 that is connected to the light-emitting diode 3 and the light-guiding structure 4, and the light-emitting diodes 3 are electrically connected to the circuit board 5 and are used by the circuit board. 5 is driven, and a part of the light guiding structure 4 is disposed on the circuit board 5.

第二實施例 Second embodiment

請同時參照圖3A及圖3B所示,其中圖3A為本發明第二實施例之發光模組的剖面圖,圖3B為圖3A之發光模組的示意圖。本實施例之發光模組2a與發光模組2不同之處在於,本實施例之發光模組2a係未設置電路板,而且部分導光結構4a係嵌合於發光二極體3a,並連接發光二極 體3a之殼體33,於此係以導光結構4a中的光耦合件41a嵌合於發光二極體3a為例。藉此,發光二極體3a與導光結構4a的連接態樣可如第一實施例係以電路板5連接發光二極體3與導光結構4,或如本實施例係將導光結構4a嵌合設置於發光二極體3a之殼體33,其非限定於本發明。其中,本實施例之導光膜片42及透光連結件43與上述實施例之中,導光膜片42及透光連結件43具有相同的技術特徵,故於此不再贅述。 3A and FIG. 3B, FIG. 3A is a cross-sectional view of a light emitting module according to a second embodiment of the present invention, and FIG. 3B is a schematic view of the light emitting module of FIG. 3A. The light-emitting module 2a of the present embodiment is different from the light-emitting module 2 in that the light-emitting module 2a of the present embodiment is not provided with a circuit board, and part of the light-guiding structure 4a is fitted to the light-emitting diode 3a and connected. Luminous dipole The case 33 of the body 3a is exemplified by the fact that the light coupling member 41a in the light guiding structure 4a is fitted to the light emitting diode 3a. Thereby, the connection state of the light-emitting diode 3a and the light-guiding structure 4a can be connected to the light-emitting diode 3 and the light-guiding structure 4 by the circuit board 5 as in the first embodiment, or the light-guiding structure as in the embodiment 4a is fitted to the casing 33 of the light-emitting diode 3a, which is not limited to the present invention. The light guiding film 42 and the light transmitting connecting member 43 of the present embodiment have the same technical features as the light guiding film 42 and the light transmitting connecting member 43 in the above embodiment, and thus will not be described again.

第三實施例 Third embodiment

請參照圖4A及圖4B所示,其中圖4A為本發明第三實施例之發光模組的剖面圖,圖4B為圖4A之發光模組的示意圖。發光模組2b包含至少一發光二極體3以及一導光結構4b。其中,發光二極體3與上述實施例之中,發光二極體3具有相同的技術特徵,故於此不再贅述。 4A and FIG. 4B, FIG. 4A is a cross-sectional view of a light-emitting module according to a third embodiment of the present invention, and FIG. 4B is a schematic view of the light-emitting module of FIG. 4A. The light emitting module 2b includes at least one light emitting diode 3 and a light guiding structure 4b. The light-emitting diode 3 and the above-described embodiment have the same technical features as the light-emitting diode 3, and thus will not be described again.

本實施例之發光模組2b與發光模組2不同之處在於,導光結構4b係包含一光耦合件41b、一導光膜片42、一透光連結件43b及一輔助成型件44。 The light-emitting module 2b of the present embodiment is different from the light-emitting module 2 in that the light-guiding structure 4b includes an optical coupling member 41b, a light guiding film 42, a light-transmitting connecting member 43b, and an auxiliary molding member 44.

本實施例之輔助成型件44係例如為一膜片,以熱塑成型之方式形成。輔助成型件44具有一容置部441,其係例如為一空腔。本實施例係以一容置部441與一發光二極體3對應設置,其中,容置部441的形狀及大小並非限定於本發明,於其他實施例中,更可調整容置部441的尺寸,例如以一容置部441與複數發光二極體3對應設置。 The auxiliary molding 44 of the present embodiment is, for example, a diaphragm formed by thermoplastic molding. The auxiliary molding 44 has a receiving portion 441 which is, for example, a cavity. In this embodiment, the accommodating portion 441 is disposed corresponding to the illuminating diode 3, and the shape and size of the accommodating portion 441 are not limited to the present invention. In other embodiments, the accommodating portion 441 can be further adjusted. The size is, for example, provided in correspondence with the plurality of light-emitting diodes 3 by a housing portion 441.

光耦合件41b係容置於輔助成型件44之容置部441 內,對應發光二極體3設置,且其尺寸大致上與容置部441相同。本實施例之光耦合件41b係為透明固態膠體,例如為環氧樹脂或矽膠等。光耦合件41b具有一反射面411b,發光二極體3射出之光線經由反射面441入射至導光膜片42。 The optical coupling member 41b is received in the receiving portion 441 of the auxiliary molding 44. The corresponding light-emitting diode 3 is disposed, and its size is substantially the same as that of the accommodating portion 441. The optical coupling member 41b of this embodiment is a transparent solid colloid, such as epoxy resin or silicone rubber. The light coupling member 41b has a reflecting surface 411b, and the light emitted from the light emitting diode 3 is incident on the light guiding film 42 via the reflecting surface 441.

第四實施例 Fourth embodiment

請參照圖5所示,其為本發明第四實施例之發光模組的剖面圖。發光模組2c包含至少一發光二極體3以及一導光結構4c。其中,發光二極體3與上述實施例之中的發光二極體3具有相同的技術特徵,故於此不再贅述。 Please refer to FIG. 5, which is a cross-sectional view of a light emitting module according to a fourth embodiment of the present invention. The light emitting module 2c includes at least one light emitting diode 3 and a light guiding structure 4c. The light-emitting diode 3 has the same technical features as the light-emitting diode 3 in the above embodiment, and thus will not be described again.

本實施例之發光模組2c與發光模組2不同之處在於,導光結構4c係包含一光耦合件41c、一導光膜片42及一透光連結件43。本實施例之光耦合件41c係為一導光板,更詳細來說,光耦合件41c係為一部分楔形導光板(partial wedged LGP),光耦合件41c於鄰近發光二極體3之一側具有一膨大部413,而膨大部413具有一第一高度H1;導光膜片42則具有一第二高度H2,第一高度H1係大於第二高度H2。第一高度H1係大於第二高度H2,本實施例之第一高度H1的範圍係為0.4毫米至0.65毫米,而第二高度H2的範圍係為0.15至0.25毫米。 The light-emitting module 2c of the present embodiment is different from the light-emitting module 2 in that the light-guiding structure 4c includes an optical coupling member 41c, a light guiding film 42 and a light-transmitting connecting member 43. The optical coupling member 41c of the present embodiment is a light guide plate. In more detail, the optical coupling member 41c is a part of a wedge-shaped light guide plate (GGP), and the optical coupling member 41c has a side adjacent to the light-emitting diode 3 An enlarged portion 413 has a first height H 1 ; the light guiding film 42 has a second height H 2 , and the first height H 1 is greater than the second height H 2 . The first height H 1 is greater than the second height H 2 , and the first height H 1 of the present embodiment ranges from 0.4 mm to 0.65 mm, and the second height H 2 ranges from 0.15 to 0.25 mm.

本實施例之導光結構4c更包含一定位片45,係連接光耦合件41c及導光膜片42。定位片45係例如為一反射片。另外,定位片45的大小及尺寸係未限定於本發明。透光連結件43係設置於光耦合件41c及導光膜片42之 間,以使光線自光耦合件41c入射導光膜片42。定位片45之兩側係以膠合之方式黏設於光耦合件41c與導光膜片42,藉此連接光耦合件41c及導光膜片42,且承載透光連結件43。 The light guiding structure 4c of the embodiment further includes a positioning piece 45 for connecting the optical coupling member 41c and the light guiding film 42. The positioning piece 45 is, for example, a reflection sheet. Further, the size and size of the positioning piece 45 are not limited to the present invention. The light-transmitting connecting member 43 is disposed on the optical coupling member 41c and the light guiding film 42 In between, light is incident on the light guiding film 42 from the optical coupling 41c. The two sides of the positioning piece 45 are glued to the optical coupling member 41c and the light guiding film 42 to connect the optical coupling member 41c and the light guiding film 42 and carry the light transmitting connecting member 43.

第五實施例 Fifth embodiment

請參照圖6A所示,其為本發明第五實施例之發光模組的剖面圖。發光模組2d包含至少一發光二極體3b以及一導光結構4d。其中,發光二極體3b本身的結構與上述第二實施例之中的發光二極體3a具有相同的技術特徵,而本實施例之導光膜片42及透光連結件43與上述實施例之中之導光膜片42及透光連結件43,具有相同的技術特徵,故於此不再贅述。 Please refer to FIG. 6A, which is a cross-sectional view of a light emitting module according to a fifth embodiment of the present invention. The light emitting module 2d includes at least one light emitting diode 3b and a light guiding structure 4d. The structure of the light-emitting diode 3b itself has the same technical features as the light-emitting diode 3a of the second embodiment, and the light-guiding film 42 and the light-transmitting connecting member 43 of the present embodiment are the same as the above embodiment. The light guiding film 42 and the light transmitting connecting member 43 have the same technical features, and thus will not be described again.

本實施例之發光模組2d與發光模組2a不同之處在於,本實施例之發光模組2d係以導光結構4d中具有二對稱的光耦合件41d且藉由另一透光連結件43而對稱設置於導光膜片42上。其中,該等光耦合件41d、透光連結件43以及導光膜片42係直接與發光二極體3b連結。藉此,導光膜片42可直接對應於發光二極體晶粒31b及發光二極體3b的中心處,而發光二極體3b的發出最亮的光線部份(中心處)可直接入射導光結構4d之導光膜片42內,提升發光二極體3b所發出之光線進入導光膜片42的光線量,而其他部分入射導光結構4d之光耦合件41d的光線,經由透光連結件43入射至導光膜片42,以提高光線利用率。 The illuminating module 2d of the present embodiment is different from the illuminating module 2a in that the illuminating module 2d of the present embodiment has two symmetrical optical coupling members 41d in the light guiding structure 4d and another light transmitting connecting member. 43 is symmetrically disposed on the light guiding film 42. The optical coupler 41d, the light-transmitting link 43, and the light-guiding film 42 are directly coupled to the light-emitting diode 3b. Thereby, the light guiding film 42 can directly correspond to the center of the light emitting diode die 31b and the light emitting diode 3b, and the light emitting portion (center) of the light emitting diode 3b can be directly incident. In the light guiding film 42 of the light guiding structure 4d, the amount of light emitted by the light emitting diode 3b into the light guiding film 42 is increased, and the light of the other portion of the light coupling member 41d incident on the light guiding structure 4d passes through The light link 43 is incident on the light guiding film 42 to improve light utilization.

另外,導光結構中可具有對稱的光耦合件,其實施方式亦可如圖6B所示,圖6B為圖6A所示之發光模組另一實施態樣的剖面圖。其中,發光模組2e係與導光結構4e的光耦合件41e直接連接,例如是光耦合件41e具有一凹部,導光結構4e嵌合在光耦合件41e的凹部中。藉此,發光二極體3b的所發出的全部光線可入射至導光結構4e之光耦合件41e,並經由透光連結件43入射至導光膜片42,而導光膜片42亦直接對應於發光二極體晶粒31b及發光二極體3b的中心處,同樣具有提升發光二極體3b所發出之光線進入導光膜片42的光線量,而其他部分入射導光結構4e之光耦合件41e的光線,經由透光連結件43入射至導光膜片42,以提高光線利用率。 In addition, the light guiding structure may have a symmetrical optical coupling member, and the embodiment thereof may also be as shown in FIG. 6B. FIG. 6B is a cross-sectional view showing another embodiment of the light emitting module shown in FIG. 6A. The light-emitting module 2e is directly connected to the light-coupling member 41e of the light-guiding structure 4e. For example, the light-coupling member 41e has a concave portion, and the light-guiding structure 4e is fitted in the concave portion of the optical coupling member 41e. Thereby, all the light emitted by the light-emitting diode 3b can be incident on the light coupling member 41e of the light guiding structure 4e, and is incident on the light guiding film 42 via the light-transmitting connecting member 43, and the light guiding film 42 is also directly Corresponding to the center of the light-emitting diode die 31b and the light-emitting diode 3b, the same amount of light that the light emitted from the light-emitting diode 3b enters the light-guiding film 42 is obtained, and the other portion is incident on the light-guiding structure 4e. The light of the optical coupling member 41e is incident on the light guiding film 42 via the light-transmitting connecting member 43 to improve the light utilization efficiency.

綜上所述,本發明之發光模組的發光二極體係發出光線並入射導光結構,其中至少部分入射導光結構之光耦合件的光線,係經由透光連結件入射至導光膜片。由於透光連結件係連接光耦合件與導光膜片,使得光耦合件藉由透光連結件可較佳地將發光二極體的光線入射導光膜片內。另外,本發明之導光結構的導光膜片較習知的導光板薄,俾使得應用於顯示裝置或其他發光裝置時,整體可更為薄型化。 In summary, the light emitting diode system of the light emitting module of the present invention emits light and enters the light guiding structure, wherein at least part of the light of the light coupling member incident on the light guiding structure is incident on the light guiding film via the light transmitting connecting member. . Since the light-transmitting connecting member connects the optical coupling member and the light guiding film, the light coupling member can preferably illuminate the light of the light-emitting diode into the light guiding film by the light-transmitting connecting member. Further, the light guiding film of the light guiding structure of the present invention is thinner than the conventional light guiding plate, and when applied to a display device or other light emitting device, the overall thickness can be made thinner.

本發明之導光結構的厚度與習知技術相比,更為薄型化,以可廣泛應用於輕薄的顯示裝置,另外,本發明之發光模組係可提升發光二極體所發出之光線進入導光結構的光線量,確保發光模組的發光功效。 The thickness of the light guiding structure of the present invention is thinner than that of the prior art, and can be widely applied to a thin and light display device. In addition, the light emitting module of the present invention can enhance the light entering by the light emitting diode. The amount of light in the light guiding structure ensures the luminous efficacy of the light emitting module.

以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1、2、2a、2b、2c、2d‧‧‧發光模組 1, 2, 2a, 2b, 2c, 2d‧‧‧ lighting modules

11、3、3a、3b‧‧‧發光二極體 11, 3, 3a, 3b‧‧‧Lighting diodes

111、31、31b‧‧‧發光二極體晶粒 111, 31, 31b‧‧‧Light-emitting diode grains

112、32、E‧‧‧出光面 112, 32, E‧‧‧ shiny surface

12‧‧‧導光板 12‧‧‧Light guide plate

13、5‧‧‧電路板 13, 5‧‧‧ circuit board

33、33b‧‧‧殼體 33, 33b‧‧‧ shell

4、4a、4b、4c、4d、4e‧‧‧導光結構 4, 4a, 4b, 4c, 4d, 4e‧‧‧ light guiding structure

41、41a、41b、41c、41d、41e‧‧‧光耦合件 41, 41a, 41b, 41c, 41d, 41e‧‧‧ optical coupling

411、411b‧‧‧反射面 411, 411b‧‧‧reflecting surface

412‧‧‧光耦合面 412‧‧‧Light coupling surface

413‧‧‧膨大部 413‧‧‧Expanded

42‧‧‧導光膜片 42‧‧‧Light guide diaphragm

43、43b‧‧‧透光連結件 43, 43b‧‧‧Light connection

44‧‧‧輔助成型件 44‧‧‧Auxiliary molded parts

441‧‧‧容置部 441‧‧‧ 容 部

45‧‧‧定位片 45‧‧‧ Positioning film

H1‧‧‧第一高度 H 1 ‧‧‧first height

H2‧‧‧第二高度 H 2 ‧‧‧second height

圖1為習知顯示裝置之發光模組的部份剖面圖;圖2A為本發明第一實施例之一種發光模組的剖面圖;圖2B為圖2A之發光模組的示意圖;圖3A為本發明第二實施例之發光模組的剖面圖;圖3B為圖3A之發光模組的示意圖;圖4A為本發明第三實施例之發光模組的剖面圖;圖4B為圖4A之發光模組的示意圖;圖5為本發明第四實施例之發光模組的剖面圖;圖6A為本發明第五實施例之發光模組的剖面圖;以及圖6B為圖6A所示之發光模組另一實施態樣的剖面圖。 1 is a partial cross-sectional view of a light emitting module of a conventional display device; FIG. 2A is a cross-sectional view of a light emitting module according to a first embodiment of the present invention; FIG. 2B is a schematic view of the light emitting module of FIG. 2A; FIG. 3B is a cross-sectional view of the light emitting module of the third embodiment of the present invention; FIG. 4B is a cross-sectional view of the light emitting module of the third embodiment of the present invention; Figure 5 is a cross-sectional view of a light-emitting module according to a fourth embodiment of the present invention; Figure 6A is a cross-sectional view of a light-emitting module according to a fifth embodiment of the present invention; and Figure 6B is a light-emitting mode shown in Figure 6A. A cross-sectional view of another embodiment of the set.

2‧‧‧發光模組 2‧‧‧Lighting module

3‧‧‧發光二極體 3‧‧‧Lighting diode

31‧‧‧發光二極體晶粒 31‧‧‧Light-emitting diode grains

32、E‧‧‧出光面 32. E‧‧‧Glossy

4‧‧‧導光結構 4‧‧‧Light guiding structure

41‧‧‧光耦合件 41‧‧‧Optical coupling

411‧‧‧反射面 411‧‧‧reflecting surface

412‧‧‧光耦合面 412‧‧‧Light coupling surface

42‧‧‧導光膜片 42‧‧‧Light guide diaphragm

43‧‧‧透光連結件 43‧‧‧Light connecting parts

5‧‧‧電路板 5‧‧‧Circuit board

H1‧‧‧第一高度 H 1 ‧‧‧first height

H2‧‧‧第二高度 H 2 ‧‧‧second height

Claims (20)

一種發光模組,包含:至少一發光二極體,並發出一光線;以及一導光結構,其與該發光二極體相對設置,且包含:一光耦合件,至少部分該光線由該發光二極體入射該光耦合件;一導光膜片,對應該光耦合件設置;及一透光連結件,設置於該光耦合件及該導光膜片之一交界處,其中入射該光耦合件的光線,至少部分經由該透光連結件,而入射該導光膜片。 A light-emitting module comprising: at least one light-emitting diode and emitting a light; and a light-guiding structure disposed opposite to the light-emitting diode, and comprising: an optical coupling member, at least part of the light being emitted by the light-emitting diode a diode is incident on the optical coupling member; a light guiding film is disposed corresponding to the optical coupling member; and a light transmitting connecting member is disposed at a boundary of the optical coupling member and the light guiding film, wherein the light is incident The light of the coupling member is incident on the light guiding film at least partially via the light transmitting connecting member. 如申請專利範圍第1項所述之發光模組,其中該透光連結件係為一膠體。 The light-emitting module of claim 1, wherein the light-transmitting connector is a colloid. 如申請專利範圍第1項所述之發光模組,其中該透光連結件係填補該光耦合件與該導光膜片之間的縫隙。 The light-emitting module of claim 1, wherein the light-transmitting connecting member fills a gap between the optical coupling member and the light-guiding film. 如申請專利範圍第1項所述之發光模組,其中該透光連結件係平滑化該光耦合件與該導光膜片交界處之一段差。 The light-emitting module of claim 1, wherein the light-transmitting connecting member smoothes a step difference between the optical coupling member and the light guiding film. 如申請專利範圍第1項所述之發光模組,其中該導光膜片之厚度係小於該發光二極體之一出光面的高度。 The light-emitting module of claim 1, wherein the thickness of the light-guiding film is smaller than a height of a light-emitting surface of the light-emitting diode. 如申請專利範圍第1項所述之發光模組,其中該導光結構之鄰近該發光二極體之一側具有一第一高度,遠離該發光二極體之一側具有一第二高度,該第一高度係大於該第二高度。 The light-emitting module of claim 1, wherein the light-guiding structure has a first height adjacent to one side of the light-emitting diode and a second height away from a side of the light-emitting diode. The first height is greater than the second height. 如申請專利範圍第6項所述之發光模組,其中該第一高度係大於等於該發光二極體之一出光面的高度。 The light-emitting module of claim 6, wherein the first height is greater than or equal to a height of a light-emitting surface of the light-emitting diode. 如申請專利範圍第6項所述之發光模組,其中該第一高度的範圍為0.4毫米至1.0毫米。 The lighting module of claim 6, wherein the first height ranges from 0.4 mm to 1.0 mm. 如申請專利範圍第6項所述之發光模組,其中該第二高度的範圍為0.05毫米至0.35毫米。 The illuminating module of claim 6, wherein the second height ranges from 0.05 mm to 0.35 mm. 如申請專利範圍第1項所述之發光模組,其中該光耦合件係為一導光板,且鄰近該發光二極體之一側具有一膨大部。 The light-emitting module of claim 1, wherein the light-coupling member is a light guide plate and has an enlarged portion adjacent to one side of the light-emitting diode. 如申請專利範圍第1項所述之發光模組,其中該光耦合件係為一部分楔形導光板。 The light-emitting module of claim 1, wherein the optical coupling member is a part of a wedge-shaped light guide plate. 如申請專利範圍第1項所述之發光模組,該導光結構更包含:一定位片,其係連接該光耦合件及該導光膜片。 The light-emitting module of claim 1, wherein the light-guiding structure further comprises: a positioning piece that connects the optical coupling member and the light guiding film. 如申請專利範圍第12項所述之發光模組,其中該定位片為一反射片。 The illuminating module of claim 12, wherein the locating piece is a reflecting piece. 如申請專利範圍第1項所述之發光模組,其中該光耦合件係為一透鏡,該透鏡設置於該導光膜片鄰近於該發光二極體之一側。 The light-emitting module of claim 1, wherein the light-coupling member is a lens disposed on a side of the light-guiding film adjacent to the light-emitting diode. 如申請專利範圍第1項所述之發光模組,其中該光耦合件係具有一反射面及一光耦合面,該光耦合件藉由該光耦合面而與該導光膜片耦接,至少部分該光線經由該反射面及該光耦合面入射該導光膜片。 The light-emitting module of claim 1, wherein the optical coupling member has a reflective surface and an optical coupling surface, and the optical coupling member is coupled to the light guiding film by the optical coupling surface. At least a portion of the light is incident on the light guiding film via the reflecting surface and the light coupling surface. 如申請專利範圍第15項所述之發光模組,其中該反 射面與該光耦合面之間具有一夾角,該夾角係小於等於45度。 The lighting module of claim 15, wherein the There is an angle between the emitting surface and the light coupling surface, and the angle is less than or equal to 45 degrees. 如申請專利範圍第1項所述之發光模組,其中該導光結構更具有一輔助成型件,該輔助成型件具有一容置部,該光耦合件係容置於該容置部。 The light-emitting module of claim 1, wherein the light-guiding structure further has an auxiliary molding member, the auxiliary molding member having a receiving portion, the optical coupling member being disposed in the receiving portion. 如申請專利範圍第1項所述之發光模組,其中該光耦合件係具有一反射面,該光線經由該反射面入射該導光膜片。 The illuminating module of claim 1, wherein the optical coupling member has a reflecting surface, and the light is incident on the light guiding film via the reflecting surface. 如申請專利範圍第1項所述之發光模組,其中當該發光二極體為複數時,該等發光二極體係設置於該導光結構之一側邊。 The light-emitting module of claim 1, wherein when the light-emitting diodes are plural, the light-emitting diode systems are disposed on one side of the light-guiding structure. 如申請專利範圍第1項所述之發光模組,更包含:一電路板,連接該發光二極體及該導光結構。 The light emitting module of claim 1, further comprising: a circuit board connecting the light emitting diode and the light guiding structure.
TW101131995A 2012-05-18 2012-09-03 Light emitting module TW201348817A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101131995A TW201348817A (en) 2012-05-18 2012-09-03 Light emitting module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101117867 2012-05-18
TW101131995A TW201348817A (en) 2012-05-18 2012-09-03 Light emitting module

Publications (1)

Publication Number Publication Date
TW201348817A true TW201348817A (en) 2013-12-01

Family

ID=50157368

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101131995A TW201348817A (en) 2012-05-18 2012-09-03 Light emitting module

Country Status (1)

Country Link
TW (1) TW201348817A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555051B (en) * 2015-07-14 2016-10-21 達方電子股份有限公司 Backlight module, and lighting keyboard
TWI855599B (en) * 2023-03-17 2024-09-11 元太科技工業股份有限公司 Light source module and reflective display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI555051B (en) * 2015-07-14 2016-10-21 達方電子股份有限公司 Backlight module, and lighting keyboard
TWI855599B (en) * 2023-03-17 2024-09-11 元太科技工業股份有限公司 Light source module and reflective display device

Similar Documents

Publication Publication Date Title
CN102252224B (en) Light unit and display apparatus having the same
US20050030960A1 (en) Illumination device for flat-panel display and light-emitting lamp
TW201418628A (en) Light source module and manufacturing method thereof
US10424691B2 (en) Display apparatus having quantum dot unit or quantum dot sheet and method for manufacturing quantum dot unit
US20130077027A1 (en) Led arrays
CN1928425A (en) Low profile light source utilizing a flexible circuit carrier
US20140340933A1 (en) Light guide element and backlight module
CN101865376A (en) Manufacturing method of backlight module, display and reflector of backlight module
KR20150033169A (en) Light emitting diode package and liquid crystal display device using the same
TW200702591A (en) Planar lighting apparatus
CN104776344B (en) LED light bar, backlight and display device
CN101779078B (en) Illuminating device and liquid crystal display device
CN101393354A (en) Backlight module and liquid crystal display using the same
KR101987049B1 (en) Lens unit and light-emitting apparatus
US9091796B2 (en) Optical coupling device and backlight module
KR101946909B1 (en) Lens unit and light-emitting apparatus
KR20100108246A (en) Illumination device
KR101877727B1 (en) Lens unit and light-emitting apparatus
TW201348817A (en) Light emitting module
JP4721159B2 (en) Surface lighting device
US20140169034A1 (en) Edge-type backlighting module having light couplers between light guiding plate and leds
US9625635B2 (en) Light source and backlight module
KR20130022174A (en) Light emitting device package, lighting system and image display device including the same
CN111367118B (en) Light source module and light splitting element
US20140347603A1 (en) Light guide plate, backlight module, and liquid crystal display device