TW201334948A - Imprinting apparatus and imprinting method - Google Patents

Abstract

An imprinting apparatus includes a first roller, a second roller, a flexible imprinting mold, a conveyer, a first pressurizing device and a curing device. An imprinting region is formed between the first roller and the second roller. The flexible imprinting mold is rolled on the first roller and the second roller. The first roller and the second roller drive the flexible imprinting mold to move and pass through the imprinting region. The conveyer is disposed under the first roller and the second roller and conveys a plurality of substrates to pass through the imprinting region in sequence. Each substrate has a resin layer thereon. The first pressurizing device provides a first pressurizing air to the imprinting region. The flexible imprinting mold contact the substrates passing through the imprinting region by the pressing of the first pressurizing air. The curing device cures the resins. An imprinting method is also provided.

Description

Imprinting equipment and imprinting method

The present invention relates to an imprint apparatus and an imprint method, and more particularly to an imprint apparatus and an imprint method using a flexible stamp.

The current common Lithography technology includes Electron Beam Lithography, Ion Beam Lithography, Extreme Ultraviolet Lithography, and Nanoimprint lithography. (Nanoimprint Lithography) technology, in which nanoimprint lithography is not limited by the optical diffraction limit, and has the characteristics of high resolution, high speed and low cost, so its application field is quite extensive.

In detail, a conventional nanoimprint lithography process is to place a glue layer on a substrate, and imprint an embossing die having an embossed pattern onto the softened adhesive layer, followed by curing the patterned adhesive layer. . Thereafter, the stamp is removed and etched to etch the nano pattern on the substrate by the mask of the adhesive layer. In the above process, the unevenness of the surface of the substrate tends to cause unevenness or incompleteness of the glue laminate. In addition, since the imprinting squeegee layer is a single-piece process rather than a continuous embossing, it is time-consuming to wait for the adhesive layer to be cured before embossing the adhesive layer on the other substrate. In addition, in order to avoid the generation of bubbles in the adhesive layer after imprinting, it is necessary to perform imprinting in a vacuum environment, thereby increasing the manufacturing cost and waiting for vacuuming.

U.S. Patent No. US20090046362 discloses a nanoimprinting method in which a roll fabric is used to emboss a pattern onto a glue layer of a substrate, and the glue layer is cured by ultraviolet light, wherein the substrate is conveyed using a conveyor belt. Taiwan Patent Publication No. TW200638461 discloses a nanoimprinting method in which a substrate is conveyed by a conveyor belt or a roller, and the mold is embossed to the substrate by a pressure equalizing device. Taiwan Patent Publication No. TW201006659 discloses a nanoimprinting method for providing an appropriate embossing pattern on a workpiece by compressing air to provide appropriate pressure of the mold and the workpiece.

The invention provides an imprinting device and an imprinting method, which can improve the uniformity and integrity of imprinting, and can save process time and cost.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides an imprint apparatus including a first roller, a second roller, a flexible stamp, a conveyor belt, and a first addition. Pressure device and curing device. An embossed area is formed between the first roller and the second roller. The flexible stamp is wound around the first roller and the second roller. The first roller and the second roller are adapted to drive the flexible stamp to move and pass through the embossed area. The conveyor belt is disposed under the first roller and the second roller and is adapted to transport the plurality of substrates sequentially through the embossed area. Each substrate has a glue layer thereon. The first pressurizing device provides a first pressurized gas stream to the embossed area. The flexible embossing mold keeps the substrates passing through the embossed area in contact with the flexible embossing die by pressurization of the first pressurized gas stream. The curing device pair is located in the embossed area and cures the embossed layers of the glue.

The embossing apparatus according to an embodiment of the present invention further includes a first adjusting component, and the first roller and the first adjusting component form a first segment, wherein the flexible embossing die surrounds the first roller and the first adjusting component The first adjustment element is adapted to drive the first section to adjust an angle of the first section relative to the substrate.

The embossing apparatus according to an embodiment of the present invention further includes a second adjusting component, and the second roller and the second adjusting component form a second section, wherein the flexible embossing mold surrounds the second roller and the second adjustment The second adjustment element is adapted to drive the second section to adjust an angle of the second section relative to the substrate.

The embossing apparatus according to an embodiment of the present invention further includes a second pressing device, wherein the conveying belt is a flexible conveying belt, and the first pressing device and the second pressing device are respectively disposed above the flexible embossing die And below the conveyor belt, the second pressing device provides a second pressurized air flow to the flexible conveyor belt of the embossed area, the flexible embossing die and the flexible conveyor belt by the first pressurized air flow and the second Pressurization of the pressurized gas stream keeps the substrates passing through the embossed area in contact with the flexible embossing die.

An imprint apparatus according to an embodiment of the present invention, wherein the conveyor belt is a rigid conveyor belt.

An imprinting apparatus according to an embodiment of the present invention, wherein the adhesive layer is a photo-curable adhesive layer, and the curing device comprises a light-emitting device.

In an embossing apparatus according to an embodiment of the invention, the conveyor belt and the substrate are transparent, and the conveyor belt is located between the curing device and the flexible embossing die.

An imprint apparatus according to an embodiment of the present invention, wherein the flexible stamp is permeable to light and the flexible stamp is located between the curing device and the conveyor belt.

An imprinting apparatus according to an embodiment of the present invention, wherein the adhesive layer is a thermosetting adhesive layer, and the curing device comprises a heating device.

An imprint apparatus according to an embodiment of the present invention, wherein the adhesive layer is a thermoplastic adhesive layer, and the curing device includes a cooling device.

In order to achieve one or a portion or all of the above or other objects, an embodiment of the present invention provides an imprint method. A flexible stamper is moved by a first roller and a second roller and passes through an embossed area, wherein the flexible embossing mold is wound around the first roller and the second roller, and the embossed area is located at the A roller and a second roller. A plurality of substrates are sequentially conveyed by a conveyor belt through an embossed area, wherein each substrate has a glue layer thereon. Providing a first pressurized air flow to the embossed area by a first pressing device to cause the flexible embossing to make the substrates passing through the embossed area and flexible by pressurization of the first pressurized air flow The positive impression remains in contact. These glue layers are cured by a curing device.

An imprinting method according to an embodiment of the present invention, wherein the step of moving the flexible stamper comprises driving the flexible stamper from the first roller into the embossed area and exiting the embossed area from the second roller, the embossing method The method further includes adjusting, by the first adjusting component, an angle between the first segment formed between the first roller and the first adjusting component relative to the substrate.

An imprinting method according to an embodiment of the present invention, wherein the step of moving the flexible stamper comprises driving the flexible stamper from the first roller into the embossed area and exiting the embossed area from the second roller, the embossing method The method further includes adjusting, by the second adjusting component, an angle between the second segment formed between the second roller and the second adjusting component relative to the substrate.

The embossing method according to an embodiment of the present invention further includes providing a second pressurized air flow to the embossed area by the second pressing means to cause the flexible embossing film to be pressurized by the second pressurized air flow. The substrates passing through the embossed area are in contact with the flexible embossing die, wherein the first pressing device and the second pressing device are respectively disposed above the flexible embossing die and below the conveyor belt.

In an imprinting method according to an embodiment of the invention, the adhesive layer is a photo-curable adhesive layer, and the step of curing the adhesive layer comprises irradiating the adhesive layer with light by a curing device.

In an imprinting method according to an embodiment of the invention, the adhesive layer is a thermosetting adhesive layer, and the step of curing the adhesive layer comprises heating the adhesive layer by a curing device.

In an imprinting method according to an embodiment of the invention, the adhesive layer is a thermoplastic adhesive layer, and the step of curing the adhesive layer comprises cooling the adhesive layer by a curing device.

In an imprinting method according to an embodiment of the present invention, the step of sequentially transporting the substrate through the embossed area comprises causing at least two of the substrates to be simultaneously located in the embossed area.

In an imprinting method according to an embodiment of the present invention, the step of moving the flexible stamping die and moving the plurality of substrates through the embossing area comprises moving the flexible stamping die at a speed equal to the moving speed of the substrate. With the direction of movement.

Based on the above, at least one of the following advantages is obtained in the above embodiments of the present invention, the first roller and the second roller drive the flexible embossing die through the embossed area, and the conveyor belt transports the substrates sequentially through the embossed area, These adhesive layers on these substrates are continuously cured by the imprinting and curing apparatus of the flexible stamp to achieve a continuous manufacturing process similar to the production line, saving an average process time. In addition, the flexible stamp can more accurately imprint the adhesive layer by the flexible characteristics of the flexible stamp and the pressure of the first pressurized airflow provided by the first pressing device. To improve the uniformity and integrity of the imprint. In addition, during the movement and imprinting of the flexible stamping die, by the driving of the roller and the pressing of the first pressurized airflow, the bubbles formed in the glue layer can be forced to be discharged, so that it is not necessary to be in a vacuum environment. Embossing in the middle can reduce bubbles in the glue layer to save process cost and time.

The above described features and advantages of the invention will be apparent from the following description.

The foregoing and other objects, features, and advantages of the invention will be apparent from the Detailed Description The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

1 is a schematic view of an imprint apparatus according to an embodiment of the present invention. Referring to FIG. 1 , the imprint apparatus 100 of the present embodiment includes a first roller 110 , a second roller 120 , a flexible stamp 130 , a conveyor belt 140 , a first pressing device 150 , and a curing device . Device 160. An embossed area R is formed between the first roller 110 and the second roller 120. The flexible embossing die 130 is wound around the first roller 110 and the second roller 120, and the first roller 110 and the second roller 120 are used to drive The flexible stamp 130 moves and passes through the embossed area R. The conveyor belt 140 is disposed under the first roller 110 and the second roller 120 and is configured to transport the plurality of substrates 50 through the embossed region R, wherein each of the substrates 50 has a glue layer 52 thereon. The first pressing device 150 is configured to provide a first pressurized airflow F1 to the embossed region R, and the flexible embossing die 130 passes the embossed regions R by the pressurization of the first pressurized airflow F1. The substrate 50 is in contact with the flexible stamp 130. The pair of curing devices 160 are located in the embossed area R and cure the glue layers 52. Because the thickness of the glue layer 52 makes the substrate 50 and the flexible embossing die 130 may be in direct contact or indirect contact, the present invention does not To this end, Figure 1 shows an embodiment of indirect contact.

Under the above configuration, the adhesive layers 52 on the substrates 50 are continuously embossed by the flexible stamping die 130, and the curing device 160 continuously cures the adhesive layers 52, thereby achieving a similar production line. The effect of continuous manufacturing to save on average process time. In addition, by the flexible characteristics of the flexible stamping die 130 and the pressing of the first pressurized airflow F1 provided by the first pressing device 150, the flexible stamping die 130 can be relatively uniformly applied to the adhesive layer. 52 is imprinted to improve the uniformity and integrity of the imprint. In addition, in the process of feeding the substrate 50 into the embossed area R by the conveyor belt 140, the flexible embossing die 130 is gradually pressed with the adhesive layer 52 by the driving of the first roller 110 and the second roller 120 and the conveying belt 140. And the substrate 50 is gradually introduced into the embossed area R and pressed by the first pressurized airflow F1, so that the bubbles formed in the adhesive layer 52 can be forced to be discharged, so that the embossing can be reduced without being embossed in a vacuum environment. Air bubbles are generated in the glue layer 52 to save process cost and time.

2A to 2C are flow charts of subsequent processes of the substrate of FIG. 1. In this embodiment, the substrate 50 can be further subjected to a lithography process to make it a substrate of a light emitting diode (LED). In detail, the substrate 50 having the nanoimprint pattern adhesive layer 52 as shown in FIG. 2A can be produced by the imprinting of the above-described imprint apparatus 100. Next, the substrate 50 is etched by the mask of the adhesive layer 52 as shown in FIG. 2B. Finally, the adhesive layer 52 is removed to obtain the substrate 50 having the patterned surface as shown in FIG. 2C. The substrate 50 having the patterned surface can smooth the epitaxial step of the subsequent light-emitting diode and reduce the defects of the epitaxial. The epitaxial step in the process of the light-emitting diode is a well-known technique in the art, and will not be described herein.

Referring to FIG. 1 , in the embodiment, the flexible stamping die 130 enters the embossed area R from the first roller 110 and exits from the second roller 120 by the driving of the first roller 110 and the second roller 120 . Imprint area R. The embossing device 100 further includes a first adjusting component 170a and a second adjusting component 170b. The first roller 110 and the first adjusting component 170a are between the first segment 130a, the second roller 120 and the second adjusting component 170b. The second section 130c is located between the first section 130a and the second section 130c outside the embossed area R. The first adjustment component 170a can drive the first segment 130a to adjust the angle A1 of the first segment 130a relative to the substrate 50, and the second adjustment component 170b can drive the second segment 130c to adjust the second segment 130c relative to the substrate The angle of 50 is A2. By the arrangement of the first adjusting component 170a, the angle A1 can be adjusted to match the material of the adhesive layer 52, the structure of the substrate 50, and the thickness of the adhesive layer 52, so that the flexible stamping die 130 and the adhesive can be adjusted. Layer 52 can be brought into contact with the embossed region R1 at an appropriate angle to reduce the chance of bubble generation within the glue layer 52. By the arrangement of the second adjusting component 170b, the angle A2 can be adjusted to match the material of the adhesive layer 52, the structure of the substrate 50, and the thickness of the adhesive layer 52, so that the flexible stamping die 130 and the adhesive can be adjusted. Layer 52 can be released at a suitable angle to demold to reduce the chance of damage to glue layer 52 during demolding.

The imprint apparatus 100 of the present embodiment further includes a second pressurizing device 180, and the conveyor belt 140 is a flexible conveyor belt. The first pressurizing device 150 and the second pressurizing device 180 are disposed above the flexible stamping die 130 and below the conveyor belt 140, respectively. The second pressurizing device 180 provides a second pressurized airflow F2 to the conveyor belt 140. The first pressurizing airflow F1 and the second pressurizing device are provided by the first pressurizing device 150. The pressurization of the second pressurized gas stream F2 provided by 180 maintains the substrates 50 passing through the embossed region R in contact with the flexible stamping die 130. In other embodiments, the conveyor belt 140 can be a rigid conveyor belt capable of providing these substrate 50 support forces, in which case the second pressurizing device 180 as shown in FIG. 1 need not be configured.

The present invention does not limit the type of material of the adhesive layer 52. For example, each adhesive layer 52 can be a photo-curable adhesive layer, and the curing device 160 is a light-emitting device for emitting ultraviolet light L1 to cure the adhesive layer 52. As shown in FIG. 1, the conveyor belt 140 of the present embodiment is located between the curing device 160 and the flexible stamping die 130. Therefore, in the case where the adhesive layer 52 is a light-curing adhesive layer and the curing device 160 is a light-emitting device, the conveying is performed. The strip 140 and the substrate 50 are transparent to allow the ultraviolet light L1 to be irradiated to the adhesive layer 52. In addition, the second pressing device 180 between the curing device 160 and the conveyor belt 140 can illuminate the glue layer 52 by means of misalignment, opening or other suitable means.

3 is a schematic view of an imprint apparatus according to another embodiment of the present invention. Referring to FIG. 3, in the imprint apparatus 200 of the embodiment, the first roller 210, the second roller 220, the flexible stamp 230, the conveyor belt 240, the first pressing device 250, the curing device 260, and the The arrangement of the adjustment element 270a, the second adjustment element 270b, and the second pressurizing device 280 is the same as that of the arrangement shown in FIG. 1, and will not be described herein. The imprint apparatus 200 of FIG. 3 differs from the imprint apparatus 100 of FIG. 1 in that the imprint apparatus 200 further includes a curing unit 290 for emitting ultraviolet light L2 to cure the adhesive layer 52. The flexible stamping die 230 of the present embodiment is located between the curing device 290 and the conveyor belt 240. Therefore, in the case where the glue layer 52 is a light-curing adhesive layer and the curing device 290 is a light-emitting device, the flexible stamping die 230 It is permeable to light so that the ultraviolet light L2 can be irradiated to the adhesive layer 52. In addition, the first pressurizing device 250 between the curing device 290 and the flexible stamp 230 can illuminate the glue layer 52 by ultraviolet light L2 by misalignment, opening or other suitable means.

4 is a schematic view of an imprint apparatus according to another embodiment of the present invention. Referring to FIG. 4, in the imprint apparatus 300 of the embodiment, the first roller 310, the second roller 320, the flexible stamp 330, the conveyor belt 340, the first pressing device 350, and the first adjusting component 370a The arrangement of the second adjusting element 370b and the second pressurizing device 380 is the same as that of the arrangement shown in FIG. 1 and will not be described herein. The imprint apparatus 300 of FIG. 4 differs from the imprint apparatus 100 of FIG. 1 in that the curing apparatus 360 of the imprint apparatus 300 is a heating apparatus. In the case where the adhesive layer 52 is a thermosetting adhesive layer, the curing device 360 is used to heat the adhesive layer 52 to cure the adhesive layer 52. The curing device 360 heats the adhesive layer 52, for example, by baking, electric heating, hot air or other suitable means, which is not limited by the present invention.

FIG. 5 is a schematic diagram of an imprint apparatus according to another embodiment of the present invention. Referring to FIG. 5, in the imprint apparatus 400 of the present embodiment, the first roller 410, the second roller 420, the flexible stamp 430, the conveyor belt 440, the first pressing device 450, and the first adjusting component 470a The arrangement of the second adjusting element 470b and the second pressurizing device 480 is the same as that of the arrangement shown in FIG. 1 and will not be described herein. The imprint apparatus 400 of FIG. 5 differs from the imprint apparatus 100 of FIG. 1 in that the curing apparatus 460 of the imprint apparatus 400 is a cooling apparatus. In the case where the adhesive layer 52 is a thermoplastic adhesive layer, the curing device 460 is used to cool the adhesive layer 52 to cure the adhesive layer 52. The curing device 360 is, for example, cooled by providing a cooling gas stream or other suitable means, which is not limited by the invention. In other embodiments, the glue layer 52 may be naturally cooled without a cooling device. Further, in the present embodiment, for example, the adhesive layer 52 is softened by heating the heating layer 490 placed before the first roller 410 to smoothly perform the imprinting.

The imprint method of the present invention will be described below by taking the imprint apparatus 100 of Fig. 1 as an example. FIG. 6 is a flow chart of an imprint method according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 6 , the first roller 110 and the second roller 120 drive the flexible stamping die 130 to move through the embossed region R, wherein the flexible stamping die 130 is wound around the first roller 110 and The second roller 120 has an embossed area R between the first roller 110 and the second roller 120 (step S602). The plurality of substrates 50 are sequentially conveyed by the conveyor belt 140 through the embossed regions R, wherein each of the substrates 50 has a glue layer 52 (step S604). The first pressurized air flow F1 is supplied to the embossed area by the first pressing device 150 to cause the flexible embossing die 130 to pass the substrates passing through the embossed area R by the pressurization of the first pressurized air flow F1. The 50 is kept in contact with the flexible stamper 130 (step S606). These glue layers 52 are cured by the curing device 160 (step S608).

The above step S602 is performed in synchronization with step S604, and for example, the moving speed and the moving direction of the flexible stamping die 130 are controlled to be the same as the moving speed and moving direction of the substrates 50, so that the flexible stamping die is performed. When the respective adhesive layers 52 are imprinted 130, the embossed pattern is not broken by the substrate 50. In addition, for example, at least two of the substrates 50 (shown as three) are simultaneously located in the embossed area R to simultaneously emboss and cure the adhesive layer 52 on the plurality of substrates 50. The continuous manufacturing effect of the production line saves average process time.

The imprinting method of the embodiment further includes adjusting the angle A1 of the first segment 130a relative to the substrate 50 by the first adjusting component 170a, so that the flexible stamping die 130 and the adhesive layer 52 can be in contact at an appropriate angle. The embossed area R is introduced to reduce the probability of bubble generation in the glue layer 52. In addition, the imprinting method of the embodiment further includes adjusting the angle A2 of the second segment 130c relative to the substrate 50 by the second adjusting member 170b, so that the flexible stamping die 130 and the adhesive layer 52 can be separated at an appropriate angle. The mold is demolded to reduce the chance of damage to the rubber layer 52 during demolding. In addition, the embossing method of the embodiment further includes providing the second pressurized airflow F2 to the embossed region R by the second pressing device 180, so that the flexible embossing die 130 is used by the first pressing device 150. The supply of the first pressurized gas stream F1 and the second pressurized gas stream F2 provided by the second pressurizing device 180 maintains the substrates 50 passing through the embossed region R in contact with the flexible stamping die 130. When the curing device 160 cures the adhesive layer 52, the substrates 50 are kept in contact with the flexible stamping die 130 by the pressurization of the first pressing device 150 and the second pressing device 180 to increase the nano pressure. The transfer rate of the printed pattern prevents the substrate 50 from being separated or displaced from the flexible stamp 130 before the adhesive layer 52 is completely cured to break the embossed pattern.

In this embodiment, each adhesive layer 52 is a photo-curable adhesive layer, and the curing device 160 in the above step S608 emits light to illuminate the embossed adhesive layers 52 to cure the adhesive layer 52. In another embodiment, if each of the adhesive layers 52 is a thermosetting adhesive layer, the adhesive layer 52 is heated by the curing device 360 as shown in FIG. 4 to cure the adhesive layer 52. In another embodiment, if each adhesive layer 52 is a thermoplastic adhesive layer, the adhesive layer 52 is cooled by a curing device 460 as shown in FIG. 5 to cure the adhesive layer 52, or the adhesive layer 52 is naturally cooled and solidified. .

In summary, in the above embodiments of the present invention, at least one of the following advantages is obtained. The first roller and the second roller drive the flexible embossing die through the embossed area, and the conveyor belt transports the substrates sequentially through the embossing. The regions are such that the adhesive layers on the substrates are continuously cured by the imprinting and curing apparatus of the flexible stamp to achieve a continuous manufacturing process similar to the production line, saving an average process time. In addition, the flexible stamp can more accurately imprint the adhesive layer by the flexible characteristics of the flexible stamp and the pressure of the first pressurized airflow provided by the first pressing device. To improve the uniformity and integrity of the imprint. In addition, during the movement and imprinting of the flexible stamping die, by the driving of the roller and the pressing of the first pressurized airflow, the bubbles formed in the glue layer can be forced to be discharged, so that it is not necessary to be in a vacuum environment. Embossing in the middle can reduce bubbles in the glue layer to save process cost and time. Furthermore, the first adjustment element can be used to adjust the angle at which the flexible stamp is in contact with the glue layer to reduce the probability of bubble generation in the glue layer, and the second adjustment element can be used to adjust the flexible impression die. The angle of release from the adhesive layer to reduce the chance of damage to the adhesive layer during demolding.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

50. . . Substrate

52. . . Glue layer

100, 200, 300, 400. . . Imprinting equipment

110, 210, 310, 410. . . First wheel

120, 220, 320, 420. . . Second wheel

130, 230, 330, 430. . . Flexible stamp

130a. . . First section

130c. . . Second section

140, 240, 340, 440. . . conveyor

150, 250, 350, 450. . . First pressing device

160, 260, 360, 460. . . Curing device

170a, 270a, 370a, 470a. . . First adjustment component

170b, 270b, 370b, 470b. . . Second adjustment component

180, 280, 380, 480. . . Second pressurizing device

290. . . Curing device

390. . . heating equipment

A1, A2. . . Angle

L1, L2. . . Ultraviolet light

R. . . Embossed area

1 is a schematic view of an imprint apparatus according to an embodiment of the present invention.

2A to 2C are schematic views of subsequent processes of the substrate of FIG. 1.

3 is a schematic view of an imprint apparatus according to another embodiment of the present invention.

4 is a schematic view of an imprint apparatus according to another embodiment of the present invention.

FIG. 5 is a schematic diagram of an imprint apparatus according to another embodiment of the present invention.

FIG. 6 is a flow chart of an imprint method according to an embodiment of the present invention.

50. . . Substrate

52. . . Glue layer

100. . . Imprinting equipment

110. . . First wheel

120. . . Second wheel

130. . . Flexible stamp

130a. . . First section

130c. . . Second section

140. . . conveyor

150. . . First pressing device

160. . . Curing device

170a. . . First adjustment component

170b. . . Second adjustment component

180. . . Second pressurizing device

A1, A2. . . Angle

L1. . . Ultraviolet light

R. . . Embossed area

Claims (19)

An embossing device includes: a first roller and a second roller, wherein the first roller and the second roller form an embossed area; a flexible embossing die, around the first roller and the a second roller, wherein the first roller and the second roller are adapted to drive the flexible stamp to move through the embossed area; a conveyor belt disposed under the first roller and the second roller The plurality of substrates are sequentially conveyed through the embossed area, wherein each of the substrates has a glue layer; a first pressing device provides a first pressurized air flow to the embossed area, wherein the flexible embossing The mold maintains contact between the substrates passing through the embossed area and the flexible embossing die by pressurization of the first pressurized air flow; and a curing device that is located in the embossed area and cures the glue Floor. The embossing device of claim 1, further comprising a first adjusting component, the first roller and the first adjusting component forming a first segment, wherein the flexible embossing die winding The first adjusting element is adapted to drive the first section to adjust an angle of the first section relative to the substrate. The embossing device of claim 1, further comprising a second adjusting component, wherein the second roller and the second adjusting component form a second segment, wherein the flexible embossing die winding In the second roller and the second adjusting component, the second adjusting component is adapted to drive the second section to adjust an angle of the second section relative to the substrate. The imprinting apparatus according to claim 1, further comprising a second pressing device, wherein the conveying belt is a flexible conveying belt, and the first pressing device and the second pressing device are respectively disposed on Above the flexible stamping die and below the conveyor belt, the second pressing device provides a second pressurized airflow to the flexible conveyor belt of the embossing area, the flexible stamping die and the The flexible conveyor belt maintains contact between the substrates passing through the embossed area and the flexible embossing die by pressurization of the first pressurized gas stream and the second pressurized gas stream. The imprint apparatus of claim 1, wherein the conveyor belt is a rigid conveyor belt. The imprinting apparatus of claim 1, wherein the adhesive layer is a photocurable adhesive layer, and the curing device comprises a light emitting device. The imprinting apparatus of claim 6, wherein the conveyor belt and the substrate are transparent, and the conveyor belt is located between the curing device and the flexible stamp. The embossing apparatus of claim 6, wherein the flexible embossing die is permeable to light and the flexible embossing die is located between the curing device and the conveyor belt. The imprinting apparatus of claim 1, wherein the adhesive layer is a thermosetting adhesive layer, and the curing device comprises a heating device. The imprinting apparatus of claim 1, wherein the adhesive layer is a thermoplastic adhesive layer, and the curing device comprises a cooling device. An embossing method comprising: driving a flexible embossing die and passing an embossed area by a first roller and a second roller, wherein the flexible embossing die surrounds the first roller and the a second roller, the embossed area is located between the first roller and the second roller; a plurality of substrates are sequentially transported through the embossed area by a conveyor belt, wherein each of the substrates has a glue layer; a first pressurizing device provides a first pressurized air flow to the embossed area to cause the flexible embossing to pass the substrates passing through the embossed area by pressurization of the first pressurized air flow Maintaining contact with the flexible stamp; and curing the layers by a curing device. The embossing method of claim 11, wherein the step of driving the flexible embossing comprises driving the flexible embossing die from the first roller into the embossed area and from the second The embossing method further comprises adjusting, by a first adjusting component, an angle of a first section formed between the first roller and the first adjusting component with respect to the substrate. The embossing method of claim 11, wherein the step of driving the flexible embossing comprises driving the flexible embossing die from the first roller into the embossed area and from the second The embossing method further includes adjusting, by a second adjusting component, an angle of a second section formed between the second roller and the second adjusting component with respect to the substrate. The embossing method of claim 11, further comprising providing a second pressurized air flow to the embossed area by a second pressing device, so that the flexible embossing die is Pressurizing the pressurized gas stream to keep the substrates passing through the embossed area in contact with the flexible embossing die, wherein the first pressing device and the second pressing device are respectively disposed at the flexible Above the stamp and below the belt. The embossing method of claim 11, wherein the adhesive layer is a photocurable adhesive layer, and the step of curing the adhesive layer comprises irradiating the embossed adhesive layers with light from the curing device. The imprint method of claim 11, wherein the adhesive layer is a thermosetting adhesive layer, and the step of curing the adhesive layer comprises heating the adhesive layers by the curing device. The embossing method of claim 11, wherein the adhesive layer is a thermoplastic adhesive layer, and the step of curing the adhesive layer comprises cooling the adhesive layer by the curing device. The embossing method of claim 11, wherein the step of sequentially transporting the substrates through the embossed area comprises causing at least two of the substrates to be simultaneously located within the embossed area. The embossing method of claim 11, wherein the step of moving the flexible embossing die and transporting the substrates through the embossed area comprises moving and moving the flexible embossing die The direction is the same as the moving speed and moving direction of the substrates.