TW201314163A - Thermal interface material and processing method thereof - Google Patents

Abstract

A thermal interface material is provided to fill the gap between the surfaces in the thermal transfer system to transfer heat between the surfaces. The thermal interface material includes a substrate and thermally conductive particles dispersed within the substrate. The thermal interface material is adjusted and/or subjected to reduced pressure (eg, before being placed in the gap between the surfaces, in the gap, after being placed in the gap, etc.), thereby improving the Thermal interface materials have operational reliability and/or resistance to crack formation during thermal cycling.

Description

Thermal interface material and processing method thereof Cross-references to related applications

The present application claims priority to U.S. Patent Application Serial No. 13/111,735, filed on May 19, 2011. The entire disclosure of the above application is hereby incorporated by reference.

The present disclosure is generally directed to thermal interface materials and methods of processing the same.

This section provides background information related to this disclosure, which is not necessarily prior art.

Electrical components such as semiconductors, integrated circuit packages, transistors, etc. typically have pre-design temperatures that optimize the operation of the electrical components. Ideally, the pre-designed temperature approximates the temperature of the surrounding air. But the working electrical components generate heat. Without removing heat, the electrical components may operate at temperatures significantly above their normal or ideal operating temperatures. Such excessive temperatures can adversely affect the operating characteristics of the electrical components and the operation of the associated devices.

To avoid or at least reduce adverse operating characteristics due to heat generation, heat should be removed, such as by transferring heat from the working electrical component to the heat sink. The heat sink can then be cooled by conventional convection and/or radiation techniques. During conduction, heat may be transferred from the working electrical component to the heat sink by direct surface contact between the electrical component and the heat sink and/or by contact of the electrical component with the surface of the heat sink via the intermediate medium or thermal interface material. The thermal interface material can be used to fill the gap between the heat transfer surfaces to increase heat transfer efficiency compared to filling the gap with air as a relatively poor thermal conductor.

This section provides a general summary of the disclosure, and is not a full disclosure of the full scope or all of its features.

It is disclosed herein to process thermal interface materials to improve their operational reliability and improve crack formation during thermal cycling when the thermal interface material is used with a thermal transfer system (eg, transferring heat between the heat transfer surfaces of the system, etc.) Specific examples of embodiments of systems and methods of sexuality and the like. Specific examples of embodiments of thermal interface materials that have been processed in accordance with the present disclosure are also disclosed, including thermal interface materials that have been adjusted and/or subjected to reduced pressure.

An illustrative embodiment discloses a thermal interface material suitable for filling a gap between at least two surfaces to transfer heat between the at least two surfaces. In an exemplary embodiment, the thermal interface material generally comprises a substrate and thermally conductive particles dispersed within the substrate. The thermal interface material can be adjusted and/or subjected to reduced pressure, thereby improving the operational reliability and/or crack formation resistance of the thermal interface material during thermal cycling.

Embodiments of the disclosed embodiments are also generally directed to methods of processing thermal interface materials to improve the operational reliability of thermal interface materials for transferring heat between at least two thermal transfer surfaces. In one embodiment, the method generally includes adjusting the thermal interface material by subjecting the thermal interface material to reduced pressure.

The following description is merely an embodiment in nature and is not intended to limit the disclosure, application, or use.

Thermal interface materials can be used to fill the thermal transfer surface in a thermal transfer system Between the gaps (for example, between the surface of the heat generating component (such as an electronic device, a hot water device, etc.) and the surface of the heat dissipating component (such as a heat sink, etc.), etc.) to increase the heat transfer efficiency between the surfaces, and to have air Compared to the gap of the filling, it is a relatively poor thermal conductor. The thermal interface material generally comprises a substrate (eg, a polyoxyl substrate, etc.) and thermally conductive particles (eg, ceramic particles, etc.) dispersed within (eg, provided, positioned, etc.) the substrate. Thermally conductive putty, thermally conductive grease, and thermal gap liners are examples of thermal interface materials that can be used to fill such gaps between thermally transfer surfaces.

As recognized by the inventors herein, when the thermal interface material is subjected to thermal cycling as described above, for example, at a temperature of about 65 degrees Celsius (eg, when the thermal interface material is cycled on and off and circulated to about 65 degrees Celsius above) Some of the thermal interface materials may have reliability issues when the temperature and then the cooled heat generating components are used in combination. For example, cracks may be formed in the thermal interface material during use between the surfaces, and/or the thermal interface material may be scooped out of the gap between the thermal transfer surfaces (leaving voids in the thermal interface material). This in turn reduces heat transfer between the heat transfer surfaces because the air filled cracks and/or voids have a lower thermal conductivity than the thermal interface material.

As an embodiment, the inventors of the present invention have recognized herein that when used in applications undergoing such temperature cycling changes (eg, when used to fill gaps between heat transfer surfaces, etc.), thermal interface materials Cracks often form in the middle. Without being bound by theory, the inventors of the present invention herein assume that the cracks are caused by movement of gases (e.g., air, etc.) entrained within the thermal interface material. Temperature changes in the thermal interface material cause entrained gas (continuous Together with the actual matrix of the thermal interface material, it expands and contracts and thus moves within the thermal interface material. Over time, gases migrate and collect, and weak points are formed (eg, due to internal stress, etc.) at the formation of cracks (or cracks) within the thermal interface material.

The inventors of the present invention have unexpectedly discovered herein that the thermal interface material is subjected to reduced pressure conditioning over a specified time period prior to storage, shipping, use, etc. (e.g., removal of entrained gas from the thermal interface material, reduction of heat). The amount of entrained gas in the interface material, etc., can help to improve the operational reliability of the thermal interface material (eg, the thermal transfer compatibility between the heat transfer surfaces, etc.) (compared to the same thermal interface material not similarly adjusted) ). The adjustment may be, for example, before, simultaneously or after mounting the thermal interface material in the thermal transfer system (eg, before, during or after the placement of the thermal interface material between the thermal transfer surfaces in the thermal transfer system, etc.), Or even before using heat interface materials to transfer heat between the heat transfer surfaces of the heat transfer system.

For example, the inventors herein have discovered that when used to transfer heat between heat transfer surfaces in applications undergoing temperature cycling, thermal interface materials (eg, bulk supplies of thermal interface materials, etc.) Subjecting to reduced pressure regulation substantially reduces crack formation in the thermal interface material (eg, by improving the resistance of the thermal interface material to crack formation during thermal cycling, etc.) (thus, improving the operational reliability of the thermal interface material as previously described) . In particular, the inventors herein have found that within about 48 hours or less than 48 hours or less (e.g., within about 24 hours or less, about 12 hours or less) after subjecting the thermal interface material to reduced pressure conditioning. Within 8 hours Using or less than 8 hours) the use of thermal interface materials (e.g., transferring heat between the heat transfer surfaces, etc.) substantially reduces crack formation in the thermal interface material during use of the thermal interface material. The inventors herein have also discovered that after subjecting the thermal interface material to a reduced pressure adjustment, further storage is carried out under conditions that inhibit contact of the thermal interface material with the surrounding gas (eg, in a sealed container, under reduced pressure, etc.) Adjusting the thermal interface material (eg, alone, applied to the heat transfer surface, etc.), and then using the stored thermal interface material (eg, transferring heat between the heat transfer surfaces, etc.), also substantially reducing exposure to the Crack formation in the thermal interface material during temperature cycling during use.

Moreover, the inventors of the present invention herein have discovered that such benefits (eg, reducing crack formation, improving operational reliability, etc.) associated with subjecting the thermal interface material to reduced pressure regulation are reversible over time, and as described herein. The subsequent exposure of the thermal interface material to the surrounding gas for a period of time (eg, up to about 8 hours or greater than 8 hours, etc.) may actually disappear after use (eg, transferring heat between the heat transfer surfaces, etc.) or prior to storage. However, the inventors herein have discovered that such benefits can be achieved by subsequently subjecting the thermal interface material to reduced pressure regulation over a particular time frame prior to use of the thermal interface material. In this connection, the inventors herein have discovered that the work for depressurizing the thermal interface material can be applied over the thermal interface material to maintain these benefits indefinitely. Such reconditioning can be performed, for example, prior to, simultaneously with, or after/or even after the thermal interface material is installed in the thermal transfer system, using heat interface material to transfer heat between the heat transfer surfaces of the thermal transfer system.

Thus, specific examples of embodiments of the present disclosure are related to use (eg, a thermal interface material (eg, a bulk supply of thermal interface material, etc.) that undergoes reduced pressure regulation over a specified time range for transferring heat between the heat transfer surfaces, and the like, and a method of subjecting the thermal interface material to reduced pressure regulation and A system that subjects the thermal interface material to reduced pressure regulation (eg, for use, etc.). For example, some embodiment specific examples include subjecting a thermal interface material (eg, applied separately to a heat transfer surface, etc.) to a reduced pressure conditioning thermal interface material and then using a thermal interface material such as heat in a thermal transfer system Transfer heat between transfer surfaces, etc. The adjustment may be, for example, before, simultaneously or after mounting the thermal interface material in the thermal transfer system (eg, before, during or after placing the thermal interface material in the gap between the thermal transfer surfaces), or even after use The thermal interface material transfers heat between the heat transfer surfaces of the heat transfer system before or at the same time. Some embodiments specific examples further include encapsulating the conditioned thermal interface material (eg, separately, applied to a heat transfer surface, etc.) in a container (eg, a sealed container, etc.) that inhibits contact of the thermal interface material with ambient gases, And maintaining the thermal interface material in the container under such conditions as needed (eg, until the thermal interface material is used, during storage of the thermal interface material, during transport of the thermal interface material, etc.) to thereby improve the thermal interface material during unsealing and The reliability of the work when used by the end user.

Embodiment embodiments will now be described more fully with reference to the accompanying drawings.

1 illustrates a flow diagram of an embodiment method 100 for processing a thermal interface material (e.g., a bulk supply of thermal interface material, etc.) in accordance with the present disclosure. This processing can help to inhibit crack formation, for example, when transferring heat between heat transfer surfaces of components in a heat transfer device undergoing temperature cycling. And/or contribute to improving the operational reliability of the thermal interface material. The embodiment method 100 is described in connection with the processing of the thermal interface material prior to installation of the thermal interface material in the thermal transfer system. However, it should be appreciated that the embodiment method 100 is also applicable to processing the thermal interface material while the thermal interface material is installed into the thermal transfer system, and processing the thermal interface material after the thermal interface material has been installed in the thermal transfer system.

The illustrated method 100 generally includes, for example, adjusting the operation of the thermal interface material by subjecting the thermal interface material to reduced pressure prior to use of the thermal interface material in a thermal transfer system, and inhibiting ambient gas from contacting the conditioned thermal interface material. 104. The method 100 can be applied to any size and/or number of thermal interface materials (eg, bulk quantities of thermal interface materials, etc.).

In the embodiment method 100, the operation 102 of conditioning the thermal interface material generally includes disposing a thermal interface material in the conditioning system (eg, within the container portion of the conditioning system, etc.) and reducing the pressure around the thermal interface material to, for example, self-heat The interface material removes entrained gases and the like. The conditioning system is configured to maintain the thermal interface material in a substantially sealed state. This allows the desired decompression to be achieved within the conditioning system around the thermal interface material (and then subsequently maintained as needed). The conditioning system can include a vacuum chamber within the scope of the present disclosure, a hermetically sealable bucket (eg, a five gallon bucket, etc.), a sealable bag (eg, a plastic heat seal bag, etc.), at least one or more than one dispensing cartridge, at least one or greater than A sealable tube, any suitable sealable package or container, the conditioning system 220 illustrated in Figure 2, a forty gallon mixer, and the like. In other embodiment embodiments, the work 102 of conditioning the thermal interface material may include at least one or more than one other suitable operation, such as for removing entrained gas from the self-heating interface material.

As just described, reducing the pressure around the thermal interface material can include Gas (eg, air, etc.) is removed from the interior of the conditioning system that is suitable for operation (eg, suction work, vacuum work, other sealing operations, etc.) from the self-heating interface material. This causes a low pressure environment (e.g., medium vacuum, etc.) around the thermal interface material in the conditioning system, wherein the pressure around the thermal interface material is less than the ambient pressure outside the conditioning system (e.g., ambient air pressure, etc.). For example, the resulting pressure around the thermal interface material can be at about 1.0% full vacuum (about 29.5 absolute mercury ingots (inHg abs), about 14.5 per square centimeters absolute pounds (psia), about 100 absolute kilopascals (kPa). Abs) or about 750 Torr) is between about 99.999% complete vacuum (about 0.0004 inHg abs, about 0.0002 psia, about 0.001 kPa abs or about 0.01 Torr).

As an embodiment, the valve port can be mounted to the conditioning system and the vacuum can be directly extracted via the valve port to the reduced pressure around the thermal interface material within the conditioning system (eg, gas removal therefrom, etc.). A vacuum of the desired period of time can be applied to the thermal interface material to achieve the desired pressure within the conditioning system (and around the thermal interface material). The resulting pressure (eg, reduced pressure, vacuum, etc.) can be substantially instantaneously achieved around the thermal interface material after application of the vacuum. As an embodiment, a vacuum of at least about 381 Torr (at least about 15 inHg abs, at least about 7.37 psia, or at least about 50.8 kPa abs) can be applied to the thermal interface material disposed in the conditioning system for at least about 5 minutes. In order to achieve the required decompression.

Alternatively, reducing the pressure around the thermal interface material can include reducing the temperature of the gas within the conditioning system surrounding the thermal interface material while maintaining the volume of the conditioning system surrounding the thermal interface material substantially constant, or increasing the volume of the conditioning system surrounding the thermal interface material while maintaining The temperature of the gas within the conditioning system around the thermal interface material is substantially constant and the like.

As an embodiment, the conditioning system and the thermal interface material contained therein can be heated and then covered to create a low pressure environment around the thermal interface material. More specifically, the container portion of the conditioning system and the thermal interface material contained therein can be heated to any desired temperature, and the container portion can then be closed using a lid while still heating to thereby seal the thermal interface material therein. When the thermal interface material cools, a slight vacuum/airtight seal will form between the container portion and the lid. It will be appreciated that it may only be necessary to have a slight increase in the temperature of the container portion and/or the thermal interface material such that the container portion of the conditioning system having the lid is subsequently closed and the thermal interface material therein is cooled to cause a slight vacuum around the thermal interface material. However, depending on the degree of vacuum desired to be achieved, the container portion and/or the thermal interface material can be heated to any desired temperature within the scope of the present disclosure (eg, greater than the thermal interface material within the conditioning system and/or conditioning system). Any temperature around the ambient air temperature, and at most the limits of the container portion of the conditioning system (eg, about 80 degrees Celsius for plastic container parts, etc.). In addition, depending on the desired degree of vacuum to be achieved, the container portion and/or the thermal interface material can be heated to any desired time range (eg, up to about 30 seconds, up to about 24 hours, etc.).

The illustrated operation 104 of method 100 (inhibiting ambient gas contact with the conditioned thermal interface material) generally includes maintaining the conditioned thermal interface material in a substantially sealed state. This protects the conditioned thermal interface material from exposure to ambient gases until the thermal interface material is required or the thermal interface material is transferred to another container (eg, for packaging, storage, transportation, etc.). The thermal interface material can then remain in a substantially sealed state as needed, for example until needed for storage, for storage, for transportation to an end user, and the like. When transported to the final use in a substantially sealed state At the time of the user, the end user can open the thermal interface material (exposing the thermal interface material to the surrounding gas) and install the thermal interface material as needed (eg, within the desired time range, etc.). As previously stated, the inventors herein have unexpectedly discovered that if the conditioned thermal interface material is installed for assembly in a thermal transfer system within about 48 hours or less after the thermal interface material is unsealed ( This adjustment of the thermal interface material can help to inhibit the formation of cracks, voids, etc. in the thermal interface material during the application (and thereby improve the operational reliability of the thermal interface material) during operation to undergo temperature cycling.

Maintaining the conditioned thermal interface material in a substantially sealed state can include maintaining the conditioned thermal interface material within the conditioning system after application of the conditioning operation 102 (eg, within a container portion of the thermal interface material conditioned conditioning system, etc.). For example, the thermal interface material can be maintained in a conditioning system under reduced pressure (eg, under continuous vacuum, etc.). Alternatively, the vacuum may be stopped and any open portion of the entrained gas (e.g., any open portion of the container portion of the conditioning system, etc.) suitable for use in the working seal adjustment system to self-heat the interface material may be used to thereby inhibit ambient gas contact. Adjusted thermal interface material. The thermal interface material can then be retained in the conditioning system as needed (eg, in the container portion of the conditioning system), for example until needed for storage, for storage, for transportation to the end user, until the thermal interface material needs to be transferred to other containers (eg, for packaging) and many more.

Alternatively, maintaining the conditioned thermal interface material in a substantially sealed state can include transferring (eg, for packaging, etc.) the conditioned thermal interface material from the conditioning system to the desired sealable container (eg, hermetic seal, hermetic seal, etc.) To thereby maintain the thermal interface material in inhibiting the conditioned thermal interface material and surrounding Under the conditions of gas contact. The container may include, for example, a hermetically sealable bucket (eg, a five gallon bucket, etc.), a sealable bag (eg, a plastic heat seal bag, etc.), at least one or more than one dispensing cartridge, at least one or more than one that is within the scope of the present disclosure. Sealed tube, any suitable sealable package or container. The thermal interface material can then be retained in the sealed container as needed, for example until needed for storage, for transport to the end user, and the like. When transported to the end user in a sealed container, the end user can open the sealed container (recovering the pressure in the container to ambient pressure) and install the thermal interface material as needed.

When processing the thermal interface material, at least one or more operations 102 of conditioning the thermal interface material and the act of inhibiting ambient gas contact with the conditioned thermal interface material may be repeated (at least once or more). For example, as generally disclosed herein, if the conditioned thermal interface material is exposed to ambient gas but is not used within about 48 hours or less after the exposure, then before the thermal interface material is used to re-adjust the thermal interface material Work 102 (and possibly work 104) can be repeated, and thus operational reliability is improved.

2 illustrates an embodiment system 220 configured to adjust thermal interface materials in accordance with the present disclosure. For example, the illustrated system 220 can be used in conjunction with the method 100 and at least one or more than one of its operations 102 and 104. In particular, system 220 is configured to receive thermal interface material therein (eg, separately, mounted to a thermal transfer surface, etc.), to adjust thermal interface materials (eg, to remove entrained gases from a self-heating interface material, etc.) and subsequently as needed The thermal interface material is maintained under reduced pressure.

As shown in FIG. 2, the illustrated system 220 generally includes a container 222. And first and second valve combinations 224, 226 coupled to the container 222. Container 222 is configured to receive a thermal interface material therein. And the first and second valve combinations 224, 226 are configured to control (in conjunction with a vacuum source (not shown)) gas flow into and/or out of the vessel 222 (eg, to reduce pressure within the vessel 222 and from the vessel 222) The inner thermal interface material removes entrained gas, etc.). For example, the valve combination 224 is operated to regulate the air pressure of the system 220. And the working valve combination 226 monitors the air pressure flowing through the line 228 to the vessel 222 (via the meter unit 226a) and monitors the vacuum inside the vessel 222 (via the meter unit 226b).

The container 222 includes a base portion 230 that is configured to receive the thermal interface material therein and a cover 232 that is configured to cover the base portion 230. A gasket (not visible) can be placed between the lid 232 and the base portion 230 to help substantially seal the thermal interface material in the container 222 (when the lid 232 covers the base portion 230). The cover 232 can be coupled to the base portion 230 by suitable work (eg, mechanical fasteners, etc.) and can include a transparent and/or translucent material such that the thermal interface material in the container 222 can be viewed via the cover 232. The illustrated container 222 includes a generally cylindrical shape, but may include any other suitable shape (eg, cuboid, spherical, etc.) that falls within the scope of the present disclosure. In addition, the container 222 can comprise any desired size (eg, 5 gallons, etc.) and/or can be any desired material within the scope of the present disclosure (eg, metallic materials (eg, steel, aluminum, combinations thereof, etc.), plastic materials) , its combination, etc.) formed.

When working with the system 220 illustrated, the thermal interface material is disposed in the base portion 230 and the cover 232 is disposed on the base portion 230 to be substantially dense. The thermal interface material in the container 222 is sealed. The first and second valve combinations 224, 226 are then operated to draw a vacuum in the vessel 222 and reduce the pressure around the thermal interface material in the vessel 222 (e.g., the entrained gas is removed from the thermal interface material, etc.). For example, the first and second valve combinations 224, 226 can be operated to draw a vacuum of at least about 381 Torr (about 15 inHg abs) in the container 222 for at least about 5 minutes to reduce the area around the thermal interface material in the container 222. pressure. After application of the vacuum, the conditioned thermal interface material can remain in the container 222 as needed. Alternatively, as disclosed herein, the thermal interface material can be removed from the container 222 for use, for subsequent packaging, and the like. In other embodiment embodiments, a vacuum of less than about 381 Torr (about 15 inHg abs) may be drawn in the system to remove entrained gas from the thermal interface material, and/or the vacuum may be drawn for less than about 5 minutes.

In some embodiments of the present disclosure, a thermal interface material is suitably provided to fill the gap between the heat transfer surfaces in the heat transfer system. Herein, the thermal interface material generally includes a substrate and thermally conductive particles dispersed in the substrate. Before using the thermal interface material to fill the gap between the heat transfer surfaces in the thermal transfer system, or within about eight hours before the thermal interface material is stored in a condition that inhibits the surrounding gas from contacting the conditioned thermal interface material, The thermal interface material is subjected to reduced pressure to condition (eg, before, at the same time, or after the thermal interface material is installed in the electrical component). As described herein, this helps to improve the operational reliability of the thermal interface material to transfer heat between the heat transfer surfaces. In some embodiment embodiments, the thermal interface material is subjected to a reduced pressure that is less than ambient air pressure. And in some embodiment embodiments, the thermal interface material is subjected to a reduced pressure of between about 0.01 Torr and about 750 Torr.

In some embodiments of the present disclosure, the conditioned thermal interface material is packaged in a desired (eg, for storage, transportation, etc.) container (eg, separately, mounted to a heat transfer surface, etc.). The container may be hermetically sealed wherein the thermal interface material is encapsulated therein while inhibiting ambient gas from contacting the conditioned thermal interface material. In some embodiment embodiments, the thermal interface material is shipped, stored, etc. in a hermetically sealed container. In some embodiment embodiments, the thermal interface material is maintained for about 48 hours or less before inhibiting ambient gas contact with the conditioned thermal interface material to use (eg, transferring heat between the heat transfer surfaces, etc.). And more specifically, the thermal interface material can be maintained under such conditions for about 24 hours or less than before use, or even more specifically about 12 hours or less before use, or more specifically until About 8 hours or less than 8 hours before use. In some embodiment embodiments, the thermal interface material can be removed from the hermetic sealed container and then subsequently as needed (eg, if the thermal interface material is not exposed to ambient gas for about 48 hours or less, etc.) Adjustment.

In some embodiment embodiments, the thermal interface materials of the present disclosure are substantially free of crack formation during use in filling the gap between the heat transfer surfaces in the heat transfer system. For example, the thermal interface material has a thermal cycle of between at least about 10 cycles or greater than 10 cycles (eg, 10 cycles, 20) between its exposure to a temperature of about -20 degrees Celsius and a temperature of about 160 degrees Celsius. One cycle, 40 cycles, 50 cycles, 1,000 cycles, etc.) may be substantially free of cracks. By way of further example, the thermal interface material is subjected to a temperature change comprising at least about 100 degrees Celsius or the like for at least about 10 cycles or greater than 10 cycles (eg, 10 cycles, 20 cycles, 40 cycles, 50 cycles) cycle, After 1,000 cycles, etc.) there may be substantially no cracks.

In some embodiment embodiments, the thermal interface materials of the present disclosure are substantially free of crack formation during exposure to thermal cycling analysis. In some embodiment embodiments, the thermal interface material is substantially free of crack formation during its exposure to a thermal cycle that includes a temperature change of at least about 100 degrees Celsius. In some embodiment embodiments, the thermal interface materials of the present disclosure are substantially free of crack formation during their exposure to thermal cycling from about -20 degrees Celsius to about 90 degrees Celsius. In some embodiment embodiments, the thermal interface materials of the present disclosure are substantially free of crack formation during their exposure to thermal cycling from about -20 degrees Celsius to about 120 degrees Celsius. In some such embodiment embodiments, the thermal interface material of the present disclosure is exposed to at least about 10 cycles or greater than 10 cycles (eg, 10 cycles, 20 cycles, 40 cycles, 50 cycles, There may be substantially no crack formation during the thermal cycle of 1,000 cycles, etc.).

In one embodiment, during the first time period, the gap between the at least two surfaces is filled with the thermal interface material during exposure of the thermal interface material between a temperature of about -20 degrees Celsius and a temperature of about 160 degrees Celsius. The thermal interface material of the present disclosure is substantially free of crack formation during thermal cycling for at least about 10 cycles. However, during the second time period, the thermal interface material (eg, the same thermal interface material, the sample of the same bulk supply taken from the thermal interface material, etc.) is exposed to ambient air for at least about eight hours or more than eight hours after the thermal interface is used The thermal interface material exhibits crack formation after the material is filled with a gap between at least two surfaces, after exposure to a thermal cycle between a temperature of about -20 degrees Celsius and a temperature of about 160 degrees Celsius for at least about 10 cycles.

Embodiments of the thermal interface material suitable for use in accordance with the present disclosure may include a wide range of A range of materials including, but not limited to, thermally conductive putty, thermally conductive grease, thermally conductive gap liners, organic (eg, polymeric) materials (compared to inorganic (eg, metal solder) materials), cured self-sustaining or individual liners or sheets (with Spread paste or remeltable solder contrast).

Example

The following examples are essentially embodiments. The following embodiments may be varied without departing from the scope of the disclosure.

Example 1

In this example, the presence of entrained gas in the four samples of the thermally conductive putty (polyoxygen hot gap filler product) was evaluated. The thermally conductive putty has a thermal conductivity of about 3 watts per meter - Kelvin (W/mK) and a density of about 2.4 grams per cubic centimeter (g/cc).

The first sample included a thermally conductive putty bulk sphere exposed to ambient laboratory conditions for approximately 24 hours. The sample was then immersed in a degassed liquid polyfluorene in a clear glass jar and the can was placed inside a vacuum chamber (with a transparent window for viewing the sample). A gradual increase in vacuum is drawn inside the vacuum chamber, resulting in a final reduced pressure in the chamber of about 127 Torr (about 5 inHg abs) (a meter reading of about -25 inHg is produced in the chamber). The sample was maintained at this reduced pressure in the chamber for about 1 hour, and the results were as follows. At a reduced pressure of about 254 Torr (about 10 inHg abs), bubbles began to form on the surface of the sample, and the number continued to increase until a final reduced pressure of about 127 Torr (about 5 inHg abs). Figure 3 shows the first sample (and bubbles formed therefrom) approximately at about 127 Torr (about 5 inHg abs) under reduced pressure in the chamber. Then, cracks begin to form on the surface of the sample, and bubbles appear in the crack. After about 15 minutes under a reduced pressure of about 127 Torr (about 5 inHg abs), The bubbles appearing in the product are reduced by about 50%. In addition, after about 1 hour at a reduced pressure of about 127 Torr (about 5 inHg abs), only a small portion of the bubbles still appeared from the sample, indicating that a significant percentage of the gas had been removed from the sample.

The second sample included a thermally conductive putty bulk sphere that was subjected to an initial vacuum conditioning operation (according to the present disclosure) for about 15 minutes under a reduced pressure of about 127 Torr (about 5 inHg abs) (a meter reading of about -25 inHg). The vacuum-adjusted sample was then immersed (as soon as after the vacuum conditioning operation) in the degassed liquid polyfluorene in the clear glass jar and the can was placed inside a vacuum chamber (with a transparent window for viewing the sample). The vacuum was drawn in the vacuum chamber in substantially the same manner as the first sample, resulting in a final reduced pressure of about 127 Torr (about 5 inHg abs) in the chamber. The sample was then maintained under the reduced pressure for about 1 hour. Figure 4 shows a second sample approximately when a reduced pressure of about 127 Torr (about 5 inHg abs) is achieved in the chamber. As shown in Figure 4, the second sample showed a significant reduction in the amount of bubbles on its surface compared to the first sample (Figure 3). In particular, the number of bubbles observed in combination with a second sample at about 127 Torr (about 5 inHg abs) decompression in the approximate chamber is about one hour after exposure to a reduced pressure of about 127 Torr (about 5 inHg abs). The first sample combined with the observed number of bubbles is approximately the same. Thus, the bubble reduction associated with the second sample (compared to the first sample) demonstrates that the initial vacuum conditioning operation effectively removes the entrained gas from the second sample.

The third sample included a thermally conductive putty bulk ball that was subjected to an initial vacuum conditioning operation for about 15 minutes under a reduced pressure of about 127 Torr (about 5 inHg abs). After the vacuum conditioning operation, the samples were placed under ambient laboratory conditions for approximately 12 hours. The sample was then immersed in a degassed liquid polyfluorene in a clear glass jar and the can was placed inside a vacuum chamber (with a transparent window for viewing the sample). In essence A sample draws a vacuum in the vacuum chamber in the same manner, resulting in a final reduced pressure of about 127 Torr (about 5 inHg abs) in the chamber. The sample was then maintained under the reduced pressure for about 1 hour. Figure 5 shows a third sample (and bubbles emerging therefrom) approximately at about 127 Torr (about 5 inHg abs) under reduced pressure in the chamber. As shown in Figure 5, in a manner similar to the first sample (Figure 3), a large number of bubbles emerge from the sample, indicating that as described herein, if the sample is subsequently exposed to ambient gas, the initial vacuum conditioning operation The entrained gas in the sample is removed to be reversible.

The fourth sample included a thermally conductive putty bulk ball that was subjected to an initial vacuum conditioning operation for about 15 minutes under a reduced pressure of about 127 Torr (about 5 inHg abs). After this vacuum conditioning operation, the sample is stored in a sealed bag of approximately one month of removal of gas (to help inhibit contact of the sample with ambient gases). The sample was then immersed in a degassed liquid polyfluorene in a clear glass jar and the can was placed inside a vacuum chamber (with a transparent window for viewing the sample). The vacuum was drawn in the vacuum chamber in substantially the same manner as the first sample, resulting in a final reduced pressure of about 127 Torr (about 5 inHg abs) in the chamber. The sample was then maintained under the reduced pressure for about 1 hour. Figure 6 shows a fourth sample (and bubbles emerging therefrom) approximately at about 127 Torr (about 5 inHg abs) under reduced pressure in the chamber. As shown in Figure 6, the fourth sample showed a significant reduction in the amount of bubbles on its surface compared to the first sample (Figure 3) and the third sample (Figure 5), indicating that there was no significant entrainment in the sample during the storage period. Gas.

Example 2

In this example, thermal cycling analysis was performed on two samples of a thermally conductive putty (polyoxygen hot gap filler product). The thermal conductivity of the heat conductive putty is about 3 W/mk and a density of about 1.5 g/cc.

A first sample of the thermally conductive putty is placed in the container and subjected to reduced pressure. In particular, a gas of about 381 Torr (about 15 inHg abs) is applied to the container and the thermally conductive putty for about 5 minutes (to allow the first sample to be vacuum adjusted) to remove gas from the container (and removed from the sample in the container) Entrained gas). The second sample of the thermally conductive putty was not subjected to reduced pressure (and thus was not vacuum regulated). Thermal cycle analysis was then performed on the first and second samples immediately. Each sample was placed between a pair of glass plates so that the effect of the thermal cycle analysis was easily observed. The spacer separates the pairs of plates such that each sample has a substantially constant thickness between about 40 mils and about 60 mils (between about 1 mm and about 1.5 mm). And using a spring clip clamp to bond the pairs of plates together to help keep the sample at this thickness. Each sample is then placed in a programmed circulating oven to cycle the sample between about -20 degrees Celsius and a temperature of about 160 degrees Celsius for about 42 cycles (where each cycle lasts about 4 hours) . Figure 7 shows the first sample that was vacuum adjusted after the analysis. And Figure 8 shows a second sample that was unconditioned after analysis. As can be seen by comparing Figures 7 and 8, the vacuum-conditioned first sample (Figure 7) after analysis does not substantially include visible cracks, while the unadjusted second sample (Figure 8) includes a large number of visible cracks.

Example 3

In this example, thermal cycling analysis was performed on two samples of a thermally conductive putty (polyoxygen hot gap filler product). The thermal conductive putty has a thermal conductivity of about 2 W/mk and a density of about 3.0 g/cc.

A first sample of the thermally conductive putty is placed in the container and subjected to reduced pressure. In particular, approximately 381 Torr (about 15 inHg abs) is applied to the container and sample. The vacuum is removed for about 5 minutes (so that the first sample is vacuum adjusted) and the gas is removed from the vessel (and the entrained gas is removed from the sample in the vessel). The second sample of the thermally conductive putty was not subjected to reduced pressure (and thus was not vacuum regulated). Thermal cycle analysis was then performed on the first and second samples immediately. Each sample was entangled between a pair of glass plates so that the effect of the thermal cycle analysis could be easily observed. The spacer separates the pairs of plates such that each sample has a substantially constant thickness between about 40 mils and about 60 mils (between about 1 mm and about 1.5 mm). And using a spring clip clamp to bond the pairs of plates together to help keep the sample at this thickness. Each sample is then placed in a programmed circulating oven to cycle the sample between about -20 degrees Celsius and a temperature of about 160 degrees Celsius for about 42 cycles (where each cycle lasts about 4 hours) . Figure 9 shows the first sample vacuum adjusted after analysis. And Figure 10 shows a second sample that was unconditioned after analysis. As can be seen by comparing Fig. 9 with Fig. 10, the vacuum-conditioned first sample (Fig. 9) after analysis does not substantially include visible cracks, while the unadjusted second sample (Fig. 10) includes a large number of visible cracks.

Example 4

In this example, thermal cycling analysis was performed on two samples of a thermally conductive putty (polyoxygen hot gap filler product). The thermal conductive putty has a thermal conductivity of about 3 W/mk and a density of about 2.4 g/cc.

A first sample of the thermally conductive putty is placed in the container and subjected to reduced pressure. In particular, the gas is removed from the container by applying a vacuum of about 381 Torr (about 15 inHg abs) to the container and sample for about 5 minutes (to allow the first sample to be vacuum adjusted) (and removing the entrainment from the sample in the container) gas). Thermal grease The second sample was not subjected to reduced pressure (and therefore was not vacuum adjusted). Thermal cycle analysis was then performed on the first and second samples immediately. Each sample was placed between a pair of glass plates so that the effect of the thermal cycle analysis was easily observed. The spacer separates the pairs of plates such that each sample has a substantially constant thickness between about 40 mils and about 60 mils (between about 1 mm and about 1.5 mm). And using a spring clip clamp to bond the pairs of plates together to help keep the sample at this thickness. Each sample is then placed in a programmed circulating oven to cycle the sample between about -20 degrees Celsius and a temperature of about 160 degrees Celsius for about 42 cycles (where each cycle lasts about 4 hours) . Figure 11 shows the first sample vacuum adjusted after analysis. And Figure 12 shows the second sample that was unconditioned after the analysis. As can be seen by comparing Fig. 11 with Fig. 12, the vacuum-conditioned first sample (Fig. 11) after analysis does not substantially include visible cracks, while the unadjusted second sample (Fig. 12) includes a large number of visible cracks.

Example 5

In this embodiment, two types of thermally conductive grease (polyoxyl thermal grease having a thermal conductivity of about 3.8 W/mk, a density of about 2.6 g/cc, and suitable for use in a high performance computer processing unit, etc.) One sample was subjected to thermal cycle analysis. A first sample of thermally conductive grease is placed in the container and subjected to reduced pressure. In particular, the gas is removed from the container by applying a vacuum of about 381 Torr (about 15 inHg abs) to the container and sample for about 5 minutes (to allow the first sample to be vacuum adjusted) (and removing the entrainment from the sample in the container) gas). The second sample of thermally conductive grease is not subjected to reduced pressure (and therefore is not vacuum regulated). Immediately thereafter, the first and second samples were subjected to thermal cycle analysis. Each sample was placed between a pair of glass plates so that the effect of the thermal cycle analysis was easily observed. Spacer The pairs of plates are separated such that each sample has a substantially constant thickness between about 40 mils and about 60 mils (between about 1 mm and about 1.5 mm). In addition, spring clip clamps are used to bond the pairs of plates together to help maintain this thickness of the sample. Each sample is then placed in a programmed circulating oven to cycle the sample between about -20 degrees Celsius and a temperature of about 160 degrees Celsius for about 42 cycles (where each cycle lasts about 4 hours) . Figure 13 shows the vacuum-conditioned first sample after analysis. In addition, Figure 14 shows the unadjusted second sample after analysis. As can be seen by comparing Figures 13 and 14, the vacuum-conditioned first sample (Figure 13) included a small number of visible cracks after analysis, while the unconditioned second sample (Figure 14) included a large number of visible cracks.

Example 6

In this example, thermal cycling analysis was performed on four samples of a thermally conductive putty (polyoxygen hot gap filler product). The thermal conductive putty has a thermal conductivity of about 3 W/mk and a density of about 2.4 g/cc.

Each sample was prepared as follows before analysis. The first sample of the thermally conductive putty was exposed to ambient laboratory conditions for about 24 hours. A second sample of thermally conductive putty was subjected to an initial vacuum conditioning operation for about 15 minutes under a reduced pressure of about 127 Torr (about 5 inHg abs). A third sample of thermally conductive putty was subjected to an initial vacuum conditioning operation for about 15 minutes under a reduced pressure of about 127 Torr (about 5 inHg abs) and then exposed to ambient laboratory conditions for about 24 hours. And the fourth sample of the thermally conductive putty is subjected to an initial vacuum conditioning operation under a reduced pressure of about 127 Torr (about 5 inHg abs) for about 15 minutes, and then encapsulated in a sealed container under vacuum (to help inhibit the sample from contacting the surrounding gas). ) About 1 month. The initial vacuum conditioning operation involves placing the test sample in a container and then extracting about 127 Torr (about 5 inHg) in the container. The vacuum of abs) is about 15 minutes.

Thermal cycle analysis was performed on four samples immediately after sample preparation. Each sample was placed between a pair of substantially square glass plates (having a size of about 2.5 inches by about 2.5 inches and a thickness of about 0.25 inches) so that the effect of the thermal cycle analysis can be easily observed. The spacer separates the pairs of plates such that each sample has a substantially constant thickness between about 40 mils and about 60 mils (between about 1 mm and about 1.5 mm). And using a spring clip clamp to bond the pairs of plates together to help keep the sample at this thickness. Each sample is then placed in a programmed circulating oven such that the sample is cycled at a rate of about 1.5 degrees Celsius per minute for about 42 cycles between about -20 degrees Celsius and about 160 degrees Celsius (so that each cycle It has a duration of about 4 hours and the analysis lasts about 7 days).

Figure 15 shows the first sample after the analysis, Figure 16 shows the second sample after the analysis, Figure 17 shows the third sample after the analysis, and Figure 18 shows the fourth sample after the analysis. As can be seen by comparing Figures 15 through 18, the second and fourth samples (Figs. 16 and 18, respectively) subjected to the initial vacuum conditioning operation within about 24 hours of the analysis exhibited substantially no visible cracks. However, the first and third samples (Figures 15 and 17, respectively) exposed to ambient laboratory conditions for approximately 24 hours prior to analysis exhibited a large number of visible cracks. In this connection, the first sample (Fig. 15) shows that the thermal cycle has a detrimental effect on the heat transfer putty (when initially not subjected to vacuum conditioning operation). The second sample (Fig. 16) shows the benefits of applying a vacuum conditioning operation to the heat transfer putty (e.g., substantially reducing surface cracking, etc.). The third sample (Fig. 17) shows that the benefits of the vacuum adjustment operation applied to the heat transfer putty can fade away over time, so that it involves heat cycling. The use of thermally conductive putty in the application of the ring can result in improper crack formation. And the fourth sample (Fig. 18) shows that by encapsulating the vacuum-regulated thermally conductive putty in a sealed container under vacuum to protect it from exposure to ambient gases, the benefits of vacuum conditioning operations applied to thermally conductive putty can be maintained over time. .

Accordingly, the present disclosure is directed to a thermal interface material that is conditioned under reduced pressure (e.g., reduced atmospheric pressure, etc.), and a method of modulating the thermal interface material. This adjustment of the thermal interface material may precede the encapsulation of the thermal interface material; before, simultaneously or after the thermal interface material is installed in the thermal transfer system; before or at the same time using the thermal interface material to transfer heat between the thermal transfer surfaces in the thermal transfer system get on.

Disclosed herein is the processing of thermal interface materials to improve the reliability, workability, and crack resistance of thermal interface materials during use with thermal transfer systems (eg, transferring heat between the heat transfer surfaces of the system, etc.) during thermal cycling. Formative, etc., in turn, will exemplify embodiments of embodiments of systems and methods for improving the reliability, workability, etc. of the heat transfer system during use, particularly when the heat transfer system undergoes temperature cycling during the use. Specific examples of embodiments of thermal interface materials that have been processed in accordance with the present disclosure are also disclosed, including thermal interface materials that have been adjusted and/or subjected to reduced pressure. In such specific examples, the adjustment of the thermal interface material can be prior to, during or after the installation of the thermal interface material between the thermal transfer surfaces in the thermal transfer system, or even the thermal transfer of the thermal interface material in the thermal transfer system. Transfer heat between surfaces before or at the same time. In some embodiment embodiments, the conditioned thermal interface material (eg, separated from the heat transfer system, mounted in a heat transfer system, etc.) may be further packaged and/or stored (eg, separately, with its The heat transfer system incorporated therein, etc., is under conditions that inhibit the contact of the conditioned thermal interface material with the surrounding gas.

Embodiments of the disclosed embodiments are generally related to thermal interface materials suitable for use in filling gaps between surfaces and/or transferring heat between surfaces (e.g., in heat transfer systems, etc.). In one embodiment, the thermal interface material generally comprises a substrate and thermally conductive particles dispersed within the substrate. The thermal interface material is configured such that during the first time period, during filling of the gap between the at least two surfaces using the thermal interface material, the thermal interface material is exposed between a temperature of about -20 degrees Celsius and a temperature of about 160 degrees Celsius After at least about 10 cycles of thermal cycling, the thermal interface material is or will be substantially crack free. During a second period of time, after the thermal interface material is exposed to ambient air for at least about eight hours, during filling of the gap between the at least two surfaces using the thermal interface material, the thermal interface material is exposed to a temperature of about -20 degrees Celsius and about Celsius After a thermal cycle between temperatures of 160 degrees for at least about 10 cycles, the thermal interface material will exhibit or exhibit crack formation.

In another embodiment, the thermal interface material generally comprises a substrate and thermally conductive particles dispersed within the substrate. Herein, the thermal interface material is adjusted under reduced pressure, and within about forty-eight hours or less than forty-eight hours of adjusting the thermal interface material, the conditioned thermal interface material is disposed in a container that inhibits ambient gas from contacting the conditioned thermal interface material, or Thermal interface materials are used to transfer heat between the heat transfer surfaces of the heat transfer system. In this embodiment embodiment, the thermal interface material can be adjusted before, during or after the installation of the thermal interface material in the thermal transfer system. Alternatively, any time before or during the transfer of heat between the heat transfer surfaces of the heat transfer system using the thermal interface material Thermal interface material.

Embodiments of the disclosed embodiments are also generally directed to methods of processing thermal interface materials to improve the operational reliability of thermal interface materials for transferring heat between at least two thermal transfer surfaces. In one embodiment, the method generally includes adjusting the thermal interface material under reduced pressure such that the thermal interface material is or will be exposed to at least about 10 cycles of thermal cycling comprising a temperature change of at least about 100 degrees Celsius It is essentially free of cracks.

Specific embodiments of the disclosed embodiments can be used to adjust bulk supplies of thermal interface materials. The bulk supplies may include any desired volume of material.

The embodiments are provided so that this disclosure will be thorough, and the scope will be fully conveyed to those skilled in the art. Numerous specific details are set forth, such as specific embodiments of the components, systems, devices, and methods. It will be apparent to those skilled in the art that <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; In some embodiments, well-known methods, well-known device structures, and well-known techniques are not described in detail. In addition, the advantages and modifications that may be achieved by one or more exemplary embodiments of the present disclosure are provided for illustrative purposes only, without limiting the scope of the disclosure, as the exemplary embodiments disclosed herein may provide the advantages mentioned above. And all or none of the improvements are still within the scope of the disclosure.

The terminology used herein is for the purpose of describing particular embodiments of the embodiments and The singular forms "a" and "the" The terms "including", "including" and "having" are inclusive. It is intended that the described features, integers, steps, operations, components and/or components are present, but one or more other features, integers, steps, operations, components, components and/or groups thereof are not excluded. The method steps, processes, and operations described herein are not to be construed as necessarily requiring a particular order in the particular It should also be understood that other or alternative steps may be used.

When an element or layer is referred to as "on," "engaged," "connected to," or "coupled" to another element or layer, it can be Or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaging," "directly connected to" or "directly coupled" to another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between components should be interpreted in a similar manner (for example, "between" and "directly between" and "adjacent" compared to "directly adjacent" Wait). The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items. The term "about" when applied to a numerical value means that the calculated value or the measured value allows some of the numerical values to be slightly inaccurate (some of which approximate the numerical value; roughly or fairly close to the value; almost this value). If for some reason the imprecision provided by "about" is not to be construed as having this general meaning in the art, the term "about" as used herein means at least the general method of measuring or using the parameters. A variant that can be produced. For example, the terms "substantially", "about" and "substantially" as used herein may mean within the manufacturing tolerances.

Although the terms first, second, third, etc. may be used herein to describe each The elements, components, regions, layers and/or sections are not limited by the terms. The terms can only be used to distinguish one element, component, region, layer or segment from another region, layer or segment. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order, unless the context clearly indicates otherwise. Thus, a first element, component, region, layer or section that is discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the embodiments.

In this paper, spatial relative terms are used for convenience of description, such as "internal", "external", "under", "below", "lower", "above", "upper". And similar terms are used to describe one element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown. For example, elements that are "under" or "under" other elements or features "below" or "under" other elements or features. Above." Therefore, the example term "below" can encompass both orientations above and below. The device may be otherwise oriented (rotated 90 degrees or down at other bits), and the spatially relative descriptors used herein may be interpreted accordingly.

Moreover, disclosures of particular values (e.g., pressure, time, dimensions, etc.) herein do not exclude other values that may be applicable to other embodiment specific examples depending on, for example, a particular processed thermal interface material, other factors, and the like. Specific numerical ranges for the parameters given herein (eg, time, pressure, The disclosure of dimensions and the like does not exclude other numerical and numerical ranges that may be applied to one or more embodiments disclosed herein. Furthermore, any two specific values envisioned for the particular parameters set forth herein may define an endpoint that is applicable to a series of values for a given parameter. The disclosure of the first and second values of a given parameter can be construed to reveal any value between the first value and the second value that can also be used for a given parameter. Similarly, it is envisioned that the disclosure of two or more numerical ranges of the parameters (whether the range is a nested, overlapping, or mutually exclusive) encompasses all of the ranges of values claimed by the endpoints of the disclosed range. May be combined.

The foregoing description of specific examples has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but are not interchangeable and may be used in the particular embodiments selected, if not specifically shown or described. It can also vary in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

100‧‧‧ method

102‧‧‧Working on the regulation of thermal interface materials

104‧‧‧Suppressing the contact of ambient gases with conditioned thermal interface materials

220‧‧‧ system

222‧‧‧ container

224‧‧‧First valve combination

226‧‧‧Second valve combination

226a and 226b‧‧‧ table units

228‧‧‧ pipeline

230‧‧‧Basic

232‧‧‧ cover

The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure.

1 is a flow chart illustrating the operation of an embodiment method of processing a thermal interface material in accordance with the present disclosure; FIG. 2 is a perspective view of a working embodiment system that facilitates processing a thermal interface material in accordance with the present disclosure; and FIG. 3 is a thermally conductive putty sample Initially exposed to ambient laboratory conditions for about 24 hours, and then immersed in a vacuum chamber for degassed liquid polyoxane under reduced pressure And the image displayed in the degassed liquid polyfluorene in the vacuum chamber when the pressure is reduced to about 127 Torr (about 5 absolute mercury indium (inHg abs)) in a vacuum chamber; FIG. 4 is a diagram 3 The same thermally conductive putty sample was conditioned under reduced pressure of about 127 Torr (about 5 inHg abs) for about 15 minutes according to the present disclosure and then immersed in a degassed liquid polyoxane under reduced pressure in a vacuum chamber, and was achieved in an approximately vacuum chamber. About 127 Torr (about 5 absolute mercury enthalpy (inHg abs)) The photo shown in the degassed liquid polyfluorene in the vacuum chamber at the time of decompression; FIG. 5 is the same heat conduction putty sample as FIG. 3 according to the present disclosure. Adjusted under a reduced pressure of about 127 Torr (about 5 inHg abs) for about 15 minutes, followed by exposure to ambient laboratory conditions for about 12 hours, and then immersed in a vacuum chamber in a degassed liquid polyoxane under reduced pressure, and at about The image shown in the degassed liquid polyfluorene in the vacuum chamber when the pressure is reduced to about 127 Torr (about 5 inHg abs) in the vacuum chamber; FIG. 6 is the same heat conduction putty sample as in FIG. 3 according to the present disclosure at about 127 Adjust (about 5 inHg abs) under reduced pressure for about 15 minutes, then store in a sealed bag under vacuum for about 1 month, and then immerse a photo of a degassed liquid in a vacuum chamber, in a degassed liquid in a vacuum chamber, and a degassed liquid in a vacuum chamber, in a vacuum chamber, at a pressure of about 127 Torr (about 5 inHg abs). Figure 7 is a photograph of a thermally conductive putty sample adjusted for about 5 minutes under a reduced pressure of about 381 Torr (about 15 inHg abs) according to the present disclosure and then subjected to thermal cycle analysis; Figure 8 is the same heat transfer putty sample as Figure 7 Adjusted under reduced pressure Photographs subjected to the same thermal cycling analysis as the sample shown in Figure 7; Figure 9 is a thermally conductive putty sample that was conditioned at about 381 Torr (about 15 inHgabs) under reduced pressure for about 5 minutes and then analyzed by thermal cycling according to the present disclosure. Fig. 10 is a photo of the same heat conduction putty sample as that of Fig. 9 subjected to the same thermal cycle analysis as the sample shown in Fig. 9 without being reduced under reduced pressure; Fig. 11 is about 381 Torr according to the present disclosure. 15 inHg abs) Photograph of a thermally conductive putty sample adjusted for about 5 minutes under decompression and then subjected to thermal cycling analysis; FIG. 12 is the same as the heat transfer putty sample of FIG. 11 and subjected to the sample shown in FIG. 11 without being adjusted under reduced pressure. Photographs of the same thermal cycle analysis; Figure 13 is a photo of a thermally conductive grease sample that was conditioned at about 381 Torr (about 15 inHg abs) under reduced pressure for about 5 minutes and then analyzed by thermal cycling in accordance with the present disclosure; The same thermal grease sample of Figure 13 was subjected to the same thermal cycle analysis as the sample shown in Figure 13 without adjustment under reduced pressure; Figure 15 is exposed to ambient laboratory conditions for about 24 hours and then subjected to thermal cycling. Analysis of the photo of the thermally conductive putty sample; Figure 16 and Figure 15 The thermally conductive putty sample was conditioned at about 5 inHg abs under reduced pressure for about 15 minutes and then subjected to thermal cycling analysis according to the present disclosure; FIG. 17 is the same thermally conductive putty sample as FIG. 15 at about 127 Torr (about 5 according to the present disclosure). inHg abs) adjusted for about 15 minutes under reduced pressure, followed by exposure to ambient laboratory conditions for about 24 hours, and then analyzed by thermal cycling And FIG. 18 is the same as the heat transfer putty sample of FIG. 15 adjusted according to the present disclosure under a reduced pressure of about 127 Torr (about 5 inHg abs) for about 15 minutes, and then packaged in a sealed container under vacuum for about 1 month, and then Photographs of thermal cycling analysis.

Corresponding reference numerals indicate corresponding parts throughout the drawings.

220‧‧‧ system

222‧‧‧ container

224‧‧‧First valve combination

226‧‧‧Second valve combination

226a‧‧‧ table unit

226b‧‧‧ table unit

228‧‧‧ pipeline

230‧‧‧Basic

232‧‧‧ cover

Claims (22)

a thermal interface material adapted to fill a gap between at least two surfaces to transfer heat between the at least two surfaces, the thermal interface material comprising: a substrate; and thermally conductive particles dispersed within the substrate; Wherein the thermal interface material is adjusted and/or subjected to reduced pressure, thereby improving the operational reliability and/or crack formation resistance of the thermal interface material during thermal cycling. The thermal interface material of claim 1, wherein: the thermal interface material is adjusted under a reduced pressure less than ambient air pressure; and/or the thermal interface material is decompressed between about 0.01 Torr and about 750 Torr. Adjustment. The thermal interface material of claim 1 or 2, wherein: during the first period of time, the thermal interface material is exposed to about -20 Celsius during filling of the gap between the at least two surfaces using the thermal interface material. After at least about 10 cycles of thermal cycling between the temperature and a temperature of about 160 degrees Celsius, the thermal interface material is substantially free of cracks; and during the second time period, the thermal interface material is exposed to ambient air for at least about eight hours After the thermal interface material is used to fill the gap between the at least two surfaces, the thermal interface material is exposed to a thermal cycle between about -20 degrees Celsius and a temperature of about 160 degrees Celsius for at least about 10 cycles. The thermal interface material exhibits crack formation. The thermal interface material of claim 1 or 2, wherein: the gap between the at least two surfaces is filled with the thermal interface material to transfer heat between the at least two surfaces, The thermal interface material is adjusted under reduced pressure; or the thermal interface material is reduced during the use of the thermal interface material to fill the gap between the at least two surfaces to transfer heat between the at least two surfaces The depression is adjusted; or the thermal interface material is subjected to a reduced pressure before, during or after the placement of the thermal interface material to fill the gap between the at least two surfaces to transfer heat between the at least two surfaces Adjustment. For example, the thermal interface material of claim 1 or 2, wherein the thermal interface material is a heat conductive putty, a thermal grease or a thermal gap spacer. The thermal interface material according to claim 1 or 2, wherein the thermal interface material has been adjusted under reduced pressure, whereby the adjusted heat is adjusted within about forty-eight hours or less than forty-eight hours. The interface material is disposed in a vessel that inhibits ambient gas from contacting the conditioned thermal interface material or to transfer heat between at least two heat transfer surfaces in the thermal transfer system. The thermal interface material of claim 6, wherein the adjusted thermal interface material is disposed to inhibit ambient gas from contacting the conditioned thermal interface material within about twelve hours or less than twelve hours of conditioning the thermal interface material. In the vessel, or to transfer heat between the at least two heat transfer surfaces in the heat transfer system. For example, the thermal interface material of claim 1 or 2, The thermal interface material is in a container that inhibits ambient gas from contacting the thermal interface material. The thermal interface material of claim 8 wherein the thermal interface material is adjusted under reduced pressure while in the container. A method of processing a thermal interface material to improve operational reliability of the thermal interface material for transferring heat between at least two thermal transfer surfaces, the method comprising adjusting the thermal interface by subjecting the thermal interface material to reduced pressure material. The method of claim 10, wherein: adjusting the thermal interface material comprises subjecting the thermal interface material to a vacuum of at least about 127 Torr to reduce pressure around the thermal interface material; and/or subjecting the thermal interface material to a vacuum of at least about 127 Torr for at least about 5 minutes; and/or adjusting the thermal interface material includes reducing a pressure around the thermal interface material to a pressure below ambient air pressure; and/or adjusting the thermal interface material includes reducing the heat The pressure around the interface material is between about 0.01 Torr and about 750 Torr. The method of claim 10, wherein the adjusting the thermal interface material improves the operational reliability and/or crack formation resistance of the thermal interface material during thermal cycling. The method of claim 10, wherein the thermal interface material is substantially free of cracks after exposure to a thermal cycle comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles; and/or Transferring between at least two heat transfer surfaces using the thermal interface material During thermal, the thermal interface material is substantially free of cracks after exposure to a thermal cycle comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles. The method of claim 10, wherein the method further comprises: inhibiting ambient gas from contacting the conditioned thermal interface material within about forty-eight hours or less than 48 hours of adjusting the thermal interface material; and/or adjusting The thermal interface material inhibits ambient gas from contacting the conditioned thermal interface material within about twelve hours or less. The method of claim 14, wherein inhibiting ambient gas from contacting the conditioned thermal interface material comprises sealing the conditioned thermal interface material in a container. The method of claim 10 or 11, further comprising encapsulating the conditioned thermal interface material in a container configured to inhibit ambient gas from contacting the conditioned thermal interface material. The method of claim 16, further comprising transporting the thermal interface material in the container to an end user. The method of claim 10 or claim 11, further comprising: using the conditioned thermal interface material in at least two of the thermal transfer systems within about forty-eight hours or less than 48 hours of conditioning the thermal interface material Transferring heat between the heat transfer surfaces; and/or using the conditioned thermal interface material between at least two heat transfer surfaces in the heat transfer system within about twelve hours or less than twelve hours or less of adjustment of the thermal interface material Transfer heat. The method of claim 10, wherein the thermal interface material comprises removing entrained gas from the thermal interface material by subjecting the thermal interface material to a reduced pressure adjustment. The method of claim 10, wherein the method further comprises installing the thermal interface material to a thermal transfer system, and wherein the thermal interface material is adjusted by subjecting the thermal interface material to reduced pressure comprising: installing the heat Adjusting the thermal interface material prior to the interface material to the thermal transfer system; or adjusting the thermal interface material while installing the thermal interface material to the thermal transfer system; or adjusting the heat after installing the thermal interface material to the thermal transfer system Interface material. A thermal interface material processed according to the method of claim 10 or 11 of the patent application. a thermal interface material adapted to fill a gap between at least two surfaces to transfer heat between the at least two surfaces, the thermal interface material comprising: a substrate; and thermally conductive particles dispersed within the substrate; Wherein the thermal interface material is adjusted under reduced pressure; and/or wherein the thermal interface material is configured such that during the first time period, the gap between the at least two surfaces is filled with the thermal interface material, the heat The interface material is exposed to a thermal cycle between about -20 degrees Celsius and a temperature of about 160 degrees Celsius for at least about 10 cycles. Thereafter, the thermal interface material will be substantially free of cracks; and during the second time period, the thermal interface material is exposed to ambient air for at least about eight hours, during filling of the gap between the at least two surfaces using the thermal interface material, After the thermal interface material is exposed to a thermal cycle between about -20 degrees Celsius and a temperature of about 160 degrees Celsius for at least about 10 cycles, the thermal interface material will exhibit crack formation.