TW201339477A - Lamp - Google Patents

Abstract

This invention aims to provide a lightweight lamp which possesses good light distribution property, and is capable of ensuring heat dissipation required for lamp. The lamp comprises a semiconductor light-emitting device 12 as a light source, a base 20 on the top side 21 of which is mounted the semiconductor light-emitting device 12, a housing 30 to the upper end portion 30a of which is attached the base 20, a circuit unit 40 received within the housing 30, and a mouthpiece 60 attached to the lower end portion 30b of the housing 30. The base 20 is formed by resin, and concavo-convex shape for preventing warpage is formed on the base 20.

Description

Lamp

The present invention relates to a luminaire utilizing a semiconductor light emitting element.

In recent years, as a substitute for an incandescent light bulb, a light bulb shaped lamp that uses a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source has become popular.

A general light bulb shaped lamp includes: a semiconductor light emitting element as a light source; a base having a semiconductor light emitting element mounted on a top surface; a frame having a base attached to the upper end; and a circuit unit housed inside the housing; The base of the lower end of the frame; the base and the frame system are made of metal (Patent Document 1).

In this way, the base and the frame are made of metal in order to ensure the heat dissipation required for the lamp, that is, to efficiently dissipate the heat generated by the semiconductor light-emitting element at the time of lighting.

Specifically, since the base is made of metal, heat generated by the semiconductor light-emitting element can be efficiently conducted to the frame. Furthermore, if the frame body is also made of metal, the heat of the frame body can be efficiently conducted to the lamp cap, thereby efficiently dissipating heat from the lamp cap to the lighting fixture side. Further, if the frame body is made of metal, heat is likely to spread over the entire frame body, so that heat can be efficiently dissipated from the entire outer surface of the frame body to the atmosphere.

According to this configuration, the thermal load on the semiconductor light emitting element or the circuit unit can be reduced, and the life of the lamp can be extended. In particular, the heat-emitting source, that is, the semiconductor light-emitting element is the highest temperature portion and bears a large heat load, so that the base is made of metal to quickly dissipate from the thermal semiconductor light-emitting element, which ensures the necessary heat dissipation of the lamp. Quite important.

However, if the abutment or frame is made of metal, the luminaire will be heavier than the incandescent bulb. Heavy luminaires are difficult to handle when transporting or loading and unloading luminaires, which is quite inconvenient. Further, when the base or the frame is made of metal, it is difficult to ensure insulation between the semiconductor light emitting element and the frame. Therefore, based on the consideration of light weight reduction and insulation assurance of the luminaire, it has been thought that the base is made of a resin.

[Practical Technical Literature] [Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-134568

However, if the base is made of a resin, the base may be warped due to a molding error during molding of the base or heat generated by the semiconductor light-emitting element when the lamp is used. When such warpage occurs, the heat dissipation property is lowered or the posture of the semiconductor light emitting element mounted on the base is skewed, and the light distribution characteristics of the lamp are deteriorated.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a lamp which ensures heat dissipation of a lamp and which is lightweight and has good light distribution characteristics.

A lamp according to the present invention includes: a semiconductor light-emitting device as a light source; a base having the semiconductor light-emitting device mounted on a top surface; a frame having the base attached to the upper end; and a circuit unit housed in the frame; And a base attached to a lower end portion of the frame; the lamp is characterized in that the base is made of a resin, and an uneven portion for preventing warpage is formed on the base.

In the lamp of the present invention, since the base is made of a resin, the lamp made of metal is more lightweight than the base. Further, since the uneven portion for preventing warpage is formed on the base, the base is less likely to warp, and the semiconductor light-emitting element can be attached to the base without warpage in an appropriate posture, so that the light distribution characteristics of the lamp are good.

1, 100, 200‧‧‧ lamps

10‧‧‧Semiconductor lighting module

11‧‧‧Installation substrate

12, 12A‧‧‧ semiconductor light-emitting components

13‧‧‧ Sealing members

14‧‧‧Receiving terminal

20, 20A, 20B, 20C, 20D, 20E, 120, 220‧‧‧ abutments

21, 21A‧‧‧ top

22, 22B, 22C, 22D, 22E‧‧‧ bottom

23, 23B, 23C, 23D, 24C, 25C, 23E‧‧ ‧ ribs

24, 122, 222‧‧‧ peripherals

25, 126, 226‧‧‧ claws

26‧‧‧ Groove

27‧‧‧through holes

30, 130, 230‧‧‧ frame

30a, 131, 231‧‧‧ upper end

30b‧‧‧Bottom

31‧‧‧ circuit housing

32‧‧‧ Cover

33‧‧‧The Great Trails Department

34‧‧‧Little Trails Department

34a‧‧‧ claw

35‧‧‧Lower side opening

36‧‧‧Inside tube

36a‧‧‧ Sidewall section

36b‧‧‧cover wall section

36c, 36d‧‧‧through holes

37‧‧‧Outer tube

37a‧‧‧Upper

37b‧‧‧Claw card stop

38‧‧‧through holes

40‧‧‧ circuit unit

41‧‧‧ circuit board

42, 43‧‧‧ Electronic parts

44, 45, 46, 47‧‧‧ Electrical wiring

60‧‧‧ lamp holder

61‧‧‧Shell Department

62‧‧‧ hole eye

63‧‧‧Insulation materials

70,170,270‧‧‧light balls

71‧‧‧ inside

72, 172, 272‧‧ ‧ open side end

80‧‧‧Adhesive

136, 139, 273, 274‧‧‧ claws

173, 239‧‧‧ claws

J‧‧‧Lighting shaft

Fig. 1 is a cross-sectional view showing the lamp of the first embodiment.

Fig. 2 is an exploded perspective view showing the lamp of the first embodiment.

Figure 3 is an enlarged cross-sectional view showing a portion surrounded by a double short dash line in Figure 1.

4 is a perspective view for explaining a mounting form of a semiconductor light emitting element in a modified example.

5(a) and 5(b) are perspective views showing the base of the first embodiment.

6(a) to 6(d) are perspective views showing a base of a modification.

Fig. 7 is a perspective view showing a base, a frame, and a bulb of the lamp of the second embodiment.

Fig. 8 is an enlarged cross-sectional view showing the main part of the lamp of the second embodiment.

Fig. 9 is a perspective view showing a base, a frame, and a bulb of the lamp according to the third embodiment.

Fig. 10 is an enlarged cross-sectional view showing the main part of the lamp of the third embodiment.

Hereinafter, a lamp according to an embodiment of the present invention will be described with reference to the drawings. In addition, the scale of the components in each drawing is different from the actual one. Further, in the present application, the symbol "~" used in displaying the numerical range includes the numerical values at both ends.

<First embodiment> [general structure]

Fig. 1 is a cross-sectional view showing the lamp of the first embodiment. Fig. 2 is an exploded perspective view showing the lamp of the first embodiment. Figure 3 is an enlarged cross-sectional view showing a portion surrounded by a double short dash line in Figure 1.

As shown in FIG. 1, the lamp 1 of the first embodiment is an LED lamp which is a substitute for an incandescent light bulb, and includes a semiconductor light-emitting module 10 as a light source and a base having a semiconductor light-emitting module 10 mounted on the top surface 21. 20. The frame 30 having the base 20 attached to the upper end portion 30a, the circuit unit 40 housed inside the frame 30, the base 60 attached to the lower end portion 30b of the frame 30, and the upper portion of the semiconductor light emitting module 10 are covered. Light ball 70.

In addition, a single short dash line drawn along the upper and lower sides of the paper in FIG. 1 shows the lamp axis J of the lamp 1. The lamp shaft J is a shaft that is a center of rotation when the lamp 1 is attached to a socket of a lighting fixture (not shown), and is aligned with the rotation axis of the base 60. Further, in Fig. 1, the upper side of the paper is above the lamp 1, and the lower side of the paper is below the lamp.

[Composition of each department] (1) Semiconductor light-emitting module

The semiconductor light emitting module 10 includes a mounting substrate 11 , a plurality of semiconductor light emitting elements 12 mounted on the mounting substrate 11 , and a sealing member 13 provided on the mounting substrate 11 to cover the semiconductor light emitting elements 12 .

The mounting substrate 11 is, for example, a metal base substrate composed of an insulating layer, a wiring pattern, and a metal plate, and is provided with a power receiving terminal 14 for receiving power for driving the semiconductor light emitting element 12 on the top surface. Each of the semiconductor light-emitting elements 12 is, for example, a blue-emitting GaN-based LED. As shown in FIG. 2, for example, 25 semiconductor light-emitting elements 12 are arranged in a matrix on the mounting substrate 11 in five rows and five rows. The sealing member 13 is formed, for example, of a transparent epoxy resin in which phosphor particles that convert blue light into yellow light are mixed, and all of the semiconductor light-emitting elements 12 are sealed.

Further, the mounting substrate 11 is not limited to the metal base substrate, and may be an existing mounting substrate other than the metal base substrate such as a resin substrate or a ceramic substrate. Further, it is not necessary to mount the substrate 11, and as shown in FIG. 4, a wiring pattern (not shown) may be formed on the top surface 21A of the electrically insulating base 20A, and a substrate is not mounted on the wiring pattern. The semiconductor light emitting element 12A.

Further, the semiconductor light emitting element 12 is not limited to an LED, and may be an LD (Laser Diode) or an EL element (Electroluminescent element). Further, the semiconductor light emitting element 12 may be mounted on the top surface of the mounting substrate 11 using a COB (Chip on Board) technology, or may be mounted using an SMD (Surface Mount Device) type technology.

Further, the semiconductor light-emitting element 12 and the sealing member 13 are not limited to a blue-emitting GaN-based LED and a blue-to-yellow sealing member, and may be other luminescent color LEDs and other wavelength-converting sealing members. Moreover, the sealing member does not have to be mixed with the wavelength conversion material. When a white LED is used, or when three kinds of LEDs emitting blue light, red light, or green light are used, white light is obtained by color mixing, and there is no need for a wavelength conversion material. Mixed in. Further, the wavelength conversion layer may be formed on the surface of the sealing member without forming the wavelength conversion material in the sealing member, or the wavelength conversion layer may be formed on the inner surface 71 of the bulb 70.

(2) Abutment

Fig. 5 is a perspective view showing the base of the first embodiment, Fig. 5(a) is a perspective view of the base viewed from the top surface side, and Fig. 5(b) is a perspective view of the base viewed from the bottom surface side.

As shown in FIGS. 5(a) and 5(b), the base 20 is, for example, a substantially circular plate shape, and the semiconductor light emitting module 10 is attached to the center of the slightly circular top surface 21. Further, as a method of mounting the semiconductor light-emitting module 10 to the base 20, a screwing, a bonding, an engaging structure, or the like can be used.

The base 20 is made of a high thermal conductivity resin, and a high thermal conductivity resin is produced by, for example, injection molding. Here, the high thermal conductivity resin is a resin composition obtained by mixing a filler having thermal conductivity into a resin material, and has higher thermal conductivity than a resin in which no filler is mixed. Since the base 20 made of a highly thermally conductive resin has high thermal conductivity, it can be used for a lamp instead of a base made of metal.

The inventors of the present invention have focused on the reduction in the heat generation rate of the semiconductor light-emitting element due to the high efficiency of the semiconductor light-emitting element, and have come up with a resin base which is still considered to be impossible to use for the lamp. It was confirmed that the base made of high thermal conductivity resin can be used for practical equivalent LED lamps for incandescent bulbs of 40W, 60W, and 100W. Further, the heat transfer coefficient of the highly thermally conductive resin can be adjusted depending on the material, shape, and amount of the filler.

As a filler of the high thermal conductivity resin, an electrically conductive filler may be used, which comprises: glass, cerium oxide, cerium oxide, aluminum oxide, magnesium oxide, zinc oxide, cerium nitride, boron nitride, titanium nitride, aluminum nitride. , diamond, graphite, tantalum carbide, titanium carbide, zirconium boride, boron boride, molybdenum telluride, antimony sulfide, aluminum, tin, zinc, indium, iron, copper, silver, etc., which are based on inorganic materials or metals, or An alloy composed of two or more kinds of materials. Further, a plurality of the above fillers may be used in combination.

When a non-conductive filler is used, electrical insulation can be imparted to the highly thermally conductive resin, so that a base having electrical insulation can be produced. In this case, it is not necessary to use an insulating member that electrically insulates the semiconductor light-emitting module from the base, and the structure of the lamp can be simplified, so that the cost of the lamp can be reduced or the productivity can be improved.

The base 20 of the present embodiment is made of a highly thermally conductive resin using a non-conductive filler, and therefore has electrical insulation properties. Therefore, an insulating member for electrically insulating the semiconductor light emitting module 10 from the base 20 is not used. In addition, when the base 20 is made of a highly thermally conductive resin using a conductive filler, in order to electrically insulate the semiconductor light emitting module 10 from the base 20, the semiconductor light emitting module 10 and the base 20 are interposed. Insulating member such as insulating sheet (not shown).

The shape of the filler is preferably fibrous, granular or the like. By using a ceramic fiber such as glass fiber as a filler, a highly thermally conductive resin having a small specific gravity can be obtained, and the base 20 can be further reduced in weight. In addition, the filler is formed into a fibrous shape and is formed by, for example, maintaining the orientation in the plane direction of the base 20, whereby a passage as a passage of heat is easily formed in the resin material, and the high thermal conductivity resin can be improved. The thermal conductivity of the direction sought.

As the resin of the high thermal conductivity resin, polypropylene, vulcanized polypropylene, polycarbonate, polyether sulfimine, polyphenylene sulfide, polyphenylene ether, polyfluorene, polybutylene terephthalate, polyfluorene are preferably used. A synthetic resin such as an amine, polyethylene terephthalate, polyether oxime or polyphthalamide.

The amount of the filler of the resin is preferably in the range of, for example, 5 to 95% by mass, preferably 10 to 70% by mass, more preferably 30 to 50% by mass. When the amount of the filler is too small, the effect of improving the thermal conductivity is lowered, and if the filler is too large, the formability of the highly thermally conductive resin is lowered.

The heat transfer coefficient of the high heat conductive resin is preferably 1 W/mk or more, preferably 5 W/mk or more, and more preferably 10 W/mk or more.

As shown in FIG. 5(b), a concave-convex portion for preventing warpage is formed on the bottom surface 22 of the base 20. Specifically, on the bottom surface 22 of the base 20, the square frame-shaped rib 23 provided by the bottom surface 22 of the base 20 forms an uneven portion. In the case of, for example, an LED lamp of an incandescent bulb equivalent to 20 W, it can be realized by a general resin even without using a high heat conductive resin.

Since the uneven portion for preventing warpage is formed, the stress caused by the warpage can be alleviated by the uneven portion, and the base 20 can be prevented from being warped. Therefore, the semiconductor light-emitting element 12 can be mounted on the base 20 without warpage in an appropriate posture, and the light distribution characteristics of the lamp 1 can be made good. Furthermore, since the base 20 is less likely to warp, the size of the base 20 is less likely to be disturbed, and the lamp 1 is not difficult to assemble due to dimensional errors.

Moreover, if the uneven portion is formed on the base 20, the rigidity of the base 20 can be maintained and the amount of resin used can be reduced. Therefore, the base 20 can be reduced in cost and weight.

Further, the uneven portion of the base 20 is not limited to being formed by the frame-shaped rib 23 provided on the bottom surface 22 of the base 20, and for example, the uneven portion may be formed in the following manner.

Fig. 6 is a perspective view showing a base of a modification. In the base 20B shown in Fig. 6(a), irregularities are formed by the annular ribs 23B provided on the bottom surface 22B of the base 20B. On the other hand, the annular rib 23B is provided on the outer peripheral edge of the bottom surface 22B of the base 20B along the outer peripheral edge.

Further, the annular ribs are not limited to one, and two or more ribs may be provided. For example, as shown in FIG. 6(b), the bottom surface 22C of the base 20C may have an annular rib 23C provided on the outer periphery along the outer circumference, and the radial length is smaller than the rib 23C and along the outer circumference. Annular ribs located on the inner side of the outer circumference 24C. The annular rib 25C having a diameter smaller than the rib 24C and disposed on the inner side of the rib 24C is provided concentrically. Further, the plurality of annular ribs are not limited to being arranged concentrically, and may be offset from the center position. Further, the ribs may have an elliptical ring shape.

In the base 20D shown in Fig. 6(c), the uneven portion is formed by the rib 23D which is radially provided on the bottom surface 22D of the base 20D. The rib 23D is radially provided from the center of the bottom surface 22D of the base 20D at an equal angle in the eight directions.

Further, the radial ribs are not limited to the eight-direction direction, and may be provided in a plurality of directions other than the eight directions. For example, as shown in FIG. 6(d), the base 20E may be provided at a uniform angle from the center of the bottom surface 22E toward the four directions, that is, in a cross shape. Further, the radial ribs are not limited to being radially provided at equal angles, and the angle is arbitrary.

Further, the annular rib or the radial rib described above may be provided on the top surface 21 of the base 20 or may be provided on both the bottom surface 22 and the top surface 21. Even in this case, the stress caused by the warpage can be alleviated to prevent the warpage of the base 20, and the amount of resin used can be reduced to reduce the cost and weight of the base 20.

For example, when an annular rib is provided on the outer periphery of the top surface 21, the rib can be temporarily fixed by the rib. Further, when a rib is provided in a portion of the top surface 21 where the semiconductor light emitting module 10 is mounted, the heat generated by the semiconductor light emitting element 12 can be efficiently transmitted to the housing 30 by the rib.

Further, the uneven portion for preventing warpage of the base 20 may be formed by a groove, a hole portion, a through hole, or the like provided on the bottom surface 22 or the top surface 21 of the base 20. The shape, position and number of the grooves, the holes, and the through holes are arbitrary. Further, the uneven portion for preventing warpage of the base 20 may be formed by making the thickness of the center side and the outer peripheral side of the base 20 different. In these cases, the stress caused by the warpage can be alleviated to prevent the warpage of the base 20, and the amount of resin used can be reduced to reduce the cost and weight of the base 20.

For example, when an annular groove is provided on the outer periphery of the top surface 21, the groove can be used to light the ball. 70 temporarily fixed. Further, when the bulb 70 is made of resin, the bulb 70 can be used to fix the bulb 70 to the base 20 by the engagement of the claws. Further, when a trench is provided in a portion of the top surface 21 where the semiconductor light emitting module 10 is mounted, the trench can be used to determine the position of the semiconductor light emitting module 10.

(3) frame

The casing 30 is composed of, for example, a circuit case 31 in which the circuit unit 40 is housed, and a cover 32 that is externally fitted to the upper end side of the circuit case 31.

The casing 30, that is, the circuit case 31 and the lid body 32 are each formed of, for example, a thermally conductive resin. When the frame 30 is made of a resin, the lamp 1 is made lighter than when the frame 30 is made of metal. Further, when the resin has high thermal conductivity, the heat of the frame body 30 can be efficiently conducted to the base 60, and heat can be efficiently dissipated from the entire outer surface of the casing 30 to the atmosphere.

Further, the frame of the lamp of the present invention is not necessarily made of a highly thermally conductive resin, and for example, the frame may be made of metal. When the frame is made of metal, the heat dissipation of the lamp is higher than when it is composed of a highly thermally conductive resin. On the other hand, if the casing is not made of a highly thermally conductive resin but is made of a resin having low thermal conductivity, the heat of the base 20 is hard to be conducted to the circuit unit 40, so that the circuit unit 40 can be protected from heat.

The definition of the high thermal conductivity resin constituting the frame 30 is the same as the definition of the high thermal conductivity resin constituting the base 20. Further, the circuit case 31 and the lid body 32 may be composed of the same resin composition as the high heat conductive resin constituting the base 20, or may be different from one of the filler or the resin, or the filler and the resin. It is composed of a variety of high thermal conductivity resins. Further, the circuit case 31 and the lid body 32 may be composed of the same resin composition, or may be composed of different types of resin compositions.

The circuit case 31 has a substantially cylindrical shape with an opening at its upper end and a lower end, and is composed of a substantially cylindrical large diameter portion 33 and a substantially cylindrical small diameter portion 34 having a smaller diameter than the large diameter portion 33. The large diameter portion 33 located on the upper side accommodates most of the circuit unit 40. On the other hand, the base 60 is externally fitted to the small diameter portion 34 on the lower side, thereby closing the lower side opening 35 of the circuit case 31.

The lid body 32 includes: a bottomed cylindrical inner tube portion 36 having a cylindrical side wall portion 36a and a lid wall portion 36b that blocks the upper end side of the side wall portion 36a; and an outer tube portion 37 having a long diameter from the upper end toward The lower end side is gradually reduced in a cylindrical shape and includes an inner tubular portion 36; the inner tubular portion 36 and the outer tubular portion 37 are continuously formed integrally at the lower end portion. A gap is formed between the inner tubular portion 36 and the outer tubular portion 37 throughout the entire circumferential direction. Therefore, if the electronic components 42 and 43 are abnormally heated or the like, the inner tubular portion 36 is dissolved or burned, and it is difficult to affect the outer tubular portion 37 constituting the outer periphery of the lamp 1.

One claw 34a is provided at the upper end of the large diameter portion 33 of the circuit case 31, and one claw end for locking the claw 34a is provided at the upper end portion of the side wall portion 36a of the inner cylindrical portion 36 of the lid body 32. Through hole 36c. The circuit case 31 is inserted into the inner tube portion 36 of the lid body 32, and the claws 34a of the circuit case 31 are engaged with the through holes 36c of the lid body 32, whereby the circuit case 31 and the lid body 32 are assembled. By the engagement of the claws 34a and the through holes 36c, the circuit case 31 is not rotated about the lamp axis J with respect to the cover 32.

Further, in the embodiment of the present embodiment, the circuit case 31 and the lid body 32 are assembled by the engagement structure of the claws, but the plurality of through holes 36c for the claws 34a and the claws may be plural; The method may be a snapping structure, a screwing, a bonding, a press fitting, or the like that does not utilize the claws, and may also combine the plural methods.

The base 20 and the bulb 70 are attached to the upper end portion 30a of the casing 30, that is, the upper end portion 37a of the outer tubular portion 37 of the lid body 32. A claw locking portion 37b for locking the claw 25 provided on the outer peripheral portion 24 of the base 20 is formed on the inner peripheral surface of the upper end portion 37a of the outer tubular portion 37, and the claw 25 of the base 20 is locked. The base 20 is attached to the lid body 32 at the claw locking portion 37b. A groove portion 26 is formed between the base 20 and the upper end portion 37a of the lid body 32, and the groove portion 26 is in a state where the upper end portion 37a of the lid body 32 is engaged with the outer peripheral portion 24 of the base 20. The adhesive 80 is filled therein, whereby the base 20 is bonded to the lid 32 and the bulb 70.

The circuit case 31 and the lid body 32 of the housing 30 are each formed of an insulating material. Thereby, the base 20 above the cover wall portion 36b of the inner tubular portion 36 of the cover 32 and the circuit located below The unit 40 is insulated by a cover wall portion 36b interposed therebetween. Further, the base 20 is provided with a through hole 27 for inserting the pair of the electric wires 44 and 45; and the position of the through hole 27 of the base 20 is similarly provided in the cover wall portion 36b for the electric wiring. 44, 45 are inserted through a pair of through holes 36d.

(4) Circuit unit

The circuit unit 40 has various electronic components 42 and 43 attached to the circuit board 41 and is housed inside the casing 30. In the embodiment of the present embodiment, the casing 30 is made of a highly thermally conductive resin having electrical insulation properties. Therefore, the circuit unit 40 is directly housed inside the casing 30, and a circuit case for insulating the casing 30 from the circuit unit 40 is not used. In addition, electronic components are also included with the symbols "42" and "43".

The pair of electric wires 44 and 45 on the output side of the circuit unit 40 are electrically connected to the power receiving terminals of the semiconductor light emitting module 10. Specifically, each of the electric wires 44 and 45 is led out above the base 20 via the through hole 36d of the lid body 32 and the through hole 27 of the base 20, and is connected to the power receiving terminal of the semiconductor light emitting module 10. Each of the electric wires 44 and 45 is, for example, a lead covered with an insulating coating layer such as a resin.

The electric wirings 46 and 47 on the input side of the circuit unit 40 are electrically connected to the base 60. Specifically, the electric wiring 46 is led out from the through hole 38 provided in the small diameter portion 34 of the casing 30 to the outside of the casing 30, and is connected to the outer casing portion 61 of the base 60. Further, the electric wiring 47 is led out from the lower side opening 35 of the small-diameter portion 34 of the casing 30 to the outside of the casing 30, and is connected to the eyelet portion 62 of the base 60. Each of the electric wires 46 and 47 is, for example, a lead covered with an insulating coating layer such as resin.

(5) lamp holder

The base 60 is a so-called Edison type base, and when the lamp 1 is attached to a lighting fixture and lights up, power is received from the socket of the lighting fixture. The base 60 has a cylindrical shape, and has an outer casing portion 61 having a male thread on its circumferential surface, and an eyelet portion 62 that is attached to the outer casing portion 61 via an insulating material 63, and is attached to the lower end portion of the small diameter portion 34 of the casing 30. That is, the small diameter portion 34 of the casing 30. Further, the base 60 is not limited to the Edison type, and may be, for example, a pin type (specifically, a G type such as GY or GX).

(6) Light ball

The bulb 70 is, for example, dome-shaped, and is attached to the upper end portion 30a of the casing 30 so as to cover the upper side of the semiconductor light emitting module 10. Specifically, in a state in which the opening-side end portion 72 of the bulb 70 is fitted into the groove portion 26 of the base 20, the adhesive base 80 of the bonding base 20 and the frame 30 is adhered to the base. The table 20 and the frame 30.

The shape of the bulb 70 is not particularly limited, and may be a shape of a sphere that mimics an A-shaped or G-shaped incandescent bulb. Further, the light ball 70 is not necessary for the lamp of the present invention, and the configuration of the lamp ball may be considered.

The light emitted from the semiconductor light emitting module 10 is incident on the inner surface 71 of the bulb 70, transmitted through the bulb 70, and is led out to the outside of the bulb 70. The inner surface 71 of the bulb 70 may be subjected to diffusion treatment for diffusing light emitted from the semiconductor light-emitting module 10, for example, by diffusion treatment using cerium oxide or white pigment.

〔summary〕

In the lamp 1 of the first embodiment described above, the heat generated by the semiconductor light-emitting device 12 is mainly transmitted to the base 60 via the base 20 and the frame 30, and is passed from the base 60 to the wall via a lighting fixture (not shown). Or the top plate is scattered. Since the base 20 and the frame 30 are made of a highly thermally conductive resin and have high thermal conductivity, the heat generated by the semiconductor light-emitting module 10 can be efficiently dissipated to the outside of the lamp 1. Further, since the casing 30 is made of a highly thermally conductive resin, heat can easily spread over the entire casing 30, and heat can be efficiently dissipated from the entire outer surface of the casing 30 to the atmosphere.

Further, in the lamp 1 of the first embodiment, since the base 20 and the frame 30 are made of a highly thermally conductive resin, the lamp formed of metal and the base and the frame are lighter, and the operation is simpler.

<Second embodiment>

Fig. 7 is a perspective view showing a base, a frame, and a bulb of the lamp of the second embodiment. Fig. 8 is an enlarged cross-sectional view showing the main part of the lamp of the second embodiment.

As shown in FIG. 7 and FIG. 8, in the lamp 100 of the second embodiment, the base 120 and the bulb 170 are attached to the upper end portion 131 of the casing 130 by the engagement structure of the claws. The lamp 1 of the first embodiment to be mounted is different. The lamp 100 of the second embodiment basically has the same configuration as that of the lamp 1 of the first embodiment except for the configuration of the above-described engagement structure. Therefore, only the related configuration of the above-described engagement structure will be described in detail, and other configurations will be omitted or simplified. In the same manner as the first embodiment, the same reference numerals as in the first embodiment are used.

A plurality of claws 126 are provided on the outer peripheral portion 122 of the base 120. Specifically, the claws 126 are respectively protruded from the circumferential surface of the outer peripheral portion 122 in a direction perpendicular to the lamp axis J (refer to FIG. 1 ), and are provided at four intervals along the circumferential direction of the outer peripheral portion 122 at equal intervals. Further, a plurality of claws 173 are also provided at the opening side end portion 172 of the lamp ball 170. Specifically, the claws 173 protrude from the outer circumferential surface of the opening-side end portion 172 in a direction perpendicular to the lamp axis J, and are provided at equal intervals in the circumferential direction of the outer circumferential surface of the opening-side end portion 172, respectively. At the office.

On the other hand, the upper end portion 131 of the casing 130 is provided with a plurality of claw receiving portions 136 at positions corresponding to the claws 126 of the base 120, and a plurality of claw bearings are also provided at positions corresponding to the claws 173 of the lamp ball 170. In the portion 139, the claw receiving portion 139 is located above the claw receiving portion 136. The claw receiving portion 136 and the claw receiving portion 139 are, for example, penetrating through holes in the thickness direction of the frame body 130, respectively.

When the base 120 is attached to the casing 130, the base 120 is fitted into the upper end portion 131 from above the casing 130, and the claws 126 of the base 120 are locked to the claw receiving portions 136 of the casing 130. Since the base 120 can be attached to the frame 130 by such a snap-fit structure, the assembly of the lamp is simplified as compared with the case where the base 120 is attached to the frame 130 by screwing, bonding, or caulking. .

Here, the base 120 and the frame 130 are each made of a highly thermally conductive resin. When the base material 120 is a resin, even if the frame body 130 is made of metal or ceramic, the base 120 can be attached to the frame body 130 by the engagement structure using the claws as described above.

When the lamp ball 170 is attached to the casing 130, the base 120 is attached to the casing 130, and the opening-side end portion 172 of the bulb 170 is fitted into the upper end portion 131 from above the casing 130 to make the bulb 170 The claw 173 is engaged with the claw receiving portion 139 of the frame 130. Since the lamp ball 170 can be attached to the frame body 130 by such a snap-fit structure, the assembly of the lamp is simplified as compared with the case where the lamp ball 170 is attached to the frame body 130 by adhesion or the like. Further, since the frame body 130 is made of a resin, the lamp ball 170 can be attached to the frame body 130 by the engagement structure using the claws as described above.

Further, the engagement structure between the base and the claws of the casing and the engagement structure between the bulb and the claws of the casing are not limited to the above configuration. For example, the claw receiving portion 136 and the claw receiving portion 139 of the frame body 130 may not be through holes but may not be penetrated. Further, the engaging structure of the base and the claws of the frame may be such that the claws provided in the frame are engaged with the claw receiving portions provided on the base. Further, the engagement structure between the light ball and the claw of the frame body may be such a structure that the claw provided on the frame body and the claw receiving portion provided on the light ball are locked.

<Third embodiment>

Fig. 9 is a perspective view showing a base, a frame, and a bulb of the lamp according to the third embodiment. Fig. 10 is an enlarged cross-sectional view showing the main part of the lamp of the third embodiment.

As shown in FIG. 9 and FIG. 10, in the lamp 200 of the third embodiment, the base 220 and the bulb 270 are attached to the upper end portion 231 of the frame 230 by the engagement structure of the claws. The lamp 1 of the first embodiment to be mounted is different. The lamp 200 of the third embodiment basically has the same configuration as that of the lamp 1 of the first embodiment except for the configuration of the above-described engagement structure. Further, the lamp 200 of the third embodiment differs from the lamp 100 of the second embodiment in the form of the engagement structure of the claws. Hereinafter, only the relevant configuration of the above-described engagement structure will be described in detail, and other configurations will be omitted or simplified. In the same manner as the first embodiment, the same reference numerals as in the first embodiment are used.

A plurality of claws 226 are provided on the outer peripheral portion 222 of the base 220. Specifically, for example, the claws 226 protrude from the circumferential surface of the outer peripheral portion 222 in a direction perpendicular to the lamp axis J (refer to FIG. 1 ), and are provided at four intervals along the circumferential direction of the outer peripheral portion 222 at equal intervals. Moreover, the upper end portion 231 of the frame 230 is also provided. There are a plurality of claws 239. Specifically, the claws 239 are respectively protruded from the inner circumferential surface of the upper end portion 231 in a direction perpendicular to the lamp axis J, and are provided at four intervals along the circumferential direction of the inner circumferential surface of the upper end portion 231 at equal intervals.

On the other hand, the opening side end portion 272 of the bulb 270 is provided with a plurality of claw receiving portions 274 at positions corresponding to the claws 226 of the base 220, and a plurality of claws 274 are provided at positions corresponding to the claws 239 of the frame 230. The claw receiving portion 273 has the claw receiving portion 273 located above the claw receiving portion 274. The claw receiving portion 273 and the claw receiving portion 274 are, for example, penetrating through holes in the thickness direction of the bulb 270, respectively.

When the base 220 is attached to the bulb 270, the base 220 is fitted into the inside of the opening-side end portion 272 from below the bulb 270, and the claw 226 of the base 220 is locked to the claw receiving portion 274 of the bulb 270. Since the base 220 can be attached to the lamp ball 270 by such a snap-fit structure, the assembly of the lamp is simplified as compared with the case where the base 220 is attached to the lamp ball 270 by adhesion or the like. Here, the base 220 is made of a highly thermally conductive resin.

After the base 220 is mounted on the light ball 270, the light ball 270 is attached to the frame 230. When the bulb 270 is attached to the housing 230, the opening-side end portion 272 of the bulb 270 is fitted into the upper end portion 231 from above the housing 230, and the claw 239 of the housing 230 and the claw receiving portion 273 of the bulb 270 are provided. Phased. Since the lamp ball 270 can be attached to the frame 230 by such a snap-fit structure, the assembly of the lamp is simplified as compared with the case where the lamp ball 270 is attached to the frame 230 by adhesion or the like. Here, the frame 230 is made of a highly thermally conductive resin. Further, although the frame 230 is a highly thermally conductive resin, it may be a metal or a ceramic.

In the embodiment of the present embodiment, the base 220 is attached to the upper end portion 231 of the casing 230 by the bulb 270. In this manner, the base 220 is mounted on the frame 230 by the lamp ball 270, whereby the heat of the base 220 can be efficiently conducted to the lamp ball 270, and the heat can be efficiently dissipated from the lamp ball 270 to the atmosphere. Out.

Further, the engagement structure between the base and the use claw of the light ball and the engagement structure between the frame and the use claw of the light ball are not limited to the above configuration. For example, the claw receiving portion 273 and the claw receiving portion 274 of the frame body 270 may not be through holes but may not be penetrated. Further, the engagement structure between the base and the claw of the light ball may be such a structure that the claw provided on the light ball and the claw receiving portion provided on the base are locked. Furthermore, The engagement structure between the frame and the claw of the light ball may be such a structure that the claw provided on the light ball and the claw receiving portion provided on the frame are locked.

<Modification>

Although the configuration of the present invention has been described above based on the first to third embodiments and the modifications thereof, the present invention is not limited to the above-described embodiments and the modifications. For example, a lamp in which the partial configurations of the lamps of the first to third embodiments and the modifications thereof are appropriately combined may be used. Moreover, the materials, numerical values, and the like described in the above-described embodiments are merely preferred, and are not limited thereto. Further, the configuration of the lamp can be appropriately changed without departing from the scope of the technical idea of the present invention.

[Industry use possibility]

The invention is widely applicable to general illumination.

1‧‧‧Lighting

10‧‧‧Semiconductor lighting module

11‧‧‧Installation substrate

12‧‧‧Semiconductor light-emitting components

13‧‧‧ Sealing members

20‧‧‧Abutment

21‧‧‧ top surface

22‧‧‧ bottom

23‧‧‧ ribs

24‧‧‧Outer Week

25‧‧‧ claws

26‧‧‧ Groove

30‧‧‧ frame

30a‧‧‧Upper

30b‧‧‧Bottom

31‧‧‧ circuit housing

32‧‧‧ Cover

33‧‧‧The Great Trails Department

34‧‧‧Little Trails Department

34a‧‧‧ claw

35‧‧‧Lower side opening

36‧‧‧Inside tube

36a‧‧‧ Sidewall section

36b‧‧‧cover wall section

36c‧‧‧through hole

37‧‧‧Outer tube

37a‧‧‧Upper

37b‧‧‧Claw card stop

38‧‧‧through holes

40‧‧‧ circuit unit

41‧‧‧ circuit board

42, 43‧‧‧ Electronic parts

44, 45, 46, 47‧‧‧ Electrical wiring

60‧‧‧ lamp holder

61‧‧‧Shell Department

62‧‧‧ hole eye

63‧‧‧Insulation materials

70‧‧‧light ball

71‧‧‧ inside

72‧‧‧Open side end

80‧‧‧Adhesive

J‧‧‧Lighting shaft

Claims (9)

A lamp comprising: a semiconductor light-emitting element as a light source; a base on which a semiconductor light-emitting element is mounted; a frame body on which the base is mounted; and a circuit unit housed inside the frame; The base is attached to a lower end portion of the frame. The lamp is characterized in that the base is made of a resin, and the base is formed with a concave-convex portion for preventing warpage. A lamp according to claim 1, wherein the uneven portion for preventing warpage is formed by a rib provided on a bottom surface of the base. The luminaire of claim 2, wherein the rib is disposed on the bottom surface of the base along the outer circumference in a ring shape. The luminaire of claim 2, wherein the rib is radially disposed on a bottom surface of the base. The luminaire according to any one of claims 1 to 4, wherein the resin constituting the base is a high thermal conductive resin having a heat transfer coefficient of 1 W/mK or more. The luminaire according to any one of claims 1 to 4, wherein the resin constituting the base is electrically insulating. The luminaire according to any one of claims 1 to 4, wherein the frame is made of a resin having electrical insulation. The luminaire of claim 7, wherein the base is mounted to the frame by a snap-fit structure. The luminaire of claim 7 , further comprising: a light ball mounted on the upper end of the frame to cover the semiconductor light emitting element; and the light ball is mounted on the frame by a snap structure body.