TW201310129A - Backlight module and fabrication method thereof - Google Patents

Abstract

A backlight module and a fabrication method there are disclosed. The backlight module includes a heat dissipation substrate, a light source and a heat transmission layer. The heat dissipation substrate is an L-type structure, and the heat dissipation substrate has a bottom portion and a sidewall portion. The light source is disposed on the sidewall portion of the heat dissipation substrate, wherein the light source includes a circuit board and a light-emitting diode chip, and the light-emitting diode chip is disposed on the circuit board, and the heat transmission layer is disposed between the sidewall portion of the heat dissipation substrate and the circuit board, so that the heat produced by the light-emitting diode chip can be transferred from the light-emitting diode chip to the heat dissipation substrate through the heat transmission layer. In the fabrication method of the backlight module, at first, the heat dissipation substrate is provided. Then, the heat dissipation substrate is punched to form a L-type structure. Thereafter, the light source is provided. Then, the heat transmission layer is used to disposing the light source on the sidewall portion of the heat dissipation substrate.

Description

Backlight module and manufacturing method of the same

The present invention relates to a backlight module and a method of manufacturing the same, and more particularly to a backlight module having excellent heat dissipation effect and a method of manufacturing the backlight module.

Liquid crystal display devices are widely used in consumer electronic products such as displays, LCD TVs, mobile phones, and notebook computers because of their thinness, low power consumption, and low radiation. However, the liquid crystal itself does not emit light, so a general liquid crystal display device requires a backlight module to provide a light source. The illumination source of the backlight module mainly adopts a cold cathode ray tube or a light emitting diode, wherein the light emitting diode has high color saturation, no mercury, high life and the like, so the light emitting diode has gradually replaced the cold cathode ray tube. And is widely used in backlight modules.

When the user uses the liquid crystal display device, after receiving the electric energy, the light-emitting diode converts part of the electric energy into light energy to emit light, and most of the remaining electric energy is converted into heat energy to escape. Therefore, almost all of the electric energy received by the light-emitting diode is converted into heat energy dissipation, which causes heat to accumulate, causing the overall circuit temperature of the liquid crystal display device to rise, thereby affecting the electrical properties, and the service life of the light-emitting diode is also shortened. Therefore, how to solve the heat dissipation problem of the light-emitting diode becomes an important issue.

However, in the current production of a backlight module using a light-emitting diode as a light source, simply using the bottom circuit board for simple heat dissipation is easy and intuitive, but the heat cannot be effectively discharged.

Therefore, how to develop a backlight module that can improve the lack of conventional technology is an urgent need for research and development.

One aspect of the present invention is to provide a backlight module having excellent heat dissipation effect to avoid problems such as affecting the service life and affecting electrical properties due to an increase in overall circuit temperature.

Another aspect of the present invention is a method of manufacturing a backlight module to produce a backlight module having excellent heat dissipation.

According to an embodiment of the invention, the backlight module comprises a heat dissipation substrate, a light source and a heat conduction layer. The heat dissipation substrate has an L-shaped structure in which the heat dissipation substrate has a bottom portion and a side portion. The light source is disposed on a side of the heat dissipation substrate, wherein the light source comprises a circuit board and a light emitting diode chip, and the light emitting diode chip is disposed on the circuit board. The heat conduction layer is disposed between the circuit board of the light source and the side of the heat dissipation substrate, so that the heat energy generated by the light emitting diode wafer is discharged to the heat dissipation substrate via the heat conduction layer.

According to another embodiment of the present invention, in the method of fabricating the backlight module, a metal substrate is first provided. Next, the metal substrate is stamped into an L shape according to a predetermined fold line so that the metal substrate has a bottom portion and a side portion. then. A light source is provided, wherein the light source comprises a circuit board and a light emitting diode chip disposed on the circuit board. Next, the light-emitting source is disposed on the side of the metal substrate by the heat-conducting layer, so that the heat energy generated by the light-emitting diode wafer is discharged to the heat-dissipating substrate via the heat-conducting layer.

In summary, the backlight module of the embodiment of the present invention utilizes an integrally formed heat dissipation substrate to enhance the heat dissipation effect of the backlight module. Secondly, the backlight module manufacturing method of the embodiment of the present invention forms the L-shaped structure of the heat-dissipating substrate through the stamping forming technology, so that the light-emitting diode mounted on the heat-dissipating substrate can obtain a better heat-dissipating effect.

Please refer to FIG. 1 , which is a cross-sectional structural view of a backlight module according to an embodiment of the invention. The backlight module 100 of the embodiment of the present invention includes a heat dissipation substrate 200, a light source 300, a heat conduction layer 400, a light guide plate 500, a reflection sheet 501, and an optical film group 502, and is housed in the housing 600. In this embodiment, the housing 600 is a high temperature resistant material. The heat dissipation substrate 200 has an L-shaped structure, and the heat dissipation substrate 200 has a bottom portion 201 and side portions 202. In this embodiment, the heat dissipation substrate 200 may be, but is not limited to, an aluminum metal plate. In the embodiment, the bottom plate 203 is further disposed on the bottom 201 of the heat dissipation substrate 200. The deformation resistance of the bottom plate 203 is greater than the deformation resistance of the heat dissipation substrate 200 to prevent deformation of the heat dissipation substrate 200. A bump 203a is disposed on the bottom plate 203, and a recess 201a is disposed on the heat dissipation substrate 200. The bump 203a is tightly engaged with the recess 201a, so that the bottom plate 203 is firmly disposed on the bottom portion 201 of the heat dissipation substrate 200 through the mutual locking of the bump 203a and the recess 201a.

The light source 300 is disposed on the side portion 202 of the heat dissipation substrate 200. In the present embodiment, the light source 300 includes a light emitting diode chip 301 and a circuit board 302, and the light emitting diode chip 301 is disposed on the circuit board 302. In other embodiments of the present invention, a solder resist layer 303 may be disposed between the LED chip 301 and the circuit board 302 to avoid causing the LED 302 to be soldered to the circuit board 302. Damage. The heat conductive layer 400 is disposed between the circuit board 302 of the light source 300 and the side portion 202 of the heat dissipation substrate 200 such that heat generated by the light source 300 is discharged to the heat dissipation substrate 200 via the heat conductive layer 400. In this embodiment, the heat conductive layer 400 may include a first thermal conductive adhesive 401, a thermal conductive copper foil layer 402 and a second thermal conductive adhesive 403, wherein the thermal conductive adhesive is used to adhere the thermal conductive copper foil layer to the circuit board 302 and the side portion 202. In order to achieve a good heat dissipation effect.

The light guide plate 500 is disposed on the bottom plate 203. A reflective sheet 501 is disposed under the light guide plate 500. The optical film group 502 (for example, a diffusion plate) is disposed between the light guide plate 500 and the light exit surface 503 of the backlight module 100. The light-emitting diode chip 301 and the light guide plate 500 are disposed adjacent to each other. Therefore, when the light-emitting diode chip 301 receives electric energy and emits light, the light is introduced into the light guide plate 500 and reflected by the reflection sheet 501 and then diffused through the diffusion plate 502 to diffuse light. In this way, the backlight module 100 can be activated according to the requirements of the display (not shown). When the light-emitting diode 301 emits heat, the heat energy can be transmitted to the heat-dissipating substrate 200 through the heat-conducting layer 400, and then the heat-dissipating substrate 200 can dissipate heat into the air, so that the backlight module 100 can be When working, it will not be affected by the temperature increase and affect the electrical and overall circuit life.

In addition, it is worth mentioning that the bottom of the housing 600 has a hollow structure, which can directly contact the heat dissipation substrate 200 with the outside air to enhance the heat dissipation effect of the backlight module 100.

Please refer to FIG. 2A and FIG. 2B, FIG. 2C and FIG. 2D. FIG. 2A is a schematic flow chart of a method for manufacturing a backlight module according to an embodiment of the present invention. FIG. 2B is a schematic diagram according to FIG. FIG. 2C and FIG. 2D are schematic side views showing the heat dissipation substrate 200 of the backlight module 100 according to an embodiment of the present invention, and FIG. 2E The figure shows a side view of a metal substrate, a light source and a heat conducting layer of a backlight module according to an embodiment of the invention.

In the manufacturing method 700 of the backlight module, the substrate providing step 710 is first performed to provide the metal substrate 200 as shown in FIGS. 2B and 2C. In the embodiment, the metal substrate 200 may be, but is not limited to, an aluminum metal plate. Next, a stamping step 720 is performed to press the metal substrate 200 into an L shape according to the preset fold line S. The metal substrate 200 has a bottom portion 201 and side portions 202 through a stamping step 720. After the substrate providing step 710 and the stamping step 720, the integrally formed L-shaped metal substrate 200 can be obtained, which has the advantages of high mechanical strength and high heat dissipation effect.

Then, a light source providing step 730 is performed to provide the light source 300. In this embodiment, the light source 300 includes a light emitting diode chip 301 and a circuit board 302. In addition, a solder resist layer 303 disposed between the LED chip 301 and the circuit board 302 may be included. Next, a bonding step 740 is performed to dispose the light source 300 on the side portion 202 of the metal substrate 200 by the heat conductive layer 400 so that the heat energy generated by the light emitting diode wafer 301 is discharged to the metal substrate 200 via the heat conductive layer 400. In this embodiment, the heat conductive layer 400 may include a first thermal conductive adhesive 401, a thermal conductive copper foil layer 402, and a second thermal conductive adhesive 403. The heat conductive layer 400 can adhere the heat conductive copper foil between the circuit board 302 and the side portion 202 of the metal substrate 200, thereby achieving a good heat dissipation effect. In another embodiment of the present invention, after the bonding step 740, a reinforcing step is performed to provide a bottom plate (not shown) on the bottom 201 of the metal substrate 200. The deformation resistance of the bottom plate is greater than the deformation of the heat dissipation substrate 200. The resistance is such that deformation of the metal substrate 200 can be prevented.

In summary, the backlight module of the embodiment of the present invention utilizes an integrally formed heat dissipation substrate to enhance the heat dissipation effect of the backlight module. The heat-dissipating substrate has a large contact area to be in contact with the outside air, so that a good heat dissipation effect can be achieved, and the problem of affecting the service life and affecting the electrical properties due to the increase in the overall circuit temperature is avoided. The method for manufacturing the backlight module of the embodiment of the present invention is to form an L-shaped structure of the heat-dissipating substrate through a stamping forming technique, so that the light-emitting diode mounted on the heat-dissipating substrate can obtain a better heat-dissipating effect. Moreover, the mechanical strength of the substrate can also be enhanced.

While the invention has been described above in terms of several embodiments, it is not intended to limit the scope of the invention, and the invention may be practiced in various embodiments without departing from the spirit and scope of the invention. The scope of protection of the present invention is defined by the scope of the appended claims.

100. . . Backlight module

200. . . Heat sink substrate

201. . . bottom

201a. . . Groove

202. . . Side

203. . . Bottom plate

203a. . . Bump

300. . . Light source

301. . . Light-emitting diode chip

302. . . Circuit board

303. . . Anti-corrosion paint layer

400. . . Thermal layer

401. . . First thermal adhesive

402. . . Thermal copper foil layer

403. . . Second thermal adhesive

500. . . Light guide

501. . . A reflective sheet

502. . . Optical film set (diffusion plate)

503. . . Glossy surface

600. . . case

700. . . Backlight module manufacturing method

710. . . Substrate supply step

720. . . Stamping step

730. . . Light source provides steps

740. . . Joining step

S. . . Preset fold line

FIG. 1 is a cross-sectional structural view of a backlight module according to an embodiment of the invention.

FIG. 2A is a schematic flow chart showing a method of manufacturing a backlight module according to an embodiment of the invention.

FIG. 2B is a schematic top plan view showing a heat dissipation substrate of a backlight module according to an embodiment of the invention.

2C and 2D are schematic side views showing a heat dissipation substrate of a backlight module according to an embodiment of the invention.

FIG. 2E is a side view showing a metal substrate, a light source, and a heat conductive layer of a backlight module according to an embodiment of the invention.

100. . . Backlight module

200. . . Heat sink substrate

201. . . bottom

201a. . . Groove

202. . . Side

203. . . Bottom plate

203a. . . Bump

300. . . Light source

301. . . Light-emitting diode chip

302. . . Circuit board

303. . . Anti-corrosion paint layer

400. . . Thermal layer

401. . . First thermal adhesive

402. . . Thermal copper foil layer

403. . . Second thermal adhesive sheet

500. . . Light guide

501. . . A reflective sheet

502. . . Optical film set (diffusion plate)

503. . . Glossy surface

600. . . case

Claims (10)

A backlight module includes: a heat dissipation substrate having an L-shaped structure, wherein the heat dissipation substrate has a bottom portion and a side portion; and a light source is disposed on the side portion of the heat dissipation substrate, wherein the light source comprises: a circuit board; and a light emitting diode chip disposed on the circuit board; and a heat conducting layer disposed between the circuit board of the light source and the side of the heat sink substrate to enable the light emitting diode chip The generated thermal energy is discharged to the heat dissipation substrate via the heat conduction layer. The backlight module of claim 1, further comprising a bottom plate fixed on the heat dissipation substrate to prevent deformation of the heat dissipation substrate. The backlight module of claim 2, wherein the bottom of the heat dissipation substrate has at least one groove, and the bottom plate has at least one protrusion, and the at least one protrusion is tightly matched with the at least one groove. So that the bottom plate is fitted to the heat dissipation substrate. The backlight module of claim 2, further comprising: a light guide plate disposed on the bottom plate to guide the light emitted by the light source to a light emitting surface of the backlight module; and a diffusion The plate is disposed between the light guide plate and the light emitting surface of the backlight module to diffuse light emitted by the light source. The backlight module of claim 2, wherein the deformation resistance of the bottom plate is greater than the deformation resistance of the heat dissipation substrate. The backlight module of claim 2, wherein the bottom plate is made of metal. The backlight module of claim 1, wherein the heat dissipation substrate is made of aluminum. A method for manufacturing a backlight module, comprising: providing a metal substrate; stamping the metal substrate into an L shape according to a predetermined fold line, so that the metal substrate has a bottom portion and a side portion; and providing a light source, comprising: a circuit board; and a light emitting diode chip disposed on the circuit board; and a heat conducting layer is disposed on the side of the metal substrate to generate the light emitting diode chip The heat energy is discharged to the metal substrate via the heat conductive layer. The method for manufacturing a backlight module according to claim 8, further comprising fitting a bottom plate to the bottom of the metal substrate to prevent deformation of the metal substrate. The method of manufacturing a backlight module according to claim 9, wherein the deformation resistance of the bottom plate is greater than the deformation resistance of the metal substrate.