TW201317667A - Cutting processing method of liquid crystal panel module - Google Patents

Abstract

The present invention provides a cutting processing method of a liquid crystal panel module, which includes: (A) conducting a freezing process on a liquid crystal panel module to solidify liquid crystals in the liquid crystal panel module; (B) cutting the liquid crystal panel module to obtain a panel module block, and the panel module block has an incision surface corresponding to the cutting location; and, (C) coating ultraviolet (UV) curing glue on the incision surface and irradiating ultraviolet to cure the ultraviolet curing glue, so as to seal the liquid crystals on the incision surface and in the panel module block. By conducting the freezing process before cutting, the liquid crystals may be solidified without arbitrary flow, so as to avoid the liquid leakage and air permeation issues during or after cutting. With the UV glue for sealing, the irradiation method may rapidly cure the glue within limited time, and the curing method is simple and fast.

Description

Cutting method of liquid crystal panel module

The invention relates to a cutting processing method for a liquid crystal panel module, in particular to a cutting processing method for cutting a larger size panel module to a required size and processing after cutting.

Liquid crystal displays (LCDs) are often used in many public places or business locations, and can be viewed as television or used to play advertisements or other multimedia information. However, in bus, MRT and other places, due to the limited installation space, the display size may have to be used in special specifications, not the usual size can be installed.

Referring to Figures 1 and 2, the liquid crystal display generally includes a panel module 1 and a backlight module (not shown) located below the panel module 1. The panel module 1 comprises: two polarizing plates 11 disposed above and below, two substrates 12, a liquid crystal layer 13 between the two substrates 12 and containing liquid crystal, and a glue surrounding the liquid crystal layer 13 Layer 14, and elements such as color filters, transistors, etc., not shown. Since the size specifications of the panel module 1 are generally fixed, when faced with the above-mentioned special size requirements, the panel module 1 of the general common specification must be cut to an appropriate size (cutting position as shown in the figure) 10)), the panel module and the backlight module are assembled to produce an appropriately sized display.

However, since the liquid crystal in the panel module 1 is liquid at a normal temperature and has high fluidity, liquid leakage of the liquid crystal out occurs when the panel module 1 is cut, and the liquid crystal liquid also causes the cut end face and the uncut. There is a pressure difference between the cut portions, which is one of the causes of liquid leakage. On the other hand, air is also infiltrated into the liquid crystal layer 13, which affects the performance of the module. In addition, when the module block of the appropriate size is cut, the cutting portion 10 becomes an open portion, and the portion must be closed by subsequent processing to avoid leakage of the liquid crystal. Therefore, the present invention improves the cutting process and the post-cutting processing mode of the panel module 1 to provide a more complete and practical cutting processing method.

Accordingly, it is an object of the present invention to provide a cutting method for a liquid crystal panel module that avoids liquid leakage during cutting or cutting.

Therefore, the cutting processing method of the liquid crystal panel module of the present invention comprises:

(A) A liquid crystal panel module is subjected to a freezing process to cure the liquid crystal in the liquid crystal panel module.

(B) cutting the liquid crystal panel module to obtain a panel module block, the panel module block having a slit surface corresponding to the cutting portion.

(C) applying a UV curable adhesive to the slit surface, and irradiating the UV light to cure the UV curable adhesive to seal the slit surface and the liquid crystal in the panel module block.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

Referring to FIG. 3, FIG. 4 and FIG. 3, a preferred embodiment of the cutting method of the liquid crystal panel module of the present invention is used for cutting a liquid crystal panel module 2 into an appropriate size. The liquid crystal panel module 2 comprises: two a polarizing plate 21 spaced apart from each other, two substrates 22 spaced apart from each other between the two polarizing plates 21, and two first adhesive layers 23 for respectively fixing the adjacent polarizing plates 21 and the substrate 22, one located at A liquid crystal layer 24 between the two substrates 22 and containing a liquid crystal, and a second adhesive layer 25 located around the liquid crystal layer 24 to fix the liquid crystal between the substrates 22. The two substrates 22 are transparent glass substrates, and each of the substrates 22 is bonded and fixed to the adjacent polarizing plate 21 by the first adhesive layer 23. The liquid crystal panel module 2 actually includes a thin film transistor, an alignment film, a black matrix, a color filter, etc., but these are conventional structures and are not improved by the present invention. Focus, no longer detailed.

The cutting processing method of this embodiment includes the following steps:

(1) Step 51: Firstly, the size of the panel module to be cut is determined, which is mainly determined according to the application of the product and the needs of the customer. Wiping the surface of one of the liquid crystal panel modules 2 to the cut portion 20 to keep the surface clean, and then performing a pre-processing operation, and cutting is performed within a range of a few millimeters (mm) corresponding to the periphery of the projected cut portion 20. The polarizing plate 21 is scraped off, and the exposed first adhesive layer 23 is wiped off. After the polarizing plate 21 is scraped off and the first adhesive layer 23 is wiped off, the substrate 22 can be partially removed. The area is exposed, and the width of the exposed area of the substrate 22 is about 10 mm, but is not limited thereto. The pre-processing operations are performed on the upper and lower polarizing plates 21 and the first adhesive layer 23 so that the upper and lower substrates 22 are partially exposed. The advantage of pre-processing is as follows: since the first adhesive layer 23 has been wiped clean first, when the liquid crystal panel module 2 is actually cut, the lower knife is mainly cut by the substrate 22 so that the blade does not The residue of the first adhesive layer 23 remains, resulting in poor cutting, which helps to improve the cutting yield.

(2) Step 52: The liquid crystal panel module 2 is subjected to a freezing process (this step is omitted in Fig. 5) to cure the liquid crystal in the liquid crystal layer 24. Specifically, the module is placed in a freezer for freezing, and the freezing time is 3 to 5 minutes to cure the liquid crystal. Further preferably, the freezing temperature is -5 to -10 °C. Since the critical temperature for changing the liquid crystal from a liquid state to a solid state is generally about -10 ° C, the liquid crystal temperature is lowered to -5 to -10 ° C and solidified before cutting, which will delay the time of liquid crystal liquefaction after cutting. It is enough to complete the process of sealing and UV curing after cutting (the UV curing process will be detailed later). However, if the liquid crystal is at an excessively low temperature for a long period of time (for example, -20 ° C or lower), the liquid crystal structure is destroyed and the liquid crystal cannot be operated, so the range of the freezing temperature must be limited.

It should be noted that the liquid crystal is "cured", and it is not limited to the fact that the liquid crystal must be 100% solid. Actually, the liquid crystal is nearly solid and the fluidity is lowered by the freezing treatment, and the object of the present invention can be attained.

(3) Performing step 53: cutting the liquid crystal panel module 2 by using a glass cutter not shown in the figure, since the pre-processing has been performed in the previous step to expose a part of the substrate 22, so in this step Cutting directly from the portion of the substrate 22 corresponding to the aforementioned predetermined cutting portion 20 to obtain a panel module block 3 having a predetermined size, and the panel module block 3 has a corresponding one for the cutting The cut surface 31 at the location. Specifically, if you want to make a 28-inch panel, you must cut a 29-inch block. The size of the cut is larger because you have to keep the surrounding area when you make the panel. It is used to frame and electrically connect the soft board. Components such as lines, so the actual visible area will shrink.

It should be noted that the cutting operation may be performed in stages, and the upper substrate 22 may be first cut, then the liquid crystal panel module 2 is turned over, and another substrate 22 is cut at a corresponding position. Each substrate 22 has a thickness of about 0.7 mm and a cutting depth of about 0.3 mm. The cutting depth does not need to reach the thickness of the entire substrate 22, in order to avoid excessive stress and damage the substrate 22, and the frozen glass substrate 22 The panel module 3 is obtained by having a certain degree of brittleness and the thickness of the substrate 22 being thin, so that the liquid crystal panel module 2 can be subsequently broken along the cutting edge of the substrate 22. The advantage of using the two-cutting in this embodiment is that the stress is dispersed in the two cutting processes, and avoiding the use of only one cutting will cause the stress to be too concentrated and may damage the module.

(4) Performing step 54: applying a UV-curable adhesive (UV adhesive) 4 to the cut surface 31 of the cut panel module block 3, and the UV-curable adhesive 4 covers the side corresponding to the entire liquid crystal layer 24. . Then, the ultraviolet light is irradiated to cure the ultraviolet curing adhesive 4 to completely seal the liquid crystal in the liquid crystal layer 24, thereby preventing liquid leakage and air infiltration, thereby completing the cutting operation. The processed panel module block 3 is then assembled with a backlight module (not shown) and other components to form a liquid crystal display of a predetermined size.

It should be noted that in order to avoid leakage and air infiltration, the sealing and sealing curing action of step 54 must be completed within the time when the liquid crystal is converted from the solid state to the liquid state, but the curing time of the natural curing glue on the market generally cannot be long. It is completely cured within the time defined above, so if a natural curing adhesive is used, liquid crystal may flow out while waiting for curing. The invention adopts the UV glue, which is characterized in that the UV glue is quickly hardened after being irradiated by UV light, and the sealing and curing operation can be completed within a limited time, so that the cutting processing operation is successfully completed.

In summary, by performing the freezing treatment before cutting, the liquid crystal is solidified without arbitrarily flowing, thereby facilitating cutting, and preventing leakage or air infiltration during cutting, and sealing after cutting. Before the glue, since the liquid crystal is still substantially maintained in a solid state, it is possible to continuously prevent leakage of the liquid crystal and air infiltration during this period. On the other hand, with the UV glue sealing, the colloid can be quickly solidified in a limited time by illumination, and the curing method is simple and rapid, thereby serving as a processing and repairing method after cutting, which can speed up the operation time and indeed achieve the present invention. purpose. The invention has considerable advantages for the manufacture and application of the liquid crystal panel, and can customize a variety of panels of different sizes to meet the different needs of customers, and is an innovative and practical invention.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

2. . . LCD panel module

20. . . Expected cut

twenty one. . . Polarizer

twenty two. . . Substrate

twenty three. . . First glue layer

twenty four. . . Liquid crystal layer

25. . . Second glue layer

3. . . Panel module block

31. . . Notched surface

4. . . UV curing adhesive

51~54. . . step

1 is a top plan view of a known panel module;

Figure 2 is a cross-sectional view taken along line 2-2 of Figure 1;

3 is a side cross-sectional view of a liquid crystal panel module, and is also an object to be cut according to a preferred embodiment of the cutting processing method of the present invention;

Figure 4 is a block diagram showing the steps of the preferred embodiment; and

Figure 5 is a flow diagram showing the flow of several of the steps of the preferred embodiment.

2. . . LCD panel module

20. . . Expected cut

twenty one. . . Polarizer

twenty two. . . Substrate

twenty three. . . First glue layer

twenty four. . . Liquid crystal layer

25. . . Second glue layer

3. . . Panel module block

31. . . Notched surface

4. . . UV curing adhesive

Claims (6)

A cutting method for a liquid crystal panel module, comprising: (A) applying a freezing process to a liquid crystal panel module to solidify liquid crystal in the liquid crystal panel module; and (B) cutting the liquid crystal panel module to obtain a panel module block having a slit surface corresponding to the cutting portion; and (C) applying an ultraviolet curing glue on the slit surface, and irradiating the ultraviolet light to cure the ultraviolet curing adhesive The liquid in the cut surface and the panel module block is sealed. The method for cutting a liquid crystal panel module according to the first aspect of the invention, wherein the liquid crystal panel module comprises two upper and lower polarizing plates, two upper and lower spaced and located between the two polarizing plates. a substrate, and a liquid crystal layer between the two substrates and containing the liquid crystal, and the ultraviolet curable adhesive of the step (C) covers a side surface corresponding to the liquid crystal layer. The cutting method of the liquid crystal panel module according to the second aspect of the invention, wherein the freezing temperature of the step (A) is -5 to -10 °C. The cutting method of the liquid crystal panel module according to the third aspect of the invention, wherein the freezing time of the step (A) is 3 to 5 minutes. The method for cutting a liquid crystal panel module according to any one of claims 2 to 4, wherein the liquid crystal panel module further comprises two separate polarizing plates and substrates for fixing adjacent ones. a first adhesive layer; the cutting processing method of the liquid crystal panel module further comprises a pre-processing step before the step (A), removing the two polarizing plates and the two first adhesive layers corresponding to an expected cutting The portion at which the portion is exposed is exposed; and the step (B) is cutting from the substrate. The method for cutting a liquid crystal panel module according to claim 5, wherein the step (B) is to first cut one of the substrates, and then cut another substrate at a corresponding position, and continue the liquid crystal panel. The module module is broken along the cutting edge of the substrate to obtain the panel module block.