TW201324888A - The organic light-emitting diode and display comprising the same - Google Patents
The organic light-emitting diode and display comprising the same Download PDFInfo
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本發明係有關於一種有機發光二極體,且特別是有關於一種避免壓降之有機發光二極體與其所組成之有機發光二極體顯示器。The present invention relates to an organic light-emitting diode, and more particularly to an organic light-emitting diode that avoids voltage drop and an organic light-emitting diode display thereof.
有機發光二極體(organic light-emitting diode)由於具有高亮度、輕、薄、不需背光源、低消耗功率等優點,以廣泛地應用於平面顯示器上。The organic light-emitting diode is widely used in flat panel displays because of its high brightness, lightness, thinness, no backlight, low power consumption, and the like.
請參見第1A圖,其顯示習知之有機發光二極體10之俯視圖,其包括顯示區12a與位於顯示區12a外圍的周邊區12b,輔助電極導通孔14係位於周邊區12b,用以與位於顯示區12a的上電極(圖中未顯示)電性連接。電源從周邊區12b的輔助電極導通孔14輸入,之後再傳送到顯示區12a中,然而,由於傳輸距離遠近造成不均勻的電流,進而產生壓降(voltage drop)與亮度不均的問題,且對於大尺寸顯示器而言,壓降問題會更加顯著。Referring to FIG. 1A, a top view of a conventional organic light emitting diode 10 is shown, which includes a display area 12a and a peripheral area 12b located at the periphery of the display area 12a. The auxiliary electrode vias 14 are located in the peripheral area 12b for The upper electrode (not shown) of the display area 12a is electrically connected. The power source is input from the auxiliary electrode via hole 14 of the peripheral region 12b, and then transferred to the display region 12a. However, due to the long distance of the transmission distance, uneven current is generated, thereby causing a problem of voltage drop and uneven brightness. For large displays, the pressure drop problem is even more pronounced.
為了解決壓降與亮度不均的問題,請參見第1B圖之習知之有機發光二極體10之俯視圖,將輔助電極裸露區16設置於顯示區12a內並位於相鄰之畫素電極18之間。然而,為了避免有機層遮蔽輔助電極裸露區16的位置,需要設置精密的金屬遮罩17,此金屬遮罩17製作不易,成本高且對準不易,且製作大尺寸顯示器,大尺寸之金屬遮罩容易會有彎曲(bending)的問題。In order to solve the problem of voltage drop and brightness unevenness, please refer to the top view of the conventional organic light emitting diode 10 of FIG. 1B, and the auxiliary electrode bare region 16 is disposed in the display region 12a and located in the adjacent pixel electrode 18 between. However, in order to prevent the organic layer from shielding the position of the auxiliary electrode bare region 16, it is necessary to provide a precise metal mask 17, which is not easy to manufacture, high in cost and difficult to align, and produces a large-sized display, and a large-sized metal cover. The cover is prone to problems with bending.
因此,業界亟需提出一種有機發光二極體,此結構能解決上述提及之問題。Therefore, there is an urgent need in the industry to propose an organic light-emitting diode which can solve the above-mentioned problems.
本發明提供一種有機發光二極體(OLED),包括:一基板,其中該基板包括一畫素電極區與一輔助電極區;以及一絕緣層,形成於該畫素電極區與該輔助電極區之間;其中該畫素電極區包括;一第一電極,形成於該基板之上;一有機層,形成於該第一電極之上;一第二電極,形成於該有機層之上;其中該輔助電極區包括:一輔助電極,形成於該基板之上;一遮蔽結構,形成於該輔助電極之上或該絕緣層之上,其中該遮蔽結構遮蓋部份的該輔助電極,且該第二電極與該輔助電極電性連接。The present invention provides an organic light emitting diode (OLED), comprising: a substrate, wherein the substrate includes a pixel electrode region and an auxiliary electrode region; and an insulating layer formed on the pixel electrode region and the auxiliary electrode region And wherein the pixel electrode region comprises: a first electrode formed on the substrate; an organic layer formed on the first electrode; and a second electrode formed on the organic layer; wherein The auxiliary electrode region includes: an auxiliary electrode formed on the substrate; a shielding structure formed on the auxiliary electrode or above the insulating layer, wherein the shielding structure covers a portion of the auxiliary electrode, and the The two electrodes are electrically connected to the auxiliary electrode.
本發明另提供一種有機發光二極體(OLED)顯示器,包括:一第一基板與一第二基板係相對設置;以及一本發明所述之有機發光二極體設置於該第一基板與該第二基板之間。The present invention further provides an organic light emitting diode (OLED) display, comprising: a first substrate disposed opposite to a second substrate; and an organic light emitting diode according to the present invention disposed on the first substrate and the Between the second substrates.
為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂,下文特舉出較佳實施例,並配合所附圖式,作詳細說明如下:The above and other objects, features and advantages of the present invention will become more <RTIgt;
第2圖為本發明之頂部發射(top emission)有機發光二極體20之俯視圖,第3A-3D圖為一系列沿第2圖中AA’線段之剖面圖,其顯示本發明頂部發射(top emission)之有機發光二極體之製法。首先,請參見第3A圖,提供一基板101。於被動陣列有機發光二極體顯示器中,基板101材質為一般的玻璃基板,於另一實施例中亦可為塑膠基板。於主動陣列有機發光二極體顯示器中,基板101為一薄膜電晶體(TFT)基板,其基板材質可為玻璃基板,亦可為塑膠基板。2 is a plan view of a top emission organic light emitting diode 20 of the present invention, and FIGS. 3A-3D are a series of cross-sectional views taken along line AA' of FIG. 2, showing the top emission of the present invention (top) Emission) method of producing organic light-emitting diodes. First, please refer to FIG. 3A to provide a substrate 101. In the passive array organic light emitting diode display, the substrate 101 is made of a general glass substrate, and in another embodiment, it may be a plastic substrate. In the active array organic light emitting diode display, the substrate 101 is a thin film transistor (TFT) substrate, and the substrate material may be a glass substrate or a plastic substrate.
接著,於基板101之上先形成平坦層102,之後於平坦層102之上形成導電層,再經由圖案化製程,形成第一電極104與輔助電極134。於主動陣列有機發光二極體顯示器中,第一電極104電性連接至薄膜電晶體(TFT)(圖中未顯示),其薄膜電晶體TFT係用以控制各個畫素。Next, a planarization layer 102 is formed on the substrate 101, and then a conductive layer is formed on the planarization layer 102, and then the first electrode 104 and the auxiliary electrode 134 are formed through a patterning process. In the active array organic light emitting diode display, the first electrode 104 is electrically connected to a thin film transistor (TFT) (not shown), and the thin film transistor TFT is used to control each pixel.
之後,塗佈並圖案化光阻層於第一電極104與輔助電極134之上,圖案化後的光阻層形成一絕緣層120,此絕緣層120用以定義出畫素電極區102a與輔助電極區,其中未被絕緣層120覆蓋的區域定義為輔助電極裸露區102b。於本發明之實施例中,光阻層由正型光阻(positive photoresist)所組成,因此,經過圖案化步驟後,會得到類梯形形狀之絕緣層120,意即絕緣層120具有一上表面與一下表面,且自剖面圖來看,上表面之長度短於下表面之長度。Then, the photoresist layer is coated and patterned on the first electrode 104 and the auxiliary electrode 134, and the patterned photoresist layer forms an insulating layer 120 for defining the pixel electrode region 102a and the auxiliary layer. The electrode region, in which the region not covered by the insulating layer 120 is defined as the auxiliary electrode bare region 102b. In the embodiment of the present invention, the photoresist layer is composed of a positive photoresist. Therefore, after the patterning step, the trapezoidal-shaped insulating layer 120 is obtained, that is, the insulating layer 120 has an upper surface. With the lower surface, and from the cross-sectional view, the length of the upper surface is shorter than the length of the lower surface.
須注意的是,於畫素電極區102a中,第一電極104形成於基板101之上;於輔助電極裸露區102b中,輔助電極134形成於基板101之上。第一電極104可為單層或多層之結構,其可包括金屬層、透明導電層或上述之組合。而輔助電極134可為單層或多層之結構,同樣可包括金屬層、透明導電層或上述之組合。第一電極104與輔助電極134可藉由相同步驟或不同步驟形成,另言之,兩者係由相同或不同材料所組成。It should be noted that in the pixel electrode region 102a, the first electrode 104 is formed on the substrate 101; in the auxiliary electrode bare region 102b, the auxiliary electrode 134 is formed on the substrate 101. The first electrode 104 may be a single layer or a multilayer structure, which may include a metal layer, a transparent conductive layer, or a combination thereof. The auxiliary electrode 134 may be a single layer or a plurality of layers, and may also include a metal layer, a transparent conductive layer, or a combination thereof. The first electrode 104 and the auxiliary electrode 134 may be formed by the same step or different steps, in other words, the two are composed of the same or different materials.
於本發明之實施例中,第一電極104包括第一層104a、第二層104b與第三層104c,其中第一層104a與第三層104c由透明導電層所組成,而第二層104b由金屬層所組成。同樣的,輔助電極134包括第一層134a、第二層134b與第三層134c,其中第一層134a與第三層134c由透明導電層所組成,而第二層134b由金屬層所組成。In an embodiment of the invention, the first electrode 104 includes a first layer 104a, a second layer 104b and a third layer 104c, wherein the first layer 104a and the third layer 104c are composed of a transparent conductive layer, and the second layer 104b It consists of a metal layer. Similarly, the auxiliary electrode 134 includes a first layer 134a, a second layer 134b, and a third layer 134c, wherein the first layer 134a and the third layer 134c are composed of a transparent conductive layer, and the second layer 134b is composed of a metal layer.
上述之金屬層包括鋁(Al)、鈣(Ca)、銀(Ag)、鎳(Ni)、鉻(Cr)、鈦(Ti)、鎂(Mg)、鎢(W)、鉬(Mo)或上述之合金。上述之透明導電層包括包括氧化銦錫(indium tin oxide,ITO)、氧化銦鋅(indium zinc oxide,IZO)、氧化鎘錫(cadmium tin oxide,CTO)、氧化鋁鋅(aluminum zinc oxide,AZO)、氧化銦錫鋅(indium tin zinc oxide,ITZO)、氧化鋅(zinc oxide)、氧化鎘(cadmium oxide,CdO)、氧化鉿(hafnium oxide,HfO)、氧化銦鎵鋅(indium gallium zinc oxide,InGaZnO)、氧化銦鎵鋅鎂(indium gallium zinc magnesium oxide,InGaZnMgO)、氧化銦鎵鎂(indium gallium magnesium oxide,InGaMgO)或氧化銦鎵鋁(indium gallium aluminum oxide,InGaAlO)。The above metal layer includes aluminum (Al), calcium (Ca), silver (Ag), nickel (Ni), chromium (Cr), titanium (Ti), magnesium (Mg), tungsten (W), molybdenum (Mo) or The above alloy. The transparent conductive layer includes indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), and aluminum zinc oxide (AZO). , indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide (CdO), hafnium oxide (HfO), indium gallium zinc oxide (InGaZnO) ), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO).
之後,請參見第3B圖,形成遮蔽結構136於輔助電極134之上,遮蔽結構136具有上表面136a與下表面136b,且上表面136a之長度W1大於下表面136b之長度W2,亦即,遮蔽結構136具有類倒梯形形狀。此外,遮蔽結構136與輔助電極134之間具有一夾角α小於90度。Thereafter, referring to FIG. 3B, a shielding structure 136 is formed on the auxiliary electrode 134. The shielding structure 136 has an upper surface 136a and a lower surface 136b, and the length W 1 of the upper surface 136a is greater than the length W 2 of the lower surface 136b, that is, The shielding structure 136 has an inverted trapezoidal shape. In addition, the shielding structure 136 and the auxiliary electrode 134 have an angle α of less than 90 degrees.
之後,請參見第3C圖,形成有機層106於第一電極104之上,其中有機層106從畫素電極區102a經過絕緣層120延伸至輔助電極裸露區102b。形成有機層106之方式例如蒸鍍法。有機層106可能由下述部分或全部材料層所組成:電洞注入層(hole injection layer,HIL)、電洞傳輸層(hole transporting layer,HTL)、發光層(light emitting layer)、電子傳輸層(electron transporting layer)與電子注入層(electron injection layer)。Thereafter, referring to FIG. 3C, an organic layer 106 is formed over the first electrode 104, wherein the organic layer 106 extends from the pixel electrode region 102a through the insulating layer 120 to the auxiliary electrode bare region 102b. The manner in which the organic layer 106 is formed is, for example, an evaporation method. The organic layer 106 may be composed of a part or all of the following material layers: a hole injection layer (HIL), a hole transporting layer (HTL), a light emitting layer, and an electron transport layer. (electron transporting layer) and electron injection layer.
接著,形成第二電極108之第一層108a於有機層106之上,其中第二電極108之第一層108a從畫素電極區102a經過絕緣層120延伸至輔助電極裸露區102b。之後,請參見第3D圖,形成第二電極108之第二層108b於第一層108a之上,於此,完成本發明之有機發光二極體300之結構。Next, a first layer 108a of the second electrode 108 is formed over the organic layer 106, wherein the first layer 108a of the second electrode 108 extends from the pixel electrode region 102a through the insulating layer 120 to the auxiliary electrode bare region 102b. Thereafter, referring to FIG. 3D, a second layer 108b of the second electrode 108 is formed over the first layer 108a. Here, the structure of the organic light emitting diode 300 of the present invention is completed.
於本發明之實施例中,第二電極108之第一層108a由金屬層所組成,可藉由蒸鍍法形成;第二層108b由透明導電層所組成,可藉由濺鍍法(sputter)形成。In the embodiment of the present invention, the first layer 108a of the second electrode 108 is composed of a metal layer, which can be formed by evaporation; the second layer 108b is composed of a transparent conductive layer, which can be sputtered (sputter) )form.
須注意的是,由於有機層106與第二電極108之第一層108a由蒸鍍法形成,而進行蒸鍍時,腔體壓力為約10-3-10-5 Pa,腔體中氣體之平均自由徑(Mean free path)為約600-7000 cm,而基板101與蒸鍍源之距離為約10-20 cm,遠短於自由徑長度,因此在碰到蒸鍍標的前,蒸鍍粒子碰撞的機率非常小,蒸鍍粒子幾乎是直線前進,所以當短於平均自由徑前即遇到遮蔽物時,此時仍直線前進之蒸鍍粒子就會受到阻擋而不易形成於遮蔽物下方。故當蒸鍍有機層106與第二電極108之第一層108a時,因平均自由徑原理(於本實施例圖示中,指接近平行於Z軸方向移動。於其他實施例中,可能因蒸鍍源擺放之位置不同而沿不同座標軸或其他方向移動。),會受到遮蔽結構136上表面遮蔽,而不易形成於遮蔽結構136垂直正下方(於本實施例中係指平行Z軸方向)的位置上,另言之,由於遮蔽結構106之類倒梯形形狀,使得有機層106與第二電極108之第一層108a並未完全覆蓋輔助電極134。It should be noted that, since the organic layer 106 and the first layer 108a of the second electrode 108 are formed by an evaporation method, when the vapor deposition is performed, the chamber pressure is about 10 -3 -10 -5 Pa, and the gas in the cavity The Mean free path is about 600-7000 cm, and the distance between the substrate 101 and the evaporation source is about 10-20 cm, which is much shorter than the free diameter length. Therefore, the vapor deposition particles are exposed before the vapor deposition target is encountered. The probability of collision is very small, and the vapor deposition particles are almost straight forward, so when the shield is encountered before the average free diameter, the vapor deposition particles that are still moving straight forward are blocked and are not easily formed under the shield. Therefore, when the organic layer 106 and the first layer 108a of the second electrode 108 are vapor-deposited, due to the principle of the average free path (in the illustration of the embodiment, the finger moves nearly parallel to the Z-axis direction. In other embodiments, The position of the evaporation source is different and moves along different coordinate axes or other directions.), it is shielded by the upper surface of the shielding structure 136, and is not easily formed vertically below the shielding structure 136 (in this embodiment, it refers to the parallel Z-axis direction). In addition, the first layer 108a of the organic layer 106 and the second electrode 108 does not completely cover the auxiliary electrode 134 due to the inverted trapezoidal shape such as the shielding structure 106.
之後,形成第二電極108之第二層108b時,由於進行濺鍍時,腔體壓力為約0.1-1 Pa,腔體中氣體之平均自由徑為約0.5-7 cm,而基板101與濺鍍源之距離為約10-20 cm,遠長於自由徑長度,因此,濺鍍粒子於到達濺鍍標的前就已經因相互碰撞而改變行進方向,因此濺鍍粒子就可以繞過遮蔽物而仍可於遮蔽物之下方形成,故當進行濺鍍第二電極108之第二層108b時,第二層108b即可繞過遮蔽結構106而仍形成於其下方的輔助電極134之上並與輔助電極134電性連接。Thereafter, when the second layer 108b of the second electrode 108 is formed, since the cavity pressure is about 0.1-1 Pa when sputtering is performed, the average free path of the gas in the cavity is about 0.5-7 cm, and the substrate 101 is splashed. The distance from the plating source is about 10-20 cm, which is much longer than the free path length. Therefore, the sputtered particles have changed direction of travel due to collision with each other before reaching the sputtering target, so the sputter particles can bypass the shield while still Can be formed under the mask, so when the second layer 108b of the second electrode 108 is sputtered, the second layer 108b can bypass the shielding structure 106 and still form on the auxiliary electrode 134 below it and assist The electrode 134 is electrically connected.
請參考第4A圖,圖上省略了除基板101以外的其他遮蔽結構或電極層結構,僅繪示作為調整角度基準之基板101。於另一實施例中,亦可於濺鍍第二電極108之第二層108b時,調整第二層108b之濺鍍源450與基板101之間的濺鍍角θ1,使第二電極108之第二層108b可容易形成於遮蔽結構106下方,並使第二電極108與輔助電極134電性連接,其中,θ1為銳角(0<θ1<90)。Referring to FIG. 4A, the shielding structure or the electrode layer structure other than the substrate 101 is omitted, and only the substrate 101 as the reference for adjusting the angle is shown. In another embodiment, the sputtering angle θ 1 between the sputtering source 450 of the second layer 108b and the substrate 101 may be adjusted when the second layer 108b of the second electrode 108 is sputtered, so that the second electrode 108 is The second layer 108b can be easily formed under the shielding structure 106 and electrically connect the second electrode 108 to the auxiliary electrode 134, wherein θ 1 is an acute angle (0 < θ 1 < 90).
須注意的是,於另一實施例中,亦可藉由濺鍍法形成單層之第二電極,由於有機層並未完全覆蓋輔助電極,因此,單層之第二電極可形成於部份的輔助電極之上並與輔助電極電性連接。It should be noted that in another embodiment, the second electrode of the single layer may also be formed by sputtering. Since the organic layer does not completely cover the auxiliary electrode, the second electrode of the single layer may be formed in the portion. Above the auxiliary electrode and electrically connected to the auxiliary electrode.
此外,於另一實施例中,請參考第4B圖,在蒸鍍第二電極的第一層108a時,可藉由調整第一層108a之蒸鍍源452與基板101之間的蒸鍍角θ2(θ2<θ1),使第二電極108之第一層108a也易於沈積於輔助電極134之上,並使第二電極108與輔助電極134達成電性連接。其中,θ1與θ2的角度範圍為銳角(0<θ1<90,0<θ2<90且θ2<θ1)。In addition, in another embodiment, referring to FIG. 4B, when the first layer 108a of the second electrode is vapor-deposited, the evaporation angle between the evaporation source 452 of the first layer 108a and the substrate 101 can be adjusted. θ 2 (θ 2 <θ 1 ), so that the first layer 108a of the second electrode 108 is also easily deposited on the auxiliary electrode 134, and the second electrode 108 is electrically connected to the auxiliary electrode 134. Wherein, the angular range of θ 1 and θ 2 is an acute angle (0 < θ 1 < 90, 0 < θ 2 < 90 and θ 2 < θ 1 ).
因此,可藉由調整濺鍍源450或蒸鍍源452之角度,使第二電極的第一層108a與第二層108b與輔助電極134電性連接機會加大,可大大提高降低壓降之效果。Therefore, by adjusting the angle of the sputtering source 450 or the evaporation source 452, the electrical connection between the first layer 108a of the second electrode and the second layer 108b and the auxiliary electrode 134 is increased, and the voltage drop can be greatly improved. effect.
本發明第3A-3D圖之實施例為頂部發射(top emission)之有機發光二極體,此實施例藉由遮蔽結構136之類倒梯形形狀的設計,使有機層106與第二電極108之第一層108a並未完全覆蓋輔助電極,因而可藉由第二電極之第二層108b電性連接至輔助電極134,以達到降低第二電極108壓降(voltage drop)之效果。The embodiment of the 3A-3D of the present invention is a top emission organic light emitting diode. In this embodiment, the organic layer 106 and the second electrode 108 are formed by an inverted trapezoidal shape such as the shielding structure 136. The first layer 108a does not completely cover the auxiliary electrode, and thus can be electrically connected to the auxiliary electrode 134 through the second layer 108b of the second electrode to achieve the effect of reducing the voltage drop of the second electrode 108.
然而,本發明之有機發光二極體並不限於應用在頂部發射(top emission),亦可應用於底部發射之有機發光二極體。於底部發射之有機發光二極體,可形成較厚之第二電極於有機層之上,且同樣可藉由遮蔽結構之特殊形狀之設計,使第二電極形成於部份的輔助電極之上並與輔助電極電性連接,以達到降低第二電極壓降(voltage drop)之效果。不論有機發光二極體為頂部或底部發射式,第一電極與第二電極至少之一為透明電極,另一為透明或不透明電極,以幫助光線發出。However, the organic light-emitting diode of the present invention is not limited to application to top emission, and can also be applied to a bottom-emitting organic light-emitting diode. The organic light emitting diode emitted at the bottom can form a thick second electrode on the organic layer, and the second electrode can be formed on the auxiliary electrode by the special shape of the shielding structure. And electrically connected with the auxiliary electrode to achieve the effect of reducing the voltage drop of the second electrode. Regardless of whether the organic light emitting diode is of a top or bottom emission type, at least one of the first electrode and the second electrode is a transparent electrode, and the other is a transparent or opaque electrode to assist light emission.
須注意的是,於本發明第一實施例中,遮蔽結構136之高度低於絕緣層120。於第二實施例中,請參見第5圖,其中遮蔽結構136之高度高於絕緣層120。因此,不論遮蔽結構136之高度高於、等於或是低於絕緣層120,只要遮蔽結構136之上表面長度大於下表面長度,且遮蔽結構136遮蓋部份的輔助電極134,以避免有機層106完全覆蓋輔助電極134,並於後續形成第二電極108時,使第二電極108可與輔助電極134電性連接以減低壓降,即可達成本發明之目的而屬本發明之範圍。It should be noted that in the first embodiment of the present invention, the shielding structure 136 has a lower height than the insulating layer 120. In the second embodiment, please refer to FIG. 5, in which the shielding structure 136 has a higher height than the insulating layer 120. Therefore, regardless of whether the height of the shielding structure 136 is higher than, equal to, or lower than the insulating layer 120, as long as the upper surface length of the shielding structure 136 is greater than the lower surface length, and the shielding structure 136 covers a portion of the auxiliary electrode 134 to avoid the organic layer 106. It is within the scope of the present invention to completely cover the auxiliary electrode 134 and to electrically connect the second electrode 108 to the auxiliary electrode 134 to reduce the low pressure drop when the second electrode 108 is subsequently formed.
請參見第6圖,其顯示本發明遮蔽結構之第三實施例,圖中標號與第3D圖相同者代表相同元件,其中遮蔽結構138包括第一層類梯形結構138a與第二層類倒梯形結構138b,兩層構成類雙梯形形狀,其同樣可避免後續有機層(圖中未顯示,可參考第3D圖)完全遮蓋輔助電極134,以使後續第二電極(圖中未顯示,可參考第3D圖)電性連接至輔助電極134,以達到降低第二電極(圖中未顯示,可參考第3D圖)壓降(voltage drop)之效果。Referring to Fig. 6, there is shown a third embodiment of the shielding structure of the present invention, wherein the same reference numerals as in Fig. 3D represent the same elements, wherein the shielding structure 138 includes a first layer type trapezoidal structure 138a and a second layer type inverted trapezoid Structure 138b, the two layers form a double trapezoidal shape, which can also avoid the subsequent organic layer (not shown in the figure, refer to FIG. 3D) completely cover the auxiliary electrode 134, so that the subsequent second electrode (not shown in the figure, can be referred to FIG. 3D is electrically connected to the auxiliary electrode 134 to achieve the effect of reducing the voltage drop of the second electrode (not shown in the drawing, refer to FIG. 3D).
請參見第7圖,其顯示本發明遮蔽結構之第四實施例,圖中標號與第6圖相同者代表相同元件,其中遮蔽結構138之高度高於絕緣層120。Referring to Fig. 7, there is shown a fourth embodiment of the shielding structure of the present invention, wherein the same reference numerals as in Fig. 6 represent the same elements, wherein the shielding structure 138 has a higher height than the insulating layer 120.
請參見第8A-8B圖,其顯示本發明遮蔽結構之第五實施例,其中第8A圖為俯視圖,而第8B圖為沿著第8A圖BB’線所得之剖面圖,圖中標號與第3D圖相同者代表相同元件。於第五實施例中,遮蔽結構140係形成於絕緣層120之上,且遮蔽結構140同樣具有類倒梯形形狀,因此,可避免後續有機層(圖中未顯示,可參考第3D圖)完全覆蓋輔助電極134,以使後續第二電極(圖中未顯示,可參考第3D圖)電性連接至輔助電極134,以達到降低第二電極(圖中未顯示,可參考第3D圖)壓降(voltage drop)之效果。Please refer to FIG. 8A-8B, which shows a fifth embodiment of the shielding structure of the present invention, wherein FIG. 8A is a top view, and FIG. 8B is a cross-sectional view taken along line BB' of FIG. 8A. The same figures in the 3D diagram represent the same components. In the fifth embodiment, the shielding structure 140 is formed on the insulating layer 120, and the shielding structure 140 also has an inverted trapezoidal shape, so that the subsequent organic layer (not shown in the drawing, refer to FIG. 3D) can be avoided completely. The auxiliary electrode 134 is covered so that the subsequent second electrode (not shown in the drawing, refer to FIG. 3D) is electrically connected to the auxiliary electrode 134 to reduce the pressure of the second electrode (not shown in the drawing, refer to FIG. 3D). The effect of a voltage drop.
請參見第9A-9F圖,其顯示本發明之有機發光二極體之輔助電極裸露區具有不同圖案之實施例之俯視圖,其包括主動區612a與位於主動區612a外圍的周邊區612b。Referring to Figures 9A-9F, there is shown a top view of an embodiment of the organic light emitting diode of the present invention having different patterns of auxiliary electrode exposed regions including an active region 612a and a peripheral region 612b located at the periphery of the active region 612a.
請配合參見第10A-10C圖,該些圖顯示本發明之輔助電極134之線路配置俯視圖。須注意的是,於第10A-10C圖中,輔助電極134位於顯示區12a,且輔助電極134會電性連接到周邊區12b的輔助電極導通孔(圖上未示,類似於第1A圖之輔助電極導通孔14),以與外部驅動電路或電源電性連接(圖上未顯示)。Please refer to FIG. 10A-10C for a plan view showing the line configuration of the auxiliary electrode 134 of the present invention. It should be noted that in the 10A-10C diagram, the auxiliary electrode 134 is located in the display area 12a, and the auxiliary electrode 134 is electrically connected to the auxiliary electrode via hole of the peripheral area 12b (not shown, similar to FIG. 1A). The auxiliary electrode via hole 14) is electrically connected to an external driving circuit or a power source (not shown).
於第10A圖中,輔助電極134沿著每一或是間隔數行列(column and row)而排列的一網狀結構的輔助電極線路圖。圖上僅例示繪出輔助電極裸露區102b為圓弧狀之實施例,且並非需於每個輔助電極134線路交叉處均設置輔助電極裸露區102b。於其他實施例中,輔助電極裸露區102b可以為塊狀、圓弧狀或是長條狀。In Fig. 10A, the auxiliary electrode 134 is arranged along each of the auxiliary electrode circuit patterns of a mesh structure arranged in a column and row. Only the embodiment in which the auxiliary electrode bare region 102b is arcuate is illustrated in the drawing, and it is not necessary to provide the auxiliary electrode bare region 102b at the intersection of each auxiliary electrode 134. In other embodiments, the auxiliary electrode bare region 102b may be in the form of a block, an arc, or an elongated strip.
於第10B圖中,輔助電極134沿著每一或是間隔數行(column)而排列的輔助電極線路圖。圖上僅例示繪出輔助電極裸露區102b為圓弧狀之實施例。於其他實施例中,輔助電極裸露區102b可以為塊狀、圓弧狀或是長條狀。In Fig. 10B, the auxiliary electrode 134 is arranged along each of the auxiliary electrode circuit patterns arranged at intervals of a plurality of columns. Only the embodiment in which the auxiliary electrode bare region 102b is arcuate is illustrated in the drawing. In other embodiments, the auxiliary electrode bare region 102b may be in the form of a block, an arc, or an elongated strip.
於第10C圖中,輔助電極134沿著每一或是間隔數列(row)而排列的輔助電極線路圖。圖上僅例示繪出輔助電極裸露區102b為圓弧狀之實施例。於其他實施例中,輔助電極裸露區102b可以為塊狀、圓弧狀或是長條狀。In Fig. 10C, the auxiliary electrode 134 is arranged along each of the auxiliary electrode circuit patterns arranged in a plurality of rows. Only the embodiment in which the auxiliary electrode bare region 102b is arcuate is illustrated in the drawing. In other embodiments, the auxiliary electrode bare region 102b may be in the form of a block, an arc, or an elongated strip.
於第9A圖中,輔助電極裸露區102b係為圓弧形狀,且其並未形成於每個畫素電極區102a,可間隔一個或數個畫素電極區才設置一個輔助電極裸露區102b。In Fig. 9A, the auxiliary electrode bare region 102b has a circular arc shape, and it is not formed in each of the pixel electrode regions 102a, and one auxiliary electrode bare region 102b is disposed apart from one or several pixel electrode regions.
於另一實施例中,輔助電極裸露區102b可形成於每個畫素電極區102a旁。而輔助電極裸露區102b下方之輔助電極則可依配置選擇不同的輔助電極線路圖案。In another embodiment, the auxiliary electrode bare region 102b may be formed beside each of the pixel electrode regions 102a. The auxiliary electrode under the auxiliary electrode bare region 102b can select different auxiliary electrode line patterns according to the configuration.
於一實施例中,當輔助電極裸露區係形成於每個畫素電極區旁時,則可選擇第10A圖之網狀圖案的輔助電極線路圖案,亦可選擇第10B圖或第10C圖之輔助電極圖案。In an embodiment, when the auxiliary electrode bare region is formed beside each pixel electrode region, the auxiliary electrode line pattern of the mesh pattern of FIG. 10A may be selected, and the 10B or 10C chart may also be selected. Auxiliary electrode pattern.
於另一實施例中,當輔助電極裸露區係間隔一個或數個畫素電極區才設置一個輔助電極裸露區102b時,可選擇第10A圖的網狀圖案,亦可選擇第10B圖或第10C圖的輔助電極線路圖案。In another embodiment, when an auxiliary electrode bare region 102b is disposed when the auxiliary electrode bare region is separated by one or several pixel electrode regions, the mesh pattern of FIG. 10A may be selected, and the 10th or the The auxiliary electrode line pattern of the 10C diagram.
由此可知,輔助電極圖案的間隔可搭配輔助電極裸露區的規劃而設置,因此,輔助電極圖案並不一定需要於每個畫素間均設置輔助電極線路,亦可間隔一至數個畫素才設置走線,端視設計的需要而可任意選擇任一輔助電極裸露區搭配任一輔助電極線路圖。Therefore, the spacing of the auxiliary electrode patterns can be set along with the planning of the exposed area of the auxiliary electrode. Therefore, the auxiliary electrode pattern does not necessarily need to be provided with an auxiliary electrode line between each pixel, and one or several pixels can be spaced apart. Set the traces and select any auxiliary electrode exposed area with any auxiliary electrode circuit diagram as needed for the design.
於第9B圖中,輔助電極裸露區102b係為長條溝槽結構且位於每一排(row)畫素電極區102a旁,而遮蔽結構136亦具有長條結構。In FIG. 9B, the auxiliary electrode bare region 102b is a long trench structure and is located beside each row of pixel electrode regions 102a, and the shielding structure 136 also has a strip structure.
於第9C圖中,每隔N排(row)畫素電極區102a之間具有一長條溝槽之輔助電極裸露區102b,其中N大於或等於1。In Fig. 9C, an auxiliary electrode bare region 102b having a long trench between every N rows of pixel regions 102a, where N is greater than or equal to 1.
於第9D圖中,每隔N排(row)畫素電極區102a之間具有一長條溝槽之輔助電極裸露區102b,其中N大於或等於1,且遮蔽結構136為不連續的塊狀結構或圓弧狀結構,圖上僅繪示塊狀結構示意圖。In FIG. 9D, the auxiliary electrode bare region 102b having a long trench between every N rows of pixel regions 102a, wherein N is greater than or equal to 1, and the shielding structure 136 is a discontinuous block. Structure or arc-shaped structure, only the block structure diagram is shown on the figure.
於第9E圖中,輔助電極裸露區102b係為長條溝槽結構且位於每一排(row)畫素電極區102a旁,而遮蔽結構136為不連續的塊狀結構或圓弧狀結構,圖上僅繪示塊狀結構示意圖。In FIG. 9E, the auxiliary electrode bare region 102b is a long trench structure and is located beside each row of pixel electrode regions 102a, and the shielding structure 136 is a discontinuous block structure or an arc-shaped structure. Only a block structure diagram is shown on the figure.
於第9F圖中,輔助電極裸露區102b係為長條溝槽結構且位於每一行(column)畫素電極區102a旁,而遮蔽結構136亦具有長條結構。於另一實施例中,輔助電極裸露區102b可間隔一行或數行的畫素電極區102a旁設置遮蔽結構136,其遮蔽結構136亦具有長條結構。圖上僅繪出其中一種實施例,亦可參考第9A圖至第9E圖的排(row)形式而對行(column)作相對應之調整。In FIG. 9F, the auxiliary electrode bare region 102b is a long trench structure and is located beside each column pixel electrode region 102a, and the shielding structure 136 also has a strip structure. In another embodiment, the auxiliary electrode bare region 102b may be provided with a shielding structure 136 adjacent to the pixel electrode region 102a of one row or several rows, and the shielding structure 136 also has a strip structure. Only one of the embodiments is shown in the figure, and the row can also be adjusted correspondingly with reference to the row form of FIGS. 9A to 9E.
由上述討論得知,第9A圖至第9D圖均可任意選擇第10A圖或第10C圖的輔助電極線路圖案。而第9F圖或其他對行(column)作調整的實施例中,亦可任意選擇搭配第10A圖或第10B圖之輔助電極線路圖案。As apparent from the above discussion, the auxiliary electrode line patterns of the 10A or 10C drawings can be arbitrarily selected from the 9A to 9D. In the embodiment of the ninth Ff or other adjustment of the column, the auxiliary electrode line pattern of the 10A or 10B can be arbitrarily selected.
藉由本發明遮蔽結構之特述形狀與位置(形成於輔助電極之上或絕緣層之上),使得有機層並未完全覆蓋輔助電極,而使得第二電極電性連接至輔助電極,以達到降低第二電極壓降(voltage drop)之效果,進而可提升發光二極體亮度之均勻性。By the specific shape and position (formed on or above the auxiliary layer) of the shielding structure of the present invention, the organic layer does not completely cover the auxiliary electrode, and the second electrode is electrically connected to the auxiliary electrode to reduce The effect of the second electrode voltage drop, which in turn improves the uniformity of the brightness of the light-emitting diode.
此外,本發明另提供一種有機發光二極體顯示器,請參見第11圖,第一基板710與第二基板720係相對設置;以及本發明之有機發光二極體(如第3D圖之標號300)設置於第一基板710與第二基板720之間,其中第一基板710與第二基板720其一為薄膜電晶體基板,另一為彩色濾光片基板、觸控面板(touch panel)或封裝基板。In addition, the present invention further provides an organic light emitting diode display. Referring to FIG. 11, the first substrate 710 and the second substrate 720 are oppositely disposed; and the organic light emitting diode of the present invention (for example, the numeral 300 of FIG. 3D) Between the first substrate 710 and the second substrate 720, wherein the first substrate 710 and the second substrate 720 are a thin film transistor substrate, and the other is a color filter substrate, a touch panel or Package substrate.
雖然本發明已以數個較佳實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作任意之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.
10、20...有機發光二極體10, 20. . . Organic light-emitting diode
12a...顯示區12a. . . Display area
12b...周邊區12b. . . Surrounding area
14...輔助電極導通孔14. . . Auxiliary electrode via
16...輔助電極裸露區16. . . Auxiliary electrode bare zone
17...金屬遮罩17. . . Metal mask
18...畫素電極18. . . Pixel electrode
101...基板101. . . Substrate
102...平坦層102. . . Flat layer
102a...畫素電極區102a. . . Pixel electrode area
102b...輔助電極裸露區102b. . . Auxiliary electrode bare zone
104...第一電極104. . . First electrode
104a...第一電極之第一層104a. . . First layer of the first electrode
104b...第一電極之第二層104b. . . Second layer of the first electrode
104c...第一電極之第三層104c. . . The third layer of the first electrode
106...有機層106. . . Organic layer
108...第二電極108. . . Second electrode
108a...第二電極之第一層108a. . . First layer of the second electrode
108b...第二電極之第二層108b. . . Second layer of the second electrode
120...絕緣層120. . . Insulation
134...輔助電極134. . . Auxiliary electrode
134a...輔助電極之第一層134a. . . First layer of auxiliary electrode
134b...輔助電極之第二層134b. . . Second layer of auxiliary electrode
134c...輔助電極之第三層134c. . . Third layer of auxiliary electrode
136...遮蔽結構136. . . Shading structure
136a...遮蔽結構之上表面136a. . . Shielding surface
136b...遮蔽結構之下表面136b. . . Under the shield structure
138...遮蔽結構138. . . Shading structure
138a...第一層類梯形結構138a. . . First layer ladder structure
138b...第二層類倒梯形結構138b. . . Second layer inverted ladder structure
140...遮蔽結構140. . . Shading structure
W1...遮蔽結構之上表面之長度W 1 . . . The length of the surface above the shielding structure
W2...遮蔽結構之下表面之長度W 2 . . . The length of the surface below the shielding structure
300...有機發光二極體300. . . Organic light-emitting diode
450...濺鍍源450. . . Sputter source
452...蒸鍍源452. . . Evaporation source
612a...主動區612a. . . Active zone
612b...周邊區612b. . . Surrounding area
710...第一基板710. . . First substrate
720...第二基板720. . . Second substrate
第1A-1B圖為一系列俯視圖,用以說明習知之有機發光二極體之結構。1A-1B is a series of top views for illustrating the structure of a conventional organic light emitting diode.
第2圖為一俯視圖,用以說明本發明之有機發光二極體之結構。Fig. 2 is a plan view showing the structure of the organic light emitting diode of the present invention.
第3A-3D圖為一系列剖面圖,用以說明本發明有機發光二極體之製法。3A-3D are a series of cross-sectional views for explaining the method of fabricating the organic light-emitting diode of the present invention.
第4A-4B圖為一系列剖面圖,用以說明本發明蒸鍍源(或濺鍍源)與基板之間的夾角。4A-4B is a series of cross-sectional views for illustrating the angle between the evaporation source (or sputtering source) of the present invention and the substrate.
第5圖為一剖面圖,用以說明本發明遮蔽結構之第二實施例。Figure 5 is a cross-sectional view showing a second embodiment of the shield structure of the present invention.
第6圖為一剖面圖,用以說明本發明遮蔽結構之第三實施例。Figure 6 is a cross-sectional view for explaining a third embodiment of the shielding structure of the present invention.
第7圖為一剖面圖,用以說明本發明遮蔽結構之第四實施例。Figure 7 is a cross-sectional view showing a fourth embodiment of the shielding structure of the present invention.
第8A圖為一俯視圖,用以說明本發明遮蔽結構之第五實施例。Fig. 8A is a plan view showing a fifth embodiment of the shielding structure of the present invention.
第8B圖為一剖面圖,用以說明本發明遮蔽結構之第五實施例。Figure 8B is a cross-sectional view for explaining a fifth embodiment of the shielding structure of the present invention.
第9A-9F圖為一系列俯視圖,用以說明本發明之有機發光二極體。Figures 9A-9F are a series of top views for illustrating the organic light emitting diode of the present invention.
第10A-10C圖為一系列俯視圖,用以說明本發明之輔助電極之線路配置。10A-10C are a series of top views for illustrating the line configuration of the auxiliary electrode of the present invention.
第11圖為一剖面圖,用以說明本發明之有機發光二極體顯示器。Figure 11 is a cross-sectional view for explaining the organic light emitting diode display of the present invention.
101...基板101. . . Substrate
102...平坦層102. . . Flat layer
102a...畫素電極區102a. . . Pixel electrode area
102b...輔助電極裸露區102b. . . Auxiliary electrode bare zone
104...第一電極104. . . First electrode
104a...第一電極之第一層104a. . . First layer of the first electrode
104b...第一電極之第二層104b. . . Second layer of the first electrode
104c...第一電極之第三層104c. . . The third layer of the first electrode
106...有機層106. . . Organic layer
108...第二電極108. . . Second electrode
108a...第二電極之第一層108a. . . First layer of the second electrode
108b...第二電極之第二層108b. . . Second layer of the second electrode
120...絕緣層120. . . Insulation
134...輔助電極134. . . Auxiliary electrode
134a...輔助電極之第一層134a. . . First layer of auxiliary electrode
134b...輔助電極之第二層134b. . . Second layer of auxiliary electrode
134c...輔助電極之第三層134c. . . Third layer of auxiliary electrode
136...遮蔽結構136. . . Shading structure
300...有機發光二極體300. . . Organic light-emitting diode
Claims (19)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100144120A TW201324888A (en) | 2011-12-01 | 2011-12-01 | The organic light-emitting diode and display comprising the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100144120A TW201324888A (en) | 2011-12-01 | 2011-12-01 | The organic light-emitting diode and display comprising the same |
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| Publication Number | Publication Date |
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| TW201324888A true TW201324888A (en) | 2013-06-16 |
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| TW100144120A TW201324888A (en) | 2011-12-01 | 2011-12-01 | The organic light-emitting diode and display comprising the same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9680123B2 (en) | 2014-12-11 | 2017-06-13 | Industrial Technology Research Institute | Light emitting device, electrode structure and manufacturing method thereof |
| TWI659530B (en) * | 2018-03-23 | 2019-05-11 | 友達光電股份有限公司 | Transparent organic light-emitting diode panel |
| US10396256B2 (en) | 2017-08-18 | 2019-08-27 | Industrial Technology Research Institute | Electronic device package |
| US10468469B2 (en) | 2017-08-18 | 2019-11-05 | Industrial Technology Research Institute | Transparent display device with wall structure |
| US10644259B2 (en) | 2017-08-18 | 2020-05-05 | Industrial Technology Research Institute | Package of electronic device and display panel |
| US20240349554A1 (en) * | 2020-08-31 | 2024-10-17 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel and display device |
-
2011
- 2011-12-01 TW TW100144120A patent/TW201324888A/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9680123B2 (en) | 2014-12-11 | 2017-06-13 | Industrial Technology Research Institute | Light emitting device, electrode structure and manufacturing method thereof |
| US10396256B2 (en) | 2017-08-18 | 2019-08-27 | Industrial Technology Research Institute | Electronic device package |
| US10468469B2 (en) | 2017-08-18 | 2019-11-05 | Industrial Technology Research Institute | Transparent display device with wall structure |
| US10644259B2 (en) | 2017-08-18 | 2020-05-05 | Industrial Technology Research Institute | Package of electronic device and display panel |
| TWI659530B (en) * | 2018-03-23 | 2019-05-11 | 友達光電股份有限公司 | Transparent organic light-emitting diode panel |
| US20240349554A1 (en) * | 2020-08-31 | 2024-10-17 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display panel and display device |
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