TW201308897A - Control circuit of electronic apparatus and display apparatus - Google Patents
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本發明是有關於一種電子裝置的控制電路,且特別是有關於一種可應用於不同介面的顯示裝置的控制電路。The present invention relates to a control circuit for an electronic device, and more particularly to a control circuit for a display device that can be applied to different interfaces.
在習知的技術領域中,多種不同介面的電子裝置所採用的控制電路,其基本架構是相類似而僅存在些微的差異。為了使這些不同介面的電子裝置都可以有效的動作,在習知的技術領域中,最簡單的就是針對每一種介面的電子裝置,都各別設計一套控制電路來配合使用。然而,這種作法需要很多的備料來因應不同介面的電子裝置,在使用上及管理上都很困難。In the conventional technical field, the basic architecture of the control circuits employed by the electronic devices of a plurality of different interfaces is similar and there are only slight differences. In order to enable these different interface electronic devices to operate effectively, in the conventional technical field, the simplest is to design a set of control circuits for each interface electronic device. However, this method requires a lot of preparation to respond to electronic devices of different interfaces, which is difficult to use and manage.
以顯示裝置的電子裝置為範例,在現今技術領域中,常見的液晶顯示裝置的控制介面包括紅、藍及綠(Red,Green and Blue,RGB)控制介面、手機夥伴計畫(Mobile Phone Partnership Initiative,MPPI)傳輸介面、行動顯示數位介面(Mobile Display Digital Interface,MDDI)以及行動產業處理器介面(Mobile Industry Processor Interface,MIPI)等。以行動顯示數位介面為範例,行動顯示數位介面是一種高速的數位資料傳輸介面,通常用在摺疊式手機上以進行其兩個主體間的資料傳輸。行動顯示數位介面傳輸速率最高可達每秒3.2 Gbit,並有效降低所屬裝置的控制器及顯示模組間的信號線的連接數量。Taking the electronic device of the display device as an example, in the current technical field, the control interface of a common liquid crystal display device includes a red, green and blue (RGB) control interface, and a mobile phone partnership initiative (Mobile Phone Partnership Initiative). , MPPI) transmission interface, mobile display digital interface (MDDI) and mobile industry processor interface (MIPI). Taking the mobile display digital interface as an example, the mobile display digital interface is a high-speed digital data transmission interface, which is usually used on a folding mobile phone for data transmission between two subjects. The action display digital interface transmission rate of up to 3.2 Gbits per second, and effectively reduce the number of signal lines connected between the controller and display module of the device.
請注意,上述的多種傳輸介面由於所需要的傳輸信號的數量不相同,因此,上述的傳輸介面與其所屬的顯示裝置的控制電路進行連接的連接器的腳位數量並不相同。也因此,在習知的技術領域中,僅能將利用不同傳輸介面的各種顯示裝置分別設計一種控制電路,造成了備料以及組裝上的複雜度。Please note that the above various transmission interfaces are different in the number of transmission signals required. Therefore, the number of pins of the connector in which the above-mentioned transmission interface is connected to the control circuit of the display device to which it belongs is not the same. Therefore, in the prior art, only a variety of display devices using different transmission interfaces can be separately designed with one control circuit, resulting in complexity in preparation and assembly.
本發明提供一種電子裝置的控制電路,可應用於多種不同介面的電子裝置。The invention provides a control circuit for an electronic device, which can be applied to electronic devices of various different interfaces.
本發明提供一種顯示裝置,透過連接不同腳位的連接器,來控制多種不同介面的顯示模組。The invention provides a display device for controlling display modules of a plurality of different interfaces by connecting connectors of different positions.
本發明提出一種電子裝置的控制電路,包括電路基板、多個銲墊、處理器以及導線切換器。銲墊配置在電路基板上的足跡區域內。銲墊耦接至連接器,其中,連接器傳收多個控制信號,且連接器的腳位的數量不大於銲墊的數量。處理器配置在電路基板上,連接多個信號傳收導線。導線切換器則配置在足跡區域以及處理器間,耦接銲墊以及處理器。導線切換器依據連接器的形式來選擇信號傳收導線與銲墊的連接方式。The invention provides a control circuit for an electronic device, comprising a circuit substrate, a plurality of pads, a processor and a wire switcher. The pad is disposed in a footprint area on the circuit substrate. The pad is coupled to the connector, wherein the connector transmits a plurality of control signals, and the number of pins of the connector is not greater than the number of pads. The processor is disposed on the circuit substrate and connects the plurality of signal transmission and reception wires. The wire switcher is disposed between the footprint area and the processor, coupled to the pad and the processor. The wire switcher selects the way the signal transmission wire is connected to the pad according to the form of the connector.
在本發明之一實施例中,上述之處理器接收至少一選擇信號,處理器依據選擇信號來判斷連接器的形式。In an embodiment of the invention, the processor receives at least one selection signal, and the processor determines the form of the connector according to the selection signal.
在本發明之一實施例中,其中更包括耦接至處理器的選擇信號產生器。選擇信號產生器包括至少一電阻。其中的電阻耦接至電源電壓或接地電壓,並藉以產生選擇信號的一個位元。In an embodiment of the invention, there is further included a selection signal generator coupled to the processor. The selection signal generator includes at least one resistor. The resistor is coupled to the supply voltage or the ground voltage and thereby generates a bit of the selection signal.
在本發明之一實施例中,上述之導線切換器包括多數個選擇開關。選擇開關耦接在銲墊以及信號傳收導線間,各選擇開關依據選擇信號決定各銲墊與該些信號傳收導線的連接關係。In an embodiment of the invention, the wire switcher includes a plurality of selector switches. The selection switch is coupled between the pad and the signal transmission wire, and each selection switch determines a connection relationship between each pad and the signal transmission wires according to the selection signal.
在本發明之一實施例中,上述之導線切換器包括多數個跳線器(jumper)。跳線器耦接在銲墊以及信號傳收導線間,各跳線器依據選擇信號決定各銲墊與該些信號傳收導線的連接關係。In an embodiment of the invention, the wire switcher includes a plurality of jumpers. The jumper is coupled between the pad and the signal transmission wire, and each jumper determines a connection relationship between each pad and the signal transmission wires according to the selection signal.
本發另提出一種顯示裝置。顯示裝置具有顯示模組以及連接器,且顯示模組藉由連接器傳收多個控制信號。顯示裝置包括電路基板、多數個銲墊、處理器以及導線切換器。其中,銲墊配置在電路基板上的足跡區域內,並用以耦接至連接器。連接器傳收控制信號,且連接器的腳位的數量不大於銲墊的數量。處理器配置在電路基板上,連接多個信號傳收導線。導線切換器配置在足跡區域以及處理器間,耦接銲墊以及處理器。導線切換器依據連接器的形式來選擇信號傳收導線與銲墊的連接方式The present invention further provides a display device. The display device has a display module and a connector, and the display module transmits a plurality of control signals through the connector. The display device includes a circuit substrate, a plurality of pads, a processor, and a wire switcher. The solder pad is disposed in a footprint area on the circuit substrate and is coupled to the connector. The connector transmits the control signal, and the number of pins of the connector is not greater than the number of pads. The processor is disposed on the circuit substrate and connects the plurality of signal transmission and reception wires. The wire switcher is disposed between the footprint area and the processor, coupled to the pad and the processor. The wire switcher selects the way the signal transmission wire is connected to the pad according to the form of the connector.
基於上述,本發明在電路基板上提供一個足跡區域已配置多數個銲墊以與連接器相連接,並依據所連接的連接器的型態來使導線切換器切換信號傳收導線與銲墊的連接方式,使處理器與連接器間的控制信號的傳收,可以因應連接器的型態來進行調整。如此一來,可以將固定型態的控制電路應用在不同型態(傳輸介面)的電子裝置上,不需針對不同型態的電子裝置製作不同的控制電路,有效降低產品的成本。Based on the above, the present invention provides a footprint area on the circuit substrate, and a plurality of pads are disposed to be connected to the connector, and the wire switcher switches the signal transmission wire and the pad according to the type of the connected connector. The connection method allows the transmission of control signals between the processor and the connector to be adjusted according to the type of the connector. In this way, the fixed type control circuit can be applied to different types (transmission interface) electronic devices, and different control circuits are not required for different types of electronic devices, thereby effectively reducing the cost of the product.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
以下請參照圖1,圖1繪示本發明的一實施例的電子裝置的控制電路100的示意圖。控制電路100包括電路基板110、銲墊121~12N、處理器140以及導線切換器130。銲墊121~12N配置在電路基板110上的足跡區域120中。銲墊121~12N形成一個導線架的結構,並用以提供以與用以連接電子裝置的連接器(未繪示)進行銲接,其中,連接器的腳位的數量不大於銲墊121~12N的數量。Please refer to FIG. 1 . FIG. 1 is a schematic diagram of a control circuit 100 of an electronic device according to an embodiment of the present invention. The control circuit 100 includes a circuit substrate 110, pads 121 to 12N, a processor 140, and a wire switcher 130. The pads 121 to 12N are disposed in the footprint region 120 on the circuit substrate 110. The pads 121~12N form a leadframe structure and are provided for soldering with a connector (not shown) for connecting the electronic device, wherein the number of pins of the connector is not greater than the pads 121-12N Quantity.
處理器140配置在電路基板110上,連接多數個信號傳收導線CS1~CSM以傳收控制信號,處理器140並藉由信號傳收導線CS1~CSM,並透過銲墊121~12N上的連接器與電子裝置進行多數個控制信號的傳收。導線切換器130配置在電路基板110上的足跡區域120以及處理器140間。導線切換器130耦接至銲墊121~12N並耦接至處理器140上的傳收導線CS1~CSM。導線切換器130依據與銲墊121~12N相耦接的連接器的形式來選擇信號傳收導線CS1~CSM與銲墊121~12N間的連接方式。The processor 140 is disposed on the circuit board 110, and connects a plurality of signal transmission lines CS1 to CSM to transmit control signals. The processor 140 transmits the wires CS1 to CSM through the signals and transmits the connections on the pads 121 to 12N. The device and the electronic device perform transmission of a plurality of control signals. The wire switch 130 is disposed between the footprint area 120 on the circuit substrate 110 and the processor 140. The wire switcher 130 is coupled to the pads 121-12N and coupled to the transmission wires CS1~CSM on the processor 140. The wire switcher 130 selects a connection mode between the signal transmission wires CS1 to CSM and the pads 121 to 12N according to the form of the connector coupled to the pads 121 to 12N.
具體一點來說明,各的銲墊121~12N都電性連接至少一條的信號傳收導線TS1~TSP。銲墊121~12N並透過信號傳收導線TS1~TSP連接至導線切換器130。導線切換器130則依據與銲墊121~12N相耦接的連接器的形式,來選擇信號傳收導線TS1~TSP與信號傳收導線CS1~CSM間的連接關係。也就是說,導線切換器130依據所連接的連接器的形式,來變更處理器140傳送(接收)的控制信號是來傳送至(來自於)銲墊121~12N的位置。Specifically, each of the pads 121 to 12N is electrically connected to at least one of the signal transmission wires TS1 to TSP. The pads 121 to 12N are connected to the wire switch 130 through the signal transmission wires TS1 to TSP. The wire switcher 130 selects the connection relationship between the signal transmission wires TS1~TSP and the signal transmission wires CS1~CSM according to the form of the connector coupled to the pads 121~12N. That is, the wire switcher 130 changes the control signal transmitted (received) by the processor 140 to the position of (from) the pads 121 to 12N depending on the form of the connector to be connected.
附帶一提的,本實施例中的信號傳收導線CS1~CSM與信號傳收導線TS1~TSP的數量不並要是相同的,信號傳收導線TS1~TSP的數量可以大於、小於或等於信號傳收導線CS1~CSM的數量。也就是說,信號傳收導線CS1~CSM與信號傳收導線TS1~TSP間不必要一對一的進行連接。導線切換器130可以將信號傳收導線TS1~TSP中的多條共同連接到信號傳收導線CS1~CSM的其中之一,相對的,導線切換器130也可以將信號傳收導線CS1~CSM中的多條共同連接到信號傳收導線TS1~TSP的其中之一。另外,導線切換器130也可以使信號傳收導線CS1~CSM及/或信號傳收導線TS1~TSP的至少其中之一處於浮接的狀態。Incidentally, the number of the signal transmission wires CS1 to CSM and the signal transmission wires TS1 to TSP in this embodiment are not the same, and the number of the signal transmission wires TS1 to TSP may be greater than, less than or equal to the signal transmission. The number of wires CS1~CSM is collected. That is to say, it is not necessary to connect the signal transmission wires CS1 to CSM and the signal transmission wires TS1 to TSP one to one. The wire switcher 130 can connect a plurality of the signal transmission wires TS1~TSP to one of the signal transmission wires CS1~CSM. In contrast, the wire switcher 130 can also transmit the signals to the wires CS1~CSM. A plurality of pieces are connected in common to one of the signal transmission wires TS1 to TSP. In addition, the wire switcher 130 may also cause at least one of the signal transmission wires CS1 to CSM and/or the signal transmission wires TS1 to TSP to be in a floating state.
以下請參照圖2A、2B以及2C,圖2A、2B以及2C分別繪示本發明實施例的銲墊121~12N與連接器的連接方式的示意圖。其中,圖2A所繪示的連接器CN1的腳位數量小於銲墊121~12N的數量,連接器CN1可以靠銲墊121~12N所處的足跡區域120的一個側邊(如圖示的左邊)以對齊銲墊121~123的方式進行銲接。當然,連接器CN1也可以靠銲墊121~12N所處的足跡區域120的另一個側邊(如圖示的右邊)來與銲墊121~12N中的多個進行銲接。2A, 2B, and 2C, FIGS. 2A, 2B, and 2C are schematic views respectively showing the connection manner of the pads 121 to 12N and the connector according to the embodiment of the present invention. The number of pins of the connector CN1 shown in FIG. 2A is smaller than the number of pads 121 to 12N, and the connector CN1 can be on the side of the footprint region 120 where the pads 121 to 12N are located (such as the left side of the figure). The welding is performed by aligning the pads 121 to 123. Of course, the connector CN1 can also be soldered to a plurality of the pads 121 to 12N by the other side of the footprint region 120 where the pads 121 to 12N are located (as shown on the right side).
此外,圖2B所繪示的連接器CN2的腳位數量小於銲墊121~12N的數量但連接器CN2的腳位數量多於連接器CN1的腳位數量。與圖2A繪示相同的,連接器CN2可靠銲墊121~12N所處的足跡區域120的一個側邊(如圖示的左邊)以對齊銲墊121~123的方式進行銲接。而圖2C繪示的連接器CN3的腳位數量則與銲墊121~12N的數量相等,因此,連接器CN3則可以依據其腳位與相對的銲墊121~12N一對一的相對耦接。In addition, the number of pins of the connector CN2 shown in FIG. 2B is smaller than the number of pads 121 to 12N, but the number of pins of the connector CN2 is larger than the number of pins of the connector CN1. As shown in FIG. 2A, one side (such as the left side of the figure) of the footprint region 120 where the connector CN2 reliable pads 121-12N are located is soldered in such a manner as to align the pads 121-123. The number of pins of the connector CN3 shown in FIG. 2C is equal to the number of pads 121~12N. Therefore, the connector CN3 can be coupled to the opposite pads 121~12N one-to-one according to the positions of the pads. .
以下則請參照圖3A及圖3B,圖3A及圖3B分別繪示本發明實施例的導線切換器130的部份電路示意圖。在圖3A的繪示中,若信號傳收導線TS1依據連接器的型態不同而需要選擇信號傳收導線CS1~CS3的其中之一以進行耦接的條件下,若信號傳收導線TS1依據連接器的型態需連接至信號傳收導線CS1時,則可以在信號傳收導線TS1與信號傳收導線CS1間放置跳線器(jumper)131來使信號傳收導線TS1與信號傳收導線CS1相互耦接。相對的,若是信號傳收導線TS1應該與信號傳收導線CS2或CS3相互耦接時,則移除跳線器131並配置跳線器132或133以使信號傳收導線TS1耦接至信號傳收導線CS2或CS3。Please refer to FIG. 3A and FIG. 3B. FIG. 3A and FIG. 3B are respectively partial circuit diagrams of the wire switcher 130 according to the embodiment of the present invention. In the illustration of FIG. 3A, if the signal transmission wire TS1 needs to select one of the signal transmission wires CS1 to CS3 for coupling according to the type of the connector, if the signal transmission wire TS1 is based on When the type of the connector needs to be connected to the signal transmission wire CS1, a jumper 131 may be placed between the signal transmission wire TS1 and the signal transmission wire CS1 to make the signal transmission wire TS1 and the signal transmission wire. CS1 is coupled to each other. In contrast, if the signal transmission wire TS1 should be coupled to the signal transmission wire CS2 or CS3, the jumper 131 is removed and the jumper 132 or 133 is configured to couple the signal transmission wire TS1 to the signal transmission. Take the wire CS2 or CS3.
另外,在圖3B的繪示中,也可以利用選擇開關來進行信號傳收導線TS1與CS1~CS3間的連接關係的變更。其中,選擇開關SWS配置在連接銲墊121~12N的傳收導線CS1~CS3以及處理器140所連接的信號傳收導線TS1。間。選擇開關SWS可以依據連接器的型態來進行切換,以使信號傳收導線TS1連接至信號傳收導線CS1~CS3的其中之一。Further, in the drawing of FIG. 3B, the connection relationship between the signal transmission wires TS1 and CS1 to CS3 may be changed by the selection switch. The selection switch SWS is disposed on the transmission wires CS1 to CS3 connecting the pads 121 to 12N and the signal transmission wires TS1 connected to the processor 140. between. The selection switch SWS can be switched according to the type of the connector to connect the signal transmission wire TS1 to one of the signal transmission wires CS1 to CS3.
上述關於圖3A及3B所繪示的選擇開關SWS以及跳線器131~133在本發明的實施例中是被配置很多個的。並且,其配置的方式並不限於圖3A及3B所繪示的方式,其中,凡本領域具通常知識者所熟知的信號傳輸導線間的連接選擇方式都可以應用在導線切換器130中。The selection switch SWS and the jumpers 131-133 described above with respect to FIGS. 3A and 3B are configured in a plurality of embodiments in the present invention. Moreover, the manner of its configuration is not limited to the manners illustrated in FIGS. 3A and 3B, and the connection selection between the signal transmission wires well known to those skilled in the art can be applied to the wire switcher 130.
以下請參照圖4,圖4繪示本發明一實施例的控制電路400的部份電路圖。其中,控制電路400中包括選擇信號產生器410以及處理器440。選擇信號產生器410耦接至處理器440並用以提供選擇信號SSEL1~SSEL2。在本發明的實施例中,選擇信號SSEL1~SSEL2的數量可以依據控制電路400所可能連接的連接器的種類來決定。簡單來說,當控制電路400所可能連接的連接器有兩種形態,選擇信號產生器410僅需提供一個選擇信號(一個選擇信號可以解碼出最多兩種型態),而當控制電路400所可能連接的連接器有三至四種形態時,選擇信號產生器410僅需提供兩個選擇信號SSEL1及SSEL2(兩個選擇信號可以解碼出最多四種型態),若控制電路400所可能連接的連接器有更多的型態時,則依上述的方式類推,即可得知選擇信號產生器410所需提供的選擇信號的數量。Referring to FIG. 4, FIG. 4 is a partial circuit diagram of a control circuit 400 according to an embodiment of the present invention. The control circuit 400 includes a selection signal generator 410 and a processor 440. The selection signal generator 410 is coupled to the processor 440 and configured to provide selection signals SSEL1 S SSEL2. In an embodiment of the invention, the number of select signals SSEL1 S SSEL2 may be determined depending on the type of connector to which the control circuit 400 may be connected. Briefly, when the connector to which the control circuit 400 is connected has two forms, the selection signal generator 410 only needs to provide one selection signal (one selection signal can decode up to two types), and when the control circuit 400 When there are three to four forms of connectors that may be connected, the selection signal generator 410 only needs to provide two selection signals SSEL1 and SSEL2 (the two selection signals can decode up to four types), if the control circuit 400 is likely to be connected When the connector has more types, the analog signal generator 410 can be used to know the number of selection signals to be provided by the selection signal generator 410.
圖5則繪示本發明實施例的選擇信號產生器410的實施方式的示意圖。在圖5的繪示中,選擇信號產生器410包括電阻R1及R2。其中的電阻R1可以選擇耦接至電源電壓VDD或接地電壓GND的其中之一,並在電阻R1的另一端產生選擇信號SSEL1。相類似的,電阻R2也可以選擇耦接至電源電壓VDD或接地電壓GND的其中之一,並在電阻R2的另一端產生選擇信號SSEL2。也就是說,選擇信號SSEL1以及SSEL2可以依據所連接的電阻R1以及R2為連接至電源電壓VDD或接地電壓GND來產生四種可能的組合。因此,選擇信號產生器410所產生的選擇信號SSEL1以及SSEL2可以提供電子裝置的控制電路可以使用最多四種不同型態的連接器(連接介面)。FIG. 5 is a schematic diagram showing an embodiment of a selection signal generator 410 according to an embodiment of the present invention. In the depiction of FIG. 5, select signal generator 410 includes resistors R1 and R2. The resistor R1 can be selectively coupled to one of the power supply voltage VDD or the ground voltage GND, and the selection signal SSEL1 is generated at the other end of the resistor R1. Similarly, the resistor R2 can also be selectively coupled to one of the power supply voltage VDD or the ground voltage GND, and generate a selection signal SSEL2 at the other end of the resistor R2. That is, the selection signals SSEL1 and SSEL2 can generate four possible combinations depending on whether the connected resistors R1 and R2 are connected to the power supply voltage VDD or the ground voltage GND. Therefore, the selection signals SSEL1 and SSEL2 generated by the selection signal generator 410 can provide a connector (connection interface) in which the control circuit of the electronic device can use up to four different types.
接著請參照圖6,圖6繪示本發明實施例的一顯示裝置500的示意圖。顯示裝置500包括電路基板510、銲墊511~51N、導線切換器530、處理器540、連接器570以及顯示模組590。銲墊521~52N配置在電路基板510上的足跡區域520中。銲墊521~52N形成一個導線架的結構,並用以提供以與用以連接顯示模組590的連接器570進行銲接。並且,連接器570提供顯示模組590與電路基板510上的處理器540進行控制信號傳收的介面。Please refer to FIG. 6. FIG. 6 is a schematic diagram of a display device 500 according to an embodiment of the present invention. The display device 500 includes a circuit substrate 510, pads 511 to 51N, a wire switch 530, a processor 540, a connector 570, and a display module 590. The pads 521 to 52N are disposed in the footprint region 520 on the circuit substrate 510. The pads 521-52N form a leadframe structure and are provided for soldering to a connector 570 for connecting the display module 590. Moreover, the connector 570 provides an interface between the display module 590 and the processor 540 on the circuit substrate 510 for control signal transmission.
在本實施例中,連接器570可能包括紅、藍及綠(Red,Green and Blue,RGB)控制介面、手機夥伴計畫(Mobile Phone Partnership Initiative,MPPI)傳輸介面、行動顯示數位介面(Mobile Display Digital Interface,MDDI)以及行動產業處理器介面(Mobile Industry Processor Interface,MIPI)等多種不同的傳輸介面,而關於導線切換器530如何依據連接器570的型態來進行動作的細節在前述的實施例都有相關的說明,以下恕不多贅述。In this embodiment, the connector 570 may include a Red, Green, and Blue (RGB) control interface, a Mobile Phone Partnership Initiative (MPPI) transmission interface, and a mobile display digital interface (Mobile Display). Digital Interface (MDDI) and a variety of different transmission interfaces such as the Mobile Industry Processor Interface (MIPI), and details on how the wire switcher 530 operates according to the type of the connector 570 are in the foregoing embodiment. There are related instructions, the following will not repeat.
綜上所述,本發明利用固定位置佈局的多個銲墊來形成導線架,在提供這些銲墊所形成的導線架來與多個不同型態的連接器的其中之一進行連接。同時,依據所連接的連接器的型態,來利用導線切換器以選擇處理器上的信號傳收導線與銲墊的連接方式。如此一來,同樣的控制電路可以應用在不同介面的電子裝置上,有效的精簡電子裝置的備料以及組裝的過程。In summary, the present invention utilizes a plurality of pads of a fixed position layout to form lead frames, and the lead frames formed by the pads are provided for connection to one of a plurality of different types of connectors. At the same time, depending on the type of connector to be connected, a wire switcher is utilized to select the manner in which the signal transmission wires on the processor are connected to the pads. In this way, the same control circuit can be applied to electronic devices of different interfaces, which effectively reduces the preparation and assembly process of the electronic device.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100...控制電路100. . . Control circuit
110、510...基板110, 510. . . Substrate
121~12N、521~52N...銲墊121~12N, 521~52N. . . Solder pad
140、440、540...處理器140, 440, 540. . . processor
130、530...導線切換器130, 530. . . Wire switcher
120、520...足跡區域120, 520. . . Footprint area
410、510...選擇信號產生器410, 510. . . Select signal generator
500...顯示裝置500. . . Display device
590...顯示模組590. . . Display module
CS1~CSM、TS1~TSP...信號傳收導線CS1~CSM, TS1~TSP. . . Signal transmission wire
CN1~CN3、570...連接器CN1~CN3, 570. . . Connector
131~133...跳線器131~133. . . Jumper
SWS...選擇開關SWS. . . switch
SSEL1~SSEL2...選擇信號SSEL1~SSEL2. . . Selection signal
VDD...電源電壓VDD. . . voltage
GND...接地電壓GND. . . Ground voltage
R1、R2...電阻R1, R2. . . resistance
圖1繪示本發明的一實施例的電子裝置的控制電路100的示意圖。FIG. 1 is a schematic diagram of a control circuit 100 of an electronic device according to an embodiment of the invention.
圖2A、2B以及2C分別繪示本發明實施例的銲墊121~12N與連接器的連接方式的示意圖。2A, 2B, and 2C are schematic views respectively showing the connection manner of the pads 121 to 12N and the connector according to the embodiment of the present invention.
圖3A及圖3B分別繪示本發明實施例的導線切換器130的部份電路示意圖。3A and 3B are respectively partial circuit diagrams of a wire switcher 130 according to an embodiment of the present invention.
圖4繪示本發明一實施例的控制電路400的部份電路圖。4 is a partial circuit diagram of a control circuit 400 in accordance with an embodiment of the present invention.
圖5繪示本發明實施例的選擇信號產生器410的實施方式的示意圖。FIG. 5 is a schematic diagram of an embodiment of a selection signal generator 410 in accordance with an embodiment of the present invention.
圖6繪示本發明實施例的一顯示裝置500的示意圖。FIG. 6 is a schematic diagram of a display device 500 according to an embodiment of the invention.
100...控制電路100. . . Control circuit
110...基板110. . . Substrate
121~12N...銲墊121~12N. . . Solder pad
140...處理器140. . . processor
130...導線切換器130. . . Wire switcher
120...足跡區域120. . . Footprint area
CS1~CSM、TS1~TSP...信號傳收導線CS1~CSM, TS1~TSP. . . Signal transmission wire
Claims (10)
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| TW100128381A TWI485985B (en) | 2011-08-09 | 2011-08-09 | Control circuit of electronic apparatus and display apparatus |
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| TW100128381A TWI485985B (en) | 2011-08-09 | 2011-08-09 | Control circuit of electronic apparatus and display apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118829065A (en) * | 2023-04-21 | 2024-10-22 | 瑞昱半导体股份有限公司 | Circuit layout of printed circuit boards |
| TWI868664B (en) * | 2023-04-13 | 2025-01-01 | 瑞昱半導體股份有限公司 | Circuit layout of printed circuit board |
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| JPH07255025A (en) * | 1994-03-15 | 1995-10-03 | Oki Electric Ind Co Ltd | Liquid crystal display module |
| US7414312B2 (en) * | 2005-05-24 | 2008-08-19 | Kingston Technology Corp. | Memory-module board layout for use with memory chips of different data widths |
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| TWI868664B (en) * | 2023-04-13 | 2025-01-01 | 瑞昱半導體股份有限公司 | Circuit layout of printed circuit board |
| CN118829065A (en) * | 2023-04-21 | 2024-10-22 | 瑞昱半导体股份有限公司 | Circuit layout of printed circuit boards |
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