TW201301304A - Wire and manufacturing method thereof and lighting module using the same - Google Patents

Abstract

A wire, a manufacturing method thereof and a lighting module using the same are provided. The wire is used for being connected to a lighting component and a substrate. The lighting component is disposed on the substrate. The wire includes a core and a light reflecting layer. The light reflecting layer covers the core.

Description

Wire, manufacturing method thereof and lighting module using same

The present invention relates to a wire, a manufacturing method thereof, and a lighting module using the same, and more particularly to a wire for being disposed in a light emitting module, a manufacturing method thereof, and a lighting module using the same.

In general, the lighting module is applied to various electronic devices or lighting devices to provide light. In the case that the light-emitting module comprises a substrate, a light source and a wire, the wire is connected to the substrate and the light source, so that the substrate can transmit the power signal to the light source via the wire. In this way, the light source receives the power signal to generate light. However, since the wire is connected to the light source and is relatively adjacent to the light source, the wire may be tied to the traveling light path of the light generated by the light source. That is to say, the light generated by the illuminating source is quite likely to be projected onto the wire. Once the light generated by the illuminating source is projected onto the wire, the light is absorbed by the wire and affects the amount of light emitted by the illuminating module. Therefore, how to provide a light-emitting module that can avoid the influence of the amount of light emitted by the wire is one of the subjects of the related industry.

The invention relates to a wire, a manufacturing method thereof and a lighting module using the same, which reflect light through a configuration of a light reflecting layer to reduce the absorption of light by the wire. In this way, the amount of light emitted by the light-emitting module can be correspondingly increased.

According to a first aspect of the present invention, a wire is provided for connecting a light emitting element and a substrate. The light emitting element is disposed on the substrate. The wire includes a core material and a light reflecting layer. The light reflecting layer covers the core material.

According to a second aspect of the present invention, a lighting module includes a substrate, a light emitting component, and a wire. The light emitting element is disposed on the substrate. Both ends of the wire are respectively connected to the substrate and the light emitting element. The wire includes a core material and a light reflecting layer. The light reflecting layer covers the core material.

According to a third aspect of the invention, a method of manufacturing a wire is provided, comprising the following steps. One end of a core material is connected to a light-emitting element. Next, a light reflecting layer is formed to cover the core material to form a wire.

In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

First embodiment

Referring to FIG. 1, there is shown a cross-sectional view of a wire according to a first embodiment of the present invention. The wire 110 of this embodiment is used to connect the light emitting element and the substrate. The light-emitting element is, for example, disposed on a substrate, and may be a light-emitting chip or a light-emitting diode. The wire 110 includes a core material 111 and a light reflecting layer 113. The light reflecting layer 113 covers the core material 111.

In the present embodiment, the light reflecting layer 113 may be made of, for example, a dielectric reflective material, an organic diffusive reflective material, an inorganic material, a mixture, or a plastic. The dielectric reflective material may be, for example, calcium titanate (CaTiO ₃ ), magnesium titanate (2MgO‧TiO ₂ ), barium titanate (BaTiO ₃ ). The organic diffusion reflective material may be, for example, a polyimine (PI), a polyamidimide (PAI), or a polyetheretherketone (PEEK) based on a high performance resin. The inorganic material may be, for example, titanium dioxide (TiO ₂ ), cerium oxide (SiO ₂ ), aluminum nitride (AlN) or magnesium oxide ‧ aluminum oxide (MgO‧Al ₂ O ₃ ). The mixture can be, for example, a combination of an organic diffuse reflective material and an inorganic material. The plastic may be, for example, polyethylene (PE), polytetrafluoroethylene (PTFE) or polycarbonate (PC).

Referring to FIG. 2, a schematic diagram of a light emitting module to which the wires of FIG. 1 are applied is shown. The light emitting module 100 includes the aforementioned wire 110, the substrate 120, and the light emitting element 130. The light emitting element 130 is disposed on the substrate 120. Both ends of the wire 110 are connected to the substrate 120 and the light emitting element 130, respectively. The structure of the wire 110 has been mentioned in the foregoing, and the description thereof will not be repeated here.

In the case of a light-emitting module using a general wire, the light generated by the light-emitting source of the light-emitting module may be projected onto the wire and absorbed by the wire. In this way, although the wire only absorbs part of the light, the amount of light emitted by the light-emitting module is still affected and reduced. In contrast, since the wire 110 of the present embodiment includes the light reflecting layer 113, even if the light generated by the light emitting element 130 is projected onto the wire 110, the light reflecting layer 113 of the wire 110 can reflect the light to effectively improve the light emitting mode. The amount of light emitted by group 100.

Hereinafter, a method of manufacturing a lead wire will be described by taking the lead wire 110 in Figs. 1 and 2 as an example. Please refer to FIG. 3 and FIG. 4A to FIG. 4C. FIG. 3 is a flow chart showing a method for manufacturing a wire according to a first embodiment of the present invention, and FIGS. 4A-4C illustrate the application of a porcelain nozzle to perform the third figure. Schematic diagram of the process steps.

The manufacturing method of the wire 110 of the present embodiment includes the following steps, and the following steps are performed, for example, with the porcelain nozzle 500.

In step S301, as shown in FIG. 4A, one end of the core material 111 is connected to the light-emitting element 130 by the porcelain nozzle 500.

Next, in step S303, as shown in FIG. 4B, the light reflecting layer 113 is formed by the porcelain nozzle 500 to cover the core material 111 to form the wire 110.

Then, in step S305, as shown in FIG. 4C, the other end of the core material 111 is connected to the substrate 120 by the porcelain nozzle 500. The light-emitting element 130 here is disposed on the substrate 120. In the present embodiment, the step S303 of forming the light reflecting layer 113 is performed during the step S305 of connecting the other end of the core member 111 to the substrate 120. In other words, when the other end of the core material 111 is connected to the substrate 120, the light reflecting layer 113 is already formed at the periphery of the core material 111.

In the present embodiment, the step S303 of forming the light reflecting layer 113 can be performed, for example, in two ways.

One of the ways in which the step S303 of forming the light reflecting layer 113 is performed will be described below. The step S303 of forming the light reflecting layer 113 includes supplying a gas to the core material 111 such that the outside of the core material 111 reacts with the gas to form the light reflecting layer 113. In this case, the light reflecting layer 113 coats the remaining core material 111 to complete the fabrication of the wire 110.

Please refer to FIG. 5, which shows a cross-sectional view of the porcelain nozzle in FIGS. 4A-4C. The step of providing gas to the core material 111 here is performed using the porcelain nozzle 500. The porcelain mouth 500 has a first passage 510 and a second passage 520. The second channel 520 surrounds the first channel 510 and is connected to the first channel 510. When the step of supplying gas to the core material 111 is performed using the porcelain nozzle 500, the core material 111 is housed in the first passage 510, and the gas system is filled in the second passage 520. In this way, the gas is supplied to the core material 111 via the first passage 510 and the second passage 520 to communicate with each other to form the light reflecting layer 113 by reacting the gas with the outer surface of the core material 111.

Next, the material of the core material 111 is aluminum, and the gas system filled is nitrogen gas as an example. The aluminum core material 111 is housed in the first passage 510, and the nitrogen gas is filled in the second passage 520. When nitrogen gas is supplied to the core material 111 of aluminum via the first passage 510 and the second passage 520, the nitrogen gas interacts with the aluminum on the outer surface of the core material 111 to form aluminum nitride as light reflection. Layer 113. It should be understood by those of ordinary skill in the art that the gas to be filled may be other gases, or that the material of the core material 111 may be adjusted and changed as needed. For example, the gas can also be oxygen. Oxygen and metal may interact to form an oxide at a temperature of, for example, 600 ° C or lower to reflect light as the light reflecting layer 113.

Next, another manner of performing the step S303 of forming the light reflecting layer 113 will be described. The step S303 of forming the light reflecting layer 113 includes coating the light reflecting layer 113 outside the core material 111 to coat the core material 111.

The step of coating the light reflecting layer 113 here is performed by using the porcelain nozzle 500 in Fig. 5. When the step of coating the light reflecting layer 113 is performed using the porcelain mouth 500, the core material 111 is housed in the first channel 510, and the material of the light reflecting layer 113 is filled in the second channel 520. In this way, in the step of coating the light reflecting layer 113, the material of the light reflecting layer 113 is supplied to the core material 111 via the first channel 510 and the second channel 520 to cover the core material 111 and solidify. A light reflecting layer 113 is formed.

Next, the material of the filled light reflecting layer 113 is, for example, cerium oxide as an example. The core material 111 is housed in the first passage 510, and the cerium oxide is filled in the second passage 520. When the cerium oxide is supplied to the core material 111 via the first passage 510 and the second passage 520, the cerium oxide is coated on the periphery of the core material 111 and solidified as the light reflecting layer 113 as a reflection. The use of light. It will be apparent to those of ordinary skill in the art that the material being filled can be determined as desired to form a light reflecting layer 113 to reflect light.

Second embodiment

Referring to Figure 6, there is shown a cross-sectional view of a wire in accordance with a second embodiment of the present invention. Compared with the first embodiment, the wire 210 of the embodiment further includes an adhesion layer 215. The adhesion layer 215 is disposed between the core material 111 and the light reflection layer 113 to allow the light reflection layer 113 to be more firmly coated on the periphery of the core material 111. The material of the adhesion layer 215 may be a synthetic resin such as Silicone, Acrylate Resin or Epoxy. In this way, when the wire 210 of the embodiment is applied to the light emitting module, and the light generated by the light emitting element of the light emitting module is projected onto the wire 210, the light reflecting layer 113 of the wire 210 can reflect the light to effectively improve the light. The amount of light emitted by the light-emitting module.

Compared with the manufacturing method of the wire of the first embodiment, the manufacturing method of the wire 210 of the present embodiment further includes the step of forming the adhesion layer 215 to cover the core material 111 such that the adhesion layer 215 is located at the core material 111 and the light reflection layer 113. between. In other words, the step of applying the adhesion layer 215 is performed before the step of forming the light reflection layer 113.

The step of forming the adhesion layer 215 includes coating the adhesion layer 215 outside the core material 111, and the step of forming the light reflection layer 113 can be accomplished in two ways as described in the first embodiment.

Referring to FIG. 7, a cross-sectional view of a porcelain nozzle applied to a step of forming an adhesion layer and a light reflection layer according to a second embodiment of the present invention is shown. In the present embodiment, the step of applying the adhesion layer 215 and the step of forming the light reflection layer 113 may all be performed using the porcelain nozzle 600. The porcelain mouth 600 has a first passage 610, a second passage 620, and a third passage 630. The second channel 620 surrounds the third channel 630 and the first channel 610, and the third channel 630 surrounds the first channel 610. The first channel 610 is in communication with the third channel 630 and the third channel 630 is in communication with the second channel 620. When the step of coating the adhesion layer 215 and the step of forming the light reflection layer 113 are performed by using the porcelain nozzle 600, the core material 111 is accommodated in the first channel 610, and the material of the adhesion layer 215 is filled in the third channel 630. The material of the light reflecting layer 113 is filled in the second channel 620. As a result, the material of the adhesion layer 215 is provided to the core material 111 via the third channel 630 and the first channel 610, and the material of the light reflection layer 113 communicates with the third channel 630 via the second channel 620. The adhesion layer 215 is provided to form the light reflection layer 113.

Although the above embodiments are described by taking a light reflecting layer only as an example, it should be understood by those skilled in the art that the wire may also include a plurality of light reflecting layers to improve the efficiency of light reflection and to be disposed in the light emitting mode. The amount of light is correspondingly increased in the group.

The wire according to the above embodiment of the present invention, the method of manufacturing the same, and the light-emitting module using the same, transmit light through the arrangement of the light reflecting layer to reduce the absorption of light by the wire. In this way, the amount of light emitted by the light-emitting module can be correspondingly increased.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100. . . Light module

110, 210. . . wire

111. . . Core

113. . . Light reflection layer

120. . . Substrate

130. . . Light-emitting element

215. . . Adhesion layer

500, 600. . . Porcelain mouth

510, 610. . . First channel

512, 613, 623. . . Connection

520. . . Second channel

630. . . Third channel

S301~S303. . . Process step

Fig. 1 is a cross-sectional view showing a wire according to a first embodiment of the present invention.

Fig. 2 is a schematic view showing a lighting module to which the wires of Fig. 1 are applied.

3 is a flow chart showing a method of manufacturing a wire according to a first embodiment of the present invention.

4A-4C are schematic views showing the application of the porcelain nozzle to perform the flow steps in FIG.

Fig. 5 is a cross-sectional view showing the porcelain nozzle of Figs. 4A to 4C.

Figure 6 is a cross-sectional view showing a wire according to a second embodiment of the present invention.

Fig. 7 is a cross-sectional view showing a porcelain nozzle applied to a step of forming an adhesion layer and a light reflection layer according to a second embodiment of the present invention.

110. . . wire

111. . . Core

113. . . Light reflection layer

Claims (23)

A wire for connecting a light-emitting element and a substrate, the light-emitting element being disposed on the substrate, the wire comprising: a core material; and a light reflecting layer covering the core material. The wire of claim 1, further comprising: an adhesive layer disposed between the core material and the light reflecting layer. The wire of claim 1, wherein the light reflecting layer is made of a dielectric reflective material, an organic diffusive reflective material, an inorganic material, a mixture or a plastic. The lead wire according to claim 3, wherein the dielectric reflective material is calcium titanate (CaTiO ₃ ), magnesium titanate (2MgO‧TiO ₂ ) or barium titanate (BaTiO ₃ ). The wire according to claim 3, wherein the organic diffuse reflection material is a resin-based polyimine (PI), polyamidimide (PAI) or polyetheretherketone (PEEK). . A light emitting module includes: a substrate; a light emitting element disposed on the substrate; and a wire having two ends connected to the substrate and the light emitting element, the wire comprising: a core material; and a light reflecting layer Covering the core material. The illuminating module of claim 6, wherein the wire further comprises: an adhesive layer disposed between the core material and the light reflecting layer. The illuminating module of claim 6, wherein the light reflecting layer is made of a dielectric reflective material, an organic diffusive reflective material, an inorganic material, a mixture or a plastic. The light-emitting module of claim 8, wherein the dielectric reflective material is calcium titanate (CaTiO ₃ ), magnesium titanate (2MgO‧TiO ₂ ) or barium titanate (BaTiO ₃ ). The light-emitting module of claim 8, wherein the organic diffusion-reflecting material is a resin-based polyimine (PI), polyamidimide (PAI) or polyetheretherketone ( PEEK). The light-emitting module of claim 6, wherein the light-emitting element is a light-emitting chip or a light-emitting diode. A method of manufacturing a wire comprising: connecting one end of a core material to a light-emitting element; and forming a light-reflecting layer to cover the core material to form a wire. The method for manufacturing a wire according to claim 12, further comprising: connecting the other end of the core material to a substrate, wherein the light emitting element is disposed on the substrate; wherein, at the other end of the core material This step of forming the light reflecting layer is performed during this step of the substrate. The method for manufacturing a wire according to claim 13, wherein the step of forming the light reflecting layer comprises: providing a gas to the core material such that an outer portion of the core material reacts with the gas to form the light reflecting layer The light reflecting layer coats the remaining core material. The method of manufacturing a wire according to claim 14, wherein the step of providing the gas to the core material and the step of connecting the other end of the core material to the substrate are performed using a porcelain nozzle. The manufacturing method of the wire according to claim 15, wherein the porcelain nozzle has a first passage and a second passage, and the second passage surrounds the first passage and communicates with the first passage. The core material is housed in the first passage, and the gas system is filled in the second passage. In the step of supplying the gas to the core material, the gas communicates with the second passage via the first passage Provided to the core material. The method of manufacturing a wire according to claim 13, wherein the step of forming the light reflecting layer comprises: coating the light reflecting layer outside the core material to coat the core material. The method of manufacturing a wire according to claim 17, wherein the step of coating the light reflecting layer and the step of connecting the other end of the core to the substrate are performed using a porcelain nozzle. The manufacturing method of the wire according to claim 18, wherein the porcelain nozzle has a first passage and a second passage, and the second passage surrounds the first passage and communicates with the first passage. The core material is disposed in the first channel, and the material of the light reflecting layer is filled in the second channel. In the step of coating the light reflecting layer, the material of the light reflecting layer passes through the first channel Provided to the core material in communication with the second passage. The method for manufacturing a wire according to claim 12, further comprising: forming an adhesion layer to cover the core material such that the adhesion layer is located between the core material and the light reflection layer. The method for manufacturing a wire according to claim 20, wherein the step of forming the adhesion layer comprises: coating the adhesion layer outside the core material. The method of manufacturing a wire according to claim 21, wherein the step of coating the adhesion layer is performed before the step of forming the light reflection layer. The method for manufacturing a wire according to claim 21, wherein the step of coating the adhesion layer is performed by using a porcelain nozzle having a first passage, a second passage and a third passage. The second channel surrounds the third channel and the first channel, the third channel surrounds the first channel, the first channel is connected to the third channel, and the third channel is connected to the second channel a channel, the core material is disposed in the first channel, and the material of the adhesion layer is filled in the third channel, and in the step of coating the adhesion layer, the material of the adhesion layer is via the third channel Providing the first channel to the core material, the material of the light reflecting layer is filled in the second channel, in the step of forming the light reflecting layer, the material of the light reflecting layer is via the second channel The third channels are provided to the adhesion layer in communication with each other.