TW201326741A - Method of compensating probe measurement - Google Patents
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本發明是有關一種探針量測補償方法,特別是指補償探針本身形狀誤差的補償方法。The invention relates to a probe measurement and compensation method, in particular to a compensation method for compensating the shape error of the probe itself.
三維量測機台中,係包含有由一探針夾頭夾掣的一探針,且機台連線到一微處理器。當要量測一待測物的表面輪廓時,先將待測物置於一移動平台上,微處理器控制該移動平台以使探針接觸待測物表面,並記錄接觸點的座標,根據所有的接觸點座標繪製出待測物的表面輪廓。In the three-dimensional measuring machine, a probe is clamped by a probe chuck, and the machine is wired to a microprocessor. When measuring the surface contour of the object to be tested, the object to be tested is first placed on a moving platform, and the microprocessor controls the moving platform to make the probe contact the surface of the object to be tested, and records the coordinates of the contact point, according to all The contact point coordinates plot the surface profile of the object to be tested.
由於機台本身會因製造、操作環境等因素,導致量測時產生誤差,因此有多種改善誤差的方法已被提出。Since the machine itself may cause errors in measurement due to factors such as manufacturing and operating environment, various methods for improving the error have been proposed.
如中華民國專利第I258566號「三座標測量機床誤差補償系統及方法」,該系統包括一輸入/輸出模組、一計算模組、一資料安全模組及一資料存儲模組,該輸入/輸出模組用於資料獲取和誤差補償結果輸出;該計算模組用於誤差補償計算和返回前座標值的計算;該資料安全模組,用於測量和對計算過程中的文檔進行加密和解密;該資料存儲模組用於測量計算過程中所產生的各種結果文檔的暫存。藉此能快速大範圍的補償三座標測量機床誤差,並降低機構的加工成本,提高了機台量測精度。For example, the Republic of China Patent No. I258566 "Three-coordinate Measuring Machine Error Compensation System and Method" includes an input/output module, a computing module, a data security module and a data storage module, the input/output The module is used for data acquisition and error compensation result output; the calculation module is used for error compensation calculation and returning front coordinate value calculation; the data security module is used for measuring and encrypting and decrypting documents in the calculation process; The data storage module is used to measure the temporary storage of various result documents generated during the calculation process. Thereby, the error of the three-coordinate measuring machine tool can be compensated quickly and widely, and the processing cost of the mechanism is reduced, and the measuring accuracy of the machine is improved.
如中華民國專利公開第201037268號「用於三次元量床之熱變形誤差補償方法」,其係建立不同環境溫度下之熱變型幾何誤差數據,其包含熱變形幾何座標誤差參數與機構參數,以取得熱變形幾何誤差模型,並輸入三次元量床之中央控制單元,接著轉換三維誤差補償量,以取得熱變形幾何誤差補償模型,藉此熱變形幾何誤差補償模型進行補償,以完成三次元量床之熱變形幾何誤差補償。For example, the Republic of China Patent Publication No. 201037268 "Method for Compensation of Thermal Deformation Errors for Three-Dimensional Beds", which is to establish thermal deformation geometric error data at different ambient temperatures, including thermal deformation geometric coordinate error parameters and mechanical parameters, The thermal deformation geometric error model is obtained, and the central control unit of the cubic element bed is input, and then the three-dimensional error compensation amount is converted to obtain the thermal deformation geometric error compensation model, thereby compensating the thermal deformation geometric error compensation model to complete the three-dimensional quantity. The thermal deformation geometric compensation of the bed.
如中華民國專利公開第200912242「座標測量機及對應補償法」,包括一設有數個可沿座標軸移動之構件以帶動一測量感測器在測量空間內移動之移動單元該移動單元中具有一與移動構件一起連動並提供與該機組之動態變形相關之量值;該量值經處理以補償隨該動態變形而生之機器之測量誤差。For example, the Republic of China Patent Publication No. 200912242 "Coordinate Measuring Machine and Corresponding Compensation Method" includes a moving unit having a plurality of members movable along a coordinate axis to drive a measuring sensor to move in the measuring space. The moving members are linked together and provide a magnitude associated with the dynamic deformation of the unit; the magnitude is processed to compensate for measurement errors of the machine born with the dynamic deformation.
上述技術都是針對機台本身進行誤差補償,然而對於探針形狀誤差並未加以考慮。當待測物的尺寸愈小,探針的精密度更顯重要。受限於探針的製程技術,探針的形狀精度可能無法滿足微小待測物的需求,因此探針本身形狀的誤差將對量測結果產生影響。The above techniques are all for error compensation of the machine itself, but the shape error of the probe is not taken into consideration. When the size of the analyte is smaller, the precision of the probe is more important. Due to the process technology of the probe, the shape accuracy of the probe may not meet the requirements of the small object to be tested, so the error of the shape of the probe itself will affect the measurement result.
因此本發明的主要目的是提供一種探針量測補償方法,當量測一待測物的表面輪廓時,期以降低因探針本身衍生的誤差。SUMMARY OF THE INVENTION It is therefore a primary object of the present invention to provide a probe measurement compensation method for measuring the surface profile of a test object in an equivalent manner to reduce errors due to the probe itself.
為達前揭目的,本發明所採用的技術手段是令該探針量測補償方法包含以下步驟:建立一探針針頭的誤差函數;控制該探針針頭接觸一待測物,記錄其接觸點座標,並計算各接觸點的法線向量,由法線向量取得定位角;將定位角代入誤差函數,以計算探針針頭對應各接觸點法線方向上的誤差,以作為補償值;將所得補償值與待測物的接觸點座標進行相加。For the purpose of the prior art, the technical means adopted by the present invention is that the probe measurement compensation method comprises the steps of: establishing an error function of a probe needle; controlling the probe needle to contact an object to be tested, and recording the contact point thereof; Coordinates, and calculate the normal vector of each contact point, obtain the positioning angle from the normal vector; substitute the positioning angle into the error function to calculate the error of the probe needle corresponding to the normal direction of each contact point as the compensation value; The compensation value is added to the contact point coordinates of the object to be tested.
是以,本發明先建立一探針針頭的誤差函數,其中所記錄的所有接觸點座標係表示待測物的表面輪廓,取得待測物的表面輪廓之後,進一步根據誤差函數在各接觸點法線方向上的誤差,以將探針針頭本身的誤差排除,藉此得到更精準的待測物表面輪廓。Therefore, the present invention first establishes an error function of a probe needle, wherein all the contact point coordinates recorded represent the surface contour of the object to be tested, and after obtaining the surface contour of the object to be tested, further according to the error function at each contact point method The error in the line direction to eliminate the error of the probe needle itself, thereby obtaining a more accurate surface profile of the object to be tested.
請參考圖1所示,機台10是透過一微處理器20執行相關運算與控制,並以x-y軸構成的平面代表水平面,z軸為垂直水平面,其中一通過原點的直線投影到x-y平面後,相對x軸的夾角定義為一θ角,通過原點直線相對z軸的夾角定義為一Φ角。請參考圖2所示,係本發明的流程圖。Referring to FIG. 1, the machine 10 performs related operations and control through a microprocessor 20, and the plane formed by the xy axis represents a horizontal plane, and the z-axis is a vertical horizontal plane, wherein a straight line passing through the origin is projected onto the xy plane. Thereafter, the angle with respect to the x-axis is defined as an angle θ, and the angle between the origin line and the z-axis is defined as a Φ angle. Please refer to FIG. 2, which is a flowchart of the present invention.
本發明首先建立一探針的圓輪廓誤差函數及球面輪廓誤差函數(100)。請參考圖1所示的示意圖,一探針11係安裝於機台10的探針夾頭12上,該機台10連線到微處理器20。如圖3所示,探針11末端具有一針頭110,該針頭110由一分隔線111區分為一下半部112與一上半部113,其中分隔線111係指針頭110具有最大外徑的位置。The invention first establishes a circular contour error function and a spherical contour error function (100) of a probe. Referring to the schematic diagram shown in FIG. 1, a probe 11 is mounted on the probe collet 12 of the machine table 10, and the machine 10 is wired to the microprocessor 20. As shown in FIG. 3, the tip of the probe 11 has a needle 110 which is divided by a dividing line 111 into a lower half 112 and an upper half 113, wherein the dividing line 111 is the position of the pointer head 110 having the largest outer diameter. .
請參考圖4所示,機台10上設置一環規30,該環規30具有一圓柱形的內表面31,並以該內表面31的圓輪廓32作為標準圓。Referring to FIG. 4, a ring gauge 30 is disposed on the machine table 10. The ring gauge 30 has a cylindrical inner surface 31 and a circular contour 32 of the inner surface 31 as a standard circle.
A.圓輪廓誤差函數Ec(θ)的計算:A. Calculation of the circular contour error function E c (θ):
圓輪廓誤差函數是應用於二維待測物量測,該微處理器20控制探針夾頭12移動探針11,使探針11垂直伸入環規30中。該微處理器20係控制探針11在相同的高度下,將針頭110的分隔線111接觸該環規30的內表面31,並以固定的間隔角度沿環規30的內表面31接觸,例如以環規30的軸心為圓心,每隔5°接觸內表面31一次。當探針11每接觸內表面31一次,該微處理器20即記錄一接觸點的座標(xi,yi);是以,當探針11沿環規30內表面31接觸一圈後,該微處理器20即記錄了針頭110所有接觸點的座標。The circular contour error function is applied to the two-dimensional object to be measured, and the microprocessor 20 controls the probe chuck 12 to move the probe 11 so that the probe 11 extends vertically into the ring gauge 30. The microprocessor 20 controls the probe 11 to contact the separation line 111 of the needle 110 to the inner surface 31 of the ring gauge 30 at the same height and to contact the inner surface 31 of the ring gauge 30 at a fixed angular angle, for example The inner surface 31 is contacted once every 5° with the axis of the ring gauge 30 as the center. When the probe 11 touches the inner surface 31 once, the microprocessor 20 records the coordinates (x i , y i ) of a contact point; that is, after the probe 11 contacts the inner surface 31 of the ring gauge 30 for one turn, The microprocessor 20 records the coordinates of all contact points of the needle 110.
由於本方法係以環規30的內表面31作為標準圓,因此將各個接觸點連線後,所反應出的輪廓即是該針頭110分隔線111的實際輪廓,如圖5所示的分隔線輪廓114。然而,各個接觸點之間是間斷而不連續的,為了取得連續的輪廓,可採用線性、二階或三階內差計算,亦即在相鄰接觸點之間計算出多個內差點,將所有的內差點與接觸點相連後,即可代表針頭110在分隔線111位置的輪廓。Since the method uses the inner surface 31 of the ring gauge 30 as a standard circle, after the respective contact points are connected, the reflected contour is the actual contour of the needle 110 dividing line 111, as shown in FIG. Contour 114. However, each contact point is discontinuous and discontinuous. In order to obtain a continuous contour, linear, second-order or third-order internal difference calculation can be used, that is, multiple internal differences are calculated between adjacent contact points, and all will be The inner point difference is connected to the contact point to represent the contour of the needle 110 at the position of the separation line 111.
請參考圖5所示,將分隔線輪廓114與一標準圓115進行比對,計算出分隔線輪廓114與標準圓115在徑向上的圓輪廓誤差函數Ec(θ)。請參考圖6所示,例如各接觸點座標(xi,yi)相對標準圓之一點(xs,ys)所對應的針頭誤差為(Δx,Δy),其中Δx=Ec(θ)cosθ,Δy=Ec(θ)sinθ。With reference to FIG. 5, the dividing line 114 for comparison with the contour to a standard circle 115, 114 and calculate the standard round contour parting line 115 in the radial direction of the circular contour of the error function E c (θ). Please refer to FIG. 6 , for example, the contact error of each contact point coordinate (x i , y i ) relative to a point (x s , y s ) of the standard circle is (Δx, Δy), where Δx=E c (θ Cos θ, Δy = E c (θ) sin θ.
B.球面輪廓誤差函數的計算:B. Calculation of the spherical contour error function:
球面輪廓誤差函數是應用於三維待測物量測,請參考圖7所示,機台上設置一標準球體40,該標準球體40以一分隔線41對分為一上半球面411與一下半球面412,以上半球面411作為標準球面。The spherical contour error function is applied to the three-dimensional object to be measured. Referring to FIG. 7, a standard sphere 40 is disposed on the machine table. The standard sphere 40 is divided into an upper hemisphere 411 and a lower hemisphere by a dividing line 41. The face 412 has the upper hemispherical surface 411 as a standard spherical surface.
該微處理器20控制探針夾頭12垂直地移動探針11,以標準球體40分隔線41所在位置作為初始高度,使針頭110的分隔線111在初始高度以固定的間隔角度沿上半球面411接觸,當探針11沿上半球面411接觸一圈後,該微處理器20即記錄了探針11於初始高度時的接觸點的座標。The microprocessor 20 controls the probe collet 12 to vertically move the probe 11 with the position of the standard sphere 40 separating the line 41 as the initial height, so that the dividing line 111 of the needle 110 is along the upper hemisphere at a fixed interval angle at the initial height. The 411 contacts, when the probe 11 contacts a circle along the upper hemispherical surface 411, the microprocessor 20 records the coordinates of the contact point of the probe 11 at the initial height.
當於初始高度記錄完畢後,請參考圖8所示,微處理器20控制該探針11往上垂直位移一段間隔,及水平移動至探針11的下半部112接觸上半球面411,即探針11相對上半球面411提高一Φ角,再控制針頭110以固定的間隔角度沿上半球面411接觸,當探針11沿上半球面411接觸一圈後,該微處理器20即記錄了探針11於此高度的接觸點的座標。是以,當探針11完成數次往上位移後,微處理器20可取得數筆接觸點座標,並根據所有接觸點座標建構成一曲面,由於本發明係以上半球面411作為標準球面,因此該曲面反應出的即是該針頭110下半部112的實際表面。After the initial height recording is completed, referring to FIG. 8, the microprocessor 20 controls the probe 11 to vertically shift upward by an interval, and horizontally moves to the lower half 112 of the probe 11 to contact the upper hemispherical surface 411, that is, The probe 11 is raised by a Φ angle with respect to the upper hemispherical surface 411, and then the needle 110 is controlled to contact along the upper hemispherical surface 411 at a fixed interval angle. When the probe 11 is contacted one turn along the upper hemispherical surface 411, the microprocessor 20 records The coordinates of the contact point of the probe 11 at this height. Therefore, after the probe 11 is displaced upward several times, the microprocessor 20 can obtain a plurality of contact point coordinates, and construct a curved surface according to all the contact point coordinates. Since the present invention uses the above hemispherical surface 411 as a standard spherical surface, The surface thus reflects the actual surface of the lower half 112 of the needle 110.
接著,將該曲面與一標準球體的球面進行比對,例如先計算每一接觸點至標準球體球心的距離,再將所得距離減去標準球面的半徑值而獲得一誤差值,整合所有接觸點相對標準球面的誤差值後,即可獲得球面輪廓誤差函數Es(θ,Φ)。綜上所述,於執行上述步驟後,微處理器20取得探針11的圓輪廓誤差Ec(θ)以及針頭110下半部112的球面輪廓誤差函數Es(θ,Φ)。Then, the surface is compared with the spherical surface of a standard sphere, for example, the distance from each contact point to the center of the standard sphere is calculated, and the obtained distance is subtracted from the radius value of the standard sphere to obtain an error value, and all the contacts are integrated. After the point is compared with the error value of the standard spherical surface, the spherical contour error function E s (θ, Φ) can be obtained. In summary, after performing the above steps, the microprocessor 20 obtains the circular contour error E c (θ) of the probe 11 and the spherical contour error function E s (θ, Φ) of the lower half 112 of the needle 110.
接著進行待測物的輪廓量測,進行曲線擬合運算或曲面擬合運算以取得各接觸點的法線向量,再根據法線向量推算各接觸點的定位角(200)。當探針11針頭110量測一待測物的形狀時,假設待測物是一凹孔,以針頭110伸入凹孔中,以針頭110的分隔線111位置量測該凹孔的內表面。當針頭110沿凹孔的內表面接觸一圈後,微處理器20可得到如圖9所示數個接觸點50的座標。Then, the contour measurement of the object to be tested is performed, and a curve fitting operation or a surface fitting operation is performed to obtain a normal vector of each contact point, and then the positioning angle of each contact point is estimated according to the normal vector (200). When the probe 11 needle 110 measures the shape of a test object, it is assumed that the object to be tested is a concave hole, and the needle 110 is inserted into the concave hole, and the inner surface of the concave hole is measured by the position of the separation line 111 of the needle 110. . When the needle 110 contacts a circle along the inner surface of the recess, the microprocessor 20 can obtain coordinates of a plurality of contact points 50 as shown in FIG.
接著,選取一第i接觸點座標,並根據第i、i-1、i-2、...、i+1、i+2...,等數個接觸點的座標進行曲線擬合運算,即將接觸點座標代入二次曲線方程式ax2+by2+dxy+gx+hy+n=0,以進行二次曲線擬合運算,解得方程式係數a、b、d、g、h及n;是以,根據算得的係數再代回二次曲線方程式ax2+by2+dxy+gx+hy+n=0中,計算待測物於第i接觸點上的法線向量A(p,q),根據法線向量A(p,q)可推算第i接觸點的定位角θi,θi=tan-1(q/p)。Next, an ith contact point coordinate is selected, and a curve fitting operation is performed according to the coordinates of the i, i-1, i-2, ..., i+1, i+2, ..., and several contact points. , that is, the contact point coordinates are substituted into the quadratic curve equation ax 2 +by 2 +dxy+gx+hy+n=0 for quadratic curve fitting operation, and the equation coefficients a, b, d, g, h, and n are solved. Therefore, according to the calculated coefficient, the quadratic curve equation ax 2 +by 2 +dxy+gx+hy+n=0 is substituted, and the normal vector A (p, at the ith contact point of the object to be tested is calculated. q), the positioning angle θ i of the ith contact point, θ i =tan -1 (q/p) can be estimated from the normal vector A (p, q).
同樣地,假設欲量測待測物為曲面的外表面,可以探針11的針頭110於數個固定高度環繞接觸待測物的外表面,以取得所有接觸點座標。接著,選取第i接觸點座標(xi,yi,zi),以及相鄰第i接觸點的複數個第j、k...接觸點座標(xj,yj,zj)、(xk,yk,zk)...,根據第i、j、k...等數個接觸點座標代入二次曲面方程式:ax2+by2+cz2+dxy+eyz+fxz+gx+hy+mz+n=0,以進行二次曲面擬合運算,進而解得方程式係數a~h、m、n;是以,根據係數a~h、m、n再代回上述二次曲面方程式中,計算待測物於第i接觸點上的法線向量A(p,q,r),而再根據法線向量A(p,q,r)推算第i接觸點的定位角θi與Φi,其中,Similarly, assuming that the object to be tested is measured as the outer surface of the curved surface, the needle 110 of the probe 11 can be circumferentially contacted with the outer surface of the object to be tested at a plurality of fixed heights to obtain all contact point coordinates. Next, selecting an ith contact point coordinate (x i , y i , z i ), and a plurality of jth, k... contact point coordinates (x j , y j , z j ) of the adjacent i-th contact point, (x k , y k , z k )..., substituting a number of contact point coordinates such as i, j, k... into the quadric equation: ax 2 + by 2 + cz 2 + dxy + eyz + fxz +gx+hy+mz+n=0, to perform quadratic surface fitting operation, and then solve the equation coefficients a~h, m, n; yes, according to the coefficients a~h, m, n and then return the above two In the subsurface equation, calculate the normal vector A (p, q, r) of the object to be measured at the ith contact point, and then calculate the positioning angle of the ith contact point according to the normal vector A (p, q, r) θ i and Φ i , wherein
取得各接觸點的定位角後,將定位角代入圓輪廓誤差函數Ec(θ)或球面輪廓誤差函數Es(θ,Φ),計算針頭110於對應該法線方向上的圓輪廓誤差或球面輪廓誤差以作為補償值(300)。於本步驟中,以圓輪廓誤差舉例而言,將定位角θi代入圓輪廓誤差函數Ec(θ),即可得到針頭110相對於定位角θi方向相對標準圓的誤差(Δx,Δy)。同理,以球面廓誤差舉例,將定位角θi與Φi代入球面輪廓誤差函數Es(θ,Φ),即可得到針頭110相對於定位角θi與Φi方向相對標準球面的誤差(Δx,Δy,Δz)。After obtaining the positioning angle of each contact point, the positioning angle is substituted into the circular contour error function E c (θ) or the spherical contour error function E s (θ, Φ), and the circular contour error of the needle 110 in the direction corresponding to the normal is calculated or The spherical contour error is taken as the compensation value (300). In this step, by taking the positioning angle θ i into the circular contour error function E c (θ) as an example of the circular contour error, the error of the needle 110 relative to the standard circle relative to the positioning angle θ i (Δx, Δy) is obtained. ). Similarly, taking the spherical profile error as an example, the positioning angles θ i and Φ i are substituted into the spherical contour error function E s (θ, Φ) to obtain the error of the needle 110 relative to the standard spherical surface with respect to the positioning angles θ i and Φ i . (Δx, Δy, Δz).
將所得補償值與待測物的接觸點座標進行相加(400)。以圓輪廓誤差舉例而言,取得誤差(Δx,Δy)後,只要將誤差(Δx,Δy)與對應的待測物接觸點的座標(xi,yi)相加,即可排除針頭110本身形狀誤差,而得到待測物較精準的輪廓。以球面廓誤差舉例而言,係將誤差(Δx,Δy,Δz)與對應的待測物接觸點的座標(xi,yi,zi)相加。The obtained compensation value is added to the contact point coordinates of the object to be tested (400). For example, in the case of the circular contour error, after the error (Δx, Δy) is obtained, the needle 110 can be excluded by adding the error (Δx, Δy) to the coordinate (x i , y i ) of the corresponding contact point of the object to be tested. The shape error itself, and the contour of the object to be tested is more accurate. For example, the spherical profile error is obtained by adding the error (Δx, Δy, Δz) to the coordinates (x i , y i , z i ) of the corresponding contact point of the object to be tested.
是以,根據本發明的方法,微處理器在量測待測物的輪廓之後,進一步考量到探針本身的輪廓誤差,以將探針本身誤差補償到待測物量測到的結果上;因此經過補償後的待測物接觸點座標,已是排除探針本身誤差,而更具有更佳的準確度。Therefore, according to the method of the present invention, after measuring the contour of the object to be tested, the microprocessor further considers the contour error of the probe itself to compensate the error of the probe itself to the result measured by the object to be tested; Therefore, the compensated contact point coordinates of the object to be tested have eliminated the error of the probe itself, and have better accuracy.
10...機台10. . . Machine
11...探針11. . . Probe
110...針頭110. . . Needle
111...分隔線111. . . Separation line
112...下半部112. . . Lower half
113...上半部113. . . Upper half
114...分隔線輪廓114. . . Divider outline
115...標準圓115. . . Standard circle
12...探針夾頭12. . . Probe chuck
20...微處理器20. . . microprocessor
30...環規30. . . Ring gauge
31...內表面31. . . The inner surface
32...圓輪廓32. . . Round outline
40...標準球體40. . . Standard sphere
41...分隔線41. . . Separation line
411...上半球面411. . . Upper hemisphere
412...下半球面412. . . Lower hemisphere
50...接觸點50. . . Contact point
圖1:本發明探針量測裝置示意圖。Figure 1: Schematic diagram of the probe measuring device of the present invention.
圖2:本發明方法流程示意圖。Figure 2: Schematic diagram of the process of the present invention.
圖3:本發明探針立體示意圖。Figure 3 is a perspective view of the probe of the present invention.
圖4:本發明探針與環規相對位置示意圖。Figure 4 is a schematic illustration of the relative position of the probe of the present invention and a ring gauge.
圖5:本發明分隔線輪廓與標準圓比對示意圖。Fig. 5 is a schematic view showing the alignment of the dividing line and the standard circle of the present invention.
圖6:本發明接觸點座標與其對應標準圓座標的誤差示意圖。Figure 6 is a schematic diagram showing the error of the contact point coordinates of the present invention and its corresponding standard coordinates.
圖7、8:本發明探針與標準球體相對位置示意圖。Figures 7 and 8 are schematic views showing the relative positions of the probe of the present invention and a standard sphere.
圖9:本發明待測物的接觸點座標示意圖。Fig. 9 is a schematic view showing the coordinates of contact points of the object to be tested of the present invention.
Claims (6)
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| US6944564B2 (en) * | 2002-05-08 | 2005-09-13 | Metris N.V. | Method for the automatic calibration-only, or calibration and qualification simultaneously of a non-contact probe |
| US8311758B2 (en) * | 2006-01-18 | 2012-11-13 | Formfactor, Inc. | Methods and apparatuses for dynamic probe adjustment |
| CN101896790B (en) * | 2007-07-24 | 2013-05-29 | 海克斯康测量技术有限公司 | Method for compensating measurement errors caused by deformations of a measuring machine bed under the load of a workpiece and measuring machine operating according to said method |
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