TW201320378A - Method of manufacturing an intermediate reflective layer - Google Patents
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- TW201320378A TW201320378A TW101132249A TW101132249A TW201320378A TW 201320378 A TW201320378 A TW 201320378A TW 101132249 A TW101132249 A TW 101132249A TW 101132249 A TW101132249 A TW 101132249A TW 201320378 A TW201320378 A TW 201320378A
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 230000004907 flux Effects 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 17
- 239000002019 doping agent Substances 0.000 claims abstract description 9
- 239000010409 thin film Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 50
- 238000000151 deposition Methods 0.000 claims description 31
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 22
- 239000007789 gas Substances 0.000 claims description 20
- 238000012545 processing Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002070 nanowire Substances 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 3
- 230000008021 deposition Effects 0.000 description 26
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 22
- 239000011787 zinc oxide Substances 0.000 description 11
- 239000002086 nanomaterial Substances 0.000 description 10
- 238000005137 deposition process Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005430 electron energy loss spectroscopy Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 240000002657 Thymus vulgaris Species 0.000 description 1
- 235000007303 Thymus vulgaris Nutrition 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005111 flow chemistry technique Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000001585 thymus vulgaris Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/17—Photovoltaic cells having only PIN junction potential barriers
- H10F10/172—Photovoltaic cells having only PIN junction potential barriers comprising multiple PIN junctions, e.g. tandem cells
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/48—Back surface reflectors [BSR]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
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- Photovoltaic Devices (AREA)
Abstract
一種在薄膜串聯太陽能電池中的中間反射層之製造,其係藉由PEDVD,在一注入包含H2、SiH4、摻雜氣體及CO2的氣體混合物之製程環境中沉積一層。在100至400間選擇H2對SiH4之氣流比率及選擇儘可能高的CO2對SiH4通量比率,因此維持該層的導電度。An intermediate reflective layer in a thin film tandem solar cell is deposited by a PEDVD in a process environment implanted with a gas mixture comprising H2, SiH4, a dopant gas, and CO2. The ratio of H2 to SiH4 gas flow is selected between 100 and 400 and the highest possible CO2 to SiH4 flux ratio is selected, thus maintaining the conductivity of the layer.
Description
光伏打裝置或太陽能電池係一種將光轉換成電能的裝置。薄膜太陽能電池對低成本大量製造來說特別重要,因為它們允許使用不貴的基材(例如玻璃)及以Si為主具有厚度範圍100奈米-2微米的薄膜。用於此以Si為基底的層之沉積的最常使用的方法之一為PECVD方法。 A photovoltaic device or solar cell is a device that converts light into electrical energy. Thin-film solar cells are particularly important for low-cost mass production because they allow the use of inexpensive substrates (such as glass) and films based on Si with a thickness ranging from 100 nm to 2 microns. One of the most commonly used methods for the deposition of this Si-based layer is the PECVD process.
簡單的薄膜太陽能電池通常包括透明(玻璃)基材及沉積在該基材上的透明導電氧化物(TCO)層(即,太陽能電池的正面觸點(或電極))。在該TCO正面觸點上沉積矽基底層:首先為正摻雜的Si層(即,p-層),然後本質吸收層(i-層)及負摻雜的n-層。該三層Si層形成p-i-n接面。該Si層的厚度之主要部分由i-層佔據且光電轉換主要發生於此。在該Si層的頂端上,沉積另一層TCO層(其亦名為背面觸點)。該TCO正及背面觸點層可由氧化鋅、氧化錫、ITO或其它合適的材料製得。通常在背面觸點後塗佈一白色反射器用以將尚未被吸收的光反射回該活性層中。 Simple thin film solar cells typically include a transparent (glass) substrate and a layer of transparent conductive oxide (TCO) deposited on the substrate (ie, the front side contacts (or electrodes) of the solar cell). A germanium substrate layer is deposited on the TCO front contact: first a positively doped Si layer (ie, a p-layer), then an intrinsic absorber layer (i-layer) and a negatively doped n-layer. The three Si layers form a p-i-n junction. The main portion of the thickness of the Si layer is occupied by the i-layer and photoelectric conversion mainly occurs here. On top of the Si layer, another layer of TCO (also known as the back contact) is deposited. The TCO positive and back contact layers can be made of zinc oxide, tin oxide, ITO or other suitable materials. A white reflector is typically applied after the back contact to reflect light that has not been absorbed back into the active layer.
第1圖顯示出一種如在本技術領域中已知的串聯接面矽薄膜太陽能電池。此薄膜太陽能電池50通常包括一第一或正面電極42、二個以上含有各別層52-54及44-46的半導體薄膜p-i-n接面51及43、及一第二或背面電極47(其相繼堆疊在基材41上)。每個p-i-n接面51,43或薄膜光電轉換單元皆包括夾在p-型層52,44與n-型層54,46(p- 型=正摻雜,n-型=負摻雜)中間的i-型層53,45。實質上,”本質”在此上下文中經了解為未摻雜或具有基本上無產生摻雜。光電轉換主要發生在此i-型層中,因此,其亦稱為吸收層。 Figure 1 shows a tandem junction tantalum thin film solar cell as is known in the art. The thin film solar cell 50 generally includes a first or front electrode 42, two or more semiconductor film pin junctions 51 and 43 including respective layers 52-54 and 44-46, and a second or back electrode 47 (which are successively Stacked on the substrate 41). Each p-i-n junction 51, 43 or thin film photoelectric conversion unit comprises a p-type layer 52, 44 and an n-type layer 54, 46 (p- Type = positive doping, n-type = negative doping) intermediate i-type layers 53, 45. In essence, "essence" is understood in this context to be undoped or substantially free of doping. Photoelectric conversion occurs mainly in this i-type layer and, therefore, is also referred to as an absorption layer.
太陽能電池或光電(轉換)裝置的p-i-n接面依i-型層53,45的結晶分量(結晶性)而具有非晶相(a-Si,53)或微晶(μc-Si,45)太陽能p-i-n接面的特徵,其與毗連的p及n層之結晶性種類無關。如在本技術領域中常見,微晶層經了解為在非晶相基質中包含極大分量的矽結晶(所謂的微結晶)之層。p-i-n接面堆疊稱為串聯或三接面光伏打電池。非晶相與微晶p-i-n-接面之組合(如顯示在第1圖中)亦稱為非微晶(micromorph)串聯電池。 The pin junction of the solar cell or photoelectric (conversion) device has an amorphous phase (a-Si, 53) or microcrystalline (μc-Si, 45) solar energy depending on the crystal component (crystallinity) of the i-type layers 53, 45. The feature of the pin junction is independent of the crystalline nature of the adjacent p and n layers. As is common in the art, a microcrystalline layer is understood to be a layer of germanium crystals (so-called microcrystals) that contain a very large fraction of the amorphous phase matrix. The p-i-n junction stack is called a series or triple junction photovoltaic cell. The combination of an amorphous phase and a microcrystalline p-i-n-junction (as shown in Figure 1) is also referred to as a micromorph series cell.
本發明係關於一種包含上述種類的堆疊多重接面之光伏打裝置。其不限於含有二個堆疊的p-i-n接面之串聯接面電池,而是可有用地使用許多種類的多接面太陽能電池,其全部皆在本描述中提出及主張為”串聯太陽能電池”。 The present invention relates to a photovoltaic device comprising stacked multi-junctions of the above kind. It is not limited to a series junction cell containing two stacked p-i-n junctions, but many types of multi-junction solar cells can be usefully used, all of which are presented and claimed as "series solar cells" in this description.
在本技術領域中已知的是,可藉由實質上在接面間安排一或多個選擇性反射層而提高於本文中所提出的堆疊式p-i-n接面種類之效率。參照上述第1圖,此可在層53/54及/或54/44及/或44/45之界面處及/或甚至在45/46中完成。此中間層亦稱為中間反射器,縮寫IRL。 It is known in the art that the efficiency of the stacked p-i-n junction types proposed herein can be improved by arranging one or more selectively reflective layers substantially between the junctions. Referring to Figure 1 above, this can be done at the interface of layers 53/54 and/or 54/44 and/or 44/45 and/or even at 45/46. This intermediate layer is also known as the intermediate reflector, abbreviated IRL.
US 5,021,100描述出一種多重電池光伏打裝置,其包括第一及第二串列連接的太陽能p-i-n接面及一於此 之間的導電或介電選擇性反射膜。選擇該選擇性反射膜的厚度以便反射可由第一太陽能p-i-n接面(上接面51)所吸收的短波長光,及傳遞不或較少由上p-i-n接面吸收但是可較佳由下p-i-n接面吸收的長波長光。該選擇性反射膜可包含ZnO、TiO、SnO2、ITO(全部具導電性)、SiO2、SiN、TaO、SiC(全部具介電性)。 No. 5,021,100 describes a multi-cell photovoltaic device comprising a first and a second series of connected solar pin junctions and a conductive or dielectric selective reflective film therebetween. Selecting the thickness of the selective reflection film to reflect short-wavelength light that can be absorbed by the first solar pin junction (upper surface 51), and transmitting less or less by the upper pin junction but preferably by lower pin Long-wavelength light absorbed by the surface. The selective reflection film may include ZnO, TiO, SnO 2 , ITO (all of which is electrically conductive), SiO 2 , SiN, TaO, and SiC (all of which have dielectric properties).
在本發明中,已描述出多種現存的IRL及其製造方法之改良,其可結合或獨自地使用以進一步推升效率,以改良所提出的種類之薄膜太陽能電池的光學及/或電性能。 In the present invention, various existing IRLs and improvements in their methods of manufacture have been described which may be used in combination or on their own to further boost efficiency to improve the optical and/or electrical properties of the proposed type of thin film solar cell.
此係藉由一種在薄膜串聯太陽能電池中製造一中間反射層IRL的方法達成,該方法包括藉由PEDVD,在注入包含H2、SiH4、摻雜氣體及CO2的氣體混合物之沉積製程環境中沉積一層,其中該H2對SiH4之氣流比率係在100至400間且選擇儘可能高的CO2對SiH4氣流比率,因此維持該層之導電度。 This is achieved by a method of fabricating an intermediate reflective layer IRL in a thin film tandem solar cell comprising a deposition process environment in which a gas mixture comprising H 2 , SiH 4 , a dopant gas, and CO 2 is implanted by PEDVD. A layer is deposited in which the ratio of the H 2 to SiH 4 gas flow is between 100 and 400 and the highest possible ratio of CO 2 to SiH 4 gas flow is selected, thus maintaining the conductivity of the layer.
再者,所提出的目標係藉由一種包含至少一層IRL層之串聯太陽能電池達成,其中該IRL層實質上由明顯SiO較豐富及明顯SiO較純的區域組成,其形成一具有數條實質上在與其上存在該層之表面垂直的方向上延伸之索的奈米結構。因此,該IRL層材料的結構可藉由電子能量損失能譜及能量過濾穿透式電子顯微鏡(EFTEM)研究,如例如已知來自G.尼扣錯(Nicotra),Appl.Surf.Sci 205(2003)或S.薛姆(Schamm),超顯微術(Ultramicroscopy)108(2008)。 Furthermore, the proposed object is achieved by a tandem solar cell comprising at least one layer of IRL, wherein the IRL layer consists essentially of a region rich in SiO and relatively pure SiO, which forms a plurality of substantially A nanostructure of a cord extending in a direction perpendicular to the surface on which the layer is present. Therefore, the structure of the IRL layer material can be studied by electron energy loss spectroscopy and energy filtration transmission electron microscopy (EFTEM), as known, for example, from G. Nicotra, Appl. Surf. Sci 205 ( 2003) or S. Schamm, Ultramicroscopy 108 (2008).
現在,將伴隨著圖形之幫助亦與其好的具體實例來例示出本發明。 Now, the present invention will be exemplified with the aid of graphics and its specific examples.
如可從根據本發明的方法和從根據本發明的串聯電池了解,該IRL的材料之一實質部分由氧化矽組成。因此,在下列中我們將根據本發明的IRL,提出為SOIR(氧化矽相互反射器)。 As can be understood from the method according to the invention and from the tandem cell according to the invention, one of the materials of the IRL consists essentially of yttrium oxide. Therefore, in the following we will propose an IIR according to the present invention as SOIR (Thyme Oxide Mutual Reflector).
SOIR必需一方面實現低折射率,及另一方面,高橫向電傳導的需求。然而,當在材料中的O含量高時,SOIR材料之折射率低;當在材料中的O含量低時,達成高橫向傳導。 SOIR must achieve low refractive index on the one hand and high lateral electrical conduction on the other hand. However, when the O content in the material is high, the refractive index of the SOIR material is low; when the O content in the material is low, high lateral conduction is achieved.
在第2圖中顯示出氫稀釋在具有波長600奈米的光之折射率上的影響。其額外顯示出當CO2/SiH4通量比率參數在箭號方向上增加時,來自H2/SiH4通量比率的折射率相依性之三種特徵。再者,在該圖形中有顯示出該SOIR層材料從導電轉至阻斷電池的定界。 The effect of hydrogen dilution on the refractive index of light having a wavelength of 600 nm is shown in Fig. 2. It additionally shows three characteristics of the refractive index dependence from the H 2 /SiH 4 flux ratio as the CO 2 /SiH 4 flux ratio parameter increases in the direction of the arrow. Furthermore, in this figure there is shown a delimitation of the SOIR layer material from conductive to blocking the cell.
當H2/SiH4通量比率增加時,可看見當該SOIR層材料變成電阻斷時,該定界特徵朝向較低折射率偏移。因此,在根據第2圖的實施例中,可看見一方面在H2/SiH4通量比率於250處及在其之上時,到達稍微大於1.8的低折射率;及當選擇相對高的CO2/SiH4通量比率時,該SOIR層材料仍然導電。 As the H 2 /SiH 4 flux ratio increases, it can be seen that when the SOIR layer material becomes resistive, the delimiting feature is shifted toward a lower index of refraction. Therefore, in the embodiment according to Fig. 2, it can be seen that on the one hand, when the H 2 /SiH 4 flux ratio is at 250 and above it, a low refractive index of slightly more than 1.8 is reached; and when a relatively high selection is made The COIR layer material is still electrically conductive when the CO 2 /SiH 4 flux ratio.
根據第2圖的實施例係產生自使用PECVD(特別是VHF PECVD),將SiH4、H2、CO2注入至沉積製程環境中及利用PH3作為摻雜劑氣體之SOIR層材料沉積。因此, 可說成該SOIR層係藉由PECVD在製程環境中沉積,其注入一包含H2、SiH4、摻雜劑氣體及CO2的氣體混合物,其中H2對SiH4之氣流比率在100至400間,因此藉由選擇儘可能高的CO2對SiH4通量比率,因此維持所產生的層之導電度。如在第2圖中看見,在不同H2/SiH4通量比率處達成類似的折射率,但是SOIR材料是否保持導電最後由CO2/SiH4通量比率控制。因此有利的是,利用二種各自獨立的變量(一方面H2/SiH4通量比率,另一方面CO2/SiH4通量比率)來實現具有二種需求(換句話說,一方面低折射率,另一方面高橫向電傳導)的SOIR材料。 The embodiment according to Fig. 2 is produced from a SOIR layer material deposited using PECVD (especially VHF PECVD), implanting SiH 4 , H 2 , CO 2 into a deposition process environment and using PH 3 as a dopant gas. Therefore, it can be said that the SOIR layer is deposited in a process environment by PECVD, which injects a gas mixture containing H 2 , SiH 4 , a dopant gas, and CO 2 , wherein the ratio of H 2 to SiH 4 is 100. Up to 400, so the conductivity of the resulting layer is maintained by selecting the highest possible CO 2 to SiH 4 flux ratio. As seen in Figure 2 , a similar refractive index is achieved at different H 2 /SiH 4 flux ratios, but whether the SOIR material remains conductive is ultimately controlled by the CO 2 /SiH 4 flux ratio. It is therefore advantageous to use two separate variables (on the one hand the H 2 /SiH 4 flux ratio, on the other hand the CO 2 /SiH 4 flux ratio) to achieve two requirements (in other words, on the one hand low) A refractive index, on the other hand, a high lateral electrical conduction) SOIR material.
已經了解所產生的SOIR層材料之奈米結構明顯具決定性。 It is known that the nanostructure of the resulting SOIR layer material is clearly decisive.
在第3圖中顯示出當使用不同H2/SiH4稀釋時所達成的三種SOIR層材料之奈米結構。左手邊由”阻斷”標記的材料顯示出實質上未結構化的SiOx材料。此係在3的低稀釋H2/SiH4下。 The nanostructures of the three SOIR layer materials achieved when diluted with different H 2 /SiH 4 are shown in Figure 3. Left by the "blocking" of labeled material exhibits substantially unstructured SiO x material. This is at a low dilution of H 2 /SiH 4 of 3.
在100之稀釋處,根據由”邊界”標記的中央表示,於此可識別出SiOx較豐富的黑色區域,及可由彼區別的SiO較純區域(白色區域)。開始可在實質上與其上存在該層的表面之垂直之方向上辨認出長細索結構。SiO較豐富索區域在沉積生長方向上的平均長度至少在5奈米至10奈米的範圍內。此SOIR層材料已經具有導電度。 At the dilution of 100, according to the central representation by the "boundary" mark, a black region rich in SiO x and a relatively pure region (white region) of SiO which can be distinguished from each other can be identified. Initially, the long cable structure can be identified in a direction substantially perpendicular to the surface on which the layer is present. The average length of the SiO richer cord region in the deposition growth direction is at least in the range of 5 nm to 10 nm. This SOIR layer material already has electrical conductivity.
右手邊由”導電”標記的材料係在根據第2圖的300稀釋處所建立。在其中,在SiO較豐富索區域的生長方向中之平均長度係大於20奈米,然而其在垂直於此的方向 中之平均長度小於10奈米。 The material labeled "conductive" on the right hand side is established at the 300 dilution according to Figure 2. In which the average length in the growth direction of the SiO rich cord region is greater than 20 nm, however it is in a direction perpendicular thereto The average length is less than 10 nm.
此材料具有好的導電度且結合低折射率。 This material has good electrical conductivity and combines a low refractive index.
將根據第3圖的”導電”層材料結果之層材料進一步沉積在形成三角錐體的粗糙ZnO表面上(如顯示在第4圖中)。μc-Si層插入ZnO與SOIR材料間。已清楚地建立出該SOIR材料之奈米結構保存在粗糙的表面上,平均波峰至波峰粗糙度係至少200奈米。 The layer material resulting from the "conducting" layer material of Figure 3 was further deposited on the rough ZnO surface forming the triangular pyramid (as shown in Figure 4). The μc-Si layer is interposed between the ZnO and SOIR materials. It has been clearly established that the nanostructure of the SOIR material is deposited on a rough surface with an average peak to peak roughness of at least 200 nm.
此實質上擴大對此SOIR層的可能應用範圍。 This substantially expands the range of possible applications for this SOIR layer.
對製造中間反射層IRL(因此根據本發明的SOIR)來說,必需小心考慮的進一步製程參數為沉積速率,特別考慮到工業製造。 For the manufacture of the intermediate reflective layer IRL (and therefore the SOIR according to the invention), a further process parameter that must be carefully considered is the deposition rate, especially in view of industrial manufacturing.
第3圖顯示出在100的H2/SiH4通量比率下,一方面(參見第2圖),折射率在上限及導電度在下限。然而,在300的H2/SiH4通量比率下,折射率和導電度皆改良,第5圖顯示出生長速率隨著H2/SiH4的通量比率增加而減少。因此,在根據本發明之方法的好具體實例中,選擇至少大約300處的H2對SiH4通量比率(根據第5圖),於此仍然產生大約0.6埃/秒之可接受的沉積速率。 Figure 3 shows that at a H 2 /SiH 4 flux ratio of 100, on the one hand (see Figure 2), the refractive index is at the upper limit and the conductivity is at the lower limit. However, at a H 2 /SiH 4 flux ratio of 300, both the refractive index and the conductivity are improved, and Fig. 5 shows that the growth rate decreases as the flux ratio of H 2 /SiH 4 increases. Thus, in a preferred embodiment of the method according to the invention, a ratio of H 2 to SiH 4 flux of at least about 300 is selected (according to Figure 5), which still produces an acceptable deposition rate of about 0.6 angstroms per second. .
藉由合適地修改沉積方法,因此正確地調整CO2對SiH4通量比率和摻雜氣體量,使得在對600奈米波長的光產生1.66之折射率下,將沉積速率進一步提高至約3.5埃/秒,且維持實質上根據在第3圖中的右手邊所顯示之SOIR材料的長細索奈米結構變可能。因此,已發現達成此所提出的進一步最佳化包括考慮在層材料中的整體氧含量。 By appropriately modifying the deposition method, the CO 2 to SiH 4 flux ratio and the amount of doping gas are properly adjusted so that the deposition rate is further increased to about 3.5 at a refractive index of 1.66 for light of a wavelength of 600 nm. Angstroms per second, and it is possible to maintain a substantially fine sonan structure that is substantially in accordance with the SOIR material shown on the right hand side of Figure 3. Therefore, it has been found that achieving further optimization as proposed herein involves considering the overall oxygen content in the layer material.
如第6圖,其顯示出在增加於層材料中的整體氧含量時,該折射率朝向高度想要的低值減少。第6圖顯示出根據本發明的方法之進一步好的具體實例,其存在於最大化在層材料中的整體氧含量,較佳為39%至52%,較佳為至少50%。在此氧含量下,對600奈米波長的光之折射率變成如想要之明顯地低。 As shown in Figure 6, it shows that as the overall oxygen content in the layer material is increased, the refractive index decreases toward a high desired low value. Figure 6 shows a further preferred embodiment of the process according to the invention which is present to maximize the overall oxygen content in the layer material, preferably from 39% to 52%, preferably at least 50%. At this oxygen content, the refractive index of light at a wavelength of 600 nm becomes significantly lower as desired.
第7圖顯示出一個提供IRL(根據本發明SOIR)之好的具體實例。根據第7圖,該串聯太陽能電池包含a-Si及μc-Si p-i-n接面51a及43a。如所顯示,在根據第7圖的特定具體實例中,該正及背面電極層47a及42a二電極層之至少一種係ZnO。至於基材,基材41a以使用玻璃為較佳。a-Si上p-i-n接面51a存在於正面電極42a上。 Figure 7 shows a good example of providing an IRL (SOIR according to the invention). According to Fig. 7, the tandem solar cell comprises a-Si and μc-Si p-i-n junctions 51a and 43a. As shown, in a specific embodiment according to Fig. 7, at least one of the two electrode layers of the front and back electrode layers 47a and 42a is ZnO. As for the substrate, the substrate 41a is preferably made of glass. The p-i-n junction 51a on a-Si is present on the front surface electrode 42a.
沉積IRL層60(根據本發明想像如為SOIR層)作為n摻雜層,及在上a-Si p-i-n接面51a的n摻雜層54a之厚度程度的一部分上擴展。因此,如顯示在第7圖的好具體實例中,所提出的IRL層60係埋入該n-層54a內。 The deposited IRL layer 60 (imagined as an SOIR layer in accordance with the present invention) is expanded as an n-doped layer and a portion of the thickness of the n-doped layer 54a of the upper a-Si p-i-n junction 51a. Thus, as shown in the good example of Figure 7, the proposed IRL layer 60 is buried within the n-layer 54a.
如從第7圖看見,在製造根據本發明的串聯電池之好的具體實例中,後者包含a-Si及μc-Si p-i-n接面51a及43a。因此,在好的具體實例中,該正及背面電極層之至少一種係沉積ZnO。因此,在好的具體實例中,該正面電極存在於玻璃基材41a上,接著為a-Si p-i-n上接面51a。該IRL層60經沉積作為n摻雜層而在a-Si p-i-n接面的n層54a之厚度程度的一部分上擴展。在好的具體實例中,該IRL層60係埋入該a-Si p-i-n接面的n-層中。 As seen from Fig. 7, in a good specific example of manufacturing a tandem cell according to the present invention, the latter comprises a-Si and μc-Si p-i-n junctions 51a and 43a. Therefore, in a good specific example, at least one of the positive and back electrode layers is deposited with ZnO. Therefore, in a good specific example, the front electrode is present on the glass substrate 41a, followed by the a-Si p-i-n upper surface 51a. The IRL layer 60 is deposited as an n-doped layer and spread over a portion of the thickness of the n-layer 54a of the a-Si p-i-n junction. In a preferred embodiment, the IRL layer 60 is embedded in the n-layer of the a-Si p-i-n junction.
如從第7圖看見,根據本發明之串聯電池的好具體實 例包含一a-Si及μc-Si p-i-n接面,一正及背面電極層。因此,在好的具體實例中,該正及背面電極層之至少一種係實質上ZnO。在好的具體實例中,該正面電極存在於玻璃基材上。在好的具體實例中,該a-Si p-i-n上接面存在於該正面電極層上。在好的具體實例中,該IRL層係一n摻雜層而在a-Si p-i-n接面的n層之厚度程度的一部分上擴展,及在進一步好的具體實例中,其埋入a-Si p-i-n接面之n層中。 As seen from Fig. 7, the goodness of the series battery according to the present invention Examples include an a-Si and μc-Si p-i-n junction, a positive and a back electrode layer. Therefore, in a good specific example, at least one of the positive and back electrode layers is substantially ZnO. In a good embodiment, the front electrode is present on a glass substrate. In a preferred embodiment, the a-Si p-i-n upper junction is present on the front electrode layer. In a preferred embodiment, the IRL layer is an n-doped layer that extends over a portion of the thickness of the n-layer of the a-Si pin junction, and in further preferred embodiments, it is embedded in a-Si In the n layer of the pin junction.
IRL(更特定的是,SOIR層60)以如顯示於第7圖的結構提供在串聯太陽能電池中。所提出的層係以3.5埃/秒之沉積速率沉積。當維持該SOIR材料的奈米結構時,達成至少大約1.7的低折射率。該SOIR層60的厚度係60奈米。 The IRL (more specifically, the SOIR layer 60) is provided in a tandem solar cell in a structure as shown in Figure 7. The proposed layer was deposited at a deposition rate of 3.5 angstroms per second. When the nanostructure of the SOIR material is maintained, a low refractive index of at least about 1.7 is achieved. The thickness of the SOIR layer 60 is 60 nm.
第8圖顯示出該串聯太陽能電池所產生的特徵,藉此由(a)所提出的特徵係根據第7圖之比較串聯電池但是沒有IRL層60的特徵。該特徵(b)係產生自所提出具有IRL層60的串聯電池之特徵。關於該SOIR層的厚度,實驗已顯示出在好的具體實例中,該厚度係40至90奈米,因此在改良的具體實例中,60至80奈米。明顯的是,例如在工業製造之觀點下,目標係最小厚度。因此,根據本發明的方法之好的具體實例產生自沉積具有厚度40奈米至90奈米的IRL(SOIR)層,進一步改良係60奈米至80奈米。 Figure 8 shows the features produced by the tandem solar cell whereby the features proposed by (a) are compared in series according to Figure 7 but without the features of the IRL layer 60. This feature (b) is derived from the features of the series connected cell with the IRL layer 60 proposed. Regarding the thickness of the SOIR layer, experiments have shown that in a good specific example, the thickness is 40 to 90 nm, and thus in a modified specific example, 60 to 80 nm. It is obvious that the target is a minimum thickness, for example, from the viewpoint of industrial manufacturing. Thus, a good specific example of the method according to the invention results in the self-deposition of an IRL (SOIR) layer having a thickness of 40 nm to 90 nm, further improving the system from 60 nm to 80 nm.
如第7圖但是沒有IRL之串聯電池上的改良係由熟練的人士明瞭:Voc、形狀因數FF及電池電流Isc全部改良。 The improvement on the tandem cell without the IRL as shown in Fig. 7 is known to the skilled person: Voc, form factor FF and battery current Isc are all improved.
起始效率為12.8%,其超過1000小時的日光曝露穩定至11.2%。因此,亦對高沉積速率來說,達成好的穩定性。 The initial efficiency was 12.8%, and its solar exposure over 1000 hours was stable to 11.2%. Therefore, good stability is also achieved for high deposition rates.
第9圖顯示出根據第7圖沒有IRL層的串聯電池及根據第7圖、根據本發明含有IRL層60的串聯電池、及根據第8圖之電池特徵。在第9圖中,該特徵(a1)提出沒有IRL的串聯電池之起始特徵,(a2)提出該沒有IRL的串聯電池在1000小時日光曝露後之特徵;該特徵(b1)提出根據本發明因此含有IRL的串聯電池之起始特徵,及特徵(b2)提出根據本發明因此含有IRL之串聯電池在1000小時日光曝露後的特徵。 Fig. 9 is a view showing a series battery having no IRL layer according to Fig. 7 and a series battery including an IRL layer 60 according to the present invention according to Fig. 7, and a battery characteristic according to Fig. 8. In Fig. 9, the feature (a1) proposes an initial feature of a series cell without IRL, and (a2) proposes a feature of the series cell without IRL after 1000 hours of solar exposure; this feature (b1) is proposed according to the invention Thus the initial feature of the series cell containing IRL, and feature (b2), characterizes the tandem cell containing the IRL according to the invention after 1000 hours of daylight exposure.
該研究結果至今的某些重點: Some of the key points of the research so far:
‧如上述提出的IRL材料之奈米結構對所產生的串聯電池之好的電性能係決定性。 ‧ The nanostructure of the IRL material as proposed above is decisive for the good electrical properties of the resulting tandem cell.
‧在低折射率下達成高上電池電流,換句話說14.3毫安培/平方公分,該IRL層係沉積在粗糙如所生長的LPCVD ZnO上。 ‧ High cell current is achieved at low refractive index, in other words 14.3 mA/cm 2 , and the IRL layer is deposited on rough as grown LPCVD ZnO.
‧甚至在最高3.5埃/秒的高沉積速率下達成該奈米結構及向下至或甚至低於1.7的折射率。 ‧ The nanostructure and the refractive index down to or even below 1.7 are achieved even at high deposition rates of up to 3.5 angstroms per second.
‧所產生的串聯電池顯示出無Voc光衰退及11.2%的穩定效率。 ‧ The resulting tandem cell showed no Voc light decay and 11.2% stable efficiency.
已經顯示出根據本發明的好SOIR(氧化矽相互反射器)應該包含一具有折射率在1.7-1.9間,及厚度在40-90奈米間(較佳為60-80奈米)之SiOx層。隨著39-52%的氧含量,可達成此甚至較低的折射率值,如已經顯示出。 It has been shown that a good SOIR (cerium oxide inter-reflector) according to the present invention should comprise a SiO x having a refractive index between 1.7 and 1.9 and a thickness between 40 and 90 nm (preferably 60 to 80 nm). Floor. With an oxygen content of 39-52%, this even lower refractive index value can be achieved, as already shown.
在好的具體實例中,該IRL層經安排如為該n層54的部分(埋入其中),其相應地經摻雜以提高導電度。 In a preferred embodiment, the IRL layer is arranged as part of the n-layer 54 (buried therein), which is correspondingly doped to increase conductivity.
在進一步好的具體實例中,該IRM層可在包含Ar的製程環境中沉積。如指示出般加入SiH4、CO2及摻雜劑氣體以達成結晶性及導電度。 In further preferred embodiments, the IRM layer can be deposited in a process environment comprising Ar. SiH 4 , CO 2 and dopant gases were added as indicated to achieve crystallinity and conductivity.
將氬加入至用於該IRL沉積的沉積氣體允許該IRL之折射率n朝向較低的值轉移,如顯示在第10圖中。 The addition of argon to the deposition gas for this IRL deposition allows the refractive index n of the IRL to shift towards a lower value, as shown in FIG.
如可從第10圖看見,將Ar加入至該製程環境會減低折射率,此當該加工壓力增加時變得更明顯。可例如利用4毫巴的加工壓力到達折射率低於1.7。 As can be seen from Figure 10, the addition of Ar to the process environment reduces the refractive index, which becomes more pronounced as the processing pressure increases. The refractive index can be reached below 1.7, for example with a processing pressure of 4 mbar.
製程條件/通量(sccm)為: Process conditions / flux (sccm) is:
H2:1500 H 2 : 1500
SiH4:15 SiH 4 : 15
PH3(0.1%):500 PH 3 (0.1%): 500
CO2:25 CO 2 :25
CO2/SiH4=1.67(通量比率) CO 2 /SiH 4 = 1.67 (flux ratio)
功率:~850瓦 Power: ~850 watts
將100 sccm Ar加入至上述配方造成折射率相當大地轉移至1.7及甚至低於。 The addition of 100 sccm Ar to the above formulation resulted in a considerable transfer of the refractive index to 1.7 and even below.
該IRL層材料的導電度可藉由各別注入用於n摻雜的摻雜物(特別是PH3)而推升。因此,第11圖顯示出IRL層材料的折射率發展與CO2/SiH4之通量比率及沒有將Ar加入至加工環境的相依性。在第11圖中有充足的理由: IRL layer of the conductive material may be used by the respective n-doped implanted dopant (especially PH 3) and pushed up. Thus, Figure 11 shows the ratio of the refractive index development of the IRL layer material to the flux ratio of CO 2 /SiH 4 and the dependence of the addition of Ar to the processing environment. There are plenty of reasons in Figure 11:
左手指示三角形:50 sccm PH3(2%)等於1.0 sccm PH3 Left hand indicating triangle: 50 sccm PH 3 (2%) equals 1.0 sccm PH 3
右手指示三角形:100 sccm PH3(2%)等於2.0 sccm PH3 Right hand indicating triangle: 100 sccm PH 3 (2%) equals 2.0 sccm PH 3
填滿標記=阻斷電池。 Fill the mark = block the battery.
製程條件/通量(sccm): Process conditions / flux (sccm):
H2:1500(最高1950) H 2 : 1500 (up to 1950)
SiH4:15 SiH 4 : 15
(PH3(0.1%):500) (PH 3 (0.1%): 500)
功率:~850瓦 Power: ~850 watts
壓力:4毫巴 Pressure: 4 mbar
第12圖顯示出沉積速率在IRL層材料之折射率上的影響。要注意,在3.3埃/秒至3.8埃/秒間之沉積速率範圍內達到最小折射率,向下至約1.7。 Figure 12 shows the effect of the deposition rate on the refractive index of the IRL layer material. It is noted that the minimum refractive index is reached over a range of deposition rates from 3.3 angstroms per second to 3.8 angstroms per second down to about 1.7.
在下列實施例中,研究在CO2通量32 sccm下,Ar及PH3(2%)於非微晶串聯電池上之影響。 In the following examples, the effect of Ar and PH 3 (2%) on a non-microcrystalline tandem cell at a CO 2 flux of 32 sccm was investigated.
1)電池參數為: 1) The battery parameters are:
4.5微米ZnO 4.5 micron ZnO
250奈米a-Si:H上電池 250 nm a-Si: H battery
60奈米氧化矽相互反射器(SOIR) 60 nm yttria mutual reflector (SOIR)
1.8微米μc-Si:H 1.8 micron μc-Si:H
製程參數為:
第13圖及第14圖顯示出結果。對結果(a)來說,在3.4埃/秒的沉積速率下達成該IRL層材料的折射率為1.66。 Figures 13 and 14 show the results. For the result (a), the refractive index of the material of the IRL layer was 1.66 at a deposition rate of 3.4 angstroms/second.
2)電池參數為: 2) The battery parameters are:
AR玻璃 AR glass
2微米厚的ZnO 2 micron thick ZnO
280奈米a-Si:H 280 nm a-Si:H
60奈米厚的SOIR或80奈米厚的SOIR(名為系統B) 60 nm thick SOIR or 80 nm thick SOIR (named System B)
2.4微米μc-Si:H 2.4 micron μc-Si:H
用於SOIR的製程參數為:
結果顯示在第15、16、17及18圖中。 The results are shown in Figures 15, 16, 17 and 18.
所產生的非微晶串聯電池之起始特徵顯示在第19圖中,在光衰退後之特徵在第20圖中: The initial characteristics of the resulting non-microcrystalline tandem cell are shown in Figure 19, and the features after light decay are in Figure 20:
特徵(a):無SIOR塗佈,SOIR厚度60奈米 Feature (a): no SIOR coating, SOIR thickness 60 nm
特徵(b):具有如上述提出的製程參數50 sccm PH3 2%,SOIR厚度60奈米 Characteristic (b): having the process parameter 50 sccm PH 3 2% as proposed above, SOIR thickness 60 nm
特徵(c):具有如上述提出的100 sccm PH3 2%及100 sccm Ar通量,SOIR厚度60奈米 Characteristic (c): having 100 sccm PH 3 2% and 100 sccm Ar flux as proposed above, SOIR thickness 60 nm
特徵(d):SOIR厚度80奈米。 Characteristic (d): SOIR thickness is 80 nm.
進行將Ar加入至如所建立的H2、SiH4、CO2、PH3混合物,或由Ar部分置換H2因此導致固定的H2+Ar氣 流,藉此進一步研究其是否在IRL相依性上有差異。 The addition of Ar to the H 2 , SiH 4 , CO 2 , PH 3 mixture as established, or the partial replacement of H 2 by Ar thus results in a fixed H 2 +Ar gas flow, thereby further studying whether it is on the IRL dependency Differences.
A)加入氣流: A) Add airflow:
通量(sccm): Flux (sccm):
H2:1900 H 2 : 1900
SiH4:15 SiH 4 : 15
PH3(2%):100 PH 3 (2%): 100
CO2:32 CO 2 : 32
CO2/SiH4:2.13 CO 2 /SiH 4 : 2.13
Ar:0至290 Ar: 0 to 290
功率:約850瓦 Power: about 850 watts
B)固定氣流: B) Fixed airflow:
通量(sccm): Flux (sccm):
H2+Ar:1900 H 2 +Ar:1900
SiH4:15 SiH 4 : 15
PH3(2%):100 PH 3 (2%): 100
CO2:32 CO 2 : 32
CO2/SiH4:2.13 CO 2 /SiH 4 : 2.13
Ar:0至290 Ar: 0 to 290
功率:約850瓦 Power: about 850 watts
結果顯示在第21圖中。 The results are shown in Figure 21.
請注意n值達到1.56。因此,在用於SOIR層的沉積加工環境中增加Ar量將減低沉積速率。 Please note that the value of n reaches 1.56. Therefore, increasing the amount of Ar in the deposition processing environment for the SOIR layer will reduce the deposition rate.
第22圖顯示出根據B)的固定氣流加工之此減低。 Figure 22 shows this reduction in fixed airflow processing according to B).
對所提出的SOIR沉積製程B)來說,第23圖顯示出在該層材料中的氧含量及該層材料的折射率與Ar氣流之 相依性。在第23圖中,該測量點(a)提出氧含量,標記(b)係折射率的點。 For the proposed SOIR deposition process B), Figure 23 shows the oxygen content in the layer material and the refractive index of the layer material and the Ar gas flow. Dependency. In Fig. 23, the measurement point (a) proposes an oxygen content, and the mark (b) is a point of the refractive index.
請注意與第6圖一致:在奈米結構上的測量顯示出在O濃度為52%,n=1.71;在O濃度為48%,n=1.82;在O濃度為39%,n=1.88。 Note that it is consistent with Figure 6: measurements on the nanostructure show an O concentration of 52%, n = 1.71; an O concentration of 48%, n = 1.82; an O concentration of 39%, n = 1.88.
因為在固定氣流加工下Ar置換H2,故H2/SiH4的通量比率減少,且因為第5圖顯示出在減少H2/SiH4通量比率下沉積速率增加,故該固定氣流加工則應該造成沉積速率隨著Ar通量增加而增加。 Since Ar replaces H 2 under fixed gas flow processing, the flux ratio of H 2 /SiH 4 decreases, and since Figure 5 shows an increase in deposition rate at a reduced H 2 /SiH 4 flux ratio, the fixed gas flow is processed. The deposition rate should be increased as the Ar flux increases.
伴隨著下列的加工參數,研究IRL材料的沉積速率及折射率與SiH4通量之相依性。結果顯示在第24圖中。點(a)提出沉積速率的測量點,點(b)係折射率。 The deposition rate of the IRL material and the dependence of the refractive index on the SiH 4 flux were investigated along with the following processing parameters. The results are shown in Figure 24. Point (a) proposes a measurement point of the deposition rate, and point (b) is a refractive index.
請注意在固定H2通量下,增加SiH4通量造成H2/SiH4通量比率減少。因此,其與先前結果(參見第2圖)一致,在足夠高SiH4通量下,該IRL材料變成電阻性太高(參見全測量點)。要了解,折射率仍然實質上穩定,未受變化的SiH4通量影響。 Note that increasing the SiH 4 flux at a fixed H 2 flux results in a decrease in the H 2 /SiH 4 flux ratio. Therefore, consistent with the previous results (see Figure 2), the IRL material becomes too resistive at a sufficiently high SiH 4 flux (see full measurement point). It is to be understood that the refractive index is still substantially stable and is unaffected by the varying SiH 4 flux.
製程參數: Process parameters:
通量(sccm): Flux (sccm):
H2:1500 H 2 : 1500
PH3(2%):50 PH 3 (2%): 50
CO2:32-64 CO 2 : 32-64
CO2/SiH4:2.1 CO 2 /SiH 4 :2.1
功率:850瓦 Power: 850 watts
我們已發現作為我們研究的進一步重點: We have found further focus as our research:
對非微晶串聯電池來說,高速率SOIR(~3.5埃/秒)良好地工作:無電流損失,於低速率SOIR的類似光學效益,無或非常些微的額外衰退。 For non-microcrystalline tandem cells, high rate SOIR (~3.5 angstroms per second) works well: no current loss, similar optical benefits at low rate SOIR, no or very little extra degradation.
約4埃/秒的沉積速率(對50-60奈米的薄SOIR來說)應該可能具有好的性能。 A deposition rate of about 4 angstroms per second (for a thin SOIR of 50-60 nm) should probably have good performance.
該配方可使用在非微晶電池的背面處用於n-SiOx。 可將厚的透明層加入至電池性能。 This formulation can be used at the back of a non-microcrystalline cell for n-SiOx. A thick transparent layer can be added to the battery performance.
41,41a‧‧‧基材 41,41a‧‧‧Substrate
43,43a‧‧‧下電池 43,43a‧‧‧Battery
45‧‧‧微晶i-型層 45‧‧‧Microcrystalline i-type layer
47,47a‧‧‧背面電極 47,47a‧‧‧Back electrode
50‧‧‧薄膜太陽能電池 50‧‧‧Thin solar cells
53‧‧‧非晶相i-型層 53‧‧‧Amorphous phase i-type layer
42,42a‧‧‧正面電極 42,42a‧‧‧ front electrode
44,52‧‧‧p-型層 44,52‧‧‧p-type layer
46,54,54a‧‧‧n-型層 46, 54, 54a‧‧ n-type layer
48‧‧‧背反射器 48‧‧‧Back reflector
51,51a‧‧‧上電池 51, 51a‧‧‧Battery
60‧‧‧IRL層 60‧‧‧IRL layer
第1圖以圖式顯示出一先前技術之串聯薄膜矽光伏打電池。 Figure 1 is a diagram showing a prior art tandem film tantalum photovoltaic cell.
第2圖顯示出折射率與如在根據本發明的中間反射層之VHF PECVD沉積方法中所施加的H2/SiH4通量比率之相依性。 Figure 2 shows the dependence of the refractive index on the H 2 /SiH 4 flux ratio as applied in the VHF PECVD deposition method of the intermediate reflective layer according to the present invention.
第3圖顯示出三種在各別的H2/SiH4通量比率下所沉積之IRL材料的奈米結構,其為電子能量損失能譜/能量過濾穿透式電子顯微鏡的結果。 Figure 3 shows the three nanostructures of the IRL material deposited at the respective H 2 /SiH 4 flux ratios, which are the results of electron energy loss spectroscopy/energy filtration through electron microscopy.
第4圖顯示出沉積在粗糙的ZnO表面外形上之根據本發明的IRL材料之奈米結構。 Figure 4 shows the nanostructure of an IRL material according to the present invention deposited on a rough ZnO surface profile.
第5圖顯示出沉積IRL材料層的沉積速率與H2/SiH4通量比率之相依性。 Figure 5 shows the dependence of the deposition rate of the deposited IRL material layer on the H 2 /SiH 4 flux ratio.
第6圖顯示出IRL層材料的折射率與在該材料中的氧含量之相依性。 Figure 6 shows the dependence of the refractive index of the IRL layer material on the oxygen content in the material.
第7圖以圖式顯示出根據本發明的串聯電池之具體 實例。 Figure 7 is a diagram showing the specificity of the series battery according to the present invention. Example.
第8圖顯示出根據第7圖的具體實例之串聯電池的特徵。 Fig. 8 shows the characteristics of the series battery according to the specific example of Fig. 7.
第9圖顯示出根據第7圖沒有發明提供IRL層的及根據本發明含有IRL層的串聯電池之衰退特徵。 Figure 9 shows the decay characteristics of a series cell comprising an IRL layer according to Figure 7 and having an IRL layer in accordance with the present invention.
第10圖顯示出折射率與於加工環境中在不同Ar量下的沉積製程壓力之相依性。 Figure 10 shows the dependence of the refractive index on the deposition process pressure at different amounts of Ar in the processing environment.
第11圖顯示出LRL層材料的折射率與如施加至該沉積加工環境的CO2/SiH4通量比率之相依性。 Figure 11 shows the dependence of the refractive index of the LRL layer material on the ratio of CO 2 /SiH 4 flux as applied to the deposition processing environment.
第12圖顯示出IRL材料的折射率與沉積此材料的沉積速率之相依性。 Figure 12 shows the dependence of the refractive index of the IRL material on the deposition rate of the deposited material.
第13圖顯示出電池電流Isc與在沉積加工環境中使用不同量的摻雜氣體及Ar之相依性。 Figure 13 shows the dependence of the battery current Isc on the different amounts of dopant gas and Ar used in the deposition processing environment.
第14圖顯示出根據第13圖的不同加工與所產生的電池效率之相依性。 Figure 14 shows the dependence of the different processing according to Figure 13 on the resulting battery efficiency.
第15圖又顯示出第13及14圖的不同加工與起始及衰退的電池電壓Voc之相依性。 Figure 15 again shows the dependence of the different processing of Figures 13 and 14 on the initial and decaying battery voltage Voc.
第16圖又顯示出所提出的不同加工與起始及衰退的膜因子之相依性。 Figure 16 again shows the dependence of the proposed different processing on the initial and declining membrane factors.
第17圖又顯示出所提出的加工與起始及衰退的電池電流Isc之相依性。 Figure 17 again shows the dependence of the proposed processing on the initial and decaying battery current Isc.
第18圖又顯示出所提出的加工與起始及降低的效率之相依性。 Figure 18 again shows the dependence of the proposed processing on the initial and reduced efficiency.
第19及20圖顯示出以與所提出之第13至18圖不同方式加工的IRL層所製造之串聯電池的起始及衰退特徵。 Figures 19 and 20 show the initial and decay characteristics of a series cell fabricated with an IRL layer processed in a different manner than the proposed Figures 13-18.
第21圖顯示出IRL層材料的折射率與存在於層沉積製程環境中的Ar量之相依性。 Figure 21 shows the dependence of the refractive index of the IRL layer material on the amount of Ar present in the layer deposition process environment.
第22圖顯示出沉積速率與流入IRL層沉積製程環境中的氬量之相依性。 Figure 22 shows the dependence of the deposition rate on the amount of argon that flows into the IRL layer deposition process environment.
第23圖顯示出在IRL層材料中之氧含量及各別之折射率與流入製程環境中的Ar之相依性。 Figure 23 shows the dependence of the oxygen content in the IRL layer material and the respective refractive indices on Ar in the process environment.
第24圖顯示出沉積速率及折射率與SiH4氣流的相依性。 Figure 24 shows the deposition rate and the dependence of the refractive index on the SiH 4 gas flow.
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