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TW201334678A - 散熱器組件 - Google Patents

散熱器組件 Download PDF

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Publication number
TW201334678A
TW201334678A TW101104881A TW101104881A TW201334678A TW 201334678 A TW201334678 A TW 201334678A TW 101104881 A TW101104881 A TW 101104881A TW 101104881 A TW101104881 A TW 101104881A TW 201334678 A TW201334678 A TW 201334678A
Authority
TW
Taiwan
Prior art keywords
heat sink
fixing member
circuit board
heat
sink assembly
Prior art date
Application number
TW101104881A
Other languages
English (en)
Inventor
林孟嫻
張耀廷
Original Assignee
鴻海精密工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鴻海精密工業股份有限公司 filed Critical 鴻海精密工業股份有限公司
Priority to TW101104881A priority Critical patent/TW201334678A/zh
Priority to US13/457,709 priority patent/US20130208427A1/en
Publication of TW201334678A publication Critical patent/TW201334678A/zh

Links

Classifications

    • H10W40/60
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0215Grounding of printed circuits by connection to external grounding means
    • H10W40/611
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • H10W40/231
    • H10W40/625

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一種散熱器組件,其包括對電路板散熱之散熱器,該散熱器組件還包括固定件、鎖持體及導接體,該散熱器經陽極處理形成絕緣表面,該表面上開設有導電槽,該導接體套於該鎖持體上,該固定件由導電槽內穿過散熱器及電路板,該鎖持體與電路板將導接體夾持,並與固定件固接。

Description

散熱器組件
本發明涉及一種散熱器組件。
習知散熱器使用鉚釘並套設兩個彈簧與電路板固定,兩個彈簧之組裝增加組裝難度且不穩固,並且多數經過陽極處理,表面會有塗層,增加散熱器之散熱效果,但該塗層絕緣使該散熱器無法接地,即無法將電磁干擾傳送地面消除。
鑒於以上內容,有必要提供一種散熱效果好且能有效消除電磁波干擾之散熱器組件。
一種散熱器組件,其包括對電路板散熱之散熱器,該散熱器組件還包括固定件、鎖持體及導接體,該散熱器經陽極處理形成絕緣表面,該表面上開設有導電槽,該導接體套於該鎖持體上,該固定件由導電槽內穿過散熱器及電路板,該鎖持體與電路板將導接體夾持,並與固定件固接。
本發明散熱器組件之鎖持體可嵌入並螺接於該固定件內,並與電路板將導接體夾持於電路板上,該散熱器上設有一未經陽極處理之導電槽,該固定件穿過導電槽及電路板與鎖持體接觸,使散熱器與電路板形成電導接地,將電磁干擾消除,於不影響經過陽極處理之散熱器之散熱效果之同時消除電磁干擾。
請一併參閱圖1,本發明較佳實施方式散熱器組件裝設於一電路板10上,其包括散熱器20、鎖持部30及導接體40。該電路板10設有一表面11及裝設於表面11之晶片12。
該散熱器20整體表面經過陽極處理,其包括本體21及數個散熱片22,即本體21及數個散熱片22之表面為陽極處理後形成之絕緣散熱表面,該數個散熱片排列裝設於該本體21上。位於該數個散熱片之間之本體21上之絕緣散熱表面藉由切割(如鐳射切割),去除絕緣層,形成一圓形導電槽23。
該鎖持部30包括固定件31、鎖持體32及一彈性體33。該固定件31可為螺絲,其包括固定桿311。該彈性體33為一螺旋彈簧,其套於該固定桿311上。該鎖持體32為“T”形塊體,其設有桿體321。該桿體321可固定於該固定桿311一端上。該導接體40為一片體,其由錫或銅製成。
將散熱器組件裝設於電路板10上,該散熱器之本體21蓋於該晶片12上,將套有彈性體33之固定桿311穿過該導電槽23並可穿透該本體21與電路板10之表面,此時彈性體33兩端抵持於該固定件31之頭部及該導電槽23內,然後將該導接體40套於該鎖持體32之桿體321上,再將該鎖持體32從與電路板10表面11相反之一面穿過該電路板10嵌入並螺接於該固定桿311之端部內,如此完成該散熱器組件與電路板10之組裝,此時,由於該散熱器20之本體21表面上被切割(如鐳射切割)形成一沒有絕緣層之導電槽23,電路板10周圍之電磁波經該導電槽23傳輸至彈性體33,經由彈性體33傳給固定桿311至鎖持體32,最後由鎖持體32傳輸給導接體40,實現電磁信號接地,即可消除電磁干擾。
本發明所述散熱器組件包括散熱器20、鎖持部30及導接體40,該鎖持部包括固定件31及鎖持體32,該鎖持體32可嵌入並螺接於該固定桿311之端部內,並與電路板10將導接體40夾持於電路板上,該固定件31穿過導電槽23及電路板10與鎖持體32接觸,使散熱器20與電路板10形成電導接地,將電磁干擾消除,於不影響經過陽極處理之散熱器20之散熱效果之同時消除電磁干擾信號,而且該固定件31與鎖持體32嵌入式螺接將該散熱器穩固裝設於該電路板10上。
可以理解,所述固定件31與散熱器20之本體21可藉由螺紋連接。
10...電路板
11...表面
12...晶片
20...散熱器
21...本體
22...散熱片
23...導電槽
30...鎖持部
31...固定件
311...固定桿
32...鎖持體
321...桿體
33...彈性體
40...導接體
圖1係本發明較佳實施例之散熱器組件平面示意圖。
10...電路板
11...表面
12...晶片
20...散熱器
21...本體
22...散熱片
23...導電槽
30...鎖持部
31...固定件
311...固定桿
32...鎖持體
321...桿體
33...彈性體
40...導接體

Claims (6)

  1. 一種散熱器組件,其包括對電路板散熱之散熱器,其改良在於:該散熱器組件還包括固定件、鎖持體及導接體,該散熱器經陽極處理形成絕緣表面,該表面上開設有導電槽,該導接體套於該鎖持體上,該固定件由導電槽內穿過散熱器及電路板,該鎖持體與電路板將導接體夾持,並與固定件固接。
  2. 如申請專利範圍第1項所述之散熱器組件,其中該散熱器組件還包括套於固定件之彈性體,該彈性體為一螺旋彈簧,兩端分別抵持於該固定件頭部及導電槽內。
  3. 如申請專利範圍第1項所述之散熱器組件,其中該散熱器包括本體及設於本體上之數個散熱片,本體及數個散熱片之表面為陽極處理後形成之絕緣散熱表面,該導電槽由該散熱片之間之本體表面切割去除絕緣層形成。
  4. 如申請專利範圍第3項所述之散熱器組件,其中該固定件包括固定桿,該鎖持體包括桿體,該固定桿經導電槽穿過本體及電路板,該桿體嵌入固定桿端部內與固定桿固接。
  5. 如申請專利範圍第1項所述之散熱器組件,其中該導接體為銅或錫製成。
  6. 如申請專利範圍第1項所述之散熱器組件,其中散熱器周緣之電磁干擾可經該導電槽、彈形體、固定桿、鎖持體及導接體實現接地而消除。
TW101104881A 2012-02-15 2012-02-15 散熱器組件 TW201334678A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101104881A TW201334678A (zh) 2012-02-15 2012-02-15 散熱器組件
US13/457,709 US20130208427A1 (en) 2012-02-15 2012-04-27 Grounding mechanism for heat sink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101104881A TW201334678A (zh) 2012-02-15 2012-02-15 散熱器組件

Publications (1)

Publication Number Publication Date
TW201334678A true TW201334678A (zh) 2013-08-16

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Application Number Title Priority Date Filing Date
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US (1) US20130208427A1 (zh)
TW (1) TW201334678A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107004939A (zh) * 2014-12-03 2017-08-01 萨基姆宽带联合股份公司 具有集成到散热器中的天线的电子设备
EP3444839A1 (en) * 2017-08-18 2019-02-20 Infineon Technologies Austria AG Assembly and method for mounting an electronic component to a substrate

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9917033B2 (en) * 2012-06-26 2018-03-13 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Multicomponent heat sink with movable fin support portion
DE102015122250A1 (de) * 2015-12-18 2017-06-22 Karlsruher Institut für Technologie Multifunktionale Modulverbindungsstruktur
FR3062276B1 (fr) * 2017-01-20 2019-06-07 Moteurs Leroy-Somer Dispositif electronique, notamment variateur de vitesse ou regulateur d'alternateur, comportant un dissipateur thermique et une carte de puissance
CN107577285B (zh) * 2017-07-05 2022-01-14 超聚变数字技术有限公司 一种处理器固定结构、组件及计算机设备
CN107983803A (zh) * 2017-11-27 2018-05-04 苏州惠琪特电子科技有限公司 一种pcb板散热件的制备方法
US10937717B2 (en) * 2019-03-29 2021-03-02 Intel Corporation Heatsink secured to a heat source
CN111244783B (zh) * 2020-02-29 2021-11-12 深圳市瑞智电力股份有限公司 一种控制终端拆卸方便的配电柜
TWI806347B (zh) * 2022-01-10 2023-06-21 緯創資通股份有限公司 散熱機構及其電子裝置
KR102778396B1 (ko) * 2023-12-19 2025-03-10 주식회사 대호전자 전기온돌판넬용 온도조절기

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546408A (en) * 1983-05-16 1985-10-08 Illinois Tool Works Inc. Electrically insulated heat sink assemblies and insulators used therein
US5880930A (en) * 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
US7183775B2 (en) * 2003-11-06 2007-02-27 Hewlett-Packard Development Company, L.P. Systems and methods for determining whether a heat sink is installed
KR100712837B1 (ko) * 2004-04-29 2007-05-02 엘지전자 주식회사 히트 싱크 및 그 표면처리방법
CN2727956Y (zh) * 2004-07-06 2005-09-21 鸿富锦精密工业(深圳)有限公司 散热器扣合装置
TWI264993B (en) * 2005-03-08 2006-10-21 Asustek Comp Inc Shielding structure
US7342796B2 (en) * 2005-06-03 2008-03-11 Southco, Inc. Captive shoulder nut assembly
TWI278276B (en) * 2005-08-15 2007-04-01 Via Tech Inc Electronic system
US8812169B2 (en) * 2005-10-31 2014-08-19 Hewlett-Packard Development Company, L.P. Heat sink verification
US7336485B2 (en) * 2005-10-31 2008-02-26 Hewlett-Packard Development Company, L.P. Heat sink detection
CN2875001Y (zh) * 2005-12-23 2007-02-28 鸿富锦精密工业(深圳)有限公司 散热器
US7474530B2 (en) * 2007-01-10 2009-01-06 Sun Microsystems, Inc. High-load even pressure heatsink loading for low-profile blade computer applications
US20080266807A1 (en) * 2007-04-27 2008-10-30 Cray Inc. Electronic assembly with emi shielding heat sink
US7667970B2 (en) * 2007-12-27 2010-02-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly for multiple electronic components
JP2009283768A (ja) * 2008-05-23 2009-12-03 Yokogawa Electric Corp 冷却シールド装置
JP5211948B2 (ja) * 2008-09-04 2013-06-12 ソニー株式会社 集積装置および電子機器
US8687359B2 (en) * 2008-10-13 2014-04-01 Apple Inc. Portable computer unified top case
CN101848623B (zh) * 2009-03-25 2013-06-05 富准精密工业(深圳)有限公司 散热装置
CN101907909A (zh) * 2009-06-05 2010-12-08 鸿富锦精密工业(深圳)有限公司 具有固定孔的主板
JP2011155166A (ja) * 2010-01-28 2011-08-11 Toshiba Corp 電子装置
US20110304968A1 (en) * 2010-06-15 2011-12-15 Apple Inc. Internal electronics of a small form factor desk top computer
US8526185B2 (en) * 2010-10-18 2013-09-03 Cisco Technology, Inc. Collar for electrically grounding a heat sink for a computer component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107004939A (zh) * 2014-12-03 2017-08-01 萨基姆宽带联合股份公司 具有集成到散热器中的天线的电子设备
EP3444839A1 (en) * 2017-08-18 2019-02-20 Infineon Technologies Austria AG Assembly and method for mounting an electronic component to a substrate

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