TW201338902A - Laser processing device - Google Patents

Abstract

The present invention provides a laser processing device with a delicate constitution, which is not adversely affected by the laser beam passing through beneath the platform and allows the end materials created from dividing the substrate to be efficiently removed from the gap outside the platform. The laser processing device A to process the substrate makes the beam spot of laser beam emitted from the laser irradiation unit 10 move along the predetermined dividing line of the substrate M carried on the platform 1. It is provided with gaps outside the platform 1 to allow the end materials Ma created from dividing the substrate to fall below the platform, and is provided with the reflection plates under the platform 1 to make the laser beam passing through the gap 2 to be reflected toward the side walls 12 surrounding the space S below the platform. The reflection plates 13 are constructed as follows: an inclined angle is formed by the tilted reflection plates for the sliding off of the falling end materials Ma from the gap 2, and a glass scrap box 15 is disposed below the lower end of the tilted reflection plates 13 for gathering the falling end materials.

Description

Laser processing device

The invention relates to a beam spot of a laser beam emitted from a laser light source, which is relatively moved along a predetermined dividing line of a brittle material substrate placed on the platform, thereby marking the substrate for cutting and cutting. Or laser processing equipment such as direct disconnection. More particularly, the present invention relates to a laser processing apparatus for a brittle material substrate including a removal mechanism for an end material (slice) which is generated at an end portion of a brittle material substrate at the time of breaking. The brittle material substrate includes glass, germanium, ceramics, semiconductors, and the like.

It is known to use the thermal stress of the irradiation of the laser beam to form a scribe line on the substrate (meaning a sipe formed by a crack formed before the substrate is completely broken and has not reached the reverse side), or is scheduled to be broken along the line. The line is completely broken and other methods. For example, Patent Document 1 discloses a method of locally heating a beam spot of a laser beam along a predetermined line of division of a substrate placed on a stage, and trailing from the cooling unit. The nozzle ejects refrigerant. The initial crack (trigger) previously formed on the end portion of the substrate is used as a starting point to cause cracking by using the compressive stress generated by heating at this time and the thermal stress distribution of the tensile stress generated by rapid cooling. The line is drawn in the direction of the predetermined line to form a score line. In addition, the complete separation of the substrate on which the score line is formed is performed by the successive breaking step.

Further, in Patent Document 2, there is disclosed a method in which a scribe line which has not been completely broken is formed along a line dividing the division of the end material region by the first laser irradiation. The second laser after the changing condition is irradiated on the scribe line, thereby causing the crack formed in the previous scribe line to penetrate and reach the reverse side of the substrate to be broken.

On the other hand, if the end material generated when the substrate is separated remains on the stage, it will cause a hindrance to the subsequent processing. However, since the end material remaining on the platform has a small width, it is difficult to remove and adsorb using a robot arm having a suction cup. In addition, once the liquid refrigerant enters between the end material and the platform at the time of laser scoring, since it is strongly adhered to the deck surface, even if air or the like is blown off, it is difficult to remove it easily, and the removal is quite difficult and adopted. The air blowing causes the fine dust such as broken glass generated at the time of breaking to rise, and the working environment is deteriorated. Here, as disclosed in Patent Document 3 and the like, a method of picking up the end material by chucking is proposed, but the mechanism of tapping is complicated, and the overall mechanism of the tapping needs to be equivalent. Since there is space, there is a problem that the entire breaking device becomes large and expensive.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-182530.

Patent Document 2: Japanese Laid-Open Patent Publication No. 2005-263578.

Patent Document 3: Japanese Laid-Open Patent Publication No. 2009-001484.

Therefore, as shown in FIG. 8, a gap 17 for dropping the end material is provided on the outer side of the stage 16 of the laser processing apparatus, and a laser irradiation unit 18 is disposed above, and the substrate M for processing is placed on the gap 17. The end material region scans the laser beam from the laser irradiation portion 18 along the line to be broken, and it is efficient to drop the end material generated at the time of the break from the gap 17 at this time. However, once the laser processing device is placed on the outside of the platform 16, such a gap is provided. Then, when the laser beam is irradiated, the laser beam passes through the gap below the platform, which may cause reflection, scattering, and light leakage from an unintended portion, and may cause the driving portion of the device or fall after being heated under the platform. The end of the material causes adverse effects.

Here, the object of the present invention is to provide a laser processing apparatus with a delicate structure, which is provided with a laser beam that is not affected by a laser beam passing through the gap below the platform, and can be efficiently performed. The end material removal function of the end material generated when the substrate is broken is removed from the gap of the platform.

In order to solve the above problems, in the present invention, the following technical means will be described. That is, the laser processing apparatus of the present invention moves the beam spot of the laser beam emitted from the laser irradiation unit relative to the predetermined line of the substrate placed on the stage, thereby processing the substrate. a laser processing device; on the outer side of the platform, a gap for causing the end material generated when the substrate is broken to fall below the platform is provided, and below the platform, a laser beam passing through the gap is disposed to surround the platform A reflector that reflects the side wall of the space below. Further, in the above invention, the reflecting plate is formed by receiving an inclination angle of the end material falling from the gap and sliding downward obliquely downward, and is provided below the inclined lower end portion of the reflecting plate to receive the sliding end material and gather it. Glass crumb box.

According to the laser processing apparatus of the present invention, the end material generated at the time of breaking the substrate can be dropped from the gap formed on the outer side of the stage to the lower side of the stage, and the end material can be efficiently removed from the land surface. Moreover, the laser beam passing through the gap below the platform during laser processing is reflected by the reflector toward the inner surface of the side wall surrounding the lower space of the platform, whereby the reflection direction of the laser beam can be used on the platform. The inside of the lower space is controlled in a fixed direction without causing irregular irregular reflection, and can prevent light leakage from an unintended portion. Further, the reflecting plate is formed by receiving an inclination angle of the end material falling from the gap and sliding downward obliquely downward, thereby dropping from the gap Since the end material is slid by the inclined surface of the reflecting plate without applying a large impact and accumulating in the swarf box, it has a fragment or dust pair which can be efficiently and efficiently collected and can be prevented from being fine and pulverized when dropped. The effect of adversely affecting the substrate to be processed or the driving portion of the device.

In the above invention, a cooling mechanism for cooling the reflecting plate may be provided. The reflector is cooled by the cooling mechanism, whereby the temperature rise of the reflector or the space under the reflector can be suppressed, and the adverse effect on the substrate can be prevented from occurring due to an increase in temperature. In the above invention, it is preferable that the beam spot of the laser beam is relatively movable in the X-Y direction along the predetermined line, and the gap is formed around the outer circumference of the platform. Thereby, the end material areas of the four peripheral portions of the substrate are arranged so as to protrude from the gap, and the laser processing is performed in the X-Y direction, whereby the four end materials of the substrate can be effectively separated.

A‧‧‧Laser processing unit

M‧‧‧Battery material substrate

Ma‧‧‧End timber

Space below the S‧‧‧ platform

1‧‧‧ platform

2‧‧‧ gap

10‧‧‧Laser Department

12‧‧‧ Side wall of the space below

13‧‧‧reflector

14‧‧‧Cooling mechanism

15‧‧‧Stainless glass box

Fig. 1 is a perspective view showing the outline of a laser processing apparatus which is an embodiment of the present invention.

Figure 2 is a cross-sectional view showing a portion of the breaking step of the laser processing apparatus of Figure 1.

Figure 3 is a cross-sectional view showing another portion of the breaking step of the laser processing apparatus of Figure 1.

Figure 4 is a plan view showing the platform portion.

Fig. 5 is a schematic perspective view showing a laser processing apparatus according to another embodiment of the present invention.

Figure 6 is a cross-sectional view showing a portion of the breaking step of the laser processing apparatus of Figure 5.

Figure 7 is a cross-sectional view showing another portion of the breaking step of the laser processing apparatus of Figure 5.

Fig. 8 is a view for explaining the subject of the present invention.

In the following, the details of the present invention will be described based on the drawings showing embodiments. figure 1 FIG. 2 is a cross-sectional view showing a part of a processing state of the laser processing apparatus A according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view showing another part of the processing state, FIG. 3 is a cross-sectional view showing another part of the processing state, and FIG. Top view.

The laser processing apparatus A is provided with a stage 1 on which a substrate M to be processed is placed. The platform 1 is provided with a holding mechanism to hold the substrate M placed thereon in a fixed position. In the present embodiment, as the holding means, the substrate is adsorbed and held by a plurality of small air suction holes (not shown) which are opened in the platform 1. Further, a gap 2 for the end material falling in the X direction and the Y direction is provided on the outer side of the stage 1. In the present embodiment, the gap 2 is formed in a continuous shape of a quadrangle around the outer periphery of the platform 1 as shown in FIG. Further, the platform 1 which is separated from the periphery by the gap 2 around the outer periphery is fixed to the frame 4 of the apparatus by the support member 3 below.

A support frame 5, 5 having two sides provided with a clamping platform 1 and a bridge 7 with a guide rod 6 extending horizontally in the X direction to connect the columns 5, 5 is provided to span the platform 1 Set by the way. The guide rod 6 is provided with a guide 8 extending horizontally in the X direction, and the guide 8 is attached to the guide 8 so as to be movable in the X direction along the guide 8. In the scribed head 9, a laser illuminating unit 10 for forming an optical path so that a laser beam from a laser light source (outside the drawing) is emitted toward the substrate M is provided in parallel with each other, and is followed by the ray The heating region (laser spot) of the substrate of the irradiation unit 10 is irradiated to cool the refrigerant ejecting portion immediately after the heating region. Further, the optical system or the refrigerant ejecting portion that transmits the laser beam from the laser light source to the laser irradiation unit 10 is omitted in order to avoid complication of the drawing.

Further, the bridge 7 holding the scribe head 9 is engaged with the rails 11, 11 at the lower ends of the left and right pillars 5, 5 so as to be orthogonal to the X direction along the rails 11, 11 Y Formed by the way the direction moves. Thereby, the substrate M placed on the stage 1 can be subjected to laser processing in the X-Y direction by the laser irradiation unit 10.

Further, as shown in FIG. 2, below the stage 1, a reflecting plate 13 for reflecting the laser beam passing through the gap 2 toward the side walls 12, 12 surrounding the lower space S of the stage 1 is provided.

The reflector 13 is formed in a roof shape having a ridge line along the Y direction by a metal plate made of aluminum or the like. The angle of inclination of the reflecting surface of the reflecting plate 13 is such that the laser beam passing through the gap 2 is reflected toward the side walls 12, 12 surrounding the space below the platform 1, and the end material falling from the gap 2 is inclined downwardly obliquely downward. And formed. The angle is preferably about 30 to 60 degrees.

Further, below the inclined lower end portion of the reflecting plate 13, a swarf box 15 that receives the slipped end material and gathers is provided. The swarf box 15 is preferably formed to be accessible from the frame 4 of the apparatus.

2 and 3 show the steps of breaking the end material along the Y direction of the substrate M by the laser beam. As shown in FIG. 2, the substrate M is placed on the stage 1 in a state in which the portion corresponding to the end material protrudes into the gap 2 extending in the Y direction outside the platform 1. In this state, by moving the bridge 7 in the Y direction along the rail 11, the laser beam from the laser irradiation unit 10 is scanned to break the end material and the end material is dropped downward from the gap 2. The dropped end material Ma, as shown in Fig. 3, is slid down by the inclined surface of the reflecting plate 13 and falls to the swarf box 15 to be gathered. Thereby, the end material Ma can be efficiently collected in a concentrated manner, and the impact of the falling can be alleviated, and the fragments or dust of the end material which is finely pulverized at the time of dropping can be prevented from adversely affecting the driving portion of the substrate or device to be processed. Further, when the end material along the X direction of the substrate is cut, the substrate M is placed in a state in which the gap 2 (see FIG. 1) extending in the X direction of the outer side of the stage 1 is protruded. Placed on platform 1. Further, the scribing head 9 is moved along the guide 8 in the X direction.

Further, in the present embodiment, the gap 2 is formed in a quadrangular shape so as to surround the outer circumference of the stage 1, and therefore, as shown in FIG. 4, the peripheral material of the peripheral portion of the substrate M which is formed in a predetermined size is formed. The region is arranged so as to protrude from the gap 2 of the square to perform laser processing in the XY direction, whereby the end materials of the four sides of the substrate can be effectively separated.

By completely dividing the end material of the laser beam, by designing the illumination optical system of the laser beam, increasing the output, or slowing down the scanning speed, etc., it can be performed by one-time laser processing, but as described above. As described above, the first laser beam is used to form a scribe line, and the second time of the laser beam scanning is performed by changing the irradiation conditions on the scribe line, thereby enabling the formation of the previous scribe line. The crack penetrates until it reaches the back of the substrate and is broken.

During the scoring of the above-mentioned laser beam, the laser beam passing from the gap 2 to the lower side of the platform is reflected by the reflecting plate 13 toward the inner surface of the side walls 12, 12 surrounding the lower space of the platform 1. Thereby, the reflection direction of the laser beam passing through the gap 2 is controlled to be fixed in the space below the stage, and irregular irregular reflection can be prevented, and light leakage from an unexpected portion can be prevented.

Next, a second embodiment of the present invention will be described. 5 is a schematic perspective view of a laser processing apparatus B according to a second embodiment, FIG. 6 is a cross-sectional view showing a part of the processing state, FIG. 7 is a cross-sectional view showing another part of the processing state, and FIG. 4 is a sectional view showing the platform portion. Top view.

In the configuration of the laser processing apparatus B, the same components as those of the laser processing apparatus A described with reference to FIGS. 1 to 3 are denoted by the same reference numerals, and a part of the description will be omitted. The laser processing apparatus B is disposed below the platform 1 as shown in FIG. The laser beam of the gap 2 faces the reflecting plate 13 which is reflected by the side walls 12, 12 of the lower space S of the platform 1, and is provided with a cooling mechanism 14 for cooling the reflecting plate 13.

The cooling mechanism 14 includes a nozzle 14a, and the nozzle 14a is disposed above the reflector 13 to eject the coolant toward the reflector 13. As the coolant, a liquid such as water or a gas such as air can be used.

Further, in the present embodiment, the swarf box is not provided below the inclined lower end portion of the reflecting plate 13, but the swarf box 15 may be provided in the same manner as the laser processing apparatus A described with reference to Figs. .

Fig. 6 and Fig. 7 show the steps of dividing the end material along the Y direction of the substrate M in the present embodiment. As shown in FIG. 6, the substrate M is placed on the stage 1 in a state in which the portion 2 corresponding to the end material protrudes into the gap 2 extending in the Y direction on the outer side of the stage 1. In this state, the bridge 7 is moved in the Y direction along the rails 11, whereby the laser beam from the laser irradiation unit 10 is scanned, and the end material is broken and the end material is dropped downward from the gap 2. The dropped end material Ma, as shown in Fig. 7, is slid down by the inclined surface of the reflecting plate 13 and gathered at the inclined lower portion. In this case, a pullable tray (outside the drawing) is disposed in a portion of the gathered end material, whereby the gathered end material can be easily taken out to the outside. Further, when the end material is cut along the X direction of the substrate, the substrate M is placed in a state in which the portion corresponding to the end material protrudes in the X direction extending from the outside of the stage 1 in the X direction (see FIG. 5). On platform 1. Further, the scribing head 9 is moved along the guide 8 in the X direction. Further, even in the present embodiment, since the gap 2 is formed in a quadrangular outline so as to surround the outer circumference of the stage 1, as shown in Fig. 4, the peripheral portion of the substrate M which is formed in a predetermined size is used. The end material region is arranged to protrude from the gap 2 of the square shape to perform laser scribing in the XY direction, thereby enabling the square end plates of the substrate to be effective Ground the ground.

At the time of scribing, the laser beam passing from the gap 2 to the lower side of the platform is reflected by the reflecting plate 13 toward the inner surface of the side walls 12, 12 surrounding the lower space of the platform 1. Thereby, the reflection direction of the laser beam passing through the gap 2 is controlled to be fixed in the space below the stage, and irregular irregular reflection can be prevented, and light leakage from an unexpected portion can be prevented. Further, at this time, since the reflecting plate 13 that receives the irradiation of the laser beam is cooled by the cooling mechanism 14, it is possible to suppress the temperature rise of the reflecting plate 13 or the space S in the lower portion thereof, and it is possible to prevent the substrate from being caused by the temperature rise. Bad effects.

Although the representative embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and may be appropriately modified or changed within the scope of the scope of the claims.

The present invention can be applied to a laser processing apparatus such as a scribing process or a division for breaking a brittle material substrate using a laser beam.

1‧‧‧ platform

2‧‧‧ gap

3‧‧‧Support materials

4‧‧‧Architecture

10‧‧‧Laser Department

12‧‧‧ Side wall of the space below

13‧‧‧reflector

15‧‧‧Stainless glass box

A‧‧‧Laser processing unit

M‧‧‧Battery material substrate

Space below the S‧‧‧ platform

Claims (4)

A laser processing apparatus for processing a beam spot of a laser beam emitted from a laser irradiation portion by relatively moving along a predetermined line of a substrate placed on a platform, thereby processing the substrate, wherein: The outer side of the platform is provided with a gap for causing the end material generated when the substrate is broken to fall below the platform; below the platform, a laser beam passing through the gap is disposed to reflect the side wall of the space surrounding the platform. Reflective plate. The laser processing apparatus of claim 1, wherein the reflector is formed by receiving an inclination angle of the end material falling from the gap and sliding it downwardly obliquely, and at an inclined lower end of the reflector Below it, a swarf box that receives the slipped end material and gathers is provided. A laser processing apparatus according to claim 1, wherein a cooling mechanism for cooling the reflecting plate is provided. The laser processing apparatus according to any one of claims 1 to 3, wherein the beam point of the laser beam is relatively movable in the XY direction along a predetermined line, and the gap surrounds the platform. Formed outside the week.