TW201337984A - Manufacture process of surface-mount type chip coil - Google Patents

Abstract

The present invention provides a manufacture process of surface-mount type chip coils, comprising the following steps: a winding step by winding coil material in the frame of a frame assembly to form at least one coil; a positioning step for pre-pressing and positioning the coil formed in the winding step at the center of pre-filled iron powder in the cavity of a bottom mold; a filling step for filling iron powder from top of the coil after the positioning step; a stamping step for squeezing the iron power filled in the filling step by a stamping machine so as to form a semi-finished inductor; and a removal step for taking out the semi-finished inductor formed in the stamping step and subjecting to the steps including first baking, coating, second baking and electroplating so on. By winding at least one coil in the frame of the frame assembly and the mold comprising at least one cavity, the production jig used in present invention can be applicable to mass production and makes the yield increase so as to enable the present invention to greatly increase the production capacity and efficiency.

Description

Surface mount wafer coil process

The invention provides a surface-adhesive wafer coil process, in particular to a surface-adhesive wafer coil process which can be applied to mass production and increase production, thereby achieving the effects of greatly improving productivity and production efficiency.

For example, in the Republic of China Patent Application No. 099110062, "Manufacturing Method of Surface Mounted Inductor and Surface Mounted Inductor", the first step is to prepare a hollow core coil wound by a rectangular coil into two spirals. The two ends of the air-core coil are pulled out to the same side of the air-core coil, and a package material obtained by mixing iron-based metal magnetic powder and epoxy resin is prepared, and the package material is made into a plate. The plate has a flat portion and a two-column convex portion; the second step: placing the hollow core coil of the first step on the flat portion of the plate, and causing the two ends of the hollow core coil to be along the column of the plate The outer side surface of the convex portion is disposed; the third step: placing the material plate in which the hollow core coil is placed in the second step into a molding die, the molding die being provided with an upper mold and a lower mold, wherein the upper mold is provided by the first upper mold The mold and the second upper mold are formed, and both ends of the hollow core coil are held by the columnar convex portion of the plate and the inner wall surface of the second upper mold, and the two ends of the hollow core coil can be fixed; Step: opening the mold from the forming mold Putting an unhardened plate-like plate into the mouth, so that the plate-like plate can cover the hollow core coil in the third step, and the plate-shaped plate is the same material as the plate in the third step; Five steps: heating the forming mold to above the softening temperature of the plate-like plate and the plate, so that the plate-like plate and the plate can be softened; the sixth step: installing a punch from the opening of the forming die to make the punch Lowering the stamping action, and integrating the sheet material in the fifth step with the sheet material to form a packaging material; and the seventh step: taking out the hardening of the packaging material from the forming mold in the sixth step a body, the surface of the molded body is exposed with an end portion of the hollow core coil; an eighth step: coating the end portion of the surface of the molded body in the seventh step with a conductive resin; ninth step: the conductive resin in the eighth step Performing a plating process to form an external electrode, thereby obtaining a surface mount inductor; the "surface mount inductor manufacturing method and the surface mount inductor" by the second step of the hollow core coil Respectively, along the outer side surface of the columnar convex portions of the sheet configuration, and both end portions may be planar air-core coil exposed to a sum of the surface of the molded and fixed, so that good engagement is obtained between the area of the external electrode.

The "surface mount inductor manufacturing method and the surface mount inductor" can provide a good bonding area between both end portions of the air core coil and the external electrode, but the package material must be used before the first step. The sheet material having the flat portion and the two-columnar convex portion is prepared in advance, so that the mold of the sheet material must be prepared before the sheet can be made by using the mold, which will result in complicated overall processing, slow processing speed and high process cost; And because its manufacturing methods and related fixtures are only for the production of a single surface mount inductor, there is no or a step or mechanism design that is suitable for mass production or productivity improvement, so the production efficiency or output is very limited. In addition, since the air-core coil is wound into a two-stage spiral shape by a special rectangular wire, it is necessary to first process the round wire to make the square wire, which will increase the wire cost. There is still a need for improvement.

Therefore, how to eliminate the above-mentioned defects is the technical difficulty point that the inventor of the case wants to solve.

In view of the manufacturing method of the existing surface mount inductor, since the manufacturing method and the related jig are only for the production of a single surface mount inductor, the improvement in production efficiency or yield is very limited, and therefore it is an object of the present invention to provide a method. The surface-adhesive wafer coil process is characterized in that at least one coil is arranged in the material frame of the material frame assembly, and the mold is provided with at least one cavity, so that the related production jig of the invention can be applied to mass production and increase output. In turn, the invention can achieve the effects of greatly increasing productivity and production efficiency.

In order to achieve the above object, the present invention provides a surface-adhesive wafer coil process comprising the steps of: a winding step of winding a wire in a frame of a hopper assembly to form at least one coil, And fixing the two ends of the wire to the material frame respectively; and positioning step, the positioning step is pre-pressing the coil of the winding step to the center of the iron powder pre-filled in the cavity of the lower mold; filling step The filling step is to fill the iron powder above the coil which completes the positioning step; the pressing step is to press the iron powder of the filling step with a punching machine to form a half-finished inductor; the removing step, the step of removing The taking step is to take out the semi-finished inductor of the stamping step; the first baking step, the first baking step is to perform the first baking of the semi-finished inductor of the taking step; the coating step, the coating step is Finishing the semi-finished inductor of the first baking step to perform a coating operation, so that the outer surface of the end edge of the inner coil of the semi-finished inductor is coated with a conductive resin layer; the second baking step, the second The baking step is to perform the second baking of the semi-finished inductor of the coating step; the electroplating step is to perform the electroplating action of the semi-finished inductor of the second baking step to electroplate the outer surface of the conductive resin layer. a layer of welding material; the frame assembly is provided with at least one coil in the material frame, and the mold is provided with at least one cavity, so that the related production jig of the invention can be applied to mass production and increase production, and further The invention can achieve the effects of greatly increasing productivity and production efficiency.

In order to make it easier for the examiner to understand the other features and advantages of the present invention and the effects achieved thereby, the present invention will be described in detail with reference to the accompanying drawings. Referring to the first figure, the present invention is A surface-adhesive wafer coil process is provided, comprising the following steps: winding step 1, please refer to the first figure and the second figure, the winding step 1 is to wind the wire 12 around the frame of the material frame assembly 11. Forming at least one coil 13 therein, wherein the wire 12 may be a circular line or an elliptical line, and both ends of the wire 12 are respectively fixed with the frame 111, and the frame assembly 11 includes at least A frame 111; positioning step 2, please refer to the second figure and the second figure A. The positioning step 2 pre-presses the coil 13 of the winding step 1 to the lower mold 20 and the cavity 204 thereof. Filled in the center of the iron powder 24, the pre-filled iron powder 24 may have a particle size of 0.1 to 500 μm (micrometer), wherein the mold 20 is provided with at least one cavity 204. In the embodiment, the cavity 204 is Square, and the size of the cavity 204 is the size of a single inductor In addition, the cavity 204 is formed by the middle mold 201 and the lower mold 202 of the mold 20, as shown in the first figure, and the positioning step 2 is provided with the alignment step 21, the placing and cutting step 22 and shifting. In step 23, please refer to the second figure and the second figure A, wherein the alignment step 21 adjusts the position of the frame assembly 11 in the winding step 1 and makes it with the alignment portion of the mold 20. Corresponding to the position of 203, the coil 13 can be accurately located in the center of the iron powder 24 pre-filled in the cavity 204 of the lower mold 20, and the alignment portion 203 can be a matching point or an alignment pin. Please refer to the first figure and the third figure again. The placing and cutting step 22 is performed by using the press tool 41 to the direction of the lower mold 202 of the mold 20 with a force of 0.1 to 1 metric ton. The coil 13 can be pressed and placed in the center of the pre-filled iron powder 24 in the cavity 204, and the excess wire at both ends of the coil 13 is cut off. Please refer to the eighth figure, 俾The end edges 131, 132 of the two ends of the coil 13 may have a circular cross section or an elliptical cross section, as shown in the first figure and the fourth figure. In addition, the shifting step 23 moves the punching tool 41 of the placing and cutting step 22 upwards away from the coil 13, and then shifts the middle mold 201 upward or shifts the lower mold 202 downward. The inner wall of the middle mold 201 can be formed into the accommodating space 25; in step 3, please refer to the first figure and the fifth figure, the filling step 3 is filled with iron powder above the coil 13 which completes the positioning step 2. 26, the iron powder 26 may have a particle size of 0.1 to 500 μm (micrometer), that is, the filling step 3 can fill the iron powder 26 into the accommodating space 25 between the middle molds 201, and the iron powder can be made. 26 is filled in above the coil 13 in the positioning step 2; in the stamping step 4, as shown in the first figure and the sixth figure, the stamping step 4 presses the iron powder 26 filled in the step 3 with the press tool 41, so that It is formed as a half finished inductor 17, that is, the punching step 4 is displaced in the direction of the lower die 202 by the press tool 41 and pressed to the iron powder 26 at a press pressure of 0.1 to 1.0 metric ton, and the pre-filled iron powder can be made. 24 and the iron powder 26 and the coil 13 filled in the step 3 are pressed and brought into a half of the finished inductor 17; the removal step 5, as shown in the first figure and the eighth figure, The take-out step 5 takes out the semi-finished inductor 17 that completes the stamping step 4, as shown in the seventh and eighth figures, that is, the take-out step 5 is to move the press tool 41 in the press step 4 away from the semi-finished inductor 17 Shifting, and the middle mold 201 can be displaced downward or the lower mold 202 can be displaced upward, so that the horizontal height of the middle mold 201 and the lower mold 202 can be made high, so that the semi-finished inductor 17 of the stamping step 4 can be taken out. The first baking step 6, please refer to the first figure and the eighth figure. The first baking step 6 is to take out the semi-finished inductor 17 of the step 5 for the first baking to make the semi-finished inductor. 17 curing, wherein the first baking temperature is 140-200 ° C, and the first baking time is 4-10 hours, controlling the temperature and time of the first baking can make the semi-finished inductor 17 reach The best curing effect; coating step 7, please refer to the first figure and the ninth figure, the coating step 7 is to complete the coating operation of the semi-finished inductor 17 of the first baking step 6 to make the semi-finished inductor The outer surfaces of the end edges 131 and 132 of the inner coil 13 are coated with a guide Electro-resin layer 71, 72; second baking step 8, please refer to the first figure and the ninth figure, the second baking step 8 is to complete the second half of the finished product of the coating step 7 The secondary baking causes the conductive resin layers 71, 72 of the semi-finished inductor 17 to be solidified, wherein the second baking temperature is 200 to 260 ° C, and the second baking time is 30 to 40 minutes, and the control is performed. The temperature and time of the second baking can achieve the best curing effect of the conductive resin layers 71, 72 of the semi-finished inductor 17, and can prevent the conductive resin layers 71, 72 from falling off during plating; plating step 9, please refer to the first As shown in FIG. 10 and FIG. 10, the plating step 9 performs a plating operation on the semi-finished inductor 17 of the second baking step 8, and the outer surfaces of the conductive resin layers 71 and 72 are plated with at least one layer of solder materials 91 and 92. The semi-finished inductor 17 can be made into a surface-adhesive inductor, and the surface-adhesive chip coil of the present invention can be completed. The outer surfaces of the conductive resin layers 71 and 72 are plated with solder materials 91 and 92. , so that the surface-adhesive inductor can facilitate the use of the surface SMT (Surface Mount Technology) is quickly soldered or adhered to the circuit board, wherein the solder material 91, 92 may be copper or nickel or tin or silver; please refer to the second figure A and the third figure It can be seen that the positioning step 2 can directly locate the coil 13 and the iron powder 24, and can eliminate the need to first process the finished sheet into a sheet, which leads to a complicated overall process, a slow processing speed and a lack of process cost, thereby enabling The invention can achieve the effects of simplifying the process, increasing the process speed and reducing the process cost; please refer to the second figure, and the frame frame 11 is surrounded by at least one coil 13 in the frame 111, the mold 20 The at least one cavity 204 is provided, so that the related production jig of the present invention can be applied to mass production and increase the yield, so that the invention can both greatly improve the productivity and the production efficiency; in addition, by the winding The wire 12 in the wire step 1 is a circular wire or an elliptical wire, and the step of separately processing the rectangular wire can be eliminated, so that the invention can reduce the processing cost of the wire 12 at the same time.

Referring to FIG. 11 and FIG. 12 again, a second embodiment of the present invention is shown. The mold 20 of the positioning step 2 has a cavity 204 of an elongated shape, and the cavity 204 has a size and a size. The at least two inductors are sized correspondingly to each other, whereby the semi-finished inductor 17 that completes the removal step 5 actually contains at least two single semi-finished inductors 17, as shown in FIG. A cutting step 51 is further provided between the removing step 5 and the first baking step 6. The cutting step 51 cuts the semi-finished inductor 17 of the above-mentioned completion removing step 5, and at least two singles are obtained. The semi-finished inductor 17 can thereby produce a plurality of semi-finished inductors 17 at the same time by using a single cavity 204, thereby simplifying the structure of the mold 20 and increasing the productivity, thereby enabling the present invention to It has the effect of simplifying the structure and improving the production capacity.

Referring to the thirteenth and fourteenth drawings, a third embodiment of the present invention is shown. The lower mold 202 of the mold 20 in the positioning step 2 further includes four telescopic positioning posts 205. The positioning post 205 can be retracted into the lower mold 202 during the stamping step 4, thereby enabling the positioning post 205 to achieve a better limit and positioning effect on the coil 13 in the positioning step 2. The invention can achieve the effect of achieving better positioning effect.

In order to make the present invention more expressive and practical, a comparative analysis with the prior art is as follows:

Lack of use:

1. The board must be pre-made, resulting in complicated process, slow processing speed and increased process cost.

2. The fixture design is only for the production of a single inductor. It is not suitable for mass production and therefore cannot increase production capacity.

3, the circular wire must be additionally processed and flattened into a flat line, resulting in increased wire cost

The advantages of the invention:

1. The positioning step can directly locate the coil and the iron powder, and can eliminate the lack of processing of the plate to be processed first, thereby simplifying the process and improving the speed of the process.

2, the fixture design can be applied to the mass production of the inductor, which can achieve the effect of improving production capacity.

3, the wire only needs to use a circular line or an elliptical line, and can eliminate the need for additional processing to make a flat angle step, thereby reducing the processing cost of the wire.

4. It can reduce the offset of the coil after positioning, which can improve the process yield.

In summary, the present invention has achieved the desired effect under the prior art structure, and is not familiar to those skilled in the art. Further, the present invention has not been disclosed before the application, and it has The progressiveness and practicability have been consistent with the application requirements of the invention patent, and the application for invention is filed according to law. You are requested to approve the application for the invention patent to encourage the invention.

The detailed description of the present invention is intended to be illustrative of a particular embodiment of the invention, and is not intended to limit the scope of the invention. In the scope of the patent in this case.

1. . . Winding step

11. . . Bin component

111. . . Material frame

12. . . Wire

13. . . Coil

131. . . End edge

132. . . End edge

17. . . Semi-finished inductor

2. . . Positioning step

20. . . Mold

201. . . Medium mold

202. . . Lower mold

203. . . Counterpoint

204. . . Cavity

205. . . Positioning column

twenty one. . . Alignment step

twenty two. . . Insert and trim steps

twenty three. . . Shift step

twenty four. . . Iron powder

25. . . Housing space

26. . . Iron powder

3. . . Fill in the steps

4. . . Stamping step

41. . . Stamping machine

5. . . Removal step

51. . . Cutting step

6. . . First baking step

7. . . Coating step

71. . . Conductive resin layer

72. . . Conductive resin layer

8. . . Second baking step

9. . . Plating step

91. . . Welding materials

92. . . Welding materials

The first figure is a block diagram of the steps of the present invention.

The second figure is a partial top view of the winding step and the positioning step of the present invention.

The second A diagram is a schematic diagram of the action before the insertion and cutting steps of the positioning step of the present invention.

The third figure is a schematic view of the action of the placing and cutting steps of the positioning step of the present invention.

The fourth figure is a schematic diagram of the action of the shifting step of the positioning step of the present invention.

The fifth figure is a schematic view of the action of the filling step of the present invention.

The sixth figure is a schematic view of the action of the stamping step of the present invention.

The seventh figure is a schematic view of the action of the removal step of the present invention.

The eighth figure is a perspective view of the inductor of the present invention in which the extraction step is completed.

The ninth drawing is a schematic side view of the inductor of the present invention in which the coating step is completed.

The tenth figure is a schematic side view of the inductor of the present invention in which the electroplating step is completed.

Figure 11 is a partial plan view showing the mold of the second embodiment of the present invention.

Figure 12 is a block diagram showing the steps of the second embodiment of the present invention.

Figure 13 is a partial perspective view of the mold of the third embodiment of the present invention.

The fourteenth embodiment is a schematic view of the third embodiment of the present invention which achieves a better auxiliary positioning effect.

1. . . Winding step

2. . . Positioning step

twenty one. . . Alignment step

twenty two. . . Insert and trim steps

twenty three. . . Shift step

3. . . Fill in the steps

4. . . Stamping step

5. . . Removal step

6. . . First baking step

7. . . Coating step

8. . . Second baking step

9. . . Plating step

Claims (15)

A surface-adhesive wafer coil process comprising the steps of: a winding step of winding a wire around a frame of a hopper assembly to form at least one coil, and having the two ends of the wire respectively The frame phase is fixed; the positioning step is to pre-position the coil of the winding step to the center of the pre-filled iron powder in the cavity of the lower mold; the filling step is to complete the positioning step The iron powder is filled above the coil; the stamping step is to press the iron powder of the filling step with a punching machine to form a half of the finished inductor; and the removing step is to complete the semi-finished inductor of the stamping step Taking out; the first baking step, the first baking step is to perform the first baking of the semi-finished inductor of the taking step; the coating step is to complete the semi-finished inductor of the first baking step Performing a coating operation to coat the outer surface of the end edges of the inner coils of the semi-finished inductor with a conductive resin layer; in the second baking step, the second baking step is to complete half of the coating step A second inductor bake goods; plating step, the plating step will be completed based semi inductance of the second baking step plating operation, so that the outer surface of the conductive resin layer for electroplating at least one layer of solder material. The surface-adhesive wafer coil process of claim 1, wherein the mold of the positioning step is provided with an alignment portion. The surface mount type wafer coil process of claim 2, wherein the positioning step is provided with a aligning step of adjusting a position of the hopper assembly in the winding step and making a pair with the mold The position of the position corresponds. The surface-adhesive wafer coil process of claim 1, wherein the cavity is formed by a middle mold and a lower mold of the mold. The surface mount type wafer coil process of claim 4, wherein the lower mold further comprises four retractable positioning posts. The surface-adhesive wafer coil process of claim 4, wherein the positioning step is provided with a placing and cutting step, and the placing and cutting step is performed by using a punching machine with a force of 0.1 to 1 metric ton to the mold. The direction of the lower mold is displaced so that the coil can be squeezed into and positioned in the center of the pre-filled iron powder in the cavity, and the excess wire at both ends of the coil is cut off. The surface-adhesive wafer coil process of claim 6, wherein the placing and trimming step is followed by a shifting step of moving the punching tool of the placing and cutting step upwards. Moving away from the coil, the middle mold is displaced upward or the lower mold is displaced downward, so that the inner wall of the middle mold forms an accommodation space. The surface-adhesive wafer coil process of claim 1, wherein the pre-filled iron powder in the positioning step and the iron powder in the filling step have a particle size of 0.1 to 500 μm. The surface-adhesive wafer coil process of claim 1, wherein the press machine of the stamping step presses the iron powder of the filling step with a press pressure of 0.1 to 1 metric ton. The surface-adhesive wafer coil process of claim 1, wherein the first baking temperature is 140 to 200 ° C, and the first baking time is 4 to 10 hours. The surface-adhesive wafer coil process of claim 1, wherein the second baking temperature is 200 to 260 ° C, and the second baking time is 30 to 40 minutes. The surface mount wafer coil process of claim 1, wherein the soldering material of the plating step is copper or nickel or tin or silver. The surface-adhesive wafer coil process of claim 1, wherein the positioning step of the mold has a square cavity, and the size of the cavity corresponds to a size of a single inductor. The surface mount type wafer coil process of claim 1, wherein the positioning step of the mold has an elongated shape, and the size of the cavity corresponds to the size of at least two inductors side by side. The surface-adhesive wafer coil process of claim 14, wherein the cutting step and the first baking step are further provided with a cutting step, wherein the cutting step is to perform the semi-finished inductance of the removing step. Cut.