TW201308677A - Packaging structure of multi-layer array-type LED light engine - Google Patents

Abstract

The present invention provides a packaging structure of multi-layer array-type LED light engine, wherein the periphery of the substrate and the surface of the lead frame are respectively provided with rugged surface structures. The rugged surface structures may increase the roughness of the periphery of the substrate and the surface of the lead frame, so that the liquid packaging material may be filled up the concave spots and concave portions, and thus the packaging body formed after solidifying of packaging material may be tightly combined with the substrate and the lead frame to form as a whole. Furthermore, the bottom of the lens may be coated with bonding agent to enhance the sealing level for the lens. Moreover, the present invention employs the soldering paste doped with material having excellent heat conduction performance to rapidly dissipate the heat generated by LED dies.

Description

Package structure of multi-layer array type light emitting diode light engine

A package structure of a light-emitting diode light engine, in particular, a package structure of a high-strength airtight multi-layer array type light-emitting diode that completely blocks moisture from entering, is durable, and maintains optical device performance for a long period of time.

According to the principle of LED illumination, it is different from the inherent characteristics of semiconductors. It is different from the principle of discharge and heat emission of incandescent lamps. Instead, it will emit light when flowing current into the PN junction of the semiconductor, so the LED is called Cold light. LEDs are widely used in the lighting industry because of their high durability, long life, light weight, low power consumption, and no harmful substances such as mercury. They are usually applied to electronic boards in LED array packages. Business areas such as traffic signs.

Please refer to the optical lens with a fluorescent layer applied to the LED package structure in the application of the new patent publication No. M393044, which is only described as a general function. Referring to the first drawing, a cross-sectional view of an optical lens having a fluorescent layer applied to a light emitting diode package structure includes a substrate 1a, a package 2a, a lead frame 3a, an optical lens 4a, and a lens cover 5a. The substrate 1a is located in a package. The bottommost portion of the structure, wherein each surface of the substrate 1a has a flat and smooth surface, the peripheral portion of the substrate 1a is covered and fixed by the package 1a, and the inner wall surface of the package 2a is provided with an optical reflector 6a. The package body 2a is also covered with the fixed lead frame 3a, and the faces of the lead frame 3a are also flat and smooth.

An optical lens 4a and a lens cover 5a are disposed on the optical reflector 6a. The lens cover 5a covers the optical lens 4a. The lens cover 5a is fixed to the top of the optical reflector 6a by bonding, and the lens cover 5a is fitted to the lens cover 5a. The package 2a is such that the lens cover 5a can be tightly fixed to the package 2a and the optical reflector 6a.

However, the disadvantage of the prior art is that since the surfaces of the substrate are smooth surfaces, when the package is fixed by the substrate, a planar-to-plane contact relationship is formed, and the package and the substrate are mutually interposed due to the plane-to-plane contact. The friction is very small, resulting in a sliding instability. This sliding instability also occurs on the lead frame, and usually the package is usually coated with a liquid material on the substrate or other components to be packaged. Around, when the liquid material is solidified to encapsulate the substrate, but when the sides of the substrate are too smooth, it will be difficult to make the liquid material evenly spread on the sides of the substrate. The solution to this situation is not It is more costly to increase the amount of material or to handle it manually.

Another disadvantage of the prior art is that it is difficult to fix the lens cover to the optical reflector for a long time, because the material of the lens cover is made of plastic material, and the optical reflector is made of metal material or plated on the surface in order to improve the light reflection. A layer of metal film, but because the plastic is not easy to be fixed with the surface of the metal, the lens cover of the plastic material will be slowly separated from the optical reflector of the metal material.

When the substrate and the package are loosened, and the lens cover cannot be tightly fixed to the optical mirror, moisture or moisture can easily penetrate into the inside of the package structure, resulting in deterioration or even damage of the light-emitting element and the optical unit, so that it cannot be used. In a humid environment, it must be improved, and a package structure of a light-emitting diode that completely blocks moisture ingress, is durable, and maintains the performance of the optical component for a long period of time.

The main purpose of the present invention is to provide a package structure of a multi-layer array type light-emitting diode light engine, wherein a surface structure is formed on each surface of a peripheral block of the substrate, and the surface structure is a recessed portion and a convex portion. In the case of the partition, the recessed portion can fill the recessed portion of the surface structure in a liquid state. When the encapsulating material is solidified, the encapsulating material fills the recessed portion and the encapsulating material corresponds to the protruding portion. The components are in a snap-fit relationship with the substrate, so that the substrate and the package formed by the solid state of the package material are tightly combined and fixed together, thereby greatly improving the structural strength and package adhesion of the substrate to the package.

Another object of the present invention is to provide a package structure of a multi-layer array type light emitting diode light engine, wherein a lead frame wrapped in a package has a plurality of second pits, and the second pits can make a liquid The encapsulating material of the state is filled in to prevent the liquid encapsulating material from flowing out from the lead frame. When the encapsulating material is solidified, the part of the encapsulating material filled in the second pits is formed to be engaged with the lead frame. The relationship is such that the lead frame and the package formed by the solid state of the package material are tightly combined and fixed into one body, thereby improving the bonding degree of the lead frame to the package.

Another object of the present invention is to provide a package structure of a multilayer array type light emitting diode light engine, wherein a lens disposed at the uppermost layer of the package structure may be further coated with a bonding agent, and the bonding agent may make the lens more closely adhere thereto. The lower members are bonded to prevent external moisture from intruding into the lens and the inside of the package structure, and the lens is floated on the silicone insulating layer similar to the lens material, instead of being disposed on the optical reflector, thereby preventing the lens A loose detachment occurs and the adhesion of the lens in the package structure is improved.

Another object of the present invention is to provide a package structure of a multi-layer array type light-emitting diode light engine capable of increasing the heat dissipation rate of a light-emitting diode, wherein a light-emitting diode grain is used by using a solder paste doped with diamond powder. Soldering on the substrate, because the diamond powder has better heat conduction effect, the heat energy generated by the light-emitting diode crystal grains can be effectively derived, and the diamond powder can also be plated with a material having excellent thermal conductivity, such that the light-emitting diode The thermal energy generated by the grains can be dissipated to the external environmental space more quickly.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

Referring to the second figure, a schematic diagram of a first embodiment of a package structure of a multi-layer array type light emitting diode light engine of the present invention is shown. The invention relates to a package structure of a multi-layer array type light-emitting diode light engine, which can completely prevent external moisture from entering the inside of the package structure of the multi-layer array type light-emitting diode light engine, and prevent internal optical components. Deteriorated due to moisture.

The package structure of the multi-layer array type LED light engine comprises at least one substrate 1, one package 3, and two lead frame pairs 5. The substrate 1 can be divided into a central area 11 and a peripheral area 13. The top surface of the central area 11 is a light emitting surface 111, and the central area 11 is covered by a central block of the substrate 1. Preferably, the central area 11 has a larger coverage area than the surrounding area 13. The surrounding area 13 is a block between the central area 11 and the edge of the substrate 1, and the peripheral area 13 has a top surface 131, a side surface 133 and a bottom surface 135.

Referring to FIG. 3A, a top view of the package structure of the multi-layer array type LED light engine of the present invention is referred to the third B diagram, and the third B is a partial cross-sectional enlarged view of the area A of the third A diagram. And please cooperate with the first picture. Two accommodating slots 131A and 131B and a plurality of first recesses 1315 are formed on the top surface 131. Preferably, the two accommodating slots 131A and 131B are respectively disposed on the top surface 131 at corresponding positions, preferably two. The accommodating grooves 131A and 131B can be disposed at a position as close as possible to the light-emitting surface 111, that is, the two accommodating grooves 131A and 131B are located on both sides of the light-emitting surface 111, and the first concave points 1315 can be arranged in a ring shape. The first recesses 1315 can also be disposed in the two accommodating grooves 131A and 131B. The shape of the central region 11 may be circular, elliptical, quadrangular, polygonal, and other suitable shapes.

The package 3 covers the portion of the peripheral region 13 of the substrate 1 but does not cover the central region 11. The coated region of the package 3 needs to cover the top surface 131, the side surface 133 and the bottom surface 135, wherein the package body 3 has The package chamber 31 is a portion of the package body 3 that does not cover the central portion 11. Therefore, the package body 3 defines an accommodating space above the central portion 11 for accommodating the space for the package chamber 31. A suitable optical member can be disposed therein, and the bottom of the package chamber 31 is just the light exit surface 111.

The inner wall surface 311 and the light-emitting surface 111 of the package chamber 31 have an angular relationship with each other, preferably at an angle of less than 90 degrees. When the angle between the inner wall surface 311 and the light-emitting surface 111 is less than 90 degrees, the inner wall surface 311 faces Outside the package chamber 31, when light is directed to the inner wall surface 311, the light will be reflected to the outside of the package chamber 31, and the optical reflector 4 may be further disposed on the inner wall surface 311. The optical reflector 4 is disposed on the inner wall surface 311 to greatly increase the probability that light is reflected outside the package chamber 31, so that the illumination of the illumination is improved.

The package 3 is used to cover a portion of the peripheral region 13 of the substrate 1 using an encapsulating material, wherein the encapsulating material may be a molding resin (Mold Resin), and the molding resin may be a polyphthalamide molding. Poly-phthal-amide (PPA) or liquid crystal polymer (LCP).

Referring to FIG. 3A and FIG. 3B, and with the second figure, both lead frames 5 have an inner end portion 51 and an outer end portion 53, and the inner end portions 51 of the two lead frames 5 are respectively located in the two receiving slots. Among the 131A and 131B, the horizontal height of the outer end portion 53 may be higher than the horizontal height of the inner end portion 51. As shown in FIG. 1, a part of the two lead frames 5 may be formed with a bent portion and a bent portion. The two ends extend out to be the inner end portion 51 and the outer end portion 53 of the two lead frames 5.

The package body 3 is separated from the substrate 1 by the two lead frames 5, and the portion between the inner end portion 51 and the outer end portion 53 of the two lead frames 5 is buried in the package body 3, and The inner end portion 51 and the outer end portion 53 are exposed outside the package body 3, wherein one of the two lead frames 5 is provided with a plurality of second pits 511, and the second pits are preferably disposed in two The inner end portion 51 of the lead frame 5 and the surrounding area of the inner end portion 51 are provided.

The first pits 1315 and the second pits 511 are respectively arranged to increase the adhesion of the package 3 to the substrate 1 and the lead frame 5, because the lead frame 5 is made of a metal having a conductive property, and the package is 3, the material of plastic or resin is used. Since the plastic or the resin is not easily joined to the metal, the surface roughness of the lead frame 5 can be increased by providing the second recess 511 on the lead frame 5, and the second concave The dot 511 can also be filled with liquid plastic or resin so that the liquid plastic or resin can be covered on the surface of the lead frame 5, so that when the liquid plastic or resin is cured, the package 3 can be added to the lead frame 5 The package 3 is more tightly sealed to the lead frame 5.

Referring to the fourth figure, a schematic diagram of a second embodiment of a package structure of a multi-layer array type light emitting diode light engine of the present invention is shown. A plurality of light emitting diode crystal grains 6 may be disposed on the light emitting surface 111, and the light emitting diode crystal grains 6 may be disposed on the light emitting surface 111 by an array arrangement, and the light emitting diode crystal grains 6 and two The lead frame 5 is electrically connected, and the light emitting diode die 6 is electrically connected to the two lead frames 5 by wire bonding.

The light-emitting diode dies 6 are soldered to the light-emitting surface 111 of the substrate 1 by a solder paste (not shown), wherein the solder paste may be at least one of solder paste or silver paste. The solder paste can also be mixed with carbon crystal and diamond crystal. The diamond crystal can also be plated with nickel, silver or other materials with excellent thermal conductivity. By adding a material with better thermal conductivity to the solder paste, the solder paste can be used. The thermal conductivity is effectively improved, so that the thermal energy generated by the light-emitting diode die 6 is quickly conducted to the external environmental space via the substrate 1.

A crystal grain protection layer 7 may be further formed on the light-emitting diode crystal grains 6, and the crystal grain protection layer 7 shall be coated with the light-emitting diode crystal grains 6 to protect the light-emitting diode crystal grains. 6 is protected from external moisture and external pollution, wherein the material of the grain protection layer 7 is a silicone rubber, and the phosphor layer 8 can be further formed on the grain protection layer 7, and the phosphor layer 8 can emit the light. The light emitted by the diode grains 6 is mixed.

On top of the phosphor layer 8, a silicone insulating layer 9 can be formed. The silicone insulating layer 9 can insulate the outside moisture from invading the phosphor layer 8, so that the phosphor layer 8 does not deteriorate due to moisture. Furthermore, the lens 10 can be disposed on the silicone insulating layer 9, and the lens 10 is adhered to the silicone insulating layer 9 by underfilling, wherein the lens 10 is floating on the silicone insulating layer 9. It is not in direct contact with the optical reflector 4, and the silicone insulating layer 9 and the lens 10 are both made of plastic material, and the lens 10 can be tightly fixed on the silicone insulating layer 9, and can be fixed by the adhesive layer 20 through the lens 10. The lens 10 can be effectively prevented from loosening. The material of the primer layer 20 can be epoxy resin or other suitable materials.

The bonding agent 30 may be coated between the silicone insulating layer 9 and the lens 10. The bonding agent 30 increases the sealing property between the silicone insulating layer 9 and the lens 10, and blocks external moisture from entering the lens 10. The inner layer of the phosphor layer 8 under the silicone barrier layer 9.

Referring to the fifth embodiment, a schematic view of a first embodiment of a substrate of the present invention, and a sixth embodiment, a schematic view of a second embodiment of the substrate of the present invention. A first upper trench 1311 may be formed on the top surface 131 of the substrate 1, as shown in the fifth figure. Alternatively, as shown in FIG. 6, the upper convex portion 1313 may be further formed on the top surface 131, wherein the first upper groove 1311 or the upper convex portion 1313 may be separately provided on the top surface 131, or may be on the top surface 131. The first upper trench 1311 and the upper convex portion 1313 are simultaneously disposed on the upper surface.

The shape of the first upper groove 1311 may be U-shaped, concave, V-shaped or other suitable shape. It is to be noted that the number of the first upper grooves 1311 and the number of the upper convex portions 1313 are determined according to actual needs, and are merely illustrative examples and are not intended to limit the scope of the present invention.

Referring to the seventh figure, a schematic view of a third embodiment of the substrate of the present invention. As described above, the second upper trench 1315 may be further disposed on the top surface 111. The second upper trench 1315 is disposed between the upper convex portion 1313 and the edge of the substrate 1. The shape of the second upper trench 1315 may be U. Type, concave, V-shaped or other suitable shape.

Referring to the eighth embodiment, a schematic view of a fourth embodiment of the substrate of the present invention, and a ninth drawing, a schematic view of a fifth embodiment of the substrate of the present invention. A side groove 1331 may be formed on the side surface 133 as shown in the eighth figure. Alternatively, as shown in the ninth figure, the side convex portion 1333 may be provided on the side surface 133, and the side convex portion 1333 and the side surface 133 below the side convex portion 1333 may form an L-shaped structure, wherein the side surface 133 The side grooves 1331 or the side convex portions 1333 may be separately provided, and the side grooves 1331 and the side convex portions 1333 may be simultaneously provided on the top surface 133. The shape of the side grooves 1331 may be U-shaped, concave, V-shaped or other suitable shape.

Referring to the tenth figure, a schematic view of a sixth embodiment of the substrate of the present invention. A lower groove 1351 may be formed on the bottom surface 135 as shown in the tenth diagram. Alternatively, a lower convex portion (not shown) may be disposed on the bottom surface 135. The lower groove 1351 or the lower convex portion may be separately disposed on the bottom surface 135, and the lower groove 1351 and the lower convex portion may be simultaneously disposed on the bottom surface 135. unit.

Referring to FIG. 11 , a schematic diagram of a preferred embodiment of a package structure of a multi-layer array type light emitting diode light engine of the present invention is shown. In the preferred embodiment of the present invention, two first upper trenches 1311, one upper convex portion 1313 and one second upper trench are disposed on the top surface 131 of the peripheral region 13 in order from the inside to the outside. 1315, wherein the two first upper grooves 1311 are all disposed in a concave shape, the second upper grooves 1315 are formed in a V shape, and the side convex portions 1333 are formed on the side surfaces 133, and the side convex portions 1333 and the side surfaces 133 form an L-shaped structure. The bottom surface 135 forms a lower groove 1351.

Referring to FIG. 12A, FIG. 12A is a partial enlarged view of the area A of the eleventh drawing, see FIG. 12B, and FIG. 12B is a partial enlarged view of the area B of the eleventh drawing. A flange 1311a may be formed on the inner wall surface of the two first upper grooves 1311, and a concave edge 1315a may be further formed on the inner wall surface of the second upper groove 1315.

The trenches and the trenches described above allow a liquid encapsulation material to be filled in the trenches, so that when the encapsulation material is formed into a solid state, the portions of the trenches and the packages are filled. The portion of the package 3 formed corresponding to the convex portion formed in the solid state of the material forms a snap-fit relationship with the substrate 1, so that the substrate 1 and the package 3 are tightly coupled and fixed integrally without sliding due to looseness. Thus, the structural strength and the package tightness of the substrate and the package can be increased.

In particular, when the flange 1311a and the recess 1315a are formed on the inner wall surface of the grooves, when the encapsulating material is formed into a solid state, it is respectively engaged with the flange 1311a and the recess 1315a of the inner wall surface of the grooves. In combination, the substrate 1 can be more tightly bonded and fixed to the package 3, so that the structural strength and package adhesion of the substrate to the package are further enhanced.

It should be noted that the actual positions of the flanges 1311a and the recesses 1315a are determined according to actual needs, and are merely illustrative examples, and are not intended to limit the scope of the present invention, that is, any of the above-mentioned grooves and Any of the protrusions can further provide at least one of the flange 1311a or the recess 1315a as needed to improve the structural strength and package tightness of the package structure of the present invention.

The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

1. . . Substrate

11. . . central area

111. . . Glossy surface

13. . . Surrounding area

131. . . Top surface

1311. . . First upper groove

1311a. . . Flange

1313. . . Upper convex

131A, 131B. . . Locating slot

1315. . . First pit

1315. . . Second upper groove

1315a. . . Concave edge

133. . . side

1331. . . Side trench

1333. . . Side convex

135. . . Bottom

1351. . . Lower groove

3. . . Package

31. . . Packaging chamber

311. . . Inner wall

4. . . Optical reflector

5. . . Lead frame

51. . . Inner end

53. . . Outer end

511. . . Second pit

6. . . Light-emitting diode grain

7. . . Grain protection layer

8. . . Fluorescent layer

9. . . Silicone insulation layer

10. . . lens

20. . . Underfill

30. . . Binding agent

1a. . . Substrate

2a. . . Package

3a. . . Lead frame

4a. . . optical lens

5a. . . Lens cover

6a. . . Optical reflector

The first figure is a cross-sectional view of an optical lens having a fluorescent layer applied to a light emitting diode package structure of the prior art.

The second figure is a schematic diagram of a first embodiment of a package structure of a multi-layer array type light emitting diode light engine of the present invention.

The third A is a schematic top view of the package structure of the multi-layer array type light emitting diode light engine of the present invention.

The third B is a partial cross-sectional enlarged view of the area A of the second A diagram.

The fourth figure is a schematic diagram of a second embodiment of a package structure of a multi-layer array type light emitting diode light engine of the present invention.

Figure 5 is a schematic view of a first embodiment of a substrate of the present invention.

Figure 6 is a schematic view of a second embodiment of the substrate of the present invention.

Figure 7 is a schematic view of a third embodiment of the substrate of the present invention.

Figure 8 is a schematic view showing a fourth embodiment of the substrate of the present invention.

Figure 9 is a schematic view showing a fifth embodiment of the substrate of the present invention.

Figure 11 is a schematic view showing a sixth embodiment of the substrate of the present invention.

11 is a schematic view of a preferred embodiment of a package structure of a multi-layer array type light emitting diode light engine of the present invention.

Fig. 12A is a partially enlarged view of a region A of the eleventh diagram.

The twelfth B is a partially enlarged view of the area B of the eleventh figure.

1. . . Substrate

11. . . central area

13. . . Surrounding area

111. . . Glossy surface

3. . . Package

4. . . Optical reflector

5. . . Lead frame

6. . . Light-emitting diode grain

7. . . Grain protection layer

8. . . Fluorescent layer

9. . . Silicone insulation layer

10. . . lens

20. . . Underfill

30. . . Binding agent

Claims (40)

A package structure of a multi-layer array type light emitting diode light engine includes: a substrate, the substrate can be divided into a central area and a peripheral area, the top surface of the central area is a light emitting surface, and the substrate has a An edge portion, the central region covering an intermediate block of the substrate, the peripheral region being a block between the central region and the edge, wherein the peripheral region has a top surface, a side surface, and a bottom surface at the top The surface is formed with two accommodating grooves; a package body covering the peripheral portion of the substrate but not covering the central portion, the covering region of the package body including the top surface, the side surface, and the a bottom surface, the package system has a package chamber, the package chamber is located above the light exit surface; and two lead frames each have an inner end portion and an outer end portion, the inner portions of the two lead frames The ends are respectively located in the two accommodating slots, and the inner end portion and the outer end portion of the two lead frames are buried in the package body, and the inner end portion and the outer end portion are The portion is exposed outside the package; and a plurality of light emitting diode dies, Other light emitting diode die is disposed on the light emitting surface, the light-emitting diodes electrically connected to crystal grains relation to the two lead frame line. The package structure of the multi-layer array type LED light engine according to claim 1, wherein the two accommodating grooves are arranged corresponding to each other. The package structure of the multi-layer array type light-emitting diode light engine according to claim 1, wherein the package chamber has an inner wall surface, and the inner wall surface has an angle relationship with respect to the light-emitting surface. The package structure of the multi-layer array type light emitting diode light engine according to claim 3, wherein an optical reflector is disposed on the inner wall surface. The package structure of the multi-layer array type light emitting diode light engine according to claim 1, wherein the package body covers a portion of the peripheral region of the substrate with a packaging material. The package structure of the multi-layer array type light emitting diode light engine according to claim 5, wherein the encapsulating material may be a molding resin. The package structure of the multi-layer array type light-emitting diode light engine according to claim 6, wherein the molding resin may be made of a polyphthalamide molding resin or a liquid crystal polymer. The package structure of the multi-layer array type light-emitting diode light engine according to claim 1, wherein the two lead frames are separated from the substrate by the package. The package structure of the multi-layer array type light-emitting diode light engine according to claim 1, wherein the two lead frames are provided with a plurality of second pits. The package structure of the multi-layer array type LED light engine according to claim 9, wherein the second pits are disposed at the inner end of the two lead frames and around the inner end portion region. The package structure of the multi-layer array type light-emitting diode light engine according to claim 1, wherein the light-emitting diode systems are arranged on the light-emitting surface in an array arrangement. The package structure of the multi-layer array type light-emitting diode light engine according to claim 1 or claim 11, wherein the light-emitting diode dies are electrically connected to the two lead frames by wire bonding. The package structure of the multi-layer array type light emitting diode light engine according to claim 1, wherein the light emitting diodes are disposed on the surface of the substrate by a solder paste. The package structure of the multi-layer array type light emitting diode light engine according to claim 13, wherein the solder paste comprises at least one of a solder paste or a silver paste. The package structure of the multi-layer array type light emitting diode light engine according to claim 14, wherein the solder paste is mixed with at least one of carbon crystal, diamond crystal or nickel-plated diamond crystal. The package structure of the multi-layer array type light emitting diode light engine according to claim 1, further comprising a die protection layer formed on the light emitting diode die And must cover the light-emitting diode crystal grains. The package structure of the multi-layer array type LED light engine according to claim 16 , wherein the material of the die protection layer may be a silicone. The package structure of the multi-layer array type light emitting diode light engine of claim 16, further comprising a phosphor layer formed on the grain protection layer. The package structure of the multi-layer array type light emitting diode light engine according to claim 18, further comprising a silicone insulating layer formed on the phosphor layer. The package structure of the multi-layer array type light emitting diode light engine according to claim 19, further comprising a lens disposed on the silicone insulating layer. The package structure of the multi-layer array type light emitting diode light engine according to claim 20, further comprising a primer layer, wherein the lens is adhered to the silicone insulating layer by the primer layer. The package structure of the multi-layer array type light-emitting diode light engine according to claim 21, wherein the material of the primer layer may be epoxy resin. The package structure of the multi-layer array type light emitting diode light engine according to claim 20, wherein the silicone protective layer and the optical lens have a bonding agent. The package structure of the multi-layer array type light emitting diode light engine according to claim 1, wherein the top surface is further formed with a plurality of first pits. The package structure of the multi-layer array type light emitting diode light engine according to claim 24, wherein the first pits are configured to be annular. The package structure of the multi-layer array type LED light engine according to claim 1 or claim 24, wherein the top surface is formed with at least a first upper trench, an upper convex portion or the first upper trench and the At least one of the upper convex portions. The package structure of the multi-layer array type LED light engine according to claim 26, wherein the inner wall surface of the first upper trench is further formed with at least one of a bump or a groove. The package structure of the multi-layer array type light-emitting diode light engine of claim 26, wherein the outer wall portion of the upper convex portion may further be formed with at least one of a bump or a groove. The package structure of the multi-layer array type LED light engine according to claim 26, wherein the shape of the first upper trench may be at least one of a U-shape, a concave shape, and a V-shape. The package structure of the multi-layer array type light emitting diode light engine of claim 26, wherein the top surface is further formed with a second upper trench, and the upper convex portion is disposed on the first upper trench and Between the second upper trenches, the first upper trench is disposed adjacent to the two accommodating trenches, and the second upper trench is disposed at a position close to the edge of the substrate. The package structure of the multi-layer array type LED light engine of claim 30, wherein the inner wall surface of the second upper trench is further formed with at least one of a bump or a groove. The package structure of the multi-layer array type LED light engine according to claim 30, wherein the shape of the second upper trench may be at least one of a U-shape, a concave shape, and a V-shape. The package structure of the multi-layer array type light emitting diode light engine according to claim 1, wherein the side surface is formed with at least one of at least one side groove or at least one side convex portion. The package structure of the multi-layer array type LED light engine according to claim 33, wherein the inner wall surface of the at least one groove may further be formed with at least one of a bump or a groove. The package structure of the multi-layer array type LED light engine according to claim 33, wherein the outer wall surface of the at least one convex portion is formed with at least one of a bump or a groove. The package structure of the multi-layer array type LED light engine of claim 33, wherein the shape of the at least one side trench may be at least one of a U shape, a concave shape, and a V shape. The package structure of the multi-layer array type light emitting diode light engine according to claim 1, wherein the bottom surface is formed with at least one of at least a lower trench or at least a lower convex portion. The package structure of the multi-layer array type LED light engine according to claim 37, wherein the inner wall surface of the at least one lower trench is further formed with at least one of a bump or a groove. The package structure of the multi-layer array type LED light engine according to claim 37, wherein at least one of the bump or the groove may be formed on the outer wall surface of the at least one lower convex portion. The package structure of the multi-layer array type LED light engine according to claim 37, wherein the shape of the at least one lower trench may be at least one of a U-shape, a concave shape, and a V-shape.