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TW201323861A - Non-contact LED inspection device - Google Patents

Non-contact LED inspection device Download PDF

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Publication number
TW201323861A
TW201323861A TW101142747A TW101142747A TW201323861A TW 201323861 A TW201323861 A TW 201323861A TW 101142747 A TW101142747 A TW 101142747A TW 101142747 A TW101142747 A TW 101142747A TW 201323861 A TW201323861 A TW 201323861A
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Taiwan
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light
emitting diode
illumination
illumination unit
camera
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TW101142747A
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Chinese (zh)
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TWI503535B (en
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李東澔
安保爀
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美德客科技有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/265Contactless testing
    • H10P74/00
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/2632Circuits therefor for testing diodes
    • G01R31/2635Testing light-emitting diodes, laser diodes or photodiodes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

本發明一個實施例的非接觸式發光二極體檢查裝置,作為用於利用照相機拍攝發光二極體後,把拍攝的圖形與預先輸入的對象圖形進行比較,判別發光二極體的良好或不良的檢查裝置,其包括:載物檯部,其搭載該發光二極體,使該發光二極體固定於檢查位置或輸送;照明部,其包含第一照明部及第二照明部,其中,該第一照明部位於該載物檯部的上方,向該發光二極體照射藍色以下波長範圍的可見光,該第二照明部位於該第一照明部的上方,向該發光二極體照射綠色波長範圍的可見光;照相機,其位於該照明部的上方,拍攝該發光二極體的影像;視覺處理部,其判讀該照相機拍攝的影像,並判別該發光二極體的良好或不良;以及控制部,其包括控制該載物檯部及該照相機部的運動控制器。A non-contact type light-emitting diode inspection apparatus according to an embodiment of the present invention is configured to compare a captured image with a target image input in advance as a result of photographing a light-emitting diode with a camera, thereby determining whether the light-emitting diode is good or bad. The inspection device includes: a stage portion on which the light emitting diode is mounted to fix the light emitting diode to an inspection position or a conveyance; and an illumination unit including a first illumination portion and a second illumination portion, wherein The first illumination unit is located above the stage portion, and emits visible light having a wavelength range of blue or less to the light-emitting diode. The second illumination unit is located above the first illumination unit and is irradiated to the light-emitting diode. a visible light in a green wavelength range; a camera positioned above the illumination portion to capture an image of the light emitting diode; and a visual processing unit that reads an image captured by the camera and determines whether the light emitting diode is good or bad; The control unit includes a motion controller that controls the stage portion and the camera portion.

Description

非接觸式發光二極體檢查裝置 Non-contact LED inspection device

本發明係關於發光二極體檢查裝置,尤指能夠獲得關於發光二極體內部各元件之明確的影像資訊之非接觸式發光二極體檢查裝置。 The present invention relates to a light-emitting diode inspection device, and more particularly to a non-contact light-emitting diode inspection device capable of obtaining clear image information about components inside a light-emitting diode.

發光二極體(LED,Light Emitting Diode)是利用半導體的p-n結合結構注入的少數載流子(電子或電洞),藉由它們的複合而發光的電子元件。也就是說,如果向特定光源的半導體施加順向電壓,則通過陽極與陰極的接合部分,電子與電洞在移動的同時相互複合,成為比電子與電洞遠離時小的能量,因此產生的能量之差異而發出光。 A light emitting diode (LED) is an electronic component that emits light by a composite of a minority carrier (electron or hole) injected by a p-n bonding structure of a semiconductor. That is, if a forward voltage is applied to the semiconductor of a specific light source, the electrons and the holes are recombined while moving through the joint portion between the anode and the cathode, and become smaller energy than when the electrons and the hole are separated, thus resulting in Light is emitted by the difference in energy.

最近發光二極體由於發光效率的提高,其應用範圍從初期的信號指示用,進一步擴大到如手機用背光模組(BLU,Back Light Unit)或液晶顯示器(LCD,Liquid Crystal Display)的平板顯示裝置的光源及照明用。這是因為發光二極體比以往用作照明的燈泡或螢光燈耗電小、壽命長。 Recently, due to the improvement of luminous efficiency, the application range of the light-emitting diode has been extended from the initial signal indication to a flat panel display such as a backlight module (BLU) or a liquid crystal display (LCD). Light source and illumination for the device. This is because the light-emitting diode consumes less power and has a longer life than a bulb or a fluorescent lamp that has been used as an illumination.

發光二極體可以製造成發光二極體組件。一般而言,發光二極體組件包括:發光二極體晶片、供發光二極體晶片貼裝的主體、在主體上方覆蓋發光二極體晶片的螢光矽。發光二極體組件可以在發光二極體晶片旁還包括齊納二極體(zener diode)。 The light emitting diode can be fabricated as a light emitting diode assembly. In general, a light-emitting diode assembly includes a light-emitting diode chip, a body for mounting a light-emitting diode wafer, and a fluorescent light-emitting diode covering the light-emitting diode chip above the main body. The light emitting diode assembly may further include a Zener diode beside the light emitting diode wafer.

發光二極體晶片是在基板上生長相互不同的導電型的半導體層 及在其之間激發的活性層之後,在各半導體層形成電極加以製造。發光二極體晶片與齊納二極體透過引線接合(wire bonding),與導線架(lead frame)電性連接。 A light-emitting diode wafer is a semiconductor layer in which different conductivity types are grown on a substrate And after the active layer excited between them, an electrode is formed on each semiconductor layer to be fabricated. The LED body and the Zener diode are electrically connected to the lead frame through wire bonding.

在發光二極體晶片與齊納二極體的上方填充螢光矽的過程中,在螢光矽填充過少的情況下,內部的接合引線露出,可能因發熱而斷開。相反地,在螢光矽填充過多的情況下,稍後組裝於模組時會無法組裝,造成光的發散角比設定值大的不良。因此,需要檢查發光二極體組件的螢光矽之填充狀態及接合引線之連接狀態等的程序。作為本發明的先前技術,參照大韓民國公司專利公報第2009-0053591號將會理解。 In the process of filling the fluorescent ruthenium above the light-emitting diode wafer and the Zener diode, when the fluorescent ruthenium filling is too small, the internal bonding wires are exposed, and may be broken due to heat generation. Conversely, in the case where the fluorescent enamel is excessively filled, it may not be assembled when assembled later in the module, resulting in a defect that the light divergence angle is larger than the set value. Therefore, it is necessary to check the filling state of the fluorescent iridium of the light-emitting diode assembly and the connection state of the bonding wires. As a prior art of the present invention, it will be understood with reference to Korean Patent Publication No. 2009-0053591.

本發明之目的在於提供一種非接觸式發光二極體檢查裝置,透過鮮明地進行對發光二極體的各元件之影像對比,從而能夠更明確地獲得關於發光二極體內部的接合引線連接狀態及發光二極體主體的圖案之影像資訊。 An object of the present invention is to provide a non-contact type light-emitting diode inspection apparatus capable of more clearly obtaining a bonding wire connection state inside a light-emitting diode by vividly comparing images of respective elements of a light-emitting diode. And image information of the pattern of the body of the light emitting diode.

本發明一個實施例的非接觸式發光二極體檢查裝置,作為用於利用照相機拍攝發光二極體後,把拍攝的圖形與預先輸入的對象圖形進行比較,判別發光二極體的良好或不良的裝置,包括:載物檯部,其搭載該發光二極體,使該發光二極體固定於檢查位置或輸送;照明部,其包含第一照明部及第二照明部,其中,該第一照明部位於該載物檯部的上方,並向該發光二極體照射藍色以下波長範圍的可見光,該第二照明部位於該第一照明部的上方,並向該發光二極體照射綠色波長範圍的可見光;照相機,其位於該照明部的上方,拍攝該發光二極體的影像;視覺處理部,其判讀該照相機拍攝的影像,並判別該發光二極體的良好或不良;以及控制部,其包括控制該載物檯部及該照相機部的運動控制器。 A non-contact type light-emitting diode inspection apparatus according to an embodiment of the present invention is configured to compare a captured image with a target image input in advance as a result of photographing a light-emitting diode with a camera, thereby determining whether the light-emitting diode is good or bad. The device includes a stage portion on which the light emitting diode is mounted to fix the light emitting diode to an inspection position or conveyance, and an illumination unit including a first illumination portion and a second illumination portion, wherein the first illumination portion and the second illumination portion An illuminating portion is located above the stage portion, and illuminates the illuminating diode with visible light having a wavelength range of less than blue, and the second illuminating portion is located above the first illuminating portion and illuminates the illuminating diode a visible light in a green wavelength range; a camera positioned above the illumination portion to capture an image of the light emitting diode; and a visual processing unit that reads an image captured by the camera and determines whether the light emitting diode is good or bad; The control unit includes a motion controller that controls the stage portion and the camera portion.

該第一照明部可以針對該發光二極體,以布魯斯特角(brewster’s angle)照射光。 The first illumination portion may illuminate the light at the Brewster's angle for the light emitting diode.

該非接觸式發光二極體檢查裝置更可以包括偏光濾光鏡,該偏光濾光鏡位於該第一照明部前,用以隔絕從該第一照明部所發出的光中之特定偏振光成分,此時,該偏光濾光鏡可以隔絕垂直偏振光(s-polarized)成分。 The non-contact LED inspection device may further include a polarizing filter, the polarizing filter is located in front of the first illumination portion for isolating a specific polarized light component of the light emitted from the first illumination portion, At this time, the polarizing filter can isolate the s-polarized component.

該藍色以下波長可以為495nm以下,該綠色波長可以為495 nm至570nm。 The wavelength below the blue may be 495 nm or less, and the green wavelength may be 495 nm to 570 nm.

該發光二極體可以包含在表面形成有包括金(Au)成分的接合引線及圖案的主體部。 The light emitting diode may include a body portion in which a bonding wire and a pattern including a gold (Au) component are formed on the surface.

5‧‧‧發光二極體 5‧‧‧Lighting diode

10‧‧‧載物檯部 10‧‧‧The Stage Department

20‧‧‧照明部 20‧‧‧Lighting Department

22‧‧‧第一照明部 22‧‧‧First Lighting Department

22a‧‧‧第一燈 22a‧‧‧First light

24‧‧‧第二照明部 24‧‧‧Second Lighting Department

24a‧‧‧第二燈 24a‧‧‧second light

24b‧‧‧偏光濾光鏡 24b‧‧‧ polarizing filter

25‧‧‧視野確保部 25‧‧‧Vision assurance department

30‧‧‧照相機 30‧‧‧ camera

40‧‧‧視覺處理部 40‧‧‧Visual Processing Department

50‧‧‧控制部 50‧‧‧Control Department

60‧‧‧輸送傳送帶 60‧‧‧Conveyor belt

100‧‧‧入射光 100‧‧‧ incident light

110‧‧‧反射光 110‧‧‧ Reflected light

120‧‧‧介質 120‧‧‧Media

200‧‧‧界面 200‧‧‧ interface

202‧‧‧法線 202‧‧‧ normal

θB‧‧‧布魯斯特角 θB‧‧‧ Brewster Point

第1圖係為顯示出本發明一個實施例的非接觸式發光二極體檢查裝置之側視剖面圖。 Fig. 1 is a side sectional view showing a non-contact type light-emitting diode inspection apparatus according to an embodiment of the present invention.

第2圖係為顯示向金屬物質照射光時的不同光波長之反射率的圖表。 Fig. 2 is a graph showing the reflectance of different light wavelengths when light is irradiated to a metal substance.

第3圖的(a)係為顯示出原有發光二極體檢查裝置的第一照明部對發光二極體模組提供光源為綠色波長範圍的可見光時的發光二極體之接合引線部分的影像。 (a) of FIG. 3 is a view showing a bonding lead portion of the light-emitting diode when the first illumination portion of the original light-emitting diode inspection device supplies visible light in a green wavelength range to the light-emitting diode module. image.

第3圖的(b)係為顯示出本發明一個實施例的非接觸式發光二極體檢查裝置之第一照明部提供的光源為藍色以下波長範圍之可見光時的發光二極體之接合引線部分的影像。 (b) of FIG. 3 is a junction of the light-emitting diodes when the light source provided by the first illumination unit of the non-contact light-emitting diode inspection apparatus according to the embodiment of the present invention is in the visible light range of the blue or lower wavelength range. An image of the lead portion.

第4圖係為顯示布魯斯特角(Brewster’s angle)原理的概念圖。 Figure 4 is a conceptual diagram showing the principle of Brewster's angle.

第5圖的(a)係為顯示出在向作為檢查對象物的發光二極體照射藍色以下波 長範圍之可見光時的發光二極體主體之影像。 (a) of Fig. 5 shows that the light-emitting diode that is the object to be inspected is irradiated with the following blue waves. An image of the body of a light-emitting diode in a long range of visible light.

第5圖的(b)係為顯示出根據本發明一個實施例,當向發光二極體同時照射第一照明部提供的藍色以下波長範圍之可見光與第二照明部提供的綠色波長範圍之可見光時獲得的發光二極體之影像。 (b) of FIG. 5 is a view showing that the visible light in the blue wavelength range and the green wavelength range provided by the second illumination portion are provided when the light emitting diode is simultaneously irradiated to the first illumination portion according to an embodiment of the present invention. An image of a light-emitting diode obtained in the visible light.

第6圖係為顯示出本發明一個實施例的整體非接觸式發光二極體檢查裝置的側視圖。 Fig. 6 is a side view showing the entire non-contact type light emitting diode inspection apparatus of one embodiment of the present invention.

以下將參照附圖,說明本發明的較佳實施例。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

但是,本發明的實施例可以變形為多種不同形態,本發明的範圍並非限定於以下說明的實施例。另外,本發明的實施例是為向所屬技術領域的技術人員更完整地說明本發明而提供的。因此,為了明確說明,附圖中的元件之形狀及大小等可能會誇張,附圖上以相同符號表示的元件是相同元件。 However, the embodiments of the present invention can be modified into various different forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Therefore, the shapes, sizes, and the like of the elements in the drawings may be exaggerated for the sake of clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

第1圖顯示出本發明一個實施例的非接觸式發光二極體檢查裝置之側視剖面圖。第6圖顯示出本發明一個實施例的整體非接觸式發光二極體檢查裝置的側視圖。如第1圖、第6圖所示,非接觸式發光二極體檢查裝置包括載物檯部(10)、照明部(20)、照相機(30)、視覺處理部(40)及控制部(50)。 Fig. 1 is a side sectional view showing a non-contact type light-emitting diode inspection apparatus according to an embodiment of the present invention. Fig. 6 is a side view showing the entire non-contact type light-emitting diode inspection apparatus of one embodiment of the present invention. As shown in FIGS. 1 and 6, the non-contact type light emitting diode inspection apparatus includes a stage unit (10), an illumination unit (20), a camera (30), a visual processing unit (40), and a control unit ( 50).

載物檯部(10)提供作為檢查對象物的發光二極體(5)安置之空間。載物檯部(10)可以包括用於調節及固定發光二極體(5)的位置之位置調節部(圖未示)及固定部(圖未示)。 The stage portion (10) provides a space in which the light-emitting diode (5) as an inspection object is placed. The stage portion (10) may include a position adjusting portion (not shown) and a fixing portion (not shown) for adjusting and fixing the position of the light emitting diode (5).

照明部(20)位於在載物檯部(10)的上方。照明部(20)為確保發光二極體(5)的準確影像資訊而向發光二極體(5)提供照明。在貫通中央的視野確保部(25)之外側面配置有多個燈,使得該等燈在四周對該發光二極體(5)照明。 The illumination unit (20) is located above the stage portion (10). The illumination unit (20) provides illumination to the light-emitting diode (5) for ensuring accurate image information of the light-emitting diode (5). A plurality of lamps are disposed on the outer side surface of the field-of-view securing portion (25) penetrating the center so that the lamps illuminate the light-emitting diodes (5) around.

該照明部(20)包括第一照明部(22)及第二照明部(24)。 The illumination unit (20) includes a first illumination unit (22) and a second illumination unit (24).

第一照明部(22)安裝於照明部(20)的下方,向該發光二極體(5)提供以比垂直小的角度入射之光源。第一照明部(22)包括向側上方傾斜一定傾角度並提供光源的第一燈(22a)。第一照明部(22)提供的光源較佳為藍色以下波長(約495nm以下)範圍的可見光。利用第2圖說明其理由。 The first illumination unit (22) is mounted below the illumination unit (20), and supplies the light-emitting diode (5) with a light source that is incident at a smaller angle than the vertical. The first illumination portion (22) includes a first lamp (22a) that is tilted at a certain angle to the upper side and provides a light source. The light source provided by the first illumination unit (22) is preferably visible light having a wavelength of less than blue (about 495 nm or less). The reason will be explained using Fig. 2 .

第2圖是顯示向金屬物質照射光時的不同光波長之反射率的圖表。作為檢查對象物的發光二極體之接合引線表面一般係以金(Au)進行鍍金。參照第2圖可知,當對金(Au)照射波長為約200nm至約500nm的光時,反射率為約40%以下。即,如果把藍色波長的光照射於以金(Au)鍍金的接合引線,則大部分被吸收,在拍攝發光二極體的影像中,顯示得比周圍暗。因此,明暗對比鮮明,從而能夠更準確地獲知接合引線的連接狀態。 Fig. 2 is a graph showing the reflectance of different light wavelengths when light is irradiated to a metal substance. The surface of the bonding lead of the light-emitting diode as the object to be inspected is generally gold-plated with gold (Au). Referring to Fig. 2, when gold (Au) is irradiated with light having a wavelength of about 200 nm to about 500 nm, the reflectance is about 40% or less. That is, if the blue wavelength light is irradiated to the gold (Au) gold-plated bonding wire, most of it is absorbed, and in the image in which the light-emitting diode is imaged, it is displayed darker than the surrounding. Therefore, the contrast between the light and the dark is clear, so that the connection state of the bonding wires can be more accurately known.

第3圖的(a)顯示出原有發光二極體檢查裝置的第一照明部(22)針對作為檢查對象物的發光二極體提供光源為綠色波長範圍的可見光時的之發光二極體的接合引線部分之影像。 (a) of FIG. 3 shows a light-emitting diode in which the first illumination unit (22) of the conventional light-emitting diode inspection apparatus supplies the light-emitting diode as the inspection object with the light source having the green wavelength range of visible light. The image of the joint lead portion.

參照第3圖的(a)可知,發光二極體的以金(Au)鍍金之接合引線部分與成為接合引線之背景的發光二極體主體部之顏色區別不明確。特別是由於紅色圓圈內的接合引線的顏色不均一,因而存在後述的視覺處理部(40)錯誤判斷為接合引線斷開的憂慮。這是因為第一照明部(22)提供的綠色波長範圍的可見光不僅在發光二極體主體部進行反射,而且在以金(Au)鍍金的接合引線表面也進行反射,從而在用照相機拍攝的影像中,接合引線與背景部分區分不鮮明。 Referring to (a) of Fig. 3, the color difference between the gold-plated (Au) gold-plated bonding wire portion of the light-emitting diode and the light-emitting diode body portion which is the background of the bonding wire is not clear. In particular, since the color of the bonding leads in the red circles is not uniform, there is a fear that the visual processing unit (40), which will be described later, erroneously determines that the bonding leads are disconnected. This is because the visible light in the green wavelength range provided by the first illumination portion (22) is not only reflected in the body portion of the light-emitting diode, but also reflected on the surface of the bonding wire plated with gold (Au), thereby being photographed by the camera. In the image, the bonding leads are not clearly distinguished from the background portion.

第3圖的(b)顯示出本發明一個實施例的非接觸式發光二極體檢查裝置的之第一照明部提供的光源為藍色以下波長範圍的可見光時之發光二極 體的接合引線部分之影像。藍色以下波長範圍的可見光在以金(Au)所構成的發光二極體的接合引線表面大部份被吸收,因而可以確認,在拍攝發光二極體的影像中,以紅色箭頭表示的接合引線部分與背景部分區別鮮明。 (b) of FIG. 3 shows a light-emitting diode in which the light source provided by the first illumination unit of the non-contact type light-emitting diode inspection apparatus according to an embodiment of the present invention is in the visible light range of blue or lower The image of the body's bonded lead portion. The visible light having a wavelength range of blue or less is mostly absorbed on the surface of the bonding lead of the light-emitting diode made of gold (Au), and thus it can be confirmed that the image indicated by the red arrow is in the image of the light-emitting diode. The lead portion is distinct from the background portion.

為進一步提高在發光二極體的接合引線表面的藍色以下波長範圍的可見光之吸收率,可以利用布魯斯特角(Brewster’s angle)原理。第4圖是顯示布魯斯特角(Brewster’s angle)原理的概念圖。光在經過折射率不同的兩種介質之間時,通常在該界面(200)出現反射。但是,如果某種偏振光形態的光以特定的入射角入射,則在界面(200)不反射,而是折射,透過不同的介質(120)。此時,由界面(200)的法線(202)與入射光(100)構成的入射角是布魯斯特角(θB)。 In order to further increase the absorption of visible light in the blue wavelength range below the surface of the bonding lead of the light-emitting diode, the Brewster's angle principle can be utilized. Figure 4 is a conceptual diagram showing the principle of Brewster's angle. When light passes between two media with different refractive indices, reflection usually occurs at the interface (200). However, if light of a certain polarization form is incident at a specific angle of incidence, it is not reflected at the interface (200), but is refracted and transmitted through a different medium (120). At this time, the incident angle formed by the normal (202) of the interface (200) and the incident light (100) is the Brewster angle (θB).

在該角度中,偏光的光的電場與入射的平面並排,因而不反射。該偏振光狀態的光被稱為水平偏振光或p-偏光(p-polarized)狀態,這是因與入射的平面平行(parallel)而得名。如果偏光成為與光入射的平面垂直之狀態,則稱為垂直偏振光或s-偏光(s-polarized)狀態,來自表示垂直意義的德語senkrecht。因此,如果無偏光狀態的入射光(100)以布魯斯特角(θB)入射,則反射光(110)始終為s-偏光狀態。 In this angle, the electric field of the polarized light is aligned with the plane of incidence and thus does not reflect. The light in the polarized state is referred to as a horizontally polarized light or a p-polarized state, which is named because it is parallel to the plane of incidence. If the polarized light is in a state perpendicular to the plane of incidence of light, it is called a vertically polarized light or an s-polarized state, derived from the German senkrecht indicating the vertical meaning. Therefore, if the incident light (100) in the non-polarized state is incident at the Brewster angle (θB), the reflected light (110) is always in the s-polarized state.

再次參照第1圖,透過在第一照明部(22)前配置隔絕s-偏光成分的偏光濾光鏡(24b),在第一照明部(22)發出的入射光相對於發光二極體(5)的表面以布魯斯特角入射的情況下,透過阻止入射光在發光二極體(5)的表面反射,而能夠獲得更明確的發光二極體(5)之影像。 Referring again to Fig. 1, by arranging a polarizing filter (24b) that isolates the s-polarizing component before the first illuminating portion (22), the incident light emitted from the first illuminating portion (22) is opposite to the light emitting diode ( When the surface of 5) is incident at the Brewster angle, by preventing the incident light from being reflected on the surface of the light-emitting diode (5), a more clear image of the light-emitting diode (5) can be obtained.

不過,作為對檢查對象物,即,對發光二極體(5)的照明,如果使用藍色以下波長範圍的可見光,那麼,如第5圖的(a)所示,除發光二極體的接合引線部分外,存在難以識別發光二極體的主體部圖案等的問題。為解決這 種問題,在第一照明部(22)的上方配置第二照明部(24),向該發光二極體(5)提供垂直入射的光源。該第二照明部(24)可以包括第二燈(24a)及半反射鏡(half mirror,24b),其中,該第二燈(24a)位於該第二照明部(24)的側部,提供光源,該半反射鏡(half mirror,24b)與第二燈(24a)隔開一定距離,並沿斜線配置。 However, as the object to be inspected, that is, the illumination of the light-emitting diode (5), if visible light having a wavelength range of blue or less is used, as shown in (a) of FIG. 5, except for the light-emitting diode. In addition to the bonding lead portion, there is a problem that it is difficult to recognize the main body portion pattern or the like of the light emitting diode. To solve this A problem is that a second illumination portion (24) is disposed above the first illumination portion (22), and a light source that is incident perpendicularly is provided to the LED (5). The second illumination portion (24) may include a second lamp (24a) and a half mirror (24b), wherein the second lamp (24a) is located at a side of the second illumination portion (24), provided The light source, the half mirror (24b) is spaced apart from the second lamp (24a) by a distance and arranged along a diagonal line.

該第二照明部(24)提供的光源較佳為綠色波長範圍(約495nm至約570nm)的可見光。其理由是,發光二極體晶片的圖案與底面平行,為鏡面(mirror-like surface),因而第二照明部(24)相對於晶片的圖案垂直地提供的綠色波長光向照相機方向進行正反射。 The light source provided by the second illumination portion (24) is preferably visible light in the green wavelength range (about 495 nm to about 570 nm). The reason is that the pattern of the light-emitting diode wafer is parallel to the bottom surface and is a mirror-like surface, so that the green light wavelength light provided by the second illumination portion (24) perpendicularly to the pattern of the wafer is positively reflected toward the camera direction. .

而且,本發明的非接觸式發光二極體檢查裝置透過使用藍色及綠色波長範圍,從而只考慮比全部可見光區域的光學系統更窄區域的波長範圍。因此,色像差小,照相機鏡頭的設計比較容易,能夠以低廉的材料製作鏡頭。 Further, the non-contact type light-emitting diode inspection apparatus of the present invention transmits only the wavelength range of a region narrower than the optical system of the entire visible light region by using the blue and green wavelength ranges. Therefore, the chromatic aberration is small, the design of the camera lens is relatively easy, and the lens can be produced with a low-cost material.

第5圖的(b)顯示出根據本發明一個實施例,當向作為檢查對象物的發光二極體同時照射第一照明部提供的藍色以下波長範圍的可見光與第二照明部提供的綠色波長範圍的可見光時獲得的發光二極體影像。第5圖的(b)與第5圖的(a)相比,可以確認:能夠更鮮明地獲得發光二極體主體部的圖案影像。 (b) of FIG. 5 shows visible light in the blue wavelength range and the second illumination portion provided by the first illumination portion simultaneously irradiating the light-emitting diode as the inspection target object according to an embodiment of the present invention. A light-emitting diode image obtained in the visible range of the wavelength range. (b) of FIG. 5 is comparable to (a) of FIG. 5, and it can be confirmed that the pattern image of the light-emitting diode main body portion can be obtained more vividly.

再次參照第1圖,照相機(30)位於照明部(20)的上方,能夠拍攝該發光二極體(5)的影像。在第1圖中,只顯示了一個照相機(30),但本發明的視覺檢查裝置可以具有倍率不同的多個照相機(圖未示),根據使用者的需要,多樣地變化發光二極體(5)的檢查範圍。另外,還可以在該照相機(30)與照明部(20)之間具有倍率相互不同的多個鏡頭(圖未示),多樣地變化發光二極體(5)的檢查範圍。 Referring again to Fig. 1, the camera (30) is positioned above the illumination unit (20) to capture an image of the LED (5). In Fig. 1, only one camera (30) is shown, but the visual inspection device of the present invention may have a plurality of cameras (not shown) having different magnifications, and variously change the light-emitting diodes according to the needs of the user ( 5) The scope of inspection. Further, a plurality of lenses (not shown) having different magnifications may be provided between the camera (30) and the illumination unit (20), and the inspection range of the light-emitting diode (5) may be variously changed.

另一方面,視覺處理部(40)把從該照相機(30)獲得的影像資訊與預先輸入的對象圖形進行比較,來判斷發光二極體(5)的良好或不良。 On the other hand, the visual processing unit (40) compares the image information obtained from the camera (30) with the target image input in advance to determine whether the light-emitting diode (5) is good or bad.

該控制部(50)作為包括對該載物檯部(10)、該照相機(30)的驅動及動作進行控制的運動控制器(圖未示)的構成元件,也可以控制本發明的視覺檢查裝置的整體驅動。 The control unit (50) is a constituent element including a motion controller (not shown) that controls driving and operation of the stage unit (10) and the camera (30), and can also control the visual inspection of the present invention. The overall drive of the device.

即,該控制部(50)如第6圖所示,能夠使結合於輸送傳送帶(60)的視覺檢查裝置在固定的發光二極體(5)上方,向前、後、左、右輸送,以便按照預先設置的發光二極體(5)之拍攝區域,向該照相機(30)傳送拍攝控制信號。 That is, as shown in Fig. 6, the control unit (50) can transport the visual inspection device coupled to the transport conveyor (60) to the front, rear, left, and right of the fixed light-emitting diode (5). In order to transmit a shooting control signal to the camera (30) in accordance with a shooting area of the preset light-emitting diode (5).

另外,該控制部(50)根據系統控制程序,不僅擔負視覺檢查裝置的拍攝位置控制與拍攝的影像的處理及照明部(20)控制等物理性控制,還執行檢查作業及數據演算作業。 Further, the control unit (50) not only performs physical control such as imaging position control of the visual inspection device, processing of captured video, and control of the illumination unit (20), but also performs an inspection operation and a data calculation operation in accordance with the system control program.

而且,該控制部(50)負責用於把作業內容及檢查結果輸出到顯示器的輸出裝置控制,並能夠供作業者輸入設置及各種事項的輸入裝置控制等視覺檢查裝置的總體控制。本發明並非限定於上述的實施例及附圖,而由申請專利範圍限定。因此,在不超出申請專利範圍所記載的本發明之技術思想的範圍內,可以進行多種形態的置換、變形及變更,這是所屬技術領域的技術人員不言而喻的,這也屬於申請專利範圍所記載的技術思想。 Further, the control unit (50) is responsible for the output device control for outputting the work content and the inspection result to the display, and is capable of inputting the overall control of the visual inspection device such as the setting and the input device control of various items. The present invention is not limited to the above embodiments and drawings, but is defined by the scope of the patent application. Therefore, various forms of substitutions, modifications, and alterations can be made without departing from the scope of the invention as described in the appended claims. It is to be understood by those skilled in the art that The technical ideas described in the scope.

根據本發明的非接觸式發光二極體檢查裝置,透過鮮明地進行對發光二極體的各元件之影像對比,從而能夠更明確地獲得關於發光二極體內部的接合引線連接狀態及發光二極體主體的圖案的影像資訊。 According to the non-contact type light-emitting diode inspection device of the present invention, the image alignment of the respective elements of the light-emitting diode can be clearly performed, so that the bonding wire connection state and the light-emitting state inside the light-emitting diode can be more clearly obtained. Image information of the pattern of the polar body.

5‧‧‧發光二極體 5‧‧‧Lighting diode

10‧‧‧載物檯部 10‧‧‧The Stage Department

20‧‧‧照明部 20‧‧‧Lighting Department

22‧‧‧第一照明部 22‧‧‧First Lighting Department

22a‧‧‧第一燈 22a‧‧‧First light

24‧‧‧第二照明部 24‧‧‧Second Lighting Department

24a‧‧‧第二燈 24a‧‧‧second light

24b‧‧‧偏光濾光鏡 24b‧‧‧ polarizing filter

30‧‧‧照相機 30‧‧‧ camera

40‧‧‧視覺處理部 40‧‧‧Visual Processing Department

50‧‧‧控制部 50‧‧‧Control Department

Claims (7)

一種非接觸式發光二極體檢查裝置,作為用於利用照相機拍攝發光二極體後,把拍攝的圖形與預先輸入的對象圖形進行比較,判別發光二極體的良好或不良的檢查裝置,其特徵在於該非接觸式發光二極體檢查裝置包括:載物檯部,其搭載該發光二極體,使該發光二極體固定於檢查位置或輸送;照明部,其包含第一照明部及第二照明部,其中,該第一照明部位於該載物檯部的上方,並向該發光二極體照射藍色以下波長範圍的可見光,該第二照明部位於該第一照明部的上方,並向該發光二極體照射綠色波長範圍的可見光;照相機,其位於該照明部的上方,用於拍攝該發光二極體的影像;視覺處理部,其判讀該照相機拍攝的影像,並判別該發光二極體的良好或不良;以及控制部,其包括控制該載物檯部及該照相機部的運動控制器。 A non-contact type light-emitting diode inspection device is an inspection device for determining whether a light-emitting diode is good or bad, by comparing a captured image with a target image input in advance by capturing a light-emitting diode with a camera. The non-contact light-emitting diode inspection apparatus includes a stage portion on which the light-emitting diode is mounted to fix the light-emitting diode to an inspection position or conveyance, and an illumination unit including a first illumination unit and a first illumination unit a second illumination unit, wherein the first illumination unit is located above the stage portion, and irradiates the light-emitting diode with visible light having a wavelength range of less than blue, and the second illumination unit is located above the first illumination unit. And illuminating the light-emitting diode with visible light in a green wavelength range; the camera is located above the illumination portion for capturing an image of the light-emitting diode; and the visual processing unit reads the image captured by the camera and discriminates the image a good or bad light-emitting diode; and a control portion including a motion controller that controls the stage portion and the camera portion. 如申請專利範圍第1項所述之非接觸式發光二極體檢查裝置,其中該第一照明部針對該發光二極體,以布魯斯特角(brewster’s angle)照射光。 The non-contact light-emitting diode inspection apparatus according to claim 1, wherein the first illumination unit irradiates light to the light-emitting diode at a Brewster's angle. 如申請專利範圍第1項所述之非接觸式發光二極體檢查裝置,其中更包括偏光濾光鏡,該偏光濾光鏡位於該第一照明部前,用以隔絕從該第一照明部所發出的光中之特定偏振光成分。 The non-contact LED inspection device of claim 1, further comprising a polarizing filter, the polarizing filter being located in front of the first illumination portion for isolating the first illumination portion The specific polarized light component of the emitted light. 如申請專利範圍第3項所述之非接觸式發光二極體檢查裝置,其中該偏光濾光鏡隔絕垂直偏振光(s-polarized)成分。 The non-contact type light emitting diode inspection apparatus according to claim 3, wherein the polarizing filter isolates an s-polarized component. 如申請專利範圍第1項所述之非接觸式發光二極體檢查裝置,其中該藍色以下的波長為495nm以下。 The non-contact type light emitting diode inspection apparatus according to claim 1, wherein the wavelength below the blue color is 495 nm or less. 如申請專利範圍第1項所述之非接觸式發光二極體檢查裝置,其中該綠色波長為495nm至570nm。 The non-contact type light emitting diode inspection apparatus according to claim 1, wherein the green wavelength is 495 nm to 570 nm. 如申請專利範圍第1項所述之非接觸式發光二極體檢查裝置,其中該發光二極體包含在表面形成有包括金(Au)成分的接合引線及圖案的主體部。 The non-contact type light emitting diode inspection apparatus according to claim 1, wherein the light emitting diode includes a body portion having a bonding lead and a pattern including a gold (Au) component formed on the surface.
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