TW201337251A - Electrode substrate and circuit pattern inspection apparatus having the same - Google Patents

Abstract

In the present invention, the sensor electrode substrate or power supply electrode substrate used in a circuit pattern inspection apparatus is an electrode substrate having penetrating wirings through two sides of the substrate formed by bonding a glass plate with patterned wirings, cutting the glass plate into glass pieces, and bonding the glass piece to other glass pieces in the direction of thickness.

Description

Electrode substrate and circuit pattern inspection device including the same

The present invention relates to an electrode substrate which can detect a defect of a conductive pattern formed on a substrate in a non-contact manner, and a circuit pattern inspection device including the electrode substrate.

Generally, the mainstream of the display device is a liquid crystal display device using liquid crystal on a glass substrate or a plasma display device using plasma. In the manufacturing steps of the display devices, it is checked whether or not there is a disconnection or a short circuit in the conductive pattern formed on the glass substrate as a circuit wiring.

For example, in Japanese Laid-Open Patent Publication No. 2004-191381, at least two inspection probes are brought close to a conductor pattern, and the probe is moved in a state of being capacitively coupled to the conductor pattern in a non-contact manner. And an AC inspection signal is applied from one inspection probe, and an AC inspection signal of the transmission conductor pattern is detected by another inspection probe. Whether or not there is a disconnection and a short circuit in the conductive pattern is detected by the change of the detection signal waveform.

With the improvement of the manufacturing technology corresponding to the need for high resolution of the screen, the display device can achieve higher density and miniaturization of pixels and wiring. That is, the wiring width of the conductor pattern and the distance between the wirings are shortened. In order to correspond to the miniaturization of such a conductor pattern, it is required to improve the detection capability of the sensor in the inspection apparatus for checking the disconnection and the short circuit.

a sensor electrode that inspects the above conductor pattern in a non-contact manner In the case of the sensor electrodes that face each other along the conductor pattern, the disconnection and the short circuit can be checked.

The sensor signal detected by the sensor electrode must be transmitted to the inspection signal processing unit by the laid wiring. The sensor substrate on which the non-contact sensor electrode is formed, the wiring formed on the sensing surface facing the conductive pattern, and the like, receives the inspection signal applied from the power supply electrode in the same manner as the sensor electrode, Therefore, in the case where the wiring is laid in the direction crossing the conductor pattern, the detection signal of the conductive pattern from the non-inspection object is received, and an interference signal is generated.

Therefore, the wiring connected to the sensor electrode on the sensor substrate extends along the conductive pattern to the edge, is applied upward to the side of the sensor substrate, or penetrates the inside of the substrate, for example, through a contact hole or a VIA hole. After passing through the non-sensing surface, wiring is performed until the signal processing unit is inspected. Currently, the holes formed in the sensor substrate are usually mechanically formed using a drill or the like. Further, as another technique for forming a hole, a multilayer wiring forming technique in a semiconductor manufacturing technique can be employed.

Among them, in the technique of forming a hole mechanically, a through hole is formed by a drill, and the through hole is filled to form a VIA wiring. Therefore, in the case where the width of the conductive pattern to be inspected and the distance between the wirings are equal to or less than the diameter of the drill, since the VIA wiring is hung with the adjacent conductive pattern, it is impossible to detect the conductive pattern having a wiring interval smaller than the diameter of the drill. Precision inspection.

Further, in the case where a hole for penetrating the substrate formed of the insulator is formed by a multilayer wiring forming technique and the hole is filled with a metal, a semiconductor processing program can also be used. However, when a fine wiring is formed on a sensor substrate having a thickness, in the case where a hole is formed by a semiconductor processing program and a landfill process is performed, depending on the aspect ratio of the performance (program) of the etching device, The width-dependent depth creates a limit, which may result in a large diameter VIA wiring.

According to a first aspect of the present invention, an electrode substrate includes at least one through wiring formed to penetrate at least one surface of a rectangular first partial electrode substrate, and a substrate having the through wiring through surface and back surface of the first partial electrode substrate The direction is set on one side or both sides in a direction orthogonal to the surface on which the through wiring is formed, so that a plurality of second partial electrode substrates which are formed in a rectangular shape and are not formed with wiring are arranged The electrode is integrally joined and fixed to each other; the electrode is electrically connected to one end portion of the through wiring on the substrate surface side; and the electrode pad is electrically connected to the other end portion of the through wiring on the back surface side of the substrate.

Further, a second embodiment of the present invention provides a circuit pattern inspection device including a sensor electrode substrate, a power supply electrode substrate, a moving portion, an inspection portion, and a defect determination portion. The sensor electrode substrate includes: a through wiring formed on a side surface of the rectangular partial electrode substrate so as to penetrate the side surface; and a substrate on which the partial electrode substrate having the through wiring is formed into a plurality of rectangular portions The electrode substrate is assembled to have a desired size, and the side surface of the first partial electrode substrate that penetrates the surface and the back surface is integrally formed on both sides in a direction including the surface on which the through wiring is formed and orthogonal to the surface The sensor electrode is electrically connected to one end portion of the through wiring on the surface side of the substrate; and the electrode electrode for signal extraction is electrically connected to the other end portion of the through wiring on the back surface side of the substrate . The power supply electrode substrate includes the substrate, a power supply electrode electrically connected to one end portion of the through wiring on the surface side of the substrate, and a signal application electrode pad electrically connected to the other end portion of the through wiring on the back surface side of the substrate. The moving portion is a substrate in which a plurality of conductive patterns are formed in a row, and the sensor is integrally held so that the sensor electrode and the power supply electrode face each other with respect to one conductive pattern. The electrode substrate and the power supply electrode substrate are spaced apart from each other over the conductive pattern and moved in a direction intersecting the conductive pattern row. The inspection unit supplies an inspection signal formed by the alternating current signal from the power supply electrode to the capacitively coupled conductive pattern during movement of the power supply electrode and the sensor electrode by the moving portion, and acquires a capacitive coupling The above-mentioned inspection signal transmitted by the conductive pattern to the sensor electrode. The defect determination unit compares the peak value of the detection signal obtained by the sensor electrode with a predetermined determination reference value to determine whether or not there is a defect.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the manufacturing process of a display device such as a liquid crystal display device, the circuit pattern inspection device of the present embodiment detects defects such as disconnection and short-circuit, which are causes of defects in a plurality of columns of conductive patterns (wiring patterns) formed on a glass substrate. .

The conductive pattern to be inspected is, for example, a circuit wiring used for a liquid crystal display panel or a touch panel, or the like, which is a conductive pattern that is electrically arranged in parallel with each other in a plurality of columns, or one end side of all the conductive patterns that are connected in parallel by a shorting bar. Comb-shaped conductive pattern. Further, each of the conductive patterns formed on the substrate may be inspected even if it is not parallel and equally spaced.

Further, when the inspection unit described later moves, if the power supply electrode and the sensor electrode are opposed to each other in the same conductive pattern, the bending or the width change can be performed in the same manner in the middle of forming the conductive pattern. . In the following description, for convenience of understanding, a conductive pattern formed in a line shape at regular intervals will be described as an inspection target.

Fig. 1 is a view showing a conceptual configuration of a circuit pattern inspection device according to an embodiment of the present invention.

The circuit pattern inspection device 1 includes an inspection unit 2 that is provided above a plurality of rows of conductor patterns 101 formed on an insulating substrate 100 such as a glass substrate, and is provided with a predetermined distance. The moving mechanism 3 maintains the inspection unit 2 Separating (non-contact) state, and moving over the conductor pattern 101 in the direction of the arrow crossing the conductor pattern 101; driving the control portion 4 for driving control The detection signal supply unit 13 supplies an inspection signal formed by an alternating current signal to the inspection unit 2, and the detection signal processing unit 5 applies a signal processing to be described later to the detection signal detected by the inspection unit 2; the control unit 6 The display unit 8 displays inspection information including the inspection result, and the input unit 7 is configured to input an operation instruction, various materials, and the like, and is formed by a keyboard or a touch panel.

The detection signal processing unit 5 includes an amplification unit 16 that amplifies the detection signal detected by the inspection unit 2, and a band-pass filter that removes the noise component of the detection signal amplified by the amplification unit 16 and passes the detection signal of the predetermined frequency band. 17; a rectifying circuit 18 that performs full-wave rectification of the detection signal that has passed through the band pass filter 17, and a smoothing circuit 19 that smoothes the full-wave rectified detection signal by the rectifying circuit 18. Further, the rectifier circuit 18 and the smoothing circuit 19 are not essential components.

The control unit 6 includes a defect determination unit 20 that determines whether or not the conductive pattern is defective based on the characteristic signal (change in peak value) included in the signal-processed detection signal, and stores the memory 9 based on the user's setting conditions and the inspection. And a central processing unit (CPU) 21 that performs calculation processing using the program and the set calculation conditions. The memory 9 is a general memory, for example, a ROM, a RAM, a flash memory, or the like, a storage control program, various calculation programs, and data (tables). The central processing unit 21 can also use a computer.

As shown in FIG. 1, the inspection unit 2 is paired with a power supply electrode portion (power supply electrode substrate 14) 11 and at least one sensor electrode portion (sensor electrode substrate 15) 12 Composition.

The power supply electrode portion 11 and the sensor electrode portion 12 are integrally connected to each other and moved at the same time by, for example, a horizontal multi-joint robot arm as the moving mechanism 3. In FIG. 1, an example in which the two ends of the conductive pattern are disposed is shown. However, the arrangement position is of course not limited to both ends, and any electrode portion or two electrode portions may be disposed inside the conductive pattern. That is, as long as the conductive pattern is opposite to the power supply electrode and the sensor electrode, it can be arranged to be separated on the substrate to be inspected (for example, at both ends of the conductive pattern), and conversely, in an approaching position. Configuration. This is because the inspection unit 2 detects the detection signal based on the capacitive coupling. Therefore, if the capacitance of the conductive pattern is changed by the disconnection defect, the peak value of the detection signal changes. Similarly, in the case where there is a short-circuit defect, if the capacitance of the conductive pattern changes, since the capacitance is different from that in the normal pattern, the peak value of the detection signal changes. Further, in the case where there is a disconnection defect and a short-circuit defect, the detected signal appears to change in the positive and negative reverse peaks.

The power supply electrode portion 11 forms one of the supply electrodes 22a and 22b at the same interval from the conductive pattern at a distance from the conductive pattern, for example, on the surface of the electrode substrate 14 formed of the glass. The power supply electrodes 22a and 22b have a width similar to the width of the conductive pattern to be inspected, and have an arbitrary length (a length opposite to the conductive pattern). The length of the power supply electrodes 22a, 22b is proportional to the amount of current applied to the inspection signal of the conductive pattern, and the longer the electrode, that is, the larger the area facing the conductive pattern, The amount of current that can be applied also increases. Further, when the widths of the power supply electrodes 22a and 22b are opposite to the conductive pattern to be inspected, it is preferable to reduce the width to the sum of the width of the conductive pattern and the pattern interval so as not to apply an inspection signal to the adjacent conductive pattern (so-called pitch). ).

Further, the sensor electrode portion 12 similarly forms a sensor electrode (first sensor electrode) for detecting a disconnection defect on a surface facing the conductive pattern of the electrode substrate 15 formed of an insulator such as glass. 23a and a sensor electrode (second sensor electrode) 23b for detecting a short defect.

Similarly to the power supply electrodes 22a and 22b, the sensor electrodes 23a and 23b have a width similar to the width of the conductive pattern to be inspected, and have an arbitrary length (a length opposite to the conductive pattern). The length of the sensor electrodes 23a, 23b is proportional to the size of the inspection signal detectable from the conductive pattern, and the longer the electrode, that is, the larger the area facing the conductive pattern, the larger the detectable signal value. However, in the case where the conductive pattern directly under the sensor electrodes 23a, 23b is defective, the detection cannot be performed. Therefore, an auxiliary sensor portion and an auxiliary power supply portion may be additionally provided for inspecting the conductive pattern portion opposed to the sensor electrodes 23a, 23b. Further, when the widths of the sensor electrodes 23a and 23b are opposed to the conductive pattern to be inspected, it is preferable that the sensor electrodes 23a and 23b do not receive the sensing signal and do not approach the adjacent conductive pattern.

Further, although not shown, a conductive pattern may be provided in which the interference sensor electrode is provided in a plurality of patterns (the number of patterns that are not affected by the electric power of the inspection signal applied from the power supply electrode 22) from the sensor electrode 23a. In the opposite direction. In the dry When the sensor electrode is disturbed, the detection signal processing unit 5 performs interference removal processing, and removes the detection signal obtained by the interference sensor electrode from the detection signals detected by the sensor electrodes 23a and 23b. That is, the interference signal.

In the present embodiment, since the inspection signal is applied by the capacitive coupling, an AC signal or a rectangular wave (pulse) signal is supplied from the inspection signal supply unit 13 to the power supply electrode 22 as an inspection signal.

The power supply electrode portion 11 and the sensor electrode portion 12 apply an inspection signal from the power supply electrode 22 toward the conductive pattern 101, and the sensor electrodes 23a, 23b detect the inspection signal transmitted in the conductive pattern 101 as a detection signal, and In a state where the same separation distance (measurement gap) is maintained above the conductive pattern, the movement mechanism 3 moves to intersect (intersect) with the conductive pattern row. Further, the electrode portion may have a lifting function for changing the height of the electrode (distance from the substrate) so as to mount the distance sensor on the power supply electrode portion 11 and the sensor electrode portion 12 to measure the distance of the object from the substrate when moving. The measurement is tracked in the case.

The detection signal processing unit 5 detects a small analog detection signal in the power supply electrode unit 11 and the sensor electrode unit 12, and the amplification unit 16 amplifies the detection signal to a predetermined voltage level (a level that can be judged to be good or bad) ). Further, the noise component of the amplified detection signal is removed by the band pass filter 17, and the necessary band is passed. Then, the rectifier circuit 18 performs full-wave rectification on the detection signal from the band pass filter 17, and then the smoothing circuit 19 smooth-filters the full-wave rectified detection signal and sends it to the defect determination unit 20. In the defect The determination unit 20 determines whether or not there is a defect based on the defect determination signal for each of the conductive patterns, and displays the determination result of all the conductive patterns 101 on the screen of the display unit 8.

FIG. 2 shows a schematic configuration of the electrode substrate 15 of the sensor electrode portion 12.

In the present embodiment, the sensor electrodes 23a and 23b are formed on the side (surface) side of the rectangular electrode substrate 15 that faces the conductive pattern to be inspected. Electrode pads 27, 28 are formed on the opposite side (back side) side of the opposite side. The sensor electrodes 23a and 23b and the electrode pads 27 and 28 are electrically connected by through wirings (or VIA wirings) 25 and 26 formed through the electrode substrate 15, respectively. In the sensor electrode portion 12, the detection signals detected by the sensor electrodes 23a and 23b are sent to the electrode pads 27 and 28 via the through wirings 25 and 26.

In the present embodiment, an example in which only the electrode lead for electrode extraction is formed will be described. However, a part of the detection signal processing unit 5 or the detection signal processing unit 5 may be formed in the vicinity of the electrode pad on the electrode substrate 15.

The electrode substrate 15 of the present embodiment is formed of an insulator such as glass. As the glass, a known glass such as soda glass, Pyrex heat-resistant glass (registered trademark), Kovar glass, tungsten glass, or quartz glass can be used. Of course, it is not limited to transparent glass.

The cross-sectional shape of the through wirings 25 and 26 is not limited, and a rectangular shape, a circular shape, a semicircular shape, or the like can be appropriately selected depending on the design. Further, the metal material as the through wirings 25 and 26 depends on the manufacturing method described later, but is not particularly limited. A predetermined wiring material such as aluminum, aluminum alloy, copper, gold, palladium or chromium may be used.

Further, the cross-sectional areas of the through wirings 25, 26 can be manufactured from the millimeter scale to the submicron scale according to the manufacturing technique. When applied to the sensor electrode of the present embodiment, depending on the value of the metal material and the detection signal, it may be in the range of about 1 μm ² to 10 mm ² or at least adjacent to the conductive pattern of the inspection object. The conductive pattern is used without overlapping the electrode width. Although it also depends on the level of the detection signal, it is preferably used at the same electrode width as a conductive pattern of the inspection object.

The first manufacturing step of the sensor electrode of the present embodiment will be described with reference to Figs. 3A, 3B, and 3C.

First, as shown in FIG. 3A, a wiring film which is the through wirings 25, 26 is formed on the rectangular glass plate 29a. As a known method for forming the film, any one of a plating method, a vapor deposition method, a sputtering (physical film formation) method, a chemical vapor deposition (CVD) method, screen printing, and inkjet printing can be used.

In the film forming method, when a plating method, a vapor deposition method, a sputtering method, or a CVD method is used, a pattern mask or a net formed of a photoresist is formed on the wiring film after the film formation. The pattern of the through wirings 25 and 26 is formed by dry etching and wet etching in the resist mask after the printing. Further, by drawing with a laser beam, the patterning of the through wirings 25 and 26 is directly performed on the wiring film.

In addition, if screen printing using a conductive paste is used, a print shape can be utilized. The pattern of the through wirings 25 and 26 is hardened by baking. Further, ink containing metal nanoparticles, for example, copper nanoparticles, may be printed by inkjet printing to form a pattern of the through wirings 25 and 26. Further, the copper nanoparticles are baked and hardened by irradiating the plasma with a plasma or the like in the patterns.

Next, as shown in FIG. 3B, the surface-bonding glass plate 29b in which the through wirings 25 and 26 are formed in the glass plate 29a is integrally formed. As one method of bonding, bonding can be performed by using an adhesive or the like. As the adhesive, an epoxy resin adhesive or a silicone adhesive is preferably used. Further, a low-melting glass may be interposed and heated to bond the glass sheets to each other. The case of using an adhesive can also be used, for example, in the case of using a low melting point metal having a melting point lower than the melting point of the glass sheet, such as aluminum or an aluminum alloy.

At this time, the bonding surface of the glass plate 29b may be flat, and a groove fitted to the through wirings 25 and 26 may be formed. The height difference (gap) due to the thickness of the through wirings 25, 26 can be eliminated by the adhesive. Further, in the case where a groove for fitting the through wirings 25 and 26 is formed on the bonding surface of the glass plate 29b, it is formed by a combination of a photolithography mask and etching (dry or wet). In addition to this, it is also applicable to draw etching by irradiating a laser beam or the like.

Further, in addition to the adhesive, the glass plate 29a and the glass plate 29b may be joined to each other by forming the through wirings 25 and 26 from a metal material having a higher melting point than the glass, that is, a melting temperature.

Next, a partial electrode substrate 29c which is used by the sensor electrode and which is formed of a glass piece is cut out from the glass plate 29. Partial electrode substrate 29c shown in Fig. 3B The length t corresponds to the thickness t of the electrode substrate 15 shown in Fig. 2 . However, in actuality, the length (thickness) of the amount of polishing is increased by the polishing treatment for flattening. The cutting of the glass plate 29 can be performed using a mechanical cutting device such as a wire saw, a diamond cutter, and a precision NC machine. In addition, a method of not generating heat during cutting processing such as waterjet processing is also applicable.

Next, as shown in FIG. 3C, each of the partial non-electrode substrates formed of the glass sheets having the same thickness t is combined with a plurality of glass sheets 30 and 31 of different sizes to form an electrode substrate 15 of a desired size. At this time, the size of the electrode substrate 15 and the formation position of the through wiring are determined in advance according to the design of the inspection device according to the position of the sensor electrode. In particular, in the case where a plurality of sensor electrodes are formed, in order to be opposed to the conductive pattern to be inspected, it is necessary to match the wiring distance of the conductive pattern. Therefore, by using the formed through wiring itself as the position reference mark, it is possible to use the index as the positioning at the time of the substrate bonding and the polishing process. Further, a through wiring as a reference may be separately provided. In addition to this, an optical mark may be engraved on the partial electrode substrate 29c to be used as a positioning index.

The partial electrode substrates 29c and the glass plates 30 and 31 are joined and integrated. The above adhesive can be used for bonding. Further, if the wiring material is not a low melting point metal having a lower melting point than glass, it may be joined by melting. For the thus-joined glass plate, a final flattening polishing process (for example, a rubbing treatment or a buffing treatment) is applied to form an electrode substrate.

Further, it is formed by a known production method (the above-described film formation and etching technique) The sensor electrodes 23a, 23b and the electrode pads 27, 28 shown in FIG.

Further, in the present embodiment, the electrode substrate 15 of the sensor electrode portion 12 has been described. However, the present invention is not limited thereto, and is similarly applicable to the power supply electrode 22. Further, it can be easily applied to a substrate on which a wiring penetrating the insulating substrate is formed, for example, a VIA wiring. Further, although the glass material has been described as an example of the substrate material, ceramics or the like may be used as long as it is bonded by an adhesive.

As described above, according to the present embodiment, the glass sheet on which the bonding wiring has been patterned is cut, the glass piece of a desired length is cut out, and the other glass piece is bonded in the thickness direction to form an electrode substrate, thereby forming the front and back surfaces of the through substrate. Through wiring. This through wiring can be provided as a function of the conventional VIA wiring.

In the present embodiment, since the wiring as the through wiring is formed on the glass plane, the width, the thickness, and the shape of the wiring can be formed into a desired standard, and the miniaturization can be easily achieved. Therefore, it is possible to solve the problem that the distance between the electrode width of the sensor and the distance between the electrodes due to the diameter of the drill cannot be reduced due to the mechanical forming method using a drill or the like. Thus, a sensor electrode that conforms to the wiring distance of the conductive pattern to be inspected can be formed.

Further, in order to form the through wiring, complicated processing conditions such as filling the contact hole or the VIA hole are not required, and the through wiring can be easily formed only by the process of forming the wiring on the plane.

The second manufacturing step of the sensor electrode of the present embodiment will be described with reference to Figs. 4A, 4B, and 4C.

As shown in Fig. 4A, in the present embodiment, grooves 42 and 43 for forming the through wirings 44 and 45 are formed on the rectangular glass plate 41a. The trench may be formed using a semiconductor technique such as a mask or dry etching, or may be formed by a water jet process or a method of irradiating a laser beam. The cross-sectional shape of the through wirings 44 and 45 can be determined according to the shapes of the grooves 42 and 43. For example, when the grooves 42 and 43 are formed in a semicircular shape, a cylindrical through wiring having a semicircular cross section is formed, or when the grooves are quadrangular, a through wiring having a quadrangular prism shape is formed.

Next, in order to fill the trenches 42, 43, a metal film is formed on one surface of the glass plate 41a. Aluminum Al is formed on the glass plate 41a by the above-described film formation method, for example, electroplating or CVD. Next, using chemical mechanical polishing (CMP), as shown in FIG. 4B, the portion other than the portion where the trenches 42, 43 are buried is removed, that is, the so-called Al damascene wiring is formed.

As another method of forming the through wiring, the through wirings 44 and 45 may be formed and hardened by directly filling the trenches 42 and 43 by screen printing or inkjet printing as described above. Further, the above-described general semiconductor manufacturing technique can be used to form a mask by a photoresist other than the trenches 42 and 43 of the glass plate 41a, and to form the trenches 42 and 43 by filling the trenches 42 and 43. The mask is removed after the metal film. Further, as a method of not using these techniques, grooves 42 and 43 having a semicircular bottom surface may be formed, and metal wires may be embedded in the grooves as the through wiring.

As shown in FIG. 4C, the glass plate 41a on which the through wirings 44 and 45 are formed is superposed and bonded to the glass plate 41b. The adhesive can use the above adhesive or low melting Point the glass and fit the glass plates to each other. Further, the glass plate 41a and the glass plate 41b can be closely adhered to each other by heating on a flat mirror surface, and heated to be integrally cured. In this case, the through wirings 44 and 45 are preferably made of a metal material resistant to high temperature treatment, such as chromium, gold, platinum, or the like.

Thereafter, similarly to the method described in FIGS. 3B and 3C, the partial electrode substrates used for the sensor electrodes are cut out from the glass plate 41, and the glass plates having the same thickness are combined and joined to form an electrode substrate having a desired size.

The second manufacturing step in the present embodiment as described above can obtain the same actions and effects as those of the first manufacturing step described above. Further, since the planes of the glass plate 41a and the glass plate 41b are joined to each other, the adhesion can be further improved. Moreover, the cross-sectional shape of the through wirings 44 and 45 can be formed into various shapes according to the shape of a groove. Further, since any wiring technique of wiring formation of a low temperature program or wiring formation of a high temperature program can be used by the damascene technique, a metal material having a low melting point and a low resistance can be used.

Next, a third manufacturing step of the sensor electrode of the present embodiment will be described with reference to FIGS. 5A and 5B.

In the first and second manufacturing steps, the manufacturing step is to form a through wiring that penetrates substantially perpendicularly to each surface from the surface on which the sensor electrode is formed to the back surface on which the electrode pad is formed. However, in practical applications, for example, when an electrode pad is formed largely, or when an electrode pad is not disposed in a direction perpendicular to the sensor electrode, electrode bonding must be formed at an end portion of the through-side wiring. pad. In this case, it is preferable to arrange a through wiring in the electrode substrate.

Therefore, in the third manufacturing step, the partial electrode substrate 51a and the partial electrode substrates 51b, 51c are formed by the first or second manufacturing steps, respectively. The partial electrode substrate 51a is formed with a partial through wiring 52a having a convex shape on the surface of the glass substrate, and partial partial through wirings 52b and 52c are formed in the partial electrode substrates 51b and 51c, respectively. The partial electrode substrates are combined to form two through wirings 52 and 53. The through wiring 52 is electrically connected to the electrode pads formed at positions deviated from the vertical direction of the sensor electrodes.

For example, as shown in FIGS. 5A and 5B, the partial electrode substrates 51a, 51b, 51c, and 51d are combined with the partial non-electrode substrates 51e and 51f. However, the partial electrode substrate 51b and the partial non-electrode substrate 51e are formed with guide grooves 54a, 54b, and 54c that are fitted to the partial through wirings 52a, 53a, and 53b, respectively.

One end surface of the partial through wiring 52a of the through wiring 52 is connected to one end surface of the partial through wiring 52b. Then, the other end surface of the partial through wiring 52b is connected to one end surface of the partial through wiring 52c. By this electrical connection, electrical connection is made from the other end surface of the partial through wiring 52a on which the sensor electrode is formed to the other end surface of the partial through wiring 52c on which the electrode pad is formed. The electrical connection between the partial through wirings may be formed only by the end faces being abutted, or may be formed by heat treatment welding. In such a configuration, by adjusting the size of the partial electrode substrate and the partial non-electrode substrate, the positions of both ends (connection ends) of the through wiring can be arbitrarily set as the positional relationship between the front surface and the back surface.

According to the third manufacturing step described above, in addition to the effects and effects obtained from the electrode substrate manufactured by the first or second manufacturing steps described above, it is not vertical Further, the position of the straight line defines the positional relationship between the sensor electrode formed on the surface of the substrate and the electrode pad formed on the back surface, and can be easily disposed at the offset position. Further, since the through wiring passes through the inside of the electrode substrate, it is possible to suppress an unnecessary inspection signal from the conductive pattern to a minimum.

Further, in the present embodiment, the example in which the electrode substrate is applied to the circuit pattern inspection device has been described. However, the device is not limited to this device, and can be easily applied to the object to be inspected or in any technical field. Connected to the electrode of the device for detecting the application of an electrical signal and/or detecting the signal. For example, it is not only applicable to such an inspection apparatus in which the inspection object is placed in the air and is intermittently detected, but can also be easily applied because the wiring is not disposed on the outer peripheral side of the detection electrode, and the gas is required when the inspection object exists in a gas or a liquid. Dense or watertight device.

According to the present invention, it is possible to provide a circuit pattern inspection device in which a non-contact type detecting portion having a sensor electrode connected by a through wiring penetrating through an insulating substrate is mounted.

1‧‧‧Circuit pattern inspection device

2‧‧‧Inspection Department

3‧‧‧Mobile agencies

4‧‧‧Drive Control Department

5‧‧‧Detection Signal Processing Department

6‧‧‧Control Department

7‧‧‧ Input Department

8‧‧‧Display Department

9‧‧‧ memory

11‧‧‧Power supply electrode

12‧‧‧Sensor electrode

13‧‧‧Check signal supply department

14‧‧‧Power electrode substrate

15‧‧‧Sensor electrode substrate

16‧‧‧Increase

17‧‧‧Bandpass filter

18‧‧‧Rectifier circuit

19‧‧‧Smooth circuit

20‧‧‧Defects Judgment Department

21‧‧‧Central Processing Unit (CPU)

22‧‧‧Power supply electrode

22a, 22b‧‧‧Power electrode

23a, 23b‧‧‧ sensor electrodes

25, 26‧‧‧through wiring

27, 28‧‧‧electrode pads

29‧‧‧ glass plate

29a, 29b‧‧‧ glass plate

29c‧‧‧Part electrode substrate

30, 31‧‧ ‧ glass plate

41‧‧‧ glass plate

41a, 41b‧‧‧ glass plate

42, 43‧‧‧ trench

44, 45‧‧‧through wiring

51a, 51b, 51c, 51d‧‧‧ part electrode substrate

51e, 51f‧‧‧ part of non-electrode substrate

52, 53‧‧‧through wiring

52a, 52b, 52c‧‧‧ part of the through wiring

53a, 53b‧‧‧ part of the through wiring

54a, 54b, 54c‧‧‧ guide slots

100‧‧‧Substrate

101‧‧‧Electrical pattern

Fig. 1 is a view showing a conceptual configuration of a circuit pattern inspection device including an electrode according to an embodiment of the present invention.

FIG. 2 is a view showing a conceptual configuration of a detecting unit.

Fig. 3A is a view for explaining a first manufacturing step of forming a detecting portion.

Fig. 3B is a view subsequent to Fig. 3A for explaining a first manufacturing step of forming the detecting portion.

Fig. 3C is a view subsequent to Fig. 3B for explaining a first manufacturing step of forming the detecting portion.

Fig. 4A is a view for explaining a second manufacturing step of forming a detecting portion.

Fig. 4B is a view subsequent to Fig. 4A for explaining a second manufacturing step of forming the detecting portion.

Fig. 4C is a view subsequent to Fig. 4B for explaining a second manufacturing step of forming the detecting portion.

Fig. 5A is a view for explaining a third manufacturing step of forming a detecting portion.

Fig. 5B is a view subsequent to Fig. 5A for explaining a third manufacturing step of forming the detecting portion.

15‧‧‧Sensor electrode substrate

23a‧‧‧Sensor electrode

23b‧‧‧Sensor electrode

25‧‧‧through wiring

26‧‧‧through wiring

27‧‧‧Electrode pads

28‧‧‧Electrode pads

Claims (4)

An electrode substrate comprising: at least one through wiring formed to penetrate at least one surface of a first partial electrode substrate having a rectangular shape; and a substrate in a direction in which the through wiring of the first partial electrode substrate penetrates a surface and a back surface a side surface or both side surfaces in which the surface of the through-wiring surface is formed to be orthogonal to each other, and a plurality of second partial electrode substrates which are formed in a rectangular shape and are not formed with wiring are arranged to be integrated, and are integrally formed into a desired size. The electrode is electrically connected to one end of the through wiring on the surface side of the substrate, and the electrode pad is electrically connected to the other end of the through wiring on the back side of the substrate. An electrode substrate having: a through wiring formed to penetrate at least one surface of a first partial electrode substrate having a rectangular shape; and a plurality of second partial electrode substrates having a rectangular shape and not formed with a wiring; and the plurality of the first portions The electrode substrate is formed to have a desired size by arranging a plurality of the second partial electrode substrates, and is electrically connected to an end portion of the plurality of through-wiring surfaces that are exposed at the end and the back side. a method of changing the direction of the first partial electrode substrate, and arranging the first partial electrode substrate and the second portion electrically in a stepwise manner Polar substrate. The electrode substrate according to claim 1 or 2, wherein the through-wiring is used as a positioning index when the substrate is formed when the first partial electrode substrate and the second partial electrode substrate are integrally bonded and fixed. A circuit pattern inspection device comprising: a sensor electrode substrate comprising: a through wiring, a side surface of a partial electrode substrate formed in a rectangular shape is formed to penetrate the side surface; and a substrate having a portion of the through wiring The electrode substrate is formed into a plurality of rectangular partial electrode substrates to have a desired size, and the surface of the first partial electrode substrate that penetrates the surface and the back surface includes the surface on which the through wiring is formed and the surface The two sides of the orthogonal direction are integrally joined and fixed; the sensor electrode is electrically connected to one end of the through wiring on the surface side of the substrate; and the electrode pad for signal extraction is on the back side of the substrate The other end of the through wiring is electrically connected; the power supply electrode substrate includes: the substrate; a power supply electrode electrically connected to one end portion of the through wiring on the surface side of the substrate; and the other end of the through wiring on the back side of the substrate a signal application electrode pad for electrical connection; a moving portion for a plurality of conductive patterns The substrate to be inspected is an object to be inspected, and the sensor electrode substrate and the power supply electrode substrate are integrally held in such a manner that the sensor electrode and the power supply electrode are opposed to each other with respect to one conductive pattern. The conductive pattern is spaced apart above a certain distance and moves in a direction crossing the conductive pattern column; The inspection unit supplies an inspection signal formed by the alternating current signal from the power supply electrode to the capacitively coupled conductive pattern during movement of the power supply electrode and the sensor electrode by the moving portion, and acquires a capacitive coupling The inspection signal transmitted from the conductive pattern to the sensor electrode; the defect determination unit compares a peak value of the detection signal obtained by the sensor electrode with a predetermined determination reference value to determine whether or not there is a defect.