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TW201303058A - 彈性體黏合物及脫膠方法 - Google Patents

彈性體黏合物及脫膠方法 Download PDF

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TW201303058A
TW201303058A TW101116329A TW101116329A TW201303058A TW 201303058 A TW201303058 A TW 201303058A TW 101116329 A TW101116329 A TW 101116329A TW 101116329 A TW101116329 A TW 101116329A TW 201303058 A TW201303058 A TW 201303058A
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substrate
layer
elastomer
metallization
debonding
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雷恩Ａ 史卡堤納
韋恩Ｒ 辛普森
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熱傳科技股份有限公司
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Abstract

本發明係關於一種諸如濺鍍標靶組件或靜電夾盤之物品，其包括第一基板；黏著至第一基板表面之金屬化層；第二基板；及位於金屬化層與第二基板之間的彈性體層。在另一具體例中，將脫膠層，諸如焊料材料，置於彈性體層與第二基板之間，以使物品在使用後可藉由將物品加熱至大約脫膠層之熔點而分離。

Description

彈性體黏合物及脫膠方法
本發明係關於一種如濺鍍標靶組件、蓮蓬頭電極或靜電夾盤之物品，其包括第一基板、第二基板、金屬化層、彈性體層及脫膠層。本發明亦有關於將物品加熱至脫膠層之熔點而使第一基板與第二基板分離之方法。
技藝中熟知使用彈性體材料來將組件附著在一起，尤其係在半導體製造工業中。舉例來說，美國專利第6,194,322號描述一種使用彈性體黏合至支撐元件之使用於電漿反應室中的電極。類似地，美國公開專利申請案號US 2006/0272941 A1(2006年12月7日公開)描述一種製造大面積濺鍍標靶組件之方法，其中利用彈性體將濺鍍標靶固持於背襯板。關於發展新穎的半導體製程，需要改良彈性體黏合技術。
簡言之，本發明包括一種諸如濺鍍標靶組件、蓮蓬頭電極或靜電夾盤之物品，其包括第一基板；黏著至第一基板表面之金屬化層；第二基板；及位於金屬化層與第二基板之間的彈性體層。使用金屬化層改良第一基板與彈性體層之間的黏合。
在另一具體例中，在彈性體層與第二基板之間設置脫膠層，以使物品在使用後可藉由將物品加熱至大約脫膠層之熔 點而分離。一般而言，脫膠層包含具在75至250℃範圍內之熔點的材料。用於脫膠層46中之較佳材料係焊料材料，諸如銦、錫、鉍、及含有此等材料之焊料合金。
圖1說明物品10，其包括基板14、金屬化層18、彈性體層22及基板26。在許多情況中，基板14及26必需在將基板14及26固持在一起之一或多個層中無間隙地強烈黏合在一起。該等間隙會，例如，減弱黏合，或在基板14及26之間提供用於發生電弧或供氣體或流體通過的路徑。
在本發明，基板14包括基於某些理由無法直接與彈性體層22形成令人滿意之黏合的材料。無法令人滿意的黏合可由基板14與彈性體層22之間的不充分黏著、在基板14與彈性體層22之間形成間隙、或由其他原因所導致。為改良基板14與彈性體層22之間的黏合品質，將金屬化層18插置於基板14與彈性體層22之間。
在一較佳具體例中，在將基板14及26黏合在一起之前，將金屬化層18施加至基板14之表面。接著在金屬化層18(其現為基板14之部分)與基板26之間施加彈性體層22。使彈性體在物品10準備供使用之前固化。
基板14可包括不會直接與彈性體層22形成令人滿意的黏合且可供任何目的使用的任何材料。舉例來說，可用作基板14的代表性材料包括金或陶瓷材料。於形成物品10後，基 板14之代表性功能包括濺鍍標靶、蓮蓬頭電極及靜電夾盤。
金屬化層18可包括許多金屬，諸如鋁、鈦、鉻、鎳、銅或焊料材料，諸如銦、錫、鉍、及含有此等材料之焊料合金。金屬化層18可藉由任何適當技術施加至基板14，諸如濺鍍、電鍍陽極處理或超音波濕潤。
彈性體層22可包括許多類型的彈性體。一般而言，彈性體係具有彈性性質的物質(較佳為聚合物)。可用於彈性體層22中之較佳類型的彈性體包括聚矽氧彈性體或聚(二甲基矽氧烷)彈性體，諸如由Dow Corning銷售之Sylgard® 184商標之聚矽氧彈性體。聚(二甲基矽氧烷)彈性體(PDMS)係包括Si-O-Si主鏈，且各矽原子帶有兩個甲基(Me)的聚矽氧彈性體。PDMS典型上係以(Me2SiO)n表示。
可用於彈性體層22中之其他類型的彈性體係稱為FKM(亦稱為FPM)的氟彈性體及稱為FFKM(亦稱為FFPM)的全氟彈性體。FKM係含有二氟亞乙烯(CH2=CF2)之單體單元及共單體(諸如六氟丙烯(HFP)、四氟乙烯(TFE)、全氟甲基乙烯基醚(PMVE)、丙烯或乙烯)的共聚物。FKM具有極佳的耐熱性及耐化學劑性，且係以諸如VitonTM、Dai-ElTM、DyneonTM及TecnoflonTM之註冊商標商業銷售。
FFKM係包含四氟乙烯(CF2=CF2)，及通常為PMVE及另一單體之三元共聚物。由於FFKM係高度氟化的聚合物，因而其具有異常良好的耐化學劑性以及FKM之彈性性質。 FFKM係以諸如ChemrazTM及KalrezTM之註冊商標商業銷售。
可用作彈性體層22之其他類型的適宜彈性體包括聚醯亞胺、聚酮、聚醚酮、聚醚碸、聚對苯二甲酸乙二酯、及氟乙烯丙烯共聚物。亦可使用撓性環氧樹脂或橡膠。可使用的其他聚矽氧彈性體包括以General Electric RTV 31及General Electric RTV 615商標聚矽氧彈性體銷售之產品。
基板26可包括直接與彈性體層22黏合且可供任何目的使用的任何適宜材料。於形成物品10後，基板26之代表性功能包括背襯板及/或冷卻板。鋁係基板26之較佳材料。
在一代表性實例中，物品10係用於在需要薄膜之物體(像是半導體裝置、玻璃或其他基板)上沈積薄膜的濺鍍標靶組件。基板14係包含金之濺鍍標靶，金屬化層18包含經由濺鍍施加至基板層14之背側的鈦及鋁。彈性體層22包含PDMS彈性體，諸如由Dow Corning以產品名稱/標示Sylgard® 184銷售之彈性體。基板26係包含銅之背襯板，其於使用期間經水冷卻。使用金屬化層18改良與彈性體層22之黏合，以致在濺鍍過程期間不會在基板14及26之間發生脫層。
可在基板14與基板26之間使用任何適當程序施加彈性體層22中之PDMS彈性體。舉例來說，美國公開專利申請案號US 2006/0272941 A1(2006年12月7日公開)(將其併入 本文為參考資料)描述可如何使用包含Sylgard® 184之彈性體層將濺鍍標靶附著至背襯板。在本發明之一代表性具體例中，彈性體層22中之Sylgard® 184 PDMS彈性體係使用以下程序施加於金屬化層18與基板26之間： 將即將與彈性體層22接觸之金屬化層18及基板26之表面塗上底塗料，以促進彈性體與層18之黏著，諸如藉由用Dow Corning Primer 1200或類似化學品塗布表面。此時，將一片銅網(即銅篩網)塗上底塗料，例如藉由用Dow Corning Primer 1200或類似化學品塗布銅網表面。將銅網切割成適當尺寸，以使其於長度及寬度方向上較基板14短大約0.100英吋。
於容許底塗料乾燥的建議等待時間後，根據製造商的指示混合Sylgard® 184。將鋁粉末填料以彈性體之A組分(Sylgard® 184)之1：1重量比添加至彈性體。將彈性體/鋁粉末混合物徹底混合並於真空脫氣室中脫氣，以移除氣泡。然後將彈性體混合物均勻施加至先前經上底塗料之金屬化層18及基板26的表面。
然後將該片經上底塗料之銅網置於覆蓋基板26之彈性體上。接著將基板14置於基板26上，使塗布於金屬化層18上之彈性體與塗布於基板26上之彈性體接觸。對基板14施加壓力，以當彈性體固化時將物品10固持在一起，諸如藉由重量或夾壓於基板14上施加每平方英吋4磅力(PSI)。 然後對物品10施加熱，以使彈性體固化。一般而言，使彈性體固化所需之條件(諸如溫度及時間)係由彈性體之製造商所指示。於彈性體固化後，移除壓力，且彈性體黏合充分強而可於電漿環境(諸如存在於電漿蝕刻室中之環境)中將物品10固持在一起。
鋁粉末及插入至彈性體層中之該片銅網的用途係利於熱自基板14轉移至基板26。在一些具體例中，不需要銅網及/或鋁粉末且可免去此等組分中之一或兩者。
在一具體例中，本發明係一種包括下列組件之物品：第一基板(諸如基板14)；黏著至第一基板表面的金屬化層(諸如金屬化層18)；第二基板(諸如基板26)；及位於金屬化層與第二基板之間的彈性體層(諸如彈性體層22)。第一基板及第二基板係藉由彈性體層固持在一起，而無需額外的附著構件來將第一基板及第二基板固持在一起。彈性體層具足夠強度，而可於電漿環境(諸如存在於電漿蝕刻室中之環境)中將第一基板及第二基板固持在一起。
參照圖1，在許多情況中，在形成物品10後的一些時候，需要將基板14及26分開(即使物品10脫膠)。可能需要脫膠來更換或修復基板14或26中之一者或用於一些其他原因。然而，由於用於彈性體層22中之彈性體具有相當高的失效點(例如>250℃)，因此經常不希望將物品10加熱至高達彈性體會失效的溫度，因高溫會損壞基板14或26中之一 或兩者。此問題的一種解決辦法說明於圖2。
圖2說明物品30，其包括基板34、金屬化層38、彈性體層42、脫膠層46及基板50。在一些具體例中，將濕潤或金屬化層54置於基板50與脫膠層46之間，以幫助脫膠層46更佳地黏著至基板50。然而，層54的使用係視需要而定。使用脫膠層46提供一種使基板34及50脫膠之方法，意謂可使基板34及50彼此分離。在一較佳具體例中，脫膠層46包括具有甚低熔點之材料。由於使用於脫膠層46中之材料在低於彈性體層42之溫度(例如75至250℃)下熔融，因而物品30可藉由加熱至脫膠層中之材料熔融或停止將物品30固持在一起之溫度而脫膠(分開)。一旦基板34及50經分離，則可例如藉由將彈性體自基板34刮除(若需要)，而移除彈性體層42。
在圖2中，基板34係類似於先前參照圖1所述之基板14，意謂先前針對基板14所述之材料及/或功能適用於基板34。同樣地，圖2所示之金屬化層38、彈性體層42及基板50分別係類似於圖1所示之金屬化層18、彈性體層22及基板26。
脫膠層46包含任何適宜的低熔點材料，且較佳具有在75至250℃範圍內，及更佳在75至232℃範圍內之熔點。然而，用於脫膠層46中之較佳材料係焊料材料。可使用任何適宜的焊料材料，但諸如銦、錫、鉍、及含有此等材料之焊料合 金的焊料材料對使用於脫膠層46中為較佳。
在一代表性實例中，物品30為靜電夾盤組件。基板34包括在加工期間用於將半導體晶圓固持於定位之靜電夾盤(ESC)。靜電夾盤包括諸如氧化鋁之陶瓷材料。金屬化層38包含經由濺鍍施加至基板34之背側的鈦及鋁。脫膠層46包含錫及彈性體層42包含PDMS彈性體，諸如由Dow Corning以產品名稱/標示Sylgard® 184銷售之彈性體。基板50係包含鋁之冷卻板。使用金屬化層38改良基板34與彈性體層42之間的黏合。濕潤層54包含錫且有助於將脫膠層46黏著至基板50。脫膠層46使基板34可藉由將物品30加熱至不會損壞基板34及/或50之溫度而與基板50分離。
物品30係使用以下程序組裝：經由濺鍍將金屬化層38(鈦及鋁)施加至基板34(ESC)之背側表面。經由超音波濕潤將濕潤層54(錫)施加至基板50(鋁)之背側表面。超音波濕潤意謂使用傳送超音波能量之工具在熔融錫經展布的同時將一薄層的熔融錫均勻展布於基板50之表面上。濕潤層54亦可經由濺鍍或電鍍來施加。
在濕潤層54凝固後，經由將基板50加熱至高於錫之熔點(大約232℃)的溫度來將脫膠層46施加於濕潤層54之頂部。隨後將熔融錫展布於濕潤層54上，以形成較佳具有大約0.001英吋(0.254毫米)之厚度的薄錫層。經由將過剩的熔融錫拭去來移除過量錫。或者，已凝固的過量錫可經由將過 量錫機器加工除去而移除。
於將脫膠層46形成於基板50上之後，使用類似於先前針對物品10中之彈性體層22所述之程序來形成彈性體層42。明確言之，將即將與彈性體層42接觸之金屬化層38及脫膠層46之表面塗上底塗料以促進黏著，諸如藉由用Dow Corning Primer 1200或類似化學品塗布表面。亦將一片銅網塗上底塗料，例如藉由用Dow Corning Primer 1200或類似化學品塗布銅網表面。
於容許底塗料乾燥的建議等待時間後，根據製造商的指示混合Sylgard® 184。將鋁粉末填料以彈性體之A組分(Sylgard® 184)之1：1重量比添加至彈性體。將彈性體/鋁粉末混合物徹底混合並脫氣，且將彈性體混合物均勻施加至金屬化層38及脫膠層46的表面。
然後將該片經上底塗料之銅網置於覆蓋脫膠層46之彈性體上。將基板34置於基板50上，使塗布於金屬化層38上之彈性體與塗布於脫膠層46上之彈性體接觸。對基板34施加壓力，以當彈性體固化時將物品30固持在一起，諸如藉由重量或夾壓於基板34上施加每平方英吋4磅力(PSI)。然後對物品10施加熱，以使彈性體固化。於彈性體固化後，移除壓力，且彈性體黏合充分強而可不利用其他附著構件(諸如機械扣件)將物品30固持在一起。
在一具體例中，本發明係一種包括下列組件之物品(諸如 物品30)：第一基板(諸如基板34)；黏著至第一基板之表面的金屬化層(諸如金屬化層38)；鄰接於金屬化層設置之彈性體層(諸如彈性體層42)；第二基板(諸如基板50)；及位於彈性體層與第二基板之間的脫膠層(諸如脫膠層46)。脫膠層包含在不會導致損壞第一基板及/或第二基板之溫度下熔融的材料。第一基板及第二基板係藉由彈性體層及脫膠層固持在一起，而未使用其他附著構件(諸如機械扣件)。可用於彈性體層中之較佳類型的彈性體包括聚矽氧彈性體及聚(二甲基矽氧烷)彈性體。可用於彈性體層中之其他類型的彈性體係稱為FKM的氟彈性體及稱為FFKM的全氟彈性體。
在另一具體例中，物品30可包括列於以上段落中之組件，且亦包括位於第二基板與脫膠層之間的濕潤或金屬化層，諸如層54。在另一具體例中，物品30可包括列於以上段落中之組件，但無金屬化層38。此一具體例亦可包括濕潤層54。在基板34及彈性體層42彼此形成可接受黏合的情況中，可免去金屬化層38。
一種使用上述發明之方法包括藉由以下步驟使物品(諸如物品30)脫膠：加熱包括下列組件之物品直至脫膠層軟化：第一基板(諸如基板34)；黏著至第一基板之表面的金屬化層(諸如金屬化層38)；鄰接於金屬化層設置之彈性體層(諸如彈性體層42)；第二基板(諸如基板50)；及位於彈性體層與第二基板之間的脫膠層(諸如脫膠層46)；然後使第一基板與 第二基板分離。
分離較佳係於脫膠層之部位處發生，儘管脫膠層係自彈性體層42或自第二基板分離並無關緊要。此外，物品經加熱至以引起脫膠之溫度較佳係低於250℃，及更佳係低於或等於232℃。一般將物品加熱至脫膠層之熔點，以使第一及第二基板分離。然而，第一及第二基板可在脫膠層經充分軟化時分離，即使其較熔點低數度(例如1-3℃)。脫膠層較佳包括選自由銦、錫、鉍及銦、錫或鉍之合金所組成之群之焊料材料。純鉍具有大約271℃之熔點，其稍高於250℃之較佳最大值。然而，在一些情況中，諸如當稍高溫將不會損壞第一基板及/或第二基板時，可使用在稍高於250℃下熔融之材料(例如，鉍)作為脫膠層。此外，鉍合金在低於250℃之溫度下熔融。
雖然本發明已就目前較佳的具體例作說明，但應明瞭不應將該揭示內容解釋為具限制性。熟悉技藝人士於閱讀以上揭示內容後無疑地當明瞭各種變化及修改。因此，隨附申請專利範圍意欲詮釋為涵蓋屬於本發明之真實範疇內的所有變化及修改。
10‧‧‧物品
14‧‧‧基板
18‧‧‧金屬化層
22‧‧‧彈性體層
26‧‧‧基板
30‧‧‧物品
34‧‧‧基板
38‧‧‧金屬化層
42‧‧‧彈性體層
46‧‧‧脫膠層
50‧‧‧基板
54‧‧‧濕潤或金屬化層
圖1係根據本發明之彈性體黏合物的橫剖面圖；及圖2係根據本發明之包括脫膠層之彈性體黏合物的橫剖面圖。
30‧‧‧物品
34‧‧‧基板
38‧‧‧金屬化層
42‧‧‧彈性體層
46‧‧‧脫膠層
50‧‧‧基板
54‧‧‧濕潤或金屬化層

Claims (16)

  1. 一種裝置，其包括：第一基板；黏著至第一基板表面之金屬化層；第二基板；及位於金屬化層與第二基板之間的彈性體層，其中該彈性體層具足夠強度來將第一基板及第二基板固持在一起，而無需額外的附著構件來將第一基板及第二基板固持在一起。
  2. 如申請專利範圍第1項之裝置，其中，該第一基板包含金。
  3. 如申請專利範圍第1項之裝置，其中，該金屬化層包含鈦。
  4. 如申請專利範圍第1項之裝置，其中，該彈性體層包含PDMS彈性體。
  5. 如申請專利範圍第1項之裝置，其中，該第一基板包括包含金之濺鍍標靶，該金屬化層包含鈦及鋁，及該彈性體層包含PDMS彈性體。
  6. 一種裝置，其包括：第一基板；黏著至第一基板表面之金屬化層；第二基板；鄰接於金屬化層設置之彈性體層，其中該彈性體層具足夠 強度來將第一基板及第二基板固持在一起，而無需額外的附著構件來將第一基板及第二基板固持在一起；及位於彈性體層與第二基板之間的脫膠層，其中該脫膠層在不會導致損壞第一基板之溫度下熔融。
  7. 如申請專利範圍第6項之裝置，其中，該脫膠層包含在75至250℃之溫度範圍內熔融之材料。
  8. 如申請專利範圍第6項之裝置，其中，該脫膠層包含選自由銦、錫、鉍及銦、錫或鉍之合金所組成之群之材料。
  9. 如申請專利範圍第6項之裝置，其中，該彈性體層包含PDMS彈性體。
  10. 如申請專利範圍第6項之裝置，其中，該第一基板包含陶瓷材料。
  11. 如申請專利範圍第6項之裝置，其中，該金屬化層包含鈦。
  12. 如申請專利範圍第6項之裝置，其進一步包含置於脫膠層與第二基板之間，用於幫助脫膠層黏著至第二基板的濕潤層。
  13. 一種使第一基板與第二基板分離之方法，其包括：加熱包括下列組件之物品直至脫膠層軟化：第一基板，黏著至第一基板表面的金屬化層，鄰接於金屬化層設置之彈性體層，第二基板及位於彈性體層與第二基板之間的脫膠層；及 使第二基板與第一基板分離。
  14. 如申請專利範圍第13項之方法，其中，該脫膠層具有在75至250℃之範圍內的熔點。
  15. 如申請專利範圍第14項之方法，其中，該物品係被加熱至該脫膠層之熔點。
  16. 如申請專利範圍第13項之方法，其中，該脫膠層包含選自由銦、錫、鉍及銦、錫或鉍之合金所組成之群之焊料材料。
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US20150004400A1 (en) * 2013-06-28 2015-01-01 Watlow Electric Manufacturing Company Support assembly for use in semiconductor manufacturing tools with a fusible bond
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US6171705B1 (en) * 1997-02-10 2001-01-09 Dofasco, Inc. Structural panel and method of manufacture
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